275 No-Clean Cored Wire

275 No-Clean Cored Wire
275
No-Clean Cored Wire
For Lead-bearing and Lead-free alloys
Product Description
Reliability Properties
Kester 275 No-Clean Flux for cored solder wire
was developed to provide superior wetting
performance for hand soldering in the electronics
industry. The chemistry is based on some of the
same principles that have been safely used for
years in mildly activated rosin fluxes. The use of
275 No-Clean Flux results in an extremely clear
post-soldering residue without cleaning. The
unique chemistry in Kester 275 was also designed
to reduce spattering common to most core fluxes.
Kester 275 can be used for both lead bearing and
lead-free soldering.
Copper Mirror Corrosion: Low
Performance Characteristics:
SIR, IPC (typical): Pass
• Colorless translucent residues
• Improves wetting performance
• Excellent solderability and fast wetting to a
variety of surface finishes
• Eliminates the need and expense of cleaning
• Low smoke and odor
• Low spattering
• Compatible with leaded and lead-free alloys
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances. (Applies only if this core flux is
combined with a lead free alloy.)
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Chloride and Bromides: None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Day 1
Day 4
Day 7
Blank
275
1.6 ´10 W
1.2 ´1010 W
1.1 ´1010 W
1.1 ´ 1010 W
9.2 ´ 109 W
8.6 ´ 109 W
10
Spread Test (typical):
Tested to J-STD-004, IPC-TM-650, Method 2.4.46
Area of Spread mm2 (in2)
Flux Core Solder
Sn96.5Ag3.0Cu0.5
Sn63Pb37
285 Mildly Activated Rosin
213 (0.33)
335 (0.52)
245 No-Clean
200 (0.31)
348 (0.54)
275 No-Clean
219 (0.34)
361 (0.56)
275
Application Notes
Availability:
Kester 275 is available in a wide variety of alloys, wire diameters and flux percentages. For most applications,
Sn63Pb37, Sn96.5Ag3.0Cu0.5 or K100LD is used. Consult the alloy temperature chart in Kester’s product
catalog for a comprehensive alloy list. The standard wire diameter for most applications is 0.80mm (0.031in).
Wire diameters range from 0.25 - 6.00mm (0.010 to 0.240in). A "Standard Wire Diameters" chart also is also
included in Kester’s product catalog. The amount of flux in the wire dictates the ease of soldering for an
application. For tin/lead applications, core 50 or 58 (1.1 and 2.2% flux by weight) are recommended. For
Lead-free and high-lead applications, core 58 or 66 (2.2 and 3.3% flux by weight) are recommended.
Process Considerations:
Solder iron tip temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and
between 371-427°C (700-800°F) for lead-free alloys. Heat both the land area and component lead to be soldered with the iron prior to adding Kester 275 cored wire. Apply the solder wire to the land area or component lead. Do not apply the wire directly to the soldering iron tip. If needed, Kester 959T no clean, liquid
flux may be used as a compatible flux to aid in reworking soldered joints. Kester 959T is also available in
Flux-Pens® for optimum board cleanliness.
Cleaning:
The 275 residues are non-conductive, non-corrosive and do not require removal in most applications. The
flux residues are comparable to a conventional RMA except that the 275 residue is clear and colorless.
Storage, Handling, and Shelf Life:
Storage must be in a dry, non-corrosive environment. The surface may lose its shine and appear a dull
shade of grey. This is a surface phenomena and is not detrimental to product functionality. Flux cored solder
wire has a limited shelf life determined by the alloy used in the wire. For alloys containing > 70% lead, the
shelf life is two years from date of manufacture. Other alloys have a shelf life of three years from date of
manufacture.
Health & Safety:
This product, during handling or use, may be hazardous to health or the evironment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143 USA
Phone: (+1) 630 616-4000 • Email: [email protected] • Website: www.kester.com
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
[email protected]
European Headquarters
Zum Plom 5
08541 Neuensalz
Germany
(+49) 3741 4233-0
[email protected]
Japanese Headquarters
20-11 Yokokawa 2-Chome
Sumida-Ku
Tokyo 130-0003 Japan
(+81) 3-3624-5351
[email protected]
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the potential hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
Rev: 20Sep12
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement