Stellaris® LM4F120 LaunchPad Evaluation Kit User's Manual (Rev. A)

Stellaris® LM4F120 LaunchPad Evaluation Kit User's Manual (Rev. A)

Stellaris

®

Board

LM4F120 LaunchPad Evaluation

User Manual

Literature Number: SPMU289A

August 2012 – Revised December 2012

Contents

1

2

3

4

A

Board Overview

1.1

1.2

..................................................................................................................

4

Kit Contents

..................................................................................................................

5

Using the Stellaris LaunchPad

............................................................................................

5

1.3

1.4

1.5

Features

......................................................................................................................

5

BoosterPacks

................................................................................................................

6

Specifications

................................................................................................................

6

Hardware Description

2.1

..........................................................................................................

7

Functional Description

......................................................................................................

7

2.1.1

Microcontroller

2.1.2

USB Device

......................................................................................................

7

.........................................................................................................

8

2.1.3

User Switches and RGB User LED

..............................................................................

8

2.2

2.1.4

Headers and BoosterPacks

Power Management

.......................................................................................

8

.......................................................................................................

11

2.2.1

Power Supplies

2.2.2

Hibernate

...................................................................................................

11

..........................................................................................................

11

2.2.3

Clocking

............................................................................................................

11

2.3

2.2.4

Reset

...............................................................................................................

11

Stellaris In-Circuit Debug Interface (ICDI)

..............................................................................

12

2.3.1

Virtual COM Port

.................................................................................................

12

Software Development

3.1

Software Description

.......................................................................................................

13

......................................................................................................

13

3.2

3.3

3.4

Source Code

Tool Options

...............................................................................................................

13

................................................................................................................

13

Programming the Stellaris LaunchPad Evaluation Board

............................................................

14

References, PCB Layout, and Bill of Materials

4.1

References

......................................................................

15

.................................................................................................................

15

4.2

4.3

Component Locations

Bill of Materials (BOM)

.....................................................................................................

16

....................................................................................................

17

Schematics

.......................................................................................................................

19

2

Contents

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List of Figures

1-1.

Stellaris LM4F120 LaunchPad Evaluation Board

.......................................................................

4

2-1.

Stellaris LaunchPad Evaluation Board Block Diagram

.................................................................

7

4-1.

Stellaris LaunchPad Component Locations (Top View)

..............................................................

16

4-2.

Stellaris LaunchPad Dimensions

........................................................................................

17

List of Tables

1-1.

EK-LM4F120XL Specifications

............................................................................................

6

2-1.

USB Device Signals

........................................................................................................

8

2-2.

User Switches and RGB LED Signals

...................................................................................

8

2-3.

J1 Connector

2-4.

J2 Connector

................................................................................................................

9

................................................................................................................

9

2-5.

J3 Connector

...............................................................................................................

10

2-6.

J4 Connector

...............................................................................................................

10

2-7.

Stellaris In-Circuit Debug Interface (ICDI) Signals

....................................................................

12

2-8.

Virtual COM Port Signals

.................................................................................................

12

4-1.

EK-LM4F120 Bill of Materials

...........................................................................................

17

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List of Figures

3

Chapter 1

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Board Overview

The Stellaris

®

LM4F120 LaunchPad Evaluation Board ( EK-LM4F120XL ) is a low-cost evaluation platform for ARM

®

Cortex™-M4F-based microcontrollers. The Stellaris LaunchPad design highlights the

LM4F120H5QR microcontroller USB 2.0 device interface and hibernation module. The Stellaris

LaunchPad also features programmable user buttons and an RGB LED for custom applications. The stackable headers of the Stellaris LM4F120 LaunchPad BoosterPack XL interface demonstrate how easy it is to expand the functionality of the Stellaris LaunchPad when interfacing to other peripherals with

Stellaris BoosterPacks and MSP430™™ BoosterPacks.

Figure 1-1

shows a photo of the Stellaris

LaunchPad.

Figure 1-1. Stellaris LM4F120 LaunchPad Evaluation Board

Power Select

Switch

USB Connector

(Power/ICDI)

Green Power LED

USB Micro-B

Connector

(Device)

Stellaris® LaunchPad

BoosterPack XL

Interface (J1, J2, J3, and J4 Connectors)

Reset Switch

RGB User LED

Stellaris® LaunchPad

BoosterPack XL

Interface (J1, J2, J3, and J4 Connectors)

Stellaris®

LM4F120H5QR

Microcontroller

MSP430™

LaunchPad-Compatible

BoosterPack Interface

MSP430™

LaunchPad-Compatible

BoosterPack Interface

User Switch 1 User Switch 2

MSP430, Code Composer Studio are trademarks of Texas Instruments.

Stellaris is a registered trademark of Texas Instruments.

Cortex is a trademark of ARM Limited.

ARM, RealView are registered trademarks of ARM Limited.

Microsoft, Windows are registered trademarks of Microsoft Corporation.

All other trademarks are the property of their respective owners.

4

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1.1

Kit Contents

The Stellaris LM4F120 LaunchPad Evaluation Kit contains the following items:

• Stellaris LaunchPad Evaluation Board (EK-LM4F120XL)

• On-board Stellaris In-Circuit Debug Interface (ICDI)

• USB micro-B plug to USB-A plug cable

• README First document

Kit Contents

1.2

Using the Stellaris LaunchPad

The recommended steps for using the Stellaris LM4F120 LaunchPad Evaluation Kit are:

1. Follow the README First document included in the kit. The README First document will help you get the Stellaris LaunchPad up and running in minutes. See the Stellaris LaunchPad web page for additional information to help you get started.

2. Experiment with LaunchPad BoosterPacks. A selection of Stellaris BoosterPacks and compatible

MSP430 BoosterPacks can be found at the Stellaris LaunchPad web page .

3. Take your first step toward developing an application with Project 0 using your preferred ARM

tool-chain and the Stellaris Peripheral Driver Library. Software applications are loaded using the

on-board Stellaris In-Circuit Debug Interface (ICDI). See

Chapter 3 , Software Development, for the

programming procedure. The StellarisWare Peripheral Driver Library Software Reference Manual contains specific information on software structure and function. For more information on Project 0, go to the Stellaris LaunchPad wiki page .

4. Customize and integrate the hardware to suit an end application. This user's manual is an important reference for understanding circuit operation and completing hardware modification.

You can also view and download almost six hours of training material on configuring and using the

LaunchPad. Visit the Stellaris LaunchPad Workshop for more information and tutorials.

1.3

Features

Your Stellaris LaunchPad includes the following features:

• Stellaris LM4F120H5QR microcontroller

• USB micro-B connector for USB device

• RGB user LED

• Two user switches (application/wake)

• Available I/O brought out to headers on a 0.1-in (2.54-mm) grid

• On-board Stellaris ICDI

• Switch-selectable power sources:

– ICDI

– USB device

• Reset switch

• Preloaded RGB quickstart application

• Supported by StellarisWare software including the USB library and the peripheral driver library

• Stellaris LM4F120 LaunchPad BoosterPack XL Interface, which features stackable headers to expand the capabilities of the Stellaris LaunchPad development platform

– For a complete list of available BoosterPacks that can be used with the Stellaris LaunchPad, see the Stellaris LaunchPad web page .

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Board Overview

5

BoosterPacks

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1.4

BoosterPacks

The Stellaris LaunchPad provides an easy and inexpensive way to develop applications with the Stellaris

LM4F120H5QR microcontroller. Stellaris BoosterPacks and MSP430 BoosterPacks expand the available peripherals and potential applications of the Stellaris LaunchPad. BoosterPacks can be used with the

Stellaris LaunchPad or you can simply use the on-board LM4F120H5QR microcontroller as its processor.

See

Chapter 2

for more information.

Build your own BoosterPack and take advantage of Texas Instruments’ website to help promote it! From sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers a variety of avenues for you to reach potential customers with your solutions.

1.5

Specifications

Table 1-1

summarizes the specifications for the Stellaris LaunchPad.

Table 1-1. EK-LM4F120XL Specifications

Parameter

Board supply voltage

Dimensions

Break-out power output

RoHS status

Value

4.75 V

DC to 5.25 V

DC from one of the following sources:

• Debugger (ICDI) USB Micro-B cable (connected to a

PC)

• USB Device Micro-B cable (connected to a PC)

2.0 in x 2.25 in x 0.425 in (5.0 cm x 5.715 cm x 10.795

mm) (L x W x H)

• 3.3 V

DC

(300 mA max)

• 5.0 V

DC mA)

(depends on 3.3 V

DC usage, 23 mA to 323

Compliant

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Chapter 2

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Hardware Description

The Stellaris LaunchPad includes a Stellaris LM4F120H5QR microcontroller and an integrated Stellaris

ICDI as well as a range of useful peripheral features (as the block diagram in

Figure 2-1

shows). This chapter describes how these peripherals operate and interface to the microcontroller.

Figure 2-1. Stellaris LaunchPad Evaluation Board Block Diagram

Debug Breakout Pads

Stellaris ICDI

USB Debug

Connector

JTAG/SWD

UART0

LM4F120H5QR

GPIO I/O

GPIO I/O

USB Device

Connector

USB

GPIO

Power Select

Switch RGB LED

VDD

HIB WAKE

GPIO

User

Switches

Power

Management

Breakout Pads

2.1

Functional Description

2.1.1 Microcontroller

The Stellaris LM4F120H5QR is a 32-bit ARM Cortex-M4F-based microcontroller with 256-KB Flash memory, 32-KB SRAM, 80-MHz operation, USB device, Hibernation module, and a wide range of other peripherals. See the LM4F120H5QR microcontroller data sheet (literature number SPMS294 ) for complete device details.

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Functional Description

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Most of the microcontroller signals are routed to 0.1-in (2.54-mm) pitch headers. An internal multiplexer allows different peripheral functions to be assigned to each of these GPIO pads. When adding external circuitry, consider the additional load on the evaluation board power rails.

The LM4F120H5QR microcontroller is factory-programmed with a quickstart demo program. The quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the quickstart application has been replaced with a user program.

2.1.2 USB Device

The Stellaris LaunchPad includes a USB micro-B connector to allow for USB 2.0 device operation. The signals shown in

Table 2-1

are used for USB device.

GPIO Pin

PD4

PD5

Table 2-1. USB Device Signals

Pin Function

USB0DM

USB0DP

USB Device

D–

D+

When connected as a USB device, the evaluation board can be powered from either the Stellaris ICDI or the USB Device connectors. The user can select the power source by moving the POWER SELECT switch (SW3) to the Device position. See the Power Management schematic (appended to this document).

2.1.3 User Switches and RGB User LED

The Stellaris LaunchPad comes with an RGB LED. This LED is used in the preloaded RGB quickstart application and can be configured for use in custom applications.

Two user buttons are included on the board. The user buttons are both used in the preloaded quickstart application to adjust the light spectrum of the RGB LED as well as go into and out of hibernation. The user buttons can be used for other purposes in the user’s custom application.

The evaluation board also has a green power LED.

Table 2-2

shows how these features are connected to the pins on the microcontroller.

Table 2-2. User Switches and RGB LED Signals

GPIO Pin

PF4

PF0

PF1

PF2

PF3

Pin Function

GPIO

GPIO

GPIO

GPIO

GPIO

USB Device

SW1

SW2

RGB LED (Red)

RGB LED (Blue)

RGD LED (Green)

2.1.4 Headers and BoosterPacks

The two double rows of stackable headers are mapped to most of the GPIO pins of the LM4F120H5QR microcontroller. These rows are labeled as connectors J1, J2, J3, and J4. Connectors J3 and J4 are located 0.1 in (2.54 mm) inside of the J1 and J2 connectors. All 40 header pins of the J1, J2, J3, and J4 connectors make up the Stellaris LM4F120 LaunchPad BoosterPack XL Interface.

Table 2-3

through

Table 2-6

show how these header pins are connected to the microcontroller pins and which GPIO functions can be selected.

NOTE:

To configure the device peripherals easily and intuitively using a graphical user interface

(GUI), see the Stellaris LM4F Pinmux Utility found at www.ti.com/tool/lm4f_pinmux . This easy-to-use interface makes setting up alternate functions for GPIOs simple and error-free.

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Table 2-3. J1 Connector

(1)

(1)

J4 Pin

1.01

1.02

1.03

1.04

1.05

1.06

1.07

1.08

1.09

1.10

GPIO

PB5

PB0

PB1

PE4

PE5

PB4

PA5

PA6

PA7

Stellaris

Pin

58

22

23

24

57

45

46

59

60

GPIOAMSEL

AIN11

AIN9

AIN8

AIN10

1

U1Rx

U1Tx

U5Rx

U5Tx

2

SSI2Fss

GPIOPCTL Register Setting

3 7

3.3 V

– T1CCP1

SSI2Clk

SSI0Tx

I2C2SCL

I2C2SDA

I2C1SCL

I2C1SDA

T2CCP0

T2CCP1

T1CCP0

Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

8

CAN0Tx

CAN0Rx

CAN0Tx

CAN0Rx

Functional Description

9

14

Table 2-4. J2 Connector

(1)

(1)

(2)

(3)

J2 Pin

2.01

2.02

2.03

2.04

2.05

2.06

(2)

2.07

(3)

2.08

2.09

2.10

GPIO

PB2

PE0

PF0

PB7

PB6

PA4

PA3

PA2

Stellaris

Pin

4

1

21

20

19

47

9

28

GPIOAMSEL

AIN3

1

U7Rx

U1RTS

2

GPIOPCTL Register Setting

3 7

GND

I2C0SCL

SSI1Rx CAN0Rx

RESET

SSI2Tx –

T3CCP0

T0CCP0

T0CCP1

SSI2Rx

SSI0Rx

SSI0Fss

SSI0Clk

T0CCP0

Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

J2.06 (PB7) is also connected via a 0-

J2.07 (PB6) is also connected via a 0-

Ω

Ω resistor to J3.04 (PD1).

resistor to J3.03 (PD0).

8

NMI

9

C0o

14

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Functional Description

Table 2-5. J3 Connector

(1)

J3 Pin

3.01

3.02

3.03

3.04

3.05

3.06

GPIO

PD0

PD1

PD2

PD3

Stellaris

Pin

61

62

63

64

GPIOAMSEL

AIN7

AIN6

AIN5

AIN4

1

SSI3Clk

SSI3Fss

SSI3Rx

SSI3Tx

2

SSI1Clk

SSI1Fss

SSI1Rx

SSI1Tx

GPIOPCTL Register Setting

3 7

5.0 V

GND

I2C3SCL

I2C3SDA

WT2CCP0

WT2CCP1

WT3CCP0

WT3CCP1

(1)

(2)

3.07

3.08

3.09

3.10

(2)

PE1

PE2

PE3

PF1

8

7

6

29

AIN2

AIN1

AIN0

U7Tx

U1CTS

SSI1Tx

Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

T0CCP1

Not recommended for BoosterPack use. This signal tied to on-board function via a 0Ω resistor.

8

9

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14

Table 2-6. J4 Connector

J4 Pin

4.01

(1)

4.02

(1)

4.03

4.04

4.05

GPIO

PF2

PF3

PB3

PC4

PC5

Stellaris

Pin

30

31

48

16

15

GPIOAMSEL

C1–

C1+

1

U4Rx

U4Tx

2

SSI1Clk

SSI1Fs

GPIOPCTL Register Setting

3

CAN0Tx

7

T1CCP0

T1CCP1

U1Rx

U1Tx

I2C0SDA T3CCP1

WT0CCP0

WT0CCP1

8

U1RTS

U1CTS

(1)

4.06

4.07

4.08

4.09

(1)

4.10

(1)

PC6

PC7

PD6

PD7

PF4

14

13

53

10

5

C0+

C0–

U3Rx

U3Tx

U2Rx

U2Tx

WT1CCP0

WT1CCP1

WT5CCP0

WT5CCP1

T2CCP0

Not recommended for BoosterPack use. This signal tied to on-board function via a 0Ω resistor.

NMI

9 14

TRD0

TRCLK

Connectors J1 and J2 of the Stellaris LM4F120 LaunchPad BoosterPack XL Interface provide compatibility with MSP430 LaunchPad BoosterPacks. Highlighted functions (shaded cells) in

Table 2-3

through

Table 2-5

indicate configuration for compatibility with the MSP430 LaunchPad.

A complete list of Stellaris BoosterPacks and Stellaris LaunchPad-compatible MSP430 BoosterPacks is available at www.ti.com/stellaris-launchpad .

TRD1

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2.2

Power Management

Power Management

2.2.1 Power Supplies

The Stellaris LaunchPad can be powered from one of two power sources:

• On-board Stellaris ICDI USB cable (Debug, Default)

• USB device cable (Device)

The POWER SELECT switch (SW3) is used to select one of the two power sources. Select only one source at a time.

2.2.2 Hibernate

The Stellaris LaunchPad provides an external 32.768-kHz crystal (Y1) as the clock source for the

LM4F120H5QR Hibernation module clock source. The current draw while in Hibernate mode can be measured by making some minor adjustments to the Stellaris LaunchPad. This procedure is explained in more detail later in this section.

The conditions that can generate a wake signal to the Hibernate module on the Stellaris LaunchPad are waking on a Real-time Clock (RTC) match and/or waking on assertion of the WAKE pin.

(1)

The second user switch (SW2) is connected to the WAKE pin on the microcontroller. The WAKE pin, as well as the

V

DD and HIB pins, are easily accessible through breakout pads on the Stellaris LaunchPad. See the appended schematics for details.

There is no external battery source on the Stellaris LaunchPad Hibernation module, which means the

VDD3ON power control mechanism should be used. This mechanism uses internal switches to remove power from the Cortex-M4F processor as well as to most analog and digital functions while retaining I/O pin power.

To measure the Hibernation mode current or the Run mode current, the VDD jumper that connects the 3.3

V pin and the MCU_PWR pin must be removed. See the complete schematics (appended to this document) for details on these pins and component locations. An ammeter should then be placed between the 3.3 V pin and the MCU_PWR pin to measure I

DD microcontroller uses V

DD as its power source during V

DD3ON

(or I

HIB_VDD3ON

). The LM4F120H5QR

Hibernation mode, so I

DD is the Hibernation

I mode (VDD3ON mode) current. This measurement can also be taken during Run mode, which measures

DD the microcontroller running current.

2.2.3 Clocking

The Stellaris LaunchPad uses a 16.0-MHz crystal (Y2) to complete the LM4F120H5QR microcontroller main internal clock circuit. An internal PLL, configured in software, multiples this clock to higher frequencies for core and peripheral timing.

The Hibernation module is clocked from an external 32.768-KHz crystal (Y1).

2.2.4 Reset

(1)

The RESET signal into the LM4F120H5QR microcontroller connects to the RESET switch and to the

Stellaris ICDI circuit for a debugger-controlled reset.

External reset is asserted (active low) under any of three conditions:

• Power-on reset (filtered by an R-C network)

• RESET switch held down

• By the Stellaris ICDI circuit when instructed by the debugger (this capability is optional, and may not be supported by all debuggers) spacer spacer

If the board does not turn on when you connect it to a power source, the microcontroller might be in Hibernate mode (depending on the programmed application). You must satisfy one of the programmed wake conditions and connect the power to bring the microcontroller out of Hibernate mode and turn on the board.

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11

Stellaris In-Circuit Debug Interface (ICDI)

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2.3

Stellaris In-Circuit Debug Interface (ICDI)

The Stellaris LaunchPad evaluation board comes with an on-board Stellaris In-Circuit Debug Interface

(ICDI). The Stellaris ICDI allows for the programming and debug of the LM4F120H5QR using the LM

Flash Programmer and/or any of the supported tool chains. Note that the Stellaris ICDI supports only

JTAG debugging. An external debug interface can be connected for Serial Wire Debug (SWD) and SWO

(trace).

Table 2-7

shows the pins used for JTAG and SWD. These signals are also mapped out to easily accessible breakout pads and headers on the board.

Table 2-7. Stellaris In-Circuit Debug Interface (ICDI)

Signals

GPIO Pin

PC0

PC1

PC2

PC3

Pin Function

TCK/SWCLK

TMS/SWDIO

TDI

TDO/SWO

2.3.1 Virtual COM Port

When plugged in to a PC, the device enumerates as a debugger and a virtual COM port.

Table 2-8

shows the connections for the COM port to the pins on the microcontroller.

Table 2-8. Virtual COM Port Signals

GPIO Pin

PA0

PA1

Pin Function

U0RX

U0TX

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Chapter 3

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Software Development

This chapter provides general information on software development as well as instructions for Flash memory programming.

3.1

Software Description

The StellarisWare software provided with the Stellaris LaunchPad provides access to all of the peripheral devices supplied in the design. The Stellaris Peripheral Driver Library is used to operate the on-chip peripherals as part of StellarisWare.

StellarisWare includes a set of example applications that use the StellarisWare Peripheral Driver Library.

These applications demonstrate the capabilities of the LM4F120H5QR microcontroller, as well as provide a starting point for the development of the final application for use on the Stellaris LaunchPad evaluation board.

3.2

Source Code

The complete source code including the source code installation instructions are provided at www.ti.com/stellaris-launchpad . The source code and binary files are installed in the DriverLib tree.

3.3

Tool Options

The source code installation includes directories containing projects and/or makefiles for the following toolchains:

• Keil ARM RealView

®

Microcontroller Development System

• IAR Embedded Workbench for ARM

• Sourcery CodeBench

• Texas Instruments' Code Composer Studio™ IDE

Download evaluation versions of these tools from www.ti.com/stellaris. Due to code size restrictions, the evaluation tools may not build all example programs. A full license is necessary to re-build or debug all examples.

Instructions on installing and using each of the evaluation tools can be found in the Quickstart guides (for example, Quickstart-Keil, Quickstart-IAR) which are available for download from the evaluation kit section of the TI website at www.ti.com/stellaris .

For detailed information on using the tools, see the documentation included in the tool chain installation or visit the respective web site of the tool supplier.

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Software Development

13

Programming the Stellaris LaunchPad Evaluation Board

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3.4

Programming the Stellaris LaunchPad Evaluation Board

The Stellaris LaunchPad software package includes pre-built binaries for each of the example applications. If you have installed StellarisWare to the default installation path of C:\StellarisWare, you can find the example applications in C:\StellarisWare\boards\ek-lm4f120xl. The on-board Stellaris ICDI is used with the Stellaris LM Flash Programmer tool to program applications on the Stellaris LaunchPad.

Follow these steps to program example applications into the Stellaris LaunchPad evaluation board using the Stellaris ICDI:

1. Install LM Flash Programmer on a PC running Microsoft

®

Windows

®

.

2. Switch the POWER SELECT switch to the right for Debug mode.

3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB port on the board.

4. Verify that the POWER LED D4 on the board is lit.

5. Run the LM Flash Programmer.

6. In the Configuration tab, use the Quick Set control to select the EK-LM4F120XL evaluation board.

7. Move to the Program tab and click the Browse button. Navigate to the example applications directory

(the default location is C:\StellarisWare\boards\ek-lm4f120xl\).

8. Each example application has its own directory. Navigate to the example directory that you want to load and then into the directory which contains the binary (*.bin) files. Select the binary file and click

Open.

9. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check

Reset MCU After Program.

Program execution starts once the Verify process is complete.

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Chapter 4

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References, PCB Layout, and Bill of Materials

4.1

References

In addition to this document, the following references are available for download at www.ti.com/stellaris :

• Stellaris LM4F120H5QR Microcontroller Data Sheet (literature number SPMS294 ).

• StellarisWare Driver Library. Available for download at www.ti.com/tool/sw-drl .

• StellarisWare Driver Library User’s Manual, publication SW-DRL-UG (literature number SPMU019 ).

• TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number

SBVS038 )

• TLV803 Voltage Supervisor Data Sheet (literature number SBVS157 )

• Texas Instruments’ Code Composer Studio IDE website: www.ti.com/ccs

Additional support:

• RealView MDK ( www.keil.com/arm/rvmdkkit.asp

)

• IAR Embedded Workbench ( www.iar.com

).

• Sourcery CodeBench development tools ( www.codesourcery.com/gnu_toolchains/arm ).

SPMU289A – August 2012 – Revised December 2012

Submit Documentation Feedback

References, PCB Layout, and Bill of Materials

Copyright © 2012, Texas Instruments Incorporated

15

Component Locations

www.ti.com

4.2

Component Locations

Plots of the top-side component locations are shown in

Figure 4-1

and the board dimensions are shown in

Figure 4-2 .

Figure 4-1. Stellaris LaunchPad Component Locations (Top View)

16

References, PCB Layout, and Bill of Materials

SPMU289A – August 2012 – Revised December 2012

Submit Documentation Feedback

Copyright © 2012, Texas Instruments Incorporated

www.ti.com

Figure 4-2. Stellaris LaunchPad Dimensions

Bill of Materials (BOM)

NOTE:

Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).

4.3

Bill of Materials (BOM)

Table 4-1

shows the bill of materials for the EK-LM4F120XL evaluation board.

Item

1

2

3

4

5

6

7

8

9

10

11

Ref Des

C1-2, C7, C12, C14

C25-26, C31-32

C28-29

C3, C5, C8, C15,

C18-19, C21

C4, C6, C10-11, C17,

C20, C23-24

C9, C22

D1

D2

D4

H24

H25

Qty

5

4

2

7

8

2

1

1

1

1

1

Table 4-1. EK-LM4F120 Bill of Materials

Description

Capacitor, 10 pF, 50 V, 5%,

NPO/COG, 0402

Manufacturer Manufacturer Part No

Capacitor, 0402, X5R, 10 V, Low Johanson Dielectrics 100R07X105KV4T

ESR Inc

Murata GRM1555C1H100JZ01D

Capacitor, 24 pF, 50 V, 5%,

NPO/COG, 0402

Capacitor, 0.01

μ F 25 V, 10%

0402 X7R

TDK

Taiyo Yuden

C1005C0G1H240J

TMK105B7103KV-F

EMK105B7104KV-F Capacitor, 0.1

μ F 16 V, 10% 0402 Taiyo Yuden

X7R

Murata Capacitor, 2.2

μ F, 16 V, 10%,

0603, X5R

LED, Tri-Color RGB, 0404 SMD

Common Anode

Everlight

Diodes Inc Diode, Dual Schottky, SC70,

BAS70 Common Cathode

LED, Green 565 nm, Clear 0805

SMD

Lite-On

GRM188R61C225KE15D

18-038/RSGHBHC1-S02/2T

BAS70W-05-7-F

LTST-C171GKT

Header, 1x2, 0.100, T-Hole,

Vertical Unshrouded, 0.220 Mate

Jumper, 0.100, Gold, Black,

Closed

3M

FCI

Sullins

961102-6404-AR

68001-102HLF

SPC02SYAN

SPMU289A – August 2012 – Revised December 2012

Submit Documentation Feedback

References, PCB Layout, and Bill of Materials

Copyright © 2012, Texas Instruments Incorporated

17

21

22

23

24

25

16

17

18

19

20

Item

12

13

14

15

Bill of Materials (BOM)

26

27

28

J1, J4

J9, J11

Q1-3

R1-2, R9-16, R20,

R26

R3-5, R8, R27

R,6 R17-19, R21-23,

R28

R7, R31

RESET SW1, SW2

SW3

U1, U2

U4

U8

Y1

Y2, Y5

R24

R30

Ref Des

C31, C34

Table 4-1. EK-LM4F120 Bill of Materials (continued)

Qty

2

2

3

12

Description Manufacturer

Header, 2x10, T-Hole Vertical unshrouded stacking

Samtec

USB Connectors Micro B Recept Hirose

RA SMT BTTM MNT

NPN SC70 pre-biased

Resistor, 0 Ω 1/10W 0603 SMD

Diodes Inc

Panasonic

1

1

2

1

1

2

3

1

5

8

2

1

2

Resistor, 330 Ω , 1/10W, 5%, 0402 Yageo

Resistor, 10 k

Ω

, 1/10W, 5%, 0402 Yageo

Thick Film

Resistor, 1 M Ω 1/10W, 5%, 0402 R Ω

Switch, Tact 6 mm SMT, 160gf Omron

Switch, DPDT, SMT 300 mA × 2 at C K Components

6 V

Stellaris MCU

LM4F120H5QRFIGA3

Texas Instruments

IC, Single Voltage Supervisor, 5 V, Texas Instruments

DBV

Regulator, 3.3 V, 400 mA, LDO Texas Instruments

Crystal, 32.768 kHz Radial Can

Crystal, 16.00 MHz 5.0x3.2mm

SMT

Abracon

NDK

Abracon

PCB Do Not Populate List

(Shown for information only)

Capacitor, 0.1

μ F 16 V, 10% 0402 Taiyo Yuden

X7R

Resistor, 330 Ω , 1/10W, 5%, 0402 Yageo

Resistor, 0 Ω 1/10W 0603 SMD Panasonic www.ti.com

Manufacturer Part No

SSW-110-23-S-D

ZX62-B-5PA

DTC114EET1G

ERJ-3GEY0R00V

RC0402FR-07330RL

RC0402FR-0710KL

MCR01MRTF1004

B3S-1000

JS202011SCQN

LM4F120H5QRFIG

TLV803MDBZR

TPS73633DRBT

AB26TRB-32.768KHZ- T

NX5032GA-16.000000 MHz

ABM3-16.000 MHz-B2- T

EMK105B7104KV-F

RC0402FR-07330RL

ERJ-3GEY0R00V

18

References, PCB Layout, and Bill of Materials

SPMU289A – August 2012 – Revised December 2012

Submit Documentation Feedback

Copyright © 2012, Texas Instruments Incorporated

Appendix A

SPMU289A – August 2012 – Revised December 2012

Schematics

This section contains the complete schematics for the Stellaris LaunchPad board.

• Microcontroller, USB, Expansion, Buttons, and LED

• Power Management

• Stellaris In-Circuit Debug Interface

SPMU289A – August 2012 – Revised December 2012

Submit Documentation Feedback

Copyright © 2012, Texas Instruments Incorporated

Schematics

19

Microcontroller, USB, Expansion, Buttons, and

LED

DEBUG/VCOM

PA0/U0RX_VCP_TXD

PA1/U0TX_VCP_RXD

GPIO

PA2

PA3

PA4

PA5

PA6

PA7

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC2/TDI

DEBUG_PC3/TDO/SWO

PC4

PC5

PC6

PC7

PE0

PE1

PE2

PE3

PE4

PE5

U1-A

21

22

23

24

17

18

19

20

52

51

50

49

16

15

14

13

59

60

9

8

7

6

PE0

PE1

PE2

PE3

PE4

PE5

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

LM4F120

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

58

57

1

4

45

46

47

48

61

62

63

64

43

44

53

10

PF0

PF1

PF2

PF3

PF4

28

29

30

31

5

PD0

PD1

PD2

PD3

USB_DM

USB_DP

PD6

PD7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PF0

PF1

PF2

PF3

PF4

GPIO

+USB_VBUS

0

R15

USB_DP

USB_DM

9

8

J9

CON-USB-MICROB

Used for VBUS detection when

7

6

+USB_VBUS

0

R14 configured as a self-powered USB Device

0

0

0

0

0

R1

R2

R11

R12

R13

USR_SW2

LED_R

LED_B

LED_G

USR_SW1 PD0

PD1

0

R9

0

R10

PB6

PB7

SW1

USR_SW1

LED_R

LED_G

LED_B

B

B

B

C

R3

330

Q1

DTC114EET1G

E

C

R5

330

Q3

DTC114EET1G

E

C

R4

330

Q2

DTC114EET1G

E

+VBUS

2 R

3 G

4 B

D1

A 1

RGB_LED_0404_COMA

WAKE

USR_SW2

R8

330

SW2

DESIGNER

DGT

REVISION

0.1

PROJECT

Stellaris Launchpad

DESCRIPTION

J1 and J2 provide compatability with

Booster Packs designed for MSP430 Launchpad

J3 and J4 sit 100 mils inside J1 and J2 to provide extended functions specific to this board.

See the board user manual for complete table of pin mux functions

GPIO

J1

5

6

7

8

1

2

3

4

9

10

CON_110_100

+3.3V

PB5

PB0

PB1

PE4

PE5

PB4

PA5

PA6

PA7

PB2

PE0

PF0

PB7

PB6

PA4

PA3

PA2

TARGETRST

J2

5

6

7

8

1

2

3

4

9

10

CON_110_100

+VBUS

J3

5

6

7

8

1

2

3

4

9

10

CON_110_100

PD0

PD1

PD2

PD3

PE1

PE2

PE3

PF1

PF2

PF3

PB3

PC4

PC5

PC6

PC7

PD6

PD7

PF4

J4

5

6

7

8

1

2

3

4

9

10

CON_110_100

DATE

8/23/2012

TEXAS INSTRUMENTS

Microcontroller, USB, Expansion, Buttons and LED

FILENAME

EK-LM4F120XL Rev A.sch

PART NO.

EK-LM4F120XL

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com/stellaris

SHEET

1 OF 3

Power Management

+USB_VBUS

H18

+ICDI_VBUS

H19

Power Select

SW3

6

4

1

3

2

5

+VBUS

+VBUS

H17 H23

+3.3V 400mA Regulator

U8

TPS73633DRB

8

IN OUT

5

EN NR

GND PAD

1

3

C14

1.0uF

H22

C18

0.01uF

+3.3V

+VBUS

+3.3V

TLV803

3

RESET

VDD

GND

2

1

U4

R17

10k

3

K

D2

A

1

A

2

TARGETRST

ICDI_RST

+MCU_PWR

RESET

RESET

R28

10k

C13

0.1uF

OMIT

H20

Y2

16MHz

C31

10pF

C32

10pF

32.768Khz

Y1

TARGETRST

38

41

40

34

35

36

3

12

27

39

55

RESET

OSC1

OSC0

XOSC0

GNDX

XOSC1

GNDA

U1-B

WAKE

32

HIB

33

VBAT

VDD

VDD

VDD

VDD

37

VDDA

2

11

26

42

54

GND

GND

GND

GND

VDDC

VDDC

25

56

LM4F120

H21

WAKE

HIB

H24 and H25 installed as a single 1x2 header on 100 mil center with jumper

+MCU_PWR

H24 H25

+3.3V

0

R30

OMIT

C3

0.01uF

C10

0.1uF

C4

0.1uF

C11

0.1uF

C5

0.01uF

C6

0.1uF

+MCU_VDDC

C8

0.01uF

C7

1.0uF

C12

1.0uF

C22

2.2uF

H13 H10

H11 H12

DESIGNER

DGT

REVISION

0.1

PROJECT

Stellaris Launchpad

DESCRIPTION

DATE

8/23/2012

Power Management

FILENAME

EK-LM4F120XL Rev A.sch

TEXAS INSTRUMENTS

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com/stellaris

PART NO.

EK-LM4F120XL

SHEET

2 OF 3

Stellaris In-Circuit Debug Interface (ICDI)

ICDI_RST

+3.3V

R19

10k

C34

0.1uF

OMIT

Y5

16MHz

C25

10pF

C26

10pF

DEBUG/VCOM

PA1/U0TX_VCP_RXD

PA0/U0RX_VCP_TXD

+MCU_PWR

R18

10k

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC3/TDO/SWO

DEBUG_PC2/TDI

TARGETRST

EXTDBG

+3.3V

R23

10k

H14

R21

10k

R22

10k

ICDI_TCK

ICDI_TMS

ICDI_TDI

ICDI_TDO

+3.3V

38

41

40

34

35

36

3

12

27

39

55

RESET

OSC1

OSC0

U2-B

WAKE

32

HIB

33

VBAT

37

XOSC0

GNDX

XOSC1

VDDA

2

GNDA

GND

GND

GND

GND

VDD

VDD

VDD

VDD

VDDC

VDDC

11

26

42

54

25

56

LM4F120

+3.3V

C15

0.01uF

C17

0.1uF

C19

0.01uF

C20

0.1uF

C21

0.01uF

C1

1.0uF

C23

0.1uF

C24

0.1uF

C2

1.0uF

C9

2.2uF

Stellaris In-Circuit Debug Interface (ICDI)

+3.3V

U2-A

21

22

23

24

17

18

19

20

52

51

50

49

16

15

14

13

9

8

7

6

59

60

PE0

PE1

PE2

PE3

PE4

PE5

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

LM4F120

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PF0

PF1

PF2

PF3

PF4

28

29

30

31

5

61

62

63

64

43

44

53

10

58

57

1

4

45

46

47

48

R24

330

DEBUG_PC3/TDO/SWO

DEBUG_PC1/TMS/SWDIO

DEBUG_PC0/TCK/SWCLK

+ICDI_VBUS

3

4

1

2

VB

D-

D+

ID

5

G

0

R16

ICDI_TCK

ICDI_TMS

ICDI JTAG

5

4

3

2

1

J5

6

7

8

9

10

TC2050-IDC-NL

ICDI_TDO

ICDI_TDI

ICDI_RST

DESIGNER

DGT

REVISION

0.1

PROJECT

Stellaris Launchpad

DESCRIPTION

SStellaris In Circuit Debug Interface

DATE

8/23/2012

FILENAME

EK-LM4F120XL Rev A.sch

TEXAS INSTRUMENTS

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746 www.ti.com/stellaris

PART NO.

EK-LM4F120XL

SHEET

3 OF 3

EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS

Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO

BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF

MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH

ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL

DAMAGES.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.

REGULATORY COMPLIANCE INFORMATION

As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal

Communications Commission (FCC) and Industry Canada (IC) rules.

For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,

DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.

General Statement for EVMs including a radio

User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant

Caution

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

FCC Interference Statement for Class A EVM devices

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Concerning EVMs including radio transmitters

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Concerning EVMs including detachable antennas

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement.

Concernant les EVMs avec appareils radio

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente

(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

Important Notice for Users of this Product in Japan

This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1.

Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and

Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of

Japan,

2.

Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or

3.

Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited

(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

http://www.tij.co.jp

【ご使用にあたっての注】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

1.

電波法施行規則第 6 条第 1 項第 1 号に基づく平成 18 年 3 月 28 日総務省告示第 173 号で定められた電波暗室等の試験設備でご使用いただく。

2.

実験局の免許を取得後ご使用いただく。

3.

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430BOOST-SENSE1 - Capacitive Touch

BoosterPack for the LaunchPad

User

'

s Guide

Literature Number: SLAU337A

April 2011 – Revised September 2011

2 SLAU337A – April 2011 – Revised September 2011

Submit Documentation Feedback

Copyright © 2011, Texas Instruments Incorporated

Contents

Preface

1

.......................................................................................................................................

5

430BOOST-SENSE1 Overview

1.1

Overview

..............................................................................................

7

..................................................................................................................

7

1.2

Kit Contents

..............................................................................................................

8

2

3

4

5

Getting Started With 430BOOST-SENSE1 BoosterPack

2.1

Hardware Preparation

...........................................................

9

..................................................................................................

9

2.2

Software Preparation

...................................................................................................

9

2.3

Capacitive Touch User Experience

..................................................................................

10

Capacitive Touch BoosterPack Hardware

3.1

Driving the LEDs

.............................................................................

14

.......................................................................................................

15

3.2

Capacitive Touch Sensors

............................................................................................

16

LaunchPad Capacitive Touch BoosterPack User Experience Firmware

4.1

4.2

....................................

17

Import Project in CCS

.................................................................................................

17

Open Project and Workspace in IAR Embedded Workbench

...................................................

17

4.3

Capacitive Touch Sense Library

.....................................................................................

18

LaunchPad Capacitive Touch BoosterPack User Experience Software

....................................

20

6

7

8

5.1

5.2

5.3

LaunchPad Capacitive Touch BoosterPack User Experience GUI

.............................................

20

MediaPad

...............................................................................................................

20

UART Communication Protocol

......................................................................................

21

Frequently Asked Questions (FAQ), Tips, and Tricks

References

.............................................................

22

.......................................................................................................................

22

Schematics and PCB Layout

8.1

8.2

8.3

Schematics

PCB Layout

Bill of Materials (BOM)

...............................................................................................

23

.............................................................................................................

23

.............................................................................................................

24

................................................................................................

24

Revision History

.........................................................................................................................

25

SLAU337A – April 2011 – Revised September 2011

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Table of Contents

3

1

2

9

10

11

12

6

7

8

1

2

3

4

5 www.ti.com

List of Figures

Capacitive Sense BoosterPack With LaunchPad

.......................................................................

7

PC GUI Looking for LaunchPad

.........................................................................................

11

PC GUI in Sleep Mode

...................................................................................................

11

PC GUI in Active Mode

...................................................................................................

12

MediaPad

...................................................................................................................

13

Capacitive Sense BoosterPack Hardware

.............................................................................

14

Schematic LED Multiplexing

.............................................................................................

15

Driving LEDs

...............................................................................................................

15

Capacitive Touch Sensor Areas

.........................................................................................

16

Capacitive Touch BoosterPack Schematic

.............................................................................

23

Capacitive Touch BoosterPack Layout, Top Layer

...................................................................

24

Capacitive Touch BoosterPack Layout, Bottom Layer and Silkscreen

.............................................

24

List of Tables

BoosterPack Interface

....................................................................................................

14

Bill of Materials

.............................................................................................................

24

4

List of Figures

SLAU337A – April 2011 – Revised September 2011

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Preface

SLAU337A

April 2011

Revised September 2011

Read This First

If You Need Assistance

If you have any feedback or questions, support for MSP430 devices, the MSP-EXP430G2 LaunchPad, and the 430BOOST-SENSE1 Capacitive Touch BoosterPack for the LaunchPad is provided by the Texas

Instruments Product Information Center (PIC) and the TI E2E Forum

( https://community.ti.com/forums/12.aspx

). Contact information for the PIC can be found on the TI web site at support.ti.com

. Additional device-specific information can be found on the MSP430 web site at www.ti.com/msp430 .

Related Documentation from Texas Instruments

The primary sources of MSP430 information are the device-specific data sheets and user's guides. The most up-to-date versions of the user's guide documents available at www.ti.com/msp430 Information specific to the MSP-EXP430G2 LaunchPad Experimenter Board and the different BoosterPacks can be found at focus.ti.com/docs/toolsw/folders/print/msp-exp430g2.html

or the LaunchPad wiki page at processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2 .

User's guides and detailed information on setting up a project for the MSP430 using Code Composer

Studio or IAR Embedded Workbench can be found at the Tools & Software section of the MSP430 landing page www.ti.com/msp430 .

FCC Warning

This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case, the user will be required to take whatever measures may be required to correct this interference his own expense.

SLAU337A – April 2011 – Revised September 2011

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Preface

5

6

Read This First

SLAU337A – April 2011 – Revised September 2011

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User

'

s Guide

SLAU337A

April 2011

Revised September 2011

430BOOST-SENSE1 - Capacitive Touch BoosterPack for the LaunchPad

1 430BOOST-SENSE1 Overview

1.1

Overview

The 430BOOST-SENSE1 Capacitive Touch BoosterPack is the first extension module for the

MSP-EXP430G2 MSP430 LaunchPad Value Line Development Kit (see

Figure 1 ). Extension modules

such as this one, designed specifically for the LaunchPad, are called BoosterPacks, and each features an application example for one of the MSP430 Value Line devices. The BoosterPacks can be connected to the MSP-EXP430G2 with both 10-pin male headers (included in MSP-EXP430G2 kit) soldered onto the board and, therefore, use all available pins on the MSP430G2452 Value Line device.

Figure 1. Capacitive Sense BoosterPack With LaunchPad

The Capacitive Sense BoosterPack is available for purchase from the TI eStore: https://estore.ti.com/430BOOST-SENSE1-Capacitive-Touch-BoosterPack-P2361C42.aspx

.

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430BOOST-SENSE1 Overview

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The Capacitive Sense BoosterPack features the new MSP430G2xx2 devices, which are capable of driving up to 16 touch-sense enabled I/O pins. The included MSP430G2452 device allows for low-cost capacitive-sensing and approximation-sensing applications without the use of any external components.

The BoosterPack includes a capacitive sense board and an MSP420G2452 device preprogrammed with a demo application. The user experience application demonstrates capacitive sense as standalone feature by showing the user interaction directly with the onboard LEDs, by a GUI, or by an application example on a Microsoft Windows PC.

430BOOST-SENSE1 features:

• Nine LEDs giving instant feedback to user interaction

• Six touch-sense areas (a button, a 4-element wheel, and a proximity sensor)

One preprogrammed MSP430G2452 device

For latest information on the LaunchPad, other available BoosterPacks, software examples, and how to program the included MSP430G2452 device, see the MSP-EXP430G2 LaunchPad Experimenter Board

User

s Guide ( SLAU318 ) or the LaunchPad wiki page processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2) .

1.2

Kit Contents

The 430BOOST-SENSE1 kit includes two components:

• One Capacitive Touch BoosterPack board with nine LEDs and six sensor areas

• One preprogrammed MSP430G2452 device

This device is a low-power 16-bit microcontroller with an 8-channel 10-bit ADC, comparator, universal serial interface that supports SPI and I2C, 8kB flash memory, and 256B RAM memory

8

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2

Getting Started With 430BOOST-SENSE1 BoosterPack

Getting Started With 430BOOST-SENSE1 BoosterPack

The following sections describe the preparation necessary to run the user experience application demo and to start developing applications with the MSP430G2452 for the Capacitive Touch BoosterPack.

2.1

Hardware Preparation

To prepare the Capacitive Touch BoosterPack hardware for its first use:

1. Solder both 10-pin male headers onto the LaunchPad's breakout pin connections J1 and J2. These two 10-pin male headers and two 10-pin female headers come with the original LaunchPad kit.

NOTE:

If the 10-pin female headers are populated, use the 10-pin male headers as adapter to further extend the connections to the LaunchPad. The additional distance adds minimal base capacitance and does not affect the user experience of the kit.

2. Remove the J5 connections on the LaunchPad to disconnect the LaunchPad LEDs and keep them from interfering with P1.0 and P1.6 functions of the Capacitive Sense BoosterPack.

3. Ensure jumpers VCC, TXD, and RXD of the J3 connection are populated for the user experience demo to operate properly.

NOTE:

The jumpers RST and TEST must also be populated when programming the device. They are not required for normal application operation.

4. Replace the existing MSP430 device in the LaunchPad MCU socket with the MSP430G2452 device that comes with the Capacitive Sense BoosterPack kit.

NOTE:

Some revision 1.4 LaunchPad kits need a firmware update to support the MSP430G2452 devices; see FAQ #1 in

Section 6 .

5. Connect the Capacitive Sense BoosterPack board to the LaunchPad with proper orientation by ensuring that the Texas Instruments logo and the text on the BoosterPack are in the same direction as the text and logo on the Launchpad.

6. Connect the LaunchPad with an USB cable to a PC or connect an external power supply (2.7 V to

3.6 V) to J6. The user experience demo application lights the center LED when power is supplied to the board.

NOTE:

The 32-kHz crystal/oscillator on pins 18 and 19 is not required for the user experience application to run.

2.2

Software Preparation

The steps described in the following sections are not required for a LaunchPad Capacitive Touch

BoosterPack stand-alone demo. For all other purposes that require PC software interaction, proper installation of the hardware driver and the software is required. To develop applications, its also necessary to install one of the IDEs shown on the Tools and Software section of the MSP430 landing page www.ti.com/msp430 . More information on how to start developing applications for the LaunchPad and how to install the drivers and IDEs that it requires can be found on the LaunchPad wiki page http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2) .

All LaunchPad Capacitive Touch BoosterPack User Experience firmware and software described in the following sections are provided in both binary/executable and source code forms, along with drivers and supporting documentation. [10] A zip file containing these items can be downloaded from www.ti.com/lit/zip/slac490 .

The same software package link and updates can also be found on the LaunchPad wiki page http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2) . When this package is installed, all user experience application demos are stored in the Software folder in the selected installation directory, and the source code for the projects can be found in the Source folder.

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Getting Started With 430BOOST-SENSE1 BoosterPack

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2.2.1

LaunchPad USB Driver

For the PC to communicate with the LaunchPad hardware, the LaunchPad USB driver must be installed. If this is the first time the LaunchPad is connected to the PC, install the USB serial COM port driver located at [INSTALL_PATH]\LaunchPad_Driver\LaunchPad_Driver.exe.

NOTE:

The LaunchPad USB drivers are integrated into the IDE installer packages from Code

Composer Studio (version 4+) or IAR Embedded Workbench (version 5.20+) and do not require a second installation if an IDE has already been installed.

2.2.2

Locate Software Programs

Two software programs are provided to work with the LaunchPad Capacitive Touch BoosterPack user experience demo. They are both installed to the [INSTALL_PATH]\Software folder. All software and firmware examples are also available as source code in the capacitive touch software package.

2.3

Capacitive Touch User Experience

The Capacitive Touch User Experience consists of three projects:

• The firmware application that can operate in stand-alone mode (LaunchPad Capacitive Touch

BoosterPack Firmware Demo)

• A processing GUI that displays the information from the LaunchPad Capacitive Touch BoosterPack visually (LaunchPad Capacitive Touch BoosterPack GUI Demo)

• A Visual Studio program that uses the LaunchPad Capacitive Touch BoosterPack input to control media in Windows (MediaPad).

2.3.1

LaunchPad Capacitive Touch BoosterPack Firmware Demo

The application described in this section can be used as either a stand-alone demo (no PC required) or as a demo with PC applications running. If PC application is desired, make sure to start the PC application execution before proceeding with step 2.

1. Plug the LaunchPad with Capacitive Touch BoosterPack into a USB source (such as USB port on PC,

USB hub, or USB battery pack) via the mini-USB connector or to a battery pack via the power pin connector J6. The User Experience application starts up and remains in sleep mode, with only the center LED on.

2. Slowly wave your hand or finger approximately 3 to 5 cm above the BoosterPack to trigger the proximity sensor and to wake the device. During the wake-up period, the LEDs surrounding the wheel light in a wake-up sequence, starting with a slow clockwise rotation and ending with a fast counter-clockwise rotation. As this sequence ends, the device enters active mode.

3. To perform a touch, firmly press any position on the wheel or the center button. Make sure to keep your finger between the circles of the wheel.

• Upon releasing a touch on the center button, the center LED toggles.

• Touching a wheel position lights up the corresponding LEDs.

4. To perform a gesture, slide your finger along the wheel without releasing it from the wheel. The corresponding LEDs trace and follow the touch and gesture.

5. After a short time of no capacitive touch activity, the board returns to sleep mode. Only the center LED stays on.

6. Go back to step 2 to re-enable the application active mode.

10

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Getting Started With 430BOOST-SENSE1 BoosterPack

2.3.2

LaunchPad Capacitive Touch BoosterPack GUI Demo

This section describes how to run the application on both the LaunchPad Capacitive Touch BoosterPack and the PC. It assumes that the hardware is connected to the PC via USB cable (see step 1 of

Section 2.3.1

) and that the software has been installed (see

Section 2.2

).

The following steps correspond to the instructions in

Section 2.3.1

.

1. Start the CapTouch_BoosterPack_UserExperience_GUI.exe application located at

[INSTALL_PATH]\Software\CapTouch_BoosterPack_UserExperience_GUI\.

When the GUI starts, it checks for a valid LaunchPad USB serial COM port. If no compatible port connection is available, the GUI prompts user to plug in the LaunchPad Capacitive Touch BoosterPack

(see

Figure 2 ). The GUI continues normally if it detects that a LaunchPad is plugged into the PC.

Figure 2. PC GUI Looking for LaunchPad

2. At start-up or after long period of inactivity, the device enters sleep mode and the GUI is disabled

(grayed out) to indicate sleep mode (see

Figure 3 ). Upon proximity sensor detection (for example,

wave your hand approximately 3 to 5 cm above the BoosterPack) the device returns to active mode and enables the GUI.

Figure 3. PC GUI in Sleep Mode

3. The 'Center Button' press data toggles the center circle color, mimicking the behavior of the center

LED on the BoosterPack.

The 'Wheel Tap' is represented by lighting up a single slice on the wheel and displaying the field number on the top left corner of the PC GUI.

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4. The gesture tracking (Start, Stop, and Update) is visualized on the wheel with the coloring of the wheel slices (see

Figure 4 ). Gesture can be tracked for several revolutions of the wheel, in both clockwise

and counter-clockwise directions

(1)

.

Figure 4. PC GUI in Active Mode

5. After a short time when no capacitive touch activity is detected, the board returns to sleep mode and the GUI is disabled.

2.3.3

MediaPad

This section describes instructions to run the MediaPad application on the LaunchPad Capacitive Touch

BoosterPack and the PC. It assumes that the hardware is connected to the PC via USB cable (see step 1 of

Section 2.3.1

) and that the software has been installed (see

Section 2.2

).

1. Start the MediaPad.exe application located at [INSTALL_PATH]\Software\MediaPad\

2. At startup, the application searches for a LaunchPad or an eZ430 emulator compatible USB serial

COM port.

If no compatible COM port is found, the application displays an error message and then exits.

If a LaunchPad COM port is found, the application displays a greeting message. When the user closes the message, the application minimizes itself to the taskbar.

3. When the LaunchPad Capacitive Touch BoosterPack is in sleep mode, no data is transferred and no activity occurs in the program. Use hand/finger wave motion to trigger the proximity sensor and wake up the device.

4. The following touches or gestures can be used for media control in a Windows system (see

Figure 5 ).

(a) Center button press: Start media player (Windows Media Player by default)

(b) Bottom arrow button press: Play/Pause

(c) Left arrow button press: Previous Track

(d) Right arrow button press: Next Track

(e) Scroll wheel clockwise: Volume Up

(f) Scroll wheel counter-clockwise: Volume Down

(1)

Using the wheel, a hidden mode can be unlocked. Input the correct sequence (similar to a rotational combination lock) to reveal a secret.

12

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Getting Started With 430BOOST-SENSE1 BoosterPack

Figure 5. MediaPad

NOTE:

The Microsoft .NET runtime library is required to run the MediaPad software. While most recent Windows PCs have the .Net runtime library installed, a new or reinstall of the library might be necessary.

SLAU337A – April 2011 – Revised September 2011

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13

Capacitive Touch BoosterPack Hardware

3 Capacitive Touch BoosterPack Hardware

www.ti.com

As shown in

Figure 6

and

Table 1 , the Capacitive Touch BoosterPack is a typical capacitive touch

application example for the new MSP430G2xx2 touch-sense enabled I/O pins. The board shows three different capacitive sensor types: a single button in the middle, a wheel made of four single capacitive sensors, and a proximity sensor around the edge of the PCB. In addition, there are nine LEDs on the board to give instant feedback to user interaction. The eight LEDs around the wheel are multiplexed to increase their number without using too many of the microcontrollers I/O pins. By using a time-shared signal, only five I/O pins are used to drive all eight LEDs.

Pin

1

2

3

9

10

11

12

13

4

5

6

7

8

17

18

19

20

14

15

16

Figure 6. Capacitive Sense BoosterPack Hardware

MSP430 Port

VCC

P1.0

P1.1/TXD

P1.2/RXD

P1.3

P1.4

P1.5

P2.0

P2.1

P2.2

P2.3

P2.4

P2.5

P1.6

P1.7

RST/SBWTDIO

TEST/SBWTCK

P2.6/XOUT

P2.7/XIN

GND

Table 1. BoosterPack Interface

NC

LEDx

LED1

LED2

SENS0

SENS1

SENS2

SENS3

SENS4

SENS5

LED3

LED4

NC

NC

NC

NC

GND

BoosterPack Signal

NC

LED9

NC

Description

Supply voltage, not connected to BoosterPack

The white center LED

Backchannel UART transmit data output, not connected to

BoosterPack

Backchannel UART receive data input, not connected to BoosterPack

LED base to drive the eight multiplexed LEDs

LED1 positive and LED5 negative drive

LED2 positive and LED6 negative drive

Touch-sense proximity sensor

Touch-sense wheel sensor left

Touch-sense wheel sensor down

Touch-sense wheel sensor right

Touch-sense wheel sensor up

Touch-sense center button sensor

LED3 positive and LED7 negative drive

LED4 positive and LED8 negative drive

Reset line for SBW JTAG data, not connected to BoosterPack

Test line for SBW JTAG clock, not connected to BoosterPack

Oscillator output, not connected to BoosterPack

Oscillator input, not connected to BoosterPack

Supply ground

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3.1

Driving the LEDs

The white center LED is connected to port P1.0 of the Value Line device and can be turned on by setting this port as output. The other eight LEDs are multiplexed as shown in

Figure 7

. Four LEDs are connected with the diode cathodes to the ports P1.4 to P1.7, and the other four LEDs are connected with the diode anodes. All LEDs are connected to port P1.3 to either source or drain four LEDs at any one time. To drive a particular set of these eight LEDs, two steps are required:

1. Port P1.3 acts as GND drain, so that the first nibble can drive LED1 to LED4 directly. The other LEDs are not active during this time.

2. Port P1.3 acts as a VCC source to light LED5 to LED8. The pattern for the second nibble must be inverted and set to port P1.4 to P1.7.

Figure 7. Schematic LED Multiplexing

Switching between modes can be controlled by a timer and has to be at least 100 times a second to generate the illusion of a constant light pattern. To reduce glitches while switching the LED modes, it is recommended to set the LED signals that are not being driven to input mode.

Figure 8

shows the signals of all the LED driving pins required to light up LED1, LED3, LED6, and LED7. The mode on P1.3 can be set before or after the LED settings, as long as the unused LEDs are set to input mode.

NOTE:

The current user experience implementation is not using a time-shared approach to drive the

LEDs, due to the shared CPU and timer resources utilized by the Capacitive Touch Sense

Library [7] functions and the UART transmissions.

Figure 8. Driving LEDs

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Capacitive Touch BoosterPack Hardware

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3.2

Capacitive Touch Sensors

The six different capacitive touch sensor areas are connected to the Port 2 of the device. On the MSP430

Value Line devices with enabled touch-sense, Port 2 I/Os have no analog functionality. These I/Os also have a smaller internal capacitance than Port 1, which make these them more sensitive than the capacitive touch sensors on Port 1.

Figure 9

shows the connection of the capacitive touch sensor areas to the MSP430.

Figure 9. Capacitive Touch Sensor Areas

To enable the touch-sense feature of the I/Os, set the secondary port select PxSEL2 and clear the PxSEL bit. The selected pins start oscillating immediately, and the frequency is a direct indication of the capacitance connected to the port pin. The touch-sense I/Os oscillate within a frequency range of 1 to 2

MHz, which is strongly dependant on the supply voltage, the device package, and environmental influences. For more information about the touch-sense feature of the Value Line devices, to download code example, or to find application examples, go to the Capacitive Touch BoosterPack wiki page

( http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2) ) or get the MSP430

Capacitive Touch Sense Library ( http://focus.ti.com/docs/toolsw/folders/print/capsenselibrary.html

), which is used in the application demo included in this kit.

NOTE:

The Capacitive Touch BoosterPack hardware can also be used with other MSP430 devices.

Resistors R10 to R15 must be populated with a resistor to realize a RC discharge that can be measured with a timer.

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4

LaunchPad Capacitive Touch BoosterPack User Experience Firmware

LaunchPad Capacitive Touch BoosterPack User Experience Firmware

This section describes the firmware application that is provided with the project. Detailed information on the project construction, use of the Capacitive Touch Sense Library, and how to set up and import the projects is included. Source code for the MSP430G2452 firmware application is installed to the

[INSTALL_PATH]\Source\ folder as described in

Section 2.2

.

The User Experience application operates on the LaunchPad platform using the MSP430G2452 device and the Capacitive Touch BoosterPack plugin board. The capacitive touch and proximity sensing are enabled by the pin oscillator feature, which is new to the MSP430G2xx2 family devices. The User

Experience application also uses the Capacitive Touch Sense Library [7] to realize and measure the capacitive touch and proximity sensors. The Capacitive Touch Sense Library provides layers of abstraction to generate higher logical outputs such as logical touches and their position (in this hardware, a four-button wheel).

The User Experience application starts in sleep mode, sampling the proximity sensor approximately every

8.3 ms (VLO / 100 = 12 kHz / 100 = 120 Hz). Upon registering a valid proximity event (for example, a hand, finger, or object hovering approximately 3 to 5 cm from the BoosterPack), the application enters the active mode. During the wake-up period, the LEDs surrounding the wheel light in a wake-up sequence, starting with a slow clockwise sequence and ending with a fast counter-clockwise sequence. As this sequence ends, the device enters active mode.

In active mode, the application samples and registers individual finger touches on the 16-position wheel or the center button. It also recognizes simple gestures (clockwise and counter-clockwise) when the finger moves along and remains on the wheel. Upon wheel position detection, the corresponding LEDs surrounding the wheel light up accordingly. Each individual tap on the center capacitive touch button toggles the center LED.

After a short time without any touch activity (on the wheel or on the center button), the application returns to sleep mode, enabling only the proximity sensor periodically.

A 9600-baud UART link is also implemented using software Timer_A to provide application and capacitive sensing data to the PC via the UART-USB back channel. The application sends UART data on events such as wake up, sleep, touch, or gesture.

For more detailed information on the firmware project, see the source code and the associated

ReadMe.txt.

4.1

Import Project in CCS

To import the project into CCS:

1. Open CCS.

2. Select a new project workspace outside of the project folder (1) .

3. Select Project--

>

Import Existing Project.

4. Browse to the [PROJECT_ROOT]\CCS folder.

5. Make sure that "Copy projects into workspace" is not checked.

6. Click Finish

NOTE:

For CCS, while project root is in the outer directory, the CCS project files are located inside

CCS. To enable the portability of the project, the file macros.ini is created to define the root.

Additionally, all project code files (.c, .h) are added as linked resources with their relative path to the project root.

4.2

Open Project and Workspace in IAR Embedded Workbench

To open the project in IAR Embedded Workbench:

1. Browse to the [PROJECT_ROOT]\IAR folder.

2. Open the Sense_BoosterPack_UserExperience.eww workspace.

(1)

The workspace should be in an independent folder, not containing or contained by the project/package folder.

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4.3

Capacitive Touch Sense Library

The Capacitive Touch Sense Library ( CAPSENSELIBRARY ) is a configurable tool to abstract the various peripheral settings from the application and perform several capacitive touch functions through API calls.

The following describes the configuration of the library to support the Capacitive Touch BoosterPack, the methodology to calibrate the different elements, and how the API calls are used in the application to create the user experience.

1. Configuration

The first step in the configuration process is identifying the methodology used to measure the capacitance. For the Capacitive Touch BoosterPack, the goal is to highlight the new PinOsc feature; therefore, an RO implementation is chosen, and the relaxation oscillator is implemented with the

PinOsc. The RO implementation requires two timers (hardware or software timers): an interval timer

(gate) and a frequency counter. The frequency counter is implemented with the Timer_A0 peripheral, and the interval timer is implemented with the WDT+.

The Capacitive Touch BoosterPack is represented in the various structures defined in the file structure.c. The element structures define the GPIO and the performance characteristics of each element. The GPIOs are defined first, the appropriate sensor characteristics are defined, and the performance characteristics are measured and added.

The sensor structure groups elements as appropriate and identifies the measurement characteristic for that group, namely the interval period. For the RO method, increasing the interval time increases the sensitivity; however, this is at the cost of response time, which is critical for supporting the PC GUI in this application.

The proximity sensor uses an SMCLK of 125 kHz. For the button and wheel, the frequency is increased to 1 MHz. The interval count is 8192: 8.192-ms gate time for the button and wheel elements and 65.5-ms gate time for the proximity element. The wheel is a special kind of sensor in which each element contributes to the sensor performance. The wheel is made up of four elements divided into 64 points or sections and requires that the cumulative response exceed 75 percent. This percentage is based upon the normalized response where meeting the threshold would represent 0% and the maximum response would represent 100%. This is to account for cases when the interaction is near the edges of the wheel instead of the middle.

2. Calibration

The calibration of the middle button and the proximity sensor are relatively straight forward, because the desired output is a binary indication of whether or not the threshold is exceeded. Using a controlled test fixture to represent the minimum touch (distance in the case of the proximity sensor), the values are recorded and input as the threshold value in the element structure.

The calibration for the wheel is more complicated, as several measurements are required at various positions. See the "Sensor Arrays: Wheels and Sliders" section in the Capacitive Touch Sense Library

User's Guide ( SLAA490 ) for a detailed explanation.

The calibration values for each element are recorded in the element structure in the file structure.c.

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3.

API Calls

There are five API functions that are called several times in the application.

• The TI_CAPT_Init_Baseline and TI_CAPT_Update_Baseline functions initialize and update, respectively, the baseline tracking performed by the library. Typically, these functions are called at the beginning of an application or after long periods of inactivity. In this application, the initialization and updates are performed after a power-up sequence and before a transition from the sleep

(polling proximity sensor only) to active (polling button and wheel only). These functions are used at the transitions, because it is unknown how old the previous measurements are and if these still represent the current environment.

• The TI_CAPT_Custom function measures the proximity sensor. The variable dCnt is updated with the measured value. In this application, this variable is compared to a threshold value. Because this is a simple On/Off function, the TI_CAPT_Button function could have been used but, for demonstration purposes, the TI_CAPT_Custom function was chosen. When a threshold crossing is detected, an LED sequence is started, and the application transitions to the active state (polling the wheel and middle button). One possible enhancement of the proximity sensor application is to enable several different thresholds and indicate how close the user is with the LEDs on the

BoosterPack.

• The TI_CAPT_Button function determines if the middle button has been detected. This function returns either a 1 to indicate a threshold crossing (touch) or a 0 to indicate that no touch was detected. The middle LED is illuminated to indicate a touch.

• The TI_CAPT_Wheel function indicates the position on the wheel if it was touched or returns a defined value if no touch was detected. This information is used by the application for gesture recognition (which is sent to the PC) and for illuminating the eight LEDs around the board.

For more information on the library, see the Capacitive Touch Sense Library User's Guide ( SLAA490 ).

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LaunchPad Capacitive Touch BoosterPack User Experience Software

5 LaunchPad Capacitive Touch BoosterPack User Experience Software

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5.1

LaunchPad Capacitive Touch BoosterPack User Experience GUI

Written in Processing, this Windows PC GUI application communicates with the LaunchPad to receive specific capacitive touch data from the LaunchPad Capacitive Touch BoosterPack and provides the visualization of that data in the GUI. Processing is a platform-independent open-source programming language and environment, specializing in visual arts, graphics, and interactive applications.

The GUI uses a small .NET utility (FindAppUART.exe) to automatically detect a proper

LaunchPad/430Emulator device connected to the PC USB port. Upon correct USB COM port discovery, the application initiates a 9600-baud UART connection and starts receiving data.

The GUI processes event and capacitive touch data and visualizes the data on the GUI in a 16-slice wheel formation. Individual touches as well as gestures can be tracked in real time.

Further description of the behavior can be found in

Section 2.3.2

and the ReadMe.txt in the project source code directory.

The application also takes advantage of the serial library for USB COM serial communication, and the sound library pitaru.sonia_v2_9 (available at http://sonia.pitaru.com/download.htm

) for audio effects.

5.1.1

Requirements

The following utilities and libraries are required when modifying the User Experience source code.

• Processing ( www.processing.org

)

• Serial library (included with Processing installation)

• pitaru.sonia_v2_9 sound library ( sonia.pitaru.com/download.htm

)

• FindAppUART.exe (included .NET utility)

5.2

MediaPad

The program MediaPad, written using Visual Studio, translates capacitive touch data from from the

LaunchPad Capacitive Touch BoosterPack into Microsoft Windows virtual keystrokes for Windows media control. The application implements auto-detection code that automatically finds a LaunchPad-compatible

USB COM port before establishing the proper connection. Further behavior of the application is described in

Section 2.3.2

and the ReadMe.txt in the project source code directory.

5.2.1

Requirements

When modifying the MediaPad source code, Microsoft Visual C++ 2010 Redistributable Package (included in any version of Visual Studio 2010) (available at http://www.microsoft.com/downloads ) is required.

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5.3

UART Communication Protocol

For each event (wake up, go to sleep, touch/press, or gesture), a UART packet of two bytes is sent via the application UART backchannel of the LaunchPad. The packets are specified as follows:

• WAKE UP [due to proximity sensor detection]: 0xBE 0xEF

• SLEEP [after period of inactivity]: 0xDE 0xAD

• CENTER BUTTON PRESS: 0x80 0x80

• WHEEL POSITION TOUCH/PRESS: 0x3z 0x3z z = touch position 0x0 to 0xF, one nibble

• GESTURE START: 0xFC 0x2z z = touch position 0x0 to 0xF, one nibble

GESTURE STOP: 0xFB 0xFB

• GESTURE and GESTURE END POSITION : 0xGG 0x2

GG = a binary number

MSB is direction: 0 = clockwise, 1 = counter-clockwise

7 LSBs = count of gesture movement z = ending position of the immediate gesture, 0x0 to 0xF, one nibble.

The PC application can receive and decipher the UART information to translate it into appropriate actions.

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Frequently Asked Questions (FAQ), Tips, and Tricks

6 Frequently Asked Questions (FAQ), Tips, and Tricks

www.ti.com

1. The LaunchPad is unable to program the MSP430G2452.

Some of the revision 1.4 LaunchPad kits must have a firmware update to support the MSP430G2452 devices. Update the LaunchPad firmware with the application provided at processors.wiki.ti.com/index.php/MSP430_LaunchPad_Firmware_Update .

2. The touch-sense I/Os are not working when the LaunchPad is picked up.

Place the board flat on a table or other stable horizontal surface before using the Capacitive Touch

BoosterPack. Do not hold the board while it is in use; the contacts on the back of the Capacitive Touch

BoosterPack may be touched, which prevents the touch-sense I/Os from detecting user interaction.

3. My application is not able to light up all the LEDs.

The LEDs around the wheel are multiplexed; therefore, they cannot all be turned on simultaneously. Its required to use a time-shared approach to light up all LEDs at once (see

Section 3.1

).

4. The button or the wheel is sometimes fails to detect the first touch.

Make sure to wave your hand 3 to 5 cm above the board to wake the device before actually touch the wheel or button. The capacitive sensors are activated immediately after the wake-up sequence is finished.

5. Windows Media Player is not starting.

Loading Windows Media Player might take some time, depending on the system. On some systems, another media player program is associated with the Windows media keys.

7 References

The primary sources of MSP430 information are the device-specific data sheets and user's guides. The most up-to-date versions of the documents can be found at the Texas Instruments MSP430 web page. [1]

All MSP430 LaunchPad and BoosterPack information can be found at the MSP430 LaunchPad wiki. [2]

The MSP430 LaunchPad and Value Line devices are supported in the latest versions of Code Composer

Studio [3] and IAR Embedded Workbench [4]. In-depth details on the supported IDEs (CCS and IAR) can be found in the documentation folders of the IDE installation. IAR tool documentation (Workbench/C-SPY, the assembler, the C compiler, the linker, and the library) is in the common\doc and 430\doc folders. CCS documents is in the msp430\doc folder under the CCS installation path.

The FET user's guides [5] [6] also include detailed information on how to set up a project for the MSP430 using CCS or IAR Embedded Workbench. These user's guide are also included in the latest IDE releases.

1.

http://www.ti.com/msp430

2.

http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2)

3.

http://processors.wiki.ti.com/index.php/Download_CCS

4.

http://focus.ti.com/docs/toolsw/folders/print/iar-kickstart.html

5. Code Composer Studio v4.2 for MSP430(tm) Users Guide ( SLAU157 )

6. IAR Embedded Workbench Version 3+ for MSP430(tm) User's Guide ( SLAU138 )

7. Capacitive Touch Sense Library (CAPSENSELIBRARY)

( http://focus.ti.com/docs/toolsw/folders/print/capsenselibrary.html

)

8. Capacitive Touch Sense Library User's Guide ( SLAA490 )

9. Capacitive Touch Sense Library Quick Start Guide ( SLAA491 )

10. Capacitive Touch BoosterPack Software and Design Documentation ( www.ti.com/lit/zip/slac490 )

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8 Schematics and PCB Layout

8.1

Schematics

Schematics and PCB Layout

Figure 10. Capacitive Touch BoosterPack Schematic

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Schematics and PCB Layout

8.2

PCB Layout

Figure 11. Capacitive Touch BoosterPack Layout, Top Layer

www.ti.com

Figure 12. Capacitive Touch BoosterPack Layout, Bottom Layer and Silkscreen

8.3

Bill of Materials (BOM)

Pos.

3

4

1

2

5

6

Ref Name

R1 to R8

R9

LED1 to LED8

LED9

J1, J2

R10 to R15

Table 2. Bill of Materials

Number per

Board

8

1

2

0

8

1

Description

390Ω SMD0603 resistor

180Ω SMD0603 resistor

Top LED red wtr clr 631NM 1206

LED white round diffused 1206

Female header SSM-110-L-SV 2.54 mm

SMD0603 resistor (not populated)

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Revision History

Revision History

Changes from Original (April 2011) to A Revision

..........................................................................................................

Page

• Clarified import instructions in

Section 4.1

...........................................................................................

17

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

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Revision History

25

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