Intel

®

User Guide

Atom™ Processor E6xx

Series Thermal Test Board

September 2010

Document Number: 324473-001

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2 Thermal Test Board User Guide

Contents

1 Introduction ....................................................................................................... 6

2 Intel

®

Atom™ Processor E6xx Series Thermal Test Board ........................................ 7

3 Intel

®

Atom™ Processor E6xx Series Thermal Test Vehicle ...................................... 8

3.1

Thermal and Electrical Vehicle Characteristics ............................................. 8

3.1.1

Heaters ..................................................................................... 8

3.1.1.1

Heater Dimension ........................................................ 8

3.1.1.2

Heater Connectivity and Locations ................................. 8

3.1.2

Temperature Sensors ................................................................ 10

3.2

Temperature Sensor Usage ..................................................................... 12

3.2.1

Temperature Sensor Calibration ................................................. 12

3.2.1.1

Four-Wire Resistance Calibration ................................. 12

3.2.2

Temperature Measurements ...................................................... 14

3.2.3

Thermal Solution and Still Air Chamber ....................................... 15

4 Summary ........................................................................................................ 16

Appendix A - Thermal Test Board Design .................................................................. 17

Appendix B – Thermal Test Board Dimensions ........................................................... 19

Appendix C – Thermal Test Board Photos .................................................................. 20

Appendix D - 4-wire Constant Current Measurement Procedure ................................... 21

D.1

Constant Current Measurement Theory .................................................... 21

Thermal Test Board User Guide 3

Figures

Figure 1. Side View of Thermal Test Vehicle Package .............................................. 6

Figure 2. Top and Bottom View of Thermal Test Vehicle Package .............................. 6

Figure 3. Thermal Test Board Designed for the Intel

®

Atom™ Processor E6xx Series

Thermal Vehicle .................................................................................... 7

Figure 4. Heater Dimension on the Test Chip ......................................................... 8

Figure 5. Heater Layout on the Test Chip ............................................................... 9

Figure 6. Electrical Connections to Power the Heater on the Test Chip While Monitoring

Voltage and Current ............................................................................ 10

Figure 7. Schematic of Temperature Sensor Locations........................................... 11

Figure 8. Example of Electrical Connections of ‘Die-Center’ Temperature Sensor for 4-

Point Measurement ............................................................................. 12

Figure 9. Example of Four-Wire Resistance Measurement Setup ............................. 13

Figure 10. Example of Thermal Die Sensor (TS_DC) Characteristics Using a Four-wire

Resistance Calibration ....................................................................... 14

Figure 11. Temperature Measurement Setup ....................................................... 15

Figure 12. Thermal Solution and Still Air Chamber for Temperature Measurement .... 15

Figure 13. Mechanical Dimensions and Enabling Holes Location .............................. 19

Figure 14. Edge Fingers and Through-hole Pin Headers ......................................... 20

Figure 15. Constant Current Measurement Wiring Diagram .................................... 22

Tables

Table 1. Heater Connectivity on the Thermal Test Vehicle ........................................ 9

Table 2. Electrical Connections of the Temperature Sensor for 4-Point Measurement 10

Table 3. Temperature Sensors and Heaters Connectivity ....................................... 17

4 Thermal Test Board User Guide

Revision History

Rev. No.

1.0

2.0

Initial Release

First SKU launch

Description Rev. Date

June 2010

September 2010

Thermal Test Board User Guide 5

Introduction

1 Introduction

A thermal test board is provided by Intel to aid in embedded system thermal designs for the latest Intel embedded processor product, Intel

®

Atom™ Processor E6xx Series.

Figure 1 and Figure 2 show a side, and top/bottom view of the Intel

®

Atom™

Processor E6xx Series thermal test vehicle (FCBGA package).

Figure 1. Side View of Thermal Test Vehicle Package

Die

BGA

Figure 2. Top and Bottom View of Thermal Test Vehicle Package

6

The thermal test board (TTB) is designed to be used with an FCBGA thermal test vehicle to facilitate proper connections to the various heaters and temperature sensor structures. Test vehicle structures are accessible through TTB as per information given in Appendix A. Additionally, a Gerber file for the TTB can also be available from your

Intel representative. This Gerber file can be modified to resemble a notebook planar board. Please contact your Intel representative for obtaining any TTB boards, or its

Gerber file.

To use an FCBGA thermal test vehicle, it must be surface mounted onto a test board.

The test vehicle structures can be accessed as per the pin/ball map, as shown in

Appendix A.

Thermal Test Board User Guide

Intel® Atom™ Processor E6xx Series Thermal Test Board

2 Intel

®

Atom™ Processor E6xx

Series Thermal Test Board

The enabling thermal test board (TTB), designed for FCBGA type packages, is

5.5 inches long, and 4 inches wide. Figure 3 shows the layout for the PCB (designed by Intel) to power and read temperature from the Intel

®

Atom™ Processor E6xx

Series thermal test vehicle through edge connector, from 1 to 36. The connections are also designed for through-hole pin headers temperature measurement from D1 to D9, for both A+ and B-, where A+ is the set of top tabs and B- are connected to the tabs on the lower side of board. The through via-pairs are separately routed and are distinguished as x and y, x being the on the higher tab number or placed to the left side of the y. P1 to P3 are designed for heater connection.

There are a total of 4 holes provided in the TTB for heat sink/thermal solution attachment (refer to Figure 13).

Figure 3. Thermal Test Board Designed for the Intel

®

Thermal Vehicle

Atom™ Processor E6xx Series

Thermal Test Board User Guide 7

Intel® Atom™ Processor E6xx Series Thermal Test Vehicle

3 Intel

®

Atom™ Processor E6xx

Series Thermal Test Vehicle

3.1 Thermal and Electrical Vehicle Characteristics

This section describes the thermal attributes of the thermal test vehicle (TTV), electrical connections of the heater and temperature sensors, temperature measurements, and test vehicle specifications. The thermal test vehicle includes heaters to simulate component power levels and temperature sensors to monitor the component temperatures.

3.1.1 Heaters

3.1.1.1 Heater Dimension

Figure 4. Heater Dimension on the Test Chip

Heater Dimension: 9250 x 9250 um >90% die area

M9 width 33 um; Min spacing 13 um

M9 length – approximately 911 um

2 v8 per M8 - 1.4 um x 10 um

M8 width 2.5 um; Pitch 8.41 um

M8 length ~9250 um

M8

Two V8

3.1.1.2 Heater Connectivity and Locations

• Each group of five FH and five FL bumps are shorted together on substrate and connected to 3 BGA each.

• 5 uvias and PTH is required on each layer for each FH and FL pinouts.

• For whole die heating connect HTR_FH/MH and HTR_FL/ML. Otherwise, half die heating.

8 Thermal Test Board User Guide

Intel® Atom™ Processor E6xx Series Thermal Test Vehicle

Table 1. Heater Connectivity on the Thermal Test Vehicle

Net Name Package Pin

HTR_FH A1.G13 A1.H12 A1.J13

HTR_MH A1.H15

HTR_FI_FH A1.G25 A1.H24 A1.J25

HTR_FI_MH A1.H26

HTR_FL A1.G39 A1.H40 A1.J39

HTR_ML A1.H37

Figure 5. Heater Layout on the Test Chip

911 911 911 911 911 911 911

1 Hanging M8 line to enable M9 spacing

HTR_MH

HTR_FI_FH

HTR_FI_MH

HTR_FH

455.5

911 911 911 911 911 911

455.5

HTR_ML

HTR_FL

Thermal Test Board User Guide 9

Intel® Atom™ Processor E6xx Series Thermal Test Vehicle

Figure 6. Electrical Connections to Power the Heater on the Test Chip While Monitoring

Voltage and Current

V

Digital Voltmeter

Heater Resistor

Digital

Current

Meter

I

DC Power

Supply

3.1.2 Temperature Sensors

Resistive Temperature Detector (RTD) type temperature sensors are used. Here the temperature sensors measure the die temperature by using a linear relationship between either the sensor resistance, or the voltage drop across the resistor, and the sensor temperature. For example, as the temperature increases, the measured voltage drop across the temperature sensor increased for a given constant current condition. By calibrating this sensor voltage drop with respect to temperature, one can determine the device temperature from voltage measurements.

Note: Both measurement methods (constant current, and 4-wire resistance measurement) produce comparable accuracy. The choice of measurement method can be decided by the user depending upon the available instrumentation.

There are a total of 6 temperature sensors on the test chip. TS_DC is recommended to mimic hot-spots location on the actual processor silicon.

Table 2. Electrical Connections of the Temperature Sensor for 4-Point Measurement

Test

Type

Test

Name

Measur e High

Force

Low

Measure

Low

TS_DC_F

H

TS_DC_F

L A1.BE16

10 Thermal Test Board User Guide

Intel® Atom™ Processor E6xx Series Thermal Test Vehicle

An example of the electrical connection schematic for the temperature sensors is illustrated in Figure 8. Here, for 4-wire measurement, a 1 mA constant current source is applied to the temperature sensor while a multi-meter is used to measure the voltage across the temperature sensor.

Figure 7. Schematic of Temperature Sensor Locations

TS_TR TS_DC TS_TL

TS_RE

TS_BR

TS_xx

= Temp Sensor

TS_BL

Thermal Test Board User Guide 11

Intel® Atom™ Processor E6xx Series Thermal Test Vehicle

Figure 8. Example of Electrical Connections of ‘Die-Center’ Temperature Sensor for 4-

Point Measurement

12

3.2 Temperature Sensor Usage

This section describes temperature sensor calibration and measurements.

3.2.1 Temperature Sensor Calibration

Before the thermal vehicle can be used for system thermal characterization, the temperature sensors must be calibrated in the manner described in one of the following sections. The sensors should be calibrated preferably in a constant temperature chamber, otherwise the sensor will require a larger amount of time to soak and reach steady state.

3.2.1.1 Four-Wire Resistance Calibration

A four-wire resistance calibration requires the use of a multi-meter or a data acquisition unit that is designed to accept inputs for a four-wire measurement. Each of the sensors should be instrumented in a manner similar to the one shown in Figure 9.

Warning:

Do not use a two-wire resistance measurement for calibration or thermal testing because it may result in inaccurate temperature measurements. For more details on the differences between a two-wire and four-wire measurement, refer to

Appendix D.

Thermal Test Board User Guide

Intel® Atom™ Processor E6xx Series Thermal Test Vehicle

Figure 9. Example of Four-Wire Resistance Measurement Setup

The calibration procedure is as follows:

1. Connect the temperature sensor to a multi-meter or a data acquisition unit that is capable of taking four-wire resistance measurements. Refer to the example shown in Figure 9.

2. Place the thermal vehicle in a constant temperature bath, using 0º C as the initial temperature setting. Soak the unit for a sufficient amount of time in order to allow the thermal vehicle to reach thermal equilibrium with the bath.

3. Measure the resistance of the temperature sensor and record the thermal bath temperature.

4. Reset the temperature of the thermal bath to 30º C and continuously monitor the bath temperature and temperature sensor resistance. Wait for a sufficient amount of time until the bath and thermal vehicle reach thermal equilibrium. At thermal equilibrium, the bath temperature and temperature sensor resistance will not change. Record the bath temperature and temperature sensor resistance.

5. Repeat step 4 for 50º C and 70º C.

6. Perform a linear regression analysis on the measured data to determine a linear calibration curve.

(Sensor Temperature) = (Sensor Resistance) * SLOPE + INTERCEPT

7. Refer to Figure 10, for the temperature sensor TS_DC calibration plot for the fourwire measurement method. Y = 0.4787X – 241.04.

8. Each sensor will vary from this performance curve and thus the example plot must not be used to determine temperature on any other sensors.

Thermal Test Board User Guide 13

Intel® Atom™ Processor E6xx Series Thermal Test Vehicle

Figure 10. Example of Thermal Die Sensor (TS_DC) Characteristics Using a Four-wire

Resistance Calibration

14

3.2.2 Temperature Measurements

After the temperature sensors are calibrated, they can be used to determine sensor temperatures during thermal testing with the following procedure:

1. Place the test vehicle in the system or thermal solution to be tested.

2. For a constant current method, connect the temperature sensors of the test vehicle to a 1-mA constant current source and a voltage meter as shown in Figure

9. and Figure 12. For a 4-wire measurement use a setup similar to Figure 10.

3. Power up the heaters in the test vehicle to the desired power level.

4. Wait for the system to reach thermal equilibrium.

Record the sensor voltage drop (or resistance) for each of the temperature sensors.

Calculate the temperature being measured by using the sensor voltage drop (or resistance) and temperature calibration charts for each sensor.

Thermal Test Board User Guide

Intel® Atom™ Processor E6xx Series Thermal Test Vehicle

Figure 11. Temperature Measurement Setup

3.2.3 Thermal Solution and Still Air Chamber

Characterization has to be done with thermal solution. Attached the thermal solution on the thermal test vehicle, and place the thermal test board into still air chamber

(dimension 1ft x 1ft), see Figure 12. Do not power the heaters without a system thermal solution attached to the die.

Figure 12. Thermal Solution and Still Air Chamber for Temperature Measurement

Thermal Solution 1ft x 1ft Still Air Chamber

Thermal Test Board User Guide 15

Summary

4 Summary

This document describes how to use the Intel

®

Atom™ Processor E6xx Series thermal test vehicle provided by Intel to aid in the design of embedded system thermal solutions. To use the FCBGA thermal test vehicles, a test board and sensor calibration is required. To use FCBGA test vehicles, it must be directly attached to a test board, and then calibrated.

Note: The information in this document is preliminary and subject to change. Please contact your Intel representative for the latest available information or with any questions related to the usage of this product.

16 Thermal Test Board User Guide

Appendix A - Thermal Test Board Design

Appendix A - Thermal Test Board

Design

Table 3. Temperature Sensors and Heaters Connectivity

TS /

Heater

TS_BR D2

TS_RE D4

TS_TR D6

TS_DC D3

TS_TL D5

TS _BL

Tab

Pair on

Board

D1

Side of

Board

Top A+

Top A+

Bottom B-

Bottom B-

Top A+

Top A+

Bottom B-

Bottom B-

Top A+

Top A+

Bottom B-

Bottom B-

Top A+

Top A+

Bottom B-

Bottom B-

Top A+

Top A+

Bottom B-

Bottom B-

Top A+

Top A+

Bottom B-

Bottom B-

Edge

Finger #

14

13

14

16

17

16

17

10

11

10

8

7

8

11

13

4

5

4

5

7

1

2

1

2

Net Name

TS_BR_FH

TS_BR_MH

TS_BR_FL

TS_BR_ML

TS_RE_FH

TS_RE_MH

TS_RE_FL

TS_RE_ML

TS_TR_FH

TS_TR_MH

TS_TR_FL

TS_TR_ML

TS_DC_FH

TS_DC_MH

TS_DC_FL

TS_DC_ML

TS_TL_FH

TS_TL_MH

TS_TL_FL

TS_TL_ML

TS_BL_FH

TS_BL_MH

TS_BL_FL

TS_BL_ML

Package

Pin

Number Polarity Function

A1.BB46

A1.AY46

A1.BA45

A1.BE16

A1.BD17

A1.BD15

A1.BE18

A1.AY6

A1.BB6

A1.AW7

A1.BA7

A1.V7

A1.T7

A1.U6

A1.W6

A1.L45

A1.R46

A1.N45

A1.M46

A1.AE45

A1.AH44

A1.AF44

A1.AG45

A1.AW45

+

+

-

+

-

-

-

+

+

-

+

-

-

-

+

+

+

-

-

+

-

-

+

+

Force High

Measure High

Force Low

Measure Low

Force High

Measure High

Force Low

Measure Low

Force High

Measure High

Force Low

Measure Low

Force High

Measure High

Force Low

Measure Low

Force High

Measure High

Force Low

Measure Low

Force High

Measure High

Force Low

Measure Low

Thermal Test Board User Guide 17

Top A+

Top A+

HTR Half

Silicon P1

Bottom B-

Bottom B-

Top A+

Top A+

HTR Half

Silicon P2

Bottom B-

Bottom B-

Top A+

Top A+

HTR

Whole

Silicon P3

Bottom B-

Bottom B-

Appendix A - Thermal Test Board Design

TS /

Heater

Tab

Pair on

Board

Side of

Board

Edge

Finger #

29

30

29

30

32

33

32

33

35

36

35

36

Net Name

HTR_FH

HTR_MH

HTR_FI_FH

HTR_FI_MH

HTR_FI_FH

HTR_FI_MH

HTR_FL

HTR_ML

HTR_FH

HTR_MH

HTR_FL

HTR_ML

Package

Pin

Number Polarity Function

A1.G13

A1.H12

+ Measure High A1.H15

A1.G25

A1.H24

A1.H26

A1.G25

A1.H24

A1.H26

A1.G39

A1.H40

-

+

Measure Low

Measure High

A1.H37

A1.G13

A1.H12

A1.H15

A1.G39

A1.H40

A1.H37

-

+

-

Measure Low

Measure High

Measure Low

18 Thermal Test Board User Guide

Appendix B – Thermal Test Board Dimensions

Appendix B – Thermal Test Board

Dimensions

Figure 13. Mechanical Dimensions and Enabling Holes Location

Thermal Test Board User Guide 19

Appendix C – Thermal Test Board Photos

Appendix C – Thermal Test Board

Photos

Figure 14. Edge Fingers and Through-hole Pin Headers

20 Thermal Test Board User Guide

Appendix D - 4-wire Constant Current Measurement Procedure

Appendix D - 4-wire Constant

Current Measurement Procedure

D.1 Constant Current Measurement Theory

A four-wire constant current temperature calibration and measurement method is recommended to obtain accurate temperature sensor resistance measurements. This is a good way to ensure that any added resistances in the sensor circuit are excluded from the sensor resistance measurement.

Four wires are provided for each sensor. Two of the wires are used to provide a constant current through the temperature sensor to induce a voltage potential across the sensor. The current supplied is ~1mA

1

.

The second pair of wires is used to measure the voltage drop across the temperature sensor. This voltage drop is measured at the appropriate point on the ETB board and is equivalent to the voltage drop across the sensor. The resistance in the sensor wiring will not affect the voltage measurement at the point on the ETB board. The true resistance of the sensor can be calculated by applying the following expression:

Sensor Resistance = Voltage/Current. In the example figure shown below, the measured voltage is 0.195 V and the calculated sensor resistance is 195 Ω (0.195

V/0.001 A).

1 The current supplied is ~1 mA and it is maintained at a small amount to avoid heating up

of the temperature sensor elements. Recall that the power dissipated through a resistive element is calculated by: (Power = Current

2

x Resistance). So for a sensor resistance

of~195Ω, and a measuring current of 0.001 Amps, total power dissipated through the

sensor= ~0.0002 Watts. This power level is small and does not significantly affect the

temperature of the sensor.

Thermal Test Board User Guide 21

Appendix D - 4-wire Constant Current Measurement Procedure

Figure 15. Constant Current Measurement Wiring Diagram

+

0.195V

V

-

Temperature Sensor

0.2 mW

1 mA

+

Constant Current

Source

-

22 Thermal Test Board User Guide