5200 Series L5215 | User manual | Intel 5200 Series L5238, L5215 Dual-Core Xeon Processor Thermal/Mechanical Design Guidelines
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The Dual-Core Intel® Xeon® Processor 5200 L5238 and Dual-Core Intel® Xeon® Processor 5200 L5215 are power-optimized processor with a front side bus speed of 1333 MHz and 1066 MHz, respectfully. The Dual-Core Intel® Xeon® Processor 5200 L5238 and Dual-Core Intel® Xeon® Processor 5200 L5215 are targeted for volumetrically constrained form factors like AdvancedTCA* and any other small form factor systems. This document includes information about the mechanical and thermal requirements of the processor cooling solution.
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Dual-Core Intel
Applications
®
Xeon
®
Processor
5200 Series in Embedded
Thermal/Mechanical Design Guidelines
September 2008
Document Number: 319012 Revision: 002
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Dual-Core Intel
®
Xeon
®
Processor 5200 Series may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel's website at http://www.intel.com.
Intel, Intel Inside, Xeon and the Intel Logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2008, Intel Corporation. All rights reserved.
2
Contents
Processor Mechanical Parameters ............................................................. 10
Xeon
®
Xeon
®
Processor 5200 Series Package .............................. 11
Processor 5200 Series Processor Considerations....... 15
Thermal Control Circuit and TDP............................................................... 15
Platform Environmental Control Interface (PECI) ........................................ 17
Multiple Core Special Considerations ......................................................... 18
Characterizing Cooling Solution Performance Requirements..................................... 26
Processor Thermal Characterization Parameter Relationships........................ 28
Chassis Thermal Design Considerations ..................................................... 30
Thermal/Mechanical Reference Design Considerations ............................................ 31
Heatsink Design Considerations................................................................ 31
Thermal Interface Material....................................................................... 32
AdvancedTCA* Reference Heatsink ........................................................... 33
Test Procedure Examples ........................................................................ 55
Time-Zero, Room Temperature Preload Measurement ................................. 55
Preload Degradation under Bake Conditions ............................................... 56
Reference Heatsink Thermal Verification .................................................... 58
Environmental Reliability Testing .............................................................. 58
Material and Recycling Requirements ........................................................ 60
3
4
Figures
®
®
®
Xeon
®
Xeon
Xeon
®
®
Processor 5200 Series Mechanical Drawing (Sheet 1 of 3) .....12
Processor 5200 Series Mechanical Drawing (Sheet 2 of 3) .....13
Processor 5200 Series Mechanical Drawing (Sheet 3 of 3) .....14
2-5 DTS Domain for Dual-Core Intel
®
Xeon
®
Processor 5200 Series...............................18
2-8 TCONTROL Value and Digital Thermal Sensor Value Interaction................................22
2-10 Thermal Profile for the Dual-Core Intel® Xeon® Processor L5238 ............................24
2-11 Thermal Profile for the Dual-Core Intel® Xeon® Processor L5215 ............................25
3-1 Exploded View of CEK Thermal Solution Components..............................................33
3-5 Isometric View of CEK Spring Attachment to the Base Board ...................................38
B-1 Load Cell Installation in Machined Heatsink Base Pocket -- Bottom View....................53
B-2 Load Cell Installation in Machined Heatsink Base Pocket -- Side View ........................54
Tables
2-2 Input and Output Conditions for Multiple Core Dual-Core Intel
®
Processor 5200
Series
Xeon
®
Thermal Management Features ........................................................................... 19
3-1 AdvancedTCA* Heatsink Thermal Mechanical Characteristics ................................... 37
Shortened Product Name Intel Reference Solution ................................................. 61
5
6
Revision History
Reference
Number
319012
319012
Revision
Number
002
001
Description
,
,
, and
to add support for the Dual-Core Intel® Xeon® Processor
L5215.
• Public release of this document.
§
Date
September 2008
1
Introduction
1.1
1.2
Objective
The purpose of this guide is to describe the reference thermal solution and design parameters required for the Dual-Core Intel® Xeon® Processor L5238 (35W) and
Dual-Core Intel® Xeon® Processor L5215 (20W). This processor is thermallyoptimized and provide optimal performance in small form factors like AdvancedTCA* under NEBS conditions. It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements. Furthermore, this document provides an understanding of the processor thermal characteristics, and discusses guidelines for meeting the thermal requirements imposed over the entire life of the processor. The thermal/mechanical solutions described in this document are intended to aid component and system designers in the development and evaluation of processor compatible thermal/mechanical solutions.
Scope
The thermal/mechanical solutions described in this document pertains to a solution intended for use with the Dual-Core Intel® Xeon® Processor L5238 and Dual-Core
Intel® Xeon® Processor L5215 in small form factor systems like AdvancedTCA*. This document contains the mechanical and thermal requirements of the processor cooling solution. In case of conflict, the data in the Dual-Core Intel® Xeon® Processor 5200
Series Electrical, Mechanical, and Thermal Specification (EMTS) supersedes any data in this document. Additional information is provided as a reference in the appendices. For other Dual-Core Intel
®
Xeon
®
Processor 5200 Series in 1U,2U,2U+ and workstation form factors systems refer to the Dual-Core Intel
Thermal/ Mechanical Design Guide.
®
Xeon
®
Processor 5200 Series
1.3
References
Material and concepts available in the following documents may be beneficial when reading this document.
Table 1-1.
Reference Documents (Sheet 1 of 2)
Document
European Blue Angel Recycling Standards
Intel
®
Xeon
®
Processor Family Thermal Test Vehicle User's Guide
LGA771 Socket Mechanical Design Guide
LGA771 SMT Socket Design Guidelines
LGA771 Daisy Chain Test Vehicle User Guide
LGA771 Socket Mechanical Models
Dual Core Intel
(PDG)
®
Xeon
®
Processor-Based Servers Platform Design Guide
Dual Core Intel
®
Guide (PDG)
Xeon
®
Processor-Based Workstation Platform Design
PECI Feature Set Overview
Comment
http://www.blauer-engel.de
http://www.developer.intel.com
See Note following table
See Note following table
See Note following table
See Note following table
See Note following table
See Note following table
See Note following table
7
8
Table 1-1.
Reference Documents (Sheet 2 of 2)
Document
Dual-Core Intel
®
Design Guide
Xeon
®
Processor 5200 Series Thermal/ Mechanical
Platform Environment Control Interface (PECI) Specification
T
RISE
Reduction Guidelines for Rack Servers and Workstations
Dual-Core Intel® Xeon® Processor 5200 Series Electrical, Mechanical, and Thermal Specification (EMTS)
Thin Electronics Bay Specification (A Server System Infrastructure [SSI]
Specification for Rack Optimized Servers)
Comment
http://www.developer.intel.com
See Note following table
See Note following table
See Note following table www.ssiforum.com
Note:
Contact your Intel field sales representative for the latest revision and order number of this document.
1.4
Definition of Terms
Table 1-2.
Terms and Descriptions (Sheet 1 of 2)
Bypass
Term
Digital Thermal
Sensor
FMB
FSC
IHS
LGA771 Socket
NEBS
P
MAX
PECI
Ψ
CA
Ψ
CS
Ψ
SA
T
CASE
T
CASE
_
MAX
TCC
Description
Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.
Digital Thermal Sensor replaces the T
DIODE
in previous products and uses the same sensor as the PROCHOT# sensor to indicate the on-die temperature. The temperature value represents the number of degrees below the TCC activation temperature.
Flexible Motherboard Guideline: an estimate of the maximum value of a processor specification over certain time periods. System designers should meet the FMB values to ensure their systems are compatible with future processor releases.
Fan Speed Control
Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.
The Dual-Core Intel
®
Xeon
®
Processor 5200 Series interface to the baseboard through this surface mount, 771 Land socket. See the LGA771 Socket Mechanical Design Guide for details regarding this socket.
Network Equipment Building Systems. Family of documents that implement directives from the Telecommunications Act of 1996 relative to industry wide general requirements for telecommunications and customer premise equipment.
The maximum power dissipated by a semiconductor component.
A proprietary one-wire bus interface that provides a communication channel between
Intel processor and chipset components to external thermal monitoring devices, for use in fan speed control. PECI communicates readings from the processor’s Digital Thermal
Sensor. PECI replaces the thermal diode available in previous processors.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (T
Package Power.
CASE
– T
S
) / Total
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
The case temperature of the processor, measured at the geometric center of the topside of the IHS.
The maximum case temperature as specified in a component specification.
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.
Table 1-2.
Terms and Descriptions (Sheet 2 of 2)
Term
T
CONTROL
T
OFFSET
TDP
Thermal Monitor
Thermal Profile
TIM
T
LA
T
SA
U
Description
A processor unique value for use in fan speed control mechanisms. T
CONTROL is a temperature specification based on a temperature reading from the processor’s Digital
Thermal Sensor. T
CONTROL implementation. T
CONTROL
can be described as a trigger point for fan speed control
= -T
OFFSET
.
An offset value from the TCC activation temperature value specified in the processor
EMTS or data sheet and T
CONTROL
= -T
OFFSET
. This value is programmed into each processor during manufacturing and can be obtained by reading the
IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value.
Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate.
A feature on the processor that can keep the processor’s die temperature within factory specifications under normal operating conditions, and with a thermal solution that satisfies the processor thermal profile specification.
Line that defines case temperature specification of a processor at a given power level.
Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.
The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.
The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc.
§
9
10
2
Thermal/Mechanical Reference
Design
2.1
This chapter describes the thermal/mechanical reference design for the Dual-Core
Intel® Xeon® Processor L5238 and Dual-Core Intel® Xeon® Processor L5215. These processors are power-optimized processor with a front side bus speed of 1333 MHz and
1066 MHz, respectfully. The Dual-Core Intel® Xeon® Processor L5238 and Dual-Core
Intel® Xeon® Processor L5215 are targeted for volumetrically constrained form factors like AdvancedTCA* and any other small form factor systems.
Mechanical Requirements
The mechanical performance of the processor cooling solution must satisfy the requirements described in this section.
Processor Mechanical Parameters 2.1.1
Table 2-1.
Processor Mechanical Parameters Table
Parameter
Volumetric Requirements and Keepouts
Static Compressive Load
Static Board Deflection
Dynamic Compressive Load
Transient Bend
Shear Load
Tensile Load
Torsion Load
Minimum Maximum
70
311
25
111
35
3.95
Unit Notes
1
3
3
3
3
2,4,5 lbf
N lbf
N in*lbf
N*m
2,4,6
2,4,7
Notes:
1.
Refer to drawings in
2.
In the case of a discrepancy, the most recent Dual-Core Intel® Xeon® Processor 5200 Series Electrical,
Mechanical, and Thermal Specification (EMTS) and LGA771 Socket Mechanical Design Guide supersede
above.
3.
These socket limits are defined in the LGA771 Socket Mechanical Design Guide.
4.
These package handling limits are defined in the Dual-Core Intel® Xeon® Processor 5200 Series Electrical,
Mechanical, and Thermal Specification (EMTS).
5.
Shear load that can be applied to the package IHS.
6.
Tensile load that can be applied to the package IHS.
7.
Torque that can be applied to the package IHS.
2.1.2
Dual-Core Intel
®
Xeon
®
Processor 5200 Series Package
The Dual-Core Intel
®
Xeon
®
Processor 5200 Series is packaged using the flip-chip land grid array (FC-LGA6) package technology. Please refer to the Dual-Core Intel® Xeon®
Processor 5200 Series Electrical, Mechanical, and Thermal Specification (EMTS) for detailed mechanical specifications. The Dual-Core Intel
®
Xeon
®
Processor 5200 Series
mechanical drawings, Figure 2-1
and
provide the mechanical information for the Dual-Core Intel
®
Xeon
®
Processor 5200 Series. The drawing located in this document is superseded with the drawings in Dual-Core Intel® Xeon® Processor
5200 Series Electrical, Mechanical, and Thermal Specification (EMTS), should there be any conflicts. Integrated package/socket stackup height information is provided in the
LGA771 Socket Mechanical Design Guide.
The package includes an integrated heat spreader (IHS). The IHS transfers the nonuniform heat from the die to the top of the IHS, out of which the heat flux is more uniform and spreads over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The IHS is designed to be the interface for contacting a heatsink. Details can be found in the
Dual-Core Intel® Xeon® Processor 5200 Series Electrical, Mechanical, and Thermal
Specification (EMTS).
The processor connects to the baseboard through a 771-land surface mount socket. A description of the socket can be found in the LGA771 Socket Mechanical Design Guide.
The processor package and socket have mechanical load limits that are specified in the
Dual-Core Intel® Xeon® Processor 5200 Series Electrical, Mechanical, and Thermal
Specification (EMTS) and the LGA771 Socket Mechanical Design Guide. These load limits should not be exceeded during heatsink installation, removal, mechanical stress testing, or standard shipping conditions. For example, when a compressive static load is necessary to ensure thermal performance of the Thermal Interface Material (TIM) between the heatsink base and the IHS, it should not exceed the corresponding specification given in the LGA771 Socket Mechanical Design Guide.
The heatsink mass can also add additional dynamic compressive load to the package during a mechanical shock event. Amplification factors due to the impact force during shock must be taken into account in dynamic load calculations. The total combination of dynamic and static compressive load should not then exceed the processor/socket compressive dynamic load specified in the LGA771 Socket Mechanical Design Guide during a vertical shock. It is not recommended to use any portion of the processor substrate as a mechanical reference or load-bearing surface in either static or dynamic compressive load conditions.
11
Figure 2-1. Dual-Core Intel
®
(Sheet 1 of 3)
Xeon
®
Processor 5200 Series Mechanical Drawing
12
Figure 2-2. Dual-Core Intel
®
(Sheet 2 of 3)
Xeon
®
Processor 5200 Series Mechanical Drawing
13
Figure 2-3. Dual-Core Intel
® of 3)
Xeon
®
Processor 5200 Series Mechanical Drawing (Sheet 3
14
2.1.3
Note:
2.2
2.2.1
Dual-Core Intel
®
Considerations
Xeon
®
Processor 5200 Series Processor
An attachment mechanism must be designed to support the heatsink since there are no features on the LGA771 socket to directly attach a heatsink. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular:
• Ensuring thermal performance of the TIM applied between the IHS and the heatsink. TIMs, especially ones based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Refer to Section 3.1.2
for information on tradeoffs made with TIM selection. Designs should consider possible decrease in applied pressure over time due to potential structural relaxation in enabled components.
• Ensuring system electrical, thermal, and structural integrity under shock and vibration events. The mechanical requirements of the attach mechanism depend on the weight of the heatsink and the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink attach mechanism. Their design should provide a means for protecting LGA771 socket solder joints as well as preventing package pullout from the socket.
The load applied by the attachment mechanism must comply with the package and socket specifications, along with the dynamic load added by the mechanical shock and vibration requirements, as identified in
A potential mechanical solution for heavy heatsinks is the direct attachment of the heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.
The Intel reference designs for Dual-Core Intel
®
Xeon
®
Processor 5200 Series is using
such a heatsink attachment scheme. Refer to Section 3 for further information
regarding the Intel reference mechanical solution.
Processor Thermal Parameters and Features
Thermal Control Circuit and TDP
The operating thermal limits of the processor are defined by the Thermal Profile. The intent of the Thermal Profile specification is to support acoustic noise reduction through fan speed control and ensure the long-term reliability of the processor. This specification requires that the temperature at the center of the processor IHS, known as (T
CASE
) remains within a certain temperature specification. For illustration,
Figure 2-4 shows the measurement location for the Dual-Core Intel
5200 Series package. Compliance with the T
CASE optimal operation and long-term reliability (See the Intel
®
Xeon
®
®
Xeon
®
Processor
specification is required to achieve
Processor Family
Thermal Test Vehicle User's Guide for Case Temperature definition and measurement methods).
15
Figure 2-4. Processor Case Temperature Measurement Location
16
To ease the burden on thermal solutions, the Thermal Monitor feature and associated logic have been integrated into the silicon of the processor. One feature of the Thermal
Monitor is the Thermal Control Circuit (TCC). When active, the TCC lowers the processor temperature by reducing power consumption. This is accomplished through a combination of Thermal Monitor and Thermal Monitor 2 (TM2).Thermal Monitor modulates the duty cycle of the internal processor clocks, resulting in a lower effective frequency. When active, the TCC turns the processor clocks off and then back on with a predetermined duty cycle. Thermal Monitor 2 adjusts both the processor operating frequency (via the bus multiplier) and input voltage (via the VID signals). Please refer to applicable processor datasheet for further details on TM and TM2.
PROCHOT# is designed to assert at or a few degrees higher than maximum T
CASE
(as specified by the thermal profile) when dissipating TDP power, and cannot be interpreted as an indication of processor case temperature. This temperature delta accounts for processor package, lifetime, and manufacturing variations and attempts to ensure the
Thermal Control Circuit is not activated below maximum T
CASE
when dissipating TDP power. There is no defined or fixed correlation between the PROCHOT# assertion temperature and the case temperature. However, with the introduction of the Digital
Thermal Sensor (DTS) on the Dual-Core Intel
®
Xeon
®
Processor 5200 Series, the DTS reports a relative temperature delta below the PROCHOT# assertion temperature (see
for more details on the Digital Thermal Sensor). Thermal solutions must
be designed to the processor specifications (i.e Thermal Profile) and cannot be adjusted based on experimental measurements of T
CASE on random processor samples.
, PROCHOT#, or Digital Thermal Sensor
By taking advantage of the Thermal Monitor features, system designers may reduce thermal solution cost by designing to the Thermal Design Power (TDP) instead of maximum power. TDP should be used for processor thermal solution design targets.
TDP is not the maximum power that the processor can dissipate. TDP is based on measurements of processor power consumption while running various high power applications. This data set is used to determine those applications that are interesting from a power perspective. These applications are then evaluated in a controlled
2.2.2
2.2.3
thermal environment to determine their sensitivity to activation of the thermal control circuit. This data set is then used to derive the TDP targets published in the processor
EMTS. The Thermal Monitor can protect the processor in rare workload excursions above TDP. Therefore, thermal solutions should be designed to dissipate this target power level. The thermal management logic and thermal monitor features are discussed in extensive detail in the Dual-Core Intel® Xeon® Processor 5200 Series
Electrical, Mechanical, and Thermal Specification (EMTS).
In addition, on-die thermal management features called THERMTRIP# and FORCEPR# are available on the Dual-Core Intel
®
Xeon
®
Processor 5200 Series. They provide a thermal management approach to support the continued increases in processor frequency and performance. Please see the Dual-Core Intel® Xeon® Processor 5200
Series Electrical, Mechanical, and Thermal Specification (EMTS) for guidance on these thermal management features.
Digital Thermal Sensor
The Dual-Core Intel
®
Xeon
®
Processor 5200 Series include on-die temperature sensor feature called Digital Thermal Sensor (DTS). The DTS uses the same sensor utilized for
TCC activation. Each individual processor is calibrated so that TCC activation occurs at a
DTS value of 0. The temperature reported by the DTS is the relative offset in PECI counts below the onset of the TCC activation and hence is negative. Changes in PECI counts are roughly linear in relation to temperature changes in degrees Celsius. For example, a change in PECI count by '1' represents a change in temperature of approximately 1°C. However, this linearity cannot be guaranteed as the offset below
TCC activation exceeds 20-30 PECI counts. Also note that the DTS will not report any values above the TCC activation temperature, it will simply return 0 in this case.
The DTS facilitates the use of multiple thermal sensors within the processor without the burden of increasing the number of thermal sensor signal pins on the processor
package. Operation of multiple DTS will be discussed in more detail in Section 2.2.4
.
Also, the DTS utilizes thermal sensors that are optimally located when compared with thermal diodes available with legacy processors. This is achieved as a result of a smaller foot print and decreased sensitivity to noise. These DTS benefits will result in more accurate fan speed control and TCC activation.The DTS application in fan speed
control will be discussed in more detail in Section 2.3.1
Platform Environmental Control Interface (PECI)
The PECI interface is designed specifically to convey system management information from the processor (initially, only thermal data from the Digital Thermal Sensor). It is a proprietary single wire bus between the processor and the chipset or other health monitoring device. Data from the Digital Thermal Sensors are processed and stored in a processor register (MSR) which is queried through the Platform Environment Control
Interface (PECI). The PECI specification provides a specific command set to discover, enumerate devices, and read the temperature. For an overview of the PECI interface, please refer to PECI Feature Set Overview. For more detail information on PECI, please refer to Platform Environment Control Interface (PECI) Specification and Dual-Core
Intel® Xeon® Processor 5200 Series Electrical, Mechanical, and Thermal Specification
(EMTS).
17
2.2.4
Multiple Core Special Considerations
2.2.4.1
Multiple Digital Thermal Sensor Operation
Each Dual-Core Intel
®
Xeon
®
Processor 5200 Series can have multiple Digital Thermal
Sensors located on the die. Each die within the processor currently maps to a PECI domain. The Dual-Core Intel
®
Xeon
®
Processor 5200 Series contains two cores per die
(domain) per socket. BIOS will be responsible for detecting the proper processor type and providing the number of domains to the thermal management system. An external
PECI device that is part of the thermal management system polls the processor domains for temperature information and currently receives the highest of the DTS output temperatures within each domain.
provides an illustration of the DTS domains for the Dual-Core Intel
®
Xeon
®
Processor 5200 Series.
Figure 2-5. DTS Domain for Dual-Core Intel
®
Xeon
®
Processor 5200 Series
2.2.4.2
Thermal Monitor for Multiple Core Products
The thermal management for multiple core products has only one TCONTROL value per processor. The TCONTROL for processor 0 and TCONTROL for processor 1 are independent from each other. If the DTS temperature from any domain within the processor is greater than or equal to TCONTROL, the processor case temperature must remain at or below the temperature as specified by the thermal profile. See
for information on TCONTROL. The PECI signal is available through CPU
pin (G5) on each LGA771 socket for the Dual-Core Intel
®
Xeon
®
Processor 5200 Series.
Through this pin, the domain receives all temperature sensor values and provide the current hottest value to an external PECI device such as a thermal management system.
18
2.2.4.3
PROCHOT#, THERMTRIP#, and FORCEPR#
The PROCHOT# and THERMTRIP# outputs will be shared by all cores on a processor.
The first core to reach TCC activation will assert PROCHOT#. A single FORCEPR# input
will be shared by each core. Table 2-2
provides an overview of input and output conditions for the Dual-Core Intel
®
Xeon
®
Processor 5200 Series thermal management features.
Table 2-2.
Input and Output Conditions for Multiple Core Dual-Core Intel
®
Processor 5200 Series
Thermal Management Features
Xeon
®
Item
TM/TM2
PROCHOT#
THERMTRIP#
FORCEPR#
Processor Input
DTS
Core X
> TCC Activation
Temperature
DTS
Core X
> TCC Activation
Temperature
DTS
Core X
> THERMTRIP #
Assertion Temperature
FORCEPR# Asserted
Processor Output
All Cores TCC Activation
PROCHOT# Asserted
THERMTRIP# Asserted, all cores shut down
All Cores TCC Activation
2.2.4.4
Notes:
1.
X=1,2, represents any one of the core1and core2 in Dual-Core Intel
®
Xeon
®
Processor 5200 Series.
2.
For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Dual-Core Intel® Xeon®
Processor 5200 Series Electrical, Mechanical, and Thermal Specification (EMTS).
Heatpipe Orientation for Multiple Core Processors
Thermal management of multiple core processors can be achieved without the use of heatpipe heatsinks, as demonstrated by the Intel Reference Thermal Solution discussed
To assist customers interested in designing heatpipe heatsinks, processor core locations have been provided. In some cases, this may influence the designer’s selection of heatpipe orientation. For this purpose, the core geometric center locations,
as illustrated in Figure 2-6 , are provided in Table 2-3
. Dimensions originate from the vertical edge of the IHS nearest to the pin 1 fiducial as shown in
19
Figure 2-6. Processor Core Geometric Center Locations
Y2
Y1
X1
X2
Table 2-3. Processor Core Geometric Center Dimensions
Feature
Core 1
Core 2
X Dimension
17.15 mm
17.15 mm
Y Dimension
11.56 mm
15.71 mm
X
Y
20
2.2.5
Thermal Profile
The thermal profile is a line that defines the relationship between a processor’s case temperature and its power consumption as shown in
. The equation of the thermal profile is defined as:
Equation 2-1.y = ax + b
Where: y x a b
= Processor case temperature, T
CASE
= Processor power consumption (W)
(°C)
= Case-to-ambient thermal resistance, ψ
CA
(°C/W)
= Processor local ambient temperature, T
LA
(°C)
Figure 2-7. Thermal Profile Diagram
The high end point of the Thermal Profile represents the processor’s TDP and the associated maximum case temperature (T
CASE_MAX
) and the lower end point represents the local ambient temperature at P = 0W. The slope of the Thermal Profile line represents the case-to-ambient resistance of the thermal solution with the y-intercept being the local processor ambient temperature. The slope of the Thermal Profile is constant, which indicates that all frequencies of a processor defined by the Thermal
Profile will require the same heatsink case-to-ambient resistance.
In order to satisfy the Thermal Profile specification, a thermal solution must be at or below the Thermal Profile line for the given processor when its DTS temperature is greater than T
CONTROL
(refer to
). The Thermal Profile allows the customers to make a trade-off between the thermal solution case-to-ambient resistance and the processor local ambient temperature that best suits their platform
implementation (refer to Section 2.3.3
). There can be multiple combinations of thermal
solution case-to-ambient resistance and processor local ambient temperature that can meet a given Thermal Profile. If the case-to-ambient resistance and the local ambient temperature are known for a specific thermal solution, the Thermal Profile of that
21
solution can easily be plotted against the Thermal Profile specification. As explained above, the case-to-ambient resistance represents the slope of the line and the processor local ambient temperature represents the y-axis intercept. Hence the
T
CASE_MAX
value of a specific solution can be calculated at TDP. Once this point is determined, the line can be extended at P = 0W representing the Thermal Profile of the specific solution. If that line stays at or below the Thermal Profile specification, then that particular solution is deemed as a compliant solution.
2.2.6
T
CONTROL
Definition
T
CONTROL
can be described as a trigger point for fan speed control implementation. The processor TCONTROL values provided by the Digital Thermal Sensor are relative and no longer absolute. The TCONTROL value is now defined as a relative value to the TCC activation set point (i.e. PECI Count = 0), as indicated by PROCHOT#.
depicts the interaction between the T
CONTROL
value and Digital Thermal Sensor value.
Figure 2-8. T
CONTROL
Value and Digital Thermal Sensor Value Interaction
Note:
The value for T
CONTROL is calibrated in manufacturing and configured for each processor individually. For the Dual-Core Intel
®
Xeon
®
Processor 5200 Series, the T is obtained by reading a processor model specific register
(IA32_TEMPERATURE_TARGET MSR).
CONTROL
value
There is no T
CONTROL_BASE
value to sum as previously required on legacy processors.
The fan speed control device only needs to read the T
OFFSET
MSR and compare this to the DTS value from the PECI interface. The equation for calculating T
CONTROL
is:
22
Equation 2-2.T
CONTROL
= -T
OFFSET
Where:
T
OFFSET
= A DTS-based value programmed into each processor during manufacturing that can be obtained by reading the IA32_TEMPERATURE_TARGET
MSR. This is a static and a unique value.
Figure 2-9 depicts the interaction between the Thermal Profile and T
CONTROL
.
Figure 2-9. T
CONTROL
and Thermal Profile Interaction
T
T
T
If the DTS temperature is less than T
CONTROL
, then the case temperature is permitted to exceed the Thermal Profile, but the DTS temperature must remain at or below
CONTROL
. The thermal solution for the processor must be able to keep the processor’s
CASE
at or below the Thermal Profile when operating between the T
CONTROL
and
CASE_MAX
at TDP under heavy workload conditions.
for the implementation of the T
CONTROL value in support of fan speed control (FSC) design to achieve better acoustic performance.
23
2.2.7
Performance Targets
The Thermal Profile specifications for this processors are published in the Dual-Core
Intel® Xeon® Processor 5200 Series Electrical, Mechanical, and Thermal Specification
(EMTS). These Thermal Profile specifications are shown as a reference in the subsequent discussions.
Figure 2-10. Thermal Profile for the Dual-Core Intel® Xeon® Processor L5238
Note:
60
50
40
30
100
90
80
70
Thermal Profile
Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed
360 hours per year
T
CASE
= 0.741 * P + 60
T
CASE
= 0.741 * P + 45
0 5 10 15 20
Power (W)
25
T
CASE-MAX
@ TDP
Nominal
Short Term
30 35
1. The thermal specifications shown in this graph are for reference only. Refer to the
Dual-Core Intel® Xeon® Processor 5200 Series Electrical, Mechanical, and Thermal
Specification (EMTS) for the Thermal Profile specifications. In case of conflict, the data information in the EMTS supersedes any data in this figure.
2. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not require NEBS Level 3 compliance.
3. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances per year, as compliant with NEBS Level
4. Implementation of either thermal profile should result in virtually no TCC activation.
5. Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the Short-Term Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processor thermal specifications and may result in permanent damage to the processor.
describe thermal performance target for the Dual-Core Intel® Xeon®
Processor L5238 processor cooling solution enabled by Intel.
24
Figure 2-11. Thermal Profile for the Dual-Core Intel® Xeon® Processor L5215
Note:
Thermal Profile
100
90
80
70
60
50
40
30
0
Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed 360 hours per
T
CASE
= 1.5 * P + 60
T
CASE
= 1.5 * P + 45
5 10
Power (W)
15
T
CASE-MAX
@ TDP
Nominal
Short Term
20
1. The thermal specifications shown in this graph are for reference only. Refer to the
Dual-Core Intel® Xeon® Processor 5200 Series Electrical, Mechanical, and Thermal
Specification (EMTS) for the Thermal Profile specifications. In case of conflict, the data information in the datasheet supersedes any data in this figure.
2. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not require NEBS Level 3 compliance.
3. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances per year, as compliant with NEBS Level
4. Implementation of either thermal profile should result in virtually no TCC activation.
5. Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the Short-Term Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processor thermal specifications and may result in permanent damage to the processor.
Table 2-5 describe thermal performance target for the Dual-Core Intel® Xeon®
Processor L5215 processor cooling solution enabled by Intel.
25
Table 2-4.
Intel Reference Heatsink Performance Targets for the Dual-Core Intel® Xeon® Processor L5238 Processor
Parameter Maximum Unit Notes
Altitude
Nominal T
LA
Short-TermT
TDP
LA
Sea-level
45
60
35 m
°C
°C
W
Heatsink designed at 0 meters
Dual-Core Intel® Xeon® Processor L5238 Reference Solution, Nominal Thermal Profile
T
CASE_MAX
Airflow
71
2.7
°C
CFM Airflow through the heatsink fins
ψ
CA
0.817
°C/W
Mean + 3σ
Dual-Core Intel® Xeon® Processor L5238 Reference Solution, Short-Term Thermal Profile
T
CASE_MAX
Airflow
ψ
CA
86
2.7
0.817
°C
CFM
°C/W
Airflow through the heatsink fins
Mean + 3σ
Table 2-5.
Intel Reference Heatsink Performance Targets for the Dual-Core Intel® Xeon® Processor L5215 Processor
Parameter Maximum Unit Notes
Altitude
Nominal T
LA
Short-TermT
LA
TDP
Sea-level
45
60
20 m
°C
°C
W
Heatsink designed at 0 meters
Dual-Core Intel® Xeon® Processor L5215 Reference Solution, Nominal Thermal Profile
T
CASE_MAX
Airflow
75
2.7
°C
CFM Airflow through the heatsink fins
ψ
CA
0.817
°C/W Mean + 3σ
Dual-Core Intel® Xeon® Processor L5215 Reference Solution, Short-Term Thermal Profile
T
CASE_MAX
Airflow
ψ
CA
90
2.7
0.817
°C
CFM
°C/W
Airflow through the heatsink fins
Mean + 3σ
2.3
2.3.1
Characterizing Cooling Solution Performance
Requirements
Fan Speed Control
Fan speed control (FSC) techniques to reduce system level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determine the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solution’s performance, which consequently determines the
T
CASE
of the processor at a given power level. Since the T
CASE
of a processor is an important parameter in the long-term reliability of a processor, the FSC implemented in a system directly correlates to the processor’s ability to meet the Thermal Profile and
26
hence the long-term reliability requirements. For this purpose, the parameter called
T
CONTROL
as explained in
, is to be used in FSC designs to ensure that the long-term reliability of the processor is met while keeping the system level acoustic
depicts the relationship between T
CONTROL and FSC methodology.
Figure 2-12. T
CONTROL
and Fan Speed Control
Once the T
CONTROL
value is determined as explained earlier, the DTS temperature reading from the processor can be compared to this T
CONTROL
value. A fan speed
control scheme can be implemented as described in Table 2-6
without compromising the long-term reliability of the processor.
Table 2-6.
Fan Speed Control, T
CONTROL
and DTS Relationship
Condition FSC Scheme
DTS≤ T
CONTROL
FSC can adjust fan speed to maintain DTS ≤ T
CONTROL
(low acoustic region).
DTS>T
CONTROL
FSC should adjust fan speed to keep T
CASE specification (increased acoustic region).
at or below the Thermal Profile
There are many different ways of implementing fan speed control, including FSC based on processor ambient temperature, FSC based on processor Digital Thermal Sensor
(DTS) temperature or a combination of the two. If FSC is based only on the processor ambient temperature, low acoustic targets can be achieved under low ambient temperature conditions. However, the acoustics cannot be optimized based on the behavior of the processor temperature. If FSC is based only on the Digital Thermal
Sensor, sustained temperatures above T
CONTROL
drives fans to maximum RPM. If FSC is based both on ambient and Digital Thermal Sensor, ambient temperature can be used to scale the fan RPM controlled by the Digital Thermal Sensor. This would result in an
27
optimal acoustic performance. Regardless of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor
Digital Thermal Sensor temperature exceeds the T
CONTOL value for a given processor.
2.3.2
Processor Thermal Characterization Parameter
Relationships
The idea of a “thermal characterization parameter”, Ψ (psi), is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical conditions (heating source, local ambient conditions). A thermal characterization parameter is convenient in that it is calculated using total package power, whereas actual thermal resistance, θ (theta), is calculated using actual power dissipated between two points. Measuring actual power dissipated into the heatsink is difficult, since some of the power is dissipated via heat transfer into the socket and board. Be aware, however, of the limitations of lumped parameters such as Ψ when it comes to a real design. Heat transfer is a three-dimensional that cannot be accurately modeled by lumped parameters.
The case-to-local ambient thermal characterization parameter value (Ψ
CA
) is used as a measure of the thermal performance of the overall thermal solution that is attached to the processor package. It is defined by the following equation, and measured in units of
°C/W:
Equation 2-3.Ψ
CA
= (T
CASE
- T
LA
) / TDP
Where:
Ψ
CA
= Case-to-local ambient thermal characterization parameter (°C/W).
T
CASE
T
LA
= Processor case temperature (°C).
= Local ambient temperature in chassis at processor (°C).
TDP
= TDP dissipation (W) (assumes all power dissipates through the integrated heat spreader (IHS)).
The case-to-local ambient thermal characterization parameter of the processor, Ψ
CA
, is comprised of Ψ
CS
, the TIM thermal characterization parameter, and of Ψ
SA
, the sink-tolocal ambient thermal characterization parameter:
Equation 2-4.Ψ
CA
= Ψ
CS
+ Ψ
SA
Where:
Ψ
CS
Ψ
SA
= Thermal characterization parameter of the TIM (°C/W).
= Thermal characterization parameter from heatsink-to-local ambient
(°C/W).
Ψ
CS
is strongly dependent on the thermal conductivity and thickness of the TIM between the heatsink and IHS.
Ψ
SA
is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. Ψ
SA
is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink.
28
illustrates the combination of the different thermal characterization parameters.
Figure 2-13. Processor Thermal Characterization Parameter Relationships
2.3.2.1
Example
The cooling performance, Ψ
CA,
is then defined using the principle of thermal characterization parameter described above:
• Define a target case temperature T
CASE_MAX processor EMTS.
and corresponding TDP, given in the
• Define a target local ambient temperature at the processor, T
LA
.
The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only.
Assume the EMTS TDP is 85 W and the case temperature specification is 68 °C. Assume as well that the system airflow has been designed such that the local processor ambient temperature is 45°C. Then the following could be calculated using equation
(2-3) from above:
Equation 2-5.Ψ
CA
= (T
CASE
– T
LA
) / TDP = (68 – 45) / 85 = 0.27 °C/W
To determine the required heatsink performance, a heatsink solution provider would need to determine Ψ
CS
performance for the selected TIM and mechanical load configuration. If the heatsink solution was designed to work with a TIM material performing at Ψ
CS
≤ 0.05 °C/W, solving for equation (2-4) from above, the performance of the heatsink would be:
Equation 2-6.Ψ
SA
= Ψ
CA
− Ψ
CS
= 0.27 − 0.05 = 0.22 °C/W
If the local processor ambient temperature is assumed to be 40°C, the same calculation can be carried out to determine the new case-to-ambient thermal resistance:
29
Equation 2-7.Ψ
CA
= (T
CASE
– T
LA
) / TDP = (68 – 40) / 85 = 0.33 °C/W
It is evident from the above calculations that, a reduction in the local processor ambient temperature has a significant positive effect on the case-to-ambient thermal resistance requirement.
2.3.3
2.3.3.1
Chassis Thermal Design Considerations
Chassis Thermal Design Capabilities and Improvements
One of the critical parameters in thermal design is the local ambient temperature assumption of the processor. Keeping the external chassis temperature fixed, internal chassis temperature rise is the only component that can affect the processor local ambient temperature. Every degree gained at the local ambient temperature directly translates into a degree relief in the processor case temperature.
Given the thermal targets for the processor, it is extremely important to optimize the chassis design to minimize the air temperature rise upstream to the processor (T rise
), hence minimizing the processor local ambient temperature. Please refer to T
RISE
Reduction Guidelines for Rack Servers and Workstations for more details.
The heat generated by components within the chassis must be removed to provide an adequate operating environment for both the processor and other system components.
Moving air through the chassis brings in air from the external ambient environment and transports the heat generated by the processor and other system components out of the system. The number, size and relative position of fans, vents and other heat generating components determine the chassis thermal performance, and the resulting ambient temperature around the processor. The size and type (passive or active) of the thermal solution and the amount of system airflow can be traded off against each other to meet specific system design constraints. Additional constraints are board layout, spacing, component placement, and structural considerations that limit the thermal solution size.
In addition to passive heatsinks, fan heatsinks and system fans, other solutions exist for cooling integrated circuit devices. For example, ducted blowers, heat pipes and liquid cooling are all capable of dissipating additional heat. Due to their varying attributes, each of these solutions may be appropriate for a particular system implementation.
To develop a reliable, cost-effective thermal solution, thermal characterization and simulation should be carried out at the entire system level, accounting for the thermal requirements of each component. In addition, acoustic noise constraints may limit the size, number, placement, and types of fans that can be used in a particular design.
30
3
Thermal/Mechanical Reference
Design Considerations
3.1
3.1.1
Heatsink Solutions
Heatsink Design Considerations
To remove the heat from the processor, three basic parameters should be considered:
• The area of the surface on which the heat transfer takes place - Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is by attaching a heatsink to the IHS. A heatsink can increase the effective heat transfer surface area by conducting heat out of the
IHS and into the surrounding air through fins attached to the heatsink base.
• The conduction path from the heat source to the heatsink fins - Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance. The length, thickness, and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink.
In particular, the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become strict. Thermal interface material (TIM) is used to fill in the gap between the IHS and the bottom surface of the heatsink, and thereby improves the overall performance of the thermal stackup (IHS-TIM-Heatsink). With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. The TIM thermal performance depends on its thermal conductivity as
well as the pressure load applied to it. Refer to Section 3.1.2
for further information on the TIM between the IHS and the heatsink base.
• The heat transfer conditions on the surface on which heat transfer takes
place - Convective heat transfer occurs between the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air,
T
LA
, and the local air velocity over the surface. The higher the air velocity over the surface, the resulting cooling is more efficient. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes the fin faces and the heatsink base.
An active heatsink typically incorporates a fan that helps manage the airflow through the heatsink.
Passive heatsink solutions require in-depth knowledge of the airflow in the chassis.
Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are typically larger (and heavier) than active heatsinks due to the increase in fin surface required to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases: it is more likely that the air will travel around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins.
31
3.1.2
3.1.3
3.2
Thermal Interface Material
TIM application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier and allow direct heatsink attach, without the need for a separate TIM dispense or attach process in the final assembly factory.
All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures the entire processor IHS area is covered. It is important to compensate for heatsink-to-processor attach positional alignment when selecting the proper TIM size.
When pre-applied material is used, it is recommended to have a protective application tape over it. This tape must be removed prior to heatsink installation.
The TIM performance is susceptible to degradation (i.e. grease breakdown) during the useful life of the processor due to the temperature cycling phenomena. For this reason, the measured T
CASE
value of a given processor can decrease over time depending on the type of TIM material.
for information on the TIM used in the Intel reference heatsink solution.
Summary
In summary, considerations in heatsink design include:
• The local ambient temperature T
LA dissipated by the processor, and the corresponding maximum T parameters are usually combined in a single lump cooling performance parameter,
Ψ
CA
(case to air thermal characterization parameter). More information on the definition and the use of Ψ
CA
at the heatsink, airflow (CFM), the power being
CASE
. These
• Heatsink interface (to IHS) surface characteristics, including flatness and roughness.
• The performance of the TIM used between the heatsink and the IHS.
• Surface area of the heatsink.
• Heatsink material and technology.
• Development of airflow entering and within the heatsink area.
• Physical volumetric constraints placed by the system.
• Integrated package/socket stackup height information is provided in the LGA771
Socket Mechanical Design Guide.
Intel Reference Heat Sinks
Intel has developed a reference heatsink designed to meet the cooling needs of Dual-
Core Intel® Xeon® Processor L5238 and Dual-Core Intel® Xeon® Processor L5215 in embedded form factors applications. This document details solutions that are compatible with the AdvancedTCA* Form Factor. The reference heatsink design
require a prescribed amount of system airflow. The system designer must ensure that suitable airflow is provided when using the reference heatsinks. Detailed mechanical drawings for each of the reference heatsinks can be found in
32
3.2.1
AdvancedTCA* Reference Heatsink
Reference design heatsinks that meets the Dual-Core Intel
®
Xeon
®
Processor 5200
Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors which can be found in the
Dual-Core Intel
®
Xeon
®
Processor 5200 Series Thermal/ Mechanical Design Guide. A
CEK style heatsink was also designed for AdvancedTCA* for the Dual-Core Intel®
Xeon® Processor L5238 and Dual-Core Intel® Xeon® Processor L5215. Each CEK consists of the following components:
• Heatsink (with captive standoff and screws)
• Thermal Interface Material (TIM)
• CEK SpringGeometric Envelope
The baseboard keepout zones on the primary and secondary sides and height
restrictions under the enabling component region are shown in detail in Appendix A
.
The overall volumetric keep in zone encapsulates the processor, socket, and the entire
thermal/mechanical enabling solution as shown in Figure 3-1 .
Figure 3-1. Exploded View of CEK Thermal Solution Components
The CEK reference thermal solution is designed to extend air-cooling capability through the use of larger heatsinks with minimal airflow blockage and bypass. CEK retention solution can allow the use of much heavier heatsink masses compared to the legacy
33
Note:
Note:
limits by using a load path directly attached to the chassis pan. The CEK spring on the secondary side of the baseboard provides the necessary compressive load for the thermal interface material. The baseboard is intended to be isolated such that the dynamic loads from the heatsink are transferred to the chassis pan via the stiff screws and standoffs. This reduces the risk of package pullout and solder-joint failures.
Using the CEK reference thermal solution, Intel recommends that the maximum outside diameter dimension of the chassis pan standoffs, regardless of shape, that interfaces with the CEK spring on the secondary side of the baseboard and captive screws on the primary side of the baseboard to attach the heatsink to the chassis pan should be no larger than 7.112 mm [0.28 in.]. For example, circular standoffs should be no larger than 7.112 mm [0.28 in.] point-to-point.
The baseboard mounting holes for the CEK solution are at the same location as the hole locations used for previous Intel
®
Xeon
®
processor thermal solution. However, CEK assembly requires 10.16 mm [0.400 in.] large diameter holes to compensate for the
CEK spring embosses.
The CEK solution is designed and optimized for a baseboard thickness range of 1.57 –
2.31 mm [0.062-0.093 in]. While the same CEK spring can be used for this board thickness range, the heatsink standoff height is different for a 1.57 mm [0.062 in] thick board than it is for a 2.31 mm [0.093 in] thick board. In the heatsink assembly, the standoff protrusion from the base of the heatsink needs to be 0.6 mm [0.024 in] longer for a 2.31 mm [0.093 in] thick board, compared to a 1.57 mm [0.062 in] thick board.
If this solution is intended to be used on baseboards that fall outside of this range, then some aspects of the design, including but not limited to the CEK spring design and the standoff heights, may need to change. Therefore, system designers need to evaluate the thermal performance and mechanical behavior of the CEK design on baseboards with different thicknesses.
for drawings of the heatsinks and CEK spring. The screws and standoffs are standard components that are made captive to the heatsink for ease of handling and assembly.
Contact your Intel field sales representative for an electronic version of mechanical and thermal models of the CEK (Pro/Engineer*, IGES and Icepak*, Flotherm* formats).
Pro/Engineer*, Icepak* and Flotherm* models are available on Intel Business Link
(IBL).
Intel reserves the right to make changes and modifications to the design as necessary.
The thermal mechanical reference design for the Dual-Core Intel
®
Xeon
®
5200 Series was verified according to the Intel validation criteria given in
Processor
. Any thermal mechanical design using some of the reference components in combination with any other thermal mechanical solution needs to be fully validated according to the customer criteria. Also, if customer thermal mechanical validation criteria differ from the Intel criteria, the reference solution should be validated against the customer criteria.
34
3.2.1.1
Structural Considerations of CEK
As Intel explores methods of keeping thermal solutions within the air-cooling space, the mass of the thermal solutions is increasing. Due to the flexible nature (and associated large deformation) of baseboard-only attachments, Intel reference solutions, such as
CEK, are now commonly using direct chassis attach (DCA) as the mechanical retention design. The mass of the new thermal solutions is large enough to require consideration for structural support and stiffening on the chassis. Intel has published a best known method (BKM) document that provides specific structural guidance for designing DCA thermal solutions. The document is titled Chassis Strength and Stiffness Measurement
and Improvement Guidelines for Direct Chassis Attach Solutions.
3.2.1.2
AdvancedTCA* Thermal Solution Performance
Figure 3-2 shows the performance of the AdvancedTCA* passive heatsink. This figure
shows the thermal performance versus the airflow provided through the fins. The bestfit equations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph.
Figure 3-2. AdvancedTCA* Heatsink Thermal Performance
2
1.75
1.5
1.25
1
0.75
0.5
0.25
Ψ
CA
= 0.2297 + 1.1239 * CFM
-0.6532
0
0 1 2 3 4
CFM Thr ough Fins
5 6 7 8
If other custom heatsinks are intended for use with the Dual-Core Intel
®
Xeon
®
Processor 5200 Series, they must support the following interface control requirements to be compatible with the reference mechanical components.
Any custom thermal solution design must meet the loading specification as documented within this document, and should refer to the Dual-Core Intel® Xeon®
Processor 5200 Series Electrical, Mechanical, and Thermal Specification (EMTS) and
LGA771 Socket Mechanical Design Guide and for specific details on package/socket loading specifications.
35
3.2.1.3
Components Overview
3.2.1.3.1
Heatsink with Captive Screws and Standoffs
The CEK reference heatsink uses snapped-fin technology for its design. It consists of a copper base and copper fins with Honeywell* PCM45F or Shin-Etsu* G751 thermal grease as the TIM. The mounting screws and standoffs are also made captive to the
heatsink base for ease of handling and assembly as shown in Figure 3-3
.
.
Figure 3-3. Isometric View of the AdvancedTCA* Heatsink
36
Note:
Refer to Appendix A for more detailed mechanical drawings of the AdvancedTCA* Heatsink.
The function of the standoffs is to provide a bridge between the chassis and the heatsink for attaching and load carrying. When assembled, the heatsink is rigid against the top of the standoff, and the standoff is rigid to a chassis standoff with the CEK spring firmly sandwiched between the two. In dynamic loading situations the standoff carries much of the heatsink load, especially in lateral conditions, when compared to the amount of load transmitted to the processor package. As such, it is comprised of steel. The distance from the bottom of the heatsink to the bottom of the standoff is
10.26 mm [0.404 in.] for a board thickness of 1.57 mm [0.062 in]. The standoff will need to be modified for use in applications with a different board thickness, as defined
The function of the screw is to provide a rigid attach method to sandwich the entire CEK assembly together, activating the CEK spring under the baseboard, and thus providing the TIM preload. A screw is an inexpensive, low profile solution that does not negatively impact the thermal performance of the heatsink due to air blockage. Any fastener (i.e. head configuration) can be used as long as it is of steel construction; the head does not interfere with the heatsink fins, and is of the correct length of 20.64 mm [0.8125 in.].
Although the CEK heatsink fits into the legacy volumetric keep-in, it has a larger footprint due to the elimination of retention mechanism and clips used in the older enabled thermal/mechanical components. This allows the heatsink to grow its base and fin dimensions, further improving the thermal performance. A drawback of this
enlarged size and use of copper for both the base and fins is the increased weight of the heatsink. The retention scheme employed by CEK is designed to support heavy heatsinks (approximately up to 1000 grams) in cases of shock, vibration and
installation as explained in Appendix D
. Some of the thermal and mechanical characteristics of the CEK heatsinks are shown in
.
Table 3-1.
AdvancedTCA* Heatsink Thermal Mechanical Characteristics
Size
ATCA
Height
(mm) [in.]
13.36 [0.53]
Weight
(kg) [lbs]
0.24 [0.53]
Target
Airflow
Through Fins
(m
3
/hr)
[CFM]
4.59 [2.7]
Mean Ψ
ca
Standard
Deviation Ψ
ca
(°C/W)
0.793
(°C/W)
0.008
3.2.1.3.2
Thermal Interface Material (TIM)
A TIM must be applied between the package and the heatsink to ensure thermal conduction. The CEK reference design uses Honeywell* PCM45F (35*35*0.07)mm, however, Shin-Etsu* G751 thermal grease can also be used.
The recommended grease dispense weight to ensure full coverage of the processor IHS is given below. For an alternate TIM, full coverage of the entire processor IHS is recommended.
Table 3-2.
Recommended Thermal Grease Dispense Weight
Processor
TIM Dispense weight
Minimum Maximum
400
Units
mg
Notes
Shin-Etsu* G751. Dispense weight is an approximate target.
Generated by the CEK.
TIM loading provided by CEK
18
80
30
133 lbf
N
It is recommended that you use thermally conductive grease. Thermally conductive grease requires special handling and dispense guidelines. The following guidelines apply to Shin-Etsu G751 thermal grease. For guidance with your specific application, please contact the vendor. Vendor information is provided in
. The use of a semi-automatic dispensing system is recommended for high volume assembly to ensure an accurate amount of grease is dispensed on top of the IHS prior to assembly of the heatsink. A typical dispense system consists of an air pressure and timing controller, a hand held output dispenser, and an actuation foot switch. Thermal grease in cartridge form is required for dispense system compatibility. A precision scale with an accuracy of ±5 mg is recommended to measure the correct dispense weight and set the corresponding air pressure and duration. The IHS surface should be free of foreign materials prior to grease dispense.
Additional recommendations include recalibrating the dispense controller settings after any two hour pause in grease dispense. The grease should be dispensed just prior to heatsink assembly to prevent any degradation in material performance. Finally, the thermal grease should be verified to be within its recommended shelf life before use.
The CEK reference solution is designed to apply a compressive load of up to 133 N
[30 lbf] on the TIM to improve the thermal performance.
37
3.2.1.3.3
CEK Spring
The CEK spring, which is attached on the secondary side of the baseboard, is made from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of the spring will be made from a similar material. The CEK spring has four embosses which, when assembled, rest on the top of the chassis standoffs. The CEK spring is located between the chassis standoffs and the heatsink standoffs. The purpose of the
CEK spring is to provide compressive preload at the TIM interface when the baseboard is pushed down upon it. This spring does not function as a clip of any kind. The two tabs on the spring are used to provide the necessary compressive preload for the TIM when the whole solution is assembled. The tabs make contact on the secondary side of the baseboard. In order to avoid damage to the contact locations on the baseboard, the tabs are insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent).
Figure 3-4 shows an isometric view of the CEK spring design.
Figure 3-4. CEK Spring Isometric View
Figure 3-5. Isometric View of CEK Spring Attachment to the Base Board
38
Please refer to Appendix A for more detailed mechanical drawings of the CEK spring.
Also, the baseboard keepout requirements shown in
this CEK spring design.
39
40
A Mechanical Drawings
The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for Dual-Core Intel
®
Xeon
®
Processor 5200 Series.
Intel reserves the right to make changes and modifications to the design as necessary.
Note:
Table A-1. Mechanical Drawing List
Drawing Description
“AdvancedTCA* CEK Heatsink (Sheet 1 of 3)”
“AdvancedTCA* CEK Heatsink (Sheet 2 of 3)”
“AdvancedTCA* CEK Heatsink (Sheet 3 of 3)”
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
Figure Number
Figure A-1. AdvancedTCA* CEK Heatsink (Sheet 1 of 3)
41
Figure A-2. AdvancedTCA* CEK Heatsink (Sheet 2 of 3)
42
Figure A-3. AdvancedTCA* CEK Heatsink (Sheet 3 of 3)
43
Figure A-4. CEK Spring (Sheet 1 of 3)
44
Figure A-5. CEK Spring (Sheet 2 of 3)
45
Figure A-6. CEK Spring (Sheet 3 of 3)
46
Figure A-7. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 5)
.000
0
4
2.191
55,66
3.200
81,28
47
Figure A-8. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 5)
4
2.191
55,66
3.138
79,69
3.200
81,28
3.350
85,09
3.450
87,63
3.263
82,87
2.700
68,58
.250
6,35
.150
3,81
.063
1,59
.000
0
.063
1,59
.500
12,7
.000
0
6 )
6 )
.563
14,29
.681
17,29 (
(
6 )
1.212
30,79 (
6 )
6 )
6
6
)
)
6 )
6 )
1.787
45,39 (
2.374
2.600
2.462
2.492
2.984
66,04
60,29
62,54
63,29 (
(
(
(
75,79 (
48
Figure A-9. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 5)
2.550
64,77
69,22
2.725
3.500
88,9
.300
7,62
.000
0
.650
16,51
.475
12,07
49
Figure A-10. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 5)
50
Figure A-11. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 5)
51
52
B Heatsink Clip Load
Methodology
B.1
Note:
B.2
B.2.1
Note:
Overview
This section describes a procedure for measuring the load applied by the heatsink/clip/ fastener assembly on a processor package.
This procedure is recommended to verify the preload is within the design target range for a design, and in different situations. For example:
• Heatsink preload for the LGA771 socket.
• Quantify preload degradation under bake conditions.
This document reflects the current metrology used by Intel. Intel is continuously exploring new ways to improve metrology. Updates will be provided later as this document is revised as appropriate.
Test Preparation
Heatsink Preparation
Three load cells are assembled into the base of the heatsink under test, in the area interfacing with the processor Integrated Heat Spreader (IHS), using load cells
equivalent to those listed in Section B.2.2
.
To install the load cells, machine a pocket in the heatsink base, as shown in Figure B-1
and
Figure B-2 . The load cells should be distributed evenly, as close as possible to the
pocket walls. Apply wax around the circumference of each load cell and the surface of the pocket around each cell to maintain the load cells in place during the heatsink installation on the processor and motherboard.
The depth of the pocket depends on the height of the load cell used for the test. It is necessary that the load cells protrude out of the heatsink base. However, this protrusion should be kept minimal, as it will create an additional load offset since the heatsink base is artificially raised. The measurement load offset depends on the whole assembly stiffness (i.e. motherboard, clip, fastener, etc.). For example, the Dual-Core
Intel
®
Xeon
®
Processor 5200 Series CEK Reference Heatsink Design clip and fasteners assembly have a stiffness of around 160 N/mm [915 lb/in]. If the resulting protrusion is 0.038 mm [0.0015”], then a extra load of 6.08 N [1.37 lb] will be created, and will need to be subtracted from the measured load.
Figure B-3 shows an example using the
Dual-Core Intel
®
Xeon the Dual-Core Intel
®
Processor 5200 Series CEK Reference Heatsink designed for
®
Xeon
®
Processor 5200 Series in the 771–land grid array (LGA) package.
When optimizing the heatsink pocket depth, the variation of the load cell height should also be taken into account to make sure that all load cells protrude equally from the heatsink base. It may be useful to screen the load cells prior to installation to minimize variation.
Alternate Heatsink Sample Preparation
As just mentioned, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative of the non-modified design is:
• Machine the pocket in the heatsink base to a depth such that the tips of the load cells are just flush with the heatsink base.
• Then machine back the heatsink base by around 0.25 mm [0.01”], so that the load cell tips protrude beyond the base.
Proceeding this way, the original stack height of the heatsink assembly should be preserved. This should not affect the stiffness of the heatsink significantly.
Figure B-1. Load Cell Installation in Machined Heatsink Base Pocket -- Bottom View
53
Figure B-2. Load Cell Installation in Machined Heatsink Base Pocket -- Side View
Figure B-3. Preload Test Configuration
Preload Fixture (copper core with milled out pocket)
Load Cells (3x)
54
B.2.2
Typical Test Equipment
For the heatsink clip load measurement, use equivalent test equipment to the one
.
Table B-1. Typical Test Equipment
Item
Load cell
Notes: 1, 5
Data Logger
(or scanner)
Notes: 2, 3, 4
Description
Honeywell*-Sensotec* Model 13 subminiature load cells, compression only
Select a load range depending on load level being tested.
www.sensotec.com
Vishay* Measurements Group Model 6100 scanner with a
6010A strain card (one card required per channel).
Part Number (Model)
AL322BL
Model 6100
Notes:
1.
Select load range depending on expected load level. It is usually better, whenever possible, to operate in the high end of the load cell capability. Check with your load cell vendor for further information.
2.
Since the load cells are calibrated in terms of mV/V, a data logger or scanner is required to supply 5 volts
DC excitation and read the mV response. An automated model will take the sensitivity calibration of the load cells and convert the mV output into pounds.
3.
With the test equipment listed above, it is possible to automate data recording and control with a 6101-PCI card (GPIB) added to the scanner, allowing it to be connected to a PC running LabVIEW* or Vishay's
StrainSmart* software.
4.
IMPORTANT: In addition to just a zeroing of the force reading at no applied load, it is important to calibrate the load cells against known loads. Load cells tend to drift. Contact your load cell vendor for calibration tools and procedure information.
5.
When measuring loads under thermal stress (bake for example), load cell thermal capability must be checked, and the test setup must integrate any hardware used along with the load cell. For example, the
Model 13 load cells are temperature compensated up to 71 °C, as long as the compensation package
(spliced into the load cell's wiring) is also placed in the temperature chamber. The load cells can handle up to 121 °C (operating), but their uncertainty increases according to 0.02% rdg/°F.
B.2.3
Test Procedure Examples
The following sections give two examples of load measurement. However, this is not meant to be used in mechanical shock and vibration testing.
Any mechanical device used along with the heatsink attach mechanism will need to be included in the test setup (i.e., back plate, attach to chassis, etc.).
Prior to any test, make sure that the load cell has been calibrated against known loads, following load cell vendor’s instructions.
B.2.4
Time-Zero, Room Temperature Preload Measurement
1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis.
For example: If the attach mechanism includes fixtures on the back side of the board, those must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism.
2. Install the test vehicle in the socket.
3. Assemble the heatsink reworked with the load cells to motherboard as shown for the Dual-Core Intel
®
Xeon
®
Processor 5200 Series CEK-reference heatsink example in
, and actuate attach mechanism.
4. Collect continuous load cell data at 1 Hz for the duration of the test. A minimum time to allow the load cell to settle is generally specified by the load cell vendors
55
B.2.5
(often on the order of 3 minutes). The time zero reading should be taken at the end of this settling time.
5. Record the preload measurement (total from all three load cells) at the target time and average the values over 10 seconds around this target time as well, i.e. in the interval for example over [target time – 5 seconds; target time + 5 seconds].
Preload Degradation under Bake Conditions
This section describes an example of testing for potential clip load degradation under bake conditions.
1. Preheat thermal chamber to target temperature (45 ºC or 85 ºC for example).
2. Repeat time-zero, room temperature preload measurement.
3. Place unit into preheated thermal chamber for specified time.
4. Record continuous load cell data as follows:
Sample rate = 0.1 Hz for first 3 hrs
Sample rate = 0.01 Hz for the remainder of the bake test
5. Remove assembly from thermal chamber and set into room temperature conditions
6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz.
§
56
C Safety Requirements
Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards:
1. UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved.
2. CSA Certification. All mechanical and thermal enabling components must have CSA certification.
3. Heatsink fins must meet the test requirements of UL1439 for sharp edges.
§
57
58
D Quality and Reliability
Requirements
D.1
D.1.1
D.1.2
D.1.2.1
Note:
Intel Verification Criteria for the Reference
Designs
Reference Heatsink Thermal Verification
The Intel reference heatsinks was verified within specific boundary conditions using a
TTV and the methodology described in the Intel
®
Xeon
®
Processor Family Thermal Test
Vehicle User's Guide.
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3σ value for thermal characterization parameter using real processors (based on the
TTV correction offset).
Environmental Reliability Testing
Structural Reliability Testing
The Intel reference heatsinks should be tested in an assembled condition, along with the LGA771 Socket. Details of the Environmental Requirements, and associated stress tests, can be found in the LGA771 Socket Mechanical Design Guide.
The AdvancedTCA* reference heat sink in this document was NOT validated for reliability.
The use condition environment definitions provided in
speculative use condition assumptions, and are provided as examples only.
Table D-1. Use Conditions Environment
D.1.2.2
Use Environment
Shipping and
Handling
Shipping and
Handling
Speculative Stress
Condition
Mechanical Shock
• System-level
• Unpackaged
• Trapezoidal
• 25 g
• velocity change is based on packaged weight
Product
Weight (lbs)
Nonpalletized
Product
Velocity
Change sec)
†
(in/
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120
≥120
250
225
205
175
145
125
†
Change in velocity is based upon a 0.5 coefficient of restitution.
Random Vibration
• System Level
• Unpackaged
• 5 Hz to 500 Hz
• 2.20 g RMS random
• 5 Hz @.001 g
20 Hz @ 0.01 g
(slope up)
2
/Hz to
2
/Hz
• 20 Hz to 500 Hz @ 0.01 g
2
/Hz (flat)
• Random control limit tolerance is ± 3 dB
Example Use
Condition
Total of 12 drops per system:
• 2 drops per axis
• ± direction n/a
Example 7-Yr
Stress Equiv.
Example 10-
Yr Stress
Equiv.
n/a
Total per system:
• 10 minutes per axis
• 3 axes n/a n/a
Note:
In the case of a discrepancy, information in the most recent LGA771 Socket Mechanical Design
Guidelines supersedes that in the Table D-1 above.
Recommended Test Sequence
Each test sequence should start with components (i.e. baseboard, heatsink assembly, etc.) that have not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test.
D.1.2.3
Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
59
D.1.2.4
D.1.3
Note:
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test of post-test samples.
6. Thermal compliance testing to demonstrate that the case temperature specification can be met.
Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or connected:
• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC
Diags is an example of software that can be utilized for this test.
Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (e.g. polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-810E,
Method 508.4 must be performed to determine material performance.
Material used shall not have deformation or degradation in a temperature life test.
Any plastic component exceeding 25 grams should be recyclable per the European Blue
Angel recycling standards.
The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant.
Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm.
RoHS compliant: Lead and other materials banned in RoHS Directive are either
(1) below all applicable substance thresholds as proposed by the EU or
(2) an approved/pending exemption applies.
RoHS implementing details are not fully defined and may change.
§
60
E Enabled Suppliers
Information
E.1
Supplier Information
E.1.1
Intel Enabled Suppliers
The Intel reference enabling solution for Dual-Core Intel
®
Xeon
®
Processor 5200 Series in AdvancedTCA* is preliminary. The Intel reference solutions have not been verified to
meet the criteria outlined in Appendix D
. Customers can purchase the Intel reference thermal solution components from the suppliers listed in
For additional details, please refer to the Dual-Core Intel
®
Xeon
®
Processor 5200
Series thermal mechanical enabling components drawings in
.
Table E-1. Suppliers for the
Shortened Product Name Intel Reference Solution
Assembly
AdvancedTCA*
Heatsink
Component
AdvancedTCA*
Heatsinks
P/N: ECC-00267-
01-GP
Description
Copper Fin, Copper
Base
Development
Suppliers
Cooler Master* includes
Honeywell* PCM45F
TIM+cover
Grease Thermal Interface
Material
CEK Spring for
CEK771 Socket
Stainless Steel 301,
Kapton* Tape on
Reinforced Spring
Fingers
Shin-Etsu G751
CNDA 75610
AVC
CNDA # AP5281
Intel P/N D13646 rev04
Supplier Contact Info
Cooler Master*
Wendy Lin
510-770-8566, x211 [email protected]
Donna Hartigan
(480) 893-8898
Steve Huang (APAC)
+86-755-3366-8888 x66888
+86-138-252-45215 [email protected]
Huabin Chen ( China Only)
+866-755-3366-8888 x66871 [email protected]
CEK Spring for
CEK771 Socket
Intel P/N D13646 rev04
Stainless Steel 301,
Kapton* Tape on
Reinforced Spring
Fingers
ITW Fastex
CNDA# 78538
Roger Knell
773-307-9035 [email protected]
Henry Lu
886-7-881-9206 x10 [email protected]
§
61
62
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Key Features
- Thermal Control Circuit (TCC)
- Thermal Design Power (TDP)
- Digital Thermal Sensor (DTS)
- Platform Environment Control Interface (PECI)
- Multiple Digital Thermal Sensors
- Thermal Profile
- AdvancedTCA* Heatsink