FIC WB-B55 Service manual

FIC MB05W Service Manual

MB05W

MB05W

(WB-B55)

1.1 Introduction

This chapter provides the outline features and operation of the MB05 including the BIOS

Setup program and other system options.

The MB05 notebook offers the latest in advanced portable computing and multimedia technology that even outperforms most desktop computers. It incorporates the latest Intel

Pentium - M processor and fully compatibles with an entire library of PC software based on operating systems such as Windows 2000 / XP. It also runs on future versions of Windows. It comes with a built-in keyboard, glide pad pointing device, sound system, PCMCIA slots, USB

(Universal Serial Bus) port, IEEE 1394 port, advanced power management and more new multimedia features.

1.2 Feature Highlights

The MB05 includes a variety of innovative features:

Category

CPU

Core Logic

Intel Pentium

Specification

– M Processor

: Banias 1.3/1.5 GHZ

Intel Montara-GM (North Bridge) :

CPU(Banias) I/F

VGA Controller

LVDS I/F

DVOB&DVOC IF.

RGB analog I/F

200/266 DDR MEMORY I/F

Hub-Link I/F

Intel ICH4-M (South Bridge) :

Integrated Hub-Link I/F to connect with PCI

Bridge

Dual IDE Master/Slave Controller ,Integrated

DMA Controller

1.1/2.0 Universal Serial Bus Host Controller

Integrated 10/100M Fast Ethernet MAC

Controller

Integrated Audio Controller with AC97 V2.2

Interface

Advanced Power Management(ACPI)

RTC

Integrated PCI to LPC Bridge

Integrated Audio Controller with AC97 Interface

PCI Bus Interface (PCI 2.2 compliant)

GPIO

Advance PIC

Stepping

FIC MB05 Service Manual

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1-1

FIC MB05W Service Manual

Cache Memory L1 Cache (Pentium Processor internal):

64KB

8-way cache associativity provides

L2 Cache (Pentium Processor internal):

1024KB Advanced Transfer Cache,8 way associativity

8-way set associative, 32-byte line size, 1 line per sector

System Memory Expansion Memory: 2 SO-DIMM Slot (1.25

”)

Size: 128/256/512MB/1G

Type: DDR DRAM, 3.3V

Data Path: 64Bit

BIOS ROM

Frequency : 266MHz

Please refer to the MB05 Key component list in detail.

Flash ROM

1 st

Vendor : SST 49LF040A PLCC Package 4Mbit LPC flash ROM

Super I/O

Plug and Play Support

RTC + NVRAM Integrated in South Bridge (Intel ICH4-M)

Real Time Clock with 256 byte extended

CMOS.

K/B Controller

SMSC LPC47N267

FDC, IEEE 1284 Printer Port

Serial Port x 1 ports

IR Port ASKIR, SIR, FIR, HPSIR, Consumer IR

Mitsubishi M38859 LPC KBC

Internal K/B, Touch Pad, External K/B or M/S

Supported A20Gate,firmware version 2.14

PMU New PMU08

Mitsubishi M38859FFHP

Embedded Controller

VGA Controller Embedded in Intel Montara-GM

High Performance and high quality 3D accelerator

Integrated dual DVO bridge

Integrated LVDS Interface

Integrated RGB analog Interface

High performance 2D accelerator

VRAM

Complete TV-OUT/Digital Flat Panel Solution

Share system memory, UMA (using DVMT configuration)

8/16/32 MB

TV out encoder None

CardBus

Controller

Sound

RICOH R5C554 (PCI Card Bus controller)

PC/Card Bus Type II x1

Build in smart card (none)

AC

’97 CODEC

Realtek ALC202

AC

’97 Revision 2.2 Compliant

TBD

1-2 FIC MB05 Service Manual



Modem MDC modem support

V.90, K56flex, ITU-T V.34, V.32, RJ11 Jack

TIA/EIA 602, V.42

ITU-T V.17, V.29, V.27ter, V.21 Ch2

TIA/EIA 578 Class1 FAX

Wake up on Ring

On board LAN Realtek 8100BL

Support LAN boot( no used)

Support for auto-negotiation (10BASE-T and 100BASE-

TX)

Wake up On LAN( S1~S5)

3com Combo

802.11b

802.11 a+b

1394

Support by Intel Calexico Mini-PCI Wireless LAN Card

<Design Ready Only>

RICOH R5C554 PCI-CARDBUS / 1394 OHCI-LINK / 1394

PHY

USB

Intel ICH4-M

Integrated in South Bridge Intel ICH4-M)

Three Independent UHCI USB 1.1 Host Controllers and

One EHCI USB 2.0 Host Controller, support up to six port.

Legacy Keyboard/Mouse support.

Supports only one Debug port at port 1(first port), it is at

USB 2.0 transfer rate..

IDE Interface

(Intel ICH4-M)

Fast IDE:

--Integrated multithreaded I/O link mastering with read pipelined streaming

--Dual independent IDE channel each with 16 DW FIFO

--Native and compatibility mode

--PIO mode 0,1,2,3,4, and multiword DMA mode 0,1,2

--Ultra DMA 33/66/100

Printer Interface IEEE 1284-Compatible

SPP mode (PS2 bi-directional mode)

EPP mode (EPP 1.7 and EPP 1.9 IEEE 1284

Compliant)

ECP mode (IEEE 1284 Compliant)

Serial Interface None

External PS/2

Port

(M38859)

Universal Serial

Bus

(Intel ICH4-M)

External Keyboard or PS/2 Mouse

Exclusively connected.

Can use both device by using branch cable(option)

--INTEL ICH4-M Integrated

--Three Independent OHCI USB 1.1 Host Controllers and


--Support up to 6 USB ports

--Support legacy devices

--Over current detection equipped

--Optional configured each port as a wake-up source

None Infrared

Modem

LAN

LCD Panel

56K Data/Fax Modem (v.90)

10/100 Base TX LAN

Lan boot support and WFM 2.0

14.1

” XGA

15 XGA

; Please refer to the MB05 Key component list in detail.



1-3


HDD

CD-ROM

(Option)

FDD(None)

2.5 inch HDD (Standard)

9.5mm Height


CD-ROM (9.5mm Height)


USB FDD

3 mode Support


DVD

(Option)

DVD

9.5mm Height ,8X


CD-RW,Combo 9.5mm Height ,24X


Pointing Device Internal Touch Pad

Keyboard

Speakers

(audio)

PS/2 mouse I/F

Pad ALPS : KGDDET 005A

Please refer to the MB05T Key component list in detail.

Internal Keyboard

6.5mm Height, 3.0mm Stroke, 19mm Pitch


Two built-in dynamic speakers

40 x 20mm, 1W 4Ω

Microphone

Buzzer

Battery

RTC Battery

DC/DC

Converter

CPU Vcore

AC Adapter

None

Not support

Battery Pack

Type: 8 cell Li-ION Battery with EEPROM

Voltage: 14.4V

Capacity: 4400mA(circle);3600mA(square)

Vendor: SANYO


Ni-MH Battery

Model:

Voltage:

Capacity:

Vendor:

CR2032

2.9V

225mAh

PANASONIC

Daughter Board

5.0 V

3.3 V

Max 6.0 A

Max 6.0 A

12V Max 120mA

2.5V Max 3.5A

1.8V Max 3.5A

1.45V Max 22A

ADP75FB : Delta(Consign)

PA-1600-05F : Liteon

Input: AC100

– 240V, 50/60Hz

Output: 19V, 60W Peak 80W(Liteon)

19V.75W(Delta)

Size: 115mm x 50mm x 29mm (Delta)

110mm x 50mm x 29mm (Liteon)

Vendor: Delta or Liteon

Color : TBD


.

Size W=308mm, D=268mm, H=27.7~31mm.




Weight

Battery Handling

Category

Approx 4.9 lb = 2.2Kg

Specification

Battery Charging

Max Change

Current:

1.7A-1.75A±150mA

Battery Life

Power On Li-ion

Power Off Li-ion

1

st

Li-ion

Save to RAM 1

st

Li-ion

CMOS Battery

Consumption power

Charge

Discharge

Maximum

Typical

3.5 h

3.5 h

4 h

1 Days

24 h

5 year

60W

30W

Remark

TBD

TBD

System on

System off

TBD



1-5


1.3 System Configuration

M BUS

FIC ASIC

F010502-B0

INTEL

Centrino

CPU

CORE

GMTG767

ICS950812

CPU PCI CLK

USB2

USB1

CRT

LCD

RGB

LVDS

INTEL

MONTARA-G

M

MBUS

DDR SDRAM X 2

32BIT PCI BUS

MINI PCI

CONN

1394 PORT R5C554

PCMCIA

CNN X 2

USB0

G576

INTEL

ICH4-M

RTL8100BL RJ 45

HD

PHONE

MIC

IN

GMTG1421 ALC202

RJ11 MDC

LPC

INT K/B

M38859 LPC47N267

4M

ROM

COM

PORT

PMU08

GP

PS2

PARALLEL

Figure 1- 1 System Configuration Diagram




1.4 Quick Tour of the Notebook

Please take a moment to become familiar with the location and purpose of every control, the

LED status panel, connectors and ports, which are illustrated in this section. It is recommended to first go through the User Guide of the notebook, which is shipped together with the notebook for information on how to operate its features.

1.4.1 The Inside of the Notebook

To open the LCD cover of the notebook, find the cover latch located at the front center of the

LCD cover. Push the latch to the right to release and tilt the LCD cover up. Inside, you will see the LCD display panel, keyboard, touch pad, status LED, and power switch.

❶

❹

Color LCD Display ❷ Status LED Indicator ❸ Keyboard

Easy Buttons

❺

Power On/Resume

Button

❻

Touchpad Pointing

Device

Figure 1- 2 The Front side of the Notebook

•

Color LCD Display

The notebook computer comes with a color LCD that you can adjust for a comfortable viewing position. The LCD can be 15" TFT color LVDS with

1024x768 XGA (Extended Graphics Array) or 1280x1024 SXGA+ resolution panels. The features of the Color LCD Display are summarized as follows:

Ÿ

Ÿ

TFT color LVDS with 14.1" 1024x768 XGA or 14.1" 1280x1024

SXGA+ resolution panels.

Capable of displaying 16M colors (32-bit true color) on either size panels.

Ÿ

Ÿ

LCD display control hot-keys allows you to adjust the brightness of the LCD.

Simultaneous display capability for LCD and external desktop computer monitor.



1-7


•

Easy Buttons

There are three easy buttons used for activating wireless function and accessing user-defined functions instantly and easily. Description of the easy buttons appears in the latter part of this section.

•

Status LED Indicator

Keeps you informed of your notebook computer

’s current power status and operating status. Description of the status icons appears in the latter part of this section.

•

Power On/Resume Button

Switches the computer power on and off, or resumes whenever it is in

Suspend mode.

•

Keyboard

Ÿ Standard QWERTY-key layout and full-sized 82/84 keys keyboard with Windows system hot-keys, embedded numeric keypad, 7 hot keys, inverted "T" cursor arrow keys, and separate page screen control keys.

Ÿ Wide extra space below the keyboard panel for your wrist or palm to sit-on comfortably during typing.

•

Touchpad Pointing Device

Microsoft and IBM PS/2 mouse compatible with three select buttons as one

Scroll button and two Touchpad click buttons. These three buttons array below the Glide pad. The middle one is located with the Scroll button that lets you execute the scroll page function. The two click buttons located at each side support tapping selection and dragging functions. These buttons work like a standard computer mouse. Simply move your fingertip over the Glide

Pad to control the position of the cursor. Use the selection buttons below the

Glide Pad to select menu item

s.




Easy Buttons

Œ

Wireless LAN Button

•

Easy Button 1

➌

Easy Button 2

Figure 1- 3 Easy Button

•

Wireless LAN Button

Push this button to activate or inactivate the Wireless LAN. When you activate the wireless LAN function, it will search the wireless LAN signal automatically if you had installed the driver

•

Easy Button 1

You can define the specific function by yourself to active the program. For example, you can define it to access the outlook 98/2000/2002... utility just by pressing this button. You can simplify several procedures in entering into

Outlook 98/2000/2002... environment. For more understanding and interesting, you can refer Section 2.5 to recognize the driver installation procedures in activating Easy Button 1.

•

Easy Button 2

You can define the specific function by yourself to active the program. For example, you can define it for providing a very convenient way in connecting

Internet only by pressing this button. For more understanding and interesting, you can refer Section 2.5 to recognize the driver installation procedures in activating Easy Button 2.



1-9


Status LED Indicator

Located just in front of the palmrest assembly, you will find three LEDs for the power and battery charge status. These LEDs are positioned to be visible even if the LCD cover is closed.

Œ

Wireless LAN Status

• Power Indicator

•

HDD/CD Access

• Caps Lock

Ž Battery charging LED

‘ Num Lock

Figure 1- 4 Status LED Indicator

•

Power Indicator

Lets you know that power to the system is turned on. This LED is positioned so that you can see the power state whether the LCD panel is opened or closed.

Ÿ Lights green when the system is powered on

Ÿ Lights green blinking when the system is in Suspend to RAM.

•

Battery Charging LED

Lights to indicate battery in charging status.

Ÿ Lights green to indicate that the battery is in charging.

Ÿ Lights off to indicate the battery is fully charged or no battery installed.

•

HDD/CD Access

When LED in green light indicates that the system is accessing either the

Hard Disk or optical disk drive.

•

Caps Lock

When LED in green light indicates that the Caps Lock key on the keyboard is activated. When activated, all alphabet keys typed in will be in uppercase or capital letters.

•

Num Lock

When LED in yellow light indicates that the Num Lock key on the keyboard is activated. When activated, the embedded numeric keypad will be enabled.




•

Wireless LAN Status

When LED in green light indicates that the system is accessing data from or is retrieving data by wireless LAN.

1.4.2 Front Side of the Notebook

❶

Cover Switch

❷

Battery

Figure 1- 5 Front Side of the Notebook

•

Cover Switch

The cover (LCD panel) is locked when it is closed. Slide the button right aside to release the latch for opening the cover of the computer.

•

Battery

The battery pack is inserted here.

1.4.3 The Rear Side of the Notebook

The right side of the notebook computer offers the features shown in the following figure

.

❶ PS/2 Port

❹ VGA Port

❷ Print Port

❺ Modem Port

❼ Air-Outlet Vent ❽ Locking Device Keyhole

Figure 1- 6 Rear Side of the Notebook

❸ COM Port

❻ DC-In Port

•

PS/2 Port

Lets you connect an external PS/2-style mouse, PS/2-style keyboard, or

PS/2-style numeric keypad to the system. With an optional Y-cable adapter, you also can connect any combination on two of these devices simultaneously.



1-11


•

Print Port

Use this port to connect a parallel printer or other parallel device. The parallel port supports Enhanced Capabilities Port (ECP) standard. The standard provides you with a greater processing speed than the conventional parallel port. The port also supports bi-directional protocols.

+

The default setting for the parallel port on your notebook computer is set to Enhanced Capabilities Port (ECP). Some older parallel devices may not function with the ECP default setting. You may need to adjust the setting to accommodate your parallel device by changing the BIOS setting.

•

COM Port

Lets you connect a 9-pin external serial device such as a PDA, mouse, or other serial devices.

•

VGA Port

Lets you attach an external CRT monitor for wider display. You can run the

LCD display and the external CRT monitor simultaneously or switch it to CRT only using the display hot-key.

•

Modem Port

A 56K internal fax/data modem is installed. It keeps you connected to the outside world through networks.

•

DC-In Power Port

Lets you connect the AC power adapter in supplying continuous power to your notebook and recharging the battery.

•

Air-Outlet Vent

Emits the heat out of your computer and keeps it within operating temperature.

•

Locking Device Keyhole

Lets you attach a Kensington security system or a compatible lock to secure your notebook computer.

1.4.4 The Left Side of the Notebook

The left side of your notebook computer provides the features shown in the following figure.

To see all the ports located on the left side, you can open the cover first.




❶

USB Port

❹

IEEE 1394

❷

LAN Port

❸

PC Card Slot

❺

Built-in Stereo Speakers

Figure 1- 7 Left Side of the Notebook

•

LAN Port

An internal 10Base-T/100Base-TX LAN module connects your computer to other computers/networks through a local area network (LAN).

•

USB Port

The Universal Serial Bus (USB) port allows you to connect up to 127 USBequipped peripheral devices (for example, printers, scanners and so on) to your notebook computer

•

IEEE 1394

IEEE 1394 port is a high speed I/O port that can transfer high levels of data in real-time, such as external hard disk, Digital Video Camera.

•

PC Card Slot

Ÿ Lets you connect various PC cards such as memory card

Ÿ Supports both 3V, 5V 32-bit CardBus and 16-bit PC cards.

•

Built-in Stereo Speakers

Integrated left and right mini stereo speakers located at the two sides of the

N/B for sound and audio output for your multimedia presentations or listening pleasure.

1.4.5 The Right Side of the Notebook

❶ Built-in Stereo

Speakers

❷ Volume Control ❸ Microphone Jack

❹ Headphone Jack ❺ Optical Disk Drive

Figure 1- 8 Right Side of the Notebook

•

Built-in Stereo Speakers

Integrated left and right mini stereo speakers located at the two side of the

N/B for sound and audio output for your multimedia presentations or listening pleasure.

•

Volume Control

Allows you to control the speaker volume.

FIC MB05 Service Manual 1-13



•

Headphone Jack

Lets you plug in a stereo headphone, powered speakers, or earphone set with 1/8 inch phono plug for personal listening.

•

Microphone Jack

Allows you to connect an external microphone for monophonic sound recording directly into your notebook computer.

•

Optical Disk Drive

Allows you to load and start programs from a compact disc (CD) or a digital video disc (DVD) and play conventional audio CDs. It also can make CD by using CD-R or CD-RW.

1.4.6 The Under Side of the Notebook

❶ Hard Disk

Compartment

❹ Memory

Compartment

❷ Battery Bay

❺ Battery Release

Latch

❸ Wireless LAN

Compartment

Figure 1- 9 Under Side of the Notebook

•

Battery Release Latch

Push the latch to the left end to remove the battery pack.

•

Battery Bay

Equipped with a choice of Lithium-Ion (Li-Ion) battery pack.

•

Hard Disk Compartment

Open this cover of this compartment to replace with other Hard Disk Drive.

Please refer to Chapter 7 for how to replace it.

•

Memory Compartment

Remove the screw to find two DIMM slots. One is inserted with DDR SDRAM memory board configured by the factory. The other is empty for upgrade use.

•

Wireless LAN Compartment

Provides optional wireless LAN card inserted into this compartment for executing relative functions.




1.5 Notebook Accessories and System Options

It is also important to understand the accessories that come along with the notebook and the options for fully utilizing the capabilities of the computer. This section describes briefly what these accessories and options are.

1.5.1 AC Adapter and Power Cord

The AC Adapter supplies external power to your computer and at the same time charges the internal battery pack. The AC adapter has an auto-switching design that can connect to any

100VAC ~ 240VAC power outlets. Connect the adapter to the AC wall outlet using the power cord. You just change the power cord if you are going to use your notebook in other countries with different connector outlets. When you connect the AC adapter, it charges the battery whether or not the notebook computer is powered on. There is an LED on the AC adapter to indicate if DC power is already available.

1.5.2 Battery Pack

Aside from the AC adapter, your computer can also be powered through the internal battery pack. The battery pack uses rechargeable Lithium-Ion (Li-Ion) battery cells that provide long computing hours when fully charged and power management enabled. You should always leave the battery inside your computer even when using the AC adapter as it also acts as a back-up power supply in case power from the AC adapter is cut off. It is also very important to have the battery pack always charged to prevent battery cell degradation.

1.5.3 Internal Modem Module

The notebook allows you to insert a proprietary internal 56Kbps-modem card to the notebook found on the underside of the notebook. The internal modem card supports only fax and data communication and is V.90-compliant. You connect the telephone line to the RJ-11 jack found on the rear side of the notebook.

1.5.4 Internal Ethernet LAN Module

This notebook comes with an optional 10Base-T/100Base-TX LAN module that supports data transfer rates at 10Mbps and can be up to 100Mbps.

1.5.5 DVD-ROM Drive

Other than the internal CD-ROM drive, the notebook also provides optional factory built-in

DVD-ROM drive. DVD-ROM drives are also backward compatible with CD-ROM, so you can also use any audio CDs, video CDs, photo CDs, and CD-R. Using a software MPEG-2/DVD program, the notebook can playback any commercial DVD movie titles.

1.6 System BIOS SETUP Program

Your computer is likely to have been properly setup and configured by your dealer prior to delivery. However, you may find it necessary to use the computer

’s BIOS (Basic Input-Output

System) Setup program to change system configuration information, such as the current date and time, or your hard disk drive type. The Setup program can be accessed when you power on the system and pressing the <F2> function key.

The settings that you specify within the Setup program are recorded in a special area memory called the CMOS RAM. This memory is backed up by a battery so that is will not be erased when you turn off or reset the system. Whenever you turn on the computer, the system will read the settings stored in the CMOS RAM and compare them to the equipment check conducted during the Power On Self Test (POST). If an error occurs, an error message will be



1-15

FIC MB05W Service Manual displayed on the screen, and you will then be prompted to run the Setup Program.

As the POST (Power-On Self Test) executes during the boot up process, the screen will display the following message:

Press <F2> to Enter SETUP

Press the <F2> key to run the BIOS Setup program. The BIOS Setup program is organized into five menus which you can select using the

ß and à keys. To move from one option to another, you use the up and down arrow keys while using the <F5> and <F6>, or <+>and <-> keys to change the settings. On the right hand side of the screen are some brief help descriptions of each item you want to change.

On the BIOS Setup program, you will find the following parts on the screen:

•

Item Specific Help

The right side of the screen. This area describes each parameter and its available settings.

•

Menu Bar

The top line of the screen. Each of the five selections displays its own screen.

•

Parameters

The left side of the screen. This area lists the parameters and their current settings.

•

Key Status Bar

The bottom part of the screen. These lines display the keys available to move the cursor, select a particular function and so forth.

To exit the BIOS Setup program, simply press the <Esc> key and select from the Exit menu whether you want to Save changes and exit; Discard Changes and exit.




1.6.1 Using the Main Menu Setup

Main

P h oe n i x BIO S S e t u p U t i l i t y

Advanced Security Boot Exit

Item Specific Help

System Time:

System Date:

LAN MAC Address

[12 :00 :00]

[02/19/2003]

00-40-CA-C3-9A-07

<Tab>, <Shift-Tab>, or <Enter> selects field.

Boot Display Device:

4

Primary Master

Secondary Master

System Memory:

Extended Memory:

[Both]

[30006MB]

Installed CD/DVD

640 KB

112640 KB

CPU Type: Intel Pentium-M Processor

CPU Speed:

BIOS Version:

1300 MHz

A.1A-2973-0812

F1 Help

á â Select Item

Esc Exit

-/+ Change Values F9 Setup Defaults

ß--> Select Menu

Enter Select 4Sub-Menu F10 Save and Exit

•

System Time

Allows you to change the system time using the hour:minute:second format of the computer.

Enter the current time for reach field and use the <Tab>, <Shift>+<Tab>, or

<Enter> key to move from one field or back to another.

You can also change the system time from your operating system.

•

System Date

Allows you to set the system date using the month/date/year format.

Enter the current time for reach field and use the <Tab>, <Shift>+<Tab>, or

<Enter> key to move from one field or back to another.

You can also change the system time from your operating system.

•

LAN MAC Address

This field reports the MAC address of the LAN module on your notebook.

•

Boot Display Device

Lets you select the display device.

•

Primary Master

This field display various parameters for the hard disk drive. If type [Auto] is selected, the system automatically sets these parameters. If type [User] is selected, Cylinders, Heads and Sectors and other value can be edited.



1-17


•

Secondary Master

This field is for information only as the BIOS automatically detects the optical drive.

•

System Memory

This field reports the amount of base (or conventional) memory found by the

BIOS during Power-On Self-Test (POST).

•

Extended Memory

This field reports the amount of extended memory found by the BIOS during

Power-On Self-Test (POST).

•

CPU Type

This field reports the CPU type information detected by the BIOS during


•

CPU Speed

This field reports the CPU speed information detected by the BIOS during


•

BIOS Version

This field is for information only as the BIOS displays the BIOS version during the Power-On Self-Test (POST).

1.6.2 Internal HDD Sub-Menu

Main

P h oe n i x B IO S Se t u p U t i l i t y


Primary Master: [30006MB] Item Specific Help

Type:

Total Sectors:

Maximum Capacity:

Multi-Sector Transfers:

LBA Mode Control:

32 Bit I/O:

Transfer Mode:

Ultra DMA Mode:

[Auto]

LBA Format

[58605120]

30006MB

[16 Sectors]

[Enabled]

[Disabled]

[FPIO 4/DMA 2]

[Mode 5]

Select the drive type corresponding to the fixed disk installed in your system.

If type USER is selected, Cylinders,

Heads & Sectors are

Edited directly.

F1 Help



Esc Exit



Use the Type field to select the drive type installed. You can select different drive types as

CD-ROM, User, Auto, or None by pressing <Space> bar. Set this option to Auto so your computer will automatically detect the drive type during power on. Set this option to None when your computer is not installed any devices. Press <Esc> to return to the Main Menu.




1.6.3 Using the Advanced CMOS Setup

Main



NumLock

Embedded Share Memory

Quiet Boot

Screen Expansion

Legacy USB Support

USB 2.0

PXE OPROM

Wake on LAN from S5:

[LockOn]

[16MB]

[Enabled]

[Disabled]

[Enabled]

[Enabled]

Item Specific Help

Selects Power-on state for NumLock

[Disabled]

[Enabled]

4

I/O Device Configuration

F1 Help


Esc Exit




•

Num-Lock

Lets you specify Enabled or Disabled for activating or inactivating Num-Lock function when system is booting.

•

Embedded Share Memory

Lets you specify the sharing memory size of the Video chip from DDR

SDRAM. The Default sharing size is 32MB. You should carefully specify the value, since while the set value is too high, the memory size of your software application will be reduced.

•

Quiet Boot

Lets you specify the boot screen to Logo screen or POST screen by choosing

Disabled or Enabled, respectively.

•

Screen Expansion

Lets you choose full-size screen or reduced size screen for viewing the display mode.

•

Legacy USB Support

Lets you specify Enabled or Disabled for activating or inactivating Legacy

USB Device function when system is booting.

•

USB 2.0

Lets you specify Enabled or Disabled for activating or inactivating USB 2.0

Device function when system is booting.



1-19


•

PXE OPROM

Lets you specify Enabled or Disabled for activating or inactivating PXE

OPROM Device function when system is booting. Please set it to default value

•

Wake on LAN from S5

Lets you activate or inactivate the LAN function when system is booting by specifying Enabled or Disabled option. Wake on LAN is a function that you can boot the system from LAN remotely.

•


Lets you configure input/output device such as Serial Port, Parallel Port, and

Floppy disk controller.

I/O Device Configuration Sub-Menu

Main

P h oe n i x B I O S S e t u p U t i l i t y


Serial port A:


[Auto]

Parallel port: [Auto]

Mode: [Bi-directional]

Item Specific Help

Configure serial port A using options:

[Disabled]

No configuration,

[Enabled]

User configuration,

[Auto]

BIOS or OS chooses configuration,

(OS Controlled) displayed when controlled by OS

F1 Help


-/+ Change Values

Esc Exit

F9 Setup Defaults

ß--> Select Menu Enter Select 4Sub-Menu F10 Save and Exit

•

Serial port A

You can select the Enabled, Disabled, or Auto option for enabled or disabled the port, or automatically sensed by BIOS or OS.

•

Parallel port

Allows you to select the Enabled, Disabled, or Auto option for enabled or disabled this port, or automatically sensed by BIOS or OS.

•

Mode

Allows you to select a parallel mode as Bi-directional, EPP or ECP when the parallel port is configured. When you set the configured parallel port to




Enabled, you need to set the parameter of Base I/O address and IRQ for this port.

1.6.4 Security Menu Setup

Main



Item Specific Help

Supervisor Password Is

User Password Is

Set Supervisor Password

Set User Password

Clear

Clear

[Enter]

[Enter]

Supervisor Password controls access to the setup utility.

Set Primary Hard Disk Password [Enter]

HDD Password Status

Password on boot

Clear

[Disabled]

I/O Security

Modem:

LAN:

[Enabled]

[Enabled]

1394/CARDBUS:

USB:

Wireless LAN:

[Enabled]

[Enabled]

[Enabled]

F1 Help


-/+

Esc Exit

Change Values F9 Setup Defaults


•

Supervisor Password Is

This field will show Set or Clear that means whether this notebook is controlled by Supervisor Password or not.

•

User Password Is

This field will show Set or Clear that means whether this notebook is controlled by User Password or not.

•

Set Supervisor Password

Supervisor password gives you the authority in accessing the setup utility.

You also need to enter this password in system booting and resuming from suspend mode. When you press <Enter> in this field, the Set Supervisor

Password dialog box appears. Enter a new password with up to 8 alphanumeric characters, and then re-enter it for confirmation.



1-21


•

Set User Password

This field is only available when Supervisor Password has set. Enter the user password when boot the system or resume from suspend mode. But if the

Write Protect is set in the Fixed disk boot sector field, you should enter a supervisor password to access the fixed disk when boot the system or resume from suspend mode.

•

Set Primary Hard Disk Password

This password gives you the authority in accessing the Hard Disk. When you press <Enter> in this field, the Set Supervisor Password dialog box appears.

Enter a new password with up to 8 alpha-numeric characters, and then reenter it for confirmation.

•

HDD Password Status

This field will show Set or Clear that means whether this notebook is controlled by HDD Password or not.

•

Password on Boot

If you set this field to Enabled, your computer will ask for the password each time you boot your computer.

•

Modem

Lets you specify Enabled or Disabled for activating or inactivating Modem


•

LAN

Lets you specify Enabled or Disabled for activating or inactivating LAN


•

1394/CARDBUS

Lets you specify Enabled or Disabled for activating or inactivating

1394/CARDBUS Device function when system is booting.

•

USB

Lets you specify Enabled or Disabled for activating or inactivating USB


•

Wireless LAN

Lets you specify Enabled or Disabled for activating or inactivating Wireless

LAN Device function when system is booting.




1.6.5 Using the Boot Setup

This item allows you to set the search drive sequence where the system will try to boot up first.

Main



Item Specific Help

F12 Multi Boot Menu:

PXE Boot with WOL:

Boot Sequence:

[Enabled]

[Disabled]

+Hard Drive

Removable Devices

CD-ROM Drive

Keys used to view or configure devices:

<Enter> expands or collapses devices with a + or -

<Ctrl+Enter> expands all

<Shift + 1> enables or disables a device.

<+> and <-> moves the device up or down.

F1 Help



Esc Exit


•

F12 Multi Boot Menu

Lets you specify Enabled or Disabled for activating or inactivating the Multi

Boot function by pressing F12 function key when system is booting.

•

PXE Boot with WOL

This field is for information only as whether the BIOS can automatically detect the PXE Boot with WOL status or not.

•

Boot Sequence

To select the boot device, you can use the up or down arrow key, then press

<+> to move up the device in the list or press <-> to move down the device in the list.



1-23


1.6.6 How to Exit the Setup Program

There are two choices to escape from the Setup program.

Main

P h oe n i x BIO S S e t u p U t i l i t y


Item Specific Help

Exit Saving Changes

Exit Discarding Changes

Load Setup Defaults

Exit System Setup and save your changes to CMOS.

Discard Changes

Save Changes

F1 Help


F5/F6 Change Values F9 Setup Defaults

Esc Exit


Enter Execute Command F10 Save and Exit

•

Exit Saving Changes

Saves all changes to CMOS while running the BIOS setup program and exit from the system setup program.

•

Exit Discarding Changes

Allows you to discard all changes made while running the BIOS setup program and exit from the system setup program.

•

Load Setup Defaults

Lets you load the default values for all setup items.

•

Discard Changes

Reverts to previously selected settings.

•

Save Changes

Saves Setup data to CMOS.

1.6.7 How to Upgrade the BIOS

Your computer uses EPROM Flash BIOS chip that allows you to easily upgrade the BIOS program. When you update the BIOS, any customized settings you made are lost.

To upgrade the BIOS:

1. Insert the BIOS Update diskette into the diskette drive.

2. Power on the system with the diskette in the diskette drive.




3. On the DOS prompt, type the following command.

A:\>Phlash XXXXXX.ROM (BIOS filename) or

A:\>XXXXXX.BAT (Batch file for BIOS file)

4. Press <Enter> to run this BIOS utility. After the system has been successfully run this program, a message similar to the following appears:

Flash memory has been successfully programmed, press any key to restart the system. If the system does not restart, turn it off, then turn on again.

5. Press any key to restart this system.

Contact your dealer for the latest BIOS update file.



1-25


2.1 Overview

This chapter provides guidelines on installing the device drivers for the built-in features of the

MB05. Most of the driver installation procedures mentioned here are only for Windows XP.

This chapter also includes procedures on how to upgrade major internal system components like CPU, memory, hard disk, and feature card modules.

2.2 Notebook Drivers and Utilities

The notebook requires several device drivers that you need to install and setup before you can fully operate the notebook. These are:

•

Intel 855GM VGA Driver

– Windows XP

•

ALC201A Audio Driver

– Windows XP

•

ALPS Touch Pad Driver

– Windows XP

•

Montara-GM Chipset Driver

– Windows XP

•

Easy Button PRO utility

– Windows XP

•

Askey MDC Modem

– Windows XP

•

Realtek 8100BL LAN driver

– Windows XP

•

Intel Wireless LAN driver

– Windows XP i

Visit FIC Support website ftp://ftp.pcg.fic.com.tw/NBTECH/MB05 for the latest driver updates.

2.2.1 Installing Windows XP from CD / DVD ROM

This section provides Windows XP installation guide from the CD-ROM or DVD-ROM device.

Installing Windows XP from CD-ROM / DVD-ROM

To install Windows XP directly from your CD-ROM, insert the Windows XP installation CD into

CD-ROM drive with following the instructions on the screen to finish the installation. You could go to Boot menu of BIOS setup menu to confirm the priority of boot device. Use arrow key to select "ATAPI CD-ROM Drive", and then use "+" or "-" to move it to the top. Go to Exit menu and select

“Exit Saving Changes”.

2.2.2 Installing the VGA Device Driver

Your notebook computer uses the high-performance Intel 855GM VGA controller, which is an

AGP 4x video local bus, 2D/3D Graphic Engine. Following is the procedure for installing the

VGA Driver for Windows XP :

Installing VGA Driver for Windows XP

1. Click the Start button, then point to Settings, and click Control Panel.

2. Double-click on the System icon, Hardware, and then click on the Device Manager folder tab.

3. Under the Other Devices line, you will find the Video Controller (VGA compatible), click Uninstall, OK, and then Scan for Hardware Changes buttons to appear the New




Hardware Found Message Box.

4. In the Found New Hardware Wizard message box which shows searching Video

Controller (VGA compatible) driver. Click Next to proceed the further step.

5. Select "Search for a suitable driver for my device", and click Next.

6. Tick on "Specify a location box", then, click Next and Browse buttons, and then navigate to the VGA driver location as "\Drivers\ WinXP\VGA".

7. Click OK and Next to begin searching the driver. Click Next to continue installing the driver.

8.

Click Finish button to finish installing VGA driver and Click Yes to restart the computer.

2.2.3 Installing the Audio Device Driver

Your notebook computer uses Realtek Audio controller.

Installing Audio Driver for Windows XP


2. Double-click on the System icon, Hardware and then click on the Device Manager folder tab.

3. Under the Other Devices line, you will find the Multimedia Audio Controller, click

Uninstall, OK, and then Scan for hardware changes buttons to appear the New

Hardware Found Message Box.

4. In the Found New Hardware Wizard message box which shows searching Multimedia

Audio Controller driver. Click Next to proceed to the next step.


6. Tick on "Specify a location box", then click Next and Browse buttons, and navigate to the Audio driver location as "\Drivers\ WinXP\Audio".

7. Click OK and Next to begin searching the driver. The Add New Hardware will found Intel

ALC201A Audio.

8. Click Yes to continue installing the driver. Click Finish button to finish installing Audio driver.

2.2.4 Installing Touch Pad Driver

Following is the procedure for installing Synaptics touch pad driver.

Installing ALPS Touch Pad Driver for Windows XP

1. Boot Windows from your hard disk and insert the diskette containing touch pad driver.



1-27


2. Click the Start button, then click Run. In the Run dialog box, click Browse button and navigate to the directory as "\Driver\WinXP\Touch Pad\setup.exe", path according to your Operating System and run "Setup.exe".

3. Execute the setup program and then select the language for this installation. After that, a

Welcome dialog box appears.

4. Click Next continuously three times when the screen appears the Next button.

5. Click OK to restart your system.

2.2.5 Installing Internal Modem Device Driver

Your notebook computer may come with an optional internal modem. The internal modem is a

56Kps V.90 Askey MDC modem.

Installing Internal Modem for Windows XP

1. Boot Windows from your hard disk and insert the disc containing the Modem driver for

Windows.

2. Click the Start button and then click Run. In the Run dialog box, click Browse button and navigate to the directory as "\driver\WinXP\MODEM\setup.exe" where the modem driver is located.

3. Click OK to process the installation of modem driver. Follow the instruction to finish the installation.

4. With

“Yes, I want to restart my computer now” selected, click Finish to complete the modem installation.

2.2.6 Installing Internal LAN Device Driver

Your notebook computer may come with an optional internal LAN, which uses the Intel 562EZ chip. Please follow the procedures below for installing the LAN driver:

Installing Internal LAN for Windows XP


2. Double-click on the System icon, Hardware and then click on the Device Manager folder tab.

3. Under the Other Devices line, you will find the Ethernet Controller, click Uninstall, OK, then Scan for hardware changes buttons to appear the New Hardware Found

Message Box.

4. In the Found New Hardware Wizard message box which shows searching Ethernet

Controller driver. Click Next to proceed to the next step.


6. Tick on "Specify a location box". Then, click Next and Browse buttons and navigate to the LAN driver location as "\Drivers\WinXP\LAN". Click OK and Next to begin searching



FIC MB05W Service Manual the driver.

7. The Add New Hardware will found Intel Fast Ethernet . Click Yes to continue installing the driver.

8. Click Finish button to finish installing LAN driver.

2.2.7 Installing EzButton Driver

Following is the procedure for installing Easy Button driver.

Installing Easy Button driver for Windows XP

1. Boot Windows from your hard disk and insert the disc containing the Easy Button driver.

2. Click the Start button, then click Run. In the Run dialog box, click Browse button and navigate to the directory as "\Drivers\WinXP\Easy Button\Ez Button.exe".

3. Run the execution file for installing the Easy Button driver, and then click Finish after complete the installing procedure.

2.2.8 Installing the Chipset Driver

Your notebook computer uses the advanced chipset. Installing the driver to enhance the stability and performance.

Installing Chipset device driver for Windows XP

1. Click the Start button, then point to Run. The Run dialog box appears.

2. Click the Browse button and specify the directory as.

"E:\Drivers\WinXP\Chipset\Setup.exe".

3. Click "OK" to execute the setup program. The Setup box appears.

4. Click Next continuously to install this driver when screen displays this command.

5. Tick the option "Yes, I want to restart my computer now.", and press Finish to restart your system.

2.3 System Upgrades

This section provides an easy step in doing system upgrades for your notebook computer.



1-29


2.3.1 Jumper Settings

This section provides a jumper setting lists of configuring the notebook.

SW1

Keyboard Type Select

SW1

JP KEYBOARD

US KEYBOARD

UK KEYBOARD

CD-ROM Cable select

SW1

Master

Slave

Password Select

Pos #1

OFF

ON

OFF

Pos #7

OFF

ON

POS #2

OFF

OFF

ON

SW1

Normal

Clear Password

CMOS Clear Select

Pos#4

OFF

ON

SW1

Default

Auto POWER ON Select

SW1

Normal

Auto Power On

Logo Select

Pos#8

OFF

Pos#6

OFF

ON

SW1

Default

MATHER BOARD ID Select

Pos#3

OFF

SW1

Default

Pos#5

OFF

The switch setting is on the bottom of Wireless LAN Compartment door. Please see the figure 2-1 for more clear location.




Figure 2-1 Location of SW1

2.3.2 CPU Upgrade Procedure

The MB05 features Mobile Intel Pentium-M FCPGA Processors.

How to Access the CPU Socket

To install or replace the CPU, follow the steps below:

1. Turn off the system and remove both AC adapter and the battery pack from the notebook unit.

2. Remove keyboard cover by gently bending it and sliding it towards in front of you.



1-31


Figure 2-2

Remove keyboard Cover

3. There are two screws on the bottom case and that should be removing as the picture indicated.

4. Lift the keyboard and tilt it towards the LCD panel.

5. Release keyboard cable by sliding the ZIF connector towards up direction.

Figure 2-3 Remove two screws




Figure 2-4 Remove keyboard

6. Release three screws as shown in the picture below, and then remove Frame Bracket.

Figure 2-5 Remove Frame Bracket

7. Release four screws and one cable as shown in the picture below, and then remove heat sink plate and Fan.



1-33


Figure 2-6 Remove heat sink plate and Fan

8. Use a flat screwdriver to unlock CPU.

Figure 2-7 Remove CPU




9. Remove CPU and insert the preferred CPU.

10. Use a flat screwdriver to lock CPU.

11.

Place back the heat plate and keyboard cover. Boot on the computer, and then BIOS will automatically detect the type of the CPU which just be installed.

2.3.3 Memory Upgrade Procedure

The notebook computer offers two memory slot using DDR DIMM at 128MB, 256MB and

512MB DDR-RAM. Two memory slots are found inside the memory compartment. The memory compartment is located on the underside of your computer inside the memory compartment. With two memory slots, you can have several combinations up to 1024MB.

Using the Memory Slot inside the Memory Compartment

Follow the steps below on how to upgrade the memory modules:

1. Make sure the system is powered off and that no peripheral devices are attached.

2. Turn the system over and locate the screw on the memory compartment.

Figure 2-8 Removing Memory module

3.

Locate the memory module socket. Align the notch with the notch in the socket connector

and insert the module as follows:



1-35


−

Hold the DIMM at a 60-degree angle and align the DIMM connector with the socket in the system. Push the connector into the socket.

−

Press down on the edge of the DIMM until the locking tabs on the sides snap into place, securing the module.

4. To remove a DIMM, press the locking tabs away from the sides of the module until the module pops up. Then, remove the DIMM.

5. Reassemble the notebook components as follows.

−

Put the DIMM door back.

−

Replace the screw and turn the system over.

2.3.4 Hard Disk Upgrade Procedure

The notebook provides a built-in hard disk for the primary IDE controller. The HDD is an industry standard 2.5

” IDE disk drive and can be upgraded with another standard 2.5” HDD.

1. Make sure the system is powered off and that no peripheral devices are attached.

2.

Remove the one screw.

Figure 2-9 Removing HDD module

3. Remove the HDD module from the base unit.

4. Remove four screws of frame HDD bracket plate.




Figure 2-10 Screws Locations of the frame HDD bracket plate

2.3.5 System BIOS Upgrade Procedure

The notebook supports EPROM Flash BIOS that allows you to easily update the system BIOS using the Phoenix BIOS Flash utility program called

“PHLASH.COM”. This program runs under MS-DOS and requires the system not to load high memory like HIMEM.SYS. It also needs the

“PLATFORM.BIN” file in order to activate.

Follow the steps below on how to update the system BIOS:

1. Prepare a clean bootable diskette without loading the HIMEM.SYS. Copy the files

PHLASH.COM and PLATFORM.BIN into the diskette along with the BIOS ROM file.

2. Restart the computer and boot from the diskette. At the DOS prompt, type the command

“PHLASH <BIOSfile.ROM>” to activate Flash BIOS programming utility. The computer will then start to update the system BIOS inside the notebook.

3. After programming is complete, the system will prompt you to press any key to shutdown the computer. The BIOS version is displayed inside the BIOS Setup Main menu. Press

<F2> after power on to run CMOS Setup program.

BIOS Version : 1.0A-0716-0724

i

It is very important not to power off the system whenever the FLASH BIOS program is running. Otherwise, the system may not be able to power on and you need to replace the BIOS EPROM chip from another working notebook. i

Always plug in the AC adapter when updating the BIOS.



1-37


3.1 Overview

The MB05 is an IBM PC/AT compatible Notebook PC which supports the Intel uFCPGA

Socket. The following are the major features that MB05 supports.

²

Microsoft PC2001 logo and WinXP logo approval.

²

14.1

”,15” XGA and 15”SXGA+ panel support.

²

Support ACPI 1.0B (or above).

²

Support PCI 2.2 (or above).

²

Support USB 1.1/2.0.

²

Support SMBIOS 2.3.(or above)

3.2 Summary of the BIOS Specification

The summary of the BIOS specification is as the below description:




Controller Chip

BIOS Feature

CPU

DRAM

Cache

Shadow

Display

Hard Disk

Multi Boot

Plug and Play

Smart Battery

Keyboard Controller

PCMCIA

Power Management

Support (ACPI Mode)

Description

§ Microsoft PC99 logo and WinXP logo approval.

§ Support Boot Block / Crisis Rescue.

§ APM 1.2 Compliance

§ Support ACPI 1.0B (or above) Spec.

§ Support PCI 2.1 (or above) Spec.

§ Support SMBIOS 2.3 (or above) Spec

§ Support Windows XP / Windows 2K.

§ Support flash function including both DOS and Windows interface for new BIOS update.

§ Support US keyboard .

§ Support boot from LAN , USB FDD/FLASH , HDD and CDROM

Drive.

§ Support Phoenix First BIOS.

Auto detecting the CPU type and speed for Intel Banias based system.

Support Intel Geyserville III Technology .

Auto sizing and detection. Support PC-200/266 DDR SDRAM.

§ Level 2 SRAM auto sizing and detection.

§ Always enable CPU L1 and L2 cache.

Always enable VGA and System BIOS shadow.

§ System auto detects LCD or CRT or TV presence on boot .

§ Up to 32 MB of Dynamic Video Memory Allocation.

§ Enhanced IDE spec.

§ Support auto IDE detection.

§ Support LBA mode for larger capacity HDD.

§ Support Ultra DMA 33/66/100.

§ Support Fast PIO mode 1-4 transfer.

§ Support 32 bit PIO transfer.

§ Support Multi-Sector transfer.

§ Support SMART monitoring.

Allow the user to select boot from USB FDD/FLASH, HDD LAN and CD-ROM.

Support PnP Run Time Service and conflict-free allocation of resource during POST

Support BIOS interface to pass battery information to the application via SMBus.

Support Fn hot keys, two Win95 hot keys, built-in Glide Pad.

Compliant with PCMCIA 2.1 specification.

The power management is compliant with ACPI 1.0B specification and supports the following power state:

§ S0 (Full-On) Mode

§ S3 (STR) Mode

§ S4 (STD) Mode

§ S5 (Soft-Off) Mode



1-39


3.3 Subsystem Software Functions

This section provides introduction on the software functions of the notebook subsystems and

BIOS related function.

3.3.1 Key Chipset Summary

Following are the main chipsets used in the notebook:

Controller Chip

Processor

North Bridge

South Bridge

Video Controller

PCMCIA Controller

Supper I/O Controller

Audio Controller

Audio Codec

Keyboard Controller

Power Management

ROM BIOS

Clock Generator

Temperature Sensor

IEEE 1394

LAN

Modem

Vendor

Intel

Intel

Intel

Intel

RICOH

SMSC

Intel

Realtek

Misubishi

NEC

SST

IMI

NS

RICOH

Realtek

ASKEY

Description

Mobile Banias

MontaraGM

ICH4

Embedded in MontaraGM

R5C554

LPC47N267

South Bridge Integrated

ALC201

M3885x

PMU08

49LF004A

CY28346

MAX1617

R5C554

8100BL

MDC AC

’97

3.3.2 System Memory

The system memory consists of SDRAM memory on 64-bit bus and the module size options are 128/256/512/1GMB upward. The BIOS will automatically detect the amount of memory in the system and configure CMOS accordingly during the POST (Power-On Self Test) process.

This must be done in a way that requires no user interaction.

Base SO-DIMM DRAM slot

Expansion SO-DIMM DRAM slot

Total Size

(Bank 0&1)

NIL

(Bank 2&3)

128MB 128MB

NIL

NIL

128MB

128MB

128MB

128MB

256MB

256MB

256MB

256MB

512MB

512MB

512MB

256MB

512MB

NIL

128MB

256MB

512MB

NIL

128MB

256MB

512MB

NIL

128MB

256MB

256MB

512MB

128MB

256MB

384MB

640MB

256MB

384MB

512MB

768MB

512MB

640MB

768MB




512MB 512MB 1024MB

3.3.3 Video

Supported Video Mode

The following is the display modes supported by the INTEL Mobility Video control in

LCD only, CRT only, and simultaneous mode. The VGA BIOS will allow mode sets of resolutions greater than the panel size but only show as much mode display as will fit on the panel.

Supported standard VGA modes:

The VGA BIOS supports the IBM VGA Standard 7-bit VGA modes numbers.

VESA

Mode

100h

101h

102h

103h

104h

105h

106h

107h

10Eh

Mode

00h/01h

02h/03h

04h/05h

06h

07h

0Dh

0Eh

0Fh

10h

11h

12h

13h

Pixel Resolution

40*25

80*25

320*200

640*200

80*25

320*200

640*200

640*350

640*350

640*480

640*480

320*200

Colors

16

16

4

2

Mono

16

16

Mono

16

2

16

256

Memory

Text

Text

2-bit Planar

1-bit Planar

Text

4-bit Planar

4-bit Planar

1-bit Planar

4-bit Planar

2-bit Planar

4-bit Planar

8-bit Planar

Note: All Standard VGA Modes are limited to the standard VGA refresh rates.

Supported extended video modes:

CRT device will support all listed VESA mode; and other devices such as PANEL & TV may be limited to the mode support due to their characteristics.

Pixel

Resolution

640 x 400

640 x 480

800 x 600

800 x 600

1024 x 768

1024 x 768

1280 x 1024

1280 x 1024

320 x 200

Memory Model Refresh Rates In (Hz)

8-bit Packed 70

8-bit Packed 60, 72, 75, 85

4-bit Planar 60, 72, 75, 85, 100

8-bit Packed 60, 72, 75, 85, 100

4-bit Planar 43(I), 60, 70, 75, 85, 100

8-bit Packed 43(I), 60, 70, 75, 85, 100

4-bit Planar 43(I), 60, 75, 85

8-bit Packed 43(I), 60, 75, 85

16-bit Packed 70

Minimum

Memory

2MB

2MB

2MB

2MB

2MB

2MB

2MB

2MB

2MB



1-41


12Ch

12Dh

12Eh

131h

133h

134h

13Bh*

13Ch*

13Eh*

141h

143h

144h

151h

153h

154h

171h

173h

174h

175h

176h

178h

179h

17Ah

11Ah

11Bh

11Dh

11Eh

120h

122h

124h

12Ah

12Bh

10Fh

111h

112h

114h

115h

117h

118h

1024 x 768

1280 x 1024

320 x 200

320 x 200

320 x 200

320 x 200

1400 x 1050

1400 x 1050

1400 x 1050

400 x 300

400 x 300

400 x 300

512 x 384

512 x 384

512 x 384

720 x 480

720 x 480

720 x 480

720 x 480

720 x 576

720 x 576

720 x 576

720 x 576

320 x 200

640 x 480

640 x 480

800 x 600

800 x 600

1024 x 768

1028 x 768

1280 x 1024

1280 x 1024

640 x 400

640 x 400

1600 x 1200

1600 x 1200

1600 x 1200

640 x 480

800 x 600

32-bit Unpacked 70

16-bit Packed 60, 72, 75, 85

32-bit Unpacked 60, 72, 75, 85

16-bit Packed 60, 72, 75, 85, 100

32-bit Unpacked 60, 72, 75, 85, 100

16-bit Packed 43(I), 60, 70, 75, 85, 100

32-bit Unpacked 43(I), 60, 70, 75, 85, 100

16-bit Packed 43(I), 60, 75, 85

32-bit Unpacked 43(I), 60, 75, 85

16-bit Packed 70

32-bit Packed 70

8-bit Packed 48(I), 60, 75, 85

16-bit Packed 48(I), 60, 75, 85

32-bit Unpacked 48(I), 60, 75, 85

24-bit Packed 60, 72, 75, 85

24-bit Packed 60, 72, 75, 85, 100

24-bit Packed 43(I), 60, 70, 75, 85, 100

24-bit Packed 43(I), 60, 75, 85

8-bit Packed 70

8-bit Packed 72

16-bit Packed 72

32-bit Packed 72

8-bit Packed 60, 75

16-bit Packed 60, 75

32-bitUnpacked 60, 75

8-bit Packed 72

16-bit Packed 72

32-bitUnpacked 72

8-bit Packed 70

16-bit Packed 70

32-bitUnpacked 70

8-bit Packed 75

16-bit Packed 75

24-bit Packed 75

32-bitUnpacked 75

8-bit Packed 75

16-bit Packed 75

24-bit Packed 75

32-bitUnpacked 75

Note: “*” The modes may not be available. Their availability should be determined by VESA function calls.

8MB

2MB

2MB

2MB

2MB

2MB

2MB

2MB

4MB

4MB

2MB

2MB

2MB

2MB

2MB

4MB

2MB

2MB

2MB

2MB

2MB

2MB

2MB

8MB

2MB

2MB

2MB

4MB

8MB

2MB

2MB

2MB

2MB

2MB

2MB

2MB

2MB

4MB

4MB




Panel Type Initialization

The VGA BIOS will issue INT 15h function call during POST. This function call allows the system BIOS to specify the panel type to the VGA BIOS. The system BIOS should get the panel type from GPIO pins before the VGA chip initialized, and pass this information to VGA BIOS through INT 15 Function 4E00h.

LCD Panel ID pin Definition:

Panel Type

1

1

1

1

1

1

1

ICH4 GPI Pins

GPI [23] GPI

[17]

0 0

GPI

[11]

0

0

0

0

1

0

0

0

0

0

0

0

1

1

1

1

0

0

1

1

0

0

1

1

0

1

1

1

0

0

0

1

0

1

1

0

1

1

0

GPI

[10]

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

3.3.4 Enhanced IDE

The system BIOS must be ready to support 4 IDE devises on two controllers. The BIOS support Ultra DMA33/66/100 and also supports automatic configuration of drives using both the

LBA and CHS large drive remapping method. In addition to supporting standard drives through an auto-configuration process that does NOT require user involvement or confirmation. The system should automatically do this at POST time in a way that is transparent to the user. If a drive is connected to the bus, the drive should be automatically recognized, configured and available for use under MS-DOS 6.2x.

3.3.5 Audio

The audio subsystem will support the requirements identified by the AC

’97 specification. Both software and hardware will control the volume level for the internal audio subsystem. In addition to the volume control, the user will be able to mute the sound to completely cut off the volume using both software and hardware.

3.3.7 PCMCIA

The PCMCIA controller chip of the notebook provides the following features:

•

Individually accessed, dual-buffer implementation

•

Support for 2 separate CardBus slots (one type III or two type II stacked)



1-43


•

Support for 3.3v, 5v and 12v (flash programming) cards

3.3.8 LED Indicator

The table below lists down the functions of the Status LED indicator:

Indicator Function Description

HDD/CD accessing This LED will turn on while accessing the IDE Device.

LED

Battery Charging LED Turn on (Green)

– Battery is under charging mode

Turn off

– Battery full charged or no battery

CapsLock LED

Wireless LAN LED

This LED will turn on when the function of CapsLock is active.

When LED in green light indicates that the system is accessing data from or is retrieving data by wireless LAN.

NumLock LED

Power Status LED

This LED will turn on when the function of NumLock is active.

Green

– System is powered on.

Green Blinking- System is entered suspend mode.

3.3.9 Hot Keys Definition

All Hot keys must be active at all times under all operation systems.

Function Function Handler

Fn + F3 Mute (Speaker ON/OFF) BIOS Handler

Fn + F4 Suspend

Fn + F7 Display toggle (CRT/LCD)

Fn + F8

Fn + F9

Internet

Button

Brightness Increase

Brightness Decrease

Internet Function Key

Mail Button Mail Function Key

Wireless Lan Turn ON/OFF Wireless LAN

3.3.10 Plug & Play

Control by OSPM

BIOS Handler

Controlled by PMU08

Controlled by PMU08

Controlled by Driver

Controlled by Driver

Control by Hardware

The BIOS supports the Plug and Play Specification 1.0A. (Include ESCD)

This section describes the device management. The system board devices and its resources are as follows:

Device Resources

DMA Controller

Connect

Type

Static

DMA

DMA4

Memory

-

Interrupt Controller

System Timer

RTC

ISAPNP Read Data

Port

System Speaker

PCI Bus

Static

Static

Static

Static

Static

Static

I/O

00~0F, 81~91,

93-9F,C0-DF

20~21, A0~A1

40~43

70~71

IRQ

-

274-277,279,

A79,

61

-

-

0-CF7,D00-FFFF -

IRQ2

IRQ0

IRQ8

-

-

-

-

-

-

-

-

-

-

-

A0000-BFFFF,

D0000-D7FFF,




MotherBoard Resource Static 10-1F,24-25,28-

29,2C-31,34-35,38-

39,3C-3D,5053,72-

77,80,A4-A5,A8-

A9,AC-AD,B0-

B5,B8-B9,BC-

BD,4D0-4D1,580-

587,1180-

11BF,1200,FE00

-

Keyboard Controller Static

PMU08 Controller

Math Coprocessor

Glide Pad

Video Controller

Static

Static

Static

Static

60, 64

68, 6C

F0~FE

-

3B0~3BB,

3C0~3DF,

1800~1807,

-

IRQ1

-

IRQ13

IRQ12

IRQ11/IRQ

5/IRQ7

-

-

-

-

-

Dual IDE Controller Static 170~177, 1F0~1F7, IRQ14, 15 -

376,3F6

CardBus Controller Dynamic 3E0~3E1,

FD00-FDFF,

FF00-FFFF

Cardbus0:

IRQ11/IRQ

5/IRQ7

Cardbus1:

IRQ10/IRQ

3/IRQ4

-

Audio chip Dynamic 1880-18BF,

1C00-1CFF

IRQ10/IRQ

3/IRQ4

-

Modem Dynamic 2000~207F,

2400-24FF

Dynamic 3000~30FF LAN

82801DB/DBM USB Dynamic 1820~185F

82801DB/DBM

SMBUS

82801DB/DBM Ultra

ATA

ACPI-Compliant system

Dynamic 1100~111F

Dynamic 1810~181F

Dynamic -

IRQ10/IRQ

3/IRQ4

IRQ10/IRQ

3/IRQ4

IRQ11/IRQ

5/IRQ7

IRQ10/IRQ

3/IRQ4

-

-

-

-

-

IRQ9 -



E0000-E3000,

10000000-

FEBFFFFF,

FEC10000-

FEC1FFFF,

FF000000-

FF070000,

FF800000-

FF870000,

FF880000-

FF8FFFFF,

FF900000-

FFBFFFFF,

FFF00000-

FFFFFFFF

-

-

-

-

A0000~BFFFF

,

C0000~CFFFF

,

E0000000-

E00FFFFF,

E8000000-

EFFFFFFF,

F0000000-

F7FFFFFF,

-

D7000-D7FFF,

FABFD000-

FEBFCFFF,

FEBFD000-

FEBFDFFF,

FEBFE000-

FEBFEFFF,

E0100800-

E01008FF,

E0100C00-

E0100DFF,

-

E0201800-

E02018FF

-

-

FEBFFC00-

FEBFFFF,

-

1-45


Wireless LAN Dynamic ~

FirmwareHub Devices Static -

IRQ10/IRQ

3/IRQ4

-

-

-

IEEE 1394 Dynamic - IRQ10/IRQ

3/IRQ4

-

3.3.11 PCI Device

The table below summarizes the PCI IDSEL Pin Allocation:

IDSEL Pin

AD21

AD19

AD17

PCI Device

Device Number Function

Number

Device 05

Device 03

Device 01

Function 0

Function 0,1

Function 0

Device Name

LAN

Card Bus/1394

MINI PCI

The table below summarizes the PCI bus master Allocation:

Arbiter Signal

REQ00/GNT00

Agents

(Master)

Function

REQ10/GNT10 RICOH Card Bus Controller

REQ20/GNT20

REQ30/GNT30

REQ40/GNT40

LAN Controller

E0200000-

E0200FFF-

FF800000-

FFFFFFFF

E0200000-

E02007FF

Use

3.3.12

SMBus Devices

The SMBus is a two-wire interface through which the system can communicate with powerrelated chips. The BIOS should initialize the SMBus devices during POST.

ICH4 SMBus Connection Devices

SMBus Device

SO-DIMM

CY28346

CLK Generator

Host/Slave

Slave

Slave

Address BIOS Need to

Initialization

A0h/A2h Memory Auto Sizing

(SPD).

D2h Program the desired clock frequency (Pin23 output 24MHz, Pin22 output 48MHz)




PMU 08 SMBus Connection Devices

SMBus Device

PMU08

MAX1617(Thermal sensor)

Host/Slave Address

A7 ~ A1

Master

Slave

10h

9Ch

BIOS Need to Initialization

Hex Address

000 - 01F

020 - 021

022

040 - 05F

060 - 064

068

– 06C

070 - 07F

080 - 08F

092

0A0 - 0A1

0B2

0B3

0C0

– 0DF

0F0

– 0FF

170 - 177

1F0 - 1F7

279

330 - 333

376

3B0 - 3DF

3E0 - 3E1

3E8 - 3EF

3F6

778

– 77F

A79

CF8

– CFF

ISA DMA Map

Battery (1 st

Battery)

ENE PIC (Fan Control)

I/O Map

Slave

Slave

A8h

24h

Enbale Decode interface

Program the desired temperature range

No Need

Program the desired Fan speed

Device

8237-1

8259-1

8254

Keyboard Controller

PMU08 Controller

RTC & NMI Mask

DMA Page Registers

System Control Port

8259-2

Advanced Power Management Control Port

Advanced Power Management Status Port

8237-2

Math Coprocessor

IDE Secondary Command Block

IDE Primary Command Block

ISA PnP Address

MIDI

IDE Secondary Control Block

Video Controller

PCMCIA Controller

Fax/Modem

IDE Primary Control Block

ECP port

ISA PnP Address

PCI BUS configuration Register

DMA Channel

DMA 0

DMA 1

DMA 2

DMA 3

DMA 4

DMA 5

DMA 6

DMA 7

Device

Unused

[Cascade]

Unused

Unused

Unused



1-47


Memory Map

Address Range

00000 - 9FFFFh

A0000

– BFFFFh

C0000

– C9FFFh

CA000

– DBFFFh

DC000 - DFFFFh

E0000

– FFFFFh

IRQ Map

IRQ#

IRQ 0

IRQ 1

IRQ 2

IRQ 3

IRQ 4

IRQ 5

IRQ 6

IRQ 7

IRQ 8

IRQ 9

IRQ10

IRQ11

IRQ12

IRQ13

IRQ14

IRQ15

Length

640 KB

128 KB

40 KB

72 KB

16 KB

128 KB

Description

System Memory

Video Memory

Video ROM

Unused

System ROM BIOS /DMI information

Description

System Timer

Keyboard

Cascade

Reserved for Card null

Reserved for Card

Reserved for Card null

CMOS/RTC

SCI IRQ used by ACPI bus

MiniPCI, LAN,Audio, Modem, IEEE1394,SMBus,cardbus1

Possible IRQ: 3, 4, 10

USB1.1, VGA, USB2.0, CardBus0

Possible IRQ: 5, 7, 11 null

Math Coprocessor

IDE primary channel

IDE secondary channel

3.3.13 GPIO Pin Assignment

The GPI and GPO pins connected to system devices. The BIOS can get device

’s status and control the device via the GPI and GPO pins.

ICH4 GPI pin assignment

GPIO

Number

GPIO0

GPIO1

GPIO2

GPIO3

GPIO8

GPIO11

GPIO12

GPIO13

Signal Name Default I/O

PanelID0

PanelID1

PanelID2

PanelID3

Q_SMI0

LPC_QPME0 1

EC_SCI0

PM_RI0

I

I

I

I

I

O

I

I

Notes

Panel ID setting

Panel ID setting

Panel ID setting

Panel ID setting

0:External K/B SMI0

1:Normal operation

0:LPC_QPME0 Event Enable

1:Normal operation --

0:PMU SCI Detect

1:PMU SCI not Detect

0:PMU GPIO detect

1:PMU GPIO not Detect




GPIO17 PMUFLASH0 1 O

GPIO25 CB_HWSUSP0 1 O

0:Flash PMU08 Firmware --

R5C551 Hardware suspend control pin

SMBus select 1 GPIO32 SPDMUX0 1 O

GPIO33 SPDMUX1 1

3.3.14 PMU08 GPIO pin assignment

0 SMBus select 0

GPIO number

Signal Name Default I/O

GPIO B6 PM_SLP_S10 1 I

Notes

Suspend Plane A control for ICH4

0: POS, STR and STD suspend state.

1: not suspend state.

GPIO B5 N.C. -- -- No used

Remark

GPIO B4 N.C.

GPIO B1 N.C.

GPIO B0 N.C.

GPIO A7 RI10

--

1

--

1

GPIO A6 PCMRI0

GPIO A0 LID0

GPIO C1 NC

GPIO B7 PM_RI0

GPIO B3 PDCOM0

1

1

--

1

1

GPIO B2 N.C.

GPIO B0 N.C.

--

--

GPIO A5 PRSTMSK0 1

GPIO A4 PCMUTE0

GPIO A2 MAILLED0

GPIO A1 N.C.

GPIO C2 CHGLED

GPIO C3 N.C.

1

1

--

--

-- No used

O No used

-- No use

I RS Ring event

0: Ring

1: No Ring

I

I

PC Card Ring event

0: Ring

1: No Ring

LCD Open/Close Status

0: LCD Close

1: LCD Open

-- No Use

O Wake Up event request

0: Wake SMI(SCI)

1: There is no demand.

O SHUTDOWN MAX3243

1:NO SHUTDOWN

0: SHUTDOWN

- No Use

-- No Use

O PCI Reset Mask

0: Reset Mask

1: Reset Enable

O Mute PC Speaker

O MAIL ARRIVAL INDICATE

-- No use

Charge Battery indicator :

1 : charging Battery

0 : Stop charging Battery

-- No Use

GPIO C0 N.C. -- -- No Use



1-49


3.4 ACPI

General Requirements

The BIOS must meet the following general Power Management requirements:

Refers to the portion of the firmware that is compatible with the ACPI 1.0b specifications.

Support for Power ON(S0 state), Suspend-to-RAM (S3 state) , Suspend-to-Disk mode (S4 state) and Soft OFF(S5 state).

Global System State Definitions

Global system states (Gx states) apply to the entire system and are visible to the user.

Following is a list of the system states:

G0/S0 - Working:

A computer state where the system dispatches user mode (application) threads and they execute. In this state, devices (peripherals) are dynamically having their power state changed. The user will be able to select (through some user interface) various performance/power characteristics of the system to have the software optimize for performance or battery life. The system responds to external events in real time. It is not safe to disassemble the machine in this state.

G1 - Sleeping:

A computer state where the computer consumes a small amount of power, user mode threads are not being executed, and the system

“appears” to be off (from an end user’s perspective, the display is off, etc.). Latency for returning to the Working state varies on the wakeup environment selected prior to entry of this state (for example, should the system answer phone calls, etc.). Work can be resumed without rebooting the OS because large elements of system context are saved by the hardware and the rest by system software. It is not safe to disassemble the machine in this state.

G2/S5 - Soft Off:

A computer state where the computer consumes a minimal amount of power. No user mode or system mode code is run. This state requires a large latency in order to return to the Working state. The system

’s context will not be preserved by the hardware. The system must be restarted to return to the Working state. It is not safe to disassemble the machine.

G3

– Mechanical Off:

A computer state that is entered and left by a mechanical means. It is implied by the entry of this off state through a mechanical means that the no electrical current is running through the circuitry and it can be worked on without damaging the hardware or endangering the service personnel. The OS must be restarted to return to the Working state. No hardware context is retained. Except for the real time clock, power consumption is zero.

Sleeping State Definitions

Sleeping states (Sx states) are types of sleeping states within the global sleeping state,

G1. The Sx states are briefly defined below. For a detailed definition of the system behavior within each Sx state, refer to ACPI specification section 7.5.2. For a detailed definition of the transitions between each of the Sx states, refer to ACPI specification section 9.1.

S1 Sleeping State:

The S1 sleeping state is a low wake-up latency sleeping state. In this state, no system context is lost (CPU or chip set) and hardware maintains all system context.





The S3 sleeping state is a low wake-up latency sleeping state where all system context is lost except system memory. CPU, cache, and chip set context are lost in this state.

Hardware maintains memory context and restores some CPU and L2 configuration context.

Control starts from the processor

’s reset vector after the wake-up event.


The S4 sleeping state is the lowest power, longest wake-up latency sleeping state supported by ACPI. In order to reduce power to a minimum, it is assumed that the hardware platform has powered off all devices. Platform context is saved in disk.

S5 Soft Off State:

The S5 state is similar to the S4 state except the OS does not save any context nor enable any devices to wake the system. The system is in the

“SOFT” off state and requires a complete boot when awakened. Software uses a different state value to distinguish between the S5 state and the S4 state to allow for initial boot operations within the BIOS to distinguish whether or not the boot is going to wake from a saved memory image.

System Power Plane

The system components are grouped as the following parties to let the system to control the

On/Off of power under different power management modes.

3.4.1 System Power Plane

The system components are grouped as the following parties to let the system to control the

On/Off of power under different power management modes.

The power plane is divided as following:

Power Group Power

Control

Pin

+B

+3VA

Nil

Nil

Controlled Devices

IMM, (9V~20V)

RTC I/F, PMU08

+12V

+5V

+3V

+5VS

+3VS

PWRON PCMCIA Card, AC97 Codec

PWRON PCMCIA Slot 5V

PWRON VGA, PCMCIA, PCMCIA Slot 3V, DRAM, Twister(DRAM I/F),

M3885x, MAX3243

SUSB#

SUSB#

+RTCVCCS Nil

FLASH ROM, HDD, CD-ROM, USB, Internal K/B, Glide Pad,

Audio AMP, Fan

ISA I/F Power, Clock Generator & Buffer (W137)

RTC

3.4.2 Power Management Mode Transition Flow Chart

From a user-visible level, the system can be thought of as being one of the states in the following diagram:



1-51


S1

Sleeping

Wake

Event

SLP_TYPx=S1 and

SLP_EN

S2

Sleeping

ACPI

Boot

(SCI_EN=1)

SLP_TYPx=S2 and

SLP_EN

G1

G2 (S5) -

Soft Off

G0 (S0) -

Working

SLP_TYPx=S3 and

SLP_EN

S3

Sleeping

SLP_TYPx=S5 and

SLP_EN or

PWRBTN_OR

S4BIOS_REQ to

SMI_CMD

SLP_TYPx=S4 and

SLP_EN

S4

Sleeping

OEM S4 BIOS

Handler

SLP_TYPx=S4 and

SLP_EN

3.4.3 Power States transition event

The following table summarizes the entry events and wake-up events of each power:

The following table summarize the entry events and wake-up events of each power state

Power State

S3

Entry Event

OSPM control

Lid Close

Power Button

Sleep Button

Battery Low

Wake up Event

Power Button

Ring Wake up

RTC Alarm

LAN Wake Up

Lid open

S4

S5

OSPM control,

Power button

Sleep button

Lid Close

Battery Low

Power Button

Battery Low

OSPM control x OSPM: OS-directed Power Management

Power Button

RTC Alarm

Power Button




Device Power Control Methodology

Power state of local devices table

This section illustrates the power control status of each key device/component of the system under each power management mode.

PowerState

Component

CPU

L2 CACHE

MontaraGM

ICH4

Doze Stand By STR

DRAM ON Self Refresh Self Refresh

Clock Synthesizer ON Low Power Power Off

CDROM ON Power Down Power Off

STD/SOff

Stop

Grant

Stop Clock

ON ON

Power Off

ON Power Down Power Off

ON Stop Clock

Power Off

Power Off (except Vcc) Power Off

Power Off (except

SUSVcc, RTCVcc )

Power Off

Power Off (except

SUSVcc, RTCVcc)

Power Off

Power Off

Power Off

HDD

FDD

KBC

PMU08

VGA/VRAM

PCMCIA

AUDIO

Audio AMP



ON ON

ON ON

Power Down

Power Down

ON Power Down Power Down

ON Power Down Power Down



LCD Backlight

LAN

ON

ON

Power Off

Power Down

Power Off

Power Down

Internal Modem ON Power Down Power Down

Power Off

Power Off

Power Off

Power Down

Power Off

Power Off

Power Off

Power Off

Power Off

Power Down

Power Down

Device Power control Methodology During S3 Mode

This section illustrates the control methodology of each device/component and its details under

Stand by mode.

Device

CPU

Power Down Controlled by Description

Hardware Controlled by SUSB# pin

L2 CACHE

ICH4

DRAM

Clock Synthesizer

CDROM

HDD

FDD

KBC

PMU08

Hardware

Hardware

Software

Hardware

Hardware

Hardware

Hardware

Software

Sofeware

Power off

Controlled by SUSB# pin

Self Refresh


Power off

Power off

Power off

Controlled by M3885xM8 power down command

Controlled by PMU08 power down command

VGA/VRAM

PCMCIA

AUDIO

Audio AMP

LCD Backlight

IR Module

LAN

Software

Software

Hardware

Hardware

Hardware

Hardware

Hardware

Controlled by MontaraGM


Controlled by ICH4

Controlled by BIOS

Power off


Controlled by Driver enter Dx status

Internal Modem Hardware Controlled by Driver enter Dx ststus



1-53


Power Button

The function of Lid Switch is depends on the ACPI aware OS.

Lid Switch (Cover Switch)

The function of Lid Switch is depends on the ACPI aware OS.

3.4.4 Expanding Event Through the Embedded Controller

The following figure shows the relationships between the devices that are wired to the embedded controller, the embedded controller queries, and ACPI general

Figure 3-2

The Relationships between ACPI, Controller, and Device

SCI Source and GPE Event from PMU08

The system will issue a beep to inform user while the following SCI alerted:

PMU08

ADPIN#

BAT0#

GPIOA0

GPIOA3

GPIOA6

GPIOA7

THRM

Input Event

AC Plug In/Out

Battery Plug In/Out

LID Event

Keyboard SMI

PCMCIA Ring In

COM Port Ring In

Thermal Event

GPE Event

GPI12

GPI12

GPI13

GPI8

GPI13

GPI13

GPI12

Handler

AML Handler

AML Handler

AML Handler

AML Handler

AML Handler

AML Handler

AML Handler




Control Method Battery Subsystem

EC should support all the battery information to ACPI-OS

−

Designed Battery capacity

−

Designed Voltage

−

Designed Low battery capacity

−

Designed Low

– Low battery capacity

−

Latest Full charged capacity

−

Present Remaining capacity

−

Present drain rate

−

Present voltage

−

Present Battery Status

ACPI BIOS should support an independent device object in the name space, and implement the following methods.

3.4.5 Thermal Control

There are primary cooling policies that the OS use to control the thermal state of the hardware

Cooling Policy

Active cooling

Action

Fan Low On

Temperature Setting

Over 60oC

Fan Low Off

Below 50oC

Active cooling Fan High On

Over 75 oC

Fan High Off

Below 65oC

Passive cooling Throttling CPU On

Over 85 oC

Throttling CPU Off

Below 80oC

Critical trip point System Shutdown

Over 95 oC

3.5 Battery Management

3.5.1 Battery Sub-system

§ The charger will stop charge the battery when the following condition is detected.

- The temperature of the system is too high

- The remaining capacity is 95% and more.

Note that the battery life is depending on different configuration running. E.g. with CD-ROM battery life is shorter, document keyin only battery life is longer, PMU disable battery life is short,

PMU enable battery life is longer.

- Battery reading methodology is through PMU08 SMBus.

3.5.2 Battery Low

When the battery voltage is approaching to the Low level, the PMU08 will generate a



1-55

FIC MB05W Service Manual battery low SMI. The system will do the following action.

1) The Power Indicator will become blinking.

2) The system will issue a Warning beep.

3.5.3 Battery Low - Low

When the battery voltage is approaching to the Low-Low level, the PMU08 will generate a battery low-low SMI. The system will do the following action.

1) The Power Indicator will keep on Blinking.

2) The system will enter Suspend To Disk mode even the power management is disabled. The function of power-on or Resume will be inhibited until the battery Low

– Low condition is removed.

3.5.4 AC Adapter

When plug in the AC adapter, the system will do the following action:

- The charger will charge the Main Battery, if remaining capacity is not full.

- The Battery Charging Indicator will turn on if the battery is in changing mode.

3.6 PMU08

The Embedded controller PMU08 acts as a supplement for power management control. It supports a lot of functions via SMBus interface.

3.6.1 The System EC RAM with PMU08

Embedded Controller Command Set

The EC I/F command set allows the OS to communicate with the PMU08.

For detail information refer to ACPI 1.0B specification.

EC I/F Command

Com man d

Byte

Register R/W

Description Interrupt

Byte

Enco ding

0x80 #1 EC_SC Read Embedded

Controller

(RD_EC)

Write Embedded

Controller

(WR_EC)

0x81

#2

EC_DAT

A

#3 EC_DAT

A

#1 EC_SC

#2

#3

EC_DAT

A

EC_DAT

A

W Command byte Header

W

Address byte to read

R

W

Read data to host

Command byte Header

Interrupt on

IBF=0

No Interrupt

Interrupt on

OBF=1

Interrupt on

IBF=0

W Address byte to write

Interrupt on

IBF=0

W Data to write Interrupt on

IBF=0




Burst Enable

Embedded

Controller

(BE_EC)

0x82 #1 EC_SC

#2 EC_DAT

A

W Command byte Header

R Burst acknowledge byte

W

Command byte Header

No Interrupt

Interrupt on

OBF=1

Burst Disable

Embedded

Controller

(BD_EC)

0x83 #1 EC_SC

Interrupt on

IBF=0

Query Embedded

Controller

0x84 #1 EC_SC W Command byte Header

No Interrupt

(QR_EC)

#2 EC_DAT

A

R Query value to host

Interrupt on

OBF=1

3.6.2 PMU08 EC RAM List

The micro controller PMU08 acts as a supplement for power management control. It supports the following functions via SMBus Command ( 0x80 , 0xC0 )

Functi on

Addres s

Regist er

R/W

Name

Bit Number

7 6 5 4 3 2 1 0

Logi c

Defaul t

Description

1 st

Battery

[ _BIF ]

00h

*3

Power unit

R(/W) DATA[15:0] *1 - 0xffff

0x0000: mWh [Fixed value]

0xffff: Unknown

02h

*3

04h

*3

Design capacit R(/W) DATA[15:0] *1 y

Last

Full

Charg e

Capaci ty

R(/W) DATA[15:0] *1

- 0xffff

0x0000-0xfffe(mWh)

0xffff: Unknown

- 0xffff

0x0000-0xfffe(mWh)

0xffff: Unknown

06h

*3

Battery

Techn R(/W) DATA[15:0] *1 ology

- 0xffff

0x0000 : Primary

0x0001: Secondary [Fixed value]

0xffff: Unknown.

08h

*3

Design

Voltag R(/W) DATA[15:0] *1 e

- 0xffff

0x0000-0xfffe(mV)

0xffff: Unknown



1-57


Functi on

Addres s

Regist er

R/W

Name

0Ah

*3

0Ch

*3

0Eh

*3

10h

*3

12h

*3

14h

*3

Bit Number

7 6 5 4 3 2 1 0

Logi c

Defaul t

Description

Design capacit y of

Warnin g

R(/W) DATA[15:0] *1

Design capacit y of

R(/W) DATA[15:0] *1

Low

Battery capacit y R(/W) DATA[15:0] *1

Granul arity 1

Battery capacit y

Granul arity 2

R(/W) DATA[15:0] *1

Model numbe r

R(/W) DATA[15:0] *1

Serial

Numbe r

R(/W) DATA[15:0] *1

-

-

-

-

-

-

0xffff

0xffff

0xffff

0xffff

0x0000-0xfffe(mWh)

0xffff: Unknown

0x0000-0xfffe(mWh)

0xffff: Unknown

0x0000-0xfffe(mWh)

0xffff: Unknown

0x0000-0xfffe(mWh)

0xffff: Unknown

0xffff 0x0000 [Not support]

0xffff 0x0000 [Not support]

16h

*3

Batter y type

R(/W)

DATA[15:

8] *1

All bits are 0

CELL_T

YPE

[7:0]

CELL_TYPE [3:0] This code depends on battery data format. In the future, this code may be added.

- 0xffff

0x00: NiMH

0x01: Li-ion

0x10: Non-rechargeable battery (Reserved)




Functi on

Addres s

18h

*3

Regist er

Name

OEM

Inform ation

R/W

R(/W)

Bit Number

7 6 5 4 3 2 1 0

Logi c

Defaul t

Description

DATA

[15:8]

*1

All bits are 0

Vender

[7:0]

- 0xffff

Vender [7:0] This code depends on battery data format.

And the following name should be described in the

ASL with the same character code.

In the future, these codes will be added.

0:

“MoliEnergy”

1:

“Panasonic”

2:

“” (SANYO does not agree the vender

name display)

3:

“TBCL”

(Toshiba)

4:

“Sony”

1Ah

*3

Battery

State

R

(/W)

DATA[15:3]

*1

All bits are 0

C

R

I

T

D

C

C

H

G

H

G

- -

DCHG=1:

CHG =1:

CRIT =1:

The battery is discharged

The battery is charged

The battery is critical

(Empty)

1 st

Battery

[ _BST

]

1Ch

*3

1Eh

*3

20h

*3

Battery

Presen t rate

R

(/W)

Battery

Remai ning

Capaci ty

R

(/W)

Battery present R

Voltag e

(/W)

DATA[15:0] *1

DATA[15:0] *1

DATA[15:0] *1

-

-

-

0xffff

0xffff

0xffff

0x0000-0xfffe(mW)

0xffff: Unknown

0x0000-0xfffe(mWh)

0xffff: Unknown

0x0000-0xfffe(mV)

0xffff: Unknown

1 st

Battery

[ _BTP

]

2 nd

Battery

[ _BIF ]

22h

24h to

3Ch

*3

Battery

Trip

Point

*2

R/W

*2

DATA[15:0] *1

*2

-

*2

0x000

0

*2

0x0000: Clear the trip point

0x0001-0xffff(mWh)

*2

2 nd

3Eh *2 *2 *2 *2 *2 *2



1-59


Functi on

Battery

[ _BST

]

Addres s

Regist er

R/W

Name

to

44h

*3

2 nd

Battery

[ _BTP

]

46h *2 *2

-

1 st

2 nd

2 nd

2 nd

Battery

[_BIF]

1 st

Battery

[_BST]

1 st

Battery

[_BTP]

Battery

[_BIF]

Battery

[_BST]

Battery

[_BTP]

48h

49h

4Ah

4Bh

4Ch

4Dh

4Eh

4Fh

50h

Bit Number

7 6 5 4 3 2 1 0

*2

Logi c

*2

Defaul t

*2

Description

*2

Battery data

Size

R

(/W)

DATA [7:0] - -

0x01: DATA size is

3byte.(PMU06A)

0x00: DATA size is 2 byte.

(PMU06) *8

Design capacit y

R

(/W)

Last

Full

Charge

R

(/W)

Capaci ty

Battery

Remai ning

R

(/W)

Capaci ty

DATA [23:16] *1 *7

DATA [23:16] *1 *7

DATA [23:16] *1 *7

-

-

-

0xff

0xff

0xff

PMU06A use this data with 02/03h. *7 *8


PMU06A use this data with 1E/1Fh. *7 *8

Battery

Trip

R

(/W)

Point

Design capacit y

R

(/W)

DATA [23:16] *1 *7

DATA [23:16] *1 *7

-

-

Last

Full

Charge

R/(/W

)

Capaci ty

DATA [23:16] *1 *7 -

0x00

0xff

0xff




Battery

Remai ng

Capaci ty

R

(/W)

Battery

Trip

R

(/W)

Point

DATA [23:16] *1 *7

DATA [23:16] *1 *7

- 0xff

0x00



51h to

6Bh

Reserv ed

R/W Don

’t care

- -




Functi on

Addres s

Regist er

R/W

Name

*3

Bit Number

7 6 5 4 3 2 1 0

Logi c

Defaul t

Description

PMU

Access

SMBus

Reserv

6Ch

6Dh

6Eh

6Fh

70h

*7

71h

*7

72h

73h

74h to

93h

94h

95h

96h to

97h

98h

99h

PMU_L

OW_

R/W

ADR

PMU_

HIG_

ADR

R/W

CHEC

K_

SUM

R/W

PMU_

DATA

R/W

DATA [7:0]

DATA [15:8]

DATA [7:0]

DATA [7:0]

-

-

-

-

SMB_

PTCL

R/W PROTOCOL [7:0]

SMB_

STS

SMB_

ADDR

R/W

D A

R

O L

E

N R

E M

S

STATUS

[4:0]

R/W

ADDRESS

[6:0]

R

E

S

SMB_

CMD

SMB_

DATA

[0-31]

R/W

R/W

COMMAND

DATA

-

-

-

-

-

SMB_

BCNT

SMB_

R/W

ALAR

M_

ADDR

R

(/W)

AMB_

ALAR

M_

DATA

[0-1]

R

(/W)

RES

[7:5]

BCNT [4:0] -

DATA

R

ADDRESS [6:0] E

S

-

-

SMB_

CNRL

R/W

Reserv R/W

RES [7:1]

Don't care

P

R

T

-

-

-

-

-

-

-

-

-

-

-

-

These registers are available when PMU slave mode or charger mode is selected.

For detail information, refer to PMU slave communication section in this document

For detail information, refer to ACPI 1.0 specification

[13.9 SMBus Host controller Interface via

Embedded controller]

These registers are not available when PMU slave mode or charger mode is selected.

The PMU06 has access protect function for the

EEPROM in the battery, to cancel the protection, set the access protect cancel bit.

For detail, refer to

SMBus section

0x00

PRT =1:

- -

TheSMBus address (A8-

AE) protection is cancelled.



1-61


Functi on

ed

PMU

Access

Addres s

to

9Fh

Regist er

R/W

Name

ed

6Ch

6Dh

6Eh

6Fh

PMU_L

OW_

R/W

ADR

PMU_

HIG_

ADR

R/W

CHEC

K_

SUM

R/W

PMU_

DATA

R/W

70h

*7

SMB_

PTCL

R/W

Bit Number

7 6 5 4 3 2 1 0

DATA [7:0]

DATA [15:8]

DATA [7:0]

DATA [7:0]

PROTOCOL [7:0]

Logi c

-

-

-

-

-

Defaul t

Description

-

-

-

-

-

These registers are available when PMU slave mode or charger mode is selected.

For detail information, refer to PMU slave communication section in this document

SMBus

71h

*7

72h

73h

74h to

93h

94h

95h

96h to

97h

SMB_

STS

SMB_

ADDR

R/W

D A

R

O L

E

N R

E M

S

STATUS

[4:0]

R/W

ADDRESS

[6:0]

R

E

S

SMB_

CMD

R/W COMMAND

SMB_

DATA

[0-31]

SMB_

BCNT

R/W

R/W

SMB_

ALAR

M_

ADDR

AMB_

ALAR

M_

DATA

[0-1]

R

(/W)

R

(/W)

RES

[7:5]

DATA

ADDRESS [6:0]

DATA

R

E

S

-

-

-

-

BCNT [4:0] -

-

-

-

-

-

-

-

-

-

For detail information, refer to ACPI 1.0 specification

[13.9 SMBus Host controller Interface via

Embedded controller]

These registers are not available when PMU slave mode or charger mode is selected.

The PMU06 has access protect function for the

EEPROM in the battery, to cancel the protection, set the access protect cancel bit.

For detail, refer to

SMBus section

98h

SMB_

CNRL

R/W RES [7:1]

P

R

T

0x00

PRT =1:

TheSMBus address (A8-

AE) protection is cancelled.




Functi on

Addres s

Regist er

Name

R/W

Bit Number

7 6 5 4 3 2 1 0

Logi c

Defaul t

Description

Reserv ed

99h to

9Fh

Reserv ed

R/W Don't care - -

R(/W): This is the read only register, but the written data will be able to read back till

PMU updates the data periodically, or PMU detects the status change.

*7: When this register is checked by polling, the interval time is necessary more than

500usec.

Functio n

Add ress

Register

R/W

Name

Bit Number

7 6 5 4 3 2 1 0

Logic

Defa ult

Description

Status

A0h

*3

ADP_ST

S

R(/W

)

RES [7:1]

C

O

N

- -

CON =

1:

AC adapter is connected

A1h

BAT1_ST

S

*3 (1st

Battery)

R(/W

)

A2h

BAT2_ST

S

*3 (2 nd

Battery)

R(/W

)

B

T

P

E

M

P

L

O

W R

D

W E

A

C

R

H

R

G

C

H

G

C

O

N

-

-

-

-

Battery trip point is detected.

BTP

=1:

Battery is empty.

EMP

=1:

LOW

=1:

Battery is

Low battery state.

WAR=1

:

ERR

=1:

Battery is

Warning state.

DCHG=

1:

Battery is

Error state.

CHG=1

:

Battery is discharged

.

CON=1

:

Battery is charged.

Battery is connected.

A3h

Reserve

*3

d

A4h

BAT1_C

*3

AP

A5h

*3

BAT2_C

AP

R/W

R(/W

)

R(/W

)

Don

’t care

BCAP

BCAP

-

-

-

-

-

-

0x00-0x64 = 0-

100(%)

0x7F =

Unknown

0x80 = Not installed

A6h

Reserve

*3

d

R/W Don

’t care

- -



1-63


Functio n

Add ress

Register

R/W

Name

Bit Number

7 6 5 4 3 2 1 0

A7h

A8h

GPIO-A_

*5

EVT_ST

S

R/W STS_A [7:0]

Read

A9h

GPIO-B_

*5

EVT_ST

S

R/W 0 STS_B [6:0]

0:No event

1:EVT detection

Write

AAh

GPIO-C_

*5

EVT_ST

S

R/W 0 0 0 0 0

0

STS

0:Clear

_C

event

[1:0

]

1:Ignore

ABh

*5

SMB_Ale rt_

ADDR

RUN_

EVT_ST

S

R/W

R/W

ADDRESS[6:0]

R

E

S

Logic

-

B S A G

R

B B A

Read

T M L P

E

A A D

0:No event

P B R I S T T P

1:EVT

Defa ult

Description

SMBAlert output device address

The alert response function is available when this register is cleared (0x00) only.

0x00

When the several devices assert the alert signal at the same time, the least address is stored to this register. And when this register is cleared , next alert address is stored to this register.

0x00

To clear the notified event flag without unexpected event loss, clear the

0x00 corresponding bit flag only.

For this operation, this register has special writing

0x00 manner as follows.

STS_X

(STS_X)

(Written data)

ß

AND

0x00

BTP2 =1:

BTP2 event is

SMB detected

=1 :

SMBus




Functio n

Add ress

Register

R/W

Name

Bit Number

Logic

7 6 5 4 3 2 1 0

2 T O 2 1 detection

Write

0:Clear event

1:Ignore

ACh

WAKE_

*5

EVT_ST

S

R/W

ADh

RUN_

*5

EVT_ST

S_2

AEh

WAKE

*5

EVT_ST

S_2

R/W Reserved [7:1]

T

H

R/W Reserved [7:1]

T

H

AFh

THERMA

*5

L_EVT_S

TS

R/W

Reserved

[7:3]

E

R

R

H

L

I

O

W

G

H

Event/

GPIO

Control

B0h

EC_RUN

_

ENB

R/W

EC_WAK

B1h

E_

ENB

R/W

0: Disable

B

T

P

2

A

S

M

R

B

L

T

RES[4:1]

D

A

1: Enable

P 0: Disable

1: Enable



Defa ult

Description

ALRT=1

: event is detected.

0x00

GPIO

SMBAlert

=1 : is

BATn=1 : detected.

ADP

GPIO

=1 : event is detected.

TH

=1 :

HIGH=1 :

Battery event is detected.

LOW

Battery

=1 : event is

ERR detected.

=1 :

Thermal event is detected

High alarm point is detected.

Low alarm point is detected.

Polling communi cation failure with retry.

0x00

To clear the notified event flag without

0x00 unexpected event loss, clear the corresponding bit flag only.

0x00

For this operation, this register has special writing manner as follows.

STS_X

(STS_X)

(Written data)

ß

AND

0x00

BTP2

:

SMB

:

0x00

ALRT

:

BTP2 event

SMBus event.

SMBAlert event.

ADP:

Adapter event.

1-65


Functio n

Add ress

Register

R/W

Name

BATT_R

B2h

UN_

ENB

R/W

Bit Number

7 6 5 4 3 2 1 0

Logic

0: Disable

1: Enable

B3h

BATT_W

AKE

_ENB

R/W

B E L W E C C C

T M O A R A / O

P P W R R P D N 0: Disable

1: Enable

GPIO-A_

B4h

IO_CON

F

R/W

B5h

GPIO-A_

DATA

R/W

CONF_A [7:0]

DATA_A [7:0]

0: Input

1: Output

GPIO-A_

B6h

RUN_EN

B

R/W RUN_ENB_A [7:0]

0: Disable

1: Enable

GPIO-A_

B7h

EVT_PO

L

R/W POL_A [7:0]

0: Falling edge

1: Rising edge

GPIO-A_

B8h

WAKE_E

NB

R/W

WAKE_ENB_A

[7:0]

GPIO-B_

B9h

IO_CON

F

R/W 1 CONF_B [6:0]

0: Disable

1: Enable

0: Input

1: Output

BAh

GPIO-B_

DATA

R/W 0 DATA_B [6:0]

GPIO-B_

BBh

RUN_EN

B

R/W 0

RUN_ENB_B

[6:0]

0: Disable

1: Enable

GPIO-B_

BCh

EVT_PO

L

R/W 0 POL_B [6:0]

0: Falling edge

1: Rising edge

GPIO-B_

BDh

WAKE_E

NB

R/W 0

BEh

GPIO-C_

DATA

R/W

WAKE_ENB_B

RES

[7 :4]

*4

[6:0]

DATA_C

[3:0]

0: Disable

1: Enable

0x00

0x00

0x00

0x80

-

0x00

0x00

0x00

-

Defa ult

Description

0x00

0x00

Battery trip point

BTP:

Empty.

EMP:

LOW:

Warning

WAR:

Error

ERR:

Low battery

CAP:

Capacity learning

C/D:

CON:

Charge/Disc harge

Battery presence

0x00

For detail information, refer to

GPIO section in this document.

-




Functio n

Add ress

Register

R/W

Name

Bit Number

7 6 5 4 3 2 1 0

Logic

GPIO-C_

BFh

RUN_EN

B

R/W 0 0 0 0 0 0

RU

N_

EN

B_

C

0: Disable

1: Enable

[1:0

]

Event/

GPIO

Control

GPIO-C_

C0h

EVT_PO

L

R/W 0 0 0 0 0

0

PO

L_

C

0: Falling edge

[1:

0]

1: Rising edge

WA

K

C1h

WAKE_E

NB

E_

GPIO-C_

R/W 0 0 0 0 0 0

EN

B

_C

0: Disable

1: Enable

[1:

0]

Defa ult

Description

0x00

0x00

0x00



1-67


Functio n

Add ress

Register

R/W

Name

Bit Number

7 6 5 4 3 2 1 0

Logic

Defa ult

Description

=0: Wake# output is

“Level”.

=1: Wake# output is

“Pulse”.

=0: SCI is always output by event detection and

SCI_EVT shows

the query data is stored.

And next SCI is not output

until

SCI_EVT is cleared.

WAKE

=1: SCI is output when the

SCI command set is not executed

and

OBF=0.

SCI_EVT shows the output

0x00

SCI is for event notification.

C2h

EVT_CO

NT

R/W

W

RES

[7:6]

W

S

A

C

K

I

E

R

Q

_

E

R

S

U

N

*

4

A

K

E

_

O X

U

T

S

U

S

_

Q_RU

N

=0: Runtime event ststus is reflected to

RUN_EVT_

STS

WAKE

_OUT register.

=1: Runtime event status is



Query data.


Functio n

Add ress

Register

R/W

Name

C3h

EC_RUN

_

ENB_2

R/W

C4h

EC_WAK

E_

ENB_2

R/W

C5h

To

C7h

Reserved R/W

C8h

GPI_AD0 R

*6

Bit Number

7 6 5 4 3 2 1 0

Reserved [7:1]

Don’t care

AD0_DATA [7:0]

Logic

0: Disable

T

1: Enable

H

0: Disable

1: Enable

-

-

C9h

GPI_AD1 R

*6

CAh

Reserve

*6

d

R/W

AD1_DATA [7:0]

Don

’t care

-

-

CBh

D/A_CO

NT

R/W DATA [7:0] -

Defa ult

Description

0x00

TH: Thermal event

0x00

-

-

-

For detail information, refer to

GPIO section in this document.

-

0xff

0x00-0xfe: D/A converter output data

0xff : Battery capacity(%) output

Battery control

D0h

BAT_CH

G_

CONT

R/W

C

RES[7:

5]

H

G

_

RE

S

R

D

[3:2

]

C C

H H

G G

2 1

Y

#

- -

CHG_RDY# =0 :

Charge ready

CHGn =1 :

The nth battery is charged

D1h

BAT_DC

H_

PRI

R/W RES[7:3]

PAT

[2:0]

-

Battery discharge priority

0 : 2 1

1 : 1 2

2 : 2 1

3 : 2 1

4 : 1 2

0x00

5 : 1 2

6 : Same as 0

7 : Simultaneously discharge (Read only :

This data can be set using PMU register)



1-69


Functio n

Add ress

Register

R/W

Name

BAT_DC

D2h

H_

CONT

R/W

BAT_WA

D3h

R_

ABS

R/W

D5h

BAT_WA

D7h

R_

REL

R/W

D8h

D9h

*3

BAT_LO

W_

ABS

BAT_LO

W_

REL

FULL_D

ATA

CC_CUR

Dah

_

DATA

R/W

R/W

R/W

R

Bit Number

7 6 5 4 3 2 1 0

RES[7:2]

Logic

D D

C C

H H

0: Not discharge

G G

1: Discharge

2 1

Defa ult

Description

-

The discharge battery can be selected one of the batteries can be discharged.

DATA[15:0] *1

DATA[15:0] *1

DATA [7:0]

DATA [7:0]

DATA [7:0]

DATA [7:0]

-

-

-

-

-

-

0x00

00

Absolute capacity battery Warning detection point

0x0000-0xffff

(mWh)

0x00

00

Absolute capacity battery Low detection point

0x0000-0xffff

(mWh)

0x10

Relative capacity battery Warning detection point

00-C8h (0-100% step 0.5%)

Relative capacity battery Low

0x06 detection point

00-C8h (0-100% step 0.5%)

Full charge cancel point

0xbe

00-C8h (0-100% step 0.5%)

Battery charging current setting

0x01-0xff (0.02-

5.10A step 0.02A)

0x00

0x00 Depends on the battery

This register is

“read only”, to change the value, use the register in

PMU registers area.




Functio n

Add ress

Register

R/W

Name

Bit Number

7 6 5 4 3 2 1 0

Logic

DBh

To BTP2

DCh

R/W DATA [15:0] -

Defa ult

Description

0x0000: Clear the trip point

0x00

00

0x0001-0xffff :

(mWh)

When all of the battery

’s capacities lesser than this setting value, the

BTP2 is detected if event is enabled.

DDh

To Reserved R/W

DFh

Don't care - -

PMU does not initialize

EC register when system

PMU control

E0h

PMU_CO

NT

R/W RES[7:3]

E B P

C A O

_ Y W

R _ _

E L L

G E E

D D

- 0x00

BAY_LED

=1:

POW_LED

=1:

PMU indicates the

Battery discharg e status to the

LED_BA

Y#n, when the battery is installed.

The

Power

LED blink

E1h

ACPI_AC

C_

ENB

R/W RES [7:1]

S

T

S

O

S

_

- 0x00

OS_STS

= 1:

= 0:

ACPI mode

Legacy mode



1-71


Functio n

Add ress

E2h

E4h

E5h

Register

R/W

Name

OFF_TIM

E

E3h

POLLING

_

ADDRES

S

HIGH_

ALARM

LOW_

ALARM

R/W

R/W

R/W

R/W

Thermal

Sensor

E6h

POLLING

_

INTERVA

L

R/W

Polling

E7h

POLLING

_

R(/W

)

DATA

Bit Number

7 6 5 4 3 2 1 0

DATA [7:0]

Slave Address

[6:0]

DATA [7:0]

DATA [7:0]

DATA [7:0]

Logic

Defa ult

Description

-

Power switch over ride function timer

0x64

01h-FFh (0.1-

25.5esc step

0.1sec)

00h : Reserved

R

E

S

Address: 0x00-0x7F

0x00

The polling slave address setting

If this address is 00, the Polling is disabled.

Signed value 0x00

If the received data

GE this value, the event will be detected.

Signed value 0x00

If the received data

LE this value, the event will be detected.

0x00 :Pollin g disable

0x00

0x01

– 0xFF [x

250ms] (250ms to

63.75sec)

DATA [7:0] Signed value 0x00

This register shows data at latest polling.

E8h

HARDW

ARE_SH

UT_DOW

N

R/W DATA [7:0]

If the thermal sensor read value

Signed value 0x7D GE this value, the

PMU automatically off the power.

E9h

POLLING

_

COMMA

ND

R/W

EAh

RETRY_

COUNT

R/W

EBh

To

Reserved R/W

EFh

DATA [7:0]

DATA [7:0]

Don't care

0x00

0x10

Polling command

(data register) address.

0x00 - 0xFF: Retry count value (0-255)

PMU control

F0h

BURST_

FLG_CL

R

R/W DATA [7:0] - -

After writing to the register addressed

A8h-AFh,

Set the 00h to this register.




Functio n

Add ress

Register

R/W

Name

F1h

To Reserved R/W

FFh

Bit Number

7 6 5 4 3 2 1 0

Don't care

Logic

Defa ult

Description

3.6.3 Security

The user may enter up to 8 standard text characters for a password. The password includes two levels. The higher priority is the Supervisor Password. The lower priority is the User Password.

The Supervisor Password can access all the system resource, while the User Password may not access the floppy disk when it is protected by Supervisor Password. When the security function is enabled, the system will request the user to enter password during the following situation.

I.

Power On: The system will prompt the user to enter the password before booting the

OS. If the user key in the wrong password for 3 times, then the system will halt.

II.

Resume: The system will prompt the user to enter password while resuming from STR or STD mode. If the user keys in the wrong password for 3 times, the system will not resume and should return to Suspend mode again.

III.

Entering CMOS Setup: The system will prompt the user to enter the password before entering the CMOS Setup. If the user keys in the wrong password for 3 times, then the system will halt.

3.7 CMOS Setup Utility

The Setup utility is used to configure the system. The Setup contains the information regarding the hardware for boot purpose. The changed settings will take effect after the system rebooted. Refer to Chapter 1 on running BIOS Setup Program for more detailed information.

3.8 Definitions of Terms

10Base-T (Ethernet) - A networking standard that supports data transfer rates up to 10Mbps

(10 megabits per second).

100Base-T (Fast Ethernet) - A relatively new networking standard that supports data transfer rates up to 100Mbps.

ACPI - Advanced Configuration and Power Management Interface, a power management specification developed by Intel, Microsoft, and Toshiba.

CardBus - The 32-bit version of the PCMCIA PC Card standard. In addition to supporting a wider bus (32 bits instead of 16 bits), CardBus also supports bus mastering and operation speeds up to 33MHz.

Clock Throttling

– South bridge function that allows the CPU clock to be stopped and started at a known duty cycle using the STPCLK# pin to enter and exit Stop Grant mode. Clock throttling is used for power saving, thermal management, and reducing the processing speed.

DIMM (SODIMM) - Dual In-line Memory Module, a small circuit board that holds memory chips.

A Single In-line Memory Module (SIMM) has a 32-bit path to the memory chips whereas a DIMM has 64-bit path. Because the Pentium processor requires a 64-bit path to memory, you need to install SIMMs two at a time. With DIMMs, you can install one DIMM at a time. SODIMM is Small

Outline Dual In-line Memory Module used in notebook computers.

DMI - Desktop Management Interface, an API to enable software to collect information about a computer environment about a computer environment. For example, using DMI a program can determine what hardware and expansion boards are installed on a computer.

GPI - General Purpose Input.

GPO - General Purpose Output.

Lid Switch - A switch that indicates the notebook LCD Panel has been closed and it can be



1-73

FIC MB05W Service Manual turned off.

MPEG-2 - Moving Picture Experts Group, a working group of ISO. The term also refers to the family of digital video compression standards developed by the group. There are two major MPEG standards : MPEG-1 and MPEG-2. The most common implementations of the MPEG-1 standard provide a video resolution 352x240 at 30 frames per second(fps). A newer standard, MPEG-2, offers resolution of 720x480 and 1280x720 at 60 fps, with full CD-quality audio.

North Bridge - The CPU to PCI interface, also contains the memory and cache controllers.

South Bridge - The PCI to ISA interface, also contains many legacy devices.

SMM - System Management Mode, Mode of operation while an SMI is active.

SMI - System Management Interrupt, non-maskable interrupt that causes the system to enter

SMM. SMM functions include power management, USB legacy keyboard control, security, hot keys, and thermal monitoring.

SMB - System Management Bus, that is used for managing smart batteries, reading SDRAM configuration information, and other miscel1aneous system function.

TBD -To Be Discussed. The mentioned specification is not final that should be discussed with related engineers.

Ultra DMA-33 - A protocol developed by Quantum Corporation and Intel that supports burst mode data transfer rates of 33.3 MBps.

USB - A new external bus standard that supports data transfer rates of 12 MBps. A single USB port can be used to connect up to 127 peripheral devices, such as mice, modems, and keyboards.

USB also supports Plug-and-Play installation and hot plugging.




4.1 Overview

The FIC MB05 notebook consists of several important functions and subsystems including:

Notebook size, 2 spindle, IBM PC/AT compatible personal computer with PCI-bus and

Multimedia functions, provide full basic function with lowest price and easy of use.

The following is a summary of MB05 features:

CPU

CPU Type uFCPGA 478pin

Intel Banias 1.3/1.5 GHZ

TDP(Target) 25W

Chip Set

Core Logic Intel Montara-GM (North) :CPU(Banias) I/F, LVDS I/F, RGB analog I/F 200/266 DDR MEMORY I/F, Hub-Link I/F,

DVOB&DVOC IF

….

Intel ICH4-M (South) : PCI I/F, LPC I/F, ATA100 IDE I/F, Hub-

Link I/F ,AC97 V2.2 I/F, RTC, 2.0/1.1USB I/F, 10/100M LAN I/F,

GPIO, ACPI, APIC

….

Memory

Support Memory DDR266/200 SDRAM 128/256/512MB SO-DIMM

Memory Slots 2 Slots SO-DIMM (1.25

”)

Max Memory 1024MB (512MB DIMM X2 )

Video

Controller Embedded in Intel Montara-GM.

UMA (using DVMT configuration)

LCD Panel

High performance & High quality 3D accelerator


Complete TV-OUT/Digital flat panel solution

MPEG-2/1 video decoder

Video accelerator

14.1

” XGA

Controlled by hot key (8 level)

15.0” XGA TFT/200nit support

Controlled by hot key (8 level)

PCMCIA

Controller RICOH R5C554 Single Slot PCI-CARDBUS BRIDGE

Built in Smart Card reader(None)

ZV-Port Support (None)

Ring wakeup support(None)

Power Switch G576

Sound

Controller

CODEC

Function

Buzzer

Volume

Integrated in Intel ICH4-M (PCI audio)

Realtek ALC201A AC97 CODEC 2.2 S/PDIF

Sound Blaster Compatible

S/W Wave Table

Support (None)

SW control.

FIC MB05 Service Manual 1-75



IEEE 1394(Option)

Support two port

Controller RICOH R5C554 two IEEE1394 ports BRIDGE

Function Compliant with Link Layer Services as defined in 1394 Open

Host Controller Interface specification release 1.0

Compliant with Physical Layer Services as defined in P1394a draft 2.0(Data Rate 100/200/400 Mbps)

Storage

USB FDD

IDE bus

3.5

” 3 mode(option)

IDE bus

Bus Mastering

Ultra DMA 33/66/100

PIO mode 0,1,2,3,4

Internal HDD 2.5

” 9.5 mmH Pack

Internal Optical Drive

DVD Combo 8x DVD , 8x CDR, CDRW write , 20x CD-ROM 9.5mm type

(KME: UJDA745, Toshiba: SD-R9022)

Communication

Internal Modem Ambit (1456VQL19V) (MDC Modem AC97 Interface) (Option)

V.90, K56flex

RJ11 Jack

Wake up on Ring support S1 or S3

Voice Function not support

Internal LAN Realtec 8100BL

10Base-T/100Base-TX

RJ-45 jack

I/O

Parallel EPP/ECP x1

CRT D-sub 15pin x1

USB 4pin x3 port (Ver:2.0)

IEEE 1394 one port

H/P Min Jack x1

Mic In Min Jack x1

Modem RJ11 x1

LAN RJ45 x1

Ps2 Ps2 x1

Keyboard

Pitch/Travel 19mm/3mm

Language US, Japan, UK

Hot Key Fn+F2: Wireless On/Off

Fn+F3: Display Mode

Fn+F4: Sleep

Fn+F6: Speaker On/Off

Fn+F7: PMU Level(No silk)

Fn+F8: Brightness Up (8 leve)

Fn+F9: Brightness Down (8 level)

Point Device ALPS : KGDDET 005A Glide Pad

AC Adapter

LITEON PA-1600-05, DELTA ADP75FB

Input AC 100-240V

Output 19V, 60W Peak80W(LITEON), 75W(DELTA)

Color Black or White




Battery

1 st

battery Li-ion (8 cell)

SANYO 4400mA(Circle);3600mA(Square)

Battery Life 4.5 hours

Switch

RTC battery x1

Short Cut Key 3 Short Cut Key (Mail Key and Internet Key)

LED

Power SW Push button type (As asserted switch over 4s,system will be powered down by force )

Power Status Yes (Need see while LCD is closed)

Battery Charge Yes (Need see while LCD is closed)

IDE Device Access Yes (HDD & CD-ROM )

Caps Lock Yes

Scr Lock Yes

Num Lock No

Mail arrival No

RF Access Yes

Security

Kensington Lock Hole x1

PMU PMU08

Compliance

PC2001 compliant

ACPI compliant


Auto Configuration

16bit I/O Address Decoded

Selectable I/O Address, IRQ and DMA

VESA Support DDC,DPMS

4.2 System Hardware Block Diagram



1-77


M BUS

FIC ASIC

F010502-B0

INTEL

Centrino

CPU

CORE

GMTG767

ICS950812

CPU PCI CLK

USB2

USB1

CRT

LCD

RGB

LVDS

INTEL

MONTARA-G

M

MBUS

DDR SDRAM X 2

32BIT PCI BUS

MINI PCI

CONN

1394 PORT R5C554

PCMCIA

CNN X 2

USB0

G576

INTEL

ICH4-M

RTL8100BL RJ 45

HD

PHONE

MIC

IN

GMTG1421 ALC202

RJ11 MDC

LPC

INT K/B

M38859 LPC47N267

4M

ROM

COM

PORT

GP

PS2

PARALLEL

Figure 1-1 MB05 Block Diagram

4.3 Chipset Summary

The MB05 notebook consists of following major chipsets:

PMU08




Controller Chip

Processor

North Bridge

South Bridge

Video Controller

PCMCIA Controller

Supper I/O Controller

Audio Controller

Audio Codec

Keyboard Controller

Power Management

ROM BIOS

Clock Generator

Temperature Sensor

IEEE 1394

LAN

Modem

Vendor

Intel

Intel

Intel

Intel

RICOH

SMSC

Intel

Realtek

Misubishi

NEC

SST

IMI

NS

RICOH

Realtek

ASKEY

Description

Mobile Banias

MontaraGM

ICH4

Embedded in MontaraGM

R5C554

LPC47N267

South Bridge Integrated

ALC201

M3885x

PMU08

49LF004A

CY28346

MAX1617

R5C554

8100BL

MDC AC

’97

4.4 System Processor (CPU)

The FIC MB05 runs on Intel Banias based on uFCPGA packaging. It supports CPU with up to

1.3/1.5 GHZ clock speed rating. The processor operates in conjunction with the RAM and

ROM memory and the system control logic to process software instructions (BIOS, Windows, and Applications).

Intel Pentium M Features

The Intel

® Pentium® M processor is a high performance, low power mobile processor with several micro-architectural enhancements over existing Intel mobile processors.

The following list provides some of the key features on this processor:

• Supports Intel® Architecture with Dynamic Execution

• High performance, low-power core

• On-die, primary 32-kbyte instruction cache and 32-kbyte write-back data cache

• On-die, 1-MByte second level cache with Advanced Transfer Cache Architecture

• Advanced Branch Prediction and Data Prefetch Logic

• Streaming SIMD Extensions 2 (SSE2)

• 400-MHz, Source-Synchronous processor system bus

• Advanced Power Management features including Enhanced Intel® SpeedStep® technology

• Micro-FCPGA and Micro-FCBGA packaging technologies

The Intel Pentium M processor is manufactured on Intel

’s advanced 0.13 micron process technology with copper interconnect. The processor maintains support for MMX

™ technology and Internet Streaming SIMD instructions and full compatibility with IA-32 software. The high performance core features architectural innovations like Micro-op Fusion and Advanced Stack

Management that reduce the number of micro-ops handled by the processor. This results in more efficient scheduling and better performance at lower power. The on-die 32-kB Level 1 instruction and data caches and the 1-MB Level 2 cache with Advanced Transfer Cache

Architecture enable significant performance improvement over existing mobile processors.

The processor also features a very advanced branch prediction architecture that significantly reduces the number of mispredicted branches. The processor

’s Data Prefetch Logic speculatively fetches data to the L2 cache before an L1 cache requests occurs, resulting in reduced bus cycle penalties and improved performance.

The Streaming SIMD Extensions 2 (SSE2) enable break-through levels of performance in multimedia applications including 3-D graphics, video decoding/encoding, and speech recognition.The new packed double-precision floating-point instructions enhance performance



1-79

FIC MB05W Service Manual for applications that require greater range and precision, including scientific and engineering applications and advanced 3-D geometry techniques, such as ray tracing.

The Intel Pentium M processor

’s 400-MHz processor system bus utilizes a split-transaction, deferred reply protocol. The 400-MHz processor system bus uses Source-Synchronous

Transfer (SST) of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a

“double-clocked” or

2X address bus.Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 3.2 Gbytes/second. The processor system bus uses Advanced Gunning

Transceiver Logic (AGTL+)signal technology, a variant of GTL+ signalling technology with low power enhancements.

The processor features Enhanced Intel SpeedStep technology, which enables real-time dynamic switching between multiple voltage and frequency points instead of two points supported on previous versions of Intel SpeedStep technology. This results in optimal performance without compromising low power. The processor features the Auto Halt, Stop-

Grant, Deep Sleep, and Deeper Sleep low power states.

The Intel Pentium M processor utilizes socketable Micro Flip -Chip Pin Grid Array (Micro-

FCPGA) and surface mount Micro Flip-Chip Ball Grid Array (Micro-FCBGA) package technology. The Micro-FCPGA package plugs into a 479-hole, surface-mount, Zero Insertion

Force (ZIF) socket, which is referred to as the mPGA479M socket.

This document includes specifications for the Intel Pentium M processor at Highest

Frequency Mode (HFM) core frequencies of 1.30, 1.40, 1.50, and 1.60 GHz, the Low Voltage

Intel Pentium M processor at HFM core frequency of 1.10 GHz and the Ultra Low Voltage

Intel Pentium M processor at HFM core frequency of 900 MHz.

4.5 System Core Logic

4.5.1 Intel 855GM Chipset GMCH Features

Processor/Host Bus Support

Ø

. Intel

® Pentium® M processor

Ø

. 2x address, 4x data

Ø

. Supports system bus at 400 MHz

Ø

. Supports Host bus dynamic bus inversion (DBI)

Ø

. Supports 64-bit host bus addressing

Ø

. 12-deep in-order queue

Ø

. AGTL+ bus driver technology with integrated AGTL+ termination resistors and low voltage operation (Vtt = 1.05 V)

Ø

. Supports Enhanced Intel

® SpeedStep® technology

Ø

. Support for DPWR# signal to Intel Pentium M processor for PSB power anagement

Memory System

Ø

. Directly supports one DDR SDRAM channel, 64-bits wide (72-bits with ECC)

Ø

. Supports 200/266-MHz DDR SDRAM devices with max of two, double-sided SO-

DIMMs (four rows populated) with unbuffered PC1600/PC2100 DDR SDRAM.

Ø

. Supports 128-Mbit, 256-Mbit, and 512-Mbit technologies providing maximum capacity of 1 GB with x16 devices and up to 2-GB with high density 512-Mbit technology

Ø

. All supported devices have four banks

Ø

. Supports up to 16 simultaneous open pages

Ø

. Supports page sizes of 2-kB, 4-kB, 8-kB, and 16-kB. Page size is individually selected for every row

Ø

. UMA support only




System Interrupts

Ø

. Supports Intel 8259 and processor system bus interrupt delivery mechanism

Ø

. Supports interrupts signaled as upstream memory writes from PCI and Hub interface

Ø

. MSI sent to the CPU through the system bus

Ø

. IOxAPIC in ICH4-M provides redirection for upstream interrupts to the system bus

Video Stream Decoder

Ø

. Improved hardware motion compensation for MPEG2

Ø

. All format decoder (18 ATSC formats) supported

Ø

. Dynamic Bob and Weave support for video streams

Ø

. Software DVD at 60 Fields/second and 30 frames/second full screen

Ø

. Support for standard definition DVD (i.e. NTSC pixel resolution of 720x480, etc.) quality encoding at low CPU utilization

Video Overlay

Ø

. Single high quality scalable overlay and second Sprite to support second overlay

Ø

. Multiple overlay functionality provided via arithmetic stretch BLT(Block Transfer)

Ø

. 5-tap horizontal, 3-tap vertical filtered scaling

Ø

. Multiple overlay formats

Ø

. Direct YUV from overlay to TV-out

Ø

. Independent gamma correction

Ø

. Independent brightness / contrast/ saturation

Ø

. Independent tint/hue support

Ø

. Destination colorkeying

Ø

. Source chromakeying

Multiple hardware color cursor support (32-bit with alpha and legacy 2-bpp mode)

Accompanying I2C and DDC channels provided through multiplexed interface

Display

Ø

. Analog display support

‧ 350-MHz integrated 24-bit RAMDAC that can drive a standard progressive scan analog monitor with pixel resolution up to 1600x1200 at 85 Hz and up to 2048x1536 at 75 Hz

Ø

. Dual independent pipe support

‧ Concurrent: Different images and native display timings on each display device

‧ Simultaneous: Same images and native display timings on each display device

Ø

. DVO (DVOB and DVOC) support

‧ Digital video out ports DVOB and DVOC with 165-MHz dot clock on each 12-bit

interface; two 12-bit channels can be combined to form one dual channel 24-bit interface with an effective dot clock of 330-MHz

‧ The combined DVO B/C ports as well as individual DVO B/C ports can drive a variety of DVO devices (TV-Out Encoders, TMDS and LVDS transmitters, etc.) with pixel resolution up to 1600x1200 at 85 Hz and up to 2048x1536 at 72 Hz.

‧ Compliant with DVI Specification 1.0

R

Ø

Ø

. Dedicated LFP (local flat panel) LVDS interface

‧ Single- or dual-channel LVDS panel support up to UXGA panel resolution with frequency range from 25 MHz to 112 MHz (single channel/dual channel)

‧ Supports data format of 18 bpp

‧ SSC support of 0.5%, 1.0%, and 2.5% center and down spread with external SSC clock

LCD panel power sequencing compliant with SPWG timing specification



1-81


Compliant with ANSI/TIA/EIA

–644-1995 spec

Integrated PWM interface for LCD backlight inverter control

Bi-linear panel fitting

. Tri-view support through LFP interface, DVO B/C port, and CRT

Internal Graphics Features

Ø

. Up to 64 MB of dynamic video memory allocation

Ø

. Display image rotation

Ø

. Graphics core frequency

Ø

. Display core frequency at 133 MHz or 200 MHz

Ø

. Render core frequency at 100 MHz,133 MHz, 200 MHz

Ø

. 2D graphics engine n

Optimized 128-bit BLT engine n

Ten programmable and predefined monochrome patterns n

Alpha Stretch BLT (via 3D pipeline) n

Anti-aliased lines n

Hardware-based BLT Clipping and Scissoring n

32-bit Alpha Blended cursor n

Programmable 64 x 64 3-color Transparent cursor n

Color Space Conversion n

Three Operand Raster BLTs n

8-bit, 16-bit, and 32-bit color n

ROP support n

DIB translation and Linear/Tile addressing

Ø

. 3D graphics engine n

3D setup and render engine n

Zone rendering n

High quality performance texture engine n

Viewpoint transform and perspective divide n

Triangle lists, strips and fans support n

Indexed vertex and flexible vertex formats n

Pixel accurate fast scissoring and clipping operation n

Backface culling support n

DirectX* and OpenGL* pixelization rules n

Anti-Aliased lines support n

Sprite points support n

Provides the highest sustained fill rate performance in 32-bit color and 24-bit W mode n

High quality performance texture engine n

266-MegaTexel/s peak performance n

Per pixel perspective corrected texture mapping n

Single pass texture compositing (multi-textures) n

Enhanced texture blending functions n

Twelve level of detail MIP map sizes from 1x1 to 2k x 2k n

Numerous texture formats including 32-bit RGBA n

Alpha and Luminance maps n

Texture chromakeying n

Bilinear, trilinear, and anisotropic MIP map filtering n

Cubic environment reflection mapping n

Dot product bump-mapping n

Embossed bump-mapping n

DXTn texture decompression n

FX1 texture compression n

3D graphics rasterization enhancements n

One Pixel per clock n

Flat and Gouraud shading



FIC MB05W Service Manual n

Color alpha blending for transparency n

Vertex and programmable pixel fog and atmospheric effects n

Color specular lighting n

Z Bias support n

Dithering n

Line and full-scene anti-aliasing n

16 and 24-bit Z buffering n

16 and 24-bit W buffering n

8-bit Stencil buffering n

Double and triple render buffer support n

16 and 32-bit color n

Destination alpha n

Vertex cache n

Optimal 3D resolution supported n

Fast Clear support n

ROP support

Hub Interface to ICH4-M

. 266 -MB/s point-to-point Hub Interface to ICH4-M

. 66-MHz base clock

Power Management

Ø

. SMRAM space remapping to A0000h (128-kB)

Ø

. Supports extended SMRAM space above 256-MB, additional 1-MB TSEG from top of memory, cacheable (cacheability controlled by CPU)

Ø

. APM Rev 1.2 compliant power management

Ø

. Supports Suspend to System Memory (S3), Suspend to Disk (S4) and Soft Off (S5)

Ø

. ACPI 1.0b, 2.0 support

Ø

. Enhanced Intel SpeedStep technology support

Package

. 732-pin Micro-FCBGA (37.5 x 37.5 mm)

4.5.2 Intel ICH4 Features

The ICH4 provides extensive I/O support. Functions and capabilities include:

•PCI Local Bus Specification, Revision 2.2-compliant with support for 33-MHz PCI operations.

•PCI slots (supports up to 6 Req/Gnt pairs)

•ACPI Power Management Logic Support

•Enhanced DMA Controller, Interrupt Controller, and Timer Functions

•Integrated IDE controller supports Ultra ATA100/66/33

•USB host interface with support for 6 USB ports; 3 UHCI host controllers; 1 EHCI highspeed USB 2.0 Host Controller

•Integrated LAN Controller

•System Management Bus (SMBus) Specification, Version 2.0 with additional support for

I2C devices

•Supports Audio Codec ’97, Revision 2.3 specification (a.k.a., AC ’97 Component



1-83


Specification, Revision 2.3). Link for Audio and Telephony codecs (up to 7 channels)

•Low Pin Count (LPC) interface

•Firmware Hub (FWH) interface support

•Alert On LAN* (AOL) and Alert On LAN 2* (AOL2)

Hub Architecture

As I/O speeds increase, the demand placed on the PCI bus by the I/O bridge has become significant. With AC

’97, USB 2.0, and Ultra ATA/100, coupled with the existing USB, I/O requirements could impact PCI bus performance. The chipset

’s hub interface architecture ensures that the I/O subsystem; both PCI and the integrated I/O features (IDE, AC

‘97, USB, etc.), receive adequate bandwidth. By placing the I/O bridge on the hub interface (instead of

PCI), the hub architecture ensures that both the I/O functions integrated into the ICH4 and the

PCI peripherals obtain the bandwidth necessary for peak performance.

PCI Interface

The ICH4 PCI interface provides a 33-MHz, Rev. 2.2 compliant implementation. All PCI signals are 5-V tolerant, except PME#. The ICH4 integrates a PCI arbiter that supports up to six external PCI bus masters in addition to the internal ICH4 requests.

IDE Interface (Bus Master Capability and Synchronous DMA Mode)

The fast IDE interface supports up to four IDE devices providing an interface for IDE hard disks and ATAPI devices. Each IDE device can have independent timings. The IDE interface supports PIO IDE transfers up to 16 Mbytes/sec and Ultra ATA transfers up 100 Mbytes/sec.

It does not consume any ISA DMA resources. The IDE interface integrates 16x32-bit buffers for optimal transfers.

The ICH4

’s IDE system contains two independent IDE signal channels. They can be electrically isolated independently. They can be configured to the standard primary and secondary channels (four devices). There are integrated series resistors on the data and control lines (see Section 5.15,

“IDE Controller (D31:F1)” on page 5-175 for details).

Low Pin Count (LPC) Interface

The ICH4 implements an LPC Interface as described in the LPC 1.0 specification. The Low

Pin Count (LPC) Bridge function of the ICH4 resides in PCI Device 31:Function 0. In addition to the LPC bridge interface function, D31:F0 contains other functional units including DMA,

Interrupt Controllers, Timers, Power Management, System Management, GPIO, and RTC.

Note that in the current chipset platform, the Super I/O (SIO) component has migrated to the

Low Pin Count (LPC) interface. Migration to the LPC interface allows for lower cost Super I/O designs.

Compatibility Modules (DMA Controller, Timer/Counters, Interrupt Controller)

The DMA controller incorporates the logic of two 82C37 DMA controllers, with seven independently programmable channels. Channels 0

–3 are hardwired to 8-bit, count-by-byte



FIC MB05W Service Manual transfers, and channels 5

–7 are hardwired to 16-bit, count-by-word transfers. Any two of the seven DMA channels can be programmed to support fast Type-F transfers.

The ICH4 supports two types of DMA (LPC and PC/PCI). DMA via LPC is similar to ISA DMA.

LPC DMA and PC/PCI DMA use the ICH4

’s DMA controller. The PC/PCI protocol allows PCIbased peripherals to initiate DMA cycles by encoding requests and grants via two PC/PCI

REQ#/GNT# pairs.

LPC DMA is handled through the use of the LDRQ# lines from peripherals and special encodings on LAD[3:0] from the host. Single, Demand, Verify, and Increment modes are supported on the LPC interface. Channels 0

–3 are 8 bit channels. Channels 5–7 are 16 bit channels. Channel 4 is reserved as a generic bus master request.

The timer/counter block contains three counters that are equivalent in function to those found in one 82C54 programmable interval timer. These three counters are combined to provide the system timer function, and speaker tone. The 14.31818-MHz oscillator input provides the clock source for these three counters.

The ICH4 provides an ISA-Compatible Programmable Interrupt Controller (PIC) that incorporates the functionality of two 82C59 interrupt controllers. The two interrupt controllers are cascaded so that 14 external and two internal interrupts are possible. In addition, the

ICH4 supports a serial interrupt scheme.

All of the registers in these modules can be read and restored. This is required to save and restore system state after power has been removed and restored to the platform.

Advanced Programmable Interrupt Controller (APIC)

In addition to the standard ISA compatible Programmable Interrupt Controller (PIC) described in the previous section, the ICH4 incorporates the Advanced Programmable Interrupt

Controller

Universal Serial Bus (USB) Controller

The ICH4 contains an Enhanced Host Controller Interface (EHCI) compliant host ontroller that supports USB high-speed signaling. High-speed USB 2.0 allows data transfers up to 480

Mb/s which is 40 times faster than full-speed USB. The ICH4 also contains three Universal

Host Controller Interface (UHCI) controllers that support USB full-speed and low-speed signaling.

The ICH4 supports 6 USB 2.0 ports. All six ports are high-speed, full-speed, and low-speed capable. ICH4

’s port-routing logic determines whether a USB port is controlled by one of the

UHCI controllers or by the EHCI controller. See Section 5.16,

“USB UHCI Controllers (D29:F0,

F1 and F2) and Section 5.17,

“USB EHCI Controller (D29:F7) for details.

LAN Controller

The ICH4

’s integrated LAN Controller includes a 32-bit PCI controller that provides enhanced scatter-gather bus mastering capabilities and enables the LAN Controller to perform high speed data transfers over the PCI bus. Its bus master capabilities enable the component to process high-level commands and perform multiple operations; this lowers processor utilization by off-loading communication tasks from the processor. Two large transmit and



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FIC MB05W Service Manual receive FIFOs of 3 kB each help prevent data underruns and overruns while waiting for bus accesses. This enables the integrated LAN Controller to transmit data with minimum interframe spacing (IFS).

The LAN Controller can operate in either full duplex or half duplex mode. In full duplex mode the LAN Controller adheres with the IEEE 802.3x Flow Control specification. Half duplex performance is enhanced by a proprietary collision reduction mechanism. See Section 5.2,

“LAN Controller (B1:D8:F0)” on page 5-78 for details.

RTC

The ICH4 contains a Motorola* MC146818A-compatible real-time clock with 256 bytes of battery-backed RAM. The real-time clock performs two key functions: keeping track of the time of day and storing system data, even when the system is powered down. The RTC operates on a 32.768 KHz crystal and a separate 3-V lithium battery that provides up to seven years of protection.

The RTC also supports two lockable memory ranges. By setting bits in the configuration space, two 8-byte ranges can be locked to read and write accesses. This prevents unauthorized reading of passwords or other system security information.

The RTC also supports a date alarm that allows for scheduling a wake up event up to 30 days in advance, rather than just 24 hours in advance.

4.6 Clock Frequency Generator

The notebook utilizes the IMI CY28346 chip to supply the system clock needed to run the computer. The following are the available clock frequencies:

System clock:

Clock generator IMI CY28346 support:

- 66/100 MHz for Pentium III Mobile CPU

- 30/33 MHz for PCI device bus clock use

- 48 MHz for PIIX4M

- 14.318 MHz for PIIX4M refresh use

•

14.318 MHz XTAL for Clock Generator use

•

32.768 KHz XTAL for RTC real time clock

•

8.0 MHz XTAL for K/B controller use

•

14.318 MHz OSC for sound blaster use

4.7 Cache Memory

The primary (L1) and secondary (L2) level cache are integrated on the CPU. By incorporating the cache on-die (meaning it is combined with the CPU into one component), Intel eliminates the need for separate components. The 512KB on-die L2 cache provides three (3X) times faster processor access, resulting in significant improvements in performance. Likewise, an integrated cache means a reduction of connections resulting in increased reliability.

4.8 System Memory

The memory subsystem, implemented on the motherboard, includes System and Video memory. The Intel 855GM System Controller chip provides primary control for the system memory.




4.8.1 System Memory

The notebook offers two 64-bit SODIMM (Small Outline Dual Inline Memory Module) sockets for main memory configuration. The memory sockets accept any standard 144-pin SODIMM modules at 128MB, 256MB,512MB and 1GMB sizes. Memory modules are DDR 200/266

SDRAM type.

4.8.2 Video Memory

The video memory of the notebook is using share system memory with 8/16/32MB UMA video memory that can support display resolutions of up to 1024 x 768 at 32-bit 16M color

(TFT LCD).

4.9 System BIOS

The notebook utilizes the Phoenix BIOS 4.0 Release 6.0 (Basic I/O System) that contains both the main system BIOS and the VGA BIOS with Shadow BIOS capability. It utilizes Flash

EPROM BIOS that allows instant erasing and programming without replacing the EPROM chip.

The BIOS is stored in a 32-pin PLCC package FLASH ROM SST 49LF040A with 4Mbit size and is mounted into the motherboard. While posting the system, the Shadow RAM will be enabled and the ROM will be disabled.

4.10 Video Subsystem

The video subsystem, embedded inside the North Bridge chip and the LCD panel, controls the display output to both the LCD Panel screen and to the external VGA port.

4.10.1 Video Chip Controller

Features summary of the Intel 852GM Video Chip Controller:

Video Stream Decoder

. Improved HW Motion Compensation for MPEG2

. All format decoder (18 ATSC formats) supported

. Dynamic Bob and Weave support for Video Streams

. Software DVD at 60 fields/second and 30 frames/second full screen

. Support for standard definition DVD (i.e. NTSC pixel resolution of 720x480, etc.) quality encoding at low CPU utilization

Video Overlay

. Single high quality scalable Overlay and second Sprite to support second Overlay

. Multiple Overlay functionality provided via Arithmetic Stretch Blt

. 5-tap horizontal, 3-tap vertical filtered scaling

. Multiple Overlay formats

. Direct YUV from Overlay to TV-out

. Independent Gamma Correction

. Independent Brightness / Contrast/ Saturation

. Independent Tint/Hue support

. Destination Colorkeying

. Source Chromakeying

Multiple hardware color cursor support (32-bit with alpha and legacy 2-bpp mode)

Accompanying I2C and DDC channels provided through multiplexed interface

Display

. Analog Display Support

. 350-MHz integrated 24-bit RAMDAC that can drive a standard progressive scan analog



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FIC MB05W Service Manual monitor with pixel resolution up to 1600x1200 at 85-Hz and up to 1920x1440 at 60 Hz

. Dual independent pipe support

‧ Concurrent: Different images and native display timings on each display device

‧ Simultaneous: Same images and native display timings on each display device

. DVO (DVOC) support

‧ Digital video out port DVOC with 165-MHz dot clock on 12-bit double pumped interface

‧ Variety of DVO devices supported

‧ Compliant with DVI Specification 1.0, thereby providing support for a display resolution up to 1400x1050 @ 75-Hz, up to 1600x1200 at 60-Hz, or up to 1920x1200 @ 60 Hz

. Dedicated LFP (local flat panel) LVDS interface

‧ Single or dual channel LVDS panel support up to SXGA+(1400x1050 @ 60 Hz) panel resolution with frequency range from 25-MHz to 112-MHz (single channel/dual channel)

‧ SSC support of 0.5%, 1.0%, and 2.5% center and down spread with external SSC clock

‧ Supports data format of 18-bpp

‧ LCD panel power sequencing compliant with SPWG timing specification

‧ Compliant with ANSI/TIA/EIA –644-1995 spec

‧ Integrated PWM interface for LCD backlight inverter control

‧ Bi-linear Panel fitting

. Tri-view support through LFP interface, DVO C port, and CRT Internal Graphics Features

. Up to 64 MB of Dynamic Video Memory Allocation

. Display Image Rotation

. Core Frequency

‧ Display Core frequency of 133-MHz

‧ Render Core frequency of 133-MHz

.

2D Graphics Engine

‧ Optimized 128-bit BLT engine

‧ Ten programmable and predefined monochrome patterns

‧ Alpha Stretch Blt (via 3D pipeline)

‧ Anti-aliased lines

‧ Hardware-based BLT Clipping and Scissoring

‧ 32-bit Alpha Blended cursor

‧ Programmable 64 x 64 3-color Transparent cursor

‧ Color Space Conversion

‧ 3 Operand Raster BLTs

‧ 8-bit, 16-bit, and 32-bit color

‧ ROP support

‧ DIB translation and Linear/Tile addressing

.

3D Graphics Engine

‧ 3D Setup and Render Engine

‧ Viewpoint Transform and Perspective Divide

‧ Triangle Lists, Strips and Fans support

‧ Indexed Vertex and Flexible Vertex formats

‧ Pixel accurate Fast Scissoring and Clipping operation

‧ Backface Culling support

‧ DirectX* and OGL Pixelization rules

‧ Anti-Aliased Lines support

‧ Sprite Points support

‧ Provides the highest sustained fill rate performance in 32-bit color and 24-bit W mode

‧ High quality performance Texture Engine

‧ 266-MegaTexel/s peak performance




‧ Per Pixel Perspective Corrected Texture Mapping

‧ Single Pass Texture Compositing (Multi-Textures) at rate

‧ Enhanced Texture Blending functions

‧ Twelve Level of Detail MIP Map Sizes from 1x1 to 2Kx2K

‧ Numerous Texture formats including 32-bit RGBA

‧ Alpha and Luminance Maps

‧ Texture Chromakeying

‧ Bilinear, Trilinear, and Anisotropic MIP - Mapped Filtering

‧ Cubic Environment Reflection Mapping

‧ Embossed Bump-Mapping

‧ DXTn Texture Decompression

‧ FX1 Texture Compression

‧ 3D Graphics Rasterization enhancements

‧ One Pixel per clock

‧ Flat and Gouraud Shading

‧ Color Alpha Blending for Transparency

‧ Vertex and Programmable Pixel Fog and Atmospheric effects

‧ Color Specular Lighting

‧ Z Bias support

‧ Dithering

‧ Line and Full-Scene Anti-Aliasing

‧ 16 and 24-bit Z Buffering

‧ 16 and 24-bit W Buffering

‧ 8-bit Stencil Buffering

‧ Double and Triple Render Buffer support

‧ 16 and 32-bit color

‧ Destination Alpha

‧ Vertex Cache

‧ Maximum 3D resolution of 1600x1200 at 85- Hz (contact your Intel Field Representative for detailed display information, i.e. pixel depths, etc.)

‧ Optimal 3D resolution supported

‧ Fast Clear support

‧ ROP support

4.10.2 Video Clock

Intel 852GM North Bridge provides input to generate VGA internal slate machine, MCLK, and

DCLK. Also provides 32.768 KHz O/P for video RAM refresh.

4.11 PCMCIA Controller

The PCMCIA controller of the notebook is implemented on the motherboard using the RICOH

R5C554 CardBus Controller. The MB05 notebook only supports single PCMCIA slot for PCI-

Cardbus Bridge.

CARDBUS CONTROLLERS

The R5C554 is an ACPI and PC98/99 logo certified high performance, single slot PC Card controller with a synchronous 32-bit bus master/target PCI interface. This PC Card to PCI bridge host controller is compliant with the 2000 PC Card Standard. This standard incorporates the new 32-bit CardBus while retaining the 16-bit PC Card specification as defined by PCMCIA release 2.1. CardBus is intended to support "temporal" add-in functions on PC Cards, such as Memory cards, Network interfaces, FAX/Modems and other wireless



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FIC MB05W Service Manual communication cards, etc. The high performance and capability of the CardBus interface will enable the new development of many new functions and applications.

The R5C554 CardBus controller is compliant with the latest ACPI-PCI Bus Power

Management interface Specification. It supports all four power states and the PME# function for maximum power savings and ACPI compliance. Additional compliance to On Now Power

Management includes D3 cold state support, paving the way for low sleep state power consumption and minimized resume times. To allow host software to reduce power consumption further, the R5C554 provides a power-down mode in which internal clock distribution and the PC Card socket clocks are stopped. An advanced CMOS process is also used to minimize system power consumption.

The R5C554 single PCMCIA socket supports the 3.3V/5V 8/16-bit PC Card R2 cards or 32-bit

CardBus R3 cards. The R2 card support is compatible with the Intel 82365SL PCIC controller, and the R3 card support is fully compliant with the 2000 PC Card Standard CardBus specification. The R5C554 is an additional buffer chip for the PC Card socket interface. In addition, the R5C554 supports dynamic PC Card hot insertion and removal, with auto configuration capabilities.

The R5C554 is fully complains with the 33Mhz PCI Bus specification, v2.2. It supports a master device with internal CardBus direct data transfer. The R5C554 implements FIFO data buffer architecture between the PCI bus and CardBus socket interface to enhance data transfers to CardBus Devices. The bi-directional FIFO buffer permits the R5C554 to accept data from a target bus (PCI or CardBus interface) while simultaneously transferring data. This architecture not only speeds up data transfers but also prevents system deadlocks.

The R5C554 is a PCMCIA R2/CardBus controller, providing the most advanced design flexibility for PC Cards that interface with advanced notebook designs.

R5C554 FEATURES

– Slot Solution

•

Supports only one PCMCIA 2.1 and JEIDA 4.2 R2 cards or 2 CardBus cards

•

ACPI-PCI Bus Power Management Interface Specification Rev 1.1 Compliant

•

Supports OnNow LAN wakeup, OnNow Ring Indicate, PCI CLKRUN#, PME#, and

CardBus CCLKRUN#

•

Compliant with the 33Mhz PCI Specification V2.2, 2000 PC Card Standard 7.1 for

R5C554

•

Yenta

™ PCI to PCMCIA CardBus Bridge register compatible

•

ExCA (Exchangeable Card Architecture) compatible registers map-able in memory and I/O space

•

Intel

™ 82365SL PCIC Register Compatible

•

Supports PCMCIA_ATA Specification

•

Supports 5V/3.3V PC and 3.3V Cardbus cards

•

Supports two PC Card or CardBus slots with hot insertion and removal

•

Supports multiple FIFOs for PCI/CardBus data transfer

•

Supports Direct Memory Access for PC/PCI and PCI/Way on PC Card socket




•

Programmable interrupt protocol: PCI, PCI+ISA, PCI/Way, or PC/PCI interrupt signaling modes

•

Win'98 IRQ and PC-98/99 compliant

•

Parallel or Serial interface for socket power control devices including Micrel and TI

•

Integrated PC 98/99 -Subsystem Vendor ID support, with auto lock bit

•

LED Activity Pins

•

R5C554 supports D3cold state PME# wakeup; 3.3Vaux Power; and Zoomed video buffer enable pins

•

R5C554: "Built-in" live video, high throughput, multimedia ZV ports support without additional buffers; 3V card protection during host system suspend with Auto Card

VS# resensing; dedicated ZV output port to LCD controller

SmartCardBus

™ combines a Smart Card reader and CardBus controller in a single IC. In addition to meeting PC Card standards, SmartCardBus is compliant to Microsoft PC/SC, ISO

7816-1, -2, -3 electrical specifications, standard protocols including T = 0, T = 1, and synchronous and asynchronous formats. SmartCardBus lowers the cost of ownership of ecommerce and corporate security Smart Card applications.

4.12 Audio Subsystem

The audio subsystem is integrated inside the South Bridge chip on the motherboard. Refer to the System Core Logic section of this chapter.

An internal two-way mini speaker and microphone provide the notebook with mobile sound generation and recording capabilities. In addition, a set of 3.5mm bayonet socket (1/8

” minijack) connectors allow for external microphone, line inputs, and headphone outputs.

4.13 Keyboard and Pointing Device

The Keyboard Subsystem of the notebook is implemented on the Motherboard and Keyboard

Assembly using the Mitsubishi M38859 keyboard controller chip and the Mitsubishi M38859 keyboard controller firmware. This chip controls the internal built-in keyboard, the built-in touchpad pointing device, as well as the external PS/2 keyboard and mouse port. The keyboard controller allows simultaneous use of both the internal and external keyboard and

PS/2 mouse.

The MB05 membrane keyboard is an 86-key IBM 101-key enhanced compatible keyboard with standard characters and 12 function keys including an embedded numeric keypad. See

Chapter 1 for more information.

The pointing device subsystem consists of the built-in Synaptics touch pad pointing device module on the system top cover assembly and a pre-programmed Mitsubishi M38859 microcontroller that interfaces the mouse device to the Motherboard. The touch pad module is connected to battery board through a 6-pin FPC cable. An external PS/2 port also supports the use of an external PS/2 compatible mouse where the system automatically detects on system power up and runs both internal and external mouse simultaneously.



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The Synaptic touch pad, a pointing device for personal computers, detects the position of a finger over a touch-sensitive area. To move the cursor, the user lightly slides a finger over the smooth sensor area. To

‘click’, the user gently taps on the surface.

The ultra-thin module is the thinnest PCB based touchpad available today. It is a capacitive sensor - the finger is detected by measuring its effect on an array of capacitive lines integrated into the PC board. The pad senses both the finger

’s position and its contact area

(X, Y, and Z). The area of contact is a measure of applied pressure. One side of the module

PC board is the sensor surface; electronic components are mounted on the other side. The sensitive area is protected by a layer of smooth and durable mylar.

The Synaptic touch pad communicates with the host via a standard PS/2 mouse or trackball interface. It is fully compatible with the standard Microsoft mouse driver. The module connector includes the PS/2 signal pins, power supply pins and two connections for external button switches.

The Synaptic touch pad includes a special

“edge-motion” feature that allows the user to extend a drag operation when the finger reaches the edge of the sensor pad. The cursor continues to coast in the indicated direction when the finger is held against the edge.

4.14 IDE Drives Subsystem

The disk drives subsystem, implemented on the Motherboard and on the associated internal hard disk drive assembly and device bay, provides disk storage for all system sof tware and user files.

The notebook is equipped with high capacity hard disk drive using Enhanced IDE controller with LBA (Logical Block Addressing) and Ultra DMA mode support.

The ICH4 controller chip provides the Primary IDE controller for the internal hard disk, and the

Secondary Master for the CD-ROM.

The notebook uses the 24X-speed IDE CD-ROM Drive and 8X-speed DVD-ROM. The CD-

ROM drive supports CD-DA transfer over ATAPI function that the host system can read CD audio data. The drive also supports Photo-CD Multi-session disc compatibility and Multimedia

PC-3 specification compatibility. The notebook also could use the 8X+ speed IDE DVD-ROM

Drive that reads DVD digital data stored on DVD-ROM at 8 times faster rotational speed.

4.15 Power Subsystem

The Power Subsystem consists of the following major sections:

4.15.1 AC Power Adapter

The computer is equipped with a 60W Peak 80W universal AC power adapter that converts

AC voltage (100 to 240VAC, 50 to 60Hz) into DC voltage used to operate the notebook and charge the batteries.

4.15.2 Internal Battery Pack

The computer utilizes Lithium-Ion (Li-Ion) that provides DC power for the notebook and real time clock battery on the motherboard when the AC Adapter is not connected to the computer.




The normal charging time for the battery is around 3.5 hours when computer is turn off while it should take around 8 hours when the computer is running. Running time of battery is around

4.5 hours.

4.15.3 DC-DC Module of Motherboard

The DC-DC module receives approximately 12VDC from the battery pack and uses this input voltage to generate multiple regulated output voltages to provide power for all internal notebook board assemblies.

4.15.4 LCD Inverter Board Assembly

The LCD Inverter Board Assembly is located in the LCD Panel Assembly. It converts the

+12VDC input directly from the Battery Pack into a high voltage AC output used to light the

CCFT (Cold-Cathode Fluorescent Tube).

4.16 Micro-P Subsystem (PMU-08)

The micro controller NEC PMU08 acts as a supplement for the power management control. It supports many functions via the SMBus interface.

The system communicates with the PMU08 via the SMBus interface. The SMBus host should be first initialized before starting the transaction. The following is the procedure for system communication with PMU08:

1. Enable SMBus interface by writing 01h to SmbHstCfg register.

2. Get SMBus I/O port base address by reading from SmbBA register.

3. Clear SMBus status by writing 1Eh to SmbHstSts register.

4. Write the PMU07 slave address to SmbHstAdd register.

−

Send command to PMU08 -- Slave address is 04h.

−

Read data from PMU08 -- Slave address is 05h.

5. Write the desired command to SmbHstCmd register.

6. Write the desired parameters to SmbHstDat0 (High byte) and SmbHstDat1 (Low byte) registers if the system wants to send command to PMU08.

7. Wait for SMBus interrupt occurred by monitoring SmbHstSts register INTR bit.

8. Get the desired data by reading from SmbHstDat0 (High byte) and SmbHstDat1 (Low byte) registers if the system wants to read data from PMU08.

Features Summary of the Micro-P:

•

5 channels 8-bit analog to digital converter

•

Timer0: 8-bit tuner/counter with 8-bit prescaler

•

Timer1: 16-bit timer/counter. TMR1 can be incremented during sleep via external crystal/clock

•

Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler

•

Capture, Compare, PWM module

•

Synchronous Serial port (SSP) with SPI and I

2

C

•

Universal Synchronous Asynchronous Receiver Transmitter (USART/SCI)

•

Brown-out detection circuitry for Brown-out Reset (BOR)

•

2K bytes program memory

•

128 bytes data memory

•

22 I/O pin

•

8 interrupt sources



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5.1 Introduction

This section contains preventive and corrective maintenance procedures for the MB05 notebook. The first part of the section describes the computer cleaning procedures and preferred handling procedures for sensitive components (e.g. disk drives, LCD, CPU, batteries).

The second part of the chapter identifies all field replaceable parts with the remainder explaining the removal and replacement procedures for the field replaceable parts.

5.2 Preventive Maintenance

Preventive maintenance is limited to cleaning the plastic case, the keyboard, and the display screen and cleaning the floppy drive heads as required.

5.2.1 Cleaning the Computer

When it is necessary to clean the plastic case and keyboard, use a soft lint-free cloth, slightly dampened with a mild detergent solution, or use the contents of any commercially available computer cleaning kit. i

Never use alcohol, petroleum-based solvents, or harsh detergents to clean the notebook. Also, do not spray any liquids directly on the computer case, keyboard, or screen. If the liquid-crystal display (LCD) screen has become smeared or dusty, clean the screen by first applying a mild glass cleaner to a soft, clean, lint-free cloth, and gently wipe the glass. Never apply liquids directly on the screen surface. Moreover, do not use paper towels to clean the display screen. Paper can scratch the display screen matte.

5.2.2 Maintaining the LCD Quality

When it comes to screen problems, heat plays a big part. After a good working session, the typical routine is to shut the machine and close the cover. But the display surface - no matter what type it is - and the components inside the computer radiates heat; when you close the cover, you trap the heat against the screen. Leave the computer's cover open for about ten minutes while the heat disperses. Make this a habit.




5.2.3 Maintaining the Hard Disk Drive

The hard disk drive is one of the most common parts that always gets problem. Here is some preventive maintenance that you can do when handling the hard disk.

•

Always back up the data files from the hard disk.

•

Run a virus detecting program for possible virus infected area on the hard disk.

•

Use SCANDISK to correct any errors found in the directory and File Allocation Table

(FAT). This will also free up space from any unused sectors.

•

Never turn the computer off when the hard disk is being accessed.

•

Never move or raise the computer while the hard disk is being accessed, most especially don't jar the hard disk as this may cause a hard disk crash.

•

Use hard disk system tools like Disk Defragmenter under Windows. This reorganizes your hard disk by eliminating fragmentation and improves the hard disk access time.

5.2.4 Handling the Computer Battery Packs

The battery packs furnished with the computer require reasonable care and handling to ensure efficient operation and maximum life. Periodically inspect the battery terminals and the batteries for evidence of corrosion and oxide build-up.

To ensure that the battery packs endure normal life cycle, always observe the following precautions when handling the battery packs:

•

Do not drop the battery packs or subject them to excessive shock and vibration.

•

Do not expose the battery packs to direct sunlight, moisture, or chemical compounds.

•

Do not disassemble the battery packs.

•

Do not use the battery packs to power other devices.

•

Do not short the battery leads or connect the battery with reversed polarity.

•

Never attempt to charge the battery packs in any way other than as described in this manual and the User

’s Manual.

•

Always charge the battery packs as soon as possible after a low battery indication.



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5.3 Required Tools and Equipment

To troubleshoot and repair PC systems properly, you need a few basic tools:

•

Tweezers

•

Small flat-blade screwdriver

•

Small Cross screwdriver

•

Regular size Cross screwdriver

•

Small Hex-bolt screwdriver

• i

All boards, options, and peripherals contain components that are sensitive to static electricity. When handling any of these items, use wrist or ankle grounding straps and grounded working mats. When moving or storing items, use the antistatic bags supplied with the items.

5.4 Notebook Field-Replaceable Parts and Assemblies

The notebook contains two major assemblies: The Cover Display LCD Assembly and the

System Unit Assembly.

5.4.1 Cover-Display LCD assembly

The Cover-Display LCD Assembly includes the following major Field Replaceable Units/parts

(FRUs):

•

LCD Face and Back Panel Cover

These parts are used to cover the whole LCD Panel assembly, which includes the LCD

Display Module, the LCD FPC cables, and inverter board.

•

LCD Display Module

“14” LCD (Liquid Crystal Display) screen is used for output display. This part is assembled together with LCD Power Inverter Board, and LCD cables contained inside the whole LCD Panel. Handle this part with care against static electricity and accidents that can break the LCD.

•

LCD Power Inverter Board

This part or PCB (Printed Circuit Board) is used to provide high voltage to the CCFT (Cold

Cathode Fluorescent Tube) of the notebook

’s LCD backlighting. It is connected to the right side of the LCD display screen and attached to the back panel by a screw. Exercise safety electrical precautions in handling and servicing this part. The circuit board also includes the function for displaying the power status and battery charge LED indicators.

•

LCD FPC Cable

The LCD FPC cable is used to convert output signals from the motherboard in driving the

LCD display screen. The cable is connected to the back of the LCD Panel.

5.4.2 System Unit Assembly

The System Unit Assembly comprise of several assemblies of which can be divided into two major sub-assemblies.

•

The System Top Unit Assembly.

•

The System Base Unit Assembly.




The following System Top Unit Assembly includes the following major Field Replaceable

Units/parts (FRUs):

•

Glidepad Touch Pad Module Assembly

The touch pad (glide pad) pointing device module is assembled at the underside of the top cover with the sensor pad exposed on the top. The assembly comprises of the glide pad board, the glide pad converter board, the select buttons bracket casing, the insulator sheet, the glide pad FPC cable, and the glidepad wire cable. The glide pad board is assembled just underneath the select button assembly. It provides a FPC cable connector for the mother board.

•

Keyboard Panel Assembly

The keyboard is assembled on top of the system unit and connected to the main board

’s keyboard FPC type connector. The keyboard is also secured on the system

’s top unit casing. There are no screws attached to the keyboard.

•

Heat Plate and Fan Exhaust Unit

The Fan Exhaust unit is assembled on the upper-right side of the system unit. It comprises of a heat plate and one fan. There are seven screws securing the heat plate to the CPU module inserted on the motherboard. The exhaust fan is secured beside the heat plate.

•

Keyboard Cover Assembly

The keyboard cover is a thin bracket for holding the keyboard as well as covering the base unit. It is also includes the power button, easy buttons, and status LED cover moldings.

The following System Base Unit Assembly includes the following major Field Replaceable

Units/parts (FRUs):

•

Battery Pack

This is one of more easily replaceable parts. The battery pack is found on the right side on the base unit and can be easily removed by pressing the latch underneath the unit and pulling the battery on its handle. The battery pack is replaced as a whole and must not be opened for repair.

•

Hard Disk Drive Module

The Hard Disk Drive is attached on the lower-left side of the system base unit located just below the keyboard. The HDD is secured by only one screw. The HDD module is a 2.5 inch hard disk drive with a maximum height of 9.5mm. The hard drive module assembly is attached to the motherboard through the HDD connector.

•

CD-ROM / DVD-ROM Drive Assembly

The CD-ROM / DVD-ROM / Drive Assembly is attached on the right side of the base unit and is lock with one latch.

•

CPU

The Pentium socket is found on the top right part of the motherboard. You will need a flat screwdriver and CPU tooling for removing or installing the CPU. Refer to Chapter 2 on how to install and upgrade the CPU.

•

Speaker Assembly

The internal speakers of the notebook are assembled into front side of the system. They are secured into a slot and speaker cable connector is attached into the main board.



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•

Motherboard Assembly

The Motherboard assembly is the most important part of the notebook. It contains the entire major chipsets including the core logic, PCMCIA, memory, and BIOS to operate the whole computer. It also includes the sockets, connectors and ports completing the functionality.

•

Internal Modem / LAN / Combo Module Assembly

If the computer includes an internal modem, LAN

•

System Base Unit Case

The System Base Unit Case is where the Motherboard is placed. It includes openings for the battery, FDD, CD-ROM and PCMCIA equipment.

5.5 Parts Removal and Replacement Procedures

This section contains the field service-level removal/ replacement procedures for the notebook of MB05 model. The notebook is designed for optimum modularity in order to make field replacement and maintenance easy and efficient.

5.5.1 Removing the Battery Pack

The procedure for removing and replacing the battery pack is as follows:

To remove the battery pack, slide the latch to left side and hold it, then take out the battery pack with your finger.

Figure 5-1 Remove the battery pack

5.5.2 Removing the Keyboard

The internal keyboard is located above the system top unit and is fitted in without screws on the top unit case. Follow the steps below on how to remove the keyboard:

12. Turn off the system and remove both AC adapter and the battery pack from the notebook unit.

13. Remove keyboard cover by gently bending it and sliding it towards in front of you.




Figure 5-2

Remove keyboard Cover

14. There are two screws on the bottom case and that should be removing as the picture indicated.

15. Lift the keyboard and tilt it towards the LCD panel.

16. Release keyboard cable by sliding the ZIF connector towards up direction.

Figure 5-3 Remove two screws



1-99


Figure 5-4 Remove keyboard

5.5.3 Removing the Internal Hard Disk Drive

The notebook provides a built-in hard disk for the primary IDE controller. The HDD is an industry standard 2.5

” IDE disk drive with a maximum height of 9.5mm.

1. Find out the built-in hard disk secured with one screw at the upper of the bottom case.

Remove this screw and take out the hard disk door then pull the hard disk module from the connector.

Figure 5-5 The disassembly of Hard Disk Drive




2. Remove four screws of frame HDD bracket plate.

Figure 5-6 Screws Locations of the frame HDD bracket plate

5.5.4 Removing the heat sink plate

The procedure for removing the heat sink plate is as follows:

1. Removing the plate, there are three screws as the picture shown.

Figure 5-7 Removing the heat sink plate



1-101


5.5.5 Removing the Heat Sink

The procedure for removing the heat sink is as follows:

1. Removing the heat sink, there are four screws and one FAN cables as the picture shown.

Figure 5-8 Removing the Heat Sink Module

5.5.6 Removing the LCD Panel

The procedure for removing the LCD Panel is as follows:

1. To remove the four screws of rear side for the system unit.

Figure 5-9 Four Screws




2. Removing the two screws for LCD cable.

Figure 5-10 T

wo screws for LCD cable

3. Slowly pullout the LCD panel from the system unit.

5.5.7

Removing the Intel CPU

The MB05 features Intel Pentium M uFC-PGA Processors. It is located on the upper left side of the system motherboard.

To install or replace the CPU, follow the steps below:

1. Before removing the CPU module, you need first to disassemble keyboard and heat sink plate.

2. Using a flat screwdriver, turn the socket lock counter-clockwise direction to unlock CPU from the socket.

Figure 5-11 CPU Assembly



1-103


5.5.8 Removing the Top Cover

The procedure for removing the top cover is as follow:

Please see the location of top cover as the below picture shown.

1. To remove the top cover, you also need to remove the seven screws and one Hex-screw and one FPC on top cover.

Figure 5-12 Location of Top Cover

2. There are six screws on the bottom case

Figure 5-13 Removing the six screws of bottom case




Figure 5-14 Removing the G/P FPC of top case

5.5.9 Removing the Audio board

The procedure for removing the audio board is as follows:

1. There are two screws and one cable for speaker and audio FPC to remove the audio board.

Figure 5-15 Removing the Audio board



1-105


5.5.10 Removing the DC board

The procedure for removing the DC board is as follows:

1. There are two screws for this DC board as the pictures shown.

Figure 5-16 Removing the DC/DC board

5.5.11 Removing the MDC Modem board

The procedure for removing the MDC Modem board is as follows:

1.

There is only two screws for this MDC Modem board and one cable as the pictures shown.




Figure 5-17 Removing the DC/DC board

5.5.12 Removing the IO board

The procedure for removing the IO board with serial/parallel/PS2 ports are as follows:

1. There are four screws on the rear side as the pictures shown.

Figure 5-18 Removing the IO Hex-Screws

2. There are two screws and one FPC for this IO board as the pictures shown.

Figure 5-19 Removing the IO board

5.5.13 Removing / Replacing the Motherboard

The motherboard contains the major chipset and components needed to run the MB05 notebook. Follow the steps below on how to remove and replace the motherboard:

1. Before removing the motherboard, you need first to disassemble the all basis unit modules mentioned in the previous sections.

2. On the motherboard, please make sure to remove the five hex bolts and 4 screws and one cable on the rear side of the system.



1-107


Figure 5-20 Motherboard Screws Location

3.

You will see two Hex-screws as the picture shown.

Figure 5-21 Removing Hex-Screws

4. When all screws and bolts are removing, the mother board and FPC should lift up together gently from the casing of base unit..




This appendix provides the technical specification of the MB05 notebook:

A.1 System Specification

Category Specification Stepping

CPU Intel Mobile Centrino Processor

FSB Speed 400MHz

Core Logic MONTARA-GM (North Bridge)

CPU Interface

Integrated 3D/2D Graphic Engine.

AGP Bus Controller

DDR DRAM Controller

HUB Interface

ICH4-M (South Bridge )

Hub Interface Technology interconnecting INTEL

NB and SB.

Dual IDE Master/Slave Controller ,Integrated DMA

Controller

Universal Serial Bus Host Controller

Integrated LAN Controller(Not use)


Advanced Programmable Interrupt Controller

Integrated PCI to LPC Bridge

Integrated RTC compatible MC146818A with

256bytes of battery backed RAM


PCI Bus Interface (PCI 2.2 compliant)

Note: See INTEL spec for Detail.

Cache Memory L1 Cache (Centrino Processor internal):

64KB

8-way cache association provides

L2 Cache (Centrino Processor internal):

1024KB Advanced Transfer Cache,8 way association

8-way set associative, 32-byte line size, 1 line per sector

System Memory Base Memory: 1 SO-DIMM Slot (1.25

”)

Size: 128/256/512MB

Type: DDR SDRAM, 2.5V

Data Path: 64Bit

Frequency: 266MHz

Refresh: CBR Refresh

Expansion Memory: 1 SO-DIMM Slot (1.25

”)

Size: 128/256/512MB

Type: DDR SDRAM, 2.5V

Data Path: 64Bit

Frequency : 266MHz

Refresh: CBR Refresh



1-109


BIOS ROM

Super I/O

Flash ROM

1 st

Vendor : SST 49LF040A PLCC Package 4Mbit LPC flash ROM

SMSC LPC47N267

FDC, IEEE 1284 Printer Port

Serial Port x 1 ports

IR Port ASKIR, SIR, FIR, HPSIR, Consumer IR


RTC + CMOS

SRAM

K/B Controller

Integrated in South Bridge (INTEL ICH4-M)

Real Time Clock with 256 byte of CMOS SRAM.

Supports keeping track of the time of day and storing system data.

Mitsubishi M38859

Internal K/B, Touch Pad, External K/B or M/S

PMU New PMU08

Mitsubishi M38859FFHP

Embedded Controller

VGA Controller MONTARA-GM Integrated 3D/2D Graphic Engine.

VRAM

High Performance and high quality 3D accelerator

AGP 1X/2X/4X BUS


Complete TV-OUT/Digital Flat Panel

Solution(DVO Interface)

Shared Main Memory 8/16/32 MB.

LVDS

Transmitter

ICH4-M Integrated.

CardBus

Controller

RICOH R5C554 PCI-CARDBUS / 1394 OHCI-LINK / 1394

PHY

PC/Card Bus Type II x 2




Sound

Modem

AC

’97 CODEC

Realtek ALC202

AC

’97 Revision 2.2 Compliant

MDC modem support

V.90, K56flex, ITU-T V.34, V.32, RJ11 Jack

TIA/EIA 602, V.42

ITU-T V.17, V.29, V.27ter, V.21 Ch2

TIA/EIA 578 Class1 FAX

Wake up on Ring

On board LAN Realtek 8100BL

Support LAN boot( no used)

Support for auto-negotiation (10BASE-T and 100BASE-TX)

Wake up On LAN( S1~S5).

802.11a+b

802.11 b

Support by Mini-pci.

1394 RICOH R5C554 PCI-CARDBUS / 1394 OHCI-LINK / 1394

PHY

USB

(ICH4-M)

Integrated in South Bridge (INTEL ICH4-M)

Three Independent UHCI USB 1.1 Host Controllers and


Legacy Keyboard/Mouse support.

Supports only one Debug port at port 1(first port), it is at

USB 2.0 transfer rate..

A.2 Display Specification

15” TFT LCD (HANNSTAR)

LCD Model

LCD Type

Display Pixels

Pixel Arrangement

Display colors

Module Size

Weight

Contrast Ratio

Power Supply

Response Time

Operating Temperature

HSD150PX16-A

15

” TFT

H1024 x V768 pixels

RGB vertical stripe

262K Colors

298.5(W) x 227.5(H) x 5.8(D) [mm]

Approx. 500g

200:1 (typ.)

3.3V

30ms (max)

0 to 50 degrees Celsius



1-111


-20 to 60 degrees Celsius

Storage Temperature

15” TFT LCD (LG)

LCD Model

LCD Type

Display Pixels


Display colors

Module Size

Weight

Contrast Ratio

Power Supply

Response Time



15” TFT LCD (AU)

LCD Model

LCD Type

Display Pixels


Display colors

Module Size

Weight

Contrast Ratio

Power Supply

Response Time



LP150X05-C2

15

” TFT

H1024 x V768 pixels

RGB vertical stripe

262K Colors

298.5(W) x 227.5(H) x 5.8(D) [mm]

Approx. 500g

200:1 (typ.)

3.3V

30ms (max)



B150XG01-2

15

” TFT

H1024 x V768 pixels

RGB vertical stripe

262K Colors

298.5(W) x 227.5(H) x 5.8(D) [mm]

Approx. 500g

200:1 (typ.)

3.3V

30ms (max)



14.1” TFT LCD (SAMSUNG)

LCD Model

LCD Type

Display Pixels


Display colors

Module Size

Weight

Contrast Ratio

Power Supply

Response Time


LTN141XB-L02

14.1

” TFT

H1024 x V768 pixels

RGB vertical stripe

262K Colors

298.5(W) x 227.5(H) x 5.8(D) [mm]

Approx. 500g

200:1 (typ.)

3.3V

30ms (max)







A.5 DVD/ RW Combo Drive Specification

Drive Manufacturer

Physical Dimension

Weight

Loading

Ejection

QSI SBW242

128.0 x 12.7 x 129 [mm] ( W * H * D )

250g +/- 10g

Manual tray loading

Host Interface

Average Access Time

Data Transfer Rate (burst)

Manual eject using the eject button

Auto eject using the eject command on software

Enhanced IDE (ATAPI)

150ms Typ.

16.7 MByte/s (PIO Mode 4)

16.7 MByte/s (Multi word DMA transfer mode-2)

33.3 MByte/s (Ultra DMA transfer mode-2)

Data Transfer Rate (sustained)

Max. 2,100Kbyte/s (CD-RW) ; Max.3,600Kbyte/s(CD)

Data Write Rate

Max. 1,200Kbyte/s (CD-R) ; Max.600Kbyte/s(CD-RW)

Starting Time

Data Buffer Capacity

Supply Voltage

MTBF

Drive Manufacturer

Physical Dimension

Max. 10 sec (from stand by to ready)

2MB

+5VDC +/- 15%

50,000POH or more

TEAC DW224EA

128.0 x 12.7 x 129 [mm] ( W * H * D )

Weight

Loading

Ejection

Host Interface

Average Access Time

Data Transfer Rate (burst)

250g +/- 10g

Manual tray loading

Manual eject using the eject button

Auto eject using the eject command on software

Enhanced IDE (ATAPI)

150ms Typ.

16.7 MByte/s (PIO Mode 4)

16.7 MByte/s (Multi word DMA transfer mode-2)

33.3 MByte/s (Ultra DMA transfer mode-2)

Data Transfer Rate (sustained)

Max. 2,100Kbyte/s (CD-RW) ; Max.3,600Kbyte/s(CD)

Data Write Rate

Max. 1,200Kbyte/s (CD-R) ; Max.600Kbyte/s(CD-RW)

Starting Time

Data Buffer Capacity

Supply Voltage

MTBF

A.6 Keyboard Specification

Max. 10 sec (from stand by to ready)

2MB

+5VDC +/- 15%

50,000POH or more

Keyboard Type

SUNREX KB



1-113


Type of key switch

Number of keys

Compatibility

Travel

Keyboard Height

Keycap Pull Off Force

Supply Voltage


A.7 Touch Pad Specification

Membrane (PE) Switch

87 keys with embedded numeric keypad

Enhanced 101/102 emulation

3.0 mm

±

0.3 mm

6.5

±

0.3 mm

7.0

±

0.3 mm (SPACE Key)

≥

500g

6V


Interface

Supply Voltage

Supply Current

Dimension

Weight


PS/2 (compatible with Microsoft Mouse Driver)

5V

4.0mA (Max) Operating

W65 x H49 x D2.82 (D1.07 PCB ) mm

8g.




A.8 On board MDC Modem Specification

Modem Type

Wake Up Function

Connection Mode

Speakerphone

Fax Transmission Way

Modem Speed

Ambit

Supports Ring-in Resume Wake Up function

V.90 Kbps

Full duplex speakerphone (FDSP)

Half Duplex

56 Kbps

Modulation Format

V.90 PCM

A.9 On board LAN Specification

LAN Type

Speed

Wake Up Function

A.10 Power Supply

Realtek 8100BL

10/100 Mbps

Supports Wake-on-LAN (WOL) function

AC POWER ADAPTER (DELTA)

Input Voltage

Input Frequency

Input Current

Efficiency

In-Rush Current (Cold Start)

Output Power

100 to 240VAC

50 to 60 Hz

1.32A Max at 110VAC

0.66A Max at 220VAC

83% Min

50A Max at 100 VAC

100A Max at 240 VAC

75W




Output Voltage

Output Current

Over Voltage Protection

Over Current Protection

Dimension

Weight

AC POWER ADAPTER (LITEON)

Input Voltage

Input Frequency

Input Current

+19Vdc (main)

3.16A (Max)

24V Max

19V / 5A (max)

L115 x W50 x H29 [mm]

250g

Efficiency

In-Rush Current (Cold Start)

Output Power

Output Voltage

Output Current

Over Voltage Protection

Over Current Protection

Dimension

Weight

BATTERY PACK

Cell Number

Model

Rating (Nominal) Voltage

Typical Capacity

Watts

Charging Voltage

Charging Efficiency

EVD1

EVDF

A.11 Inverter Specification

100 to 240VAC

50 to 60 Hz

1.32A Max at 110VAC

0.66A Max at 220VAC

83% Min

50A Max at 100 VAC

100A Max at 240 VAC

80W

+19Vdc (main)

3.16A (Max)

24V Max

19V / 5A (max)

L115 x W50 x H29 [mm]

250g

Sanyo Li-Ion Rechargeable Smart Battery

8

14.4V

4400 mAH

52 W

16.8V

100%

14.0V

12.0V

Input Voltage

Start Voltage

Output Current

Frequency

Efficiency

Brightness Control Voltage

5.0V

1200Vrms (min)

6mA (max)

30~70KHz

75% (min)

0.94~1.86V



1-115


A.12 DC/DC Specification

Controller

Input Voltage

Output Current

Frequency

Support Mode

A.13 Charger Specification

PMU 08

8 ~ 20V

4A (5V) / 4A (3.3V) / 100mA (12V)

200KHz

OVP / OCP

Controller

Input Voltage

A.14 Mechanical Specification

PMU 08

18.5 ~ 20V

Category

Size

Weight

Specification

W=308mm, D=268mm, H=27.7~31mm.

Approx 4.9 lb = 2.2Kg

A.15 Environmental Requirements

Temperature

Operating Temperature

Storage Temperature

Humidity

Operating

Storage

Shock (Non-operating)

Unpacked

Drop

Package

Electro-Static Discharge (ESD)

5oC to 35oC

-20oC to 60oC

10% to 80% RH without condensation

5% to 90% RH without condensation

Acceleration: 30G/50G

Duration Time: 11ms

No. of Times: 3 Times

Direction: 6 face

Drop Height: 91cm (under 10Kg)

76cm (over 10Kg)

Drop Phase: 1 corner, 3 line, 6 face

Contact: +/- 6KV

Air: +/-10KV

Remark




This appendix provides you with the field replaceable unit (FRU) parts listing of the MB05

Series. Refer to this appendix whenever ordering for spare parts or requesting for RMA

(Returned Merchandise Authorization) number.

ITE

M FRU

FRU Level

Q'ty

A B C

FIC

Part Number

Lead

Time

(Days)

Return to

Warranty

FIC/Custo mer

Period for Repair

1 CPU Centrino1.3GHZ 1 x

01-10966-01

40 N/A N/A

1 x

01-10968-01

40 N/A N/A 2 CPU Centrino 1.5GHZ

CPU Centrino 1.3GHZ Trigem

3 Consign

4

CPU Centrino 13GHZ Trigem

Assign

5 DDR-UNI 128M

6 DDR-A-data 128M

1

7 DDR-UNI 256M

8 DDR-Adata 256M

1

1

9 COMBO DW-224E-A97

10

1

CD-RW+DVD COMBO DW-

224EA97 TEAC 1

11

FRAME M05H ODD Support

PLATE 1

12 PLASTIC-M CDROM DW TEAC 1

1

1

1 x x x x x x x

01-10966N01

40

01-10966D02

40

02-33036-01

40

02-33095-00

40

02-33037-01

40

02-33096-00

40

25-03434-10

N/A x 23-40558-01 x 24-52423-00 x 80-40844-10 x

25-03435-00

N/A

N/A

N/A

N/A

N/A

N/A

N/A

60 12 Mth

30

30

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

FIC

N/A

N/A

N/A 13 COMBO SBW-242 QSI

14

1

DVD-ROM COMBO SBW-242

QSI 1

15

16


PLATE 1

PLASTIC-M COMBO QSI

PANEL 1

17 CD-ROM CD-224E-C97

18

1

CD-ROM 24X CD-224E-C97

650MB TEAC 1

19

20


PLATE 1

PLASTIC-M CDROM TEAC

PANEL 1

21 Module HDD _30GB _HIT 1

22 x 23-40489-00 x 24-52423-00 x 80-40855-10 x

25-03436-10 x 23-40139-14 x 24-52423-00

60 12 Mth

30

30

N/A

30

N/A

N/A

N/A

60 12 Mth

N/A x 80-40843-10 30 N/A x 25-03541-00 N/A x 23-20813-06 45

N/A

12 Mth

FIC

N/A

N/A

N/A

FIC

N/A

N/A

N/A

FIC

23

24

25

26 Module HDD _60GB _HIT

27

28

HDD 60GB HIT

1

1

CON SOCKET FOR HDD S-

TECH 1

29 FRAME HDD 1

30

HDD 30GB HIT 1


TECH 1

FRAME HDD 1

PLASIIC-M HDD 1

PLASIIC-M HDD 1 x 20-21749-00 x 24-52404-00 x 80-40845-10

30

30

N/A

N/A

30 N/A x

25-03542-00

N/A x 23-20900-00 45

N/A

12 Mth x 20-21749-00 x 24-52404-00 x 80-40845-10

30

30

30

N/A

N/A

N/A

N/A

N/A

N/A

N/A

FIC

N/A

N/A

N/A



1-117


72

73

74

75

31 Module HDD_40GB_HIT

32

33

34

35

HDD 40GB HIT

1

1


TECH 1

FRAME HDD 1

PLASIC-M HDD 1

36 Module HDD 60 GB_HIT

37

38

HDD 60 GB HIT

1

1


TECH 1

39 FRAME HDD 1

40 PLASIIC-M HDD 1

41 Module HDD _40GB _HIT 1

42

43

HDD 40GB HIT 1


TECH 1

44

45

FRAME HDD

PLASIIC-M HDD

46 Module HDD_40GB_FUJ

1

1

1

47

48

49

50

HDD 40GB FUJ 1


TECH 1

FRAME HDD 1

PLASIC-M HDD 1

51 Module HDD _40GB _HIT

52

53

HDD 40GB HIT

1

1


TECH 1

54 FRAME HDD 1

55 PLASIIC-M HDD 1

56 Module HDD 60 GB_HIT 1

57

58

59

HDD 60 GB HIT 1


TECH 1

FRAME HDD 1 x 25-03553-00 x 23-20862-03 x 20-21749-00 x 24-52404-00 x 80-40854-10 x

25-03571-00 x 23-21021N00

N/A N/A

45 12 Mth

30

30

30

N/A

N/A

N/A

N/A N/A

45 12 Mth x 20-21749-00 x 24-52404-00

30

30

N/A

N/A x 80-40845-10 x

30

25-03570-00

N/A x 23-21020N00 45

N/A

N/A

12 Mth x 20-21749-00 x 24-52404-00 x 80-40845-10 x

25-03554-00 x 23-21016-01 x 20-21749-00 x 24-52404-00 x 80-40854-10

30

30

N/A

N/A

30 N/A x

25-03570-01

N/A x 23-21020D00 45

N/A

12 Mth x 20-21749-00 x 24-52404-00 x 80-40845-10 x

25-03571-01 x 23-21021D00

30

30

30

N/A

N/A

N/A

N/A

N/A

45 12 Mth

30

30

N/A

N/A

30

N/A

N/A

N/A

45 12 Mth x 20-21749-00 x 24-52404-00 x 80-40845-10 x 25-03487-00 x 21-92190-02

30

30

30

45

90

N/A

N/A

N/A

12 Mth

3 Mth x 71-40231-01 x 71-40231N04 x 71-40231D02

45

45

12 Mth

N/A

45 N/A x 71-40245-03 x x 71-90124-01

45

45

56-20810-00

N/A

12 Mth

N/A

N/A x 51-71577-03 x 51-71578-03 x 51-71579-02

30

30

30 x 80-40842-10 x 80-40845-10 x 80-40846-10

30

30

30 x 21-92197-01 30

12 Mth

12 Mth

12 Mth

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

FIC

N/A

N/A

N/A

N/A

FIC

FIC

N/A

N/A

FIC

N/A

N/A

N/A

N/A

N/A

FIC

FIC

FIC

FIC

FIC

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

FIC

N/A

N/A

N/A

N/A

FIC

N/A

FIC

N/A

N/A

N/A

N/A

FIC




76

77

SPEAKER +CABLE

HEAT SINK FOR CPU

HEAT SINK MB02 NORTH

78

79 Module Bottom cover

1

1

BRIDGE 1

1

80

81

82

83

CASE BOTTOM 1

CASE PCMCIA DOOR 1

FRAME SLIDE PLT FOR

BATTERY 1

FRAME HDD

BRACKET(BOTTEN SIDE) 1

84

85

RUBBER FOOT

RUBBER CIRCLE

1

1

86 Metal-M Topcover Plat Thermal 1

87 MUDULE PALM-REST 1

8 F-CABLE MB05H SWITCH FPC 1

89

90

91

92

SW/ Board

GLIDE PAD KGDDFT014A

PLASTIC-M TOP COVER

METAL-M MB05H G/P

1

1

1

1

93 Module LCD TFT 15' HAN

94

1

LCD 15" MONITOR 15.0INCH

TFT XGA HAN 1

95

96

97

INVT /B 1

WIRE MB05H COAXIAL

CABLE15" HAN 1

CASE HINGE COVER 1

98

99

100

RUBBER LCD UPPER 1

LCD BEZEL 15" 1

LCD 15"Back Cover 1

101 Module LCD TFT 15" LG

102

1

LCD 15" TFT XGA LP150X05-

C2 LG 1

103

104

105

106

INVT/B 1

WIRE MB05H COAXIAL

CABLE15" HAN 1

CASE HINGE COVER 1

RUBBER LCD UPPER 1

107

108

LCD BEZEL 15" 1

LCD 15"Back Cover 1

109

110

HINGE_L_15"

HINGE_R_15"

1

1

111 Module LCD TFT 15" AU

112

1

LCD 15INCH TFT XGA

B150XG01-2 AU 1

113

114

INVT TBD141N TDK FOR

MB05H 1

WIRE MB05H COAXIAL

CABLE15" HAN 1

115

116

117

118

119

RUBBER LCD UPPER

LCD BEZEL 15"

LCD 15"Back Cover

HINGE_L_15"

HINGE_R_15"

1

1

1

1

1 x 21-20779-00 30 x 24-20705-00 30 x x

24-20687-00

30

80-40847-10

N/A x 24-45816-10 35 x 24-45817-10 35 x 24-52412-00 x 24-52403-00 x 24-84611-00

35

35 x 24-84569-00 35 x 80-50238-00 35 x

25-03559-00

N/A x 22-21321-00 35 x 51-71581-03 x 71-23017-00 x 80-40841-10 x 80-50233-00 x

35

35

35

35

56-10684-10

N/A x 71-10681-00 x 12-01614-01 x x 22-11144-00 x 24-45798-10 x 24-84515-00 x 80-40839-10 x 80-40840-10

60

30

30

30

30

56-10703-10

N/A x 71-10676-10 x 12-01614-01

60 12 Mth

60 12 Mth x 22-11144-00 x 24-45798-10 x 24-84515-00 x 80-40839-10 x 80-40840-10

60

30

30

30

30 x 24-84519-00 x x 24-84517-00

30

30

56-10707-00

N/A x 71-10726-00 x 12-01614-01 x 22-11144-00 x 24-84515-00 x 80-40839-10 x 80-40840-10 x 24-84519-00 x 24-84517-00

35

60

30

30

30

30

30

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

60 12 Mth

60 12 Mth

60 12 Mth

60 12 Mth

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A



FIC

FIC

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

FIC

FIC

N/A

N/A

N/A

N/A

N/A

N/A

FIC

FIC

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

N/A

1-119


120 POWER CORD (JAP)

121 POWER CORD (US)

122 POWER CORD (UK)

123 POWER CORD(EUR)

124 POWER CORD(Korea)

125

ADAPTOR 60W FIC DELAT

ADP-60NH

126 Keyboard(JAP)

127 Keyboard(US)

128 Keyboard(Canada)

129 Keyboard(UK)

130 Keyboard(Taiwan)

131 Keyboard(Korea)

132 Keyboard(France)

133 Keyboard(GR) x x x x x x x x x

1

1

1

1

1

1

1

1

1

1

1

1

1

1 x x x x x

22-30135-06

22-30135-15

22-30135-16

30

30

30

22-30135-17 30

22-301135-18

30

N/A

N/A

N/A

N/A

N/A

12-01618-02

35 12 Mth

71-31705-00

35 12 Mth

71-31705-01

35 12 Mth

71-31705-04

35 12 Mth

71-31705-05

35 12 Mth

71-31705-06

35 12 Mth

71-31705-07

35 12 Mth

71-31705-09

35 12 Mth

71-31705-11

35 12 Mth

FIC

FIC

FIC

FIC

FIC

FIC

FIC

FIC

FIC

N/A

N/A

N/A

N/A

N/A



FIC WB-B55 Service manual

FIC MB05W Service Manual

1.1 Introduction

1.2 Feature Highlights

FIC MB05 Service Manual

1-1

1-2 FIC MB05 Service Manual

FIC MB05 Service Manual

1-3

1-4 FIC MB05 Service Manual

Battery Handling

Category

Battery Charging

Max Change

Current:

1.7A-1.75A±150mA

Power On Li-ion

Power Off Li-ion

1

Li-ion

Save to RAM 1

Li-ion

CMOS Battery

Consumption power

Charge

Discharge

Maximum

Typical

3.5 h

3.5 h

4 h

1 Days

24 h

5 year

60W

30W

Remark

TBD

TBD

System on

System off

TBD

FIC MB05 Service Manual

1-5

1.3 System Configuration

Figure 1- 1 System Configuration Diagram

1-6 FIC MB05 Service Manual

1.4 Quick Tour of the Notebook

Figure 1- 2 The Front side of the Notebook

FIC MB05 Service Manual

1-7

s.

1-8 FIC MB05 Service Manual

Easy Buttons

Œ

•

Figure 1- 3 Easy Button

FIC MB05 Service Manual

1-9

Status LED Indicator

Œ

•

Figure 1- 4 Status LED Indicator

1-10 FIC MB05 Service Manual

Figure 1- 5 Front Side of the Notebook

.

Figure 1- 6 Rear Side of the Notebook

FIC MB05 Service Manual

1-11

1-12 FIC MB05 Service Manual

Figure 1- 7 Left Side of the Notebook

Figure 1- 8 Right Side of the Notebook

FIC MB05 Service Manual 1-13

Figure 1- 9 Under Side of the Notebook

1-14 FIC MB05 Service Manual

1.5 Notebook Accessories and System Options

1.6 System BIOS SETUP Program

FIC MB05 Service Manual

1-15

1-16 FIC MB05 Service Manual