New Generation of Solderability tester
RHESCA launched 5200T in the overseas solderability-testing world.
The year 2010 may mark the start of a new era for the solderability testing.
5200T is defining latest high performance solderability tester.
RHESCA CO., LTD. was established in 1955.
We have traceability experience of manufacturing testing instruments for electronic components for over 50 years in the word.
With previous good history of SAT-5100 and SAT-5000 models, RHESCA has now grown to become one of the leading companies in Japan
for solderability testers.
Features of 5200T
5200T robust solderability platform is renowned for its superior build
quality and exceptional performance.
5200T has been designed to integrate with the widest range of method
for solderability testing.
Our development is in a bid to lessen the burden of the users, and they
take a good repeatability. The unique design of the 5200T allows stateof-the-art performance without requiring study for solderability testing
We have 4 plus 1 method.
RHESCA has a broad range of analysis method suitable for our
solderability-testing systems.
Wetting Balance Method
Wetting Balance Method
Solder Globule Method
Rapid Heat Method
Temperature Profile Method
In conformity with international standard as follows,
• IEC 60068-2-54
• IEC 60068-2-69
• MIL STD 883
• JIS C 60068-2-69
• JIS C 60068-2-54
• JIS Z 3198-4
• JIS C 0099
• JEITA ET-7401
• JEITA ET-7404
• JEITA ET-7411
• User customs criterion
New electro microbalance:
We board on a new improved electro microbalance and controller in a
bid to lessen the burden of the users with improved auto zero balancing.
If appropriate balance weight is required, auto prompt display will notify
the users. This new electro microbalance has better response for wetting
force and able to perform good repeatability for the result. We achieved
success high resolution that the dynamic wetting force and time are
established down to 0.01mN resolution.
Solder Globule Method
Stand-alone and PC-based data manipulation:
We board on touch panel display for stand-alone full operation, which
can show the result of wetting force and time chart.
Magnetic clip hold:
Rapid Heat Method
We have improved sample clips using magnetic hold for good
repeatability by samples position.
The SAT/WET DATA ANALYSIS SYSTEM is the control and
data manipulate software for RHESCA s’ solderabilitytesting systems. The SAT/WET DATA ANALYSIS SYSTEM
allows simple operation via PC. Users can have selection of
languages between English, Chinese or Japanese.
The test mode select
Make the test file and data save including condition
Transfer the instruments’ condition and start/stop function from the PC
Take the data and shows wetting force to time chart, which can overlay,
zoom and average
• Automatic passes or fails judgment
• Report print out
Temperature Profile Method
This is conventional method for testing solderability between
molten solder and specimen. The wetting balance method,
primarily aimed at inspecting solderability of flow soldering, has
been used over 25 years.
In this method, a solder globule is used to cope with the difficulty
involved in the wetting evaluation between molten solder and
surface mount devices. We can support O.D. 4, 2 and 1mm
Aluminum globule blocks.
This method serves fast evaluation of solderability between surface
mount device and solder paste. At first a surface mount device is
brought into contact with a customized copper coupon that printed
with solder paste. They are then placed on molten solder, rapid
heated and the wetting curve determined.
At first, a surface mount device is brought into contact with a
customized copper coupon that printed with solder paste. Then
you can take the wetting force with temperature profile/gradient
by upper and lower heaters. You can make a temperature profile
flexible, which is similar to a reflow-soldering furnace. This method
helps to study condition for reflow soldering lines and to study the
flux effect. Nitrogen gas purge is available.
Reflow simulate Mode
This mode is simulating for reflow soldering and study for flux
activity. At first, a surface mount device or solder ball and printed
copper coupon set into appropriate position and going temperature
profile. Both sample and printed solder paste are heating by
upper and lower heater. After reflow temperature profiling which
sample put into solder paste and get the wetting force and time,
temperature chart.
5200T with PC
PC with monitor, Data manipulate software, USB cable
Kit (Clip A, B, C, 45 degree, 2 solder pod)
Certification of calibration
Data manipulate software, USB cable
Kit (Clip A, B, C, 45 degree, 2 solder pod)
Certification of calibration
Clip A
Clip B
Clip C
Clip 45 degree
Solder temperature
RT. to 400 degree
Size of solder pod
I.D. 60mm, 30mm depth
Range of analysis
10mN full scale and 50mN full scale
Dwell time
1 to 999sec, 1 to 999min
Immersion depth
0.01 to 1mm 0.01mm steps
1 to 20mm 0.1mm steps
Immersion speed
0.1 to 1mm/sec 0.1mm/sec steps
1 to 5mm/sec 0.5mm/sec steps
5 to 30mm/sec 5mm/sec steps
0.1% full scale (0.01mN at the 10mN full scale, 0.05mN
at the 50mN full scale)
Maximum spacemen weight
Power supply
220V 60Hz or 110V 50Hz
Power consumption
600W only main unit
Net weight
467(W)*475(D)*556(H) mm
We recommend preparing stable table for small sample analysis.
Solder globule block
Rapid heat unit
Temperature Profile unit
120fps CCD Observation system
Active isolation table
Temperature Profile unit
15-17,Hinohonmachi 1-chome Hino Tokyo
191-0011 Japan
TEL : +81-(0)42-582-4711
FAX : +81-(0)42-589-4686
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