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DDR1/DDR2/DDR3 HYNIX Module Ordering Information DDR1 1 2 3 4 5 6 7 8 9 HYM XX X XX X X X XX X 10 11 12 13 14 15 X X X X X X DDR2 1 2 HMP 3 4 5 6 7 8 9 10 11 12 X XX X X X X X X X XX XX DDR2 1 2 HYM 3 4 5 6 7 8 9 10 11 12 13 14 XX X XX X XX X X X X X X XX X DDR3 1 2 HMT 1 4 5 6 7 8 9 10 11 X XX X X X X X X X XX Memory Module : 3 DDR1 : HYM 8 Die Generation DDR2 : HMP DDR1 BLANK : 1st Gen DDR2 : HYM A : 2nd Gen DDR3 : HMT B : 3rd Gen C : 4th Gen 2 Component Group DDR2 Package Material DDR1 D1 - 128Mb DDR SDRAM D5 - 512Mb DDR SDRAM D2 - 256Mb DDR SDRAM DG - 1Gb DDR SDRAM Component Density DDR2 2 - 256Mb DDR2 SDRAM 1Gb DDR2 SDRAM 4Gb DDR2 SDRAM LPR- Leaded Lead Free (ROHS Compliant ) Lead Free & Halogen Free 512Mb DDR2 SDRAM (ROHS Compliant) 12Gb DDR2 SDRAM DDR2 Power Consumption 4Blank - Normal Component Group LLow Power DDR2 P2 : 256Mb DDR2 SDRAM 8K Ref./48Banks DDR3 Package Material P5 : 512Mb DDR2 SDRAM 8K Ref./48Banks LLeaded P1 : 1Gb DDR2 SDRAM 8K Ref./48Banks PLead Free (ROHS Compliant ) P3 : 2Gb DDR2 SDRAM 8K Ref./48Banks RLead Free & Halogen Free P4 : 4Gb DDR2 SDRAM 8K Ref./48Banks (ROHS Compliant) Component Density DDR3 5 - 512Mb 1- 1Gb 3- 2Gb 4- 4Gb 8- 8Gb 53- 9 Power Consumption Nomal LLow Power Component Organization DDR1 Blank - DDR2 4 - 6- x4 Based x6 Based 8- x8 Based 3 Power Supply & Interface DDR 1 BLANK : W: S: VDD 2.5V & VDDQ 2.5V DDR2 PRH- VDD 2.5V & VDDQ 1.8V VDD 1.8V & VDDQ 1.8V Memory Depth 32M 51- 512M 64- 64M 1G- 1G 12- 128M 2G- 2G 25- 256M 4G- 4G Power Supply & Interface Package Type Blank : FBGA Single Die FBGA Stak FBGA DDP (Dual Die Package ) FBGA DDP Stack DDR2 32- DDR2 Blank : VDD 1.8V & VDDQ 1.8V Memory Depth DDR3 16 - 16Mb 32 64 12 25 - 4 32Mb 64Mb 128Mb 256Mb 51 1G 2G 4G 8G- 521Mb 1Gb 2Gb 4Gb 8Gb 25511G2G- 256M 512M 1G 2G DDR3 16326412DDR2 8M 16M 32M 64M 128M Modules Type U : 240pin Unbuffered DIMM V : 240pin VLP Registered DIMM S : 240pin Unbuffered SO DIMM F : 240pin Fully Buffered DIMM with Full DIMM Heat Spreader L : 240pin Fully Buffered DIMM with Fully DIMM Heat Spreader Memory Depth 16 - 16M 32 - 32M 64 - 64M 12 - 128M 25 - 256M Module Type DDR3 U - F : FBGA Operating Temperature & Power Consumption DDR2 DDR2 CLEI- Commercial Temp2 & Normal P Commercial Temp2 & Low P Commercial Temp3& Lormal P Commercial Temp4 & Low P Package Material Blank : Normal PLead Free(ROHS Compliant) RLead & Halogen Free (ROHS Compliant) Operating Temperature & R : 240pin Registered DIMM E : 276pin Registered DIMM P : 240pin Registered DIMM with CMD/ADDR Parity DDR2 8 - x8 Based 10 Package Type DDR1 Blank : TSOP Memory Depth DDR1 8- Organization 4x4 Based 6x16 Based 51 1G 2G 4G - 512M 1G 2G 4G RV- 240pin Unbuffered DIMM 240pin Registered DIMM 240pin VLP Registered DIMM S- 204pin Unbuffered SO DIMM Power Consumption DDR3 CLEIA- Commercial Temp2 & Normal P Commercial Temp2 & Low P Extended Temp3& Lormal P Industrial Temp4& Normal Power Commercial Temp1 & 1.35VDD P 11 Package Stack DDR1 Blank : Single Die S: Hynix Stack K: M&T Stack J : Other Stack M: Hynix DDP Module Speed (Tcl-Trcd-Trp) DDR2 G7 DDR2-1066 7-7-7 S6 DDR2-800 6-6-6 S5 Y5 Y4 - DDR2-800 5-5-5 DDR2-667 5-5-5 DDR2-667 4-4-4 C4 - DDR2-533 4-4-4 E3 DDR2-400 3-3-3 Component Configuration DDR2 4 x4 Based 86- x8 Based x6 Based 5 Modules Type Speed (Tcl-Trcd-Trp ) DDR3-1600 9-9-9 PA - DDR3-1600 10-10-10 PB - DDR3-1600 11-11-11 H8DDR3-1333 8-8-8 H9 - DDR3-1333 9-9-9 DDR1 BLANK : 184pin Unbuffered DIMM DDR3 P9 - G : 184pin Registered DIMM M : 200pin SO DIMM R : 200pin Registered DIMM E : 208pin Registered DIMM HA G7 G8 S5 S6 - Data Width DDR2 6x64 7x72 Module Type DDR2 B - Fully Buffered DIMM DDR3-1333 10-10-10 DDR3-1066 7-7-7 DDR3-1066 8-8-8 DDR3-800 5-5-5 DDR3-800 6-6-6 12 Package Material Fully Buffered DIMM with Full DIMM Heat Spreader 276pin Registered DIMM DDR1 Blank : Normal 214pin Micro-DIMM P: Lead Free(ROHS* Compliant) 244pin Mini -DIMM R: Lead & Halogen Free 240pin Registered DIMM with (ROHS* Compliant) Command /Address Parity Module Options DDR2 FBDIMM1 Dx IDT AMB R - 240pin Registered DIMM S - 200pin SO-DIMM Ex NEC AMB U - 240pin Unbuffered DIMM Nx Intel AMB Data Width Other DIMM'S L0 Low Profile DDR3 6 x64 7x72 Module Revision DDR2 R Low Cost FEMNP- 6 Data Width DDR1 64- 72- x64 x72 LTDDR2 Die Generation DDR2 64 - x64 72 - x72 Die Generation 1st A - 2md B - 3rd C - 4th DDR3 M - 7 M- 1st D- 5th ABC- 2nd 3rd 4th EFG- 6th 7th 8th 13 Compnent Configuration DDR1 4- 6- x4 Based x16 Based 8- x8 Based AMB Vendor & Revision DEFG- 5th 6th 7th 8th DDR2 Nx - Refresh / Banks DDR1 1- Low Profile DDR2 667 SODIMM with Thermal Sensor 2- 4K Ref./2Banks 8K Ref./2Banks 35- 16K Ref./2Banks 4K Ref./4Banks 6- 8 Ref./4Banks 716K Ref./4Banks Package Type DDR2 FFBGA SDP ( Single Die Package ) P - FBGA DDP ( Dual Die Package ) H - FBGA QDP ( Quad Die Package ) 14 Ex Dx Cx Px - Intel NEC IDT ICS Inphhi Ax Mx - Infineon Micron Module Revision DDR1 Blank: Origianl A~H : Module Rev. M: Low Profile R : Low Cost J: N: U: K: DDR333 / 400 Unbuffered DIMM DDR400 Registered DIMM IBM System Regatta E4 DDR500 Unbuffered DIMM Die Generation DDR2 Blank - 1st Gen Speed DEFG- 5th Gen 6th Gen 7th Gen 8th Gen DDR2 S6 - A - 2nd Gen B - 3rd Gen C - 4th Gen Package Type DDR3 F : FBGA SDP (Single Die Packge ) M : FBGA DDP (Dual Die Package ) H: FBGA QDP ( Quad Die Package ) S5 Y5 Y4 C4 E3 - 15 DDR2-800 6-6-6 DDR2-800 5-5-5 DDR2-667 5-5-5 DDR2-667 4-4-4 DDR2-533 4-4-4 DDR2-400 3-3-3 Package Type DDR1 D5 : DDDR500 3-4-4 D4 : DDR400 3-4-4 M : DDR266 2-2-2 H : DDR266B 2.5-3-3 D43 : DDR400 3-3-3 J : DDR333 2.5-3-3 K : DDR266A 2-3-3 L : DDR200 2-2-2
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