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WiLink™ 7.0 single-chip WLAN,
GPS, Bluetooth® and FM solution
Product Bulletin
Key benefits
WiLink™ 7.0 single-chip connectivity solution
The WiLink™ 7.0 solution from TI is the first
complete hardware and software solution to offer
proven, carrier-quality mobile WLAN (mWLAN);
global positioning satellite (GPS); Bluetooth®; and
FM transmit/receive cores integrated into a single
This seventh-generation chip further extends the
capabilities of the WiLink product family to include
GPS location functions. Although the cores offer
robust performance individually, the WiLink 7.0
platform integrates the cores into a single-chip
solution, eliminating coexistence issues and saving
mobile-device manufacturers design time and
system cost.
New and robust user experiences will be realized
with the WiLink 7.0 solution. TI’s WiLink 7.0 platform supports the simultaneous operation of the
WLAN, GPS, Bluetooth, BLE, ANT and FM radio
to allow countless connectivity combinations
and enable the ultimate user experience. For
example, mobile-device users could determine
their current position with GPS, download a
related map over a WLAN connection, and listen
to an FM radio station over a Bluetooth headset
all at the same time. This is just one example of
the many multitasking opportunities the WiLink
7.0 solution enables for users.
WiLink™ 7.0 Solution
Host interface
Host clocks
Antenna interface
Antenna interface
WiLink 7.0 solution
Antenna interface
Antenna interface
• Industry’s first true single-chip mobile
WLAN, GPS, Bluetooth®, BLE, ANT and
FM transmit/receive solution.
• Implemented in 65-nm CMOS process,
- Total bill-of-materials (BOM)
reduction by sharing passive
components between connectivity
- 50 percent smaller form factor than
solution using the WiLink™ 6.0
solution and separate GPS chip.
• Proven carrier-quality connectivity
technologies to enhance the user
experience, with range-extended
mobile WLAN (mWLAN) (802.11a/b/g/n),
Bluetooth specification 3.0, FM
functional cores and enhanced GPS
- Supports Bluetooth low energy
- Extensible to the upcoming WiFi
direct specification
• Sophisticated Enhanced Low Power (ELP) technology from TI and Voice over WLAN
(VoWLAN) support, with on-chip
Unlicensed Mobile Access (UMA) and IP
Multimedia Subsystem (IMS) acceleration
for extended talk time and battery life.
• Optimized RF coexistence for
simultaneous operation of each
integrated connectivity function.
• Offers full support for Cisco Compatible
Extensions (CCX)
Bringing connectivity features previously found
only in high-end devices to the mainstream,
the WiLink 7.0 solution helps mobile-device
manufactures quickly and seamlessly bring
high-demand connectivity technologies into
mainstream products. These include smart
phones, mobile Internet devices (MIDs), portable
media players (PMPs), gaming devices and
personal navigation devices (PNDs).
WiLink 7.0 solution mitigates
coexistence challenges
As more radios are added to mobile devices,
RF coexistence performance is increasingly
important. The WiLink 7.0 solution includes
TI’s proven, robust coexistence platform, which
addresses system-wide interference issues that
impact radio designs and hardware/software
The WiLink 7.0 single-chip solution is manufactured in a 65-nm CMOS process to meet
the low-power, small-form-factor and low-cost
requirements of mobile-device manufacturers.
The single-chip implementation reduces OEM
product design risk and time to market by solving
RF coexistence problems on-chip.
TI leads the market in coexistence solutions
for Bluetooth and mWLAN technologies, with
more than 30 mobile devices currently using
TI’s coexistence technology. TI’s WiLink 7.0
solution eliminates the need for time-consuming
coexistence debugging to ease the integration
process and seamlessly bring the solution to
new product designs.
TI’s WiLink 7.0 platform is designed to work with
a variety of processors, including TI’s OMAP™
applications processor family.
WiLink 7.0 solution lowers risk with market
proven cores
Built upon seven generations of proven
technologies and legacy software resulting in
shipments of more than 400-million units to top
OEMS worldwide, this single-chip solution further
extends TI’s heritage of bringing technologies
previously seen in high-end devices to the
mass market.
WiLink 7.0 software development kit
The WiLink 7.0 software development kit
(SDK) included with the WiLink 7.0 platform is
optimized for mobile-device applications and will
help speed device manufacturers’ design cycle
times. The WiLink 7.0 SDK includes support
for Linux®, Windows® WinCE™ and Symbian™
operating systems, as well as lab testing and
manufacturing software. It is partitioned to
minimize host CPU loading and power
consumption in mobile applications.
For more information
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conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no
liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information
regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
The platform bar, WiLink and OMAP are trademarks of Texas Instruments. The Bluetooth word mark and logos are
owned by the Bluetooth SIG, Inc., and any use of such marks by Texas Instruments is under license. All other trademarks are the property of their respective owners.
© 2010 Texas Instruments Incorporated
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