Artesyn AXP1440

AXP1440

Installation and Use

P/N: 6806800H23J

July 2013

Embedded Computing for

Business-Critical Continuity

TM

Copyright

©

2009-2013 Emerson Network Power

All rights reserved.

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©

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, CompactPCI

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, AdvancedTCA

™

and the PICMG, CompactPCI and AdvancedTCA logos are registered trademarks of the PCI

Industrial Computer Manufacturers Group.

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Notice

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Contact Address

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USA

About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1 Platform Architecture. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

1.2 PICMG Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

1.3 Shelf Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

1.4 Network Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

1.4.1 Base Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

1.4.2 Fabric Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

1.4.3 IPMI Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

1.4.4 Update Channel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

1.5 Backplane and Component Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

1.6 Operating Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

1.7 Remote Management and Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

2 AXP1440 Shelf Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

2.2 Platform Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

2.3 Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

2.4 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

2.5 Shelf Ground Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

2.6 Backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

2.6.1 Functional Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

2.6.2 E-Keying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

2.6.3 Shelf FRU Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

2.6.4 Backplane Slot Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

2.6.5 Zone Locations on a Blade. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

2.7 IEEE802.3ap 10GBASE-KR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

2.8 Fan Tray Modules (FTMs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

2.9 Power Entry Modules (PEMs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

2.10 Stationary Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

2.11 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

2.12 WEEE Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

AXP1440 Installation and Use (6806800H23J)

3

3 Site Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.2 Site Planning Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.2.1 Receiving and Unpacking the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.2.2 Site and Installation Planning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

3.2.3 Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

3.2.3.1 Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

3.2.3.2 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

3.2.4 Dimensions and Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

3.2.5 Mounting Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

3.2.6 Airflow Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

3.2.7 Acoustic Noise Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

3.3 Site Planning Checklists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

4 AXP1440 Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4.2 Recommended Power-On Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4.3 Recommended Power-Off Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

4.4 Emergency Power-Off Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

4.5 Power Entry Module (PEM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

4.5.1 Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

4.5.2 IPMC Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

4.6 Fan Tray Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

4.6.1 Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

4.6.2 Cooling Budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

4.6.3 IPMC Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

4.7 Air Filter Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

4.8 Cleaning the Air Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

4.8.1 Storing the Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

5 AXP1440 Shelf Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

5.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

5.2 Shelf Physical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

5.3 Installation Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

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Contents

5.3.1 Equipment You Will Need . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

5.3.2 Rack/Cabinet Cooling Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

5.3.3 Mounting Options and Stabilization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.3.4 Weight Distribution Within a Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

5.3.5 Electrostatic Discharge (ESD) and Safety Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

5.4 Installing the Shelf . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

5.4.1 23" EIA Rack/Cabinet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

5.4.2 600mm ETSI Rack/Cabinet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

5.5 Grounding the Shelf . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

5.6 Shelf Ground Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

5.7 DC Power Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

5.8 Power Cable Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

5.9 Connecting the Cables to the PEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

5.10 Powering Up the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

5.11 Accessing the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

5.12 Upgrading Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

5.12.1 FTM IPMC Firmware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

5.12.1.1 FTM Upgrade Sample Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

5.12.2 PEM IPMC Firmware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

5.12.2.1 PEM Upgrade Sample Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

5.12.3 Shelf Manager Firmware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

5.12.3.1 Establishing Network Connectivity to the SAM . . . . . . . . . . . . . . . . . . . . . . . . . . 82

5.12.3.2 Update ShM Firmware on the SAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

6 FRU Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

6.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

6.2 Installing RTMs, Blades and SAMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

6.2.1 Module Installation and Removal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

6.2.1.1 Installing the RTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

6.2.1.2 Removing the RTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

6.2.2 Node Blade Installation and Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

6.2.2.1 Installing the Node Blade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

6.2.2.2 Removing the Node Blade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

6.2.3 Installing and Removing the Shelf Management Alarm Module . . . . . . . . . . . . . . . . . . . . 97

6.2.3.1 Non-Powered System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98


5

6.2.3.2 Powered System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

6.3 Unused Slots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

6.4 Installing Power Entry Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

6.4.1 Tools You Will Need . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

6.4.2 Removing the PEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

6.5 Upper and Lower Fan Tray Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

6.5.1 Removing the Upper FTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

6.5.2 Installing the Upper FTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

6.5.3 Removing the Lower FTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

6.5.4 Installing the Lower FTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

6.6 Replacing the Fan Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

7 Shelf Management Alarm Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

7.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

7.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

7.3 SAM Diagram and Face Plate Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

7.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

7.4.1 IPMB Connectivity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

7.4.2 RS-232 Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

7.4.3 Master-Only I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

7.4.4 Shelf FRU SEEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

7.4.5 SAM LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

7.4.5.1 Hot Swap LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

7.4.5.2 SAM/ADP Status LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

7.5 Management and Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

7.5.1 Hardware Monitoring and Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

7.5.1.1 Voltage Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

7.5.1.2 Temperature Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

7.5.1.3 Fan Speed and Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

7.5.2 Redundancy Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

7.5.2.1 Hardware Redundancy Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

7.5.2.2 HRI Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

7.5.2.3 Ethernet Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

7.5.3 Switchover Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

7.6 Telco Alarm Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

6


Contents

7.6.1 Telco Alarm Cutoff Push Button . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

7.6.2 Telco Alarm LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

7.6.3 Telco Alarm Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

7.7 Hot Swap Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

7.8 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

7.9 SAM Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

7.9.1 imls Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

A Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

A.1 Emerson Network Power - Embedded Computing Documents . . . . . . . . . . . . . . . . . . . . . . . . . 135

A.2 Related Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Sicherheitshinweise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149

Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161


7

8


List of Tables

Table 5-1

Table 7-1

Table 7-2

Table 7-3

Table 7-4

Table 7-5

Table 7-6

Table 7-7

Table 7-8

Table A-1

Table A-2

Table 2-1

Table 2-2

Table 2-3

Table 2-4

Table 2-5

Table 2-6

Table 2-7

Table 2-8

Table 2-9

Table 2-10

Table 3-1

Table 3-2

Table 3-3

Table 3-4

Table 4-1

Table 4-2

AXP1440 Shelf Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Slot Connector Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Backplane Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Slot Hardware Addressing for J10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Fan Tray Module Hardware Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

SAM and PEM Hardware Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

FTM LED Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

PEM LED Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

ADP LED Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Environmental Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Critical Temperature Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

System Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Dimensions and Weight of System and Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

PEM IPMB Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Cooling Budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

AXP1440 14-Slot Shelf Physical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

RJ-45 Serial Port Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

Alarm Display Panel (ADP) Serial Port Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

SAM LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Hot Swap LED States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

SAM LED Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

ADP LED Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Cooling Budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

Hot Swap Interface Pin Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Emerson Network Power - Embedded Computing Publications . . . . . . . . . . . . . . . . . . 135

Related Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136


9

List of Tables

10


List of Figures

Figure 5-2

Figure 5-3

Figure 5-4

Figure 6-1

Figure 6-2

Figure 6-3

Figure 6-4

Figure 7-1

Figure 7-2

Figure 7-3

Figure 7-4

Figure 1-1

Figure 1-2

Figure 2-1

Figure 2-2

Figure 2-3

Figure 2-4

Figure 2-5

Figure 2-6

Figure 2-7

Figure 2-8

Figure 2-9

Figure 3-1

Figure 3-2

Figure 3-3

Figure 3-4

Figure 5-1

Update Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Location of Zones 1, 2, and 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Front Shelf View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Rear Shelf View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Backplane Power Segments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Blade Slot Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Hub Slot Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Lower Fan Tray Module, Front View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Upper Front FTM, Front View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

PEM Backplane Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

PEM View with Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Rack Mounting Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Shelf Airflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Planning Checklist 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Planning Checklist 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Rack Mounting Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Shelf Airflow Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Placement of Grounding Lug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

DC Power Connection Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

SAM-1500R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Upper Rear FTM Ejector Handles and LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Lower Front FTM Ejector Handles and LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

Position of the Fan Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Block Diagram of SAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

SAM Face Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

SAM HRI Interconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Interhub Slot and Shelf Manager Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128


11

List of Figures

12


About this Manual

Overview of Contents

This Installation and Use manual is organized as follows:

Chapter

About this Manual

Safety Notes

Sicherheitshinweise

Platform Architecture

AXP1440 Shelf Description

Site Preparation

AXP1440 Operations

AXP1440 Shelf Installation

FRU Installation

Shelf Management Alarm Module

Related Documentation

Description

Lists all conventions and abbreviations used in this manual and outlines the revision history

Describes the safety information which has to be regarded

Translation of the chapter "Safety Notes" to German

Describes the system architecture

Provides an overview of the features of the system and lists the standard compliances

Provides site planning considerations and checklists, describes the requirements and conditions

Describes basic operating procedures

Describes mounting and installation options

Describes how to install and replace blades, modules, power components, fans, and air filter

Describes the shelf management alarm module

Lists related documentation and specifications

Abbreviations

This document uses the following abbreviations:

Abbreviation

10GBASE-BX4

AdvancedTCA

AMC

ANSI

ARP


Definition

The common name of the standard that defines 10 gigabit-per-second

Ethernet data link over eight pairs of copper: Four pairs for transmit and four pairs for received.

Advanced Telecom Computing Architecture

AdvancedTCA Mezzanine Card

American National Standards Institute

Address Resolution Protocol

13

14

GmbH

HA

HPI

HS

ID

IEC

EN

ESD

ETSI

FAE

FCC

FCU

FRU

FUMI

CISPR

CO

CPU

DC

DHCP

EMC

EMI

EMV

Abbreviation

ARTM

ATCA

AWG

BBS

CGL

CGM

Definition

AdvancedTCA Rear Transition Module

Advanced Telecommunications Computing Architecture

American Wire Gauge

Basic Blade Services

Carrier Grade Linux

Clock Generator Module

Comité International Spécial des Perturbations Radioélectriques

Central Office

Central Processing Unit

Direct Current

Dynamic Host Configuration Protocol

Electromagnetic Compatibility

Electromagnetic Interference

Elektromagnetische Vertraeglichkeit

European Norm

Electrostatic Discharge

European Telecommunication Standards Institute

Field Application Engineers

Federal Communications Comission

Firmware Upgrade Utility

Field Replaceable Unit

Firmware Update Management Instrument

Gesellschaft mit beschraenkter Haftung

High Availability

Hardware Platform Interface

Hot Swap

Identifier

International Electric Code


ROM

RTM

SAF

SCSI

SELV

ShM

OS

PCI

PEM

PICMG

PMC

RAM

RMCP

RoHS

IPMI

LED

MMC

NAE

NEBS

NEC

OEM

OOB

Abbreviation

IEEE

I/O

IP

IPM

IPMB

IPMC


Definition

Institute of Electrical and Electronics Engineers

Input / Output

Internet Protocol

Intelligent Platform Management

Intelligent Platform Management Bus

Intelligent Platform Management Controller

Intelligent Platform Management Interface

Light Emitting Diode

Mezzanine Management Controller

National Academy of Engineering

Network Equipment Building System

National Electric Code

Original Equipment Manufacturer

Out-of-band

Operating System

Peripheral Component Interconnect

Power Entry Module

PCI Industrial Computer Manufacturers Group

PCI Mezzanine Card

Random Access Memory

Remote Management Control Protocol

Restriction of Certain Hazardous Substances

Read-Only Memory

Rear Transition Module

Service Availability Forum

Small Computer System Interface

Safety Extra Low Voltage

Shelf Manager


15

TPE

UL

USB

VCCI

VLAN

WEEE

Abbreviation

ShMC

SNMP

SSH

SW

TDM

TNV-2

Definition

Shelf Management Controller

Simple Network Management Protocol

Secure Shell

Ethernet Switch

Time-Division Multiplexing

Telecom Network Voltages without overvoltage

Twisted-Pair Ethernet

Underwriters Laboratories

Universal Serial Bus

Voluntary Control Council for Interference

Virtual Local Area Network

Waste from Electrical and Electronic Equipment

Conventions

The following table describes the conventions used throughout this manual.

Notation

0x00000000

0b0000 bold

Screen

Courier + Bold

Reference

File > Exit

Description

Typical notation for hexadecimal numbers (digits are

0 through F), for example used for addresses and offsets

Same for binary numbers (digits are 0 and 1)

Used to emphasize a word

Used for on-screen output and code related elements or commands in body text

Used to characterize user input and to separate it from system output

Used for references and for table and figure descriptions

Notation for selecting a submenu

16


...

.

.

.

..

|

Notation

<text>

[text]



Description

Notation for variables and keys

Notation for software buttons to click on the screen and parameter description

Repeated item for example node 1, node 2, ..., node

12

Omission of information from example/command that is not necessary at the time being

Ranges, for example: 0..4 means one of the integers

0,1,2,3, and 4 (used in registers)

Logical OR

Indicates a hazardous situation which, if not avoided, could result in death or serious injury

Indicates a hazardous situation which, if not avoided, may result in minor or moderate injury

Indicates a property damage message

No danger encountered. Pay attention to important information

17

Summary of Changes

Order No.

Date

6806800H23A December 2008

6806800H23B May 2009

6806800H23C

6806800H23D

6806800H23E

April 2011

March 2012

6806800H23F October 2012

6806800H23G December 2012

6806800H23H April 2013

6806800H23J

October 2010

July 2013

Description

Initial Release

Added

Figure "Update Channel" on page 22

Updated

Figure "Backplane Power Segments" on page 30

Editorial changes

New layout

Changed all instances of Centrellis 4440 to AXP1440.

Added

Table "Hot Swap Interface Pin Out" on page 130

Editorial changes

Updated Declaration of Conformity . Product changed from Centrellis 4440 to AXP1440.

Updated

Backplane Power Segments

on page 30

,

Blade Slot

Connectivity

on page 35 ,and

Hub Slot Connectivity

on page

35

.

Updated

Standard Compliances

on page 41 . Updated

Figure 7-1 . Updated

Ethernet Signals

on page 127 .

Updated

System Installation

on page 139

and

Systeminstallation

on page 151

. Updated section

EMC

on page 138

and

EMV

on page 150

.

Updated

Figure 1-2 on page 23 .

Updated

Standard Compliances

on page 41 .

Updated

Receiving and Unpacking the System

on page 43

,

Mounting Options

on page 50 ,

Connecting the Cables to the

PEM

on page 73 ,

Accessing the System

on page 76 ,

Installing the Upper FTM

on page 107 , and

Installing the Lower FTM

on page 109

.

Updated

Figure 2-3 on page 30 .

18


Chapter 1

Platform Architecture

1.1

Description

The AXP1440 is designed as an open standard platform on which to run applications in the

Telecom Central Office environments. It combines existing PICMG standards featuring high speed serial data fabrics. These standards serve to streamline the architecture by eliminating the overhead of bridging, increasing payload, and eliminating the need for system and nonsystem slot blades. This is accomplished by using the Intelligent Platform Management

Interface (IPMI) and dual Ethernet star network which allows for communication between all node blades using Ethernet.

The AXP1440 is a high-availability platform with special locations for Shelf Management Alarm

Module (SAMs) and fourteen 8U x 280mm slots, fourteen 8U x 70mm rear transition modules,

Fan Tray Modules, (FTMs), and Power Entry Modules (PEMs).

1.2

PICMG Compliance

The AXP1440 is designed to be compliant with PCI Industrial Computers Manufacturer’s Group

(PICMG) specifications 3.0 and 3.1, and also provides support for PICMG 1.5.1 IPMI bus for system management.

1.3

Shelf Topology

Topology refers to the shape of a network, or the network's physical layout. The way that different nodes in a network are connected to each other and how they communicate are determined by the network's topology.’

The backplane of the AXP1440 uses a dual star topology that supports two independent networks. The dual star uses a point-to-point configuration with redundancy added for reliability. All devices on a star network are connected to a central connection point (hub).

Nodes communicate across the network by passing data through the hub slot, which on the

AXP1440 contains a switching function that forwards packets to the appropriate port based on the packet's address. Switching hubs support traditional Ethernet (10 Mbps), Fast Ethernet

(100 Mbps), and Gigabit Ethernet (1000 Mbps) ports.


19


1.4

Network Descriptions

This section describes the operational aspects of each of the shelf’s network designs, based on the Base and Fabric interfaces.

1.4.1

Base Interface

The blade slots are numbered physically from 1 to 14 going left to right along the front of the shelf. Each slot also has a "logical" slot number that defines it for backplane connectivity; logical slot numbers are not shown on the shelf. Please note that the slots will be referred to by their physical slot location.

The base hub slots (physical slots 6 and 9) have four pairs of 1000Base-T signals to node slots which form the dual star topology fabric. Each of the node slots support two base channel interface signals that connect to each hub slot. In turn, the channel 1 base interface of each hub slot is connected to the SAM. Each of the hub slots support a total of 14 base channels.

The hub slots require connectors P23 and P24. The base node slots require only connector P23.

1.4.2

Fabric Interface

The fabric interface supports point-to-point connections between AdvancedTCA blades. In the

AXP1440, these fabric connections are configured in a dual star topology that runs back to the hub slots. The AXP1440 system has Option 9 channel slots. These channels are aggregated at the hub slots into the dual-star topology. In this configuration, all node slots support one fabric channel to each of the two hub slots.The fabric channels are located on connector P20 of the node slots, and connectors P20, P21, P22, and P23 of the hub slots.

The implementation of the interface is indicated by the level of PICMG compliance a blade or hub is designed to. The AXP1440 supports the PICMG 3.1 fabric standard to allow for several configuration options that can provide greater bandwidth to certain slots in the shelf. The fabric interface switch supports: PICMG 3.1 Option 9 (10Gbps). The following figure shows the

AXP1440 shelf update channel connectivity.

20



A PICMG 3.1 compliant hub provides 10GBASE-BX4 to the fabric interface of a PICMG 3.1 compliant blade.

The fabric interface switch is also extended outside the AXP1440 shelf through eight external connectors on the RTM.

1.4.3

IPMI Network

The Intelligent Platform Management Interface (IPMI) is based on a redundant radial topology.

Redundant IPMI networks are supported by the Shelf Management Alarm Module (SAM) to manage the shelf resources.

The SAM is the center of the IPMI network; hubs are the center of the Base Interface network.

The SAM connects to all slots in the shelf and monitors and reports on the content of the

AXP1440. The SAM collects environmental data from sensors within the shelf and can assist high availability software to determine when a failover is necessary due to hardware removal or environmental changes, such as an over-temp condition.

The SAMs contain the Shelf Management Controller (ShMC) which polls all devices resident to the shelf and collects the FRU data records for all the components. The SAM also manages non-

IPMI devices for the shelf and performs environmental monitoring of the temperature and voltage. Using the PICMG 3.0 standard, the SAM is able to power off and reset slots for hot swap capability.


21


1.4.4

Update Channel Interface

The update channel interface consists of 10 differential pairs on the P20 connector. The physical layer and protocol used on this interface is application specific.

Figure 1-1 Update Channel

1.5

Backplane and Component Connectivity

The blade connectivity on the AXP1440backplane is divided among three zones, each with the following characteristics:



Zone 1 provides redundant, radial IPMI to all blade slots and redundant -48 VDC to all blade slots



Zone 2, the data transport interface, provides the dual star configuration for the base interface, dual star configuration for the fabric interface, update channel routing for all blade slots, and three redundant, bussed telecom clock signals to all blade slots

22





Zone 3 provides the PICMG 3.0 defined open area that is application specific

Rear Transition Modules connect directly with the connectors on the front-side blade and do not make the connection through the backplane.

Figure 1-2 Location of Zones 1, 2, and 3

Slot ID

Zone 3

Physical

Slots

RTM

I/O

Interface

1 2 3 4 5 6 7

P21

8 9 10 11 12 13 14

Zone 2

Synch Clock

Update Chnl

Fabric &

Base

Interface

Zone 1

Power

Distribution

& Shelf

Mangement

Slot ID

Logical

Slots

P20

P23

P24

J10

P20

P23

P20

P23

J10 J10

P20 P20 P20

P21

P20 P20 P20

P21

P20

P22 P22

P23 P23 P23 P23 P23 P23 P23

P20

P23

P20 P20

P23 P23

J10 J10 J10 J10 J10 J10 J10 J10 J10 J10

P20

P23

J10

13 11 9

SAM A

Shelf Management

Alarm Module

7 5 1

14 Slot Backplane

3 4 2 6 8 10 12 14

PEM A

Power Entry

Module

J20

J21

J22

J23

J24

P10

SAM B

Shelf Management

Alarm Module

Upper FTM

Fan Tray

Module

Lower FTM

Fan Tray

Module

PEM B

Power Entry

Module

1.6

Operating Systems

The AXP1440 comes installed with the following software;





Wind River PNE-LE-2.0

Enhanced Basic Blade Services (BBS)

For more information, contact your Emerson sales representative for other software products for your configuration.


23


1.7

Remote Management and Maintenance

The AXP1440 supports remote critical management and maintenance procedures. This eliminates the need for on-site maintenance personnel to handle routine maintenance tasks. A standard Telnet connection for remote access to networked functionality provides the ability to:





Upgrade IPMI firmware flashed on the SAMs, PEMs, FTMs, node and hub blades

Upgrade BIOS







Access in-service application software upgrades

Access IPMI event logs for performance monitoring

Access custom designed-in functionality or event logs

24


Chapter 2

AXP1440 Shelf Description

2.1

Overview

The AXP1440 Shelf supports 14 AdvancedTCA blade slots, of which 12 are I/O node slots that can be populated with task CPU processor blades, network processor blades, or any other blade designed for a specific application, and two slots for the system controller and switching blades. There are slot locations below the AdvancedTCA slots in the rear of the shelf for the two

SAMs (shelf management alarm modules). All slots comply with PICMG 3.0 for power distribution and form factor and use the PICMG 3.1 for Ethernet and Dual Star interface. The shelf’s other components include two Power Entry Modules (PEMs), one upper Fan Tray

Module (FTM), one lower FTM, and front and rear cable management trays.

2.2

Platform Features

The AXP1440 includes the following features:



14-slot card cage with 14 rear transition module (RTM) slots





Two Shelf Management Alarm Modules (SAMs)

Up to two PICMG 3.0 compliant System Controller and Switching blades









Two DC hot-swappable, 2N+1 redundant Power Entry Modules (PEMs)

Fan Trays Modules (FTMs), one upper tray and one lower tray

Front access service and installation of blades and lower fan tray

Rear access service and installation of RTMs, SAMs, upper FTM, and PEMs







Cable management, front and rear

Alarm Display Panel (ADP) for telco alarms located on the front of the chassis

Filler panels for front and rear slots


25


The following figure shows the location of each of the components in the AXP1440.

Figure 2-1 Front Shelf View

Alarm Display Panel

ACT B COMM A COMM B ACT B PWR MIN MAJ CRT ACO

ACT B COMM A COMM B ACT B PWR MIN MAJ CRT ACO

Cable

Management

Tray

26

FanTray



Figure 2-2 Rear Shelf View

FanTray

Backplane

Cable

Management

Tray

-48 VDC RTN

-48 VDC

OFF ON

ODS IS ODS

OFF ON

-48 VDC RTN

-48 VDC

OSS

IS

HS

OSS

IS

HS

-48 VDC RTN

-48 VDC

OFF ON

ODS IS ODS

OFF ON

-48 VDC RTN

-48 VDC

ESD

BOND

POINT

PEM 1

FEED B2/B4

Phy Slots:

8 to 14

Lower FTM

FTM-2

Circuit Breakers

FEED B1/B3

Phy Slots:

1 to 7

Upper FTM

FTM-1

SAM 1 SAM 2

FEED A2/A4

Phy Slots:

8 to 14

Lower FTM

FTM-2

Circuit Breakers PEM 2

Earth Ground

FEED A1/A3

Phy Slots:

1 to 7

Upper FTM

FTM-1


27


2.3

Enclosure

The AXP1440 shelf consists of a formed 13U sheet metal card cage with structure and support for the backplane, PEMs, FTMs, SAMs, and 14 card slots.

Figure 2-1 on page 26 provides a front

view of the shelf.

The enclosure mounts in a 600mm x 600mm ETSI frame relay rack or optional EIA 23" rack.

Mounting holes for bezel brackets are provided, which allows the use of power supply or card cage (customer designed) bezels. See Appendix A, Specifications for details on the physical characteristics of the enclosure.

2.4

Power Consumption

The following table shows the total power requirements for the shelf. Power consumption breakdown is shown in the next table.

Table 2-1 AXP1440 Shelf Power Requirements

Amps per Fan

AXP1440 Shelf without AdvancedTCA

Blades

Maximum Total Watts

850 Watts (assumes the shelf is configured with 2 SAMs, 2

PEMs, and all FTMs running at full speed.

2.5

Shelf Ground Configuration

The AXP1440 shelf was tested in the default configuration of logic ground and shelf ground connected and does not connect -48VDC Return with Shelf Ground. The AXP1440 platform has been tested in the default configuration and complies with safety and regulatory standards.

As a compliant AdvancedTCA shelf, the AXP1440 allows system integrators, at their own discretion, to remove the mechanism which connects Logic Ground to Shelf Ground and install the mechanism that connects -48VDC Return to Shelf Ground. If the system integrator exercises the option of removing the connections from Logic Ground to Shelf Ground and or adds the connection between -48VDC Return and Shelf Ground, the responsibility for maintaining compliance to CSA (C/US)/VDE safety requirements and EMI/RFI emission limits rests entirely with the system integrator and installer.

28



2.6

Backplane

The shelf backplane supports 2 hub slots, 12 node slots, and two SAMs. This AdvancedTCA backplane provides the IPMB and I

2

C bus interface signals from the shelf manager to all

AdvancedTCA blades and the other FRUs. The backplane provides signal routing for fail-over signals between active SAM and standby SAM. The power connectors for the power entry modules are located on the backplane. The backplane is not a Field Replaceable Unit (FRU).

2.6.1

Functional Layout

The backplane provides dual star base interface and dual star fabric interface connections at each blade slot with segmented power (two power segments) provided by the dual Power

Entry Modules (PEMs).


29


The blade slots are numbered physically from 1 to 14 going left to right along the front of the shelf. Numbers on slots 6 and 9 designate the hub slots. Each slot also has a “logical” slot number that defines it for backplane connectivity; logical slot numbers are not shown on the shelf. The backplane functional layout is shown in the following figure.

Figure 2-3 Backplane Power Segments

2.6.2

E-Keying

The AXP1440 supports the shelf management infrastructure with a process called E-Keying.

E-Keying replaces the mechanical connector keying method used in earlier backplane designs.

E-Keying prevents damage to blades, prevents misoperation, and verifies fabric compatibility.

E-Keying entries are present as FRU information in the shelf FRU and all blades present in the shelf. The E-Keying entries describe the Base Interface, Fabric Interface, Update Channel

Interface as implemented by the shelf and blades. E-keying allows blades that support different

PICMG 3 standards to be used in the same shelf.

30



More detailed information, such as connectivity and requirements for E-Keying can be found in

PICMG 3.0 R1.0 AdvancedTCA Specification and the AXP1440 Subsystem IPMI Programmer’s

Reference listed in

Appendix A, Related Documentation .

2.6.3

Shelf FRU Information

The SEEPROMs are located on the Alarm Display Panel (ADP); the FRU information for the PEM is contained in FRU 0. This information is accessed by using the standard IPMI FRU commands over the IPMC. Refer to the AXP1440 Subsystem IPMI Programmer’s Reference listed in

Appendix

A, Related Documentation .

The SAM queries all IPMCs during system startup to determine whether they are a source of shelf FRU information and then uses that information to complete initialization. The information is cached as FRU 254 on the active ShMC (0x20). The information in the SEEPROM is only needed when the SAMs are first inserted or when the shelf is powered on for the first time. The redundancy feature provides the shelf-specific information should one SEEPROM be nonfunctional.

2.6.4

Backplane Slot Connectors

The following table provides a summary of what resides on each of the slot connectors.

Table 2-2 Slot Connector Description

Connector

J10

P24

P23

P22

P21

P20

Slots 6 and 9 (Physical) Switches

Power, IPMB, Hardware Address

Base

Fabric and Base

Fabric

Fabric

Clocks, Update, Fabric

Slots 1-5, 7-8, 10-14 (Physical) Node

Power, IPMB, Hardware Address

N/A

Base

N/A

N/A

Clocks, Update, Fabric


31


32

The following table provides connector-specific information for the backplane slots.

Table 2-3 Backplane Connectors

Zone

3

2

Connector

1

N/A

P20

P21

P22

P23

P24

J10

SAM1_J1 and SAM2_J1

SAM1_J2 and SAM2_J2

PEM1_J1

FTM2_J1

FIB_J1

Where Used

Slots 1 through 14

Slots 6 and 9

Slots 6 and 9

Slots 1 through 14

Slots 6 and 9

Slots 1 through 14

SAM A and B

SAM A and B

PEM A and B

Lower Fan

FTM Interconnect

Quantity

2

2

2

14

14

2

2

14

2

1

1

Table 2-4 Slot Hardware Addressing for J10

8

9

6

7

10

4

5

2

3

Logical

Slot

1

4

2

1

3

6

7

5

11

9

Physical

Slot

13

44h

45h

46h

47h

HW

Address

41h

HA7

Gnd

HA6 HA5

Open Gnd

42h

43h

Gnd

Open

Open

Open

Gnd

Gnd

Gnd

Open

Open

Gnd

Open

Open

Open

Open

Gnd

Gnd

Gnd

Gnd

48h

49h

4Ah

Gnd Open Gnd

Open Open Gnd

Open Open Gnd

Gnd

Gnd

Gnd

Gnd

HA4

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

Gnd

HA3

Gnd

Gnd

Gnd

HA2

Gnd

Gnd

Gnd

Open Gnd

Open Gnd

Open

Gnd

Open Open Open

Open Open Gnd

Open Gnd

Open Gnd

Open Gnd

HA1

Gnd

HA0

Open

Open Open

Open Gnd

Gnd

Gnd

Open

Gnd

Open Open



Table 2-4 Slot Hardware Addressing for J10 (continued)

Logical

Slot

11

12

13

14

Physical

Slot

8

10

12

14

HW

Address HA7 HA6

4Bh

4Ch

Gnd

Open

Open

Open

HA5

Gnd

Gnd

4Dh

4Eh

Gnd

Gnd

Open Gnd

Open Gnd

HA4

Gnd

Gnd

Gnd

Gnd

HA3 HA2 HA1 HA0

Open Gnd Open Gnd

Open Open Gnd Open

Open Open Gnd Gnd

Open Open Open Open

Table 2-5 Fan Tray Module Hardware Addressing

Physical

Slot

Fan 1

Fan 2

1

2

HW

Address

Site

Type

04h

04h

HA7 HA6 HA5 HA4 HA3

Gnd

Gnd

HA2

Gnd

Gnd

HA1 HA0

Gnd Open

Open Gnd


33


Table 2-6 SAM and PEM Hardware Addressing

Physica l Slot

PEM 1

PEM 2

SAM 1

SAM 2

1

2

1

2

HW

Address

Site

Type

01h

01h

03h

03h

HA7 HA6 HA5 HA4 HA3 HA2 HA1 HA0

Gnd Open

Open Gnd

Gnd Open

Open Gnd

2.6.5

Zone Locations on a Blade

The backplane provides dual star Base Interface and dual star Fabric Interface connections at each slot with segmented power (four power segments) provided by the dual PEMs.



Zone 1 provides the system management and power interfaces, such as redundant

-48VDC power and IPMB





Zone 2, the data transport interface, provides the Base and Fabric interfaces, Update

Channels, and clock synchronization through the ZD connectors per front-side blade

Zone 3 provides the direct interconnect for user designated I/O

Rear Transition Modules connect directly with the connectors on the front-side blade and do not make the connection through the backplane.

34


Figure 2-4 Blade Slot Connectivity


Figure 2-5 Hub Slot Connectivity


35


2.7

IEEE802.3ap 10GBASE-KR

The AXP1440 backplane is designed to support 40Gb traffic through 10GBASE-KR. Currently, the Centellis 4440 platform core switch does not support this.

2.8

Fan Tray Modules (FTMs)

The AXP1440 supports 2 fan trays in a push/pull configuration. Each fan tray contains 6 dual counter rotating fans. The lower fan tray is accessible from the front of the chassis and contains the replaceable air filter. The upper fan tray is located in the rear of the chassis.

The FTM has a ejector handle which signals the IPM Sentry software for hot swap. If your system is not running high-availability software, behavior of the LED may be indeterminate.

The face plate of the upper and lower FTMs has the following indicators:

Table 2-7 FTM LED Status Indicators

FTM LED

In-Service (IS)

LED Color

Green

Out-of-Service (OOS) and Failure

Hot Swap (H/S)

Red (default)

Blue

State/Condition

Off: no service

Blink: FTM activating

Glow Steady: service available

Off: service available

Blink: Deactivation requested

Glow Steady: no service

Off: FTM is not ready to be removed


Glow Steady: FTM is ready to remove

36


Figure 2-6 Lower Fan Tray Module, Front View


Figure 2-7 Upper Front FTM, Front View

2.9

Power Entry Modules (PEMs)

The PEM is a Field Replaceable Unit (FRU) and can be replaced while the system is on, but the power for the PEM being replaced (PEM A or PEM B) must be shut down at the external source.

Replacement can take place in under 30 minutes by a trained service person.

For important information on removing power before replacing a PEM, refer to

Recommended

Power-Off Procedures

on page 56 and

Power Entry Module (PEM)

on page 57 .

The PEMs are accessible from the rear of the shelf and connect to the power entry module connectors on the backplane. A removable plastic housing covers the power feeds and returns to prevent accidental shorting. The PEM also features an injector/ejector handle that provides the hot swap mechanism for signalling the state of the PEM prior to removal.

Each PEM powers two separate power domains A and B and each domain supports two 80A power rails to supply power to the AdvancedTCA slots.


37


The PEMs are hot-swappable and will not cause a fault when one is removed for replacement.

Two PEMs are required to support 2N+1 redundancy. If your system is configured for redundant operation using two power feeds, they operate in load sharing where the total load is equal to or less than what one power feed can provide.

Figure 2-8 PEM Backplane Connectivity

Seated#

HA1

Logic_GND

Shelf_GND

SAM A

IPMB_A

SAM B

IPMB_B

Backplane

IPMC_PWR

Power Entry Module

-48v

-48v

-48v_RTN

+12V

7 ATCA

Slots

7 ATCA

Slots

FTM FTM SAM A SAM B

38



Each of the PEMS are equipped with two rocker type circuit breakers, three status LEDs, hot swap ejector handle, and a plastic cover that protects the dual stud terminal block. The rear of the PEM has two output connectors that mate with the backplane.

Figure 2-9 PEM View with Detail

OFF ON OFF ON

-48 VDC RTN

-48 VDC

-48 VDC RTN

-48 VDC

OOS IS HS

Table 2-8 PEM LED Status Indicators

Power LED

In Service

Color

Green

Out of Service (OOS) Red

Hot Swap (HS) Blue

State/Condition

Off: no service

Blink: PEM activating

Glow Steady: service available

Off: service available


Glow Steady: no service

Off: PEM is not ready to be removed


Glow Steady: PEM is ready to remove


39


2.10 Stationary Boards

There are four stationary boards in the shelf which are completely passive and are not field replaceable:









Backplane

Upper Fan Interconnect board, provides power and signaling from the backplane to the

FTM distribution board

FTM distribution board, provides the signal and power connections to the upper fan tray modules from the backplane

Alarm Display Panel (ADP), contains the shelf FRU SEEPROMs, teleco alarm indicators, and serial console ports for the SAM. The following table shows the ADP teleco alarm indicators:

Table 2-9 ADP LED Status Indicators

Alarm Display Panel LED

Critical alarm (CRT)

Major alarm (MAJ)

Minor Alarm (MIN)

Power (PWR)

LED Color

Red

Red

Yellow

Green

State

On

On

On

On

State/Condition

Active

Active

Active

Power Present

40



2.11 Standard Compliances

The AXP1440 AdvancedTCA platform complies with the safety and regulatory standards as shipped from the factory. It is possible to use this product with other components that produce a system not in compliance with system guidelines. Since Emerson cannot anticipate what equipment may be used with this enclosure or how it may be used, the responsibility for designing a system that conforms overall to the safety requirements, EMI/RFI emission limits, and other applicable standards rests entirely with the system integrator and installer.

Table 2-10 Standard Compliances

Standard

PICMG3.0 R1.0,

PICMC1.5.1

UL 60950-1

EN 60950-1

IEC 60950-1

CAN/CSA C22.2 No 60950-1

CISPR 22

CISPR 24

EN 55022

EN 55024

EN 300386

FCC Part 15

Industry Canada ICES-003

NEBS Standard GR-63-CORE

NEBS Standard GR-1089-CORE

ETSI EN 300 019 series

ETSI ETS 300 753

ETSI EN 300 132-2

Directive 2011/65/EU

Description

Defines mechanics, board dimensions, power distribution, power and data connectors, and system management.

Safety Requirements (legal)

EMC requirements (legal) on system level

(predefined Emerson system)

Environmental Requirements

Power requirements

The product has been designed to meet the directive on the

Restriction of the use of certain Hazardous Substances in electrical and electronic equipment (RoHS).


41


To fulfill the requirements of Telcordia GR-1089,R4-14, use Shielded Twisted Pair (STP) cables grounded at both ends to connect to the Ethernet ports.

For Declaration of Conformity, Refer: 4400 Series Declaration of Conformity

2.12 WEEE Compliance

To satisfy the requirements for marking electrical and electronic equipment in accordance with article 11 (2) of Directive 2002/96/EC, Waste from Electrical and Electronic Equipment (WEEE), Emerson includes a crossed-out bin symbol on all standard and noncustom chassis product. This marking fulfills the requirement set out by WEEE that a producer of an electrical or electronic appliance that bears their trade name and is put on the European Union market after 13 August 2005, places a clearly identifiable mark on the equipment and that this mark signifies that equipment is to be reprocessed or recycled using authorized recyclers and processes. This minimizes the disposal of unsorted municipal waste, achieves a high level of separate collection of WEEE, and ensures the environmentally sound disposal of electrical and electronic equipment placed on the market after 13 August 2005.

To dispose of equipment marked with the WEEE symbol, Emerson has contracted with certified companies that can reprocess this equipment per European Union requirements. Please visit the Emerson web site or contact your Emerson representative to find out who to contact and how to dispose of the equipment.

42


Chapter 3

Site Preparation

3.1

Overview

The following sections help you to prepare system installation:

Section

Site Planning Considerations

Site Planning Checklists

Gives Information On

This section includes information on unpacking and inspecting the system, requirements, technical data, and other information you need to know before you start system installation.

This section provides checklists for site preparation.

3.2

Site Planning Considerations

This section provides information to prepare the site and the shelf for installation.

3.2.1

Receiving and Unpacking the System

Carefully inspect the system and all components delivered together with it.

Personal Injury or System Damage

The system is heavy and if you carry it on your own you can hurt your back.

To prevent injury, keep your back straight and have two people lift the system or use additional lifting equipment.

Personal or System Damage

Unstable system installation in a rack can cause the rack to topple over.

Therefore, if your system is the only one in the rack, make sure to mount the system in the lowest part of the rack. If other systems are installed in one rack, start with the heaviest component at the bottom.

If the rack is equipped with stabilizing devices, make sure that they are installed and extended so that the rack is secure. Then proceed to mount or service the system.

Do not tilt the sytem forward or backward when removing it from the system package as the FRU ejector handles at the bottom could be damaged.


43


Damage of Circuits

Electrostatic discharge and incorrect RTM installation and removal can damage circuits or shorten their life.

Before touching the RTM or electronic components, make sure that you are working in an

ESD-safe environment.

Shipment Inspection

To inspect the shipment perform the following steps:

1. Verify that you have received all items of your shipment.

Compare the shipment thoroughly with the delivery note.

2. Visually inspect the shelf to ensure that all of the connector pins are straight, shrouds are properly seated, screws are tight, and so on.

3. Check the rails for proper alignment.

4. Check that the air filter is properly installed.

5. Check that the cable connections are secure and properly fitted.

6. Check the EMI gaskets for damage.

7. Check the items listed above for damage and report any damage or differences to the customer service at www.emersonnetworkpower.com/embeddedcomputing .

8. Tighten loose screws before proceeding.

44



9. Remove the desiccant bags delivered together with the system and dispose of them according to your country’s legislation.

10.Do not remove shipping frame stiffeners until positioning is complete and all bolts are fully tightened. Mounting without frame stiffeners may cause warping of the chassis.

The system is thoroughly inspected before shipment. If any damage occurred during transportation or any items are missing, please contact our customer's service immediately.

3.2.2

Site and Installation Planning

Planning basic site and installation requirements you have to consider the following issues:

1. Is adequate power for the AXP1440 system available?

2. Can the system be positioned in a way that -48 to -60V DC power source is easy to reach?

3. Are racks with sufficient space to install the system available?

4. Is suitable equipment available to lift the system into the rack?

5. Is there enough space to run a system console terminal? Is the cable long enough to reach the system?

6. Are the inlet and outlet of the fans and therefore the airflow not blocked?

3.2.3

Requirements

Before and during system installation and operation, you always have to ensure that the requirements listed in the following sections are met.

3.2.3.1

Environmental Requirements

To ensure proper function of the system, make sure that the environment in which the system is to be used fulfills the environmental requirements.


45


46

The environmental values must be tested and proven in the planned system configuration, that is, the delivered system and other third-party products you want to integrate.





Operating temperatures refer to the temperature of the air circulating at the air intake of the system and not to component temperatures.

Some of the climatic values may exceed the specification of some system components

(for example, hard disks). As Emerson cannot guarantee the functionality of third party products that are handled or operated out of their specifications, the environmental conditions may be limited to the specifications of these components.

The following table lists the environmental requirements.

Table 3-1 Environmental Conditions

Feature Operating

Temperature +5ºC (41°F) to +40ºC (104°F) (normal operation) according to NEBS standard

GR-63-CORE

-5°C (23°F) to +55°C (131°F) (exceptional operation) according to NEBS standard

GR-63-CORE

Temp. change +/-0.25°C/min according to NEBS standard GR-63-CORE

Relative humidity

Shock

5% to 90% non-condensing according to Emerson-internal environmental requirements

Half-sine, 11 ms, 30 m/s

2

Vibration

(tested in target platform)

Free fall -

Non-Operating (packed state)

-40°C (-40°F) to +70°C (158°F)

+/-0.25°C/min

0.1g from 5 Hz to 100 Hz and back to 5 Hz at a rate of 0.1 octave/minute

5% to 95% non-condensing according to Emerson-internal environmental requirements

Blade level packaging

Half-sine, 6 ms at 180 m/s

2

5-20 Hz at 0.01 g

2

/Hz

20-200 Hz at -3.0 dB/octave

Random 5-20 Hz at 1m

2

/s

3

Random 20-200 Hz at -3 dB/octave

300mm (11.8 in) (packaged)

25mm (1 in) (unpackaged) per GR-

63-CORE fully populated system



Table 3-1 Environmental Conditions (continued)

Feature

Noise

Operating

ETSI ETS 300 753 (October 1997)

Telecommunication equipment rooms

(attended): 7.2 bel

Measurement of "declared A-weight sound power level"

All values are applicable to normal operating conditions (~23°C).

-

Non-Operating (packed state)

NEBS GR-63-CORE, Issue 3

Telecommunication equipment rooms

(attended): 78 dB

Measurement of "declared A-weight sound power level"

All values are applicable to normal operating conditions (~27°C).





The ambient temperature around the shelf and the air inlet temperature must not exceed 55°C (131°F).

The AXP1440 system regulates the fan speed based on the temperature sensors present in the system. The fan speed is adjusted to the lowest speed which still keeps the evaluated temperature readings below or at their respective "upper non-critical threshold". Hence, the fan speed depends on the ambient temperature, blade design, temperature threshold settings, and system configuration.

To guarantee proper blade operation, you have to make sure that the temperatures at the locations specified in the following are not exceeded. If not stated otherwise, the temperatures should be measured by placing a sensor exactly at the given locations.

Table 3-2 Critical Temperature Limits

Component

Air inlet (system’s front)

Air outlet (system’s rear)

Temperature Limit

55°C (131 °F)

70°C (158 °F)


47


Table 3-2 Critical Temperature Limits (continued)

Component

Power entry module lug-plastic washer

Temperature Limit

70°C (158 °F)

>70°C (158 °F) and maximum 90°C (194 °F): the cables must be isolated and must be approved to be used in this temperature range.

>70°C (158 °F) and maximum 90° (194 °F): the service personel may touch the components: the cables must be isolated and the "hot surface" icon must be attached. The cables must be approved to be used in this temperature range.

3.2.3.2

Power Requirements

Make sure that a suitable -48VDC or -60VDC power source is within reach of the system. Two power entry modules (PEMs) can be installed in the system. The shelf may require up to 125 amps DC, through two 80 amp feeds. The required cable size for 80 amps is 4 AWG wire.

48


The system may be supplied by a TNV-2 voltage. This voltage is considered hazardous.

Make sure that the power supply unit meets the local safety standards.

Table 3-3 System Power Requirements

Feature Value

Rated voltage Input current -40VDC to -60VDC (SELV)

-60VDC to -72VDC (TNV-2)

125A

Operating voltage range -40.0 to -72VDC



When installing additional blades or modules, make sure that the power consumption of all installed modules does not exceed the system's maximum power dissipation.

3.2.4

Dimensions and Weight

The table below lists the dimenstions and weight of the shelf and system components.

The maximum weight of the system must not exceed 208 lbs.

Table 3-4 Dimensions and Weight of System and Components

Component

Shelf, including two fans, two PEMs, air filter

PEM

Upper Fan Tray Module

Lower Fan Tray Module

ATCA-F120

ATCA-F120-RTM

Dimensions w x h x d in mm

497 x 573 x 544

164 x 73 x 155

491 x 87 x 227

491 x 119 x 331

30 x 351 x 312

322.25 x 70

Weight

87.5 lbs.

3.7 lbs.

8.8 lbs.

13.4 lbs.

6.16 lbs.

1.54 lbs.


49


3.2.5

Mounting Options

You can simply operate the system on your desk or you can install it in a standard 23" rack.













During the course of handling, shipping, and assembly, pins, shrouds and mounting screws, fans and other items can become loose or damaged.

Do not operate a damaged shelf, this can cause damage to devices that interfere with it.

Do not remove shipping frame stiffeners until positioning is complete and all bolts are fully tightened. Mounting without frame stiffeners may cause warping of the chassis.

Always lift the chassis from the bottom/base of the chassis.

Do not lift chassis at the internal card cage.

Lifting at internal card cage may cause warping of the chassis and prevent proper insertion of blades products.

Do not lift chassis at the front upper fan tray or top front of chassis.

Lifting at these points may cause warping of the chassis and prevent proper EMI sealing or damage to the fan tray.

Grounding

To ensure the system is properly grounded, each of the system's parts contact the EMI gasket. The system contains gaskets at the shelf and module level.

The shelf is also fitted with ESD contacts. Please take care for proper ESD protection of the operator.

50



You have to keep in mind the following conditions when installing the system into a 600 mm

(23.62 inch) deep rack. The physical dimensions in the figure below are in millimeters.

Figure 3-1 Rack Mounting Dimensions

Cabinet

Door

3.5mm

to Door

Air Outlet at Back Side of Rear Door

25mm Thick

Door, 2X

13U Shelf Side View

3mm to Door

Air Inlet

75mm

550mm Inside, Door to Door

600mm Deep Cabinet

42mm

3.2.6

Airflow Requirements

The AXP1440 provides fault tolerant cooling to front-mounted AdvancedTCA blades and to rear transition modules based on one front and one rear maintainable intelligent fan trays with six fans per tray.


51


Fan trays are mounted in the shelf top and bottom. The figure below shows the general airflow for the system.

Figure 3-2 Shelf Airflow

Upper FTM

Outlet Plenum

Chassis

Exhaust

Air Flow

RTM

Chassis

Front

Chassis

Rear

Room

Ambient

Air Flow

PEM

Exhaust

Lower Front Air Intake

Lower FTMs

The cooling subsystem is compliant to CP-TA B.4. The cooling system provides for greater than

40 CFM for the front blade and 5.0 CFM for the RTM..

The actual cooling performance depends on the slot population and the heat sink design of installed blades and should be validated based on the used configuration.

The distance to other equipment must be sufficient to avoid an overheating of the system.

52



The cooling subsystem is designed to provide 31.1 CFM in the front and presence of any single cooling failure.

3.2.7

Acoustic Noise Control

The system can generate a lot of acoustic noise. This system has a built-in noise control due to the fan speed control. If the system is installed in an environment where the noise may be harmful to personnel being exposed to the noise during extended time periods, addititional protective measures should be considered.

3.3

Site Planning Checklists

The following table lists the tasks which you have to perform as plan the installation of the system.

Figure 3-3 Planning Checklist 1


53


Figure 3-4 Planning Checklist 2

54


Chapter 4

AXP1440 Operations

4.1

Overview

This chapter provides the basic operating procedures for the AXP1440. For software-specific information, or information regarding the operation of third-party or add-on components, please refer to the software or hardware product’s vendor documentation. You can refer to

Appendix A, Related Documentation for a collection of supporting manuals.

This chapter covers the following topics:





Recommended Power-On Procedures

Recommended Power-Off Procedures









Emergency Power-Off Procedures

Power Entry Module (PEM)

Fan Tray Modules

Air Filter Maintenance

4.2

Recommended Power-On Procedures

Procedure

Follow these steps to power-on your AXP1440.

1. Verify that all shelf modules and associated data and control cables are properly configured and installed. Make sure that all empty or unused slots contain an approved filler panel.

2. Enable DC power at each external source (branch circuit or power distribution unit).

3. Verify that the shelf configuration's current loads do not exceed 200W/slot for front-side blades, 25W/slot for RTMs, across the operating range of the equipment.

4. Push the circuit breakers to the ON position. They are located on the front of each

PEM.


55


4.3

Recommended Power-Off Procedures

Procedure

Follow these steps to shut down your AXP1440.

1. Shut down all software operations and the operating system. For shelves with independently running segments, each segment must be shut down.

2. Turn each circuit breaker on the front of PEM A and PEM B to the OFF position.

Step 2 removes the input power from the slots in the AXP1440 shelf only. It does not remove power to the PEMs. To remove power to these components, refer to the next step.

3. Disable the DC power at each of the external sources (branch circuit or power distribution unit) for both PEM A and PEM B.

4. This completely removes power from the shelf and its subassemblies.

4.4

Emergency Power-Off Procedures

Procedure

Read this caution and follow the next steps if it is necessary to remove power during an emergency situation.

Following this procedure will result in a loss of data and may cause damage to chassis components in a running platform. Use this method only when normal shutdown procedures cannot be followed.

56



1. Turn each circuit breaker on the front of PEM A and PEM B to the OFF position.

2. Disable the DC power at the external sources (branch circuit or power distribution unit) for PEM A and PEM B).

4.5

Power Entry Module (PEM)

This section discusses the operations of the Power Entry Module for the AXP1440 configurations.

4.5.1

Description

The AXP1440 has PICMG 3.0 compliant, dual PEMs and is rated for nominal -48VDC to

-60VDC. The PEMs plug directly into the midplane and deliver power to the backplane. Each input is rated for 80 amps. The two 80 amp feeds each power eight AdvancedTCA slots and the upper and lower FTMs. Each PEM also generates a separate +12V for redundant powering of the

SAMs. This voltage is distributed to each of these modules across the backplane.

Power conversion for the SAMs and PEMs consists of two 66 watt, +48VDC to +12VDC converters which distribute dual power busses of +12VDC to separate parts of the system. The

+12VDC outputs are provided on the backplane connector to the rest of the shelf. Power is redundant through the secondary PEM.

Removing power to these components cannot be accomplished by turning the PEM's circuit breakers to the OFF position. The PEMs remain powered until the -48VDC power to each

PEM is removed. Make sure you disconnect the power at the external source before removing the PEM from the shelf.


57


Power is introduced to the PEM using a DC power cable attached to the terminal blocks on the front of the module (power input cable and return cable). The terminal block consists of a dual stud connection which prevents the power cables from rotating and provides secure contacts for the cable lug. There is a plastic cover that protects the cable connections.

The DC power inputs must only be attached to approved Telephone Network Voltage (TNV) or Safety Extra Low Voltage (SELV) branch circuits. Branch circuits must comply with all requirements called for in these safety standards: IEC 60950, EN 60950, CAN/CSA-C22.2 No.

60950. Attaching inputs to non-TNV/SELV approved power sources will cause the system to fail compliance with safety regulations.

4.5.2

IPMC Circuitry

Each PEM is capable of monitoring voltage and circuit breaker status. The PEMs are loaded with the AdvancedTCA IPMC firmware. Preprogrammed FRU and Sensor Data Record (SDR) information reside on the PEM and is accessible from the SAM through the IPMB ports of the

PEM. In addition, the IPMC monitoring functions include digital inputs to detect circuit breaker trips, voltage sensors to detect backplane voltages, current sensors to detect current to the backplane, and on-board circuitry to detect failures on the PEM. The PEMs are managed by the

Sentry Shelf Management software. Refer to the AXP1440 Subsystem IPMI Programmer’s

Reference guide listed in

Appendix A, Related Documentation

for more information.

Table 4-1 PEM IPMB Addresses

Description IPMB Address

PEM A

PEM B

0x66

0x68

Figure 2-3 on page 30 provides a conceptual view of the connections between the PEMs,

backplane, FTMs, and SAMs.

58



4.6

Fan Tray Modules

This section discusses the operation of the Fan Tray Modules (FTMs) of the AXP1440.

4.6.1

Description

The FTMs are loaded with AdvancedTCA IPMC firmware. The fans are controlled as a group through the IPMI-based interfaces (IPMB) to the SAM. The IPMI interface is used for reporting faults, events, and status.The shelf manager software performs management of the FTM through the IPMB bus.The IPMC circuit provides temperature sensors for monitoring the temperatures of the FTM board components and for monitoring the inlet and outlet air temperature of the shelf. For further information, refer to the AXP1440 Subsystem IPMI

Programmer’s Reference guide listed in

Appendix A, Related Documentation .

The upper FTM receives its signal and power connections from the backplane through a FTM distribution board. A fan interconnect board connects the backplane to the FTM distribution board. The FTMs are powered from -48VDC from the backplane. The lower FTM receives its signal and power connections from the AdvancedTCA backplane. Only the lower FTM has an air filter frame and filter in the module.

The FTMs have variable speed fan control, which is dependent on the temperature readings in the shelf. Airflow rates can vary depending on the fan speed and payload. Fan speed levels are controlled from the SAM through the IPM shelf management software. The fan speed levels

change automatically based on temperature sensors. For more information, refer to

Fan Speed and Control

on page 122 .

The FTM has an ejector handle that interfaces with a mechanical switch to signal the software for hot swap. The handle and captive screws lock the FTM securely into the shelf. Each FTM is equipped with three status LEDs on the face plate. For removal and installation procedures for the FTMs, refer to

Chapter 6, FRU Installation .

In the event of a Fan/Filter Out-of-Service alarm, first check the fan filters (only on the lower

FTMs) to make sure the airflow is not obstructed. For information on the maintenance of air

filters, see


on page 61 .


59


4.6.2

Cooling Budget

The shelf cooling is designed to operate with the following temperature rises across the shelf.

This allows cards with these dissipations to operate with commercial grade components, 70C ambient temperature typical.

Table 4-2 Cooling Budget

Ambient Temperature

25C

40C

55C

Temperature Rise

Delta T = 20 C

Delta T = 15 C

Delta T = 10 C

The following guidelines can assist in determining the cause of the cooling failure. Also refer to

Environmental Requirements

on page 45 for important information regarding ambient

temperature requirements during servicing.

If a cooling failure occurs, the failure may be caused by a failed fan or possibly a clogged filter.

Check the filter first before replacing the FTM (see


on page 61 ).

For further information of nonrecoverable temperature events, refer to the FRU Information chapter in the AXP1440 Subsystem IPMI Programmer’s Reference.

4.6.3

IPMC Circuitry

Preprogrammed FRU and SDR information reside on the FTMs and is accessible from the SAM through the I

2

C bus. FRU information can be found in the AXP1440 Subsystem IPMI

Programmer’s Reference, listed in Appendix A, Related Documentation

.

60



4.7

Air Filter Maintenance

Air filters should be cleaned every 90 days or sooner, depending on the conditions of the

Central Office Environment. Because Central Offices vary in physical location and cleanliness, check your air filters every week after you first install your system. In a dusty environment, a filter may need cleaning more often than a filter in a cleaner environment. Check the filters frequently until you have a good idea of how often it needs cleaning. Based on your findings, establish a regular cleaning schedule and keep a log to record the date of each filter cleaning or replacement.

Air filters should also be checked occasionally to make sure they are not obstructed or damaged. Visually inspect filters for tears or rips. Do not reinstall a torn filter as it will be ineffective in trapping particulates and will interrupt air flow distribution. To maintain safety certification, use only Emerson approved fan filters. You can order replacement fan filters (part number RAF1440) by contacting your Emerson sales representative.

For replacement procedures, refer to

Replacing the Fan Filter

on page 109 .

4.8

Cleaning the Air Filter

To ensure the AXP1440 shelf operates properly, routine filter maintenance is required as discussed in


. Maintenance includes cleaning, replacing, and properly

storing the air filters.

Filter cleaning frequency depends on the environment the system is subjected to. The shelf filter requires routine cleaning to ensure effective filtration and airflow. To prevent air contamination from polluting the air filter and possibly obstructing the air intake of the system, the air filter should be replaced according to the schedule you have established based on your Central Office Environment as discussed in


.

Remove and inspect the filter for tears or damage before cleaning it. If the filter is torn or

damaged, discard the filter and replace it with a new one. Refer to

Replacing the Fan Filter

on page 109 if you need help.

If the filter is undamaged, proceed to clean it. There are several methods for cleaning the air filter.

1. Vacuum clean. A few passes of a vacuum cleaner can remove accumulated dust and dirt.


61


2. Oil-free compressor air. Point the compressed air nozzle in the opposite direction of the filter’s operating airflow (blow from the filter’s exhaust side toward the intake side).

3. Cold water rinse. Collected dirt is washed away using a standard hose nozzle with plain water. Ensure the filter is completely dry before returning to service.

4. Immersion in warm soapy water. Dip the filter in a solution of warm water and mild detergent. Then rinse the filter in clear water and let stand until completely dry before returning to service.

Before returning a filter to service, visually inspect it for tears or rips that may have occurred during cleaning. Do not reinstall a torn filter as it will be ineffective in trapping particulates and will interrupt air flow distribution. You may order replacement fan filters (part number

RAF1440) by contacting your Emerson sales representative.

4.8.1

Storing the Filter

The ideal storage condition for the air filter is a cool, dry, dark environment. High temperature, humidity, and ultraviolet light adversely affect the filter media (foam). Foam also degrades when exposed to solvents and sulfates, such as engine exhaust.

Controlling relative humidity between 40%-80% and temperature between 4.4°C - 32.2°C

(40°F - 90°F) yields an acceptable environment. Covering the filters with dark plastic keeps the foam dry and protects it from ultraviolet light. Purchase enough to keep adequate inventory for no more than a few months, filters could degrade under long term storage conditions.

62


Chapter 5

AXP1440 Shelf Installation

5.1

Overview

This chapter discusses mounting and installation options for the AXP1440 shelf.

The topics covered are:



Installation Prerequisites





Installing the Shelf

DC Power Cable













Connecting the Cables to the PEM

Grounding the Shelf

Shelf Ground Configuration

Powering Up the System

Accessing the System

Upgrading Firmware

5.2

Shelf Physical Characteristics

The following table provides the dimensions and weight of an equipped and unequipped shelf and rack mounting requirements.

Table 5-1 AXP1440 14-Slot Shelf Physical Characteristics

Characteristics

Size:

Weight:

Specifications

22.56 inches (57.3 cm) high, 13U

17.67 inches (44.88 cm) wide

21.06 inches (53.5 cm) with mounting flanges

21.51 inches (54.64 cm) deep with cable trays

Approximately 87.5 lbs (31.5 kg) base integrated platform

Base platform: 2 shelf managers, 2 PEMs, 1 upper FTM, 1 lower FTM

(no payload blades)


63


Table 5-1 AXP1440 14-Slot Shelf Physical Characteristics (continued)

Characteristics

Rack Mounting:

Specifications

Per ETSI 600mm x 600mm ETSI frame on integrated front frame mounting ears.

Frame mounting brackets are required for a 23" EIA frame. Rear mounting brackets are recommended in both instances for Central Office

Environment.

Each shelf requires 13U of space and effectively takes up 13U when mounted in a rack. Three shelves can fit in a 40U telecom rack, which leaves 1U remaining.

Cable management trays are available for the front and the rear of the shelf.

5.3

Installation Prerequisites

This section describes the prerequisites required for installation.

5.3.1

Equipment You Will Need

You will need the following to install the AXP1440 14-slot shelf into an approved EIA 23" or

600mm x 600mm ETSI frame:





Torque wrench

Nut driver with 7/16mm socket











Multimeter

Phillips head screwdriver, #1

Front mounting brackets for an EIA 23" frame (shipped with your AXP1440)

AdvancedTCA PEM Service Kit, PN 6706808A01 (shipped with your AXP1440)

Right-angle Cable Lug Kit, PN 6706808A01 (shipped with your AXP1440)

64



5.3.2

Rack/Cabinet Cooling Guidelines

It is important to have sufficient open space at the front and rear of the shelf when installed in a rack or cabinet. Depending on whether the enclosure has solid or vented doors will determine the recommended open space required. Follow these guidelines for positioning the shelf to allow for the optimal open space for the shelf air inlet and shelf air exhaust.

Do not obstruct the ventilation openings at the top, sides and back of the shelf.

Figure 5-1 Rack Mounting Dimensions

Cabinet

Door

3.5mm

to Door

Air Outlet at Back Side of Rear Door

25mm Thick

Door, 2X

13U Shelf Side View

Air Inlet

75mm

550mm Inside, Door to Door

600mm Deep Cabinet

42mm


3mm to Door

65


Figure 5-2 Shelf Airflow Diagram

Upper FTM

Outlet Plenum

RTM

Chassis

Exhaust

Air Flow

Chassis

Front

Chassis

Rear

Room

Ambient

Air Flow

PEM

Exhaust

Lower Front Air Intake

Lower FTMs

5.3.3

Mounting Options and Stabilization

The AXP1620 is designed to be mounted in an equipment rack while maintaining conformance to the NEBS 24" deep lineup and the ETSI 600mm deep lineup standards for telecommunication equipment. For increased stability, we recommend that the rack is securely mounted to the floor, or if using stabilizing devices make sure they are installed and extended.

66



5.3.4

Weight Distribution Within a Rack

To avoid personal injury or damage to the equipment, plan your installation so that (within the limitations of equipment and cabling):

The weight of the equipment is evenly distributed in the rack.

The heaviest units are mounted nearer the bottom of the rack.

Uneven mechanical loading of the rack may cause toppling.

ESD

5.3.5

Electrostatic Discharge (ESD) and Safety Procedures

Emerson strongly recommends that you use an antistatic wrist strap and a conductive foam pad when installing or upgrading a shelf. Electronic components, such as disk drives, computer boards, and memory modules, can be extremely sensitive to electrostatic discharge (ESD).

After removing the component from its protective wrapper or from the shelf, place the component flat on a grounded, static-free surface (and, in the case of a blade, component side up). Do not slide the component over any surface.

If an ESD station is not available, you can avoid damage resulting from ESD by wearing an antistatic wrist strap (available at electronics stores) that is attached to an active electrical ground. Note that a shelf may not be grounded if it is unplugged.

There is one earth ground located at the back of the shelf.

There are three ESD bonding points, two on the front and one on the back of the shelf.


67


5.4

Installing the Shelf

The AXP1440 can be mounted in a 23" EIA or 600mm ETSI frame using front mounting brackets. Using rear mounting brackets is recommended for all frame types when installed in a Central Office Environment. Front or rear mounting brackets are not shipped with this product. For assistance with the acquisition or design of mounting brackets for your particular application, please contact your Emerson representative.

Do not mount a single shelf at the top of the rack. A top-heavy rack can tip, causing damage to equipment and injury to personnel.

Do not use the FTM handles or PEM handles for lifting the shelf.

Make sure you have the appropriate equipment to safely lift and mount the shelf securely.

To avoid personal injury or damage to the equipment, use two persons for the the installation procedure.

5.4.1

23" EIA Rack/Cabinet

Installation

Front mounting brackets are required to attach the shelf to an EIA 23" frame.

1. Locate the standard mounting hole and slot locations on the front mounting flanges on the

AXP1440

shelf.

2. Fasten the mounting brackets to the back side of the front chassis flanges using M6 screws x 12mm at each of the 5 locations.

3. Be sure to mount the shelf with metal screws or bolts that give a good electrical connection between the screws or bolts and the mounting surface.

68



4.

Tighten all screws using a torque setting of 35.5 to 38.5 inch-pounds.

Failure to observe proper grounding practices may cause a variety of noise, electrostatic discharge, and RFI (Radio Frequency Interference) problems.

5.4.2

600mm ETSI Rack/Cabinet

Installation

The shelf mounts directly from the integrated flange on the front of the shelf.

1.

Locate the standard mounting hole and slot locations on the front integrated mounting flanges on the

AXP1440

shelf.

2. Fasten the mounting brackets to the back side of the front chassis flanges using M6 screws x 12mm at each of the 5 locations.

3. Be sure to mount the shelf with metal screws or bolts that give a good electrical connection between the screws or bolts and the mounting surface.

4.

Tighten all screws using a torque setting of 35.5 to 38.5 inch-pounds.

Failure to observe proper grounding practices may cause a variety of noise, electrostatic discharge, and RFI (Radio Frequency Interference) problems.


69


5.5

Grounding the Shelf

Use a 2 AWG wire with a 2-hole copper lug and connect directly to the earth ground point located on the right side of the back of the shelf; connect the other end of the wire to a reliable earth ground. Use the torque setting required by the connector supplier. The 2-hole lug prevents rotation of the lug and ensures a permanent bonding of ground to the shelf.

Figure 5-3 Placement of Grounding Lug

Back of Shelf

15

4437 0706

5.6

Shelf Ground Configuration

The AXP1440 shelf was tested in the default configuration of logic ground and shelf ground connected and does not connect -48VDC Return with Shelf Ground. The system has been tested in the default configuration and complies with safety and regulatory standards. As a compliant AdvancedTCA shelf, the AXP1440 allows system integrator at their own discretion to remove the mechanism which connects Logic Ground to Shelf Ground and install the mechanism that connects -48VDC Return to Shelf Ground. If the system integrator exercises the option of removing the connections from Logic Ground to Shelf Ground and or adds the connection between -48VDC Return and Shelf Ground, the responsibility for maintaining compliance to CSA (C/US)/VDE safety requirements and EMI/RFI emission limits rests entirely with the system integrator and installer.

70



5.7

DC Power Cable

Power is introduced to the shelf through redundant DC PEMs. The recommended power cable is an 4 AWG gauge that meets the specifications for this shelf. There are four lugs for each PEM.

Two are straight and the other two are custom offset lugs. The end that connects to the external DC power source should be equipped with an 8mm terminal.

Always check with your local building authorities for wire sizing requirements for your environment.

The installation must comply with the 1993 National Electric Code (NEC) and other applicable codes.

The DC power inputs must only be attached to approved Telephone Network Voltage (TNV) or SELV (Safety Extra Low Voltage) branch circuits. Branch circuits must comply with all requirements called for in these safety standards: IEC 60950, EN 60950, CAN/CSA-C22.2 No.

60950. Attaching inputs to non-TNV/SELV approved power sources will cause the system to fail compliance with safety regulations.

The ground wire must be connected to a reliable earth ground connection to comply with

Class 1 Equipment requirements.

Multiple power sources are present.

Service only by qualified service personnel.

Mehrfache Energiequellen.

Handhabung nur durch geschultes Personal.

Des sources multiples de pouvoir sont présentes.

L'entretien de cet équipement doit être effectué par du personnel de service qualifié.

Wire

Earth Ground

Input power

Return


Signal

PE GND (Primary Earth Ground)

-48VDC nominal to -60VDC

-48VDC RETURN

71


Figure 5-4 DC Power Connection Detail

OFF

ON

VDC RTN

-48 VDC

-48 VDC RTN

-48 VDC

OFF

ON

72



5.8

Power Cable Termination

Custom lugs are used with large gauge wires for up to 80 AMPs DC (4 AWG) when connecting to the PEM. These are shipped with the product.The lugs are angled to allow the cables to be dressed below the cable management tray, thus protecting the circuit breakers from accidental tripping.

Terminating this lug is identical to terminating standard lugs. To minimize shorting of the terminals, the lugs must be insulated according to the following illustration.

Heat shrink should be placed as close to the hole as possible (0.15") apart. The heat shrink tube should be cut approximately at a 30° angle.

5.9

Connecting the Cables to the PEM

In a redundant configuration, each PEM must be connected to a separate DC power source. The

2 separate inputs on a single PEM should be connected to the DC same source. Power is introduced to each PEM’s terminal block on the front of the module (power input cable and return cable). The lugs provide secure contact for the cable and prevent the power cables from rotating. A plastic housing covers the power feeds and returns and is attached with one screw.

Refer to Figure "DC Power Connection Detail" on page 72 for detail.

To cable a dual breaker DC system, read all cautions and warnings, properly ground the equipment by following the procedure in


on page 70

, and follow these steps. This procedure assumes that the PEMs are preinstalled in the shelf.


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Procedure

Have the following tools on hand before you begin these steps: standard Phillips screwdriver, nut driver, torque wrench, multimeter, and lug kit.

1. Locate the target power input cable’s terminals at the branch circuit or power distribution unit. Open the external circuit breakers that provide DC feed power to the PEM.

2. Lock and tagout the circuit breakers on the branch circuit or power distribution unit.

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Cables may or may not be preinstalled at the branch circuit or power distribution unit.

If the DC power cables are not connected to the branch circuit or power distribution unit, connect the power cables to the PEMs before connecting the DC power cables to the external power source.

If the DC power cables are connected to the branch circuit or power distribution unit, a qualified service person must confirm that the power to the cables is terminated (off) before continuing the steps to attach the cables to the PEMs.

In either case, use a multimeter to check the PEM end of the terminals to confirm there is no power present.

3. Using the appropriate tool, carefully remove the plastic covering over the terminal blocks.

4. Confirm that there is no power to the PEM lug bolts. Using a multimeter, measure between the two lugs and then measure between the chassis ground and each lug.

If the DC potential is 3.0VDC or less, then power is not present.

5. Attach the DC power cables (input and return) to the dual lug bolts on each PEM.

6. Using a torque wrench, tighten the nuts with a recommended torque setting of

35.5 to 38.5 inch-pounds. Make sure all DC leads are fastened securely.

7. Replace the plastic cover over the terminal blocks.

8. Verify that the circuit breakers are in the ON position.



9. Break the tagout or lockout seals on the branch circuit or power distribution unit.

10.Apply power by closing the branch circuit or power distribution unit.

The OOS indicator LED will glow solid red and the other LEDs will go dark. The OOS will not go dark and the IS indicator LED will not illuminate until the external power circuit breakers are closed.

11.Verify that all FRU LEDs illuminate and the PEM’s IS LED is green, and the OOS LED is dark.

5.10 Powering Up the System

With the installation cabled up, you are ready to apply power to the system.

Cover all open module slots and put all approved filler panels in place before turning on power. This is necessary to properly cool the chassis and to avoid electrical shock and other possible hazards. Slot covers and panels must remain in place during system operation.

Procedure

Follow these steps to power up the system:

1. Push the PEM circuit breakers to the ON position.

2. Verify that all FRU LEDs illuminate and the PEM’s In Service LED is green.

The system executes its normal start-up routine and is then ready to use.


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5.11 Accessing the System

You can access your system using the SAM shelf manager. The SAM-1500 direct serial console connector (back of chassis) is an RJ45 connector on the SAM face plate. This connector is configured as DTE. The indirect serial console connector (front of chassis, located on the ADP) is a 9-pin micro-D subconnector. Configure your console or terminal emulation software using the parameters: baud rate 9600, data bits 8, parity None, stop bits 1, flow control None. For default user name and password, contact your Emerson’s sales representative.

Custom cables are required for these connectors. Refer to

RS-232 Serial Interface

on page 118

for pin assignments.

5.12 Upgrading Firmware

Upgrading firmware on the AXP1440 shelf involves the following components:







IPMC firmware on the two Fan Tray Modules (FTMs)

IPMC firmware on the two Power Entry Modules (PEMs)

Shelf Manager firmware (including an FPGA image) on the two SAMs

5.12.1 FTM IPMC Firmware Upgrade

There is a single IPMC firmware image common to the two FTMs in the AXP1440. The FTM

IPMCs are assigned IPMB addresses 0x56 and 0x58.

Different upgrade image variants are generated as part of the release, but only one file is required for the normal field upgrade process. This file is ftm14x0_hpm1fw.img. As upgrades are released, Emerson will supply the current version of this file

The upgrade process described here uses a script named upgradeftm, which is supplied on shelf managers starting with build 4.1.0-3.

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Upgrade Process Steps

Follow these steps to upgrade the FTM firmware:

1. Copy the ftm14x0_hpm1fw.img file to the /tmp directory on the active Shelf

Manager.

The /tmp directory on the shelf manager is mounted to ram; this copy of the file will be deleted on the next reset of the shelf manager. If you want to save the file to flash, copy it to the /var/nvdata directories on both shelf managers.

2. Execute the following command to upgrade the upper FTM:

upgradeftm upper /tmp/ftm14x0_hpm1fw.img

3. Repeat the command to upgrade the lower FTM:

upgradeftm lower /tmp/ftm14x0_hpm1fw.img

4. After a successful upgrade, the upgradeftm script displays the current firmware level reported by the device as shown in

FTM Upgrade Sample Output

on page 77

.

5. If necessary, it is possible to revert to the previous firmware version using a command of the form:

upgradeftm upper | lower rollback

5.12.1.1 FTM Upgrade Sample Output

The sample output for these commands for one FTM is shown below.

# upgradeftm upper /tmp/ftm14x0_hpm1fw.img

Upgrading...

ipmitool_v0.9 -H 192.168.24.11 -t 0x58 -U openhpi -P openhpi hpm \

upgrade /var/nvdata/ftm14x0_hpm1fw.img

PICMG HPM.1 Upgrade Agent 0.4:


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Validating firmware image integrity...OK

Performing preparation stage...OK

Target Product ID : 95

Target Manufacturer ID: 161

Performing upgrade stage:

Upgrading H8S-ATCA F/W

with Version: Major: 1

Minor: 8

Aux : 000 000 000 000

Firmware size : 171840

Writing firmware: 100% completed

Firmware upgrade procedure successful ipmitool returned 0.

Activating...

ipmitool_v0.9 -H 192.168.24.11 -t0x56 -U openhpi -P openhpi hpm activate

PICMG HPM.1 Upgrade Agent 0.4: ipmitool returned 0.

/bin/upgradeftm: Upgrade and activate complete.

Verify firmware version: clia ipmc -v 0x56

Pigeon Point Shelf Manager Command Line Interpreter

58: Entity: (0x1e, 0x60) Maximum FRU device ID: 0x00

Hot Swap State: M4 (Active), Previous: M3 (Activation In Process), Last

State Change Cause: Normal State Change (0.0)

Device ID: 0x00, Revision: 0, Firmware: 0.00 (ver 0.0.0), IPMI ver 0.0

Manufacturer ID: 000000, Product ID: 0000, Auxiliary Rev: 00000000

Device ID String: "FTM14x0"

Global Initialization: 0xc, Power State Notification: 0xc, Device

Capabilities: 0x29

Controller does not provide Device SDRs

Supported features: 0x00

5.12.2 PEM IPMC Firmware Upgrade

There is a single IPMC firmware image common to the two PEMs in the AXP1440. The PEM

IPMCs are assigned IPMB addresses 0x66 and 0x68.

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The file containing the firmware image is pem1620.img. As upgrades are released, Emerson will supply the current version of this file.

The upgrade process described here uses a script named upgradepem, which is supplied on shelf managers starting with build 4.1.0-3.

Upgrade Process Steps

Follow these steps to upgrade the PEM firmware:

1. Copy the pem1620.img file to the /tmp directory on the active Shelf Manager.

The /tmp directory on the shelf manager is mounted to ram; this copy of the file will be deleted on the next reset of the shelf manager. If you want to save the file to flash, copy it to the /var/nvdata directories on both shelf managers.

2. Execute the following command to upgrade one PEM: upgradepem pem1 /tmp/pem1620.img

3. After a successful upgrade, the upgradepem script displays the current firmware level reported by the device as shown in

PEM Upgrade Sample Output

on page 79 .

4. Repeat this command to upgrade the other PEM: upgradepem pem2 /tmp/pem1620.img

5.12.2.1 PEM Upgrade Sample Output

The sample output for this command for one PEM is shown below.

# upgradepem pem1 /tmp/pem1620.img

Upgrading...

upgradefw -I /dev/i2c5:0x66 /tmp/pem1620.img

BMR-AVR firmware upgrade utility. Pigeon Point Systems (c) 2004.


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Upgrade interface: IPMB, device: /dev/i2c5, options: 0x66

Firmware upgrade image: /tmp/pem1620.img

Preparing Master AVR for programming .................. OK

Programming 39703 bytes to Master AVR at 000000 ... 100%

Preparing Slave AVR for programming ... OK

Programming 7008 bytes to Slave AVR at 000000 ... 100% upgradefw returned 0.

/bin/upgradepem: Upgrade complete.

Verify firmware version:

# clia ipmc -v 0x66

Pigeon Point Shelf Manager Command Line Interpreter

66: Entity: (0xa, 0x60) Maximum FRU device ID: 0x01

PICMG Version 2.1

Hot Swap State: M4 (Active), Previous: M3 (Activation In Process), Last

State Change Cause): Normal State Change (0x0)

Device ID: 0x01, Revision: 0, Firmware: 1.03 (ver. 1.0.3), IPMI ver 1.5

Manufacturer ID: 0000a1, Product ID: 005e, Auxiliary Rev: 00000018

Device ID String: "PEM1620"

Global Initialization: 0xc, Power State Notification: 0xc, Device

Capabilities (0x29)

Controller provides Device SDRs

Supported features: 0x29

"Sensor Device" "FRU Inventory Device" "IPMB Event Generator"

5.12.3 Shelf Manager Firmware Upgrade

There are three files which contain the ShM firmware: sentry.shmm1500.kernel,

sentry.shmm1500.rfs

, and sentry.shmm1500.u-boot.bin. All files should be loaded onto both ShMs using the procedures described here. These files also contain firmware to be loaded into the SAM1500 FPGA. The SAM1500 FPGA will be programmed automatically

(if necessary) by the process.

As upgrades are released, Emerson will supply the current version of these files.

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Shelf Manager Upgrade Steps

The upgrade process involves the following steps.

1. Preserving and restoring configuration settings

Normally, any configuration settings you have saved in /etc/shelfman.conf and /etc/shelfman.conf.sam1500 are preserved during the upgrade procedure (if you are starting with a version of shelfman that is at revision PPS 2.5.2 or higher), so you do not need to save and restore unique settings saved in these files. Occasionally, however, a firmware upgrade presents a change in the options presented in these configuration files. If this is the case, you are asked to note any changes to settings you have made to these files, and to perform the upgrade in a way that overwrites these configuration files. You then need to edit these text files, reapplying your changes.

If you are starting from an earlier version of shelfman (prior to PPS 2.5.2), your configuration files will not be preserved across an upgrade, and you will need to restore any special configuration settings by editing the .conf files after the upgrade

2. Upgrading the U-boot, kernel, and root file system images

This is the normal upgrade sequence.

3. Upgrading the FPGA firmware on the SAM

The startup logic (following the root file system upgrade) automatically detects the need to upgrade the FPGA. If an upgrade is necessary, the startup logic loads the

FPGA and automatically reboots the ShM again. If this occurs, you should note a delay of approximately 5-8 minutes while this download occurs.

4. Updating the default U-boot environment variable configuration

The upgrade procedure preserves all U-boot environment variables. No special procedures are necessary.

Start the following sequence of operations with the backup Shelf Manager.


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5.12.3.1 Establishing Network Connectivity to the SAM

The list below outines the different actions required to enable and use the front panel Ethernet interface on a SAM. If the upgrade is being performed over the backplane Ethernet interfaces from one of the hub boards, skip these steps.

1. Login to the SAM front panel serial console using the id root and password root. Earlier firmware versions use the password motorola.

2. Set the environment variable that defines the IP address allocated for the SAM’s front panel Ethernet interface.

# setenv ip1addr W.X.Y.Z

(substituting your address)

# ifconfig eth1 W.X.Y.Z

3. If your file server (for Emerson files) is on a different subnet, :

# route add default gw W.X.Y.Z

(you will need to do this each time you reboot)

If you use the Uboot environment variable gatewayip, the route is set automatically at reboot (setenv gatewayip W.X.Y.X)

4. If the local subnet is not a class ‘C’ subnet, you may need to also execute the command:

# ifconfig eth1 netmask ...

to alter the netmask used by the ethernet interface

If you use the Uboot environment variable netmask1, this subnet mask is set automatically at bootup (setenv netmask1 netmask)

5. Ping the file server containing the Emerson files. You should get a response if the Ethernet cable is connected.

6. Set the environment variable that keeps the front panel Ethernet interface enabled following a reboot.

# setenv enable_front_panel_ethernet y

5.12.3.2 Update ShM Firmware on the SAM

This step involves programming of the U-boot, Linux kernel, and root file system into flash on the ShMM1500 on the SAM.

1. Copy the three required firmware image files listed below to the /tmp directory on the

ShM:





 sentry.shmm1500.u-boot.bin

sentry.shmm1500.kernel

sentry.shmm1500.rts

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One way of doing this is:

# scp acctname@fileserver_ip:dirname/sentry.shmm1500.* /tmp

where: acctname is the login account for the user on the (linux) file server fileserver_ip is the IP address of the file server dirname is the relative directory name (from the login home) for the location of the images

Verify that the files were copied to /tmp.

2. Execute the command to program these images into flash and then reset to execute the new images:

# rupgrade_tool -s -v -d -a [--hook=erase]

The “—-hook=erase” argument is optional, and is normally not used. This directs the upgrade procedure to avoid preserving the customer-specific configuration files,

/etc/shelfman.conf and /etc/shelfman.conf.sam1500. Normally, these files should be preserved across an upgrade, but on occasion, when Emerson makes a change to the format of the configuration options, you may be instructed to use this option. In this case, you need to re-enter the configuration by editing these files, following the upgrade.

3. The files are copied to flash memory and the system should reboot in a couple of minutes.

When the system is restarted, the bootup logic automatically determines if the SAM1500

FPGA needs to be loaded to a new firmware revision. If so, an additional upgrade and reboot takes place and takes an additional 5-8 minutes. The SAM should now be running the new firmware.

The process can now be repeated with the other Shelf Manager.


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84


Chapter 6

FRU Installation

6.1

Overview

The following chapters help you to start up and maintain the system:

Step

Installing RTMs, blades, and SAMs

Covering unused slots

Installing power components

Installing fan trays

Installing an air filter

Installing cable management

Description

This section provides information about how to install and remove RTMs, AdvancedTCA blades, and shelf management alarm modules.

This section provides information how to cover empty slots.

This section provides information about how to install and remove Power Entry Modules.

This section provides information about how to install and remove upper and lower fan trays.

This section provides information about how to install and remove an air filter.

This section provides information about to install the cables of the system secure.

6.2

Installing RTMs, Blades and SAMs

The following sections provide the information needed to install RTMs, AdvancedTCA blades, and SAMs.

Installation Sequence of RTMs and AdvancedTCA Blades

If you are going to install an RTM and an AdvancedTCA blade, you have to regard the following sequence:

First install the RTM, then install the matching AdvancedTCA blade. Otherwise the blades and RTMs will be damaged.


85


6.2.1

Module Installation and Removal

The RTM can be installed into a powered or nonpowered system.

RTM Damage

Installing the RTM with other blades than the ones designed for it may damage the RTM and the front blade.

Only install the RTM with the correct front blade.

Damage of Circuits

Electrostatic discharge and incorrect RTM installation and removal can damage circuits or shorten their life.

Before touching the RTM or electronic components, make sure that you are working in an


6.2.1.1

Installing the RTM

You can install the RTM into a system if the front blade is already installed or if it is not installed.

If the front blade is already installed, its payload has to be powered down first.

Installation Procedure with Installed Front Blade

The following procedure describes the installation of the RTM. It assumes that your system is powered. If your system is unpowered, you can disregard the blue LED and thus skip the respective step. In this case it is a purely mechanical installation.

1. Locate the slot the RTM is to be installed into the shelf's rear which must be the same as that of the front blade.

2. Open the lower handle of the front blade in order to power down its payload.

The blue LED on the front blade starts to flash. This indicates that the front blade is informing the shelf manager about its desire to power down its payload.

3. Wait until the blue LED on the front blade is ON.

This indicates that the front blade’s payload is powered down.

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4. Ensure that the top and the bottom handles of the RTM are in an outward position by squeezing the lever and the latch together.

5. Insert the RTM into the shelf by placing the top and bottom edges in the card guides of the slot.

6. Slide the RTM into the slot.

7. Apply equal and steady pressure to the RTM to carefully slide the RTM into the shelf until you feel resistance. Continue to gently push the RTM until the RTM connectors engage.

8. Squeeze the lever and the latch together and hook the lower and the upper handle into the shelf rail recesses.


87


9. Fully insert the RTM and lock it to the shelf by pressing the two components of the lower and the upper handles together and turning the handles toward the face plate.

88

If your shelf is powered, as soon as the RTM is connected to the front blade, the blue

LED is illuminated, and will remain illuminated until both the lower handle of the

RTM and the lower handle of the front blade are closed.

10.Close the lower handle of the front blade in order to power up the payload of both the front blade and the RTM.

The blue LEDs of both the front blade and the RTM start to flash. This indicates that the front blade is informing the shelf manager about its desire to power up the payload of both the front blade and the RTM.

11.Tighten both face plate screws on the RTM.

12.Wait until the blue LEDs of both the front blade and the RTM are OFF.



A switched OFF blue LED indicates that the payload of the respective blade or RTM has been powered up and is active.

13.Plug interface cable into face plate connectors, if applicable.

Installation Procedure without Installed Front Blade

The following procedure describes the installation of the RTM.

1. Locate the slot the RTM is to be installed into the shelf's rear which must be the same as that of the front blade.

2. Ensure that the top and the bottom handles of the RTM are in an outward position by squeezing the lever and the latch together.

3. Insert the RTM into the shelf by placing the top and bottom edges in the card guides of the slot.

4. Slide the RTM into the slot.

5. Apply equal and steady pressure to the RTM to carefully slide the RTM into the shelf until you feel resistance. Continue to gently push the RTM until the RTM connectors engage.


89



7. Fully insert the RTM and lock it to the shelf by pressing the two components of the lower and the upper handles together and turning the handles toward the face plate.

90

8. Tighten both face plate screws on the RTM.

9. Insert the front blade from the system's front into the same slot as the RTM.

As soon as the front blade is connected to the backplane, the blue hot swap LEDs of both the front blade and the RTM are illuminated permanently. This indicates that the IPMC of the front blade and the MMC of the RTM are powered up.

10.Close the handles of the front blade.



The blue LEDs on both the front blade and the RTM start flashing. This indicates that the front blade is informing the shelf manager about its desire to power up the payload of both the front blade and the RTM.

11.Tighten the two face plate screws on the front blade.

12.Wait until the blue LEDs on both the front blade and the RTM are OFF.

Switched off blue LEDs indicate that the payload of the respective blade or RTM has become active.

13.Plug interface cable into face plate connectors, if applicable.

6.2.1.2

Removing the RTM

Removal Procedure

The following procedure describes the removal of the RTM. It assumes that your system is powered. If your system is unpowered, you can disregard the blue LED and thus skip the respective step. In this case it is a purely mechanical procedure.

Damage of RTM and Front Blade

Removing the RTM from the system while the payload of the front blade is powered up may damage the front blade and RTM.

Whenever removing the RTM from the system, you have to power down the payload of the front blade first.


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1. Unlatch the lower handle outward by squeezing the lever and the latch together and turning the handle outward only enough to unlatch the handle from the face plate, that means until you feel a resistance. Do not rotate the handle fully outwards.

The blue LED blinks indicating that the shelf manager is informed about the desire of the blade to power down the payload of both the front blade and the RTM and the power-down process is ongoing.

Data Loss

Removing the RTM with the system power on and the blue LED on the front blade still flashing causes data loss.

Before removing the RTM from a powered system, power down the slot by opening the lower handle of the front blade and wait until the blue LED is permanently ON.

92

2. Wait until the blue LEDs on both the front blade and the RTM are permanently ON.

A permanently switched ON LED indicates that the payload of respective blade or

RTM has been powered down.



3. Unlatch the upper handle and rotate both handles fully outward.

4. Remove interface cables from face plate connectors, if applicable.

5. Loosen the two RTM face plate screws.

6. Remove the RTM from the slot.

6.2.2

Node Blade Installation and Removal

The blade is fully compatible to the AdvancedTCA standard and is designed to be used in

AdvancedTCA shelves. The blade can be installed in any AdvancedTCA node slot.

Damage of Circuits

Electrostatic discharge and incorrect blade installation and removal can damage circuits or shorten their life.

Before touching the blade or electronic components, make sure that you are working in an


Blade Malfunctioning

Incorrect blade installation and removal can result in blade malfunctioning.

When plugging the blade in or removing it, do not press on the face plate but use the handles.

6.2.2.1

Installing the Node Blade

To install the blade into an AdvancedTCA shelf, proceed as follows.


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Installation Procedure

The following procedure describes the installation of the blade. It assumes that your system is powered. If your system is unpowered, you can disregard the blue LED and thus skip the respective step. In this case it is a purely mechanical installation.

1. Ensure that the top and bottom ejector handles are in the outward position by squeezing the lever and the latch together.

94

2. Insert blade into the shelf by placing the top and bottom edges of the blade in the card guides of the shelf. Ensure that the guiding module of shelf and blade are aligned properly.

3. Apply equal and steady pressure to the blade to carefully slide the blade into the shelf until you feel resistance. Continue to gently push the blade until the blade connectors engage.




5. Fully insert the blade and lock it to the shelf by squeezing the lever and the latch together and turning the handles towards the face plate.

If your shelf is powered, as soon as the blade is connected to the backplane power pins, the blue LED is illuminated.

When the blade is completely installed, the blue LED starts to blink. This indicates that the blade announces its presence to the shelf management controller.

If an RTM is connected to the front blade, make sure that the handles of both the RTM and the front blade are closed in order to power up the blade`s payload.

6. Wait until the blue LED is switched off, then tighten the face plate screws which secure the blade to the shelf.


95


The switched off blue LED indicates that the blade`s payload has been powered up and that the blade is active.

7. Connect cables to the face plate, if applicable.

After the blade has been inserted, you have to ensure that a boot image is either present on the ATCA-F120 or on the blade’s hard disk.

6.2.2.2

Removing the Node Blade

This section describes how to remove the blade from an AdvancedTCA system.

96

Damage of Circuits




Blade Malfunctioning


When plugging the blade in or removing it, do not press on the face plate but use the handles.


The following procedure describes how to remove the blade from a system. It assumes that the system is powered. If the system is unpowered, you can disregards the blue LED and thus skip the respective step. In that case it is a purely mechanical procedure.

1. Unlatch the lower handle by squeezing the lever and the latch together and turning the handle outward only enough to unlatch the handle from the face plate. Do not rotate the handle fully outward.

The blue LED blinks indicating that the blade power-down process is ongoing.



2. Wait until the blue LED is illuminated permanently, then unlatch the upper handle and rotate both handles fully outward.

If the LED continues to blink, a possible reason may be that upper layer software rejects the blade extraction request.

Data Loss

Removing the blade with the blue LED still blinking causes data loss.

Wait until the blue LED is permanently illuminated, before removing the blade.

3. Remove face plate cables, if applicable.

4. Unfasten the screws of face plate until the blade is detached from shelf.

5. Remove the blade from the shelf.

6.2.3

Installing and Removing the Shelf Management Alarm Module

The following sections describe the installation and removal procedures for the shelf management alarm module (SAM-1500R).

For a detailed description of the SAM, refer to

Chapter 7, Shelf Management Alarm Module, on page 113 .


97


The following figure shows the face plate of the SAM-1500R shelf management alarm module.

Figure 6-1 SAM-1500R

OOS

IS

HS

Damage of Circuits




6.2.3.1

Non-Powered System

This section describes the installation procedure for the SAM in non-powered systems.

98




To install a SAM in a non-powered shelf, proceed as follows:

1. Put on an ESD wrist strap.

2. Connect the strap to the shelf by attaching the front or rear ESD jack.

3. Insert the module into the shelf by placing the top and bottom edges of the module in the card guides of the shelf. Ensure that the guiding module of shelf and board are aligned properly. The alignment pin facilitates the insertion and prevents bent pins.

4. Slide the module into the shelf and rotate the ejector handle upward until it snaps into place.

5. Screw in the captive screw hand tight.


To remove a SAM from a non-powered shelf, proceed as follows:



3. Unfasten the captive screw at the upper left hand corner of the face plate until the board is detached from the shelf.

4. Unlock ejector handle by pressing the handle and pull down. The SAM should start to move out of the chassis. Do not force it. If the SAM does not move, it means the captive screw is not fully unscrewed. Unscrew until loose and rotate the ejector handle down.

5. Remove the module from the shelf.

6.2.3.2

Powered System

This section describes the installation and removal procedures for a SAM in powered systems.


99



To install a SAM in a powered shelf, proceed as follows:



3. Insert the module into the shelf by placing the top and bottom edges of the board in the card guides of the shelf. Ensure that the guiding module of shelf and board are aligned properly. The alignment pin facilitates the insertion and prevents bent pins.

4. Slide the module into the shelf and rotate the ejector handle upward until it snaps into place.

5. Wait until the blue LED is illuminated.

6. Screw in the captive screw hand tight. The blue LED blinks.

7. Wait until the blue LED is switched OFF. The switched off blue LED indicates that the board is activated.


To remove a SAM from a powered shelf, proceed as follows:



3. Unfasten the captive screw at the upper left hand corner of the face plate until the module is detached from the shelf.

4. The blue LED blinks indicating that the module power down process is ongoing.

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5. Wait until the blue LED is illuminated permanently.

Data Loss

Removing the module with the blue LED still blinking causes data loss. Wait until the blue

LED is permanently illuminated, before removing the module.

6. Unlock ejector handle by pressing the handle and pull down. The SAM should start to move out of the chassis. Do not force it. If the SAM does not move, it means the captive screw is not fully unscrewed. Unscrew until loose and rotate the ejector handle down.

7. Remove the module from the shelf.

6.3

Unused Slots

All unused node or hub slots must be covered with filler blades. These filler blades ensure a consistent airflow per slot whether or not the neighboring slot contains an AdvancedTCA blade. There are filler blades sized for the front and for the RTM slots. An unused slot can not contain a front filler when an AdvancedTCA RTM is installed. When fillers are used, both the front and RTM filler must be in place. Filler blades are available from Emerson.

6.4

Installing Power Entry Modules

The AXP1440 shelf supports two Power Entry Modules (PEMs). Since the shelf is equipped with a redundant power distribution system, the removal of a single PEM does not interrupt system operation. PEMs are accessible from the rear of the shelf. Each PEM has EMI gaskets on all sides of the module that provide EMI shielding.

The following instructions describe how to replace a power entry module. For further

information on power entry modules, refer to

Power Entry Modules (PEMs)

on page 37 .


101


6.4.1

Tools You Will Need





Multimeter

Standard #2 Phillips-head screwdriver







7/16" Torque wrench

Nut driver (torque nut to 50 in. lbs.)

AXP1440 DC Power Installation Kit, PN 6706822A01 (shipped with AXP1440)

6.4.2

Removing the PEM

When replacing a PEM, make sure you have a replacement PEM available. Replacement can take place in under 30 minutes by a qualified service person. PEMs are accessible from the rear of the shelf.

Replacing one PEM is done while the other PEM is in operation. Having the PEM located in the shelf is critical to maintaining proper airflow and cooling of the shelf. Steps in which a PEM is removed from a slot and reinserted should be completed within 3 minutes to maintain the shelf within safe operating temperatures.

Read all cautions and warnings, and ensure the equipment is properly grounded by reviewing the procedure in


on page 70 , and follow these steps. The PEM

has multiple power sources. This procedure should be followed precisely to ensure the PEM is isolated from all power sources before removing the PEM from the shelf, or removing the plastic terminal block lug cover.

This procedure assumes that the redundant PEMs are powered on in the shelf.

102




To remove a PEM, refer to this figure and follow the steps.

OFF ON OFF ON

-48 VDC RTN

-48 VDC

-48 VDC RTN

-48 VDC

OOS IS HS

1. Locate the target power input cable’s terminals at the branch circuit or power distribution unit. Open the external circuit breakers that provide DC feed power to the PEM you are replacing.

2. Lock and tagout the circuit breakers on the branch circuit or power distribution unit.

3. Using the appropriate tool, loosen the chassis retention screws on each side of the

PEM.

4. Open the ejector latches. This will signal the switch to deactivate the hot swap signal. Watch for the Blue LED to go solid and steady, signalling that it is ready to remove.

5. Open the ejector handles completely. You will feel the PEM disconnect from the backplane.

6. Pull the module straight out from the rail guides, about 3 inches.

7. With the PEM in place and before removing the terminal block lug cover, screw a standoff/lockout screw extension onto the retaining screws located on each side of the PEM. Align the threaded end of the standoff/lockout screw extension with the screw holes on each side of the shelf and securely tighten to lock the PEM approximately 2 inches out of the shelf.


103


8. Using the appropriate tool, carefully remove the terminal block cover (plastic covering) over the terminal block. The terminal block cover is attached to the terminal block by two tabs with slots in the cover that insert into embossments in the terminal block wall. To remove the cover, press the upper wall of the terminal block wall downward and slip a flat-bladed screwdriver between the cover and the terminal block wall and pry the cover tab up to relieve it from the embossment in the terminal block wall. Once the upper cover tab is free from the terminal block embossment, the cover should rotate downward and free itself from the lower embossment.

If the multimeter indicates there is still power present and power cannot be removed from the terminals, the entire shelf must be powered down to perform the PEM replacement.

9. Confirm that there is no power to the PEM lug bolts. Using a multimeter, measure between the two lugs and then measure between the chassis ground and each lug.

If the DC potential is 3.0VDC or less, then power is not present.

10.Remove the DC power cable from the dual lug bolts on the PEM you are replacing, being careful to place the two cables so they cannot short to each other or to other conductors.

11.Loosen the standoff/lockout screw extensions and remove the PEM from the slot by pulling straight out of the rail guides.

12.Remove the standoff/lockout screw extensions and put them aside to use when installing the new PEM.

104



6.5

Upper and Lower Fan Tray Modules

To prevent system damage, the operator must replace the fans within the recommended service interval shown in the following table to prevent a decline in shelf operability. Make sure the replacement FTM is available for exchange and ready to install.

Service Interval for 1 FTM

Not recommended

Four hours

Temperature Range

40-55°C

40°C maximum

When an FTM is taken out of operation, the system manager will compensate for the loss by increasing the speed of the remaining fans, as needed. Please read the following caution before replacing any of the FTMs.

Fans may continue to rotate after power is removed. Be careful to keep fingers away from the bottom of the FTM enclosure.


105


6.5.1

Removing the Upper FTM


Follow these steps and refer to the figures to remove the upper fan tray module from the shelf.

1. Loosen the retention screw to the chassis before loosening the ejector handle screw.

Figure 6-2 Upper Rear FTM Ejector Handles and LEDs

106

2. Pull the ejector handle outward to a slightly open position to disengage the hot swap switch.

Watch for the Blue LED to blink. When the blinking stops and the LED remains a solid blue, the FTM is ready to be removed.

3. Open the ejector handle to a full open position.

4. Using the handle on the front of the FTM, slowly pull the FTM out of the shelf, while supporting the bottom of the module with the palm of your hand.

The module is heavy; hold it securely.



6.5.2

Installing the Upper FTM


Have the correct FTM available and follow these steps to install the upper fan tray module.

1. While supporting the FTM, align the FTM carefully into the fan slot in the shelf and slowly slide the FTM until the ejector handles engage; fully close the handles.

The FTM is connected when the assembly is firmly seated in the upper backplane connector and the hot swap handle moves to the closed position.

2. Hand tighten both chassis retention screws at the same time to secure the FTM.

Hand tool tighten both chassis retention screws, alternating back and forth until hand tight. The recommended torque settings is 5 inch-pounds.

When the blue LED turns off, the fan is operating.


107


6.5.3

Removing the Lower FTM


Follow these steps and refer to the figure to remove the lower front fan tray module from the shelf.

1. Using a Phillips screwdriver, loosen the two chassis retention screws.

Figure 6-3 Lower Front FTM Ejector Handles and LEDs

LEDs

2. Open the ejector handle and wait for the Blue LED to go solid and steady. This indicates that the FTM is ready to be removed.

3. Open the ejector handle to a full open position.

4. Using the ejector handle on the front of the FTM, slowly pull the FTM out of the shelf, while supporting the bottom of the module with the palm of your hand.

The module is heavy; hold it securely.

108



6.5.4

Installing the Lower FTM


Have the correct FTM available and follow these steps to install the upper fan tray module.

1. While supporting the FTM, align the FTM carefully into the fan slot in the shelf and slowly slide the FTM until the ejector handles engage; fully close the handles.

The FTM is connected when the assembly is firmly seated in the upper backplane connector and the hot swap handle moves to the closed position.

2. Hand tighten both chassis retention screws at the same time to secure the FTM.

Hand tool tighten both chassis retention screws, alternating back and forth until hand tight. The recommended torque settings is 5 inch-pounds.

When the blue LED turns off, the fan is operating.

6.6

Replacing the Fan Filter

Your replacement fan filter consists of a filter media for the lower Fan Tray Module. The fan filter housing is kept in place by 2 tabs located on the inner left-side in front of the stationary metal frame.

Air filters should be checked occasionally to make sure they are not obstructed or damaged.

Visually inspect filters for tears or rips. Do not reinstall a torn filter as it will be ineffective in trapping particulates and will interrupt air flow distribution. To maintain safety certification, use only Emerson approved fan filters. You can order replacement fan filters (part number

RAF1620) by contacting your Emerson sales representative. For detailed information on filter

maintenance and cleaning, see


on page 61 .


109


Replacement Procedure

To replace the fan filter for a lower FTM, refer to

Removing the Lower FTM

and follow these steps to replace a fan filter. Please have your replacement fan filter available before starting this procedure.

1. With the FTM removed and placed on a solid surface, position the FTM with the front facing you.

2. Using your fingers, rotate the filter frame away from the housing using the two tabs on the right and left sides of the filter frame.

3. Rotate the vane assembly out of the way to expose the lower portion of the air filter.

4. Insert the replacement fan filter by positioning the filter onto the velcro edges and form into place.

Any particulates that fall into the fan tray module during the air filter replacement must be cleaned out (vacuumed) from the fan tray prior to re-installing the fan tray into the chassis.

110


Figure 6-4 Position of the Fan Filter

Velcro


5. Lower the vane assembly and rotate the filter bracket into place.

6. Reinstall the lower FTM using the procedure described in

Installing the Lower FTM

.


111


112


Shelf Management Alarm Module

Chapter 7

7.1

Overview

This chapter describes the AdvancedTCA Shelf Management Alarm Module, hereafter known as the SAM, which consists of the Shelf Management Controller (ShMC) and the Shelf

Management Mezzanine Module (ShMM) which installs on the carrier blade. Two SAMs are installed into two dedicated shelf manager slots located at the bottom-rear of the AXP1620

16-Slot Shelf. The SAM is hot swappable and the connectors are accessible through the face plate.

You will find the following information in this chapter:





Features

SAM Diagram and Face Plate Layout













Functional Description

Hardware Monitoring and Control

Telco Alarm Functionality

Hot Swap Interface

Power

SAM Software

The SAM supports redundant operation by automatic switchover between two SAMs. When two SAMs are present in a shelf, one acts as the Active SAM and the other acts as a Standby

SAM. They share signals across the AdvancedTCA backplane that allow them to coordinate their redundant operations. The SAM provides access to the IPMCs for the Power Entry Module

(PEM) and the two fan trays through the IPMB. The SAMs use IPM Sentry Shelf Manager software for system management. Refer to

SAM Software

on page 131

for further information.

The SAM also provides these operations for the AXP1440 shelf:



Control for the activation/deactivation of AdvancedTCA blades





Handles E-Keying

Control of Power Management





Monitoring of overall system and blade level health

Logging for critical system events


113






Support for the Command Line Interface (CLI) to access shelf information for:

– Shelf blade population

– List of sensors and sensor values

– Sensor threshold settings

– System events

– Shelf health

Control of chassis cooling management (fan levels)

For additional information on the above operations and the Command Line Interface, refer to the AXP1440/AXP1620 Subsystem IPMI Programmer’s Reference guide and the Pigeon Point Shelf

Manager External Interface Reference, Release 2.5.3, respectively.

7.2

Features

The SAM is based on the Pigeon Point Systems ShMM-1500R and Freescale MPC8343 System

On a Chip (SOC).

The following lists the features of the SAM.



High density, small (92 mm x 50.8 mm) form-factor





Fully compliant with the Restriction of Hazardous Substances (RoHS) directive

I/O interfaces available on a Tyco 220-pin 0.5 mm Free Height receptacle













64, or 128 MBytes of DDR SDRAM with Error Correcting Code (ECC) support

266 or 400 MHz PowerPC superscalar RISC core with MMU and caches (32K/32K with parity)

32 or 64 MBytes of Flash

Hardware support for a reliable upgrade of software images in Flash

Dual IPMB with IPMB buffer controls for hot insertion and removal onto a live backplane

Dual serial interface at RS232 or CMOS levels (one port with modem control)

114

























Dual 10/100Mbit Ethernet using the integrated 802.3 controllers buffered by external onboard

PHY layer devices

FPGA device on the PCI bus used to implement IPMB-0, the Shelf Manager-oriented interfaces for hardware redundancy, hot swap and carrier ID, plus the ATCA Watchdog and a high-speed serial interface for an alternate software redundancy interface between peer ShMM-1500Rs.

Three general-purpose I

2

C interfaces (one with limitations) for access to on-carrier devices, such as hardware monitors and the Telco Alarm interface

RTC, backed by on-carrier battery

User SEEPROM

External interrupt inputs

User GPIO

SPI interface as an extension interface for on-carrier devices

PCI interface as an extension interface for on-carrier devices

On-carrier PLD interface

JTAG interface for software debug and manufacturing


115


7.3

SAM Diagram and Face Plate Layout

Figure 7-1

shows a block diagram of the overall SAM architecture and Figure 7-2 on page 117

shows the face plate layout.

Figure 7-1 Block Diagram of SAM

12VA

12VB

Base 1

Base 2

XFMR

XFMR

Redundancy

Interface

Inter

SAM

Link

Cross-SAM

IPMB link

Fan Full

Speed

IPMB-0

XFMR

20

Dual hotswap controllers

Handle

Switch

Four-port

Ethernet

Switch

XFMR

SPI

Ethernet

Power Supplies

Voltage and

Temperature

Monitoring

Carrier ID

PROM

I2C(3)

I2C(2)

RS232

ShMM-1500R

XFMR

PCI

High Speed

Serial

FPGA

GPIOs

GPIOs

HS

LED

Console

Port

(RJ45)

Ethernet

(RJ45)

Telco

Alarm relays and reset

Telco

Alarm

(DB15)

LEDs

RS232

(DB9)

ADP Telco Alarm

Cutoff

LEDs

116



The SAM has these interfaces:



Four 10/100Base-T Ethernet links

– One link to each system controller and switching blade (2)

– One link to the redundant SAM









– One link to the face plate

One Ethernet link, failover management status signals, and one IPMB branch or segment to the other SAM

Radial IPMB links for up to 20 modules (16 blades, 2 fan trays, and 2 PEMs)

Face plate interfaces that include 10/100Base-T Ethernet, RS232 serial console, and Telco alarm interface with connector

Interface to ADP panel for Telco Alarm indicators and serial console port

The SAM provides the face plate LEDs listed in the following table. More detail on the LEDs is provided in the following sections.

Figure 7-2 SAM Face Plate

OOS

IS

HS


117


7.4

Functional Description

The SAM has a high-density 220 pin socket for the shelf management mezzanine (ShMM) device and front-panel connectors for the serial console, Ethernet, and Telco alarm signals of the mezzanine. The dual-IPMB interface from the mezzanine is connected to the dual IPMBs in the backplane.

The SAM includes several on-board devices that enable different aspects of shelf management based on the shelf management mezzanine. These facilities include I

2

C-based hardware monitoring/control and GPIO expander devices.

7.4.1

IPMB Connectivity

The IPMB is a dual radial topology. Eac IPMC in the shelf connects to both SAMs for a redundant

IPMB.

7.4.2

RS-232 Serial Interface

The SAM provides an RS-232 interface on the face plate connector using an RJ-45 connector.

The connector is routed to the serial port of the shelf manager mezzanine.The default baud rate is 9600, 8, N, 1. Pin assignments for this connector are:

Table 7-1 RJ-45 Serial Port Connector

6

7

4

5

8

2

3

Pin

1

Signal

DSR

DCD

DTR

GND

RXD

TXD

CTS

RTS

Direction

Input

Input

Output

Input

Output

Input

Output

118



Table 7-2 Alarm Display Panel (ADP) Serial Port Connector

6

7

4

5

8

9

2

3

Pin

1

Signal

No Connect

RXD

TXD

No Connect

SigGnd

No Connect

No Connect

No Connect

No Connect

Direction

Input

Output

7.4.3

Master-Only I

2

C Bus

The SAM provides a number of I

2

C devices using the master-only I

2

C bus of the shelf manager mezzanine. The master-only I

2

C bus is used internally on the mezzanine for the real-time clock and EEPROM devices. Additional I

2

C devices connected to the bus on the SAM are used for the following functions:



System hardware monitoring and control



GPIO extension, for various purposes

7.4.4

Shelf FRU SEEPROM

The SAM provides access to the SEEPROMS on the Alarm Display Panel (ADP) through the master-only I

2

C. Information stored on the ADP contains Emerson OEM records that enable the

SAM to self-configure for the AXP1440 shelf.


119


7.4.5

SAM LEDs

The SAM provides the LEDs listed in the following table. More detail on the LEDs is provided in the following sections. Also refer to

Figure 7-2 on page 117 for SAM face plate LED locations

and to Figure 2-1 on page 26 for the ADP teleco LED locations.

Table 7-3 SAM LEDs

LED

Teleco

Location

Alarm Display Panel

Power

In Service

Out of Service

Hot Swap

Type

Critical alarm (CRIT)

Major alarm (MAJ)

Minor alarm (MIN)

Power indicator

In Service (IS)

Out of Service (OOS)

Hot swap ready (HS)

Alarm Display Panel

SAM face plate

SAM face plate

SAM face plate

7.4.5.1

Hot Swap LED

The SAM provides a blue hot swap LED. This LED indicates when it is safe to remove the SAM from a live shelf.

Table 7-4 Hot Swap LED States

State

Off

Blue

Long-blink

Short-blink

Condition

The SAM is not ready to be removed/disconnected from the shelf

The SAM is ready to be removed/disconnected from the shelf

The SAM is activating itself

Deactivation has been requested

The software running on the shelf manager mezzanine is responsible for turning the LED on/off using the GPIOs on the ShMC.

120



7.4.5.2

SAM/ADP Status LEDs

Status is shown using an LED on the SAM face plate and ADP. The illumination state of the LED is normally controlled by the GPIO on the SAM. The following tables describe the LED states.

Table 7-5 SAM LED Status Indicators

SAM Face Plate LED

IS (In Service)

OOS (Out of Service)

HS (How Swap)

LED Color

Green

Red

Blue

State

On

On

On

State/Condition

Active, power good

Failed

Remove OK

Table 7-6 ADP LED Status Indicators

Alarm Display Panel LED

Critical alarm (CRT)

Major alarm (MAJ)

Minor Alarm (MIN)

Power (PWR)

LED Color

Red

Red

Yellow

Green

State

On

On

On

On

State/Condition

Active

Active

Active

Power Present

7.5

Management and Control

This section gives a general description of the role of the on-board I

2

C devices and how management, control, and redundancy is handled by the SAM. Detailed information on sensors can be found in the AXP1440/AXP1620 Subsystem IPMI Programmer’s Reference.

7.5.1

Hardware Monitoring and Control

The hardware monitoring and control functions implemented by the AXP1620 are provided by the on-board I

2

C-based devices.


121


7.5.1.1

Voltage Sensors

On-board sensors provide the following power supply voltages. All voltage sensors are implemented using the ADM1024 device on the master-only I

2

C bus. System management software running on the SAM is responsible for reacting to an event when an interrupt is triggered by the ADM1024 device.

7.5.1.2

Temperature Monitoring

An on-board temperature sensor is available on the SAM. This sensor is implemented through the ADM1024.

7.5.1.3

Fan Speed and Control

All fan speed and fan voltage sensors are exposed on the active SAM.

The FTMs have 110 fan speed settings. The SAM uses a proprietary cooling algorithm to automatically adjust the fan speed to cool the chassis based on sensor data from the blades as well as inlet and outlet sensors on the FTMs. The minimum fan speed is 1.

In normal operating conditions, the cooling algorithm adjusts the fan speed based on the ambient air temperature as measured at the inlet fans to maintain a deltaT value (calculated to be the rise in air temperature measured at the inlet and outlet fan sensors) based on the inlet air temperature value. The lower the ambient temperature, the higher the rise in temperature allowed.

122


The deltaT set point is calculated as follows:

Set Point

S1


S2

T1

T2 Inlet Air Temperature

For ambient air temperatures at or below 25°C (default T1), the deltaT set point is set to 20°C

(default S1). For ambient air temperatures at or above 55°C (default T2), the deltaT set point is set to 10°C (default S2). For ambient air temperatures between T1 and T2, the deltaT set point is calculated using the following algorithm:

S1 +

S2 - S1

T2 - T1

(T

inlet

- T1)


123


124

Using the above algorithm, at 40°C ambient, the cooling algorithm adjusts the fan speeds to maintain a deltaT rise in temperature at 15°C.

Table 7-7 Cooling Budget

Ambient Temperature

25C

40C

55C

Temperature Rise

Delta T = 20 C

Delta T = 15 C

Delta T = 10 C

70

80

90

100

30

40

50

60

Fan Level

1

10

20

The values for S1, S2, T1, and T2 are configurable.

In abnormal operating conditions; that is, when a blade thermal sensor is approaching or crossed its upper non-critical threshold, the SAM automatically adjusts the fan speeds to a point where all the blade thermal sensors are just below their upper non-critical threshold

(minus a user configurable offset).

The dynamic minimum fan level is not used.

Each fan tray has six fan units and each fan unit has an inlet and outlet fan. Fan speeds for all level settings are summarized in the next table.

Speed in RPMs

1800 Inlet, 1100 Outlet +/-10%

2600 Inlet, 1500 Outlet +/-10%

3200 Inlet, 2000 Outlet +/-8%

3900 Inlet, 2400 Outlet +/-8%

4500 Inlet, 2900 Outlet +/-5%

5100 Inlet, 3300 Outlet +/-5%

5800 Inlet, 3700 Outlet +/-5%

6400 Inlet, 4200 Outlet +/-5%

7000 Inlet, 4500 Outlet +/-5%

7600 Inlet, 5000 Outlet +/-5%

8000 Inlet, 5200 Outlet +/-5%



7.5.2

Redundancy Control

The ShMM-1500R supports redundant operation with automatic switchover using a redundant

ShMM-1500R. In a configuration where two ShMM-1500Rs are present, one acts as the active shelf manager and the other as a standby. Both ShMM-1500Rs monitor each other, and either can trigger a switchover if necessary.

The ShMM-1500R provides a number of hardware redundancy signals on the CN1 connector.

The HRI is implemented using the FPGA device.

7.5.2.1

Hardware Redundancy Interface

The hardware redundancy signals of the ShMM-1500R are implemented as follows:











Cross connected ShMM-1500R present input (PRES_R#) and output (PRES_L#)

Cross connected ShMM-1500R status 0 input (SHMM_STATUS0_R) and output

(SHMM_STATUS0_L)

Cross connected redundant ShMM-1500R status 1 input (SHMM_STATUS1_R) and output

(SHMM_STATUS1_L)

Active output (ACTIVE#) that can be used on the ShMM-1500R carrier to enable interfaces that must be exclusively driven by the active ShMM-1500R

Bi-color status LED

Note that the ACTIVE# signal is intended for use on a carrier and is not connected directly to the peer-ShMM through the backplane. The cross-connected ShMM-1500R status signals are asynchronous serial bit streams that are transmitted to the peer-ShMM by the FPGA and communicate the following information: Health status, Switchover Requests, PRES_R state,

Active state, watchdog timer status, parity and other TBD data. An identical copy of the bit stream is also sent on the redundant ShMM-1500R status signal. This information is used by the

FPGA to ensure that only one of the two connected ShMM-1500Rs goes into active mode at a

time. Figure 7-3 on page 126 shows the HRI of the ShMM-1500R.

As shown in the figure, the ShMM-1500R HRI incorporates a hot-swap buffer (IDT

QuickSwitch), which isolates the interface from the peer ShMM prior to FPGA configuration or when the ShMM-1500R is powered down. The QuickSwitch device is guaranteed to be disabled

(open) when unpowered and does not have a low impedance path from any of the signal pins


125


to the power or ground rails. Hence, the device prevents an unpowered ShMM-1500R from loading down the HRI of the peer ShMM-1500R. It also prevents a carrier from detecting the

ACTIVE# output as a zero; that is, active, during a ShMM-1500R power cycle or a ShMM-1500R power supply failure.

The FPGA device contains a built-in CRC error checker for detecting soft errors in the configuration data. When a CRC error is detected the signal LATCH_CRC_ERROR is set active by the ShMM-1500R CRC error detection circuit, which immediately sets the

ShMM_STATUS[0:1]_L and ACTIVE# signals high. The peer ShMM-1500R, if it is not already active upon detecting the loss of the status serial bit streams, becomes the active ShMM-

1500R.

Figure 7-3 SAM HRI Interconnection

F_ShMM_STATUS 0

ShMM-1500R A

GND

F_ShMM_STATUS 1

PRES#

ShMM-1500R A buffer

GND

ShMM-1500R B buffer

ShMM-1500R B

The HRI also includes 13 test points for in-service monitoring of the hardware redundancy signals and for out-of-service diagnostics, enabling the ShMM-1500R to isolate failures on the

HRI to a single carrier +ShMM-1500R pair.

7.5.2.2

HRI Protocol

In the redundant configuration, the two ShMM-1500R boards communicate through the HRI by exchanging data packets. The HRI continues to be operational in case of a single interconnection failure and is able to detect a double failure. The HRI has a redundant communication path, using four signals. In the case of a single wire permanent failure (the signal gets stuck high, low or breaks), data packets continue to be transmitted through the redundant communication path. A short between two of these four signals is considered a double failure.

126



7.5.2.3

Ethernet Signals

The ShMM1500R provides two 100BaseT Ethernet ports, identified within the Linux environment as eth0 and eth1.The eth0 port is cross-connected to the eth0 port on the other

SAM to provide a dedicated high-speed inter-SAM link for the exchange of status and configuration details. The eth1 port is connected to an Ethernet switch (a Broadcom

BCM5325E), which in turn connects to the base ports of the two hub slots and to the frontpanel RJ45 Ethernet connector.

The port utilization of the switch is:



TP port 1 to Local hub slot





TP port 2 to Remote hub slot

TP port 3 to Front panel RJ45)







TP port 4 to ShMM1500R

TP port 5 is not used

MII port is not used


127


The default state of the Ethernet switch is not to forward packets between ports. The correct switch configuration for normal operation is to allow ingress from ports 1, 2 and 3 to port 4 and to allow egress from port 4 to ports 1, 2 and 3. With the exception of routing a port to itself, all other routes are blocked.

Figure 7-4 Interhub Slot and Shelf Manager Connectivity

128



7.5.3

Switchover Signals

A switchover takes place when the Standby SAM determines that the Active SAM is no longer operational. The signs of this are:



The REMOTE_HEALTHY or REMOTE_PRESENT changes to FALSE. This indicates that the peer SAM is no longer healthy or present





The TCP connection between the Active and the Standby SAMS closes. The keep alive timeout parameter for this connection is set to 1 second to recognize a malfunction of the

Active SAM as quickly as possible. In this case the Standby SAM waits for 3 seconds and then checks the state of the REMOTE_HEALTHY to make sure the connection is broken due to a failure of the Active SAM and not due to a communication failure.

If the Standby SAM detects that the Active SAM is still healthy it doesn’t perform the switchover but instead reboots itself. After the reboot it makes a second attempt to initialize as a backup and will continue until either it succeeds in establishing the connection with the Active SAM or it detects that the Active SAM is no longer healthy. If it detects that it isn’t healthy it will initialize as the Active SAM.

When the Active SAM receives a switchover command from the Standby SAM and agrees to switchover, it closes the TCP connection, clears the LOCAL_HEALTHY bit and exits the program which indicates the switchover to the Standby SAM.

If the Standby SAM decides that a switchover should take place it closes the TCP connection and exits this function. Activate callbacks are called for all facilities and the

SAM starts to work in active mode, with no backup. At this moment the SAM sets the

LOCAL_SWITCHOVER bit, requesting the hardware to recognize it as the Active SAM. In response, the hardware must set the ACTIVE bit. When the formerly active SAM restarts it successfully establishes the connection with the current SAM and starts to operate in the backup mode.

7.6

Telco Alarm Functionality

The SAM provides Telco alarm functionality with the following components:







Telco alarm cutoff push button

DB15 Telco alarm contacts

Telco alarm LEDs


129


7.6.1

Telco Alarm Cutoff Push Button

The SAM provides a Telco alarm cutoff function with the front-panel push button switch located on the ADP. This push button activates the alarm cutoff (ACO) state. When ACO is activated, the active alarm LED blinks and all of the alarm relays are deactivated. This button does not clear alarms. Refer to

Figure 7-2 on page 117 for the location of the alarm cutoff push

button switch.

7.6.2

Telco Alarm LEDs

These LEDs are used to indicate the presence of the critical, major, and minor alarms. When a

LED is lit, the respective alarm is active. A blinking LED signals an alarm cut-off state which is initiated by pressing the alarm cut-off button when an alarm is active.

7.6.3

Telco Alarm Interface

The SAM provides a front-panel alarm connector, which is a standard DB-15 connector with the following pin assignments:

Table 7-8 Hot Swap Interface Pin Out

6

7

4

5

2

3

Pin

1

8

9

10

11

12

Description

Minor Alarm Reset +

Minor Alarm Reset -

Major Alarm Reset +

Major Alarm Reset -

Critical Alarm - NO

Critical Alarm - NC

Critical Alarm - COM

Minor Alarm - NO

Minor Alarm - NC

Minor Alarm - COM

Major Alarm - NO

Major Alarm - NC

130



Table 7-8 Hot Swap Interface Pin Out (continued)

Pin

13

14

15

Description

Major Alarm - COM

Pwr Alarm - NO

Pwr Alarm - COM

7.7

Hot Swap Interface

The SAM provides a hot swap interface allowing the SAM to be replaced without powering down the shelf. The hot swap interface is implemented using the shelf manager mezzanine

CPLD device. The interface is composed of three components:







Injector/Ejector handle switch

Presence signal indicating that the SAM is fully seated in its backplane connector

HS LED to indicate safe to remove state

7.8

Power

The SAM uses dual +12V power feeds, one from each PEM. Hot swap circuitry ensures correct operation when a SAM is inserted into or removed from a live system.

7.9

SAM Software

The software that runs on the shelf manager is described in detail in the Pigeon Point Systems

IPM Sentry Shelf Manager User Guide, which provides an introduction to shelf management, the shelf manager, and the shelf management mezzanine. Also available is the Pigeon Point Systems

IPM Sentry Shelf-External Interface Reference which describes the command line, web, SNMP

(Simple Network Management Protocol), and RMCP (Remote Management Control Protocol) interfaces. Refer to

Appendix A, Related Documentation for more information on these

publications.


131


7.9.1

imls Utility

A utility called imls is available on the SAM. It can be used to list all firmware images present in flash. Note that the Shelf Manager flash is divided into two banks. Each bank contains a set of three separate firmware images:







U-Boot

RFS

Kernel images

When the rupgrade_tool utility is used to perform a reliable firmware upgrade operation on the Shelf Manager, the flash bank that is currently not active is programmed with the new images, the processor is reset, and the newly programmed flash bank is selected.

If the new firmware fails to load or execute properly, the Shelf Manager automatically resets and reverts to the previous flash bank. Selection of the bank to be used for booting is not a configurable option at run-time.

The following text shows sample output obtained by running imls at the Shelf Manager Linux prompt. Note that the first three images listed reflect the currently active flash bank contents, and the next set of three images is contained within the other flash bank.

# imls

/dev/mtdblock3:

Image Name: U-Boot 1.1.4 for shmm1500 board

Created: Fri Jun 6 14:51:44 2008

Image Type: PowerPC Linux Firmware (uncompressed)

Data Size: 212992 Bytes = 208.00 kB = 0.20 MB

Load Address: 0xF0000000

Entry Point: 0x00000000

/dev/mtdblock2:

Image Name: Linux-2.4.25


Image Type: PowerPC Linux Kernel Image (gzip compressed)


Load Address: 0x00000000


132



/dev/mtdblock4:

Image Name: shelfman 4.0.0 build 21


Image Type: PowerPC Linux RAMDisk Image (gzip compressed)




/dev/mtdblock8:

Image Name: U-Boot 1.1.4 for shmm1500 board

Created: Thu Mar 27 21:27:47 2008

Image Type: PowerPC Linux Firmware (uncompressed)


Load Address: 0xF0000000


/dev/mtdblock7:

Image Name: Linux-2.4.25

Created: Thu Mar 27 21:33:51 2008

Image Type: PowerPC Linux Kernel Image (gzip compressed)




/dev/mtdblock9:

Image Name: sentry.shmm1500 RFS Ramdisk Imag

Created: Thu Mar 27 21:41:21 2008

Image Type: PowerPC Linux RAMDisk Image (gzip compressed)




#

From the sample output, it is possible to see the compilation dates of the U-Boot, RFS, and

Kernel images for both the active and nonactive firmware banks. Compilation times will never be identical for all three images, but should be relatively close to each other.


133


134


Appendix A

A

Related Documentation

A.1

Emerson Network Power - Embedded

Computing Documents

The publications listed below are referenced in this manual. You can obtain electronic copies of

Emerson Network Power - Embedded Computing publications by contacting your local

Emerson Sales Office. For released products, you can also visit our Web site for the latest copies of our product documentation.

1. Go to http://www.emersonnetworkpower.com/EmbeddedComputing

2. Under Resources, click Technical Documentation.

3. Enter the publication number or the complete name of the product in the Search box.

Table A-1 Emerson Network Power - Embedded Computing Publications

Document Title

AXP1440 Release 1.0 Document Collection

AXP1440/AXP1620 Subsystem IPMI Programmer’s Reference

Publication Number

6806800H24

6806800G38

AXP1440 Release Notes

ATCA-F120 Installation and Use

6806800H23

6806800D06

ATCA-F120: Control through IPMI Programmer’s Reference 6806800D18

System Management Interface Based on HPI-B (AXP1620/1440) User’s Guide 6806800D85

Pigeon Point Shelf Manager User Guide, Release 2.5.3

Pigeon Point Shelf Manager External Interface Reference, Release 2.5.3

6806800G49

6806800G50


135

Related Documentation

A.2

Related Specifications

For additional information, refer to the following table for related specifications. As an additional help, a source for the listed document is provided. Please note that, while these sources have been verified, the information is subject to change without notice.

Table A-2 Related Specifications

Document Title and Source

IEEE http://standards.ieee.org/catalog/

IEEE Standard for Local Area Networks: Carrier Sense Multiple Access with

Collision Detection (CSMA/CD) Access Method and Physical Layer

Specifications

Institute of Electrical and Electronics Engineers, Inc.

IEEE Amendment 1: Media Access Control parameters, Physical Layers, and Management Parameters for 10Gb/s Operation

PCI Industrial Manufacturers Group (PICMG) http://www.picmg.com/

PICMG 3.0 AdvancedTCA Base Specification, Revision 1.0

PICMG 3.0 AdvancedTCA Serial Interconnect Specification R2.0

PICMG 3.1 AdvancedTCA Ethernet/Fibre Channel, Revision 1.0

PICMG 3.0 ECN 3.0-1.0-001

Publication Number

IEEE 802.3

March 2002

IEEE 802.3ae

August 2002

PICMG 3.0 R 1.0

December 30, 2002

PICMG 3.0, R2.0

PICMG 3.1 R1.0

January 22, 2003

January 21, 2004

ECN 3.0, 1.0-001

136


Safety Notes

This section provides warnings that precede potentially dangerous procedures throughout this manual. Instructions contained in the warnings must be followed during all phases of operation, service, and repair of this equipment. You should also employ all other safety precautions necessary for the operation of the equipment in your operating environment.

Failure to comply with these precautions or with specific warnings elsewhere in this manual could result in personal injury or damage to the equipment.

Emerson intends to provide all necessary information to install and handle the product in this manual. Because of the complexity of this product and its various uses, we do not guarantee that the given information is complete. If you need additional information, ask your Emerson representative.

The product has been designed to meet the standard industrial safety requirements. It must only be used in its specific area of office telecommunication industry, industrial control, and development. It must not be used in safety critical components, life supporting devices or on aircraft.

Only personnel trained by Emerson or persons qualified in electronics or electrical engineering are authorized to install, remove or maintain the product. The information given in this manual is meant to complete the knowledge of a specialist and must not be used as replacement for qualified personnel.

Keep away from live circuits inside the equipment. Operating personnel must not remove equipment covers. Only factory authorized service personnel or other qualified service personnel may remove equipment covers for internal subassembly or component replacement or any internal adjustment.

Do not install substitute parts or perform any unauthorized modification of the equipment or the warranty may be voided. Contact your local Emerson representative for service and repair to make sure that all safety features are maintained.

General

Danger of Injuries

At the system's rear there are sharp pins which can cause injuries.

Be careful when handling the system.


137

Safety Notes

EMC

The product has been tested and found to comply with the limits for a Class A digital device in this system, pursuant to part 15 of the FCC Rules, EN 55022 Class A respectively. These limits are designed to provide reasonable protection against harmful interference when the product is operated in a commercial, business or industrial environment.

The product generates and uses radio frequency energy and, if not installed properly and used in accordance with this user's documentation, may cause harmful interference to radio communications. Operating the product in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his own expense.

To ensure EMC protection use only shielded cables when connecting peripherals to assure that appropriate radio frequency emissions compliance is maintained. Installed blades must have the face plates installed and all vacant slots in the shelf must be covered.

An AXP1440 that is shipped as a spare, replacement chassis, or an unconfigured system will not have filler panels installed. It is the responsibility of the customer to ensure that all open slots are filled with payload blades, rear transition modules (RTMs), or approved filler panels in order to be compliant with the safety/EMC regulatory markings.

Grounding

To ensure the system is properly grounded, each of the system's parts must contact the EMI gasket. The system contains gaskets at the shelf and module level.

The shelf is also fitted with ESD contacts. Please take care for proper ESD protection of the operator.

This is a Class A product based on the standard of the Voluntary Control Council for

Interference by Information Technology Interference (VCCI). If this equipment is used in a domestic environment, radio disturbance may arise. When such trouble occurs, the user may be required to take corrective actions.

The equipment is suitable for installation in a Common Bonding Network (CBN) or Isolated

Bonding Network (IBN).

138


Safety Notes

System Installation

To avoid system damage verify that the system environment meets the environmental and power requirements given in this manual before installing the system.

Before you begin to set up and cable your new system, consider these guidelines:







Restricted access area: Install the system only in a restricted access area.

Installation codes: This unit must be installed in accordance with the National Electrical

Code, Articles 110.16, 110.17, and 110.18 and the Canadian Electrical Code, Section 12.a

Overcurrent protection: A readily accessible listed branch circuit overcurrent protective device must be incorporated into the building wiring. For appropriate AWG rating of the overcurrent protection device see NEC Table 310.16 and other national regulations.







The protective bonding conductor depends on your power distribution topology. Make sure that you use an appropriate protective bonding conductor regarding the rating of the branch circuit protection.

Install the system safely. Make sure that cables and cords are out of the way.

Make sure that the set-up is comfortable for users.

WARNING: The intra-building port(s) of the equipment or subassembly is suitable for connection to intra-building or unexposed wiring or cabling only. The intra-building port(s) of the equipment or subassembly MUST NOT be metallically connected to interfaces that connect to the OSP or its wiring. These interfaces are designed for use as intra-building interfaces only (Type 2 or Type 4 ports as described in GR-1089) and require isolation from the exposed OSP cabling. The addition of Primary Protectors is not sufficient protection in order to connect these interfaces metallically to OSP wiring.

Environmental contamination can impair system operation.

Locate the system in a stable area free of excess movement and jarring and free of dust, smoke, and electrostatic discharge (ESD). Make sure that the temperature does not exceed the operating temperature given in the environmental requirements in this manual and allow room for proper air flow for cooling.


139

Safety Notes


The system is supplied by a TNV2 voltage. This voltage is considered hazardous.

Make sure that the power supply meets the local safety standards.

Inproper cooling leads to blade damage.

To ensure proper cooling always operate the system in a horizontal position. Furthermore, keep clear at least 6 cm adjacent to the cooling vents on the chassis front and back side. For detailed information refer to

Site Planning Considerations

on page 43 .


Unstable system installation in a rack can cause the rack to topple over.

Therefore, if your system is the only one in the rack, make sure to mount the system in the lowest part of the rack. If other systems are installed in one rack, start with the heaviest component at the bottom.

If the rack is equipped with stabilizing devices, make sure that they are installed and extended so that the rack is secure. Then proceed to mount or service the system.


When pulling the system out of the rack, it can fall down and cause injuries.

Pull out the system cautiously.


The system is heavy and if you carry it on your own you can hurt your back.

To prevent injury, keep your back straight and have two people lift the system or use additional lifting equipment.

During the course of handling, shipping, and assembly, pins, shrouds and mounting screws, fans and other items can become loose or damaged.

Do not operate a damaged shelf, this can cause damage to devices that interface with it.

140


Safety Notes

The caution label on the system's rear near the grounding studs shows that you have to create an earth connection because there may be a high leakage current which is considered as hazardous.

High leakage current can cause injuries. Therefore, it is essential that you create an earth connection before connecting the PEM to a telecommuncation network.

Wrong jumper settings can make the shelf in-operable. Therefore, never change the settings of the jumpers.

Blade and RTM Installation

Damage of Circuits

Electrostatic discharge and incorrect RTM or blade installation and removal can damage circuits or shorten their life.

Before touching the RTM, blade or electronic components, make sure that you are working in an ESD-safe environment.

Installation Sequence of RTMs and AdvancedTCA Blades

If you are going to install an RTM and an AdvancedTCA blade you have to regard the following sequence:

First install the RTM, then install the matching AdvancedTCA blade. Otherwise the blades and

RTMs will be damaged.

Blade or System Damage

Installing a blade in the wrong slot causes blade or system damage.

Only install blades in the designated slots.


141

Safety Notes

Damage of RTM and Front Blade

Removing the RTM from the system while the playload of the front blade is powered up may damage the front blade and RTM.

Whenever removing the RTM from the system, you have to power down the playload of the front blade first.

Incorrect RTM installation and removal can result in RTM malfunctioning.

When plugging the RTM in or removing it, do not press on the face plate but use the handles.

Installing the RTM with other blades than the ones designed for it may damage the RTM and the front blade.

Only install the RTM with the correct front blade.

Removing the RTM with the system power on and the blue LED on the front blade still flashing causes data loss.

Before removing the RTM from a powered system, power down the slot by opening the lower handle of the front blade and wait until the blue LED is permanently ON.


Make sure that the blade is connected to the system backplane through all assembled connectors and that power is available on all zone 1 power pins.

Operation

Cooling vents

Inproper cooling can lead to blade and system damage.

142


Safety Notes

To ensure proper cooling and undisturbed airflow through the system always operate the system in a horizontal position and keep clear at least 60 mm at the back of the system. Do not obstruct the ventilation openings at the top and back of the system. Keep the fresh air intake at the bottom front side of the chassis completely clear, and ensure that fresh air supply is not mixed with hot exhaust from other devices.

To ensure proper air flow within the system make sure that all slots are populated with either filler blades, blades or dummy blades.

High humidity and condensation on blade surfaces causes short circuits.

Do not operate the system outside the specified environmental limits. Make sure the system is completely dry and there is no moisture on any surface before applying power. Do not start the system below 0ºC.

Injury

Caution: this unit has four -48V to -60V DC feeds. All must be disconnected to de-energize the system. To reduce the risk of injury, disconnect the feeds when removing power from the system.

Air Filter

Air contamination can pollute the air filter and obstruct the air intake of the system which may cause system overheating and component damage.

To guarantee proper airflow through the system, the air filter has to be replaced at least every six months. Emerson recommends to replace the air filter every 90 days. Filter replacement frequency depends on the environment the system is subjected to.

Because central offices vary in physical location and cleanliness, check your air filters every week after you first install your system. In a dusty environment, a filter may need cleaning more often than a filter in a cleaner environment. Check the filters frequently until you have a good idea of how often it needs cleaning. Based on your findings, establish a regular cleaning schedule and keep a log to record the date of each filter cleaning or replacement.


143

Safety Notes

144

This equipment is designed to permit the connection of the earthed conductor of the DC supply circuit to the earthing conductor at the equipment. If this connection is made, all of the following conditions must be met:



This equipment shall be connected directly to the DC supply system earthing electrode conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply system earthing electrode conductor is connected.







This equipment shall be located in the same immediate area (such as, adjacent cabinets) as any other equipment that has a connection between the earthed conductor of the same

DC supply circuit and the earthing conductor, and also the point of earthing of the DC system. The DC system shall not be earthed elsewhere.

The DC supply source shall be located within the same premises as this equipment.

Switching or disconnecting devices shall not be in the earthed circuit conductor between the DC source and the point of connection of the earthing electrode conductor.

French translation: Cet appareil est conçu pour permettre le raccordement du conducteur relié

à la terre du circuit d'alimentation c.c. au conducteur de terre de l'appareil. Pour ce raccordement, toutes les conditions suivantes doivent être respectées:







Ce matériel doit être raccordé directement au conducteur de la prise de terre du circuit d'alimentation c.c. ou à une tresse de mise à la masse reliée à une barre omnibus de terre laquelle est raccordée à l'électrode de terre du circuit d'alimentation c.c.

Les appareils dont les conducteurs de terre respectifs sont raccordés au conducteur de terre du même circuit d'alimentation c.c. doivent être installés à proximité les uns des autres (p.ex., dans des armoires adjacentes) et à proximité de la prise de terre du circuit d'alimentation c.c. Le circuit d'alimentation c.c. ne doit comporter aucune autre prise de terre.

La source d'alimentation du circuit c.c. doit être située dans la même pièce que le matériel.

- Il ne doit y avoir aucun dispositif de commutation ou de sectionnement entre le point de raccordement au conducteur de la source d'alimentation c.c. et le point de raccordement

à la prise de terre.

If you reduce the fan speed, the system temperature will rise.

Constantly control the system temperature once you have reduced the fan speed.

While operating the system ensure that the environmental and power requirements are met.


Safety Notes

Injuries or Short Circuits

Blade or Power Supply

In case the ORing diodes of the blade fail, the blade may trigger a short circuit between input line A and input line B so that line A remains powered even if it is disconnected from the power supply circuit (and vice versa).

To avoid damage or injuries, always check that there is no more voltage on the line that has been disconnected before continuing your work.

Expansion

To avoid an overload of the system check the total power consumption of all components installed (see the technical specification of the respective components). Ensure that any individual output current of any source stays within its acceptable limits (see the technical specification of the respective source).

Loss of Safety Compliance

Using of Additional Plug-in Blades

By using additional plug-in blades it may be possible that the system may be no more compliant to safety and EMC regulations.

The system integrator has to ensure that the compliancy is guaranteed.

Exchanging PEMs

Personal Injury through Electric Shock and Burning

Touching the PEM power input terminals with metallic objects on your hands, wrists, or hanging from your neck may lead to serious injuries like burns or amputations. Do not wear any metallic attire or commodity on your hands, wrists, or hanging from your neck when working at the power input terminals or power input cables. Be extremely careful when you use electrically conductive tools near the PEMs.

Short Circuits or Personal Injury

Ensure that the power feeds you plan to remove or attach are powered off and cannot be switched on while you are working.


145

Safety Notes

Short Circuit and Electric Shock

To avoid short circuits and electric shock, the power lugs must not be energized before removing the screws. It is essential to ensure that the power lugs are not energized before loosening the screws. Be careful with the used tools in order to prevent a short circuit.

Applying reversal power causes damage to the electrolytic capacitors of the filter. Therefore, only switch on the breakers if no red light is visible.

Exchanging Fans

Cabling

Rotating Fans

Inserting tools or fingers into operational fans may cause injuries.

Fans become exposed when the fan tray is pulled. Keep clear of the fans as long as they are rotating.

When the fan is removed, extreme care should be taken while handling the fan itself. The centrifugal forces will make the unit difficult to handle.

146

The cabling should follow existing cable paths using existing or similar cable fastenings.

Never change the system's cabling as delivered by Emerson. Check proper function of the system after cabling extensions. To avoid injuries always ensure that cables are securely installed so that nobody can trip over them.

Personal Injury through Electric Shock

Touching contacts and cables during system operation can cause injuries through electric shock.

To avoid electric shock make sure that contacts and cables of the system cannot be touched while the system is operating. If in doubt concerning cabling, ask your local Emerson representative.


Safety Notes

Folding the fiber cable damages the cable and inhibits the data transmission. Therefore, make sure you do not fold the cable.

RJ-45 Connector

RJ-45 connectors on blades are either twisted-pair Ethernet (TPE) or E1/T1/J1 network interfaces. Connecting an E1/T1/J1 line to an Ethernet connector may damage your system.



Make sure that TPE connectors near your working area are clearly marked as network connectors.







Verify that the length of an electric cable connected to a TPE bushing does not exceed 100 m.

Make sure the TPE bushing of the system is connected only to safety extra low voltage circuits (SELV circuits).

If in doubt, ask your system administrator.

Laser

Battery

Some variants of the blades in the system are Class 1 laser products. The use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Some variants of the RTM are a Class 1 laser product. The use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Wrong battery installation may result in hazardous explosion and blade damage.


147

Safety Notes

Always use the same type of battery as is installed and make sure the battery is installed as described in the user manual of the blade.

Always dispose of old batteries according to your country's legislation.

Environment

Environmental

Always dispose of used blades, system components and RTMs according to your country’s legislation and manufacturer’s instructions.

148


Sicherheitshinweise

Dieses Kapitel enthält Hinweise, die potentiell gefährlichen Prozeduren innerhalb dieses

Handbuchs vorrangestellt sind. Beachten Sie unbedingt in allen Phasen des Betriebs, der

Wartung und der Reparatur des Systems die Anweisungen, die diesen Hinweisen enthalten sind. Sie sollten außerdem alle anderen Vorsichtsmaßnahmen treffen, die für den Betrieb des

Systems innerhalb Ihrer Betriebsumgebung notwendig sind. Wenn Sie diese

Vorsichtsmaßnahmen oder Sicherheitshinweise, die an anderer Stelle diese Handbuchs enthalten sind, nicht beachten, kann das Verletzungen oder Schäden am System zur Folge haben.

Emerson ist darauf bedacht, alle notwendigen Informationen zum Einbau und zum Umgang mit dem System in diesem Handbuch bereit zu stellen. Da es sich jedoch bei dem System um ein komplexes Produkt mit vielfältigen Einsatzmöglichkeiten handelt, können wir die

Vollständigkeit der im Handbuch enthaltenen Informationen nicht garantieren. Falls Sie weitere Informationen benötigen sollten, wenden Sie sich bitte an die für Sie zuständige

Geschäftsstelle von Emerson.

Das System erfüllt die für die Industrie geforderten Sicherheitsvorschriften und darf ausschließlich für Anwendungen in der Telekommunikationsindustrie, im Zusammenhang mit

Industriesteuerungen und in der Entwicklung verwendet werden. Es darf nicht in sicherheitskritischen Anwendungen, lebenserhaltenden Geräten oder in Flugzeugen verwendet werden.

Einbau, Wartung und Betrieb dürfen nur von durch Emerson ausgebildetem oder im Bereich

Elektronik oder Elektrotechnik qualifiziertem Personal durchgeführt werden. Die in diesem

Handbuch enthaltenen Informationen dienen ausschließlich dazu, das Wissen von

Fachpersonal zu ergänzen, können dieses jedoch nicht ersetzen.

Halten Sie sich von stromführenden Leitungen innerhalb des Systems fern. Entfernen Sie auf keinen Fall die Systemabdeckung. Nur werksseitig zugelassenes Wartungspersonal oder anderweitig qualifiziertes Wartungspersonal darf die Systemabdeckung entfernen, um

Systemkomponenten zu ersetzen oder andere Anpassungen vorzunehmen.

Installieren Sie keine Ersatzteile oder führen Sie keine unerlaubten Veränderungen am System durch, sonst verfällt die Garantie. Wenden Sie sich für Wartung oder Reparatur bitte an die für

Sie zuständige Geschäftsstelle von Emerson. So stellen Sie sicher, dass alle sicherheitsrelevanten Aspekte beachtet werden.


149


Allgemein

Verletzungsgefahr

An der Rückseite des Systems befinden sich spitze Stifte, an denen Sie sich verletzen können.

Seien Sie vorsichtig im Umgang mit dem System.

EMV

Das Produkt wurde getestet und erfüllt die für digitale Geräte der Klasse A gültigen Grenzwerte gemäß den FCC-Richtlinien Abschnitt 15 bzw. EN 55022 Klasse A. Diese Grenzwerte sollen einen angemessenen Schutz vor Störstrahlung beim Betrieb des Produkts in Geschäfts-,

Gewerbe- sowie Industriebereichen gewährleisten.

Das Produkt arbeitet im Hochfrequenzbereich und erzeugt Störstrahlung. Bei unsachgemäßem Einbau und anderem als in diesem Handbuch beschriebenen Betrieb können

Störungen im Hochfrequenzbereich auftreten.

Benutzen Sie zum Anschließen von Peripheriegeräten ausschließlich abgeschirmte Kabel. So stellen Sie sicher, dass ausreichend Schutz vor Störstrahlung vorhanden ist. Die Blades müssen mit der Frontblende installiert und alle freien Steckplätze müssen mit Blindblenden abgedeckt sein.

Ein AXP1440, das als Ersatzteil, Austauschchassis oder unkonfiguriertes System ausgeliefert wird, enthält keine Platzhalter-Boards. Es liegt in der Kundenverantwortung sicherzustellen, dass alle leeren Steckplätze mit Boards, RTMs oder zugelassenen Platzhalter-Boards belegt sind, um die Sicherheits- und EMC-Vorschriften zu erfüllen.

Erdung

Um eine korrekte Erdung des Systems zu gewährleisten, befinden sich sowohl am System als auch an den einzelnen Modulen Dichtungen. Stellen Sie sicher, dass alle Systemteile die EMI

Dichtung berühren.

Am System befinden sich auch ESD Kontakte. Stellen Sie sicher, dass jede Person, die mit dem

System arbeitet, mit ESD-Schutz, zum Beispiel ESD Bändern, ausgerüstet ist.

150



Das Produkt ist eine Einrichtung der Klasse A gemäß dem Standard des Voluntary Control

Council for Interference von Information Technology Interference (VCCI). Wird das Produkt in

Wohngegenden betrieben, können Störungen im Hochfrequenzbereich auftreten. In einem solchen Fall ist der Benutzer verpflichtet, entsprechende Gegenmaßnahmen zu ergreifen.

Das Produkt ist für den Einsatz in Netzwerken mit gemeinsamem Potentialausgleich oder mit isoliertem Potentialausgleich geeignet.

Systeminstallation

Beschädigung des Systems

Bevor Sie das System installieren, überprüfen Sie, ob die im Handbuch beschriebenen

Anforderungen erfüllt werden.

Beachten Sie folgende allgemeinen Sicherheitshinweise vor der Installation und Verkabelung des Systems:



Bereich mit eingeschränktem Zugang - Installieren Sie das System nur in Bereichen mit eingeschränktem Zugang.











Installationsrichtlinien: Dieses System muss gemäß folgender Richtlinien installiert werden: National Electrical Code, Artikel 110.16, 110.17 und 110.18 und Canadian

Electrical Code, Abschnitt 12.a

Überstrom Schutzeinrichtung - Eine leicht zugängliche Trennvorrichtung muss in der

Gebäudeverkabelung eingebaut sein. Einen angemessenen AWG (American Wire Gauge - amerikanische Norm für Drahtquerschnitte) Wert der Überstrom Schutzeinrichtung können Sie der NEC (National Electrical Code) Tabelle 310.16 oder anderen nationalen

Regelwerken entnehmen.

Der Erdungsleiter ist abhängig von der Spannungsverteilungstopologie innerhalb Ihrer

Anlage. Stellen Sie sicher, dass Sie einen angemessenen Erdungsleiter gemäß der

Auslegung des Zugangsleitungsschutzes verwenden.

Bauen Sie das System sicher ein. Stellen Sie sicher, dass Kabel und Leitungen nicht im Weg sind.

Stellen Sie sicher, dass der Systemaufbau anwenderfreundlich ist.


151



Die Gebäude-internen Schnittstellen ("intra-building ports" per GR-1089-CORE) der Geräte oder Baugruppen sind nur für gebäudeinterne Verkabelung vorgesehen. Die Schnittstellen sind als Typ 2 oder Typ 4 definiert (wie in GR-1089-Core beschrieben) und erfordern eine

Isolation zu Leitungen außerhalb des Gebäudes.

Die Gebäude-internen Schnittstellen dürfen keine elektrisch leitende Verbindung zu Leitungen außerhalb des Gebäudes haben. Ein "Primary Protector" (wie in GR-1089-CORE beschrieben) ist keine ausreichende Absicherung, um die Gebäude-internen Schnittstellen mit Leitungen außerhalb des Gebäudes zu verbinden.


Verschmutzungen können das System beschädigen.

Betreiben Sie das System an einem erschütterungsfreien Ort, an dem weder Staub, Rauch noch elektrostatische Entladungen auftreten. Stellen Sie außerdem sicher, dass die klimatischen

Bedingungen, die in diesem Handbuch spezifiziert sind, eingehalten werden und genug Raum für die Luftzirkulation vorhanden ist.

Verletzungsgefahr und Beschädigung des Systems

Das System ist an eine TNV-2 Spannungsquelle angeschlossen. Diese Spannung kann gefährlich sein.

Stellen Sie sicher, dass die externe Spannungsversorgung den entsprechenden

Sicherheitsstandards entspricht.

Unzureichende Kühlung kann zu einer Beschädigung der Boards führen.

Um eine ausreichende Kühlung sicherzustellen betreiben Sie das System nur aufrecht. Sorgen

Sie außerdem dafür, dass ein aureichender Mindestabstand (mindestens 6 cm) vor den

Lüftungsschlitzen an der Vorder- und Rückseite des Systems freigehalten wird. Genaue

Informationen finden Sie im Kapitel

Site Planning Considerations

on page 43 .

152



Verletzungsgefahr und Beschädigung des Systems

Wenn die Gewichte im Schaltschrank ungleich verteilt sind, kann der Schaltschrank umkippen.

Bauen Sie das System deshalb ganz unten im Schrank ein, wenn es das einzige System im

Schrank ist. Wenn mehrere Systeme in einen Schrank eingebaut werden sollen, plazieren Sie das schwerste System ganz unten und die leichteren weiter oben. Falls der Schaltschrank mit

Kippsicherungen ausgestattet ist, stellen Sie sicher, dass diese auch installiert und ausgefahren sind, um einen sicheren Stand des Schranks zu gewährleisten. Beginnen Sie erst danach mit dem Einbau oder der Wartung des Systems.

Verletzungsgefahr oder Beschädigung des Systems

Das System kann beim Herausziehen herunterfallen und Verletzungen verursachen.

Ziehen Sie das System vorsichtig heraus, damit es nicht herunterfällt.

Verletzungsgefahr oder Beschädigung des Systems

Das System ist schwer, und wenn Sie es alleine tragen, kann dies zu Rückenschäden führen.

Heben Sie deshalb das System nur zu zweit und halten Sie beim Heben Ihren Rücken gerade oder benutzen Sie zusätzliche Hilfsmittel.


Während des Transportes und Zusammenbaus des Systems können sich Teile, wie zum

Beispiel Schrauben, Blenden, Stecker oder Lüfter lösen oder beschädigt werden.

Nehmen Sie das System nicht in Betrieb, wenn Teile beschädigt sind. Dies könnte zu

Beschädigungen an anderen Teilen führen.

Dieser Aufkleber befindet sich in der Nähe der Schuzleiter auf der Rückseite des Systems und warnt, dass Sie vor der Inbetriebnahme eine Erdung durchführen müssen, da hier ein hoher

Ableitstrom vorhanden sein kann.


153


Hoher Ableitstrom kann zu Verletzungen führen.

Stellen Sie deshalb vor Anschluss des Systems an ein Telekommunikationsnetz unbedingt eine

Erdungsverbindung her.


Falsche Jumper-Einstellungen können dazu führen, dass das System nicht mehr funktioniert.

Ändern Sie deshalb nie die Einstellungen der Jumper.

Board und RTM Installation

Beschädigung des Boards

Berühren Sie das Board oder elektrische Komponenten in einem nicht ESD-geschützten

Bereich, kann dies zu einer Beschädigung des Boards führen.

Bevor Sie Boards oder elektronische Komponenten berühren, vergewissern Sie sich, dass Sie in einem ESD-geschützten Bereich arbeiten.

Reihenfolge bei der Installation von RTMs und AdvancedTCA Boards

Die folgende Reihenfolge muß bei der Installation von RTMs und AdvancedTCA Boards eingehalten werden:

Installieren Sie zuerst das RTM und erst danach das passende AdvancedTCA Board. Ansonsten können RTM oder Board beschädigt werden.

Beschädigung des Boards oder Systems

Wird ein Board in den falschen Steckplatz im System gesteckt, können sowohl das Board als auch das System beschädigt werden. Installieren Sie Boards deshalb ausschließlich in dafür vorgesehene Steckplätze.

Beschädigung des RTMs oder Boards

Wird das RTM ausgebaut, während die Payload des dazugehörigen AdvancedTCA Boards noch nicht heruntergefahren ist, kann dies zu Beschädigungen am Board oder RTM führen.

Fahren Sie deshalb die Payload des AdvancedTCA Blades immer herunter, bevor Sie das dazugehörige RTM aus dem System entfernen.

154



Beschädigung des RTMs

Fehlerhafte Installation kann zu einer Beschädigung des RTMs führen. Verwenden Sie die

Handles, um das RTM zu installieren/deinstallieren. Auf diese Weise vermeiden Sie, dass die

Frontblende oder die Platine deformiert oder zerstört werden.

Beschädigung des RTMs oder Boards

Das System wird beschädigt, wenn die RTMs nicht zu den von vorne in dem System installierten Boards passen.

Stellen Sie deshalb sicher, dass Boards und RTMs, die von vorne bzw. von hinten in den gleichen

Steckplatz des Systems eingebaut werden, stets zueinander passen.

Datenverlust

Das Entfernen eines RTMs während des Systembetriebs und blinkender blauer LED des Front

Boards führt zu Datenverlust.

Vor dem Entfernen des RTMs im laufenden Systembetrieb, schalten Sie das entsprechende

Board ab, indem Sie die Griffe des Boards öffnen. Warten Sie, bis die blaue LED dauerhaft leuchtet.

Fehlfunktion

Unsachgemäßer Ein- und Ausbau von Boards kann zu einer Fehlfunktion des Boards führen.

Vergewissern Sie sich, dass das Board über alle Stecker an die AdvancedTCA-Backplane angeschlossen und die Stromversorgung gewährleistet ist.

Betrieb

Überhitzung des Systems

Lüftungsschlitze

Unzureichende Lüftung kann Schäden an Boards und am System verursachen.


155


Um eine ausreichende Lüftung zu gewährleisten, stellen Sie sicher, dass das System während des Betriebs stets waagerecht steht und dass ein Freiraum von mindestens 60 mm an der

Rückseite des Systems vorhanden ist. Halten Sie die Lüftungsschlitze an der Oberseite und der

Rückseite des Systems frei. Halten Sie die Frischluftzufuhröffnung an der unteren Vorderseite des Systems völlig frei und stellen Sie sicher, dass sich die Frischluft nicht mit der Abluft von anderen Systemen mischt.

Um eine ungestörte Luftzirkulation zu gewährleisten, stellen Sie sicher, dass alle Steckplätze mit Boards oder Platzhaltern belegt sind.


Durch hohe Luftfeuchtigkeit können Kurzschlüsse entstehen.

Betreiben Sie das System nur innerhalb der angegebenen Grenzwerte für die relative

Luftfeuchtigkeit und Temperatur. Stellen Sie vor dem Einschalten des Stroms sicher, dass sich auf dem System und auf den Boards kein Kondensat befindet und starten Sie das System nicht unter 0ºC.

Stromschlaggefahr

Das System besitzt vier -48V bis -60V DC Anschlüsse. Alle Anschlüsse müssen vom System entfernt werden, um das System spannungsfrei zu schalten.

Um eine Verletzungsgefahr zu minimieren, entfernen Sie die Anschlüsse, wenn Sie das System ausschalten.


Luftfilter

Verunreinigungen in der Luft können den Luftfilter verschmutzen und so die Luftzufuhr des

Systems beeinträchtigen. Das kann zur Überhitzung des Systems und zu Schäden an

Systemteilen führen.

Um einen reibungslosen Luftstrom durch das System zu gewährleisten, sollten Sie den

Luftfilter spätestens alle sechs Monate austauschen. Emerson empfiehlt, die Lüfter alle 90 Tage auszutauschen. Wie häufig Sie die Filter austauschen müssen, hängt von der Umgebung ab, in der das System betrieben wird. Da die Verhältnisse in Vermittlungsstellen sehr unterschiedlich sein können, sollten Sie die Luftfilter nach der Erstinstallation des Systems jede Woche kontrollieren. In einer staubigen Umgebung muss ein Filter gegebenenfalls öfter gereinigt

156



werden als in einer sauberen Umgebung. Prüfen Sie den Filter regelmäßig bis Sie eine

Vorstellung davon haben, wie oft der Filter gereinigt werden muss. Erstellen Sie aufgrund Ihrer

Beobachtungen einen Reinigungsplan und protokollieren Sie jede Reinigung oder jeden

Austausch des Filters.

Überhitzung des Systems

Wenn Sie die Geschwindigkeit der Lüfter reduzieren, steigt die Systemtemperatur an.

Kontrollieren Sie deshalb ständig die Temperatur im System, wenn Sie die Geschwindigkeit der

Lüfter reduziert haben. Stellen Sie während des Betriebs sicher, dass die Bedingungen, die im

Handbuch beschrieben sind, eingehalten werden.

Verletzungen oder Kurzschlüsse

Blade oder Stromversorgung

Falls die ORing Dioden des Blades durchbrennen, kann das Blade einen Kurzschluss zwischen den Eingangsleitungen A und B verursachen. In diesem Fall ist Leitung A immer noch unter

Spannung, auch wenn sie vom Versorgungskreislauf getrennt ist (und umgekehrt).

Prüfen Sie deshalb immer, ob die Leitung spannungsfrei ist, bevor Sie Ihre Arbeit fortsetzen, um Schäden oder Verletzungen zu vermeiden.

Ausbau/Erweiterung

Systemüberlastung

Verhindern Sie eine Systemüberlastung, indem Sie die gesamte aufgenomme Leistung aller eingebauten Komponenten, also z.B. der installierten Blades und Laufwerke (siehe die technischen Daten der entsprechenden Komponente) überprüfen. Stellen Sie sicher, dass der

Ausgangsstrom jedes Verbrauchers innerhalb der zulässigen Grenzwerte liegt.

Verlust der Sicherheitszulassung

Verwendung zusätzlicher Module

Wenn Sie zusätzliche Module und Boards verwenden, ist es möglich, dass das System nicht mehr den gültigen Sicherheits- und EMV Normen entspricht. Der Systemintegrator muss die

Einhaltung der gültigen Normen sicherstellen.


157


Austausch von PEMs

Verletzungsgefahr durch Stromschlag und Verbrennungen

Berühren metallische Gegenstände an Händen, Handgelenken oder am Hals die Input

Terminals der PEMs, kann dies zu extremen Verletzungen, wie zum Beispiel Verbrennungen oder Amputationen führen. Tragen Sie bei der Arbeit mit dem System keine metallischen

Gegenstände an Ihren Händen oder Armen und lassen sie keine metallischen Gegenstände um

Ihren Hals hängen. Seien Sie extrem vorsichtig mit elektrisch leitenden Gegenständen in der

Nähe der PEMs.

Kurzschluß und Gefahr durch Stromschlag

Um einen elektrischen Schlag zu vermeiden, überzeugen Sie sich, dass vor dem Austausch des

PEMs die Stromzufuhr unterbrochen ist und während des Austausches unterbrochen bleibt.

Kurzschluß und Gefahr durch Stromschlag

Um Kurzschlüsse und elektrischen Schlag zu vermeiden, überzeugen Sie sich, dass vor dem

Lösen der Schrauben die Stromzufuhr unterbrochen ist und während des Austausches unterbrochen bleibt. Vermeiden Sie Kurzschlüsse, indem Sie sehr vorsichtig mit dem

Werkzeug umgehen.

Beschädigung der Spannungsversorgungseinheit

Wir die Spannungsversorgungseinheit verkehrt angeschlossen, werden die

Elektrolytkondensatoren der Filter beschädigt. Schalten Sie die Unterbrecher deshalb nur, wenn das rote Licht nicht sichtbar ist.

Lüfteraustausch

Verletzungsgefahr

Rotierende Lüfterschaufeln

Sie können verletzt werden, wenn Sie Werkzeuge oder Finger in laufende Lüfter einführen.

Wenn Sie die Lüfterschublade aus dem Chassis ziehen, wird die Abdeckung der Lüfterschaufeln freigelegt. Berühren Sie die Lüfterschaufeln nicht.

Seien Sie vorsichtig nach dem Herausziehen des Lüfters, da die Zentrifugalkräfte noch wirken und somit die Handhabung erschweren können.

158



Verkabelung/Kabelführung

Verletzungsgefahr

Verändern Sie nie die von Emerson ausgelieferte Verkabelung des Systems.

Stellen Sie sicher, dass die Verkabelung schon existierenden Kabelführungen folgt und bestehende oder ähnliche Befestigungen verwendet. Überprüfen Sie nach der Erweiterung der

Verkabelung, ob das System ordnungsgemäß arbeitet.

Reduzieren Sie die Verletzungsgefahr, indem Sie Kabel so verlegen, dass niemand darüber stolpern kann.

Verletzungsgefahr durch Stromschlag

Durch das Berühren von Kontakten und Kabeln während des Betriebs können Sie einen elektrischen Schlag bekommen.

Schließen Sie in jedem Fall aus, dass Personen durch einen elektrischen Schlag verletzt werden können, indem Sie sicherstellen, dass Kontakte und Kabel des Systems während des Betriebs nicht berührt werden können.

Falls Sie Fragen bezüglich der Verkabelung haben, wenden Sie sich an die für Sie zuständige

Geschäftsstelle von Emerson.

Beschädigung der Kabel

Werden Kabel geknickt, kann das Kabel beschädigt werden und der Datentransfer nicht mehr stattfinden. Stellen Sie sicher, dass Kabel nicht geknickt werden.

RJ-45 Stecker


Bei den RJ-45 Steckern, die sich auf den Boards befinden, handelt es sich entweder um Twisted-

Pair-Ethernet (TPE) oder um E1/T1/J1-Stecker. Beachten Sie, dass ein versehentliches

Anschließen einer E1/T1/J1 Leitung an einen TPE-Stecker Ihr System zerstören kann.





Kennzeichnen Sie deshalb TPE-Anschlüsse in der Nähe Ihres Arbeitsplatzes deutlich als

Netzwerkanschlüsse.

Stellen Sie sicher, dass die Länge eines mit Ihrem Systems verbundenen TPE-Kabels 100 m nicht überschreitet.


159






Das System darf über die TPE Stecker nur mit einem Sicherheits-Kleinspannungs-

Stromkreis (SELV) verbunden werden.

Bei Fragen wenden Sie sich an Ihren Systemverwalter.

Laser

Verletzungsgefahr

Einige Boards, die in verschiedenen Systemkonfigurationen verwendet werden, sind

Laserprodukte der Klasse 1. Verwenden Sie diese anders als in der Dokumentation beschrieben, kann dies zu gefährlicher Strahlung führen.

Einge RTMs sind Laserprodukte der Klasse 1. Verwenden Sie diese anders als in der

Dokumentation beschrieben, kann dies zu gefährlicher Strahlung führen.

Batterieaustausch

Beschädigung der Boards

Ein unsachgemäßer Austausch von Batterien kann zu gefährlichen Explosionen und

Beschädigung der Boards führen.

Verwenden Sie deshalb nur den Batterietyp, der auch bereits eingesetzt wurde und befolgen

Sie die entsprechende Anleitung im Installationshandbuch des jeweiligen Boards.

Entsorgen sie alte Batterien entsprechend der in Ihrem Land gültigen Richtlinien.

Umweltschutz

Umweltschutz

Entsorgen Sie alte Blades, RTMs und Systeme gemäß der in Ihrem Land gültigen Gesetzgebung und den Empfehlungen des Herstellers.

160


Index

A

Abbreviations

13

air filter maintenance

61

air filter, storing

62

air filters

61

Air flow

101

airflow

59

application software upgrades

24

architecture, SAM1500

116

B

backplane connectivity

22

description

29

functional layout

29

, mechanical layout

29

34

power connectors

29

slot connectors

31

slot numbering

29

backplane PCB

40

,

34

Basic Blade Services

23

baud rate, SAM

76

,

118

Blade

Filler

101

blade connectivity, diagram

35

Blade installation

Into powered shelves

94

Blade removal

From powered shelves

97

block diagram, SAM1500

116

Blower

Speed

47

Blue LED

101

boards, stationary

40

bonding point

37

bonding point, ESD

67

bus segments

29

busses

I2C

119

off-board

119

C

cables power feed sensing

71

chip temperature

122

AXP1440 Installation and Use (6806800H23J) circuit breakers

39

,

55

,

75

cleaning air filters

61

clogged filter

60

Closed frame

53

command line interface

131

configuring the I2C bus

119

connectivity between zones

22

connectivity, PEMs

38

connectors backplane

31

SAM1500

113

Control

Noise

53

controller shelf management

113

conventions

16

Cooling

51

cooling failure, troubleshooting

60

PEM

57

cooling output

59

CPIO extension

119

custom functionality

24

D

data loss

56

devices, I2C

119

disabling power

56

Dissipation

Heat

52

Document organization

13

E

earth ground

71

EIA equipment rack

66

ejector handle, FTM

59

e-keying, description

30

emergency power-off

56

enclosure description

28

Environmental conditions

45

environments, intended

19

equipment rack/cabinet

66

ESD precautions

67

event logs

24

161

Index

F

fabric interface

20

face plate connectors, SAM1500

118

failed fan

60

fan speed levels

59

Fan tray

51

fan tray module, description

36

features

SAM

114

shelf

25

Filler blade

101

Filter

Replacement frequency

143

filter, storage

62

filters for FTMs

61

filters, cleaning

61

firmware upgrade

76

Frame

Closed

53

frame release rack

66

FRU information of components

31

FTM air filters

61

power distribution

59

FTM PCB

40

FTM, see fan tray module

G

grounding DC platform

71

H

hardware monitoring

119

,

121

Heat dissipation

52

hot swap

FTM

59

interfaces

131

LED

120

hub connectivity, diagram

35

hub slots

20

I

I2C bus configuration

119

I2C devices

119

Installation

Into powered systems

86

162

M100

99

Shelf manager

99

installing system

63

interconnect boards

40

interconnect for RTMs

34

interfaces data transport

34

fabric

20

hot swap

131

power

34

RTM

34

serial

118

system management

34

IPMI network

21

K

kits, mounting brackets

68

,

69

L

LED

LEDs

Blue

101

behavior

120

face plate, SAM

120

face plate, SAM1500

117

FTM

59

power status

39

logical slot numbers

29

,

34

logical slots and physical slots

20

M

M100

98

maintenance, air filters

61

maintenance, remote

24

Manual organization

13

MontaVista CGE

23

mounting bracket, part numbers

68

mounting options

66

,

69

mounting the shelf

63

N

network designs

20

network topologies

19

networks

21


Index

Noise

53

Control

53

nonstandard rack

66

O

obstruction of air intake

61

on-board circuitry

58

Options

System installation

50

Organization

13

Overheating

52

Overview

Manual

13

P

PEM connectivity

58

IPMC circuitry

58

PEM connectivity, diagram

38

PEM cooling

37

PEM, see power entry module

physical slot numbers

29

,

34

physical slots and logical slots

20

PICMG compliance

19

Platform

19

power cable

71

power conversion

57

power entry module, description

37

power input segmentation

57

power off slots

21

Power requirements

48

power source

55

power supplies

,

39

output

55

status indicators

39

,

59

power supply voltage

122

power to FTM

59

power-off, emergency

56

power-on

55

Preparing the site

43

R

rack/cabinet, equipment

66

remote access

24

remote management

24

163

replacing air filters

61

PEMs

103

Requirements

Environmental

45

Power

48

reset slots

21

Revision history

18

S

safety, ESD procedures

67

SAM baud rate

118

LEDs

120

RS-232

118

SAM1500 features

113

functional description

118

hot swap

120

LEDs

117

,

120

software

131

status LEDs

121

SEEPROM, location

31

sensors temperature

122

voltage

122

serial interface, SAM

118

shelf description

28

shelf FRU, IPMI FRU commends

31

shelf management

113

shelf management controller

113

shelf management mezzanine module

113

shelf management software

131

Shelf manager

98

shelf, description

25

Shipment

44

ShM/ATCA-M100

98

ShMC, see shelf management controller

Site preparation

43

slot addressing, PEM

37

slot connectivity

35

slot connector descriptions

31

slot connectors

31

Slots

Not occupied

101


Index

slots, shelf manager

113

software

PEM

58

SAM1500

113

,

122

software, available

23

,

131

software, information on

55

Speed

Blower

47

stationary PCBs

40

status LED, SAM1500

121

System

Installation options

50

Overheating

52

system features

25

installation

63

T

temperature monitoring

122

topologies fabric

20

IPMI

21

topologies, description

19

troubleshooting, cooling

60

U

update channel, description

22

upgrading firmware

24

upper fan tray module

59

V

voltage sensors

122

voltages, power supply

122

Z

Zone 1 description

22

Zone 2 description

22

Zone 3 description

22

164


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