Galaxy Raid Installation and Hardware Reference Manual

Galaxy Raid Installation and Hardware Reference Manual
Galaxy Raid
Model A16F-G2422
FC-4G to SATA-II RAID Subsystem
Installation and Hardware
Reference Manual
Version 070106
Version 1.0 (08, 2005)
Galaxy Raid Installation and Hardware Reference Manual
Contact Information
Americas
Rorke Data Inc
9700 West 76th St
Eden Prairie, MN 55344
USA
Tel: +1-800 328 8147
Fax: +1-952 829 0988
[email protected]
[email protected]
http://www.rorke.com
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Galaxy Raid Installation and Hardware Reference Manual
Copyright 2005
This Edition First Published 2005
All rights reserved. This publication may not be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without the prior written
consent of Rorke Data , Inc.
Disclaimer
Rorke Data makes no representations or warranties with respect to the
contents hereof and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. Furthermore, Rorke
Data reserves the right to revise this publication and to make changes from
time to time in the content hereof without obligation to notify any person of
such revisions or changes. Product specifications are also subject to change
without prior notice.
Trademarks
Galaxy and the Galaxy logo are registered trademarks of Rorke Data , Inc.
PowerPC® is a trademark of International Business Machines Corporation
and Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered
trademarks of their respective owners.
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Galaxy Raid Installation and Hardware Reference Manual
Warnings and Certifications
FCC (applies in the U.S. and Canada)
FCC Class A Note
This device complies with Part 15 of the FCC rules. Operation is subject to
the following two conditions: (1) this device may not cause harmful
interference, and (2) this device may accept any interference received,
including interference that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
The changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate the
equipment.
WARNING:
Use only shielded cables to connect I/O devices to this equipment.
You are cautioned that changes or modifications not expressly approved by
the party responsible for compliance could void your authority to operate the
equipment.
This device is in conformity with the EMC.
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Galaxy Raid Installation and Hardware Reference Manual
CB
This device is in conformity with the CB safety specifications.
This device meets the requirements of the CB standard for electrical
equipment with regard to establishing a satisfactory level of safety for
persons using the device and for the area surrounding the apparatus. This
standard covers only safety aspects of the above apparatus; it does not cover
other matters, such as style or performance.
ITE BSMI Class A, CNS 13438 (for Taiwan)
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Galaxy Raid Installation and Hardware Reference Manual
Table of Contents
CHAPTER 1 INTRODUCTION
1.1. PRODUCT OVERVIEW .................................................................................................. 1-1
1.1.1
Product Introduction.......................................................................................... 1-1
1.1.2
Enclosure Chassis .............................................................................................. 1-2
1.1.2.1
1.1.2.2
1.1.2.3
1.1.2.4
1.1.2.5
1.1.2.6
Chassis Overview.............................................................................................................. 1-2
Physical Dimensions ......................................................................................................... 1-3
Front Panel Overview ....................................................................................................... 1-3
Hard Drive Numbering ..................................................................................................... 1-4
Rear Panel Overview......................................................................................................... 1-4
Back-plane Board.............................................................................................................. 1-5
1.2. GALAXY COMPONENTS ............................................................................................ 1-5
1.2.1
LCD Panel.......................................................................................................... 1-5
1.2.2
Drive Trays......................................................................................................... 1-6
1.2.3
RAID Controller Modules.................................................................................. 1-6
1.2.4
Controller Module Interfaces ............................................................................ 1-7
1.2.5
DIMM Modules .................................................................................................. 1-9
1.2.6
BBU .................................................................................................................... 1-9
1.2.7
PSUs ................................................................................................................. 1-10
1.2.8
Cooling Modules .............................................................................................. 1-11
1.3. GALAXY MONITORING ........................................................................................... 1-12
1.3.1
I2C bus ............................................................................................................. 1-12
1.3.2
LED Indicators................................................................................................. 1-12
1.3.3
Firmware (FW) and RAIDWatch GUI ............................................................ 1-13
1.3.4
Audible Alarms................................................................................................. 1-13
1.4. HOT-SWAPPABLE COMPONENTS ............................................................................... 1-13
1.4.1
Hot-swap Capabilities...................................................................................... 1-13
1.4.2
Components...................................................................................................... 1-13
1.4.3
Normalized Airflow .......................................................................................... 1-14
CHAPTER 2 HARDWARE INSTALLATION
2.1. INSTALLATION OVERVIEW ................................................................................ 2-1
2.2. INSTALLATION PRE-REQUISITES...................................................................... 2-1
2.3. SAFETY PRECAUTIONS: ....................................................................................... 2-2
2.3.1
Precautions and Instructions ............................................................................. 2-2
2.3.2
Static-free Installation........................................................................................ 2-3
2.4. GENERAL INSTALLATION PROCEDURE .......................................................... 2-3
2.4.1
Installation Procedure Flowchart ..................................................................... 2-4
2.5. UNPACKING THE SUBSYSTEM........................................................................... 2-5
2.6. INSTALLATION OVERVIEW ................................................................................ 2-5
2.6.1
Pre-installed Components.................................................................................. 2-5
2.6.2
Uninstalled Components.................................................................................... 2-5
2.7. INSTALLING THE OPTIONAL BBU ..................................................................... 2-6
2.7.1
BBU Installation Overview ................................................................................ 2-6
2.7.2
BBU Warnings and Precautions........................................................................ 2-6
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Galaxy Raid Installation and Hardware Reference Manual
2.7.3
Installation Procedure ....................................................................................... 2-7
2.8. HARD DRIVE INSTALLATION ............................................................................. 2-9
2.8.1
Hard Drive Installation Prerequisites ............................................................... 2-9
2.8.2
SATA Drive Installation..................................................................................... 2-9
2.9. DRIVE TRAY INSTALLATION............................................................................ 2-10
2.10. RACK/CABINET INSTALLATION...................................................................... 2-12
CHAPTER 3 SUBSYSTEM MONITORING
3.1. SUBSYSTEM MONITORING OVERVIEW........................................................................ 3-1
3.2. STATUS-INDICATING LEDS......................................................................................... 3-2
3.2.1
Brief Overview of the LEDs ............................................................................... 3-2
3.2.2
LCD Panel.......................................................................................................... 3-3
3.2.3
Drive Tray LEDs ................................................................................................ 3-4
3.2.4
Controller Module LEDs ................................................................................... 3-5
3.2.5
LAN Port LEDs .................................................................................................. 3-6
3.2.6
BBU LED............................................................................................................ 3-7
3.2.7
PSU LEDs .......................................................................................................... 3-8
3.2.8
Cooling Module LEDs ....................................................................................... 3-9
3.3. AUDIBLE ALARM ...................................................................................................... 3-10
3.3.1
Default Threshold Values ................................................................................ 3-10
3.3.2
Failed Devices.................................................................................................. 3-11
3.4. I2C MONITORING ...................................................................................................... 3-11
CHAPTER 4 SUBSYSTEM CONNECTION AND OPERATION
4.1
FC HOST CONNECTION PREREQUISITES ......................................................... 4-1
4.1.1
Choosing the Fibre Cables ................................................................................ 4-1
4.1.2
FC Lasers ........................................................................................................... 4-2
4.1.3
FC Speed Auto-detection ................................................................................... 4-2
4.1.4
SFP Transceivers ............................................................................................... 4-2
4.2
TOPOLOGY AND CONFIGURATION CONSIDERATIONS............................... 4-3
4.2.1
Basic Configuration Rules ................................................................................. 4-3
4.2.2
Fibre Channel Topologies ................................................................................. 4-3
4.2.3
Host-side Topologies.......................................................................................... 4-4
4.2.4
Unique Identifier ................................................................................................ 4-4
4.2.5
ID/LUN Mapping ............................................................................................... 4-4
4.3
SAMPLE TOPOLOGIES .......................................................................................... 4-5
4.3.1
Sample Topology – Clustered Hosts.................................................................. 4-5
4.3.2
Sample Topology – Direct-Attached.................................................................. 4-6
4.4
POWER ON ............................................................................................................... 4-6
4.4.1
Check List ........................................................................................................... 4-7
4.4.2
Power On Procedure ......................................................................................... 4-7
4.4.3
Power On Status Check...................................................................................... 4-8
4.4.4
LCD Screen ........................................................................................................ 4-9
4.5
POWER OFF PROCEDURE................................................................................... 4-10
CHAPTER 5 SUBSYSTEM MAINTENANCE
5.1. OVERVIEW............................................................................................................... 5-1
5.1.1
Maintenance ....................................................................................................... 5-1
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Galaxy Raid Installation and Hardware Reference Manual
5.1.2
General Notes on Component Replacement...................................................... 5-1
5.2. REPLACING CONTROLLER MODULE COMPONENTS ................................... 5-2
5.2.1
Overview............................................................................................................. 5-2
5.2.2
Notes on Controller Module Maintenance ........................................................ 5-3
5.2.3
Removing the Controller Module ...................................................................... 5-3
5.2.4
Replacing the Controller Module ...................................................................... 5-4
5.3. DIMM MODULE REPLACEMENT ........................................................................ 5-6
5.3.1
DIMM Module Considerations.......................................................................... 5-6
5.3.2
DIMM Module Replacement Procedure............................................................ 5-6
5.4. REPLACING A FAULTY BBU................................................................................ 5-7
5.5. REPLACING A FAULTY PSU MODULE .............................................................. 5-9
5.5.1
PSU Module Overview....................................................................................... 5-9
5.5.2
Replacing the PSU Module.............................................................................. 5-10
5.6. COOLING MODULE MAINTENANCE ............................................................... 5-13
5.6.1
Cooling Module Overview ............................................................................... 5-13
5.6.2
Replacing a Cooling Module ........................................................................... 5-13
5.7. REPLACING A FAILED HARD DRIVE ............................................................... 5-14
5.7.1
Hard Drive Maintenance Overview................................................................. 5-14
5.7.2
Replacing a Hard Drive................................................................................... 5-15
APPENDIX A UNINTERRUPTIBLE POWER SUPPLY
A.1. UNINTERRUPTIBLE POWER SUPPLY OVERVIEW .......................................................A-1
A.2. COMPATIBLE UPS SUPPLIES .....................................................................................A-1
A.3. SERIAL COMMUNICATION CABLES ...........................................................................A-1
A.4. CONNECTING THE UPS TO THE SUBSYSTEM.............................................................A-2
A.4.1
Connect the PSU Module Power Cords .......................................................... A-2
A.4.2
Set the Baud Rate ............................................................................................. A-2
A.4.3
Connect COM2................................................................................................. A-2
A.5. POWER ON ................................................................................................................A-3
A.6. UPS STATUS MONITORING .......................................................................................A-3
A.6.1
Normal Operational Status .............................................................................. A-3
A.6.2
UPS Messages .................................................................................................. A-3
UPS Message Summary ................................................................................... A-4
A.6.3
APPENDIX B SPECIFICATIONS
B.1. TECHNICAL SPECIFICATIONS .................................................................................... B-1
B.2. CONTROLLER SPECIFICATIONS ................................................................................. B-3
B.2.1
Configuration ................................................................................................... B-3
B.2.2
Architecture...................................................................................................... B-3
B.3. DRIVE TRAY SPECIFICATIONS................................................................................... B-4
B.4. POWER SUPPLY SPECIFICATIONS .............................................................................. B-4
B.5. COOLING MODULE SPECIFICATIONS ......................................................................... B-5
B.6. RAID MANAGEMENT ............................................................................................... B-5
B.7. FAULT TOLERANCE MANAGEMENT .......................................................................... B-6
APPENDIX C SPARE PARTS AND ACCESSORIES
C.1.
C.2.
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SPARE PARTS ............................................................................................................ C-1
ACCESSORIES ............................................................................................................ C-2
Galaxy Raid Installation and Hardware Reference Manual
APPENDIX D PIN OUTS
D.1.
D.2.
D.3.
D.4.
D.5.
D.6.
SFP CONNECTOR PIN OUTS ......................................................................................D-1
COM1 CABLE: DB9 AUDIO JACK PIN OUTS ............................................................D-3
COM2 CABLE: DB9 AUDIO JACK PIN OUTS ............................................................D-3
IFT-9011 NULL MODEM ...........................................................................................D-4
ETHERNET PORT PIN OUTS .......................................................................................D-5
MAIN POWER ............................................................................................................D-5
Safety Precautions
Precautions and Instructions
•
Prior to powering on the subsystem, ensure that the correct power range is being
used.
•
The GALAXY subsystem comes with sixteen (16) drive bays. Leaving any of
these drive bays empty will greatly affect the efficiency of the airflow within the
enclosure, and will consequently lead to the system overheating, which can
cause irreparable damage.
•
If a module fails, leave it in place until you have a replacement unit and you are
ready to replace it.
•
Airflow Consideration: The subsystem requires an airflow clearance, especially
at the front and rear.
•
Handle subsystem modules using the retention screws, eject levers, and the metal
frames/face plates. Avoid touching PCB boards and connector pins.
•
To comply with safety, emission, or thermal requirements, none of the covers or
replaceable modules should be removed. Make sure that during operation, all
enclosure modules and covers are securely in place.
•
Be sure that the rack cabinet into which the subsystem chassis will be installed
provides sufficient ventilation channels and airflow circulation around the
subsystem.
•
Provide a soft, clean surface to place your subsystem on before working on it.
Servicing on a rough surface may damage the exterior of the chassis.
•
If it is necessary to transport the subsystem, repackage all disk drives separately.
•
Dual redundant controller models come with two controller modules that must
be installed into the subsystem. Single controller modules come with a single
controller module and a metal sheet is placed over the lower controller bay at the
rear of the subsystem. Since single controller modules cannot be upgraded, this
metal sheet should NEVER be removed.
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Galaxy Raid Installation and Hardware Reference Manual
ESD Precautions
Observe all conventional anti-ESD methods while handling system
modules. The use of a grounded wrist strap and an anti-static work pad are
recommended. Avoid dust and debris in your work area.
About This Manual
This manual:
•
Introduces the GALAXY RAID subsystem series.
•
Describes all the active components in the subsystem.
•
Provides recommendations and details about the hardware installation
process.
•
Briefly describes how to monitor the subsystem.
•
Describes how to maintain the subsystem.
This manual does not:
•
Describe components that are not user-serviceable.
•
Describe the configuration options of firmware, using terminal
emulation programs, or the RAIDWatch GUI software that came with
your subsystem.
•
Give a detailed description of the RAID controllers embedded within
the subsystem.
Revision History
♦
Initial release
Who should read this manual?
This manual assumes that its readers are experienced with computer
hardware installation and are familiar with storage enclosures.
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Galaxy Raid Installation and Hardware Reference Manual
Related Documentation
•
User’s Operation Manual
•
RAIDWatch User’s Manual
These two documents can be found in the product utility CD included with
your subsystem package.
Conventions
Naming
From this point on and throughout the rest of this manual, the GALAXY
series is referred to as simply the “subsystem” or the “system” and
GALAXY is frequently abbreviated as “GAL.”
Lists
Bulleted Lists: Bulleted lists are statements of non-sequential facts. They
can be read in any order. Each statement is preceded by a round black dot
“•.”
Numbered Lists: Numbered lists are used to describe sequential steps you
should follow in order.
Important information that users should be aware of is indicated with the
following icons:
NOTE:
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help you avoid making mistakes.
CAUTION!
Cautionary messages should also be heeded to help you reduce the
chance of losing data or damaging the system.
IMPORTANT!
The Important messages pertain to use the GALAXY subsystem
introduced in this manual.
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Galaxy Raid Installation and Hardware Reference Manual
WARNING!
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
Software and Firmware Updates
Please contact Rorke Data’s tech support ([email protected]) for the
latest software or firmware updates.
Problems that occur during the updating process may cause unrecoverable
errors and system down time. Always consult technical personnel before
proceeding with any firmware upgrade.
NOTE:
The firmware version installed on your system should provide the
complete functionality listed in the specification sheet/user’s manual.
We provide special revisions for various application purposes.
Therefore, DO NOT upgrade your firmware unless you fully understand
what a firmware revision will do.
xii
Index
INDEX
accessory items, 2-5
airflow clearance, 2-2
Airflow, 2-2
alarm, 3-2
ambient temperature, 4-7
audible alarm, 1-13, 3-2, 3-9, 3-10
audio jack cable, 2-5
audio jack-to-DB9 cable, A-1
authorized battery disposal sites, 2-6
auto-negotiate, speed, 1-7, 1-8
backplane, 1-1, 1-5
battery backup unit, 1-1
baud rate, A-2
BBU LED, 3-7
BBU module, 1-9
BBU Warnings, 2-6
BBU, 1-1, 4-7
bi-directional data link, 4-2
Cable connection, 4-7
Cabling, 2-1
capacity, 2-9
chassis, 1-2
COM port, 1-8
COM2, A-2
component check, 2-1
configuration, 1-3
controller lever, 1-9
controller module installation, 2-6
controller module maintenance, 5-3
controller module, 1-6, 3-3, 3-5, 3-6, 5-1, 5-2, 5-3,
5-4
controller module, remove, 5-3
controller module, replace, 5-4
cooling module LED, 3-7
cooling module maintenance, 5-13
cooling module side latches, 5-14
cooling module slot, 1-11
cooling module, 1-1, 1-5, 1-11, 3-3, 3-8, 5-1, 5-13
cooling module, replace, 5-13
copper cable, 4-1
Data Compare Errors, 5-15
DDR RAM DIMM module, 1-9, 5-2, 5-6
DIMM socket, 1-7
drive bays, 2-9
drive channel, 1-9
drive ID, 1-4
drive tray front panel, 1-6
drive tray installation, 2-10
drive tray LED, 1-6, 3-4
drive tray maintenance, 5-14
drive tray, 1-6, 2-9, 2-10, 4-7, 5-15
Drive Trays, 3-3
dual-fan cooling module, 1-1
electrical earth connection, 2-2
electronic noise, 4-3
electrostatic discharge, 2-1
ESD damage, 2-3
Ethernet port, 1-8, 3-1, 3-6
event notification, 1-13
fabric topology, 4-4
failover software, 4-6
fan failure, 1-10
faulty module, 2-2
FC-AL, 4-3
Fibre cable, 4-1
firmware, 1-13, 3-1
front flap, 2-11, 5-15, 5-16
front panel, 1-3, 1-5
Full redundancy, 4-5, 4-6
functional integrity, 3-2
GUI, 1-13
handles, 5-14
handling precautions, 5-8
hard drive, 2-1, 2-9, 4-7, 5-1, 5-15
hard drives, replace, 5-15
Hardware Manual, 2-5
HBA, 4-4
host channel, 1-1, 1-7
host computer, 1-8, 4-5, 4-6
hot-swap mechanism, 1-5, 5-1
hot-swappable components, 1-13
I/O access, 4-10
I/O traffic, 4-5, 4-6
I2C bus, 1-12, 3-2, 3-10
initial screen, 1-5
installation procedure flowchart, 2-4
interface board, 1-4
international transportation regulation, 1-9
Index-1
Galaxy Raid Installation and Hardware Reference Manual
key-lock, 5-16
LAN Port LED, 3-6
laser types, 4-2
LC connector, 4-2
LCD panel, 1-3, 1-5, 3-2, 3-3
LCD Screen, 4-9
LCD, 4-9
LED, 1-12, 3-2
lower level, 2-5
LUN mapping, 4-4
main power source, 5-10
maintenance, 5-1
media scan, 4-10
memory capacity, 1-9, 5-6
memory module, 4-7, 5-1
monitoring methods, 1-12
monitoring, 3-1, 5-1
mute button, 3-3
Non-OFC laser, 4-2
normalized airflow, 1-14, 5-2
null modem, 2-5
numbering of drive trays, 1-4
OFC laser, 4-2
operational integrity, 3-2
optical cable, 4-1
Optical Fibre Control, 4-2
over-voltage, 1-10
Partner Fail, 3-6
PC hyper-terminal, 3-1, 3-2, A-1
permanent IP, 3-6
physical dimensions, 1-3
points of failure, 4-4
Point-to-Point, 4-3
power cable, 5-10
power cord, 4-7
power down, 4-10
power on sequence, 4-7
power on status check, 4-8
power on, 4-6, A-3
power outlet, 2-2
power range, 2-2
power socket, 4-7
power supply unit, 1-1, 1-4
power switch, 1-4, 4-8
Pre-installed Components, 2-5
PSU Bracket, 5-9
PSU module maintenance, 5-9
PSU module, 1-1, 3-3, 5-1
Index-2
PSU module, replace, 5-10
PSU printing mark, 5-9
PSU, 1-4, 1-10, 3-7, 5-10
quick installation guide, 2-5
rack cabinet, 2-2
RAIDWatch User’s Manual, 2-5
RAIDWatch, 1-13, 3-1
rear panel, 1-4, 1-5
Regenerating logical drive parity, 4-10
retention screws, 2-2
RJ-45, 3-6
safety precaution, 2-2, 5-3
SATA chip, 1-1
SATA drive installation, 2-9
SATA hard drive, 1-1
SATA-I drives, 2-9
SATA-II drives, 2-9
self-monitoring features, 3-1
sensors, 3-8
SFP connector, 1-7
SFP module, 1-8
SFP transceivers, 2-2, 4-2
signal quality, 4-3
startup, 4-9
static electricity, 2-3
static free installation environment, 2-1
status checking, 1-3
status-indicating LEDs, 3-2
storage network, 4-5, 4-6
subsystem downtime, 5-1
temperature threshold, 3-2
terminal emulation program, 1-13
the controller board, 3-2
thermal notice, 2-2
troubleshooting, 1-3
Uninstalled Components, 2-5
unique identifier, 4-4
Unpacking Checklist, 2-5
unpacking, 2-5, 5-1
upper level, 2-5
UPS Messages, A-3
UPS, A-1
User’s Operation Manual, 2-5, 3-1, 3-9, 4-9
ventilation, 2-2
VT-100 terminal, 1-8
wavelengths, 4-2
white clips, 5-7
working integrity, 5-1
Chapter 1: Introduction
Chapter 1
Introduction
1.1. Product Overview
1.1.1
Product Introduction
This hardware manual briefly introduces the Galaxy Fibre-4G to SATA-II
storage subsystem shown in Figure 1-1. Through this manual, you will gain
the knowledge of each hardware components, installation procedures,
monitoring functions, connection topologies and hardware maintenances.
The GALAXY subsystem comes with single Fibre to SATA RAID
controller and provides two
(2) 4Gbps (FC-4G) host
channels. Two (2) onboard
SATA
chips
provide
sixteen (16) 3Gbps SATAII drive channels that can
Figure 1-1: A16F-G2422 Subsystem
support up to sixteen (16)
SATA-II hard drives. The controller board has a pre-installed 256MB DDR
RAM DIMM module and can support a memory module with a capacity up
to 2GB.
The metal container in which the controller board is pre-installed is referred
to as the “controller module.” The controller module is accessed through the
rear of the GALAXY and is comprised of a PCB board, a rear faceplate, and
a metal canister. An optional battery backup unit (BBU) can be installed in
the upper left side of the controller module when viewed from the rear of the
subsystem. The independent BBU is also accessible and hot swappable
through the rear panel of the GALAXY.
I/O signals/commands transmitted between the controller and drives at the
front of the subsystem pass through a non-user-serviceable backplane board.
The backplane is connected to a maximum of sixteen (16) hard drives that
you purchase separately and install into the sixteen (16) drive trays that
come with the subsystem. The drive trays, which must be installed in the
drive bays, accommodate SATA-II hard drives (backward compatible to
SATA-I).
Two (2) redundant, hot-swappable, dual-fan cooling modules protect the
subsystem from overheating and two (2) redundant, hot-swappable, 2U
460W power supply units (PSUs) provide constant power to the subsystem.
Product Overview
1-1
Galaxy Raid Installation and Hardware Reference Manual
The modular nature of the subsystem and the easy accessibility to all major
components ensure the ease of the subsystem maintenance.
NOTE:
On receiving and unpacking your subsystem, please check the package
contents against the included Unpacking List. If any modules are missing,
please contact your subsystem vendor immediately.
1.1.2 Enclosure Chassis
1.1.2.1 Chassis Overview
The GALAXY RAID storage subsystem chassis is an enhanced 3U metal
chassis divided into front and rear sections, which are respectively accessed
through front and rear panels. Pre-drilled mounting holes in the sides of the
3U RAID subsystem enclosure allow you to attach separately purchased
slide rails so that you can install the enclosure into a rack or cabinet. Please
see Figure 1-2 for the components’ locations in the subsystem and read the
following sections for the front and rear panels descriptions.
Figure 1-2: GALAXY Subsystem Overview
NOTE:
Components accessed through the front panel are referred to as “Front
Panel Components” and components accessed through the rear panel are
referred to as “Rear Panel Components.”
1-2
Product Overview
Chapter 1: Introduction
1.1.2.2 Physical Dimensions
The GALAXY comes in an enhanced 3U chassis with the following
dimensions:
•
With handles: 482.6mm x 131mm x 504.3mm (19 x 5.2 x 19.9
inches) (width x height x depth)
•
Without handles: 445mm x 130mm x 488.2mm (17.5 x 5.1 x 19.2
inches) (width x height x depth)
1.1.2.3 Front Panel Overview
The front section of the subsystem features a 4x4 layout for sixteen (16) 3.5inch drives. The two (2) handles on the front of the subsystem enable you to
easily insert/extract the chassis into/from a rack or cabinet. The LCD panel
on the left handle provides an easy way for you to monitor and configure
your subsystem.
The front panel of the GALAXY RAID subsystem described in this manual
is shown in Figure 1-3. A description of each front panel component is
given below:
Figure 1-3: GALAXY Front View
The front panel shown in Figure 1-3 accommodates the following
components:
Product Overview
•
Drive bays with drive tray canisters: The subsystem has sixteen
(16) drive bays in the front side of the chassis to house sixteen (16)
hard drives.
•
Right handle and left handle with LCD panel: These front handles
are conveniently placed and simplify moving the subsystem
enclosure into and out of a rack or cabinet. The left side fronthandle houses a 16x2 character LCD panel that can be used for
subsystem configuration, troubleshooting and status checking.
(Please refer to Section 1.2.1)
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Galaxy Raid Installation and Hardware Reference Manual
1.1.2.4 Hard Drive Numbering
The front panel of the GALAXY enclosure houses sixteen (16) hard drives
in a 4x4 configuration as shown in Figure 1-4. When viewed from the front,
the drive bays (slots) are numbered 1 to 16 from top to bottom, from left to
right.
Figure 1-4: Hard Drive Numbering
1.1.2.5 Rear Panel Overview
The rear section of the GALAXY subsystem is accessed through the rear
panel and is reserved for single RAID controller module, an optional BBU,
two (2) power supply units (PSUs), and two (2) cooling modules. A metal
sheet covers the lower section of controller model slot and BBU slot.
The rear panel of the GALAXY described in this manual is shown in Figure
1-5. A description of each rear panel component is given below:
Figure 1-5: GALAXY Rear View
The rear panel shown in Figure 1-5 accommodates the following
components:
1-4
•
RAID controller module: A single controller module is installed in
the GALAXY . The controller module contains a RAID controller
board, interface board, DDR RAM DIMM module which provide
the system RAID functionalities. (See Section 1.2.3.)
•
BBU: An independent BBU sustain cache memory during a power
shortage to prevent data loss. (See Section 1.2.6.)
•
PSUs: The hot-swappable PSUs provide power to the subsystem.
A power switch is located on the right of each PSU to turn the
system on and off. (See Section 1.2.7.)
Product Overview
Chapter 1: Introduction
•
Cooling modules: The redundant cooling modules provide
ventilation to reduce the temperature within the subsystem. (See
Section 1.2.8.)
1.1.2.6 Back-plane Board
Internal backplane boards separate the front and rear sections of the
GALAXY. The PCB board provides logic level signals and low voltage
power paths. They contain no user-serviceable components.
1.2. GALAXY Components
The GALAXY houses many active components and most of them can be
accessed through either the front or rear panel. The modular design of the
active components facilitates their easy installation and removal. Hot-swap
mechanisms are incorporated to eliminate power surges and signal glitches
that might occur while removing or installing these modules. Each
component is further described below:
1.2.1 LCD Panel
Figure 1-6: LCD Panel
The LCD panel shown in Figure 1-6 consists of a 16x2-character LCD
screen with push buttons and LED status indicators. The LCD front panel
provides full access to all RAID configuration settings and monitoring
functions. After powering up the subsystem, the initial screen will show the
subsystem model name. A different name may be assigned for the
subsystem, controller or different logical drive. This will enable easier
identification in a topology with numerous arrays.
1.2.2 Drive Trays
GALAXY Components
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Galaxy Raid Installation and Hardware Reference Manual
Figure 1-7: Drive Tray
Each GALAXY subsystem comes with sixteen (16) drive trays. The front
panel of each drive tray (see Figure 1-7) contains a locking mechanism that
secures the drive tray to the enclosure and a latch that facilitates the removal
and installation of the drive tray. Two (2) status-indicating LEDs are also
located on the front of the drive tray. Retention screw holes are located on
the sides of the drive tray. These holes are reserved for securing hard drives
to the tray. Other retention screw holes are located on the surface of the tray
at the rear.
WARNING!
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by
dropping it or resting heavy objects on it). The drive tray has been
customized to fit into the drive bays in the ES subsystem. If the drive bay
superstructure is deformed or altered, the drive trays may not fit into the
drive bay.
1.2.3 RAID Controller Modules
Figure 1-8: Controller Module
The RAID controller module that shipped with your subsystem contains a
metal bracket, a main circuit controller board, a management rear panel, and
a pre-installed 256MB capacity or above DDR RAM DIMM module. (See
Figure 1-8) The controller module contains no user-serviceable
components. Except when installing/upgrading the cache memory inside,
the controller module should never be removed or opened.
WARNING!
Although the RAID controller can be removed, the only time you should
touch the controller itself is to install the memory modules. The RAID
controller is built of sensitive components and unnecessary tampering can
damage the controller.
1-6
GALAXY Components
Chapter 1: Introduction
NOTE:
If the pre-installed DIMM module is not damaged, it can be reused when
the controller module is being replaced. The controller module, PN: IFT83AF24GD16 comes without DIMM module installed.
The heart of the GALAXY RAID controller subsystem is the FC-4G to
SATA-II controller board. The controller comes with two (2) pre-set FC-4G
host channels, CH0 and CH1. The subsystem connects to the external FC4G host computer(s) through two (2) FC connectors on the controller
module interface. These FC connectors can auto-negotiate the speed and
determine whether the data transmission rate is 1Gbps, 2Gbps or 4Gbps.
The docking connector at the rear of the controller board is used to connect
the controller module to the backplane board. A DDR RAM DIMM socket
is strategically placed in an easily accessible location on the controller board
for easy insertion of the DDR RAM DIMM module.
Cooling module speed detection: When the system temperature breaches
the high temperature threshold, the cooling modules in the subsystem will
automatically switch to high fan speed to cool the subsystem down.
1.2.4 Controller Module Interfaces
All external interfaces that connect to external devices are located on the
controller module rear panel shown in Figure 1-9. The interfaces are listed
below.
Figure 1-9: Controller Module Rear Panel
♦
Host ports: Each controller module has two (2) FC ports (labeled FCCH0 and FC-CH1) on the left of the controller module rear panel that
accept SFP transceivers. The two (2) FC ports should be connected to
external FC-4G host computer(s). These ports can auto-negotiate the
speed and determine whether the data transmission rate is 4Gbps,
2Gbps or 1Gbps.
The default configurations do not include SFP transceivers on the FC
ports. You can order the field-replaceable, SFP tranceivers (IFT9270CSFP2GA01) from your subsystem vendor or contact them for a
compatible list.
GALAXY Components
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Galaxy Raid Installation and Hardware Reference Manual
♦
COM ports: The controller module comes with two (2) COM ports.
One port, COM1, is used for accessing the controller-embedded
configuration utility through the network that allows you to configure
and monitor your array and upgrade firmware over a VT-100 terminal
emulation program running on a management computer. An audio
jack to DB9 cable is shipped with your subsystem to facilitate the
connection.
The second COM port, marked as COM2 is for uninterruptible power
supply (UPS) connection. An optional audio jacks to DB-9 serial
communication cable is available for purchase. Please refer to
Appendix A for instructions on connecting a UPS.
♦
Ethernet ports: The controller module on the GALAXY comes with a
10/100M Ethernet port used for remote management through the
network. Shielded cables must be used to protect against emissions.
Connect the other end of the Ethernet cable to a LAN hub port of the
local network.
♦
LED indicators: Each controller board rear panel comes with eight (8)
LED indicators (labeled from 1 to 6 and from A to B). Please refer to
Chapter 3 for information on how to monitor your subsystem using
the LED indicators.
♦
Levers: Two (2) levers located on the sides of the controller board
rear panel provide easy controller module installation and secure the
controller module in place.
♦
Drive: All models come with sixteen (16) SATA drive channels that
are interfaced through board-to-board connectors to subsystem back
plane. (NOTE: Drive interfaces are not accessed through the
controller module rear panel.)
1.2.5 DIMM Modules
The controller module comes with a pre-installed 256MB capacity or above
DDR RAM DIMM module and can support capacities up to 2GB. The
DIMM module is placed in an easily accessed location on the controller
board. However, when the DIMM module is being changed, the controller
module must be removed from the subsystem chassis.
1-8
GALAXY Components
Chapter 1: Introduction
1.2.6 BBU
Figure 1-10: BBU
An optional, separately purchased Li-ION battery backup unit (BBU) (see
Figure 1-10) can sustain cache memory after a power failure. If you
purchased a BBU, it will be installed on the upper left side of the controller
module in the rear subsystem chassis. Please refer to Section 2.7 for
installation instructions.
In accordance with international transportation regulations, the BBU is only
charged to between 35% and 45% of its total capacity when shipped.
Therefore, after powering on the subsystem (see Section 4.4) the BBU must
be charged to its full capacity. It normally requires approximately seven (7)
hours for the battery to be fully charged. If the battery is not fully charged
after seven (7) hours, there is a problem with the BBU and you should
contact your subsystem vendor immediately. While the battery is being
charged, the LED on the BBU rear panel and the fifth LED on the rear panel
of the controller module will flash slowly. (See Chapter 3.2.8 for details on
the LED indicators.) You can check the status of the battery’s charge via
RAIDWatch or the firmware.
1.2.7 PSUs
Figure 1-11: PSU Module
The GALAXY is equipped with two (2) redundant, hot-swappable, 460W
PSUs, which are located at the rear of the enclosure. (See Figure 1-5) The
PSU is permanently mounted into a 2U (dual-level) bracket especially
GALAXY Components
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Galaxy Raid Installation and Hardware Reference Manual
designed to house both the PSU and a cooling module, which is mounted in
the lower part of the 2U bracket. Hot-swapping the PSU requires the
removal of the cooling module.
As shown in Figure 1-11, each PSU comes with a single power socket for
power cord plug-in, and a power switch on the right to turn the subsystem
on and off. Two (2) embedded cooling fans provide sufficient airflow to
keep the PSU cool. A single LED indicates the PSU status. When any power
supply failure occurs, such as over-voltage or fan failure, the LED shines
red. A handle at the back of the PSU has been especially designed to enable
you to remove the PSU from the subsystem while the subsystem is online.
This should only be done if the PSU has failed and needs to be replaced.
A retention screw at the top of the PSU module secures the PSU to the
enclosure. To remove the PSU, the retention screw must be removed first.
When installing a new PSU module, make sure that the retention screw has
been firmly secured.
PSU specifications are shown in Appendix B.
1.2.8 Cooling Modules
Figure 1-12: Cooling Module
The GALAXY is equipped with two (2) 1U, dual-fan, redundant, hotswappable cooling modules. They are installed in the cooling module slots
located in the lower section of the PSU modules (see Figure 1-12) Two (2)
LEDs on the rear panel indicates the internal cooling fans status. Use the
latches and handle to insert and remove the cooling module from the
subsystem.
Intelligent Dual Speed Operation
The cooling fans in the cooling module operate with two rotation speeds.
Under normal operating conditions, the cooling fans run at the low speed,
which is sufficient for maintaining efficient airflow across components.
Under the following conditions, cooling fans raise their rotation speed to
increase the airflow:
1-10
GALAXY Components
Chapter 1: Introduction
1.
Component Failure: if one cooling fan, a PSU, or a temperature
sensor fails, the remaining cooling fan(s) automatically raises its
rotation speed.
2.
Elevated Temperature: if the temperature breaches the upper
threshold set for any of the interior temperature sensors, the cooling
fans automatically raises its rotation speed.
3.
During the subsystem initialization stage, the cooling fans operate
at the high speed and return to lower speed once the initialization
process is completed and no erroneous condition is detected.
NOTE:
There are two values sets for the upper temperature thresholds. One is
set for event notification and the other triggering higher fan rotation
speed. The preset value for event notification can be changed using the
firmware-embedded configuration utility, while the fan speed trigger is
not a user’s option. Please refer to the User’s Operation Manual for the
options with event notification values.
The cooling module specifications are listed in Appendix B.
1.3. GALAXY Monitoring
The GALAXY RAID subsystem comes with several monitoring methods to
give you constant updates on the status of the system and individual
components. The following monitoring features are included in the
subsystem.
1.3.1 I2C bus
The following GALAXY elements are interfaced to the RAID controller
over a non-user-serviceable I2C bus:
•
PSUs
•
Cooling modules
•
Temperature sensors (for the temperature of the backplane board
and controller board)
1.3.2 LED Indicators
The following active components come with LEDs to indicate the status of
the individual component:
GALAXY Monitoring
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Galaxy Raid Installation and Hardware Reference Manual
•
LCD panel (3 LEDs)
•
Drive trays (2 LEDs on each tray)
•
RAID controllers (8 controller status LEDs and 2 Ethernet port
status LEDs)
•
Optional BBU (1 LED)
•
Cooling modules (2 LEDs on each module)
•
PSUs (1 LED on each module)
1.3.3 Firmware (FW) and RAIDWatch GUI
Firmware: The firmware (FW) is pre-installed software used to configure
the subsystem. The FW can be accessed either through the front LCD panel
or a terminal emulation program running on a management computer that is
connected to the subsystem’s serial port.
RAIDWatch: RAIDWatch is a premier, web-based graphics user interface
(GUI) that can be installed on a remote computer and accessed via the web.
The manager communicates with the array via the connection of the existing
host interface or Ethernet link to the array’s LAN port.
1.3.4 Audible Alarms
The GALAXY subsystem comes with audible alarms that are triggered
when certain active components fail or when certain controller or subsystem
thresholds are exceeded. Whenever you hear an audible alarm from the
GALAXY, it is imperative that you determine the cause and rectify the
problem immediately.
Event notification messages indicate the completion or status of array
configuration tasks and are always accompanied by two (2) or three (3)
successive and prolonged beeps.
WARNING:
Failing to respond when an audible alarm is heard can lead to permanent
damage of the GALAXY. When an audible alarm is heard, rectify the
problem as soon as possible.
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GALAXY Monitoring
Chapter 1: Introduction
1.4. Hot-swappable Components
1.4.1 Hot-swap Capabilities
The GALAXY subsystem comes with a number of hot-swappable
components. A hot-swap component is one that can be exchanged while the
subsystem is still online without affecting the operational integrity of the
subsystem. These components should only be removed from the subsystem
when they are being replaced. At no other time should these components be
removed from the subsystem.
1.4.2 Components
The following components are hot-swappable:
•
PSUs
•
Cooling modules
•
Optional BBU
•
Hard drives
NOTE:
Instructions on how to replace these hot-swappable components are given
in Chapter 5.
1.4.3 Normalized Airflow
Proper subsystem cooling is referred to as “normalized” airflow.
Normalized airflow ensures the sufficient cooling of the subsystem and is
only attained when all the components are properly installed. Therefore, a
failed component should only be hot-swapped when a replacement is
available. If a failed component is removed but not replaced, permanent
damage to the subsystem can result.
Hot-swappable Components
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Galaxy Raid Installation and Hardware Reference Manual
Chapter 1 Introduction ........................................................................................................... 1-1
1.1. Product Overview...................................................................................................... 1-1
1.1.1
Product Introduction ......................................................................................... 1-1
1.1.2
Enclosure Chassis.............................................................................................. 1-2
1.1.2.1 Chassis Overview.......................................................................................... 1-2
1.1.2.2 Physical Dimensions..................................................................................... 1-3
1.1.2.3 Front Panel Overview ................................................................................... 1-3
1.1.2.4 Hard Drive Numbering ................................................................................. 1-4
1.1.2.5 Rear Panel Overview .................................................................................... 1-4
1.1.2.6 Back-plane Board.......................................................................................... 1-5
1.2. GALAXY Components .................................................Error! Bookmark not defined.
1.2.1
LCD Panel ......................................................................................................... 1-5
1.2.2
Drive Trays........................................................................................................ 1-5
1.2.3
RAID Controller Modules ................................................................................ 1-6
1.2.4
Controller Module Interfaces............................................................................ 1-7
1.2.5
DIMM Modules ................................................................................................ 1-8
1.2.6
BBU................................................................................................................... 1-9
1.2.7
PSUs .................................................................................................................. 1-9
1.2.8
Cooling Modules............................................................................................. 1-10
1.3. GALAXY Monitoring.............................................................................................. 1-11
1.3.1
I2C bus............................................................................................................. 1-11
1.3.2
LED Indicators ................................................................................................ 1-11
1.3.3
Firmware (FW) and RAIDWatch GUI........................................................... 1-12
1.3.4
Audible Alarms ............................................................................................... 1-12
1.4. Hot-swappable Components ................................................................................... 1-13
1.4.1
Hot-swap Capabilities ..................................................................................... 1-13
1.4.2
Components..................................................................................................... 1-13
1.4.3
Normalized Airflow ........................................................................................ 1-13
audible alarm, 1-13
auto-negotiate speed, 1-7
auto-negotiate, speed, 1-8
backplane, 1-1, 1-5
battery backup unit, 1-1
BBU, 1-1
BBU module, 1-9
chassis, 1-2
COM port, 1-8
configuration, 1-3
controller lever, 1-9
controller module, 1-6
cooling fan module, 1-11
cooling module, 1-1, 1-5, 1-11
cooling module slot, 1-11
DDR RAM DIMM module, 1-9
DIMM socket, 1-7
drive channel, 1-9
drive ID, 1-4
drive tray front panel, 1-6
drive tray LEDs, 1-6
drive trays, 1-6
dual-fan cooling module, 1-1
Ethernet port, 1-8
1-14
event notification, 1-13
fan failure, 1-10
firmware, 1-13
front panel, 1-3, 1-5
GUI, 1-13
host channel, 1-1, 1-7
host computer, 1-8
host connection module, 1-7
hot-swap mechanism, 1-5
hot-swappable, 1-13
hot-swappable components, 1-13
I2C bus, 1-12
initial screen, 1-5
interface board, 1-4
international transportation regulation, 1-9
LCD panel, 1-3, 1-5
LED, 1-12
memory capacity, 1-9
monitoring methods, 1-12
normalized airflow, 1-14
numbering of drive trays, 1-4
over-voltage, 1-10
physical dimensions, 1-3
power supply unit, 1-1, 1-4
Hot-swappable Components
Chapter 1: Introduction
power switch, 1-4
PSU, 1-4, 1-10
PSU module, 1-1
RAIDWatch, 1-13
rear panel, 1-4, 1-5
SATA chip, 1-1
SATA hard drive, 1-1
Hot-swappable Components
SFP connector, 1-7
SFP module, 1-8
status checking, 1-3
terminal emulation program, 1-13
troubleshooting, 1-3
VT-100 terminal, 1-8
1-15
Chapter 2: Hardware Installation
Chapter 2
Hardware Installation
2.1. Installation Overview
This chapter gives detailed instructions on how to install the controller
module, hard drives, and drive trays into the subsystem. Installation into a
rack or cabinet should occur before the hard drives or drive trays are
installed into the subsystem. Please confirm that you received all of the
components listed on the Unpacking List that came with the subsystem
before proceeding with the installation process.
CAUTION!
Please note that the installation instructions described in this manual
should be carefully followed to prevent any difficulties and damages to
your system.
2.2. Installation Pre-requisites
1.
Static-free installation environment: The GALAXY subsystem must
be installed in a static-free environment to minimize the possibility of
electrostatic discharge (ESD) damage. (See Section 2.3)
2.
Component check: Before installing the GALAXY subsystem, you
should first check to see that you have received all the required
components. (See Section 2.5) If any items appear damaged, contact
your vendor for a replacement.
3.
Hard drives: Up to sixteen (16) SATA-II or SATA-I hard drives must
be purchased separately prior to the GALAXY subsystem installation.
(See Section 2.6)
4.
Cabling: All Fibre cables used to connect the subsystem to the host
computers or external devices must be purchased separately. Please see
Chapter 4 for sample topologies and configuration options. Contact
your vendor or Infortrend for the list of compatible cables.
Installation Overview
2-1
Galaxy Raid Installation and Hardware Reference Manual
5.
SFP transceivers: If the FC cables that were previously purchased do
not come with pre-installed SFP transceivers, transceivers must be
separately purchased and connected to the FC cables. (See Section
4.1.4)
6.
Memory modules: If you wish to change the pre-installed memory
module, a separately purchased module must be installed. (See Section
5.3)
7.
Rack installation: The enclosure chassis can be installed into rack
cabinet using self-purchased mounting rails, rear-attached brackets, or
Infortrend’s IFT-9273CSlider slide rails. (See Section 2.10)
2.3. Safety Precautions:
2.3.1
2-2
Precautions and Instructions
1.
Be sure the correct power range (100-120 or 200-230VAC) is supplied
by your rack cabinet or power outlet.
2.
Thermal notice: All drive trays (even if they do not contain a hard
drive) must be installed into the enclosure. Leaving a drive bay or
module slot open will greatly affect the airflow efficiency within the
enclosure, and will consequently lead to system overheating. Keep a
faulty module in place until you have a replacement unit and you are
ready to replace it.
3.
An enclosure without disk drives can weigh over 24 kilograms (53
pounds). Two (2) people are required to install or relocate the
subsystem. Drives should be removed from the enclosure before
moving the subsystem.
4.
Airflow considerations: The subsystem requires an airflow clearance
especially on the front and rear. For proper ventilation, a minimum of
2.5cm is required between the front of the enclosure and rack cover; a
minimum of 5cm is required between the enclosure and end of the rack.
5.
Handle the system modules by the retention screws, eject levers, or the
module’s metal frame/face plate only. Avoid touching the PCB boards
and connector pins.
6.
None of the covers or replaceable modules should be removed in order
to maintain compliance with safety, emission, or thermal requirements.
7.
Always secure every enclosure module by its retaining screws or make
sure it is held in place by its latches.
8.
Always make sure the subsystem has a safe electrical earth connection
via power cords or chassis ground by the rack cabinet.
Safety Precautions:
Chapter 2: Hardware Installation
9.
Be sure that the rack cabinet in which the subsystem chassis is to be
installed provides sufficient ventilation channels and airflow circulation
around the subsystem.
10. Provide a soft, clean surface to place your enclosure on before working
on it. Servicing the enclosure on a rough surface may damage the finish
of the chassis.
11. If it is necessary to transport the subsystem, repackage all drives and
replaceable modules separately.
2.3.2
Static-free Installation
Static electricity can damage the system’s electronic components. To
prevent ESD damage to any of the components, follow these precautions
before touching or handling them:
•
Discharge the static electricity accumulated in your body by
wearing an anti-static wristband.
•
Avoid carpets, plastic, vinyl, and Styrofoam in your work area.
•
Handle all components by holding their edges or metal frames.
Avoid touching the exposed circuitry on PCB boards and connector
pins.
2.4. General Installation Procedure
Following all the instructions provided below can save subsystem
installation time. Detailed, illustrated instructions for each component are
given in the following sections.
CAUTION!
To ensure that your system is correctly installed, please follow the steps
outlined below. If you follow these steps, installation will be fast and
efficient. If you do not follow these steps, you may accidentally install the
hardware incorrectly.
Step 1. Unpack: Unpack the subsystem and confirm that all the
components on the packing list have been included. (See Section
2.5)
Step 2. Rack/Cabinet installation: If the subsystem is going to be
installed in a rack or cabinet, it should be installed prior to
installing the hard drives. Installing the subsystem into a rack or
cabinet requires at least two (2) people. (See Section 2.10)
General Installation Procedure
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Galaxy Raid Installation and Hardware Reference Manual
Step 3. Install hard drives: Separately purchased SATA-II or SATA-I
hard drives must be individually installed into the drive trays.
(See Section 2.8)
Step 4. Install drive trays: After the hard drives have been installed into
the drive trays, the drive trays must be installed into the enclosure
itself. (See Section 2.9)
Step 5. Cable connection: Use the power cords that came with the
subsystem to connect the subsystem to the main power source.
Use the self-purchased Fibre cable to connect a host port to the
host computer or an external device.
Step 6. Power up: Once the components have been properly installed and
all cables are properly connected, you can power up the
subsystem and configure the RAID array. (See Section 4.4)
2.4.1 Installation Procedure Flowchart
Figure 2-1 shows a flowchart of the installation procedure. As you complete
each step, check off the “Done” box on the right. Please use this flowchart
in conjunction with the instructions that follow.
Figure 2-1: Upgrade Procedure Flowchart
2-4
General Installation Procedure
Chapter 2: Hardware Installation
2.5. Unpacking the Subsystem
Use the Unpacking List in your subsystem package to verify package
contents. Carefully check the items contained in each box before proceeding
with installation.
WARNING!
Do not rely on the non-definitive, summarized unpacking list shown
below--it is for reference only. A detailed packing list can be found in
your product shipping package or product CD.
Each packed box is separated into upper and lower levels.
Upper level: The box on the upper level contains sixteen (16) drive trays.
Lower level: Three (3) boxes are placed in the lower level. One (1) box
contains the enclosure chassis with all the pre-installed components. The
other two (2) boxes contain the power cords and accessory items.
Accessory items include an audio-jack to DB9 cable, null modem, Quick
Installation Guide, screws, and a CD containing the Installation and
Hardware Reference Manual (this document), the User’s Operation
Manual (Firmware), RAIDWatch Management Software and the
RAIDWatch User’s Manual.
2.6. Installation Overview
2.6.1
Pre-installed Components
The following components have been pre-installed in the GALAXY and
therefore do not need to be installed:
• 1 - LCD module
• 2 – Front handles (right and left)
• 1 - Backplane board
• 1 - Controller module
• 1 - DDR RAM DIMM module
• 2 - PSUs
• 2 - Cooling modules
The following components are pre-integrated and need to be installed
• Hard drives (separately purchased SATA-II or SATA-I drives)
• Drive trays
Unpacking the Subsystem
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Galaxy Raid Installation and Hardware Reference Manual
2.7. Installing the Optional BBU
2.7.1 BBU Installation Overview
The BBU is an optional item that can sustain cache memory in the event of
a power failure or in the extremely unlikely event of both PSUs failing.
Purchasing and installing a BBU is highly recommended. The optional BBU
provides additional data security and helps minimize the loss of data during
power shutdowns.
The BBU is inserted into the subsystem in the top, left corner of the
controller module. The BBU is secured to the subsystem with two (2)
retention screws. When shipped, the BBU slot in the subsystem rear panel is
covered with a metal dummy plate that must first be removed.
2.7.2 BBU Warnings and Precautions
2-6
•
Install or replace the BBU supplied by your subsystem vendors
only. Use of battery cells provided otherwise will void our
warranty.
•
Always dispose of discharged or used batteries in an ecologically
responsible manner. Dispose used BBU at authorized battery
disposal sites only.
•
Do not use nor leave the BBU near a heat source. Heat can melt the
insulation and damage other safety features of battery cells,
possibly leading it to acid leak, and result in flames or explosion.
•
Do not immerse the BBU in water nor allow it to get wet. Its
protective features can be damaged. Abnormal chemical reactions
may occur, possibly causing functional defects, acid leak, and other
hazardous results.
•
Do not disassemble or modify the BBU. If disassembled, the BBU
could leak acid, overheat, emit smoke, burst and/or ignite.
•
Do not pierce the BBU with a sharp object, strike it with a hammer,
step on it, or throw it. These actions could damage or deform it,
internal short-circuiting can occur, possibly causing functional
defects, acid leak, and other hazardous results.
•
If the BBU leaks, gives off a bad odor, generates heat, becomes
discolored or deformed, or in any way appears abnormal during
use, recharging or storage, immediately remove it from the
subsystem and stop using it. If this is discovered when you first use
the BBU, return it to Infortrend or your system vendor.
Installing the Optional BBU
Chapter 2: Hardware Installation
2.7.3 Installation Procedure
To install the BBU into the controller module, please follow these steps:
NOTE:
A new or replaced BBU takes 7 hours to charge to its full capacity. Reset
the subsystem whenever a BBU is replaced or added for the new BBU to
take effect.
Step 1. Remove the metal sheet from the chassis. A metal sheet covers
the BBU slot on the rear panel of the subsystem. The metal sheet
is attached to the chassis with two (2) screws. These screws must
be removed. To loosen, turn the screws counterclockwise. (See
Figure 2-2)
Figure 2-2: Remove the Metal Sheet Retention Screws
Step 2. Remove the metal sheet. It may be difficult to remove the metal
sheet as it is embedded in the subsystem chassis. If you are
unable to dislodge the sheet, wedge the head of a flat-head
screwdriver between the metal sheet and the chassis and then
gently nudge the metal sheet out of the chassis.
Installing the Optional BBU
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Galaxy Raid Installation and Hardware Reference Manual
Figure 2-3: Use a Screwdriver to Remove the Metal Sheet
Step 3. Install the BBU. After the metal sheet covering the BBU slot has
been removed, the BBU can be installed. To do this, align the
BBU with the slot from which the metal sheet was removed, and
then gently push the BBU into the slot. (See Figure 2-4)
Figure 2-4: Install the BBU
Step 4. Secure the BBU to the enclosure. Tighten the two (2) retention
screws on the back of the BBU. The BBU comes equipped with a
charger circuit. Once the BBU is properly installed, the
installation process is completed.
2-8
Installing the Optional BBU
Chapter 2: Hardware Installation
2.8. Hard Drive Installation
NOTE:
Your hard drives have been preintegrated in drive trays and
replacement hard drives will come preintegrated as well. The following
procedures apply to the cases where you may have to replace or sway
hard drives for troubleshooting purposes. Always replace hard drives
with the exact size and model of the original drive.
2.8.1 Hard Drive Installation Prerequisites
Hard drives for the GALAXY subsystem must be purchased separately.
When purchasing the hard drives, the following factors should be
considered:
Capacity (MB/GB): Use drives with the same capacity. RAID arrays use a
“least-common-denominator” approach. The maximum capacity of each
drive used in the array is the maximum capacity of the smallest drive.
Choose big drives with the same storage capacity.
Profile: The drive trays and bays of the system are designed for 3.5-inch
wide x 1-inch-high hard drives. It is highly recommended that you do not try
to use drives of any other size.
Drive type: The GALAXY described in this manual can use SATA-II or
SATA-I hard drives. Please ensure that you purchase the correct hard drives.
CAUTION!
The hard drives and drive trays should only be installed into the
subsystem after the subsystem has been mounted into a rack cabinet. If
the hard drives are installed first, the subsystem will be too heavy to lift
and the possible impact during installation may damage your drives.
WARNING!
1.
Handle hard drives with extreme care. Hard drives are very
delicate. Dropping a drive onto a hard surface (even from a short
distance) and hitting or touching the circuits on the drives with your
tools may cause damage to the drives.
2.
Observe all ESD prevention methods when installing drives.
3.
Only use screws supplied with the drive canisters. Longer screws
may damage the drive.
Hard Drive Installation
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Galaxy Raid Installation and Hardware Reference Manual
2.8.2 SATA Drive Installation
Step 1. Place the SATA hard drive into the drive tray (as shown in
Figure 2-5); making sure that the connector at the back of the
drive is facing the back of the drive tray.
Figure 2-5: Insert the Hard Drive and the Retention Screws
Step 2. Adjust the drive’s location until the mounting holes in the drive
canister are aligned with those on the hard drive. Secure the drive
with four supplied 6/32 flat-head screws. (See Figure 2-5)
2.9. Drive Tray Installation
Once the hard drives have been installed in the drive trays, the drive trays
must be installed into the GALAXY.
WARNING!
All drive trays must be installed into the enclosure even if they do not
contain a hard drive. If the trays are not installed into the enclosure, the
ventilation required for cooling will not be normalized and the subsystem
will overheat.
Step 1. Make sure the key-lock is in the unlocked position. The keylock is unlocked if the groove on its face is in a horizontal
orientation. If the groove is in a vertical position, as shown in
Figure 2-6, then the key-lock is locked and the front flap on the
drive tray cannot be opened.
2-10
Drive Tray Installation
Chapter 2: Hardware Installation
Figure 2-6: Front View of an Individual Drive Tray
Step 2. Open the front flap on the drive tray (see Figure 2-7) by
pushing the release button on the front of the drive tray. The front
flap will open in an upward direction.
Figure 2-7: Open Drive Tray Front Flap
Step 3. Align the drive tray with the slot in which you wish to insert it.
Make sure that it is resting on the rails inside the enclosure, and
then gently slide it in. This should be done smoothly and gently.
Figure 2-8: Installing a Drive Tray
Step 4. Close the front flap on the drive tray. Make sure the front flap is
closed properly to ensure that the connector at the back of the
hard drive is firmly connected to the corresponding connector on
the backplane board. If the front flap is not closed properly, the
connection between the hard drive and the subsystem will not be
secure.
Drive Tray Installation
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Galaxy Raid Installation and Hardware Reference Manual
Figure 2-9: Closing the Drive Tray Front Flap
Step 5. Lock the flap into place by turning the key-lock until the groove
on its face is pointing down (vertical orientation).
Figure 2-10: Drive Tray Key-lock Rotation
Step 6. Once the drive tray is inserted, the RAID controller will
recognize the drive and scan it in automatically.
2.10. Rack/Cabinet Installation
The GALAXY subsystem has been designed to fit into a standard cabinet or
rack. Two (2) slide rails are available for installing the subsystem into a rack
or cabinet. Please contact your system vendor for further details. The
subsystem should be installed in the rack or cabinet before the hard drives
and the drive trays are installed. If the drive trays with the associated hard
drives are installed, the subsystem will be too heavy to mount into a rack or
cabinet. When installing the subsystem into a rack or cabinet it is advisable
that three people assist in the mounting process.
To install the subsystem into a rack or cabinet please refer to the installation
instructions that came with the slide rails.
2-12
Rack/Cabinet Installation
Chapter 2: Hardware Installation
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Galaxy Raid Installation and Hardware Reference Manual
CHAPTER 2................................................................................................................................ 1
HARDWARE INSTALLATION.............................................................................................. 1
2.1. INSTALLATION OVERVIEW ............................................................................................ 1
2.2. INSTALLATION PRE-REQUISITES ................................................................................... 1
2.3. SAFETY PRECAUTIONS:................................................................................................. 2
2.3.1
Precautions and Instructions ............................................................................... 2
2.3.2
Static-free Installation.......................................................................................... 3
2.4. GENERAL INSTALLATION PROCEDURE ......................................................................... 3
2.4.1
Installation Procedure Flowchart ....................................................................... 4
2.5. UNPACKING THE SUBSYSTEM ....................................................................................... 5
2.6. INSTALLATION OVERVIEW ............................................................................................ 5
2.6.1
Pre-installed Components.................................................................................... 5
2.7. INSTALLING THE OPTIONAL BBU................................................................................. 6
2.7.1
BBU Installation Overview .................................................................................. 6
2.7.2
BBU Warnings and Precautions.......................................................................... 6
2.7.3
Installation Procedure ......................................................................................... 7
2.8. HARD DRIVE INSTALLATION ........................................................................................ 9
2.8.1
Hard Drive Installation Prerequisites ................................................................. 9
2.8.2
SATA Drive Installation..................................................................................... 10
2.9. DRIVE TRAY INSTALLATION ....................................................................................... 10
2.10.
RACK/CABINET INSTALLATION .............................................................................. 12
accessory items, 5
Airflow, 2
airflow clearance, 2
audio jack cable, 5
authorized battery disposal sites, 6
BBU Warnings, 6
Cabling, 1
capacity, 9
component check, 1
controller module installation, 6
drive bays, 9
drive tray, 10
drive tray installation, 10
drive trays, 9
electrical earth connection, 2
electrostatic discharge, 1
ESD damage, 3
faulty module, 2
front flap, 11
Generic Operation Manual, 5
hard drive, 9
hard drives, 1
Hardware Manual, 5
2-14
installation procedure flowchart, 4
lower level, 5
null modem, 5
power outlet, 2
power range, 2
Pre-installed Components, 5
quick installation guide, 5
rack cabinet, 2
RAIDWatch User’s Manual, 5
retention screws, 2
safety precaution, 2
SATA drive installation, 9
SATA-I drives, 9
SATA-II drives, 9
SFP transceivers, 2
static electricity, 3
static free installation environment, 1
thermal notice, 2
Uninstalled Components, 5
unpacking, 5
Unpacking Checklist, 5
upper level, 5
ventilation, 2
Chapter 3: Subsystem Monitoring
Chapter 3
Subsystem Monitoring
3.1. Subsystem Monitoring Overview
The GALAXY subsystem is equipped with a variety of self-monitoring
features that help to keep subsystem managers informed of the subsystem
operational status, providing vital feedback to help you maintain the
operational integrity of the subsystem. Prompt response to warnings and
component failure notifications will improve the overall operation of the
subsystem and help ensure the longevity of the GALAXY RAID.
Self-monitoring features include:
•
Firmware (FW): The controllers in the GALAXY come with preinstalled FW, which can be accessed using either the LCD panel or
a PC hyper-terminal. The GALAXY can be connected to a PC
hyper-terminal through the COM ports. Device status information
can be obtained from the FW. The FW is fully described in the
User’s Operation Manual that came with your system. Please
refer to this manual for further information.
•
RAIDWatch: RAIDWatch is a fully integrated, Java-based,
Graphics User Interface (GUI) that came with the subsystem and
can be used to monitor and maintain the subsystem and the RAID
controllers using your web browsers. The LAN port at the back of
each controller module enables you to use an Ethernet cable to
connect to the subsystem.
The RAIDWatch Panel View can be customized to show a direct
representation of the GALAXY in the content panel of the
RAIDWatch screen. Panel View allows you to quickly determine
the operational status of critical GALAXY components. Please
refer to the RAIDWatch User’s Manual for further details.
NOTE:
Detailed installation instructions for RAIDWatch Manager are given in
the RAIDWatch User’s Manual, which is located on the product CD
that came with the ES system.
Subsystem Monitoring Overview
3-1
Galaxy Raid Installation and Hardware Reference Manual
•
Configuration Client: The Configuration Client is a powerful
module that runs as an independent program from RAIDWatch
and can be installed on different hosts. It is used for event
notification via email, fax, LAN broadcast, SNMP traps, MSN
Messenger, ICQ, SMS (Short Message Service), and the
configuration utility screen. The Configuration Client helps
prevent blind time and keeps you constantly informed as to the
status of the storage management subsystem. Instructions on
activating the Configuration Client functionality are given in the
RAIDWatch User’s Manual.
•
LEDs: Device status indicating LEDs are placed on all the ES
active components. These LEDs are used to inform users of the
integrity of a given component or of a given FC link. You should
become familiar with the different LEDs that are present on the
subsystem and be aware of their functions. (See Section 3.2)
•
Audible alarm: An audible alarm is present on the subsystem
controller board and will be triggered if any of a number of
threatening events occur. These events usually jeopardize the
functional and operational integrity of the controller board and
must be heeded at all times. Events such as a breach of the
temperature threshold will trigger the alarm and if an onsite
subsystem manager is present, the manager should use either the
LCD panel or the PC hyper-terminal to determine the cause of the
alarm and take the appropriate corrective measures. (See Section
3.3)
•
I2C: The I2C bus monitors the operational integrity of the PSUs,
cooling modules, voltage readings, and RAID controller board
temperature. (See Section 3.4)
Subsystem monitoring is a necessary part of subsystem management. If
failure events or other disruptive events are detected and reported, the
subsystem managers must take the appropriate action to rectify the problem.
Failure to act in a properly specified manner to a system event (like
overheating) can cause severe and permanent damage to the subsystem.
3.2. Status-indicating LEDs
3.2.1 Brief Overview of the LEDs
The GALAXY has status-indicating LEDs distributed over the active
components that inform subsystem managers about each component
operational status. The list in Table 3-1 shows the number of LEDs assigned
to each component.
3-2
Status-indicating LEDs
Chapter 3: Subsystem Monitoring
Component
LEDs per Module
Total LEDs
Definition
LCD Panel
3
3
See Section 3.2.2
Drive Trays
2
32
See Section 3.2.3
Controller
Module(s)
8
8
See Section 3.2.4
LAN Ports
2
4
See Section 3.2.5
BBU
(optional)
1
1
See Section 3.2.6
PSUs
1
2
See Section 3.2.7
Cooling
Modules
2
4
See Section 3.2.8
Table 3-1: LED Distribution
LED definitions are given in the following sections.
3.2.2 LCD Panel
The LCD panel shown in Figure 3-1 consists of five (5) buttons, three (3)
LEDs, and a 16x2-character LCD screen that indicates subsystem status.
Press the ENT button for two (2) seconds on the initial screen to enter the
main menu. Press the ESC button to clear the current event.
Press the UP and DOWN arrow keys to select viewing items. In the last
item, “View and Edit Event Logs,” the most recent event is displayed first.
The MUTE button stops the alarm until the next controller event occurs.
Three (3) LEDs monitor the status of the system. The definitions of these
LEDs are given in Table 3-2 below.
Figure 3-1: LCD Panel LEDs
Status-indicating LEDs
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Galaxy Raid Installation and Hardware Reference Manual
Name
Color
Status
ON indicates that power is being supplied to the
subsystem.
PWR
Blue
(Power)
OFF indicates that no power is being supplied to
the subsystem.
FLASHING indicates that there is activity on
the host/drive channels.
BUSY
White
OFF indicates that there is no actively on the
host/drive channels.
ATTEN
(Attention)
ON indicates that a component failure/status
event has occurred.
Red
OFF indicates that the subsystem and all its
components are operating correctly.
Table 3-2: LCD Panel LED Definitions
NOTE:
During the power up process, the LCD panel ATTEN LED will be turned
on. If the subsystem boots up correctly, then the ATTEN LED will be
turned off after the boot-up procedure is complete.
3.2.3 Drive Tray LEDs
Two (2) LED indicators are located on the right side of each drive tray. (See
Figure 3-2 Refer to Table 3-3 for the LED definitions. When notified by a
drive failure message, you should check the drive tray indicators to find the
correct location of the failed drive. Replacing the wrong drive can fatally
fail a logical array.
Figure 3-2: Drive Tray LEDs
3-4
Status-indicating LEDs
Chapter 3: Subsystem Monitoring
LED Name
Drive Busy
Color
Status
FLASHING
indicates
there
read/write activity on the drive.
Blue
is
OFF indicates there is no read/write
activity on the drive.
GREEN indicates that a drive is
installed in the drive tray
Power Status
Green/ Red
RED indicates that there is a drive
failure.
Table 3-3: Drive Tray LED Definitions
3.2.4 Controller Module LEDs
The rear panel of the controller module is shown in Figure 3-3 below. The
LEDs are numbered from 1 – 6 and A - B. The LED definitions are shown
in Table 3-4 below.
Figure 3-3: Controller Module Rear Panel
LED
Name
Color
Status
ON indicates the controller is active
and operating properly.
1
2
3
Status-indicating LEDs
Ready
Hst Bsy
(Host Busy)
Drv Bsy
(Drive Busy)
Green
OFF indicates the controller is not
ready for operation.
FLASHING indicates there is activity
on the host ports.
Green
OFF indicates there is no activity on
the host ports.
FLASHING indicates there is activity
on the drive ports.
Green
OFF indicates there is no activity on
the drive ports.
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Galaxy Raid Installation and Hardware Reference Manual
4
N/A
5
C_Dirty
(Cache
Dirty)
N/A
N/A
Amber
ON indicates that data is currently
being cached in memory or is being
held up by the BBU during a system
power loss.
ON indicates the BBU cannot sustain
the cache memory. This maybe caused
by a missing BBU.
6
BBU Status
Amber
OFF indicates the BBU is functioning
normally and is able to sustain the
cache memory.
FLASHING indicates the BBU is
charging.
Table 3-4: Controller Module LED Definitions
This controller module has additional two (2) LEDs, labeled A and B. The
definitions of these LEDs are shown in Table 3-5 below.
LED
A
Name
CH0 LINK
Color
Status
Green
ON indicates that channel 0 link has
been established.
OFF indicates that channel 0 link has
not been established.
B
CH1 LINK
Green
ON indicates that channel 1 link has
been established.
OFF indicates that channel 1 link has
not been established.
Table 3-5: Controller Module Channel Status LEDs
3.2.5 LAN Port LEDs
A shielded Ethernet cable must be used to connect the RJ-45 Ethernet port
to a hub on a network after you assign a permanent IP to the A16F-R/S2221.
This enables you to manage your subsystem via the web. Two (2) LEDs
located on the Ethernet port indicate the Ethernet connection status. See
Figure 3-4 for the locations of the two (2) LED indicators. Refer to Table
3-6 for the LED definitions.
Online Status
LAN Activity
Figure 3-4: LAN Port LEDs
3-6
Status-indicating LEDs
Chapter 3: Subsystem Monitoring
Name
Color
Status
Online Status
Green
ON indicates currently connected to a LAN
LAN Activity
Green
BLINKING indicates active transmission
Table 3-6: LAN Connector LED Definitions
3.2.6 BBU LED
The BBU LED is located on the right side of the BBU on the subsystem rear
panel. (See Figure 3-5) The function is the same as the sixth LED on the
controller module.
Figure 3-5: BBU LED Location
LED Name
Color
Status
BBU Status
Amber
ON indicates the BBU has failed and cannot
sustain the cache memory. Please re-charge
the BBU or contact your system vendor to
verify the problem
OFF indicates the BBU is sufficiently
charged and can sustain cached data.
FLASHING indicates the BBU is charging.
Table 3-7: BBU LED Definitions
Status-indicating LEDs
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Galaxy Raid Installation and Hardware Reference Manual
IMPORTANT!
In addition to BBU failure itself and the charger failure, the
subsystem may also light the BBU fault LED when the following
occur:
1.
The temperature sensor embedded with the charger circuit
reports a temperature reading exceeding 45 degree Celsius.
2.
The BBU (battery cell pack) has been charged for over 7 hours.
The BBU charger will enter a timer fault state.
When the above conditions occur, the charger circuit will enter a lowpower and self-protection state.
You may correct the faults when receiving a “BBU Thermal
Shutdown/Enter Sleep-Mode!” event message:
1.
Check proper ventilation within the subsystem. You may also
check the readings from other sensors within the enclosure.
Airflow might have been disrupted by the absence of one or
several major modules or the failure of a cooling fan. Once the
thermal condition is improved, charging will resume
automatically.
2.
If a new battery module has been charged for over seven (7)
hours and this event is issued, you may remove and re-install the
battery module. An empty battery module may take more than 7
hours to be fully charge. There is a timer embedded with the
charger, doing so can reset the timer. Charging will resume
automatically.
3.2.7 PSU LEDs
Each PSU comes with a single LED at the back (see Figure 3-6), located
just above the power switch that turns on the subsystem. This LED indicates
the operational status of the PSU module. Please refer to the PSU LED
definitions shown in Table 3-8.
Figure 3-6: PSU LED Location
3-8
Status-indicating LEDs
Chapter 3: Subsystem Monitoring
Color
Status
FLASHING
Green
The power supply has not been turned on. The PSU
module LED will blink when the subsystem is
connected to a power source but not yet turned on.
Static Green
The PSU is operating normally and experiencing no
problem.
Static Red
The PSU has failed and is unable to provide power to
the subsystem.
OFF
The subsystem has not yet been plugged into a power
source.
Table 3-8: PSU LED Definitions
3.2.8
Cooling Module LEDs
Each cooling module has two (2) red LEDs on the back. Each LED
corresponds to a single fan in the cooling module. (See Figure 3-7) When
the LED is on, it indicates the fan has failed. When the LED is off, it
indicates the fan is functioning properly.
Figure 3-7: Cooling Module LEDs and Cooling Fan Locations
The GALAXY has a novel approach to stabilizing the temperature within
the subsystem: When the intelligent sensors on the backplane detect higher
temperature, such as high ambient temperature or the failure of any cooling
or PSU module, the system will turn the cooling fans to high speed to
extract more heat. Once the ambient temperature cools down to normal or
the cooling or PSU modules have been replaced, the cooling fans will return
to low speed.
Status-indicating LEDs
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Galaxy Raid Installation and Hardware Reference Manual
3.3. Audible Alarm
Different controller environmental and operational parameters (like
temperature, etc.) have been assigned a range of values between which they
can fluctuate. If either the upper or lower thresholds are exceeded, an
audible alarm will automatically be triggered. The alarm will also be
triggered when an active component on the GALAXY fails. If the
administrator is onsite and hears an alarm, the manager must read the error
message on the LCD screen or PC terminal to determine what has triggered
the alarm. After determining what has occurred, the manager must take
appropriate actions to rectify the problem.
WARNING!
If an alarm is triggered, it is necessary for you to determine the problem.
If the audible alarm is ignored and the problem is not rectified,
unexpected damages may occur.
3.3.1 Default Threshold Values
NOTE:
The threshold values listed below are used to trigger a warning event and
sound the alarm. A different value set is reserved for triggering the
cooling fans to operate at a high rotation speed. The fan speed value set
is not user-configurable.
Table 3-9 shows the default threshold values for the A16F-G2422. If any of
these values are surpassed, the alarm will sound:
Parameter
Upper
Threshold
Lower
Threshold
+3.3V
+3.6V
+2.9V
+5V
+5.5V
+4.5V
+12V
+13.2V
+10.8V
CPU Temperature
90ºC
5ºC
Board Temperature
80ºC
5ºC
Enclosure
Temperature
40ºC
0ºC
Ambient
Table 3-9: Default Threshold Values
The thresholds in Table 3-9 are the default threshold values. To change
these pre-set values, please refer to the User’s Operation Manual that came
with your system. The values set for the subsystem’s ambient temperature
are pre-configured before shipping and cannot be changed.
3-10
Audible Alarm
Chapter 3: Subsystem Monitoring
3.3.2 Failed Devices
If any of the following devices fail, the audible alarm will be triggered:
•
Cooling module
•
PSU module
•
BBU
•
Hard drive
NOTE:
When the temperature exceeds a preset threshold, the controller’s
charger circuits will stop charging. You will then receive a message that
says “Thermal Shutdown/Enter Sleep Mode.” When the temperature falls
back within normal range, the battery will resume charging.
3.4. I2C Monitoring
Presence detection and the general working status of the cooling fan and
other modules are monitored through an I2C serial bus. If any of these
modules fail, you will be notified via the various methods described above.
I2C Monitoring
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This page is intentionally
left blank
3-12
I2C Monitoring
Chapter 3: Subsystem Monitoring
Chapter 3.................................................................................................................................... 3-1
Subsystem Monitoring .............................................................................................................. 3-1
3.1. Subsystem Monitoring Overview ............................................................................. 3-1
3.2. Status-indicating LEDs ............................................................................................. 3-2
3.2.1
Brief Overview of the LEDs ............................................................................. 3-2
3.2.2
LCD Panel ......................................................................................................... 3-3
3.2.3
Drive Tray LEDs............................................................................................... 3-4
3.2.4
Controller Module LEDs .................................................................................. 3-5
3.2.5
LAN Port LEDs................................................................................................. 3-6
3.2.6
BBU LED.......................................................................................................... 3-7
3.2.7
PSU LEDs ......................................................................................................... 3-8
3.2.8
Cooling Module LEDs ...................................................................................... 3-9
3.3. Audible Alarm......................................................................................................... 3-10
3.3.1
Default Threshold Values ............................................................................... 3-10
3.3.2
Failed Devices ................................................................................................. 3-11
3.4. I2C Monitoring ........................................................................................................ 3-11
alarm, 3-2
audible alarm, 3-2, 3-9, 3-10
BBU LED, 3-7
controller module, 3-5, 3-6
Controller Modules, 3-3
cooling module, 3-8
Cooling Module, 3-3
cooling module LED, 3-7
drive tray LED, 3-4
Drive Trays, 3-3
Ethernet port, 3-1, 3-6
firmware, 3-1
functional integrity, 3-2
Generic Operation Manual, 3-1, 3-9
I2C, 3-2, 3-10
LAN Port LED, 3-6
LCD panel, 3-2
I2C Monitoring
LCD Panel, 3-3
LED, 3-2
monitoring, 3-1
mute button, 3-3
operational integrity, 3-2
Partner Fail, 3-6
PC hyper-terminal, 3-1, 3-2
permanent IP, 3-6
PSU, 3-7
PSU Module, 3-3
RAIDWatch, 3-1
RJ-45, 3-6
self-monitoring features, 3-1
sensors, 3-8
status-indicating LEDs, 3-2
temperature threshold, 3-2
the controller board, 3-2
3-13
Chapter 4: Subsystem Connection and Operation
Chapter 4
Subsystem Connection and Operation
This chapter outlines some basic configuration rules you should use when
configuring a storage system and introduces basic information about Fibre
cables and Fibre topologies for the GALAXY Raid. You can set the system
up using these topologies or use them as a guide for developing your own
unique topologies. A complete description of the power on and power off
procedures is also given in this chapter.
4.1 FC Host Connection Prerequisites
4.1.1
Choosing the Fibre Cables
The Fibre Channel standard allows for both copper and optical connections.
Copper cable is cheaper but limited to lengths of less than 30m. Optical
cable can be used over longer distances and have been shown to be more
reliable. Due to the extremely demand of high data transfer rate, optical
cables are preferred for 4Gb/s Fibre connectivity. Optical cables are also
less susceptible to EMI.
Fibre cables are expansive components that need to be purchased separately.
You may order Fibre cables that came with different lengths from Rorke
Data Sales. Those cables are being proved to be compatible with your
GALAXY subsystems.
WARNING!
All Fibre cables are sensitive and must be handled with care. To prevent
interference within a rack system, the cable routing path must be
carefully planned and the cables must not be bent.
FC Host Connection Prerequisites
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Galaxy Raid Installation and Hardware Reference Manual
4.1.2
FC Lasers
CAUTION!
Lasers can be hazardous and may cause permanent eye damage or
blindness, and therefore must be treated with respect and used with
caution. Never look at lasers without knowing whether they are on or off.
Wavelengths: The lasers on fiber optic cables emit either short wave (SW)
beams (770nm-860nm) or long wave (LW) (1270nm-1355nm) beams.
Cables using either of these wavelengths can be used.
Laser types: Two (2) types of laser devices can be used in FC cables:
Optical Fibre Control (OFC) and non-OFC lasers. The OFC lasers are highpowered and can be used over long distances.
Safety features: Due to their high power output, OFC lasers usually come
with a safety mechanism that switches the laser off as soon as it is
unplugged. Non-OFC lasers are low power and do not come with these
safety features; however, they can still inflict damage.
4.1.3
FC Speed Auto-detection
Speed auto-detection is specified by the Fibre Channel standard. If a 2Gb/s
port is connected to a 4Gb/s port, it will negotiate down and run at 2Gb/s. If
there are two 4Gb/s ports on either end of the link, the link will be run at
4Gb.
NOTE:
If the Fibre Channel cable being used is too long for your system, it
may end up running at slower speed even with two (2) 4Gb/s ports.
4.1.4
SFP Transceivers
Once you have purchased your FC cables, it may be necessary to connect
them to SFP transceivers. These transceivers should typically have at least
4Gbps bi-directional data links, a laser transmitter (for fiber optic cables),
LC connector, and a metal enclosure to lower the EMI.
NOTE:
LC connectors are small form-factor, fiber-optic connectors based on a
1.25-mm ceramic ferrule with the familiar latching mechanism of the RJ45 modular plug and jack.
Other beneficial features of a typical SFP transceiver include a single power
supply, low power dissipation, and hot-swap capability. It is also important
4-2
FC Host Connection Prerequisites
Chapter 4: Subsystem Connection and Operation
that any transceiver you use meets the FC performance and reliability
specifications.
NOTE:
SFP transceiver modules must be purchased separately. You can order
the field-replaceable, SFP tranceivers from your subsystem vendor or
contact them for a compatible list.
4.2 Topology and Configuration Considerations
4.2.1 Basic Configuration Rules
When you are configuring your GALAXY Raid, the list below contains
some basic rules that should be followed.
NOTE:
Please adhere to these basic configuration rules. They are provided for
your convenience to ensure that your storage system will run smoothly
and effectively.
•
When selecting the number of hard drives that should be connected
through the drive channels, the transfer rates and the mechanical
performance of the hard disks should be considered.
•
When cabling, follow all the Fibre channel specifications. Pay
attention to signal quality and avoid electronic noise from adjacent
interfaces.
•
The drives in the same logical array should have the same capacity,
but it is preferred that all the drives have the same capacity.
•
A spare drive should have a minimum capacity that is equivalent to
the largest drive that it is expected to replace. If the capacity of the
spare is less than the capacity of the drive it is expected to replace,
then the controller will not proceed with the failed drive rebuild.
4.2.2 Fibre Channel Topologies
The Fibre channel standard supports three (3) separate topologies. They are
point-to-point, Fibre Channel Arbitrated Loop (FC-AL), and fabric switch
topologies.
•
Point-to-Point: Point-to-point topology is the simplest topology
that can be used. It is a direct connection between two (2) Fibre
channel devices.
Topology and Configuration Considerations
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Galaxy Raid Installation and Hardware Reference Manual
•
FC-AL: This is the most common topology currently in use. Fibre
channel devices are all connected in a loop. Each device is assigned
an arbitrated loop physical address (AL_PA). The FC-AL supports
127 devices in a single loop.
•
Fabric: The fabric topology supports up to 224 Fibre channel
devices. This topology allows many devices to communicate at the
same time. A Fibre switch is required to implement this topology.
The GALAXY supports the three topologies discussed above.
4.2.3 Host-side Topologies
The primary concern for configuring host-side topologies is to avoid points
of failure. It is therefore recommended that the host side be connected to at
least two (2) HBAs. It is also preferable to connect the FC RAID
subsystems to the host computer(s) through either a Fibre Channel hub or a
Fibre switch.
NOTE:
To create dual-redundant data paths on the host side, it is necessary for
third-party failover software to be installed on the host computer.
4.2.4 Unique Identifier
The unique identifier is a user-specified, 16-bit hexadecimal number that is
used to assign a FC port number to the active controller. Each controller is
assigned a separate hexadecimal number and the firmware then determines
which unique identifier to use. To see how to use the front panel LCD
screen or the terminal emulation program to enter the unique identifier,
please refer to the User’s Operation Manual.
4.2.5 ID/LUN Mapping
I/O load distribution is determined by the host ID/LUN mapping. Different
logical groups of drives are mapped to the LUN numbers under a host ID.
For a multi-host operation, a logical drive configuration can be mapped to
different ID/LUN combinations. In this case, the file locking mechanism is
necessary. ID/LUN mapping procedures are described fully in the User’s
Operations Manual.
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Topology and Configuration Considerations
Chapter 4: Subsystem Connection and Operation
4.3 Sample Topologies
The FC ports on the controller rear panel can be used to connect the
GALAXY to the hosts, and/or external devices. The subsystem will
automatically validate the dual-loop configuration, and the RAID controller
will activate the enclosure monitoring service accordingly.
NOTE:
Rather you are going to connect the GALAXY to hosts, or external
devices, be sure to have SFP transceivers and Fibre cables ready. You
may purchase the SFP transceivers and Fibre cables from your subsystem
vendor. See Appendix C for the available accessories list.
4.3.1 Sample Topology – Clustered Hosts
In the configuration shown in Figure 4-1, one (1) GALAXY subsystem is
connected to two (2) host computers. Data path redundancy makes sense
when the following configurations are available:
1.
These two computers are clustered.
2.
Cluster software is installed.
3.
The same storage volume(s) are made available on both host ports.
The surviving computer can access the array in the event of single
computer failure.
Figure 4-1: Connect GALAXY Subsystem to Dual Host
Sample Topologies
•
Connections: The input ports on the subsystem, FC-CH0 and FCCH1, are connected to two separate host computers.
•
Redundant Data Paths: In the configuration shown in Figure 4-1,
the data paths are redundant. If either of these data paths fails, I/O
traffic will be transmitted along the alternative path. If one of the
host computers fails, the second host computer that is connected to
the subsystem can resume the operation of the subsystem.
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Galaxy Raid Installation and Hardware Reference Manual
NOTE:
To create dual-redundant data paths on the host side, it is necessary for
third-party failover software to be installed on the host computer.
4.3.2 Sample Topology – Direct-Attached
In the configuration shown in Figure 4-2, one (1) GALAXY subsystem is
connected to a single host computer. Data path redundancy makes sense
when the following configurations are available:
1.
Path failover software is installed.
2.
Storage volume(s) are presented on either of the host ports. The
host management software should direct the data flow through a
surviving path in the event of single path failure.
Figure 4-2: Connect Galaxy Raid Subsystem to Single Host
•
Connections: The input ports on the subsystem, FC-CH0 and FCCH1, are connected to two separate HBAs on a host computer.
•
Redundant Data Paths: In the configuration shown above, the data
paths are redundant. If either of these data paths fails, I/O traffic
will be transmitted along the alternative path.
4.4 Power On
Once all of the components have been installed in the GALAXY and the
host channels have been connected to the host, the subsystem can be
powered on.
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Power On
Chapter 4: Subsystem Connection and Operation
4.4.1
Check List
BEFORE powering on the GALAXY Raid, please check the following:
4.4.2
‰
Memory module: Memory modules have been correctly installed
on the controller boards.
‰
BBU: If BBU is installed, make sure BBU has been installed
correctly.
‰
Hard drives: Hard drives have been correctly installed in the drive
trays.
‰
Drive trays: All the drive trays, whether or not they contain a hard
drive, have been installed into the subsystem.
‰
Cable connections: The host ports on the subsystem have been
correctly connected to a host computer(s).
‰
Power cords: The power cords have been connected to the PSU
modules on the subsystem and plugged into the main power source.
‰
Ambient temperature: All the subsystem components have been
acclimated to the surrounding temperature.
Power On Procedure
When powering on the GALAXY Raid, please follow these steps:
Step 1. Power on the Fibre Channel connection devices.
These devices include the hubs, switches, and any other such
device that have been connected to the GALAXY Raid. Please
refer to the manual that came with your FC device to see the power
on procedure.
CAUTION!
All necessary SFP transceivers and cables connections must be made
between subsystems before turn on the subsystem. If you power on the
subsystem before correctly connect cables, unexpected damages may
occur.
Step 2. Power on the GALAXY Raid.
The first GALAXY should be powered on before the host
computers. To power on the GALAXY Raid, please follow the
description below.
•
Power On
Using the power cords provided in the package, connect both
power sockets on the subsystem rear panel to the main power
source.
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Galaxy Raid Installation and Hardware Reference Manual
•
Turn the two (2) power switches on. (See Figure 4-3) Each
switch controls a single PSU, therefore make sure that both
switches are turned on.
Figure 4-3: GALAXY Raid Subsystem Power Switches
CAUTION!
Although the PSUs are redundant and a single PSU can provide
sufficient power to the system, it is advisable to turn both the power
switches on. If only one (1) PSU is operating and that PSU fails, the
whole system will crash.
Step 3. Power on the host computers.
The host computers should be the last devices that are turned on.
Please refer to the manual that came with your host computers to see
their own power on procedures.
4.4.3
Power On Status Check
Once the GALAXY has been powered on, the status of the entire subsystem
should be checked to ensure that everything is running smoothly and that
there are no complications or malfunctions.
4-8
1.
Controller module LEDs: The Controller Ready, Host Busy, and
Drive Busy LEDs should all flash green.
2.
Drive tray LEDs: The green LEDs for all the drive trays that
contain hard drives should light up showing that there is power.
3.
LCD panel LEDs: The blue LED on the LCD panel should
illuminate, indicating that power is being supplied to the system.
4.
BBU LEDs: If a BBU module is installed, the LEDs on the BBU
rear panel should start flashing amber, indicating that the BBU is
being charged.
5.
PSU LEDs: If the PSU is operating normally and experiencing no
problem after power on, the LEDs on the PSU should light green
constantly.
Power On
Chapter 4: Subsystem Connection and Operation
6.
Firmware and RAIDWatch: The overall status of the system may
be checked using the pre-installed firmware or the RAIDWatch
GUI.
7.
Audible alarm: If any errors occur during the initialization process,
the onboard alarm will sound in a hastily repeated manner.
8.
Drive tray LEDs should start flashing, indicating that the RAID
control units are attempting to access the hard drives.
System firmware can be configured to support a delayed sequence for
starting drives. Please consult your User’s Operation Manual for more
details.
NOTE:
The subsystem has been designed to run continuously. If a component
fails, the fault can be corrected online.
4.4.4
LCD Screen
When powering on the subsystem, the following messages should appear on
the front panel LCD screen. Wait for the front panel LCD to show
“READY” or “No Host LUN” before the host boots up. Refer to Figure
4-4 on how to read the screens.
Model Name
GALAXY
Ready
Status/Data Transfer Indicator
Figure 4-4: The LCD Start-up Screen
The LCD screen startup sequence is shown and described in the sequence
below.
Power On
Initializing….
Please Wait...
This screen appears when the PSUs are
turned on.
GALAXY
Power On Self Test
The subsystem will start a self-test.
GALAXY
Self Test Completed
The self-test has been completed.
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Galaxy Raid Installation and Hardware Reference Manual
GALAXY
Modem Not Config
This screen appears after the initialization
process. It clearly shows the model name.
GALAXY
256MB RAM, Wait…
Verifying installed cache memory.
GALAXY
No Host LUN
System is ready. You can now start to
configure the subsystem.
4.5 Power Off Procedure
If you wish to power down the GALAXY Raid, please follow these steps:
NOTE:
If you wish to power down the subsystem, please ensure that no timeconsuming processes, like “Regenerate Logical Drive Parity” or a
“Media Scan,” are taking place.
Step 1. Stop I/O access to the system.
Stop all I/O access to the GALAXY Raid subsystem. Please refer to
the related documentation of your applications.
Step 2. Flush the cache.
Locate the C_Dirty LED on the back of controller module to check
if there is still cached data in memory. Use the Shutdown Controller
function to flush all cached data. This prepares the RAID subsystem
to be safely powered down.
Step 3. Turn off the power.
Turn off the power switches at the top of the rear panel of the
GALAXY Raid. Once the subsystem has been powered down, other
devices that are connected to the subsystem may be powered down.
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Power Off Procedure
Chapter 4: Subsystem Connection and Operation
CHAPTER 4 SUBSYSTEM CONNECTION AND OPERATION................................. 1
4.1
FC HOST CONNECTION PREREQUISITES ....................................................................... 1
4.1.1
Choosing the Fibre Cables .................................................................................. 1
4.1.2
FC Lasers ............................................................................................................. 2
4.1.3
FC Speed Auto-detection ..................................................................................... 2
4.1.4
SFP Transceivers ................................................................................................. 2
4.2
TOPOLOGY AND CONFIGURATION CONSIDERATIONS ................................................... 3
4.2.1
Basic Configuration Rules ................................................................................... 3
4.2.2
Fibre Channel Topologies ................................................................................... 3
4.2.3
Host-side Topologies............................................................................................ 4
4.2.4
Unique Identifier .................................................................................................. 4
4.2.5
ID/LUN Mapping ................................................................................................. 4
4.3
SAMPLE TOPOLOGIES .................................................................................................... 5
4.3.1
Sample Topology – Clustered Hosts.................................................................... 5
4.3.2
Sample Topology – Direct-Attached.................................................................... 6
4.4
POWER ON .................................................................................................................... 6
4.4.1
Check List ............................................................................................................. 7
4.4.2
Power On Procedure ........................................................................................... 7
4.4.3
Power On Status Check........................................................................................ 8
4.4.4
LCD Screen .......................................................................................................... 9
4.5
POWER OFF PROCEDURE............................................................................................. 10
ambient temperature, 7
BBU, 7
bi-directional data link, 2
Cable connection, 7
copper cable, 1
drive tray, 7
electronic noise, 3
fabric topology, 4
failover software, 6
FC-AL, 3
Fibre cable, 1
Full redundancy, 5, 6
Generic Operation Manual, 9
hard drives, 7
HBA, 4
host computers, 5, 6
I/O access, 10
I/O traffic, 5, 6
laser, 2
laser types, 2
LC connector, 2
LCD, 9
LCD Screen, 9
LUN mapping, 4
media scan, 10
memory module, 7
Power Off Procedure
Non-OFC laser, 2
non-OFC lasers, 2
OFC, 2
OFC laser, 2
optical cable, 1
Optical Fibre Control, 2
points of failure, 4
Point-to-Point, 3
power cord, 7
power down, 10
power on, 6
Power On, 6
power on sequence, 7
power on status check, 8
power socket, 7
power switch, 8
Regenerating logical drive parity, 10
SFP transceiver, 2
SFP transceivers, 2
signal quality, 3
startup, 9
storage network, 5, 6
unique identifier, 4
Unique Identifier, 4
wavelengths, 2
4-11
Chapter 5: Subsystem Maintenance and Upgrading
Chapter 5
Subsystem Maintenance
5.1. Overview
5.1.1
Maintenance
Constant monitoring and maintenance of your GALAXY subsystem will
minimize subsystem downtime and preserve the working integrity of the
system for a longer period of time. If any of the subsystem components fail,
they must be replaced as soon as possible.
WARNING!
Do not remove a failed component from the subsystem until you have a
replacement on hand. If you remove a failed component without replacing
it, the internal airflow will be disrupted and the system will overheat
causing damage to the subsystem.
All of the following components can be replaced in case of failure:
1.
Controller module – Section 5.2
2.
Memory module – Section 5.3
3.
BBU - Section 5.4
4.
PSU module – Section 5.5
5.
Cooling module – Section 5.6
6.
Hard drive – Section 5.7
5.1.2 General Notes on Component Replacement
Overview
•
With the exception of the RAID controller module, all of the
components on the GALAXY, including the PSU modules, cooling
modules, and drive trays, are hot-swappable and can be changed
while the subsystem is still in operation.
•
Qualified engineers who are familiar with the GALAXY should be
the only ones who make component replacements. If you are not
familiar with the GALAXY or with RAID subsystem maintenance
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Galaxy Raid Installation and Hardware Reference Manual
in general, it is strongly advised that you refer GALAXY
maintenance to a suitably qualified maintenance engineer.
•
Normalized airflow depends upon the presence of all subsystem
components. A subsystem component, even if it has failed, should
not be removed from the subsystem until a replacement is readily at
hand and can be quickly installed. Removing subsystem
components without a replacement can lead to permanent
subsystem damage.
•
When replacing any hot-swappable component, caution should be
taken to ensure that the components are handled in an appropriate
manner. Rough or improper handling of components can lead to
irreparable damage.
•
When removing a controller module from the subsystem, ensure
that the power has been turned off and that all precautionary
measures, without exception, are adhered to. The controller board
is very sensitive component and can be easily damaged.
WARNING!
When inserting a removable module, take heed that DO NOT USE
EXCESSIVE FORCE! Forcing or slamming a module can damage the
pins on the module connectors either on the module itself or on the
backplane. Gently push the module until it reaches the end of module
slot. Feel the contact resistance and use slightly more force to ensure the
module connectors are correctly mated. If the module comes with
extraction levers or retention screws, use them to secure the module.
5.2. Replacing Controller Module Components
5.2.1 Overview
The controller module in the GALAXY consists of the following
replaceable components:
•
•
DDR RAM DIMM module
Controller module
If any of these components fails, it needs to be replaced. To replace any of
these components, the controller module must be removed.
5-2
Replacing Controller Module Components
Chapter 5: Subsystem Maintenance and Upgrading
5.2.2 Notes on Controller Module Maintenance
•
The GALAXY is a single-controller model subsystem; therefore, it
is necessary to power down the subsystem to remove the controller.
When replacing a DIMM or the controller itself, the whole
subsystem needs to be powered down. You should carefully select
the time when the replacement will be made in order to minimize
the overall disruption to service.
•
The controller module contains a DDR RAM DIMM module.
When replacing the controller module, the DIMM module must be
removed from the old controller module and it can be reinstalled
onto the new controller module.
•
When replacing the controller module, always remember that the
controller board is one of the most sensitive components in the
GALAXY. All previously stipulated safety precautions (see
Section 2.3) must be strictly adhered to. Failure to adhere to these
precautions can result in permanent damage to the controller board,
resulting in lengthy delays for the end user.
•
For your own safety and that of the subsystem, make sure that no
power is being supplied to the system prior to replacing the
controller module.
5.2.3 Removing the Controller Module
To remove the controller module:
Step 1. Turn off the subsystem. If possible power off the subsystem in
the way described in Chapter 4. If it is not possible to do this,
turn off both PSU modules.
Step 2. Disconnect all cables from the controller module. These include
the Ethernet cable connected to the Ethernet port, and any cables
connected to the COM ports.
Step 3. Remove the screws on the levers at the back of the controller
module. (See Figure 5-1)
Replacing Controller Module Components
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Galaxy Raid Installation and Hardware Reference Manual
Figure 5-1: Removing Screws from the Retention Levers
Step 4. Remove the controller module by pressing down the two (2)
levers at the back of the controller module. The controller module
will automatically be eased out of the controller module bay. (See
Figure 5-2)
Figure 5-2: Removing the Controller Module
Step 5. Gently pull the controller module out of the subsystem. Place the
controller module on a clean surface.
5.2.4 Replacing the Controller Module
If the controller module itself has failed, it must be replaced. To replace a
failed controller module:
Step 1. Remove the controller module from the subsystem (see Section
5.2.3) If the DIMM module is undamaged, it can be removed and
reinstalled on the new controller module. For instructions on
removing and installing a DIMM module, please see Section 5.3)
Step 2. Install the DIMM module onto the new controller module;
making sure that the memory module is securely in place. (See
Section 5.3)
Step 3. Install the controller module. Make sure the levers at the back of
the controller module are down. Align the controller module with
the controller module bay at the rear of the subsystem. Gently
slide the controller module in. (See Figure 5-3)
5-4
Replacing Controller Module Components
Chapter 5: Subsystem Maintenance and Upgrading
Figure 5-3: Inserting the Controller Module
Step 4. Reposition the controller module. Once fully inserted, lift up the
levers at the back of the controller module. This will set the
controller module in the correct position.
Figure 5-4: Lifting the Controller Module Latches Upward
Step 5. Secure the controller module to the subsystem by installing the
two (2) screws on the levers. (See Figure 5-5)
Figure 5-5: Installing the Controller Module Screws
Step 6. Re-attach all the cables that were removed. These include the
cables that connect to the host and the expansion chassis, any
Ethernet cable that was previously attached to the LAN port, and
any cables that were attached to the COM ports.
Step 7. Power up the system.
Replacing Controller Module Components
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Galaxy Raid Installation and Hardware Reference Manual
5.3. DIMM Module Replacement
The subsystem comes with a pre-installed 256MB capacity or above DDR
RAM DIMM module on the controller. The controller supports memory up
to 2GB. If a DDR RAM DIMM module has been failed or a different size of
DIMM module needs to be used, the pre-installed module must be removed
and the new one installed. Replacement and installation instructions are
described fully below.
5.3.1 DIMM Module Considerations
If the memory module on the controller module is going to be replaced, the
following issues must be considered when purchasing a replacement DIMM
module:
•
Pre-installed DDR RAM DIMM module: The GALAXY RAID
subsystem comes with a 256MB capacity or above DDR RAM DIMM
pre-installed on each controller board. If you wish to change the size of
the DDR DIMM, then a new DIMM must be installed.
•
Installation considerations: When installing the DDR RAM DIMM
module, it is necessary to remove the controller module. The controller
board is more susceptible to damage than the other components and
must be handled with extreme care.
•
Secure installation: When replacing the DIMM module, make sure that
the new DIMM module is firmly in place prior to re-installing the
controller module. If the DIMM module is not firmly in place, the
subsystem will not run and the whole procedure must be repeated.
5.3.2 DIMM Module Replacement Procedure
NOTE:
If you are going to replace or upgrade a DIMM module, please follow the
instructions below. If you do not want to replace or upgrade a DIMM you
may skip this section.
If a DIMM module fails or if a DIMM module with a higher memory
capacity is required, the onboard DIMM module must be replaced. To
replace the DIMM module:
Step 1. Remove the controller module. (See Section 5.2.3.)
Step 2. Remove the previously installed DIMM module from the
DIMM socket. Pull down the white clips on either side of the
DIMM module to a 45-degree angle to dislodge the DIMM
module. (See Figure 5-6)
5-6
DIMM Module Replacement
Chapter 5: Subsystem Maintenance and Upgrading
Figure 5-6: Removing the DIMM Module
Step 3. Re-insert the new DIMM module. Align the new DDR RAM
DIMM module with the DIMM socket and gently (but firmly)
push it in. The white clips on either side of the slot should
automatically close and lock the new DIMM module into place.
(See Figure 5-7)
Figure 5-7: Installing the DIMM Module
Step 4. Install the controller module. Once the new DIMM module has
been installed, place the controller module back in its original
location. (See Section 5.2.3)
5.4. Replacing a Faulty BBU
The GALAXY houses one (1) BBU that can sustain cache memory in the
event of a power failure or in the extremely unlikely event of both PSUs
failing. The BBU provides additional data security and helps minimize the
loss of data during power shutdowns.
Each BBU consists of a bracket, battery pack, and a PCB board that
connects to the backplane board. The BBUs are pre-installed into the
subsystem in the top left corner of each controller module. Each BBU is
secured to the subsystem with two (2) retention screws. If a BBU has failed,
it should be replaced. Please read the BBU handling precautions below
before replacing it.
Replacing a Faulty BBU
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Galaxy Raid Installation and Hardware Reference Manual
To replace a BBU, please follow these steps:
Step 1. Remove the faulty BBU from the chassis. Loosen the two (2)
retention screws located on both sides of the BBU, then pull out
the BBU. (See Figure 5-8)
Figure 5-8: Removing the BBU
Step 2. Install the new BBU. Align the BBU with the slot, and then
gently push the BBU into the slot. (See Figure 5-9)
Step 3. Secure the BBU to the subsystem by fastening the two (2)
retention screws on the back of the BBU.
Figure 5-9: Installing the BBU
Step 4. Reset the subsystem for the new BBU to take effect. The LED
should start flashing to indicate that BBU is being charged. When
the BBU is fully charged, the LED will be turned off. (See
Figure 5-10)
Figure 5-10: BBU LEDs
5-8
Replacing a Faulty BBU
Chapter 5: Subsystem Maintenance and Upgrading
NOTE:
A new or replaced BBU takes at least 7 hours to charge to its full
capacity. Reset the subsystem whenever a BBU is replaced or added in
order for the new BBU to take effect.
NOTE:
The life expectancy of a BBU is more than one year. Follow the
procedures above to replace an old BBU with a new one in order to
maintain fault-tolerant subsystem functionalities.
5.5. Replacing a Faulty PSU Module
5.5.1 PSU Module Overview
•
Two (2) redundant PSU modules: The GALAXY is preinstalled with
two (2) 460W, fully redundant, hot-swappable PSU modules. These
modules are located at the rear of the subsystem.
•
PSU bracket: Each PSU module is permanently mounted in a two-level
steel bracket, creating a single unit. The PSU is located in the upper
level and a removable cooling module is mounted in the lower level.
When removing the PSU from the subsystem, the cooling module is
also being removed.
•
PSU printing mark: Before you insert a new PSU, be sure that it has
the same printing mark on its handle as that shown on the handle of a
remaining PSU. Double-check to avoid mixing a PSU of previous
GALAXY series. (See Figure 5-11)
Figure 5-11: Label on the PSU Handle
Replacing a Faulty PSU Module
5-9
Galaxy Raid Installation and Hardware Reference Manual
•
Immediate replacement: When a PSU fails, it should be replaced
immediately. However, do not remove the PSU module unless a
replacement is readily available. Removing a PSU without a
replacement will cause severe disruptions to the internal airflow and the
subsystem will overheat, possibly causing irreparable damage to some
of the subsystem components.
5.5.2 Replacing the PSU Module
WARNING!
Although the PSU modules are fully redundant, it is not advisable to run
the GALAXY with a single PSU module for an extended period of time. If
the second PSU module fails, the subsystem will be shut down.
To replace a PSU, please follow these steps:
Step 1. Turn off the PSU. Using the power switch can be found on the
right side of each PSU module. (See Figure 5-12)
Step 2. Remove the power cable that connects the GALAXY to the main
power source. The power socket is found on the left side of each
power supply module.
Figure 5-12: Power Sockets and Power Switches
Step 3. Remove the PSU retention screw at the top right-hand side of the
PSU. (See Figure 5-13.)
Figure 5-13: Removing the PSU Retention Screw
5-10
Replacing a Faulty PSU Module
Chapter 5: Subsystem Maintenance and Upgrading
Step 4. Remove the PSU module by pressing down the ejection handle
found on the top of the PSU. (See Figure 5-14) This will
dislodge the PSU module from the subsystem.
Figure 5-14: Removing the PSU Module
Step 5. Use the handle to gently pull the PSU module out of the
enclosure. (See Figure 5-15)
Figure 5-15: Dislodging the PSU
Step 6. Remove the cooling module from the lower level of the PSU
module. Please refer to Section 5.6.
WARNING!
When a PSU is pulled out of the chassis, the cooling module beneath the
PSU is removed from the chassis at the same time.
It is recommended that the replacement procedure is completed in less
than five (5) minutes to prevent the subsystem from overheating.
Step 7. Insert the previously removed cooling module into the new PSU
module. (See Section 5.6.)
Step 8. Insert the new PSU module into the subsystem. Make sure the
ejection handle is in its down position so that the saddle notches
on the lower edges of the handle can lock on to the edge metal
brackets along the chassis inner walls. Push the PSU into the slot
and pull the handle upward to secure the module. (See Figure 516)
Replacing a Faulty PSU Module
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Galaxy Raid Installation and Hardware Reference Manual
Figure 5-16: Installing the new PSU Module
Step 9. Secure the PSU to the subsystem by inserting the retention screw
to the PSU. (See Figure 5-17)
Figure 5-17: Fastening the PSU Retention Screw
Step 10. Replace the power cable that connects the PSU module to the
main power source.
Step 11. Turn the PSU module on.
5.6. Cooling Module Maintenance
5.6.1 Cooling Module Overview
5-12
•
Cooling Module Overview Redundant cooling modules: The
GALAXY is equipped with two (2) redundant, hot-swappable, dualblower cooling modules located on the lower level of the subsystem
rear panel. These cooling modules control the internal operational
temperature of the subsystem and therefore their working integrity
should be maintained at all times.
•
Detecting a failed cooling module: If a cooling module fails, the LED
located at the back of the module, an audible alarm, the firmware, the
RAIDWatch panel view, or the Configuration Client can notify you.
Cooling Module Maintenance
Chapter 5: Subsystem Maintenance and Upgrading
•
Replacing a cooling module: Once you are notified that a cooling
module has failed, it should be replaced as soon as possible. A failed
cooling module should only be removed from the subsystem when you
have a replacement module immediately available that can be installed
as soon as the failed cooling module has been removed.
WARNING!
The latches at the back of the cooling module secure the cooling module
into the enclosure. If these latches are broken, the warranty on the
cooling module will be void.
5.6.2 Replacing a Cooling Module
If one of the cooling modules fails, it must be replaced as soon as possible.
The cooling modules are secured to the chassis with the two (2) black
latches located on the rear surface of the module itself. To replace the
cooling module, please follow these steps:
WARNING!
•
Although the cooling modules are fully redundant, it is not
advisable to run the GALAXY with a single cooling module for an
extended period of time. If the remaining cooling module fails, the
system is at risk of sustaining irreparable damage.
•
Keep a failed module in its enclosure bay until a replacement unit is
in hand.
Step 1. To remove the cooling module, pull both side latches toward the
center of the cooling module. Withdraw the cooling module from
the subsystem by gently pulling on the silver handle at the bottom
of the module. (See Figure 5-18)
Figure 5-18: Removing the Cooling Module
Step 2. Install the new cooling module by aligning the module with the
cooling module slot on the lower section of the PSU module and
gently sliding it in. The latches will hold the module in place.
(See Figure 5-19)
Cooling Module Maintenance
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Galaxy Raid Installation and Hardware Reference Manual
Figure 5-19: Installing the New Cooling Module
5.7. Replacing a Failed Hard Drive
5.7.1 Hard Drive Maintenance Overview
•
Hot-swappable drive trays: The drive trays are all hot-swappable. If a
hard drive fails, it can be replaced while the subsystem is still running.
•
Handles: If the failed hard drive is behind either the left or right front
handle, unfold the handles to access the drive trays. (See Figure 5-20)
Figure 5-20: Open the Front Handles
5-14
•
Open flap: Once the flap on the drive tray has been opened, the drive
tray must be removed from the subsystem. Failure to remove the drive
tray from the subsystem after the flap has been opened may cause data
errors.
•
Remove drives slowly: When removing a drive tray from the
GALAXY, pull the drive tray out only about one inch and then wait for
at least 30 seconds for the hard drive motor to spin down before taking
it out completely. Any impact to the hard drive while the drive motor is
spinning can damage the drive.
•
Keep a replacement on hand: If a hard drive has failed, make sure you
have a replacement hard drive readily available before removing the
failed drive from the subsystem. Do not leave the drive tray slot open
for an extended period of time or the normalized airflow will be
disrupted and subsystem components will overheat and may become
permanently damaged.
Replacing a Failed Hard Drive
Chapter 5: Subsystem Maintenance and Upgrading
5.7.2 Replacing a Hard Drive
When a hard drives fails, it needs to be replaced. To replace a hard drive,
please follow these steps:
WARNING!
The hard drive is fragile; therefore always handle with extreme care. Do
not drop the hard drive; always be slow, gentle, and careful when setting
down a hard drive. Only handle the hard drive by the edges, and avoid
touching any components or connectors.
Step 1. Identify the drive tray that contains the hard drive that needs to be
replaced.
Step 2. Open the key-lock. (See Figure 5-21) To do this, turn the key-lock
on the front of the drive tray until the groove on its face is in a
horizontal orientation.
Figure 5-21: Drive Tray Key-lock Rotation
Replacing a Failed Hard Drive
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Galaxy Raid Installation and Hardware Reference Manual
Step 3. Open the front flap by pushing the button at the front of the drive
tray. (See Figure 5-22) The drive tray front flap will automatically
be lifted and the drive tray will be dislodged from the chassis.
Figure 5-22: Opening the Front Flap
Step 4. Remove the drive tray with the hard drive, gently and carefully
withdrawing the drive tray with hard drive from the chassis. (See
Figure 5-23)
Figure 5-23: Removing a Drive Tray
Step 5. Remove the four (4) retention screws located on the sides of the
drive tray (two on each side.) (See Figure 5-24)
Figure 5-24: Removing the SATA Hard Drive
Step 6. Remove the hard drive from the drive tray.
Step 7. Install the new hard drive. Please refer to the complete hard drive
installation procedures in Section 2.7.3.
Step 8. Install the drive tray with the hard drive to the chassis. See
Section 2.8.
5-16
Replacing a Failed Hard Drive
Chapter 5: Subsystem Maintenance and Upgrading
CHAPTER 5 SUBSYSTEM MAINTENANCE............................................................ 1
5.1. OVERVIEW .................................................................................................................... 1
5.1.1
Maintenance ......................................................................................................... 1
5.1.2
General Notes on Component Replacement........................................................ 1
5.2. REPLACING CONTROLLER MODULE COMPONENTS ...................................................... 2
5.2.1
Overview............................................................................................................... 2
5.2.2
Notes on Controller Module Maintenance .......................................................... 3
5.2.3
Removing the Controller Module ........................................................................ 3
5.2.4
Replacing the Controller Module ........................................................................ 4
5.3. DIMM MODULE REPLACEMENT .................................................................................. 6
5.3.1
DIMM Module Considerations............................................................................ 6
5.3.2
DIMM Module Replacement Procedure.............................................................. 6
5.4. REPLACING A FAULTY BBU ......................................................................................... 7
5.5. REPLACING A FAULTY PSU MODULE........................................................................... 9
5.5.1
PSU Module Overview......................................................................................... 9
5.5.2
Replacing the PSU Module................................................................................ 10
5.6. COOLING MODULE MAINTENANCE ............................................................................ 12
5.6.1
Cooling Module Overview ................................................................................. 12
5.6.2
Replacing a Cooling Module ............................................................................. 13
5.7. REPLACING A FAILED HARD DRIVE ............................................................................ 14
5.7.1
Hard Drive Maintenance Overview................................................................... 14
5.7.2
Replacing a Hard Drive..................................................................................... 15
controller module, 1, 2, 3, 4
controller module maintenance, 3
controller module, remove, 3
controller module, replace, 4
cooling module, 1, 13
cooling module maintenance, 13
cooling module side latches, 14
cooling module, replace, 13
Data Compare Errors, 15
DDR RAM DIMM, 6
DDR RAM DIMM module, 2
DIMM module, 6
drive tray, 15
drive tray maintenance, 14
front flap, 15, 16
handles, 14
handling precautions, 8
hard drive, 15
hard drives, 1
hard drives, replace, 15
Replacing a Failed Hard Drive
hot-swappable, 1
key-lock, 16
main power source, 10
maintenance, 1
memory capacity, 6
memory module, 1
monitoring, 1
normalized airflow, 2
power cable, 10
PSU, 10
PSU Bracket, 9
PSU module, 1
PSU module maintenance, 9
PSU module, replace, 10
PSU printing mark, 9
safety precautions, 3
subsystem downtime, 1
upgrading, 1
white clips, 7
working integrity, 1
5-17
Appendix A: Uninterruptible Power Supply
Appendix A
Uninterruptible Power Supply
A.1 Uninterruptible Power Supply Overview
An uninterruptible power supply (UPS) is a separately purchased battery
backup unit that is connected to an Infortrend subsystem. If the UPS is
sufficiently large, it can be used to power the whole subsystem in the event
of an AC power failure.
A.2 Compatible UPS Supplies
The APC SMART-UPS 700VA is compatible with the GALAXY
subsystem.
A.3 Serial Communication Cable
The GALAXY is shipped with a customized audio-jack to DB9 serial
communication cable that connects the subsystem controller module to a PC
hyper-terminal for subsystem management. If you wish to use a UPS with
your subsystem, an additional audio-jack to DB9 UPS cable (see Figure A1) must be purchased.
Figure A-1: Audio-Jack to DB9 UPS Cable
CAUTION!
The pinouts on the audio jack to DB9 serial cable used to connect to the
UPS are different from the pinouts on the serial cable that was shipped
with the subsystem. When connecting the UPS device, please be sure to
use the correct cable. The cable pinouts are listed in Appendix E.
Uninterruptible Power Supply Overview
A-1
Galaxy Raid Installation and Hardware Reference Manual
A.4 Connecting the UPS to the Subsystem
A.4.1 Connect the PSU Module Power Cords
The two (2) power cords shipped with the subsystem must be plugged into
the power cord sockets in the rear of the PSU modules. The plug at the other
end of the power cord must be inserted into a socket on the UPS. (See
Figure A-2) Please refer to the UPS manual to determine the location of
these sockets. The UPS must then be connected to main power.
A.4.2 Set the Baud Rate
The default baud rate for the COM 2 serial port is 38400 and must be
changed to 2400. For instructions on changing the baud rate, please refer to
the User’s Operation Manual that came with the subsystem.
A.4.3 Connect COM2
The separately purchased audio-jack to DB9 serial cable connects the
COM2 port on the controller module to the UPS directly. (See Figure A-2)
The cable transmits UPS status updates to the controller module and will in
turn determine the write policy of the controller module. To connect the
serial communication cable to the subsystem controller, insert the audio jack
connector on one end of the cable into the COM2 port on the controller
module. To see how to connect the DB9 connector to the UPS, please refer
to the documentation that came with your UPS.
Figure A-2: Connecting the UPS to the Subsystem
A-2
Connecting the UPS to the Subsystem
Appendix A: Uninterruptible Power Supply
A.5 Power On
When powering on the subsystem, the UPS must be powered on before the
subsystem. For instruction on how to power on the UPS, please refer to the
documentation that came with your UPS. Note that the power on sequence
described in Chapter 4 will be altered as shown below:
Step 1. Power on Fibre Channel connection devices (including hubs and
switches).
Step 2. Power on the UPS.
Step 3. Power on the GALAXY subsystem.
Step 4. Power on the host computers.
Step 5. Trigger the firmware to allow the subsystem to detect the UPS.
To see how to do this please, refer to the User’s Operation
Manual that came with the subsystem.
NOTE:
•
A UPS can be connected to the subsystem after the subsystem has
been powered on, but you will have to trigger the firmware to allow
the subsystem to detect the UPS.
A.6 UPS Status Monitoring
If a UPS has been correctly connected to the subsystem, the status of the
UPS will be constantly monitored by the controller through the COM2
(audio jack) serial port. The status of the UPS will determine the controller’s
write policy, and messages that appear on the LCD panel and other
monitoring devices will keep you informed of the UPS status.
A.6.1 Normal Operational Status
If the UPS has been connected to main power and the UPS battery power
level is above 50%, then no status messages will appear and the default
“Write Back” write policy will be implemented by the controller.
A.6.2 UPS Messages
The following messages may appear on the LCD screen:
Message 1: “UPS connection is absent”
This message appears when COM2 has not been connected to the UPS.
Power On
A-3
Galaxy Raid Installation and Hardware Reference Manual
Message 2: “UPS connection detected”
This message appears when the COM2 ports on the subsystem have been
connected to the UPS.
Message 3: “Warning: UPS AC Power-Loss detected”
This message appears when the UPS battery power level remains above
50% but its connection to the AC power supply has been disrupted in some
way. The write policy changes from write back to write through.
Message 4: “Warning: UPS Battery Low 50%. Please shut down to protect
data loss”
This message appears when the UPS battery power level has dipped below
50% of its capacity and the UPS has either been disconnected from the AC
power supply or the AC power supply has been disrupted. The write policy
will be changed from the default write back to write through. If this message
appears, the subsystem should be properly shut down to avoid data loss.
Message 5: “Warning: UPS Battery Low 50%”
This message appears when the UPS battery power level has dipped below
50% of its capacity. The default write policy will be changed from the
default write back to write through.
Message 6: “UPS Battery restored to safe level”
This message appears when the UPS battery power level has been restored
to above 50% of its capacity. The write policy will be changed from write
through to write back.
Message 7: “UPS AC Power Restored”
This message appears when the AC power supply to the UPS has been
reconnected. If the UPS battery power level is below 50%, the write policy
will remain as write through. If the battery power level is above 50%, the
write policy will change from write through to write back.
A-4
UPS Status Monitoring
Appendix A: Uninterruptible Power Supply
A.6.3 UPS Message Summary
Table A-1 below summarizes the UPS messages described above. It is
important that you become familiar with these messages and their meanings
to help maintain the integrity of the data running through your subsystem.
Message
AC Power
Battery
Power
Level (BPL)
Write
Policy
Status
UPS connection is absent
N/A
N/A
Write back
UPS connection detected
N/A
N/A
Write back
Warning: UPS AC PowerLoss detected
Disconnected
BPL > 50%
Write through
Warning: UPS Battery
Low 50%. Please shut
down to protect data loss
Disconnected
BPL < 50%
Write through
Warning: UPS
Low 50%.
Connected
BPL < 50%
Write through
UPS AC Power Restored
Reconnected
BPL > 50%
Write back
UPS AC Power Restored
Reconnected
BPL < 50%
Write through
UPS Battery restored to
safe level
Reconnected
BPL > 50%
Write back
Battery
Table A-1: UPS Status Messages
UPS Status Monitoring
A-5
Galaxy Raid Installation and Hardware Reference Manual
This page is intentionally
left blank
A-6
UPS Status Monitoring
Appendix A: Uninterruptible Power Supply
APPENDIX A ...........................................................................................................................1
UNINTERRUPTIBLE POWER SUPPLY..................................................................................1
A.1
UNINTERRUPTIBLE POWER SUPPLY OVERVIEW ........................................................... 1
A.2
COMPATIBLE UPS SUPPLIES ......................................................................................... 1
A.3
SERIAL COMMUNICATION CABLE ................................................................................. 1
A.4
CONNECTING THE UPS TO THE SUBSYSTEM................................................................. 2
A.4.1
Connect the PSU Module Power Cords .............................................................. 2
A.4.2
Set the Baud Rate ................................................................................................. 2
A.4.3
Connect COM2..................................................................................................... 2
A.5
POWER ON .................................................................................................................... 3
A.6
UPS STATUS MONITORING ........................................................................................... 3
A.6.1
Normal Operational Status .................................................................................. 3
A.6.2
UPS Messages ...................................................................................................... 3
A.6.3
UPS Message Summary ....................................................................................... 5
UPS Status Monitoring
A-7
Appendix B Specifications
Appendix B
Specifications
B.1. Technical Specifications
Environmental Specifications
Operating: 10% to 80% (non condensing)
Humidity
Non-operating: 10 to 95% (non condensing)
Operating: 0º to 40ºC (32º F to 104º F)
Temperature
Non-operating: -40º to 60ºC (-40º F to 149º F)
Operating: 3,658m (12,000 ft)
Altitude
Non-operating: 12,192m (40,000 ft)
Power Requirements
100VAC @ 10A
Input Voltage
240VAC @ 5A with PFC (auto-switching)
Frequency
47-63Hz
Power Consumption
460W
Dimensions
Without Front Handles
With Front Handles
Height
130.0mm (5.1 inches)
131.0mm (5.1 inches)
Width
445.0mm (17.5 inches)
482.6mm (19 inches)
Length
488.2mm (19.2 inches)
504.3mm (19.9 inches)
System Weight
Net weight: 28.5 Kg (63 pounds)
Gross weight: 30.5 Kg (67 pounds)
Technical Specifications
B-1
Galaxy Raid Installation and Hardware Reference Manual
EMI/EMC
•
•
FCC Class-A
CE
Safety Requirements
•
UL60950
•
CB
Shock
Operating: 5G, 11ms duration, half-sine
Non-operating: 15G, 11ms duration, half-sine
Vibration
Operating: 5~500Hz, 0.16G, X/Y/Z Sine
Non-operating: 5~500Hz, 1.0G, X/Y/Z Sine
Warning Alarms
•
•
•
B-2
Audible alarms
System LEDs
Event notification via the RAIDWatch Manager, LCD screen, or RS-232C
terminal
Technical Specifications
Appendix B Specifications
B.2. Controller Specifications
B.2.1 Configuration
Specification
RAID Levels
0, 1(0 + 1), 3, 5, 6, 10, 30, 50, 60, JBOD, or NRAID
Host O/S Compatibility
Host O/S independent
Host Interface
4Gb FC
Host Channels
Pre-configured host channels
Drive Interface
Supports up to 16 channels of 3Gbps SATA-II
All drive channels are pre-configured and cannot be
changed
Write-through, write-back, adaptive write policy
Pre-installed 256MB (or above) DDR RAM DIMM with
ECC, registered
Up to 32 per host ID
Drive Channels
Cache Mode
Cache Memory
Number of LUNs
Multiple Target
IDs/Host Channel
Aliases for Target IDs
Firmware on Flash
Memory
Drive Hot-swapping
Yes
Yes
Yes
Yes
B.2.2 Architecture
Specification
CPU
600MHz PowerPC 750FX
Fibre Controllers
HPFC-5700C
DIMM Slot
One 184-pin DIMM module
PC-133 Support
Yes
ASIC
64-bit chipset
Flash ROM
32Mbit (8MB)
NVRAM
32KB with RTC
Hardware XOR
Yes
Real-time Clock
For event messages with time record
Controller Specifications
B-3
Galaxy Raid Installation and Hardware Reference Manual
B.3. Drive Tray Specifications
Specification
Height
28mm
Width
110mm
Depth
218.92mm
Key Lock
Yes
B.4. Power Supply Specifications
Specification
Nominal Power
DC Output
Input Frequency
AC Input
Power Factor
Correction
Hold-up Time
100VAC @ 10A – 240VAC @ 5A with PFC
Yes
At least 16ms at 115/230VAC full load after a loss of AC
input
I2C
Through backplane to RAID controller
Over-temperature
Protection
Lost cooling or excessive ambient temperature
Cooling Fans
Temperature
Humidity
Altitude
Acoustic Noise
B-4
460W
12.0V: 32A
5.0V: 32A
3.3V: 30A
47 to 63Hz
Two fans for each unit (inside PSU)
Operating: 0°C to 50°C (32°F to 122°F)
Storage: -40°C to 70°C (-40°F to 158°F)
Operating: 20% to 90% non-condensing
Non-operating: 5% to 95% non-condensing
Operating: 0 to- 10,000 ft
Non-operating: 0 to 40,000 ft
115V input, full load of +5V;
50 dB max.
0.5A of +12V
Drive Tray Specifications
Appendix B Specifications
B.5. Cooling Module Specifications
Specification
Max. Air Flow (each
module)
High speed: 31.8 CFM
Low speed: 20.1 CFM
Input Power
9W max.
Input Current
0.89A max.
Rated Voltage
DC 12V
Acoustic Noise
Temperature
High speed: 55dB max.
Low speed: 44dB max.
Operating: -10 to +60ºC
Storage: -20 to +70ºC
B.6. RAID Management
Specification
•
Configuration
Performance Monitoring
Remote Control and
Monitoring
Event Broadcast/Alert
Event Notification
Hardware Connection
Configuration on Disk
Failure Indicator
Cooling Module Specifications
•
•
Text-based firmware-embedded utility over RS232C through the included serial cable
LCD keypad panel
The RAIDWatch Manager program using in-band
or Ethernet connection
Yes
Yes
Yes (via Java-based RAIDWatch Manager)
Yes (via RAIDWatch’s sub-module, Configuration
Client or NPC)
In-band over Fibre, Ethernet, or RS-232C
Configuration data stored on disk drives for logical
drive assemblies to exist after controller replacement;
basic settings, e.g., channel mode settings, are stored
on NVRAM
Via audible alarm, LCD keypad panel, RAIDWatch
Manager session, event notifications, or event prompts
on terminal emulation
B-5
Galaxy Raid Installation and Hardware Reference Manual
B.7. Fault Tolerance Management
Specification
Drive S.M.A.R.T Support
Battery Back-up Option
ISEMS (Simple Enclosure
Management Service) via I2C
Interface
Automatic Drive Failure
Detection
Automatic Rebuild on Spare
Drives
B-6
Yes (with user-configurable detect only, clone
and replace, and perpetual clone functions)
Yes
Yes
Yes
Yes
Regenerate Logical Drive Parity
Yes
Bad Block Reassignment
Automatic Rebuild upon Failed
Drive Replacement
Manual Clone of Suspected
Failed Drive
Concurrent Rebuild on Multiple
Drives in a RAID (0 + 1) Logical
Drive
Salvage the 2nd Temporary Failed
Drive in a RAID 1, 3 or 5 Logical
Drive
Salvage the 1st Temporary Failed
Drive in a RAID 0 Logical Drive
Yes
Yes
Yes
Yes
Yes
Yes
Fault Tolerance Management
Appendix B Specifications
APPENDIX B SPECIFICATIONS .......................................................................................... 1
B.1. TECHNICAL SPECIFICATIONS ........................................................................................ 1
Vibration............................................................................................................................... 2
B.2. CONTROLLER SPECIFICATIONS ..................................................................................... 3
B.2.1
Configuration ....................................................................................................... 3
B.2.2
Architecture.......................................................................................................... 3
B.3. DRIVE TRAY SPECIFICATIONS....................................................................................... 4
B.4. POWER SUPPLY SPECIFICATIONS .................................................................................. 4
B.5. COOLING MODULE SPECIFICATIONS ............................................................................. 5
B.6. RAID MANAGEMENT ................................................................................................... 5
B.7. FAULT TOLERANCE MANAGEMENT .............................................................................. 6
Fault Tolerance Management
B-7
Appendix C: Spare Parts and Accessories
Appendix C
Spare Parts and Accessories
C.1. Spare Parts
Spare parts that come with the subsystem are listed in Table C-1.
Model Name
Description
GAL 83AF24GD16
Fibre to SATA RAID controller module, for Galaxy
single controller subsystem, 2 x FC-4G SFP host
connectors, RAID 6
GAL 9273CDTray
Drive tray, Type-III bezel and Type-II LED lightpipe
GAL 9273CPSU
Power supply module, Enhanced 16-bay subsystems,
460W capacity
GAL 9273CFanMod
Cooling fan module for Enhanced 16-bay subsystems
GAL 9273HandLLCD
Left-side forearm handle for 3U RAID subsystems,
LCD panel included
GAL 9270CHandR
Right-side forearm handle for 3U subsystems,
applicable to the Left or Right-side of JBOD subsystems
Table C-1: Spare Parts Shipped with the Subsystem
C.2. Accessories
Accessories that came with the subsystem are listed in Table C-2.
Model Name
Description
GAL 9011
Null modem, DB-9 female to DB-9 male, wires
swapped
GAL 9270ASCab
RS-232C serial cable, audio-jack-to-DB-9
Table C-2: Accessories Shipped with the Subsystem
Spare Parts
C-1
Galaxy Raid Installation and Hardware Reference Manual
Accessories that must be purchased separately are listed in Table C-3.
Model Name
Description
GAL 9270CUPSCab
UPS cable, audio-jack to DB9
GAL 9270CSFP2GA01
Agilent Fibre Channel 2.125 / 1.0625 GBd Small
Form Pluggable Optical Transceiver, LC, waivelength 850nm, multi-mode
GAL 9270CFCCab01
Optical FC cable, LC-LC, MM-62.5/125, Duplex,
LSZH, O.D.=1.8mmx2, 1 Meter
GAL 9270CFCCab02
Optical FC cable, LC-LC, MM-62.5/125, Duplex,
LSZH, O.D.=1.8mmx2, 5 Meters
GAL 9270CFCCab03
Optical FC cable, LC-LC, MM-62.5/125, Duplex,
LSZH, O.D.=1.8mmx2, 10 Meters
GAL 9272CDTrayDmy
Dummy Drive tray, Type-II bezel
GAL 9273CBT-C
Battery cell pack, Li-Ion, Enhanced Galaxy 16-bay
subsystems
GAL 9273Cslider32
Slide rail assembly for Enhanced Galaxy 3U
enclosures, 23"~32" rack depth
GAL 9273Cslider36
Slide rail assembly for Enhanced Galaxy 3U
enclosures, 23"~36" rack depth
Table C-3: Separately Purchased Accessories
C-2
Accessories
Appendix C: Spare Parts and Accessories
APPENDIX C SPARE PARTS AND ACCESSORIES ................................................ 1
C.1.
C.2.
SPARE PARTS ................................................................................................................ 1
ACCESSORIES ................................................................................................................ 1
Accessories
C-3
Appendix D: Pin Outs
Appendix D
Pin Outs
D.1. SFP Connector Pin Outs
Each of the SFP host or expansion ports is comprised of a case bottom, an
EMI case, and a 20-pin host connector. These port sockets receive SmallForm-Factor (SFP) fiber optic and copper-based transceivers. You may
contact our technical support for an updated list of SFP transceiver modules
that have been tested to comply with the sockets. The pin outs are shown in
Figure D-1 and their definitions are shown in Table D-1.
Figure D-1: SFP Connector Pin Outs
SFP Connector Pin Outs
D-1
Galaxy Raid Installation and Hardware Reference Manual
Pin
Pin Name
Pin Description
1
VEET
Transmitter ground (common with receiver
ground)
2
TFAULT
Transmitter fault; not supported
3
TDIS
Transmitter disable; laser output disabled on
high or open
4
MOD_DEF(2)
Module definition 2; data line for serial ID
5
MOD_DEF(1)
Module definition 1; clock line for serial ID
6
MOD_DEF(0)
Module definition 0; grounded within the
module
7
Rate Select
No connection required
8
LOS
Indicates loss of signal; logic 0 indicates normal
operation
9
VEER
Receiver ground (common with transmitter
ground)
10
VEER
Receiver ground (common with transmitter
ground)
11
VEER
Receiver ground (common with transmitter
ground)
12
RD-
Receiver inverted DATA out; AC coupled
13
RD+
Receiver non-inverted DATA out; AC coupled
14
VEER
Receiver ground (common with transmitter
ground)
15
VCCR
Receiver power supply
16
VCCT
Transmitter power supply
17
VEET
Transmitter ground (common with receiver
ground)
18
TD+
Transmitter non-Inverted DATA in 100 ohm
termination between TD+ and TD-; AC coupled
thereafter
19
TD-
Transmitter inverted DATA in. See TD+
20
VEET
Transmitter ground (common with receiver
ground)
Table D-1: SFP Pin Out Definitions
D-2
SFP Connector Pin Outs
Appendix D: Pin Outs
D.2. DB9 Audio Jack Pin Outs
This cable connects the COM1 serial port on the controller module rear
panel for terminal emulation management.
PN: IFT-9270ASCab
Figure D-2: RS-232C (Audio Jack) Pin Outs
CN1 Pin Number
1
2
3
CN2 Pin Number
1
2
3
4
5
6
7
8
9
Pin Name
Ground
TXD
RXD
Pin Name
NC
RXD
TXD
DTR (Shorted)
GND
DSR (Shorted)
RTS (Shorted)
CTS (Shorted)
NC
Table D-2: RS-232C (Audio Jack) Pin Out Definitions
DB9 Audio Jack Pin Outs
D-3
Galaxy Raid Installation and Hardware Reference Manual
D.3. DB9 Audio Jack UPS Cable Pin Outs
Use this cable to connect the COM2 serial port to a UPS.
PN: IFT-9270CUPSCab
Figure D-3: RS-232C (Audio Jack) Pin Outs
CN1 Pin Number
1
2
3
CN2 Pin Number
1
2
3
4
5
6
7
8
9
Pin Name
Ground
TXD
RXD
Pin Name
TXD
RXD
NA
NA
NA
NA
NA
NA
Ground
Table D-3: RS-232C (Audio Jack) Pin Out Definitions
D-4
DB9 Audio Jack UPS Cable Pin Outs
Appendix D: Pin Outs
D.4. Null Modem
A null modem is used for wire-swap and is necessary for connecting COM1
CN2 to a PC serial port.
PN: IFT-9011
Figure D-4: Null Modem Pin Outs
Swap pin 2 and pin 3
Swap pin 4 and pin 6
Swap pin 7 and pin 8
Table D-4: Null Modem Pin Outs
Null Modem
D-5
Galaxy Raid Installation and Hardware Reference Manual
D.5. Ethernet Port Pin Outs
Figure D-5: LAN Port Pin Outs
Pin
Pin Name
Pin
Pin Name
1
LAN_TXP
5
N2
2
LAN_TXN
6
LAN_RXN
3
LAN_RXP
7
N1
4
N2
8
N1
Table D-5: Ethernet Port Pin Outs
D.6. Main Power
IEC-type receptacle.
D-6
Ethernet Port Pin Outs
Appendix D: Pin Outs
APPENDIX D.............................................................................................................................. 1
PIN OUTS.................................................................................................................................... 1
D.1.
D.2.
D.3.
D.4.
D.5.
D.6.
SFP CONNECTOR PIN OUTS .......................................................................................... 1
DB9 AUDIO JACK PIN OUTS ......................................................................................... 3
DB9 AUDIO JACK UPS CABLE PIN OUTS ..................................................................... 4
NULL MODEM ............................................................................................................... 5
ETHERNET PORT PIN OUTS ........................................................................................... 6
MAIN POWER ................................................................................................................ 6
Main Power
D-7
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