n CMOS Low Power Consumption
XCM414 Series
ETR24034-001
Voltage Regulator with Bridge Diode for Wireless Power Receiver
■GENERAL DESCRIPTION
The XCM414 series consist of four Schottky Barrier Diodes (SBD) and a positive voltage regulator (VR).
These four SBDs configure a bridge circuit and it performs the full-wave rectification of an AC input so that the positive
voltage regulator can generate DC output.
The VR consists of a voltage reference, an error amplifier, a current limiter, a thermal shutdown circuit and a phase
compensation circuit plus a driver transistor. The output voltage is preset at 3.3V in the IC as a standard value, and it is
selectable in 0.1V increments within the range of 2.0V to 12V using laser trimming technologies. The output stabilization
capacitor (CL) is also compatible with low ESR ceramic capacitors.
The over current protection circuit and the thermal shutdown circuit are built-in. These two protection circuits will operate
when the output current reaches current limit level or the junction temperature reaches temperature limit level.
The CE function enables the output to be turned off and the IC becomes a stand-by mode resulting in greatly reduced power
consumption.
■APPLICATIONS
■FEATURES
●Smart Card
Schottky Barrier Diode (SBD)
●Hearing Aid
●Wireless earphone/
Bluetooth earphone
●Wearable Devices
●Wireless Charger Devices
Forward Voltage
Reverse Current
: 0.33V (IF=10mA)
: 2μA (VR=40V)
Voltage Regulator (VR)
Input Voltage Range
Output Voltage Range
Fixed Output Accuracy
Low Power Consumption
Stand-by Current
High Ripple Rejection
: 2.0V~26.0V
: 2.0V~12.0V(0.1V increments)
: ±2.0%
: 5μA
: less than 0.1μA
: [email protected]
Low ESR Capacitor
Built–in Protection
: Ceramic Capacitor Compatible
: Current Limit Circuit
: Thermal Shutdown Circuit
: -40℃~+85℃
: USP-8B10
: EU RoHS Compliant, Pb Free
Operating Temperature
Packages
Environmentally Friendly
■ TYPICAL APPLICATION CIRCUIT
■
1/30
XCM414 Series
■PIN CONFIGURATION
IN1
POS
VIN
VOUT
1
2
3
4
A
* The dissipation pad should be solder-plated in reference to the mount
pattern and metal masking so as to enhance mounting strength and
heat release. Connect mount pattern D with VSS pin (#6 pin) but
don’t connect the mount pattern A, B, and C to other pins, because
they are connected with each SBD.
B
D
C
8
7
6
5
NEG
IN2
VSS
CE
USP-8B10
(BOTTOM VIEW)
■FUNCTION
PIN NAME
DESIGNATOR
CONDITIONS
IC OPERATION
CE
L
H
OPEN
0V≦VCE≦0.35V
1.1V≦VCE≦26.0V
CE=OPEN
OFF
ON
Undefined state
*Please avoid the state of OPEN, and make CE Pin arbitrary fixed potential.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTION
1
IN1
Bridge Input 1
2
POS
Bridge Positive
3
VIN
Voltage Regulator Input Power
4
VOUT
Voltage Regulator Output
5
CE
ON/OFF Control (*1)
6
VSS
Voltage Regulator Ground
7
IN2
Bridge Input2
8
NEG
Bridge Negative
USP-8B10
(*1)
Please avoid the state of OPEN, and make CE Pin arbitrary fixed potential.
■ PRODUCT CLASSIFICATION
●Ordering Information
XCM414①②③④⑤⑥-⑦
(*1)
DESIGNATOR
DESCRIPTION
SYMBOL
①
TYPE
B
②③④
Output Voltage
020~120
⑤⑥-⑦
Packages Taping Type
D2-G
(*1)
DESCRIPTION
Fixed
For the voltage within 2.0V ~12.0V (0.1V increments)
e.g. 033 ⇒ 3.3V, 105 ⇒ 10.5V
USP-8B10 (5,000 pcs/Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
2/30
XCM414
Series
■ BLOCK DIGRAMS
■
VIN
POS
Bridge circuit
Voltage Regulator Circuit
Error
Amp
Current
Limit
+
VOUT
IN1
Thermal
Protection
Voltage
Reference
R11
IN2
R12
ON/OFF Control
VSS
NEG
CE
* The diode in the bridge circuit in the above figure is a Schottky barrier diode.
The diode of the voltage regulator circuit is a diode for electrostatic protection and a parasitic diode. diodes.
■ABSOLUTE MAXIMUM RATINGS
PARMETER
●
SYMBOL
RATINGS
UNITS
Repetitive Peak Voltage
VRM
40
V
Reverse Voltage (DC)
VR
40
V
IF(AV)
200
mA
IFSM
1
A
VIN
VSS-0.3~+28
Schottky Barrier Diode (SBD)
Forward Current (Average)
Peak Forward Surge Current
●
Voltage Regulator (VR)
(*1)
(*2)
Input Voltage
●
Ta = 25℃
300
(*3)
V
Output Current
IOUT
mA
Output Voltage
VOUT
VSS-0.3~VIN+0.3
V
CE Input Voltage
VCE
VSS-0.3~+28
V
Pd
1400 (PCB mounted)
mW
Operating Ambient Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-55 ~ +125
℃
Common
Power
Dissipation
USP-8B10
(*1)
Non continuous 1 cycle high amplitude 60Hz half-sine wave.
(*2)
Voltage Regulator voltage rating is based on VSS
(*3)
Please use within the range of Pd > (VIN - VOUT) × IOUT + (VF × IF)
3/30
XCM414 Series
■ELECTRICAL CHARACTERISTICS
● Schottky Barrier Diode (SBD)
PARAMETER
STMBOL
●
Forward Voltage
Reverse Current
Inter-Terminal Capacity
Reverse Recovery Time
(*1)
Ta = 25℃
(*1)
MIN.
TYP.
MAX.
VF1
TEST CONDITION
IF=10mA
-
0.33
-
VF2
V
IF=200mA
-
0.53
0.6
V
IR
VR=40V
-
-
2
μA
Ct
VR=10V , f=1MHz
-
10
-
pF
trr
IF=IR=10mA , irr=1mA
-
6
-
ns
trr measurement circuit
IF
trr
A
0
irr
IR
4/30
UNITS
t
XCM414
Series
■ELECTRICAL CHARACTERISTICS (Continued)
● Voltage Regulator (VR)
●
Ta = 25℃
PARAMETER
STMBOL
Output Voltage
VOUT(E) (*2)
TEST CONDITION
IOUT=20mA , VCE=VIN
VIN= VOUT(T)
Maximum Output Current
IOUTMAX
(*1)
+3.0V , VCE=VIN
(VOUT(T)≧3.0V)
VIN=V OUT(T) (*1) +3.0V , VCE=VIN
(VOUT(T)<3.0V)
1mA≦IOUT≦50mA, VCE=VIN
Load Regulation
△VOUT
MIN.
(2.0V≦VOUT(T)(*1)≦7.0V)
1mA≦IOUT≦50mA , VCE=VIN
( 7.0<VOUT(T)(*1)≦12.0V )
TYP.
MAX.
E-0
UNITS
CIRCUIT
V
①
150
-
-
mA
①
100
-
-
mA
①
-
50
90
mV
①
-
110
140
mV
①
Dropout Voltage 1
Vdif1(*3)
IOUT=20mA , VCE=VIN
-
E-1
mV
①
Dropout Voltage 2
Vdif2(*3)
IOUT=100mA ,VCE=VIN
-
E-2
mV
①
Supply Current
ISS
VCE=VIN
1
5
9
μA
②
ISTB
VCE=VSS
-
0.01
0.1
μA
②
-
0.05
0.10
%/V
①
-
0.15
0.30
%/V
①
2.0
-
26.0
V
-
-
±100
-
ppm/℃
①
-
30
-
dB
③
-
30
-
mA
①
V
①
①
Stand-by Current
Line Regulation 1
Line Regulation 2
△VOUT /
(△VIN・VOUT)
△VOUT /
(△VIN・VOUT)
Input Voltage
VIN
Output Voltage
△VOUT /
Temperature Characteristics
Power Supply
Rejection Ratio
VOUT(T)(*1)+2.0V≦VIN≦26.0V
IOUT=5mA , VCE=VIN
VOUT(T)(*1)+2.0V≦VIN≦26.0V
IOUT=13mA , VCE=VIN
IOUT=20mA , VCE=VIN
(△Topr・V OUT) -40℃≦Topr≦85℃
PSRR
VIN=[VOUT(T)(*1)+2.0]V+0.5Vp-pAC
IOUT=20mA , f=1kHz , VCE=VIN
Short Current
ISHORT
VCE=VIN
CE ”H” Level Voltage
VCEH
-
1.1
-
26.0
0
-
0.35
V
①
CE ”L” Level Voltage
VCEL
-
CE ”H” Level Current
ICEH
VIN=VCE=26.0V
-0.1
-
0.1
μA
CE ”L” Level Current
ICEL
VIN=26.0V , VCE=VSS
-0.1
-
0.1
μA
①
-
150
-
℃
①
-
125
-
℃
①
-
25
-
℃
-
Thermal Shutdown
Detect Temperature
Thermal Shutdown Release
Temperature
Hysteresis Width
TTSD
TTSR
TTSD-TTSR
VCE=VIN
Junction Temperature
VCE=VIN
Junction Temperature
VCE=VIN
Junction Temperature
Unless otherwise stated, VIN=VOUT(T)+2.0V.
NOTE:
*1: VOUT(T): Nominal output voltage
*2: VOUT(E): Effective output voltage
(i.e. the output voltage when “VOUT(T)+2.0V” is provided at the VIN pin while maintaining a certain IOUT value.)
*3: Vdif={VIN1 - VOUT1}
VOUT1: VOUT(T)<3.0V, A voltage equal to 98% of the output voltage whenever an amply stabilized IOUT{VOUT(T)+3.0V} is input.
VOUT(T)≧3.0V, A voltage equal to 98% of the output voltage whenever an amply stabilized IOUT{VOUT(T)+2.0V} is input.
VIN1: The input voltage when VOUT1 appears as input voltage is gradually decreased.
5/30
XCM414 Series
■ELECTRICAL CHARACTERISTICS (Continued)
● Voltage Chart1 (VR)
PARAMETER
E-0
E-1
E-2
NOMINAL
OUTPUT VOLTAGE
DROPOUT VOLTAGE 1
DROPOUT VOLTAGE 2
OUTPUT
(V)
(mV)
(mV)
VOLTAGE(V)
2% ACCURACY
IOUT=20mA
IOUT=100mA
VOUT(E)
Vdif1
VOUT(T)
6/30
Vdif2
MIN
MAX
TYP
MAX
TYP
MAX
2.0
1.960
2.040
450
600
1900
2600
2.1
2.058
2.142
450
600
1900
2600
2.2
2.156
2.244
390
520
1700
2200
2.3
2.254
2.346
390
520
1700
2200
2.4
2.352
2.448
390
520
1700
2200
2.5
2.450
2.550
310
450
1500
1900
2.6
2.548
2.652
310
450
1500
1900
2.7
2.646
2.754
310
450
1500
1900
2.8
2.744
2.856
310
450
1500
1900
2.9
2.842
2.958
310
450
1500
1900
3.0
2.940
3.060
260
360
1300
1700
3.1
3.038
3.162
260
360
1300
1700
3.2
3.136
3.264
260
360
1300
1700
3.3
3.234
3.366
260
360
1300
1700
3.4
3.332
3.468
260
360
1300
1700
3.5
3.430
3.570
260
360
1300
1700
3.6
3.528
3.672
260
360
1300
1700
3.7
3.626
3.774
260
360
1300
1700
3.8
3.724
3.876
260
360
1300
1700
3.9
3.822
3.978
260
360
1300
1700
4.0
3.920
4.080
220
320
1100
1500
4.1
4.018
4.182
220
320
1100
1500
4.2
4.116
4.284
220
320
1100
1500
4.3
4.214
4.386
220
320
1100
1500
4.4
4.312
4.488
220
320
1100
1500
4.5
4.410
4.590
220
320
1100
1500
4.6
4.508
4.692
220
320
1100
1500
4.7
4.606
4.794
220
320
1100
1500
4.8
4.704
4.896
220
320
1100
1500
4.9
4.802
4.998
220
320
1100
1500
XCM414
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●Voltage Chart2 (VR)
PARAMETER
E-0
E-1
E-2
NOMINAL
OUTPUT VOLTAGE
DROPOUT VOLTAGE 1
DROPOUT VOLTAGE 2
OUTPUT
(V)
(mV)
(mV)
VOLTAGE(V)
2% ACCURACY
IOUT=20mA
IOUT=100mA
VOUT(E)
Vdif1
VOUT(T)
Vdif2
MIN
MAX
TYP
MAX
TYP
MAX
5.0
4.900
5.100
190
280
1000
1300
5.1
4.998
5.202
190
280
1000
1300
5.2
5.096
5.304
190
280
1000
1300
5.3
5.194
5.406
190
280
1000
1300
5.4
5.292
5.508
190
280
1000
1300
5.5
5.390
5.610
190
280
1000
1300
5.6
5.488
5.712
190
280
1000
1300
5.7
5.586
5.814
190
280
1000
1300
5.8
5.684
5.916
190
280
1000
1300
5.9
5.782
6.018
190
280
1000
1300
6.0
5.880
6.120
190
280
1000
1300
6.1
5.978
6.222
190
280
1000
1300
6.2
6.076
6.324
190
280
1000
1300
6.3
6.174
6.426
190
280
1000
1300
6.4
6.272
6.528
190
280
1000
1300
6.5
6.370
6.630
170
230
800
1150
6.6
6.468
6.732
170
230
800
1150
6.7
6.566
6.834
170
230
800
1150
6.8
6.664
6.936
170
230
800
1150
6.9
6.762
7.038
170
230
800
1150
7.0
6.860
7.140
170
230
800
1150
7.1
6.958
7.242
170
230
800
1150
7.2
7.056
7.344
170
230
800
1150
7.3
7.154
7.446
170
230
800
1150
7.4
7.252
7.548
170
230
800
1150
7.5
7.350
7.650
170
230
800
1150
7.6
7.448
7.752
170
230
800
1150
7.7
7.546
7.854
170
230
800
1150
7.8
7.644
7.956
170
230
800
1150
7.9
7.742
8.058
170
230
800
1150
8.0
7.840
8.160
170
230
800
1150
7/30
XCM414 Series
■ELECTRICAL CHARACTERISTICS(Continued)
●Voltage Chart3 (VR)
PARAMETER
E-0
E-1
E-2
NOMINAL
OUTPUT VOLTAGE
DROPOUT VOLTAGE 1
DROPOUT VOLTAGE 2
OUTPUT
(V)
(mV)
(mV)
VOLTAGE(V)
2% ACCURACY
IOUT=20mA
IOUT=100mA
VOUT(E)
Vdif1
Vdif2
VOUT(T)
8/30
MIN
MAX
TYP
MAX
TYP
MAX
8.1
7.938
8.262
130
190
700
950
8.2
8.036
8.364
130
190
700
950
8.3
8.134
8.466
130
190
700
950
8.4
8.232
8.568
130
190
700
950
8.5
8.330
8.670
130
190
700
950
8.6
8.428
8.772
130
190
700
950
8.7
8.526
8.874
130
190
700
950
8.8
8.624
8.976
130
190
700
950
8.9
8.722
9.078
130
190
700
950
9.0
8.820
9.180
130
190
700
950
9.1
8.918
9.282
130
190
700
950
9.2
9.016
9.384
130
190
700
950
9.3
9.114
9.486
130
190
700
950
9.4
9.212
9.588
130
190
700
950
9.5
9.310
9.690
130
190
700
950
9.6
9.408
9.792
130
190
700
950
9.7
9.506
9.894
130
190
700
950
9.8
9.604
9.996
130
190
700
950
9.9
9.702
10.098
130
190
700
950
10.0
9.800
10.200
130
190
700
950
10.1
9.898
10.302
120
160
650
850
10.2
9.996
10.404
120
160
650
850
10.3
10.094
10.506
120
160
650
850
10.4
10.192
10.608
120
160
650
850
10.5
10.290
10.710
120
160
650
850
10.6
10.388
10.812
120
160
650
850
10.7
10.486
10.914
120
160
650
850
10.8
10.584
11.016
120
160
650
850
10.9
10.682
11.118
120
160
650
850
11.0
10.780
11.220
120
160
650
850
11.1
10.878
11.322
120
160
650
850
11.2
10.976
11.424
120
160
650
850
11.3
11.074
11.526
120
160
650
850
11.4
11.172
11.628
120
160
650
850
11.5
11.270
11.730
120
160
650
850
11.6
11.368
11.832
120
160
650
850
11.7
11.466
11.934
120
160
650
850
11.8
11.564
12.036
120
160
650
850
11.9
11.662
12.138
120
160
650
850
12.0
11.760
12.240
120
160
650
850
XCM414
Series
■ TEST CIRCUITS
■
●Circuit①
●Circuit②
■
VIN
VOUT
A
A
IOUT
VIN
VOUT
OPEN
ISH OR T
CIN=1.0uF
C IN=1.0μ F
CE
V
V
VSS
V
A
C OUT=1.0μ F
CE
VSS
●Circuit③
VIN
V
~
VOUT
Please open all the SBD pins (IN1, IN2, POS, NEG) of the bridge
circuit.
C OUT=1.0μ F
CE
VSS
V
~
9/30
XCM414 Series
■Representative Components Example
■
■
CIN
POS
VIN
IN1
Transmitter
VOUT
VR
COUT
IN2
CE
VSS
NEG
Example) AC Input Voltage±10V, VOUT=5.0V
CIN
COUT
10/30
MANUFACTURER
PRODUCT NUMBER
VALUE
SIZE(L×W×T)
TDK
Murata
CGB2A1X5R1E105K
GRM033R61E474ME15
1μF/25V
0.47μF/25V, 2 parallel
1.0×0.5×0.33(mm)
0.6×0.3×0.39(mm)
TDK
CGB2A3X5R0J105K033BB
1μF/6.3V
1.0×0.5×0.33(mm)
Murata
GRM153R60J105ME15D
1μF/6.3V
1.0×0.5×0.33(mm)
TDK
CGB2A1X5R1A105K
1μF/10V
1.0×0.5×0.33(mm)
Murata
GRM153R61A105ME95
1μF/10V
1.0×0.5×0.33(mm)
XCM414
Series
■ OPERATIONAL EXPLANATION
<Bridge
■ Circuit>
IN1 and IN2 are input pins for the bridge circuit consisted of four SBDs.
The full rectified wave form on NEG pin basis is output from the POS pin.
■
Please connect POS pin with VIN pin, and connect NEG pin and VSS pin with the ground.
To stabilize the input voltage of the regulator part, please add a ceramic capacitor between VSS pin and V IN pin.
< Voltage Regulators Circuit>
The voltage divided by resistors is compared with the internal reference voltage by the error amplifier. The Pchannel MOSFET which is connected to the VOUT pin is then driven by the subsequent controlled signal. The
output voltage at the VOUT pin is controlled and stabilized by a system of negative feedback. The current limit
circuit and short protect circuit operate in relation to the level of output current and heat dissipation. Further,
the IC’s internal circuitry can be shutdown via the CE pin’s signal.
<Short-Circuit Protection>
The Voltage circuit includes a current fold-back circuit as a short circuit protection. When the load current
reaches the current limit level, the current fold-back circuit operates and output voltage drops. The output
voltage drops further and output current decreases. When the output pin is shorted, a current of about 30mA
flows.
<CE Pin>
The IC’s internal circuitry can be shutdown via the signal from the CE pin. In shutdown mode, output at the
VOUT pin will be pulled down by divided resistors to the VSS level. We suggest that you use this IC with either
a VIN voltage or a VSS voltage input at the CE pin. If this IC is used with the correct specifications for the CE
pin, the operational logic is fixed and the IC will operate normally. However, supply current may increase as a
result of through current in the IC’s internal circuitry if a medium voltage is applied.
<Thermal Protection>
When the junction temperature of the built-in driver transistor reaches the temperature limit, the thermal shutdown
circuit operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal
shutdown function is released and the IC’s operation is automatically restored because the junction temperature
drops to the level of the thermal shutdown release voltage.
<Minimum Operating Voltage>
For the stable operation of the IC, over 2.0V of input voltage is necessary.
generated normally if the input voltage is less than 2.0V.
The output voltage may not be
11/30
XCM414 Series
■ NOTES ON USE
■ Please use this IC within the stated absolute maximum ratings.
1.
ratings be exceeded.
The IC is liable to malfunction should the
■
2. Where wiring impedance is high, operations may become unstable due to the noise and/or phase lag
depending on output current. Please strengthen VIN and VSS wiring in particular.
3. Since the absolute maximum rated voltage of the Schottky Barrier Diode is 40V, the AC input voltage input to
the IN 1 terminal and IN 2 terminal should not exceed ± 20V.
4. In order to smooth the full-wave rectified output by the bridge circuit and stabilize the input of the voltage
regulator, an input capacitor CIN of about 1.0μF is required between the power supply input pin (VIN) and the
ground pin (VSS). When increasing the capacitance value, select the input capacitor (C IN) so that the inrush
current at power-on will not exceed the peak forward surge current 1A of the Schottky Barrier Diode. In
addition, it is necessary to connect the NEG terminal of the bridge circuit and the ground terminal (VSS) of the
voltage regulator circuit.
5. The output voltage fluctuation such as under shoot or over shoot, which occurs because of the load change
can be controlled by placing the output capacitor C OUT around 0.1μF~1.0μF between the VOUT pin and VSS
pin. The input capacitor (CIN) and the output capacitor (COUT) should be placed to the IC as close as possible
with a shorter wiring.
6. Torex places an importance on improving our products and their reliability. We request that users incorporate
fail-safe designs and post-aging protection treatment when using Torex products in their systems.
12/30
XCM414
Series
■ TYPICAL PERFORMANCE CHARACTERISTICS
● Voltage Regulator (VR)
■
(1) Output Voltage vs. Output Current
●
■
■
13/30
XCM414 Series
(1) Output Voltage vs. Output Current (Continued)
(2) Output Voltage vs. Input Voltage
14/30
XCM414
Series
(2) Output Voltage vs. Input Voltage (Continued)
(3) Dropout Voltage vs. Output Current
15/30
XCM414 Series
(3) Dropout Voltage vs. Output Current (Continued)
(4) Supply Current vs. Input Voltage
16/30
XCM414
Series
(5) Supply Current vs. Ambient Temperature
(6) Output Voltage vs. Ambient Temperature
17/30
XCM414 Series
(6) Output Voltage vs. Ambient Temperature (Continued)
(7) Line Transient Response
18/30
XCM414
Series
(7) Line Transient Response (Continued)
(8) Load Transient Response
19/30
XCM414 Series
(8) Load Transient Response (Continued)
(9) Input Rise Time
20/30
XCM414
Series
(9) Input Rise Time (Continued)
(10) CE Rise Time
21/30
XCM414 Series
(10) CE Rise Time (Continued)
22/30
XCM414
Series
(11) Ripple Rejection Rate
23/30
XCM414 Series
(11) Ripple Rejection Rate (Continued)
24/30
XCM414
Series
● Schottky Barrier Diodes (SBD)
●
(1) Forward Current vs. Forward Voltage
(2) Reverse Current vs. Reverse Voltage
1000
1000
100
Reverse Current IR (uA)
Forward Current IF (mA)
Ta=125℃
Ta=125℃
-25℃
75℃
10
25℃
1
0.1
100
10
75℃
1
25℃
0.1
0.01
0
0.2
0.4
0.6
0
Forward Voltage VF (V)
10
20
30
Reverse Voltage VR (V)
(3) Forward Voltage vs. Operating Temperature
(4) Reverse Current vs. Operating Temperature
0.6
1000
VR=40V
20V
Reverse Current IR (uA)
Forward Voltage VF (V)
IF=200mA
100mA
0.4
10mA
0.2
0.0
-50
0
50
100
100
5V
10
1
0.1
0.01
150
0
Operating Temperature Ta (℃)
50
100
150
Operating Temperature Ta (℃)
(5) Inter-Terminal Capacity vs. Reverse Voltage
(6) Average Forward Current vs. Operating Temperature
500
Average Forward Current IF(AV) (mA)
50
Inter-Terminal Capacity Ct (pF)
40
40
30
20
10
Ta=25℃
0
0
10
20
30
Reverse Voltage VR (V)
40
400
300
200
100
0
0
50
100
150
Operating Temperature Ta (℃)
25/30
XCM414 Series
■PACKAGING INFORMATION
●USP-8B10
2.6±0.05
2.9±0.05
(0.22)
(0.12)
(0.22)
0.3±0.05
3
4
0.55±0.05
1.13±0.05
8
7
6
1.32±0.05
5
0.3±0.05
0.3±0.05
26/30
1.34±0.05
0.96±0.05 (0.39)
0.55±0.05
2
0.55±0.05
(0.48)
(0.22)
1
(0.65)
0.2±0.05
(0.11)
(0.25)
0.33 MAX
1pin INDENT
XCM414
Series
■PACKAGING INFORMATION (Continued)
USP-8B10 Reference Metal Mask Design
USP-8B10 Reference Pattern Layout
1.065
0.65
0.35
0.35
6
5
8
7
0.98
1
2
3
0.03 0.21
4
0.095
0.84
0.545
0.3
0.35
0.35
1
2
0.3
1.18
0.7
0.56
1.34
2.88
0.3
0.4
0.55
0.53
2.78
0.27
0.55
0.96
0.43
0.545
0.09
5
0.35
1.32
0.55
6
0.3
7
0.4
8
0.65
0.3575
0.35 0.355
3
0.045
4
0.21
1.13
27/30
XCM414 Series
USP-8B10 Power Dissipation
Power dissipation data for the USP-8B10 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition:: Mount on a board
Ambient:: Natural convection
Soldering:: Lead (Pb) free
Board:: Copper foil 4 layer
76.2
demenshins 76.2mm×114.3mm (about 8700mm 2 in one side)
1st inner layer:50mm×50mm connection with heat sink
50
2nd inner layer:70mm×70mm connection with heat sink
3rd inner layer:70mm×70mm connection with heat sink
4th inner layer:50mm×50mm connection with heat sink
114.3
50
Material: Glass Epoxy (FR-4)
Thickness: 1.6mm
Through-hole: φ 0.2mm 60pcs
8.74
2. Power Dissipation vs. Ambient temperature
Board Mount (Tjmax = 125℃)
Ambient Temperature(℃)
Power Dissipation Pd(mW)
Thermal Resistance(℃/W)
25
85
1400
560
71.43
Power Dissipation Pd(mW)
Pd vs. Ta
1600
1400
1200
1000
800
600
400
200
0
25
45
65
85
Ambient Temperature Ta(℃)
28/30
105
125
XCM414
Series
■MARKING RULE
① represents product series.
represents product series.
MARK
PRODUCT SERIES
4
USP-8B10
8
7
6
5
XC414Bxxxxx-G
①
② represents Integer part of the output voltage range.
MARK
Voltage (V)
MARK
Voltage (V)
2
2.X
8
8.X
3
3.X
9
9.X
4
4.X
A
10.X
5
5.X
B
11.X
6
6.X
C
12.X
7
7.X
1
2
②
③
④
⑤
3
4
③ represents first digit of decimal point of output voltage range.
MARK
Voltage (V)
MARK
Voltage (V)
0
X.0
5
X.5
1
X.1
6
X.6
2
X.2
7
X.7
3
X.3
8
X.8
4
X.4
9
X.9
④⑤ represents production lot number.
01 to 09, 0A to 0Z, A1 to A9, AA to AZ, B1 to ZZ repeated
* G, I, J, O, Q, W excluded
* No character inversion used.
29/30
XCM414 Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or completeness
of the information contained in this datasheet nor grant any license to any intellectual property rights
of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require extremely
high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human
life, bodily injury, serious property damage including but not limited to devices or equipment used in 1)
nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other
transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products; nevertheless
Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or
property damage resulting from such failure, customers are required to incorporate adequate safety
measures in their designs, such as system fail safes, redundancy and fire prevention features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
30/30
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