null  User manual
8/31/2017
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Thinkstation-specs » ThinkStation P910
Version: 2.0 Dec 6, 2016
THINKSTATION P910
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Product Overview
The ThinkStation P910 is high performance dual socket workstation. An Intel® Grantley‐
based product, the P910 provides excellent performance and quality for applications where
processor, memory, graphics, and storage requirements are critical.
The P910 is positioned above two Grantley‐based workstations, the single socket P510 and
dual socket P710.
Operating Systems
Preloaded
Genuine Windows 10® Professional 64‐bit
Genuine Windows 10DG to 7® Professional 64‐bit
Genuine Windows 10® 64‐bit
Supported
Red Hat Enterprise Linux 7
Motherboard – P910
Form Factor
Board Size
13.15″ x 14.9″ (334mm x 378.5mm)
Layout
Custom ATX
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Motherboard Core
Processor Support
Intel® Xeon™ Quad Core (Broadwell EP)
Intel® Xeon™ Six Core (Broadwell EP)
Intel® Xeon™ Eight Core (Broadwell EP)
Intel® Xeon™ Ten Core (Broadwell EP)
Intel® Xeon™ Twelve Core (Broadwell EP)
Intel® Xeon™ Fourteen Core (Broadwell EP)
Intel® Xeon™ Sixteen Core (Broadwell EP)
Intel® Xeon™ Twenty‐Two Core (Broadwell EP)
Intel® Xeon™ Six Core (Haswell EP)
Socket Type
Socket‐R3 (LGA 2011)
Memory Support
1600/1866/2133/2400 MHz
QPI (GTPS)
6.4/8.0/9.6 GTPS Links
Voltage Regulator
Intel VR12.5 – 145W TDP Capable
Chipset (PCH)
Wellsburg (Intel 612)
Flash
16MB + Depoped 16MB
HW Monitor
Super I/O
Nuvoton NCT6683D
Clock
Wellsburg (Intel 612) Native isCLK
Audio
Realtek ALC662
Ethernet
Intel Clarkville WGI218LM
SAS
Optional via Flex Adapter
Memory
Slots
16 total Slots, 8 per CPU
Channels
4 Channels per CPU
Type
DDR4 288‐Pin, 1600/1866/2133/2400 MHz RDIMM and LRDIMM support
ECC Support
YES
Speed
Up to 2400 MHz
Max DIMM Size
Up to 32GB RDIMM, 64GB LRDIMM
Max System Memory
Up to 1TB LRDIMM (w/ 64GB)
Ethernet
Vendor
Intel, Clarkville WGI210AT/WGI218LM
Count
2
EEPROM
None for Clarkville
Speeds
10/100/1000 Mbps
Functions
PXE, ASF, WOL, Jumbo Frames, Teaming
Connectors
(2) x RJ45 on Rear I/O
Audio
Vendor
Realtek
Type
HD (5.1)
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Internal Speaker
Yes, using SSM2211 amplifier
Connectors
(3) x Rear 3.5mm Jacks (Line In, Line Out, Microphone In)
Global Headphone Jack (Headphone + MIC in
(1) x 2‐Pin Internal Speaker Header
Video
Onboard
<Not Supported>
Adapter
(3) x PCI‐E 3.0 16‐Lane Slots
Additional adapters may be supported in x4 slots for Spec Bids
Multi‐GPU Support
BIOS supported, card dependent
Storage
Floppy
None
IDE
None
SATA/SAS
(8) x SATA Connectors, Gen. 3
4 SATA HDD ports connected through 2 Mini SAS HD (X2 electrical, X4
mechanical) (2 HDDs upper bay, 2HDDs lower bay) + 2 SATA Gen 3 for
ODDs + 1SATA for Mez Connector
eSATA
(1) x eSATA Connector, Gen. 3 (Optional eSATA bracket)
Slots
Slot 1 (Near CPU)
PCIe x16, gen 3, with Latch, CPU1,Full Length, FH
Slot 2
PCIe x1, gen 2, Open Ended, CPU1,Full Length, FH ( “Half length with
Flex Adapters / Full length without Flex Adapter”)
Slot 3
PCIe x16, gen 3, with Latch, CPU1,Full Length, FH
Slot 4
PCIe x1, gen 2, Open Ended, CPU1,Full Length, FH
Slot 5 (Near Edge)
PCIe x4, gen 2, Open Ended, CPU1, Half Length, FH
Slot 6 (Near Edge)
PCIe x16, gen 3, with Latch, CPU2, Full Length, FH ( “Half length
with Flex Adapters / Full length without Flex Adapter”)
Slot 7
PCIe x16, gen 3, with Latch, CPU2, Full Length, FH
Slot 8
PCIe x4, gen 2, Open Ended, CPU2, Full Length, FH
Rear I/O
COM
(1) x Serial Port (COM1)
eSATA
(1) x eSATA Port (Gen. 2), optional via bracket
LPT
None
Video
<No Onboard Video>
Audio
Microphone‐In, Line In, Line Out
Ethernet
(2) x RJ45
USB 2.0
(4) x USB 2.0 Ports
USB 3.0
(4) x USB 3.0 Ports
Firewire
Optional
Internal I/O
USB 2.0
6 Total (4 Rear, 2 Internal to Flex Slot)
USB 3.0
9 total (4 front, 4 rear, 1 internal header for MCR)
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PS/2
Yes (2)
Audio
2×7‐pin (Mic In, Headphone) Global Version
COM2
None
Clear CMOS
3‐Pin Clear CMOS Header
Speaker
2‐Pin Internal Speaker Header
Chassis Intrusion
2‐Pin Chassis Intrusion Switch Header
Firewire
None
Thermal
Temp Sensors
Ambient Thermal Sensor – Thermal diode Connected to Super I/O
VR1 Thermal Sensor – Thermal diode Connected to Super I/O
VR2 Thermal Sensor‐ Thermal diode Connected to Super I/O
PSU Thermal Sensor
Fans
CPU Fan 4‐pin header with 3‐pin key
Rear SYSTEM Fan X2 4‐pin header with 4‐pin key
Front Fan 4‐pin header with 4 pin key
ODD bay Fan X2 4‐pin header with 3‐pin key
PSU Fan Main PSU power connector
Power Connectors
Main
Single Card Edge Connector
Memory & CPU
Graphics
Security
TPM
Version 1.2, Infineon SLB9660TT1.3
Asset ID
Yes, 1024X8bit, might depoped in future
vPro
Intel vPro for WS (AMT 9.x)
BIOS
Vendor
AMI
Chassis Summary
Chassis Information
Format
55L Rack Mountable Tower
Dimensions
440mm H x 200mm W x 620mm D (chassis only)446mm H x 200mm W x 620mm D
(with rear handle & feet)
Weight
71.3lbs
Color
PSU
1300W 92% Efficient tooless
Thermal Solutions
Three (3) system fans standard (2 front, 1 rear)
Physical Security & Serviceability
Access Panel
Tool‐less side cover removal
Optical Drive
Tool‐less
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Hard Drives
Tool‐less
Expansion Cards
Tool‐less
Processor Socket
Tool‐less
Color coded User Touch Points
Yes
Color‐coordinated Cables and Connectors
Yes
Memory
Tool‐less
System Board
Tool‐less
Green Color Power LED on Front of
Computer
Yes
Restore CD/DVD Set
Restore system to original factory shipping
image – Can be obtained via Lenovo Support
Cable Lock Support
Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network,
Enable/Disable Port Control
Yes
Power‐On Password
Yes
Setup Password
Yes
NIC LEDs (integrated)
Yes
Security Chip
Yes
Access Panel Key Lock
Optional
Boot Sequence Control
Yes
Padlock Support
Yes, loop in rear for optional padlock,
prevents side panel removal
Boot without keyboard and/or mouse
Yes
Operating Environment
Air Temperature
Operating: 10°C to 35°C (50°F to 95°F)
Storage: ‐40°C to 60°C (‐40°F to 140°F) in original shipping carton
Storage: ‐10°C to 60°C (14°F to 140°F) without carton
Humidity
Relative Humidity Operating: 10% to 80% (non‐condensing)
Relative Humidity Storage/Transit: 10% to 90% (non‐condensing)
Wet Bulb Temperature Operating: 25°C max
Wet Bulb Temperature Non‐operating: 40°C max
Altitude
Operating: ‐15.2 m to 3048 m (‐50 ft to 10 000 ft)
Regulations and Standards
EMC
FCC (DoC)/Canada
CE (EMC)
VCCI
JEIDA
C‐Tick
BSMI
CCIB
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Safety
FCC (DoC)/Canada
CE (EMC)
VCCI
JEIDA
C‐Tick
BSMI
CCIB
PSB
CE (LVD)
Environmentals
Energy Star
Energy Star Program Requirements for Computers: Version 6.0 (select models)
EPEAT
ErP Lot‐6 2014 (via system setup option; default on for systems shipped to EMEA.)
Hazardous Substances
Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1%
hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated
diphenol ethers (PBDE).
Products do not contain Asbestos.
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),
hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons,
carbontetrachloride, 1,1,1‐trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005%
polychlorinated terphenyl (PCT) in preparation.
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10‐
13 carbon atoms in the chain containing at least 48% per mass of chlorine in the
SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations
above 0.5 microgram/cm²/week.
SECTION II: SUPPORTED COMPONENTS
CPU Specifications
2S Processor SKUs – These SKUs have 2 QPI links and are targeted for dual CPU systems but will also work on
single CPU systems
Intel Xeon E5‐2687W v4 – 12 Cores, 3.0 GHz, 9.6 QPI, 30MB Cache, DDR4‐2400, Turbo. HT, 160W
Intel Xeon E5‐2699 v4 – 22 Cores, 2.2 GHz, 9.6 QPI, 55MB Cache, DDR4‐2400, Turbo, HT, 145W
Intel Xeon E5‐2697A v4 – 16 Cores, 2.6 GHz, 9.6 QPI, 40MB Cache, DDR4‐2400, Turbo, HT, 145W
Intel Xeon E5‐2690 v4 – 14 Cores, 2.6 GHz, 9.6 QPI, 35MB Cache, DDR4‐2400, Turbo, HT, 135 W
Intel Xeon E5‐2680 v4 – 14 Cores, 2.4 GHz, 9.6 QPI, 35MB Cache, DDR4‐2400, Turbo, HT, 120W
Intel Xeon E5‐2667 v4 – 8 Cores, 3.2 GHz, 9.6 QPI, 25MB Cache, DDR4‐2400, Turbo, HT, 135W
Intel Xeon E5‐2660 v4 – 14 Cores, 2.0 GHz, 9.6 QPI, 35MB Cache, DDR4‐2400, Turbo, HT, 105W
Intel Xeon E5‐2658 v4 – 14 Cores, 2.3 GHz, 9.6 QPI, 35MB Cache, DDR4‐2400, Turbo, HT, 105W
Intel Xeon E5‐2650 v4 – 12 Cores, 2.2 GHz, 9.6 QPI, 30MB Cache, DDR4‐2400, Turbo, HT, 105W
Intel Xeon E5‐2643 v4 – 6 Cores, 3.4 GHz, 9.6 QPI, 20MB Cache, DDR4‐2400 , Turbo, HT, 135W
Intel Xeon E5‐2640 v4 – 10 Cores, 2.4 GHz, 8.0 QPI, 25MB Cache, DDR4‐2133 , Turbo, HT, 90W
Intel Xeon E5‐2637 v4 – 4 Cores, 3.5 GHz, 9.6 QPI, 15MB Cache, DDR4‐2400 , Turbo, HT, 135W
Intel Xeon E5‐2630 v4 – 10 Cores, 2.2 GHz, 8.0 QPI, 25MB Cache, DDR4‐2133 , Turbo, HT, 85W
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Intel Xeon E5‐2623 v4 – 4 Cores, 2.6 GHz, 8.0 QPI, 10MB Cache, DDR4‐2133 , Turbo, HT, 85W
Intel Xeon E5‐2620 v4 – 8 Cores, 2.1 GHz, 8.0 QPI, 20MB Cache, DDR4‐2133 , Turbo, HT, 85W
Intel Xeon E5‐2609 v4 – 8 Cores, 1.7 GHz, 6.4 QPI, 20MB Cache, DDR4‐1866 , 85W
Intel Xeon E5‐2603 v4 – 6 Cores, 1.7 GHz, 6.4 QPI, 15MB Cache, DDR4‐1866 , 85W
Intel Xeon E5‐2620 v3 6 Cores, 2.4GHz, 8.0 QPI, 15MB Cache, DDR4‐1866, Turbo, HT, 85W
Intel Xeon E5‐2609 v3 – 6 Cores, 1.9GHz, 6.4 QPI, 15MB Cache, DDR4‐1600, 85W
Notes
When ordering two processors, the second processor must be the same as the first. Intel
processor numbers are not a measurement of higher performance. Processor numbers
differentiate features within each processor family, not across different processor families.
Multi core technologies are designed to improve performance of multithreaded software
products and hardware‐aware multitasking operating systems and may require appropriate
operating system software for full benefits; check with software provider to determine
suitability; not all customers or software applications will necessarily benefit from use of
these technologies.
64‐bit computing on Intel® 64 architecture requires a computer system with a processor,
chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64
architecture. Processors will not operate (including 32‐bit operation) without an Intel® 64
architecture‐enabled BIOS. Performance will vary depending on your hardware and software
configurations
Memory Specifications
P910
RDIMMs – 2400MHz
8GB DDR4 ECC RDIMM PC4‐2400‐R 2Rx8
16GB DDR4 ECC RDIMM PC4‐2400‐R 2Rx4
32GB DDR4 ECC RDIMM PC4‐2400‐R 2Rx4
LRDIMMs – 2400MHz
64GB DDR4 ECC LRDIMM PC4‐2400‐L 4Rx4
Storage – Hard Drive/SSD Specifications
3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Enterprise SATA Hard Disk Drive (HDD)
4TB SATA – 7200rpm, 6Gb/s, 3.5″
6TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 10000rpm, 12Gb/s, 2.5″
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600GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 15000rpm, 12Gb/s, 2.5″
2.5″ SATA Solid State Drive (SSD)
128GB SATA SSD, 6Gb/s, , 2.5″ Non‐OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ Non‐OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ OPAL
512GB SATA SSD, 6Gb/s, , 2.5″ Non‐OPAL
1 TB SATA SSD , 6Gb/s, , 2.5″ Non‐OPAL
180GB SATA SSD. 6Gb/s. , 2.5″ OPAL
240GB SATA SSD, 6Gb/s, , 2.5″ OPAL
480GB SATA SSD, 6Gb/s, , 2.5″ OPAL
M.2 (NGFF) PCIe Solid State Drive (SSD)
256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, OPAL NVMe
512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, NVMe
2.5″ PCIe Solid State Drive (SSD)
400GB PCIe ‐Intel 750 2.5″ PCIe Gen 3×4 NVMe
PCIe Half Height / Half Length Solid State Drive (SSD)
400GB PCIe – Intel P3700 PCIe Gen 3×4 NVMe,Non‐Opal
RAID
Supported RAID levels for a system will vary from the stated capabilities of the RAID
controller due to dependencies on the number and capacity of physical disks in the system
and on customer requirements for performance, fault tolerance, or data redundancy. Max
support RAID 0,1,5,10
RAID levels and requirements:
RAID 0 (striping) provides increased performance by writing data across multiple
drives.
RAID 1 (mirroring) provides fault tolerance by writing the data on two drives.
RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance
more efficiently than RAID 1. Requires three or more drives.
RAID 10 (or RAID 1+0) combines
RAID 1 and RAID 0 to create a stripe of mirrors that is fault tolerant while offering
increased performance. Requires four drives.
Optional Hard Disk Drive Controllers
LSI 9364‐8i 8‐port SATA/SAS ROC Adapter(Base Mode) w/ 1GB DDR Memory Module
LSI SAS/SATA RAID Flex adapter
Optical Drive/Removable Media
DVD‐ROM Drive (SATA)
DVD‐ROM Drive – 16x/48x (SATA)
DVD Burner/CD‐RW Rambo Drive (SATA)
DVD Burner/CD‐RW Rambo Drive (SATA)
Blu‐Ray Burner Drive (SATA)
Blu‐Ray Burner Drive w/AACS encryption (SATA)
DVD Burner/CD‐RW Rambo Drive (Slim SATA)
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DVD Burner/CD‐RW Rambo Drive (9.5mm Slim SATA)
Media Card Reader
Front 9 in 1 Media Card reader Standard
Front 29 in 1 Media card reader, USB3.0, MPOB, 760mm (Requires FLEX Module)
Keyboard
Preferred Pro Fullsize Keyboard (USB)
Preferred Pro Fullsize Keyboard (PS/2)
Smart Card KYB
Chicony KUF1256 fingerprint KB Win8
Lenovo Slim New F5 USB Keyboard
Pointing Devices
Optical Wheel Mouse (1000 DPI), USB – red wheel
Lenovo USB Laser Mouse for win7 and win10
PS2 black optical mouse with new logo
3DConnexion CadMouse
Graphics Cards
Nvidia Quadro P5000 (DVI‐D,4xDP) – 16GB GDDR5 with Long extenderNvidia Quadro P6000
(DVI‐D,4xDP) – 24GB GDDR5 with Long extender
Nvidia NVS310 (DP x 2) – 1GB DDR3
Nvidia NVS310 (DP x 2) – 1GB DDR3
Nvidia NVS315 (with DMS‐59 to Dual DVI single link dongle) – 1GB DDR3
Nvidia NVS315 (with DMS‐59 to Dual Display Port dongle) – 1GB DDR3
Nvidia NVS 510 (mini DP x 4) – 2GB DDR3
NVS 810 (miniDPx8) – 4GB DDR3‐ATX Long Offset Ext Bracket
Nvidia Quadro K420(DP/DVI) – 2GB DDR3‐ ATX
Nvidia Quadro K620 (DVI, DP) – 2GB DDR3 ATX
NVIDIA Quadro K1200(miniDPx4) – 4GB GDDR5 – HP
Nvidia Quadro K2200 (DVI, DP, DP) – 4GB GDDR5 ATX
Nvidia Quadro M2000 (Dp x 4) – 4GB ATX
Nvidia Quadro M4000 (DP x 4I) – 8GB GDDR5‐ ATX Long Offset Ext Bracket
Nvidia Quadro M5000 (DVI, DP x 4) – 8GB GDDR5‐ ATX Long Offset Ext Bracket
Nvidia Quadro M6000 (Dual Link DVI, DPx4) – 24GB GDDR5 – Long Offset Extender
NVIDIA SLI Implementations
2 x Nvidia Quadro M5000 with SLI cable
2 x Nvidia Quadro M6000 with SLI Cable
NVIDIA GPU Computing Processor
NVIDIA Tesla K40C GPU Active Accelerator – 12GB GDDR5 Long Ext
Intel Parallel Coprocessor
Intel Xeon Phi Coprocessor 3120A – 57 Cores, 1.1 GHz, 6GB Cache, 300 W – PCIe x16, with long extender bracket
NVIDIA Stereo 3D Bracket
Nvidia Stereo 3D Connector Bracket
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FLEX Components
Flex Bay: Formerly known as ODD bays. Will support not only ODD, but
also HDDs and Flex Module
Flex Module: Module supported in the Flex Bay with several options
integrated. Will support slim ODD, High Speed Media Card Reader or 2
universal ports supporting IEEE1394, eSATA, etc…
Flex Connector: Mezzanine connector in the motherboard, that enables
expanded storage and I/O. 2 available in P900, 1 available in P500/P700
Flex Tray: New HDD Tray design enables that two drives on a single tray
(when used in a blind connect configuration)
PCIe
Network
Intel I210‐T1 Single Port Gigabit Ethernet Adapter
Intel I350‐T2 Dual Port Gigabit Ethernet Adapter
Intel I350‐T4 Quad Port Gigabit Ethernet Adapter
Bitland BN8E88 1000M PCIE ASF FH
Thunderbolt
Intel Thunderbolt PCIe Add‐In‐Card
IEE 1394
IEEE 1394a (Firewire‐400) PCI Express x1 Adapter (1 external, 1 internal port)
USB
USB 3.0 PCI Express x1 Adapter
WIFI Card
Intel 7260 AC Wifi card
Parallel Card
Sunix 1 – Port IEEE1284 Parallel PCI Express x1 Communication card full Height
SECTION III: SYSTEM TECHNICAL SPECIFICATIONS
Power Supply Specifications
Power Supply
1300W PSU
Operating Voltage Range
90‐264VAC
Rated Voltage Range
100‐240V
Rated Line Frequency
50/60Hz
Operating Line Frequency Range
47Hz/63Hz
Rated Input Current
15A‐9A
Power Supply Fan
(2) 60x38mm, 14000rpm max
ENERGY STAR® qualified (Config Dependent)
*System level select models
80 PLUS Compliant
Yes 80 PLUS Platinum
Built‐in Self Test (BIST) LED
YES
Surge Tolerant Full Ranging Power Supply
(withstands power surges up to 2000V)
YES
Aux Power Drop
Quad Drop
Click here to access the ThinkStation Power Calculator.
BIOS Specifications
WMI Support
Compliant with Microsoft WBEM and the DMTF
Common Information Model
ROM‐Based Setup Utility (F1)
System Configuration Setup program available
at power‐on with F1 key
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Bootblock Recovery
Recovers system BIOS when Flash ROM
corrupted.
Replicated Setup
Saves System Configuration settings to file
that can then be used replicated to other
systems.
Boot Control
Boot control available through ROM‐Based
Setup Utility or with F12 key at power‐on
Memory Change Alert
Power‐on Error message in event of decrease
in system memory
Thermal Alert
Power‐on Error message in event of fan
failure
Asset Tag
Support ability to set SMBIOS Type 2
Baseboard Asset Tag field.
System/Emergency ROM Flash
Recovery with Video
Support process to recover system BIOS when
Flash ROM corrupted
Remote Wakeup/Remote Shutdown
System admin can power on/off a client
computer from remote location to provide
maintenance
Quick Resume time
Support lor power S3 (suspend to RAM) and
prompt resume times
ROM revision level
System UEFI (BIOS) version reported in
SMBIOS Type 0 structure and in BIOS Setup
Keyboard‐less Operation
System can be booted without a keyboard
Per‐port Control
Allows I/O ports to be individually
enabled/disabled through ROM‐based setup
or WMI interface
Adaptive Cooling
Fans dynamically controlled by system BIOS
based on temperature. User has ability to
provide custom fan control table
Security
User and Administrator passwords can protect
boot and ROM‐base Setup. Chassis intrusion
detection protect
Intel(R) AMT (includes ASF 2.0)
Allows system to be supported from a remote
location
Intel(R) TXT
Intel(R) Trusted Execution Technology
provides a security foundation to build
protections against software base attacks.
Memory modes
Supports mirroring, lock step, and sparing
memory modes
Windows 8 ready
Supports Windows 8 requirements – Secure
flash, UEFI v 2.3.1 spec
Industry Standard Specification
Support
UEFI
Unified Extensible Firmware Interface
v2.3.1d
ACPI (Advanced Configuration and
power Management Interface)
Advanced Configuration and Power Interface
v5.0
ASF 2.0
DMTF Alert Standard Format Specification
v2.0
ATA (IDE)
AT Attachment 6 with Packet Interface
(ATA/ATAPI‐6)
CD Boot
“El Torito” Bootable CD‐Rom Format
Specification, Version 1.0
EHCI
Enhanced Host Controller Interface for
Universal Serial Bus, Revision 1.0
PCI
PCI Local Bus v3.0
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PC Firmware Specification 3.1
PCI Express
PCI Express Base Specification 3.0
SATA
Serial ATA Revision 3.0 Specification
TPM
Trusted Computing Group TPM Specification
Version 1.2
UHCI
Universal Host Controller Interface Design
Guide, Revision 1.1
USB
Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS
DMTF System Management Spec v2.8.0
Social and Environmental Responsibility
Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent
quality control
Hazardous substances and preparation
Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1%
hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated
diphenyl ethers (PBDE). (See legal reference and Note B2
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),
hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons,
carbontetrachloride, 1,1,1‐trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005%
polychlorinated terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10‐
13 carbon atoms in the chain containing at least 48% per mass of chlorine in the
SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations
above 0.6 microgram/cm²/week
REACH Article 33 information about substances in articles is available
at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment
Batteries
If the product contains a battery or an accumulator, it is labeled with the disposal
symbol and if it contains more than 0.0005% of mercury (for button cells only) by
weight, or more than 0.004% of lead,it shall be marked with the chemical symbol for
the metal concerned, Hg or Pb. Information on proper disposal is provided in user
manual
Button cells used in the product do not contain more than 2% by weight of mercury.
Other batteries or accumulators do not contain more than 0.0005% of mercury or
0.002% of cadmium
Batteries and accumulators are easily removable by either users or service providers
(as dependent on the design of the product). Exception: Batteries that are
permanently installed for safety, performance, medical or data integrity reasons do
not have to be “easily removable
Safety, EMC connection to the telephone network and labeling
The product complies with legally required safety standards as specified
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The product complies with legally required standards for electromagnetic
compatibility
If product is intended for connection to a public telecom network or contains a radio
transmitter, it complies with legally required standards for radio and
telecommunication devices
The product is labeled to show conformance with applicable legal requirements
Product packaging
Packaging and packaging components do not contain more than 0.01% lead, mercury,
cadmium and hexavalent chromium by weight of these together.
Plastic packaging material is marked according to ISO 11469 referring ISO 1043
The product packaging material is free from ozone depleting substances as specified
in the Montreal Protocol
For more information on Lenovo social environmental practices
visit: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment
Manageability
Industry Standard Specifications
This product meets the following industry standard specifications for
manageability functionality:
Intel LAN with AMT
Remote Manageability Software Solutions
Lenovo ThinkStation is supported on the following remote manageability
software consoles:
Lenovo ThinkManagement Console
LANDesk Management Suite for ThinkVantage Technologies
(www.landesk.com/lenovo)
Microsoft System Center Configuration Manager
System Software Manager
Lenovo ThinkStation supports software management tools from the
ThinkVantage System Update suite:
System Update
Update Retriever
Thin Installer
Service, Support, and Warranty
On‐site Warranty and Service: Three‐years, limited warranty and service
offering delivers on‐site, next business‐day service for parts and labor and
includes free telephone support 8am – 5pm. Global coverage ensures that any
product purchased in one country and transferred to another, non‐restricted
country will remain fully covered under the original warranty and service
offering.
Go to www.lenovo.com/support and www.lenovo.com/warranty for more details
SECTION IV: COMPONENT SPECIFICATIONS
HDD Specifications
3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Enterprise SATA Hard Disk Drive
(HDD)
4TB SATA – 7200rpm, 6Gb/s, 3.5″
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6TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″
Hybrid
2.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 15000rpm, 12Gb/s, 2.5″
<
2.5 10K SAS 300G/600G
(Model:Thunderbolt)
2.5 15K SAS 600G
(Model:Valkyrie BP)
Connector
SAS
SAS
Transfer Rate
12Gb
12Gb
10,000 +/‐
15,000 +/‐
Performance
Spindle Speed(RPM)
Power off to Spindle Stop(sec) 20 sec
20 sec
DC Power to Drive Ready(sec)
20 sec
20 sec
Receipt of Start Unit
Command to Drive Ready(sec)
20 sec
20 sec
Average Latency(sec)
2
2
Input(VDC)
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
Typical(Watts)
6.01
8.03
Idle(Watts)
3.44
5.28
Height(mm – Max)
15
15
Width(mm)
69.85
69.85
Depth(mm – Max)
100.45
100.45
Weight(grams)
199(maximum)
230(maximum)
Operating(C) Ambient
5 to 55
5 to 55
Operating(C) Base Casting
60 max
60 max
Non‐Operating(C) Ambient
‐40 to 70
‐40 to 70
Gradient(C per Hour)
20 max
20 max
Operating(Gs @2ms)
25
25
Non‐Operating(Gs @2ms)
400
400
Power Management
Dimensions
Temperature
Shock
Connector
3.5 7200 Enterprise
4T/6T (Model:Makara)
3.5 7200 Enterprise
4T/6T
(Model:MakaraBP)
3.5″ 7200 2T/3T
(Model:Grenada BP‐R
)
3.5″ 7200 500G/1T
(Model:Pharaoh
Oasis)
3.5″ 7200RPM
Hybrid2T/1T
(Model:Grenada BP2H
)
SATA
SATA
SATA
SATA
SATA
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Transfer Rate (Gb/sec)
Thinkstation-specs » ThinkStation P910
600MB/sec
600MB/sec
600MB/sec
600MB/sec
600MB/sec
Spindle Speed(RPM)
7200
7200
7200
7200
7200
Power off to Spindle
Stop(sec)
23 max
23 max
11 max
10 max
11 max
DC Power to Drive
Ready(sec)
30 max
30 max
10 max
10 max
Receipt of Start Unit
Command to Drive
Ready(sec)
30 max
30 max
17 max
10 max
Average Latency(msec)
4.16
4.16
4.16
4.16
4.16
Input(VDC)
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
Typical(Watts)
10.62(6T)
10(6T)
8 max
5.57 max
6.7 max
Idle(Watts)
8(6T)
6.2(6T)
5.4 (Idle 2)
4.21
4.5 (Idle 2)
Height(mm – Max)
26.11
26.11
26.1
20
26.11
Width(mm)
101.6
101.6
101.6
101.6
101.6
Depth(mm – Max)
146.99
146.99
146.99
146.99
146.99
Weight(grams)
780 max
705 max
626 max
415 max
535
5 to 60
5 to 60
0 to 60
0 to 60
0 to 60
Non‐Operating(C)
Ambient
‐40 to 70
‐40 to 70
‐40 to 70
‐40 to 70
‐40 to 70
Gradient(C per Hour)
20 max
20 max
30 max
30 max
30 max
Operating(Gs @ 2ms)
70(read) 40(write)
70(read) 40(write)
70 max
80 max
80 max
Non‐Operating(Gs @ 2ms)
250 6T,300 other
250 6T,300 other
350 max
300 max
300 max
Performance
Power Management
Dimensions
Temprature
Operating(C) Ambient
Operating(C) Base Casting
Shock
SSD Specifications
2.5″ SATA Solid State Drive (SSD)
128GB SATA SSD, 6Gb/s, , 2.5″ Non‐
OPAL
180GB SATA SSD. 6Gb/s. , 2.5″ OPAL
240GB SATA SSD, 6Gb/s, , 2.5″ OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ Non‐
OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ OPAL
480GB SATA SSD, 6Gb/s, , 2.5″ OPAL
512GB SATA SSD, 6Gb/s, , 2.5″ Non‐
OPAL
1 TB SATA SSD , 6Gb/s, , 2.5″ Non‐
OPAL
M.2 (NGFF) PCIe Solid State Drive
(SSD)
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256 GB M.2 PCIe – Solid State Drive
(SSD), Gen3x4, OPAL NVMe
512 GB M.2 PCIe – Solid State Drive
(SSD), Gen3x4, NVMe
2.5″ PCIe Solid State Drive (SSD)
400GB PCIe ‐Intel 750 2.5″ PCIe Gen
3×4 NVMe
PCIe Half Height / Half Length Solid
State Drive (SSD)
400GB PCIe – Intel P3700 PCIe Gen 3×4
NVMe,Non‐Opal
180GB SATA
SSD. 6Gb/s.
OPAL.2.5″
240GB SATA SSD, 480GB SATA SSD,
6Gb/s,OPAL.
6Gb/s,OPAL.
2.5″
2.5″
128GB SATA
SSD, 6Gb/s,
2.5″ Non‐
OPAL
256GB SATA
SSD, 6Gb/s,
2.5″ OPAL
256GB SATA
SSD, 6Gb/s,
2.5″ Non‐
OPAL
512GB SATA
SSD, 6Gb/s,
2.5″ Non‐
OPAL
512GB SATA
SSD, 6Gb/s,
2.5″ OPAL
Min Sequential
Read
540 MB/s
540 MB/s
540 MB/s
460 MB/s
520 MB/s
520 MB/s
520 MB/s
530 MB/s
Min Sequential
Write
490 MB/s
490 MB/s
490 MB/s
270 MB/s
450 MB/s
450 MB/s
440 MB/s
495 MB/s
Min Random Read
(8GB Span)
41000 IOPS
41000 IOPS
48000 IOPS
77000 IOPS
92000 IOPS
92000 IOPS
86000 IOPS
70000 IOPS
Min Random Write
(8GB Span)
49000 IOPS
49000 IOPS
37000 IOPS
60000 IOPS
38000 IOPS
38000 IOPS
53000 IOPS
60000 IOPS
Min Power – Active
165 mW
165 mW
165 mW
155 mW
155 mW
155 mW
155 mW
100 mW
Min Power – Idle
55 mW
55 mW
55 mW
75 mW
75 mW
75 mW
75 mW
40 mW
Min MTBF
1.2 M hours
1.2 M hours
1.2 M hours
1.5 M hours
1.5M hours
1.5M hours
1.5M hours
1.5M hours
Hardware
Encryption
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
1 TB SATA SSD , 6Gb/s, 2.5″
Non‐OPAL
2 TB SATA SSD , 6Gb/s, 2.5″
OPAL
Min Sequential Read
560 MB/s
530 MB/s
Min Sequential Write
510 MB/s
500 MB/s
Min Random Read (8GB Span)
100,000 IOPS
920,000 IOPS
Min Random Write (8GB Span)
88,000 IOPS
83,000 IOPS
Min Power – Active
150 mW
150 mW
Min Power – Idle
70 mW
110 mW
Min MTBF
1.5M hours
1.5M hours
Hardware Encryption
AES 256 bit
AES 256 bit
Interface
PCIe Gen3 x4 OPAL NVMe
PCIe Gen3 x4 NVMe
Capacity
256GB
512GB
Sequential Read
2,250 MB/s
2,600 MB/s
Sequential Write
1,250 MB/s
1,500 MB/s
Random Read
295,000 IOPS
310,000 IOPS
Random Write
93,000 IOPS
100,000 IOPS
6.5W
5.5W
Performance
Power Consumption
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400GB PCIe – Intel P3700
400GB PCIe ‐Intel 750 2.5″
Sequential Read
2700 MB/s
2300 MB/s
Sequential Write
1080 MB/s
1000 MB/s
Random Read (100% Span)
450000 IOPS
450000 IOPS
Random Write (100% Span)
75000 IOPS
200000 IOPS
Latency – Read
20 µs
20 µs
Latency – Write
20 µs
20 µs
Power – Active
12W (write), 9W (read)
12
Power – Idle
4w
4
Operating Temperature Range
0°C to 55°C
0°C to 35°C
Endurance Rating (Lifetime Writes)
10 DWPD
70GB per day
Mean Time Between Failures (MTBF)
2,000,000 Hrs
1.2M hours
Interface
PCIe Gen 3×4
PCIe Gen 3×4
HDD Controllers
LSI 9364‐8i 8‐port SATA/SAS ROC Adapter(Base Mode)
w/ 1GB DDR Memory Module
LSI SAS/SATA RAID Flex adapter
LSI 9364‐8i 8‐port SATA/SAS ROC Adapter(Base LSI SAS/SATA RAID Flex adapter
Mode) w/ 1GB DDR Memory Module
PCI Bus
x8 lane PCI Express® 3.0
x8 lane PCI Express® 3.0
RAID Levels
RAID 0, 1, 5, 10, 50 and JBOD mod
RAID 0, 1, 5, 10, 50 and JBOD mod
Data Transfer Rates
Up to 12Gb/s per port
Up to 12Gb/s per port
+3.3V, +12V
+3.3V, +12V
Full Height and Low‐Profile
Full Height and Low‐Profile
2 HD Mini‐SAS SFF8643 (Vertical mount)
2 HD Mini‐SAS SFF8643 (Vertical mount)
PCI Modes
PCI Card Type
PCI Voltage
PCI Power
Bracket
Certification Level
Internal Connectors
Optical Drives Specifications
Desktop/Workstation. No driver is required for this device. Native support is provided by
the operating system.Desktop/Workstation. No driver is required for this device. Native
support is provided by the operating system.Desktop/Workstation. No driver is required for
this device. Native support is provided by the operating system.Desktop/Workstation. No
driver is required for this device. Native support is provided by the operating system.
DVD‐ROM Drive – 16x/48x
(SATA)
DVD Burner/CD‐RW Rambo
Drive (SATA)
Blu‐Ray Burner Drive
w/AACS encryption (SATA)
DVD Burner/CD‐RW Rambo
Drive (9.5mm Slim SATA)
Description
5.25‐inch, half‐height, tray‐
load
5.25‐inch, half‐height, tray‐
load
5.25‐inch, half‐height, tray‐
load
9.5mm slim, tray‐load
Mounting Orientation
Either horizontal or vertical
Either horizontal or vertical
Either horizontal or vertical
Either horizontal or vertical
Interface Type
SATA/ATAPI
SATA/ATAPI
SATA/ATAPI
SATA/ATAPI
Dimensions
(WxHxD) 15.0 x 4.4 x 20.3
(WxHxD) 15.0 x 4.4 x 20.3
(WxHxD) 15.0 x 4.4 x 20.3
(WxHxD) 128 x 9.5 x 127cm
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cm (5.9 x 1.7 x 8.0 in)
cm (5.9 x 1.7 x 8.0 in)
cm (5.9 x 1.7 x 8.0 in)
MAX
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
DVD‐ROM Single Layer
< 140 ms (typical)
< 140 ms (typical)
< 140 ms (typical)
< 160 ms (typical)
CD‐ROM Mode 1
< 125 ms (typical)
< 125 ms (typical)
< 125 ms (typical)
< 140 ms (typical)
Full Stroke DVD
< 250 ms (seek)
< 250 ms (seek)
< 250 ms (seek)
< 250 ms (seek)
Full Stroke CD
< 210 ms (seek)
< 210 ms (seek)
< 210 ms (seek)
< 210 ms (seek)
Source
SATA DC power receptacle
SATA DC power receptacle
SATA DC power receptacle
SATA DC power receptacle
DC Power Requirements
5 VDC ± 5%‐100 mV ripple p‐
p
5 VDC ± 5%‐100 mV ripple p‐
p
5 VDC ± 5%‐100 mV ripple p‐
p
5 VDC ± 5%‐100 mV ripple p‐
p
12 VDC ± 10%‐200 mV ripple
p‐p
12 VDC ± 10%‐200 mV ripple
p‐p
12 VDC ± 10%‐200 mV ripple
p‐p
5 VDC – <1000 mA typical, <
1600 mA
5 VDC – <1000 mA typical, <
1600 mA
5 VDC – <1100 mA typical, <
2000 mA
5 VDC – <1000 mA typical, <
1500 mA
maximum
maximum
maximum
maximum
12 VDC – < 1000 mA typical,
< 2000 mA
12 VDC – < 1000 mA typical,
< 2000 mA
12 VDC – < 1600 mA typical,
< 2500 mA
maximum
maximum
maximum
Temperature
5° to 50° C (41° to 122° F)
5° to 50° C (41° to 122° F)
5° to 50° C (41° to 122° F)
5° to 50° C (41° to 122° F)
Relative Humidity
8% to 80%
8% to 80%
8% to 80%
8% to 80%
Maximum Wet Bulb
Temperature
30° C (86° F)
30° C (86° F)
30° C (86° F)
30° C (86° F)
Operating Systems
Supported
Windows 10 Professional or
Home 64‐bit
Windows 10 Professional or
Home 64‐bit
Windows 10 Professional or
Home 64‐bit
Windows 10 Professional or
Home 64‐bit
Windows 7 Professional 64‐
bit
Windows 7 Professional 64‐
bit
Windows 7 Professional 64‐
bit
Windows 7 Professional 64‐
bit
Red Hat Enterprise Linux
(RHEL) 7.2
Red Hat Enterprise Linux
(RHEL) 7.2
Red Hat Enterprise Linux
(RHEL) 7.2
Red Hat Enterprise Linux
(RHEL) 7.2
Disc Capacity DVD‐ROM
Access Times
Power
DC Current
Operating
Environmental
Graphics Cards
P6000
P5000
3840
2560
PCIe Gen
3
3
Memory Size
24G
16G
Memory BW
433 GB/s
288 GB/s
Slots + Display Connectors
4xDP+DVI‐D
4xDP+DVI‐D
Display Support
5
5
Advanced Display
SDI, SYNC, Stereo
SDI, SYNC, Stereo
Board Power
250W
180W
SLI Support
Yes
Yes
Form Factor
FH
FH
# CUDA Cores
Single Precision
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M6000
M5000
M4000
M2000
# CUDA Cores
3072
2048
1664
768
Single Precision
7.1 TFLOPs
4.3 TFLOPs
2.6 TFLOPs
1.8 TFLOPs
PCIe Gen
3
3
3
3
Memory Size
12GB
8 GB
8 GB
4GB
Memory BW
317 GB/s
211 GB/s
192 GB/s
105.7 GB/s
Slots + Display Connectors
4x DP + DVI‐I
4x DP + 1x DVI
4x DP
4x DP
Display Support
4
4
4
4
Advanced Display
SDI, SYNC, Stereo
SYNC
SYNC
N/A
Board Power
250W
150 W
120 W
75W
SLI Support
Yes
Yes
Yes
No
Form Factor
FH
FH
FH
FH
K2200
K1200
K620
K420
# CUDA Cores
640
512
384
192
Single Precision
1.3 TFLOPs
1 TFLOPs
0.8 TFLOPs
0.3 TFLOPs
PCIe Gen
2
2
2
2
Memory Size
4 GB
4GB
2 GB
1 GB
Memory BW
80 GB/s
80 GB/s
29 GB/s
29 GB/s
Slots + Display Connectors
2x DP + DVI
4x mDP
DP + DVI
DP + DVI
Display Support
4
4
4
4
Advanced Display
N/A
N/A
N/A
N/A
Board Power
68 W
46 W
45 W
41 W
SLI Support
No
No
No
No
Form Factor
FH
LP
HH
HH
NVS310
NVS315
NVS510
NVS810
# CUDA Cores
48
48
192
1024(512 per GPU)
PCIe Gen
2
2
2
3
Memory Size
512 MB
1GB
2GB
4GB
Memory BW
14 GB/s
14 GB/s
28.5 GB/s
28.8 GB/s
Slots + Display Connectors
DP
DMS‐59
Mini DP
Mini DP
Max Display
2
2
4
8
Max Power
19.5 W
19.3 W
35 W
68 W
Max Resolution
2560 × 1600 at 60Hz
(DP)
2560 × 1600 at
60Hz (DP)
3840×2160 at 60Hz
(DP)
4096×2160 at 30Hz
(DP)
Form Factor
HH
HH
HH
FH
K40
# CUDA Cores
2880
PCIe Gen
Gen 3
Memory Size
12GB
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Memory BW
Thinkstation-specs » ThinkStation P910
288 GB/sec
Display Support
Board Power
235W
Supported APIs
C Based
Form Factor
FL/FH/2x W
Available Graphics Drivers
Microsoft Windows 7 Professional (64‐bit and 32‐bit)
Microsoft Windows 10 Professional (64‐bit)
Red Hat Enterprise Linux(RHEL) 7 Desktop/Workstation
Intel Xeon Phi Coprocessor 3120A
Processor Number
3120A processor
Processor
Intel® Xeon® Phi™
Cache
28.5 MB L2
Instruction Set
64‐bit
Instruction Set Extensions
IMCI
Embedded Options Available
No
Lithography
22 nm
# of Cores
57
Processor Base Frequency
1.1 GHz
TDP 300
W
Max Memory Size (dependent on
memory type)
6 GB
Max # of Memory Channels
12
Max Memory Bandwidth
240 GB/s
ECC Memory Supported
Yes
PCI Express Revision
2
Networking
P910
Connector
RJ‐45
Controller
Intel, Clarkville WGI210AT
Intel, Clarkville WGI218LM
Intel i218 Gigabit Ethernet – LM
Lithography
40 nm
TDP
0.5 W
Operating Temperature Range
0°C to 85°C
# of Ports
Single
Data Rate Per Port
1 Gbps
Jumbo Frames Supported
Yes
1000Base‐T
Yes
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Supported Under vPro
Yes
Intel i210 Gigabit Ethernet – AT
Operating Temperature Range
0°C to 70°C
# of Ports
Single
Data Rate Per Port
1 Gbps
System Interface Type
PCIe v2.1 (2.5GT/s)
NC Sideband Interface
Yes
Jumbo Frames Supported
Yes
1000Base‐T
Yes
MACsec IEEE 802.1 AE
No
IEEE 1588
Yes
Other
MEDIA CARD READER
9 in 1
29 in 1
Description
Description
The Media card reader device is standard in our Pseries
products The device connects to a 2×5 two channel USB
header on the motherboard of the system. There is no USB
controller card provided. Please see the Disc Formats section
below for a list of flash memory card formats that are
supported.
The Media card reader mounts into our FLEX
module which fits into a standard 5.25″ Optical
bay.
Mounting Orientation The Media Card Reader can not be
changed and is hard wired into the system
Mounting Orientation The Media Card Reader can
not be changed, it only fits into the FLEX Module
one way.
Interface Type
Interface Type
USB 2.0 (one channel dedicated to the separate USB port;
one channel dedicated to the flash memory card slots)
USB 3.0 (one channel dedicated to the separate
USB port; one channel dedicated to the flash
memory card slots)
Disc Formats
Disc Formats
SD
xD‐H
SDHC
xD‐M
SDXC
Micro SD
Mini SD
Micro SDHC
Mini SDHC
SD
Micro SD*
SDHC
Micro SDHC*
SDXC
Micro SDXC*
Mini SD
RS‐MMC
Mini SDHC
MMC
MultiMediaCard (MMC)
MMC Micro
Reduced Size MultiMediaCard (RS MMC)
MMC Mobile
(MMC Plus)
MMC Plus
(MMC Mobile)
M2
CompactFlash Card Type I (CF Type 1)
CF Type 2
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MicroDrive (MD)
Memory Stick (MS)
Memory Stick Select
MS Duo
MS PRO
MS PRO DuMS PRO‐HG Duo
MS XS Duo
MS XC‐HG Duo
MS HG Micro*
MS XC Micro*
MS XC‐HG Micro*
MMC Micro
Memory Stick Micro (M2)*
*Available with adapter
*Available with adapter
IEEE 1394a (Firewire‐400) PCI Express x1 Adapter (1 internal port, 1 external port)
Data Transfer Rate
Supports up to 400 Mbps
Devices Supported
IEEE‐1394 compliant devices
Bus Type
PCIe card full height PCIe slots
Ports
One IEEE‐1394a bilingual 6‐Pin Connector (Rear)
System Requirements
Genuine Windows 10® Professional 64‐bit, Genuine Windows 10DG to 7®
Professional 64‐big
Not supported on Linux.
Premium® III or higher processor 128‐MB RAM 1‐GB Hard Drive CD‐ROM drive
Built in sound system available PCI slot
Temperature –
50° to 131° F (10° to 55° C)
Operating
Temperature – Storage
–22° to 140° F (–30° to 60° C)
Relative Humidity –
20% to 80%
Operating
Compliances
FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024‐
1998 STD, Taiwan BSMI CNS13438, Korea MIC
Intel I210‐T1 Single Port Gigabit
Ethernet Adapter
Intel I350‐T2 Dual Port Gigabit
Ethernet Adapter
Intel I350‐T4 Quad Port Gigabit
Ethernet Adapter
Cable Medium
Copper
Copper
Copper
Cabling Type
RJ‐45 Category‐5, up to 100 m
Cat 5 up to 100m
Cat 5 up to 100m
Bracket Height
Low Profile and Full Height
Low Profile and Full Height
Low Profile and Full Height
TDP
1W
4.4W
5W
# of Ports
Single
Dual
Quad
System Interface Type
PCIe 2.1(2.5GT/s)
PCIe v2.1 (5.0GT/s)
PCIe v2.1 (5.0GT/s)
http://thinkstation-specs.com/thinkstation-p910/
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8/31/2017
Thinkstation-specs » ThinkStation P910
Intel® Virtualization
Technology for
Connectivity (VT‐c)
Yes
Yes
Speed & Slot Width
2.5 GT/s, x1 Lane
5 GT/s, x4 Lane
5 GT/s, x4 Lane
Controller
Intel I210
Intel I350
Intel I350
iWARP/RDMA
No
No
No
Intel® Ethernet Power
Management
Yes
Yes
Yes
Intel® Data Direct I/O
Technology
No
Intelligent Offloads
Yes
Yes
Yes
iSCSI, NFS
iSCSI, NFS
Storage Over Ethernet
On‐chip QoS and Traffic
Management
No
Yes
Yes
Flexible Port
Partitioning
No
Yes
Yes
Virtual Machine Device
Queues (VMDq)
No
Yes
Yes
PCI‐SIG* SR‐IOV Capable
No
Yes
Yes
http://thinkstation-specs.com/thinkstation-p910/
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