Agilent Technologies | Medalist x6000 | Agilent Medalist x6000 Automated X

Agilent Medalist x6000
Automated X-ray Inspection (AXI)
ata Sheet
Industry-Leading 3D Inspection
Throughput Delivers Reduced
Conversion Costs, Reduced
Capital Expenditure and
High Defect Coverage
• The Agilent Medalist x6000 AXI
system offers extensive simultaneous 3D X-ray inspection of
double-sided panels at throughput
rates that match most line rates of
medium to high complexity printed
circuit board assemblies (PCBA).
• Provides uncompromised 3D
inspection for maximum fault
detection up to 95% of all manufacturing defects.
• Designed for in-line or off-line
automated X-ray process testing
of lead or lead-free solder joints
on PCBAs, with user configurable
pass-thru or pass-back loading.
• Enables successful implementations through an easy-to-learn
and easy-to-use development
environment providing faster
time-to-market with high
quality results.
• Digital cross-sectional X-ray images
of solder joints are automatically
generated and analyzed. The
dynamic analysis measures joint
characteristics and compares
results against both learned and
user defined thresholds.
Key System Parameters
Total panel
test cycle time1
Minimum feature
detection capability
Maximum image acquisition rate
32.3 cm2/sec (5 in2/sec)
Typical image acquisition rate2
25.8 cm2/sec (4 in2/sec)
Positioning, alignment and automatic
system adjustments3
20 sec
Joint pitch4
0.3 mm & up (0.012 in & up)
Solder thickness
0.045 mm (0.0018 in)
0.0127 mm (0.0005 in)
1 This is an estimate of time from one panel load to when the system is ready to load the next panel.
Panels above 17 inches (43.1 cm) long require repositioning and realignment.
2 Image acquisition rate is dependent on component’s opacity.
3 Panel setup contains all panel movement for load, unload, X-ray barrier control, mechanical positioning
and compensation, automatic system adjustments, and panel alignment. Alignment time is dependent on
the size of the panel. Left to right pass through mode.
4 Assuming pad width is 50% of pitch.
5 The reported values for minimum feature detection assume that the feature is in a single plane of focus
and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than
those found in a typical multi-layer printed circuit board.
Defect detection capability
Test development environment
All typical components found
in manufacturing of electronic
PCBAs, such as:
User Interface
Microsoft® Windows®-based software solution used to define
system and panel setups, perform verification and editing of CAD,
setup tests and thresholds, and execute test programs.
• ≥ 0.4 mm Ball Grid Array (BGA)
Off-line test
development software
Optional off-line test development software enabling
application development on an off-line PC
CAMCAD Professional
Optional software available to translate CAD data to Agilent’s format.
Contains integrated input filters for industry leading CAD systems.
Typical test
development time
• Less than 30 minutes to translate and verify CAD data
(using CAMCAD Professional)
• 4 hours to 1.5 days to develop application
Multiple levels of
login privilege
• Column Grid Array (CGA)
• Ball Grid Array (BGA) – non-collapsible
and collapsible
• Chip Scale Package (CSP)
Medalist x6000
• ≥ 0201 Chip: capacitor, resistor
• Polarized capacitors
• SMT connector and sockets
• Direct FET
System administrator
• Fine pitch and standard gullwing
• JLead
Line integration
• Leadless Chip Carrier (LCC)
Configurable board flow
• Right or left flow-through
• Right or left pass-back
• Automatic panel width adjustment for fast line changeover
• Quad-Flatpack No Lead (QFN)
Transport heights
Transport height levels between 823 mm – 980 mm (32.4 in – 38.6 in)
• Small Outline Transistor (SOT)
Line communication
Bar code readers
Compatible with most industry standard manual
or automatic bar code readers
• Metal Electrical Face (Melf)
• Plated Through-hole (PTH)
• Heat sinks
Defects detected
• Shorts
• Opens
• Missing component
System controller
Integrated controller with Dual Core Intel® Xeon® processors
• Non-wetting
Operating system
Microsoft® Windows® XP Professional
• Billboards
Data communication
USB, RS-232, 10/100/1000 Ethernet
Data storage devices
System footprint
1.52 m x 1.93 m (60 in x 76 in)
• Void (BGA, Paste)
Integrated monitor
and keyboard tray
either sitting or standing positions
• Insufficient solder
Total system weight
3220 kg (7100 lb)
• Reversed tantalum capacitor
Average system floor
loading weight/
service area
371 kg/sqm (76 lb/sq ft)
Concentrated loads
805 kg (1775 lb) on 152 mm (6 in) diameter pad,
4 pads on 131 cm (52 in) x 110 cm (43 in) centers
• Tombstones
• Lifted leads
• Solderball
• Excess solder
1 Not all defects are applicable to all
types of component solder joints.
Configurable for left or right of system. Adjustable for
Test reporting and repair
Test result reports
Medalist Quality Tool provides powerful pre-configurable views,
context-sensitive drill-downs, PC-based charting, and straightforward
export to Microsoft®Excel®.
Repair tools
Medalist Repair Tool provides an intuitive, graphical interface
enabling operators to quickly locate and validate a given defect call.
Allowable panel characteristics
Panel size
(width x length)1
Minimum 3
Aspect ratio
Maximum panel
inspectable area
457 mm x 609 mm (18.0 in x 24.0 in)
102 mm x 127 mm (4.0 in x 5.0 in)
Length ≥ 0.5 x panel width
445 mm x 609 mm (17.5 in x 24 in)
Panel thickness
3.2 mm (0.125 in)
0.5 mm (0.020 in)
Panel clearance
Top clearance5
Bottom clearance5
Panel edge clearance
Panel width tolerance
25.0 mm (1.0 in)
50.0 mm (2.0 in)
3.0 mm (0.118 in) on parallel edges of the panel
±0.7 mm (0.0275 in)
Panel weight2
4.5 kg (10.0 lb)
0.03 kg (0.066 lb)
Maximum acceptable 40ºC (104ºF)
panel temperatures
(at time of load)
Panel warp
(after reflow and
wave soldering)
Warp of less than 1% per unit of linear measurement.
Maximum downside panel warp cannot exceed 2.0 mm (0.08 in).
Maximum upside panel warp cannot exceed 1.0 mm (0.04 in).
Maximum number
of PCBs per panel
No restriction
1 Panels are handled on width edges. Panels with edge cut outs may require the use of a carrier.
2 Maximum panel size dimensions and weight must include carrier if applicable.
3 Smaller panels are possible with the use of panel carriers. A carrier can only have one panel.
4 With panels of this thickness, imaging results can be affected by PCBA layout.
5 Measured from the bottom of the panel including a maximum warp.
Power and environmental
Voltage requirements 200-240 VAC three phase; 380-415 VAC three phase wye (±5%)
(50 Hz or 60 Hz)
Total harmonic
distortion (THD)
THD <5%, single harmonic <3%
Ground to
neutral voltage
Voltage <1 VRMS
Momentary voltage
Interruptions, defined as: voltage drop on one or more phase
conductors below 180 VAC for greater than 10 ms
Primary power rating 2.8 kVA
Maximum inrush
58 amps RMS
Circuit breaker rating 10,000 amps interrupting capacity (AIC) for voltages up to 240 VAC,
14,000 AIC for voltages greater than 240 VAC
Wiring requirements Reference the Agilent Medalist x6000 Installation Guide for hookup
wiring configurations, full load amperes, circuit breaker size/#
poles and conductor size
Note: local electrical wiring codes take precedence
Air requirements
552 kPa (80 psi) compressed air
16-30ºC, 60-86ºF
Humidity requirements Relative humidity 20-60%
The system is designed to prevent
electrical, mechanical, or radiation
hazards to the operator. The
system is fully certified to meet
all U.S. Federal specifications
regarding the use of cabinet X-ray
systems in an industrial environment. All design requirements
meet or exceed 21 CFR 1020.40,
subchapter J. The system meets
the applicable international
government radiation emission
standards (including German
and Japanese standards).
Safety interlocks
Redundant safety interlocks are
used to eliminate the possibility
of accidental X-ray exposure or
physical harm.
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Revised: October 24, 2007
Product specifications and descriptions in this document subject to change
without notice.
© Agilent Technologies, Inc. 2008
March 13, 2008
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