Intel® Desktop Board DB65AL Technical Product Specification

Intel® Desktop Board

DB65AL

Technical Product Specification

October 2012

Part Number: G15478-003

The Intel

®

Desktop Board DB65AL may contain design defects or errors known as errata that may cause the product to deviate from published specifications.

Current characterized errata are documented in the Intel Desktop Board DB65AL Specification Update.

ii

Revision History

Revision

-001

-002

-003


First release of the Intel

®

Desktop Board DB65AL Technical Product

Specification

Second release of the Intel

®

Specification

Desktop Board DB65AL Technical Product

Specification clarification

Date

February 2010

May 2011

October 2012

This product specification applies to only the standard Intel

®

Desktop Board DB65AL with BIOS identifier ALB6510H.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

®

PRODUCTS. NO LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS

GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR

SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR

IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR

WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR

INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS

OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED

FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION

WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel

®

desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by

Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel, Intel Core, and Pentium are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Copyright  2010-2012 Intel Corporation. All rights reserved.

Board Identification Information

Basic Desktop Board DB65AL Identification Information

AA Revision BIOS Revision

G12530-302

G12530-303

G12530-305

G12530-306

ALB6510H.86A.0033

ALB6510H.86A.0033

ALB6510H.86A.0041

ALB6510H.86A.0041

Notes

1,2

1,2

1,2

1,2

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The B65 chipset used on this AA revision consists of the following component:

Device Stepping S-Spec Numbers

B2 SLH98 82B65 Platform Controller

Hub (PCH)

82B65 Platform Controller

Hub (PCH)

B3 SLJ4A

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel

®

Desktop Board DB65AL.

Specification Changes or Clarifications

Date

May 2011

October 2012

Type of Change Description of Change or Clarification

Spec Clarifications

Spec Clarification

• The Intel B65 Express Chipset does not support RAID.

The following sections of this manual have been updated:

― Reference to RAID in Table 1. Feature Summary has

been deleted

― Section 1.9.1.1 Serial ATA RAID has been deleted

― Section 1.9.1.2 Intel

® been deleted

Rapid Recover Technology has

― The Caution in Section 3.7 Hard Disk Drive Password

Security Feature has been deleted

• The Korean Certification mark has changed. The following sections of this manual have been updated:

― Section 5.1.4 EMC Regulations. The Korean Class B

Statement translation has been updated.

― Section 5.1.6 Regulatory Compliance Marks (Board

Level). The new Korean Certification mark has been

added.

•

Updated Table 31. Environmental Specifications to

address operating temperature requirements for the board.

•

Updated Section 1.7.1.2 Digital Visual Interface (DVI-D)

to correct maximum supported resolution

•

Updated Section 1.11.2.2 S/PDIF Header

iii

Errata

Current characterized errata, if any, are documented in a separate Specification

Update. See http://developer.intel.com/products/desktop/motherboard/index.htm

for the latest documentation. iv

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the

Intel

®

Desktop Board DB65AL.

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop

Board DB65AL and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the Intel Desktop Board DB65AL

2

3

A map of the resources of the Intel Desktop Board

The features supported by the BIOS Setup program

4

5

A description of the BIOS error messages, beep codes, and POST codes

Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

v

Intel Desktop Board DB65AL Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

GB

GB/s

Gigabyte (1,073,741,824 bytes)

Gigabytes per second

Gb/s

KB

Kbit kbits/s

MB

MB/s

Mbit

Mbits/s xxh x.x V

*

Gigabits per second

Kilobyte (1024 bytes)

Kilobit (1024 bits)

1000 bits per second

Megabyte (1,048,576 bytes)

Megabytes per second

Megabit (1,048,576 bits)

Megabits per second

An address or data value ending with a lowercase h indicates a hexadecimal value.

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their respective owners. vi

Contents


Board Identification Information .................................................................. iii

Specification Changes or Clarifications .......................................................... iii

Errata ......................................................................................................iv

Preface

Intended Audience ..................................................................................... v

What This Document Contains ..................................................................... v

Typographical Conventions ......................................................................... v

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Legacy Considerations ....................................................................... 16

1.3 Online Support ................................................................................. 16

1.4 Processor ........................................................................................ 16

1.5 Intel

®

B65 Express Chipset ................................................................ 17

1.6 System Memory ............................................................................... 17

1.6.1 Memory Configurations .......................................................... 18

1.7 Graphics Subsystem ......................................................................... 20

1.7.1 Integrated Graphics ............................................................... 20

1.7.2 PCI Express x16 Graphics ....................................................... 20

1.8 USB ................................................................................................ 21

1.9 SATA Interfaces ............................................................................... 21

1.10 Legacy I/O Controller ........................................................................ 22

1.10.1 Serial Port ............................................................................ 22

1.11 Audio Subsystem .............................................................................. 23

1.11.1 Audio Subsystem Software ..................................................... 23

1.11.2 Audio Headers and Connectors ................................................ 23

1.12 LAN Subsystem ................................................................................ 25

1.12.1 Intel

®

82579V Gigabit Ethernet Controller ................................ 25

1.12.2 LAN Subsystem Software ....................................................... 25

1.12.3 RJ-45 LAN Connector with Integrated LEDs .............................. 26

1.13 Real-Time Clock Subsystem ............................................................... 27

1.14 Thermal Monitoring ........................................................................... 28

1.15 Platform Management and Security ..................................................... 29

1.15.1 Hardware Management Subsystem .......................................... 29

1.15.2 Hardware Monitoring ............................................................. 29

vii


1.16 Intel Standard Manageability Technology ............................................. 30

1.16.1 Intel Standard Manageability Features ..................................... 30

1.16.2 Intel

®

Active Management Technology Software and Drivers ....... 32

1.17 Power Management .......................................................................... 32

1.17.1 ACPI .................................................................................... 33

1.17.2 Hardware Support ................................................................. 36

2 Technical Reference

2.1 Memory Resources ........................................................................... 41

2.1.1 Addressable Memory ............................................................. 41

2.1.2 Memory Map ......................................................................... 43

2.2 Connectors and Headers .................................................................... 43

2.2.1 Back Panel Connectors ........................................................... 44

2.2.2 Component-side Connectors and Headers................................. 45

2.3 BIOS Configuration Jumper Block ....................................................... 54

2.4 Intel

®

Management Engine BIOS Extension (Intel

®

MEBX) Reset Header . 56

2.5 Mechanical Considerations ................................................................. 57

2.5.1 Form Factor .......................................................................... 57

2.6 Electrical Considerations .................................................................... 58

2.6.1 Power Supply Considerations .................................................. 58

2.6.2 Fan Header Current Capability ................................................ 59

2.6.3 Add-in Board Considerations ................................................... 59

2.7 Thermal Considerations ..................................................................... 60

2.8 Reliability......................................................................................... 62

2.9 Environmental .................................................................................. 62

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 63

3.2 System Management BIOS (SMBIOS) ................................................. 65

3.3 Legacy USB Support ......................................................................... 65

3.4 BIOS Updates .................................................................................. 66

3.4.1 Language Support ................................................................. 66

3.4.2 Custom Splash Screen ........................................................... 67

3.5 BIOS Recovery ................................................................................. 67

3.6 Boot Options .................................................................................... 68

3.6.1 Optical Drive Boot ................................................................. 68

3.6.2 Network Boot ........................................................................ 68

3.6.3 Booting Without Attached Devices ........................................... 68

3.6.4 Changing the Default Boot Device During POST ......................... 68

3.7 Hard Disk Drive Password Security Feature .......................................... 69

3.8 BIOS Security Features ..................................................................... 70

viii

Contents

4 Error Messages and Beep Codes

4.1 Speaker .......................................................................................... 73

4.2 BIOS Beep Codes ............................................................................. 73

4.3 Front-panel Power LED Blink Codes ..................................................... 74

4.4 BIOS Error Messages ........................................................................ 74

4.5 Port 80h POST Codes ........................................................................ 75

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 81

5.1.1 Safety Standards................................................................... 81

5.1.2 European Union Declaration of Conformity Statement ................ 82

5.1.3 Product Ecology Statements ................................................... 83

5.1.4 EMC Regulations ................................................................... 85

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 88

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 89

5.2 Battery Disposal Information .............................................................. 90

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. Memory Channel and DIMM Configuration ............................................ 19

4. Back Panel Audio Connector Options ................................................... 24

5. LAN Connector LED Locations ............................................................. 26

6. Thermal Sensors and Fan Headers ...................................................... 28

7. Location of the Standby Power LED (Green) ......................................... 39

8. Detailed System Memory Address Map ................................................ 42

9. Back Panel Connectors ...................................................................... 44

10. Component-side Connectors and Headers ............................................ 45

11. Connection Diagram for Front Panel Header ......................................... 51

12. Connection Diagram for Front Panel USB Headers ................................. 53

13. Location of the Jumper Block ............................................................. 54

14. Intel MEBX Reset Header ................................................................... 56

15. Board Dimensions ............................................................................. 57

16. Localized High Temperature Zones ..................................................... 61

Tables

1. Feature Summary ............................................................................. 11

2. Components Shown in Figure 1 .......................................................... 14

3. Supported Memory Configurations ...................................................... 18

4. LAN Connector LED States ................................................................. 26

5. Effects of Pressing the Power Switch ................................................... 33

6. Power States and Targeted System Power ........................................... 34

7. Wake-up Devices and Events ............................................................. 35

8. System Memory Map ........................................................................ 43

ix


9. Component-side Connectors and Headers Shown in Figure 10 ................ 46

10. Serial Port Header ............................................................................ 47

11. S/PDIF Header ................................................................................. 47

12. Internal Mono Speaker Header ........................................................... 47

13. Front Panel Audio Header for Intel HD Audio ........................................ 47

14. Front Panel Audio Header for AC ’97 Audio ........................................... 48

15. Front Panel USB Header .................................................................... 48

16. SATA Connectors .............................................................................. 48

17. Chassis Intrusion Header ................................................................... 48

18. Processor (4-Pin) Fan Header ............................................................. 49

19. Front and Rear Chassis Fan Headers ................................................... 49

20.

Intel FCFH Header ............................................................................ 49

21. Processor Core Power Connector ........................................................ 50

22. Main Power Connector ....................................................................... 50

23. Front Panel Header ........................................................................... 51

24. States for a One-Color Power LED ....................................................... 52

25. Alternate Front Panel Power LED Header.............................................. 52

26. BIOS Setup Configuration Jumper Settings .......................................... 55

27. Intel MEBX Reset Header Signals ........................................................ 56

28. Recommended Power Supply Current Values ........................................ 58

29. Fan Header Current Capability ............................................................ 59

30. Thermal Considerations for Components .............................................. 61

31. Environmental Specifications .............................................................. 62

32. BIOS Setup Program Menu Bar ........................................................... 64

33. BIOS Setup Program Function Keys .................................................... 64

34. AcceptableDrives/Media Types for BIOS Recovery ................................. 67

35. Boot Device Menu Options ................................................................. 68

36. Master Key and User Hard Drive Password Functions ............................ 69

37. Supervisor and User Password Functions ............................................. 71

38. BIOS Beep Codes ............................................................................. 73

39. Front-panel Power LED Blink Codes ..................................................... 74

40. BIOS Error Messages ........................................................................ 74

41. Port 80h POST Code Ranges .............................................................. 75

42. Port 80h POST Codes ........................................................................ 76

43. Typical Port 80h POST Sequence ........................................................ 80

44. Safety Standards .............................................................................. 81

45. EMC Regulations ............................................................................... 85

46. Regulatory Compliance Marks ............................................................ 89

x

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor

Processor

Chipset

Memory

Graphics

Audio

MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by

243.84 millimeters])

•

Intel

®

Core™ i7, Intel

®

Core™ i5, Intel

®

Core™ i3, and Intel

®

Pentium

® processors in an LGA1155 socket with up to 95 W TDP:

― Integrated graphics processing (processors with Intel

®

Technology)

Graphics

― External graphics interface controller

― Integrated memory controller

Intel

®

B65 Express Chipset consisting of the Intel

Hub (PCH)

®

B65 Platform Controller

• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

•

Support for up to 32 GB of system memory with four DIMMs using 4 Gb memory technology

• Support for non-ECC memory

• Integrated graphics support for processors with Intel

®

Graphics Technology:

― VGA

― DVI-D

• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card

• Intel

®

High Definition Audio:

― Realtek* ALC888S audio codec

― S/PDIF audio header

― Front panel audio header

― Mono speaker header continued

11


Table 1. Feature Summary (continued)

Peripheral

Interfaces

•

Twelve USB ports:

― Six USB 2.0 ports are implemented with stacked back panel connectors (black)

― Six USB 2.0 front panel ports are implemented through three dual-port internal headers

•

Six SATA interfaces through the Intel B65 Express Chipset:

― One internal SATA 6 Gb/s port (blue)

― Three internal SATA 3 Gb/s ports (black)

― Two internal eSATA 3 Gb/s ports (red)

•

One serial port header

•

One PS/2* keyboard/mouse port on back panel

Legacy I/O Control • Nuvoton* W83677HG-i Super I/O controller for hardware management and serial port, and PS/2 support

BIOS

•

Intel

®

BIOS resident in the SPI Flash device

•

Support for Advanced Configuration and Power Interface (ACPI), Plug and

Play, and SMBIOS

Instantly Available

PC Technology

• Support for PCI* Local Bus Specification Revision 2.2

• Support for PCI Express*

•

Suspend to RAM support

•

Wake on Conventional PCI, PCI Express, LAN, front panel, serial, PS/2, and

USB ports

LAN Support

Expansion

Capabilities

Hardware Monitor

Subsystem

Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel

®

Ethernet Controller

82579V Gigabit

•

One PCI Express 2.0 x16 add-in card connector

•


•


•

One Conventional PCI bus connector

•

Hardware monitoring through the Nuvoton Super I/O controller

•

Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• Three fan headers

• Three fan sense inputs used to monitor fan activity

• Fan speed control

12

Product Description

1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DB65AL.

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

13


Z

AA

BB

CC

DD

EE

Table 2. Components Shown in Figure 1

R

S

T

N

O

P

Q

U

V

W

X

Y

K

L

M

I

J

G

H

C

D

E

F

Item/callout

from Figure 1

A

B

Description

Conventional PCI bus add-in card connector

Front panel audio header

PCI Express x4 add-in card connector

Internal mono speaker header



Back panel connectors

12 V internal power connector (ATX12V)

LGA1155 processor socket

Processor fan header

DIMM 3 (Channel A DIMM 0)

DIMM 1 (Channel A DIMM 1)

DIMM 4 (Channel B DIMM 0)

DIMM 2 (Channel B DIMM 1)

Serial port header

Battery

Chassis intrusion header

Front chassis fan header

Main power connector (2 x 12)

Standby power LED

Piezoelectric speaker

Intel B65 Express Chipset

Alternate front panel power LED header

Front panel header

SATA connectors (one 6 Gb/s SATA port (blue), three 3 Gb/s SATA ports (black), and two 3 Gb/s eSATA ports (red))

Intel

®

Management Engine BIOS Extension (Intel

®

MEBX) Reset header

BIOS setup configuration jumper block

Intel Fast Call for Help (Intel FCFH) header

Front panel USB headers (4)

S/PDIF header

Rear chassis fan header

14


1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Figure 2. Block Diagram

15


1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:

• No Parallel ATA (PATA) IDE drive connector

•

No parallel port connector on the back panel

•

No diskette drive connector

1.3 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Board DB65AL

Desktop Board Support

Available configurations for the Intel

Desktop Board DB65AL

Supported processors

Chipset information

BIOS and driver updates http://www.intel.com/products/motherboard/index.htm

http://www.intel.com/p/en_US/support?iid=hdr+support http://ark.intel.com http://processormatch.intel.com

http://www.intel.com/products/desktop/chipsets/index.htm

http://downloadcenter.intel.com

Tested memory

Integration information http://www.intel.com/support/motherboards/desktop/sb/CS-

025414.htm

http://www.intel.com/support/go/buildit

1.4 Processor

The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, and

Intel Pentium processors in an LGA1155 socket.

Other processors may be supported in the future. This board is designed to support processors with a maximum TDP of 95 W. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about…

Supported processors

Refer to:

http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

NOTE

This board has specific requirements for providing power to the processor. Refer to

Section 2.6.1 on page 58 for information on power supply requirements for this board.

16


1.5 Intel

®

B65 Express Chipset

The Intel B65 Express Chipset consisting of the Intel B65 Platform Controller Hub

(PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network, display, Conventional PCI, and PCI Express. The PCH is a centralized controller for the board’s I/O paths.

For information about

The Intel B65 Express chipset

Resources used by the chipset

Refer to

http://www.intel.com/products/desktop/chipsets/index.htm

Chapter 2

1.6 System Memory

The board has four DIMM sockets and supports the following memory features:

• Two independent memory channels with interleaved mode support

•

Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8 organization

•

32 GB maximum total system memory (with 4 Gb memory technology). Refer to

Section 2.1.1 on page 41 for information on the total amount of addressable

memory.

•

Minimum total system memory: 1 GB using 1 Gb x8 module

• Serial Presence Detect

•

DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

17


Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

DIMM

Capacity

512 MB

1024 MB

1024 MB

2048 MB

Configuration

(Note)

SS

SS

SS

DS

SDRAM

Density

1 Gbit

1 Gbit

2 Gbit

1 Gbit

SDRAM Organization

Front-side/Back-side

64 M x16/empty

128 M x8/empty

128 M x16/empty

128 M x8/128 M x8

Number of SDRAM

Devices

4

8

4

16

2048 MB

4096 MB

4096 MB

8192 MB

SS

DS

SS

DS

2 Gbit

2 Gbit

4 Gbit

4 Gbit

128 M x16/empty

256 M x8/256 M x8

512 M x8/empty

512 M x8/512 M x8

8

16

8

16

Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM).

For information about…

Tested Memory

Refer to:

http://support.intel.com/support/motherboards/desktop/sb/CS-

025414.htm

1.6.1 Memory Configurations

The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors support the following types of memory organization:

•

Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

•

Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.

For information about… Refer to:

Memory Configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

18

Figure 3 illustrates the memory channel and DIMM configuration.


Figure 3. Memory Channel and DIMM Configuration

19


1.7 Graphics Subsystem

The board supports system graphics through either Intel Graphics Technology or a

PCI Express 2.0 x16 add-in graphics card.

1.7.1 Integrated Graphics

The board supports integrated graphics through the Intel

®

(Intel

®

Flexible Display Interface

FDI) for processors with Intel Graphics Technology.

1.7.1.1 Analog Display (VGA)

The VGA port supports analog displays. The maximum supported resolution is 2048 x

1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a monitor is attached, regardless of the DVI-D connector status.

1.7.1.2 Digital Visual Interface (DVI-D)

The DVI-D port supports only digital DVI displays. The maximum supported resolution is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI-D port is compliant with the

DVI 1.0 specification.

1.7.2 PCI Express x16 Graphics

The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an

LGA1155 socket support discrete add in graphics cards through the PCI Express 2.0 x16 graphics connector:

• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is

8 GB/s in each direction, simultaneously, when operating in x16 mode.

• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is

4 GB/s in each direction, simultaneously, when operating in x16 mode.

For information about Refer to

PCI Express technology http://www.pcisig.com

20


1.8 USB

The board supports up to 12 USB 2.0 ports. The Intel B65 Express Chipset provides the USB controller for the 2.0 ports. The port arrangement is as follows:

• Six USB 2.0 ports are implemented with stacked back panel connectors

•

Six USB 2.0 front panel ports implemented through three internal headers

All 12 USB ports are high-speed, full-speed, and low-speed capable.

NOTES

Computer systems that have an unshielded cable attached to a USB port may not meet

FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.


The location of the USB connectors on the back panel

The location of the front panel USB headers

Refer to

Figure 9, page 44

Figure 10, page 45

1.9 SATA Interfaces

The board provides six SATA connectors through the PCH, which support one device per connector:

•

One internal SATA 6 Gb/s port (blue)

•

Three internal SATA 3 Gb/s ports (black)

• Two internal eSATA 3 Gb/s ports for external connectivity (red)

The PCH provides independent SATA ports with a theoretical maximum transfer rate of

6 Gb/s for one port and 3 Gb/s for five ports. A point-to-point interface is used for host to device connections.

The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE

I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI

Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP, Windows Vista*, and Windows 7* operating systems.

For more information, see: http://www.serialata.org/ .


The location of the SATA connectors

Refer to

Figure 10, page 45

21


1.10 Legacy I/O Controller

The Legacy I/O Controller provides the following features:

•

One serial port

•

PS/2-style keyboard/mouse interface on the back panel

•

Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems

•

Intelligent power management, including a programmable wake-up event interface

•

PCI Conventional bus power management support

The BIOS Setup program provides configuration options for the Legacy I/O controller.

1.10.1 Serial Port

The serial port is implemented as a 10-pin header on the board. The serial port supports data transfers at speeds up to 115.2 kbits/s with BIOS support.


The location of the serial port header

Figure 10, page 45

22


1.11 Audio Subsystem

The board supports Intel High Definition Audio through the Realtek ALC888S audio codec interface.

The Realtek ALC888S-based audio subsystem supports the following features:

•

8-channel audio with independent multi-streaming stereo.

•

Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.

• Stereo input and output through back panel jacks

•

Headphone and Mic in functions for front panel audio jacks

•

S/PDIF audio header

•

A signal-to-noise (S/N) ratio of 90 dB

1.11.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.


Obtaining audio software and drivers

Refer to

Section 1.3, page 16

1.11.2 Audio Headers and Connectors

The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include the following:

• Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals for front panel audio connectors) (yellow)

• S/PDIF audio header (1 x 4-pin header) (yellow)

• Internal mono speaker header (1 x 2-pin header) (yellow)


The locations of the front panel audio header, S/PDIF header, and internal mono speaker header

The signal names of the front panel audio header

The signal names of the S/PDIF header

The signal names of the internal mono speaker header

The back panel audio connectors

Refer to

Figure 10, page 45

Table 13 and Table 14, page 47

Table 11, page 47

Table 12, page 47

Section 2.2.1, page 44

23


1.11.2.1 Analog Audio Connectors

The available configurable back panel audio connectors are shown in Figure 4.

Item Description

A Audio line in

B

C

Audio line out

Mic in

Figure 4. Back Panel Audio Connector Options

The back panel audio connectors are configurable through the audio device drivers.


The back panel audio connectors

Refer to

Section 2.2.1, page 44

The front panel headphone output is supported using a separate audio channel pair allowing multi-streaming audio configurations such as simultaneous 5.1 surround playback and stereo audio conferencing (through back panel speakers and a front panel headset, respectively).

1.11.2.2 S/PDIF Header

The S/PDIF header allows connections to optical dongles for digital audio output.

1.11.2.3 Internal Mono Speaker Header

The internal mono speaker header allows connection to an internal, low-power speaker for basic system sound capability. The subsystem is capable of driving a speaker load of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).

24


1.12 LAN Subsystem

The LAN subsystem consists of the following:

•

Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s)

•

RJ-45 LAN connector with integrated status LEDs


Obtaining LAN software and drivers

Refer to


1.12.1 Intel

®

82579V Gigabit Ethernet Controller

The Intel 82579V Gigabit Ethernet Controller supports the following features:

•

10/100/1000 BASE-T IEEE 802.3 compliant

•

PCI Express link

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

•

Transmit TCP segmentation

•

Full device driver compatibility

•

PCI Express power management support

1.12.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.


Obtaining LAN software and drivers

Refer to


25


1.12.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).


A

B

Link/Activity LED (green)

Link Speed LED (green/yellow)

Figure 5. LAN Connector LED Locations

Table 4 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 4. LAN Connector LED States

LED

Link/Activity

Link Speed

LED Color

Green

Green/Yellow

LED State

Off

On

Blinking

Off

Green

Yellow

Condition

LAN link is not established.

LAN link is established.

LAN activity is occurring.

10 Mbits/s data rate is selected or negotiated.



26


1.13 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery.

The clock is accurate to ± 13 minutes/year at 25 ºC with power applied through the power supply 5V STBY rail.

NOTE

If the battery and AC power fail date and time values will be reset and the user will be notified during POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the

battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

27


1.14 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.

28


A

B

C

D

Thermal diode, located on processor die




Figure 6. Thermal Sensors and Fan Headers


1.15 Platform Management and Security

In addition to Intel AMT the Intel DB65AL Desktop Board integrates several functions designed to manage the system and lower the total cost of ownership (TCO) of the system. These system management functions are designed to report errors, diagnose the system, and recover from system lockups without the aid of an external microcontroller.

1.15.1 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

•

Fan monitoring and control

•

Thermal and voltage monitoring

•

Chassis intrusion detection

1.15.2 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Nuvoton

W83677HG-i device, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

•

Power monitoring of +12 V, +5 V, +3.3 V, V_SM, and +VCCP

•

SMBus interface

1.15.2.1 Fan Monitoring

Fan monitoring can be observed through the BIOS setup user interface, Intel

Utilities or third-party software.

®

Desktop


The functions of the fan headers

Section 1.17.2.2, page 37

1.15.2.2 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.


The location of the chassis intrusion header

Refer to

Figure 10, page 45

29


1.16 Intel Standard Manageability Technology

Intel offers IT organizations tamper-resistant and persistent management capabilities.

Specifically, Intel Standard Manageability is a hardware-based solution that uses out of band communication to manage access to client systems in addition to offering encrypted and persistent asset management and remote diagnostics and/or recovery capabilities for networked platforms. With Intel manageability, IT organizations can easily get accurate platform information, and can perform remote updating, diagnostics, debugging and repair of a system, regardless of the state of the operating system or the power state of the system.

The Intel manageability subsystem consists of:

•

ARC4 micro-controller embedded in the Intel B65 PCH

•

Intel 82579V Gigabit (10/100/1000 Mbits/sec) Ethernet LAN controller

• BIOS/SPI Flash (64 Mbits)

NOTE

Software with manageability capability is required to take advantage of Intel platform management capabilities.

1.16.1 Intel Standard Manageability Features

The key features of Intel manageability include:

• Secure Out of Band (OOB) system management that allows remote management of

PCs regardless of system power or operating system state.



SSL 3.1/TLS encryption

 HTTP authentication



TCP/IP



HTTP web GUI

 XML/SOAP API



Web Services for Management (WS-MAN) protocol support

•

Remote troubleshooting and recovery that can significantly reduce desk-side visits and potentially increasing efficiency of IT technical staff.

 Intel Fast Call for Help



System event log



IDE Redirection (IDE-R) or PXE boot: remote CD or network drive boot

 Serial over LAN



OOB diagnostics



Remote control

 Operating system repair

30


• Proactive alerting that decreases downtime and minimizes time to repair.

 Programmable policies

 Operating system lock-up alert



Boot failure alert



Hardware failure alerts

•

Third party non-volatile storage that prevents users from removing critical inventory, remote control, or virus protection agents.

 Nonvolatile storage for agents

 Tamper-resistant

• Remote hardware and software asset tracking that eliminates time-consuming manual inventory tracking, which also reduces asset accounting costs.



E-Asset Tag

 HW/SW inventory

• System Defense 2 - In addition to the in-bound and out-bound packet filtering of the previous generation, System Defense 2 is an Intel manageability feature that uses advanced heuristics to help protect against the propagation of worms through the use of preset packet filters. The number of new connections made to a specific port or IP address are counted over a specific time window. If a preset threshold is exceeded, it will alert the Management Console and suspend the client’s network activity until the system can be remediated.

•

Remote Configuration or Zero Touch Configuration (ZTC) minimizes the cost to deploy Intel manageability by eliminating the need for IT personnel to touch each client system prior to configuration. ZTC consists of a single OEM BIOS/Firmware image that provides the Intel manageability client with information to authenticate connections and allows it to remotely perform a secure setup procedure. IT departments must acquire an appropriate Intel Standard Manageability Technology

-trusted certificate as well as use a remote management application that supports ZTC.

31


1.16.1.1 Intel

®

Fast Call for Help

Intel Fast Call for Help allows platforms outside the enterprise firewall to trigger a connection to the Internet with a gateway enabled by Intel

®

vPro™ technology. The platform user presses a special button or key combination to initiate the platform connection to a remote gateway enabled with Intel vPro technology. Upon establishing a successful connection, a standardized event, such as a Platform Event Trap (PET) is propagated to the enterprise network to register the client, either in the enterprise or in the remediation network.

1.16.2 Intel

®

Active Management Technology Software and Drivers

Intel AMT software and drivers are available from Intel’s World Wide Web site. The package consists of two separate drivers: one for the Intel MEI and one for Intel AMT.


Obtaining Intel AMT software and drivers


1.17 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

•

Hardware support:



Power connector



Fan headers



LAN wake capabilities



Instantly Available PC technology



Wake from USB

 Power Management Event signal (PME#) wake-up support

 PCI Express WAKE# signal support

 Wake from serial port



Wake from PS/2

32


1.17.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include:

•

Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives

•

Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state

•

A Soft-off feature that enables the operating system to power-off the computer

•

Support for multiple wake-up events (see Table 7 on page 35)

•

Support for a front panel power and sleep mode switch

Table 5 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 5. Effects of Pressing the Power Switch

If the system is in this state…

Off

(ACPI G2/G5 – Soft off)

On

(ACPI G0 – working state)

On


Sleep

(ACPI G1 – sleeping state)

Sleep


…and the power switch is pressed for

Less than four seconds


More than six seconds


More than six seconds

…the system enters this state

Power-on


Soft-off/Standby (note)


Fail safe power-off


Wake-up


Power-off


Note: System can only enter Standby state if power switch action is properly configured by the operating system.

33


1.17.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications.

Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 6 lists the power states supported by the board along with the associated system

power targets. See the ACPI specification for a complete description of the various system and power states.

Table 6. Power States and Targeted System Power

Global States

G0 – working state

G1 – sleeping state



G2/S5

Sleeping States

S0 – working

S1 – Processor stopped

S3 – Suspend to

RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

S5 – Soft off.

Context not saved.

Cold boot is required.

Processor

States Device States

C0 – working D0 – working state.

C1 – stop grant

D1, D2, D3 – device specification specific.

No power D3 – no power except for wake-up logic.

No power

No power

D3 – no power except for wake-up logic.

D3 – no power except for wake-up logic.

Targeted System

Power (Note 1)

Full power > 30 W

5 W < power < 52.5 W

Power < 5 W

Power < 5 W

Power < 5 W

(Note 2)

(Note 2)

(Note 2)

G3 – mechanical off

AC power is disconnected from the computer.

No power to the system.

No power D3 – no power for wake-up logic, except when provided by battery or external source.

No power to the system.

Service can be performed safely.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

34


1.17.1.2 Wake-up Devices and Events

Table 7 lists the devices or specific events that can wake the computer from specific

states.

Table 7. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state

Power switch S3, S4, S5

RTC alarm S3, S4, S5

LAN

USB

PME# signal

WAKE# signal

Serial port

PS/2

Notes:

• S4 implies operating system support only.

• USB ports are turned off during S4/S5 states.

S3, S4, S5

S3

S3, S4, S5

S3, S4, S5

S3

S3, S4, S5

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

35


1.17.2 Hardware Support

CAUTION

Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

The board provides several power management hardware features, including:

•

Power connector

•

Fan headers

•

LAN wake capabilities

•

Instantly Available PC technology

• Wake from USB

• PME# signal wake-up support

• WAKE# signal wake-up support

•

Wake from serial port

•

Wake from PS/2

•

+5 V Standby Power Indicator LED

LAN wake capabilities and Instantly Available PC technology require power from the

+5 V standby line.

NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.17.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.


The location of the main power connector

The signal names of the main power connector

Refer to

Figure 10, page 45

Table 22, page 50

36


1.17.2.2 Fan Headers

The function/operation of the fan headers is as follows:

•

The fans are on when the board is in the S0 state

•

The fans are off when the board is in the S3, S4, or S5 state

•

Each fan header is wired to a fan tachometer input of the hardware monitoring and fan control ASIC

•

All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed

• All fan headers have a +12 V DC connection

• 4-pin fan headers are controlled by Pulse Width Modulation

• The front fan and rear fan headers also support linear fan control on 3-wire fans


The location of the fan headers

The location of the fan headers and sensors for thermal monitoring

Figure 10, page 45

Figure 6, page 28

1.17.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network. The

LAN subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.

37


1.17.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-

RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off and the front panel power LED will behave as configured by the

BIOS “S3 State Indicator” option). When signaled by a wake-up device or event, the

system quickly returns to its last known wake state. Table 7 on page 35 lists the

devices and events that can wake the computer from the S3 state.

The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and

PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.

1.17.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB and is supported by the operating system.

1.17.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.17.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on a PCI Express add-in card is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.17.2.8 Wake from Serial Port

Serial port activity wakes the computer from an ACPI S3 state.

1.17.2.9 Wake from PS/2 Devices

PS/2 device activity wakes the computer from an ACPI S3, S4, or S5 state. However, when the computer is in an S4 or S5 state, the only PS/2 activity that will wake the computer is the alt-PrtScrn key combination on the keyboard.

38


1.17.2.10 +5 V Standby Power LED

The green +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the Standby

Power indicator LED on the board.

CAUTION

If AC power has been switched off and the standby power indicators are still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.

Figure 7. Location of the Standby Power LED (Green)

39


40

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 32 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM

(total system memory). On a system that has 32 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash device (64 Mbit)

• Local APIC (19 MB)

•

Direct Media Interface (40 MB)

•

Front side bus interrupts (17 MB)

•

PCI Express configuration space (256 MB)

•

PCH base address registers PCI Express ports (up to 256 MB)

•

Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI

Express add-in cards (256 MB)

The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

NOTE

32-bit operating systems may not be able to make use of physical memory higher than

4 GB. Check with your operating system vendor.

NOTE

32-bit operating systems may see less available memory than what is shown in

Section 2.1.1 due to CPU MTRR cache allocation.

41


42

Figure 8. Detailed System Memory Address Map

Technical Reference

2.1.2 Memory Map

Table 8 lists the system memory map.

Table 8. System Memory Map

Address Range

1024 K - 33550336 K

960 K - 1024 K

896 K - 960 K

800 K - 896 K

640 K - 800 K

639 K - 640 K

512 K - 639 K

0 K - 512 K

Address Range

100000 – 7FFC00000

F0000 - FFFFF

E0000 - EFFFF

C8000 - DFFFF

A0000 - C7FFF

9FC00 - 9FFFF

80000 - 9FBFF

00000 - 7FFFF

Size Description

32764 MB Extended memory

64 KB Runtime BIOS

64 KB

96 KB

160 KB

1 KB

127 KB

512 KB

Reserved

Potential available high DOS

Video memory and BIOS

Extended BIOS data (movable by

Conventional memory

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel and front panel USB, and PS/2.

The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board.

This section describes the board’s connectors. The connectors can be divided into these groups:

•

Back panel I/O connectors

•

Component-side I/O connectors and headers (see page 45)

43


2.2.1 Back Panel Connectors

Figure 9 shows the location of the back panel connectors for the board.


D

E

F

G

A

B

C

H

I

J

PS/2 keyboard/mouse connector

USB 2.0 ports

LAN

USB 2.0 ports

VGA connector

DVI-D connector

USB 2.0 ports

Audio line in

Audio line out

Mic in

Figure 9. Back Panel Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

44


2.2.2 Component-side Connectors and Headers

Figure 10 shows the locations of the component-side connectors and headers.

Figure 10. Component-side Connectors and Headers

Table 9 lists the component-side connectors and headers identified in Figure 10.

45


Table 9. Component-side Connectors and Headers Shown in Figure 10

P

Q

R

J

K

L

M

N

O

S

T

U

V

G

H

I

C

D

E

F

Item/callout

from Figure 10

A

B

Description

Conventional PCI bus add-in card connector

Front panel audio header

PCI Express x4 bus add-in card connector

Internal mono speaker header



12 V internal power connector (ATX12V)


Serial port header

Chassis intrusion header


Main power connector (2 x 12)

Alternate front panel power LED header

Front panel header

SATA connectors

Intel MEBX Reset header

Front panel USB header

Intel FCFH header



S/PDIF header


46


2.2.2.1 Signal Tables for the Connectors and Headers

Table 10. Serial Port Header

Pin Signal Name

1

3

5

7

9

DCD (Data Carrier Detect)

TXD# (Transmit Data)

Ground

RTS (Request To Send)

RI (Ring Indicator)

Pin

2

4

6

8

10

Signal Name

RXD# (Receive Data)

DTR (Data Terminal Ready)

DSR (Data Set Ready)

CTS (Clear To Send)

Key (no pin)

Table 11. S/PDIF Header

2

3

3

Pin

1

Signal Name

Ground

S/PDIF out

Key (no pin)

+5V_DC

Table 12. Internal Mono Speaker Header

Pin

1

2

Signal Name

−

+

3

5

7

9

Table 13. Front Panel Audio Header for Intel HD Audio

Pin

1

Signal Name

[Port 1] Left channel

Pin

2

Signal Name

Ground

[Port 1] Right channel

[Port 2] Right channel

SENSE_SEND (Jack detection)

[Port 2] Left channel

4

6

8

10

PRESENCE# (Dongle present)

[Port 1] SENSE_RETURN

Key (no pin)

[Port 2] SENSE_RETURN

47


Table 14. Front Panel Audio Header for AC ’97 Audio

Pin

1

3

5

7

9

Signal Name

MIC

MIC_BIAS

FP_OUT_R

AUD_5V

FP_OUT_L

Pin

2

4

6

8

10

Signal Name

AUD_GND

AUD_GND

FP_RETURN_R

KEY (no pin)

FP_RETURN_L

NOTE

Not all AC ’97 signals are supported; specifically, pins 4, 6, 7, and 10 are not supported.

Table 15. Front Panel USB Header

Pin

1

3

5

7

9

Signal Name

+5 VDC

D-

D+

Ground

KEY (no pin)

Pin

2

4

6

8

10

Signal Name

+5 VDC

D-

D+

Ground

No Connect

Table 16. SATA Connectors

3

4

5

6

7

Pin

1

2

Signal Name

Ground

TXP

TXN

Ground

RXN

RXP

Ground

Table 17. Chassis Intrusion Header

Pin

1

2

Signal Name

Intruder#

Ground

48


Table 18. Processor (4-Pin) Fan Header

Pin

1

2

3

4

Signal Name

Ground

+12 V

FAN_TACH

FAN_CONTROL

Table 19. Front and Rear Chassis Fan Headers

Pin

1

2

3

4

4-Wire Support

Ground

+12 V

FAN_TACH

FAN_CONTROL

Pin

3

2

1

N/A

3-Wire Support

Ground

FAN_POWER

FAN_TACH

N/A

Table 20. Intel FCFH Header

Pin Description

1

2

Ground

FCFH#

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

•

One PCI Express 2.0 x16: one PCI Express 2.0 x16 connector. This connector supports simultaneous transfer speeds of up to 8 GB/s of peak bandwidth per direction.

• PCI Express 2.0 x4: one PCI Express 2.0 x4 connector. The x4 interface supports simultaneous transfer speeds up to 500 MB/s of peak bandwidth per direction and up to 4 GB/s concurrent bandwidth.

•

PCI Express 2.0 x1: one PCI Express 2.0 x1 connector. The x1 interface supports simultaneous transfer speeds up to 1 GB/s of peak bandwidth per direction and up to 2 GB/s concurrent bandwidth.

•

One Conventional PCI (rev 2.3 compliant) connector.

Note the following considerations for the Conventional PCI bus connector:

• The Conventional PCI bus connector is bus master capable.

•

SMBus signals are routed to the Conventional PCI bus connector. This enables

Conventional PCI bus add-in boards with SMBus support to access sensor data on the desktop board. The specific SMBus signals are as follows:



The SMBus clock line is connected to pin A40.



The SMBus data line is connected to pin A41.

49


2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:

•

Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of

ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and 24 must remain unconnected.

•

Processor core power – a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting.

CAUTION

If a high power (75 W or greater) add-in card is installed in the PCI Express x16 connector, that card must also be connected directly to the power supply. Failure to do so may cause damage to the board and the add-in card.

Table 21. Processor Core Power Connector

Pin

1

3

Signal Name

Ground

+12 V

Pin

2

4

Signal Name

Ground

+12 V

Table 22. Main Power Connector

Pin

1

2

7

8

9

3

4

5

6

10

11

12

Signal Name

+3.3 V

+3.3 V

Ground

+5 V

Ground

+5 V

Ground

PWRGD (Power Good)

+5 V (Standby)

+12 V

+12 V

(Note)

+3.3 V 2 x 12 connector detect

(Note)

Pin

13

14

15

16

17

18

19

20

21

22

23

24

Signal Name

+3.3 V

−12 V

Ground

PS-ON# (power supply remote on/off)

Ground

Ground

Ground

−5 V (obsolete)

+5 V

+5 V

+5 V

(Note)

Ground

(Note)

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.


Power supply considerations

Refer to

Section 2.6.1 on page 58

50


2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 23 lists the signal

names of the front panel header. Figure 11 is a connection diagram for the front panel header.

Table 23. Front Panel Header

Pin Signal

In/

Out

Hard Drive Activity LED

Description

1

3

HD_PWR

HDA#

Out

Out

Hard disk LED pull-up to +5 V

Hard disk active

LED

Reset Switch

5

7

Ground

FP_RESET# In

Power

9 +5 V

Ground

Reset switch

Power

Pin Signal

Power LED

2 FP_LED+

4 FP_LED−

On/Off Switch

6

8

PWR#

Ground

Not Connected

10 N/C

In/

Out

Out

Out

In

Description

Front panel green

LED

Front panel yellow

LED

Power switch

Ground

Not connected

Figure 11. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to an internal storage device. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector.

51


2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the

POST.

2.2.2.4.3 Power LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 24 shows the default states for this LED. More options are available through BIOS setup.

Table 24. States for a One-Color Power LED

LED State

Off

Steady Lit

Blink

Description

Power off/sleeping

Running

Standby

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.

2.2.2.5 Alternate Front Panel Power LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header.

Table 25. Alternate Front Panel Power LED Header

Pin

1

2

3

Signal Name

FP_LED+

Not connected

FP_LED−

In/Out

Out

Out

Description

FP_LED+

FP_LED−

52


2.2.2.6 Front Panel USB Headers

Figure 12 is a connection diagram for the front panel USB headers.

NOTE

•

The +5 V DC power on the USB headers is fused.

•

Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.

Figure 12. Connection Diagram for Front Panel USB Headers

53


2.3 BIOS Configuration Jumper Block

CAUTION

Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 13 shows the location of the jumper block. The 3-pin jumper block determines

the BIOS Setup program’s mode. Table 26 describes the jumper settings for the three

modes: normal, configure, and recovery.

Figure 13. Location of the Jumper Block

54


Table 26. BIOS Setup Configuration Jumper Settings

Function/Mode

Normal

Configure

Jumper Setting Configuration

1-2 The BIOS uses current configuration information and passwords for booting.

2-3 After the POST runs, Setup runs automatically. The maintenance menu is displayed.

Recovery None

Note that this Configure mode is the only way to clear the

BIOS/CMOS settings. Press F9 (restore defaults) while in

Configure mode to restore the BIOS/CMOS settings to their default values.

The BIOS attempts to recover the BIOS configuration. A recovery CD or USB flash drive is required.

55


2.4 Intel

®

(Intel

Management Engine BIOS Extension

®

MEBX) Reset Header

The Intel

®

MEBX reset header (see Figure 14) allows you to reset the Intel AMT

configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper

(not supplied) will accomplish the following:

•

Return all Intel ME parameters to their default values.

•

Delete any user entered information, including PID/PPS and user entered Hash

Certificates. USB key and remote configuration data will be removed if the parameters are not default parameters.

• Reset the Intel MEBX password to the default value (admin).

56

Figure 14. Intel MEBX Reset Header

Table 27. Intel MEBX Reset Header Signals

Pin

1

Function

PCH.AK24 (PCH_RTCRST_PULLUP)

2

3

Ground

No connection


2.5 Mechanical Considerations

2.5.1 Form Factor

The board is designed to fit into a microATX form-factor chassis. Figure 15 illustrates

the mechanical form factor for the board. Dimensions are given in inches

[millimeters]. The outer dimensions are 9.60 inches by 9.60 inches

[243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification.

Figure 15. Board Dimensions

57


2.6 Electrical Considerations

2.6.1 Power Supply Considerations

CAUTION

The +5 V standby line from the power supply must be capable of providing adequate

+5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

Additional power required will depend on configurations chosen by the integrator.

The power supply must comply with the indicated parameters of the ATX form factor specification.

•

The potential relation between 3.3 VDC and +5 VDC power rails

•

The current capability of the +5 VSB line

•

All timing parameters

•

All voltage tolerances

For example, for a system consisting of a supported 95 W processor (see Section 1.4 on page 16 for information on supported processors), 2 GB DDR3 RAM, one high end

video card, one hard disk drive, one optical drive, and all board peripherals enabled,

the minimum recommended power supply is 460 W. Table 28 lists the recommended

power supply current values.

Table 28. Recommended Power Supply Current Values

Output Voltage

Current

3.3 V

22 A

5 V

20 A

12 V1

16 A

12 V2

16 A

-12 V

0.3 A

5 VSB

1.5 A


Selecting an appropriate power supply

Refer to

http://www.intel.com/support/motherboards/desktop/sb/C

S-026472.htm

58


2.6.2 Fan Header Current Capability

CAUTION

The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation.

Table 29 lists the current capability of the fan headers.

Table 29. Fan Header Current Capability

Fan Header

Processor fan

Front chassis fan

Rear chassis fan

Maximum Available Current

2.0 A

1.5 A

1.5 A

2.6.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board

(all expansion slots filled) must not exceed the system’s power supply +5 V maximum current.

59


2.7 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38

o

C at the processor fan inlet is required. Use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is highly recommended. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system

with adequate thermal performance.

CAUTION

The ambient temperature must not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating

temperature, see the environmental specifications in Section 2.9.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit.

Failure to do so may result in damage to the voltage regulator circuit.

60


Figure 16 shows the locations of the localized high temperature zones.


A

B

C

Processor voltage regulator area

Processor


Figure 16. Localized High Temperature Zones

Table 30 provides maximum case temperatures for the components that are sensitive

to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 30. Thermal Considerations for Components

Component

Processor


Maximum Case Temperature

For processor case temperature, see processor datasheets and processor specification updates

111 o

C (under bias)


Processor datasheets and specification updates

Refer to


61


2.8 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia

"Reliability Prediction Procedure for Electronic Equipment" SR-332 Issue 1, an update of Bellcore TR-332, Issue 6. The MTBF prediction is used to estimate repair rates and spare parts requirements.

The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is

194,809.26 hours.

2.9 Environmental

Table 31 lists the environmental specifications for the board.

Table 31. Environmental Specifications

Parameter

Temperature

Non-Operating

Operating

Shock

Unpackaged

Packaged

Vibration

Unpackaged

Packaged

Specification

-40 °C to +60 °C

(Note)

0 °C to +40 °C

The operating temperature of the board may be determined by measuring the air temperature from within 1 inch of the edge of the chipset/PCH heatsink and

1 inch above the board, in a closed chassis, while the system is in operation.

50 g trapezoidal waveform

Velocity change of 170 inches/second²

Half sine 2 millisecond

Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)

<20 36 167

21-40

41-80

81-100

30

24

18

152

136

118

5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz

20 Hz to 500 Hz: 0.02 g² Hz (flat)

5 Hz to 40 Hz: 0.015 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum operating temperature specified. It is recommended that the board temperature be at least room temperature before attempting to power on the board.

62

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in a 64 Mbit (8,192 KB) Serial Peripheral

Interface Flash Memory (SPI Flash) device which can be updated using a set of utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM information, Plug and Play support, and other firmware.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as ALB6510H.86A.

The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the

Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.

Maintenance Main Configuration Performance Security Power Boot Intel ME Exit

NOTE

The maintenance menu is displayed only when the board is in configure mode.

Section 2.3 on page 54 shows how to put the board in configure mode.

63


Table 32 lists the BIOS Setup program menu features.

Table 32. BIOS Setup Program Menu Bar

Maintenance

Clears passwords and displays processor information

Main

Displays processor and memory configuration

Configuration

Configures advanced features available through the chipset

Performance

Configures

Memory and

Processor overrides

Security

Sets passwords and security features

Power

Configures power management features

Table 33 lists the function keys available for menu screens.

Boot

Selects boot options

Intel ME

Configure

Intel ME and Intel

AMT settings

Exit

Saves or discards changes to

Setup program options

Table 33. BIOS Setup Program Function Keys

BIOS Setup Program

Function Key

<←> or <→>

<↑> or <↓>

<Tab>

<Enter>

<F9>

<F10>

<Esc>

Description

Selects a different menu screen (Moves the cursor left or right)

Selects an item (Moves the cursor up or down)

Selects sub-items within a field (i.e., date/time)

Executes command or selects the submenu

Load the default configuration values for the current menu

Save the current values and exits the BIOS Setup program

Exits the menu

64

Overview of BIOS Features

3.2 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The

BIOS enables applications such as third-party management software to use SMBIOS.

The BIOS stores and reports the following SMBIOS information:

•

BIOS data, such as the BIOS revision level

•

Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the

SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.3 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s

USB drivers are not yet available. Legacy USB support is used to access the BIOS

Setup program, and to install an operating system that supports USB. By default,

Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system.

(Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the

BIOS is no longer used.

65


3.4 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel

®

Express BIOS Update utility, which enables automated updating while in the

Windows environment. Using this utility, the BIOS can be updated from a file on a

• hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.

Intel

®

Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash

• drive or a USB drive), or an optical drive.

Intel

®

F7 switch allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS

Recovery without removing the BIOS configuration jumper.

Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.

NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.


BIOS update utilities

Refer to

http://www.intel.com/support/motherboards/desktop/sb/CS-

022312.htm

.

3.4.1 Language Support

The BIOS Setup program and help messages are supported in US English.

66


3.4.2 Custom Splash Screen

During POST, an Intel

®

splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen.


Refer to

Intel

®

Integrator Toolkit

Additional Intel

®

software tools http://developer.intel.com/design/motherbd/software/itk/ http://developer.intel.com/products/motherboard/DB65AL/ tools.htm

and http://developer.intel.com/design/motherbd/software.htm

3.5 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption

occurs, the BIOS could be damaged. Table 34 lists the drives and media types that

can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable however, it must contain the motherboard .bio file at the root level.

Table 34. Acceptable Drives/Media Types for BIOS Recovery

Media Type

Optical drive connected to the SATA interface

USB removable drive (a USB Flash Drive, for example)

USB diskette drive (with a 1.44 MB diskette)

USB hard disk drive

Legacy diskette drive (with a 1.44 MB diskette) connected to the legacy diskette drive interface

Can be used for BIOS recovery?

Yes

Yes

No

No

No


BIOS recovery

Refer to

http://www.intel.com/support/motherboards/desktop/sb

/cs-023360.htm

67


3.6 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

3.6.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable

CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order.

Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.6.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.6.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

•

Keyboard

•

Mouse

3.6.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This

menu displays the list of available boot devices. Table 35 lists the boot device menu

options.

Table 35. Boot Device Menu Options

Boot Device Menu Function Keys

<↑> or <↓>

<Enter>

<Esc>

Description

Selects a default boot device

Exits the menu, and boots from the selected device

Exits the menu and boots according to the boot priority defined through BIOS setup

68


3.7 Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will automatically unlock drives on resume from S3.

The User hard disk drive password, when installed, will be required upon each powercycle until the Master Key or User hard disk drive password is submitted.

The Master Key hard disk drive password, when installed, will not lock the drive. The

Master Key hard disk drive password exists as an unlock override in the event that the

User hard disk drive password is forgotten. Only the installation of the User hard disk drive password will cause a hard disk to be locked upon a system power-cycle.

Table 36 shows the effects of setting the Hard Disk Drive Passwords.

Table 36. Master Key and User Hard Drive Password Functions

Password Set

Neither

Master only

User only

Master and User Set

Password During Boot

None

None

User only

Master or User

During every POST, if a User hard disk drive password is set, POST execution will pause with the following prompt to force the user to enter the Master Key or User hard disk drive password:

Enter Hard Disk Drive Password:

Upon successful entry of the Master Key or User hard disk drive password, the system will continue with normal POST.

If the hard disk drive password is not correctly entered, the system will go back to the above prompt. The user will have three attempts to correctly enter the hard disk drive password. After the third unsuccessful hard disk drive password attempt, the system will halt with the message:

Hard Disk Drive Password Entry Error

A manual power cycle will be required to resume system operation.

NOTE

As implemented on DB65AL, Hard Disk Drive Password Security is only supported on

SATA port 0. The passwords are stored on the hard disk drive so if the drive is relocated to another SATA port or computer that does not support Hard Disk Drive

Password Security feature, the drive will not be accessible.

69


3.8 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:

•

The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and change Setup options in the

BIOS Setup program. This is the user mode.

•

If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted access to Setup.

•

If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to

Setup respective to which password is entered.

•

Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.

•

For enhanced security, use different passwords for the supervisor and user passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to

16 characters in length.

70


Table 37 shows the effects of setting the supervisor password and user password. This

table is for reference only and is not displayed on the screen.

Table 37. Supervisor and User Password Functions

Password

Set

Neither

Supervisor only

User only

Supervisor and user set

Supervisor

Mode

Can change all options

(Note)


N/A


User Mode


(Note)

Can change a limited number of options


Can change a limited number of options

Setup Options

None

Enter Password

Clear User Password

Supervisor Password

Enter Password

Password to Enter

Setup

None

Supervisor Password Supervisor

User

Supervisor or user

Note: If no password is set, any user can change all Setup options.

Password

During

Boot

None

None

User

Supervisor or user

71


72

4 Error Messages and Beep Codes

4.1 Speaker

The board-mounted piezoelectric speaker provides audible error code (beep code) information during POST.


The location of the onboard speaker

Refer to

Figure 1, page 13

4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s

piezoelectric speaker to beep an error message describing the problem (see Table 38).

Table 38. BIOS Beep Codes

Type

F2 Setup/F10 Boot

Menu Prompt

Pattern

One 0.5 second beep when BIOS is ready to accept keyboard input

BIOS update in progress None

Video error (no add-in graphics card installed)

On-off (1.0 second each) two times, then

2.5-second pause (off), entire pattern repeats

(beeps and pause) once and the BIOS will continue to boot.

Memory error

Thermal trip warning

On-off (1.0 second each) three times, then


(beeps and pause) until the system is powered off.

Alternate high and low beeps (1.0 second each) for eight beeps, followed by system shut down.

Frequency/Comments

932 Hz

932 Hz

For processors requiring an add-in graphics card

932 Hz

High beep 2000 Hz

Low beep 1500 Hz

73


4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front

panel power LED to blink an error message describing the problem (see Table 39).

Table 39. Front-panel Power LED Blink Codes

Type Pattern

F2 Setup/F10 Boot

Menu Prompt

Video error (no add-in graphics card installed)

None

BIOS update in progress Off when the update begins, then on for

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete.

On-off (1.0 second each) two times, then


(blink and pause) until the system is powered off.

Memory error

Thermal trip warning

On-off (1.0 second each) three times, then


(blinks and pause) until the system is powered off.

Each beep will be accompanied by the following blink pattern: .25 seconds on, .25 seconds off,

.25 seconds on, .25 seconds off. This will result in a total of 16 blinks.

Note

For processors requiring an add-in graphics card

4.4 BIOS Error Messages

Table 40 lists the error messages and provides a brief description of each.

Table 40. BIOS Error Messages

Error Message

CMOS Battery Low

CMOS Checksum Bad

Memory Size Decreased

No Boot Device Available

Explanation

The battery may be losing power. Replace the battery soon.

The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values.

Memory size has decreased since the last boot. If no memory was removed, then memory may be bad.

System did not find a device to boot.

74

Error Messages and Beep Codes

4.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes requires a Conventional PCI bus add-in card, often called a

POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.

NOTE

The POST card must be installed in the Conventional PCI bus connector.

The following tables provide information about the POST codes generated by the BIOS:

•

Table 41 lists the Port 80h POST code ranges

•

Table 42 lists the Port 80h POST codes themselves

•

Table 43 lists the Port 80h POST sequence

NOTE

In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 41. Port 80h POST Code Ranges

Range Subsystem

0x00 – 0x05 Entering SX states S0 to S5.

0x10, 0x20, 0x30, 0x40, 0x50 Resuming from SX states. 0x10 –0x20 – S2, 0x30 – S3, etc.

0x08 – 0x0F Security (SEC) phase

0x11 – 0x1F

0x21 – 0x29

0x2A – 0x2F

0x31 – 0x35

0x36 – 0x3F

0x41 – 0x4F

0x50 – 0x5F

0x60 – 0x6F

0x70 – 0x7F

0x80 – 0x8F

0x90 – 0x9F

0xA0 – 0xAF

0xB0 – 0xBF

0xC0 – 0xCF

0xD0 – 0xDF

0xF0 – 0xFF

PEI phase pre MRC execution

MRC memory detection

PEI phase post MRC execution

Recovery

Platform DXE driver

CPU Initialization (PEI, DXE, SMM)

I/O buses: PCI, USB, ATA etc. 0x5F is an unrecoverable error. Start with PCI.

BDS

Output devices: All output consoles.

For future use

Input devices: Keyboard/Mouse.

For future use

Boot devices: Includes fixed media and removable media. Not that critical since consoles should be up at this point.

For future use

For future use

75


Table 42. Port 80h POST Codes

Port 80 Code Progress Code Enumeration

ACPI S States

0x1C

0x21

0x23

0x24

0x27

0x28

0x29

0x2A

0x2B

0x00,0x01,0x02,0x03,0x04,0x05 Entering S0, S2, S3, S4, or S5 state

0x10,0x20,0x30,0x40,0x50 Resuming from S2, S3, S4, S5

0x08

0x09

Security Phase (SEC)

Starting BIOS execution after CPU BIST

SPI prefetching and caching

0x0A

0x0B

0x0C

0x0D

0x0E

0x0F

0x11

Load BSP microcode

Load APs microcodes

Platform program baseaddresses

Wake up all APs

Initialize NEM

Pass entry point of the PEI core

PEI before MRC

0x12

0x13

0x14

0x15

PEI Platform driver

Set bootmode, GPIO init

Early chipset register programming including graphics init

Basic PCH init, discrete device init (1394, SATA)

LAN init

Exit early platform init driver

PEI SMBUS

0x16

0x17

0x18

0x19

0x1A

0x1B

SMBUSriver init

Entry to SMBUS execute read/write

Exit SMBUS execute read/write

PEI CK505 Clock Programming

Entry to CK505 programming

Exit CK505 programming

PEI Over-Clock Programming

Entry to entry to PEI over-clock programming

Exit PEI over-clock programming

MRC entry point

Configuring memory

Testing memory

Exit MRC driver

Memory

Reading SPD from memory DIMMs

Detecting presence of memory DIMMs

PEI after MRC

Start to Program MTRR Settings

Done Programming MTRR Settings continued

76


Port 80 Code

0x4C

0x4D

0x4E

0x4F

0x50

0x51

0x52

0x58

0x59

0x5A

0x5B

0x44

0x45

0x46

0x47

0x48

0x49

0x4A

0x4B

0x31

0x33

0x34

0x41

0x42

0x43

Table 42. Port 80h POST Codes (continued)

Progress Code Enumeration

PEIMs/Recovery

Crisis Recovery has initiated

Loading recovery capsule

Start recovery capsule/ valid capsule is found

CPU Initialization

CPU PEI Phase

Begin CPU PEI Init

XMM instruction enabling

End CPU PEI Init

CPU PEI SMM Phase

Begin CPU SMM Init smm relocate bases

Smm relocate bases for APs

End CPU SMM Init

CPU DXE Phase

CPU DXE Phase begin

Refresh memory space attributes according to MTRRs

Load the microcode if needed

Initialize strings to HII database

Initialize MP support

CPU DXE Phase End

CPU DXE SMM Phase

CPU DXE SMM Phase begin

Relocate SM bases for all APs

CPU DXE SMM Phase end

I/O BUSES

Enumerating PCI buses

Allocating resources to PCI bus

Hot Plug PCI controller initialization

USB

Resetting USB bus

Reserved for USB

ATA/ATAPI/SATA

Resetting PATA/SATA bus and all devices

Reserved for ATA continued

77



Port 80 Code

0x69

0x6A

0x6B

0x6C

0x6D

0x6E

0x6F

0x90

0x60

0x61

0x62

0x63

0x64

0x65

0x66

0x67

0x68

0x91

0x92

0x93

0x94

0x95

0x98

0x99

0x9A

0x9B

0xB0

0xB1


BDS

BDS driver entry point initialize

BDS service routine entry point (can be called multiple times)

BDS Step2

BDS Step3

BDS Step4

BDS Step5

BDS Step6

BDS Step7

BDS Step8

BDS Step9

BDS Step10

BDS Step11

BDS Step12

BDS Step13

BDS Step14

BDS return to DXE core (should not get here)

Keyboard (PS/2 or USB)

Resetting keyboard

Disabling the keyboard

Detecting the presence of the keyboard

Enabling the keyboard

Clearing keyboard input buffer

Instructing keyboard controller to run Self Test (PS/2 only)

Mouse (PS/2 or USB)

Resetting mouse

Detecting mouse

Detecting presence of mouse

Enabling mouse

Fixed Media

Resetting fixed media

Disabling fixed media

0xB2

0xB3

Detecting presence of a fixed media (IDE hard drive detection etc.)

Enabling/configuring a fixed media continued

78


0xBB

0xE4

0xE7

0xE8

0xE9

0xEB

0xF8

0xF9


Port 80 Code

0xB8

0xB9

0xBA


Removable Media

Resetting removable media

Disabling removable media

Detecting presence of a removable media (IDE, CDROM detection etc.)

Enabling/configuring a removable media

DXE Core

Entered DXE phase

BDS

Waiting for user input

Checking password

Entering BIOS setup

Calling Legacy Option ROMs

Runtime Phase/EFI OS Boot

EFI boot service ExitBootServices ( ) has been called

EFI runtime service SetVirtualAddressMap ( ) has been called

79


Table 43. Typical Port 80h POST Sequence

5A

92

90

94

5A

28

90

94

E7

01

00

51

92

90

94

95

EB

58

25

28

34

E4

12

13

50

POST Code Description

21

22

23

Initializing a chipset component

Reading SPD from memory DIMMs

Detecting presence of memory DIMMs

Configuring memory

Testing memory

Loading recovery capsule

Entered DXE phase

Starting application processor initialization

SMM initialization

Enumerating PCI buses

Allocating resourced to PCI bus


Resetting keyboard


Keyboard Self Test

Calling Video BIOS

Resetting USB bus



Resetting keyboard



Testing memory

Resetting keyboard


Waiting for user input

INT 19

Ready to boot

80

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop

Board DB65AL:

• Safety standards

• European Union Declaration of Conformity statement

•

Product Ecology statements

•

Electromagnetic Compatibility (EMC) standards

•

Product certification markings

5.1.1 Safety Standards

The Intel Desktop Board DB65AL complies with the safety standards stated in Table 44

when correctly installed in a compatible host system.

Table 44. Safety Standards

Standard

CSA/UL 60950-1

EN 60950-1

IEC 60950-1

Title

Information Technology Equipment – Safety - Part 1: General

Requirements (USA and Canada)


Requirements (European Union)


Requirements (International)

81


5.1.2 European Union Declaration of Conformity

Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel

®

Desktop Board DB65AL is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive

2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC

(ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC,

2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,

2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv

2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europees Directief

2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja

2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne

2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie

2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών

2004/108/EC, 2006/95/EC και 2002/95/EC.

Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai

Irányelv előírásainak.

Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer

2004/108/EC, 2006/95/EC, & 2002/95/EC.

Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,

2006/95/EC & 2002/95/EC.

Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un

2002/95/EC noteikumiem.

Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir

2002/95/EC nuostatas.

Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej

2004/108/EC, 2006/95/EC u 2002/95/EC.

Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet

2004/108/EC, 2006/95/EC & 2002/95/EC.

Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej

2004/108/EC, 206/95/EC i 2002/95/EC.

82

Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,

2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,

2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív

2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,

2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,

2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the

Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc.

中文

作为其对环境责任之承诺的部分，英特尔已实施

Intel Product Recycling Program

（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰

当的重复使用处理。

请参考 http://www.intel.com/intel/other/ehs/product_ecology

了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel

Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel

Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben.

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology

83


Español

Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.

Français

Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc.

日本語

インテルでは、環境保護活動の一環として、使い終えたインテル

ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル

プログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、 http://www.intel.com/in tel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,

Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb.

Portuguese

Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

84


Russian

В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.

Пожалуйста, обратитесь на веб-сайт http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin

Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen http://www.intel.com/intel/other/ehs/product_ecology

Web sayfasına gidin.

5.1.4 EMC Regulations

The Intel Desktop Board DB65AL complies with the EMC regulations stated in Table 45

when correctly installed in a compatible host system.

Table 45. EMC Regulations

Regulation

FCC 47 CFR Part 15,

Subpart B

ICES-003

EN55022

EN55024

EN55022

CISPR 22

CISPR 24

VCCI V-3, V-4

KN-22, KN-24

CNS 13438

Title

Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio

Frequency Devices. (USA)

Interference-Causing Equipment Standard, Digital Apparatus. (Canada)

Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union)

Information Technology Equipment – Immunity Characteristics Limits and methods of measurement. (European Union)

Australian Communications Authority, Standard for Electromagnetic

Compatibility. (Australia and New Zealand)

Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment. (International)

Information Technology Equipment – Immunity Characteristics – Limits and Methods of Measurement. (International)

Voluntary Control for Interference by Information Technology Equipment.

(Japan)

Korean Communications Commission – Framework Act on

Telecommunications and Radio Waves Act (South Korea)

Bureau of Standards, Metrology, and Inspection (Taiwan)

85


FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact:

Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected.

•

Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications to the equipment not expressly approved by Intel

Corporation could void the user’s authority to operate the equipment.

Tested to comply with FCC standards for home or office use.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian

Department of Communications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le

Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

86


Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment

(VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas..

87


5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance

The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.

Intel Desktop Board DB65AL meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply:

•

Energy Star v5.0, category A

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2009 (ErP)


ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar

Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/

Korea e-Standby Program

European Union Energy-related Products Directive 2009 (ErP) http://www.kemco.or.kr/new_eng/pg02

/pg02100300.asp

http://ec.europa.eu/enterprise/policies/s ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

88


5.1.6 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DB65AL has the regulatory compliance marks shown in Table 46.

Table 46. Regulatory Compliance Marks

Description

UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882.

Mark

FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European Union (EU) EMC directive,

Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio

Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232.

Japan VCCI (Voluntary Control Council for Interference) mark.

Korea Certification mark. Includes an adjacent KCC (Korean

Communications Commission) certification number:

KCC-REM-CPU-DB65AL

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.

Printed wiring board manufacturer’s recognition mark. Consists of a unique

UL recognized manufacturer’s logo, along with a flammability rating (solder side).

China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The

Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years.

V-0

89


5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

PRÉCAUTION

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

FORHOLDSREGEL

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

OBS!

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.

VARO

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.

VORSICHT

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen

Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des

Herstellers entsprechend.

AVVERTIMENTO

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.

Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

90


PRECAUCIÓN

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

WAARSCHUWING

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.

As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.

Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Προσοχή

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία

λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι

δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με

τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

91


AWAS

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

OSTRZEŻENIE

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

PRECAUŢIE

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.

Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ

При использовании батареи несоответствующего типа существует риск ее взрыва.

Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.

Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.

Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi.

UYARI

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.

Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

92


93


94

No results