OPA2
34
OPA2
OPA2
234
OPA234
OPA2234
OPA4234
OPA
4234
34
SBOS055B – MAY 1996 – REVISED APRIL 2008
Low-Power, Precision
SINGLE-SUPPLY OPERATIONAL AMPLIFIERS
FEATURES
OPA234
● WIDE SUPPLY RANGE:
Single Supply: VS = +2.7V to +36V
Dual Supply: VS = ±1.35V to ±18V
● SPECIFIED PERFORMANCE:
+2.7V, +5V, and ±15V
● LOW QUIESCENT CURRENT: 250µA/amp
● LOW INPUT BIAS CURRENT: 25nA max
● LOW OFFSET VOLTAGE: 100µV max
● HIGH CMRR, PSRR, and AOL
Offset Trim
1
8
NC
–In
2
7
V+
+In
3
6
Output
V–
4
5
Offset Trim
8
V+
7
Out B
6
–In B
5
+In B
SO-8, MSOP-8
● SINGLE, DUAL, and QUAD VERSIONS
OPA2234
DESCRIPTION
The OPA234 series low-cost op amps are ideal for
single-supply, low-voltage, low-power applications. The
series provides lower quiescent current than older
“1013”-type products and comes in current industrystandard packages and pinouts. The combination of
low offset voltage, high common-mode rejection, high
power-supply rejection, and a wide supply range provides excellent accuracy and versatility. Single, dual,
and quad versions have identical specifications for
maximum design flexibility. These general-purpose op
amps are ideal for portable and battery-powered applications.
The OPA234 series op amps operate from either single
or dual supplies. In single-supply operation, the input
common-mode range extends below ground and the
output can swing to within 50mV of ground. Excellent
phase margin makes the OPA234 series ideal for demanding applications, including high load capacitance.
Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from
interaction.
Single version packages are in an SO-8 surface-mount
and a space-saving MSOP-8 surface-mount. Dual packages are in an SO-8 surface-mount. Quad packages
are in an SO-14 surface-mount. All are specified for
–40°C to +85°C operation.
Out A
–In A
1
A
2
+In A
3
V–
4
B
SO-8
OPA4234
Out A
1
–In A
2
A
14
Out D
13
–In D
D
+In A
3
12
+In D
V+
4
11
V–
+In B
5
10
+In C
B
C
–In B
6
9
–In C
Out B
7
8
Out C
SO-14
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 1996-2008, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = +5V
At TA = 25°C, VS = +5V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted.
OPA234UA, EA
OPA2234UA
OPA4234UA, U
OPA234U, E
OPA2234U
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
OPA234E, EA
vs Temperature(1)
vs Power Supply
vs Time
Channel Separation (Dual, Quad)
CONDITION
VOS
dVOS/dT
PSRR
INPUT BIAS CURRENT
Input Bias Current(2)
Input Offset Current
NOISE
Input Voltage Noise Density
Current Noise Density
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection
IB
IOS
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time: 0.1%
0.01%
Overload Recovery Time
TEMPERATURE RANGE
Specified Range
Operating Range
Storage
Thermal Resistance
8-Pin DIP
SO-8 Surface-Mount
MSOP-8 Surface-Mount
14-Pin DIP
SO-14 Surface-Mount
MAX
Operating Temperature Range
VS = +2.7V to +30V, VCM = 1.7V
±40
±100
±0.5
3
0.2
0.3
VCM = 2.5V
VCM = 2.5V
–15
±1
VCM = 2.5V
MIN
TYP
MAX
UNITS
±100
±150
±3
10
✻
✻
✻
✻
✻
✻
±250
±350
✻
20
µV
µV
µV/°C
µV/V
µV/mo
µV/V
–30
±5
✻
✻
–50
✻
nA
nA
f = 1kHz
CMRR
AOL
GBW
SR
✻
✻
25
80
VCM = –0.1V to 4V
–0.1
91
VO = 0.25V to 4V
RL = 10kΩ
RL = 2kΩ
108
86
CL = 100pF
✻
86
120
96
100
✻
0.35
0.2
15
25
16
G = 1, 3V Step, CL = 100pF
G = 1, 3V Step, CL = 100pF
(VIN) (Gain) = VS
RL = 10kΩ to VS /2
RL = 10kΩ to VS /2
RL = 10kΩ to Ground
RL = 10kΩ to Ground
(V+) –1
106
107 || 5
1010 || 6
VCM = 2.5V
OUTPUT
Voltage Output: Positive
Negative
Positive
Negative
Short-Circuit Current
ISC
Capacitive Load Drive (Stable Operation)(3)
POWER SUPPLY
Specified Operating Voltage
Operating Voltage Range
Quiescent Current (per amplifier)
TYP
vn
in
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
MIN
(V+) –1
0.25
(V+) –1
0.1
G = +1
✻
✻
✻
✻
(V+) –0.65
0.05
(V+) –0.65
0.05
±11
1000
IQ
IO = 0
250
–40
–40
–55
✻
✻
V
dB
✻
✻
Ω || pF
Ω || pF
✻
✻
dB
dB
✻
✻
✻
✻
✻
MHz
V/µs
µs
µs
µs
✻
✻
✻
✻
✻
✻
V
V
V
V
mA
pF
✻
+5
+2.7
+36
300
✻
+85
+125
+125
✻
✻
✻
✻
θJA
100
150
220
80
110
nV/√Hz
fA/√Hz
✻
✻
✻
✻
✻
✻
✻
V
V
µA
✻
✻
✻
°C
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
✻ Specifications same as OPA234U, E.
NOTES: (1) Wafer-level tested to 95% confidence level. (2) Positive conventional current flows into the input terminals. (3) See Small-Signal Overshoot vs Load
Capacitance typical curve.
2
OPA234, OPA2234, OPA4234
www.ti.com
SBOS055B
ELECTRICAL CHARACTERISTICS: VS = +2.7V
At TA = 25°C, VS = +2.7V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted.
OPA234UA, EA
OPA2234UA
OPA4234UA, U
OPA234U, E
OPA2234U
PARAMETER
CONDITION
OFFSET VOLTAGE
Input Offset Voltage
OPA234E, EA
vs Temperature(1)
vs Power Supply
vs Time
Channel Separation (Dual, Quad)
TYP
MAX
Operating Temperature Range
VS = +2.7V to +30V, VCM = 1.7V
±40
±100
±0.5
3
0.2
0.3
VCM = 1.35V
VCM = 1.35V
–15
±1
VOS
dVOS/dT
PSRR
INPUT BIAS CURRENT
Input Bias Current(2)
Input Offset Current
NOISE
Input Voltage Noise Density
Current Noise Density
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection
VCM = 1.35V
IB
IOS
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time: 0.1%
0.01%
Overload Recovery Time
CMRR
TEMPERATURE RANGE
Specified Range
Operating Range
Storage
Thermal Resistance
8-Pin DIP
SO-8 Surface-Mount
MSOP-8 Surface-Mount
14-Pin DIP
SO-14 Surface-Mount
TYP
MAX
UNITS
±100
±150
±3
10
✻
✻
✻
✻
✻
✻
±250
±350
✻
20
µV
µV
µV/°C
µV/V
µV/mo
µV/V
–30
±5
✻
✻
–50
✻
nA
n
AOL
GBW
SR
✻
✻
25
80
VCM = –0.1V to 1.7V
–0.1
91
VO = 0.25V to 1.7V
RL = 10kΩ
RL = 2kΩ
108
86
CL = 100pF
✻
86
125
96
100
86
0.35
0.2
6
16
8
G = 1, 1V Step, CL = 100pF
G = 1, 1V Step, CL = 100pF
(VIN) (Gain) = VS
RL = 10kΩ to VS /2
RL = 10kΩ to VS /2
RL = 10kΩ to Ground
RL = 10kΩ to Ground
(V+) –1
106
107 || 5
1010 || 6
VCM = 1.35V
OUTPUT
Voltage Output: Positive
Negative
Positive
Negative
Short-Circuit Current
ISC
Capacitive Load Drive (Stable Operation)(3)
POWER SUPPLY
Specified Operating Voltage
Operating Voltage Range
Quiescent Current (per amplifier)
MIN
f = 1kHz
vn
in
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
MIN
(V+) –1
0.25
(V+) –1
0.1
G = +1
✻
✻
✻
✻
(V+) –0.6
0.05
(V+) –0.65
0.05
±8
1000
IQ
IO = 0
250
–40
–40
–55
✻
✻
V
dB
✻
✻
Ω || pF
Ω || pF
✻
✻
dB
dB
✻
✻
✻
✻
✻
MHz
V/µs
µs
µs
µs
✻
✻
✻
✻
✻
✻
V
V
V
V
mA
pF
✻
+2.7
+2.7
+36
300
✻
+85
+125
+125
✻
✻
✻
✻
θJA
100
150
220
80
110
nV/√Hz
fA/√Hz
✻
✻
✻
✻
✻
✻
✻
V
V
µA
✻
✻
✻
°C
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
✻ Specifications same as OPA234U, E.
NOTES: (1) Wafer-level tested to 95% confidence level. (2) Positive conventional current flows into the input terminals. (3) See Small-Signal Overshoot vs Load
Capacitance typical curve.
OPA234, OPA2234, OPA4234
SBOS055B
www.ti.com
3
ELECTRICAL CHARACTERISTICS: VS = ±15V
At TA = 25°C, VS = ±15V, and RL = 10kΩ connected to ground, unless otherwise noted.
OPA234UA, EA
OPA2234UA
OPA4234UA, U
OPA234U, E
OPA2234U
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
OPA4234U Model
vs Temperature(1)
vs Power Supply
vs Time
Channel Separation (Dual, Quad)
CONDITION
VOS
dVOS/dT
PSRR
INPUT BIAS CURRENT
Input Bias Current(2)
Input Offset Current
NOISE
Input Voltage Noise Density
Current Noise Density
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection
IB
IOS
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time: 0.1%
0.01%
Overload Recovery Time
TEMPERATURE RANGE
Specified Range
Operating Range
Storage
Thermal Resistance
8-Pin DIP
SO-8 Surface-Mount
MSOP-8 Surface-Mount
14-Pin DIP
SO-14 Surface-Mount
MAX
VCM = 0V
±70
±250
Operating Temperature Range
VS = ±1.35V to ±18V, VCM = 0V
±0.5
3
0.2
0.3
VCM = 0V
VCM = 0V
–12
±1
MIN
TYP
MAX
UNITS
±5
10
✻
±70
✻
✻
✻
✻
±500
±250
✻
20
µV
µV
µV/°C
µV/V
µV/mo
µV/V
–25
±5
✻
✻
–50
✻
nA
nA
f = 1kHz
CMRR
AOL
GBW
SR
VCM = –15V to 14V
(V–)
91
VO = –14.5V to 14V
(V+) –1
106
110
CL = 100pF
120
100
0.35
0.2
41
47
22
✻
✻
(V+) –1 (V+) –0.7
(V–) +0.5 (V–) +0.15
±22
1000
G = +1
✻
86
107 || 5
1010 || 6
G = 1, 10V Step, CL = 100pF
G = 1, 10V Step, CL = 100pF
(VIN) (Gain) = VS
±1.35
IQ
✻
✻
25
80
VCM = 0V
OUTPUT
Voltage Output: Positive
Negative
Short-Circuit Current
ISC
Capacitive Load Drive (Stable Operation)(3)
POWER SUPPLY
Specified Operating Voltage
Operating Voltage Range
Quiescent Current (per amplifier)
TYP
vn
in
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
MIN
IO = 0
±15
±275
–40
–40
–55
✻
✻
V
dB
✻
✻
Ω || pF
Ω || pF
✻
dB
✻
✻
✻
✻
✻
MHz
V/µs
µs
µs
µs
✻
✻
✻
✻
V
V
mA
pF
✻
±18
±350
✻
+85
+125
+125
✻
✻
✻
✻
θJA
100
150
220
80
110
nV/√Hz
fA/√Hz
✻
✻
✻
✻
✻
✻
✻
V
V
µA
✻
✻
✻
°C
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
✻ Specifications same as OPA234U, E.
NOTES: (1) Wafer-level tested to 95% confidence level. (2) Positive conventional current flows into the input terminals. (3) See Small-Signal Overshoot vs Load
Capacitance typical curve.
4
OPA234, OPA2234, OPA4234
www.ti.com
SBOS055B
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V– .................................................................... 36V
Input Voltage ..................................................... (V–) –0.7V to (V+) +0.7V
Output Short-Circuit(1) .............................................................. Continuous
Operating Temperature .................................................. –40°C to +125°C
Storage Temperature ..................................................... –55°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
NOTE: (1) Short-circuit to ground, one amplifier per package.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE INFORMATION
PRODUCT
Single
OPA234EA
OPA234E
OPA234UA
OPA234U
PACKAGE
PACKAGE
MARKING
MSOP-8 Surface-Mount
A34
"
"
SO-8 Surface-Mount
OPA234UA
OPA234U
"
Dual
OPA2234UA
OPA2234U
SO-8 Surface-Mount
Quad
OPA4234UA
OPA4234U
SO-8 Surface-Mount
"
"
OPA2234UA
OPA2234U
OPA4234UA
OPA4234U
NOTE: (1) For the most current package and ordering information, see the
Package Option Addendum located at the end of this data sheet.
OPA234, OPA2234, OPA4234
SBOS055B
www.ti.com
5
TYPICAL CHARACTERISTIC CURVES
At TA = +25°C and RL = 10kΩ, unless otherwise noted.
POWER-SUPPLY AND COMMON-MODE REJECTION
vs FREQUENCY
OPEN-LOOP GAIN/PHASE vs FREQUENCY
140
VS = +2.7V
0
120
–60
80
φ
–90
60
–120
40
VO = 0.25V
20
–150
G
V
VO = S
2
0
PSR, CMR (dB)
–30
Phase (°)
VS = +5V
±15V
100
Voltage Gain (dB)
CL = 100pF
–180
–20
0.1
1
10
100
1k
10k
100k
120
110
100
90
80
70
60
50
40
30
20
10
0
+PSR
CMR
VS = +2.7V, +5V
or ±15V
VS = +2.7V or +5V
VS = ±15V
10
1M
100
–PSR
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
INPUT NOISE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
CHANNEL SEPARATION vs FREQUENCY
1k
160
Channel Separation (dB)
Voltage Noise (nV/√Hz)
Current Noise (fA/√Hz)
RL = 10kΩ
Current Noise
100
140
120
100
Voltage Noise
10
80
10
1
100
1k
10k
100k
10
1k
10k
100k
Frequency (Hz)
INPUT BIAS AND INPUT OFFSET CURRENT
vs TEMPERATURE
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
–17
VS = +2.7V, +5V
–15
VS = +5V
–16
Input Bias Current (nA)
Input Bias, Input Offset Current (nA)
100
Frequency (Hz)
–20
IB
VS = ±15V
–10
–5
IOS
0
–15
VS = +2.7V
–14
–13
VS = ±15V
–12
–11
–10
+5
–75
–50
–25
0
25
50
75
100
–15
125
Ambient Temperature (°C)
6
Dual and quad devices.
G = 1, all channels.
Quad measured channel
A to D or B to C—other
combinations yield improved
rejection.
–10
–5
0
5
Common-Mode Voltage (V)
10
15
OPA234, OPA2234, OPA4234
www.ti.com
SBOS055B
TYPICAL CHARACTERISTIC CURVES (Cont.)
At TA = +25°C and RL = 10kΩ, unless otherwise noted.
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
30
25
15
10
5
0.1%
0.3%
0.1%
Typical production
distribution of packaged
units. Single, dual,
and quad units included.
VS = ±15V
20
15
10
0.7%
0.3%
5
0.5%
0.1%
0.2%
500
400
300
200
100
0
–100
–200
–500
175
200
150
125
75
100
50
0
25
25
75
50
100
125
150
175
200
–300
0
0
–400
20
VS = +2.7V, +5V
Typical production
distribution of packaged
units. Single, dual, and
quad units included.
Percent of Amplifiers (%)
Percent of Amplifiers (%)
25
Offset Voltage (µV)
Offset Voltage (µV)
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
35
35
25
30
Percent of Amplifiers (%)
20
15
10
0.3%
5
0.2% 0.1%
0.1%
25
20
15
10
0.3%
0.5%
0.2% 0.1%
5
0.1%
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
Typical production
distribution of packaged
units. Single, dual,
and quad units included.
15
10
0.4% 0.3%
0.2%
0.1% 0.1%
0.1%
0.1%
120
5
4.5
4
3.5
PSR
110
CMR
100
90
80
70
0
VS = +2.7V
VS = +5V
VS = ±15V
AOL
130
20
5
3
140
AOL, CMR, PSR (dB)
25
2.5
AOL, CMR, AND PSR vs TEMPERATURE
30
VS = ±15V
2
1.5
0.5
5
4
3.5
3
2.5
2
1.5
1
0.5
4.5
Offset Voltage Drift (µV/°C)
Offset Voltage Drift (µV/°C)
Percent of Amplifiers (%)
0.1%
0
0
1
Percent of Amplifiers (%)
30
Typical production
distribution of packaged
units. Single, dual,
and quad units included.
VS = +5V
Typical production
distribution of packaged
units. Single, dual,
and quad units included.
VS = +2.7V
VCM = (V–) –0.02V to (V+) –1V
8
7.5
7
6.5
6
5
5.5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
60
–75
–25
0
25
50
75
100
125
Ambient Temperature (°C)
Offset Voltage Drift (µV/°C)
OPA234, OPA2234, OPA4234
SBOS055B
–50
www.ti.com
7
TYPICAL CHARACTERISTIC CURVES (Cont.)
At TA = +25°C and RL = 10kΩ, unless otherwise noted.
SMALL-SIGNAL STEP RESPONSE
G = 1, CL = 100pF, VS = +5V
20mV/div
20mV/div
SMALL-SIGNAL STEP RESPONSE
G = 1, CL = 10,000pF, VS = +5V
2µs/div
20µs/div
LARGE-SIGNAL STEP RESPONSE
G = 1, CL = 100pF, VS = +5V
SETTLING TIME vs CLOSED-LOOP GAIN
1000
1V/div
Settling Time (µs)
CL = 100pF
VS = ±15V,
10V Step
100
10
VS = +5V,
3V Step
VS = +2.7V,
1V Step
0.1%
0.01%
1
±1
10µs/div
±10
±100
Gain (V/V)
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
V+
(V+) –0.5
(V+) –1.0
(V+) –1.5
(V+) –2.0
(V+) –2.5
(V+) –3.0
70
25°C
60
VO = 100mVp-p
–55°C
125°C
85°C
(V–) +3.0
(V–) +2.5
(V–) +2.0
(V–) +1.5
(V–) +1.0
(V–) +0.5
V–
–40°C
85°C
–40°C
–55°C
25°C
125°C
0
Overshoot (%)
Output Voltage Swing (V)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
±5
±10
±15
G = –1,
G = +2
30
10
G = +1,
VS = ±15V
G = ±10
G = +1,
VS = +2.7, +5V
0
10pF
100pF
1nF
10nF
100nF
Load Capacitance
Output Current (mA)
8
40
20
High output current may
not be available at low
supply voltages due to
output swing limitations.
G = –2
50
OPA234, OPA2234, OPA4234
www.ti.com
SBOS055B
TYPICAL CHARACTERISTIC CURVES (Cont.)
At TA = +25°C and RL = 10kΩ, unless otherwise noted.
MAXIMUM OUTPUT VOLTAGE
vs FREQUENCY
QUIESCENT CURRENT AND SHORT-CIRCUIT CURRENT
vs TEMPERATURE
VS = +2.7V
VS = +5V
VS = +2.7V or +5V
VS = ±15V
450
25
VS = ±15V
Quiescent Current (µA)
Output Voltage (Vp-p)
70
525
Maximum output voltage
without slew-rate induced
distortion.
20
15
10
VS = +5V
5
375
60
50
±IQ
300
40
30
225
150
20
±ISC
10
75
VS = ±2.7V
0
0
0
10k
1k
100k
Short-Circuit Current (mA)
30
–75
–50
–25
0
Frequency (Hz)
25
50
75
100
125
Temperature (°C)
APPLICATIONS INFORMATION
V+
The OPA234 series op amps are unity-gain stable and
suitable for a wide range of general-purpose applications.
Power-supply pins should be bypassed with 10nF ceramic
capacitors.
10nF
OPA234 single op amp only.
Use offset adjust pins only to null
offset voltage of op amp—see text.
7
2
6
3
OPA234
5
OPERATING VOLTAGE
1
The OPA234 series op amps operate from single (+2.7V to
+36V) or dual (±1.35V to ±18V) supplies with excellent
performance. Specifications are production tested with +2.7V,
+5V, and ±15V supplies. Most behavior remains unchanged
throughout the full operating voltage range. Parameters
which vary significantly with operating voltage are shown in
the Typical Characterisitc curves.
10nF 4
100kΩ
Trim Range: ±4mV typ
(V–) = 0V for single supply operation.
V–
FIGURE 1. OPA234 Offset Voltage Trim Circuit.
OFFSET VOLTAGE TRIM
Offset voltage of the OPA234 series amplifiers is laser
trimmed and usually requires no user adjustment. The
OPA234 (single op amp version) provides offset voltage
trim connections on pins 1 and 5. Offset voltage can be
adjusted by connecting a potentiometer, as shown in Figure 1. This adjustment should be used only to null the offset
of the op amp, not to adjust system offset or offset produced by the signal source. Nulling offset could degrade
the offset drift behavior of the op amp. While it is not
possible to predict the exact change in drift, the effect is
usually small.
OPA234, OPA2234, OPA4234
SBOS055B
www.ti.com
9
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
OPA2234PA
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
OPA2234U
ACTIVE
SOIC
D
8
OPA2234U-2/2K5
OBSOLETE
SOIC
D
8
OPA2234U/2K5
ACTIVE
SOIC
D
8
Green (RoHS
& no Sb/Br)
2500
Green (RoHS
& no Sb/Br)
TBD
Call TI
CU NIPDAU Level-3-260C-168 HR
OPA2234U/2K5E4
PREVIEW
SOIC
D
8
OPA2234U/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA2234UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA2234UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
2500
Green (RoHS
& no Sb/Br)
75
Green (RoHS
& no Sb/Br)
OPA2234UA/2K5E4
PREVIEW
SOIC
D
8
OPA2234UA/2K5G4
ACTIVE
SOIC
D
8
TBD
CU NIPDAU Level-3-260C-168 HR
Call TI
TBD
TBD
Call TI
Call TI
Call TI
Call TI
CU NIPDAU Level-3-260C-168 HR
OPA2234UAE4
PREVIEW
SOIC
D
8
OPA2234UAG4
ACTIVE
SOIC
D
8
OPA2234UE4
PREVIEW
SOIC
D
8
OPA2234UG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234E/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234E/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234E/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234E/2K5E4
PREVIEW
VSSOP
DGK
8
OPA234E/2K5G4
ACTIVE
VSSOP
DGK
8
TBD
TBD
2500
Green (RoHS
& no Sb/Br)
Addendum-Page 1
Call TI
Call TI
CU NIPDAU Level-3-260C-168 HR
Call TI
Call TI
Samples
(Requires Login)
OPA2234P
75
(3)
Call TI
Call TI
CU NIPDAU Level-3-260C-168 HR
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
OPA234EA/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234EA/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234EA/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234EA/2K5G4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234P
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
OPA234PA
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
OPA234U
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234U/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234U/2K5E4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA234UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
2500
Green (RoHS
& no Sb/Br)
OPA234UA/2K5E4
PREVIEW
SOIC
D
8
OPA234UA/2K5G4
ACTIVE
SOIC
D
8
OPA234UAE4
PREVIEW
SOIC
D
8
OPA234UAG4
OBSOLETE
SOIC
D
8
OPA234UG4
ACTIVE
SOIC
D
8
OPA4234PA
OBSOLETE
PDIP
N
14
OPA4234U
ACTIVE
SOIC
D
OPA4234U/2K5
ACTIVE
SOIC
OPA4234U/2K5E4
PREVIEW
OPA4234U/2K5G4
ACTIVE
TBD
TBD
TBD
Call TI
Call TI
CU NIPDAU Level-3-260C-168 HR
Call TI
Call TI
Call TI
Call TI
75
Green (RoHS
& no Sb/Br)
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
SOIC
D
14
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
TBD
TBD
Addendum-Page 2
CU NIPDAU Level-3-260C-168 HR
Call TI
Call TI
Samples
(Requires Login)
Call TI
Call TI
CU NIPDAU Level-3-260C-168 HR
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
16-Aug-2012
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
OPA4234UA
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA4234UA/2K5
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
OPA4234UA/2K5E4
PREVIEW
SOIC
D
14
OPA4234UA/2K5G4
ACTIVE
SOIC
D
14
OPA4234UAE4
PREVIEW
SOIC
D
14
OPA4234UAG4
ACTIVE
SOIC
D
14
OPA4234UE4
PREVIEW
SOIC
D
14
OPA4234UG4
ACTIVE
SOIC
D
14
TBD
2500
Green (RoHS
& no Sb/Br)
TBD
50
Green (RoHS
& no Sb/Br)
50
Green (RoHS
& no Sb/Br)
TBD
Call TI
Samples
(Requires Login)
Call TI
CU NIPDAU Level-3-260C-168 HR
Call TI
Call TI
CU NIPDAU Level-3-260C-168 HR
Call TI
Call TI
CU NIPDAU Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA2234 :
• Military: OPA2234M
NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
OPA2234U/2K5
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA2234UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA234E/250
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA234E/2K5
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA234EA/250
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA234EA/2K5
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA234U/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA234UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4234U/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
OPA4234UA/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2234U/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA2234UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA234E/250
VSSOP
DGK
8
250
210.0
185.0
35.0
OPA234E/2K5
VSSOP
DGK
8
2500
367.0
367.0
35.0
OPA234EA/250
VSSOP
DGK
8
250
210.0
185.0
35.0
OPA234EA/2K5
VSSOP
DGK
8
2500
367.0
367.0
35.0
OPA234U/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA234UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA4234U/2K5
SOIC
D
14
2500
367.0
367.0
38.0
OPA4234UA/2K5
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated