T E C H N O L O G Y
Memory Module Specification
KHX8500S3ULK2/4GX
4GB (2GB 256M x 64-Bit x 2 pcs.)
PC3-8500 CL5 204-Pin SODIMM Kit
DESCRIPTION:
Kingston's KHX8500S3ULK2/4GX is a kit of two 256M x 64-bit 2GB (2048MB) PC3-8500 CL5 SDRAM (Synchronous
DRAM) memory modules. Each module is based on sixteen 128M x 8-bit DDR3 FBGA components. Total kit capacity
is 4GB (4096MB). Each module pair has been tested to run at DDR3- 1066MHz at an ultra-low latency timing of
5-5-5-15 at 1.5V. The SPDs are programmed to JEDEC standard latency 1066Mhz timing of 7-7-7 at 1.5V. Each
204-pin SODIMM uses gold contact fingers and requires +1.5V. The electrical and mechanical specifications are as
follows:
FEATURES:
JEDEC standard 1.5V ± 0.075V Power Supply
VDDQ = 1.5V ± 0.075V
533MHz fCK for 1066Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 5,6,7,8
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 6(DDR3-1066)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4
which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C
Asynchronous Reset
PCB : Height 1.180” (30.00mm), double sided component
PERFORMANCE:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh Command Time (tRFCmin)
Row Active Time (tRASmin)
Power
UL Rating
Operating Temperature
7 cycles
50.63ns (min.)
110ns
37.5ns (min.)
1.320 W (operating per module)
94 V - 0
0o C to 85o C
Storage Temperature
-55o C to +100o C
Document No. 4805207-001.A00
06/02/09
Page 1
Kingston Technology
MODULE DIMENSIONS:
(units = millimeters)
w/ heatsink assembly
For more information, go to www.kingston.com
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not
operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to
run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to
computer components.
Document No. 4805207-001.A00
Page 2