MIC29302A
3A Fast Response LDO Regulator
Features
General Description
•
•
•
•
•
•
•
•
The MIC29302A is a high-current, low-dropout voltage
regulator that uses Microchip's proprietary Super βeta
PNP process with a PNP pass element. The 3A LDO
regulator features 560 mV (full load) dropout voltage
and very low ground current. Designed for high-current
loads, these devices also find applications in lower
current, low-dropout critical systems, where their
dropout voltages and ground current values are
important attributes.
High-Current Capability
Operating Input Voltage Range: 3V to 16V
Low Dropout Voltage
Low Ground Current
Accurate 1% Tolerance
Fast Transient Response
1.24V to 15V Adjustable Output Voltage
Packages: TO-263-5L and TO-252-5L
Applications
•
•
•
•
•
•
•
Processor Peripheral and I/O Supplies
High-Efficiency Green Computer Systems
Automotive Electronics
High-Efficiency Linear Lower Supplies
Battery-Powered Equipment
PC Add-In Cards
High-Efficiency Post-Regulator for Switching
Supply
Along with a total accuracy of ±2% (over temperature,
line, and load regulation) the regulator features very
fast transient recovery from input voltage surges and
output load current changes.
The MIC29302A has an adjustable output that can be
set by two external resistors to a voltage between
1.24V and 15V. In addition, the device is fully protected
against overcurrent faults, reversed input polarity,
reversed lead insertion, and overtemperature
operation. A TTL/CMOS logic enable (EN) pin is
available in the MIC29302A to shutdown the regulator.
When not used, the device can be set to continuous
operation by connecting EN to the input (IN). The
MIC29302A is available in the standard and 5-pin
TO-263 and TO-252 packages with an operating
junction temperature range of –40°C to +125°C.
Package Types
 2018 Microchip Technology Inc.
5
4
3
2
1
ADJ
OUT
GND
IN
EN
MIC29302AWD
5-Lead TO-252 (D)
(D-Pak) Adjustable Voltage
TAB
TAB
MIC29302AWU
5-Lead TO-263 (U)
(D2Pak) Adjustable Voltage
5
4
3
2
1
ADJ
OUT
GND
IN
EN
DS20005897B-page 1
MIC29302A
Typical Application Circuit
MIC29302A
TO-263 or TO-252
3.3VIN
IN
2.5VOUT
OUT
R1
Ÿ
CIN
EN
ADJ
R2
Ÿ
GND
CL
Functional Block Diagram
OUT
IN
BIAS
EN
ON/OFF
O.V.
LIMIT
16V
REFERENCE
FEEDBACK
ADJ
THERMAL
SHUTDOWN
GND
MIC29302A
DS20005897B-page 2
 2018 Microchip Technology Inc.
MIC29302A
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Supply Voltage (VIN) .......................................................................................................................... –20V to +20V
Enable Input Voltage (VEN) ............................................................................................................................–0.3V to VIN
Power Dissipation .................................................................................................................................. Internally Limited
ESD Rating (All Pins) ..............................................................................................................................................Note 1
Operating Ratings ‡
Operating Input Voltage ................................................................................................................................ +3V to +16V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions recommended.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = 4.184V; IOUT = 100 mA; TA = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C,
unless noted. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Output Voltage Accuracy
∆VOUT
–2
—
2
%
100 mA ≤ IOUT ≤ 3A, (VOUT + 1V) ≤
VIN ≤ 16V
Line Regulation
∆VOUT/
∆VIN
—
0.1
0.5
%
IOUT = 100 mA, (VOUT + 1V) ≤ VIN ≤
16V
Load Regulation
∆VOUT/
∆IOUT
—
0.2
1
%
VIN = VOUT + 1V, 100 mA ≤ IOUT ≤
3A
—
100
200
—
300
—
—
500
—
—
560
800
Output Voltage
Dropout Voltage (Note 2)
VDO
IOUT = 100 mA, VIN ≥ 3.184V
mV
IOUT = 1.5A, VIN ≥ 3.184V
IOUT = 2.75A, VIN ≥ 3.184V
IOUT = 3A, VIN ≥ 3.4V
Ground Current
Ground Current
Ground Pin Current at
Dropout
Current Limit
IGND
—
5
20
—
15
—
—
60
150
IOUT = 750 mA, VIN = VOUT + 1V
mA
IOUT = 1.5A
VIN = 0.5V less than specified
VOUT; IOUT = 10 mA
IOUT = 3A
IGNDDO
—
2
—
mA
ILIMIT
3
4
—
A
VOUT = 0V, Note 3
—
400
—
—
260
—
ISHDN
—
32
—
µA
Input Voltage VIN = 16V
VREF
1.215
—
1.267
V
Note 4
—
40
—
—
—
120
nA
—
Output Noise Voltage
(10 Hz to 100 kHz)
eN
Ground Pin Current in
Shutdown
µVRMS
CL = 10 µF
CL = 33 µF
Reference
Reference Voltage
Adjust Pin Bias Current
 2018 Microchip Technology Inc.
IADJ
DS20005897B-page 3
MIC29302A
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = 4.184V; IOUT = 100 mA; TA = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C,
unless noted. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
ENABLE Input
Input Logic Voltage
Enable Pin Input Current
Regulator Output Current in
Shutdown
Note 1:
2:
3:
4:
5:
VENABLE
IENABLE
IOUT-SHDN
—
—
0.8
2.4
—
—
—
15
30
—
—
75
—
—
2
—
—
4
—
10
—
—
—
20
V
Low (OFF)
High (ON)
VEN = 4.2V
µA
VEN = 0.8V
µA
Note 5
Specification for packaged product only
Dropout voltage is defined as the input-to-output differential when output voltage drops to 99% of its normal value with VOUT + 1V applied to VIN.
VIN = VOUT (nominal) + 1V. For example, use VIN = 4.3V for a 3.3V regulator or use 6V for a 5V regulator.
Employ pulse testing procedure for current-limit.
VREF ≤ VOUT ≤ VIN – 1, 3V ≤ VOUT ≤ 16V, 10 mA ≤ IL ≤ IFL, TJ ≤ TJ(MAX).
VEN ≤ 0.8V, VIN ≤ 16V and VOUT = 0V.
DS20005897B-page 4
 2018 Microchip Technology Inc.
MIC29302A
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+125
°C
—
Storage Temperature Range
TS
–65
—
+150
°C
—
Thermal Resistance TO-263
JC
—
3
—
°C/W
—
Thermal Resistance TO-252
JC
—
3
—
°C/W
—
Thermal Resistance TO-263
JA
—
28
—
°C/W
—
Thermal Resistance TO-252
JA
—
35
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
 2018 Microchip Technology Inc.
DS20005897B-page 5
MIC29302A
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Voltage.
Dropout Voltage vs. Input
FIGURE 2-4:
Voltage.
Adjust Pin Current vs. Input
FIGURE 2-2:
Voltage.
GND Pin Current vs. Input
FIGURE 2-5:
Voltage.
Load Regulation vs. Input
FIGURE 2-3:
Voltage.
Adjust Pin Voltage vs. Input
FIGURE 2-6:
Input Voltage.
Short-Circuit Current vs.
DS20005897B-page 6
 2018 Microchip Technology Inc.
MIC29302A
FIGURE 2-7:
Voltage.
Enable Pin Current vs. Input
FIGURE 2-10:
Temperature.
Enable Bias Current vs.
FIGURE 2-8:
Voltage.
Output Voltage vs. Input
FIGURE 2-11:
Temperature.
Dropout Voltage vs.
FIGURE 2-9:
Temperature.
GND Pin Current vs.
FIGURE 2-12:
Temperature.
Dropout Voltage vs.
 2018 Microchip Technology Inc.
DS20005897B-page 7
MIC29302A
FIGURE 2-13:
Temperature.
Short-Circuit Current vs.
FIGURE 2-16:
Temperature.
Line Regulation vs.
FIGURE 2-14:
Temperature.
Adjust Pin Voltage vs.
FIGURE 2-17:
Current.
Dropout Voltage vs. Output
FIGURE 2-15:
Temperature.
Adjust Pin Current vs.
FIGURE 2-18:
Current.
Dropout Voltage vs. Output
DS20005897B-page 8
 2018 Microchip Technology Inc.
MIC29302A
FIGURE 2-19:
Output Current.
Adjust Pin Voltage vs.
FIGURE 2-22:
FIGURE 2-20:
Current.
Line Regulation vs. Output
FIGURE 2-23:
Ripple Rejection (IOUT =
10 mA) vs. Frequency.
FIGURE 2-21:
Current.
GND Pin Current vs. Output
FIGURE 2-24:
Ripple Rejection (IOUT =
1.5A) vs. Frequency.
 2018 Microchip Technology Inc.
Output Noise vs. Frequency.
DS20005897B-page 9
MIC29302A
32mV
VOUT
3mV
3A
IOUT
200mA
IOUT = 3A
COUT = 1000μF
Time (1.00ms/div)
FIGURE 2-25:
vs. Frequency.
Ripple Rejection (IOUT = 3A)
FIGURE 2-28:
Line Transient Response
with 3A Load, 10 µF Output Capacitance.
6mV
6mV
VOUT
VOUT
11mV
11mV
15V
15V
VIN
VIN
5V
5V
IOUT = 3A
COUT = 1000μF
Time (1.00ms/div)
Time (1.00ms/div)
FIGURE 2-26:
Line Transient Response
with 3A Load, 1000 µF Output Capacitance.
3.3VIN
IN
IOUT = 3A
COUT = 10μF
FIGURE 2-29:
Load Transient Response
with 3A Load, 1000 µF Output Capacitance.
2.5VOUT
OUT
R1
Ÿ
CIN
EN
ADJ
GND
R2
Ÿ
CL
FIGURE 2-27:
MIC29302A Load Transient
Response Test Circuit.
DS20005897B-page 10
 2018 Microchip Technology Inc.
MIC29302A
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
TO-263
Pin Number
TO-252
Pin Name
Description
1
1
EN
Enable (Input): Active-high TTL/CMOS-compatible control input. Do
not float.
2
2
IN
INPUT: Unregulated input, +3V to +16V maximum.
3, TAB
3, TAB
GND
GND: TAB is also connected internally to the IC’s ground on both
packages.
4
4
OUT
OUTPUT: The regulator output voltage.
5
5
ADJ
Feedback Voltage: 1.24V feedback from external resistor divider.
 2018 Microchip Technology Inc.
DS20005897B-page 11
MIC29302A
4.0
APPLICATION INFORMATION
The MIC29302A is a high-performance, low-dropout
voltage regulator suitable for all moderate to
high-current voltage regulation applications. Its 560 mV
typical dropout voltage at full load makes it especially
valuable in battery-powered systems and as high
efficiency noise filters in post-regulator applications.
Unlike older NPN-pass transistor designs, where the
minimum dropout voltage is limited by the base-emitter
voltage drop and collector-emitter saturation voltage,
dropout performance of the PNP output is limited
merely by the low VCE saturation voltage.
A trade-off for the low dropout voltage is a varying base
driver requirement. But the Super ßeta PNP process
reduces this drive requirement to merely 1% of the load
current.
4.2
The MIC29302A has excellent response to variations in
input voltage and load current. By virtue of its low
dropout voltage, the device does not saturate into
dropout as readily as similar NPN-based designs. A
3.3V output Microchip LDO will maintain full speed and
performance with an input supply as low as 4.2V, and
will still provide some regulation with supplies down to
3.8V, unlike NPN devices that require 5.1V or more for
good performance and become nothing more than a
resistor under 4.6V of input. Microchip’s PNP
regulators provide superior performance in “5V to 3.3V”
conversion applications than NPN regulators,
especially when all tolerances are considered.
The MIC29302A regulator is fully protected from
damage due to fault conditions. Current limiting is
linear; output current under overload conditions is
constant. Thermal shutdown disables the device when
the die temperature exceeds the +125°C maximum
safe operating temperature. The output structure of the
regulators allows voltages in excess of the desired
output voltage to be applied without reverse current
flow. The MIC29302A offers a logic-level ON/OFF
control. When disabled, the device draws 32 µA at
maximum 16V input.
4.3
4.1
4.4
Capacitor Requirements
For stability and minimum output noise, a capacitor on
the regulator output is necessary. The value of this
capacitor is dependent upon the output current; lower
currents allow smaller capacitors. The MIC29302A is
stable with a 10 μF capacitor at full load.
This capacitor need not be an expensive low-ESR type;
aluminum electrolytics are adequate. In fact, extremely
low-ESR capacitors may contribute to instability.
Tantalum capacitors are recommended for systems
where fast load transient response is important.
When the regulator is powered from a source with high
AC impedance, a 0.1 µF capacitor connected between
input and GND is recommended.
VIN
OUT
IN
VOUT
Transient Response and 5V to
3.3V Conversion
Minimum Load Current
The MIC29302A regulator operates within a specified
load range. If the output current is too small, leakage
currents dominate and the output voltage rises.
A minimum load current of 10 mA is necessary for
proper regulation and to swamp any expected leakage
current across the operating temperature range.
For best performance the total resistance (R1+R2)
should be small enough to pass the minimum regulator
load current of 10 mA.
Adjustable Regulator Design
The output voltage can be programmed anywhere
between 1.25V and the 15V. Two resistors are used.
The resistor values are calculated by:
EQUATION 4-1:
V OUT
R1 = R2   ------------- – 1
 1.240

Where:
VOUT
= Desired output voltage.
Figure 4-2 shows component definition. Applications
with widely varying load currents may scale the
resistors to draw the minimum load current required for
proper operation (see the Minimum Load Current
section).
GND
FIGURE 4-1:
Linear Regulators Require
Only Two Capacitors for Operation.
DS20005897B-page 12
 2018 Microchip Technology Inc.
MIC29302A
EQUATION 4-2:
P D = I OUT  1.05V IN – V OUT 
MIC29302A
Ground current is, in the worst case, 5% of IOUT. Then
the heatsink thermal resistance is determined with this
formula:
VOUT
VIN
EQUATION 4-3:
R1
10μF
R2
T J  MAX  – T A
 SA = -------------------------------- –   JC +  CS 
PD
22μF
Where:
FIGURE 4-2:
Resistors.
4.5
Adjustable Regulator with
Enable Input
MIC29302A features an enable (EN) input that allows
ON/OFF control of the device. The EN input has
TTL/CMOS-compatible
thresholds
for
simple
interfacing with logic, or may be directly tied to VIN.
Enabling the regulator requires approximately 20 µA of
current into the EN pin.
4.6
Thermal Design
Linear regulators are simple to use. The most
complicated set of design parameters to consider are
thermal characteristics. Thermal design requires the
following application-specific parameters:
•
•
•
•
Maximum Ambient Temperature, TA
Output Current, IOUT
Output Voltage, VOUT
Input Voltage, VIN
First, calculate the power dissipation of the regulator
from these numbers and the device parameters from
this data sheet:
TJ(MAX) = Less than or equal to +125°C.
θCS
= Between 0°C/W and 2°C/W.
θJC
= Selected from Temperature
Specifications table for selected package
The heatsink may be significantly increased in
applications where the minimum input voltage is known
and is large compared to the dropout voltage. A series
input resistor can be used to drop excessive voltage
and distribute the heat between this resistor and the
regulator. The low-dropout properties of Microchip
Super βeta PNP regulators allow very significant
reductions in regulator power dissipation and the
associated
heatsink
without
compromising
performance. When this technique is employed, a
capacitor of at least 0.1 µF is needed directly between
the input and regulator ground.
Please refer to Application Note 9 and Application Hint
17 on Microchip’s website for further details and
examples on thermal design and heatsink
specification.
With no heatsink in the application, calculate the
junction temperature to determine the maximum power
dissipation that will be allowed before exceeding the
maximum junction temperature of the MIC29302A. The
maximum power allowed can be calculated using the
thermal resistance (θJA) of the D-Pak (TO-252)
adhering to the following criteria for the PCB design:
2 oz./ft.2, meaning 70 µm thickness, copper and
100 mm2 copper area for the MIC29302A.
For example, given an expected maximum ambient
temperature (TA) of +75°C with VIN = 3.3V, VOUT =
2.5V, and IOUT = 3A, first calculate the expected PD
using Equation 4-4.
 2018 Microchip Technology Inc.
DS20005897B-page 13
MIC29302A
EQUATION 4-4:
P D = 3.0A  1.05  3.3V – 2.5V  = 2.9W
Next, calculate the junction temperature for the
expected power dissipation:
EQUATION 4-5:
T J =   JA  P D  + T A =
 35C/W  2.9W  + 75C = 176.5C
Now determine the maximum power dissipation
allowed that would not exceed the IC’s maximum
junction temperature (125°C) without the use of a
heatsink by:
EQUATION 4-6:
P D  MAX  =  T J  MAX  – T A    JA
=  125C – 75C    35C/W 
= 1.428W
DS20005897B-page 14
 2018 Microchip Technology Inc.
MIC29302A
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
5-Pin TO-252*
Example
TAB
TAB
XXX
XXXXXXX
WNNNP
5-Pin TO-263*
MIC
29302AWD
4031P
Example
TAB
TAB
XXX
XXXXXXX
WNNNP
MIC
29302AWU
8604P
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
 2018 Microchip Technology Inc.
DS20005897B-page 15
MIC29302A
5-Lead TO-252 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20005897B-page 16
 2018 Microchip Technology Inc.
MIC29302A
5-Lead TO-263 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
 2018 Microchip Technology Inc.
DS20005897B-page 17
MIC29302A
NOTES:
DS20005897B-page 18
 2018 Microchip Technology Inc.
MIC29302A
APPENDIX A:
REVISION HISTORY
Revision A (November 2017)
• Converted Micrel document MIC29302A to Microchip data sheet DS20005897A.
• Minor text changes throughout.
• Updated the list of Features.
• Updated values and notes in Table 1-1.
• Rearranged sub-sections and revised values in
Application Information section to improve clarity.
Revision B (January 2018)
• Updated Current Limit values in Table 1-1.
 2018 Microchip Technology Inc.
DS20005897B-page 19
MIC29302A
NOTES:
DS20005897B-page 20
 2018 Microchip Technology Inc.
MIC29302A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Device
Examples:
X
PART NO.
X
X
–XX
Output Junction Temp. Package Media Type
Voltage
Range
Device:
MIC29302A:
Output Voltage:
<blank>= Adjustable
a) MIC29302AWD:
3A Fast Response LDO
Regulator, Adjustable
Voltage Option,
–40°C to +125°C Junction
Temperature Range, RoHSCompliant*, 5-Lead D-PAK
(TO-252) package, 80/Tube
b) MIC29302AWU:
3A Fast Response LDO
Regulator, Adjustable
Voltage Option,
–40°C to +125°C Junction
Temperature Range, RoHSCompliant*, 5-Lead D2PAK
(TO-263) package, 50/Tube
c) MIC29302AWD-TR:
3A Fast Response LDO
Regulator, Adjustable
Voltage Option,
–40°C to +125°C Junction
Temperature Range, RoHSCompliant*, 5-Lead D-PAK
(TO-252) package,
2,500/Reel
d) MIC29302AWU-TR:
3A Fast Response LDO
Regulator, Adjustable
Voltage Option,
–40°C to +125°C Junction
Temperature Range, RoHSCompliant*, 5-Lead D2PAK
(TO-263) package,
750/Reel
3A Fast Response LDO Regulator
Junction
Temperature
Range:
W
=
–40°C to +125°C, RoHS-Compliant*
Package:
D
U
=
=
5-Lead D-Pak (TO-252)
5-Lead D2Pak (TO-263)
Media Type:
<blank>=
TR =
<blank>=
TR =
80/Tube (TO-252 Package)
2,500/Reel (TO-252 Package)
50/Tube (TO-263 Package)
750/Reel (TO-263 Package)
* RoHS-Compliant with “high melting solder” exemption.
Note 1:
 2018 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20005897B-page 21
MIC29302A
NOTES:
DS20005897B-page 22
 2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
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Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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Information contained in this publication regarding device
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTSYSTEM
CERTIFIEDBYDNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2606-6
== ISO/TS16949==
 2018 Microchip Technology Inc.
DS20005897B-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
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support
Web Address:
www.microchip.com
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Tel: 408-436-4270
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Fax: 905-695-2078
DS20005897B-page 24
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
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Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
 2018 Microchip Technology Inc.
10/25/17