Intel® Solid-State Drive DC P3700 Series Specifications

Intel® Solid-State Drive DC P3700 Series
Capacities:
400GB, 800GB, 1.6TB, 2TB
Components
– Intel® 20nm MLC NAND Flash Memory
Form Factors
– 2.5-inch Form Factor

15mm Z-height

8639-compatible connector
– AIC Form Factor

Half-height, Half-length

Single slot x4 connector
PCIe* Gen3 X4
Performance1,2
– Seq R/W: Up to 2800/2000MB/s3
– IOPS Rnd 4KB4 70/30 R/W: Up to 265K
– IOPS Rnd 4KB4 R/W: Up to 460/175K
– Seq Latency (typ) R/W: 20/20µs
Operating System Support:
– Windows* Server 2012 R2, 2012,
2008 R2 x64
– Windows* 7, Windows* 8,
Windows* 8.1 (32/64bit)
– RHEL* 6.5, 6.6, 7.0
– SLES11 SP3*
– UEFI 2.3.1*
Reliability
– Uncorrectable Bit Error Rate (UBER):
1 sector per 1017 bits read
– Mean Time Before Failure (MTBF):
2 million hours
– T10 DIF protection
– Variable Sector Size: 512, 520, 528, 4096,
4104, 4160, 4224 Bytes
Compliance
– NVM Express* 1.0
– PCI Express* Base Specification Rev 3.0
– Enterprise SSD Form Factor Version 1.0a
– PCI Express Card Electro-Mechanical (CEM)
Specification Rev 2.0
Certifications and Declarations
– UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft*
WHQL*, VCCI*
1.
2.
3.
4.
5.
6.
7.
Product Specification
Power
– 2.5-inch: 3.3V and 12V Supply Rail
– AIC: 3.3V and 12V Supply Rail
– Enhanced power-loss data protection
– Active/Idle (TYP): Up to 25W/4W (TYP)
Endurance Rating
– Up to 65.7 PBW (Petabytes Written)5
– Up to 17 Drive Writes/day (JESD219 workload)
Temperature Specification
– Operating:

AIC: 0 to 55° C ambient with
specified airflow

2.5-inch: 0 to 35° C ambient,
0 to 70° C case with specified airflow
– Non-Operating6: -55 to 95° C
– Temperature monitoring (In-band and by
way of SMBUS)
– Thermal throttling when approaching
maximum operating temperature
Airflow
– AIC (55° C airflow towards IO bracket7)

400GB: 200 LFM

800GB, 1.6TB, 2.0TB: 300 LFM
– 2.5-inch (Airflow towards the connector)

400GB: 250/300 LFM (25/35° C)

800GB: 350/500 LFM (25/35° C)

1.6TB, 2TB: 450/600 LFM (25/35° C)
Weight
– AIC: 400/800GB up to 185gm
1.6TB, 2TB up to 195gm
– 2.5-inch: 400/800GB up to 115gm
1.6TB, 2TB up to 125gm
Shock
– 2.5-inch: 1,000 G/0.5msec
– AIC: 50 G Trapezoidal, 170 in/s
Vibration
– Operating: 2.17 GRMS (5-700Hz)
– Non-Operating: 3.13 GRMS (5-800Hz)
Altitude (Simulated)
– Operating: -1,000 to 10,000 ft
– Non-Operating: -1,000 to 40,000 ft
Product Ecological Compliance
– RoHS
Performance values vary by capacity and form factor
Performance specifications apply to both compressible and incompressible data
MB/s = 1,000,000 bytes/second
4KB = 4,096 bytes; 8KB = 8,192 bytes
1PB = 1015 Bytes
Please contact your Intel representative for details on the non-operating temperature range
Airflow out of server through PCIe Card Slot
Order Number: 330566-008US
Intel® Solid-State Drive DC P3700 Series
Ordering Information
Contact your local Intel sales representative for ordering information.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the
absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The information here is subject to change without notice. Do not finalize a design with this information.
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or
configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider
your purchase.
All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections
within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.
The products described in this document may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
This document contains information on products in the design phase of development.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be
obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htmIntel and the Intel logo are
trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2015 Intel Corporation. All rights reserved.
Product Specification
2
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Contents
1
Overview ................................................................................................................................................................................................................... 7
1.1
1.2
2
References ................................................................................................................................................................................................. 8
Terms and Acronyms............................................................................................................................................................................ 9
Product Specifications .................................................................................................................................................................................... 10
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
Capacity ................................................................................................................................................................................................... 10
Performance .......................................................................................................................................................................................... 10
Electrical Characteristics .................................................................................................................................................................. 12
Environmental Conditions .............................................................................................................................................................. 14
Product Regulatory Compliance .................................................................................................................................................. 15
Reliability Specifications .................................................................................................................................................................. 16
Temperature Sensor .......................................................................................................................................................................... 16
Power Loss Capacitor Test .............................................................................................................................................................. 16
Hot Plug Support ................................................................................................................................................................................. 16
Out of Band Management (SMBUS) ............................................................................................................................................ 17
Variable Sector Size Support ......................................................................................................................................................... 17
3
Mechanical Information .................................................................................................................................................................................. 18
4
Pin and Signal Descriptions .......................................................................................................................................................................... 20
4.1
4.2
5
2.5-inch Form Factor Pin Locations ............................................................................................................................................ 20
Pin Signal Definitions......................................................................................................................................................................... 20
Supported Command Sets............................................................................................................................................................................ 23
5.1
5.2
5.3
5.4
5.5
5.6
5.7
NVMe* Admin Command Set ......................................................................................................................................................... 23
NVMe I/O Command Set .................................................................................................................................................................. 23
Log Page Support ................................................................................................................................................................................ 24
SMART Attributes ................................................................................................................................................................................ 24
Temperature Statistics ...................................................................................................................................................................... 27
Drive Marketing Name Log .............................................................................................................................................................. 27
SET Feature Identifiers...................................................................................................................................................................... 28
6
NVMe Driver Support ...................................................................................................................................................................................... 30
7
Certifications and Declarations ................................................................................................................................................................... 31
Appendix A
IDENTIFY Data Structure ........................................................................................................................................................ 32
Appendix B
Vital Data Structure ................................................................................................................................................................... 40
Appendix C
Out of Band Temperature Sensor Read Out ................................................................................................................. 41
Appendix D
PCIe ID ............................................................................................................................................................................................. 42
Appendix E
SCSI Command Translation .................................................................................................................................................. 43
Appendix F
Add-in Card LED Decoder ...................................................................................................................................................... 44
March 2015
330566-008US
Product Specification
3
Intel® Solid-State Drive DC P3700 Series
Figures
Figure 3-1:
Figure 3-2:
Figure 4-1:
Figure A-1:
Intel SSD DC P3700 Series SFF Dimensions ....................................................................................................................... 18
Intel SSD DC P3700 Series PCIe Dimensions ..................................................................................................................... 19
2.5-inch Form Factor Pin Locations ........................................................................................................................................ 20
LED Location ...................................................................................................................................................................................... 44
Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Table 19:
Table 20:
Table 21:
Table 22:
Table 23:
Table 24:
Table 25:
Table 26:
Table 27:
Table 28:
Table 29:
Table 30:
Table 31:
Table 32:
Table 33:
Table 34:
Table 35:
Table 36:
Table 37:
Standard Information referenced in this document .............................................................................................................. 8
Glossary of Terms and Acronyms ................................................................................................................................................... 9
User Addressable Sectors ............................................................................................................................................................... 10
Random Read/Write Input/Output Operations Per Second (IOPS) ............................................................................. 10
Random Read/Write IOPS Consistency .................................................................................................................................... 11
Sequential Read and Write Bandwidth ..................................................................................................................................... 11
Latency ..................................................................................................................................................................................................... 11
Quality of Service ................................................................................................................................................................................ 12
Operating Voltage ............................................................................................................................................................................... 12
Power Consumption .......................................................................................................................................................................... 13
Temperature, Shock, Vibration ..................................................................................................................................................... 14
Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card) .......................................................................... 14
Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor) ....................................................... 15
Product Regulatory Compliance Specifications .................................................................................................................... 15
Reliability Specifications .................................................................................................................................................................. 16
Pin Definition for 2.5-inch Form Factor (8639 connector specification) ................................................................... 20
Pin Definition for Add-In Card (Half Height Half Length) Form Factor ....................................................................... 22
SMART Attributes (Log Identifier 02h) ...................................................................................................................................... 24
Additional SMART Attributes (Log Identifier CAh) ............................................................................................................... 26
Temperature Statistics (Log Identifier C5h) ............................................................................................................................ 27
Drive Marketing Name Log (Log Identifier DDh) ................................................................................................................... 27
Set Max LBA Setting - Command Dword 11 and Command Dword 12 ..................................................................... 28
Status Code - Set Max LBA Command Specific Status Values ....................................................................................... 29
C6h - Set/Get Power Governor Setting – Command Dword 11 .................................................................................... 29
Status Codes - Power Governor Setting Command Specific Status Values ............................................................ 29
D5h – Reset Timed Workload Counters – Command Dword 11 ................................................................................... 29
NVMe Driver Support ........................................................................................................................................................................ 30
Device Certifications and Declarations ...................................................................................................................................... 31
Identify Controller ............................................................................................................................................................................... 32
Power State Descriptor ..................................................................................................................................................................... 36
Identify Namespace ............................................................................................................................................................................ 37
LBA Format Data Structure ............................................................................................................................................................. 39
Vital Product Data Structure (VPD) ............................................................................................................................................. 40
Capability List Pointer (Out of Band Temperature Sensor) ............................................................................................. 40
Register 0x05 read out format ...................................................................................................................................................... 41
PCIe ID ...................................................................................................................................................................................................... 42
LED Functionality................................................................................................................................................................................. 44
Product Specification
4
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Revision History
Revision
Number
001
002
003
004
Description
Revision Date
June 2014
 Initial release
 Driver and temperature updates
July 2014
 Updated performance information
 Updated power number for 400GB
September 2014
 Update driver/OS support list
September 2014
 Endurance rating corrected
 Added clarification in SMART critical warning
005
October 2014
 Corrected error is QoS percentile
 Modified power governor setting target for 01 and 02
 Updated Endurance Specifications
006
 Updated Log Identifier 0xCA and Identify Data Structure
 SMBUS footnote
January 2015
 Added RHEL 6.6 Operating System Support
 Updated Quality of Service values
007
 Modified C7 (CRC Error Count) Description
March 2015
 Modified Table 16 footnote
 Updated Power on to Ready specification
008
March 2015
 Updated IDENTIFY Data Structure
§
March 2015
330566-008US
Product Specification
5
Intel® Solid-State Drive DC P3700 Series
This page intentionally left blank.
Product Specification
6
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
1
Overview
This document describes the specifications and capabilities of the Intel® Solid-State Drive (SSD)
Data Center P3700 Series.
P3700 Series is a PCIe Gen3 SSD architected with the new high performance controller interface – NVMe
(Non-Volatile Memory express) delivering leading performance, low latency and Quality of Service. Matching
the performance with world-class reliability and endurance, P3700 Series offers a range of capacity – 400GB,
800GB, 1.6TB and 2TB in both Add-In card and 2.5-inch form factor.
With PCIe Gen3 support and NVMe queuing interface, the P3700 Series delivers excellent sequential read
performance of up to 2.8GB/s and sequential write speeds of up to 2.0GB/s. P3700 Series delivers very high
random read IOPS of 460K and random write IOPS of 175K for 4KB operations. Taking advantage of the direct path
from the storage to the CPU by means of NVMe, P3700 Series exhibits low latency of less than 20 μs for sequential
access to the SSD.
P3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and
SSD NAND management techniques to extend SSD write endurance up to 17 drive writes per day for 5 years.
The 2.5-inch P3700 Series takes advantage of the 8639 connector and provides
hot-pluggable removal and insertion providing in-service replacement options.
P3700 Series includes these key features:
 Consistently High IOPS and throughput
 Sustained low latency
 High Endurance Technology (HET)
 Variable Sector Size and End-to-End data-path protection
 Enhanced power-loss data protection
 Power loss protection capacitor self-test
 Out of band management
 Thermal throttling and monitoring
March 2015
330566-008US
Product Specification
7
Intel® Solid-State Drive DC P3700 Series
1.1
References
Table 1:
Standard Information referenced in this document
Date
Title
Location
Jan 2013
Enterprise SSD Form Factor Version 1.0a
http://www.ssdformfactor.org
Feb 2012
NVMe Revision 1.0c
http://www.nvmexpress.org
Nov 2010
PCIe Base Specification Revision 3.0
http://pcisig.com
July 2012
Solid-State Drive (SSD) Requirements and Endurance Test
Method (JESD219)
http://www.jedec.org/standardsdocuments/results/jesd219
Sept 2010
Solid-State Drive (SSD) Requirements and Endurance Test
Method (JESD218)
http://www.jedec.org/standardsdocuments/docs/jesd218/
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
June 2009
RoHS
http://qdms.intel.com/
Click Search MDDS Database and
search for material description
datasheet
International Electrotechnical Commission EN 61000
4-2 (Electrostatic discharge immunity test)
4-3 (Radiated, radio-frequency, electromagnetic field immunity
test)
4-4 (Electrical fast transient/burst immunity test)
4-5 (Surge immunity test)
4-6 (Immunity to conducted disturbances, induced by radiofrequency fields)
4-11 (Voltage Variations, voltage dips, short interruptions and
voltage variations immunity tests)
http://www.iec.ch/
ENV 50204
(Radiated electromagnetic field from digital radio telephones)
http://www.dbicorporation.com/
radimmun.htm/
1995
1996
1995
1995
1997
1994
1995
Product Specification
8
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
1.2
Terms and Acronyms
Table 2:
Glossary of Terms and Acronyms
Term
Definition
ATA
Advanced Technology Attachment
CRC
Cyclic Redundancy Check
DAS
Device Activity Signal
DMA
Direct Memory Access
ECC
Error Correction Code
EEPROM
EXT
FPDMA
Electrically Erasable Programmable Read Only Memory
Extended
First Party Direct Memory Access
GB
Gigabyte
Note: The total usable capacity of the SSD may be less than the total physical capacity because a
small portion of the capacity is used for NAND flash management and maintenance purposes.
Gb
Gigabit
HDD
Hard Disk Drive
HET
High Endurance Technology
KB
Kilobyte
I/O
Input/Output
IOPS
Input/Output Operations Per Second
ISO
International Standards Organization
LBA
Logical Block Address
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NOP
No Operation
NVMe
PB
Non-Volatile Memory Express
Petabyte
PCB
Printed Circuit Board
RDT
Reliability Demonstration Test
RMS
Root Mean Square
SSD
Solid-State Drive
TB
Terabyte
TYP
Typical
UBER
Uncorrectable Bit Error Rate
VPD
Vital Product Data
§
March 2015
330566-008US
Product Specification
9
Intel® Solid-State Drive DC P3700 Series
2
Product Specifications
2.1
Capacity
Table 3:
User Addressable Sectors
Intel SSD DC P3700 Series
Unformatted Capacity
(Total User Addressable Sectors in LBA Mode)
400GB
781,422,768
800GB
1,562,824,368
1.6TB
3,125,627,568
2TB
3,907,029,168
NOTES:
1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes or 520 bytes or 528 bytes.
LBA count shown represents total user storage capacity and will remain the same throughout the life
of the drive.
The total usable capacity of the SSD may be less than the total physical capacity because a small portion
of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.
2.2
Performance
Table 4:
Random Read/Write Input/Output Operations Per Second (IOPS)
Specification1
Unit
Random 4KB 70/30 Read/Write
(up to) 2
Intel SSD DC P3700 Series
400GB
800GB
1.6TB
2TB
IOPS
150,000
200,000
240,000
265,000
Random 8KB 70/30 Read/Write
(up to) 3
IOPS
75,000
100,000
140,000
150,000
Random 4KB Read (up to)2
IOPS
450,000
460,000
450,000
450,000
Random 4KB Write (up to)
IOPS
75,000
90,000
150,000
175,000
Random 8KB Read (up to)3
IOPS
275,000
285,000
290,000
295,000
Random 8KB Write (up to)
IOPS
32,000
45,000
75,000
90,000
NOTES:
1.
Performance measured using IOMeter* on Windows* Server 2012 R2 driver with Queue Depth 32 and 4 workers.
Measurements are performed on a full Logical Block Address (LBA) span of the drive. Power mode set at 25W.
2.
4KB = 4,096 bytes
3.
8KB = 8,192 bytes
Product Specification
10
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Table 5:
Random Read/Write IOPS Consistency
Specification1
Unit
Intel SSD DC P3700 Series
400GB
800GB
1.6TB
2TB
Random 4KB Read (up to)2
%
90
90
90
90
Random 4KB Write (up to)
%
90
90
90
90
Random 8KB Read (up to)3
%
90
90
90
90
Random 8KB Write (up to)
%
90
90
90
90
NOTES:
1.
Performance consistency measured using IOMeter* based on Random 4KB with total queue depth of 128, measured as
(IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed
on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all
background activities required for normal operation and data reliability
2.
4KB = 4,096 bytes
3.
8KB = 8,192 bytes
Table 6:
Sequential Read and Write Bandwidth
Intel SSD DC P3700 Series
Specification
Unit
400GB
800GB
1.6TB
2TB
Sequential Read (up to)1
MB/s
2,700
2,800
2,800
2,800
Sequential Write (up to)1
MB/s
1,080
1,900
1,900
2,000
NOTES:
1.
Performance measured using IOMeter* with 128 KB (131,072 bytes) of transfer size with Queue
Depth 128. Power mode set at 25W.
Table 7:
Latency
Specification
Intel SSD DC P3700 Series
Latency1 (TYP)
Read Sequential/Random
Write Sequential/Random
Power On to PCIe Config Ready2Power On to
Controller Ready3
20/115 µs
20/25 µs
2.0 sec (TYP)
10.0 sec (TYP)
NOTES:
1.
Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload using
Windows Server 2012 R2 driver. Power mode set at 25W.
2.
Power On To Ready time measured from de-assertion of PCIe* reset to PCIe Config Ready state.
3.
Power On to Controller ready signifies when drive can begin receiving PCIe commands from host based on a single
#PERESET. For power on from unsafe shutdown, power on to controller ready can take up to 20 seconds.
March 2015
330566-008US
Product Specification
11
Intel® Solid-State Drive DC P3700 Series
Table 8:
Quality of Service
Specification
Unit
Intel SSD DC P3700 Series
QD = 1
QD = 128
Quality of Service1,2 (99%)
Reads
ms
0.120
0.750
Writes
ms
0.090
11
Reads
ms
4
5
Writes
ms
0.500 (400GB)
Quality of Service1,2 (99.99%)
25
0.250 (800GB, 1.6TB, 2.0TB)
NOTES:
1.
Device measured using IOMeter. Quality of Service measured using 4KB (4,096 bytes) transfer size on a random
workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but
including all background activities required for normal operation and data reliability.
2.
2.3
Based on Random 4KB QD=1,128 workloads, measured as the time taken for 99.0 (or 99.99) percentile of commands
to finish the round-trip from host to drive and back to host.
Electrical Characteristics
Table 9:
Operating Voltage
Electrical Characteristics
3.3V Operating Characteristics: (Add-in Card only)
Operating Voltage range
Rise time (Max/Min)
Fall time (Max/Min)1
Noise level
Min Off time2
Inrush Current (Typical Peak) 3
Max Average Current
12V Operating Characteristics:
Operating Voltage range
Rise time (Max/Min)
Fall time (Max/Min)1
Noise level
Min Off time2
Inrush Current (Typical Peak) 3
Max Average Current
Product Specification
12
Intel SSD DC P3700 Series
3.3 V (±10%)
50ms/1ms
5s/1ms
300 mV pp 10Hz – 100 KHz
50 mV pp 100KHz – 20 MHz
3 seconds
1.5 A
3.0 A
12 V (+10%/-20%)
50ms/1ms
5s/1ms
1000 mV pp 10Hz – 100 KHz
100 mV pp 100KHz – 20 MHz
3 seconds
1.5 A
2.1 A/ 2.45 A (Add-in Card/ 2.5-inch FF)
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Electrical Characteristics
Intel SSD DC P3700 Series
3.3Vaux Operating Characteristics:
Operating Voltage range
Rise time (Max/Min)
Fall time (Max/Min)1
Noise level
3.3 V (±9%)
50ms/1ms
5s/1ms
300 mV pp 10Hz – 100 KHz
50 mV pp 100KHz – 20 MHz
20mA/1mA (AIC/2.5-inch FF)
Max Current
Notes:
1.
Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss
management.
2.
The drive must be powered off for at least 500msec before powering on.
3.
Measured during initial power supply application. Typically this will be seen within 2 seconds of initial power up. Inrush
specified for 12V and 3.3V supply, not the 3.3Vaux.
Note: 3.3Vaux is optional, not needed for power up or functionality. 3.3Vaux is needed for accessing VPD page
by means of SMBUS for both form factors.
Table 10: Power Consumption
Specification
Unit
Intel SSD DC P3700 Series
400GB
800GB
1.6TB
2TB
Active Write - Average1
W
12
18
22
25
2
Active Read - Average
W
9
9
10
11
Idle
W
4
4
4
4
Notes:
1.
The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential writes. Average power is
measured using scope trigger over a 100 ms sample period.
2.
The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential reads.
March 2015
330566-008US
Product Specification
13
Intel® Solid-State Drive DC P3700 Series
2.4
Environmental Conditions
Table 11: Temperature, Shock, Vibration
Temperature
Temperature
Operating1
Non-operating3
Temperature Gradient4
Operating
Non-operating
Add-In card form factor
2.5-inch form factor
Ambient: 0 – 55o C / 0 -40o C2
-55–95o C
Ambient: 0–35o C, Case: 0-70o C
30o C/hr (Typical)
30o C/hr (Typical)
30o C/hr (Typical)
30o C/hr (Typical)
5–95%
5–95%
5–95%
5–95%
Humidity
Operating
Non-operating
Shock and Vibration
Range
Shock5
Operating
Non-operating
50 G Trapezoidal, 170 in/s
50 G Trapezoidal, 170 in/s
1,000 G (Max) at 0.5 msec
1,000 G (Max) at 0.5 msec
Vibration6
Operating
Non-operating
2.17 GRMS (5-700 Hz) Max
3.13 GRMS (5-800 Hz) Max
2.17 GRMS (5-700 Hz) Max
3.13 GRMS (5-800 Hz) Max
Notes:
1.
Operating temperature implies ambient air temperature under defined airflow in Tables 12 and 13.
2.
0-55° C is for airflow from the server towards the card and 0-40° C is for airflow into the server.
3.
Please contact your Intel representative for details on the non-operating temperature range.
4.
Temperature gradient measured without condensation.
5.
Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS)
value.
6.
Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.
Table 12: Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card)
Airflow
Direction
Unit
Towards
the server
LFM
Out of the
server
LFM
NOTE:
Ambient
Temperature
Intel SSD DC P3700 Series
400GB
800GB
1.6TB
2TB
40o C
200
300
300
300
55o C
200
300
300
300
For Add-In cards airflow can be for both the directions. Airflow specified is based on approach velocity.
Product Specification
14
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Table 13: Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor)
Airflow
Definition
Airflow Along
Drive1
Approach
Airflow2
NOTE:
1.
2.
2.5
Unit
Ambient
Temperature
Intel SSD DC P3700 Series
400GB
800GB
1.6TB
2TB
LFM
35o C
300
500
650
650
LFM
25o C
250
350
450
450
LFM
35o C
70
120
155
155
LFM
25o C
60
85
110
110
It is recommended that airflow for 2.5-inch form factor should be towards the server, from the non-connector
side to the connector side. Airflow is specified across the surface of the drive. Spacing between two SSDs is
assumed to be 3mm.
The approach velocity of the airflow will be less than the airflow along the surface. Approach area
of 1.35 ft2 is assumed.
Product Regulatory Compliance
Intel SSD DC P3700 Series meets or exceeds the following regulatory or certification requirements.
Table 14: Product Regulatory Compliance Specifications
Title
TITLE 47-Telecommunications CHAPTER 1 –
FEDERAL COMMUNMICATIONS COMMISSION PART
15 – RADIO FREQUENCY DEVICES
ICES*-003, Issue 4 Interference-Causing Equipment
Standard Digital Apparatus
Description
FCC Part 15B Class A
Region For Which
Conformity Declared
USA
CA/CSA-CEI/IEC CISPR 22:10. This is
CISPR 22:2008 with Canadian
Modifications
Canada
IEC* 55024 Information Technology Equipment –
Immunity characteristics – Limits and methods of
measurement CISPR24:2010
EN-55024: 2010 and its amendments
European Union
IEC 55022 Information Technology Equipment –
Radio disturbance Characteristics – Limits and
methods of measurement CISPR24:2008 (Modified)
EN-55022: 2010 and its amendments
European Union
EN-60950-1 2nd Edition
Information Technology Equipment –
Safety – Part 1: General Requirements
USA/Canada
UL/CSA EN-60950-1 2nd Edition
Information Technology Equipment –
Safety – Part 1: General Requirements
USA/Canada
March 2015
330566-008US
Product Specification
15
Intel® Solid-State Drive DC P3700 Series
2.6
Reliability Specifications
Intel SSD DC P3700 Series meets or exceeds SSD endurance and data retention requirements as specified in the
JESD218 standard. Reliability specifications are listed in the following table.
Table 15: Reliability Specifications
Parameter
Value
Uncorrectable Bit Error Rate (UBER)
Uncorrectable bit error rate will not exceed one sector in the
specified number of bits read. In the unlikely event of a nonrecoverable read error, the SSD will report it as a read failure to the
host; the sector in error is considered corrupt and is not returned to
the host.
< 1 sector per 1017 bits read
Mean Time Between Failures (MTBF)
Mean Time Between Failures is estimated based on Telcordia*
methodology and demonstrated through Reliability Demonstration
Test (RDT).
2 million hours
Data Retention
The time period for retaining data in the NAND at maximum
rated endurance.
Endurance Rating
The number of drive writes such that the SSD meets the
requirements according to the JESD218 standard. Endurance rating
verification is defined to establish UBER <1E-16 at 60% upper
confidence limit.
3 months power-off retention once SSD
reaches rated write endurance at 40° C
400GB: 7.3 PBW
800GB: 14.6 PBW
(10 drive writes/day*)
1.6TB: 43.8 PBW
(15 drive writes/day*)
2.0TB: 65.7 PBW
(17 drive writes/day*)
Note: Petabytes Written (PBW). Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD
requirements.
2.7
Temperature Sensor
P3700 Series has an internal temperature sensor with an accuracy of +/-2° C over a range of -10° C to +85° C which
can be monitored using NVMe Health Log.
For more information on sensor reading see SMART attributes section. In addition, drive will provide out of band
access to temperature by means of SMBUS. The sensor has an accuracy of +/- 3° C over a range of -20° C to 125° C.
SMBUS temperature sensor will not be reported in NVMe Health Log.
2.8
Power Loss Capacitor Test
P3700 Series supports testing of the power loss capacitor, which can be monitored using SMART attribute critical
warning in log page identifier 02h, byte 0, bit 4.
2.9
Hot Plug Support
2.5-inch form factor will support surprise hot plug feature in capable platforms and OSs. P3700 Series supports
hot insertion and removal and surprise hot insertion by means of presence detect and link-up detect. On surprise
hot removal during IOs, P3700 Series will ensure the integrity of already committed data on the media and commit
acknowledged writes to the media.
Product Specification
16
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
2.10
Out of Band Management (SMBUS)
Intel SSD DC P3700 Series provides out of band management by means of SMBUS interface. This requires 3.3V
Auxiliary voltage. SMBUS accesses a VPD page as listed in Appendix B through address 0X53.
Temperature sensor is accessed through address 0x1B. For temperature sensor access, temperature can be read by
the BMC (base) using Read Temperature Data Register (0x05) by means of SMBUS 0x1B. Bits [11:0] return raw
ambient temperature.
Host may also see 0x66 address in a bus scan. This is only used for write protecting the EEPROM during
manufacturing.
NOTES:
1.
2.
2.11
In certain tools the address for the VPD and temperature sensor will appear as 0xA6 and 0x36
respectively, due to bit shift.
BMC should not access the SMBUS address within 100msec of device power up, it may experience
some glitch on the bus
Variable Sector Size Support
P3700 Series supports 512, 520, 528, 4096, 4104, 4160 and 4224 byte sector sizes. P3700 Series will also support
DIF as specified in NVMe 1.0 specification. Host sector sizes supporting DIF are 512 bytes and 4096 bytes with a PI
(Protection Information) of 8 bytes.
In terms of protection information action (PRACT), bit 29 of DWORD12 in READ/WRITE command should not be
equal to 1. Device only supports PRACT=0 implying protection information is passed to the SSD and checked by
the SSD.
§
March 2015
330566-008US
Product Specification
17
Intel® Solid-State Drive DC P3700 Series
3
Mechanical Information
Figures 3-1 and 3-2 show the physical package information for the Intel SSD DC P3700 Series in the 2.5-inch form
factors. All dimensions are in millimeters.
Figure 3-1:
Intel SSD DC P3700 Series SFF Dimensions
X – Length
Y - Width
Z - Height
100.45 Max
69.85 +/- 0.25
15.0 +0/-0.5
Note: Length does not include 0.3 connector protrusion
Product Specification
18
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Figure 3-2:
Intel SSD DC P3700 Series PCIe Dimensions
§
March 2015
330566-008US
Product Specification
19
Intel® Solid-State Drive DC P3700 Series
4
Pin and Signal Descriptions
4.1
2.5-inch Form Factor Pin Locations
Figure 4-1:
2.5-inch Form Factor Pin Locations
Note: 2.5-inch connector supports built in latching capability.
4.2
Pin Signal Definitions
Table 16: Pin Definition for 2.5-inch Form Factor (8639 connector specification)
Pin
S1
Name
Pin
Name
Description
Ground
E7
REFCLK0+
Reference clock port 0
S2
Not used (SATA/SAS)
E8
REFCLK0-
Reference clock port 0
S3
Not used (SATA/SAS)
E9
GND
Ground
Ground
E10
PETp0
Transmitter differential pair, Lane 0
S5
Not used (SATA/SAS)
E11
PETn0
Transmitter differential pair, Lane 0
S6
Not used (SATA/SAS)
E12
GND
Ground
GND
Ground
E13
PERn0
Receiver differential pair, Lane 0
E1
REFCLK1+
Reference clock port 1
(not used)
E14
PERp0
Receiver differential pair, Lane 0
E2
REFCLK1-
Reference clock port 1
(not used)
E15
GND
Ground
E3
3.3Vaux
3.3V auxiliary power
E16
RSVD
Reserved
E4
PERST1#
Fundamental reset port 1
(not used)
S8
GND
Ground
E5
PERST0#
Fundamental reset port 0
S9
E6
RSVD
S4
S7
GND
Description
GND
Not used (SATAe/SAS)
Reserved
S10
P1
Not used (SATAe/SAS)
S11
P2
Not used (SATAe/SAS)
S12
Not used (SATAe/SAS)
P3
Not used (SATAe)
S13
Not used (SATAe/SAS)
Product Specification
20
Not used (SATAe/SAS)
GND
Ground
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Pin
Name
Description
Pin
Name
Description
P4
IfDet_N
Interface detect (drive type)
S14
GND
Ground
P5
GND
Ground
S15
RSVD
Reserved
P6
GND
Ground
S16
GND
Ground
P7
Not used (SATA/SAS)
S17
PETp1
Transmitter differential pair, Lane 1
P8
Not used (SATA/SAS)
S18
PETn1
Transmitter differential pair, Lane 1
P9
Not used (SATA/SAS)
S19
GND
Ground
P10
PRSNT_N
Presence detect
(also used for drive type)
S20
PERn1
Receiver differential pair, Lane 1
P11
Activity
Activity signal from the drive
S21
PERp1
Receiver differential pair, Lane 1
P12
Hot-Plug
Ground
S22
GND
Ground
P13
+12V_pre
12V power
S23
PETp2
Transmitter differential pair, Lane 2
P14
+12V
12V power
S24
PETn2
Transmitter differential pair, Lane 2
P15
+12V
12V power
S25
GND
Ground
S26
PERn2
Receiver differential pair, Lane 2
S27
PERp2
Receiver differential pair, Lane 2
S28
GND
Ground
E17
PETp3
Transmitter differential pair, Lane 3
E18
PETn3
Transmitter differential pair, Lane 3
E19
GND
Ground
E20
PERn3
Receiver differential pair, Lane 3
E21
PERp3
Receiver differential pair, Lane 3
E22
GND
Ground
E23
SMCLK
SMBus clock
E24
SMDAT
SMBus data
E25
DualPortEn_N
Dual port enable
NOTES:
 SMCLK and SMDAT routes to an internal EEPROM which contains Vital Product Data (VPD).
 PRSNT_N is kept open by the P3700 Series.
 IfDet_N is grounded by P3700 Series.
 DualPortEn_N pin should be left un-connected or un-driven by the system to enable single port operation with
all 4 lanes. If un-connected, P3700 Series will pull it high. However, if the pin is asserted by the system (driven
low by storage backplane), then P3700 Series will be configured as x2 lanes
 Transmit differential pair lanes have 220 nF of AC coupling capacitance.
 P11 is used for activity. When idle, logic level is low (LED Solid On). During IO activity and formatting,
pin toggles 250msec high, 250msec low signal.
 P3700 Series only uses REFCLK0+ and REFCLK0- as reference clock pair.
 P3700 Series only uses PERST0# as a fundamental reset.
 3.3Vaux is only needed during SMBUS access to the VPDROM.
March 2015
330566-008US
Product Specification
21
Intel® Solid-State Drive DC P3700 Series
Table 17: Pin Definition for Add-In Card (Half Height Half Length) Form Factor
Side B
Pin
Name
Side A
Description
Name
Description
1
+12V
12V power
PRSNT1#
Hot-Plug presence detect
2
+12V
12V power
+12V
12V power
3
+12V
12V power
+12V
12V power
4
GND
Ground
GND
Ground
5
SMCLK
SMBus(System Management Bus) clock
JTAG2
TCK (Test Clock), clock input for JTAG
interface
6
SMDAT
SMBus (System Management Bus) data
JTAG3
TDI (Test Data Input)
7
GND
Ground / UART_HOST
JTAG4
TDO (Test Data Output)
8
+3.3V
3.3V power
JTAG5
TMS (Test Mode Select)
9
JTAG1
TRST# (Test Reset) resets the JTAG interface
+3.3V
3.3V power
10
3.3Vaux
3.3V auxiliary power
+3.3V
3.3V power
11
WAKE#
Signal for Link reactivation
PERST#
Fundamental reset
Mechanical Key
12
RSVD
Reserved
GND
Ground
13
GND
Ground
REFCLK+
Reference clock (differential pair)
14
PETp0
Transmitter differential pair, Lane 0
REFCLK-
Reference clock (differential pair)
15
PETn0
Transmitter differential pair, Lane 0
GND
Ground
16
GND
Ground
PERp0
Receiver differential pair, Lane 0
17
PRSNT2#
Hot-Plug presence detect
PERn0
Receiver differential pair, Lane 0
18
GND
Ground
GND
Ground
End of the x1 Connector
19
PETp1
Transmitter differential pair, Lane 1
RSVD
Reserved
20
PETn1
Transmitter differential pair, Lane 1
GND
Ground
21
GND
Ground
PERp1
Receiver differential pair, Lane 1
22
GND
Ground
PERn1
Receiver differential pair, Lane 1
23
PETp2
Transmitter differential pair, Lane 2
GND
Ground
24
PETn2
Transmitter differential pair, Lane 2
GND
Ground
25
GND
Ground
PERp2
Receiver differential pair, Lane 2
26
GND
Ground
PERn2
Receiver differential pair, Lane 2
27
PETp3
Transmitter differential pair, Lane 3
GND
Ground
28
PETn3
Transmitter differential pair, Lane 3
GND
Ground
29
GND
Ground
PERp3
Receiver differential pair, Lane 3
30
RSVD
Reserved
PERn3
Receiver differential pair, Lane 3
31
PRSNT2#
Hot-Plug presence detect
GND
Ground
32
GND
Ground
RSVD
Reserved
End of the x4 Connector
NOTES:
 All pins are numbered in ascending order from the left to the right, with side A on the top of the centerline and
side B on the bottom of the centerline, use the reference drawing in Fig2, with the logo visible.
 The PCI Express interface pins PETpx, PETnx, PERpx, and PERnx are named with the following convention: “PE”
stands for PCI Express high speed, “T” for Transmitter, “R” for Receiver, “p” for positive (+) and “n” for negative (-).
 The sequential mating for Hot-Plug is accomplished by staggering the edge fingers on the add-in card.
§
Product Specification
22
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
5
Supported Command Sets
Intel SSD DC P3700 Series supports all mandatory Admin and I/O commands defined in NVMe
(Non-Volatile Memory Express) revision 1.0.
5.1
NVMe Admin Command Set
P3700 Series supports all mandatory NVMe commands, which consists of:

Delete I/O Submission Queue

Delete I/O Completion Queue

Create I/O Submission Queue

Create I/O Completion Queue

Get Log Page

Identify

Abort

SET Features

GET Features

Asynchronous Event Notification
P3700 Series also supports the following optional I/O commands defined in NVMe revision 1.0:

Firmware Activate

Firmware Image Download

Format NVM
Note:
5.2
See Appendix A, “Identify Controller Data Structure” for details on commands
and capabilities.
NVMe I/O Command Set
P3700 Series supports all the mandatory NVMe I/O command set defined in NVMe 1.0
specification, which consists of:

Flush

Write

Read
Additionally, the following optional commands are supported:

Write Uncorrectable

Dataset Management (De-allocate only)
Note: See Appendix E, “SCSI Command Translation Table” for details on SCSI supported commands and
capabilities.
March 2015
330566-008US
Product Specification
23
Intel® Solid-State Drive DC P3700 Series
5.3
Log Page Support
Intel SSD DC P3700 Series supports the following mandatory log pages defined in NVMe 1.0
specification:

Error Information (Log Identifier 01h)

SMART/ Health Information (Log Identifier 02h)

Firmware Slot Information (Log Identifier 03h)
Note: See NVMe 1.0 version of the specification for the log page content. Additionally, P3700 Series will support
the following vendor unique log pages:
5.4

Log Page Directory (Log Identifier C0h)

Temperature Statistics (Log Identifier C5h)

Vendor Unique SMART Log (Log Identifier CAh)
SMART Attributes
The following table lists the SMART attributes supported by the P3700 Series in accordance with
NVMe 1.0 specification.
Table 18: SMART Attributes (Log Identifier 02h)
# of
Bytes
Attribute
Description
0
1
Critical Warning: These bits if set, flag various
warning sources.
Bit 0: Available Spare is below Threshold
Bit 1: Temperature has exceeded Threshold
Bit 2: Reliability is degraded due to excessive media
or internal errors
Bit 3: Media is placed in Read- Only Mode
Bit 4: Volatile Memory Backup System has failed
(e.g., enhanced power loss capacitor test failure)
Bits 5-7: Reserved
Any of the critical warning can be tied to
asynchronous event notification. Drive
Health Indicator defined under bytes 30953076 of Identify Controller may still indicate
“healthy” status when the critical warning
flag is set.
1
2
Temperature: Overall Device current temperature in
Kelvin.
For AIC, this reports the NAND temperature,
for 2.5-inch FF, this reports the case
temperature,
3
1
Available Spare: Contains a normalized percentage
(0 to 100%) of the remaining spare capacity
available
Starts from 100 and decrements.
4
1
Available Spare Threshold
Threshold is set to 10%.
Percentage Used Estimate (Value allowed to exceed
100%)
A value of 100 indicates that the estimated
endurance of the device has been
consumed, but may not indicate a device
failure. The value is allowed to exceed 100.
Percentages greater than 254 shall be
represented as 255. This value shall be
updated once per power-on hour (when the
controller is not in a sleep state).
Byte
5
1
Product Specification
24
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Byte
# of
Bytes
32
16
Attribute
Description
Data Units Read (in LBAs)
Contains the number of 512 byte data units
the host has read from the controller; this
value does not include metadata. This value
is reported in thousands (i.e., a value of 1
corresponds to 1000 units of 512 bytes
read) and is rounded up. When the LBA size
is a value other than 512 bytes, the
controller shall convert the amount of data
read to 512 byte units.
48
16
Data Units Write (in LBAs)
Contains the number of 512 byte data units
the host has written to the controller; this
value does not include metadata. This value
is reported in thousands (i.e., a value of 1
corresponds to 1000 units of 512 bytes
written) and is rounded up. When the LBA
size is a value other than 512 bytes, the
controller shall convert the amount of data
written to 512 byte units. For the NVM*
command set, logical blocks written as part
of Write operations shall be included in this
value. Write Uncorrectable commands shall
not impact this value.
64
16
Host Read Commands
Contains the number of read commands
issued to the controller.
80
16
Host Write Commands
Contains the number of write commands
issued to the controller.
96
16
Controller Busy Time (in minutes)
Contains the amount of time the controller is
busy with I/O commands. The controller is
busy when there is a command outstanding
to an I/O Queue (specifically, a command
was issued by way of an I/O Submission
Queue Tail doorbell write and the
corresponding completion queue entry has
not been posted yet to the associated I/O
Completion Queue). This value is reported in
minutes.
112
16
Power Cycles
Contains the number of power cycles.
128
16
Power On Hours
Contains the number of power-on hours.
This does not include time that the
controller was powered and in a low power
state condition.
144
16
Unsafe shutdowns
Contains the number of unsafe shutdowns.
This count is incremented when a shutdown
notification (CC.SHN) is not received prior to
loss of power.
160
16
Media Errors
Contains the number of occurrences where
the controller detected an unrecovered data
integrity error. Errors such as uncorrectable
ECC, CRC checksum failure, or LBA tag
mismatch are included in this field.
176
16
Number of Error Information Log Entries
Contains the number of Error Information
log entries over the life of the controller.
March 2015
330566-008US
Product Specification
25
Intel® Solid-State Drive DC P3700 Series
Table 19: Additional SMART Attributes (Log Identifier CAh)
Byte
# of Bytes
Attribute
0
1
AB (Program Fail Count)
3
1
Normalized Value
5
6
Current Raw Value
12
1
AC (Erase Fail Count)
15
1
Normalized Value
17
6
Current Raw Value
24
1
AD (Wear Leveling Count)
27
1
Normalized Value
29
6
Current Raw Value
36
1
B8 (End to End Error Detection Count)
39
1
Normalized Value
41
6
Current Raw Value
48
1
C7 (CRC Error Count)
51
1
Normalized Value
53
6
Current Raw Value
60
1
E2 (Timed Workload, Media Wear)
63
1
Normalized Value
65
6
Current Raw Value
72
1
E3 (Timed Workload, Host Reads %)
75
1
Normalized Value
77
6
Current Raw Value
84
1
E4 (Timed Workload, Timer)
87
1
Normalized Value
89
6
Current Raw Value
96
1
EA (Thermal Throttle Status)
99
1
Normalized Value
101
6
Current Raw Value
108
1
F0 (Retry Buffer Overflow Counter)
111
1
Normalized Value
113
6
Current Raw Value
120
1
F3 (PLL Lock Loss Count)
123
1
Normalized Value
125
6
Current Raw Value
Product Specification
26
Description
Raw value: shows total count of program fails.
Normalized value: beginning at 100, shows the
percent remaining of allowable program fails.
Raw value: shows total count of erase fails.
Normalized value: beginning at 100, shows the
percent remaining of allowable erase fails.
Raw value:
Bytes 1-0: Min. erase cycle
Bytes 3-2: Max. erase cycle
Bytes 5-4: Avg. erase cycles
Normalized value: decrements from 100 to 0.
Raw value: reports number of End-to-End
detected and corrected errors by hardware.
Normalized value: always 100.
Raw value: total number of PCIe Interface CRC
errors encountered, as specified in PCIe Link
Performance Counter Parameter for “Bad TLP”.
Normalized value: always 100.
Raw value: measures the wear seen by the SSD
(since reset of the workload timer, attribute E4h),
as a percentage of the maximum rated cycles.
Divide the raw value by 1024 to derive the
percentage with 3 decimal points.
Normalized value: always 100.
Raw value: shows the percentage of I/O
operations that are read operations (since reset
of the workload timer, attribute E4h). Reported
as integer percentage from 0 to 100.
Normalized value: always 100.
Raw value: measures the elapsed time (number
of minutes since starting this workload timer).
Normalized value: always 100.
Raw value: reports Percent Throttle Status and
Count of events
Byte 0: Throttle status reported as integer
percentage.
Bytes 1-4: Throttling event count. Number of
times thermal throttle has activated. Preserved
over power cycles.
Byte 5: Reserved.
Normalized value: always 100.
Raw Value: Counter to indicate the number of
times Retry Buffer has overflown
Normalized Value is always 100
Raw Value: Counter to indicate the number of
times PCIe Refclock PLL has unlocked
Normalized Value is always 100
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
5.5
Temperature Statistics
Table 20: Temperature Statistics (Log Identifier C5h)
Byte
# of Bytes
Description
0
1
Current Temperature
24
8
Highest temperature
32
8
Lowest temperature
80
8
Specified Maximum Operating Temperature
96
8
Specified Minimum Operating Temperature
104
8
Estimated offset
Note: For 2.5-inch form factor, case temperature is reported.
For Add-in Card, NAND temperature is reported.
5.6
Drive Marketing Name Log
Table 21: Drive Marketing Name Log (Log Identifier DDh)
Byte
# of Bytes
Log Page Content
0
8
Intel
8
1
Space
9
3
SSD
12
1
Space
13
2
DC
15
1
Space
16
5
P3700
21
1
Space
22
6
Series
28-511
484
Reserved
March 2015
330566-008US
Product Specification
27
Intel® Solid-State Drive DC P3700 Series
5.7
SET Feature Identifiers
In addition to the SMART attribute structure, features pertaining to the operation and health of the Intel SSD DC
P3700 Series can be reported to the host on request through the Get Features command. P3700 Series can change
settings using SET Features on the following items as defined in NVMe 1.0 specification.

Arbitration (Feature Identifier 01h)

Power Management (Feature Identifier 02h)

Temperature Threshold (Feature Identifier 04h)

Error Recovery (Feature Identifier 05h)

Volatile Write Cache (Feature Identifier 06h)

Number of Queues (Feature Identifier 07h)

Interrupt Coalescing (Feature Identifier 08h)

Interrupt Vector Configuration (Feature Identifier 09h)

Write Atomicity (Feature Identifier 0Ah)

Asynchronous Event Configuration (Feature Identifier 0Bh)
Intel SSD DC P3700 Series will also support the following vendor unique SET Features.

Set/Get Max LBA (Feature Identifier C1h)

Get Native Max LBA (Feature Identifier C2h)

Power Governor Setting (Feature Identifier C6h)

Reset Timed Workload Counters (Feature Identifier D5h)
Table 22: Set Max LBA Setting - Command Dword 11 and Command Dword 12
Bit
63:00
Product Specification
28
Description
Maximum User LBA: Write Usage: This field sets the 64-bit maximum LBA addressable by
the Drive.
Read Usage: This field contains the 64-bit maximum LBA addressable by the Drive.
Command Dword 11 contains bits 31:00; Command Dword 12 contains bits 63: 32.
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Table 23: Status Code - Set Max LBA Command Specific Status Values
Value
Description
C0h
Requested MAX LBA exceeds Available capacity
C1h
Requested MAX LBA smaller than minimum allowable limit.
C2h
Requested MAX LBA is smaller than allocated Namespace requirements
Table 24: C6h - Set/Get Power (Typical) Governor Setting – Command Dword 11
Bit
Description
31:08
Reserved (TBD)
07:00
Power Governor Setting: 00h = 25W, 01h = 20W, 02h =10W
Table 25: Status Codes - Power Governor Setting Command Specific Status Values
Value
Description
C0h
Invalid Setting
Table 26: D5h – Reset Timed Workload Counters – Command Dword 11
Bit
Description
31:01
Reserved
00
Timed Workload Reset Settings: Write Usage: 00 = NOP, 1 = Reset E2, E3,E4 counters;
Read Usage: Not Supported
Note: Get Features will not work for “Reset Timed Workload Counters” and status code is same as Table 25.
§
March 2015
330566-008US
Product Specification
29
Intel® Solid-State Drive DC P3700 Series
6
NVMe Driver Support
Table 27 describes the NVMe Driver Support for Intel SSD DC P3700 Series. The support includes releasing and
validating NVMe drivers for certain operating systems and validating functionality for open source drive, inbox or
native drivers for select operating systems.
Table 27: NVMe Driver Support
Support Level
Operating System Description
Intel Provided1
Windows Server 2012 R2, 2012, 2008 R2 x64, Windows 7(32bit/64bit),
Windows 8 (32bit/64bit), Windows 8.1 (32bit/64Bit)
In-box Driver2
RHEL 6.5, RHEL 6.6, RHEL 7.0, SLES11 SP3,
Windows Server 2012 R2, Windows 8.1
NOTES:
1.
With Intel provided driver, full product specification is guaranteed, booting is only supported for 64bit OS
2.
With open source non-Intel driver, compatibility and functionality is validated
§
Product Specification
30
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
7
Certifications and Declarations
Table 28: Device Certifications and Declarations
Certification
Description
CE* Compliant
European Economic Area (EEA): Compliance with the essential requirements of EC Council
Directives Low Voltage Directive (LVD) 2006/95/EC, EMC Directive 2004/108/EC and Directive
2011/65/EU.
UL* Recognized
Certified Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd
Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General
Requirements)
CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety
- Part 1: General Requirements)
C-Tick* Compliant
Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic
Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).
BSMI* Compliant
Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1,
2006, is harmonized with CISPR 22: 2005.04.
KCC*
Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control
Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the
Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.
VCCI*
Voluntary Control Council for Interface to cope with disturbance problems caused by personal
computers or facsimile.
Microsoft* WHCK
Microsoft Windows Hardware Certification Kit
RoHS* Compliant
Restriction of Hazardous Substance Directive
WEEE*
Directive on Waste Electrical and Electronic Equipment
§
March 2015
330566-008US
Product Specification
31
Intel® Solid-State Drive DC P3700 Series
Appendix A IDENTIFY Data Structure
Table 29: Identify Controller
Bytes
F = Fixed
V = Variable
X = Both
Default
Value
Interpretation
Description
1-0
F
8086h
Contains the company vendor
identifier that is assigned by the
PCI SIG
PCI Vendor ID (VID)
3-2
F
8086h
Contains the company vendor
identifier that is assigned by the
PCI SIG for subsystem
PCI Subsystem Vendor ID (SSVID)
23-4
V
varies
Contains the serial number for the
NVM subsystem
Serial Number (SN)
63-24
V
varies
Contains the serial number for the
NVM subsystem that is assigned by
the vendor as an ASCII string
Model Number (MN)
71-64
V
varies
Contains the currently active
firmware revision for the NVM
subsystem
Firmware Revision (FR)
72
F
0h
Recommended Arbitration Burst
size equals 1
Recommended Arbitration Burst (RAB)
75-73
F
5CD2E4h
Contains the Organization Unique
Identifier (OUI) for the controller
vendor
IEEE OUI Identifier (IEEE)
76
X
0h
No of multiple PCI Express
interfaces connected to the host,
bit 0 determines multiple interface
Multi-Interface Capabilities (MIC)
77
F
05h
Supports MDTS of 128K
Maximum Data Transfer Size (MDTS)
Optional Admin Command Support
(OACS)
255:78
Reserved
257-256
F
06h
Supports Security Send/Receive,
Format NVM and Firmware
Activate/Download
258
F
03h
Supports up to 3 concurrently
outstanding abort commands
Abort Command Limit (ACL)
259
F
03h
Supports up to 3 concurrently
outstanding asynchronous event
requests
Asynchronous Event Request Limit
(AERL)
260
X
02h
261
X
0h
SMART/Health Log Support per
drive not per namespace
Log Page Attributes (LPA)
262
F
3Fh
Number of Error Information log
entries equals 64
Error Log Page Entries (ELPE)
263
F
0h
Number of NVM Express power
states equal 1
Number of Power States Support (NPSS)
264
F
0h
Configuration settings for Admin
Vendor Specific command handling
Admin Vendor Specific Command
Configuration (AVSCC)
Product Specification
32
Single slot
Read/write capable
Firmware Updates (FRMW)
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Bytes
F = Fixed
V = Variable
X = Both
Default
Value
Interpretation
511-265
Description
Reserved
512
F
66h
Required and max submission
queue entry size is 64 Byte
513
F
44h
Required and max submission
queue entry size is 16 Byte
515-514
Submission Queue Entry Size (SQES)
Completion Queue Entry Size (CQES)
Reserved
519-516
F
01h
Supports single namespace
Number of Namespaces (NN)
521-520
F
06h
Supports Dataset Management and
Write Uncorrectable optional NVMe
commands.
Optional NVMe Command Support
(ONCS)
523-522
F
0h
Fused commands not supported
Fused Operation Support (FUSES)
524
F
07h
Supports Crypto Erase and format
of entire drive, not per namespace
Format NVM Attributes (FNA):
525
F
0h
Volatile write cache is not present
Volatile Write Cache (VWC)
Atomic Write Unit Normal (AWUN)
527-526
F
0h
Atomic write size for controller
during normal equals to 512B
529-528
F
0h
Indicates the atomic write size for
the controller during a power fail
condition equals 512B
Atomic Write Unit Power Fail (AWUPF)
530
X
0h
Not Supported
NVM Vendor Specific Command
Configuration (NVSCC)
703-531
Reserved
2047-704
Reserved
2079-2048
V
Indicates the characteristics of
power state 0
2111-2080
V
Indicates the characteristics of
power state 1
Power State 1 Descriptor (PSD1)
2143-2112
V
Indicates the characteristics of
power state 2
Power State 2 Descriptor (PSD2)
2175-2144
V
Indicates the characteristics of
power state 3
Power State 3 Descriptor (PSD3)
2207-2176
V
Indicates the characteristics of
power state 4
Power State 4 Descriptor (PSD4)
2239-2208
V
Indicates the characteristics of
power state 5
Power State 5 Descriptor (PSD5)
2271-2240
V
Indicates the characteristics of
power state 6
Power State 6 Descriptor (PSD6)
2303-2272
V
Indicates the characteristics of
power state 7
Power State 7 Descriptor (PSD7)
2335-2304
V
Indicates the characteristics of
power state 8
Power State 8 Descriptor (PSD8)
2367-2336
V
Indicates the characteristics of
power state 9
Power State 9 Descriptor (PSD9)
2399-2368
V
Indicates the characteristics of
power state 10
Power State 10 Descriptor (PSD10)
2431-2400
V
Indicates the characteristics of
power state 11
Power State 11 Descriptor (PSD11)
March 2015
330566-008US
Power State 0 Descriptor (PSD0)
Product Specification
33
Intel® Solid-State Drive DC P3700 Series
Bytes
F = Fixed
V = Variable
X = Both
2463-2432
V
Indicates the characteristics of
power state 12
Power State 12 Descriptor (PSD12)
2495-2464
V
Indicates the characteristics of
power state 13
Power State 13 Descriptor (PSD13)
2527-2496
V
Indicates the characteristics of
power state 14
Power State 14 Descriptor (PSD14)
2559-2528
V
Indicates the characteristics of
power state 15
Power State 15 Descriptor (PSD15)
2591-2560
V
Indicates the characteristics of
power state 16
Power State 16 Descriptor (PSD16)
2623-2592
V
Indicates the characteristics of
power state 17
Power State 17 Descriptor (PSD17)
2655-2624
V
Indicates the characteristics of
power state 18
Power State 18 Descriptor (PSD18)
2687-2656
V
Indicates the characteristics of
power state 19
Power State 19 Descriptor (PSD19)
2719-2688
V
Indicates the characteristics of
power state 20
Power State 20 Descriptor (PSD20)
2751-2720
V
Indicates the characteristics of
power state 21
Power State 21 Descriptor (PSD21)
2783-2752
V
Indicates the characteristics of
power state 22
Power State 22 Descriptor (PSD22)
2815-2784
V
Indicates the characteristics of
power state 23
Power State 23 Descriptor (PSD23)
2847-2816
V
Indicates the characteristics of
power state 24
Power State 24 Descriptor (PSD24)
2879-2848
V
Indicates the characteristics of
power state 25
Power State 25 Descriptor (PSD25)
2911-2880
V
Indicates the characteristics of
power state 26
Power State 26 Descriptor (PSD26)
2943-2912
V
Indicates the characteristics of
power state 27
Power State 27 Descriptor (PSD27)
2975-2944
V
Indicates the characteristics of
power state 28
Power State 28 Descriptor (PSD28)
3007-2976
V
Indicates the characteristics of
power state 29
Power State 29 Descriptor (PSD29)
3039-3008
V
Indicates the characteristics of
power state 30
Power State 30 Descriptor (PSD30)
3071-3040
V
Indicates the characteristics of
power state 31
Power State 31 Descriptor (PSD31)
3075
F
05h
Data striped at 128 KB, value
shown is reported as 2^
(CAP.MPSMIN)
Internal stripe size
3095-3076
V
Varies
Shows healthy status or error code
Health indicator
3096
V
Varies
Reads current negotiated PCIe link
speed, as reported by PXLS register
(PXCAP + 12h), bits[3:0]
Current PCIe Link Speed field (CLS)
Product Specification
34
Default
Value
Interpretation
Description
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Bytes
F = Fixed
V = Variable
X = Both
3097
V
3107-3100
V
3109-3108
3111-3110
4095-3112
F
F
V
Default
Value
Varies
Varies
Interpretation
Description
Reads current negotiated PCIe Link
Width as reported by PXLS register
(PXCAP + 12h), bits[9:4]
Negotiated Link Width (NLW)
Bootloader Version
Bootloader Version reported by the drive
0x8086
Company Vendor Identifier
Vendor identifier assigned by PCI-SIG
(Intel)
0x0953
Device Identifier
Device identifier assigned by PCI-SIG
(Intel)
Range of bytes is allocated for
vendor specific usage
Vendor Specific (VS)
NA
NOTES:
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change
when media is removed or changed.
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the
commands executed by the device.
X = F or V. The content of the word may be fixed or variable.
March 2015
330566-008US
Product Specification
35
Intel® Solid-State Drive DC P3700 Series
Table 30: Power State Descriptor
Bytes
F = Fixed
V = Variable
X = Both
Default
Value
Interpretation
255-125
124-120
Reserved
F
0h
Indicates the relative write latency
associated with this power state
119-117
116-112
Relative Write Latency (RWL)
Reserved
F
0h
Indicates the relative write
throughput associated with this
power state
111-109
108-104
Description
Relative Write Throughput (RWT)
Reserved
F
0h
Indicates the relative read latency
associated with this power state
103-101
Relative Read Latency (RRL)
Reserved
100-96
F
0h
Indicates the relative read
throughput associated with this
power state.
Relative Read Throughput (RRT)
95-64
F
0h
Indicates the maximum exit latency
in microseconds associated with
exiting this power state.
Exit Latency (EXLAT)
63-32
F
0h
Indicates the maximum entry
latency in microseconds
associated with entering this power
state
Entry Latency (ENLAT)
31-16
15-00
Reserved
F
09C4h
Indicates the maximum power
consumed by the NVM subsystem
in this power state. The power in
Watts is equal to the value in this
field multiplied by 0.01
Maximum Power (MP)
NOTES:
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when
media is removed or changed.
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the
commands executed by the device.
X = F or V. The content of the word may be fixed or variable.
Product Specification
36
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Table 31: Identify Namespace
Bytes
F = Fixed
V = Variable
X = Both
7-0
V
varies
Indicates the total size of the
namespace in logical blocks.
Namespace Size (NSZE)
15-8
V
varies
Indicates the maximum number
of logical blocks that may be
allocated in the namespace at any
point in time
Namespace Capacity (NCAP)
23-16
V
varies
Indicates the current number of
logical blocks allocated in the
namespace
Namespace Utilization (NUSE)
24
F
00h
Indicates thin provisioning is not
supported
Namespace Features (NSFEAT)
25
F
06h
Defines the number of supported
LBA size and metadata size
combinations supported by the
namespace
Number of LBA Formats (NLBAF)
26
V
00h
Indicates metadata transferred
with the extended data LBA or in
separate buffer
Formatted LBA Size (FLBAS)
Metadata Capabilities (MC)
Default
Value
Interpretation
Description
27
F
03h
Indicates support for metadata
transferred with the extended
data LBA and in separate buffer –
both are supported
28
V
11h
Indicates PI supports Type 1,2,3
with PI transferred as the first 8
bytes
End-to-end Data Protection Capabilities
(DPC)
29
X
00h
Indicates type settings for the
namespace
End-to-end Data Protection Type Settings
(DPS)
127-30
Reserved
131-128
V
MS:0,
LBADS:9,
RP:2
Indicates the LBA format 0 that is
supported by the controller
LBA Format 0 Support (LBAF0)
135-132
V
MS:8,
LBADS:9,
RP:2
Indicates the LBA format 1 that is
supported by the controller
LBA Format 1 Support (LBAF1)
139-136
V
MS:16,
LBADS:9,
RP:2
Indicates the LBA format 2 that is
supported by the controller
LBA Format 2 Support (LBAF2)
143-140
V
MS:0,
LBADS:12,
RP:0
Indicates the LBA format 3 that is
supported by the controller
LBA Format 3 Support (LBAF3)
147-144
V
MS:8,
LBADS:12,
RP:0
Indicates the LBA format 4 that is
supported by the controller
LBA Format 4 Support (LBAF4)
151-148
V
MS:64,
LBADS:12,
RP:0
March 2015
330566-008US
Indicates the LBA format 5 that is
supported by the controller
LBA Format 5 Support (LBAF5)
Product Specification
37
Intel® Solid-State Drive DC P3700 Series
Bytes
F = Fixed
V = Variable
X = Both
155-152
V
Default
Value
Interpretation
Description
MS:128,
LBADS:12,
RP:0
Indicates the LBA format 6 that is
supported by the controller
159-156
Not
supported
Indicates the LBA format 7 that is
supported by the controller
LBA Format 7 Support (LBAF7)
163-160
Not
supported
Indicates the LBA format 8 that is
supported by the controller
LBA Format 8 Support (LBAF8)
167-164
Not
supported
Indicates the LBA format 9 that is
supported by the controller
LBA Format 9 Support (LBAF9)
171-168
Not
supported
Indicates the LBA format 10 that
is supported by the controller
LBA Format 10 Support (LBAF10)
175-172
Not
supported
Indicates the LBA format 11 that
is supported by the controller
LBA Format 11 Support (LBAF11)
179-176
Not
supported
Indicates the LBA format 12 that
is supported by the controller
LBA Format 12 Support (LBAF12)
183-180
Not
supported
Indicates the LBA format 13 that
is supported by the controller
LBA Format 13 Support (LBAF13)
187-184
Not
supported
Indicates the LBA format 14 that
is supported by the controller
LBA Format 14 Support (LBAF14)
191-188
Not
supported
Indicates the LBA format 15 that
is supported by the controller
LBA Format 15 Support (LBAF15)
383-192
Not
supported
4095-384
Not
supported
LBA Format 6 Support (LBAF6)
Reserved
Range of bytes is allocated for
vendor specific usage
Vendor Specific (VS)
NOTES:
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when
media is removed or changed.
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the
commands executed by the device.
X = F or V. The content of the word may be fixed or variable
Product Specification
38
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Table 32: LBA Format Data Structure
Bytes
F = Fixed
V = Variable
X = Both
Default Value
Interpretation
31-26
Description
Reserved
25-24
V
Varies (2,0)
Relative Performance ranging
from “best” to “degraded”
Relative Performance (RP)
23-16
V
Varies
(9 and 12)
Indicates the LBA data size
supported. The value is reported
in terms of a power of two (2^n)
LBA Data Size (LBADS)
15-00
V
Varies
(0, 8, 16,64, 128)
Indicates the number of metadata
bytes provided per LBA based on
the LBA Data Size indicated.
Metadata Size (MS)
NOTES:
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when
media is removed or changed.
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the
commands executed by the device.
X = F or V. The content of the word may be fixed or variable.
§
March 2015
330566-008US
Product Specification
39
Intel® Solid-State Drive DC P3700 Series
Appendix B Vital Data Structure
Table 33: Vital Product Data Structure (VPD)
Address
# Bytes
0
Function
3
Class Code
Programming
Value
Byte
02h
0
08h
1
01h
2
86h
3
80h
4
Varies
5-24
Serial Number
Varies
25-64
Model Number
03h
65
Maximum Link Speed
04h
66
Maximum Link Width
03h
67
Maximum Link Speed
04h
68
Maximum Link Width
12V Power rail initial power requirement
(W)
3
2
5
20
25
40
65
1
66
1
67
1
68
1
69
1
Initial Power
Requirements
0Ah
69
70
2
Reserved
00h
70-71
72
1
Maximum
Power
Requirements
19h
72
73
2
Reserved
00h
73-74
75
2
Capability List
Pointer
50h
75
ID
PCIe Port0
Capabilities
PCIe Port1
Capabilities
Description
Device type and Programming Interface
PCI-SIG Vendor ID
12V Power rail maximum power
requirement (W)
16b address pointer to start of
capability list
Table 34: Capability List Pointer (Out of Band Temperature Sensor)
Addr
(Hex)
00
01
02
03
04
05
06
07
08
09
A
B
50
A2
00
00
00
00
36
00
00
varies
varies
varies
varies
Description
Capability ID
(temp)
Next Capability
(none)
Sensor
Type
SMBUS
address
Reserved
Warning
Threshold
Over
Temperature
§
Product Specification
40
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Appendix C Out of Band Temperature Sensor
Read Out
Register 0x05 on address 0x1B contains the temperature information for the latest readout. Measured temperature
is captured by bit 12 to bit 0. Data format is two’s complement. Bit12 represents sign value, bit11 presents 128° C
and bit0 represents 0.0625° C. Following table gives an example of the read out.
Table 35: Register 0x05 read out format
Binary
Hex
Temperature
1 1100 1001 0000
1C90
-55° C
1 1100 1110 0000
1CE0
-50° C
1 1110 0111 0000
1E70
-25° C
1 1111 1111 1111
1FFFF
-0.0625° C
0 0000 0000 0000
000
0° C
0 0000 0000 0001
001
0.0625° C
0 0001 1001 0000
190
25° C
0 0011 0010 0000
320
50° C
0 0111 1101 0000
7D0
55° C
§
March 2015
330566-008US
Product Specification
41
Intel® Solid-State Drive DC P3700 Series
Appendix D PCIe ID
Table 36: PCIe ID
ID name
Description
Add-in
Card
2.5” FF
PCIe
Register
Location
Identify
Controller
Location
Vital Product Data
Location
Vendor ID (VID)
Vendor ID
assigned by
PCI-SIG
0x8086
0x8086
PCI Header
Offset 00h
(bits 15:00)
Bytes 01:00h
Address 3, (size 2B)
Device ID (DID)
Device ID
assigned by
vendor
0x0953
0x0953
PCI Header
Offset 00h
(bits 31:16)
NA
NA
Subsystem
Vendor ID
Indicates Subsystem vendor
ID
0x8086
0x8086
PCI Header
Offset 2Ch
(bits 15:00)
Bytes 03:02h
NA
Subsystem ID
Sub-system
identifier
0x3702
0x3703
PCI Header
Offset 2Ch
(bits 31:16)
NA
NA
§
Product Specification
42
March 2015
330566-008US
Intel® Solid-State Drive DC P3700 Series
Appendix E SCSI Command Translation
Following SCSI commands are supported:

Read 6,10,12,16

Inquiry

Mode Sense 6,10

Mode Select 6.10

Log Sense

Read Capacity 10,16

Report LUNs

Request Sense

Start Stop Unit

Test Unit Ready

Write Buffer

Unmap
Note: Refer to NVM Express: SCSI translation reference doc under nvmexpress.org
§
March 2015
330566-008US
Product Specification
43
Intel® Solid-State Drive DC P3700 Series
Appendix F Add-in Card LED Decoder
Table 37: LED Functionality
LED
Figure A-1:
Description
Blink Behavior
LED 1( Amber)
Shows IO activity
Blinks at the rate of
250msec high, 250msec
low with IO activity
LED 2 (Red)
Drive fail indicator
Solid red if drive is in
disabled logical mode
LED 3 (Yellow)
Drive pre-fail indicator
Solid yellow if any of the
critical warnings in log
page 0x02 is triggered
LED 4 (Green)
Drive health indicator
Solid green when drive is
healthy
LED Location
Note: 2.5-inch Form factor does not contain LEDs
§
Product Specification
44
March 2015
330566-008US