CB70C - Rugged COM Express (VITA 59 RCE) with Intel Core i7

Embedded Solutions
for Transportation and Industrial Markets
www.men.de/products/cb70c/
CB70C – Rugged COM Express (VITA 59 RCE)
with Intel Core i7
n Intel Core i7, 3rd generation
n Quad-core 64-bit processor
n Up to 16 GB DDR3 DRAM, ECC, soldered
n Board Management Control
n Active Management Technology
n Open CL 1.1 support
n 9 V to 16 V extended input range
n -40°C to +85°C Tcase screened, depending on
processor
n Conduction cooling
n VITA 59 in process, compliant with COM
Express Basic, type 6
n PICMG COM.0 COM Express version also
available
The CB70C is a member of a new family of Rugged
COM Express modules which is controlled by a third
generation Intel Core i7 processor running at up to 3.1
GHz maximum turbo frequency bringing state-of-theart PC technology onto a small form factor. This means
a scalable performance with 1 up to 4 cores, integrated
graphics, as well as support of Intel AMT or Open CL
1.1.
The board can be controlled using a Board
Management Controller and an adaptable BIOS which
ensures flexibility in tailoring the complete system for
the final application. Intel AMT support is actively
integrated in the BIOS adaptation.
The modules are 100% compatible to COM Express
modules of Pin-out Type 6. They conform to the new
CB70C Data Sheet / 2015-09-01
VITA-59 standard which specifies the mechanics to make COM Express
modules suitable for operation in harsh environments.
The modules are embedded in a covered frame ensuring EMC
protection and allowing efficient conductive cooling. Air cooling is also
possible by applying a heat sink on top of the cover.
The CB70C accommodates up to 16 GB of directly soldered main
memory and supports other memory like USB Flash on the carrier
board.
The interfaces include a combination of PCI Express links, LVDS, DDI,
VGA, high-definition audio, SATA, Ethernet and USB.
The CB70C is screened for operation from -40°C to +85°C (Tcase). Only
soldered components are used to withstand shock and vibration, and
the design is optimized for conformal coating.
For evaluation and development purposes a microATX carrier board, the
XC15, is available.
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Diagram
B Onboard
DDR3 SDRAM
Intel® Core™
Processor
1 PEG x16
FDI
DMI
2 SATA (6 Gb)
3 DDI
2 SATA (3 Gb)
LVDS dual channel
4 USB 3.0
VGA
4 USB 2.0
HD Audio
Intel® Platform Controller Hub
QM77
7 PCIe x1 (2.x)
Gigabit
Ethernet PHY
BIOS TPM BMC
8 GPIO
SPI
LPC
SMBus
COM Express® Type 6 connectors A-B & C-D
CB70C Data Sheet / 2015-09-01
Speaker
B
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Technical Data
CPU
n
n
n
Memory
n
n
Graphics
n
n
Onboard Interfaces
n
n
n
n
n
n
n
n
n
n
n
n
Supervision and Control
n
n
n
n
n
n
Computer-On-Module Standard
n
n
CB70C Data Sheet / 2015-09-01
The following CPU types are available:
o Intel Core i7 (3rd gen)
o Intel Core i5 (3rd gen)
o Intel Core i3 (3rd gen)
o Intel Celeron (2nd or 3rd gen)
Chipset
o Intel Core i7-3612QE (QM77 Platform Controller Hub (PCH))
For more details please see the overview matrix of supported processor types.
System Memory
o Soldered DDR3
o 2 GB, 4 GB, 8 GB or 16 GB
Boot Flash
o 16 MB
Integrated in processor and chipset
Maximum resolution: 2560 x 1600 pixels
Available via COM Express connectors
Video
o One x16 link (PCI Express graphics)
o One VGA
o Three DDI ports for DP, HDMI, DVI, SDVO
o One LVDS dual channel up to 48-bit RGB
Audio
o HD audio
Serial ATA (SATA)
o Two ports with SATA Revision 2.x support; transfer rates up to 300 MB/s (3 Gbit/s)
o Two ports with SATA Revision 3.x support; transfer rates up to 600 MB/s (6 Gbit/s)
o RAID level 0/1/5/10 support
USB
o Four USB 3.0 host ports, xHCI implementation, data rate up to 5 Gbit/s
o Four USB 2.0 host ports, EHCI implementation, data rates up to 480 Mbit/s
Ethernet
o One 10/100/1000Base-T Ethernet channel
o Three LED signals for LAN link, activity status and connection speed
PCI Express
o Seven x1 links (up to 500 MB/s in each direction), PCIe 2.x (5 Gbit/s per lane)
GPIO
o 8 lines
SMBus interface
LPC
SPI
Speaker
Input voltage supervision
Power sequencing
Board monitoring
Watchdog
Accessible via SMBus
Real-time clock, with supercapacitor or battery backup on the carrier board
CB70C: VITA 59 RCE: Rugged COM Express in process
o With conduction cooling cover and frame
o Rugged COM Express Basic, Module Pin-out Type 6
CB70: PICMG COM.0 COM Express Module Base Specification
o Without conduction cooling wings, without cover and frame
o COM Express Basic (135 mm x 105 mm), Module Pin-out Type 6
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Technical Data
Electrical Specifications
n
n
Mechanical Specifications
n
n
Environmental Specifications
n
n
n
n
n
n
n
n
n
n
Supply voltage
o +12V (9 to 16 V)
o +5V (-5%/+5%) standby voltage
Power consumption
o 48 W typ./ 70 W max.
o 1.1 W in standby operation
Dimensions:
o 135 mm x 105 mm x 18 mm (height) (conforming to VITA 59 RCE Basic format), PCB mounted
between a cover and a frame (model 15CB70C00/15CB70C01)
o 125 mm x 95 mm (conforming to PICMG COM.0 COM Express Basic format) (model 15CB70-00)
Weight:
o 460 g (model 15CB70C00/15CB70C01)
o 90 g (model 15CB70-00)
Temperature range (operation): -40..+85°C Tcase (Rugged COM Express cover/frame) (screened)
Temperature range (storage): -40..+85°C
Cooling Concept
o Conduction-cooled versions according to VITA 59 RCE: Rugged COM Express in process
o Air-cooled versions according to PICMG COM.0 COM Express standard
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300 m to +3000 m
Shock: 50 m/s², 30 ms (EN 61373)
Vibration (function): 1 m/s², 5 Hz - 150 Hz (EN 61373)
Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz (EN 61373)
Conformal coating on request
Reliability
n
MTBF
o 415 714 h @ 40°C according to IEC/TR 62380 (RDF 2000)
Safety
n
Flammability
o UL 94V-0
EMC
n
EMC behavior depends on the system and housing surrounding the COM Express module.
The Rugged COM Express module in its cover and frame supports the system to meet the requirements of
o EN 55022 (radio disturbance)
o IEC 61000-4-2 (ESD)
o IEC 61000-4-3 (electromagnetic field immunity)
o IEC 61000-4-4 (burst)
o IEC 61000-4-5 (surge)
o IEC 61000-4-6 (conducted disturbances)
n
Software Support
n
Windows
Linux
For more information on supported operating system versions and drivers see Software.
n
InsydeH2O UEFI Framework
n
n
BIOS
CB70C Data Sheet / 2015-09-01
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Embedded Solutions
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Up-to-date information,
documentation and
ordering information:
www.men.de/products/cb70c/
www.men.de/products/cb70c/
Germany
France
USA
MEN Mikro Elektronik GmbH
Neuwieder Straße 3-7
90411 Nuremberg
Phone +49-911-99 33 5-0
Fax +49-911-99 33 5-901
MEN Mikro Elektronik SAS
18, rue René Cassin
ZA de la Châtelaine
74240 Gaillard
Phone +33 (0) 450-955-312
Fax +33 (0) 450-955-211
MEN Micro Inc.
860 Penllyn Blue Bell Pike
Blue Bell, PA 19422
Phone (215) 542-9575
Fax (215) 542-9577
info@men.de
www.men.de
info@men-france.fr
www.men-france.fr
sales@menmicro.com
www.menmicro.com
The date of issue stated in this data sheet refers to the Technical Data only. Changes in ordering information given herein do not affect the date of issue. All brand or product names are
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Copyright © 2015 MEN Mikro Elektronik GmbH. All rights reserved.
CB70C Data Sheet / 2015-09-01
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