dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)

dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)
dsPIC33FJ16(GP/MC)101/102 AND
dsPIC33FJ32(GP/MC)101/102/104
16-Bit Digital Signal Controllers
(up to 32-Kbyte Flash and 2-Kbyte SRAM)
Operating Conditions
Advanced Analog Features
• 3.0V to 3.6V, -40°C to +125°C, DC to 16 MIPS
• ADC module:
- 10-bit, 1.1 Msps with four S&H
- Four analog inputs on 18-pin devices and up to
14 analog inputs on 44-pin devices
• Flexible and Independent ADC Trigger Sources
• Three Comparator modules
• Charge Time Measurement Unit (CTMU):
- Supports mTouch™ capacitive touch sensing
- Provides high-resolution time measurement (1 ns)
- On-chip temperature measurement
• 3.0V to 3.6V, -40°C to +150°C, DC to 5 MIPS
Core: 16-Bit dsPIC33F CPU
•
•
•
•
•
Code-Efficient (C and Assembly) Architecture
Two 40-Bit Wide Accumulators
Single-Cycle (MAC/MPY) with Dual Data Fetch
Single-Cycle Mixed-Sign MUL plus Hardware Divide
32-Bit Multiply Support
Clock Management
•
•
•
•
•
±0.25% Internal Oscillator
Programmable PLLs and Oscillator Clock Sources
Fail-Safe Clock Monitor (FSCM)
Independent Watchdog Timer (WDT)
Fast Wake-up and Start-up
Power Management
•
•
•
•
Low-Power Management modes (Sleep, Idle, Doze)
Integrated Power-on Reset and Brown-out Reset
1 mA/MHz Dynamic Current (typical)
30 µA IPD Current (typical)
PWM
•
•
•
•
Up to Three PWM Pairs
Two Dead-Time Generators
31.25 ns PWM Resolution
PWM Support for:
- Inverters, PFC, UPS
- BLDC, PMSM, ACIM, SRM
• Class B-Compliant Fault Inputs
• Possibility of ADC Synchronization with PWM Signal
Timers/Output Compare/Input Capture
• Up to Five General Purpose Timers:
- One 16-bit and up to two 32-bit timers/counters
• Two Output Compare modules
• Three Input Capture modules
• Peripheral Pin Select (PPS) to allow Function Remap
Communication Interfaces
• UART module (4 Mbps):
- With support for LIN/J2602 Protocols and IrDA®
• 4-Wire SPI module (8 MHz maximum speed):
- Remappable pins in 32-Kbyte Flash devices
• I2C™ module (400 kHz)
Input/Output
• Sink/Source 10 mA or 6 mA, Pin-Specific for Standard
VOH/VOL, up to 16 mA or 12 mA for Non-Standard VOH1
• 5V Tolerant Pins
• Up to 20 Selectable Open-Drain and Pull-ups
• Three External Interrupts (two are remappable)
Qualification and Class B Support
• AEC-Q100 REV G (Grade 0 -40°C to +150°C)
• Class B Safety Library, IEC 60730, UDE Certified
Debugger Development Support
• In-Circuit and In-Application Programming
• Up to Three Complex Data Breakpoints
• Trace and Run-Time Watch
 2011-2014 Microchip Technology Inc.
DS70000652F-page 1
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
dsPIC33FJ16(GP/MC)101/102 AND
dsPIC33FJ32(GP/MC)101/102/104
PRODUCT FAMILIES
The device names, pin counts, memory sizes and
peripheral availability of each device are listed in
Table 1. The following pages show their pinout
diagrams.
dsPIC33FJ16(GP/MC)101/102 DEVICE FEATURES
Remappable Pins
16-bit Timer(1,2)
Input Capture
Output Compare
UART
External Interrupts(3)
SPI
Motor Control PWM
PWM Faults
RTCC
I2C™
Comparators
CTMU
I/O Pins
16
1
8
3
3
2
1
3
1
—
—
1 ADC,
4-ch
Y
1
3
Y
13 PDIP,
SOIC
20
16
1
8
3
3
2
1
3
1
—
—
1 ADC,
4-ch
Y
1
3
Y
15 SSOP
28
16
1
16
3
3
2
1
3
1
—
—
1 ADC,
6-ch
Y
1
3
Y
21 SPDIP,
SOIC,
SSOP,
QFN
36
16
1
16
3
3
2
1
3
1
—
—
1 ADC,
6-ch
Y
1
3
Y
21 VTLA
dsPIC33FJ16MC101
20
16
1
10
3
3
2
1
3
1
6-ch
1
1 ADC,
4-ch
Y
1
3
Y
15 PDIP,
SOIC,
SSOP
dsPIC33FJ16MC102
28
16
1
16
3
3
2
1
3
1
6-ch
2
1 ADC,
6-ch
Y
1
3
Y
21 SPDIP,
SOIC,
SSOP,
QFN
36
16
1
16
3
3
2
1
3
1
6-ch
2
1 ADC,
6-ch
Y
1
3
Y
21 VTLA
dsPIC33FJ16GP101
dsPIC33FJ16GP102
Note 1:
2:
3:
Packages
RAM (Kbytes)
18
Device
10-Bit, 1.1 Msps ADC
Program Flash (Kbyte)
Remappable Peripherals
Pins
TABLE 1:
Two out of three timers are remappable.
One pair can be combined to create one 32-bit timer.
Two out of three interrupts are remappable.
DS70000652F-page 2
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
dsPIC33FJ32(GP/MC)101/102/104 DEVICE FEATURES
Remappable Pins
16-bit Timer(1,2)
Input Capture
Output Compare
UART
External Interrupts(3)
SPI
Motor Control PWM
PWM Faults
RTCC
I2C™
Comparators
CTMU
I/O Pins
32
2
8
5
3
2
1
3
1
—
—
1 ADC,
6-ch
Y
1
3
Y
13 PDIP,
SOIC
20
32
2
8
5
3
2
1
3
1
—
—
1 ADC,
6-ch
Y
1
3
Y
15 SSOP
28
32
2
16
5
3
2
1
3
1
—
—
1 ADC,
8-ch
Y
1
3
Y
21 SPDIP,
SOIC,
SSOP,
QFN
36
32
2
16
5
3
2
1
3
1
—
—
1 ADC,
8-ch
Y
1
3
Y
21 VTLA
dsPIC33FJ32GP104
44
32
2
26
5
3
2
1
3
1
—
—
1 ADC,
14-ch
Y
1
3
Y
35 TQFP,
QFN,
VTLA
dsPIC33FJ32MC101
20
32
2
10
5
3
2
1
3
1
6-ch
1
1 ADC,
6-ch
Y
1
3
Y
15 PDIP,
SOIC,
SSOP
dsPIC33FJ32MC102
28
32
2
16
5
3
2
1
3
1
6-ch
2
1 ADC,
8-ch
Y
1
3
Y
21 SPDIP,
SOIC,
SSOP,
QFN
36
32
2
16
5
3
2
1
3
1
6-ch
2
1 ADC,
8-ch
Y
1
3
Y
21 VTLA
44
32
2
26
5
3
2
1
3
1
6-ch
2
1 ADC,
14-ch
Y
1
3
Y
35 TQFP,
QFN,
VTLA
dsPIC33FJ32GP101
dsPIC33FJ32GP102
dsPIC33FJ32MC104
Note 1:
2:
3:
Packages
RAM (Kbytes)
18
Device
10-Bit, 1.1 Msps ADC
Program Flash (Kbyte)
Remappable Peripherals
Pins
TABLE 2:
Four out of five timers are remappable.
Two pairs can be combined to have up to two 32-bit timers.
Two out of three interrupts are remappable.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 3
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams
= Pins are up to 5V tolerant
18-Pin PDIP/SOIC
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/RP4(1)/CN1/RB4
PGEC3/SOSCO/T1CK/CN0/RA4
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
Note 1:
1
2
3
4
5
6
7
8
9
dsPIC33FJ32GP101
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
1
2
3
4
5
6
7
8
9
dsPIC33FJ16GP101
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
18
17
16
15
14
13
12
11
10
18
17
16
15
14
13
12
11
10
VDD
VSS
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
VCAP
VSS
SDA1/SDI1/RP9(1)/CN21/RB9
SCL1/SDO1/RP8(1)/CN22/RB8
SCK1/INT0/RP7(1)/CN23/RB7
VDD
VSS
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
VCAP
VSS
SDA1/RP9(1)/CN21/RB9
SCL1/RP8(1)/CN22/RB8
INT0/RP7(1)/CN23/RB7
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
DS70000652F-page 4
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
= Pins are up to 5V tolerant
20-Pin SSOP
VSS
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/RP4(1)/CN1/RB4
PGEC3/SOSCO/T1CK/CN0/RA4
VSS
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
Note 1:
1
2
3
4
5
6
7
8
9
10
dsPIC33FJ32GP101
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
1
2
3
4
5
6
7
8
9
10
dsPIC33FJ16GP101
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
20
19
18
17
16
15
14
13
12
11
20
19
18
17
16
15
14
13
12
11
AVDD
AVSS
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
VDD
VCAP
VSS
SDA1/SDI1/RP9(1)/CN21/RB9
SCL1/SDO1/RP8(1)/CN22/RB8
SCK1/INT0/RP7(1)/CN23/RB7
AVDD
AVSS
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
VDD
VCAP
VSS
SDA1/RP9(1)/CN21/RB9
SCL1/RP8(1)/CN22/RB8
INT0/RP7(1)/CN23/RB7
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 5
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
= Pins are up to 5V tolerant
28-Pin SPDIP/SOIC/SSOP
Note 1:
1
2
3
4
5
6
7
8
9
10
11
12
13
14
dsPIC33FJ32GP102
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
VSS
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
VDD
ASDA1/RP5(1)/CN27/RB5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
dsPIC33FJ16GP102
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
VSS
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/RP4(1)/CN1/RB4
PGEC3/SOSCO/T1CK/CN0/RA4
VDD
ASDA1/RP5(1)/CN27/RB5
28
27
26
25
24
23
22
21
20
19
18
17
16
15
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AVDD
AVSS
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
RP13(1)/CN13/RB13
RP12(1)/CN14/RB12
RP11(1)/CN15/RB11
RP10(1)/CN16/RB10
VCAP
VSS
SDA1/SDI1/RP9(1)/CN21/RB9
SCL1/SDO1/RP8(1)/CN22/RB8
SCK1/INT0/RP7(1)/CN23/RB7
ASCL1/RP6(1)/CN24/RB6
AVDD
AVSS
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
RP13(1)/CN13/RB13
RP12(1)/CN14/RB12
RP11(1)/CN15/RB11
RP10(1)/CN16/RB10
VCAP
VSS
SDA1/RP9(1)/CN21/RB9
SCL1/RP8(1)/CN22/RB8
INT0/RP7(1)/CN23/RB7
ASCL1/RP6(1)/CN24/RB6
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
DS70000652F-page 6
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
= Pins are up to 5V tolerant
20-Pin PDIP/SOIC/SSOP
VSS
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/RP4(1)/CN1/RB4
PGEC3/SOSCO/T1CK/CN0/RA4
VSS
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
Note 1:
2:
1
2
3
4
5
6
7
8
9
10
dsPIC33FJ32MC101
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
1
2
3
4
5
6
7
8
9
10
dsPIC33FJ16MC101
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
20
19
18
17
16
15
14
13
12
11
20
19
18
17
16
15
14
13
12
11
VDD
VSS
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
PWM1L2/RP13(1)/CN13/RB13
PWM1H2/RP12(1)/CN14/RB12
VCAP
SDA1/SDI1/PWM1L3/RP9(1)/CN21/RB9
SCL1/SDO1/PWM1H3/RP8(1)/CN22/RB8
FLTA1(2)/SCK1/INT0/RP7(1)/CN23/RB7
VDD
VSS
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
PWM1L2/RP13(1)/CN13/RB13
PWM1H2/RP12(1)/CN14/RB12
VCAP
SDA1/PWM1L3/RP9(1)/CN21/RB9
SCL1/PWM1H3/RP8(1)/CN22/RB8
FLTA1(2)/INT0/RP7(1)/CN23/RB7
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM Faults”
for more information on the PWM Faults.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 7
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
= Pins are up to 5V tolerant
28-Pin SPDIP/SOIC/SSOP
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
VSS
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
VDD
FLTB1(2)/ASDA1/RP5(1)/CN27/RB5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Note 1:
2:
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AVDD
AVSS
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
PWM1L2/RP13(1)/CN13/RB13
PWM1H2/RP12(1)/CN14/RB12
PWM1L3/RP11(1)/CN15/RB11
PWM1H3/RP10(1)/CN16/RB10
VCAP
VSS
SDA1/SDI1/RP9(1)/CN21/RB9
SCL1/SDO1/RP8(1)/CN22/RB8
SCK1/INT0/RP7(1)/CN23/RB7
FLTA1(2)/ASCL1/RP6(1)/CN24/RB6
dsPIC33FJ32MC102
1
2
3
4
5
6
7
8
9
10
11
12
13
14
dsPIC33FJ16MC102
MCLR
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
VSS
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED3/SOSCI/RP4(1)/CN1/RB4
PGEC3/SOSCO/T1CK/CN0/RA4
VDD
FLTB1(2)/ASDA1/RP5(1)/CN27/RB5
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AVDD
AVSS
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
PWM1L2/RP13(1)/CN13/RB13
PWM1H2/RP12(1)/CN14/RB12
PWM1L3/RP11(1)/CN15/RB11
PWM1H3/RP10(1)/CN16/RB10
VCAP
VSS
SDA1/RP9(1)/CN21/RB9
SCL1/RP8(1)/CN22/RB8
INT0/RP7(1)/CN23/RB7
FLTA1(2)/ASCL1/RP6(1)/CN24/RB6
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM Faults”
for more information on the PWM Faults.
DS70000652F-page 8
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
28-Pin QFN(2)
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
AVSS
MCLR
AVDD
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
= Pins are up to 5V tolerant
28 27 26 25 24 23 22
21
RP13(1)/CN13/RB13
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
2
20
RP12(1)/CN14/RB12
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
3
19
RP11(1)/CN15/RB11
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
4 dsPIC33FJ16GP102 18
RP10(1)/CN16/RB10
VSS
5
17
VCAP
OSCI/CLKI/CN30/RA2
6
16
VSS
OSCO/CLKO/CN29/RA3
7
15
SDA1/SDI1/RP9(1)/CN21/RB9
Note 1:
2:
SCL1/SDO1/RP8(1)/CN22/RB8
ASCL1/RP6(1)/CN24/RB6
SCK1/INT0/RP7(1)/CN23/RB7
ASDA1/RP5(1)/CN27/RB5
9 10 11 12 13 14
VDD
8
PGED3/SOSCI/RP4(1)/CN1/RB4
1
PGEC3/SOSCO/T1CK/CN0/RA4
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 9
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
28-Pin QFN(2)
RTCC/RP14(1)/CN12/RB14
RP15(1)/CN11/RB15
AVSS
MCLR
AVDD
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
= Pins are up to 5V tolerant
28 27 26 25 24 23 22
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
1
21
RP13(1)/CN13/RB13
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
2
20
RP12(1)/CN14/RB12
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
3
19
RP11(1)/CN15/RB11
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
4 dsPIC33FJ32GP102 18
RP10(1)/CN16/RB10
VSS
Note 1:
2:
VCAP
6
16
VSS
OSCO/CLKO/CN29/RA3
7
15
SDA1/RP9(1)/CN21/RB9
SCL1/RP8 /CN22/RB8
(1)
INT0/RP7(1)/CN23/RB7
ASCL1/RP6(1)/CN24/RB6
ASDA1/RP5(1)/CN27/RB5
9 10 11 12 13 14
VDD
8
PGEC3/SOSCOAN10//T1CK/CN0/RA4
17
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
5
OSCI/CLKI/CN30/RA2
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
DS70000652F-page 10
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
28-Pin QFN(2)
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
AVSS
MCLR
AVDD
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
= Pins are up to 5V tolerant
28 27 26 25 24 23 22
(1)
1
21
(1)
2
20
PGED1/AN2/C2INA/C1INC/RP0 /CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1 /CN5/RB1
3
19
4 dsPIC33FJ16MC102 18
VSS
5
17
VCAP
OSCI/CLKI/CN30/RA2
6
16
VSS
OSCO/CLKO/CN29/RA3
7
15
SDA1/SDI1/RP9(1)/CN21/RB9
PWM1H3/RP10(1)/CN16/RB10
SCL1/SDO1/RP8(1)/CN22/RB8
SCK1/INT0/RP7(1)/CN23/RB7
FLTA1(3)/ASCL1/RP6(1)/CN24/RB6
FLTB1(3)/ASDA1/RP5(1)/CN27/RB5
9 10 11 12 13 14
VDD
PGED3/SOSCI/RP4(1)/CN1/RB4
8
PGEC3/SOSCO/T1CK/CN0/RA4
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
3:
PWM1H2/RP12(1)/CN14/RB12
PWM1L3/RP11(1)/CN15/RB11
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
Note 1:
2:
PWM1L2/RP13(1)/CN13/RB13
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM Faults”
for more information on the PWM Faults.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 11
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
28-Pin QFN(2)
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
AVSS
MCLR
AVDD
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
= Pins are up to 5V tolerant
28 27 26 25 24 23 22
(1)
1
21
PWM1L2/RP13(1)/CN13/RB13
(1)
2
20
PWM1H2/RP12(1)/CN14/RB12
PGED1/AN2/C2INA/C1INC/RP0 /CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1 /CN5/RB1
3
19
4 dsPIC33FJ32MC102 18
PWM1L3/RP11(1)/CN15/RB11
VSS
5
17
VCAP
OSCI/CLKI/CN30/RA2
6
16
VSS
OSCO/CLKO/CN29/RA3
7
15
SDA1/RP9(1)/CN21/RB9
Note 1:
2:
3:
PWM1H3/RP10(1)/CN16/RB10
SCL1/RP8(1)/CN22/RB8
INT0/RP7(1)/CN23/RB7
FLTA1(3)/ASCL1/RP6(1)/CN24/RB6
9 10 11 12 13 14
FLTB1(3)/ASDA1/RP5(1)/CN27/RB5
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
8
VDD
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM
Faults” for more information on the PWM Faults.
DS70000652F-page 12
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
36-Pin VTLA(2)
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
N/C
N/C
MCLR
AVDD
AVSS
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
= Pins are up to 5V tolerant
36
35
34
33
32
31
30
29
28
27
RP13(1)/CN13/RB13
1
26
RP12(1)/CN14/RB12
(1)
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1 /CN5/RB1
2
25
RP11(1)/CN15/RB11
(1)/CN6/RB2
3
24
RP10(1)/CN16/RB10
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
4
23
VDD
VDD
5
22
VCAP
VSS
6
21
VSS
OSCI/CLKI/CN30/RA2
7
20
N/C
OSCO/CLKO/CN29/RA3
8
19
SDA1/SDI1/RP9(1)/CN21/RB9
PGED3/SOSCI/RP4(1)/CN1/RB4
9
Note 1:
2:
18
SCL1/SDO1/RP8 /CN22/RB8
16 17
(1)
VDD
15
SCK1/INT0/RP7(1)/CN23/RB7
N/C (Vss)
14
ASCL1/RP6 /CN24/RB6
13
(1)
12
N/C (VDD)
11
ASDA1/RP5(1)/CN27/RB5
10
N/C
dsPIC33FJ16GP102
PGEC3/SOSCO/T1CK/CN0/RA4
AN4/C3INC/C2INC/RP2
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 13
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
36-Pin VTLA(2)
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
N/C
N/C
MCLR
AVDD
AVSS
RP15(1)/CN11/RB15
RTCC/RP14(1)/CN12/RB14
= Pins are up to 5V tolerant
36
35
34 33
32
31
30
29
28
27
RP13(1)/CN13/RB13
1
26
RP12(1)/CN14/RB12
(1)
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1 /CN5/RB1
2
25
RP11(1)/CN15/RB11
(1)/CN6/RB2
3
24
RP10(1)/CN16/RB10
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
4
23
VDD
VDD
5
22
VCAP
VSS
6
21
VSS
OSCI/CLKI/CN30/RA2
7
20
N/C
OSCO/CLKO/CN29/RA3
8
19
SDA1/RP9(1)/CN21/RB9
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
9
Note 1:
2:
15
N/C (Vss)
VDD
N/C (VDD)
ASDA1/RP5(1)/CN27/RB5
16 17
18
SCL1/RP8 /CN22/RB8
14
(1)
13
INT0/RP7(1)/CN23/RB7
12
ASCL1/RP6 /CN24/RB6
11
(1)
10
N/C
dsPIC33FJ32GP102
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
AN4/C3INC/C2INC/RP2
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
DS70000652F-page 14
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
36-Pin VTLA(2)
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
N/C
N/C
MCLR
AVDD
AVSS
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
= Pins are up to 5V tolerant
36
35
34
33
32
31
30
29
28
27
PWM1L2/RP13(1)/CN13/RB13
1
26
PWM1H2/RP12(1)/CN14/RB12
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1 /CN5/RB1
2
25
PWM1L3/RP11(1)/CN15/RB11
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
3
24
PWM1H3/RP10(1)/CN16/RB10
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
4
23
VDD
VDD
5
22
VCAP
VSS
6
21
VSS
OSCI/CLKI/CN30/RA2
7
20
N/C
OSCO/CLKO/CN29/RA3
8
19
SDA1/SDI1/RP9(1)/CN21/RB9
PGED3/SOSCI/RP4(1)/CN1/RB4
9
Note 1:
2:
3:
18
SCL1/SDO1/RP8(1)/CN22/RB8
SCK1/INT0/RP7(1)/CN23/RB7
N/C (VDD)
16 17
/ASCL1/RP6 /CN24/RB6
VDD
15
(1)
14
FLTA1(3)
13
FLTB1 /ASDA1/RP5 /CN27/RB5
12
(1)
11
(3)
10
N/C (Vss)
dsPIC33FJ16MC102
N/C
(1)
PGEC3/SOSCO/T1CK/CN0/RA4
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM Faults”
for more information on the PWM Faults.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 15
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
36-Pin VTLA(2)
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
N/C
N/C
MCLR
AVDD
AVSS
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
= Pins are up to 5V tolerant
36
35
34
33
32
31
30
29
28 27
PWM1L2/RP13(1)/CN13/RB13
1
26
PWM1H2/RP12(1)/CN14/RB12
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1 /CN5/RB1
2
25
PWM1L3/RP11(1)/CN15/RB11
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
3
24
PWM1H3/RP10(1)/CN16/RB10
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
4
23
VDD
VDD
5
22
VCAP
VSS
6
21
VSS
OSCI/CLKI/CN30/RA2
7
20
N/C
OSCO/CLKO/CN29/RA3
8
19
SDA1/RP9(1)/CN21/RB9
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
9
Note 1:
2:
3:
11
12
13
14
15
16 17
18
VDD
N/C (VDD)
FLTB1(3)/ASDA1/RP5(1)/CN27/RB5
FLTA1(3)/ASCL1/RP6(1)/CN24/RB6
SCL1/RP8(1)/CN22/RB8
INT0/RP7(1)/CN23/RB7
10
N/C (Vss)
dsPIC33FJ32MC102
N/C
(1)
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM Faults”
for more information on the PWM Faults.
DS70000652F-page 16
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
= Pins are up to 5V tolerant
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
RA9
AN11/RP19(1)/CN28/RC3
AN12/RP20(1)/CN25/RC4
AN15/RP21(1)/CN26/RC5
VSS
VDD
ASDA1/RP5(1)/CN27/RB5
ASCL1/RP6(1)/CN24/RB6
INT0/RP7(1)/CN23/RB7
SCL1/RP8(1)/CN22/RB8
44-Pin TQFP
44 43 42 41 40 39 38 37 36 35 34
SDA1/RP9(1)/CN21/RB9
1
33
PEGED3/SOSCI/AN9/RP4(1)/CN1/RB4
RP22(1)/CN18/RC6
2
32
RA8
RP23(1)/CN17/RC7
3
31
OSC2/CLK0/CN29/RA3
RP24(1)/CN20/RC8
4
30
OSC1/CLKI/CN30/RA2
RP25(1)/CN19/RC9
5
29
VSS
dsPIC33FJ32GP104
VSS
6
28
VDD
VCAP
7
27
AN8/RP18(1)/CN10/RC2
RP10/CN16/RB10
8
26
AN7/RP17(1)/CN9/RC1
RP11(1)/CN15/RB11
9
25
AN6/RP16(1)/CN8/RC0
RP12(1)/CN14/RB12
10
24
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
RP13(1)/CN13/RB13
11
23
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
Note 1:
/CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
PGED1/AN2/C2INA/C1INC/RP0(1)
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
MCLR
AVSS
AVDD
RP15(1)/CN11/RB15
RA7
RTCC/RP14(1)/CN12/RB14
RA10
12 13 14 15 16 17 18 19 20 21 22
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 17
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
44-Pin TQFP
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
RA9
AN11/RP19(1)/CN28/RC3
AN12/RP20(1)/CN25/RC4
AN15/RP21(1)/CN26/RC5
VSS
VDD
FLTB1(2)/ASDA1/RP5(1)/CN27/RB5
FLTA1(2)/ASCL1/RP6(1)/CN24/RB6
INT0/RP7(1)/CN23/RB7
SCL1/RP8(1)/CN22/RB8
= Pins are up to 5V tolerant
44 43 42 41 40 39 38 37 36 35 34
SDA1/RP9(1)/CN21/RB9
1
33
PEGED3/SOSCI/AN9/RP4(1)/CN1/RB4
RP22(1)/CN18/RC6
2
32
RA8
RP23(1)/CN17/RC7
3
31
OSC2/CLK0/CN29/RA3
RP24(1)/CN20/RC8
4
30
OSC1/CLKI/CN30/RA2
RP25(1)/CN19/RC9
5
29
VSS
dsPIC33FJ32MC104
VSS
6
28
VDD
VCAP
7
27
AN8/RP18(1)/CN10/RC2
PWM1H3/RP10(1)/CN16/RB10
8
26
AN7/RP17(1)/CN9/RC1
(1)/CN15/RB11
9
25
AN6/RP16(1)/CN8/RC0
10
24
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
11
23
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
PWM1L3/RP11
PWM1H2/RP12(1)/CN14/RB12
(1)
PWM1L2/RP13 /CN13/RB13
Note 1:
2:
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
MCLR
AVSS
AVDD
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14(1)/CN12/RB14
RA7
RA10
12 13 14 15 16 17 18 19 20 21 22
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM Faults”
for more information on the PWM Faults.
DS70000652F-page 18
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
44-Pin QFN(2)
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
RA9
AN11/RP19(1)/CN28/RC3
AN12/RP20(1)/CN25/RC4
AN15/RP21(1)/CN26/RC5
VSS
VDD
ASDA1/RP5(1)/CN27/RB5
ASCL1/RP6(1)/CN24/RB6
INT0/RP7(1)/CN23/RB7
SCL1/RP8(1)/CN22/RB8
= Pins are up to 5V tolerant
44 43 42 41 40 39 38 37 36 35 34
SDA1/RP9(1)/CN21/RB9
1
33
(1)
RP22 /CN18/RC6
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
2
32
RA8
RP23(1)/CN17/RC7
3
31
OSC2/CLKO/CN29/RA3
RP24(1)/CN20/RC8
4
30
OSC1/CLKI/CN30/RA2
RP25(1)/CN19/RC9
5
29
VSS
dsPIC33FJ32GP104
VSS
6
28
VDD
VCAP
7
27
AN8/RP18(1)/CN10/RC2
RP10(1)/CN16/RB10
8
26
AN7/RP17(1)/CN9/RC1
RP11(1)/CN15/RB11
9
25
AN6/RP16(1)/CN8/RC0
RP12 /CN14/RB12
10
24
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
RP13(1)/CN13/RB13
11
23
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
(1)
Note 1:
2:
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1 /CN5/RB1
(1)
PGED1/AN2/C2INA/C1INC/RP0 /CN4/RB0
(1)
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
AVDD
MCLR
AVSS
RP15 /CN11/RB15
(1)
RTCC/RP14(1)/CN12/RB14
RA7
RA10
12 13 14 15 16 17 18 19 20 21 22
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 19
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
44-Pin QFN(2)
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
RA9
AN11/RP19(1)/CN28/RC3
AN12/RP20(1)/CN25/RC4
AN15/RP21(1)/CN26/RC5
VSS
VDD
FLTB1(3)/ASDA1/RP5(1)/CN27/RB5
FLTA1(3)/ASCL1/RP6(1)/CN24/RB6
INT0/RP7(1)/CN23/RB7
SCL1/RP8(1)/CN22/RB8
= Pins are up to 5V tolerant
44 43 42 41 40 39 38 37 36 35 34
SDA1/RP9(1)/CN21/RB9
1
33
RP22(1)/CN18/RC6
2
32
RA8
RP23(1)/CN17/RC7
3
31
OSC2/CLKO/CN29/RA3
RP24(1)/CN20/RC8
4
30
OSC1/CLKI/CN30/RA2
RP25(1)/CN19/RC9
5
29
VSS
VSS
6
28
VDD
dsPIC33FJ32MC104
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
VCAP
7
27
AN8/RP18(1)/CN10/RC2
PWM1H3/RP10(1)/CN16/RB10
8
26
AN7/RP17(1)/CN9/RC1
PWM1L3/RP11(1)/CN15/RB11
9
25
AN6/RP16(1)/CN8/RC0
PWM1H2/RP12(1)/CN14/RB12
10
24
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
11
23
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
(1)
PWM1L2/RP13 /CN13/RB13
Note 1:
2:
3:
PGED1/AN2/C2INA/C1INC/RP0 /CN4/RB0
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
(1)
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
MCLR
AVSS
AVDD
PWM1L1/RP15(1)/CN11/RB15
RA7
PWM1H1/RTCC/RP14(1)/CN12/RB14
RA10
12 13 14 15 16 17 18 19 20 21 22
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM Faults”
for more information on the PWM Faults.
DS70000652F-page 20
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
44-Pin TLA(2)
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
AN11/RP19(1)/CN28/RC3
AN12/RP20(1)/CN25/RC4
AN15/RP21(1)/CN26/RC5
32
RA8
RP22 /CN18/RC6
2
31
OSC2/CLKO/CN29/RA3
RP23(1)/CN17/RC7
3
30
OSC1/CLKI/CN30/RA2
RP24 /CN20/RC8
4
29
VSS
RP25(1)/CN19/RC9
5
28
VDD
VSS
6
27
AN8/RP18(1)/CN10/RC2
VCAP
7
26
AN7/RP17(1)/CN9/RC1
RP10 /CN16/RB10
8
25
AN6/RP16(1)/CN8/RC0
RP11(1)/CN15/RB11
(1)
(1)
RA9
1
(1)
VDD
43 42 41 40 39 38 37 36 35 34 33
VSS
INT0/RP7(1)/CN23/RB7
ASDA1/RP5(1)/CN27/RB5
SCL1/RP8(1)/CN22/RB8
44
SDA1/RP9(1)/CN21/RB9
dsPIC33FJ32GP104
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1(1)/CN5/RB1
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
RP15
RA10
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
11 12 13 14 15 16 17 18 19 20 21 22
RP13 /CN13/RB13
MCLR
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
AVDD
23
AVSS
10
(1)
(1)/CN11/RB15
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
RTCC/RP14(1)/CN12/RB14
24
RA7
9
(1)
RP12 /CN14/RB12
Note 1:
2:
ASCL1/RP6(1)/CN24/RB6
= Pins are up to 5V tolerant
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 21
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Pin Diagrams (Continued)
44-Pin TLA(2)
SDA1/RP9(1)
PGEC3/SOSCO/AN10/T1CK/CN0/RA4
AN11/RP19(1)/CN28/RC3
AN12/RP20(1)/CN25/RC4
AN15/RP21(1)/CN26/RC5
RA9
43 42 41 40 39 38 37 36 35 34 33
VSS
44
VDD
INT0/RP7(1)/CN23/RB7
FLTB1(3)/ASDA1/RP5(1)/CN27/RB5
SCL1/RP8(1)/CN22/RB8
FLTA1(3)/ASCL1/RP6(1)/CN24/RB6
= Pins are up to 5V tolerant
PGED3/SOSCI/AN9/RP4(1)/CN1/RB4
1
32
RA8
2
31
OSC2/CLKO/CN29/RA3
RP23(1)/CN17/RC7
3
30
OSC1/CLKI/CN30/RA2
RP24(1)/CN20/RC8
4
29
VSS
RP25(1)/CN19/RC9
5
28
VDD
VSS
6
27
AN8/RP18(1)/CN10/RC2
VCAP
7
26
AN7/RP17(1)/CN9/RC1
PWM1H3/RP10(1)/CN16/RB10
8
25
AN6/RP16(1)/CN8/RC0
PWM1L3/RP11(1)/CN15/RB11
9
24
AN5/C3IND/C2IND/RP3(1)/CN7/RB3
PWM1H2/RP12(1)/CN14/RB12
10
23
AN4/C3INC/C2INC/RP2(1)/CN6/RB2
PWM1L2/RP13(1)/CN13/RB13
11 12 13 14 15 16 17 18 19 20 21 22
Note 1:
2:
3:
(1)
PGED1/AN2/C2INA/C1INC/RP0(1)/CN4/RB0
PGEC2/AN1/C3INA/C1INB/CTED2/CN3/RA1
PGED2/AN0/C3INB/C1INA/CTED1/CN2/RA0
MCLR
AVSS
AVDD
PWM1L1/RP15(1)/CN11/RB15
PWM1H1/RTCC/RP14 /CN12/RB14
RA7
(1)
RA10
dsPIC33FJ32MC104
PGEC1/AN3/CVREFIN/CVREFOUT/C2INB/C1IND/RP1 /CN5/RB1
/CN21/RB9
RP22(1)/CN18/RC6
The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals.
The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to VSS externally.
The PWM Fault pins are enabled and asserted during any Reset event. Refer to Section 15.2 “PWM Faults”
for more information on the PWM Faults.
DS70000652F-page 22
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 27
2.0 Guidelines for Getting Started with 16-bit Digital Signal Controllers .......................................................................................... 33
3.0 CPU............................................................................................................................................................................................ 37
4.0 Memory Organization ................................................................................................................................................................. 49
5.0 Flash Program Memory.............................................................................................................................................................. 83
6.0 Resets ....................................................................................................................................................................................... 87
7.0 Interrupt Controller ..................................................................................................................................................................... 95
8.0 Oscillator Configuration ............................................................................................................................................................ 125
9.0 Power-Saving Features............................................................................................................................................................ 133
10.0 I/O Ports ................................................................................................................................................................................... 139
11.0 Timer1 ...................................................................................................................................................................................... 165
12.0 Timer2/3 and Timer4/5 ............................................................................................................................................................. 167
13.0 Input Capture............................................................................................................................................................................ 175
14.0 Output Compare....................................................................................................................................................................... 177
15.0 Motor Control PWM Module ..................................................................................................................................................... 181
16.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 197
17.0 Inter-Integrated Circuit™ (I2C™).............................................................................................................................................. 203
18.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 211
19.0 10-Bit Analog-to-Digital Converter (ADC)................................................................................................................................. 217
20.0 Comparator Module.................................................................................................................................................................. 231
21.0 Real-Time Clock and Calendar (RTCC) .................................................................................................................................. 243
22.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 255
23.0 Special Features ...................................................................................................................................................................... 261
24.0 Instruction Set Summary .......................................................................................................................................................... 269
25.0 Development Support............................................................................................................................................................... 277
26.0 Electrical Characteristics .......................................................................................................................................................... 281
27.0 High-Temperature Electrical Characteristics............................................................................................................................ 339
28.0 Packaging Information.............................................................................................................................................................. 343
Appendix A: Revision History............................................................................................................................................................. 373
Index ................................................................................................................................................................................................. 381
The Microchip Web Site ..................................................................................................................................................................... 387
Customer Change Notification Service .............................................................................................................................................. 387
Customer Support .............................................................................................................................................................................. 387
Product Identification System ............................................................................................................................................................ 389
 2011-2014 Microchip Technology Inc.
DS70000652F-page 23
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at [email protected] We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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Customer Notification System
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DS70000652F-page 24
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Referenced Sources
This device data sheet is based on the following
individual chapters of the “dsPIC33/PIC24 Family Reference Manual”. These documents should be
considered as the primary reference for the operation
of a particular module or device feature.
Note 1: To access the documents listed below,
browse to the documentation section
of the dsPIC33FJ16MC102 product
page of the Microchip Web site
(www.microchip.com).
In addition to parameters, features and
other documentation, the resulting page
provides links to the related family
reference manual sections.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
“CPU” (DS70204)
“Data Memory” (DS70202)
“Program Memory” (DS70203)
“Flash Programming” (DS70191)
“Reset” (DS70192)
“Watchdog Timer and Power-Saving Modes” (DS70196)
“Timers” (DS70205)
“Input Capture” (DS70198)
“Output Compare” (DS70209)
“Motor Control PWM” (DS70187)
“Analog-to-Digital Converter (ADC)” (DS70183)
“UART” (DS70188)
“Serial Peripheral Interface (SPI)” (DS70206)
“Inter-Integrated Circuit™ (I2C™)” (DS70195)
“CodeGuard Security” (DS70199)
“Programming and Diagnostics” (DS70207)
“Device Configuration” (DS70194)
“I/O Ports with Peripheral Pin Select (PPS)” (DS70190)
“Real-Time Clock and Calendar (RTCC)” (DS70301)
“Introduction (Part VI)” (DS70655)
“Oscillator (Part VI)” (DS70644)
“Interrupts (Part VI)” (DS70633)
“Comparator with Blanking” (DS70647)
“Charge Time Measurement Unit (CTMU)” (DS70635)
 2011-2014 Microchip Technology Inc.
DS70000652F-page 25
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 26
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
1.0
Note:
DEVICE OVERVIEW
This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
devices. However, it is not intended to be
a comprehensive reference source. To
complement the information in this data
sheet, refer to the latest family reference
sections of the “dsPIC33/PIC24 Family
Reference Manual”, which are available
from
the
Microchip
web
site
(www.microchip.com).
 2011-2014 Microchip Technology Inc.
This data sheet contains device-specific information for
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 Digital Signal Controller (DSC)
devices. These devices contain extensive Digital Signal
Processor (DSP) functionality with a high-performance,
16-bit microcontroller (MCU) architecture.
Figure 1-1 shows a general block diagram of the core
and peripheral modules in the dsPIC33FJ16(GP/
MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104
family of devices. Table 1-1 lists the functions of the
various pins shown in the pinout diagrams.
DS70000652F-page 27
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 1-1:
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104 BLOCK
DIAGRAM
PSV and Table
Data Access
Control Block
Y Data Bus
X Data Bus
Interrupt
Controller
PORTA
16
16
8
16
16
Data Latch
Data Latch
PCU PCH PCL
Program Counter
X RAM
Y RAM
Loop
Control
Logic
Address
Latch
Address
Latch
23
23
Stack
Control
Logic
23
PORTB
16
16
16
Remappable
Pins
Address Generator Units
Address Latch
Program Memory
EA MUX
ROM Latch
Data Latch
24
Instruction Reg
Control Signals
to Various Blocks
Timing
Generation
FRC/LPRC
Oscillators
CTMU
Note:
16
DSP Engine
16 x 16
W Register Array
Power-up
Timer
Divide Support
16
Oscillator
Start-up Timer
Power-on
Reset
Precision
Band Gap
Reference
Watchdog
Timer
Voltage
Regulator
Brown-out
Reset
VCAP
Literal Data
Instruction
Decode and
Control
OSC2/CLKO
OSC1/CLKI
16
16
VDD, VSS
16-Bit ALU
16
MCLR
External
Interrupts
1-3
Timers
1-5
UART1
ADC1
OC/
PWM1-2
RTCC
Comparators
1-3
SPI1
IC1-IC3
CNx
I2C1
PWM
6-ch
Not all pins or features are implemented on all device pinout configurations. See the “Pin Diagrams” section for the specific pins
and features present on each device.
DS70000652F-page 28
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 1-1:
PINOUT I/O DESCRIPTIONS
Pin
Type
Buffer
Type
PPS
AN0-AN12,
AN15(5)
I
Analog
No
Analog input channels.
CLKI
CLKO
I
O
ST/CMOS
—
No
No
External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes. Always
associated with OSC2 pin function.
OSC1
I
ST/CMOS
—
No
OSC2
I/O
Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
SOSCI
SOSCO
I
O
ST/CMOS
—
No
No
32.768 kHz low-power oscillator crystal input; CMOS otherwise.
32.768 kHz low-power oscillator crystal output.
CN0-CN30(5)
I
ST
No
Change Notification inputs. Can be software programmable for internal weak
pull-ups on all inputs.
Pin Name
No
Description
IC1-IC3
I
ST
Yes Capture Inputs 1/2/3.
OCFA
OC1-OC2
I
O
ST
—
Yes Compare Fault A input (for Compare Channels 1 and 2).
Yes Compare Outputs 1/2.
INT0
INT1
INT2
I
I
I
ST
ST
ST
No External Interrupt 0.
Yes External Interrupt 1.
Yes External Interrupt 2.
RA0-RA4,
RA7-RA10(5)
I/O
ST
No
PORTA is a bidirectional I/O port.
RB0-RB15(5)
I/O
ST
No
PORTB is a bidirectional I/O port.
RC0-RC9(5)
I/O
ST
No
PORTC is a bidirectional I/O port.
T1CK
T2CK
T3CK
T4CK(6)
T5CK(6)
I
I
I
I
I
ST
ST
ST
ST
ST
No
Yes
Yes
Yes
Yes
Timer1 external clock input.
Timer2 external clock input.
Timer3 external clock input.
Timer4 external clock input.
Timer5 external clock input.
U1CTS
U1RTS
U1RX
U1TX
I
O
I
O
ST
—
ST
—
Yes
Yes
Yes
Yes
UART1 Clear-to-Send.
UART1 Ready-to-Send.
UART1 receive.
UART1 transmit.
SCK1
SDI1
SDO1
I/O
I
O
ST
ST
—
Yes Synchronous serial clock input/output for SPI1.
Yes SPI1 data in.
Yes SPI1 data out.
Legend: CMOS = CMOS compatible input or output
Analog = Analog input
P = Power
ST = Schmitt Trigger input with CMOS levels
O = Output
I = Input
PPS = Peripheral Pin Select
Note 1: An external pull-down resistor is required for the FLTA1 pin in dsPIC33FJXXMC101 (20-pin) devices.
2: The FLTA1 pin and the PWM1Lx/PWM1Hx pins are available in dsPIC(16/32)MC10X devices only.
3: The FLTB1 pin is available in dsPIC(16/32)MC102/104 devices only.
4: The PWM Fault pins are enabled during any Reset event. Refer to Section 15.2 “PWM Faults” for more
information on the PWM Faults.
5: Not all pins are available on all devices. Refer to the specific device in the “Pin Diagrams” section for
availability.
6: These pins are available in dsPIC33FJ32(GP/MC)104 (44-pin) devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 29
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 1-1:
PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
PPS
SCL1
SDA1
ASCL1
ASDA1
I/O
I/O
I/O
I/O
ST
ST
ST
ST
No
No
No
No
Synchronous serial clock input/output for I2C1.
Synchronous serial data input/output for I2C1.
Alternate synchronous serial clock input/output for I2C1.
Alternate synchronous serial data input/output for I2C1.
FLTA1(1,2,4)
FLTB1(3,4)
PWM1L1
PWM1H1
PWM1L2
PWM1H2
PWM1L3
PWM1H3
I
I
O
O
O
O
O
O
ST
ST
—
—
—
—
—
—
No
No
No
No
No
No
No
No
PWM1 Fault A input.
PWM1 Fault B input.
PWM1 Low Output 1.
PWM1 High Output 1.
PWM1 Low Output 2.
PWM1 High Output 2.
PWM1 Low Output 3.
PWM1 High Output 3.
RTCC
O
Digital
No
RTCC Alarm output.
CTPLS
CTED1
CTED2
O
I
I
Digital
Digital
Digital
Yes CTMU pulse output.
No CTMU External Edge Input 1.
No CTMU External Edge Input 2.
CVREFIN
CVREFOUT
C1INA
C1INB
C1INC
C1IND
C1OUT
C2INA
C2INB
C2INC
C2IND
C2OUT
C3INA
C3INB
C3INC
C3IND
C3OUT
I
O
I
I
I
I
O
I
I
I
I
O
I
I
I
I
O
Analog
Analog
Analog
Analog
Analog
Analog
Digital
Analog
Analog
Analog
Analog
Digital
Analog
Analog
Analog
Analog
Digital
No
No
No
No
No
No
Yes
No
No
No
No
Yes
No
No
No
No
Yes
Comparator Voltage Positive Reference Input.
Comparator Voltage Positive Reference Output.
Comparator 1 Positive Input A.
Comparator 1 Negative Input B.
Comparator 1 Negative Input C.
Comparator 1 Negative Input D.
Comparator 1 Output.
Comparator 2 Positive Input A.
Comparator 2 Negative Input B.
Comparator 2 Negative Input C.
Comparator 2 Negative Input D.
Comparator 2 Output.
Comparator 3 Positive Input A.
Comparator 3 Negative Input B.
Comparator 3 Negative Input C.
Comparator 3 Negative Input D.
Comparator 3 Output.
PGED1
PGEC1
PGED2
PGEC2
PGED3
PGEC3
I/O
I
I/O
I
I/O
I
ST
ST
ST
ST
ST
ST
No
No
No
No
No
No
Data I/O pin for Programming/Debugging Communication Channel 1.
Clock input pin for Programming/Debugging Communication Channel 1.
Data I/O pin for Programming/Debugging Communication Channel 2.
Clock input pin for Programming/Debugging Communication Channel 2.
Data I/O pin for Programming/Debugging Communication Channel 3.
Clock input pin for Programming/Debugging Communication Channel 3.
MCLR
I/P
ST
No
Master Clear (Reset) input. This pin is an active-low Reset to the device.
Pin Name
Description
Legend: CMOS = CMOS compatible input or output
Analog = Analog input
P = Power
ST = Schmitt Trigger input with CMOS levels
O = Output
I = Input
PPS = Peripheral Pin Select
Note 1: An external pull-down resistor is required for the FLTA1 pin in dsPIC33FJXXMC101 (20-pin) devices.
2: The FLTA1 pin and the PWM1Lx/PWM1Hx pins are available in dsPIC(16/32)MC10X devices only.
3: The FLTB1 pin is available in dsPIC(16/32)MC102/104 devices only.
4: The PWM Fault pins are enabled during any Reset event. Refer to Section 15.2 “PWM Faults” for more
information on the PWM Faults.
5: Not all pins are available on all devices. Refer to the specific device in the “Pin Diagrams” section for
availability.
6: These pins are available in dsPIC33FJ32(GP/MC)104 (44-pin) devices only.
DS70000652F-page 30
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 1-1:
PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
PPS
Description
AVDD
P
P
No
Positive supply for analog modules. This pin must be connected at all times.
AVDD is connected to VDD in the 18-pin dsPIC33FJXXGP101 and 20-pin
dsPIC33FJXXMC101 devices. In all other devices, AVDD is separated from
VDD.
AVSS
P
P
No
Ground reference for analog modules. AVSS is connected to VSS in the
18-pin dsPIC33FJXXGP101 and 20-pin dsPIC33FJXXMC101 devices. In all
other devices, AVSS is separated from VSS.
VDD
P
—
No
Positive supply for peripheral logic and I/O pins.
VCAP
P
—
No
CPU logic filter capacitor connection.
VSS
P
—
No
Ground reference for logic and I/O pins.
Pin Name
Legend: CMOS = CMOS compatible input or output
Analog = Analog input
P = Power
ST = Schmitt Trigger input with CMOS levels
O = Output
I = Input
PPS = Peripheral Pin Select
Note 1: An external pull-down resistor is required for the FLTA1 pin in dsPIC33FJXXMC101 (20-pin) devices.
2: The FLTA1 pin and the PWM1Lx/PWM1Hx pins are available in dsPIC(16/32)MC10X devices only.
3: The FLTB1 pin is available in dsPIC(16/32)MC102/104 devices only.
4: The PWM Fault pins are enabled during any Reset event. Refer to Section 15.2 “PWM Faults” for more
information on the PWM Faults.
5: Not all pins are available on all devices. Refer to the specific device in the “Pin Diagrams” section for
availability.
6: These pins are available in dsPIC33FJ32(GP/MC)104 (44-pin) devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 31
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 32
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
2.0
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To complement the information in this data sheet,
refer to the “dsPIC33/PIC24 Family
Reference Manual”. Please see the
Microchip web site (www.microchip.com)
for the latest “dsPIC33/PIC24 Family
Reference Manual” sections.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
2.1
Basic Connection Requirements
Getting started with the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104 family of 16-bit
Digital Signal Controllers (DSCs) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All VDD and VSS pins
(see Section 2.2 “Decoupling Capacitors”)
• All AVDD and AVSS pins, if present on the device
(regardless if ADC module is not used)
(see Section 2.2 “Decoupling Capacitors”)
• VCAP
(see Section 2.3 “CPU Logic Filter Capacitor
Connection (VCAP)”)
• MCLR pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
• PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
• OSC1 and OSC2 pins when external oscillator
source is used
(see Section 2.6 “External Oscillator Pins”)
 2011-2014 Microchip Technology Inc.
2.2
Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS, is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
of 0.1 µF (100 nF), 10V-20V. This capacitor
should be a low-ESR and have resonance
frequency in the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
• Handling high-frequency noise: If the board is
experiencing high-frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
DS70000652F-page 33
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 2-1:
RECOMMENDED
MINIMUM CONNECTION
0.1 µF
Ceramic
10 µF
Tantalum
VDD
The placement of this capacitor should be close to the
VCAP. It is recommended that the trace length not
exceed one-quarter inch (6 mm). Refer to Section 23.2
“On-Chip Voltage Regulator” for details.
R1
VSS
VDD
VCAP
2.4
R
The MCLR
functions:
MCLR
dsPIC33F
VSS
VSS
VDD
VDD
AVSS
VDD
AVDD
VSS
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
L1(1)
Note
1:
pin
provides
two
specific
device
• Device Reset
• Device programming and debugging
C
0.1 µF
Ceramic
Master Clear (MCLR) Pin
As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between VDD and
AVDD to improve ADC noise rejection. The inductor
impedance should be less than 1 and the inductor
capacity greater than 10 mA.
Where:
F CNV
f = -------------- (i.e., ADC conversion rate/2)
2
1
f = ---------------------- 2 LC 
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (VIH and VIL) and fast signal
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For example, as shown in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
EXAMPLE OF MCLR PIN
CONNECTIONS
VDD
2
1
L =  ----------------------
  2f C 
R(1)
R1(2)
MCLR
2.2.1
TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that connects the power supply source to the device and the
maximum current drawn by the device in the application. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3
CPU Logic Filter Capacitor
Connection (VCAP)
JP
dsPIC33F
C
Note 1:
R  10 k is recommended. A suggested
starting value is 10 k. Ensure that the
MCLR pin VIH and VIL specifications are met.
2:
R1  470 will limit any current flowing into
MCLR from the external capacitor, C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR
pin VIH and VIL specifications are met.
A low-ESR (< 5 Ohms) capacitor is required on the
VCAP pin, which is used to stabilize the voltage
regulator output voltage. The VCAP pin must not be
connected to VDD, and must have a capacitor between
4.7 µF and 10 µF, 16V connected to ground. The type
can be ceramic or tantalum. Refer to Section 26.0
“Electrical Characteristics” for additional information.
DS70000652F-page 34
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
2.5
ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging purposes. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communications to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternately, refer to the AC/DC characteristics and
timing requirements information in the “dsPIC33F
Flash Programming Specification for Devices with Volatile Configuration Bits” (DS70659) for information on
capacitive loading limits and pin Voltage Input High
(VIH) and Voltage Input Low (VIL) requirements.
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB® ICD 3 or MPLAB REAL ICE™.
For more information on ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
• “Using MPLAB® ICD 3” (poster) (DS51765)
• “MPLAB® ICD 3 Design Advisory” (DS51764)
• “MPLAB® REAL ICE™ In-Circuit Debugger
User’s Guide” (DS51616)
• “Using MPLAB® REAL ICE™” (poster) (DS51749)
 2011-2014 Microchip Technology Inc.
2.6
External Oscillator Pins
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
FIGURE 2-3:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Main Oscillator
13
Guard Ring
14
15
Guard Trace
Secondary
Oscillator
16
17
18
19
20
DS70000652F-page 35
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
2.7
Oscillator Value Conditions on
Device Start-up
If the PLL of the target device is enabled and
configured for the device start-up oscillator, the
maximum oscillator source frequency must be limited
to 4 MHz < FIN < 8 MHz (for MSPLL mode) or 3 MHz <
FIN < 8 MHz (for ECPLL mode) to comply with device
PLL start-up conditions. HSPLL mode is not supported.
This means that if the external oscillator frequency is
outside this range, the application must start-up in the
FRC mode first. The fixed PLL settings of 4x after a
POR with an oscillator frequency outside this range will
violate the device operating speed.
Once the device powers up, the application firmware
can enable the PLL and then perform a clock switch to
the Oscillator + PLL clock source. Note that clock
switching must be enabled in the device Configuration
Word.
2.8
Configuration of Analog and
Digital Pins During ICSP
Operations
If your application needs to use certain
Analog-to-Digital pins as analog input pins during the
debug session, the user application must clear the
corresponding bits in the AD1PCFGL register during
initialization of the ADC module.
When MPLAB ICD 3 or MPLAB REAL ICE in-circuit
emulator is used as a programmer, the user application
firmware must correctly configure the AD1PCFGL
register. Automatic initialization of this register is only
done during debugger operation. Failure to correctly
configure the register(s) will result in all
Analog-to-Digital pins being recognized as analog input
pins, resulting in the port value being read as a logic ‘0’,
which may affect user application functionality.
2.9
Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic-low state.
Alternately, connect a 1k to 10k resistor between VSS
and unused pins.
If MPLAB ICD 3 or MPLAB REAL ICE in-circuit
emulator is selected as a debugger, it automatically
initializes all of the Analog-to-Digital input pins (ANx) as
“digital” pins, by setting all bits in the AD1PCFGL
register.
The bits in the register that correspond to the
Analog-to-Digital pins that are initialized by MPLAB
ICD 3 or MPLAB REAL ICE in-circuit emulator, must
not be cleared by the user application firmware;
otherwise, communication errors will result between
the debugger and the device.
DS70000652F-page 36
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
3.0
CPU
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “CPU” (DS70204) in the
“dsPIC33/PIC24 Family Reference Manual”, which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 CPU module has a
16-bit (data) modified Harvard architecture with an
enhanced instruction set, including significant support
for DSP. The CPU has a 24-bit instruction word with a
variable length opcode field. The Program Counter
(PC) is 23 bits wide and addresses up to 4M x 24 bits
of user program memory space. The actual amount of
program memory implemented varies by device. A
single-cycle instruction prefetch mechanism is used to
help maintain throughput and provides predictable
execution. All instructions execute in a single cycle,
with the exception of instructions that change the
program flow, the double-word move (MOV.D)
instruction and the table instructions. Overhead-free
program loop constructs are supported using the DO
and REPEAT instructions, both of which are
interruptible at any point.
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices have sixteen, 16-bit Working registers in the programmer’s
model. Each of the Working registers can serve as a
data, address, or address offset register. The 16th
Working register (W15) operates as a Software Stack
Pointer (SSP) for interrupts and calls.
There are two classes of instruction in the
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices: MCU and DSP. These two
instruction classes are seamlessly integrated into a single CPU. The instruction set includes many addressing
modes and is designed for optimum C compiler efficiency. For most instructions, dsPIC33FJ16(GP/
MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104
devices are capable of executing a data (or program
data) memory read, a Working register (data) read, a
data memory write and a program (instruction) memory
read per instruction cycle. As a result, three parameter
instructions can be supported, allowing A + B = C
operations to be executed in a single cycle.
 2011-2014 Microchip Technology Inc.
A block diagram of the CPU is shown in Figure 3-1, and
the programmer’s model for the dsPIC33FJ16(GP/
MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104
is shown in Figure 3-2.
3.1
Data Addressing Overview
The data space can be addressed as 32K words or
64 Kbytes and is split into two blocks, referred to as X
and Y data memory. Each memory block has its own
independent Address Generation Unit (AGU). The
MCU class of instructions operates solely through the
X memory AGU, which accesses the entire memory
map as one linear data space. Certain DSP instructions
operate through the X and Y AGUs to support dual
operand reads, which splits the data address space
into two parts. The X and Y data space boundary is
device-specific.
Overhead-free circular buffers (Modulo Addressing
mode) are supported in both X and Y address spaces.
The Modulo Addressing removes the software
boundary checking overhead for DSP algorithms.
Furthermore, the X AGU circular addressing can be
used with any of the MCU class of instructions. The X
AGU also supports Bit-Reversed Addressing to greatly
simplify input or output data reordering for radix-2 FFT
algorithms.
The upper 32 Kbytes of the data space memory map
can optionally be mapped into program space at any
16K program word boundary defined by the 8-bit
Program Space Visibility Page (PSVPAG) register. The
program-to-data-space mapping feature lets any
instruction access program space as if it were data
space.
3.2
DSP Engine Overview
The DSP engine features a high-speed, 17-bit by 17-bit
multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. The barrel
shifter is capable of shifting a 40-bit value up to 16 bits
right or left, in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been
designed for optimal real-time performance. The MAC
instruction and other associated instructions can concurrently fetch two data operands from memory, while
multiplying two W registers and accumulating and optionally saturating the result in the same cycle. This instruction functionality requires that the RAM data space be
split for these instructions and linear for all others. Data
space partitioning is achieved in a transparent and
flexible manner through dedicating certain Working
registers to each address space.
DS70000652F-page 37
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
3.3
Special MCU Features
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 supports 16/16
and 32/16 divide operations, both fractional and
integer. All divide instructions are iterative operations.
They must be executed within a REPEAT loop, resulting
in a total execution time of 19 instruction cycles. The
divide operation can be interrupted during any of those
19 cycles without loss of data.
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 features a 17-bit
by 17-bit, single-cycle multiplier that is shared by both
the MCU ALU and DSP engine. The multiplier can perform signed, unsigned and mixed-sign multiplication.
Using a 17-bit by 17-bit multiplier for 16-bit by 16-bit
multiplication not only allows you to perform mixed-sign
multiplication, it also achieves accurate results for
special operations, such as (-1.0) x (-1.0).
FIGURE 3-1:
A 40-bit barrel shifter is used to perform up to a 16-bit
left or right shift in a single cycle. The barrel shifter can
be used by both MCU and DSP instructions.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
CPU CORE BLOCK DIAGRAM
PSV and Table
Data Access
Control Block
Y Data Bus
X Data Bus
Interrupt
Controller
8
16
16
16
16
Data Latch
Data Latch
X RAM
Y RAM
Address
Latch
Address
Latch
23
23
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
16
23
16
16
Address Generator Units
Address Latch
Program Memory
EA MUX
Data Latch
ROM Latch
24
Instruction Reg
16
Literal Data
Instruction
Decode and
Control
16
Control Signals
to Various Blocks
16
DSP Engine
16 x 16
W Register Array
Divide Support
16
16-Bit ALU
16
To Peripheral Modules
DS70000652F-page 38
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 3-2:
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
PROGRAMMER’S MODEL
D15
D0
W0/WREG
PUSH.S Shadow
W1
DO Shadow
W2
W3
Legend
W4
DSP Operand
Registers
W5
W6
W7
Working Registers
W8
W9
DSP Address
Registers
W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer
Stack Pointer Limit Register
SPLIM
AD39
DSP
Accumulators
AD15
AD31
AD0
ACCA
ACCB
PC22
PC0
Program Counter
0
0
7
TBLPAG
Data Table Page Address
7
0
PSVPAG
Program Space Visibility Page Address
15
0
RCOUNT
REPEAT Loop Counter
15
0
DCOUNT
DO Loop Counter
22
0
DOSTART
DO Loop Start Address
DOEND
DO Loop End Address
22
15
0
Core Configuration Register
CORCON
OA
OB
SA
SB OAB SAB DA
SRH
 2011-2014 Microchip Technology Inc.
DC
IPL2 IPL1 IPL0 RA
N
OV
Z
C
STATUS Register
SRL
DS70000652F-page 39
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
3.4
CPU Control Registers
REGISTER 3-1:
SR: CPU STATUS REGISTER
R-0
OA
R-0
R/C-0
R/C-0
R-0
R/C-0
R-0
R/W-0
OB
SA(1)
SB(1)
OAB
SAB
DA
DC
bit 15
bit 8
R/W-0(3)
IPL2
R/W-0(3)
R/W-0(3)
R-0
R/W-0
R/W-0
R/W-0
R/W-0
IPL1(2)
IPL0(2)
RA
N
OV
Z
C
(2)
bit 7
bit 0
Legend:
C = Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
OA: Accumulator A Overflow Status bit
1 = Accumulator A has overflowed
0 = Accumulator A has not overflowed
bit 14
OB: Accumulator B Overflow Status bit
1 = Accumulator B has overflowed
0 = Accumulator B has not overflowed
bit 13
SA: Accumulator A Saturation ‘Sticky’ Status bit(1)
1 = Accumulator A is saturated or has been saturated at some time
0 = Accumulator A is not saturated
bit 12
SB: Accumulator B Saturation ‘Sticky’ Status bit(1)
1 = Accumulator B is saturated or has been saturated at some time
0 = Accumulator B is not saturated
bit 11
OAB: OA || OB Combined Accumulator Overflow Status bit
1 = Accumulators A or B have overflowed
0 = Neither Accumulators A or B have overflowed
bit 10
SAB: SA || SB Combined Accumulator ‘Sticky’ Status bit
1 = Accumulators A or B are saturated or have been saturated at some time in the past
0 = Neither Accumulator A or B are saturated
This bit may be read or cleared (not set). Clearing this bit will clear SA and SB.
bit 9
DA: DO Loop Active bit
1 = DO loop is in progress
0 = DO loop is not in progress
bit 8
DC: MCU ALU Half Carry/Borrow bit
1 = A carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data)
of the result occurred
0 = No carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized
data) of the result occurred
Note 1:
2:
3:
This bit can be read or cleared (not set).
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read-only when NSTDIS = 1 (INTCON1<15>).
DS70000652F-page 40
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 3-1:
SR: CPU STATUS REGISTER (CONTINUED)
bit 7-5
IPL<2:0>: CPU Interrupt Priority Level Status bits(2,3)
111 = CPU Interrupt Priority Level is 7 (15), user interrupts are disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 4
RA: REPEAT Loop Active bit
1 = REPEAT loop is in progress
0 = REPEAT loop is not in progress
bit 3
N: MCU ALU Negative bit
1 = Result was negative
0 = Result was non-negative (zero or positive)
bit 2
OV: MCU ALU Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of a magnitude that
causes the sign bit to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation)
0 = No overflow occurred
bit 1
Z: MCU ALU Zero bit
1 = An operation that affects the Z bit has set it at some time in the past
0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result)
bit 0
C: MCU ALU Carry/Borrow bit
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1:
2:
3:
This bit can be read or cleared (not set).
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read-only when NSTDIS = 1 (INTCON1<15>).
 2011-2014 Microchip Technology Inc.
DS70000652F-page 41
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 3-2:
CORCON: CORE CONTROL REGISTER
U-0
—
bit 15
U-0
—
R/W-0
SATA
bit 7
R/W-0
SATB
bit 11
bit 10-8
R/W-0
US
R/W-0
EDT(1)
R-0
DL2
R-0
DL1
R-0
DL0
bit 8
Legend:
R = Readable bit
0’ = Bit is cleared
bit 15-13
bit 12
U-0
—
R/W-1
SATDW
R/W-0
ACCSAT
C = Clearable bit
W = Writable bit
‘x = Bit is unknown
R/C-0
IPL3(2)
R/W-0
PSV
R/W-0
RND
R/W-0
IF
bit 0
-n = Value at POR
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
Unimplemented: Read as ‘0’
US: DSP Multiply Unsigned/Signed Control bit
1 = DSP engine multiplies are unsigned
0 = DSP engine multiplies are signed
EDT: Early DO Loop Termination Control bit(1)
1 = Terminates executing DO loop at the end of current loop iteration
0 = No effect
DL<2:0>: DO Loop Nesting Level Status bits
111 = 7 DO loops are active
•
•
•
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note 1:
2:
001 = 1 DO loop is active
000 = 0 DO loops are active
SATA: ACCA Saturation Enable bit
1 = Accumulator A saturation is enabled
0 = Accumulator A saturation is disabled
SATB: ACCB Saturation Enable bit
1 = Accumulator B saturation is enabled
0 = Accumulator B saturation is disabled
SATDW: Data Space Write from DSP Engine Saturation Enable bit
1 = Data space write saturation is enabled
0 = Data space write saturation is disabled
ACCSAT: Accumulator Saturation Mode Select bit
1 = 9.31 saturation (super saturation)
0 = 1.31 saturation (normal saturation)
IPL3: CPU Interrupt Priority Level Status bit 3(2)
1 = CPU Interrupt Priority Level is greater than 7
0 = CPU Interrupt Priority Level is 7 or less
PSV: Program Space Visibility in Data Space Enable bit
1 = Program space is visible in data space
0 = Program space is not visible in data space
RND: Rounding Mode Select bit
1 = Biased (conventional) rounding is enabled
0 = Unbiased (convergent) rounding is enabled
IF: Integer or Fractional Multiplier Mode Select bit
1 = Integer mode is enabled for DSP multiply operations
0 = Fractional mode is enabled for DSP multiply operations
This bit will always read as ‘0’.
The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
DS70000652F-page 42
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
3.5
Arithmetic Logic Unit (ALU)
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 ALU is 16 bits
wide, and is capable of addition, subtraction, bit shifts
and logic operations. Unless otherwise mentioned,
arithmetic operations are 2’s complement in nature.
Depending on the operation, the ALU can affect the
values of the Carry (C), Zero (Z), Negative (N), Overflow (OV) and Digit Carry (DC) Status bits in the SR
register. The C and DC Status bits operate as Borrow
and Digit Borrow bits, respectively, for subtraction
operations.
The ALU can perform 8-bit or 16-bit operations,
depending on the mode of the instruction that is used.
Data for the ALU operation can come from the W
register array or data memory, depending on the
addressing mode of the instruction. Likewise, output
data from the ALU can be written to the W register array
or a data memory location.
The divide algorithm takes one cycle per bit of divisor,
so both 32-bit/16-bit and 16-bit/16-bit instructions take
the same number of cycles to execute.
3.6
DSP Engine
The DSP engine consists of a high-speed,
17-bit x 17-bit multiplier, a barrel shifter and a 40-bit
adder/subtracter (with two target accumulators, round
and saturation logic).
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 is a single-cycle
instruction flow architecture; therefore, concurrent
operation of the DSP engine with MCU instruction flow
is not possible. However, some MCU ALU and DSP
engine resources can be used concurrently by the
same instruction (e.g., ED, EDAC).
The DSP engine can also perform inherent accumulatorto-accumulator operations that require no additional
data. These instructions are ADD, SUB and NEG.
Refer to the “16-Bit MCU and DSC Programmer’s
Reference Manual” (DS70157) for information on the
SR bits affected by each instruction.
The DSP engine has options selected through bits in
the CPU Core Control register (CORCON), as listed
below:
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 CPU incorporates
hardware support for both multiplication and division.
This includes a dedicated hardware multiplier and
support hardware for 16-bit-divisor division.
•
•
•
•
•
•
3.5.1
MULTIPLIER
Using the high-speed, 17-bit x 17-bit multiplier of the
DSP engine, the ALU supports unsigned, signed or
mixed-sign operation in several MCU multiplication
modes:
•
•
•
•
•
•
•
16-bit x 16-bit signed
16-bit x 16-bit unsigned
16-bit signed x 5-bit (literal) unsigned
16-bit unsigned x 16-bit unsigned
16-bit unsigned x 5-bit (literal) unsigned
16-bit unsigned x 16-bit signed
8-bit unsigned x 8-bit unsigned
3.5.2
DIVIDER
The divide block supports 32-bit/16-bit and 16-bit/16-bit
signed and unsigned integer divide operations with the
following data sizes:
•
•
•
•
32-bit signed/16-bit signed divide
32-bit unsigned/16-bit unsigned divide
16-bit signed/16-bit signed divide
16-bit unsigned/16-bit unsigned divide
The quotient for all divide instructions ends up in W0
and the remainder in W1. The 16-bit signed and
unsigned DIV instructions can specify any W register
for both the 16-bit divisor (Wn) and any W register
(aligned) pair (W(m + 1):Wm) for the 32-bit dividend.
 2011-2014 Microchip Technology Inc.
Fractional or Integer DSP Multiply (IF)
Signed or Unsigned DSP Multiply (US)
Conventional or Convergent Rounding (RND)
Automatic Saturation On/Off for ACCA (SATA)
Automatic Saturation On/Off for ACCB (SATB)
Automatic Saturation On/Off for Writes to Data
Memory (SATDW)
• Accumulator Saturation mode Selection (ACCSAT)
A block diagram of the DSP engine is shown in
Figure 3-3.
TABLE 3-1:
DSP INSTRUCTIONS
SUMMARY
Algebraic
Operation
ACC Write
Back
CLR
A=0
Yes
ED
A = (x – y)2
Instruction
No
EDAC
A = A + (x –
y)2
No
MAC
A = A + (x * y)
Yes
MAC
A = A + x2
No
No change in A
Yes
MPY
A=x*y
No
MPY
A=x2
No
MOVSAC
MPY.N
MSC
A=–x*y
No
A=A–x*y
Yes
DS70000652F-page 43
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 3-3:
DSP ENGINE BLOCK DIAGRAM
40
S
a
40 Round t 16
u
Logic r
a
t
e
40-Bit Accumulator A
40-Bit Accumulator B
Carry/Borrow Out
Saturate
Carry/Borrow In
Adder
Negate
40
40
40
16
X Data Bus
Barrel
Shifter
40
Y Data Bus
Sign-Extend
32
16
Zero Backfill
32
33
17-Bit
Multiplier/Scaler
16
16
To/From W Array
DS70000652F-page 44
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
3.6.1
MULTIPLIER
The 17-bit x 17-bit multiplier is capable of signed or
unsigned operation and can multiplex its output using a
scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the
multiplier input value. The output of the 17-bit x 17-bit
multiplier/scaler is a 33-bit value that is sign-extended
to 40 bits. Integer data is inherently represented as a
signed 2’s complement value, where the Most Significant bit (MSb) is defined as a sign bit. The range of an
N-bit 2’s complement integer is -2N-1 to 2N-1 – 1.
• For a 16-bit integer, the data range is -32768
(0x8000) to 32767 (0x7FFF) including 0.
• For a 32-bit integer, the data range is
-2,147,483,648 (0x8000 0000) to 2,147,483,647
(0x7FFF FFFF).
When the multiplier is configured for fractional
multiplication, the data is represented as a 2’s
complement fraction, where the MSb is defined as a sign
bit and the radix point is implied to lie just after the sign bit
(QX format). The range of an N-bit 2’s complement
fraction with this implied radix point is -1.0 to (1 – 21-N).
For a 16-bit fraction, the Q15 data range is -1.0 (0x8000)
to 0.999969482 (0x7FFF) including 0 and has a precision
of 3.01518x10-5. In Fractional mode, the 16 x 16 multiply
operation generates a 1.31 product that has a precision
of 4.65661 x 10-10.
The same multiplier is used to support the MCU
multiply instructions, which include integer 16-bit
signed, unsigned and mixed sign multiply operations.
The MUL instruction can be directed to use byte or
word-sized operands. Byte operands will direct a 16-bit
result and word operands will direct a 32-bit result to
the specified register(s) in the W array.
3.6.2
DATA ACCUMULATORS AND
ADDER/SUBTRACTER
The data accumulator consists of a 40-bit adder/
subtracter with automatic sign extension logic. It
can select one of two accumulators (A or B) as its
pre-accumulation source and post-accumulation
destination. For the ADD and LAC instructions, the data
to be accumulated or loaded can be optionally scaled
using the barrel shifter prior to accumulation.
 2011-2014 Microchip Technology Inc.
3.6.2.1
Adder/Subtracter, Overflow and
Saturation
The adder/subtracter is a 40-bit adder with an optional
zero input into one side and either true or complement
data into the other input.
• In the case of addition, the Carry/Borrow input is
active-high and the other input is true data (not
complemented).
• In the case of subtraction, the Carry/Borrow input
is active-low and the other input is complemented.
The adder/subtracter generates Overflow Status bits,
SA/SB and OA/OB, which are latched and reflected in
the STATUS Register:
• Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
• Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block that controls
accumulator data saturation, if selected. It uses the result
of the adder, the Overflow Status bits described
previously, and the SAT<A:B> (CORCON<7:6>) and
ACCSAT (CORCON<4>) mode control bits to determine
when and to what value, to saturate.
Six STATUS Register bits support saturation and
overflow:
• OA:
• OB:
• SA:
ACCA overflowed into guard bits
ACCB overflowed into guard bits
ACCA saturated (bit 31 overflow and
saturation)
or
• SB:
ACCA overflowed into guard bits and
saturated (bit 39 overflow and saturation)
ACCB saturated (bit 31 overflow and
saturation)
or
ACCB overflowed into guard bits and
saturated (bit 39 overflow and saturation)
• OAB: Logical OR of OA and OB
• SAB: Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent operation has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when OA and OB are set and
the corresponding Overflow Trap Flag Enable bits
(OVATE, OVBTE) in the INTCON1 register are set
(refer to Section 7.0 “Interrupt Controller”). This
allows the user application to take immediate action; for
example, to correct system gain.
DS70000652F-page 45
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
The SA and SB bits are modified each time data
passes through the adder/subtracter, but can only be
cleared by the user application. When set, they indicate
that the accumulator has overflowed its maximum
range (bit 31 for 32-bit saturation or bit 39 for 40-bit
saturation) and will be saturated (if saturation is
enabled). When saturation is not enabled, SA and SB
default to bit 39 overflow, and therefore, indicate that a
catastrophic overflow has occurred. If the COVTE bit in
the INTCON1 register is set, the SA and SB bits will
generate an arithmetic warning trap when saturation is
disabled.
The Overflow and Saturation Status bits can optionally
be viewed in the STATUS Register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). Programmers can check one bit in
the STATUS Register to determine whether either
accumulator has overflowed, or one bit to determine
whether either accumulator has saturated. This is
useful for complex number arithmetic, which typically
uses both accumulators.
The device supports three Saturation and Overflow
modes:
• Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic loads the maximally positive
9.31 value (0x7FFFFFFFFF) or maximally negative
9.31 value (0x8000000000) into the target
accumulator. The SA or SB bit is set and remains
set until cleared by the user application. This condition is referred to as ‘super saturation’ and provides
protection against erroneous data or unexpected
algorithm problems (such as gain calculations).
• Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally positive
1.31 value (0x007FFFFFFF) or maximally negative 1.31 value (0x0080000000) into the target
accumulator. The SA or SB bit is set and remains
set until cleared by the user application. When
this Saturation mode is in effect, the guard bits are
not used, so the OA, OB or OAB bits are never
set.
• Bit 39 Catastrophic Overflow:
The bit 39 Overflow Status bit from the adder is
used to set the SA or SB bit, which remains set
until cleared by the user application. No saturation
operation is performed and the accumulator is
allowed to overflow, destroying its sign. If the
COVTE bit in the INTCON1 register is set, a
catastrophic overflow can initiate a trap exception.
DS70000652F-page 46
3.6.3
ACCUMULATOR ‘WRITE BACK’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator which is not targeted by the instruction into data space memory. The write is performed
across the X bus into combined X and Y address
space. The following addressing modes are supported:
• W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a
1.15 fraction.
• [W13]+ = 2, Register Indirect with Post-Increment:
The rounded contents of the non-target accumulator are written into the address pointed to by
W13 as a 1.15 fraction. W13 is then incremented
by 2 (for a word write).
3.6.3.1
Round Logic
The round logic is a combinational block that performs
a conventional (biased) or convergent (unbiased)
round function during an accumulator write (store). The
Round mode is determined by the state of the RND bit
in the CORCON register. It generates a 16-bit,
1.15 data value that is passed to the data space write
saturation logic. If rounding is not indicated by the
instruction, a truncated 1.15 data value is stored and
the least significant word (lsw) is simply discarded.
Conventional rounding will zero-extend bit 15 of the
accumulator and will add it to the ACCxH word (bits 16
through 31 of the accumulator).
• If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000
included), ACCxH is incremented.
• If ACCxL is between 0x0000 and 0x7FFF, ACCxH
is left unchanged.
A consequence of this algorithm is that over a succession of random rounding operations, the value tends to
be biased slightly positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. In this case, the Least
Significant bit (LSb), bit 16 of the accumulator, of
ACCxH is examined:
• If it is ‘1’, ACCxH is incremented.
• If it is ‘0’, ACCxH is not modified.
Assuming that bit 16 is effectively random in nature,
this scheme removes any rounding bias that may
accumulate.
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
The SAC and SAC.R instructions store either a
truncated (SAC), or rounded (SAC.R) version of the
contents of the target accumulator to data memory via
the X bus, subject to data saturation (see
Section 3.6.3.2 “Data Space Write Saturation”). For
the MAC class of instructions, the accumulator writeback operation functions in the same manner,
addressing combined MCU (X and Y) data space
though the X bus. For this class of instructions, the data
is always subject to rounding.
3.6.3.2
Data Space Write Saturation
In addition to adder/subtracter saturation, writes to data
space can also be saturated, but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit,
1.15 fractional value from the round logic block as its
input, together with overflow status from the original
source (accumulator) and the 16-bit round adder.
These inputs are combined and used to select the
appropriate 1.15 fractional value as output to write to
data space memory.
If the SATDW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly:
The MSb of the source (bit 39) is used to determine the
sign of the operand being tested.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
3.6.4
BARREL SHIFTER
The barrel shifter can perform up to 16-bit arithmetic or
logic right shifts, or up to 16-bit left shifts, in a single
cycle. The source can be either of the two DSP
accumulators or the X bus (to support multi-bit shifts of
register or memory data).
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value shifts the operand right.
A negative value shifts the operand left. A value of ‘0’
does not modify the operand.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is
presented to the barrel shifter between Bit Positions 16
and 31 for right shifts, and between Bit Positions 0 and
16 for left shifts.
• For input data greater than 0x007FFF, data
written to memory is forced to the maximum
positive 1.15 value, 0x7FFF.
• For input data less than 0xFF8000, data written to
memory is forced to the maximum negative
1.15 value, 0x8000.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 47
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 48
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.0
MEMORY ORGANIZATION
Note:
4.1
This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 family
devices. However, it is not intended to be
a comprehensive reference source. To
complement the information in this data
sheet, refer to “Data Memory” (DS70202)
and “Program Memory” (DS70203) in
the “dsPIC33/PIC24 Family Reference
Manual”, which are available from the
Microchip web site (www.microchip.com).
The device architecture features separate program and
data memory spaces and buses. This architecture also
allows the direct access of program memory from the
data space during code execution.
FIGURE 4-1:
Program Address Space
The program address memory space of the
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices is 4M instructions. The space
is addressable by a 24-bit value derived either from the
23-bit Program Counter (PC) during program execution,
or from table operation or data space remapping as
described in Section 4.6 “Interfacing Program and
Data Memory Spaces”.
User application access to the program memory space
is restricted to the lower half of the address range
(0x000000 to 0x7FFFFF). The exception is the use of
TBLRD/TBLWT operations, which use TBLPAG<7> to
permit access to the Configuration bits and Device ID
sections of the configuration memory space.
The memory maps for the dsPIC33FJ16(GP/MC)101/
102 and dsPIC33FJ32(GP/MC)101/102/104 family of
devices are shown in Figure 4-1 and Figure 4-2.
PROGRAM MEMORY MAP FOR dsPIC33FJ16(GP/MC)101/102 DEVICES
User Memory Space
GOTO Instruction
Reset Address
Interrupt Vector Table
Reserved
Alternate Vector Table
User Program
Flash Memory
(5.6K instructions)
Flash Configuration
Words(1)
0x000000
0x000002
0x000004
0x0000FE
0x000100
0x000104
0x0001FE
0x000200
0x002BFA
0x002BFC
0x002BFE
0x002COO
Unimplemented
(Read ‘0’s)
0x7FFFFE
0x800000
Configuration Memory Space
Reserved
Device Configuration
Shadow Registers
Reserved
DEVID (2)
Note 1:
0xF7FFFE
0xF80000
0xF80017
0xF80018
0xFEFFFE
0xFF0000
0xFFFFFE
On Reset, these bits are automatically copied into the device Configuration Shadow registers.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 49
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 4-2:
PROGRAM MEMORY MAP FOR dsPIC33FJ32(GP/MC)101/102/104 DEVICES
User Memory Space
GOTO Instruction
Reset Address
Interrupt Vector Table
Reserved
Alternate Vector Table
User Program
Flash Memory
(11.2K instructions)
Flash Configuration
Words(1)
0x000000
0x000002
0x000004
0x0000FE
0x000100
0x000104
0x0001FE
0x000200
0x0057FA
0x0057FC
0x0057FE
0x005800
Unimplemented
(Read ‘0’s)
0x7FFFFE
0x800000
Configuration Memory Space
Reserved
Device Configuration
Shadow Registers
Reserved
DEVID (2)
Note 1:
0xF7FFFE
0xF80000
0xF80020
0xF80022
0xFEFFFE
0xFF0000
0xFFFFFE
On Reset, these bits are automatically copied into the device Configuration Shadow registers.
DS70000652F-page 50
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.1.1
PROGRAM MEMORY
ORGANIZATION
4.1.2
All of the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 devices reserve
the addresses between 0x00000 and 0x000200 for
hard-coded program execution vectors. A hardware
Reset vector is provided to redirect code execution
from the default value of the PC on device Reset to the
actual start of code. A GOTO instruction is programmed
by the user application at 0x000000, with the actual
address for the start of code at 0x000002.
The program memory space is organized in wordaddressable blocks. Although it is treated as 24 bits
wide, it is more appropriate to think of each address of
the program memory as a lower and upper word, with
the upper byte of the upper word being unimplemented.
The lower word always has an even address, while the
upper word has an odd address (Figure 4-3).
Program memory addresses are always word-aligned
on the lower word and addresses are incremented or
decremented by two during code execution. This
arrangement provides compatibility with data memory
space addressing and makes data in the program
memory space accessible.
FIGURE 4-3:
msw
Address
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices also have two Interrupt Vector Tables (IVTs), located from 0x000004 to 0x0000FF
and 0x000100 to 0x0001FF. These vector tables allow
each of the device interrupt sources to be handled by
separate Interrupt Service Routines (ISRs). A more
detailed discussion of the Interrupt Vector Tables is
provided in Section 7.1 “Interrupt Vector Table”.
PROGRAM MEMORY ORGANIZATION
least significant word (lsw)
most significant word (msw)
23
0x000001
0x000003
0x000005
0x000007
INTERRUPT AND TRAP VECTORS
16
8
 2011-2014 Microchip Technology Inc.
0
0x000000
0x000002
0x000004
0x000006
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(read as ‘0’)
PC Address
(lsw Address)
Instruction Width
DS70000652F-page 51
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.2
Data Address Space
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 family CPU has a
separate 16-bit-wide data memory space. The data
space is accessed using separate Address Generation
Units (AGUs) for read and write operations. The data
memory maps is shown in Figure 4-4.
All Effective Addresses (EAs) in the data memory space
are 16 bits wide and point to bytes within the data space.
This arrangement gives a data space address range of
64 Kbytes or 32K words. The lower half of the data
memory space (that is, when EA<15> = 0) is used for
implemented memory addresses, while the upper half
(EA<15> = 1) is reserved for the Program Space
Visibility area (see Section 4.6.3 “Reading Data from
Program Memory Using Program Space Visibility”).
Microchip
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices implement
up to 2 Kbytes of data memory. Should an EA point to
a location outside of this area, an all-zero word or byte
will be returned.
4.2.1
DATA SPACE WIDTH
The data memory space is organized in byteaddressable, 16-bit wide blocks. Data is aligned in data
memory and registers as 16-bit words, but all data
space EAs resolve to bytes. The Least Significant
Bytes (LSBs) of each word have even addresses, while
the Most Significant Bytes (MSBs) have odd
addresses.
4.2.2
DATA MEMORY ORGANIZATION
AND ALIGNMENT
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word
operations, or translating from 8-bit MCU code. If a
misaligned read or write is attempted, an address error
trap is generated. If the error occurred on a read, the
instruction in progress is completed. If the error
occurred on a write, the instruction is executed but the
write does not occur. In either case, a trap is then executed, allowing the system and/or user application to
examine the machine state prior to execution of the
address Fault.
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
A Sign-Extend (SE) instruction is provided to allow user
applications to translate 8-bit signed data to 16-bit
signed values. Alternately, for 16-bit unsigned data,
user applications can clear the MSB of any W register
by executing a Zero-Extend (ZE) instruction on the
appropriate address.
4.2.3
The first 2 Kbytes of the Near Data Space, from 0x0000
to 0x07FF, is primarily occupied by Special Function
Registers (SFRs). These are used by the
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 family core and peripheral modules
for controlling the operation of the device.
SFRs are distributed among the modules that they
control and are generally grouped together by module.
Much of the SFR space contains unused addresses;
these are read as ‘0’.
Note:
®
To maintain backward compatibility with PIC MCU
devices and improve data space memory usage
efficiency, the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 family instruction
set supports both word and byte operations. As a
consequence of byte accessibility, all Effective Address
calculations are internally scaled to step through wordaligned memory. For example, the core recognizes that
Post-Modified Register Indirect Addressing mode
[Ws++] will result in a value of Ws + 1 for byte
operations and Ws + 2 for word operations.
Data byte reads will read the complete word that
contains the byte, using the LSB of any EA to
determine which byte to select. The selected byte is
placed onto the LSB of the data path. That is, data
memory and registers are organized as two parallel
byte-wide entities with shared (word) address decoding
but separate write lines. Data byte writes only write to
the corresponding side of the array or register that
matches the byte address.
DS70000652F-page 52
SFR SPACE
4.2.4
The actual set of peripheral features and
interrupts varies by the device. Refer to
the corresponding device tables and
pinout diagrams for device-specific
information.
NEAR DATA SPACE
The 8-Kbyte area, between 0x0000 and 0x1FFF, is
referred to as the Near Data Space. Locations in this
space are directly addressable via a 13-bit absolute
address field within all memory direct instructions.
Additionally, the whole data space is addressable using
the MOV class of instructions, which support Memory
Direct Addressing mode with a 16-bit address field or
by using Indirect Addressing mode with a Working
register as an Address Pointer.
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 4-4:
DATA MEMORY MAP FOR dsPIC33FJ16(GP/MC)101/102 DEVICES WITH
1-KBYTE RAM
MSB
Address
MSb
2-Kbyte
SFR Space
1-Kbyte
SRAM Space
LSB
Address
16 Bits
LSb
0x0000
0x0001
SFR Space
0x07FF
0x0801
0x07FE
0x0800
X Data RAM (X)
0x09FF
0x0A01
0x09FE
0x0A00
Y Data RAM (Y)
0x0BFF
0x0C01
0x0BFE
0x0C00
0x1FFF
0x2001
0x1FFE
0x8001
0x8000
8-Kbyte
Near Data
Space
0x2000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
 2011-2014 Microchip Technology Inc.
0xFFFE
DS70000652F-page 53
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 4-5:
DATA MEMORY MAP FOR dsPIC33FJ32(GP/MC)101/102/104 DEVICES WITH
2-KBYTE RAM
MSB
Address
MSb
2 Kbyte
SFR Space
2 Kbyte
SRAM Space
LSb
0x0000
0x0001
SFR Space
0x07FF
0x0801
0x0BFF
0x0C01
0x07FE
0x0800
X Data RAM (X)
Y Data RAM (Y)
0x0BFE
0x0C00
0x0FFF
0x1001
0x0FFE
0x1000
0x1FFF
0x2001
0x1FFE
0x8001
0x8000
8 Kbyte
Near Data
Space
0x2000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
DS70000652F-page 54
LSB
Address
16 Bits
0xFFFE
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.2.5
X AND Y DATA SPACES
The core has two data spaces, X and Y. These data
spaces can be considered either separate (for some
DSP instructions), or as one unified linear address
range (for MCU instructions). The data spaces are
accessed using two Address Generation Units (AGUs)
and separate data paths. This feature allows certain
instructions to concurrently fetch two words from RAM,
thereby enabling efficient execution of DSP algorithms
such as Finite Impulse Response (FIR) filtering and
Fast Fourier transform (FFT).
The X data space is used by all instructions and
supports all addressing modes. X data space has
separate read and write data buses. The X read data
bus is the read data path for all instructions that view
data space as combined X and Y address space. It is
also the X data prefetch path for the dual operand DSP
instructions (MAC class).
 2011-2014 Microchip Technology Inc.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide
two concurrent data read paths.
Both the X and Y data spaces support Modulo
Addressing mode for all instructions, subject to
addressing mode restrictions. Bit-Reversed Addressing
mode is only supported for writes to X data space.
All data memory writes, including in DSP instructions,
view data space as combined X and Y address space.
The boundary between the X and Y data spaces is
device-dependent and is not user-programmable.
All Effective Addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes, or 32K words, although the
implemented memory locations vary by device.
DS70000652F-page 55
SFR Name
CPU CORE REGISTER MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
WREG0
0000
Working Register 0
xxxx
WREG1
0002
Working Register 1
xxxx
WREG2
0004
Working Register 2
xxxx
WREG3
0006
Working Register 3
xxxx
WREG4
0008
Working Register 4
xxxx
WREG5
000A
Working Register 5
xxxx
WREG6
000C
Working Register 6
xxxx
WREG7
000E
Working Register 7
xxxx
WREG8
0010
Working Register 8
xxxx
WREG9
0012
Working Register 9
xxxx
WREG10
0014
Working Register 10
xxxx
WREG11
0016
Working Register 11
xxxx
WREG12
0018
Working Register 12
xxxx
WREG13
001A
Working Register 13
xxxx
WREG14
001C
Working Register 14
xxxx
WREG15
001E
Working Register 15
0800
SPLIM
0020
Stack Pointer Limit Register
xxxx
ACCAL
0022
Accumulator A Low Word Register
xxxx
ACCAH
0024
Accumulator A High Word Register
xxxx
ACCAU
0026
Accumulator A Upper Word Register
xxxx
ACCBL
0028
Accumulator B Low Word Register
xxxx
ACCBH
002A
Accumulator B High Word Register
xxxx
xxxx
 2011-2014 Microchip Technology Inc.
ACCBU
002C
Accumulator B Upper Word Register
PCL
002E
Program Counter Low Word Register
PCH
0030
—
—
—
—
—
—
—
—
Program Counter High Byte Register
0000
TBLPAG
0032
—
—
—
—
—
—
—
—
Table Page Address Pointer Register
0000
PSVPAG
0034
—
—
—
—
—
—
—
—
Program Memory Visibility Page Address Pointer Register
RCOUNT
0036
0000
0000
Repeat Loop Counter Register
xxxx
DCOUNT
0038
DOSTARTL
003A
DCOUNT<15:0>
DOSTARTH
003C
DOENDL
003E
DOENDH
0040
—
—
—
—
—
—
—
—
—
—
SR
0042
OA
OB
SA
SB
OAB
SAB
DA
DC
IPL2
IPL1
xxxx
DOSTARTL<15:1>
—
—
—
—
—
—
—
—
—
—
xxxx
0
xxxx
DOSTARTH<5:0>
00xx
DOENDL<15:1>
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
0
DOENDH
IPL0
RA
N
OV
00xx
Z
C
0000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 56
TABLE 4-1:
SFR Name
CPU CORE REGISTER MAP (CONTINUED)
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
CORCON
0044
—
—
—
US
EDT
DL2
DL1
DL0
SATA
SATB
SATDW
ACCSAT
IPL3
PSV
RND
IF
0020
MODCON
0046
XMODEN
YMODEN
—
—
BWM3
BWM2
BWM1
BWM0
YWM3
YWM2
YWM1
YWM0
XWM3
XWM2
XWM1
XWM0
0000
XMODSRT
0048
XS<15:1>
0
xxxx
XMODEND
004A
XE<15:1>
1
xxxx
YMODSRT
004C
YS<15:1>
0
xxxx
YMODEND
004E
YE<15:1>
1
xxxx
XBREV
0050
BREN
DISICNT
0052
—
XB<14:0>
—
Disable Interrupts Counter Register
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
xxxx
0000
DS70000652F-page 57
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
TABLE 4-1:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXXGP101 DEVICES
SFR
Name
SFR
Addr
Bit 15
CNEN1
0060
—
CNEN2
0062
—
CNPU1
0068
—
—
—
CNPU2
006A
—
Bit 14
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
—
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
0000
CN22IE
CN21IE
—
—
—
—
—
0000
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000
—
—
—
—
—
0000
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
—
—
CN12IE
CN11IE
—
—
—
—
CN30IE
CN29IE
—
—
—
—
—
CN23IE
—
—
—
—
—
—
—
—
CN30PUE CN29PUE
CN12PUE CN11PUE
—
—
Bit 7
Bit 5
Bit 13
Bit 6
CN23PUE CN22PUE CN21PUE
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-3:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXXMC101 DEVICES
SFR
Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
CNEN1
0060
—
CN14IE
CN13IE
CN12IE
CN11IE
—
—
—
—
—
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
0000
CNEN2
0062
—
CN30IE
CN29IE
—
—
—
—
—
CN23IE
CN22IE
CN21IE
—
—
—
—
—
0000
CNPU1
0068
—
CN14PUE CN13PUE CN12PUE CN11PUE
—
—
—
—
—
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000
CNPU2
006A
—
CN30PUE CN29PUE
—
—
—
—
—
—
—
—
0000
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
0000
—
—
Bit 7
Bit 6
CN23PUE CN22PUE CN21PUE
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-4:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXX(GP/MC)102 DEVICES
SFR
Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
CNEN1
0060
CN15IE
CN14IE
CN13IE
CNEN2
0062
—
CN30IE
CN29IE
CNPU1
0068
CNPU2
006A
Bit 11
Bit 10
Bit 9
CN12IE
CN11IE
—
—
—
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
—
CN27IE
—
—
CN24IE
CN23IE
CN22IE
CN21IE
—
—
—
—
CN16IE
0000
—
—
—
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000
—
—
—
—
—
—
CN16PUE
0000
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE
—
CN30PUE CN29PUE
—
CN27PUE
Bit 8
Bit 7
Bit 6
CN24PUE CN23PUE CN22PUE CN21PUE
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
 2011-2014 Microchip Technology Inc.
TABLE 4-5:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ32(GP/MC)104 DEVICES
SFR
Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
CNEN1
0060
CN15IE
CN13IE
CN13IE
CNEN2
0062
—
CN30IE
CN29IE
CNPU1
0068
CNPU2
006A
Bit 11
Bit 10
CN12IE
CN11IE
CN10IE
CN9IE
CN8IE
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
0000
CN28IE
CN27IE
CN26IE
CN25IE
CN24IE
CN23IE
CN22IE
CN21IE
CN20IE
CN19IE
CN18IE
CN17IE
CN16IE
0000
CN15PUE CN13PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE
CN8PUE
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000
CN30PUE CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE
0000
—
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 58
TABLE 4-2:
SFR
Name
SFR
Addr
INTERRUPT CONTROLLER REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
INTCON1 0080
NSTDIS
OVAERR
OVBERR
INTCON2 0082
ALTIVT
DISI
—
—
—
—
COVAERR COVBERR OVATE
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
OVBTE
COVTE
SFTACERR
DIV0ERR
—
—
—
—
—
—
—
—
MATHERR ADDRERR
Bit 0
All
Resets
OSCFAIL
—
0000
INT1EP
INT0EP
0000
Bit 2
Bit 1
STKERR
INT2EP
IFS0
0084
—
—
AD1IF
U1TXIF
U1RXIF
SPI1IF
SPI1EIF
T3IF
T2IF
OC2IF
IC2IF
—
T1IF
OC1IF
IC1IF
INT0IF
0000
IFS1
0086
—
—
INT2IF
T5IF(2)
T4IF(2)
—
—
—
—
—
—
INT1IF
CNIF
CMIF
MI2C1IF
SI2C1IF
0000
IFS2
0088
—
—
—
—
—
—
—
—
—
—
IC3IF
—
—
—
—
—
0000
IFS3
008A FLTA1IF(1)
RTCIF
—
—
—
—
PWM1IF(1)
—
—
—
—
—
—
—
—
—
0000
IFS4
008C
—
—
CTMUIF
—
—
—
—
—
—
—
—
—
—
—
U1EIF
FLTB1IF(3)
0000
IEC0
0094
—
—
AD1IE
U1TXIE
U1RXIE
SPI1IE
SPI1EIE
T3IE
T2IE
OC2IE
IC2IE
—
T1IE
OC1IE
IC1IE
INT0IE
0000
IEC1
0096
—
—
INT2IE
T5IE(2)
T4IE(2)
—
—
—
—
—
—
INT1IE
CNIE
CMIE
MI2C1IE
SI2C1IE
0000
IEC2
0098
—
—
—
—
—
—
—
—
—
—
IC3IE
—
—
—
—
—
0000
IEC3
009A FLTA1IE(1)
RTCIE
—
—
—
—
PWM1IE(1)
—
—
—
—
—
—
—
—
—
0000
IEC4
009C
—
—
CTMUIE
—
—
—
—
—
—
—
—
—
—
—
U1EIE
FLTB1IE(3)
0000
IPC0
00A4
—
T1IP2
T1IP1
T1IP0
—
OC1IP2
OC1IP1
OC1IP0
—
IC1IP2
IC1IP1
IC1IP0
—
IPC1
00A6
—
T2IP2
T2IP1
T2IP0
—
OC2IP2
OC2IP1
OC2IP0
—
IC2IP2
IC2IP1
IC2IP0
—
—
—
—
4440
IPC2
00A8
—
U1RXIP2
U1RXIP1
U1RXIP0
—
SPI1IP2
SPI1IP1
SPI1IP0
—
SPI1EIP2
SPI1EIP1
SPI1EIP0
—
T3IP2
T3IP1
T3IP0
4444
IPC3
00AA
—
—
—
—
—
—
—
—
—
AD1IP2
AD1IP1
AD1IP0
—
U1TXIP2
U1TXIP1
U1TXIP0
0044
IPC4
00AC
—
CNIP2
CNIP1
CNIP0
—
CMIP2
CMIP1
CMIP0
—
MI2C1IP2
MI2C1IP1
MI2C1IP0
—
SI2C1IP2
SI2C1IP1
SI2C1IP0
4444
IPC5
00AE
—
—
—
—
—
—
—
—
—
—
—
—
—
INT1IP2
INT1IP1
INT1IP0
0004
IPC6
00B0
—
T4IP2(2)
T4IP1(2)
T4IP0(2)
—
—
—
—
—
—
—
—
—
—
—
—
4000
IPC7
00B2
—
—
—
—
—
—
—
—
—
INT2IP2
INT2IP1
INT2IP0
—
T5IP2(2)
T5IP1(2)
T5IP0(2)
0044
IPC9
00B6
—
—
—
—
—
—
—
—
—
IC3IP2
IC3IP1
IC3IP0
—
—
—
—
0040
IPC14
00C0
—
—
—
—
—
—
—
—
—
—
—
—
—
0040
IPC15
00C2
—
—
RTCIP2
RTCIP1
RTCIP0
—
—
—
—
—
—
—
—
4400
IPC16
00C4
—
—
—
—
—
—
—
—
—
U1EIP2
U1EIP1
U1EIP0
—
IPC19
00CA
—
—
—
—
—
—
—
—
—
CTMUIP2
CTMUIP1
CTMUIP0
—
INTTREG 00E0
—
—
—
—
ILR3
ILR2
ILR1
ILR0
—
VECNUM6
VECNUM5
VECNUM4 VECNUM3 VECNUM2
DS70000652F-page 59
Legend:
Note 1:
2:
3:
FLTA1IP2(1) FLTA1IP1(1) FLTA1IP0(1)
— = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
These bits are available in dsPIC33FJXXMC10X devices only.
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
These bits are available in dsPIC33FJ(16/32)MC102/104 devices only.
PWM1IP2(1) PWM1IP1(1) PWM1IP0(1)
INT0IP2:0>
4444
FLTB1IP2(3) FLTB1IP1(3) FLTB1IP0(3) 0040
—
—
—
VECNUM1 VECNUM0
0040
0000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
TABLE 4-6:
SFR
Name
SFR
Addr
TIMERS REGISTER MAP FOR dsPIC33FJ16(GP/MC)10X DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
TMR1
0100
Timer1 Register
PR1
0102
Period Register 1
T1CON
0104
TMR2
0106
TON
—
TSIDL
—
—
—
TMR3HLD 0108
—
—
—
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
0000
FFFF
TGATE
TCKPS1
TCKPS0
—
TSYNC
TCS
—
0000
Timer2 Register
0000
Timer3 Holding Register (for 32-bit timer operations only)
xxxx
TMR3
010A
Timer3 Register
0000
PR2
010C
Period Register 2
FFFF
PR3
010E
Period Register 3
T2CON
0110
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1
TCKPS0
T32
—
TCS
—
0000
T3CON
0112
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1
TCKPS0
—
—
TCS
—
0000
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
FFFF
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-8:
SFR
Name
SFR
Addr
TIMERS REGISTER MAP FOR DSPIC33FJ32(GP/MC)10X DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
TMR1
0100
Timer1 Register
PR1
0102
Period Register 1
T1CON
0104
TMR2
0106
TON
—
TSIDL
—
—
—
TMR3HLD 0108
—
—
—
0000
FFFF
TGATE
TCKPS1
TCKPS0
—
TSYNC
TCS
—
0000
Timer2 Register
0000
Timer3 Holding Register (for 32-bit timer operations only)
xxxx
 2011-2014 Microchip Technology Inc.
TMR3
010A
Timer3 Register
0000
PR2
010C
Period Register 2
FFFF
PR3
010E
Period Register 3
T2CON
0110
TON
—
TSIDL
—
—
—
—
T3CON
0112
TON
—
TSIDL
—
—
—
—
TMR4
0114
TMR5HLD 0116
FFFF
—
—
TGATE
TCKPS1
TCKPS0
T32
—
TCS
—
0000
—
—
TGATE
TCKPS1
TCKPS0
—
—
TCS
—
0000
Timer4 Register
0000
Timer5 Holding Register (for 32-bit operations only)
xxxx
TMR5
0118
Timer5 Register
0000
PR4
011A
Period Register 4
FFFF
PR5
011C
Period Register 5
T4CON
011E
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1
TCKPS0
T32
—
TCS
—
0000
T5CON
0120
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1
TCKPS0
—
—
TCS
—
0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
FFFF
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 60
TABLE 4-7:
SFR Name
INPUT CAPTURE REGISTER MAP
SFR
Addr
IC1BUF
0140
IC1CON
0142
IC2BUF
0144
IC2CON
0146
IC3BUF
0148
IC3CON
014A
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
—
ICSIDL
—
—
—
—
—
—
ICSIDL
—
—
—
—
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All Resets
ICI1
ICI0
ICOV
ICBNE
ICM2
ICM1
ICM0
0000
ICI1
ICI0
ICOV
ICBNE
ICM2
ICM1
ICM0
Input Capture 1 Register
—
ICTMR
xxxx
Input Capture 2 Register
—
ICTMR
xxxx
Input Capture 3 Register
—
—
ICSIDL
—
—
—
—
—
ICTMR
0000
xxxx
ICI1
ICI0
ICOV
ICBNE
ICM2
ICM1
ICM0
0000
Bit 1
Bit 0
All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-10:
SFR Name
OUTPUT COMPARE REGISTER MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
OC1RS
0180
Output Compare 1 Secondary Register
xxxx
OC1R
0182
Output Compare 1 Register
xxxx
OC1CON
0184
OC2RS
0186
Output Compare 2 Secondary Register
xxxx
OC2R
0188
Output Compare 2 Register
xxxx
OC2CON
018A
—
—
—
—
OCSIDL
OCSIDL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
OCFLT
—
OCFLT
OCTSEL
OCTSEL
OCM2
OCM2
OCM1
OCM1
OCM0
OCM0
0000
0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-11:
SFR Name
SFR
Addr.
6-OUTPUT PWM1 REGISTER MAP FOR dsPIC33FJXXMC10X DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
PTSIDL
—
—
—
—
Bit 8
—
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
P1TCON
01C0
PTEN
P1TMR
01C2
PTDIR
PWM1 Timer Count Value Register
PTOPS3 PTOPS2 PTOPS1 PTOPS0 PTCKPS1 PTCKPS0 PTMOD1 PTMOD0 0000 0000 0000 0000
0000 0000 0000 0000
P1TPER
01C4
—
PWM1 Time Base Period Register
0111 1111 1111 1111
P1SECMP
01C6 SEVTDIR
PWM1 Special Event Compare Register
PWM1CON1 01C8
—
—
—
—
—
PMOD3
PMOD2
PMOD1
PWM1CON2 01CA
—
—
—
—
DTB5
DTB4
DTB3
DTB2
DTB1
DTB0
—
—
—
—
—
—
—
SEVOPS3 SEVOPS2 SEVOPS1 SEVOPS0
0000 0000 0000 0000
—
PEN3H
PEN2H
PEN1H
—
PEN3L
PEN2L
PEN1L
0000 0000 0000 0000
—
—
—
—
—
IUE
OSYNC
UDIS
0000 0000 0000 0000
DTA5
DTA4
DTA3
DTA2
DTA1
DTA0
0000 0000 0000 0000
—
DTS3A
DTS3I
DTS2A
DTS2I
DTS1A
DTS1I
0000 0000 0000 0000
DS70000652F-page 61
P1DTCON1
01CC DTBPS1 DTBPS0
DTAPS1 DTAPS0
P1DTCON2
01CE
—
—
P1FLTACON 01D0
—
—
FAOV3H FAOV3L
FAOV2H
FAOV2L
FAOV1H
FAOV1L
FLTAM
—
—
—
—
FAEN3
FAEN2
FAEN1
0000 0000 0000 0111
P1FLTBCON 01D2
—
—
FBOV3H FBOV3L
FBOV2H
FBOV2L
FBOV1H
FBOV1L
FLTBM
—
—
—
—
FBEN3
FBEN2
FBEN1
0000 0000 0000 0111
P1OVDCON 01D4
—
—
POVD3H POVD3L POVD2H
POVD2L
POVD1H
POVD1L
—
—
POUT3H POUT3L POUT2H
POUT2L POUT1H POUT1L 0011 1111 0000 0000
P1DC1
01D6
PWM1 Duty Cycle 1 Register
0000 0000 0000 0000
P1DC2
01D8
PWM1 Duty Cycle 2 Register
0000 0000 0000 0000
P1DC3
01DA
PWM1 Duty Cycle 3 Register
0000 0000 0000 0000
PWM1KEY
01DE
PWMKEY<15:0>
0000 0000 0000 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
TABLE 4-9:
I2C1 REGISTER MAP
All
Resets
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
I2C1RCV
0200
—
—
—
—
—
—
—
—
I2C1 Receive Register
0000
I2C1TRN
0202
—
—
—
—
—
—
—
—
I2C1 Transmit Register
00FF
I2C1BRG
0204
—
—
—
—
—
—
—
I2C1CON
0206
I2CEN
—
I2CSIDL
SCLREL
IPMIEN
A10M
DISSLW
SMEN
GCEN
STREN
I2C1STAT
0208
ACKSTAT
TRSTAT
—
—
—
BCL
GCSTAT
ADD10
IWCOL
I2COV
I2C1ADD
020A
—
—
—
—
—
—
I2C1 Address Register
0000
I2C1MSK
020C
—
—
—
—
—
—
I2C1 Address Mask Register
0000
SFR Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Baud Rate Generator Register
0000
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
D_A
P
S
R_W
RBF
TBF
1000
0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-13:
SFR Name
SFR
Addr
UART1 REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
USIDL
IREN
RTSMD
—
UEN1
UEN0
—
UTXBRK
UTXEN
UTXBF
TRMT
U1MODE
0220
UARTEN
U1STA
0222
UTXISEL1
U1TXREG
0224
—
—
—
—
—
—
—
U1RXREG
0226
—
—
—
—
—
—
—
U1BRG
0228
UTXINV UTXISEL0
Bit 8
Bit 7
Bit 6
WAKE
LPBACK
URXISEL1 URXISEL0
Bit 0
All
Resets
PDSEL0
STSEL
0000
OERR
URXDA
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
ABAUD
URXINV
BRGH
PDSEL1
ADDEN
RIDLE
PERR
FERR
0110
UART1 Transmit Register
xxxx
UART1 Receive Register
0000
Baud Rate Generator Prescaler
0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-14:
SFR Name
SPI1 REGISTER MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
 2011-2014 Microchip Technology Inc.
Bit 2
Bit 1
Bit 0
All
Resets
0000
SPI1STAT
0240
SPIEN
—
SPISIDL
—
—
—
—
—
—
SPIROV
—
—
—
—
SPITBF
SPIRBF
SPI1CON1
0242
—
—
—
DISSCK
DISSDO
MODE16
SMP
CKE
SSEN
CKP
MSTEN
SPRE2
SPRE1
SPRE0
PPRE1
PPRE0
0000
SPI1CON2
0244
FRMEN
SPIFSD
FRMPOL
—
—
—
—
—
—
—
—
—
—
—
FRMDLY
—
0000
SPI1BUF
0248
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SPI1 Transmit and Receive Buffer Register
0000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 62
TABLE 4-12:
ADC1 REGISTER MAP FOR dsPIC33FJXX(GP/MC)101 DEVICES
All
Resets
File Name
SFR
Addr
ADC1BUF0
0300
ADC1 Data Buffer 0
xxxx
ADC1BUF1
0302
ADC1 Data Buffer 1
xxxx
ADC1BUF2
0304
ADC1 Data Buffer 2
xxxx
ADC1BUF3
0306
ADC1 Data Buffer 3
xxxx
ADC1BUF4
0308
ADC1 Data Buffer 4
xxxx
ADC1BUF5
030A
ADC1 Data Buffer 5
xxxx
ADC1BUF6
030C
ADC1 Data Buffer 6
xxxx
ADC1BUF7
030E
ADC1 Data Buffer 7
xxxx
ADC1BUF8
0310
ADC1 Data Buffer 8
xxxx
ADC1BUF9
0312
ADC1 Data Buffer 9
xxxx
ADC1BUFA
0314
ADC1 Data Buffer 10
xxxx
ADC1BUFB
0316
ADC1 Data Buffer 11
xxxx
ADC1BUFC
0318
ADC1 Data Buffer 12
xxxx
ADC1BUFD
031A
ADC1 Data Buffer 13
xxxx
ADC1BUFE
031C
ADC1 Data Buffer 14
xxxx
ADC1BUFF
031E
ADC1 Data Buffer 15
AD1CON1
0320
ADON
—
ADSIDL
AD1CON2
0322
VCFG2
VCFG1
VCFG0
AD1CON3
0324
ADRC
—
—
Bit 15
Bit 14
Bit 13
Bit 12
—
Bit 11
Bit 10
Bit 9
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
xxxx
—
—
CSCNA
CHPS1
CHPS0
BUFS
—
SMPI3
SMPI2
SMPI1
SMPI0
BUFM
ALTS
0000
SAMC4
SAMC3
SAMC2
SAMC1
SAMC0
ADCS7
ADCS6
ADCS5
ADCS4
ADCS3
ADCS2
ADCS1
ADCS0
0000
0326
—
—
—
—
—
0328
CH0NB
—
—
CH0SB4
CH0SB3
AD1PCFGL
032C
—
—
—
—
—
AD1CSSL
0330
—
—
—
—
—
SSRC2
Bit 6
—
AD1CHS123
FORM0
Bit 7
—
AD1CHS0
FORM1
Bit 8
CH123NB1 CH123NB0 CH123SB
SSRC1
SSRC0
—
SIMSAM
ASAM
SAMP
0000
—
—
—
—
—
CH0SB0
CH0NA
—
—
CH0SA4
CH0SA3
PCFG<10:9>(1)
—
—
—
—
—
PCFG<3:0>
0000
CSS<10:9>(1)
—
—
—
—
—
CSS<3:0>
0000
CH0SB2
CH0SB1
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: The PCFG<10:9> and CSS<10:9> bits are available in dsPIC33FJ32(GP/MC)101/102 devices only.
CH123NA1 CH123NA0
DONE
CH0SA2
CH0SA1
CH123SA
0000
CH0SA0
0000
DS70000652F-page 63
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
TABLE 4-15:
ADC1 REGISTER MAP FOR dsPIC33FJXX(GP/MC)102 DEVICES
File Name
SFR
Addr
ADC1BUF0
0300
ADC1 Data Buffer 0
xxxx
ADC1BUF1
0302
ADC1 Data Buffer 1
xxxx
ADC1BUF2
0304
ADC1 Data Buffer 2
xxxx
ADC1BUF3
0306
ADC1 Data Buffer 3
xxxx
ADC1BUF4
0308
ADC1 Data Buffer 4
xxxx
ADC1BUF5
030A
ADC1 Data Buffer 5
xxxx
ADC1BUF6
030C
ADC1 Data Buffer 6
xxxx
ADC1BUF7
030E
ADC1 Data Buffer 7
xxxx
ADC1BUF8
0310
ADC1 Data Buffer 8
xxxx
ADC1BUF9
0312
ADC1 Data Buffer 9
xxxx
ADC1BUFA
0314
ADC1 Data Buffer 10
xxxx
ADC1BUFB
0316
ADC1 Data Buffer 11
xxxx
ADC1BUFC
0318
ADC1 Data Buffer 12
xxxx
ADC1BUFD
031A
ADC1 Data Buffer 13
xxxx
ADC1BUFE
031C
ADC1 Data Buffer 14
xxxx
ADC1BUFF
031E
ADC1 Data Buffer 15
AD1CON1
0320
ADON
—
ADSIDL
AD1CON2
0322
VCFG2
VCFG1
VCFG0
AD1CON3
0324
ADRC
—
—
Bit 15
Bit 14
Bit 13
Bit 12
—
Bit 11
Bit 10
Bit 9
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
xxxx
—
—
CSCNA
CHPS1
CHPS0
BUFS
—
SMPI3
SMPI2
SMPI1
SMPI0
BUFM
ALTS
0000
SAMC4
SAMC3
SAMC2
SAMC1
SAMC0
ADCS7
ADCS6
ADCS5
ADCS4
ADCS3
ADCS2
ADCS1
ADCS0
0000
—
—
0326
—
—
—
—
—
0328
CH0NB
—
—
CH0SB4
CH0SB3
AD1PCFGL
032C
—
—
—
—
—
AD1CSSL
0330
—
—
—
—
—
CH123NB1 CH123NB0 CH123SB
SSRC2
Bit 6
—
AD1CHS0
FORM0
Bit 7
—
AD1CHS123
FORM1
Bit 8
SSRC1
SSRC0
—
SIMSAM
ASAM
SAMP
DONE
—
—
—
CH0SB0
CH0NA
—
—
PCFG<10:9>(1)
—
—
—
PCFG<5:0>
0000
CSS<10:9>(1)
—
—
—
CSS<5:0>
0000
CH0SB2
CH0SB1
 2011-2014 Microchip Technology Inc.
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: The PCFG<10:9> and CSS<10:9> bits are available in dsPIC33FJ32(GP/MC)101/102 devices only.
CH123NA1 CH123NA0 CH123SA
0000
CH0SA4 CH0SA3
CH0SA2
CH0SA1
CH0SA0
0000
0000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 64
TABLE 4-16:
ADC1 REGISTER MAP FOR dsPIC33FJ32(GP/MC)104 DEVICES
File Name
SFR
Addr
ADC1BUF0
0300
ADC1 Data Buffer 0
xxxx
ADC1BUF1
0302
ADC1 Data Buffer 1
xxxx
ADC1BUF2
0304
ADC1 Data Buffer 2
xxxx
ADC1BUF3
0306
ADC1 Data Buffer 3
xxxx
ADC1BUF4
0308
ADC1 Data Buffer 4
xxxx
ADC1BUF5
030A
ADC1 Data Buffer 5
xxxx
ADC1BUF6
030C
ADC1 Data Buffer 6
xxxx
ADC1BUF7
030E
ADC1 Data Buffer 7
xxxx
ADC1BUF8
0310
ADC1 Data Buffer 8
xxxx
ADC1BUF9
0312
ADC1 Data Buffer 9
xxxx
ADC1BUFA
0314
ADC1 Data Buffer 10
xxxx
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
ADC1BUFB
0316
ADC1 Data Buffer 11
xxxx
ADC1BUFC
0318
ADC1 Data Buffer 12
xxxx
ADC1BUFD
031A
ADC1 Data Buffer 13
xxxx
ADC1BUFE
031C
ADC1 Data Buffer 14
xxxx
ADC1BUFF
031E
ADC1 Data Buffer 15
AD1CON1
0320
ADON
—
ADSIDL
—
—
—
FORM1
FORM0
SSRC2
SSRC1
SSRC0
—
SIMSAM
ASAM
SAMP
DONE
0000
AD1CON2
0322
VCFG2
VCFG1
VCFG0
—
—
CSCNA
CHPS1
CHPS0
BUFS
—
SMPI3
SMPI2
SMPI1
SMPI0
BUFM
ALTS
0000
AD1CON3
0324
ADRC
—
—
SAMC4
SAMC3
SAMC2
SAMC1
SAMC0
ADCS7
ADCS6
ADCS5
ADCS4
ADCS3
ADCS2
ADCS1
—
—
—
—
—
—
—
—
—
—
—
—
CH0SA4
CH0SA3
AD1CHS123 0326
CH123NB1 CH123NB0 CH123SB
xxxx
CH123NA1 CH123NA0
ADCS0
0000
CH123SA
0000
CH0SA0
0000
AD1CHS0
0328
CH0NB
—
—
AD1PCFGL
032C PCFG15
—
—
PCFG<12:0>(1)
0000
AD1CSSL
0330
—
—
CSS12:0>(1)
0000
CSS15
CH0SB4 CH0SB3
CH0SB2
CH0SB1
CH0SB0
CH0NA
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: The PCFG<10:9> and CSS<10:9> bits are available in dsPIC33FJ32(GP/MC)104 devices only.
CH0SA2
CH0SA1
DS70000652F-page 65
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
TABLE 4-17:
File Name
SFR
Addr
CTMUCON1 033A
CTMU REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
CTMUEN
—
CTMUSIDL
TGEN
EDGEN
EDGSEQEN
IDISSEN
CTTRIG
—
—
—
—
—
—
—
—
0000
CTMUCON2 033C EDG1MOD EDG1POL EDG1SEL3 EDG1SEL2 EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT EDG2MOD EDG2POL EDG2SEL3 EDG2SEL2 EDG2SEL1 EDG2SEL0
—
—
0000
CTMUICON 033E
—
—
0000
Legend:
ITRIM5
ITRIM4
ITRIM3
ITRIM2
ITRIM1
ITRIM0
IRNG1
IRNG0
—
—
—
—
—
—
— = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-19:
File Name
SFR
Addr
ALRMVAL
0620
ALCFGRPT
0622
RTCVAL
0624
RCFGCAL
0626
REAL-TIME CLOCK AND CALENDAR REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
ALRMEN
CHIME
AMASK3
AMASK2
AMASK1
AMASK0
RTCEN
—
RTCWREN RTCSYNC HALFSEC
RTCOE
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
ARPT5
ARPT4
ARPT3
ARPT2
ARPT1
ARPT0
0000
CAL5
CAL4
CAL3
CAL2
CAL1
CAL0
0000
Alarm Value Register Window based on ALRMPTR<1:0>
ALRMPTR1 ALRMPTR0
ARPT7
ARPT6
xxxx
RTCC Value Register Window based on RTCPTR<1:0>
RTCPTR1
RTCPTR0
CAL7
CAL6
xxxx
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-20:
PAD CONFIGURATION REGISTER MAP
File Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
PADCFG1
02FC
—
—
—
—
—
—
—
—
—
—
—
—
—
—
RTSECSEL
—
0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 66
TABLE 4-18:
File Name
SFR
Addr
COMPARATOR REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
CMSTAT
0650 CMSIDL
—
—
—
—
C3EVT
C2EVT
C1EVT
—
—
—
—
—
C3OUT
C2OUT
C1OUT
0000
CVRCON
0652
—
—
—
—
—
VREFSEL
BGSEL1
BGSEL0
CVREN
CVROE
CVRR
—
CVR3
CVR2
CVR1
CVR0
0000
CM1CON
0654
CON
COE
CPOL
—
—
—
CEVT
COUT
EVPOL1
EVPOL0
—
CREF
—
—
CCH1
CCH0
0000
CM1MSKSRC 0656
—
—
—
—
CM1MSKCON 0658
OCEN OCNEN
SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0 SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0 0000
HLMS
—
OBEN
OBNEN
OAEN
OANEN
NAGS
PAGS
ACEN
ACNEN
ABEN
ABNEN
AAEN
AANEN
0000
CM1FLTR
065A
—
—
—
—
—
—
—
—
—
CFSEL2
CFSEL1
CFSEL0
CFLTREN
CFDIV2
CFDIV1
CFDIV0
0000
CM2CON
065C
CON
COE
CPOL
—
—
—
CEVT
COUT
EVPOL1
EVPOL0
—
CREF
—
—
CCH1
CCH0
0000
CM2MSKSRC 065E
—
—
—
—
CM2MSKCON 0660
HLMS
—
OBEN
OBNEN
OAEN
OANEN
NAGS
PAGS
ACEN
ACNEN
ABEN
ABNEN
AAEN
AANEN
0000
CM2FLTR
0662
—
—
—
—
—
—
—
—
—
CFSEL2
CFSEL1
CFSEL0
CFLTREN
CFDIV2
CFDIV1
CFDIV0
0000
CM3CON
0664
CON
COE
CPOL
—
—
—
CEVT
COUT
EVPOL1
EVPOL0
—
CREF
—
—
CCH1
CCH0
0000
CM3MSKSRC 0666
—
—
—
—
CM3MSKCON 0668
HLMS
—
—
—
CM3FLTR
066A
OCEN OCNEN
SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0 SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0 0000
OCEN OCNEN
—
SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0 SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0 0000
OBEN
OBNEN
OAEN
OANEN
NAGS
PAGS
ACEN
ACNEN
ABEN
ABNEN
AAEN
AANEN
0000
—
—
—
—
—
CFSEL2
CFSEL1
CFSEL0
CFLTREN
CFDIV2
CFDIV1
CFDIV0
0000
—
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-22:
File
Name
PERIPHERAL PIN SELECT INPUT REGISTER MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
—
—
Bit 10
Bit 9
Bit 8
—
—
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
—
—
—
—
—
—
—
—
DS70000652F-page 67
RPINR0
0680
—
—
—
RPINR1
0682
—
—
—
RPINR3
0686
—
—
—
T3CKR<4:0>
—
—
RPINR4
0688
—
—
—
T5CKR<4:0>(1)
—
—
RPINR7
068E
—
—
—
IC2R<4:0>
—
RPINR8
0690
—
—
—
—
—
—
—
—
RPINR11
0696
—
—
—
—
—
—
—
—
RPINR18
06A4
—
—
—
RPINR20
06A8
—
—
—
RPINR21
06AA
—
—
—
INT1R<4:0>
—
—
—
Bit 2
Bit 1
Bit 0
—
—
—
All
Resets
1F00
INT2R<4:0>
001F
—
T2CKR<4:0>
1F1F
—
T4CKR<4:0>(1)
1F1F
—
—
IC1R<4:0>
1F1F
—
—
—
IC3R<4:0>
001F
—
—
—
OCFAR<4:0>
001F
U1CTSR<4:0>
—
—
—
U1RXR<4:0>
1F1F
SCK1R<4:0>(1)
—
—
—
SDI1R<4:0>(1)
1F1F
—
—
—
SS1R<4:0>
001F
—
—
—
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
TABLE 4-21:
File
Name
PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJXXGP101 DEVICES
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
—
—
Bit 10
Bit 9
Bit 8
—
—
RP1R<4:0>
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Bit 7
Bit 6
Bit 5
—
—
—
RP0R<4:0>
0000
—
—
—
RP4R<4:0>
0000
RPOR0
06C0
—
—
—
RPOR2
06C4
—
—
—
RPOR3
06C6
—
—
—
RP7R<4:0>
—
—
—
RPOR4
06C8
—
—
—
RP9R<4:0>
—
—
—
RP8R<4:0>
0000
RPOR7
06CE
—
—
—
RP15R<4:0>
—
—
—
RP14R<4:0>
0000
—
—
—
—
—
—
0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-24:
File
Name
PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJXXMC101 DEVICES
SFR
Addr
Bit 15
Bit 14
Bit 13
RPOR0
06C0
—
—
—
RPOR2
06C4
—
—
—
RPOR3
06C6
—
—
—
RPOR4
06C8
—
—
RPOR6
06CC
—
—
RPOR7
06CE
—
—
Bit 12
Bit 11
—
—
Bit 10
Bit 9
Bit 8
Bit 6
Bit 5
—
—
—
—
—
RP0R<4:0>
—
—
—
RP4R<4:0>
RP7R<4:0>
—
—
—
—
RP9R<4:0>
—
—
—
RP8R<4:0>
0000
—
RP13R<4:0>
—
—
—
RP12R<4:0>
0000
—
RP15R<4:0>
—
—
—
RP14R<4:0>
0000
RP1R<4:0>
—
Bit 4
—
Bit 3
—
Bit 2
—
Bit 1
Bit 0
All
Resets
Bit 7
0000
0000
—
—
0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-25:
File
Name
PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJXX(GP/MC)102 DEVICES
 2011-2014 Microchip Technology Inc.
SFR
Addr
Bit 15
Bit 14
Bit 13
RPOR0
06C0
—
—
—
RPOR1
06C2
—
—
—
RPOR2
06C4
—
—
RPOR3
06C6
—
RPOR4
06C8
RPOR5
Bit 12
Bit 11
Bit 10
Bit 8
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Bit 7
Bit 6
Bit 5
RP1R<4:0>
—
—
—
RP0R<4:0>
0000
RP3R<4:0>
—
—
—
RP2R<4:0>
0000
—
RP5R<4:0>
—
—
—
RP4R<4:0>
0000
—
—
RP7R<4:0>
—
—
—
RP6R<4:0>
0000
—
—
—
RP9R<4:0>
—
—
—
RP8R<4:0>
0000
06CA
—
—
—
RP11R<4:0>
—
—
—
RP10R<4:0>
0000
RPOR6
06CC
—
—
—
RP13R<4:0>
—
—
—
RP12R<4:0>
0000
RPOR7
06CE
—
—
—
RP15R<4:0>
—
—
—
RP14R<4:0>
0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 9
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 68
TABLE 4-23:
File
Name
PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ32(GP/MC)104 DEVICES
SFR
Addr
Bit 15
Bit 14
Bit 13
RPOR0
06C0
—
—
—
RPOR1
06C2
—
—
—
RPOR2
06C4
—
—
RPOR3
06C6
—
—
RPOR4
06C8
—
RPOR5
06CA
RPOR6
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Bit 7
Bit 6
Bit 5
RP1R<4:0>
—
—
—
RP0R<4:0>
0000
RP3R<4:0>
—
—
—
RP2R<4:0>
0000
—
RP5R<4:0>
—
—
—
RP4R<4:0>
0000
—
RP7R<4:0>
—
—
—
RP6R<4:0>
0000
—
—
RP9R<4:0>
—
—
—
RP8R<4:0>
0000
—
—
—
RP11R<4:0>
—
—
—
RP10R<4:0>
0000
06CC
—
—
—
RP13R<4:0>
—
—
—
RP12R<4:0>
0000
RPOR7
06CE
—
—
—
RP15R<4:0>
—
—
—
RP14R<4:0>
0000
RPOR8
06D0
—
—
—
RP17R<4:0>
—
—
—
RP16R<4:0>
0000
RPOR9
06D2
—
—
—
RP19R<4:0>
—
—
—
RP18R<4:0>
0000
RPOR10
06D4
—
—
—
RP21R<4:0>
—
—
—
RP20R<4:0>
0000
RPOR11
06D6
—
—
—
RP23R<4:0>
—
—
—
RP22R<4:0>
0000
RPOR12
06D8
—
—
—
RP25R<4:0>
—
—
—
RP24R<4:0>
0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-27:
File
Name
PORTA REGISTER MAP FOR dsPIC33FJ16(GP/MC)101/102 DEVICES
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISA
02C0
—
—
—
—
—
—
—
—
—
—
—
TRISA<4:0>
001F
PORTA
02C2
—
—
—
—
—
—
—
—
—
—
—
RA<4:0
xxxx
LATA
02C4
—
—
—
—
—
—
—
—
—
—
—
LATA<4:0
ODCA
02C6
—
—
—
—
—
—
—
—
—
—
—
ODCA<4:2>
xxxx
—
—
0000
Bit 1
Bit 0
All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-28:
File
Name
PORTA REGISTER MAP FOR dsPIC33FJ32(GP/MC)101/102 DEVICES
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
DS70000652F-page 69
TRISA
02C0
—
—
—
—
—
—
—
—
—
—
—
TRISA<4:0>
001F
PORTA
02C2
—
—
—
—
—
—
—
—
—
—
—
RA<4:0
xxxx
LATA
02C4
—
—
—
—
—
—
—
—
—
—
—
LATA<4:0
ODCA
02C6
—
—
—
—
—
—
—
—
—
—
—
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
—
ODCA<3:2>
xxxx
—
—
0000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
TABLE 4-26:
File
Name
PORTA REGISTER MAP FOR dsPIC33FJ32(GP/MC)104 DEVICES
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
TRISA
02C0
—
—
—
—
—
PORTA
02C2
—
—
—
—
—
LATA
02C4
—
—
—
—
ODCA
02C6
—
—
—
—
Bit 10
Bit 9
Bit 8
Bit 7
Bit 4
Bit 5
TRISA<10:7>
—
—
TRISA<4:0>
001F
RA<10:7>
—
—
RA<4:0>
xxxx
—
LATA<10:7>
—
—
LATA<4:0>
—
ODCA<10:7>
—
—
—
Bit 3
Bit 2
ODCA<3:2>
Bit 1
Bit 0
All
Resets
Bit 6
xxxx
—
—
0000
Bit 0
All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-30:
File Name
SFR
Addr
PORTB REGISTER MAP FOR dsPIC33FJ16GP101 DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
TRISB
02C8
TRISB<15:14>
—
—
—
—
TRISB<9:7>
—
—
TRISB4
—
—
TRISB<1:0>
C393
PORTB
02CA
RB<15:14>
—
—
—
—
RB<9:7>
—
—
RB4
—
—
RB<1:0>
xxxx
LATB
02CC
LATB<15:14>
—
—
—
—
LATB<9:7>
—
—
LATB4
—
—
LATB<1:0>
xxxx
ODCB
02CE
ODCB<15:14>
—
—
—
—
ODCB<9:7>
—
—
ODCB4
—
—
—
—
0000
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-31:
File Name
SFR
Addr
PORTB REGISTER MAP FOR dsPIC33FJ16MC101 DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
 2011-2014 Microchip Technology Inc.
TRISB
02C8
TRISB<15:12>
—
—
TRISB<9:7>
—
—
TRISB4
—
—
TRISB<1:0>
F393
PORTB
02CA
RB<15:12>
—
—
RB<9:7>
—
—
RB4
—
—
RB<1:0>
xxxx
LATB
02CC
LATB<15:12>
—
—
LATB<9:7>
—
—
LATB4
—
—
LATB<1:0>
xxxx
ODCB
02CE
ODCB<15:12>
—
—
ODCB<9:7>
—
—
ODCB4
—
—
—
—
0000
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-32:
File
Name
SFR
Addr
PORTB REGISTER MAP FOR dsPIC33FJ16(GP/MC)102 DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
TRISB
02C8
TRISB<15:0>
FFFF
PORTB
02CA
RB<15:0>
xxxx
LATB
02CC
ODCB
02CE
LATB<15:0>
ODCB<15:4>
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
xxxx
—
—
—
—
0000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 70
TABLE 4-29:
File Name
SFR
Addr
PORTB REGISTER MAP FOR dsPIC33FJ32GP101 DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISB
02C8
TRISB<15:14>
—
—
—
—
TRISB<9:7>
—
—
TRISB4
—
—
TRISB<1:0>
C393
PORTB
02CA
RB<15:14>
—
—
—
—
RB<9:7>
—
—
RB4
—
—
RB<1:0>
xxxx
LATB
02CC
LATB<15:14>
—
—
—
—
LATB<9:7>
—
—
LATB4
—
—
LATB<1:0>
xxxx
ODCB
02CE
ODCB<15:14>
—
—
—
—
ODCB<9:7>
—
—
—
—
—
—
—
0000
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-34:
File Name
SFR
Addr
PORTB REGISTER MAP FOR dsPIC33FJ32MC101 DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
TRISB
02C8
TRISB<15:12>
—
—
TRISB<9:7>
—
—
TRISB4
—
—
TRISB<1:0>
F393
PORTB
02CA
RB<15:12>
—
—
RB<9:7>
—
—
RB4
—
—
RB<1:0>
xxxx
LATB
02CC
LATB<15:12>
—
—
LATB<9:7>
—
—
LATB4
—
—
LATB<1:0>
xxxx
ODCB
02CE
ODCB<15:12>
—
—
ODCB<9:7>
—
—
—
—
—
—
—
0000
Bit 2
Bit 1
Bit 0
All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-35:
File
Name
SFR
Addr
PORTB REGISTER MAP FOR dsPIC33FJ32(GP/MC)102 AND dsPIC33FJ32(GP/MC)104 DEVICES
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
TRISB
02C8
TRISB<15:0>
FFFF
PORTB
02CA
RB<15:0>
xxxx
LATB
02CC
ODCB
02CE
LATB<15:0>
xxxx
ODCB<15:5>
—
—
—
—
—
0000
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-36:
File
Name
PORTC REGISTER MAP FOR dsPIC33FJ32(GP/MC)104 DEVICES
DS70000652F-page 71
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
TRISC
02D0
—
—
—
—
—
—
TRISC<9:0>
FFFF
PORTC
02D2
—
—
—
—
—
—
RC<9:0>
xxxx
LATC
02D4
—
—
—
—
—
—
LATC<9:0>
ODCC
02D6
—
—
—
—
—
—
Bit 9
Bit 8
Bit 7
ODCC<9:6>
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 6
Bit 5
—
—
xxxx
—
—
—
—
0000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
TABLE 4-33:
SYSTEM CONTROL REGISTER MAP
File Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
VREGS
EXTR
SWR
SWDTEN
WDTO
SLEEP
IDLE
LOCK
—
CF
—
—
—
—
—
RCON
0740
TRAPR
IOPUWR
—
—
—
—
CM
OSCCON
0742
—
COSC2
COSC1
COSC0
—
NOSC2
NOSC1
CLKDIV
0744
ROI
DOZE2
DOZE1
DOZE0
OSCTUN
0748
—
—
—
—
NOSC0 CLKLOCK IOLOCK
DOZEN FRCDIV2 FRCDIV1 FRCDIV0
—
—
—
—
—
—
—
—
Bit 1
Bit 0
All
Resets
BOR
POR
xxxx(1)
LPOSCEN OSWEN
—
—
TUN<5:0>
0300(2)
3040
0000
Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: RCON register Reset values are dependent on the type of Reset.
2: OSCCON register Reset values are dependent on the FOSC Configuration bits and by type of Reset.
TABLE 4-38:
NVM REGISTER MAP
File Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
NVMCON
0760
WR
WREN
WRERR
—
—
—
—
—
—
ERASE
—
—
NVMKEY
0766
—
—
—
—
—
—
—
—
Bit 3
Bit 2
Bit 1
Bit 0
NVMOP3 NVMOP2 NVMOP1 NVMOP0
NVMKEY<7:0>
All
Resets
0000(1)
0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset.
TABLE 4-39:
PMD REGISTER MAP
File Name
SFR
Addr
PMD1
0770
PMD2
0772
—
PMD3
0774
PMD4
0776
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
T3MD
T2MD
T1MD
—
—
—
—
—
—
—
—
—
—
—
—
—
T5MD(2) T4MD(2)
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
PWM1MD(1)
—
I2C1MD
—
U1MD
—
SPI1MD
—
IC3MD
IC2MD
IC1MD
—
—
—
—
—
—
—
CMPMD
RTCCMD
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CTMUMD
 2011-2014 Microchip Technology Inc.
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This bit is available in dsPIC33FJXXMC10X devices only.
2: These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
Bit 0
All
Resets
—
AD1MD
0000
OC2MD
OC1MD
0000
—
—
0000
—
—
0000
Bit 1
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 72
TABLE 4-37:
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.2.6
4.2.7
SOFTWARE STACK
In addition to its use as a working register, the W15
register in the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 devices is also
used as a Software Stack Pointer. The Stack Pointer
always points to the first available free word and grows
from lower to higher addresses. It pre-decrements for
stack pops and post-increments for stack pushes, as
shown in Figure 4-6. For a PC push during any CALL
instruction, the MSb of the PC is zero-extended before
the push, ensuring that the MSb is always clear.
Note:
A PC push during exception processing
concatenates the SRL register to the MSb
of the PC prior to the push.
The Stack Pointer Limit register (SPLIM) associated
with the Stack Pointer sets an upper address boundary
for the stack. SPLIM is uninitialized at Reset. As is the
case for the Stack Pointer, SPLIM<0> is forced to ‘0’
because all stack operations must be word-aligned.
Whenever an EA is generated using W15 as a source
or destination pointer, the resulting address is
compared with the value in SPLIM. If the contents of
the Stack Pointer (W15) and the SPLIM register are
equal and a push operation is performed, a stack error
trap will not occur. However, the stack error trap will
occur on a subsequent push operation. For example, to
cause a stack error trap when the stack grows beyond
address 0x0C00 in RAM, initialize the SPLIM with the
value 0x0BFE.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800. This prevents the stack from
interfering with the SFR space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
FIGURE 4-6:
Stack Grows Toward
Higher Address
0x0000
15
CALL STACK FRAME
0
PC<15:0>
000000000 PC<22:16>
<Free Word>
W15 (before CALL)
W15 (after CALL)
POP : [--W15]
PUSH : [W15++]
 2011-2014 Microchip Technology Inc.
DATA RAM PROTECTION FEATURE
The dsPIC33F product family supports data RAM
protection features that enable segments of RAM to be
protected when used in conjunction with Boot and
Secure Code Segment Security. BSRAM (Secure RAM
Segment for BS) is accessible only from the Boot
Segment Flash code when enabled. SSRAM (Secure
RAM Segment for RAM) is accessible only from the
Secure Segment Flash code when enabled. See
Table 4-1 for an overview of the BSRAM and SSRAM
SFRs.
4.3
Instruction Addressing Modes
The addressing modes shown in Table 4-40 form the
basis of the addressing modes that are optimized to
support the specific features of individual instructions.
The addressing modes provided in the MAC class of
instructions differ from those provided in other
instruction types.
4.3.1
FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field
(f) to directly address data present in the first
8192 bytes of data memory (Near Data Space). Most
file register instructions employ a Working register, W0,
which is denoted as WREG in these instructions. The
destination is typically either the same file register or
WREG (with the exception of the MUL instruction),
which writes the result to a register or register pair. The
MOV instruction allows additional flexibility and can
access the entire data space.
4.3.2
MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
where Operand 1 is always a Working register (that is,
the addressing mode can only be Register Direct),
which is referred to as Wb. Operand 2 can be a W register, fetched from data memory, or a 5-bit literal. The
result location can be either a W register or a data
memory location. The following addressing modes are
supported by MCU instructions:
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
5-Bit or 10-Bit Literal
Note:
Not all instructions support all of the
addressing modes given above. Individual
instructions can support different subsets of
these addressing modes.
DS70000652F-page 73
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 4-40:
FUNDAMENTAL ADDRESSING MODES SUPPORTED
Addressing Mode
Description
File Register Direct
The address of the file register is specified explicitly.
Register Direct
The contents of a register are accessed directly.
Register Indirect
The contents of Wn forms the Effective Address (EA).
Register Indirect Post-Modified
The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified
Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
(Register Indexed)
Register Indirect with Literal Offset
4.3.3
The sum of Wn and a literal forms the EA.
MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing modes supported by most MCU
instructions, move and accumulator instructions also
support Register Indirect with Register Offset
Addressing mode, also referred to as Register Indexed
mode.
Note:
For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA. However, the 4-bit Wb (Register Offset) field is
shared by both source and destination
(but typically only used by one).
4.3.4
The two-source operand prefetch registers must be
members of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 are always directed to the X RAGU,
and W10 and W11 are always directed to the Y AGU.
The Effective Addresses generated (before and after
modification) must, therefore, be valid addresses within
X data space for W8 and W9 and Y data space for W10
and W11.
Note:
In summary, the following addressing modes are
supported by move and accumulator instructions:
•
•
•
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-modified
Register Indirect Pre-modified
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-Bit Literal
16-Bit Literal
Note:
Not all instructions support all the
addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
DS70000652F-page 74
MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, use a simplified set of
addressing modes to allow the user application to
effectively manipulate the Data Pointers through
register indirect tables.
Register Indirect with Register Offset
Addressing mode is available only for W9
(in X space) and W11 (in Y space).
In summary, the following addressing modes are
supported by the MAC class of instructions:
•
•
•
•
•
Register Indirect
Register Indirect Post-Modified by 2
Register Indirect Post-Modified by 4
Register Indirect Post-Modified by 6
Register Indirect with Register Offset (Indexed)
4.3.5
OTHER INSTRUCTIONS
In addition to the addressing modes outlined previously,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit signed
literals to specify the branch destination directly, whereas
the DISI instruction uses a 14-bit unsigned literal field. In
some instructions, such as ADD Acc, the source of an
operand or result is implied by the opcode itself. Certain
operations, such as NOP, do not have any operands.
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.4
Modulo Addressing
Modulo Addressing mode is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or program
space (since the Data Pointer mechanism is essentially
the same for both). One circular buffer can be supported
in each of the X (which also provides the pointers into
program space) and Y data spaces. Modulo Addressing
can operate on any W Register Pointer. However, it is not
advisable to use W14 or W15 for Modulo Addressing
since these two registers are used as the Stack Frame
Pointer and Stack Pointer, respectively.
In general, any particular circular buffer can be configured to operate in only one direction as there are
certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing
buffers), based upon the direction of the circular buffer.
The only exception to the usage restrictions is for
buffers that have a power-of-two length. As these
buffers satisfy the start and end address criteria, they
can operate in a bidirectional mode (that is, address
boundary checks are performed on both the lower and
upper address boundaries).
4.4.1
The length of a circular buffer is not directly specified. It
is determined by the difference between the corresponding start and end addresses. The maximum possible
length of the circular buffer is 32K words (64 Kbytes).
4.4.2
W ADDRESS REGISTER
SELECTION
• The Modulo and Bit-Reversed Addressing Control
register, MODCON<15:0>, contains enable flags as
well as a W register field to specify the W Address
registers. The XWM and YWM fields select which
registers will operate with Modulo Addressing.
• If XWM = 15, X RAGU and X WAGU Modulo
Addressing is disabled.
• If YWM = 15, Y AGU Modulo Addressing is disabled.
The X Address Space Pointer W register (XWM), to
which Modulo Addressing is to be applied, is stored in
MODCON<3:0> (see Table 4-1). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than ‘15’ and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing is to be applied is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than
‘15’ and the YMODEN bit is set at MODCON<14>.
START AND END ADDRESS
The Modulo Addressing scheme requires that a
starting and ending address be specified, and loaded
into the 16-bit Modulo Buffer Address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 4-1).
Note:
Y space Modulo Addressing EA calculations assume word-sized data (LSb of
every EA is always clear).
FIGURE 4-7:
MODULO ADDRESSING OPERATION EXAMPLE
Byte
Address
0x1100
0x1163
MOV
MOV
MOV
MOV
MOV
MOV
#0x1100, W0
W0, XMODSRT
#0x1163, W0
W0, MODEND
#0x8001, W0
W0, MODCON
MOV
#0x0000, W0
;W0 holds buffer fill value
MOV
#0x1110, W1
;point W1 to buffer
DO
AGAIN, #0x31
MOV
W0, [W1++]
AGAIN: INC W0, W0
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;fill the 50 buffer locations
;fill the next location
;increment the fill value
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 Words
 2011-2014 Microchip Technology Inc.
DS70000652F-page 75
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.4.3
MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W
register. Address boundaries check for addresses
equal to:
• The upper boundary addresses for incrementing
buffers
• The lower boundary addresses for decrementing
buffers
It is important to realize that the address boundaries
check for addresses less than or greater than the upper
(for incrementing buffers) and lower (for decrementing
buffers) boundary addresses (not just equal to).
Address changes can, therefore, jump beyond
boundaries and still be adjusted correctly.
Note:
4.5
The modulo corrected Effective Address
is written back to the register only when
Pre-Modify or Post-Modify Addressing
mode is used to compute the Effective
Address. When an address offset (such
as [W7 + W2]) is used, Modulo
Addressing correction is performed, but
the contents of the register remain
unchanged.
Bit-Reversed Addressing
Bit-Reversed Addressing mode is intended to simplify
data reordering for radix-2 FFT algorithms. It is
supported by the X AGU for data writes only.
The modifier, which can be a constant value or register
contents, is regarded as having its bit order reversed. The
address source and destination are kept in normal order.
Thus, the only operand requiring reversal is the modifier.
4.5.1
BIT-REVERSED ADDRESSING
IMPLEMENTATION
If the length of a bit-reversed buffer is M = 2N bytes,
the last ‘N’ bits of the data buffer start address must
be zeros.
XB<14:0> is the bit-reversed address modifier, or ‘pivot
point,’ which is typically a constant. In the case of an
FFT computation, its value is equal to half of the FFT
data buffer size.
Note:
All bit-reversed EA calculations assume
word-sized data (LSb of every EA is always
clear). The XB<14:0> value is scaled
accordingly to generate compatible (byte)
addresses.
When enabled, Bit-Reversed Addressing is executed
only for Register Indirect with Pre-Increment or PostIncrement Addressing and word-sized data writes. It
will not function for any other addressing mode or for
byte-sized data and normal addresses are generated
instead. When Bit-Reversed Addressing is active, the
W Address Pointer is always added to the address
modifier (XB) and the offset associated with the
Register Indirect Addressing mode is ignored. In
addition, as word-sized data is a requirement, the LSb
of the EA is ignored (and always clear).
Note:
Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. If an application attempts to do
so, Bit-Reversed Addressing will assume
priority when active. For the X WAGU and
Y AGU, Modulo Addressing will be
disabled. However, Modulo Addressing will
continue to function in the X RAGU.
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, a write to the
XBREV register should not be immediately followed by
an indirect read operation using the W register that has
been designated as the Bit-Reversed Pointer.
Bit-Reversed Addressing mode is enabled in any of
these situations:
• BWM<3:0> bits (W register selection) in the
MODCON register are any value other than ‘15’
(the stack cannot be accessed using
Bit-Reversed Addressing)
• The BREN bit is set in the XBREV register
• The addressing mode used is Register Indirect
with Pre-Increment or Post-Increment
DS70000652F-page 76
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 4-8:
BIT-REVERSED ADDRESS EXAMPLE
Sequential Address
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4
0
Bit-Reversed Address
Pivot Point
XB<14:0> = 0x0008 for a 16-Word, Bit-Reversed Buffer
TABLE 4-41:
BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
Normal Address
Bit-Reversed Address
A3
A2
A1
A0
Decimal
A3
A2
A1
A0
Decimal
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
8
0
0
1
0
2
0
1
0
0
4
0
0
1
1
3
1
1
0
0
12
0
1
0
0
4
0
0
1
0
2
0
1
0
1
5
1
0
1
0
10
0
1
1
0
6
0
1
1
0
6
0
1
1
1
7
1
1
1
0
14
1
0
0
0
8
0
0
0
1
1
1
0
0
1
9
1
0
0
1
9
1
0
1
0
10
0
1
0
1
5
1
0
1
1
11
1
1
0
1
13
1
1
0
0
12
0
0
1
1
3
1
1
0
1
13
1
0
1
1
11
1
1
1
0
14
0
1
1
1
7
1
1
1
1
15
1
1
1
1
15
 2011-2014 Microchip Technology Inc.
DS70000652F-page 77
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.6
4.6.1
Interfacing Program and Data
Memory Spaces
Since the address ranges for the data and program
spaces are 16 and 24 bits, respectively, a method is
needed to create a 23-bit or 24-bit program address
from 16-bit data registers. The solution depends on the
interface method to be used.
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 architecture uses
a 24-bit-wide program space and a 16-bit-wide data
space. The architecture is also a modified Harvard
scheme, meaning that data can also be present in the
program space. To use this data successfully, it must
be accessed in a way that preserves the alignment of
information in both spaces.
For table operations, the 8-bit Table Page (TBLPAG)
register is used to define a 32K word region within the
program space. This is concatenated with a 16-bit EA to
arrive at a full 24-bit program space address. In this
format, the MSb of TBLPAG is used to determine if the
operation occurs in the user memory (TBLPAG<7> = 0)
or the configuration memory (TBLPAG<7> = 1).
Aside from normal execution, the dsPIC33FJ16(GP/
MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104
architecture provides two methods by which program
space can be accessed during operation:
For remapping operations, the 8-bit Program Space
Visibility (PSVPAG) register is used to define a
16K word page in the program space. When the MSb
of the EA is ‘1’, PSVPAG is concatenated with the lower
15 bits of the EA to form a 23-bit program space
address. Unlike table operations, this limits remapping
operations strictly to the user memory area.
• Using table instructions to access individual
bytes, or words, anywhere in the program space
• Remapping a portion of the program space into
the data space (Program Space Visibility)
Table instructions allow an application to read or write
to small areas of the program memory. This capability
makes the method ideal for accessing data tables that
need to be updated periodically. It also allows access
to all bytes of the program word. The remapping
method allows an application to access a large block of
data on a read-only basis, which is ideal for lookups
from a large table of static data. The application can
only access the lsw of the program word.
TABLE 4-42:
ADDRESSING PROGRAM SPACE
Table 4-42 and Figure 4-9 show how the program EA is
created for table operations and remapping accesses
from the data EA.
PROGRAM SPACE ADDRESS CONSTRUCTION
Access
Space
Access Type
Program Space Address
<23>
<22:16>
<15>
<14:1>
Instruction Access
(Code Execution)
User
TBLRD/TBLWT
(Byte/Word Read/Write)
User
TBLPAG<7:0>
Configuration
TBLPAG<7:0>
Data EA<15:0>
1xxx xxxx
xxxx xxxx xxxx xxxx
Program Space Visibility
(Block Remap/Read)
Note 1:
PC<22:1>
0
0xx
xxxx
xxxx
0xxx xxxx
User
xxxx
<0>
0
xxxx
xxx0
Data EA<15:0>
xxxx xxxx xxxx xxxx
0
PSVPAG<7:0>
0
xxxx xxxx
Data EA<14:0>(1)
xxx xxxx xxxx xxxx
Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of
the address is PSVPAG<0>.
DS70000652F-page 78
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 4-9:
DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
Program Counter(1)
Program Counter
0
0
23 Bits
EA
Table Operations(2)
1/0
1/0
TBLPAG
8 Bits
16 Bits
24 Bits
Select
Program Space Visibility(1)
(Remapping)
0
EA
1
0
PSVPAG
8 Bits
15 Bits
23 Bits
User/Configuration
Space Select
Note 1:
2:
Byte Select
The Least Significant bit of program space addresses is always fixed as ‘0’ to maintain word
alignment of data in the program and data spaces.
Table operations are not required to be word-aligned. Table read operations are permitted in
the configuration memory space.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 79
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.6.2
DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
The TBLRDL and TBLWTL instructions offer a direct
method of reading or writing the lower word of any
address within the program space without going
through data space. The TBLRDH and TBLWTH
instructions are the only method to read or write the
upper 8 bits of a program space word as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit-wide
word address spaces, residing side by side, each with
the same address range. TBLRDL and TBLWTL access
the space that contains the least significant data word.
TBLRDH and TBLWTH access the space that contains the
upper data byte.
Two table instructions are provided to move byte or
word-sized (16-bit) data to and from program space.
Both function as either byte or word operations.
• TBLRDL (Table Read Low):
- In Word mode, this instruction maps the
lower word of the program space location
(P<15:0>) to a data address (D<15:0>).
- In Byte mode, either the upper or lower byte
of the lower program word is mapped to the
lower byte of a data address. The upper byte
is selected when Byte Select is ‘1’; the lower
byte is selected when it is ‘0’.
FIGURE 4-10:
• TBLRDH (Table Read High):
- In Word mode, this instruction maps the entire
upper word of a program address (P<23:16>)
to a data address. Note that D<15:8>, the
‘phantom byte’, will always be ‘0’.
- In Byte mode, this instruction maps the upper
or lower byte of the program word to D<7:0>
of the data address, in the TBLRDL instruction. The data is always ‘0’ when the upper
‘phantom’ byte is selected (Byte Select = 1).
In a similar fashion, two table instructions, TBLWTH
and TBLWTL, are used to write individual bytes or
words to a program space address. The details of
their operation are explained in Section 5.0 “Flash
Program Memory”.
For all table operations, the area of program memory
space to be accessed is determined by the Table Page
register (TBLPAG). TBLPAG covers the entire program
memory space of the device, including user and
configuration spaces. When TBLPAG<7> = 0, the table
page is located in the user memory space. When
TBLPAG<7> = 1, the page is located in configuration
space.
ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS
Program Space
TBLPAG
02
23
15
0
0x000000
23
16
8
0
00000000
0x020000
00000000
00000000
0x030000
00000000
‘Phantom’ Byte
TBLRDH.B (Wn<0> = 0)
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)
TBLRDL.W
0x800000
DS70000652F-page 80
The address for the table operation is determined by the data EA
within the page defined by the TBLPAG register.
Only read operations are shown; write operations are also valid in
the user memory area.
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
4.6.3
READING DATA FROM PROGRAM
MEMORY USING PROGRAM SPACE
VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word page of the program space.
This option provides transparent access to stored
constant data from the data space without the need to
use special instructions (such as TBLRDL and
TBLRDH).
Program space access through the data space occurs
if the MSb of the data space EA is ‘1’ and program
space visibility is enabled by setting the PSV bit in the
Core Control register (CORCON<2>). The location of
the program memory space to be mapped into the data
space is determined by the Program Space Visibility
Page register (PSVPAG). This 8-bit register defines
any one of 256 possible pages of 16K words in program
space. In effect, PSVPAG functions as the upper 8 bits
of the program memory address, with the 15 bits of the
EA functioning as the lower bits. By incrementing the
PC by 2 for each program memory word, the lower 15
bits of data space addresses directly map to the lower
15 bits in the corresponding program space addresses.
Data reads to this area add a cycle to the instruction
being executed, since two program memory fetches
are required.
Although each data space address, 0x8000 and higher,
maps directly into a corresponding program memory
address (see Figure 4-11), only the lower 16 bits of the
FIGURE 4-11:
24-bit program word are used to contain the data. The
upper 8 bits of any program space location used as
data should be programmed with ‘1111 1111’ or
‘0000 0000’ to force a NOP. This prevents possible
issues should the area of code ever be accidentally
executed.
Note:
PSV access is temporarily disabled during
Table Reads/Writes.
For operations that use PSV and are executed outside a
REPEAT loop, the MOV and MOV.D instructions require
one instruction cycle in addition to the specified execution
time. All other instructions require two instruction cycles
in addition to the specified execution time.
For operations that use PSV, and are executed inside
a REPEAT loop, these instances require two instruction
cycles in addition to the specified execution time of the
instruction:
• Execution in the first iteration
• Execution in the last iteration
• Execution prior to exiting the loop due to an
interrupt
• Execution upon re-entering the loop after an
interrupt is serviced
Any other iteration of the REPEAT loop will allow the
instruction using PSV to access data, to execute in a
single cycle.
PROGRAM SPACE VISIBILITY OPERATION
When CORCON<2> = 1 and EA<15> = 1:
Program Space
PSVPAG
02
23
15
Data Space
0
0x000000
0x0000
Data EA<14:0>
0x010000
0x018000
The data in the page
designated by
PSVPAG is mapped
into the upper half of
the data memory
space...
0x8000
PSV Area
0x800000
 2011-2014 Microchip Technology Inc.
...while the lower 15 bits
of the EA specify an
exact address within
0xFFFF the PSV area. This
corresponds exactly to
the same lower 15 bits
of the actual program
space address.
DS70000652F-page 81
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 82
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
5.0
FLASH PROGRAM MEMORY
ICSP allows a device to be serially programmed while
in the end application circuit. This is done with two lines
for programming clock and programming data (one of
the alternate programming pin pairs: PGECx/PGEDx),
and three other lines for power (VDD), ground (VSS) and
Master Clear (MCLR). This allows users to manufacture boards with unprogrammed devices and then
program the Digital Signal Controller just before
shipping the product. This also allows the most recent
firmware or a custom firmware to be programmed.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 family
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Flash Programming”
(DS70191) in the “dsPIC33/PIC24 Family
Reference Manual”, which is available
from
the
Microchip
web
site
(www.microchip.com).
RTSP is accomplished using TBLRD (Table Read) and
TBLWT (Table Write) instructions. With RTSP, the user
application can write program memory data in a single
program memory word and erase program memory in
blocks or ‘pages’ of 512 instructions (1536 bytes).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
5.1
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices contain
internal Flash program memory for storing and
executing application code. The memory is readable,
writable and erasable during normal operation over the
entire VDD range.
Flash memory can be programmed in two ways:
• In-Circuit Serial Programming™ (ICSP™)
programming capability
• Run-Time Self-Programming (RTSP)
Table Instructions and Flash
Programming
Regardless of the method used, all programming of
Flash memory is done with the Table Read and Table
Write instructions. These allow direct read and write
access to the program memory space, from the data
memory, while the device is in normal operating mode.
The 24-bit target address in the program memory is
formed using bits<7:0> of the TBLPAG register and the
Effective Address (EA) from a W register specified in
the table instruction, as shown in Figure 5-1.
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
both Word and Byte modes.
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can also access program memory in Word
or Byte mode.
FIGURE 5-1:
ADDRESSING FOR TABLE REGISTERS
24 Bits
Using
Program Counter
Program Counter
0
0
Working Reg EA
Using
Table Instruction
1/0
TBLPAG Reg
8 Bits
User/Configuration
Space Select
 2011-2014 Microchip Technology Inc.
16 Bits
24-Bit EA
Byte
Select
DS70000652F-page 83
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
5.2
RTSP Operation
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 Flash program
memory array is organized into rows of 64 instructions or
192 bytes. RTSP allows the user application to erase a
page of memory, which consists of eight rows
(512 instructions); and to program one word. Table 26-12
shows typical erase and programming times. The 8-row
erase pages are edge-aligned from the beginning of
program memory, on boundaries of 1536 bytes.
5.3
Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. The processor stalls (waits) until the operation is
finished.
The programming time depends on the FRC accuracy
(see Table 26-18) and the value of the FRC Oscillator
Tuning register (see Register 8-3). Use the following
formula to calculate the minimum and maximum values
for the Word write time and page erase time (see
Parameters D138a and D138b, and Parameters D137a
and D137b in Table 26-12, respectively).
EQUATION 5-1:
PROGRAMMING TIME
T
-------------------------------------------------------------------------------------------------------------------------7.37 MHz   FRC Accuracy %   FRC Tuning %
For example, if the device is operating at +125°C, the
FRC accuracy will be ±2%. If the TUN<5:0> bits (see
Register 8-3) are set to ‘b000000, the minimum row
write time is equal to Equation 5-2.
EQUATION 5-2:
MINIMUM ROW WRITE
TIME
355 Cycles
T RW = ---------------------------------------------------------------------------------------------- = 47.4s
7.37 MHz   1 + 0.02    1 – 0.00375 
5.3.1
PROGRAMMING ALGORITHM FOR
FLASH PROGRAM MEMORY
Programmers can program one word (24 bits) of
program Flash memory at a time. To do this, it is
necessary to erase the 8-row erase page that contains
the desired address of the location the user wants to
change.
For protection against accidental operations, the write
initiate sequence for NVMKEY must be used to allow
any erase or program operation to proceed. After the
programming command has been executed, the user
application must wait for the programming time until
programming is complete. The two instructions
following the start of the programming sequence
should be NOPs.
Note:
Performing a page erase operation on the
last page of program memory will clear the
Flash Configuration Words, thereby
enabling code protection as a result.
Therefore, users should avoid performing
page erase operations on the last page of
program memory.
Refer to “Flash Programming” (DS70191) in the
“dsPIC33/PIC24 Family Reference Manual” for details
and codes examples on programming using RTSP.
5.4
Control Registers
Two SFRs are used to read and write the program
Flash memory: NVMCON and NVMKEY.
The NVMCON register (Register 5-1) controls which
blocks are to be erased, which memory type is to be
programmed and the start of the programming cycle.
NVMKEY is a write-only register that is used for write
protection. To start a programming or erase sequence,
the user application must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 5.3
“Programming Operations” for further details.
The maximum row write time is equal to Equation 5-3.
EQUATION 5-3:
MAXIMUM ROW WRITE
TIME
355 Cycles
T RW = ---------------------------------------------------------------------------------------------- = 49.3s
7.37 MHz   1 – 0.02    1 – 0.00375 
Setting the WR bit (NVMCON<15>) starts the operation and the WR bit is automatically cleared when the
operation is finished.
DS70000652F-page 84
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 5-1:
NVMCON: FLASH MEMORY CONTROL REGISTER
R/SO-0(1)
R/W-0(1)
R/W-0(1)
U-0
U-0
U-0
U-0
U-0
WR
WREN
WRERR
—
—
—
—
—
bit 15
bit 8
R/W-0(1)
U-0
—
U-0
ERASE
—
U-0
—
R/W-0(1)
NVMOP3
(2)
R/W-0(1)
NVMOP2
(2)
R/W-0(1)
NVMOP1
(2)
R/W-0(1)
NVMOP0(2)
bit 7
bit 0
Legend:
SO = Settable Only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
WR: Write Control bit(1)
1 = Initiates a Flash memory program or erase operation; the operation is self-timed and the bit is
cleared by hardware once operation is complete
0 = Program or erase operation is complete and inactive
bit 14
WREN: Write Enable bit(1)
1 = Enables Flash program/erase operations
0 = Inhibits Flash program/erase operations
bit 13
WRERR: Write Sequence Error Flag bit(1)
1 = An improper program or erase sequence attempt or termination has occurred (bit is set automatically
on any set attempt of the WR bit)
0 = The program or erase operation completed normally
bit 12-7
Unimplemented: Read as ‘0’
bit 6
ERASE: Erase/Program Enable bit(1)
1 = Performs the erase operation specified by NVMOP<3:0> on the next WR command
0 = Performs the program operation specified by NVMOP<3:0> on the next WR command
bit 5-4
Unimplemented: Read as ‘0’
bit 3-0
NVMOP<3:0>: NVM Operation Selection bits(1,2)
If ERASE = 1:
1111 = No operation
1101 = Erase General Segment
1100 = No operation
0011 = No operation
0010 = Memory page erase operation
0001 = No operation
0000 = No operation
If ERASE = 0:
1111 = No operation
1101 = No operation
1100 = No operation
0011 = Memory word program operation
0010 = No operation
0001 = No operation
0000 = No operation
Note 1:
2:
These bits can only be reset on a POR.
All other combinations of NVMOP<3:0> are unimplemented.
REGISTER 5-2:
NVMKEY: NONVOLATILE MEMORY KEY REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
 2011-2014 Microchip Technology Inc.
DS70000652F-page 85
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
bit 15
bit 8
W-0
W-0
W-0
W-0
W-0
W-0
W-0
W-0
NVMKEY<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
Unimplemented: Read as ‘0’
bit 7-0
NVMKEY<7:0>: Key Register bits (write-only)
DS70000652F-page 86
x = Bit is unknown
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
6.0
RESETS
A simplified block diagram of the Reset module is
shown in Figure 6-1.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Reset” (DS70192) in the
“dsPIC33/PIC24
Family
Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The Reset module combines all Reset sources and
controls the device Master Reset Signal, SYSRST. The
following is a list of device Reset sources:
•
•
•
•
•
•
•
•
POR: Power-on Reset
BOR: Brown-out Reset
MCLR: Master Clear Pin Reset
SWR: RESET Instruction
WDTO: Watchdog Timer Reset
CM: Configuration Mismatch Reset
TRAPR: Trap Conflict Reset
IOPUWR: Illegal Condition Device Reset
- Illegal Opcode Reset
- Uninitialized W Register Reset
- Security Reset
FIGURE 6-1:
Any active source of Reset will make the SYSRST signal active. On system Reset, some of the registers
associated with the CPU and peripherals are forced to
a known Reset state, and some are unaffected.
Note:
Refer to the specific peripheral section or
Section 3.0 “CPU” of this data sheet for
register Reset states.
All types of device Reset set a corresponding status bit
in the RCON register to indicate the type of Reset (see
Register 6-1).
All bits that are set, with the exception of the POR bit
(RCON<0>), are cleared during a POR event. The user
application can set or clear any bit at any time during
code execution. The RCON bits only serve as status
bits. Setting a particular Reset status bit in software
does not cause a device Reset to occur.
The RCON register also has other bits associated with
the Watchdog Timer and device power-saving states.
The function of these bits is discussed in other sections
of this data sheet.
Note:
The status bits in the RCON register
should be cleared after they are read so
that the next RCON register value after a
device Reset is meaningful.
RESET SYSTEM BLOCK DIAGRAM
RESET Instruction
Glitch Filter
MCLR
WDT
Module
Sleep or Idle
BOR
Internal
Regulator
SYSRST
VDD
VDD Rise
Detect
POR
Trap Conflict
Illegal Opcode
Uninitialized W Register
Configuration Mismatch
 2011-2014 Microchip Technology Inc.
DS70000652F-page 87
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
6.1
Reset Control Register
RCON: RESET CONTROL REGISTER(1)
REGISTER 6-1:
R/W-0
R/W-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
TRAPR
IOPUWR
—
—
—
—
CM
VREGS
bit 15
bit 8
R/W-0
R/W-0
EXTR
SWR
R/W-0
(2)
SWDTEN
R/W-0
R/W-0
R/W-0
R/W-1
R/W-1
WDTO
SLEEP
IDLE
BOR
POR
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
TRAPR: Trap Reset Flag bit
1 = A Trap Conflict Reset has occurred
0 = A Trap Conflict Reset has not occurred
bit 14
IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit
1 = An illegal opcode detection, an illegal address mode or Uninitialized W register used as an
Address Pointer caused a Reset
0 = An Illegal Opcode or Uninitialized W Reset has not occurred
bit 13-10
Unimplemented: Read as ‘0’
bit 9
CM: Configuration Mismatch Flag bit
1 = A Configuration Mismatch Reset has occurred
0 = A Configuration Mismatch Reset has not occurred
bit 8
VREGS: Voltage Regulator Stand-by During Sleep bit
1 = Voltage regulator is active during Sleep
0 = Voltage regulator goes into Stand-by mode during Sleep
bit 7
EXTR: External Reset (MCLR) Pin bit
1 = A Master Clear (pin) Reset has occurred
0 = A Master Clear (pin) Reset has not occurred
bit 6
SWR: Software Reset (Instruction) Flag bit
1 = A RESET instruction has been executed
0 = A RESET instruction has not been executed
bit 5
SWDTEN: Software Enable/Disable of WDT bit(2)
1 = WDT is enabled
0 = WDT is disabled
bit 4
WDTO: Watchdog Timer Time-out Flag bit
1 = WDT time-out has occurred
0 = WDT time-out has not occurred
bit 3
SLEEP: Wake-up from Sleep Flag bit
1 = Device has been in Sleep mode
0 = Device has not been in Sleep mode
Note 1:
2:
All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
If the FWDTEN Configuration bit is set to ‘1’ (unprogrammed), the WDT is always enabled, regardless of
the SWDTEN bit setting.
DS70000652F-page 88
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 6-1:
RCON: RESET CONTROL REGISTER(1) (CONTINUED)
bit 2
IDLE: Wake-up from Idle Flag bit
1 = Device has been in Idle mode
0 = Device has not been in Idle mode
bit 1
BOR: Brown-out Reset Flag bit
1 = A Brown-out Reset has occurred
0 = A Brown-out Reset has not occurred
bit 0
POR: Power-on Reset Flag bit
1 = A Power-on Reset has occurred
0 = A Power-on Reset has not occurred
Note 1:
2:
All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
If the FWDTEN Configuration bit is set to ‘1’ (unprogrammed), the WDT is always enabled, regardless of
the SWDTEN bit setting.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 89
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
6.2
System Reset
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 family of devices
have two types of Reset:
• Cold Reset
• Warm Reset
A Cold Reset is the result of a POR or a BOR. On a
Cold Reset, the FNOSC<2:0> Configuration bits in the
FOSCSEL Configuration register selects the device
clock source.
TABLE 6-1:
A Warm Reset is the result of all other Reset sources,
including the RESET instruction. On Warm Reset, the
device will continue to operate from the current clock
source as indicated by the Current Oscillator Selection (COSC<2:0>) bits in the Oscillator Control
(OSCCON<14:12>) register.
The device is kept in a Reset state until the system
power supplies have stabilized at appropriate levels
and the oscillator clock is ready. The sequence in
which this occurs is shown in Figure 6-2.
OSCILLATOR DELAY
Oscillator
Start-up Delay
Oscillator Start-up
Timer
PLL Lock Time
Total Delay
FRC, FRCDIV16,
FRCDIVN
TOSCD(1)
—
—
TOSCD
FRCPLL
TOSCD(1)
—
TLOCK(3)
TOSCD(1) + TLOCK(3)
MS
TOST(2)
—
TOSCD(1) + TOST(2)
HS
TOSCD(1)
TOSCD(1)
TOST(2)
—
TOSCD(1) + TOST(2)
EC
—
—
—
TOSCD(1)
TOST(2)
TLOCK(3)
TLOCK(3)
Oscillator Mode
MSPLL
—
TOSCD(1)
+ TOST(2) + TLOCK(3)
ECPLL
—
—
TLOCK(3)
SOSC
TOSCD(1)
TOST(2)
—
TOSCD(1) + TOST(2)
LPRC
TOSCD(1)
—
—
TOSCD(1)
Note 1:
2:
3:
TOSCD = Oscillator Start-up Delay (1.1 s max. for FRC, 70 s max. for LPRC). Crystal oscillator start-up
times vary with crystal characteristics, load capacitance, etc.
TOST = Oscillator Start-up Timer Delay (1024 oscillator clock period). For example, TOST = 102.4 s for a
10 MHz crystal and TOST = 32 ms for a 32 kHz crystal.
TLOCK = PLL Lock time (1.5 ms nominal) if PLL is enabled.
DS70000652F-page 90
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 6-2:
SYSTEM RESET TIMING
VBOR
VPOR
VDD
TPOR
POR
1
TBOR
2
BOR
3
TPWRT
SYSRST
4
Oscillator Clock
TOSCD
TOST
TLOCK
6
TFSCM
FSCM
5
Reset
Device Status
Run
Time
1.
2.
3.
4.
5.
6.
POR: A POR circuit holds the device in Reset when the power supply is turned on. The POR circuit is active until VDD crosses the
VPOR threshold and the delay, TPOR, has elapsed.
BOR: The on-chip voltage regulator has a BOR circuit that keeps the device in Reset until VDD crosses the VBOR threshold and the
delay, TBOR, has elapsed. The delay, TBOR, ensures the voltage regulator output becomes stable.
PWRT Timer: The Power-up Timer continues to hold the processor in Reset for a specific period of time (TPWRT) after a BOR. The
delay, TPWRT, ensures that the system power supplies have stabilized at the appropriate level for full-speed operation. After the delay,
TPWRT, has elapsed, the SYSRST becomes inactive, which in turn, enables the selected oscillator to start generating clock cycles.
Oscillator Delay: The total delay for the clock to be ready for various clock source selections is given in Table 6-1. Refer to
Section 8.0 “Oscillator Configuration” for more information.
When the oscillator clock is ready, the processor begins execution from location, 0x000000. The user application programs a GOTO
instruction at the Reset address, which redirects program execution to the appropriate start-up routine.
The Fail-Safe Clock Monitor (FSCM), if enabled, begins to monitor the system clock when the system clock is ready and the delay,
TFSCM, has elapsed.
TABLE 6-2:
Symbol
VPOR
TPOR
VBOR
TBOR
OSCILLATOR PARAMETERS
Parameter
POR Threshold
Value
1.8V nominal
POR Extension Time 30 s maximum
BOR Threshold
2.5V nominal
BOR Extension Time 100 s maximum
TPWRT
Power-up Time
Delay
64 ms nominal
TFSCM
Fail-Safe Clock
Monitor Delay
900 s maximum
 2011-2014 Microchip Technology Inc.
Note:
When the device exits the Reset condition
(begins normal operation), the device
operating parameters (voltage, frequency,
temperature, etc.) must be within their
operating ranges; otherwise, the device
may not function correctly. The user application must ensure that the delay between
the time power is first applied, and the time
SYSRST becomes inactive, is long
enough to get all operating parameters
within specification.
DS70000652F-page 91
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
6.3
POR
6.4
A POR circuit ensures the device is reset from poweron. The POR circuit is active until VDD crosses the
VPOR threshold and the delay, TPOR, has elapsed. The
delay, TPOR, ensures that the internal device bias
circuits become stable.
The device supply voltage characteristics must meet
the specified starting voltage and rise rate requirements to generate the POR. Refer to Section 26.0
“Electrical Characteristics” for details.
The Power-on Reset (POR) status bit in the Reset Control (RCON<0>) register is set to indicate the Power-on
Reset.
BOR and PWRT
The on-chip regulator has a BOR circuit that resets the
device when the VDD is too low (VDD < VBOR) for proper
device operation. The BOR circuit keeps the device in
Reset until VDD crosses the VBOR threshold and the
delay, TBOR, has elapsed. The delay, TBOR, ensures
the voltage regulator output becomes stable.
The Brown-out Reset (BOR) status bit in the Reset
Control (RCON<1>) register is set to indicate the
Brown-out Reset.
The device will not run at full speed after a BOR as the
VDD should rise to acceptable levels for full-speed
operation. The Power-up Timer (PWRT) provides powerup time delay (TPWRT) to ensure that the system power
supplies have stabilized at the appropriate levels for
full-speed operation before the SYSRST is released.
Refer to Section 23.0 “Special Features” for further
details.
Figure 6-3 shows the typical brown-out scenarios. The
Reset delay (TBOR + TPWRT) is initiated each time VDD
rises above the VBOR trip point.
FIGURE 6-3:
BROWN-OUT RESET SITUATIONS
VDD
VBOR
TBOR + TPWRT
SYSRST
VDD
VBOR
TBOR + TPWRT
SYSRST
VDD Dips Before PWRT Expires
VDD
VBOR
TBOR + TPWRT
SYSRST
DS70000652F-page 92
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
6.5
External Reset (EXTR)
The External Reset is generated by driving the MCLR
pin low. The MCLR pin is a Schmitt trigger input with an
additional glitch filter. Reset pulses that are longer than
the minimum pulse width will generate a Reset. Refer
to Section 26.0 “Electrical Characteristics” for
minimum pulse-width specifications. The External
Reset pin (MCLR) bit (EXTR) in the Reset Control
(RCON) register is set to indicate the MCLR Reset.
6.5.1
EXTERNAL SUPERVISORY
CIRCUIT
Many systems have external supervisory circuits that
generate Reset signals to reset multiple devices in the
system. This External Reset signal can be directly
connected to the MCLR pin to reset the device when
the rest of the system is reset.
6.5.2
INTERNAL SUPERVISORY CIRCUIT
When using the internal power supervisory circuit to
reset the device, the External Reset pin (MCLR) should
be tied directly or resistively to VDD. In this case, the
MCLR pin will not be used to generate a Reset. The
External Reset pin (MCLR) does not have an internal
pull-up and must not be left unconnected.
6.6
Software RESET Instruction (SWR)
Whenever the RESET instruction is executed, the device
will assert SYSRST, placing the device in a special
Reset state. This Reset state will not re-initialize the
clock. The clock source in effect prior to the RESET
instruction will remain as the source. SYSRST is
released at the next instruction cycle and the Reset
vector fetch will commence.
The Software RESET (Instruction) Flag (SWR) bit in the
Reset Control (RCON<6>) register is set to indicate the
Software Reset.
6.7
Watchdog Timer Time-out Reset
(WDTO)
6.8
Trap Conflict Reset
If a lower priority hard trap occurs while a higher priority
trap is being processed, a hard Trap Conflict Reset
occurs. The hard traps include exceptions of Priority
Level 13 through Level 15, inclusive. The address error
(Level 13) and oscillator error (Level 14) traps fall into
this category.
The Trap Reset Flag (TRAPR) bit in the Reset Control
(RCON<15>) register is set to indicate the Trap Conflict
Reset. Refer to Section 7.0 “Interrupt Controller” for
more information on Trap Conflict Resets.
6.9
Configuration Mismatch Reset
To maintain the integrity of the Peripheral Pin Select
Control registers, they are constantly monitored with
shadow registers in hardware. If an unexpected
change in any of the registers occurs (such as cell
disturbances caused by ESD or other external events),
a Configuration Mismatch Reset occurs.
The Configuration Mismatch Flag (CM) bit in the Reset
Control (RCON<9>) register is set to indicate the
Configuration Mismatch Reset. Refer to Section 10.0
“I/O Ports” for more information on the Configuration
Mismatch Reset.
Note:
6.10
The Configuration Mismatch feature and
associated Reset flag is not available on
all devices.
Illegal Condition Device Reset
An Illegal Condition Device Reset occurs due to the
following sources:
• Illegal Opcode Reset
• Uninitialized W Register Reset
• Security Reset
The Illegal Opcode or Uninitialized W Access Reset
Flag (IOPUWR) bit in the Reset Control (RCON<14>)
register is set to indicate the Illegal Condition Device
Reset.
Whenever a Watchdog Timer Time-out Reset occurs,
the device will asynchronously assert SYSRST. The
clock source will remain unchanged. A WDT time-out
during Sleep or Idle mode will wake-up the processor,
but will not reset the processor.
6.10.1
The Watchdog Timer Time-out Flag (WDTO) bit in the
Reset Control (RCON<4>) register is set to indicate the
Watchdog Timer Reset. Refer to Section 23.4
“Watchdog Timer (WDT)” for more information on the
Watchdog Timer Reset.
The Illegal Opcode Reset function can prevent the
device from executing program memory sections that
are used to store constant data. To take advantage of
the Illegal Opcode Reset, use only the lower 16 bits of
each program memory section to store the data values.
The upper 8 bits should be programmed with 0x3F,
which is an illegal opcode value.
 2011-2014 Microchip Technology Inc.
ILLEGAL OPCODE RESET
A device Reset is generated if the device attempts to
execute an illegal opcode value that is fetched from
program memory.
DS70000652F-page 93
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
6.10.2
UNINITIALIZED W REGISTER
RESET
6.11
Any attempts to use the Uninitialized W register as an
Address Pointer will reset the device. The W register
array (with the exception of W15) is cleared during all
Resets and is considered uninitialized until written to.
6.10.3
The user application can read the Reset Control
(RCON) register after any device Reset to determine
the cause of the Reset.
Note:
SECURITY RESET
If a Program Flow Change (PFC) or Vector Flow
Change (VFC) targets a restricted location in a
protected segment (Boot and Secure Segment), that
operation will cause a Security Reset.
Using the RCON Status Bits
The status bits in the RCON register
should be cleared after they are read so
that the next RCON register value after a
device Reset will be meaningful.
Table 6-3 provides a summary of Reset flag bit
operation.
The PFC occurs when the Program Counter is
reloaded as a result of a Call, Jump, Computed Jump,
Return, Return from Subroutine or other form of branch
instruction.
The VFC occurs when the Program Counter is
reloaded with an interrupt or trap vector.
TABLE 6-3:
RESET FLAG BIT OPERATION
Flag Bit
Set by:
Cleared by:
TRAPR (RCON<15>)
Trap conflict event
POR, BOR
IOPWR (RCON<14>)
Illegal opcode or uninitialized
W register access or Security Reset
POR, BOR
Configuration Mismatch
POR, BOR
CM (RCON<9>)
EXTR (RCON<7>)
MCLR Reset
SWR (RCON<6>)
RESET instruction
WDTO (RCON<4>)
WDT Time-out
SLEEP (RCON<3>)
POR
POR, BOR
PWRSAV instruction,
CLRWDT instruction, POR, BOR
PWRSAV #SLEEP instruction
POR, BOR
IDLE (RCON<2>)
PWRSAV #IDLE instruction
POR, BOR
BOR (RCON<1>)
POR, BOR
—
POR (RCON<0>)
POR
—
Note:
All Reset flag bits can be set or cleared by user software.
DS70000652F-page 94
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
7.0
INTERRUPT CONTROLLER
Note 1: This data sheet summarizes the features of
the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 family
devices. It is not intended to be a comprehensive reference source. To complement
the information in this data sheet, refer to
“Interrupts (Part IV)” (DS70300) in the
“dsPIC33/PIC24 Family Reference Manual”, which is available on the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The interrupt controller reduces the numerous peripheral interrupt request signals to a single interrupt
request signal to the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104 family CPU. It
has the following features:
•
•
•
•
Up to eight processor exceptions and software traps
Seven user-selectable priority levels
Interrupt Vector Table (IVT) with up to 118 vectors
A unique vector for each interrupt or exception
source
• Fixed priority within a specified user priority level
• Alternate Interrupt Vector Table (AIVT) for debug
support
• Fixed interrupt entry and return latencies
7.1
Interrupt Vector Table
The Interrupt Vector Table (IVT) is shown in Figure 7-1.
The IVT resides in program memory, starting at location,
000004h. The IVT contains 126 vectors consisting of
eight non-maskable trap vectors, plus up to 118 sources
of interrupt. In general, each interrupt source has its own
vector. Each interrupt vector contains a 24-bit-wide
address. The value programmed into each interrupt
vector location is the starting address of the associated
Interrupt Service Routine (ISR).
 2011-2014 Microchip Technology Inc.
Interrupt vectors are prioritized in terms of their natural
priority. This priority is linked to their position in the
vector table. Lower addresses generally have a higher
natural priority. For example, the interrupt associated
with Vector 0 will take priority over interrupts at any
other vector address.
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices implement up to 26 unique
interrupts and 4 nonmaskable traps. These are
summarized in Table 7-1 and Table 7-2.
7.1.1
ALTERNATE INTERRUPT VECTOR
TABLE
The Alternate Interrupt Vector Table (AIVT) is located
after the IVT, as shown in Figure 7-1. Access to the AIVT
is provided by the ALTIVT control bit (INTCON2<15>). If
the ALTIVT bit is set, all interrupt and exception
processes use the alternate vectors instead of the
default vectors. The alternate vectors are organized in
the same manner as the default vectors.
The AIVT supports debugging by providing a way to
switch between an application and a support environment without requiring the interrupt vectors to be
reprogrammed. This feature also enables switching
between applications to facilitate evaluation of different
software algorithms at run time. If the AIVT is not
needed, the AIVT should be programmed with the
same addresses used in the IVT.
7.2
Reset Sequence
A device Reset is not a true exception because the interrupt controller is not involved in the Reset process. The
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices clear their registers in
response to a Reset, forcing the PC to zero. The Digital
Signal Controller then begins program execution at
location, 0x000000. A GOTO instruction at the Reset
address can redirect program execution to the
appropriate start-up routine.
Note:
Any unimplemented or unused vector
locations in the IVT and AIVT should be
programmed with the address of a default
interrupt handler routine that contains a
RESET instruction.
DS70000652F-page 95
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 7-1:
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
INTERRUPT VECTOR TABLE
Decreasing Natural Order Priority
Reset – GOTO Instruction
Reset – GOTO Address
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved
Reserved
Reserved
Interrupt Vector 0
Interrupt Vector 1
~
~
~
Interrupt Vector 52
Interrupt Vector 53
Interrupt Vector 54
~
~
~
Interrupt Vector 116
Interrupt Vector 117
Reserved
Reserved
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved
Reserved
Reserved
Interrupt Vector 0
Interrupt Vector 1
~
~
~
Interrupt Vector 52
Interrupt Vector 53
Interrupt Vector 54
~
~
~
Interrupt Vector 116
Interrupt Vector 117
Start of Code
Note 1:
0x000000
0x000002
0x000004
0x000014
0x00007C
0x00007E
0x000080
Interrupt Vector Table (IVT)(1)
0x0000FC
0x0000FE
0x000100
0x000102
0x000114
Alternate Interrupt Vector Table (AIVT)(1)
0x00017C
0x00017E
0x000180
0x0001FE
0x000200
See Table 7-1 for the list of implemented interrupt vectors.
DS70000652F-page 96
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 7-1:
INTERRUPT VECTORS
Interrupt
Vector
Request (IRQ)
Number
Number
IVT Address
AIVT Address
Interrupt Source
8
0
0x000014
0x000114
INT0 – External Interrupt 0
9
1
0x000016
0x000116
IC1 – Input Capture 1
10
2
0x000018
0x000118
OC1 – Output Compare 1
11
3
0x00001A
0x00011A
T1 – Timer1
12
4
0x00001C
0x00011C
Reserved
13
5
0x00001E
0x00011E
IC2 – Input Capture 2
14
6
0x000020
0x000120
OC2 – Output Compare 2
15
7
0x000022
0x000122
T2 – Timer2
16
8
0x000024
0x000124
T3 – Timer3
17
9
0x000026
0x000126
SPI1E – SPI1 Error
18
10
0x000028
0x000128
SPI1 – SPI1 Transfer Done
19
11
0x00002A
0x00012A
U1RX – UART1 Receiver
20
12
0x00002C
0x00012C
U1TX – UART1 Transmitter
21
13
0x00002E
0x00012E
ADC1 – ADC1
22-23
14-15
24
16
0x000030-0x000032 0x000130-0x000132 Reserved
0x000034
0x000134
SI2C1 – I2C1 Slave Events
25
17
0x000036
0x000136
MI2C1 – I2C1 Master Events
26
18
0x000038
0x000138
CMP – Comparator Interrupt
27
19
0x00003A
0x00013A
Change Notification Interrupt
28
20
0x00003C
0x00013C
INT1 – External Interrupt 1
29-34
21-26
35
27
0x00004A
0x00014A
T4 – Timer4(2)
36
28
0x00004C
0x00014C
T5 – Timer5(2)
37
29
0x00004E
0x00014E
INT2 – External Interrupt 2
38-44
30-36
45
37
46-64
38-56
65
57
66-69
58-61
70
62
0x000090
0x000190
RTCC – Real-Time Clock and Calendar
71
63
0x000092
0x000192
FLTA1 – PWM1 Fault A(1)
72
64
0x000094
0x000194
FLTB1 – PWM1 Fault B(3)
73
65
0x000096
0x000196
U1E – UART1 Error
74-84
66-76
85
77
86-125
Note 1:
2:
3:
78-117
0x00003E-0x000038 0x00013E-0x000138 Reserved
0x000050-0x00005C 0x000150-0x00015C Reserved
0x00005E
0x00015E
IC3 – Input Capture 3
0x000060-0x000084 0x000160-0x000184 Reserved
0x000086
0x000186
PWM1 – PWM1 Period Match(1)
0x000088-0x00008E 0x000188-0x00018E Reserved
0x000098-0x0000AC 0x000198-0x0001AC Reserved
0x0000AE
0x0001AE
CTMU – Charge Time Measurement Unit
0x0000B0-0x0000FE 0x0001B0-0x0001FE Reserved
This interrupt vector is available in dsPIC33FJ(16/32)MC10X devices only.
This interrupt vector is available in dsPIC33FJ32(GP/MC)10X devices only.
This interrupt vector is available in dsPIC33FJ(16/32)MC102/104 devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 97
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 7-2:
TRAP VECTORS
Vector Number
7.3
IVT Address
0x000004
0x000104
Reserved
1
0x000006
0x000106
Oscillator Failure
2
0x000008
0x000108
Address Error
3
0x00000A
0x00010A
Stack Error
4
0x00000C
0x00010C
Math Error
5
0x00000E
0x00010E
Reserved
6
0x000010
0x000110
Reserved
7
0x000012
0x000112
Reserved
Interrupt Control and Status
Registers
INTCON1
INTCON2
IFSx
IECx
IPCx
INTTREG
7.3.1
INTCON1 AND INTCON2
Global interrupt functions are controlled from INTCON1
and INTCON2. INTCON1 contains the Interrupt Nesting Disable (NSTDIS) bit as well as the control and
status flags for the processor trap sources. The
INTCON2 register controls the external interrupt
request signal behavior and the use of the Alternate
Interrupt Vector Table.
7.3.2
IFSx Registers
The IFSx registers maintain all of the interrupt request
flags. Each source of interrupt has a status bit, which is
set by the respective peripherals or external signal and
is cleared via software.
7.3.3
Trap Source
0
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices implement
a total of 26 registers for the interrupt controller:
•
•
•
•
•
•
AIVT Address
IECx Registers
The IECx registers maintain all of the interrupt enable
bits. These control bits are used to individually enable
interrupts from the peripherals or external signals.
7.3.4
IPCx Registers
The IPCx registers are used to set the Interrupt Priority
Level (IPL) for each source of interrupt. Each user
interrupt source can be assigned to one of eight priority
levels.
7.3.5
INTTREG
The INTTREG register contains the associated
interrupt vector number and the new CPU Interrupt
Priority Level, which are latched into Vector Number
(VECNUM<6:0>) and Interrupt Level (ILR<3:0>) bit
fields in the INTTREG register. The new Interrupt
Priority Level is the priority of the pending interrupt.
The interrupt sources are assigned to the IFSx, IECx
and IPCx registers in the same sequence that they are
listed in Table 7-1. For example, the INT0 (External
Interrupt 0) is shown as having Vector Number 8 and a
natural order priority of 0. Thus, the INT0IF bit is found
in IFS0<0>, the INT0IE bit in IEC0<0> and the INT0IPx
bits in the first positions of IPC0 (IPC0<2:0>).
7.3.6
STATUS/CONTROL REGISTERS
Although they are not specifically part of the interrupt
control hardware, two of the CPU Control registers
contain bits that control interrupt functionality.
• The CPU STATUS Register, SR, contains the
IPL<2:0> bits (SR<7:5>). These bits indicate the
current CPU Interrupt Priority Level. The user
application can change the current CPU Interrupt
Priority Level by writing to the IPLx bits.
• The CORCON register contains the IPL3 bit
which, together with IPL<2:0>, also indicates the
current CPU Interrupt Priority Level. IPL3 is a
read-only bit so that trap events cannot be
masked by the user software.
All Interrupt registers are described in Register 7-1
through Register 7-28 on the following pages.
DS70000652F-page 98
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
SR: CPU STATUS REGISTER(1)
REGISTER 7-1:
R-0
R-0
R/C-0
R/C-0
R-0
R/C-0
R-0
R/W-0
OA
OB
SA
SB
OAB
SAB
DA
DC
bit 15
bit 8
R/W-0(3)
IPL2
R/W-0(3)
(2)
IPL1
(2)
R/W-0(3)
R-0
R/W-0
R/W-0
R/W-0
R/W-0
IPL0(2)
RA
N
OV
Z
C
bit 7
bit 0
Legend:
C = Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
IPL<2:0>: CPU Interrupt Priority Level Status bits(2,3)
111 = CPU Interrupt Priority Level is 7 (15); user interrupts are disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 7-5
Note 1:
2:
3:
For complete register details, see Register 3-1.
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1.
REGISTER 7-2:
CORCON: CORE CONTROL REGISTER(1)
U-0
U-0
U-0
R/W-0
R/W-0
R-0
R-0
R-0
—
—
—
US
EDT
DL2
DL1
DL0
bit 15
bit 8
R/W-0
R/W-0
SATA
SATB
R/W-1
SATDW
R/W-0
ACCSAT
R/C-0
(2)
IPL3
R/W-0
R/W-0
R/W-0
PSV
RND
IF
bit 7
bit 0
Legend:
C = Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 3
Note 1:
2:
x = Bit is unknown
IPL3: CPU Interrupt Priority Level Status bit 3(2)
1 = CPU Interrupt Priority Level is greater than 7
0 = CPU Interrupt Priority Level is 7 or less
For complete register details, see Register 3-2.
The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 99
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-3:
INTCON1: INTERRUPT CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
NSTDIS
OVAERR
OVBERR
COVAERR
COVBERR
OVATE
OVBTE
COVTE
bit 15
bit 8
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
SFTACERR
DIV0ERR
—
MATHERR
ADDRERR
STKERR
OSCFAIL
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
NSTDIS: Interrupt Nesting Disable bit
1 = Interrupt nesting is disabled
0 = Interrupt nesting is enabled
bit 14
OVAERR: Accumulator A Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator A
0 = Trap was not caused by overflow of Accumulator A
bit 13
OVBERR: Accumulator B Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator B
0 = Trap was not caused by overflow of Accumulator B
bit 12
COVAERR: Accumulator A Catastrophic Overflow Trap Flag bit
1 = Trap was caused by catastrophic overflow of Accumulator A
0 = Trap was not caused by catastrophic overflow of Accumulator A
bit 11
COVBERR: Accumulator B Catastrophic Overflow Trap Flag bit
1 = Trap was caused by catastrophic overflow of Accumulator B
0 = Trap was not caused by catastrophic overflow of Accumulator B
bit 10
OVATE: Accumulator A Overflow Trap Enable bit
1 = Trap overflow of Accumulator A
0 = Trap is disabled
bit 9
OVBTE: Accumulator B Overflow Trap Enable bit
1 = Trap overflow of Accumulator B
0 = Trap is disabled
bit 8
COVTE: Catastrophic Overflow Trap Enable bit
1 = Trap on catastrophic overflow of Accumulator A or B is enabled
0 = Trap is disabled
bit 7
SFTACERR: Shift Accumulator Error Status bit
1 = Math error trap was caused by an invalid accumulator shift
0 = Math error trap was not caused by an invalid accumulator shift
bit 6
DIV0ERR: Arithmetic Error Status bit
1 = Math error trap was caused by a divide-by-zero
0 = Math error trap was not caused by a divide-by-zero
bit 5
Unimplemented: Read as ‘0’
bit 4
MATHERR: Arithmetic Error Status bit
1 = Math error trap has occurred
0 = Math error trap has not occurred
DS70000652F-page 100
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-3:
INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED)
bit 3
ADDRERR: Address Error Trap Status bit
1 = Address error trap has occurred
0 = Address error trap has not occurred
bit 2
STKERR: Stack Error Trap Status bit
1 = Stack error trap has occurred
0 = Stack error trap has not occurred
bit 1
OSCFAIL: Oscillator Failure Trap Status bit
1 = Oscillator failure trap has occurred
0 = Oscillator failure trap has not occurred
bit 0
Unimplemented: Read as ‘0’
 2011-2014 Microchip Technology Inc.
DS70000652F-page 101
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-4:
INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-0
R-0
U-0
U-0
U-0
U-0
U-0
U-0
ALTIVT
DISI
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
INT2EP
INT1EP
INT0EP
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
ALTIVT: Enable Alternate Interrupt Vector Table bit
1 = Uses Alternate Interrupt Vector Table
0 = Uses standard Interrupt Vector Table (default)
bit 14
DISI: DISI Instruction Status bit
1 = DISI instruction is active
0 = DISI instruction is not active
bit 13-3
Unimplemented: Read as ‘0’
bit 2
INT2EP: External Interrupt 2 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 1
INT1EP: External Interrupt 1 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 0
INT0EP: External Interrupt 0 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
DS70000652F-page 102
x = Bit is unknown
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-5:
IFS0: INTERRUPT FLAG STATUS REGISTER 0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
AD1IF
U1TXIF
U1RXIF
SPI1IF
SPI1EIF
T3IF
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
T2IF
OC2IF
IC2IF
—
T1IF
OC1IF
IC1IF
INT0IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12
U1TXIF: UART1 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11
U1RXIF: UART1 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10
SPI1IF: SPI1 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9
SPI1EIF: SPI1 Fault Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8
T3IF: Timer3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7
T2IF: Timer2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
OC2IF: Output Compare Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
IC2IF: Input Capture Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4
Unimplemented: Read as ‘0’
bit 3
T1IF: Timer1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 103
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-5:
IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED)
bit 2
OC1IF: Output Compare Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1
IC1IF: Input Capture Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
INT0IF: External Interrupt 0 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
DS70000652F-page 104
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-6:
IFS1: INTERRUPT FLAG STATUS REGISTER 1
U-0
U-0
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
—
—
INT2IF
T5IF(1)
T4IF(1)
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
INT1IF
CNIF
CMIF
MI2C1IF
SI2C1IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
INT2IF: External Interrupt 2 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12
T5IF: Timer5 Interrupt Flag Status bit(1)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11
T4IF: Timer4 Interrupt Flag Status bit(1)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10-5
Unimplemented: Read as ‘0’
bit 4
INT1IF: External Interrupt 1 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3
CNIF: Input Change Notification Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2
CMIF: Comparator Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1
MI2C1IF: I2C1 Master Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
Note 1:
x = Bit is unknown
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 105
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-7:
IFS2: INTERRUPT FLAG STATUS REGISTER 2
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
IC3IF
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-6
Unimplemented: Read as ‘0’
bit 5
IC3IF: Input Capture Channel 3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4-0
Unimplemented: Read as ‘0’
REGISTER 7-8:
x = Bit is unknown
IFS3: INTERRUPT FLAG STATUS REGISTER 3
R/W-0
R/W-0
U-0
U-0
U-0
U-0
R/W-0
U-0
FLTA1IF(1)
RTCIF
—
—
—
—
PWM1IF(1)
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
FLTA1IF: PWM1 Fault A Interrupt Flag Status bit(1)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 14
RTCIF: RTCC Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13-10
Unimplemented: Read as ‘0’
bit 9
PWM1IF: PWM1 Interrupt Flag Status bit(1)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8-0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
These bits are available in dsPIC(16/32)MC10X devices only.
DS70000652F-page 106
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-9:
IFS4: INTERRUPT FLAG STATUS REGISTER 4
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
CTMUIF
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
U1EIF
FLTB1IF(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
CTMUIF: CTMU Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12-2
Unimplemented: Read as ‘0’
bit 1
U1EIF: UART1 Error Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
FLTB1IF: PWM1 Fault B Interrupt Flag Status bit(1)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
Note 1:
x = Bit is unknown
This bit is available in dsPIC(16/32)MC102/104 devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 107
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-10:
IEC0: INTERRUPT ENABLE CONTROL REGISTER 0
U-0
—
bit 15
U-0
—
R/W-0
AD1IE
R/W-0
U1TXIE
R/W-0
U1RXIE
R/W-0
SPI1IE
R/W-0
SPI1EIE
R/W-0
T3IE
bit 8
R/W-0
T2IE
bit 7
R/W-0
OC2IE
R/W-0
IC2IE
U-0
—
R/W-0
T1IE
R/W-0
OC1IE
R/W-0
IC1IE
R/W-0
INT0IE
bit 0
Legend:
R = Readable bit
-n = Value at POR
bit 15-14
bit 13
bit 12
bit 11
bit 10
bit 9
bit 8
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
x = Bit is unknown
Unimplemented: Read as ‘0’
AD1IE: ADC1 Conversion Complete Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
U1TXIE: UART1 Transmitter Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
U1RXIE: UART1 Receiver Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
SPI1IE: SPI1 Event Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
SPI1EIE: SPI1 Error Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
T3IE: Timer3 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
T2IE: Timer2 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
OC2IE: Output Compare Channel 2 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
IC2IE: Input Capture Channel 2 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
Unimplemented: Read as ‘0’
T1IE: Timer1 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
OC1IE: Output Compare Channel 1 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
IC1IE: Input Capture Channel 1 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
INT0IE: External Interrupt 0 Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
DS70000652F-page 108
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-11:
U-0
IEC1: INTERRUPT ENABLE CONTROL REGISTER 1
U-0
—
—
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
INT2IE
T5IE(1)
T4IE(1)
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
INT1IE
CNIE
CMIE
MI2C1IE
SI2C1IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
INT2IE: External Interrupt 2 Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 12
T5IE: Timer5 Interrupt Enable bit(1)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11
T4IE: Timer4 Interrupt Enable bit(1)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10-5
Unimplemented: Read as ‘0’
bit 4
INT1IE: External Interrupt 1 Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 3
CNIE: Input Change Notification Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 2
CMIE: Comparator Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 1
MI2C1IE: I2C1 Master Events Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 0
SI2C1IE: I2C1 Slave Events Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
Note 1:
x = Bit is unknown
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 109
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-12:
IEC2: INTERRUPT ENABLE CONTROL REGISTER 2
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
IC3IE
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-6
Unimplemented: Read as ‘0’
bit 5
IC3IE: Input Capture Channel 3 Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 4-0
Unimplemented: Read as ‘0’
REGISTER 7-13:
R/W-0
IEC3: INTERRUPT ENABLE CONTROL REGISTER 3
R/W-0
(1)
RTCIE
FLTA1IE
x = Bit is unknown
U-0
—
U-0
U-0
—
—
U-0
R/W-0
U-0
—
PWM1IE(1)
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
FLTA1IE: PWM1 Fault A Interrupt Enable bit(1)
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 14
RTCIE: RTCC Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 13-10
Unimplemented: Read as ‘0’
bit 9
PWM1IE: PWM1 Interrupt Enable bit(1)
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 8-0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
These bits are available in dsPIC(16/32)MC10X devices only.
DS70000652F-page 110
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-14:
IEC4: INTERRUPT ENABLE CONTROL REGISTER 4
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
CTMUIE
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
U1EIE
FLTB1IE(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
CTMUIE: CTMU Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 12-2
Unimplemented: Read as ‘0’
bit 1
U1EIE: UART1 Error Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 0
FLTB1IE: PWM1 Fault B Interrupt Enable bit(1)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
Note 1:
x = Bit is unknown
This bit is available in dsPIC(16/32)MC102/104 devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 111
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-15:
IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0
U-0
R/W-1
R/W-0
R/W-0
U-0
R/W-1
R/W-0
R/W-0
—
T1IP2
T1IP1
T1IP0
—
OC1IP2
OC1IP1
OC1IP0
bit 15
bit 8
U-0
R/W-1
R/W-0
R/W-0
U-0
R/W-1
R/W-0
R/W-0
—
IC1IP2
IC1IP1
IC1IP0
—
INT0IP2
INT0IP1
INT0IP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T1IP<2:0>: Timer1 Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
INT0IP<2:0>: External Interrupt 0 Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
DS70000652F-page 112
x = Bit is unknown
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-16:
IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1
U-0
R/W-1
R/W-0
R/W-0
U-0
R/W-1
R/W-0
R/W-0
—
T2IP2
T2IP1
T2IP0
—
OC2IP2
OC2IP1
OC2IP0
bit 15
bit 8
U-0
R/W-1
R/W-0
R/W-0
U-0
U-0
U-0
U-0
—
IC2IP2
IC2IP1
IC2IP0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T2IP<2:0>: Timer2 Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3-0
Unimplemented: Read as ‘0’
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 113
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-17:
IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2
U-0
R/W-1
R/W-0
R/W-0
U-0
R/W-1
R/W-0
R/W-0
—
U1RXIP2
U1RXIP1
U1RXIP0
—
SPI1IP2
SPI1IP1
SPI1IP0
bit 15
bit 8
U-0
R/W-1
R/W-0
R/W-0
U-0
R/W-1
R/W-0
R/W-0
—
SPI1EIP2
SPI1EIP1
SPI1EIP0
—
T3IP2
T3IP1
T3IP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
SPI1IP<2:0>: SPI1 Event Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
T3IP<2:0>: Timer3 Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
DS70000652F-page 114
x = Bit is unknown
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-18:
IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
R/W-0
R/W-0
U-0
R/W-1
R/W-0
R/W-0
—
AD1IP2
AD1IP1
AD1IP0
—
U1TXIP2
U1TXIP1
U1TXIP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 115
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-19:
IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4
U-0
R/W-1
R/W-0
R/W-0
U-0
R/W-1
R/W-0
R/W-0
—
CNIP2
CNIP1
CNIP0
—
CMIP2
CMIP1
CMIP0
bit 15
bit 8
U-0
R/W-1
R/W-0
R/W-0
U-0
R/W-1
R/W-0
R/W-0
—
MI2C1IP2
MI2C1IP1
MI2C1IP0
—
SI2C1IP2
SI2C1IP1
SI2C1IP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
CNIP<2:0>: Change Notification Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
CMIP<2:0>: Comparator Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
DS70000652F-page 116
x = Bit is unknown
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-20:
IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
R/W-1
R/W-0
R/W-0
—
—
—
—
—
INT1IP2
INT1IP1
INT1IP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-3
Unimplemented: Read as ‘0’
bit 2-0
INT1IP<2:0>: External Interrupt 1 Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
REGISTER 7-21:
x = Bit is unknown
IPC6: INTERRUPT PRIORITY CONTROL REGISTER 6
U-0
R/W-1
R/W-0
R/W-0
U-0
U-0
U-0
U-0
—
T4IP2(1)
T4IP1(1)
T4IP0(1)
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T4IP<2:0>: Timer4 Interrupt Priority bits(1)
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 11-0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 117
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-22:
IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
INT2IP2
R/W-0
INT2IP1
R/W-0
INT2IP0
U-0
R/W-1
R/W-0
R/W-0
—
T5IP2(1)
T5IP1(1)
T5IP0(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
INT2IP<2:0>: External Interrupt 2 Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
T5IP<2:0>: Timer5 Interrupt Priority bits(1)
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
Note 1:
x = Bit is unknown
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
DS70000652F-page 118
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-23:
IPC9: INTERRUPT PRIORITY CONTROL REGISTER 9
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
R/W-0
R/W-0
U-0
U-0
U-0
U-0
—
IC3IP2
IC3IP1
IC3IP0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
IC3IP<2:0>: External Interrupt 3 Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3-0
Unimplemented: Read as ‘0’
REGISTER 7-24:
x = Bit is unknown
IPC14: INTERRUPT PRIORITY CONTROL REGISTER 14
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
PWM1IP2(1)
R/W-0
R/W-0
PWM1IP1(1) PWM1IP0(1)
U-0
U-0
U-0
U-0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
PWM1IP<2:0>: PWM1 Interrupt Priority bits(1)
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3-0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
These bits are available in dsPIC(16/32)MC10X devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 119
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-25:
U-0
—
IPC15: INTERRUPT PRIORITY CONTROL REGISTER 15
R/W-1
FLTA1IP2
R/W-0
(1)
FLTA1IP1
R/W-0
(1)
FLTA1IP0
(1)
U-0
R/W-1
R/W-0
R/W-0
—
RTCIP2
RTCIP1
RTCIP0
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
FLTA1IP<2:0>: PWM1 Fault A Interrupt Priority bits(1)
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
RTCIP<2:0>: RTCC Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 7-0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
These bits are available in dsPIC(16/32)MC10X devices only.
DS70000652F-page 120
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-26:
IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
U1EIP2
R/W-0
U1EIP1
R/W-0
U1EIP0
U-0
R/W-0
R/W-0
R/W-0
—
FLTB1IP2(1)
FLTB1IP1(1)
FLTB1IP0(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
U1EIP<2:0>: UART1 Error Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
FLTB1IP<2:0>: PWM1 Fault B Interrupt Priority bits(1)
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
Note 1:
x = Bit is unknown
These bits are available in dsPIC(16/32)MC102/104 devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 121
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-27:
IPC19: INTERRUPT PRIORITY CONTROL REGISTER 19
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
R/W-0
R/W-0
U-0
U-0
U-0
U-0
—
CTMUIP2
CTMUIP1
CTMUIP0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
CTMUIP<2:0>: CTMU Interrupt Priority bits
111 = Interrupt is Priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is Priority 1
000 = Interrupt source is disabled
bit 3-0
Unimplemented: Read as ‘0’
DS70000652F-page 122
x = Bit is unknown
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 7-28:
INTTREG: INTERRUPT CONTROL AND STATUS REGISTER
U-0
U-0
U-0
U-0
R-0
R-0
R-0
R-0
—
—
—
—
ILR3
ILR2
ILR1
ILR0
bit 15
bit 8
U-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
—
VECNUM6
VECNUM5
VECNUM4
VECNUM3
VECNUM2
VECNUM1
VECNUM0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unimplemented: Read as ‘0’
bit 11-8
ILR<3:0>: New CPU Interrupt Priority Level bits
1111 = CPU Interrupt Priority Level is 15
•
•
•
0001 = CPU Interrupt Priority Level is 1
0000 = CPU Interrupt Priority Level is 0
bit 7
Unimplemented: Read as ‘0’
bit 6-0
VECNUM<6:0>: Vector Number of Pending Interrupt bits
0111111 = Interrupt vector pending is Number 135
•
•
•
0000001 = Interrupt vector pending is Number 9
0000000 = Interrupt vector pending is Number 8
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 123
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
7.4
7.4.3
Interrupt Setup Procedures
7.4.1
INITIALIZATION
To configure an interrupt source at initialization:
1.
2.
Set the NSTDIS bit (INTCON1<15>) if nested
interrupts are not desired.
Select the user-assigned priority level for the
interrupt source by writing the control bits into
the appropriate IPCx register. The priority level
will depend on the specific application and type
of interrupt source. If multiple priority levels are
not desired, the IPCx register control bits for all
enabled interrupt sources can be programmed
to the same non-zero value.
Note:
3.
4.
At a device Reset, the IPCx registers
are initialized such that all user
interrupt sources are assigned to
Interrupt Priority Level 4.
Clear the interrupt flag status bit associated with
the peripheral in the associated IFSx register.
Enable the interrupt source by setting the interrupt enable control bit associated with the
source in the appropriate IECx register.
7.4.2
TRAP SERVICE ROUTINE
A Trap Service Routine (TSR) is coded like an ISR,
except that the appropriate trap status flag in the
INTCON1 register must be cleared to avoid re-entry
into the TSR.
7.4.4
INTERRUPT DISABLE
All user interrupts can be disabled using this
procedure:
1.
2.
Push the current SR value onto the software
stack using the PUSH instruction.
Force the CPU to Priority Level 7 by inclusive
ORing the value OEh with SRL.
To enable user interrupts, the POP instruction can be
used to restore the previous SR value.
Note:
Only user interrupts with a priority level of
7 or lower can be disabled. Trap sources
(Level 8-Level 15) cannot be disabled.
The DISI instruction provides a convenient way to
disable interrupts of Priority Levels 1-6 for a fixed
period of time. Level 7 interrupt sources are not
disabled by the DISI instruction.
INTERRUPT SERVICE ROUTINE
The method used to declare an ISR and initialize
IVT with the correct vector address depends on
programming language (C or assembler), and
language development toolsuite used to develop
application.
the
the
the
the
In general, the user application must clear the interrupt
flag in the appropriate IFSx register for the source of
interrupt that the ISR handles. Otherwise, the program
will re-enter the ISR immediately after exiting the
routine. If the ISR is coded in assembly language, it
must be terminated using a RETFIE instruction to
unstack the saved PC value, SRL value and old CPU
priority level.
DS70000652F-page 124
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
8.0
OSCILLATOR
CONFIGURATION
The oscillator system for dsPIC33FJ16(GP/MC)101/
102 and dsPIC33FJ32(GP/MC)101/102/104 devices
provides:
• External and internal oscillator options as clock
sources
• An on-chip, 4x Phase Lock Loop (PLL) to scale the
internal operating frequency to the required system
clock frequency
• An internal FRC oscillator that can also be used with
the PLL, thereby allowing full-speed operation
without any external clock generation hardware
• Clock switching between various clock sources
• Programmable clock postscaler for system power
savings
• A Fail-Safe Clock Monitor (FSCM) that detects clock
failure and takes fail-safe measures
• An Oscillator Control register (OSCCON)
• Nonvolatile Configuration bits for main oscillator
selection
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To complement the information in this data sheet,
refer to “Oscillator (Part VI)” (DS70644)
in the “dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
A simplified diagram of the oscillator system is shown
in Figure 8-1.
FIGURE 8-1:
OSCILLATOR SYSTEM DIAGRAM
Primary Oscillator (POSC)
MS, HS, EC
R(1)
S3
4x PLL
S1
OSC2
MSPLL, ECPLL,
FRCPLL
DOZE<2:0>
S2
S1/S3
DOZE
OSC1
POSCMD<1:0>
FCY(2)
FP(2)
(To Peripherals)
FRCDIV
FRC
Oscillator
FRCDIVN
S7
÷2
FOSC
FRCDIV<2:0>
TUN<5:0>
÷ 16
FRCDIV16
FRC
LPRC
LPRC
Oscillator
Secondary Oscillator (SOSC)
SOSC
SOSCO
S6
S0
S5
S4
LPOSCEN
SOSCI
Clock Fail
Clock Switch
Reset
S7
NOSC<2:0>
FNOSC<2:0>
WDT, PWRT,
FSCM
Timer 1
Note 1:
2:
If the oscillator is used with MS or HS modes, an extended parallel resistor with the value of 1 M must be connected.
The term, FP, refers to the clock source for all peripherals, while FCY refers to the clock source for the CPU. Throughout this document, FCY and FP are used interchangeably, except in the case of Doze mode. FP and FCY will be different when Doze mode is used
with a Doze ratio of 1:2 or lower.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 125
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
8.1
CPU Clocking System
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices provide
seven system clock options:
•
•
•
•
•
•
•
Fast RC (FRC) Oscillator
FRC Oscillator with 4x PLL
Primary (MS, HS or EC) Oscillator
Primary Oscillator with 4x PLL
Secondary (LP) Oscillator
Low-Power RC (LPRC) Oscillator
FRC Oscillator with postscaler
8.1.1
8.1.1.1
SYSTEM CLOCK SOURCES
Fast RC
The Fast RC (FRC) internal oscillator runs at a nominal
frequency of 7.37 MHz. User software can tune the
FRC frequency. User software can optionally specify a
factor (ranging from 1:2 to 1:256) by which the FRC
clock frequency is divided. This factor is selected using
the FRCDIV<2:0> (CLKDIV<10:8>) bits.
The FRC frequency depends on the FRC accuracy
(see Table 26-18) and the value of the FRC Oscillator
Tuning register (see Register 8-3).
8.1.1.2
Primary
The primary oscillator can use one of the following as
its clock source:
• MS (Crystal): Crystals and ceramic resonators in
the range of 4 MHz to 10 MHz. The crystal is
connected to the OSC1 and OSC2 pins.
• HS (High-Speed Crystal): Crystals in the range of
10 MHz to 32 MHz. The crystal is connected to
the OSC1 and OSC2 pins.
• EC (External Clock): The external clock signal is
directly applied to the OSC1 pin.
8.1.1.3
Secondary
The secondary (LP) oscillator is designed for low power
and uses a 32.768 kHz crystal or ceramic resonator.
The LP oscillator uses the SOSCI and SOSCO pins.
DS70000652F-page 126
8.1.1.4
Low-Power RC
The Low-Power RC (LPRC) internal oscillator runs at a
nominal frequency of 32.768 kHz. It is also used as a
reference clock by the Watchdog Timer (WDT) and
Fail-Safe Clock Monitor (FSCM).
8.1.1.5
PLL
The clock signals generated by the FRC and primary
oscillators can be optionally applied to an on-chip, 4x
Phase Lock Loop (PLL) to provide faster output
frequencies for device operation. PLL configuration is
described in Section 8.1.3 “PLL Configuration”.
8.1.2
SYSTEM CLOCK SELECTION
The oscillator source used at a device Power-on Reset
event is selected using Configuration bit settings. The
Oscillator Configuration bit settings are located in the
Configuration registers in the program memory. (Refer
to Section 23.1 “Configuration Bits” for further
details.) The initial Oscillator Selection Configuration
bits, FNOSC<2:0> (FOSCSEL<2:0>), and the Primary
Oscillator
Mode
Select
Configuration
bits,
POSCMD<1:0> (FOSC<1:0>), select the oscillator
source that is used at a Power-on Reset. The FRC
primary oscillator is the default (unprogrammed)
selection.
The Configuration bits allow users to choose among
12 different clock modes, shown in Table 8-1.
The output of the oscillator (or the output of the PLL if
a PLL mode has been selected) FOSC is divided by 2 to
generate the device instruction clock (FCY) and the
peripheral clock time base (FP). FCY defines the
operating speed of the device, and speeds up to
16 MHz are supported by the dsPIC33FJ16(GP/
MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104
architecture.
Instruction execution speed or device operating
frequency, FCY, is given by:
EQUATION 8-1:
DEVICE OPERATING
FREQUENCY
F OSC
F CY = ------------2
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
8.1.3
PLL CONFIGURATION
EQUATION 8-2:
The primary oscillator and internal FRC oscillator can
optionally use an on-chip, 4x PLL to obtain higher
speeds of operation.
FCY =
MS WITH PLL MODE
EXAMPLE
1
FOSC
=
(8000000 • 4) = 16 MIPS
2
2
For example, suppose an 8 MHz crystal is being used
with the selected oscillator mode of MS with PLL. This
provides a FOSC of 8 MHz * 4 = 32 MHz. The resultant
device operating speed is 32/2 = 16 MIPS.
TABLE 8-1:
CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator
Source
POSCMD<1:0>
FNOSC<2:0>
Fast RC Oscillator with Divide-by-n (FRCDIVN)
Internal
xx
111
1, 2
Fast RC Oscillator with Divide-by-16 (FRCDIV16)
Internal
xx
110
1
Oscillator Mode
Low-Power RC Oscillator (LPRC)
See
Note
Internal
xx
101
1
Secondary
xx
100
1
Primary Oscillator (MS) with PLL (MSPLL)
Primary
01
011
Primary Oscillator (EC) with PLL (ECPLL)
Primary
00
011
Primary Oscillator (HS)
Primary
10
010
Primary Oscillator (MS)
Primary
01
010
Secondary (Timer1) Oscillator (SOSC)
1
Primary Oscillator (EC)
Primary
00
010
1
Fast RC Oscillator (FRC) with Divide-by-n and
PLL (FRCPLL)
Internal
xx
001
1
Fast RC Oscillator (FRC)
Internal
xx
000
1
Note 1:
2:
OSC2 pin function is determined by the OSCIOFNC Configuration bit.
This is the default oscillator mode for an unprogrammed (erased) device.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 127
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
8.2
Oscillator Control Registers
OSCCON: OSCILLATOR CONTROL REGISTER(1)
REGISTER 8-1:
U-0
R-0
R-0
R-0
U-0
R/W-y
R/W-y
R/W-y
—
COSC2
COSC1
COSC0
—
NOSC2(2)
NOSC1(2)
NOSC0(2)
bit 15
bit 8
R/W-0
R/W-0
R-0
U-0
R/C-0
U-0
R/W-0
R/W-0
CLKLOCK
IOLOCK
LOCK
—
CF
—
LPOSCEN
OSWEN
bit 7
bit 0
Legend:
C = Clearable bit
y = Value set from Configuration bits on POR
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
COSC<2:0>: Current Oscillator Selection bits (read-only)
111 = Fast RC Oscillator (FRC) with Divide-by-n
110 = Fast RC Oscillator (FRC) with Divide-by-16
101 = Low-Power RC Oscillator (LPRC)
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator (MS, EC) with PLL
010 = Primary Oscillator (MS, HS, EC)
001 = Fast RC Oscillator (FRC) with Divide-by-n and PLL (FRCPLL)
000 = Fast RC Oscillator (FRC)
bit 11
Unimplemented: Read as ‘0’
bit 10-8
NOSC<2:0>: New Oscillator Selection bits(2)
111 = Fast RC Oscillator (FRC) with Divide-by-n
110 = Fast RC Oscillator (FRC) with Divide-by-16
101 = Low-Power RC Oscillator (LPRC)
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator (MS, EC) with PLL
010 = Primary Oscillator (MS, HS, EC)
001 = Fast RC Oscillator (FRC) with Divide-by-n and PLL (FRCPLL)
000 = Fast RC Oscillator (FRC)
bit 7
CLKLOCK: Clock Lock Enable bit
If Clock Switching is Enabled and FSCM is Disabled (FCKSM<1:0> (FOSC<7:6>) = 0b01):
1 = Clock switching is disabled, system clock source is locked
0 = Clock switching is enabled, system clock source can be modified by clock switching
bit 6
IOLOCK: Peripheral Pin Select Lock bit
1 = Peripheral Pin Select is locked, a write to Peripheral Pin Select registers is not allowed
0 = Peripheral Pin Select is not locked, a write to Peripheral Pin Select registers is allowed
bit 5
LOCK: PLL Lock Status bit (read-only)
1 = Indicates that PLL is in lock or PLL start-up timer is satisfied
0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled
bit 4
Unimplemented: Read as ‘0’
Note 1:
2:
Writes to this register require an unlock sequence. Refer to “Oscillator (Part VI)” (DS70644) in the
“dsPIC33/PIC24 Family Reference Manual” for details.
Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.
This applies to clock switches in either direction. In these instances, the application must switch to FRC
mode as a transitional clock source between the two PLL modes.
DS70000652F-page 128
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 8-1:
OSCCON: OSCILLATOR CONTROL REGISTER(1) (CONTINUED)
bit 3
CF: Clock Fail Detect bit (read/clear by application)
1 = FSCM has detected a clock failure
0 = FSCM has not detected a clock failure
bit 2
Unimplemented: Read as ‘0’
bit 1
LPOSCEN: Secondary (LP) Oscillator Enable bit
1 = Enables secondary oscillator
0 = Disables secondary oscillator
bit 0
OSWEN: Oscillator Switch Enable bit
1 = Requests oscillator switch to selection specified by the NOSC<2:0> bits
0 = Oscillator switch is complete
Note 1:
2:
Writes to this register require an unlock sequence. Refer to “Oscillator (Part VI)” (DS70644) in the
“dsPIC33/PIC24 Family Reference Manual” for details.
Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.
This applies to clock switches in either direction. In these instances, the application must switch to FRC
mode as a transitional clock source between the two PLL modes.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 129
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 8-2:
R/W-0
ROI
CLKDIV: CLOCK DIVISOR REGISTER
R/W-0
(2,3)
DOZE2
R/W-1
DOZE1
(2,3)
R/W-1
(2,3)
DOZE0
R/W-0
(1,2,3)
DOZEN
R/W-0
R/W-0
R/W-0
FRCDIV2
FRCDIV1
FRCDIV0
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ROI: Recover on Interrupt bit
1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1
0 = Interrupts have no effect on the DOZEN bit
bit 14-12
DOZE<2:0>: Processor Clock Reduction Select bits(2,3)
111 = FCY/128
110 = FCY/64
101 = FCY/32
100 = FCY/16
011 = FCY/8 (default)
010 = FCY/4
001 = FCY/2
000 = FCY/1
bit 11
DOZEN: DOZE Mode Enable bit(1,2,3)
1 = DOZE<2:0> bits field specifies the ratio between the peripheral clocks and the processor clocks
0 = Processor clock/peripheral clock ratio is forced to 1:1
bit 10-8
FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits
111 = FRC divide-by-256
110 = FRC divide-by-64
101 = FRC divide-by-32
100 = FRC divide-by-16
011 = FRC divide-by-8
010 = FRC divide-by-4
001 = FRC divide-by-2
000 = FRC divide-by-1 (default)
bit 7-0
Unimplemented: Read as ‘0’
Note 1:
2:
3:
This bit is cleared when the ROI bit is set and an interrupt occurs.
If DOZEN = 1, writes to DOZE<2:0> are ignored.
If DOZE<2:0> = 000, the DOZEN bit cannot be set by the user; writes are ignored.
DS70000652F-page 130
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 8-3:
OSCTUN: FRC OSCILLATOR TUNING REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
TUN<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-6
Unimplemented: Read as ‘0’
bit 5-0
TUN<5:0>: FRC Oscillator Tuning bits
011111 = Maximum frequency deviation of 1.453% (7.477 MHz)
011110 = Center frequency + 1.406% (7.474 MHz)
•
•
•
000001 = Center frequency + 0.047% (7.373 MHz)
000000 = Center frequency (7.37 MHz nominal)
111111 = Center frequency – 0.047% (7.367 MHz)
•
•
•
100001 = Center frequency – 1.453% (7.263 MHz)
100000 = Minimum frequency deviation of -1.5% (7.259 MHz)
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 131
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
8.3
Clock Switching Operation
Applications are free to switch among any of the four
clock sources (Primary, LP, FRC and LPRC) under
software control at any time. To limit the possible side
effects of this flexibility, dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104 devices have
a safeguard lock built into the switch process.
Note:
8.3.1
Primary Oscillator mode has three different
submodes (MS, HS and EC), which are
determined by the POSCMD<1:0> Configuration bits. While an application can
switch to and from Primary Oscillator
mode in software, it cannot switch among
the different primary submodes without
reprogramming the device.
The NOSCx control bits (OSCCON<10:8>) do not control
the clock selection when clock switching is disabled. However, the COSCx bits (OSCCON<14:12>) reflect the clock
source selected by the FNOSCx Configuration bits.
The OSWEN control bit (OSCCON<0>) has no effect
when clock switching is disabled; it is held at ‘0’ at all
times.
OSCILLATOR SWITCHING SEQUENCE
Performing
sequence:
1.
2.
3.
4.
5.
a
clock
switch requires this
1.
The clock switching hardware compares the
COSCx status bits with the new value of the
NOSCx control bits. If they are the same, the
clock switch is a redundant operation. In this
case, the OSWEN bit is cleared automatically
and the clock switch is aborted.
If a valid clock switch has been initiated, the LOCK
and CF (OSCCON<5,3>) status bits are cleared.
The new oscillator is turned on by the hardware
if it is not currently running. If a crystal oscillator
must be turned on, the hardware waits until the
Oscillator Start-up Timer (OST) expires. If the
new source is using the PLL, the hardware waits
until a PLL lock is detected (LOCK = 1).
The hardware waits for 10 clock cycles from the new
clock source and then performs the clock switch.
The hardware clears the OSWEN bit to indicate a
successful clock transition. In addition, the NOSCx
bit values are transferred to the COSCx status bits.
The old clock source is turned off at this time,
with the exception of LPRC (if WDT or FSCM is
enabled) or LP (if LPOSCEN remains set).
2.
3.
4.
ENABLING CLOCK SWITCHING
To enable clock switching, the FCKSM1 Configuration bit
in the FOSC Configuration register must be programmed
to ‘0’. (Refer to Section 23.1 “Configuration Bits” for
further details.) If the FCKSM1 Configuration bit is unprogrammed (‘1’), the clock switching function and Fail-Safe
Clock Monitor function are disabled. This is the default
setting.
8.3.2
Once the basic sequence is completed, the system
clock hardware responds automatically as follows:
basic
If
desired,
read
the
COSC
bits
(OSCCON<14:12>) to determine the current
oscillator source.
Perform the unlock sequence to allow a write to
the OSCCON register high byte.
Write the appropriate value to the NOSCx control bits (OSCCON<10:8>) for the new oscillator
source.
Perform the unlock sequence to allow a write to
the OSCCON register low byte.
Set the OSWEN bit (OSCCON<0>) to initiate
the oscillator switch.
5.
6.
Note 1: The processor continues to execute code
throughout the clock switching sequence.
Timing-sensitive code should not be
executed during this time.
2: Direct clock switches between any Primary Oscillator mode with PLL and
FRCPLL mode are not permitted. This
applies to clock switches in either direction. In these instances, the application
must switch to FRC mode as a transition
clock source between the two PLL modes.
3: Refer to “Oscillator (Part VI)”
(DS70644) in the “dsPIC33/PIC24 Family
Reference Manual” for details.
8.4
Fail-Safe Clock Monitor (FSCM)
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by programming.
If the FSCM function is enabled, the LPRC internal
oscillator runs at all times (except during Sleep mode)
and is not subject to control by the Watchdog Timer.
In the event of an oscillator failure, the FSCM
generates a clock failure trap event and switches the
system clock over to the FRC oscillator. Then, the
application program can either attempt to restart the
oscillator or execute a controlled shutdown. The trap
can be treated as a Warm Reset by simply loading the
Reset address into the oscillator fail trap vector.
If the PLL multiplier is used to scale the system clock,
the internal FRC is also multiplied by the same factor
on clock failure. Essentially, the device switches to
FRC with PLL on a clock failure.
DS70000652F-page 132
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
9.0
POWER-SAVING FEATURES
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Watchdog Timer and
Power-Saving Modes” (DS70196) in the
“dsPIC33/PIC24 Family Reference Manual”, which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices provide
the ability to manage power consumption by selectively
managing clocking to the CPU and the peripherals. In
general, a lower clock frequency and a reduction in the
number of circuits being clocked constitutes lower
consumed power. Devices can manage power
consumption in four different ways:
•
•
•
•
Clock Frequency
Instruction-Based Sleep and Idle modes
Software-Controlled Doze mode
Selective Peripheral Control in Software
Combinations of these methods can be used to selectively tailor an application’s power consumption while
still maintaining critical application features, such as
timing-sensitive communications.
9.1
Clock Frequency and Clock
Switching
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices allow a wide range of clock
frequencies to be selected under application control. If
the system clock configuration is not locked, users can
choose low-power or high-precision oscillators by simply
changing the NOSC<2:0> bits (OSCCON<10:8>). The
process of changing a system clock during operation, as
well as limitations to the process, are discussed in more
detail in Section 8.0 “Oscillator Configuration”.
EXAMPLE 9-1:
9.2
Instruction-Based Power-Saving
Modes
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices have two special powersaving modes that are entered through the execution of
a special PWRSAV instruction. Sleep mode stops clock
operation and halts all code execution. Idle mode halts
the CPU and code execution, but allows peripheral
modules to continue operation. The assembler syntax
of the PWRSAV instruction is shown in Example 9-1.
Note:
SLEEP_MODE and IDLE_MODE are
constants defined in the assembler
include file for the selected device.
Sleep and Idle modes can be exited as a result of an
enabled interrupt, WDT time-out or a device Reset. When
the device exits these modes, it is said to wake-up.
9.2.1
SLEEP MODE
The following occurs in Sleep mode:
• The system clock source is shut down. If an
on-chip oscillator is used, it is turned off.
• The device current consumption is reduced to a
minimum, provided that no I/O pin is sourcing
current
• The Fail-Safe Clock Monitor does not operate,
since the system clock source is disabled
• The LPRC clock continues to run in Sleep mode if
the WDT is enabled
• The WDT, if enabled, is automatically cleared
prior to entering Sleep mode
• Some device features or peripherals may continue
to operate. This includes items such as the Input
Change Notification (ICN) on the I/O ports or
peripherals that use an external clock input.
• Any peripheral that requires the system clock
source for its operation is disabled
The device will wake-up from Sleep mode on any of the
these events:
• Any interrupt source that is individually enabled
• Any form of device Reset
• A WDT time-out
On wake-up from Sleep mode, the processor restarts
with the same clock source that was active when Sleep
mode was entered.
PWRSAV INSTRUCTION SYNTAX
PWRSAV #SLEEP_MODE
PWRSAV #IDLE_MODE
; Put the device into SLEEP mode
; Put the device into IDLE mode
 2011-2014 Microchip Technology Inc.
DS70000652F-page 133
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
9.2.2
IDLE MODE
The following occurs in Idle mode:
• The CPU stops executing instructions.
• The WDT is automatically cleared.
• The system clock source remains active. By
default, all peripheral modules continue to operate
normally from the system clock source, but can
also be selectively disabled (see Section 9.4
“Peripheral Module Disable”).
• If the WDT or FSCM is enabled, the LPRC also
remains active.
The device will wake from Idle mode on any of these
events:
• Any interrupt that is individually enabled
• Any device Reset
• A WDT time-out
On wake-up from Idle mode, the clock is reapplied to
the CPU and instruction execution will begin (2-4 clock
cycles later), starting with the instruction following the
PWRSAV instruction, or the first instruction in the ISR.
9.2.3
INTERRUPTS COINCIDENT WITH
POWER SAVE INSTRUCTIONS
Any interrupt that coincides with the execution of a
PWRSAV instruction is held off until entry into Sleep or
Idle mode has completed. The device then wakes up
from Sleep or Idle mode.
9.3
Doze Mode
The preferred strategies for reducing power consumption
are changing clock speed and invoking one of the powersaving modes. In some circumstances, this may not be
practical. For example, it may be necessary for an
application to maintain uninterrupted synchronous
communication, even while it is doing nothing else.
Reducing system clock speed can introduce
communication errors, while using a power-saving mode
can stop communications completely.
Doze mode is a simple and effective alternative method
to reduce power consumption while the device is still
executing code. In this mode, the system clock
continues to operate from the same source and at the
same speed. Peripheral modules continue to be
clocked at the same speed, while the CPU clock speed
is reduced. Synchronization between the two clock
domains is maintained, allowing the peripherals to
access the SFRs while the CPU executes code at a
slower rate.
DS70000652F-page 134
Doze mode is enabled by setting the DOZEN bit
(CLKDIV<11>). The ratio between peripheral and core
clock speed is determined by the DOZE<2:0> bits
(CLKDIV<14:12>). There are eight possible
configurations, from 1:1 to 1:128, with 1:1 being the
default setting.
Programs can use Doze mode to selectively reduce
power consumption in event-driven applications. This
allows clock-sensitive functions, such as synchronous
communications, to continue without interruption while
the CPU Idles, waiting for something to invoke an
interrupt routine. An automatic return to full-speed CPU
operation on interrupts can be enabled by setting the
ROI bit (CLKDIV<15>). By default, interrupt events
have no effect on Doze mode operation.
For example, suppose the device is operating at
20 MIPS and the UART module has been configured
for 500 kbps based on this device operating speed. If
the device is placed in Doze mode with a clock
frequency ratio of 1:4, the UART module continues to
communicate at the required bit rate of 500 kbps, but
the CPU now starts executing instructions at a
frequency of 5 MIPS.
9.4
Peripheral Module Disable
The Peripheral Module Disable (PMDx) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a peripheral is disabled using the appropriate
PMDx control bit, the peripheral is in a minimum power
consumption state. The control and status registers
associated with the peripheral are also disabled, so
writes to those registers will have no effect and read
values will be invalid.
A peripheral module is enabled only if both the
associated bit in the PMDx register is cleared and the
peripheral is supported by the specific dsPIC® DSC
variant. If the peripheral is present in the device, it is
enabled in the PMDx register by default.
Note:
If a PMDx bit is set, the corresponding
module is disabled after a delay of one
instruction cycle. Similarly, if a PMDx bit is
cleared, the corresponding module is
enabled after a delay of one instruction
cycle (assuming the module control registers are already configured to enable
module operation).
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
9.5
PMD Control Registers
REGISTER 9-1:
PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
U-0
T5MD(1)
T4MD(1)
T3MD
T2MD
T1MD
—
PWM1MD
—
bit 15
bit 8
R/W-0
U-0
R/W-0
U-0
R/W-0
U-0
U-0
R/W-0
I2C1MD
—
U1MD
—
SPI1MD
—
—
AD1MD(2)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
T5MD: Timer5 Module Disable bit(1)
1 = Timer5 module is disabled
0 = Timer5 module is enabled
bit 14
T4MD: Timer4 Module Disable bit(1)
1 = Timer4 module is disabled
0 = Timer4 module is enabled
bit 13
T3MD: Timer3 Module Disable bit
1 = Timer3 module is disabled
0 = Timer3 module is enabled
bit 12
T2MD: Timer2 Module Disable bit
1 = Timer2 module is disabled
0 = Timer2 module is enabled
bit 11
T1MD: Timer1 Module Disable bit
1 = Timer1 module is disabled
0 = Timer1 module is enabled
bit 10
Unimplemented: Read as ‘0’
bit 9
PWM1MD: PWM1 Module Disable bit
1 = PWM1 module is disabled
0 = PWM1 module is enabled
bit 8
Unimplemented: Read as ‘0’
bit 7
I2C1MD: I2C1 Module Disable bit
1 = I2C1 module is disabled
0 = I2C1 module is enabled
bit 6
Unimplemented: Read as ‘0’
bit 5
U1MD: UART1 Module Disable bit
1 = UART1 module is disabled
0 = UART1 module is enabled
bit 4
Unimplemented: Read as ‘0’
Note 1:
2:
x = Bit is unknown
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
PCFGx bits have no effect if the ADC module is disabled by setting this bit. When the bit is set, all port
pins that have been multiplexed with ANx will be in Digital mode.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 135
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 9-1:
PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1 (CONTINUED)
bit 3
SPI1MD: SPI1 Module Disable bit
1 = SPI1 module is disabled
0 = SPI1 module is enabled
bit 2-1
Unimplemented: Read as ‘0’
bit 0
AD1MD: ADC1 Module Disable bit(2)
1 = ADC1 module is disabled
0 = ADC1 module is enabled
Note 1:
2:
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
PCFGx bits have no effect if the ADC module is disabled by setting this bit. When the bit is set, all port
pins that have been multiplexed with ANx will be in Digital mode.
REGISTER 9-2:
PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
IC3MD
IC2MD
IC1MD
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
OC2MD
OC1MD
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-11
Unimplemented: Read as ‘0’
bit 10
IC3MD: Input Capture 3 Module Disable bit
1 = Input Capture 3 module is disabled
0 = Input Capture 3 module is enabled
bit 9
IC2MD: Input Capture 2 Module Disable bit
1 = Input Capture 2 module is disabled
0 = Input Capture 2 module is enabled
bit 8
IC1MD: Input Capture 1 Module Disable bit
1 = Input Capture 1 module is disabled
0 = Input Capture 1 module is enabled
bit 7-2
Unimplemented: Read as ‘0’
bit 1
OC2MD: Output Compare 2 Module Disable bit
1 = Output Compare 2 module is disabled
0 = Output Compare 2 module is enabled
bit 0
OC1MD: Output Compare 1 Module Disable bit
1 = Output Compare 1 module is disabled
0 = Output Compare 1 module is enabled
DS70000652F-page 136
x = Bit is unknown
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 9-3:
PMD3: PERIPHERAL MODULE DISABLE CONTROL REGISTER 3
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
U-0
—
—
—
—
—
CMPMD
RTCCMD
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-11
Unimplemented: Read as ‘0’
bit 10
CMPMD: Comparator Module Disable bit
1 = Comparator module is disabled
0 = Comparator module is enabled
bit 9
RTCCMD: RTCC Module Disable bit
1 = RTCC module is disabled
0 = RTCC module is enabled
bit 8-0
Unimplemented: Read as ‘0’
REGISTER 9-4:
x = Bit is unknown
PMD4: PERIPHERAL MODULE DISABLE CONTROL REGISTER 4
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
R/W-0
U-0
U-0
—
—
—
—
—
CTMUMD
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-3
Unimplemented: Read as ‘0’
bit 2
CTMUMD: CTMU Module Disable bit
1 = CTMU module is disabled
0 = CTMU module is enabled
bit 1-0
Unimplemented: Read as ‘0’
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 137
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 138
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
10.0
I/O PORTS
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To complement the information in this data sheet,
refer to “I/O Ports” (DS70193) in the
“dsPIC33/PIC24 Family Reference Manual”, which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared among the peripherals and the
parallel I/O ports. All I/O input ports feature Schmitt
Trigger inputs for improved noise immunity.
10.1
Parallel I/O (PIO) Ports
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
can be read, but the output driver for the parallel port bit
is disabled. If a peripheral is enabled, but the peripheral
is not actively driving a pin, that pin can be driven by a
port.
All port pins have three registers directly associated
with their operation as digital I/O. The Data Direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a ‘1’, the pin is
an input. All port pins are defined as inputs after a
Reset. Reads from the Output Latch (LATx) register
read the latch. Writes to the Output Latch register write
the latch. Reads from the port (PORTx) read the port
pins, while writes to the port pins write the latch.
Any bit and its associated data and control registers
that is not valid for a particular device will be disabled.
This means the corresponding LATx and TRISx
registers and the port pin will read as zeros.
When a pin is shared with another peripheral or
function that is defined as an input only, it is
nevertheless regarded as a dedicated port because
there is no other competing source of outputs.
Generally a parallel I/O port that shares a pin with a
peripheral is subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pin. The logic also prevents “loop through,” in
which a port’s digital output can drive the input of a
peripheral that shares the same pin. Figure 10-1 shows
how ports are shared with other peripherals and the
associated I/O pin to which they are connected.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 139
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 10-1:
BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE
Peripheral Module
Output Multiplexers
Peripheral Input Data
Peripheral Module Enable
I/O
Peripheral Output Enable
1
Peripheral Output Data
0
PIO Module
Read TRIS
1
Output Enable
Output Data
0
Data Bus
D
WR TRIS
CK
Q
I/O Pin
TRIS Latch
D
WR LAT +
WR PORT
Q
CK
Data Latch
Read LAT
Input Data
Read PORT
DS70000652F-page 140
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
10.1.1
OPEN-DRAIN CONFIGURATION
In addition to the PORTx, LATx and TRISx registers
for data control, some port pins can also be
individually configured for either digital or open-drain
output. This is controlled by the Open-Drain Control
register, ODCx, associated with each port. Setting any
of the bits configures the corresponding pin to act as
an open-drain output.
The open-drain feature allows the generation of
outputs higher than VDD (e.g., 5V) on any desired 5V
tolerant pins by using external pull-up resistors. The
maximum open-drain voltage allowed is the same as
the maximum VIH specification.
See “Pin Diagrams” for the available pins and their
functionality.
10.2
Configuring Analog Port Pins
The AD1PCFGL and TRISx registers control the operation of the Analog-to-Digital port pins. The port pins
that are to function as analog inputs must have their
corresponding TRISx bit set (input). If the TRISx bit is
cleared (output), the digital output level (VOH or VOL)
will be converted.
The AD1PCFGL register has a default value of 0x0000;
therefore, all pins that share ANx functions are analog
(not digital) by default.
When the PORTx register is read, all pins configured as
analog input channels will read as cleared (a low level).
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin defined as a
digital input (including the ANx pins) can cause the
input buffer to consume current that exceeds the
device specifications.
EXAMPLE 10-1:
MOV
MOV
NOP
btss
0xFF00, W0
W0, TRISBB
PORTB, #13
10.2.1
I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP. A demonstration is shown in
Example 10-1.
10.3
Input Change Notification (ICN)
The Input Change Notification function of the I/O
ports allows the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 devices to generate interrupt requests to the processor in response to a
Change-of-State (COS) on selected input pins. This
feature can detect input Change-of-States, even in
Sleep mode, when the clocks are disabled. Depending
on the device pin count, up to 21 external signals (CNx
pin) can be selected (enabled) for generating an
interrupt request on a Change-of-State.
Four control registers are associated with the CN
module. The CNEN1 and CNEN2 registers contain the
interrupt enable control bits for each of the CN input
pins. Setting any of these bits enables a CN interrupt
for the corresponding pins.
Each CN pin also has a weak pull-up connected to it.
The pull-ups act as a current source connected to the
pin and eliminate the need for external resistors when
push button or keypad devices are connected. The
pull-ups are enabled separately using the CNPU1 and
CNPU2 registers, which contain the control bits for
each of the CN pins. Setting any of the control bits
enables the weak pull-ups for the corresponding pins.
Note:
Pull-ups on Input Change Notification pins
should always be disabled when the port
pin is configured as a digital output.
PORT WRITE/READ EXAMPLE
;
;
;
;
 2011-2014 Microchip Technology Inc.
Configure PORTB<15:8> as inputs
and PORTB<7:0> as outputs
Delay 1 cycle
Next Instruction
DS70000652F-page 141
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
10.4
Peripheral Pin Select (PPS)
Peripheral Pin Select configuration enables peripheral
set selection and placement on a wide range of I/O
pins. By increasing the pinout options available on a
particular device, programmers can better tailor the
microcontroller to their entire application, rather than
trimming the application to fit the device.
The Peripheral Pin Select configuration feature
operates over a fixed subset of digital I/O pins. Programmers can independently map the input and/or
output of most digital peripherals to any one of these
I/O pins. Peripheral Pin Select is performed in software and generally does not require the device to be
reprogrammed. Hardware safeguards are included
that prevent accidental or spurious changes to the
peripheral mapping, once it has been established.
10.4.1
AVAILABLE PINS
The Peripheral Pin Select feature is used with a range
of up to 16 pins. The number of available pins depends
on the particular device and its pin count. Pins that
support the Peripheral Pin Select feature include the
designation “RPn” in their full pin designation, where
“RP” designates a remappable peripheral and “n” is the
remappable pin number.
10.4.2
10.4.2.1
The inputs of the Peripheral Pin Select options are
mapped on the basis of the peripheral. A control
register associated with a peripheral dictates the pin it
will be mapped to. The RPINRx registers are used to
configure peripheral input mapping (see Register 10-1
through Register 10-10). Each register contains sets
of 5-bit fields, with each set associated with one of the
remappable peripherals. Programming a given
peripheral’s bit field with an appropriate 5-bit value
maps the RPn pin with that value to that peripheral.
For any given device, the valid range of values for any
bit field corresponds to the maximum number of
Peripheral Pin Selections supported by the device.
Figure 10-2 Illustrates remappable pin selection for
U1RX input.
Note:
The association of a peripheral to a peripheral selectable pin is handled in two different ways, depending on
whether an input or output is being mapped.
For input mapping only, the Peripheral Pin
Select (PPS) functionality does not have
priority over the TRISx settings. Therefore, when configuring the RPx pin for
input, the corresponding bit in the TRISx
register must also be configured for input
(i.e., set to ‘1’).
FIGURE 10-2:
CONTROLLING PERIPHERAL PIN
SELECT
Peripheral Pin Select features are controlled through
two sets of Special Function Registers: one to map
peripheral inputs and one to map outputs. Because
they are separately controlled, a particular peripheral’s
input and output (if the peripheral has both) can be
placed on any selectable function pin without
constraint.
Input Mapping
REMAPPABLE MUX
INPUT FOR U1RX
U1RXR<4:0>
0
RP0
1
RP1
2
U1RX Input
to Peripheral
RP2
25
RP25
DS70000652F-page 142
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
SELECTABLE INPUT SOURCES (MAPS INPUT TO FUNCTION)(1)
TABLE 10-1:
Function Name
Register
Configuration
Bits
INT1
RPINR0
INT1R<4:0>
External Interrupt 2
INT2
RPINR1
INT2R<4:0>
Timer2 External Clock
T2CK
RPINR3
T2CKR<4:0>
Timer3 External Clock
T3CK
RPINR3
T3CKR<4:0>
Timer4 External Clock
T4CK
RPINR4
T4CKR<4:0>(2)
Timer5 External Clock
T5CK
RPINR4
T5CKR<4:0>(2)
Input Capture 1
IC1
RPINR7
IC1R<4:0>
Input Capture 2
IC2
RPINR7
IC2R<4:0>
Input Capture 3
IC3
RPINR8
IC3R<4:0>
Input Name
External Interrupt 1
Output Compare Fault A
OCFA
RPINR11
OCFAR<4:0>
UART1 Receive
U1RX
RPINR18
U1RXR<4:0>
UART1 Clear-to-Send
U1CTS
RPINR18
U1CTSR<4:0>
SDI1 SPI Data Input 1
SDI1
RPINR20
SDI1R<4:0>(2)
SCK1 SPI Clock Input 1
SCK1
RPINR20
SCK1R<4:0>(2)
SPI1 Slave Select Input
SS1
RPINR21
SS1R<4:0>(2)
Note 1:
2:
Unless otherwise noted, all inputs use the Schmitt input buffers.
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 143
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
10.4.2.2
Output Mapping
FIGURE 10-3:
In contrast to the inputs, the outputs of the Peripheral
Pin Select options are mapped on the basis of the pin.
In this case, a control register associated with a
particular pin dictates the peripheral output to be
mapped. The RPORx registers are used to control output mapping. Like the RPINRx registers, each register
contains sets of 5-bit fields, with each set associated
with one RPn pin (see Register 10-11 through
Register 10-23). The value of the bit field corresponds
to one of the peripherals and that peripheral’s output is
mapped to the pin (see Table 10-2 and Figure 10-3).
The list of peripherals for output mapping also includes
a null value of ‘00000’ because of the mapping
technique. This permits any given pin to remain
unconnected from the output of any of the pin
selectable peripherals.
MULTIPLEXING OF
REMAPPABLE OUTPUT
FOR RPn
RPnR<4:0>
Default 0
U1TX Output Enable
3
U1RTS Output Enable 4
Output Enable
OC2 Output Enable
Default
19
0
U1TX Output
3
U1RTS Output 4
Output Data
RPn
OC2 Output
TABLE 10-2:
19
OUTPUT SELECTION FOR REMAPPABLE PIN (RPn)
Function
RPnR<4:0>
Output Name
NULL
00000
RPn tied to Default Port Pin
C1OUT
00001
RPn tied to Comparator 1 Output
C2OUT
00010
RPn tied to Comparator 2 Output
U1TX
00011
RPn tied to UART1 Transmit
U1RTS
00100
RPn tied to UART1 Ready-to-Send
SCK1
01000
RPn tied to SPI Clock(1)
SDO1
00111
RPn tied to SPI Data Output(1)
SS1
01001
RPn tied to SPI1 Slave Select Output(1)
OC1
10010
RPn tied to Output Compare 1
OC2
10011
RPn tied to Output Compare 2
CTPLS
11101
RPn tied to CTMU Pulse Output
C3OUT
11110
RPn tied to Comparator 3 Output
Note 1:
This function is available in dsPIC33FJ32(GP/MC)10X devices only.
DS70000652F-page 144
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
10.4.3
CONTROLLING CONFIGURATION
CHANGES
Because peripheral remapping can be changed during
run time, some restrictions on peripheral remapping are
needed to prevent accidental configuration changes.
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices include three features to
prevent alterations to the peripheral map:
• Control register lock sequence
• Continuous state monitoring
• Configuration bit pin select lock
10.4.3.1
Control Register Lock
To set or clear IOLOCK, a specific command sequence
must be executed:
Write 0x46 to OSCCON<7:0>.
Write 0x57 to OSCCON<7:0>.
Clear (or set) IOLOCK as a single operation.
Note:
Continuous State Monitoring
In addition to being protected from direct writes, the
contents of the RPINRx and RPORx registers are
constantly monitored in hardware by shadow registers.
If an unexpected change in any of the registers occurs
(such as cell disturbances caused by ESD or other
external events), a Configuration Mismatch Reset will
be triggered.
10.4.3.3
Under normal operation, writes to the RPINRx and
RPORx registers are not allowed. Attempted writes
appear to execute normally, but the contents of the
registers remain unchanged. To change these registers, they must be unlocked in hardware. The register
lock is controlled by the IOLOCK bit (OSCCON<6>).
Setting IOLOCK prevents writes to the control
registers; clearing IOLOCK allows writes.
1.
2.
3.
10.4.3.2
Configuration Bit Pin Select Lock
As an additional level of safety, the device can be
configured to prevent more than one write session to
the RPINRx and RPORx registers. The IOL1WAY
(FOSC<5>) Configuration bit blocks the IOLOCK bit
from being cleared after it has been set once. If
IOLOCK remains set, the register unlock procedure will
not execute and the Peripheral Pin Select Control
registers cannot be written to. The only way to clear the
bit and re-enable peripheral remapping is to perform a
device Reset.
In the default (unprogrammed) state, IOL1WAY is set,
restricting users to one write session. Programming
IOL1WAY allows user applications unlimited access
(with the proper use of the unlock sequence) to the
Peripheral Pin Select registers.
MPLAB® C30 provides built-in C language
functions for unlocking the OSCCON
register:
__builtin_write_OSCCONL(value)
__builtin_write_OSCCONH(value)
See MPLAB IDE
information.
Help
for
more
Unlike the similar sequence with the oscillator’s LOCK
bit, IOLOCK remains in one state until changed. This
allows all of the Peripheral Pin Selects to be configured
with a single unlock sequence followed by an update to
all control registers, then locked with a second lock
sequence.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 145
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
10.5
1.
2.
In some cases, certain pins, as defined in
Section 26.0 “Electrical Characteristics”,
Table 26-11 under “Injection Current”, have
internal protection diodes to VDD and VSS. The
term, “Injection Current”, is also referred to as
“Clamp Current”. On designated pins, with sufficient external current limiting precautions by the
user, I/O pin input voltages are allowed to be
greater or less than the data sheet absolute
maximum ratings with nominal VDD, with respect
to the VSS and VDD supplies. Note that when the
user application forward biases either of the high
or low side internal input clamp diodes, that the
resulting current being injected into the device,
that is clamped internally by the VDD and VSS
power rails, may affect the ADC accuracy by
four to six counts.
I/O pins that are shared with any analog input pin,
(i.e., ANx), are always analog pins by default after
any Reset. Consequently, any pin(s) configured
as an analog input pin, automatically disables the
digital input pin buffer. As such, any attempt to
read a digital input pin will always return a ‘0’
regardless of the digital logic level on the pin if the
analog pin is configured. To use a pin as a digital
I/O pin on a shared ANx pin, the user application
needs to configure the ADC1 Port Configuration
Low (AD1PCFGL) register in the ADC module, by
setting the appropriate bit that corresponds to that
I/O port pin, to a ‘1’. On devices with more than
one ADC, both analog pin configurations for both
ADC modules must be configured as a digital I/O
pin for that pin to function as a digital I/O pin.
Note:
3.
I/O Helpful Tips
Although it is not possible to use a digital
input pin when its analog function is
enabled, it is possible to use the digital I/O
output function, TRISx = 0x0, while the
analog function is also enabled. However,
this is not recommended, particularly if the
analog input is connected to an external
analog voltage source, which would
create signal contention between the
analog signal and the output pin driver.
Most I/O pins have multiple functions. Referring to
the device pin diagrams in the data sheet, the
priorities of the functions allocated to any pins are
indicated by reading the pin name from left-to-right.
The left most function name takes precedence over
any function to its right in the naming convention.
For example: AN16/T2CK/T7CK/RC1. This indicates that AN16 is the highest priority in this
example and will supersede all other functions to its
right in the list. Those other functions to its right,
even if enabled, would not work as long as any
other function to its left was enabled. This rule
applies to all of the functions listed for a given pin.
DS70000652F-page 146
4.
5.
Each CN pin has a configurable internal weak
pull-up resistor. The pull-ups act as a current
source connected to the pin and eliminates the
need for external resistors in certain applications. The internal pull-up is to ~(VDD – 0.8), not
VDD. This is still above the minimum VIH of
CMOS and TTL devices.
When driving LEDs directly, the I/O pin can
source or sink more current than what is specified
in the VOH/IOH and VOL/IOL DC characteristic
specification. The respective IOH and IOL current
rating only applies to maintaining the corresponding output at or above the VOH and at or below the
VOL levels. However, for LEDs unlike digital
inputs of an externally connected device, they are
not governed by the same minimum VIH/VIL
levels. An I/O pin output can safely sink or source
any current less than that listed in the absolute
maximum rating section of the data sheet. For
example:
VOH = 2.4v @ IOH = -6 mA and VDD = 3.3V
The maximum output current sourced by any 6 mA
I/O pin = 15 mA.
LED source current < 15 mA is technically
permitted. Refer to the VOH/IOH specifications in
Section 26.0 “Electrical Characteristics” for
additional information.
10.6
I/O Resources
Many useful resources are provided on the main
product page of the Microchip web site for the devices
listed in this data sheet. This product page, which can
be accessed using this link, contains the latest updates
and additional information.
Note:
10.6.1
In the event you are not able to access the
product page using the link above, enter
this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en554109
KEY RESOURCES
• “I/O Ports” (DS70193) in the “dsPIC33/PIC24
Family Reference Manual”
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All related “dsPIC33/PIC24 Family Reference
Manual” Sections
• Development Tools
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
10.7
Peripheral Pin Select Registers
Note:
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 family of devices
implements up to 23 registers for remappable
peripheral configuration.
REGISTER 10-1:
Input and output register values can only
be changed if IOLOCK (OSCCON<6>) = 0.
See Section 10.4.3.1 “Control Register
Lock” for a specific command sequence.
RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
INT1R4
INT1R3
INT1R2
INT1R1
INT1R0
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
INT1R<4:0>: Assign External Interrupt 1 (INTR1) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-0
Unimplemented: Read as ‘0’
 2011-2014 Microchip Technology Inc.
DS70000652F-page 147
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-2:
RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
INT2R4
INT2R3
INT2R2
INT2R1
INT2R0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-5
Unimplemented: Read as ‘0’
bit 4-0
INT2R<4:0>: Assign External Interrupt 2 (INTR2) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
DS70000652F-page 148
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-3:
RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
T3CKR4
T3CKR3
T3CKR2
T3CKR1
T3CKR0
bit 15
bit 8
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
T2CKR4
T2CKR3
T2CKR2
T2CKR1
T2CKR0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
T3CKR<4:0>: Assign Timer3 External Clock (T3CK) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
T2CKR<4:0>: Assign Timer2 External Clock (T2CK) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
 2011-2014 Microchip Technology Inc.
DS70000652F-page 149
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-4:
U-0
RPINR4: PERIPHERAL PIN SELECT INPUT REGISTER 4
U-0
—
—
U-0
—
R/W-1
T5CKR4
R/W-1
(1)
R/W-1
(1)
T5CKR3
R/W-1
(1)
T5CKR2
R/W-1
(1)
T5CKR1
T5CKR0(1)
bit 15
bit 8
U-0
U-0
—
—
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
T4CKR4(1)
T4CKR3(1)
T4CKR2(1)
T4CKR1(1)
T4CKR0(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
T5CKR<4:0>: Assign Timer5 External Clock (T5CK) to the Corresponding RPn Pin bits(1)
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
T4CKR<4:0>: Assign Timer4 External Clock (T4CK) to the Corresponding RPn Pin bits(1)
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
Note 1:
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
DS70000652F-page 150
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-5:
RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
IC2R4
IC2R3
IC2R2
IC2R1
IC2R0
bit 15
bit 8
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
IC1R4
IC1R3
IC1R2
IC1R1
IC1R0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
IC2R<4:0>: Assign Input Capture 2 (IC2) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
IC1R<4:0>: Assign Input Capture 1 (IC1) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
 2011-2014 Microchip Technology Inc.
DS70000652F-page 151
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-6:
RPINR8: PERIPHERAL PIN SELECT INPUT REGISTER 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
IC3R4
IC3R3
IC3R2
IC3R1
IC3R0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-5
Unimplemented: Read as ‘0’
bit 4-0
IC3R<4:0>: Assign Input Capture 3 (IC3) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
DS70000652F-page 152
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-7:
RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
OCFAR4
OCFAR3
OCFAR2
OCFAR1
OCFAR0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-5
Unimplemented: Read as ‘0’
bit 4-0
OCFAR<4:0>: Assign Output Capture A (OCFA) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
 2011-2014 Microchip Technology Inc.
DS70000652F-page 153
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-8:
RPINR18: PERIPHERAL PIN SELECT INPUT REGISTER 18
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
U1CTSR4
U1CTSR3
U1CTSR2
U1CTSR1
U1CTSR0
bit 15
bit 8
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
U1RXR4
U1RXR3
U1RXR2
U1RXR1
U1RXR0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
U1CTSR<4:0>: Assign UART1 Clear-to-Send (U1CTS) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
U1RXR<4:0>: Assign UART1 Receive (U1RX) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
DS70000652F-page 154
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-9:
RPINR20: PERIPHERAL PIN SELECT INPUT REGISTER 20
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
SCK1R4(1)
SCK1R3(1)
SCK1R2(1)
SCK1R1(1)
SCK1R0(1)
bit 15
bit 8
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
SDI1R4(1)
SDI1R3(1)
SDI1R2(1)
SDI1R1(1)
SDI1R0(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
SCK1R<4:0>: Assign SPI1 Clock Input (SCK1IN) to the Corresponding RPn Pin bits(1)
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
SDI1R<4:0>: Assign SPI1 Data Input (SDI1) to the Corresponding RPn Pin bits(1)
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
Note 1:
These bits are available in dsPIC33FJ32(GP/MC)10X devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 155
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-10: RPINR21: PERIPHERAL PIN SELECT INPUT REGISTER 21
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
SS1R4
SS1R3
SS1R2
SS1R1
SS1R0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-5
Unimplemented: Read as ‘0’
bit 4-0
SS1R<4:0>: Assign SPI1 Slave Select Input (SS1IN) to the Corresponding RPn Pin bits
11111 = Input tied to VSS
11110 = Reserved
.
.
.
11010 = Reserved
11001 = Input tied to RP25
.
.
.
00001 = Input tied to RP1
00000 = Input tied to RP0
DS70000652F-page 156
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-11: RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTER 0
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP1R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP0R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP1R<4:0>: Peripheral Output Function is Assigned to RP1 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP0R<4:0>: Peripheral Output Function is Assigned to RP0 Output Pin bits
(see Table 10-2 for peripheral function numbers)
REGISTER 10-12: RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTER 1
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP3R<4:0>(1)
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP2R<4:0>(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP3R<4:0>: Peripheral Output Function is Assigned to RP3 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP2R<4:0>: Peripheral Output Function is Assigned to RP2 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are not available in dsPIC33FJXX(GP/MC)101 devices.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 157
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-13: RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTER 2
U-0
U-0
—
—
U-0
R/W-0
R/W-0
—
R/W-0
RP5R<4:0>
R/W-0
R/W-0
(1)
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP4R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP5R<4:0>: Peripheral Output Function is Assigned to RP5 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP4R<4:0>: Peripheral Output Function is Assigned to RP4 Output Pin bits
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are not available in dsPIC33FJ(16/32)(GP/MC)101 devices.
REGISTER 10-14: RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTER 3
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP7R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP6R<4:0>(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP7R<4:0>: Peripheral Output Function is Assigned to RP7 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP6R<4:0>: Peripheral Output Function is Assigned to RP6 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are not available in dsPIC33FJ(16/32)(GP/MC)101 devices.
DS70000652F-page 158
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-15: RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTER 4
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP9R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP8R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP9R<4:0>: Peripheral Output Function is Assigned to RP9 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP8R<4:0>: Peripheral Output Function is Assigned to RP8 Output Pin bits
(see Table 10-2 for peripheral function numbers)
REGISTER 10-16: RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTER 5
U-0
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP11R<4:0>(1)
—
bit 15
bit 8
U-0
U-0
—
U-0
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP10R<4:0>(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP11R<4:0>: Peripheral Output Function is Assigned to RP11 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP10R<4:0>: Peripheral Output Function is Assigned to RP10 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are not available in dsPIC33FJXX(GP/MC)101 devices.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 159
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-17: RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTER 6
U-0
U-0
—
—
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
(1)
—
RP13R<4:0>
bit 15
bit 8
U-0
U-0
—
—
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
(1)
—
RP12R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP13R<4:0>: Peripheral Output Function is Assigned to RP13 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP12R<4:0>: Peripheral Output Function is Assigned to RP12 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are not available in dsPIC33FJXXGP101 devices.
REGISTER 10-18: RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTER 7
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP15R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP14R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP15R<4:0>: Peripheral Output Function is Assigned to RP15 Output Pin bits
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP14R<4:0>: Peripheral Output Function is Assigned to RP14 Output Pin bits
(see Table 10-2 for peripheral function numbers)
DS70000652F-page 160
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-19: RPOR8: PERIPHERAL PIN SELECT OUTPUT REGISTER 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP17R<4:0>(1)
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP16R<4:0>(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP17R<4:0>: Peripheral Output Function is Assigned to RP17 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP16R<4:0>: Peripheral Output Function is Assigned to RP16 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are available in dsPIC33FJ32(GP/MC)104 devices only.
REGISTER 10-20: RPOR9: PERIPHERAL PIN SELECT OUTPUT REGISTER 9
U-0
U-0
—
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP19R<4:0>(1)
—
bit 15
bit 8
U-0
U-0
—
U-0
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP18R<4:0>(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP19R<4:0>: Peripheral Output Function is Assigned to RP19 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP18R<4:0>: Peripheral Output Function is Assigned to RP18 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are available in dsPIC33FJ32(GP/MC)104 devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 161
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 10-21: RPOR10: PERIPHERAL PIN SELECT OUTPUT REGISTER 10
U-0
U-0
—
—
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
(1)
—
RP21R<4:0>
bit 15
bit 8
U-0
U-0
—
—
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
(1)
—
RP20R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP21R<4:0>: Peripheral Output Function is Assigned to RP21 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP20R<4:0>: Peripheral Output Function is Assigned to RP20 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are available in dsPIC33FJ32(GP/MC)104 devices only.
REGISTER 10-22: RPOR11: PERIPHERAL PIN SELECT OUTPUT REGISTER 11
U-0
U-0
—
—
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP23R<4:0>(1)
—
bit 15
bit 8
U-0
U-0
—
—
U-0
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
(1)
RP22R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP23R<4:0>: Peripheral Output Function is Assigned to RP23 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP22R<4:0>: Peripheral Output Function is Assigned to RP22 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are available in dsPIC33FJ32(GP/MC)104 devices only.
DS70000652F-page 162
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
\
REGISTER 10-23: RPOR12: PERIPHERAL PIN SELECT OUTPUT REGISTER 12
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP25R<4:0>(1)
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP24R<4:0>(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP25R<4:0>: Peripheral Output Function is Assigned to RP25 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP24R<4:0>: Peripheral Output Function is Assigned to RP24 Output Pin bits(1)
(see Table 10-2 for peripheral function numbers)
Note 1:
These bits are available in dsPIC33FJ32(GP/MC)104 devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 163
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 164
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
11.0
TIMER1
Timer1 also supports these features:
•
•
•
•
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To complement the information in this data sheet,
refer to “Timers” (DS70205) in the
“dsPIC33/PIC24 Family Reference Manual”, which is available from the Microchip
web site (www.microchip.com).
Figure 11-1 presents a block diagram of the 16-bit timer
module.
To configure Timer1 for operation:
1.
2.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
3.
4.
5.
The Timer1 module is a 16-bit timer, which can serve
as the time counter for the Real-Time Clock (RTC) or
operate as a free-running interval timer/counter. Timer1
can operate in three modes:
6.
• 16-Bit Timer
• 16-Bit Synchronous Counter
• 16-Bit Asynchronous Counter
FIGURE 11-1:
Timer gate operation
Selectable prescaler settings
Timer operation during CPU Idle and Sleep modes
Interrupt on 16-bit Period register match or falling
edge of external gate signal
7.
Load the timer value into the TMR1 register.
Load the timer period value into the PR1
register.
Select the timer prescaler ratio using the
TCKPS<1:0> bits in the T1CON register.
Set the Clock and Gating modes using the TCS
and TGATE bits in the T1CON register.
Set or clear the TSYNC bit in T1CON to select
synchronous or asynchronous operation.
If interrupts are required, set the Timer1 Interrupt Enable bit, T1IE. Use the Timer1 Interrupt
Priority bits, T1IP<2:0>, to set the interrupt
priority.
Set the TON bit (= 1) in the T1CON register.
16-BIT TIMER1 MODULE BLOCK DIAGRAM
TCKPS<1:0>
SOSCO/
T1CK
1x
SOSCEN
SOSCI
Gate
Sync
01
TCY
00
2
TON
Prescaler
1, 8, 64, 256
TGATE
TCS
TGATE
1
Q
D
0
Q
CK
Set T1IF
Reset
0
TMR1
1
Comparator
Sync
TSYNC
Equal
PR1
 2011-2014 Microchip Technology Inc.
DS70000652F-page 165
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
11.1
Timer1 Control Register
REGISTER 11-1:
T1CON: TIMER1 CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON(1)
—
TSIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
U-0
—
TGATE
TCKPS1
TCKPS0
—
TSYNC
TCS(1)
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
TON: Timer1 On bit(1)
1 = Starts 16-bit Timer1
0 = Stops 16-bit Timer1
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Timer1 Stop in Idle Mode bit
1 = Discontinues module operation when device enters Idle mode
0 = Continues module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer1 Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 5-4
TCKPS<1:0> Timer1 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
Unimplemented: Read as ‘0’
bit 2
TSYNC: Timer1 External Clock Input Synchronization Select bit
When TCS = 1:
1 = Synchronizes external clock input
0 = Does not synchronize external clock input
When TCS = 0:
This bit is ignored.
bit 1
TCS: Timer1 Clock Source Select bit(1)
1 = External clock from pin, T1CK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
Note 1:
When TCS = 1 and TON = 1, writes to the TMR1 register are inhibited from the CPU.
DS70000652F-page 166
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
12.0
TIMER2/3 AND TIMER4/5
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To complement the information in this data sheet,
refer to “Timers” (DS70205) in the
“dsPIC33/PIC24 Family Reference Manual”, which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Timer2/3 and Timer4/5 have three 2-bit timers that can
also be configured as two independent 16-bit timers
with selectable operating modes.
For 32-bit timer/counter operation, Timer2/4 is the least
significant word (lsw) and Timer3/5 is the most
significant word (msw) of the 32-bit timers.
Note:
12.1
• Two independent 16-bit timers (e.g., Timer2 and
Timer3 or Timer4 and Timer5) with all 16-bit
operating modes (except Asynchronous Counter
mode)
• Single 32-bit timer (Timer2/3 and Timer4/5)
• Single 32-bit synchronous counter (Timer2/3 and
Timer4/5)
Timer2/3 and Timer4/5 also support:
•
•
•
•
•
Timer gate operation
Selectable prescaler settings
Timer operation during Idle and Sleep modes
Interrupt on a 32-bit Period register match
Time base for input capture and output compare
modules (Timer2 and Timer3 only)
• ADC1 event trigger (Timer2/3 only)
Individually, all eight of the 16-bit timers can function as
synchronous timers or counters. They also offer the
features listed above, except for the event trigger. The
operating modes and enabled features are determined
by setting the appropriate bit(s) in the T2CON, T3CON,
T4CON and T5CON registers (see Register 12-1
through Register 12-4).
1.
2.
3.
4.
5.
6.
Set the T32 control bit.
Select the prescaler ratio for Timer2 or Timer4
using the TCKPS<1:0> bits.
Set the Clock and Gating modes using the
corresponding TCS and TGATE bits.
Load the timer period value. PR3/PR5 contains
the msw of the value, while PR2/PR4 contains
the least significant word (lsw).
If interrupts are required, set the Timer3 (or
Timer5) Interrupt Enable bit, T3IE (or T5IE). Use
the priority bits, T3IP<2:0> or T5IP<2:0>, to set the
interrupt priority. While Timer2/Timer4 controls the
timer, the interrupt appears as a Timer3/Timer5
interrupt.
Set the corresponding TON bit.
The timer value at any point is stored in the register
pair, TMR3:TMR2 or TMR5:TMR4, which always
contains the msw of the count, while TMR2 or TMR4
contains the lsw.
12.2
16-Bit Operation
To configure any of the timers for individual 16-bit
operation:
1.
2.
3.
4.
5.
6.
 2011-2014 Microchip Technology Inc.
32-Bit Operation
To configure Timer2/3 and Timer4/5 for 32-bit
operation:
Note 1: Timer4 and Timer5 are available in
dsPIC33FJ32(GP/MC10X) devices only.
As a 32-bit timer, Timer2/3 and Timer4/5 permit
operation in three modes:
For 32-bit operation, T3CON and T5CON
control bits are ignored. Only T2CON and
T4CON control bits are used for setup and
control. Timer2 and Timer4 clock and gate
inputs are used for the 32-bit timer
modules, but an interrupt is generated
with the Timer3 and Timer5 interrupt flags.
Clear the T32 bit corresponding to that timer.
Select the timer prescaler ratio using the
TCKPS<1:0> bits.
Set the Clock and Gating modes using the TCS
and TGATE bits.
Load the timer period value into the PRx
register.
If interrupts are required, set the Timerx Interrupt
Enable bit, TxIE. Use the priority bits,
TxIP<2:0>, to set the interrupt priority.
Set the TON bit.
DS70000652F-page 167
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TIMER2/3 AND TIMER4/5 (32-BIT) BLOCK DIAGRAM(1,3,4)
FIGURE 12-1:
1x
TxCK
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
TGATE
TCS
TGATE
Q
1
Set TxIF
Q
0
PRx
ADC Event Trigger(2)
TCKPS<1:0>
2
TON
Equal
D
CK
PRy
Comparator
MSb
LSb
TMRx
Reset
TMRy
Sync
16
To CTMU Filter
Read TMRx/TMRy
Write TMRx/TMRy
16
16
TMRxHLD
16
Data Bus<15:0>
Note 1:
2:
3:
4:
The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are
respective to the TxCON register.
The ADC event trigger is available only on Timer2/3.
Timer4/5 is available in dsPIC33FJ32(GP/MC)10X devices only.
Where ‘x’ or ‘y’ is present, x = 2 or 4; y = 3 or 5.
DS70000652F-page 168
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TIMER2 AND TIMER4 (16-BIT) BLOCK DIAGRAM(1)
FIGURE 12-2:
TCKPS<1:0>
2
TON
1x
TxCK
Gate
Sync
Prescaler
1, 8, 64, 256
01
00
TGATE
TCS
TCY
1
Q
D
0
Q
CK
TGATE
Set TxIF
Reset
Sync
TMRx
Comparator
To CTMU Filter
Equal
PRx
Note 1:
FIGURE 12-3:
Timer4 is available in dsPIC33FJ32(GP/MC)10X devices only.
TIMER3 AND TIMER5 (16-BIT) BLOCK DIAGRAM(1)
Gate
Sync
FCY
Falling Edge
Detect
Set TxIF Flag
10
Prescaler
(/n)
00
TCKPS<1:0>
Sync
1
Prescaler
(/n)
0
TMRx
TGATE
x1
Comparator
TxCK
TCKPS<1:0>
Reset
Equal
ADC SOC Trigger
TGATE
TCS
PRx
To CTMU Filter
Note 1:
Timer5 is available in dsPIC33FJ32(GP/MC)10X devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 169
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
12.3
Timer2/3 and Timer4/5 Control
Registers
REGISTER 12-1:
T2CON: TIMER2 CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON
—
TSIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
U-0
—
TGATE
TCKPS1
TCKPS0
T32
—
TCS
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
TON: Timer2 On bit
When T32 = 1:
1 = Starts 32-bit Timer2/3
0 = Stops 32-bit Timer2/3
When T32 = 0:
1 = Starts 16-bit Timer2
0 = Stops 16-bit Timer2
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Timer2 Stop in Idle Mode bit
1 = Discontinues module operation when device enters Idle mode
0 = Continues module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer2 Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 5-4
TCKPS<1:0>: Timer2 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
T32: 32-Bit Timer Mode Select bit
1 = Timer2 and Timer3 form a single 32-bit timer
0 = Timer2 and Timer3 act as two 16-bit timers
bit 2
Unimplemented: Read as ‘0’
bit 1
TCS: Timer2 Clock Source Select bit
1 = External clock from pin, T2CK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
DS70000652F-page 170
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 12-2:
R/W-0
TON
T3CON: TIMER3 CONTROL REGISTER
U-0
(2)
R/W-0
—
TSIDL
(1)
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
(2)
—
TGATE
R/W-0
TCKPS1
R/W-0
(2)
TCKPS0
U-0
(2)
—
U-0
—
R/W-0
(2)
TCS
bit 7
U-0
—
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
TON: Timer3 On bit(2)
1 = Starts 16-bit Timer3
0 = Stops 16-bit Timer3
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Timer3 Stop in Idle Mode bit(1)
1 = Discontinues timer operation when device enters Idle mode
0 = Continues timer operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer3 Gated Time Accumulation Enable bit(2)
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 5-4
TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(2)
11 = 1:256 prescale value
10 = 1:64 prescale value
01 = 1:8 prescale value
00 = 1:1 prescale value
bit 3-2
Unimplemented: Read as ‘0’
bit 1
TCS: Timer3 Clock Source Select bit(2)
1 = External clock from T3CK pin
0 = Internal clock (FOSC/2)
bit 0
Unimplemented: Read as ‘0’
Note 1:
2:
x = Bit is unknown
When 32-bit timer operation is enabled (T32 = 1) in the Timer2 Control register (T2CON<3>), the TSIDL
bit must be cleared to operate the 32-bit timer in Idle mode.
When the 32-bit timer operation is enabled (T32 = 1) in the Timer2 Control register (T2CON<3>), these
bits have no effect.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 171
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
T4CON: TIMER4 CONTROL REGISTER(1)
REGISTER 12-3:
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON
—
TSIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
U-0
—
TGATE
TCKPS1
TCKPS0
T32
—
TCS
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
TON: Timer4 On bit
When T32 = 1:
1 = Starts 32-bit Timer4/5
0 = Stops 32-bit Timer4/5
When T32 = 0:
1 = Starts 16-bit Timer4
0 = Stops 16-bit Timer4
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Timer4 Stop in Idle Mode bit
1 = Discontinues module operation when device enters Idle mode
0 = Continues module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer4 Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 5-4
TCKPS<1:0>: Timer4 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
T32: 32-Bit Timer Mode Select bit
1 = Timer4 and Timer5 form a single 32-bit timer
0 = Timer4 and Timer5 act as two 16-bit timers
bit 2
Unimplemented: Read as ‘0’
bit 1
TCS: Timer4 Clock Source Select bit
1 = External clock from pin, T4CK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
Note 1:
This register is available in dsPIC33FJ32(GP/MC)10X devices only.
DS70000652F-page 172
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 12-4:
R/W-0
TON
T5CON: TIMER5 CONTROL REGISTER(1)
U-0
(3)
R/W-0
—
TSIDL
(2)
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
(3)
—
TGATE
R/W-0
TCKPS1
R/W-0
(3)
TCKPS0
U-0
(3)
—
U-0
—
R/W-0
(3)
TCS
bit 7
U-0
—
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
TON: Timer5 On bit(3)
1 = Starts 16-bit Timer3
0 = Stops 16-bit Timer3
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Timer5 Stop in Idle Mode bit(2)
1 = Discontinues timer operation when device enters Idle mode
0 = Continues timer operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer5 Gated Time Accumulation Enable bit(3)
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 5-4
TCKPS<1:0>: Timer5 Input Clock Prescale Select bits(3)
11 = 1:256 prescale value
10 = 1:64 prescale value
01 = 1:8 prescale value
00 = 1:1 prescale value
bit 3-2
Unimplemented: Read as ‘0’
bit 1
TCS: Timer5 Clock Source Select bit(3)
1 = External clock from T5CK pin
0 = Internal clock (FOSC/2)
bit 0
Unimplemented: Read as ‘0’
Note 1:
2:
3:
x = Bit is unknown
This register is available in dsPIC33FJ32(GP/MC)10X devices only.
When 32-bit timer operation is enabled (T32 = 1) in the Timer4 Control register (T4CON<3>), the TSIDL
bit must be cleared to operate the 32-bit timer in Idle mode.
When the 32-bit timer operation is enabled (T32 = 1) in the Timer4 Control register (T4CON<3>), these
bits have no effect.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 173
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 174
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
13.0
INPUT CAPTURE
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Input Capture”
(DS70198) in the “dsPIC33/PIC24 Family
Reference Manual”, which is available
from
the
Microchip
web
site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The input capture module is useful in applications
requiring frequency (period) and pulse measurement.
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices support
up to three input capture channels.
FIGURE 13-1:
The input capture module captures the 16-bit value of
the selected Time Base register when an event occurs
on the ICx pin. The events that cause a capture event
are listed below in three categories:
1.
2.
3.
Simple Capture Event modes:
• Capture timer value on every falling edge of
input at ICx pin
• Capture timer value on every rising edge of
input at ICx pin
Capture timer value on every edge (rising and
falling).
Prescaler Capture Event modes:
• Capture timer value on every 4th rising edge
of input at ICx pin
• Capture timer value on every 16th rising
edge of input at ICx pin
Each input capture channel can select one of two
16-bit timers (Timer2 or Timer3) for the time base.
The selected timer can use either an internal or
external clock.
Other operational features include:
• Device wake-up from capture pin during CPU
Sleep and Idle modes
• Interrupt on input capture event
• 4-word FIFO buffer for capture values:
- Interrupt optionally generated after 1, 2, 3 or
4 buffer locations are filled
• Use of input capture to provide additional sources
of external interrupts
INPUT CAPTURE x BLOCK DIAGRAM
From 16-Bit Timers
TMR2 TMR3
16
16
1
3
ICTMR
(ICxCON<7>)
FIFO
R/W Logic
ICM<2:0> (ICxCON<2:0>)
Mode Select
FIFO
ICx Pin
Edge Detection Logic
and
Clock Synchronizer
Prescaler
Counter
(1, 4, 16)
0
ICOV, ICBNE (ICxCON<4:3>)
ICxBUF
ICI<1:0>
ICxCON
Interrupt
Logic
System Bus
Set Flag ICxIF
(in IFSn Register)
Note: An ‘x’ in a signal, register or bit name denotes the number of the input capture channel.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 175
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
13.1
Input Capture Control Register
REGISTER 13-1:
ICxCON: INPUT CAPTURE x CONTROL REGISTER
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
ICSIDL
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R-0, HC
R-0, HC
R/W-0
R/W-0
R/W-0
ICTMR
ICI1
ICI0
ICOV
ICBNE
ICM2
ICM1
ICM0
bit 7
bit 0
Legend:
HC = Hardware Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13
ICSIDL: Input Capture x Stop in Idle Control bit
1 = Input Capture x module will halt in CPU Idle mode
0 = Input Capture x module will continue to operate in CPU Idle mode
bit 12-8
Unimplemented: Read as ‘0’
bit 7
ICTMR: Input Capture x Timer Select bits
1 = TMR2 contents are captured on a capture event
0 = TMR3 contents are captured on a capture event
bit 6-5
ICI<1:0>: Select Number of Captures per Interrupt bits
11 = Interrupt on every fourth capture event
10 = Interrupt on every third capture event
01 = Interrupt on every second capture event
00 = Interrupt on every capture event
bit 4
ICOV: Input Capture x Overflow Status Flag bit (read-only)
1 = Input Capture x overflow occurred
0 = No Input Capture x overflow occurred
bit 3
ICBNE: Input Capture x Buffer Empty Status bit (read-only)
1 = Input Capture x buffer is not empty, at least one more capture value can be read
0 = Input Capture x buffer is empty
bit 2-0
ICM<2:0>: Input Capture x Mode Select bits
111 = Input Capture x functions as an interrupt pin only when device is in Sleep or Idle mode (rising
edge detect only, all other control bits are not applicable)
110 = Unused (module is disabled)
101 = Capture mode, every 16th rising edge
100 = Capture mode, every 4th rising edge
011 = Capture mode, every rising edge
010 = Capture mode, every falling edge
001 = Capture mode, every edge, rising and falling (ICI<1:0> bits do not control interrupt generation
for this mode)
000 = Input Capture x module is turned off
DS70000652F-page 176
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
14.0
OUTPUT COMPARE
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To complement the information in this data sheet,
refer to “Output Compare” (DS70209) in
the “dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
FIGURE 14-1:
The output compare module can select either Timer2 or
Timer3 for its time base. The module compares the
value of the timer with the value of one or two compare
registers depending on the operating mode selected.
The state of the output pin changes when the timer
value matches the Output Compare Control register
value. The output compare module generates either a
single output pulse, or a sequence of output pulses, by
changing the state of the output pin on the compare
match events. The output compare module can also
generate interrupts on compare match events.
The output compare module has multiple operating
modes:
•
•
•
•
•
•
•
Active-Low One-Shot mode
Active-High One-Shot mode
Toggle mode
Delayed One-Shot mode
Continuous Pulse mode
PWM mode without Fault Protection
PWM mode with Fault Protection
OUTPUT COMPARE x MODULE BLOCK DIAGRAM
Set Flag bit,
OCxIF
OCxRS
Output
Logic
OCxR
S
R
Q
3
OCM<2:0>
Mode Select
Comparator
0
16
1
OCTSEL
Output
Enable
OCx
Output
Enable
Logic
OCFA
0
1
TMR2
Rollover
TMR3
Rollover
16
TMR2 TMR3
 2011-2014 Microchip Technology Inc.
DS70000652F-page 177
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
14.1
Output Compare Modes
Configure the Output Compare modes by setting the
appropriate Output Compare Mode bits (OCM<2:0>) in
the Output Compare x Control (OCxCON<2:0>)
register. Table 14-1 lists the different bit settings for the
Output Compare modes. Figure 14-2 illustrates the
output compare operation for various modes. The user
TABLE 14-1:
application must disable the associated timer when
writing to the Output Compare Control registers to
avoid malfunctions.
Note:
See “Output Compare” in the “dsPIC33/
PIC24 Family Reference Manual”
(DS70209) for OCxR and OCxRS register
restrictions.
OUTPUT COMPARE x MODES
OCM<2:0>
Mode
OCx Pin Initial State
OCx Interrupt Generation
000
Module Disabled
001
Active-Low One-Shot
Controlled by GPIO register
—
010
Active-High One-Shot
011
Toggle
100
Delayed One-Shot
0
OCx Falling Edge
101
Continuous Pulse
0
OCx Falling Edge
110
PWM without Fault Protection
0, if OCxR is zero
1, if OCxR is non-zero
No Interrupt
111
PWM with Fault Protection
0, if OCxR is zero
1, if OCxR is non-zero
OCFA Falling Edge for OC1 to OC4
0
OCx Rising Edge
1
OCx Falling Edge
Current output is maintained OCx Rising and Falling Edge
FIGURE 14-2:
OUTPUT COMPARE x OPERATION
Output Compare
Mode Enabled
Timer is Reset on
Period Match
OCxRS
TMRy
OCxR
Active-Low One-Shot
(OCM<2:0> = 001)
Active-High One-Shot
(OCM<2:0> = 010)
Toggle Mode
(OCM<2:0> = 011)
Delayed One-Shot
(OCM<2:0> = 100)
Continuous Pulse Mode
(OCM<2:0> = 101)
PWM Mode
(OCM<2:0> = 110 or 111)
DS70000652F-page 178
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
14.2
Output Compare Control Register
REGISTER 14-1:
OCxCON: OUTPUT COMPARE x CONTROL REGISTER
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
OCSIDL
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R-0, HC
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
OCFLT
OCTSEL
OCM2
OCM1
OCM0
bit 7
bit 0
Legend:
HC = Hardware Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13
OCSIDL: Output Compare x Stop in Idle Mode Control bit
1 = Output Compare x will halt in CPU Idle mode
0 = Output Compare x will continue to operate in CPU Idle mode
bit 12-5
Unimplemented: Read as ‘0’
bit 4
OCFLT: PWM Fault Condition Status bit
1 = PWM Fault condition has occurred (cleared in hardware only)
0 = No PWM Fault condition has occurred
(This bit is only used when OCM<2:0> = 111.)
bit 3
OCTSEL: Output Compare x Timer Selection bit
1 = Timer3 is the clock source for Output Compare x
0 = Timer2 is the clock source for Output Compare x
bit 2-0
OCM<2:0>: Output Compare x Mode Select bits
111 = PWM mode on OCx, Fault pin is enabled
110 = PWM mode on OCx, Fault pin is disabled
101 = Initializes OCx pin low, generates continuous output pulses on OCx pin
100 = Initializes OCx pin low, generates single output pulse on OCx pin
011 = Compare event toggles OCx pin
010 = Initializes OCx pin high, compare event forces OCx pin low
001 = Initializes OCx pin low, compare event forces OCx pin high
000 = Output Compare x channel is disabled
 2011-2014 Microchip Technology Inc.
DS70000652F-page 179
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 180
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
15.0
MOTOR CONTROL PWM
MODULE
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Motor Control PWM”
(DS70187) in the “dsPIC33/PIC24
Family Reference Manual”, which is
available on the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
15.1
PWM1: 6-Channel PWM Module
This module simplifies the task of generating multiple
synchronized PWM outputs. The following power and
motion control applications are supported by the PWM
module:
•
•
•
•
3-Phase AC Induction Motor
Switched Reluctance (SR) Motor
Brushless DC (BLDC) Motor
Uninterruptible Power Supply (UPS)
This module contains three duty cycle generators,
numbered 1 through 3. The module has six PWM
output pins, numbered PWM1H1/PWM1L1 through
PWM1H3/PWM1L3. The six I/O pins are grouped into
high/low numbered pairs, denoted by the suffix H or L,
respectively. For complementary loads, the low PWM
pins are always the complement of the corresponding
high I/O pin.
The dsPIC33FJ16MC10X devices have a 6-channel
Pulse-Width Modulation (PWM) module.
The PWM module has the following features:
•
•
•
•
•
•
•
•
•
Up to 16-bit resolution
On-the-fly PWM frequency changes
Edge-Aligned and Center-Aligned Output modes
Single Pulse Generation mode
Interrupt support for asymmetrical updates in
Center-Aligned mode
Output override control for Electrically
Commutative Motor (ECM) operation or BLDC
Special event comparator for scheduling other
peripheral events
Fault pins to optionally drive each of the PWM
output pins to a defined state
Duty cycle updates configurable to be immediate
or synchronized to the PWM time base
 2011-2014 Microchip Technology Inc.
DS70000652F-page 181
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 15-1:
6-CHANNEL PWM MODULE BLOCK DIAGRAM (PWM1)
PWM1CON1
PWM Enable and Mode SFRs
PWM1CON2
P1DTCON1
Dead-Time Control SFRs
P1DTCON2
P1FLTACON
Fault A Pin Control SFRs
P1FLTBCON
Fault B Pin Control SFRs
P1OVDCON
PWM Manual Control SFR
PWM Generator 3
P1DC3 Buffer
16-Bit Data Bus
P1DC3
Comparator
PWM1H3
Channel 3 Dead-Time
Generator and
Override Logic
PWM
Generator 2(1)
P1TMR
Channel 2 Dead-Time
Generator and
Override Logic
PWM1L3
PWM1H2
Output
PWM1L2
Driver
Comparator
PWM
Generator 1(1)
P1TPER
Channel 1 Dead-Time
Generator and
Override Logic
Block
PWM1H1
PWM1L1
P1TPER Buffer
FLTA1(2,3)
P1TCON
FLTB1(3)
Comparator
SEVTDIR
P1SECMP
Special Event
Postscaler
Special Event Trigger
PTDIR
PWM Time Base
Note 1:
2:
3:
The details of PWM Generator 1 and 2 are not shown for clarity.
On dsPIC33FJ16MC101 (20-pin) devices, the FLTA1 pin is supported, but requires an external pull-down resistor
for correct functionality.
On dsPIC33FJ16MC102 (28-pin) devices, the FLTA1 and FLTB1 pins are supported and do not require an external
pull-down resistor.
DS70000652F-page 182
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
15.2
PWM Faults
The Motor Control PWM module incorporates up to two
Fault inputs, FLTA1 and FLTB1. These Fault inputs are
implemented with Class B safety features. These
features ensure that the PWM outputs enter a safe
state when either of the Fault inputs is asserted.
Refer to “Motor Control PWM” (DS70187) in the
“dsPIC33/PIC24 Family Reference Manual” for more
information on the PWM Faults.
Note:
The FLTA1 and FLTB1 pins, when enabled and having
ownership of a pin, also enable a soft internal pull-down
resistor. The soft pull-down provides a safety feature by
automatically asserting the Fault should a break occur
in the Fault signal connection.
The implementation of internal pull-down resistors is
dependent on the device variant. Table 15-1 describes
which devices and pins implement the internal pull-down
resistors.
TABLE 15-1:
INTERNAL PULL-DOWN
RESISTORS ON PWM FAULT
PINS
Device
Fault Pin
Internal
Pull-Down
Implemented?
dsPIC33FJXXMC101
FLTA1
No
dsPIC33FJXXMC102
FLTA1
Yes
FLTB1
Yes
FLTA1
Yes
FLTB1
Yes
dsPIC33FJ32MC104
On devices without internal pull-downs on the Fault pin,
it is recommended to connect an external pull-down
resistor for Class B safety features.
15.2.1
PWM FAULTS AT RESET
During any Reset event, the PWM module maintains
ownership of both PWM Fault pins. At Reset, both
Faults are enabled in latched mode to guarantee the
fail-safe power-up of the application. The application
software must clear both of the PWM Faults before
enabling the Motor Control PWM module.
15.3
The number of PWM Faults mapped to
the device pins depend on the specific
variant. Regardless of the variant, both
Faults will be enabled during any Reset
event. The application must clear both
FLTA1 and FLTB1 before enabling the
Motor Control PWM module. Refer to the
specific device pin diagrams to see which
Fault pins are mapped to the device pins.
Write-Protected Registers
On dsPIC33FJ(16/32)MC10X devices, write protection
is implemented for the PWMxCON1, PxFLTACON and
PxFLTBCON registers. The write protection feature
prevents any inadvertent writes to these registers. The
write protection feature can be controlled by the
PWMLOCK Configuration bit in the FOSCSEL Configuration register. The default state of the write protection
feature is enabled (PWMLOCK = 1). The write protection feature can be disabled by configuring PWMLOCK
(FOSCSEL<6>) = 0.
The user application can gain access to these locked
registers either by configuring the PWMLOCK bit
(FOSCSEL<6>) = 0 or by performing the unlock
sequence. To perform the unlock sequence, the user
application must write two consecutive values
(0xABCD and 0x4321) to the PWMxKEY register to
perform the unlock operation. The write access to the
PWMxCON1, PxFLTACON or PxFLTBCON registers
must be the next SFR access following the unlock
process. There can be no other SFR accesses during
the unlock process and subsequent write access.
To write to all registers, the PWMxCON1, PxFLTACON
and PxFLTBCON registers require three unlock
operations.
The correct unlocking sequence is described in
Example 15-1 and Example 15-2.
The Fault condition must be cleared by the external circuitry driving the Fault input pin high and clearing the
Fault interrupt flag. After the Fault pin condition has been
cleared, the PWM module restores the PWM output
signals on the next PWM period or half-period boundary.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 183
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
EXAMPLE 15-1:
ASSEMBLY CODE FOR WRITE-PROTECTED REGISTER UNLOCK AND FAULT
CLEARING SEQUENCE
; FLTA1 pin must be pulled high externally in order to clear and disable the Fault
; Writing to P1FLTBCON register requires unlock sequence
mov
mov
mov
mov
mov
mov
#0xabcd,w10
#0x4321,w11
#0x0000,w0
w10, PWM1KEY
w11, PWM1KEY
w0,P1FLTACON
;
;
;
;
;
;
Load first unlock key to w10 register
Load second unlock key to w11 register
Load desired value of P1FLTACON register in w0
Write first unlock key to PWM1KEY register
Write second unlock key to PWM1KEY register
Write desired value to P1FLTACON register
; FLTB1 pin must be pulled high externally in order to clear and disable the Fault
; Writing to P1FLTBCON register requires unlock sequence
mov
mov
mov
mov
mov
mov
#0xabcd,w10
#0x4321,w11
#0x0000,w0
w10, PWM1KEY
w11, PWM1KEY
w0,P1FLTBCON
;
;
;
;
;
;
Load first unlock key to w10 register
Load second unlock key to w11 register
Load desired value of P1FLTBCON register in w0
Write first unlock key to PWM1KEY register
Write second unlock key to PWM1KEY register
Write desired value to P1FLTBCON register
; Enable all PWMs using PWM1CON1 register
; Writing to PWM1CON1 register requires unlock sequence
mov
mov
mov
mov
mov
mov
#0xabcd,w10
#0x4321,w11
#0x0077,w0
w10, PWM1KEY
w11, PWM1KEY
w0,PWM1CON1
EXAMPLE 15-2:
;
;
;
;
;
;
Load first unlock key to w10 register
Load second unlock key to w11 register
Load desired value of PWM1CON1 register in w0
Write first unlock key to PWM1KEY register
Write second unlock key to PWM1KEY register
Write desired value to PWM1CON1 register
C CODE FOR WRITE-PROTECTED REGISTER UNLOCK AND FAULT CLEARING
SEQUENCE
// FLTA1 pin must be pulled high externally in order to clear and disable the Fault
// Writing to P1FLTACON register requires unlock sequence
// Use builtin function to write 0x0000 to P1FLTACON register
__builtin_write_PWMSFR(&P1FLTACON, 0x0000, &PWM1KEY);
// FLTB1 pin must be pulled high externally in order to clear and disable the Fault
// Writing to P1FLTBCON register requires unlock sequence
// Use builtin function to write 0x0000 to P1FLTBCON register
__builtin_write_PWMSFR(&P1FLTBCON, 0x0000, &PWM1KEY);
// Enable all PWMs using PWM1CON1 register
// Writing to PWM1CON1 register requires unlock sequence
// Use builtin function to write 0x0077 to PWM1CON1 register
__builtin_write_PWMSFR(&PWM1CON1, 0x0077, &PWM1KEY);
DS70000652F-page 184
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
15.4
PWM Control Registers
REGISTER 15-1:
PxTCON: PWMx TIME BASE CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
PTEN
—
PTSIDL
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PTOPS3
PTOPS2
PTOPS1
PTOPS0
PTCKPS1
PTCKPS0
PTMOD1
PTMOD0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
PTEN: PWMx Time Base Timer Enable bit
1 = PWMx time base is on
0 = PWMx time base is off
bit 14
Unimplemented: Read as ‘0’
bit 13
PTSIDL: PWMx Time Base Stop in Idle Mode bit
1 = PWMx time base halts in CPU Idle mode
0 = PWMx time base runs in CPU Idle mode
bit 12-8
Unimplemented: Read as ‘0’
bit 7-4
PTOPS<3:0>: PWMx Time Base Output Postscale Select bits
1111 = 1:16 postscale
•
•
•
0001 = 1:2 postscale
0000 = 1:1 postscale
bit 3-2
PTCKPS<1:0>: PWMx Time Base Input Clock Prescale Select bits
11 = PWMx time base input clock period is 64 TCY (1:64 prescale)
10 = PWMx time base input clock period is 16 TCY (1:16 prescale)
01 = PWMx time base input clock period is 4 TCY (1:4 prescale)
00 = PWMx time base input clock period is TCY (1:1 prescale)
bit 1-0
PTMOD<1:0>: PWMx Time Base Mode Select bits
11 = PWMx time base operates in a Continuous Up/Down Count mode with interrupts for double
PWM updates
10 = PWMx time base operates in a Continuous Up/Down Count mode
01 = PWMx time base operates in Single Pulse mode
00 = PWMx time base operates in a Free-Running mode
 2011-2014 Microchip Technology Inc.
DS70000652F-page 185
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-2:
R-0
PxTMR: PWMx TIMER COUNT VALUE REGISTER
R/W-0
R/W-0
R/W-0
PTDIR
R/W-0
R/W-0
R/W-0
R/W-0
PTMR<14:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PTMR<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
PTDIR: PWMx Time Base Count Direction Status bit (read-only)
1 = PWMx time base is counting down
0 = PWMx time base is counting up
bit 14-0
PTMR <14:0>: PWMx Time Base Register Count Value bits
REGISTER 15-3:
U-0
PxTPER: PWMx TIME BASE PERIOD REGISTER
R/W-0
R/W-0
R/W-0
—
R/W-0
R/W-0
R/W-0
R/W-0
PTPER<14:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PTPER<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-0
PTPER<14:0>: PWMx Time Base Period Value bits
DS70000652F-page 186
x = Bit is unknown
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-4:
R/W-0
PxSECMP: PWMx SPECIAL EVENT COMPARE REGISTER
R/W-0
R/W-0
R/W-0
(1)
R/W-0
SEVTCMP<14:8>
SEVTDIR
R/W-0
R/W-0
R/W-0
(2)
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
SEVTCMP<7:0>
R/W-0
R/W-0
R/W-0
(2)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
SEVTDIR: Special Event Trigger Time Base Direction bit(1)
1 = A Special Event Trigger will occur when the PWMx time base is counting down
0 = A Special Event Trigger will occur when the PWMx time base is counting up
bit 14-0
SEVTCMP<14:0>: Special Event Compare Value bits(2)
Note 1:
2:
SEVTDIR is compared with PTDIR (PxTMR<15>) to generate the Special Event Trigger.
PxSECMP<14:0> is compared with PxTMR<14:0> to generate the Special Event Trigger.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 187
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
PWMxCON1: PWMx CONTROL REGISTER 1(1)
REGISTER 15-5:
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
PMOD3
PMOD2
PMOD1
bit 15
bit 8
U-0
R/W-0
R/W-0
R/W-0
—
PEN3H(2)
PEN2H(2)
PEN1H(2)
U-0
R/W-0
R/W-0
R/W-0
—
PEN3L(2)
PEN2L(2)
PEN1L(2)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-11
Unimplemented: Read as ‘0’
bit 10-8
PMOD<3:1>: PWMx I/O Pair Mode bits
1 = PWMx I/O pin pair is in the Independent PWM Output mode
0 = PWMx I/O pin pair is in the Complementary Output mode
bit 7
Unimplemented: Read as ‘0’
bit 6-4
PEN3H:PEN1H: PWMxH I/O Enable bits(2)
1 = PWMxH pin is enabled for PWMx output
0 = PWMxH pin is disabled, I/O pin becomes a general purpose I/O
bit 3
Unimplemented: Read as ‘0’
bit 2-0
PEN3L:PEN1L: PWMxL I/O Enable bits(2)
1 = PWMxL pin is enabled for PWMx output
0 = PWMxL pin is disabled, I/O pin becomes a general purpose I/O
Note 1:
2:
The PWMxCON1 register is a write-protected register. Refer to Section 15.3 “Write-Protected
Registers” for more information on the unlock sequence.
The Reset status for these bits depends on the setting of the PWMPIN Configuration bit (FPOR<7>):
• If PWMPIN = 1 (default), the PWM pins are controlled by the PORT register at Reset, meaning they
are initially programmed as inputs (i.e., tri-stated).
• If PWMPIN = 0, the PWM pins are controlled by the PWM module at Reset and are therefore, initially
programmed as output pins.
DS70000652F-page 188
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-6:
PWMxCON2: PWMx CONTROL REGISTER 2
U-0
U-0
U-0
U-0
—
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
SEVOPS<3:0>
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
IUE
OSYNC
UDIS
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-12
Unimplemented: Read as ‘0’
bit 11-8
SEVOPS<3:0>: PWMx Special Event Trigger Output Postscale Select bits
1111 = 1:16 postscale
•
•
•
0001 = 1:2 postscale
0000 = 1:1 postscale
bit 7-3
Unimplemented: Read as ‘0’
bit 2
IUE: Immediate Update Enable bit
1 = Updates to the active PxDC registers are immediate
0 = Updates to the active PxDC registers are synchronized to the PWMx time base
bit 1
OSYNC: Output Override Synchronization bit
1 = Output overrides via the PxOVDCON register are synchronized to the PWMx time base
0 = Output overrides via the PxOVDCON register occur on the next TCY boundary
bit 0
UDIS: PWMx Update Disable bit
1 = Updates from Duty Cycle and Period Buffer registers are disabled
0 = Updates from Duty Cycle and Period Buffer registers are enabled
 2011-2014 Microchip Technology Inc.
DS70000652F-page 189
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-7:
PxDTCON1: PWMx DEAD-TIME CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
DTBPS1
DTBPS0
DTB5
DTB4
DTB3
DTB2
DTB1
DTB0
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
DTAPS1
DTAPS0
DTA5
DTA4
DTA3
DTA2
DTA1
DTA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
DTBPS<1:0>: Dead-Time Unit B Prescale Select bits
11 = Clock period for Dead-Time Unit B is 8 TCY
10 = Clock period for Dead-Time Unit B is 4 TCY
01 = Clock period for Dead-Time Unit B is 2 TCY
00 = Clock period for Dead-Time Unit B is TCY
bit 13-8
DTB<5:0>: Unsigned 6-Bit Dead-Time Value for Dead-Time Unit B bits
bit 7-6
DTAPS<1:0>: Dead-Time Unit A Prescale Select bits
11 = Clock period for Dead-Time Unit A is 8 TCY
10 = Clock period for Dead-Time Unit A is 4 TCY
01 = Clock period for Dead-Time Unit A is 2 TCY
00 = Clock period for Dead-Time Unit A is TCY
bit 5-0
DTA<5:0>: Unsigned 6-Bit Dead-Time Value for Dead-Time Unit A bits
DS70000652F-page 190
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-8:
PxDTCON2: PWMx DEAD-TIME CONTROL REGISTER 2
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
DTS3A
DTS3I
DTS2A
DTS2I
DTS1A
DTS1I
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-6
Unimplemented: Read as ‘0’
bit 5
DTS3A: Dead-Time Select for PWM3 Signal Going Active bit
1 = Dead time provided from Unit B
0 = Dead time provided from Unit A
bit 4
DTS3I: Dead-Time Select for PWM3 Signal Going Inactive bit
1 = Dead time provided from Unit B
0 = Dead time provided from Unit A
bit 3
DTS2A: Dead-Time Select for PWM2 Signal Going Active bit
1 = Dead time provided from Unit B
0 = Dead time provided from Unit A
bit 2
DTS2I: Dead-Time Select for PWM2 Signal Going Inactive bit
1 = Dead time provided from Unit B
0 = Dead time provided from Unit A
bit 1
DTS1A: Dead-Time Select for PWM1 Signal Going Active bit
1 = Dead time provided from Unit B
0 = Dead time provided from Unit A
bit 0
DTS1I: Dead-Time Select for PWM1 Signal Going Inactive bit
1 = Dead time provided from Unit B
0 = Dead time provided from Unit A
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 191
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
PxFLTACON: PWMx FAULT A CONTROL REGISTER(1,2,3,4)
REGISTER 15-9:
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
FAOV3H
FAOV3L
FAOV2H
FAOV2L
FAOV1H
FAOV1L
bit 15
bit 8
R/W-0
U-0
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
FLTAM
—
—
—
—
FAEN3
FAEN2
FAEN1
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13-8
FAOV<3:1>H:FAOV<3:1>L: Fault Input A PWMx Override Value bits
1 = The PWMx output pin is driven active on an external Fault input event
0 = The PWMx output pin is driven inactive on an external Fault input event
bit 7
FLTAM: Fault A Mode bit
1 = The Fault A input pin functions in the Cycle-by-Cycle mode
0 = The Fault A input pin latches all control pins to the programmed states in PxFLTACON<13:8>
bit 6-3
Unimplemented: Read as ‘0’
bit 2
FAEN3: Fault Input A Enable bit
1 = PWMxH3/PWMxL3 pin pair is controlled by Fault Input A
0 = PWMxH3/PWMxL3 pin pair is not controlled by Fault Input A
bit 1
FAEN2: Fault Input A Enable bit
1 = PWMxH2/PWMxL2 pin pair is controlled by Fault Input A
0 = PWMxH2/PWMxL2 pin pair is not controlled by Fault Input A
bit 0
FAEN1: Fault Input A Enable bit
1 = PWMxH1/PWMxL1 pin pair is controlled by Fault Input A
0 = PWMxH1/PWMxL1 pin pair is not controlled by Fault Input A
Note 1:
2:
3:
4:
Comparator outputs are not internally connected to the PWM Fault control logic. If using the comparator
modules for Fault generation, the user must externally connect the desired comparator output pin to the
dedicated FLTA1 or FLTB1 input pin.
Refer to Table 15-1 for FLTA1 implementation details.
The PxFLTACON register is a write-protected register. Refer to Section 15.3 “Write-Protected Registers”
for more information on the unlock sequence.
During any Reset event, FLTA1 is enabled by default and must be cleared as described in Section 15.2
“PWM Faults”.
DS70000652F-page 192
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-10: PxFLTBCON: PWMx FAULT B CONTROL REGISTER(1,2,3,4)
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
FBOV3H
FBOV3L
FBOV2H
FBOV2L
FBOV1H
FBOV1L
bit 15
bit 8
R/W-0
U-0
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
FLTBM
—
—
—
—
FBEN3
FBEN2
FBEN1
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13-8
FBOV<3:1>H:FBOV<3:1>L: Fault Input B PWMx Override Value bits
1 = The PWMx output pin is driven active on an external Fault input event
0 = The PWMx output pin is driven inactive on an external Fault input event
bit 7
FLTBM: Fault B Mode bit
1 = The Fault B input pin functions in the Cycle-by-Cycle mode
0 = The Fault B input pin latches all control pins to the programmed states in PxFLTBCON<13:8>
bit 6-3
Unimplemented: Read as ‘0’
bit 2
FBEN3: Fault Input B Enable bit
1 = PWMxH3/PWMxL3 pin pair is controlled by Fault Input B
0 = PWMxH3/PWMxL3 pin pair is not controlled by Fault Input B
bit 1
FBEN2: Fault Input B Enable bit
1 = PWMxH2/PWMxL2 pin pair is controlled by Fault Input B
0 = PWMxH2/PWMxL2 pin pair is not controlled by Fault Input B
bit 0
FBEN1: Fault Input B Enable bit
1 = PWMxH1/PWMxL1 pin pair is controlled by Fault Input B
0 = PWMxH1/PWMxL1 pin pair is not controlled by Fault Input B
Note 1:
2:
3:
4:
Comparator outputs are not internally connected to the PWM Fault control logic. If using the comparator
modules for Fault generation, the user must externally connect the desired comparator output pin to the
dedicated FLTA1 or FLTB1 input pin.
Refer to Table 15-1 for FLTB1 implementation details.
The PxFLTACON register is a write-protected register. Refer to Section 15.3 “Write-Protected Registers”
for more information on the unlock sequence.
During any Reset event, FLTB1 is enabled by default and must be cleared as described in Section 15.2
“PWM Faults”.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 193
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-11: PxOVDCON: PWMx OVERRIDE CONTROL REGISTER
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
POVD3H
POVD3L
POVD2H
POVD2L
POVD1H
POVD1L
bit 15
bit 8
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
POUT3H
POUT3L
POUT2H
POUT2L
POUT1H
POUT1L
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13-8
POVD<3:1>H:POVD<3:1>L: PWMx Output Override bits
1 = Output on PWMx I/O pin is controlled by the PWMx generator
0 = Output on PWMx I/O pin is controlled by the value in the corresponding POUTxH:POUTxL bits
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
POUT<3:1>H:POUT<3:1>L: PWM Manual Output bits
1 = PWMx I/O pin is driven active when the corresponding POVDxH:POVDxL bits are cleared
0 = PWMx I/O pin is driven inactive when the corresponding POVDxH:POVDxL bits are cleared
DS70000652F-page 194
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-12: PxDC1: PWMx DUTY CYCLE 1 REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PDC1<15:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PDC1<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
PDC1<15:0>: PWMx Duty Cycle 1 Value bits
REGISTER 15-13: PxDC2: PWMx DUTY CYCLE 2 REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PDC2<15:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PDC2<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
PDC2<15:0>: PWMx Duty Cycle 2 Value bits
REGISTER 15-14: PxDC3: PWMx DUTY CYCLE 3 REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PDC3<15:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PDC3<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
PDC3<15:0>: PWMx Duty Cycle 3 Value bits
 2011-2014 Microchip Technology Inc.
DS70000652F-page 195
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 15-15: PWMxKEY: PWMx UNLOCK REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PWMKEY<15:8>
R/W-0
R/W-0
R/W-0
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PWMKEY<7:0>
R/W-0
R/W-0
R/W-0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
PWMKEY<15:0>: PWMx Unlock bits
If the PWMLOCK Configuration bit is asserted (PWMLOCK = 1), the PWMxCON1, PxFLTACON and
PxFLTBCON registers are writable only after the proper sequence is written to the PWMxKEY register. If the
PWMLOCK Configuration bit is deasserted (PWMLOCK = 0), the PWMxCON1, PxFLTACON and
PxFLTBCON registers are writable at all times. Refer to “Motor Control PWM” (DS70187) in the “dsPIC33/
PIC24 Family Reference Manual” for details on the unlock sequence.
DS70000652F-page 196
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
16.0
SERIAL PERIPHERAL
INTERFACE (SPI)
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Serial Peripheral Interface (SPI)” (DS70206) in the “dsPIC33/
PIC24 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
FIGURE 16-1:
The Serial Peripheral Interface (SPI) module is a
synchronous serial interface useful for communicating
with other peripheral or microcontroller devices. These
peripheral devices can be serial EEPROMs, shift registers, display drivers, Analog-to-Digital Converters, etc.
The SPI module is compatible with SPI and SIOP from
Motorola®.
Each SPI module consists of a 16-bit shift register,
SPIxSR (where x = 1 or 2), used for shifting data in and
out, and a buffer register, SPIxBUF. A control register,
SPIxCON, configures the module. Additionally, a status
register, SPIxSTAT, indicates status conditions.
The serial interface consists of four pins:
•
•
•
•
SDIx (serial data input)
SDOx (serial data output)
SCKx (shift clock input or output)
SSx (active-low slave select).
In Master mode operation, SCKx is a clock output. In
Slave mode, it is a clock input.
SPIx MODULE BLOCK DIAGRAM
SCKx
1:1 to 1:8
Secondary
Prescaler
1:1/4/16/64
Primary
Prescaler
FCY
SSx
Sync
Control
Select
Edge
Control
Clock
SPIxCON1<1:0>
Shift Control
SPIxCON1<4:2>
SDOx
Enable
Master Clock
bit 0
SDIx
SPIxSR
Transfer
Transfer
SPIxRXB
SPIxTXB
SPIxBUF
Read SPIxBUF
Write SPIxBUF
16
Internal Data Bus
 2011-2014 Microchip Technology Inc.
DS70000652F-page 197
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
16.1
1.
In Frame mode, if there is a possibility that the
master may not be initialized before the slave:
a) If FRMPOL (SPIxCON2<13>) = 1, use a
pull-down resistor on SSx.
b) If FRMPOL = 0, use a pull-up resistor on SSx.
Note:
2.
5.
6.
This will insure that during power-up and
initialization, the master/slave will not lose
sync due to an errant SCK transition that
would cause the slave to accumulate data
shift errors for both transmit and receive,
appearing as corrupted data.
FRMEN (SPIxCON2<15>) = 1 and SSEN
(SPIxCON1<7>) = 1 are exclusive and invalid.
In Frame mode, SCKx is continuous and the
Frame Sync pulse is active on the SSx pin,
which indicates the start of a data frame.
Note:
4.
This insures that the first frame transmission
after initialization is not shifted or corrupted.
In Non-Framed 3-Wire mode (i.e., not using SSx
from a master):
a) If CKP (SPIxCON1<6>) = 1, always place a
pull-up resistor on SSx.
b) If CKP = 0, always place a pull-down
resistor on SSx.
Note:
3.
SPI Helpful Tips
16.2
SPI Resources
Many useful resources are provided on the main product page of the Microchip web site for the devices listed
in this data sheet. This product page, which can be
accessed using this link, contains the latest updates
and additional information.
Note:
16.2.1
In the event you are not able to access
the product page using the link above,
enter this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en554109
KEY RESOURCES
• “Serial Peripheral Interface (SPI)” (DS70206) in
the “dsPIC33/PIC24 Family Reference Manual”.
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All related “dsPIC33/PIC24 Family Reference
Manual” sections
• Development Tools
Not all third-party devices support Frame
mode timing. Refer to the SPI electrical
characteristics for details.
In Master mode only, set the SMP bit
(SPIxCON1<9>) to a ‘1’ for the fastest SPI data
rate possible. The SMP bit can only be set at the
same time or after the MSTEN bit
(SPIxCON1<5>) is set.
To avoid invalid slave read data to the master,
the user’s master software must ensure enough
time for slave software to fill its write buffer
before the user application initiates a master
write/read cycle. It is always advisable to preload the SPIxBUF Transmit register in advance
of the next master transaction cycle. SPIxBUF is
transferred to the SPIx Shift register and is
empty once the data transmission begins.
The SPI related pins (SDI1, SDO1, SCK1) are
located at fixed positions in the dsPIC33FJ16(GP/
MC)10X devices. The same pins are remappable
in the dsPIC33FJ32(GP/MC)10X devices.
DS70000652F-page 198
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
16.3
SPI Control Registers
REGISTER 16-1:
SPIxSTAT: SPIx STATUS AND CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
SPIEN
—
SPISIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/C-0
U-0
U-0
U-0
U-0
R-0
R-0
—
SPIROV
—
—
—
—
SPITBF
SPIRBF
bit 7
bit 0
Legend:
C = Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
SPIEN: SPIx Enable bit
1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins
0 = Disables module
bit 14
Unimplemented: Read as ‘0’
bit 13
SPISIDL: SPIx Stop in Idle Mode bit
1 = Discontinues module operation when device enters Idle mode
0 = Continues module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
SPIROV: SPIx Receive Overflow Flag bit
1 = A new byte/word is completely received and discarded; the user software has not read the
previous data in the SPIxBUF register
0 = No overflow has occurred.
bit 5-2
Unimplemented: Read as ‘0’
bit 1
SPITBF: SPIx Transmit Buffer Full Status bit
1 = Transmit has not yet started, SPIxTXB is full
0 = Transmit has started, SPIxTXB is empty
Automatically set in hardware when the CPU writes the SPIxBUF location, loading SPIxTXB. Automatically
cleared in hardware when the SPIx module transfers data from SPIxTXB to SPIxSR.
bit 0
SPIRBF: SPIx Receive Buffer Full Status bit
1 = Receive complete, SPIxRXB is full
0 = Receive is not complete, SPIxRXB is empty
Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB. Automatically cleared
in hardware when the core reads the SPIxBUF location, reading SPIxRXB.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 199
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 16-2:
SPIXCON1: SPIx CONTROL REGISTER 1
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
DISSCK
DISSDO
MODE16
SMP
CKE(1)
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
SSEN(2)
CKP
MSTEN
SPRE2(3)
SPRE1(3)
SPRE0(3)
PPRE1(3)
PPRE0(3)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12
DISSCK: Disable SCKx pin bit (SPI Master modes only)
1 = Internal SPI clock is disabled, pin functions as I/O
0 = Internal SPI clock is enabled
bit 11
DISSDO: Disable SDOx pin bit
1 = SDOx pin is not used by the module; pin functions as I/O
0 = SDOx pin is controlled by the module
bit 10
MODE16: Word/Byte Communication Select bit
1 = Communication is word-wide (16 bits)
0 = Communication is byte-wide (8 bits)
bit 9
SMP: SPIx Data Input Sample Phase bit
Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
Slave mode:
SMP must be cleared when SPIx is used in Slave mode.
bit 8
CKE: Clock Edge Select bit(1)
1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6)
0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6)
bit 7
SSEN: SPIx Slave Select Enable bit (Slave mode)(2)
1 = SSx pin is used for Slave mode
0 = SSx pin is not used by the module, pin is controlled by port function
bit 6
CKP: Clock Polarity Select bit
1 = Idle state for clock is a high level; active state is a low level
0 = Idle state for clock is a low level; active state is a high level
bit 5
MSTEN: Master Mode Enable bit
1 = Master mode
0 = Slave mode
Note 1:
2:
3:
The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes
(FRMEN = 1).
This bit must be cleared when FRMEN = 1.
Do not set both primary and secondary prescalers to a value of 1:1.
DS70000652F-page 200
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 16-2:
SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED)
bit 4-2
SPRE<2:0>: Secondary Prescale bits (Master mode)(3)
111 = Secondary prescale 1:1
110 = Secondary prescale 2:1
.
.
.
000 = Secondary prescale 8:1
bit 1-0
PPRE<1:0>: Primary Prescale bits (Master mode)(3)
11 = Primary prescale 1:1
10 = Primary prescale 4:1
01 = Primary prescale 16:1
00 = Primary prescale 64:1
Note 1:
2:
3:
The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes
(FRMEN = 1).
This bit must be cleared when FRMEN = 1.
Do not set both primary and secondary prescalers to a value of 1:1.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 201
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 16-3:
SPIxCON2: SPIx CONTROL REGISTER 2
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
U-0
U-0
FRMEN
SPIFSD
FRMPOL
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
U-0
—
—
—
—
—
—
FRMDLY
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
FRMEN: Framed SPIx Support bit
1 = Framed SPIx support is enabled (SSx pin is used as Frame Sync pulse input/output)
0 = Framed SPIx support is disabled
bit 14
SPIFSD: Frame Sync Pulse Direction Control bit
1 = Frame Sync pulse input (slave)
0 = Frame Sync pulse output (master)
bit 13
FRMPOL: Frame Sync Pulse Polarity bit
1 = Frame Sync pulse is active-high
0 = Frame Sync pulse is active-low
bit 12-2
Unimplemented: Read as ‘0’
bit 1
FRMDLY: Frame Sync Pulse Edge Select bit
1 = Frame Sync pulse coincides with first bit clock
0 = Frame Sync pulse precedes first bit clock
bit 0
Unimplemented: This bit must not be set to ‘1’ by the user application
DS70000652F-page 202
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
17.0
INTER-INTEGRATED CIRCUIT™
(I2C™)
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 family
devices. It is not intended to be a
comprehensive reference source. To complement the information in this data sheet,
refer to “Inter-Integrated Circuit™
(I2C™)” (DS70195) in the “dsPIC33/
PIC24 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The Inter-Integrated Circuit™ (I2C™) module provides
complete hardware support for both Slave and MultiMaster modes of the I2C serial communication
standard, with a 16-bit interface.
The I2C module has a 2-pin interface:
• The SCLx pin is clock
• The SDAx pin is data
The I2C module offers the following key features:
• I2C interface supporting both Master and Slave
modes of operation
• I2C Slave mode supports 7-bit and 10-bit addresses
• I2C Master mode supports 7-bit and 10-bit addresses
• I2C port allows bidirectional transfers between
master and slaves
• Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
resume serial transfer (SCLREL control)
• I2C supports multi-master operation, detects bus
collision and arbitrates accordingly
 2011-2014 Microchip Technology Inc.
17.1
Operating Modes
The hardware fully implements all the master and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7-Bit and 10-Bit Addressing.
The I2C module can operate either as a slave or a
master on an I2C bus.
The following types of I2C operation are supported:
•
•
•
I2C slave operation with 7-Bit Addressing
I2C slave operation with 10-Bit Addressing
I2C master operation with 7-Bit or
10-Bit Addressing
For details about the communication sequence in each
of these modes, refer to the Microchip web site
(www.microchip.com) for the latest “dsPIC33/PIC24
Family Reference Manual” sections.
17.2
I2C Registers
I2CxCON and I2CxSTAT are control and status
registers, respectively. The I2CxCON register is
readable and writable. The lower six bits of I2CxSTAT
are read-only. The remaining bits of the I2CxSTAT are
read/write.
• I2CxRSR is the shift register used for shifting data
• I2CxRCV is the receive buffer and the register to
which data bytes are written or from which data
bytes are read
• I2CxTRN is the transmit register to which bytes
are written during a transmit operation
• I2CxADD register holds the slave address
• ADD10 status bit indicates 10-Bit Addressing
mode
• I2CxBRG acts as the Baud Rate Generator (BRG)
reload value
In receive operations, I2CxRSR and I2CxRCV together
form a double-buffered receiver. When I2CxRSR
receives a complete byte, it is transferred to I2CxRCV
and an interrupt pulse is generated.
DS70000652F-page 203
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 17-1:
I2C™ BLOCK DIAGRAM (X = 1)
Internal
Data Bus
I2CxRCV
Read
SCLx
Shift
Clock
I2CxRSR
LSb
SDAx
Address Match
Match Detect
Write
I2CxMSK
Write
Read
I2CxADD
Read
Start and Stop
Bit Detect
Write
Start and Stop
Bit Generation
Control Logic
I2CxSTAT
Collision
Detect
Read
Write
I2CxCON
Acknowledge
Generation
Read
Clock
Stretching
Write
I2CxTRN
LSb
Read
Shift Clock
Reload
Control
BRG Down Counter
Write
I2CxBRG
Read
TCY/2
DS70000652F-page 204
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
17.3
I2C Control Registers
REGISTER 17-1:
I2CxCON: I2Cx CONTROL REGISTER
R/W-0
U-0
R/W-0
R/W-1, HC
R/W-0
R/W-0
R/W-0
R/W-0
I2CEN
—
I2CSIDL
SCLREL
IPMIEN
A10M
DISSLW
SMEN
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0, HC
R/W-0, HC
R/W-0, HC
R/W-0, HC
R/W-0, HC
GCEN
STREN
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
bit 7
bit 0
Legend:
HC = Hardware Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
I2CEN: I2Cx Enable bit
1 = Enables the I2Cx module, and configures the SDAx and SCLx pins as serial port pins
0 = Disables the I2Cx module; all I2C™ pins are controlled by port functions
bit 14
Unimplemented: Read as ‘0’
bit 13
I2CSIDL: I2Cx Stop in Idle Mode bit
1 = Discontinues module operation when device enters an Idle mode
0 = Continues module operation in Idle mode
bit 12
SCLREL: SCLx Release Control bit (when operating as I2C slave)
1 = Releases SCLx clock
0 = Holds SCLx clock low (clock stretch)
If STREN = 1:
Bit is R/W (i.e., software can write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clears at
beginning of every slave data byte transmission. Hardware clears at end of every slave address byte
reception. Hardware clears at every slave data byte reception.
If STREN = 0:
Bit is R/S (i.e., software can only write ‘1’ to release clock). Hardware clears at beginning of every slave
data byte transmission. Hardware clears at end of every slave address byte reception.
bit 11
IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit
1 = IPMI mode is enabled; all addresses are Acknowledged
0 = IPMI mode is disabled
bit 10
A10M: I2Cx 10-Bit Slave Address bit
1 = I2CxADD is a 10-bit slave address
0 = I2CxADD is a 7-bit slave address
bit 9
DISSLW: Disable Slew Rate Control bit
1 = Slew rate control is disabled
0 = Slew rate control is enabled
bit 8
SMEN: SMBus Input Levels bit
1 = Enables I/O pin thresholds compliant with SMBus specification
0 = Disables SMBus input thresholds
bit 7
GCEN: General Call Enable bit (when operating as I2C slave)
1 = Enables interrupt when a general call address is received in the I2CxRSR (module is enabled for
reception)
0 = General call address is disabled
 2011-2014 Microchip Technology Inc.
DS70000652F-page 205
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 17-1:
I2CxCON: I2Cx CONTROL REGISTER (CONTINUED)
bit 6
STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave)
Used in conjunction with the SCLREL bit.
1 = Enables software or receives clock stretching
0 = Disables software or receives clock stretching
bit 5
ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive)
Value that will be transmitted when the software initiates an Acknowledge sequence.
1 = Sends NACK during Acknowledge
0 = Sends ACK during Acknowledge
bit 4
ACKEN: Acknowledge Sequence Enable bit (when operating as I2C master, applicable during master receive)
1 = Initiates Acknowledge sequence on SDAx and SCLx pins and transmits ACKDT data bit; hardware
clears at end of master Acknowledge sequence
0 = Acknowledge sequence is not in progress
bit 3
RCEN: Receive Enable bit (when operating as I2C master)
1 = Enables Receive mode for I2C; hardware clears at end of eighth bit of the master receive data byte
0 = Receive sequence is not in progress
bit 2
PEN: Stop Condition Enable bit (when operating as I2C master)
1 = Initiates Stop condition on SDAx and SCLx pins; hardware clears at end of the master Stop sequence
0 = Stop condition not in progress
bit 1
RSEN: Repeated Start Condition Enable bit (when operating as I2C master)
1 = Initiates Repeated Start condition on SDAx and SCLx pins; hardware clears at end of the master
Repeated Start sequence
0 = Repeated Start condition is not in progress
bit 0
SEN: Start Condition Enable bit (when operating as I2C master)
1 = Initiates Start condition on SDAx and SCLx pins; hardware clears at end of master Start sequence
0 = Start condition is not in progress
DS70000652F-page 206
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 17-2:
I2CxSTAT: I2Cx STATUS REGISTER
R-0, HSC
R-0, HSC
U-0
U-0
U-0
R/C-0, HS
R-0, HSC
R-0, HSC
ACKSTAT
TRSTAT
—
—
—
BCL
GCSTAT
ADD10
bit 15
bit 8
R/C-0, HS
R/C-0, HS
R-0, HSC
R/C-0, HSC
R/C-0, HSC
R-0, HSC
R-0, HSC
R-0, HSC
IWCOL
I2COV
D_A
P
S
R_W
RBF
TBF
bit 7
bit 0
Legend:
C = Clearable bit
HSC = Hardware Settable/Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
HS = Hardware Settable bit
bit 15
ACKSTAT: Acknowledge Status bit
(when operating as I2C™ master, applicable to master transmit operation)
1 = NACK received from slave
0 = ACK received from slave
Hardware sets or clears at end of slave Acknowledge.
bit 14
TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation)
1 = Master transmit is in progress (8 bits + ACK)
0 = Master transmit is not in progress
Hardware sets at beginning of master transmission. Hardware clears at end of slave Acknowledge.
bit 13-11
Unimplemented: Read as ‘0’
bit 10
BCL: Master Bus Collision Detect bit
1 = A bus collision has been detected during a master operation
0 = No collision
Hardware sets at detection of bus collision.
bit 9
GCSTAT: General Call Status bit
1 = General call address was received
0 = General call address was not received
Hardware sets when address matches general call address. Hardware clears at Stop detection.
bit 8
ADD10: 10-Bit Address Status bit
1 = 10-bit address was matched
0 = 10-bit address was not matched
Hardware sets at match of 2nd byte of matched 10-bit address. Hardware clears at Stop detection.
bit 7
IWCOL: Write Collision Detect bit
1 = An attempt to write to the I2CxTRN register failed because the I2C module is busy
0 = No collision
Hardware sets at occurrence of a write to I2CxTRN while busy (cleared by software).
bit 6
I2COV: Receive Overflow Flag bit
1 = A byte was received while the I2CxRCV register is still holding the previous byte
0 = No overflow
Hardware sets at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).
bit 5
D_A: Data/Address bit (when operating as I2C slave)
1 = Indicates that the last byte received was data
0 = Indicates that the last byte received was a device address
Hardware clears at device address match. Hardware sets by reception of a slave byte.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 207
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 17-2:
I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED)
bit 4
P: Stop bit
1 = Indicates that a Stop bit has been detected last
0 = Stop bit was not detected last
Hardware sets or clears when Start, Repeated Start or Stop is detected.
bit 3
S: Start bit
1 = Indicates that a Start (or Repeated Start) bit has been detected last
0 = Start bit was not detected last
Hardware sets or clears when Start, Repeated Start or Stop is detected.
bit 2
R_W: Read/Write Information bit (when operating as I2C slave)
1 = Read – Indicates data transfer is output from slave
0 = Write – Indicates data transfer is input to slave
Hardware sets or clears after reception of an I 2C device address byte.
bit 1
RBF: Receive Buffer Full Status bit
1 = Receive is complete, I2CxRCV is full
0 = Receive is not complete, I2CxRCV is empty
Hardware sets when I2CxRCV is written with received byte. Hardware clears when software reads
I2CxRCV.
bit 0
TBF: Transmit Buffer Full Status bit
1 = Transmit in progress, I2CxTRN is full
0 = Transmit complete, I2CxTRN is empty
Hardware sets when software writes to I2CxTRN. Hardware clears at completion of data transmission.
DS70000652F-page 208
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 17-3:
I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
R/W-0
R/W-0
AMSK<9:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
AMSK<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-10
Unimplemented: Read as ‘0’
bit 9-0
AMSK<9:0>: Mask for Address Bit x Select bits
1 = Enables masking for Bit x of incoming message address; bit match not required in this position
0 = Disables masking for Bit x; bit match required in this position
 2011-2014 Microchip Technology Inc.
DS70000652F-page 209
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 210
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
18.0
UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART)
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be a
comprehensive reference source. To complement the information in this data sheet,
refer to “UART” (DS70188) in the
“dsPIC33/PIC24
Family
Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The Universal Asynchronous Receiver Transmitter
(UART) module is one of the serial I/O modules
available in the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 device family. The
UART is a full-duplex asynchronous system that can
communicate with peripheral devices, such as
personal computers, LIN/J2602, RS-232 and RS-485
interfaces. The module also supports a hardware flow
control option with the UxCTS and UxRTS pins, and
also includes an IrDA® encoder and decoder.
The primary features of the UART module are:
• Full-Duplex, 8-Bit or 9-Bit Data Transmission
through the UxTX and UxRX Pins
• Even, Odd or No Parity options (for 8-bit data)
• One or Two Stop bits
• Hardware Flow Control Option with UxCTS and
UxRTS Pins
• Fully Integrated Baud Rate Generator with
16-Bit Prescaler
• Baud Rates Ranging from 1 Mbps to 6 bps at
16x mode at 16 MIPS
• Baud Rates Ranging from 4 Mbps to 24.4 bps at
4x mode at 16 MIPS
• 4-Deep First-In First-Out (FIFO) Transmit Data
Buffer
• 4-Deep FIFO Receive Data Buffer
• Parity, Framing and Buffer Overrun Error Detection
• Support for 9-bit mode with Address Detect
(9th bit = 1)
• Transmit and Receive Interrupts
• A Separate Interrupt for all UART Error Conditions
• Loopback mode for Diagnostic Support
• Support for Sync and Break Characters
• Support for Automatic Baud Rate Detection
• IrDA® Encoder and Decoder Logic
• 16x Baud Clock Output for IrDA® Support
A simplified block diagram of the UART module is
shown in Figure 18-1. The UART module consists of
these key hardware elements:
• Baud Rate Generator
• Asynchronous Transmitter
• Asynchronous Receiver
FIGURE 18-1:
UARTx SIMPLIFIED BLOCK DIAGRAM
Baud Rate Generator
IrDA®
Hardware Flow Control
UxRTS/BCLK
UxCTS
UARTx Receiver
UxRX
UARTx Transmitter
UxTX
 2011-2014 Microchip Technology Inc.
DS70000652F-page 211
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
18.1
1.
2.
UART Helpful Tips
In multi-node, direct connect UART networks,
UART receive inputs react to the complementary
logic level defined by the URXINV bit
(UxMODE<4>), which defines the Idle state, the
default of which is logic high (i.e., URXINV = 0).
Because remote devices do not initialize at the
same time, it is likely that one of the devices,
because the RX line is floating, will trigger a Start
bit detection and will cause the first byte received
after the device has been initialized to be invalid.
To avoid this situation, the user should use a
pull-up or pull-down resistor on the RX pin
depending on the value of the URXINV bit.
a) If URXINV = 0, use a pull-up resistor on the
RX pin.
b) If URXINV = 1, use a pull-down resistor on
the RX pin.
The first character received on a wake-up from
Sleep mode caused by activity on the UxRX pin
of the UART module will be invalid. In Sleep
mode, peripheral clocks are disabled. By the
time the oscillator system has restarted and
stabilized from Sleep mode, the baud rate bit
sampling clock, relative to the incoming UxRX
bit timing, is no longer synchronized, resulting in
the first character being invalid; this is to be
expected.
DS70000652F-page 212
18.2
UART Resources
Many useful resources are provided on the main
product page of the Microchip web site for the devices
listed in this data sheet. This product page, which can
be accessed using this link, contains the latest updates
and additional information.
Note:
18.2.1
In the event you are not able to access
the product page using the link above,
enter this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en554109
KEY RESOURCES
• “UART” (DS70188) in the “dsPIC33/PIC24
Family Reference Manual”
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All related “dsPIC33/PIC24 Family Reference
Manual” sections
• Development Tools
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
18.3
UART Control Registers
REGISTER 18-1:
UxMODE: UARTx MODE REGISTER
R/W-0
U-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
UARTEN(1)
—
USIDL
IREN(2)
RTSMD
—
UEN1
UEN0
bit 15
bit 8
R/W-0, HC
R/W-0
R/W-0, HC
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
WAKE
LPBACK
ABAUD
URXINV
BRGH
PDSEL1
PDSEL0
STSEL
bit 7
bit 0
Legend:
HC = Hardware Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
UARTEN: UARTx Enable bit(1)
1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by the UEN<1:0> bits
0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption is
minimal
bit 14
Unimplemented: Read as ‘0’
bit 13
USIDL: UARTx Stop in Idle Mode bit
1 = Discontinues module operation when device enters Idle mode
0 = Continues module operation in Idle mode
bit 12
IREN: IrDA® Encoder and Decoder Enable bit(2)
1 = IrDA encoder and decoder are enabled
0 = IrDA encoder and decoder are disabled
bit 11
RTSMD: UARTx Mode Selection for UxRTS Pin bit
1 = UxRTS pin is in Simplex mode
0 = UxRTS pin is in Flow Control mode
bit 10
Unimplemented: Read as ‘0’
bit 9-8
UEN<1:0>: UARTx Pin Enable bits
11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin is controlled by port latches
10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used
01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin is controlled by port latches
00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins are controlled by
port latches
bit 7
WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit
1 = UARTx will continue to sample the UxRX pin; interrupt is generated on falling edge, bit is cleared
in hardware on following rising edge
0 = No wake-up is enabled
bit 6
LPBACK: UARTx Loopback Mode Select bit
1 = Enables Loopback mode
0 = Loopback mode is disabled
bit 5
ABAUD: Auto-Baud Enable bit
1 = Enables baud rate measurement on the next character – requires reception of a Sync field (55h)
before other data; cleared in hardware upon completion
0 = Baud rate measurement is disabled or completed
Note 1:
2:
Refer to “UART” (DS70188) in the “dsPIC33/PIC24 Family Reference Manual” for information on
enabling the UART module for receive or transmit operation.
This feature is available for 16x BRG mode (BRGH = 0) only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 213
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 18-1:
UxMODE: UARTx MODE REGISTER (CONTINUED)
bit 4
URXINV: UARTx Receive Polarity Inversion bit
1 = UxRX Idle state is ‘0’
0 = UxRX Idle state is ‘1’
bit 3
BRGH: High Baud Rate Enable bit
1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode)
0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode)
bit 2-1
PDSEL<1:0>: Parity and Data Selection bits
11 = 9-bit data, no parity
10 = 8-bit data, odd parity
01 = 8-bit data, even parity
00 = 8-bit data, no parity
bit 0
STSEL: Stop Bit Selection bit
1 = Two Stop bits
0 = One Stop bit
Note 1:
2:
Refer to “UART” (DS70188) in the “dsPIC33/PIC24 Family Reference Manual” for information on
enabling the UART module for receive or transmit operation.
This feature is available for 16x BRG mode (BRGH = 0) only.
DS70000652F-page 214
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 18-2:
UxSTA: UARTx STATUS AND CONTROL REGISTER
R/W-0
R/W-0
R/W-0
U-0
R/W-0, HC
R/W-0
R-0
R-1
UTXISEL1
UTXINV
UTXISEL0
—
UTXBRK
UTXEN(1)
UTXBF
TRMT
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R-1
R-0
R-0
R/C-0
R-0
URXISEL1
URXISEL0
ADDEN
RIDLE
PERR
FERR
OERR
URXDA
bit 7
bit 0
Legend:
C = Clearable bit
HC = Hardware Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15,13
UTXISEL<1:0>: UARTx Transmission Interrupt Mode Selection bits
11 = Reserved; do not use
10 = Interrupt when a character is transferred to the Transmit Shift Register (TSR) and as a result, the
transmit buffer becomes empty
01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit operations
are completed
00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at least
one character open in the transmit buffer)
bit 14
UTXINV: UARTx Transmit Polarity Inversion bit
If IREN = 0:
1 = UxTX Idle state is ‘0’
0 = UxTX Idle state is ‘1’
If IREN = 1:
1 = IrDA encoded, UxTX Idle state is ‘1’
0 = IrDA encoded, UxTX Idle state is ‘0’
bit 12
Unimplemented: Read as ‘0’
bit 11
UTXBRK: UARTx Transmit Break bit
1 = Sends Sync Break on next transmission – Start bit, followed by twelve ‘0’ bits, followed by Stop bit;
cleared by hardware upon completion
0 = Sync Break transmission is disabled or completed
bit 10
UTXEN: UARTx Transmit Enable bit(1)
1 = Transmit is enabled, UxTX pin is controlled by UARTx
0 = Transmit is disabled, any pending transmission is aborted and the buffer is reset; UxTX pin is
controlled by port
bit 9
UTXBF: UARTx Transmit Buffer Full Status bit (read-only)
1 = Transmit buffer is full
0 = Transmit buffer is not full, at least one more character can be written
bit 8
TRMT: Transmit Shift Register Empty bit (read-only)
1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed)
0 = Transmit Shift Register is not empty, a transmission is in progress or queued
bit 7-6
URXISEL<1:0>: UARTx Receive Interrupt Mode Selection bits
11 = Interrupt is set on UxRSR transfer, making the receive buffer full (i.e., has 4 data characters)
10 = Interrupt is set on UxRSR transfer, making the receive buffer 3/4 full (i.e., has 3 data characters)
0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive
buffer; receive buffer has one or more characters
Note 1:
Refer to “UART” (DS70188) in the “dsPIC33/PIC24 Family Reference Manual” for information on enabling
the UART module for transmit operation.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 215
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 18-2:
UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED)
bit 5
ADDEN: Address Character Detect bit (Bit 8 of received data = 1)
1 = Address Detect mode is enabled; if 9-bit mode is not selected, this does not take effect
0 = Address Detect mode is disabled
bit 4
RIDLE: Receiver Idle bit (read-only)
1 = Receiver is Idle
0 = Receiver is active
bit 3
PERR: Parity Error Status bit (read-only)
1 = Parity error has been detected for the current character (character at the top of the receive FIFO)
0 = Parity error has not been detected
bit 2
FERR: Framing Error Status bit (read-only)
1 = Framing error has been detected for the current character (character at the top of the receive FIFO)
0 = Framing error has not been detected
bit 1
OERR: Receive Buffer Overrun Error Status bit (read-only/clear only)
1 = Receive buffer has overflowed
0 = Receive buffer has not overflowed; clearing a previously set OERR bit (1  0 transition) will reset
the receiver buffer and the UxRSR to the empty state
bit 0
URXDA: UARTx Receive Buffer Data Available bit (read-only)
1 = Receive buffer has data, at least one more character can be read
0 = Receive buffer is empty
Note 1:
Refer to “UART” (DS70188) in the “dsPIC33/PIC24 Family Reference Manual” for information on enabling
the UART module for transmit operation.
DS70000652F-page 216
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
19.0
10-BIT ANALOG-TO-DIGITAL
CONVERTER (ADC)
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 family
devices. It is not intended to be a comprehensive reference source. To complement
the information in this data sheet, refer
to
“Analog-to-Digital
Converter
(ADC)” (DS70183) in the “dsPIC33/
PIC24 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices have up to
14 ADC module input channels.
19.1
Key Features
Depending on the particular device pinout, the ADC
can have up to 14 analog input pins.
Block diagrams of the ADC module are shown in
Figure 19-1 through Figure 19-3.
19.2
ADC Initialization
To configure the ADC module:
1.
2.
3.
4.
5.
6.
7.
Select
port
pins
as
analog
inputs
(AD1PCFGL<15:0>).
Select the analog conversion clock to match the
desired data rate with the processor clock
(ADxCON3<7:0>).
Determine how many Sample-and-Hold
channels will be used (ADxCON2<9:8>).
Select the appropriate sample and conversion
sequence
(ADxCON1<7:5>
and
ADxCON3<12:8>).
Select the way conversion results are presented
in the buffer (ADxCON1<9:8>).
Turn on the ADC module (ADxCON1<15>).
Configure the ADC interrupt (if required):
a) Clear the ADxIF bit.
b) Select the ADC interrupt priority.
The 10-bit ADC configuration has the following key
features:
•
•
•
•
•
•
•
•
•
•
Successive Approximation (SAR) conversion
Conversion speeds of up to 1.1 Msps
Up to 14 analog input pins
Four Sample-and-Hold (S&H) circuits for
simultaneous sampling of up to four analog input
pins
Automatic Channel Scan mode
Selectable conversion trigger source
Selectable Buffer Fill modes
Four result alignment options (signed/unsigned,
fractional/integer)
Operation during CPU Sleep and Idle modes
16-word conversion result buffer
 2011-2014 Microchip Technology Inc.
DS70000652F-page 217
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 19-1:
ADC1 BLOCK DIAGRAM FOR dsPIC33FJXX(GP/MC)101 DEVICES
CTMUI(1)
CTMU TEMP(1)
Open(2)
AN0-AN3
AN9(3)
AN10(3)
S&H0
Channel
Scan
+
CH0SA<4:0>
CH0
CH0SB<4:0>
-
CSCNA
AN1
VREFL
CH0NA CH0NB
AN0
AVDD
AN3
AVSS
S&H1
+
-
CH123SA CH123SB
CH1
AN9(3)
VCFG<2:0>
ADC1BUF0
VREFL
ADC1BUF1
ADC1BUF2
VREFH
CH123NA CH123NB
VREFL
SAR ADC
AN1
S&H2
ADC1BUFE
+
CH123SA CH123SB
CH2
ADC1BUFF
-
AN10(3)
VREFL
CH123NA CH123NB
AN2
S&H3
+
CH123SA
CH123SB
CH3
-
VREFL
CH123NA
CH123NB
Alternate Input Selection
Note 1:
2:
3:
Internally connected to the CTMU module.
This selection is only used with CTMU capacitive and time measurement.
This pin is available in dsPIC33FJ32(GP/MC)101 devices only.
DS70000652F-page 218
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 19-2:
ADC1 BLOCK DIAGRAM FOR dsPIC33FJXX(GP/MC)102 DEVICES
CTMUI(1)
CTMU TEMP(1)
Open(2)
AN0-AN5
AN9(3)
AN10(3)
S&H0
Channel
Scan
+
CH0SA<4:0>
CH0
CH0SB<4:0>
-
CSCNA
AN1
VREFL
CH0NA CH0NB
AN0
AVDD
AN3
AVSS
S&H1
+
-
CH123SA CH123SB
CH1
AN9(3)
VCFG<2:0>
ADC1BUF0
VREFL
ADC1BUF1
ADC1BUF2
VREFH
CH123NA
VREFL
CH123NB
SAR ADC
AN1
AN4
S&H2
CH123SA
CH2
CH123SB
+
ADC1BUFE
-
ADC1BUFF
AN10(3)
VREFL
CH123NA CH123NB
AN2
AN5
S&H3
+
CH123SA CH123SB
CH3
-
VREFL
CH123NA CH123NB
Alternate Input Selection
Note 1:
2:
3:
Internally connected to the CTMU module.
This selection is only used with CTMU capacitive and time measurement.
This pin is available in dsPIC33FJ32(GP/MC)101 devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 219
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 19-3:
ADC1 BLOCK DIAGRAM FOR dsPIC33FJ32(GP/MC)104 DEVICES
CTMUI(1)
CTMU TEMP(1)
Open(2)
AN0-AN12
AN15
S&H0
Channel
Scan
+
CH0SA<4:0>
CH0
CH0SB<4:0>
-
CSCNA
AN1
VREFL
CH0NA CH0NB
AN0
AVDD
AN3
AVSS
S&H1
+
CH123SA
-
CH123SB
CH1
AN6
VCFG<2:0>
AN9
ADC1BUF0
VREFL
ADC1BUF1
ADC1BUF2
VREFH
CH123NA CH123NB
VREFL
SAR ADC
AN1
AN4
S&H2
CH123SA CH123SB
+
ADC1BUFE
-
ADC1BUFF
CH2
AN7
AN10
VREFL
CH123NA CH123NB
AN2
AN5
S&H3
+
CH123SA CH123SB
CH3
-
AN8
AN11
VREFL
CH123NA CH123NB
Alternate Input Selection
Note 1:
2:
Internally connected to the CTMU module.
This selection is only used with CTMU capacitive and time measurement.
DS70000652F-page 220
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 19-4:
ADC1 CONVERSION CLOCK PERIOD BLOCK DIAGRAM
AD1CON3<15>
ADC1 Internal
RC Clock(1)
1
TAD
AD1CON3<5:0>
0
6
TOSC(1)
TCY
X2
ADC1 Conversion
Clock Multiplier
1, 2, 3, 4, 5,..., 64
Note 1:
19.3
1.
2.
3.
See the ADC specifications in Section 26.0 “Electrical Characteristics” for the exact RC clock value.
ADC Helpful Tips
The SMPI<3:0> (AD1CON2<5:2>) control bits:
a) Determine when the ADC interrupt flag is
set and an interrupt is generated if enabled.
b) When the CSCNA bit (AD1CON2<10>) is
set to ‘1’, determine when the ADC analog
scan channel list, defined in the AD1CSSL
register, starts over from the beginning.
The ADC has 16 result buffers. ADC conversion
results are stored sequentially in ADC1BUF0ADC1BUFF, regardless of which analog inputs
are being used, subject to the SMPI<3:0> bits
(AD1CON2<5:2>). There is no relationship
between the ANx input being measured and
which ADC buffer (ADC1BUF0-ADC1BUFF)
that the conversion results will be placed in.
The DONE bit (AD1CON1<0>) is only cleared at
the start of each conversion and is set at the
completion of the conversion, but remains set
indefinitely, even through the next sample phase
until the next conversion begins. If application
code is monitoring the DONE bit in any kind of
software loop, the user must consider this
behavior because the CPU code execution is
faster than the ADC. As a result, in Manual
Sample mode, particularly where the user’s
code is setting the SAMP bit (AD1CON1<1>),
the DONE bit should also be cleared by the user
application just before setting the SAMP bit.
 2011-2014 Microchip Technology Inc.
19.4
ADC Resources
Many useful resources are provided on the main product page of the Microchip web site for the devices listed
in this data sheet. This product page, which can be
accessed using this link, contains the latest updates
and additional information.
Note:
19.4.1
In the event you are not able to access
the product page using the link above,
enter this URL in your browser: http://
www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en554109
KEY RESOURCES
• “Analog-to-Digital Converter (ADC)”
(DS70183) in the “dsPIC33/PIC24 Family
Reference Manual”
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All related “dsPIC33/PIC24 Family Reference
Manual” sections
• Development Tools
DS70000652F-page 221
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
19.5
ADC Control Registers
REGISTER 19-1:
AD1CON1: ADC1 CONTROL REGISTER 1
R/W-0
U-0
R/W-0
U-0
U-0
U-0
R/W-0
R/W-0
ADON
—
ADSIDL
—
—
—
FORM1
FORM0
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
SSRC2
SSRC1
SSRC0
—
SIMSAM
ASAM
R/W-0, HC, HS R/C-0, HC, HS
SAMP
bit 7
DONE
bit 0
Legend:
C = Clearable bit
HS = Hardware Settable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
HC = Hardware Clearable bit
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ADON: ADC1 Operating Mode bit
1 = ADC1 module is operating
0 = ADC1 is off
bit 14
Unimplemented: Read as ‘0’
bit 13
ADSIDL: ADC1 Stop in Idle Mode bit
1 = Discontinues module operation when device enters Idle mode
0 = Continues module operation in Idle mode
bit 12-10
Unimplemented: Read as ‘0’
bit 9-8
FORM<1:0>: Data Output Format bits
11 = Signed fractional (DOUT = sddd dddd dd00 0000, where s = .NOT.d<9>)
10 = Fractional (DOUT = dddd dddd dd00 0000)
01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>)
00 = Integer (DOUT = 0000 00dd dddd dddd)
bit 7-5
SSRC<2:0>: Sample Clock Source Select bits
111 = Internal counter ends sampling and starts conversion (auto-convert)
110 = CTMU
101 = Reserved
100 = Reserved
011 = Motor control PWM interval ends sampling and starts conversion(1)
010 = GP Timer3 compare ends sampling and starts conversion
001 = Active transition on INT0 pin ends sampling and starts conversion
000 = Clearing SAMP bit ends sampling and starts conversion
bit 4
Unimplemented: Read as ‘0’
bit 3
SIMSAM: Simultaneous Sample Select bit (applicable only when CHPS<1:0> = 01 or 1x)
1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x) or samples CH0 and CH1
simultaneously (when CHPS<1:0> = 01)
0 = Samples multiple channels individually in sequence
bit 2
ASAM: ADC1 Sample Auto-Start bit
1 = Sampling begins immediately after last conversion; SAMP bit is auto-set
0 = Sampling begins when the SAMP bit is set
Note 1:
This feature is available in dsPIC33FJ(16/32)MC10X devices only.
DS70000652F-page 222
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 19-1:
AD1CON1: ADC1 CONTROL REGISTER 1 (CONTINUED)
bit 1
SAMP: ADC1 Sample Enable bit
1 = ADC1 Sample-and-Hold amplifiers are sampling
0 = ADC1 Sample-and-Hold amplifiers are holding
If ASAM = 0, software can write ‘1’ to begin sampling; automatically set by hardware if ASAM = 1. If
SSRC<2:0> = 000, software can write ‘0’ to end sampling and start conversion. If SSRC<2:0> 000,
automatically cleared by hardware to end sampling and start conversion.
bit 0
DONE: ADC1 Conversion Status bit
1 = ADC1 conversion cycle is completed
0 = ADC1 conversion has not started or is in progress
Automatically set by hardware when ADC conversion is complete. Software can write ‘0’ to clear the
DONE bit status (software not allowed to write ‘1’). Clearing this bit will NOT affect any operation in
progress. Automatically cleared by hardware at start of a new conversion.
Note 1:
This feature is available in dsPIC33FJ(16/32)MC10X devices only.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 223
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 19-2:
AD1CON2: ADC1 CONTROL REGISTER 2
R/W-0
R/W-0
R/W-0
U-0
U-0
R/W-0
R/W-0
R/W-0
VCFG2
VCFG1
VCFG0
—
—
CSCNA
CHPS1
CHPS0
bit 15
bit 8
R-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
BUFS
—
SMPI3
SMPI2
SMPI1
SMPI0
BUFM
ALTS
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-13
x = Bit is unknown
VCFG<2:0>: Converter Voltage Reference Configuration bits
xxx
ADREF+
ADREF-
AVDD
AVSS
bit 12-11
Unimplemented: Read as ‘0’
bit 10
CSCNA: Scan Input Selections for CH0+ During Sample A bit
1 = Scans inputs
0 = Does not scan inputs
bit 9-8
CHPS<1:0>: Select Channels Utilized bits
1x = Converts CH0, CH1, CH2 and CH3
01 = Converts CH0 and CH1
00 = Converts CH0
bit 7
BUFS: Buffer Fill Status bit (valid only when BUFM = 1)
1 = ADC1 is currently filling second half of buffer, user should access data in the first half
0 = ADC1 is currently filling first half of buffer, user application should access data in the second half
bit 6
Unimplemented: Read as ‘0’
bit 5-2
SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits
1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence
1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence
•
•
•
0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence
0000 = Interrupts at the completion of conversion for each sample/convert sequence
bit 1
BUFM: Buffer Fill Mode Select bit
1 = Starts filling first half of buffer on first interrupt and the second half of buffer on next interrupt
0 = Always starts filling buffer from the beginning
bit 0
ALTS: Alternate Input Sample Mode Select bit
1 = Uses channel input selects for Sample A on first sample and Sample B on next sample
0 = Always uses channel input selects for Sample A
DS70000652F-page 224
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 19-3:
AD1CON3: ADC1 CONTROL REGISTER 3
R/W-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADRC
—
—
SAMC4(1)
SAMC3(1)
SAMC2(1)
SAMC1(1)
SAMC0(1)
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADCS7(2)
ADCS6(2)
ADCS5(2)
ADCS4(2)
ADCS3(2)
ADCS2(2)
ADCS1(2)
ADCS0(2)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
ADRC: ADC1 Conversion Clock Source bit
1 = ADC1 internal RC clock
0 = Clock derived from system clock
bit 14-13
Unimplemented: Read as ‘0’
bit 12-8
SAMC<4:0>: Auto-Sample Time bits(1)
11111 = 31 TAD
•
•
•
00001 = 1 TAD
00000 = 0 TAD
bit 7-0
ADCS<7:0>: ADC1 Conversion Clock Select bits(2)
11111111 = Reserved
•
•
•
•
01000000 = Reserved
00111111 = TCY • (ADCS<7:0> + 1) = 64 • TCY = TAD
•
•
•
00000010 = TCY • (ADCS<7:0> + 1) = 3 • TCY = TAD
00000001 = TCY • (ADCS<7:0> + 1) = 2 • TCY = TAD
00000000 = TCY • (ADCS<7:0> + 1) = 1 • TCY = TAD
Note 1:
2:
x = Bit is unknown
This bit is only used if SSRC<2:0> (AD1CON1<7:5>) = 1.
This bit is not used if ADRC (AD1CON3<15>) = 1.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 225
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 19-4:
AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
CH123NB1
CH123NB0
CH123SB
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
CH123NA1
CH123NA0
CH123SA
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-11
Unimplemented: Read as ‘0’
bit 10-9
CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits
dsPIC33FJ16(GP/MC)101/102 Devices Only:
11 = Reserved
10 = Reserved
0x = CH1, CH2, CH3 negative inputs are AVSS
dsPIC33FJ32(GP/MC)101/102 Devices Only:
11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is not connected
10 = Reserved
0x = CH1, CH2, CH3 negative inputs are AVSS
dsPIC33FJ32(GP/MC)104 Devices Only:
11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11
10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8
0x = CH1, CH2, CH3 negative inputs are AVSS
bit 8
CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit
dsPIC33FJXX(GP/MC)101 Devices Only:
1 = CH1 positive input is AN3, CH2 and CH3 positive inputs are not connected
0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2
All Other Devices:
1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5
0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2
bit 7-3
Unimplemented: Read as ‘0’
bit 2-1
CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits
Refer to bits<10-9> for the available settings.
bit 0
CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit
Refer to bit 8 for the available settings.
DS70000652F-page 226
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 19-5:
AD1CHS0: ADC1 INPUT CHANNEL 0 SELECT REGISTER
R/W-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CH0NB
—
—
CH0SB4
CH0SB3
CH0SB2
CH0SB1
CH0SB0
bit 15
bit 8
R/W-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CH0NA
—
—
CH0SA4
CH0SA3
CH0SA2
CH0SA1
CH0SA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
CH0NB: Channel 0 Negative Input Select for Sample B bit
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is AVSS
bit 14-13
Unimplemented: Read as ‘0’
bit 12-8
CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits
11111-10000 = Reserved; do not use
01111 = Channel 0 positive input is AN15(2)
01110 = No channels connected, all inputs are floating (used for CTMU)
01101 = Channel 0 positive input is connected to CTMU temperature sensor
01100 = Channel 0 positive input is AN12(2)
01011 = Channel 0 positive input is AN11(2)
01010 = Channel 0 positive input is AN10(3)
01001 = Channel 0 positive input is AN9(3)
01000 = Channel 0 positive input is AN8(2)
00111 = Channel 0 positive input is AN7(2)
00110 = Channel 0 positive input is AN6(2)
00101 = Channel 0 positive input is AN5(1)
00100 = Channel 0 positive input is AN4(1)
00011 = Channel 0 positive input is AN3
00010 = Channel 0 positive input is AN2
00001 = Channel 0 positive input is AN1
00000 = Channel 0 positive input is AN0
bit 7
CH0NA: Channel 0 Negative Input Select for Sample A bit
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is AVSS
bit 6-5
Unimplemented: Read as ‘0’
bit 4-0
CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits
Refer to bits<12-8> for the available settings.
Note 1:
2:
3:
This setting is available in all devices, excluding the dsPIC33FJXX(GP/MC)101, where it is reserved.
This setting is available in the dsPIC33FJ32(GP/MC)104 devices only and is reserved in all other devices.
This setting is available in all devices, excluding the dsPIC33FJ16(GP/MC)101/102, where it is reserved.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 227
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
,2
AD1CSSL: ADC1 INPUT SCAN SELECT REGISTER LOW(1,2,3)
REGISTER 19-6:
R/W-0
U-0
U-0
CSS15(4)
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CSS<12:8>(4,6)
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CSS<7:0>(4,5)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
CSS15: ADC1 Input Scan Selection bit(4)
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 14-13
Unimplemented: Read as ‘0’
bit 12-0
CSS<12:0>: ADC1 Input Scan Selection bits(4,5,6)
1 = Selects ANx for input scan
0 = Skips ANx for input scan
Note 1:
2:
3:
4:
5:
6:
x = Bit is unknown
On devices without 14 analog inputs, all AD1CSSL bits can be selected by the user application. However,
inputs selected for scan without a corresponding input on the device converts VREFL.
CSSx = ANx, where x = 0 through 12 and 15.
CTMU temperature sensor input cannot be scanned.
The CSS<15,12:11,8:6> bits are available in the dsPIC33FJ32(GP/MC)104 devices only and are reserved
in all other devices.
The CSS<5:4> bits are available on all devices, excluding the dsPIC33FJXX(GP/MC)101 devices, where
they are reserved.
The CSS<10:9> bits are available on all devices, excluding the dsPIC33FJ16(GP/MC)101/102 devices,
where they are reserved.
DS70000652F-page 228
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 19-7:
AD1PCFGL: ADC1 PORT CONFIGURATION REGISTER LOW(1,2,3)
R/W-0
U-0
U-0
PCFG15(4,5)
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PCFG<12:0>(4,5,7)
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PCFG<7:0>(4,5,6)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
PCFG15: ADC1 Port Configuration Control bit(4,5)
1 = Port pin is in Digital mode, port read input is enabled, ADC1 input multiplexer is connected to AVSS
0 = Port pin is in Analog mode, port read input is disabled, ADC1 samples pin voltage
bit 14-13
Unimplemented: Read as ‘0’
bit 12-0
PCFG<12:0>: ADC1 Port Configuration Control bits(4,5,6,7)
1 = Port pin is in Digital mode, port read input is enabled, ADC1 input multiplexer is connected to AVSS
0 = Port pin is in Analog mode, port read input is disabled, ADC1 samples pin voltage
Note 1:
2:
3:
4:
5:
6:
7:
On devices without 14 analog inputs, all PCFGx bits are R/W by user. However, PCFGx bits are ignored on
ports without a corresponding input on the device.
PCFGx = ANx, where x = 0 through 12 and 15.
The PCFGx bits have no effect if the ADC module is disabled by setting the AD1MD bit in the PMD1 register.
When the bit is set, all port pins that have been multiplexed with ANx will be in Digital mode.
Pins shared with analog functions (i.e., ANx) are analog by default and therefore, must be set by the user
to enable any digital function on that pin. Reading any port pin with the analog function enabled will return
a ‘0’, regardless of the signal input level.
The PCFG<15,12:11,8:6> bits are available in the dsPIC33FJ32(GP/MC)104 devices only and are
reserved in all other devices.
The PCFG<5:4> bits are available on all devices, excluding the dsPIC33FJXX(GP/MC)101 devices, where
they are reserved.
The PCFG<10:9> bits are available on all devices, excluding the dsPIC33FJ16(GP/MC)101/102 devices,
where they are reserved.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 229
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 230
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
20.0
COMPARATOR MODULE
The comparator module provides three comparators
that can be configured in different ways. As shown in
Figure 20-1, individual comparator options are
specified by the comparator module’s Special Function
Register (SFR) control bits.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
device families. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Comparator with Blanking” (DS70647) in the “dsPIC33/PIC24
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
These options allow users to:
• Select the edge for trigger and interrupt generation
• Select low-power control
• Configure the comparator voltage reference and
band gap
• Configure output blanking and masking
The comparator operating mode is determined by the
input selections (i.e., whether the input voltage is
compared to a second input voltage) to an internal
voltage reference.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
FIGURE 20-1:
COMPARATOR I/O OPERATING MODES
EVPOL<1:0>
INTREF
C1INB
C1INC
MUX
VIN-
C1IND
VIN+
CVREFIN
C1INA
–
C1
+
Blanking
Function
(Figure 20-3)
Digital
Filter
(Figure 20-4)
EVPOL<1:0>
MUX
VIN-
C2IND
VIN+
CVREFIN
CPOL
–
C2
+
Blanking
Function
(Figure 20-3)
COE
C2OUT
COUT
MUX
EVPOL<1:0>
MUX
C3INC
VIN-
C3IND
VIN+
CVREFIN
C3INA
Interrupt
Logic
Digital
Filter
(Figure 20-4)
INTREF
C3INB
C1OUT
MUX
C2INC
C2INA
COE
COUT
INTREF
C2INB
CPOL
Interrupt
Logic
CPOL
–
+
C3
Blanking
Function
(Figure 20-3)
Interrupt
Logic
COE
Digital
Filter
(Figure 20-4)
C3OUT
COUT
MUX
Comparator Voltage
Reference
(Figure 20-2)
CVREF
BGSEL<1:0>
AVDD
AVSS
IVREF(1)
Note 1:
This reference voltage is generated internally on the device. Refer to Section 26.0 “Electrical Characteristics”
for the specified voltage range.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 231
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 20-2:
COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
CVRCON<3:0>
CVRSRC
VREFSEL
CVR3
CVR2
CVR1
CVR0
AVDD(1)
8R
CVREFIN
R
CVREN
R
16-to-1 MUX
R
R
16 Steps
CVREF
R
CVROE (CVRCON<6>)
R
R
CVRR
8R
AVSS(1)
Note 1:
This pin is VDD and VSS on devices that have no AVDD or AVSS pins.
FIGURE 20-3:
USER-PROGRAMMABLE BLANKING FUNCTION BLOCK DIAGRAM
Blanking
Signals
MUX A
SELSRCA<3:0>
(CMxMSKSRC<3:0>)
Comparator Output
MAI
“AND-OR” Function
MAI
MBI
Blanking
Logic
To Digital
Filter
ANDI
AND
SELSRCB<3:0>
(CMxMSKSRC<7:4)
MCI
HLMS
(CMxMSKCON<15>)
Blanking
Signals
MUX B
MAI
MBI
MBI
OR
MASK
MCI
SELSRCC<3:0>
(CMxMSKSRC<11:8)
Blanking
Signals
MUX C
CMxMSKCON
DS70000652F-page 232
MCI
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 20-4:
DIGITAL FILTER INTERCONNECT BLOCK DIAGRAM
Timer2
Timer3
PWM Special Event Trigger
FOSC
FCY
CFDIV
CFLTREN
CFSEL<2:0>
From Blanking Logic
Digital Filter
CXOUT
 2011-2014 Microchip Technology Inc.
DS70000652F-page 233
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
20.1
Comparator Control Registers
REGISTER 20-1:
CMSTAT: COMPARATOR STATUS REGISTER
R/W-0
U-0
U-0
U-0
U-0
R-0
R-0
R-0
CMSIDL
—
—
—
—
C3EVT
C2EVT
C1EVT
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
R-0
R-0
R-0
—
—
—
—
—
C3OUT
C2OUT
C1OUT
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
CMSIDL: Comparator Stop in Idle Mode bit
1 = Discontinues operation of all comparators when device enters Idle mode
0 = Continues operation of all comparators in Idle mode
bit 14-11
Unimplemented: Read as ‘0’
bit 10
C3EVT: Comparator 3 Event Status bit
1 = Comparator event occurred
0 = Comparator event did not occur
bit 9
C2EVT: Comparator 2 Event Status bit
1 = Comparator event occurred
0 = Comparator event did not occur
bit 8
C1EVT: Comparator 1 Event Status bit
1 = Comparator event occurred
0 = Comparator event did not occur
bit 7-3
Unimplemented: Read as ‘0’
bit 2
C3OUT: Comparator 3 Output Status bit
When CPOL = 0:
1 = VIN+ > VIN0 = VIN+ < VINWhen CPOL = 1:
1 = VIN+ < VIN0 = VIN+ > VIN-
bit 1
C2OUT: Comparator 2 Output Status bit
When CPOL = 0:
1 = VIN+ > VIN0 = VIN+ < VINWhen CPOL = 1:
1 = VIN+ < VIN0 = VIN+ > VIN-
bit 0
C1OUT: Comparator 1 Output Status bit
When CPOL = 0:
1 = VIN+ > VIN0 = VIN+ < VINWhen CPOL = 1:
1 = VIN+ < VIN0 = VIN+ > VIN-
DS70000652F-page 234
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 20-2:
CMxCON: COMPARATOR x CONTROL REGISTER
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
R/W-0
R/W-0
CON
COE
CPOL
—
—
—
CEVT
COUT
bit 15
bit 8
R/W-0
R/W-0
U-0
R/W-0
U-0
U-0
R/W-0
R/W-0
EVPOL1
EVPOL0
—
CREF
—
—
CCH1
CCH0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
CON: Comparator x Enable bit
1 = Comparator x is enabled
0 = Comparator x is disabled
bit 14
COE: Comparator x Output Enable bit
1 = Comparator output is present on the CxOUT pin
0 = Comparator output is internal only
bit 13
CPOL: Comparator x Output Polarity Select bit
1 = Comparator x output is inverted
0 = Comparator x output is not inverted
bit 12-10
Unimplemented: Read as ‘0’
bit 9
CEVT: Comparator x Event bit
1 = Comparator x event according to EVPOL<1:0> settings occurred; disables future triggers and
interrupts until the bit is cleared
0 = Comparator x event did not occur
bit 8
COUT: Comparator x Output bit
When CPOL = 0 (non-inverted polarity):
1 = VIN+ > VIN0 = VIN+ < VINWhen CPOL = 1 (inverted polarity):
1 = VIN+ < VIN0 = VIN+ > VIN-
bit 7-6
EVPOL<1:0>: Trigger/Event/Interrupt Polarity Select bits
11 = Trigger/event/interrupt is generated on any change of the comparator output (while CEVT = 0)
10 = Trigger/event/interrupt is generated only on high-to-low transition of the polarity selected
comparator output (while CEVT = 0)
If CPOL = 1 (inverted polarity):
Low-to-high transition of the comparator output.
If CPOL = 0 (non-inverted polarity):
High-to-low transition of the comparator output.
01 = Trigger/event/interrupt is generated only on low-to-high transition of the polarity selected
comparator output (while CEVT = 0)
If CPOL = 1 (inverted polarity):
High-to-low transition of the comparator output.
If CPOL = 0 (non-inverted polarity):
Low-to-high transition of the comparator output.
00 = Trigger/event/interrupt generation is disabled
bit 5
Unimplemented: Read as ‘0’
 2011-2014 Microchip Technology Inc.
DS70000652F-page 235
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 20-2:
CMxCON: COMPARATOR x CONTROL REGISTER (CONTINUED)
bit 4
CREF: Comparator x Reference Select bit (VIN+ input)
1 = VIN+ input connects to internal CVREFIN voltage
0 = VIN+ input connects to CxINA pin
bit 3-2
Unimplemented: Read as ‘0’
bit 1-0
CCH<1:0>: Comparator x Channel Select bits
11 = VIN- input of comparator connects to INTREF
10 = VIN- input of comparator connects to CXIND pin
01 = VIN- input of comparator connects to CXINC pin
00 = VIN- input of comparator connects to CXINB pin
DS70000652F-page 236
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 20-3: CMxMSKSRC: COMPARATOR x MASK SOURCE SELECT REGISTER
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
RW-0
—
—
—
—
SELSRCC3
SELSRCC2
SELSRCC1
SELSRCC0
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
SELSRCB3
SELSRCB2
SELSRCB1
SELSRCB0
SELSRCA3
SELSRCA2
SELSRCA1
SELSRCA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unimplemented: Read as ‘0’
bit 11-8
SELSRCC<3:0>: Mask C Input Select bits
1111 = Reserved
1110 = Reserved
1101 = Reserved
1100 = Reserved
1011 = Reserved
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0110 = Reserved
0101 = PWM1H3
0100 = PWM1L3
0011 = PWM1H2
0010 = PWM1L2
0001 = PWM1H1
0000 = PWM1L1
bit 7-4
SELSRCB<3:0>: Mask B Input Select bits
1111 = Reserved
1110 = Reserved
1101 = Reserved
1100 = Reserved
1011 = Reserved
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0110 = Reserved
0101 = PWM1H3
0100 = PWM1L3
0011 = PWM1H2
0010 = PWM1L2
0001 = PWM1H1
0000 = PWM1L1
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 237
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 20-3: CMxMSKSRC: COMPARATOR x MASK SOURCE SELECT REGISTER (CONTINUED)
bit 3-0
SELSRCA<3:0>: Mask A Input Select bits
1111 = Reserved
1110 = Reserved
1101 = Reserved
1100 = Reserved
1011 = Reserved
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0110 = Reserved
0101 = PWM1H3
0100 = PWM1L3
0011 = PWM1H2
0010 = PWM1L2
0001 = PWM1H1
0000 = PWM1L1
DS70000652F-page 238
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 20-4:
CMxMSKCON: COMPARATOR x MASK GATING CONTROL
REGISTER
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
HLMS
—
OCEN
OCNEN
OBEN
OBNEN
OAEN
OANEN
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
NAGS
PAGS
ACEN
ACNEN
ABEN
ABNEN
AAEN
AANEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
HLMS: High or Low Level Masking Select bits
1 = The masking (blanking) function will prevent any asserted (‘0’) comparator signal from propagating
0 = The masking (blanking) function will prevent any asserted (‘1’) comparator signal from propagating
bit 14
Unimplemented: Read as ‘0’
bit 13
OCEN: OR Gate C Input Inverted Enable bit
1 = MCI is connected to OR gate
0 = MCI is not connected to OR gate
bit 12
OCNEN: OR Gate C Input Inverted Enable bit
1 = Inverted MCI is connected to OR gate
0 = Inverted MCI is not connected to OR gate
bit 11
OBEN: OR Gate B Input Inverted Enable bit
1 = MBI is connected to OR gate
0 = MBI is not connected to OR gate
bit 10
OBNEN: OR Gate B Input Inverted Enable bit
1 = Inverted MBI is connected to OR gate
0 = Inverted MBI is not connected to OR gate
bit 9
OAEN: OR Gate A Input Enable bit
1 = MAI is connected to OR gate
0 = MAI is not connected to OR gate
bit 8
OANEN: OR Gate A Input Inverted Enable bit
1 = Inverted MAI is connected to OR gate
0 = Inverted MAI is not connected to OR gate
bit 7
NAGS: Negative AND Gate Output Select
1 = Inverted ANDI is connected to OR gate
0 = Inverted ANDI is not connected to OR gate
bit 6
PAGS: Positive AND Gate Output Select
1 = ANDI is connected to OR gate
0 = ANDI is not connected to OR gate
bit 5
ACEN: AND Gate A1 C Input Inverted Enable bit
1 = MCI is connected to AND gate
0 = MCI is not connected to AND gate
bit 4
ACNEN: AND Gate A1 C Input Inverted Enable bit
1 = Inverted MCI is connected to AND gate
0 = Inverted MCI is not connected to AND gate
 2011-2014 Microchip Technology Inc.
DS70000652F-page 239
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 20-4:
CMxMSKCON: COMPARATOR x MASK GATING CONTROL
REGISTER (CONTINUED)
bit 3
ABEN: AND Gate A1 B Input Inverted Enable bit
1 = MBI is connected to AND gate
0 = MBI is not connected to AND gate
bit 2
ABNEN: AND Gate A1 B Input Inverted Enable bit
1 = Inverted MBI is connected to AND gate
0 = Inverted MBI is not connected to AND gate
bit 1
AAEN: AND Gate A1 A Input Enable bit
1 = MAI is connected to AND gate
0 = MAI is not connected to AND gate
bit 0
AANEN: AND Gate A1 A Input Inverted Enable bit
1 = Inverted MAI is connected to AND gate
0 = Inverted MAI is not connected to AND gate
DS70000652F-page 240
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 20-5:
CMxFLTR: COMPARATOR x FILTER CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
CFSEL2
CFSEL1
CFSEL0
CFLTREN
CFDIV2
CFDIV1
CFDIV0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
CFSEL<2:0>: Comparator Filter Input Clock Select bits
111 = Reserved
110 = Reserved
101 = Timer3
100 = Timer2
011 = Reserved
010 = PWM Special Event Trigger
001 = FOSC
000 = FCY
bit 3
CFLTREN: Comparator Filter Enable bit
1 = Digital filter is enabled
0 = Digital filter is disabled
bit 2-0
CFDIV<2:0>: Comparator Filter Clock Divide Select bits
111 = Clock Divide 1:128
110 = Clock Divide 1:64
101 = Clock Divide 1:32
100 = Clock Divide 1:16
011 = Clock Divide 1:8
010 = Clock Divide 1:4
001 = Clock Divide 1:2
000 = Clock Divide 1:1
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 241
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 20-6:
CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
VREFSEL
BGSEL1
BGSEL0
bit 15
bit 8
R/W-0
R/W-0
CVREN
CVROE
(1)
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
CVRR
—
CVR3
CVR2
CVR1
CVR0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-11
Unimplemented: Read as ‘0’
bit 10
VREFSEL: Voltage Reference Select bit
1 = CVREFIN = CVREF pin
0 = CVREFIN is generated by the resistor network
bit 9-8
BGSEL<1:0>: Band Gap Reference Source Select bits
11 = INTREF = CVREF pin
10 = INTREF = 1.2V (nominal)(2)
0x = Reserved
bit 7
CVREN: Comparator Voltage Reference Enable bit
1 = Comparator voltage reference circuit is powered on
0 = Comparator voltage reference circuit is powered down
bit 6
CVROE: Comparator Voltage Reference Output Enable bit(1)
1 = Voltage level is output on CVREF pin
0 = Voltage level is disconnected from CVREF pin
bit 5
CVRR: Comparator Voltage Reference Range Selection bit
1 = CVRSRC/24 step-size
0 = CVRSRC/32 step-size
bit 4
Unimplemented: Read as ‘0’
bit 3-0
CVR<3:0>: Comparator Voltage Reference Value Selection 0  CVR<3:0>  15 bits
When CVRR = 1:
CVREFIN = (CVR<3:0>/24) • (CVRSRC)
When CVRR = 0:
CVREFIN = 1/4 • (CVRSRC) + (CVR<3:0>/32) • (CVRSRC)
Note 1:
2:
CVROE overrides the TRISx bit setting.
This reference voltage is generated internally on the device. Refer to Section 26.0 “Electrical Characteristics”
for the specified voltage range.
DS70000652F-page 242
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
21.0
REAL-TIME CLOCK AND
CALENDAR (RTCC)
Some of the key features of the RTCC module are:
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
device families of devices. It is not
intended to be a comprehensive reference
source. To complement the information in
this data sheet, refer to “Real-Time Clock
and Calendar (RTCC)” (DS70310) in the
“dsPIC33/PIC24 Family Reference Manual”, which is available on the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
This chapter discusses the Real-Time Clock
and Calendar (RTCC) module, available
on
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices, and its
operation.
•
•
•
•
•
•
•
•
•
•
•
•
Time: hours, minutes and seconds
24-hour format (military time)
Calendar: weekday, date, month and year
Alarm configurable
Year range: 2000 to 2099
Leap year correction
BCD format for compact firmware
Optimized for low-power operation
User calibration with auto-adjust
Calibration range: ±2.64 seconds error per month
Requirements: external 32.768 kHz clock crystal
Alarm pulse or seconds clock output on RTCC pin
The RTCC module is intended for applications where
accurate time must be maintained for extended periods
of time with minimum to no intervention from the CPU.
The RTCC module is optimized for low-power usage to
provide extended battery lifetime while keeping track of
time.
The RTCC module is a 100-year clock and calendar
with automatic leap year detection. The range of the
clock is from 00:00:00 (midnight) on January 1, 2000 to
23:59:59 on December 31, 2099.
The hours are available in 24-hour (military time)
format. The clock provides a granularity of one second
with half-second visibility to the user.
FIGURE 21-1:
RTCC BLOCK DIAGRAM
RTCC Clock Domain
32.768 kHz Input
from SOSC Oscillator
CPU Clock Domain
RCFGCAL
RTCC Prescalers
ALCFGRPT
0.5s
RTCC Timer
RTCVAL
Alarm
Event
Comparator
Compare Registers
with Masks
ALRMVAL
Repeat Counter
RTCC Interrupt
RTCC Interrupt Logic
Alarm Pulse
RTCC Pin
RTCOE
 2011-2014 Microchip Technology Inc.
DS70000652F-page 243
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
21.1
RTCC Module Registers
The RTCC module registers are organized into three
categories:
• RTCC Control Registers
• RTCC Value Registers
• Alarm Value Registers
21.1.1
By writing the ALRMVALH byte, the Alarm Pointer
value (ALRMPTR<1:0> bits) decrements by one until it
reaches ‘00’. Once it reaches ‘00’, the ALRMMIN and
ALRMSEC value will be accessible through
ALRMVALH and ALRMVALL until the pointer value is
manually changed.
TABLE 21-2:
To limit the register interface, the RTCC Timer and
Alarm Time registers are accessed through
corresponding register pointers. The RTCC Value
register window (RTCVALH and RTCVALL) uses the
RTCPTR bits (RCFGCAL<9:8>) to select the desired
Timer register pair (see Table 21-1).
By writing the RTCVALH byte, the RTCC Pointer value
(RTCPTR<1:0> bits) decrements by one until it
reaches ‘00’. Once it reaches ‘00’, the MINUTES and
SECONDS value will be accessible through RTCVALH
and RTCVALL until the pointer value is manually
changed.
TABLE 21-1:
RTCVAL REGISTER MAPPING
ALRMPTR
<1:0>
RTCVAL<15:8>
RTCVAL<7:0>
00
MINUTES
SECONDS
01
WEEKDAY
HOURS
10
MONTH
DAY
11
—
YEAR
ALRMMIN
ALRMSEC
01
ALRMWD
ALRMHR
10
ALRMMNTH
ALRMDAY
11
—
—
21.1.2
This only applies to read operations and
not write operations.
WRITE LOCK
In order to perform a write to any of the RTCC Timer
registers, the RTCWREN bit (RCFGCAL<13>) must be
set (refer to Example 21-1).
Note:
To avoid accidental writes to the timer, it is
recommended that the RTCWREN bit
(RCFGCAL<13>) is kept clear at any
other time. For the RTCWREN bit to be
set, there is only 1 instruction cycle time
window allowed between the 55h/AA
sequence and the setting of RTCWREN;
therefore, it is recommended that code
follow the procedure in Example 21-1.
SETTING THE RTCWREN BIT
#NVMKEY, W1
#0x55, W2
#0xAA, W3
W2, [W1]
W3, [W1]
RCFGCAL, #13
DS70000652F-page 244
ALRMVAL<15:8> ALRMVAL<7:0>
00
Note:
The Alarm Value register window (ALRMVALH and
ALRMVALL) uses the ALRMPTR bits (ALCFGRPT<9:8>)
to select the desired Alarm register pair (see Table 21-2).
EXAMPLE 21-1:
Alarm Value Register Window
Considering that the 16-bit core does not distinguish
between 8-bit and 16-bit read operations, the user must
be aware that when reading either the ALRMVALH or
ALRMVALL, bytes will decrement the ALRMPTR<1:0>
value. The same applies to the RTCVALH or RTCVALL
bytes with the RTCPTR<1:0> being decremented.
RTCC Value Register Window
RTCPTR
<1:0>
MOV
MOV
MOV
MOV
MOV
BSET
ALRMVAL REGISTER
MAPPING
REGISTER MAPPING
;move the address of NVMKEY into W1
;start 55/AA sequence
;set the RTCWREN bit
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
21.2
RTCC Control Registers
REGISTER 21-1:
RCFGCAL: RTCC CALIBRATION AND CONFIGURATION REGISTER(1)
R/W-0
U-0
R/W-0
R-0
R-0
R/W-0
R/W-0
R/W-0
RTCEN(2)
—
RTCWREN
RTCSYNC
HALFSEC(3)
RTCOE
RTCPTR1
RTCPTR0
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CAL7
CAL6
CAL5
CAL4
CAL3
CAL2
CAL1
CAL0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
RTCEN: RTCC Enable bit(2)
1 = RTCC module is enabled
0 = RTCC module is disabled
bit 14
Unimplemented: Read as ‘0’
bit 13
RTCWREN: RTCC Value Registers Write Enable bit
1 = RTCVALH and RTCVALL registers can be written to by the user
0 = RTCVALH and RTCVALL registers are locked out from being written to by the user
bit 12
RTCSYNC: RTCC Value Registers Read Synchronization bit
1 = RTCVALH, RTCVALL and ALCFGRPT registers can change while reading, due to a rollover ripple,
resulting in an invalid data read. If the register is read twice and the results are the same data, the
data can be assumed to be valid.
0 = RTCVALH, RTCVALL or ALCFGRPT registers can be read without concern over a rollover ripple
bit 11
HALFSEC: Half-Second Status bit(3)
1 = Second half period of a second
0 = First half period of a second
bit 10
RTCOE: RTCC Output Enable bit
1 = RTCC output is enabled
0 = RTCC output is disabled
bit 9-8
RTCPTR<1:0>: RTCC Value Register Window Pointer bits
Points to the corresponding RTCC Value registers when reading RTCVALH and RTCVALL registers;
the RTCPTR<1:0> value decrements on every read or write of RTCVALH until it reaches ‘00’.
RTCVAL<15:8>:
00 = MINUTES
01 = WEEKDAY
10 = MONTH
11 = Reserved
RTCVAL<7:0>:
00 = SECONDS
01 = HOURS
10 = DAY
11 = YEAR
Note 1:
2:
3:
The RCFGCAL register is only affected by a POR.
A write to the RTCEN bit is only allowed when RTCWREN = 1.
This bit is read-only; it is cleared to ‘0’ on a write to the lower half of the MINSEC register.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 245
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-1:
bit 7-0
Note 1:
2:
3:
RCFGCAL: RTCC CALIBRATION AND CONFIGURATION REGISTER(1) (CONTINUED)
CAL<7:0>: RTC Drift Calibration bits
01111111 = Maximum positive adjustment; adds 508 RTC clock pulses every one minute
•
•
•
00000001 = Minimum positive adjustment; adds 4 RTC clock pulses every one minute
00000000 = No adjustment
11111111 = Minimum negative adjustment; subtracts 4 RTC clock pulses every one minute
•
•
•
10000000 = Maximum negative adjustment; subtracts 512 RTC clock pulses every one minute
The RCFGCAL register is only affected by a POR.
A write to the RTCEN bit is only allowed when RTCWREN = 1.
This bit is read-only; it is cleared to ‘0’ on a write to the lower half of the MINSEC register.
DS70000652F-page 246
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-2:
PADCFG1: PAD CONFIGURATION CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
—
U-0
—
—
U-0
—
U-0
—
U-0
—
R/W-0
U-0
(1)
RTSECSEL
bit 7
—
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-2
Unimplemented: Read as ‘0’
bit 1
RTSECSEL: RTCC Seconds Clock Output Select bit(1)
1 = RTCC seconds clock is selected for the RTCC pin
0 = RTCC alarm pulse is selected for the RTCC pin
bit 0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
To enable the actual RTCC output, the RTCOE (RCFGCAL<10>) bit needs to be set.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 247
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-3:
ALCFGRPT: ALARM CONFIGURATION REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ALRMEN
CHIME
AMASK3
AMASK2
AMASK1
AMASK0
ALRMPTR1
ALRMPTR0
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ARPT7
ARPT6
ARPT5
ARPT4
ARPT3
ARPT2
ARPT1
ARPT0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ALRMEN: Alarm Enable bit
1 = Alarm is enabled (cleared automatically after an alarm event whenever ARPT<7:0> = 0x00 and
CHIME = 0)
0 = Alarm is disabled
bit 14
CHIME: Chime Enable bit
1 = Chime is enabled; ARPT<7:0> bits are allowed to roll over from 0x00 to 0xFF
0 = Chime is disabled; ARPT<7:0> bits stop once they reach 0x00
bit 13-10
AMASK<3:0>: Alarm Mask Configuration bits
0000 = Every half second
0001 = Every second
0010 = Every 10 seconds
0011 = Every minute
0100 = Every 10 minutes
0101 = Every hour
0110 = Once a day
0111 = Once a week
1000 = Once a month
1001 = Once a year (except when configured for February 29th, once every 4 years)
101x = Reserved – do not use
11xx = Reserved – do not use
bit 9-8
ALRMPTR<1:0>: Alarm Value Register Window Pointer bits
Points to the corresponding Alarm Value registers when reading ALRMVALH and ALRMVALL registers;
the ALRMPTR<1:0> value decrements on every read or write of ALRMVALH until it reaches ‘00’.
ALRMVAL<15:8>:
00 = ALRMMIN
01 = ALRMWD
10 = ALRMMNTH
11 = Unimplemented
ALRMVAL<7:0>:
00 = ALRMSEC
01 = ALRMHR
10 = ALRMDAY
11 = Unimplemented
bit 7-0
ARPT<7:0>: Alarm Repeat Counter Value bits
11111111 = Alarm will repeat 255 more times
•
•
•
00000000 = Alarm will not repeat
The counter decrements on any alarm event. The counter is prevented from rolling over from 0x00 to
0xFF unless CHIME = 1.
DS70000652F-page 248
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-4:
RTCVAL (WHEN RTCPTR<1:0> = 11): RTCC YEAR VALUE REGISTER(1)
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
YRTEN3
YRTEN2
YRTEN1
YRTEN0
YRONE3
YRONE2
YRONE1
YRONE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-8
Unimplemented: Read as ‘0’
bit 7-4
YRTEN<3:0>: Binary Coded Decimal Value of Year’s Tens Digit bits
Contains a value from 0 to 9.
bit 3-0
YRONE<3:0>: Binary Coded Decimal Value of Year’s Ones Digit bits
Contains a value from 0 to 9.
Note 1:
A write to this register is only allowed when RTCWREN = 1.
REGISTER 21-5:
RTCVAL (WHEN RTCPTR<1:0> = 10): RTCC MONTH AND DAY VALUE
REGISTER(1)
U-0
U-0
U-0
R-x
R-x
R-x
R-x
R-x
—
—
—
MTHTEN0
MTHONE3
MTHONE2
MTHONE1
MTHONE0
bit 15
bit 8
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
—
DAYTEN1
DAYTEN0
DAYONE3
DAYONE2
DAYONE1
DAYONE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-13
Unimplemented: Read as ‘0’
bit 12
MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit bit
Contains a value of 0 or 1.
bit 11-8
MTHONE<3:0>: Binary Coded Decimal Value of Month’s Ones Digit bits
Contains a value from 0 to 9.
bit 7-6
Unimplemented: Read as ‘0’
bit 5-4
DAYTEN<1:0>: Binary Coded Decimal Value of Day’s Tens Digit bits
Contains a value from 0 to 3.
bit 3-0
DAYONE<3:0>: Binary Coded Decimal Value of Day’s Ones Digit bits
Contains a value from 0 to 9.
Note 1:
x = Bit is unknown
A write to this register is only allowed when RTCWREN = 1.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 249
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-6:
RTCVAL (WHEN RTCPTR<1:0> = 01): RTCC WEEKDAY AND HOURS VALUE
REGISTER(1)
U-0
U-0
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
—
—
—
—
—
WDAY2
WDAY1
WDAY0
bit 15
bit 8
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
—
HRTEN1
HRTEN0
HRONE3
HRONE2
HRONE1
HRONE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-11
Unimplemented: Read as ‘0’
bit 10-8
WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits
Contains a value from 0 to 6.
bit 7-6
Unimplemented: Read as ‘0’
bit 5-4
HRTEN<1:0>: Binary Coded Decimal Value of Hour’s Tens Digit bits
Contains a value from 0 to 2.
bit 3-0
HRONE<3:0>: Binary Coded Decimal Value of Hour’s Ones Digit bits
Contains a value from 0 to 9.
Note 1:
A write to this register is only allowed when RTCWREN = 1.
DS70000652F-page 250
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-7:
RTCVAL (WHEN RTCPTR<1:0> = 00): RTCC MINUTES AND SECONDS VALUE
REGISTER
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
MINTEN2
MINTEN1
MINTEN0
MINONE3
MINONE2
MINONE1
MINONE0
bit 15
bit 8
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
SECTEN2
SECTEN1
SECTEN0
SECONE3
SECONE2
SECONE1
SECONE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
MINTEN<2:0>: Binary Coded Decimal Value of Minute’s Tens Digit bits
Contains a value from 0 to 5.
bit 11-8
MINONE<3:0>: Binary Coded Decimal Value of Minute’s Ones Digit bits
Contains a value from 0 to 9.
bit 7
Unimplemented: Read as ‘0’
bit 6-4
SECTEN<2:0>: Binary Coded Decimal Value of Second’s Tens Digit bits
Contains a value from 0 to 5.
bit 3-0
SECONE<3:0>: Binary Coded Decimal Value of Second’s Ones Digit bits
Contains a value from 0 to 9.
 2011-2014 Microchip Technology Inc.
x = Bit is unknown
DS70000652F-page 251
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-8:
ALRMVAL (WHEN ALRMPTR<1:0> = 10): ALARM MONTH AND DAY VALUE
REGISTER(1)
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
—
—
MTHTEN0
MTHONE3
MTHONE2
MTHONE1
MTHONE0
bit 15
bit 8
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
—
DAYTEN1
DAYTEN0
DAYONE3
DAYONE2
DAYONE1
DAYONE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12
MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit bit
Contains a value of 0 or 1.
bit 11-8
MTHONE<3:0>: Binary Coded Decimal Value of Month’s Ones Digit bits
Contains a value from 0 to 9.
bit 7-6
Unimplemented: Read as ‘0’
bit 5-4
DAYTEN<1:0>: Binary Coded Decimal Value of Day’s Tens Digit bits
Contains a value from 0 to 3.
bit 3-0
DAYONE<3:0>: Binary Coded Decimal Value of Day’s Ones Digit bits
Contains a value from 0 to 9.
Note 1:
A write to this register is only allowed when RTCWREN = 1.
DS70000652F-page 252
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-9:
ALRMVAL (WHEN ALRMPTR<1:0> = 01): ALARM WEEKDAY AND HOURS
VALUE REGISTER(1)
U-0
U-0
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
—
—
—
—
—
WDAY2
WDAY1
WDAY0
bit 15
bit 8
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
—
HRTEN1
HRTEN0
HRONE3
HRONE2
HRONE1
HRONE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-11
Unimplemented: Read as ‘0’
bit 10-8
WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits
Contains a value from 0 to 6.
bit 7-6
Unimplemented: Read as ‘0’
bit 5-4
HRTEN<1:0>: Binary Coded Decimal Value of Hour’s Tens Digit bits
Contains a value from 0 to 2.
bit 3-0
HRONE<3:0>: Binary Coded Decimal Value of Hour’s Ones Digit bits
Contains a value from 0 to 9.
Note 1:
x = Bit is unknown
A write to this register is only allowed when RTCWREN = 1.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 253
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 21-10: ALRMVAL (WHEN ALRMPTR<1:0> = 00): ALARM MINUTES AND SECONDS
VALUE REGISTER
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
MINTEN2
MINTEN1
MINTEN0
MINONE3
MINONE2
MINONE1
MINONE0
bit 15
bit 8
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
SECTEN2
SECTEN1
SECTEN0
SECONE3
SECONE2
SECONE1
SECONE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
MINTEN<2:0>: Binary Coded Decimal Value of Minute’s Tens Digit bits
Contains a value from 0 to 5.
bit 11-8
MINONE<3:0>: Binary Coded Decimal Value of Minute’s Ones Digit bits
Contains a value from 0 to 9.
bit 7
Unimplemented: Read as ‘0’
bit 6-4
SECTEN<2:0>: Binary Coded Decimal Value of Second’s Tens Digit bits
Contains a value from 0 to 5.
bit 3-0
SECONE<3:0>: Binary Coded Decimal Value of Second’s Ones Digit bits
Contains a value from 0 to 9.
DS70000652F-page 254
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
22.0
CHARGE TIME
MEASUREMENT UNIT (CTMU)
Note 1: This data sheet summarizes the features
of the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104
device families of devices. It is not
intended to be a comprehensive reference
source. To complement the information in
this data sheet, refer to “Charge Time
Measurement Unit (CTMU)” (DS70635)
in the “dsPIC33/PIC24 Family Reference
Manual”, which is available on the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Together with other on-chip analog modules, the CTMU
can be used to precisely measure time, measure
capacitance, measure relative changes in capacitance
or generate output pulses that are independent of the
system clock.
The CTMU module is ideal for interfacing with
capacitive-based sensors. The CTMU is controlled
through three registers: CTMUCON1, CTMUCON2
and CTMUICON. CTMUCON1 enables the module,
the edge delay generation, sequencing of edges, and
controls the current source and the output trigger.
CTMUCON2 controls the edge source selection, edge
source polarity selection and edge sampling mode. The
CTMUICON register controls the selection and trim of
the current source.
Figure 22-1 shows the CTMU block diagram.
The Charge Time Measurement Unit (CTMU) is a flexible
analog module that provides accurate differential time
measurement between pulse sources, as well as
asynchronous pulse generation. Its key features include:
•
•
•
•
•
•
Four edge input trigger sources
Polarity control for each edge source
Control of edge sequence
Control of response to edges
Precise time measurement resolution of 200 ps
Accurate current source suitable for capacitive
measurement
• On-chip temperature measurement using a
built-in diode
 2011-2014 Microchip Technology Inc.
DS70000652F-page 255
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 22-1:
CTMU BLOCK DIAGRAM
CTMUCON1 or CTMUCON2
CTMUICON
ITRIM<5:0>
IRNG<1:0>
Current Source
Edge
Control
Logic
CTED1
CTED2
Timer1
OC1
IC1
CMP2
EDG1STAT
EDG2STAT
TGEN
Current
Control
CTMUP
CTMU
Control
Logic
Pulse
Generator
Analog-to-Digital
Trigger
CTPLS
CTMUI to ADC
CTMU TEMP
CTMU
Temperature
Sensor
C2INA
CDelay
Comparator 2
External Capacitor
for Pulse Generation
Current Control Selection
CTMU TEMP
DS70000652F-page 256
TGEN
EDG1STAT, EDG2STAT
0
EDG1STAT = EDG2STAT
CTMUI
0
EDG1STAT  EDG2STAT
CTMUP
1
EDG1STAT  EDG2STAT
No Connect
1
EDG1STAT = EDG2STAT
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
22.1
CTMU Control Registers
REGISTER 22-1:
CTMUCON1: CTMU CONTROL REGISTER 1
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CTMUEN
—
CTMUSIDL
TGEN(1)
EDGEN
EDGSEQEN
IDISSEN(2)
CTTRIG
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
CTMUEN: CTMU Enable bit
1 = Module is enabled
0 = Module is disabled
bit 14
Unimplemented: Read as ‘0’
bit 13
CTMUSIDL: CTMU Stop in Idle Mode bit
1 = Discontinues module operation when device enters Idle mode
0 = Continues module operation in Idle mode
bit 12
TGEN: Time Generation Enable bit(1)
1 = Enables edge delay generation
0 = Disables edge delay generation
bit 11
EDGEN: Edge Enable bit
1 = Edges are not blocked
0 = Edges are blocked
bit 10
EDGSEQEN: Edge Sequence Enable bit
1 = Edge 1 event must occur before Edge 2 event can occur
0 = No edge sequence is needed
bit 9
IDISSEN: Analog Current Source Control bit(2)
1 = Analog current source output is grounded
0 = Analog current source output is not grounded
bit 8
CTTRIG: CTMU Trigger Control bit
1 = Trigger output is enabled
0 = Trigger output is disabled
bit 7-0
Unimplemented: Read as ‘0’
Note 1:
2:
x = Bit is unknown
If TGEN = 1, the peripheral inputs and outputs must be configured to an available RPn pin. For more
information, see Section 10.4 “Peripheral Pin Select (PPS)”.
The ADC module S&H capacitor is not automatically discharged between sample/conversion cycles.
Software using the ADC as part of a capacitance measurement must discharge the ADC capacitor before
conducting the measurement. The IDISSEN bit, when set to ‘1’, performs this function. The ADC must be
sampling while the IDISSEN bit is active to connect the discharge sink to the capacitor array.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 257
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 22-2:
CTMUCON2: CTMU CONTROL REGISTER 2
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
EDG1MOD
EDG1POL
EDG1SEL3
EDG1SEL2
EDG1SEL1
EDG1SEL0
EDG2STAT
EDG1STAT
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
U-0
EDG2MOD
EDG2POL
EDG2SEL3
EDG2SEL2
EDG2SEL1
EDG2SEL0
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
EDG1MOD: Edge 1 Edge Sampling Selection bit
1 = Edge 1 is edge-sensitive
0 = Edge 1 is level-sensitive
bit 14
EDG1POL: Edge 1 Polarity Select bit
1 = Edge 1 is programmed for a positive edge response
0 = Edge 1 is programmed for a negative edge response
bit 13-10
EDG1SEL<3:0>: Edge 1 Source Select bits
1xxx = Reserved
01xx = Reserved
0011 = CTED1 pin
0010 = CTED2 pin
0001 = OC1 module
0000 = Timer1 module
bit 9
EDG2STAT: Edge 2 Status bit
Indicates the status of Edge 2 and can be written to control the edge source.
1 = Edge 2 has occurred
0 = Edge 2 has not occurred
bit 8
EDG1STAT: Edge 1 Status bit
Indicates the status of Edge 1 and can be written to control the edge source.
1 = Edge 1 has occurred
0 = Edge 1 has not occurred
bit 7
EDG2MOD: Edge 2 Edge Sampling Selection bit
1 = Edge 2 is edge-sensitive
0 = Edge 2 is level-sensitive
bit 6
EDG2POL: Edge 2 Polarity Select bit
1 = Edge 2 is programmed for a positive edge response
0 = Edge 2 is programmed for a negative edge response
bit 5-2
EDG2SEL<3:0>: Edge 2 Source Select bits
1xxx = Reserved
01xx = Reserved
0011 = CTED2 pin
0010 = CTED1 pin
0001 = Comparator 2 module
0000 = IC1 module
bit 1-0
Unimplemented: Read as ‘0’
DS70000652F-page 258
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 22-3:
CTMUICON: CTMU CURRENT CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ITRIM5
ITRIM4
ITRIM3
ITRIM2
ITRIM1
ITRIM0
IRNG1
IRNG0
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-10
ITRIM<5:0>: Current Source Trim bits
011111 = Nominal current output specified by IRNG<1:0> + 62%
011110 = Nominal current output specified by IRNG<1:0> + 60%
•
•
•
000001 = Nominal current output specified by IRNG<1:0> + 2%
000000 = Nominal current output specified by IRNG<1:0>
111111 = Nominal current output specified by IRNG<1:0> – 2%
•
•
•
100010 = Nominal current output specified by IRNG<1:0> – 62%
100001 = Nominal current output specified by IRNG<1:0> – 64%
bit 9-8
IRNG<1:0>: Current Source Range Select bits
11 = 100  Base Current(1)
10 = 10  Base Current
01 = Base current level (0.55 A nominal)
00 = Reserved
bit 7-0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
This setting must be used for the CTMU temperature sensor.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 259
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 260
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
23.0
SPECIAL FEATURES
Note 1: This data sheet summarizes the
features of the dsPIC33FJ16(GP/
MC)101/102
and
dsPIC33FJ32(GP/
MC)101/102/104 devices. It is not
intended to be a comprehensive reference
source. To complement the information in
this data sheet, refer to “Programming
and Diagnostics” (DS70207) and
“Device Configuration” (DS70194) in
the “dsPIC33/PIC24 Family Reference
Manual”, which are available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/
MC)101/102/104 devices include several features
intended to maximize application flexibility and
reliability, and minimize cost through elimination of
external components. These are:
•
•
•
•
•
Flexible Configuration
Watchdog Timer (WDT)
Code Protection
In-Circuit Serial Programming™ (ICSP™)
In-Circuit Emulation
23.1
Configuration Bits
The Configuration Shadow register bits can be configured (read as ‘0’) or left unprogrammed (read as ‘1’) to
select various device configurations. These read-only
bits are mapped starting at program memory location,
0xF80000. A detailed explanation of the various bit
functions is provided in Table 23-4.
In
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices, the Configuration bytes are implemented as volatile memory.
This means that configuration data must be programmed
each time the device is powered up. Configuration data
is stored in the two words at the top of the on-chip program memory space, known as the Flash Configuration
Words. Their specific locations are shown in Table 23-2.
These are packed representations of the actual device
Configuration bits, whose actual locations are distributed
among several locations in configuration space. The configuration data is automatically loaded from the Flash
Configuration Words to the proper Configuration
registers during device Resets.
Note:
Configuration data is reloaded on all types
of device Resets.
When creating applications for these devices, users
should always specifically allocate the location of the
Flash Configuration Word for configuration data. This is
to make certain that program code is not stored in this
address when the code is compiled.
The upper byte of all Flash Configuration Words in program memory should always be ‘1111 1111’. This
makes them appear to be NOP instructions in the
remote event that their locations are ever executed by
accident. Since Configuration bits are not implemented
in the corresponding locations, writing ‘1’s to these
locations has no effect on device operation.
Note:
Performing a page erase operation on the
last page of program memory clears the
Flash Configuration Words, enabling code
protection as a result. Therefore, users
should avoid performing page erase
operations on the last page of program
memory.
Note that address, 0xF80000, is beyond the user program memory space and belongs to the configuration
memory space (0x800000-0xFFFFFF), which can only
be accessed using Table Reads.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 261
TABLE 23-1:
File Name
CONFIGURATION SHADOW REGISTER MAP
Addr.
FGS
F80004
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
—
—
—
—
—
—
GCP
GWRP
FOSCSEL
F80006
IESO
PWMLOCK(1)
—
WDTWIN1
WDTWIN0
FNOSC2
FNOSC1
FNOSC0
FOSC
F80008
FCKSM1
FCKSM0
IOL1WAY
—
—
OSCIOFNC
POSCMD1
POSCMD0
FWDT
F8000A
FWDTEN
WINDIS
PLLKEN
WDTPRE
WDTPOST3
WDTPOST2
WDTPOST1
WDTPOST0
FPOR
F8000C
PWMPIN(1)
HPOL(1)
LPOL(1)
ALTI2C1
—
—
—
—
FICD
F8000E
Reserved(2)
—
Reserved(3)
Reserved(3)
—
—
ICS1
ICS0
Legend:
Note 1:
2:
3:
— = unimplemented, read as ‘1’.
These bits are available in dsPIC33FJ(16/32)MC10X devices only.
This bit is reserved for use by development tools.
These bits are reserved, program as ‘0’.
The Configuration Flash Word maps are shown in Table 23-2 and Table 23-3.
TABLE 23-2:
File
Name
Addr.
CONFIG2 002BFC
CONFIG1 002BFE
Legend:
Note 1:
2:
3:
4:
5:
 2011-2014 Microchip Technology Inc.
Addr.
CONFIG2 0057FC
CONFIG1 0057FE
Legend:
Note 1:
2:
3:
4:
5:
Bits 23-16
Bit 15
—
IESO
—
Reserved(3)
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
PWMLOCK(2) PWMPIN(2) WDTWIN1 WDTWIN0 FNOSC2 FNOSC1 FNOSC0 FCKSM1 FCKSM0 OSCIOFNC(5) IOL1WAY
Reserved(3)
GCP
GWRP
Reserved(4)
HPOL(2)
ICS1
ICS0
FWDTEN WINDIS
PLLKEN
Bit 3
Bit 2
Bit 1
Bit 0
LPOL(2)
ALTI2C1
POSCMD1
POSCMD0
WDTPRE WDTPOST3 WDTPOST2 WDTPOST1 WDTPOST0
— = unimplemented, read as ‘1’.
During a Power-on Reset (POR), the contents of these Flash locations are transferred to the Configuration Shadow registers.
These bits are reserved in dsPIC33FJ16GP10X devices and read as ‘1’.
These bits are reserved, program as ‘0’.
This bit is reserved for use by development tools and must be programmed as ‘1’.
This bit is programmed to ‘0’ during final tests in the factory.
TABLE 23-3:
File
Name
CONFIGURATION FLASH WORDS FOR dsPIC33FJ16(GP/MC)10X DEVICES(1)
CONFIGURATION FLASH WORDS FOR dsPIC33FJ32(GP/MC)10X DEVICES(1)
Bits 23-16
Bit 15
—
IESO
—
Reserved(3)
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
PWMLOCK(2) PWMPIN(2) WDTWIN1 WDTWIN0 FNOSC2 FNOSC1 FNOSC0 FCKSM1 FCKSM0 OSCIOFNC(5) IOL1WAY
Reserved(3)
GCP
GWRP
Reserved(4)
HPOL(2)
ICS1
ICS0
FWDTEN WINDIS
— = unimplemented, read as ‘1’.
During a Power-on Reset (POR), the contents of these Flash locations are transferred to the Configuration Shadow registers.
These bits are reserved in dsPIC33FJ32GP10X devices and read as ‘1’.
These bits are reserved, program as ‘0’.
This bit is reserved for use by development tools and must be programmed as ‘1’.
This bit is programmed to ‘0’ during final tests in the factory.
PLLKEN
Bit 3
Bit 2
Bit 1
Bit 0
LPOL(2)
ALTI2C1
POSCMD1
POSCMD0
WDTPRE WDTPOST3 WDTPOST2 WDTPOST1 WDTPOST0
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 262
The Configuration Shadow register map is shown in Table 23-1.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 23-4:
dsPIC33F CONFIGURATION BITS DESCRIPTION
Bit Field
Description
GCP
General Segment Code-Protect bit
1 = User program memory is not code-protected
0 = Code protection is enabled for the entire program memory space
GWRP
General Segment Write-Protect bit
1 = User program memory is not write-protected
0 = User program memory is write-protected
IESO
Two-Speed Oscillator Start-up Enable bit
1 = Starts up device with FRC, then automatically switches to the user-selected oscillator source
when ready
0 = Starts up device with user-selected oscillator source
PWMLOCK
PWM Lock Enable bit
1 = Certain PWM registers may only be written after a key sequence
0 = PWM registers may be written without a key sequence
WDTWIN<1:0>
Watchdog Timer Window Select bits
11 = WDT window is 24% of WDT period
10 = WDT window is 37.5% of WDT period
01 = WDT window is 50% of WDT period
00 = WDT window is 75% of WDT period
FNOSC<2:0>
Oscillator Selection bits
111 = Fast RC Oscillator with Divide-by-N (FRCDIVN)
110 = Reserved; do not use
101 = Low-Power RC Oscillator (LPRC)
100 = Secondary Oscillator (SOSC)
011 = Primary Oscillator with PLL module (MS + PLL, EC + PLL)
010 = Primary Oscillator (MS, HS, EC)
001 = Fast RC Oscillator with Divide-by-N and PLL module (FRCDIVN + PLL)
000 = Fast RC Oscillator (FRC)
FCKSM<1:0>
Clock Switching Mode bits
1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled
01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled
00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled
IOL1WAY
Peripheral Pin Select Configuration bit
1 = Allow only one reconfiguration
0 = Allow multiple reconfigurations
OSCIOFNC
OSC2 Pin Function bit (except in MS and HS modes)
1 = OSC2 is a clock output
0 = OSC2 is a general purpose digital I/O pin
POSCMD<1:0>
Primary Oscillator Mode Select bits
11 = Primary Oscillator is disabled
10 = HS Crystal Oscillator mode (10 MHz-32 MHz)
01 = MS Crystal Oscillator mode (3 MHz-10 MHz)
00 = EC (External Clock) mode (DC-32 MHz)
FWDTEN
Watchdog Timer Enable bit
1 = Watchdog Timer is always enabled (LPRC oscillator cannot be disabled; clearing the SWDTEN
bit in the RCON register will have no effect)
0 = Watchdog Timer is enabled/disabled by user software (LPRC can be disabled by clearing the
SWDTEN bit in the RCON register)
WINDIS
Watchdog Timer Window Enable bit
1 = Watchdog Timer in Non-Window mode
0 = Watchdog Timer in Window mode
 2011-2014 Microchip Technology Inc.
DS70000652F-page 263
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 23-4:
dsPIC33F CONFIGURATION BITS DESCRIPTION (CONTINUED)
Bit Field
WDTPRE
Description
Watchdog Timer Prescaler bit
1 = 1:128
0 = 1:32
WDTPOST<3:0> Watchdog Timer Postscaler bits
1111 = 1:32,768
1110 = 1:16,384
•
•
•
0001 = 1:2
0000 = 1:1
PLLKEN
PLL Lock Enable bit
1 = Clock switch to PLL will wait until the PLL lock signal is valid
0 = Clock switch will not wait for the PLL lock signal
ALTI2C
Alternate I2C™ Pins bit
1 = I2C is mapped to SDA1/SCL1 pins
0 = I2C is mapped to ASDA1/ASCL1 pins
ICS<1:0>
ICD Communication Channel Select bits
11 = Communicate on PGEC1 and PGED1
10 = Communicate on PGEC2 and PGED2
01 = Communicate on PGEC3 and PGED3
00 = Reserved, do not use
PWMPIN
Motor Control PWM Module Pin Mode bit
1 = PWM module pins controlled by PORT register at device Reset (tri-stated)
0 = PWM module pins controlled by PWM module at device Reset (configured as output pins)
HPOL
Motor Control PWM High Side Polarity bit
1 = PWM module high side output pins have active-high output polarity
0 = PWM module high side output pins have active-low output polarity
LPOL
Motor Control PWM Low Side Polarity bit
1 = PWM module low side output pins have active-high output polarity
0 = PWM module low side output pins have active-low output polarity
DS70000652F-page 264
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
REGISTER 23-1:
R
DEVID: DEVICE ID REGISTER
R
R
R
R
R
R
R
(1)
DEVID<23:16>
bit 23
bit 16
R
R
R
R
R
DEVID<15:8>
R
R
R
(1)
bit 15
bit 8
R
R
R
R
R
DEVID<7:0>
R
R
R
(1)
bit 7
bit 0
Legend: R = Read-Only bit
bit 23-0
Note 1:
DEIDV<23:0>: Device Identifier bits(1)
Refer to the “dsPIC33F Flash Programming Specification for Devices with Volatile Configuration Bits”
(DS70659) for the list of device ID values.
REGISTER 23-2:
R
U = Unimplemented bit
DEVREV: DEVICE REVISION REGISTER
R
R
R
R
R
R
R
DEVREV<23:16>(1)
bit 23
bit 16
R
R
R
R
R
R
R
R
DEVREV<15:8>(1)
bit 15
bit 8
R
R
R
R
R
R
R
R
DEVREV<7:0>(1)
bit 7
bit 0
Legend: R = Read-only bit
bit 23-0
Note 1:
U = Unimplemented bit
DEVREV<23:0>: Device Revision bits(1)
Refer to the “dsPIC33F Flash Programming Specification for Devices with Volatile Configuration Bits”
(DS70659) for the list of device revision values.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 265
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
23.2
On-Chip Voltage Regulator
All of the dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104 devices power
their core digital logic at a nominal 2.5V. This can
create a conflict for designs that are required to operate
at a higher typical voltage, such as 3.3V. To simplify
system design, all devices in the dsPIC33FJ16(GP/
MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104
family incorporate an on-chip regulator that allows the
device to run its core logic from VDD.
The regulator provides power to the core from the other
VDD pins. When the regulator is enabled, a low-ESR
(less than 5 ohms) capacitor (such as tantalum or
ceramic) must be connected to the VCAP pin
(Figure 23-1). This helps to maintain the stability of the
regulator. The recommended value for the filter capacitor is provided in Table 26-14 located in Section 26.1
“DC Characteristics”.
Note:
It is important for low-ESR capacitors to be
placed as close as possible to the VCAP pin.
On a POR, it takes approximately 20 s for the on-chip
voltage regulator to generate an output voltage. During
this time, designated as TSTARTUP, code execution is
disabled. TSTARTUP is applied every time the device
resumes operation after any power-down.
FIGURE 23-1:
CONNECTIONS FOR THE
ON-CHIP VOLTAGE
REGULATOR(1,2,3)
23.3
BOR: Brown-out Reset
The Brown-out Reset (BOR) module is based on an
internal voltage reference circuit that monitors the
regulated supply voltage, VCAP. The main purpose of
the BOR module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (for
example, missing portions of the AC cycle waveform
due to bad power transmission lines or voltage sags
due to excessive current draw when a large inductive
load is turned on).
A BOR generates a Reset pulse, which resets the
device. The BOR selects the clock source, based on
the device Configuration bit values (FNOSC<2:0> and
POSCMD<1:0>).
If an Oscillator mode is selected, the BOR activates the
Oscillator Start-up Timer (OST). The system clock is
held until OST expires. If the PLL is used, the clock is
held until the LOCK bit (OSCCON<5>) is ‘1’.
Concurrently, the PWRT Time-out (TPWRT) is applied
before the internal Reset is released. If TPWRT = 0 and
a crystal oscillator is being used, then a nominal delay
of TFSCM = 100 is applied. The total delay in this case
is TFSCM.
The BOR status bit (RCON<1>) is set to indicate that a
BOR has occurred. The BOR circuit continues to operate while in Sleep or Idle modes and resets the device
should VDD fall below the BOR threshold voltage.
3.3V
dsPIC33F
VDD
CEFC
10 µF
Tantalum
VCAP
VSS
Note 1: These are typical operating voltages. Refer to
Table 26-14 located in Section 26.1 “DC
Characteristics” for the full operating ranges
of VDD and VCAP.
2: It is important for low-ESR capacitors to be
placed as close as possible to the VCAP pin.
3: Typical VCAP pin voltage = 2.5V when
VDD  VDDMIN.
DS70000652F-page 266
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
23.4
23.4.2
Watchdog Timer (WDT)
For
dsPIC33FJ16(GP/MC)101/102
and
dsPIC33FJ32(GP/MC)101/102/104 devices, the WDT
is driven by the LPRC oscillator. When the WDT is
enabled, the clock source is also enabled.
23.4.1
PRESCALER/POSTSCALER
The nominal WDT clock source from LPRC is 32 kHz.
This feeds a prescaler than can be configured for either
5-bit (divide-by-32) or 7-bit (divide-by-128) operation.
The prescaler is set by the WDTPRE Configuration bit.
With a 32 kHz input, the prescaler yields a nominal
WDT Time-out (TWDT) period of 1 ms in 5-bit mode or
4 ms in 7-bit mode.
A variable postscaler divides down the WDT prescaler
output and allows for a wide range of time-out periods.
The postscaler is controlled by the WDTPOST<3:0>
Configuration bits (FWDT<3:0>), which allow the
selection of 16 settings, from 1:1 to 1:32,768. Using the
prescaler and postscaler, time-out periods, ranging
from 1 ms to 131 seconds, can be achieved.
The WDT, prescaler and postscaler are reset:
• On any device Reset
• On the completion of a clock switch, whether
invoked by software (i.e., setting the OSWEN bit
after changing the NOSCx bits) or by hardware
(i.e., Fail-Safe Clock Monitor)
• When a PWRSAV instruction is executed
(i.e., Sleep or Idle mode is entered)
• When the device exits Sleep or Idle mode to
resume normal operation
• By a CLRWDT instruction during normal execution
Note:
SLEEP AND IDLE MODES
If the WDT is enabled, it will continue to run during Sleep
or Idle modes. When the WDT time-out occurs, the
device will wake the device and code execution will
continue from where the PWRSAV instruction was
executed. The corresponding SLEEP or IDLE bits
(RCON<3:2>) will need to be cleared in software after the
device wakes up.
23.4.3
ENABLING WDT
The WDT is enabled or disabled by the FWDTEN
Configuration bit in the FWDT Configuration register.
When the FWDTEN Configuration bit is set, the WDT is
always enabled.
The WDT can be optionally controlled in software when
the FWDTEN Configuration bit has been programmed to
‘0’. The WDT is enabled in software by setting the
SWDTEN control bit (RCON<5>). The SWDTEN control
bit is cleared on any device Reset. The software WDT
option allows the user application to enable the WDT for
critical code segments and disables the WDT during
non-critical segments for maximum power savings.
Note:
If the WINDIS bit (FWDT<6>) is cleared,
the CLRWDT instruction should be executed
by the application software only during the
last 1/4 of the WDT period. This CLRWDT
window can be determined by using a timer.
If a CLRWDT instruction is executed before
this window, a WDT Reset occurs.
The WDT flag bit, WDTO (RCON<4>), is not automatically
cleared following a WDT time-out. To detect subsequent
WDT events, the flag must be cleared in software.
The CLRWDT and PWRSAV instructions
clear the prescaler and postscaler counts
when executed.
FIGURE 23-2:
WDT BLOCK DIAGRAM
All Device Resets
Transition to New Clock Source
Exit Sleep or Idle Mode
PWRSAV Instruction
CLRWDT Instruction
Watchdog Timer
Sleep/Idle
WDTPOST<3:0>
WDTPRE
SWDTEN
FWDTEN
WDT
Wake-up
RS
Prescaler
(divide-by-N1)
LPRC Clock
1
RS
Postscaler
(divide-by-N2)
0
WINDIS
WDT
Reset
WDT Window Select
CLRWDT Instruction
 2011-2014 Microchip Technology Inc.
DS70000652F-page 267
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
23.5
In-Circuit Serial Programming™
(ICSP™)
Devices can be serially programmed while in the end
application circuit. This is done with two lines for clock
and data and three other lines for power, ground and
the programming sequence. Serial programming
allows customers to manufacture boards with
unprogrammed devices and then program the Digital
Signal Controller just before shipping the product.
Serial programming also allows the most recent
firmware or a custom firmware to be programmed.
Refer to the “dsPIC33F Flash Programming
Specification for Devices with Volatile Configuration
Bits” (DS70659) for details about In-Circuit Serial
Programming (ICSP).
Any of the three pairs of programming clock/data pins
can be used:
• PGEC1 and PGED1
• PGEC2 and PGED2
• PGEC3 and PGED3
DS70000652F-page 268
23.6
In-Circuit Debugger
When MPLAB® ICD 3 is selected as a debugger, the incircuit debugging functionality is enabled. This function
allows simple debugging functions when used with
MPLAB IDE. Debugging functionality is controlled
through the PGECx (Emulation/Debug Clock) and
PGEDx (Emulation/Debug Data) pin functions.
Any of the three pairs of debugging clock/data pins can
be used:
• PGEC1 and PGED1
• PGEC2 and PGED2
• PGEC3 and PGED3
To use the in-circuit debugger function of the device,
the design must implement ICSP connections to
MCLR, VDD, VSS and the PGECx/PGEDx pin pair. In
addition, when the feature is enabled, some of the
resources are not available for general use. These
resources include the first 80 bytes of data RAM and
two I/O pins.
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
24.0
Note:
INSTRUCTION SET SUMMARY
This data sheet summarizes the
features of the dsPIC33FJ16(GP/
MC)101/102
and
dsPIC33FJ32(GP/
MC)101/102/104 devices. However, it is
not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
latest family reference sections of the
“dsPIC33/PIC24
Family
Reference
Manual”, which are available from the
Microchip web site (www.microchip.com).
The dsPIC33F instruction set is identical to that of the
dsPIC30F.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word, divided
into an 8-bit opcode, which specifies the instruction
type and one or more operands, which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five basic categories:
•
•
•
•
•
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 24-1 shows the general symbols used in
describing the instructions.
The dsPIC33F instruction set summary in Table 24-2
lists all the instructions, along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
• The first source operand, which is typically a
register ‘Wb’ without any address modifier
• The second source operand, which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register instructions
have two operands:
Most bit-oriented instructions (including simple rotate/
shift instructions) have two operands:
• The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
• The bit in the W register or file register (specified
by a literal value or indirectly by the contents of
register ‘Wb’)
The literal instructions that involve data movement can
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand, which is a register ‘Wb’
without any address modifier
• The second source operand, which is a literal
value
• The destination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions can use some of the
following operands:
• The accumulator (A or B) to be used (required
operand)
• The W registers to be used as the two operands
• The X and Y address space prefetch operations
• The X and Y address space prefetch destinations
• The accumulator write-back destination
The other DSP instructions do not involve any
multiplication and can include:
• The accumulator to be used (required)
• The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
• The amount of shift specified by a W register ‘Wn’
or a literal value
The control instructions can use some of the following
operands:
• A program memory address
• The mode of the Table Read and Table Write
instructions
• The file register specified by the value ‘f’
• The destination, which could be either the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
 2011-2014 Microchip Technology Inc.
DS70000652F-page 269
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Most instructions are a single word. Certain doubleword instructions are designed to provide all the
required information in these 48 bits. In the second
word, the 8 MSbs are ‘0’s. If this second word is
executed as an instruction (by itself), it will execute as
a NOP.
The double-word instructions execute in two instruction
cycles.
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true, or the
Program Counter is changed as a result of the instruction. In these cases, the execution takes two instruction
cycles with the additional instruction cycle(s) executed
TABLE 24-1:
as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all Table
Reads and Writes and RETURN/RETFIE instructions,
which are single-word instructions but take two or three
cycles. Certain instructions that involve skipping over the
subsequent instruction require either two or three cycles
if the skip is performed, depending on whether the
instruction being skipped is a single-word or two-word
instruction. Moreover, double-word moves require two
cycles.
Note:
For more details on the instruction set, refer
to the “16-Bit MCU and DSC Programmer’s
Reference Manual” (DS70157).
SYMBOLS USED IN OPCODE DESCRIPTIONS
Field
#text
Description
Means literal defined by “text”
(text)
Means “content of text”
[text]
Means “the location addressed by text”
{ }
Optional field or operation
<n:m>
Register bit field
.b
Byte mode selection
.d
Double-Word mode selection
.S
Shadow register select
.w
Word mode selection (default)
Acc
One of two accumulators {A, B}
AWB
Accumulator write-back destination address register {W13, [W13]+ = 2}
bit4
4-bit bit selection field (used in word addressed instructions) {0...15}
C, DC, N, OV, Z
MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr
Absolute address, label or expression (resolved by the linker)
f
File register address {0x0000...0x1FFF}
lit1
1-bit unsigned literal {0,1}
lit4
4-bit unsigned literal {0...15}
lit5
5-bit unsigned literal {0...31}
lit8
8-bit unsigned literal {0...255}
lit10
10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode
lit14
14-bit unsigned literal {0...16384}
lit16
16-bit unsigned literal {0...65535}
lit23
23-bit unsigned literal {0...8388608}; LSb must be ‘0’
None
Field does not require an entry, can be blank
OA, OB, SA, SB
DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate
PC
Program Counter
Slit10
10-bit signed literal {-512...511}
Slit16
16-bit signed literal {-32768...32767}
Slit6
6-bit signed literal {-16...16}
Wb
Base W register {W0..W15}
Wd
Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo
Destination W register 
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm, Wn
Dividend, Divisor Working register pair (direct addressing)
DS70000652F-page 270
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 24-1:
SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field
Description
Wm*Wm
Multiplicand and Multiplier Working register pair for Square instructions 
{W4 * W4,W5 * W5,W6 * W6,W7 * W7}
Wm*Wn
Multiplicand and Multiplier Working register pair for DSP instructions 
{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}
Wn
One of 16 Working registers {W0..W15}
Wnd
One of 16 destination Working registers {W0..W15}
Wns
One of 16 source Working registers {W0..W15}
WREG
W0 (Working register used in file register instructions)
Ws
Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso
Source W register 
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx
X data space prefetch address register for DSP instructions
 {[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2,
[W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2,
[W9 + W12], none}
Wxd
X data space prefetch destination register for DSP instructions {W4..W7}
Wy
Y data space prefetch address register for DSP instructions
 {[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2,
[W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2,
[W11 + W12], none}
Wyd
Y data space prefetch destination register for DSP instructions {W4..W7}
 2011-2014 Microchip Technology Inc.
DS70000652F-page 271
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 24-2:
Base
Instr
#
1
2
3
4
5
6
7
8
INSTRUCTION SET OVERVIEW
Assembly
Mnemonic
ADD
ADDC
AND
ASR
BCLR
BRA
BSET
BSW
Assembly Syntax
# of
# of
Words Cycles
Description
Status Flags
Affected
ADD
Acc
Add Accumulators
1
1
ADD
f
f = f + WREG
1
1
OA,OB,SA,SB
C,DC,N,OV,Z
ADD
f,WREG
WREG = f + WREG
1
1
C,DC,N,OV,Z
ADD
#lit10,Wn
Wd = lit10 + Wd
1
1
C,DC,N,OV,Z
ADD
Wb,Ws,Wd
Wd = Wb + Ws
1
1
C,DC,N,OV,Z
ADD
Wb,#lit5,Wd
Wd = Wb + lit5
1
1
C,DC,N,OV,Z
OA,OB,SA,SB
ADD
Wso,#Slit4,Acc
16-bit Signed Add to Accumulator
1
1
ADDC
f
f = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
f,WREG
WREG = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
#lit10,Wn
Wd = lit10 + Wd + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,Ws,Wd
Wd = Wb + Ws + (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
ADDC
Wb,#lit5,Wd
Wd = Wb + lit5 + (C)
1
1
AND
f
f = f .AND. WREG
1
1
N,Z
AND
f,WREG
WREG = f .AND. WREG
1
1
N,Z
AND
#lit10,Wn
Wd = lit10 .AND. Wd
1
1
N,Z
AND
Wb,Ws,Wd
Wd = Wb .AND. Ws
1
1
N,Z
AND
Wb,#lit5,Wd
Wd = Wb .AND. lit5
1
1
N,Z
ASR
f
f = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
f,WREG
WREG = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
Ws,Wd
Wd = Arithmetic Right Shift Ws
1
1
C,N,OV,Z
ASR
Wb,Wns,Wnd
Wnd = Arithmetic Right Shift Wb by Wns
1
1
N,Z
ASR
Wb,#lit5,Wnd
Wnd = Arithmetic Right Shift Wb by lit5
1
1
N,Z
BCLR
f,#bit4
Bit Clear f
1
1
None
BCLR
Ws,#bit4
Bit Clear Ws
1
1
None
BRA
C,Expr
Branch if Carry
1
1 (2)
None
BRA
GE,Expr
Branch if greater than or equal
1
1 (2)
None
BRA
GEU,Expr
Branch if unsigned greater than or equal
1
1 (2)
None
BRA
GT,Expr
Branch if greater than
1
1 (2)
None
BRA
GTU,Expr
Branch if unsigned greater than
1
1 (2)
None
BRA
LE,Expr
Branch if less than or equal
1
1 (2)
None
BRA
LEU,Expr
Branch if unsigned less than or equal
1
1 (2)
None
BRA
LT,Expr
Branch if less than
1
1 (2)
None
BRA
LTU,Expr
Branch if unsigned less than
1
1 (2)
None
BRA
N,Expr
Branch if Negative
1
1 (2)
None
BRA
NC,Expr
Branch if Not Carry
1
1 (2)
None
BRA
NN,Expr
Branch if Not Negative
1
1 (2)
None
BRA
NOV,Expr
Branch if Not Overflow
1
1 (2)
None
BRA
NZ,Expr
Branch if Not Zero
1
1 (2)
None
BRA
OA,Expr
Branch if Accumulator A overflow
1
1 (2)
None
BRA
OB,Expr
Branch if Accumulator B overflow
1
1 (2)
None
BRA
OV,Expr
Branch if Overflow
1
1 (2)
None
BRA
SA,Expr
Branch if Accumulator A saturated
1
1 (2)
None
BRA
SB,Expr
Branch if Accumulator B saturated
1
1 (2)
None
BRA
Expr
Branch Unconditionally
1
2
None
BRA
Z,Expr
Branch if Zero
1
1 (2)
None
BRA
Wn
Computed Branch
1
2
None
BSET
f,#bit4
Bit Set f
1
1
None
BSET
Ws,#bit4
Bit Set Ws
1
1
None
BSW.C
Ws,Wb
Write C bit to Ws<Wb>
1
1
None
BSW.Z
Ws,Wb
Write Z bit to Ws<Wb>
1
1
None
DS70000652F-page 272
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 24-2:
Base
Instr
#
9
10
11
12
13
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
BTG
BTSC
BTSS
BTST
BTSTS
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
BTG
f,#bit4
Bit Toggle f
1
1
None
BTG
Ws,#bit4
Bit Toggle Ws
1
1
None
BTSC
f,#bit4
Bit Test f, Skip if Clear
1
1
(2 or 3)
None
BTSC
Ws,#bit4
Bit Test Ws, Skip if Clear
1
1
(2 or 3)
None
BTSS
f,#bit4
Bit Test f, Skip if Set
1
1
(2 or 3)
None
BTSS
Ws,#bit4
Bit Test Ws, Skip if Set
1
1
(2 or 3)
None
BTST
f,#bit4
Bit Test f
1
1
Z
BTST.C
Ws,#bit4
Bit Test Ws to C
1
1
C
BTST.Z
Ws,#bit4
Bit Test Ws to Z
1
1
Z
BTST.C
Ws,Wb
Bit Test Ws<Wb> to C
1
1
C
BTST.Z
Ws,Wb
Bit Test Ws<Wb> to Z
1
1
Z
BTSTS
f,#bit4
Bit Test then Set f
1
1
Z
BTSTS.C
Ws,#bit4
Bit Test Ws to C, then Set
1
1
C
BTSTS.Z
Ws,#bit4
Bit Test Ws to Z, then Set
1
1
Z
lit23
Call subroutine
2
2
None
14
CALL
CALL
CALL
Wn
Call indirect subroutine
1
2
None
15
CLR
CLR
f
f = 0x0000
1
1
None
CLR
WREG
WREG = 0x0000
1
1
None
CLR
Ws
Ws = 0x0000
1
1
None
CLR
Acc,Wx,Wxd,Wy,Wyd,AWB
Clear Accumulator
1
1
OA,OB,SA,SB
Clear Watchdog Timer
1
1
WDTO,Sleep
16
CLRWDT
17
COM
18
19
20
CP
CP0
CPB
CLRWDT
COM
f
f=f
1
1
N,Z
COM
f,WREG
WREG = f
1
1
N,Z
COM
Ws,Wd
Wd = Ws
1
1
N,Z
CP
f
Compare f with WREG
1
1
C,DC,N,OV,Z
CP
Wb,#lit5
Compare Wb with lit5
1
1
C,DC,N,OV,Z
CP
Wb,Ws
Compare Wb with Ws (Wb – Ws)
1
1
C,DC,N,OV,Z
CP0
f
Compare f with 0x0000
1
1
C,DC,N,OV,Z
CP0
Ws
Compare Ws with 0x0000
1
1
C,DC,N,OV,Z
CPB
f
Compare f with WREG, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,#lit5
Compare Wb with lit5, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,Ws
Compare Wb with Ws, with Borrow
(Wb – Ws – C)
1
1
C,DC,N,OV,Z
21
CPSEQ
CPSEQ
Wb, Wn
Compare Wb with Wn, skip if =
1
1
(2 or 3)
None
22
CPSGT
CPSGT
Wb, Wn
Compare Wb with Wn, skip if >
1
1
(2 or 3)
None
23
CPSLT
CPSLT
Wb, Wn
Compare Wb with Wn, skip if <
1
1
(2 or 3)
None
24
CPSNE
CPSNE
Wb, Wn
Compare Wb with Wn, skip if 
1
1
(2 or 3)
None
25
DAW
DAW
Wn
Wn = decimal adjust Wn
1
1
C
26
DEC
DEC
f
f=f–1
1
1
C,DC,N,OV,Z
DEC
f,WREG
WREG = f – 1
1
1
C,DC,N,OV,Z
DEC
Ws,Wd
Wd = Ws – 1
1
1
C,DC,N,OV,Z
DEC2
f
f=f–2
1
1
C,DC,N,OV,Z
DEC2
f,WREG
WREG = f – 2
1
1
C,DC,N,OV,Z
DEC2
Ws,Wd
Wd = Ws – 2
1
1
C,DC,N,OV,Z
DISI
#lit14
Disable Interrupts for k instruction cycles
1
1
None
27
28
DEC2
DISI
 2011-2014 Microchip Technology Inc.
DS70000652F-page 273
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 24-2:
Base
Instr
#
29
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
DIV
Assembly Syntax
# of
# of
Words Cycles
Description
Status Flags
Affected
DIV.S
Wm,Wn
Signed 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.SD
Wm,Wn
Signed 32/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.U
Wm,Wn
Unsigned 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.UD
Wm,Wn
Unsigned 32/16-bit Integer Divide
1
18
N,Z,C,OV
Signed 16/16-bit Fractional Divide
1
18
N,Z,C,OV
None
30
DIVF
DIVF
31
DO
DO
#lit14,Expr
Do code to PC + Expr, lit14 + 1 times
2
2
DO
Wn,Expr
Do code to PC + Expr, (Wn) + 1 times
2
2
None
Wm,Wn
32
ED
ED
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance (no accumulate)
1
1
OA,OB,OAB,
SA,SB,SAB
33
EDAC
EDAC
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance
1
1
OA,OB,OAB,
SA,SB,SAB
34
EXCH
EXCH
Wns,Wnd
Swap Wns with Wnd
1
1
None
35
FBCL
FBCL
Ws,Wnd
Find Bit Change from Left (MSb) Side
1
1
C
36
FF1L
FF1L
Ws,Wnd
Find First One from Left (MSb) Side
1
1
C
37
FF1R
FF1R
Ws,Wnd
Find First One from Right (LSb) Side
1
1
C
38
GOTO
GOTO
Expr
Go to address
2
2
None
GOTO
Wn
Go to indirect
1
2
None
INC
f
f=f+1
1
1
C,DC,N,OV,Z
INC
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
INC
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
INC2
f
f=f+2
1
1
C,DC,N,OV,Z
INC2
f,WREG
WREG = f + 2
1
1
C,DC,N,OV,Z
39
40
41
INC
INC2
IOR
INC2
Ws,Wd
Wd = Ws + 2
1
1
C,DC,N,OV,Z
IOR
f
f = f .IOR. WREG
1
1
N,Z
IOR
f,WREG
WREG = f .IOR. WREG
1
1
N,Z
IOR
#lit10,Wn
Wd = lit10 .IOR. Wd
1
1
N,Z
IOR
Wb,Ws,Wd
Wd = Wb .IOR. Ws
1
1
N,Z
IOR
Wb,#lit5,Wd
Wd = Wb .IOR. lit5
1
1
N,Z
42
LAC
LAC
Wso,#Slit4,Acc
Load Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
43
LNK
LNK
#lit14
Link Frame Pointer
1
1
None
44
LSR
LSR
f
f = Logical Right Shift f
1
1
C,N,OV,Z
LSR
f,WREG
WREG = Logical Right Shift f
1
1
C,N,OV,Z
LSR
Ws,Wd
Wd = Logical Right Shift Ws
1
1
C,N,OV,Z
LSR
Wb,Wns,Wnd
Wnd = Logical Right Shift Wb by Wns
1
1
N,Z
LSR
Wb,#lit5,Wnd
Wnd = Logical Right Shift Wb by lit5
1
1
N,Z
MAC
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, Multiply and Accumulate
AWB
1
1
OA,OB,OAB,
SA,SB,SAB
MAC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
MOV
f,Wn
Move f to Wn
1
1
None
MOV
f
Move f to f
1
1
N,Z
MOV
f,WREG
Move f to WREG
1
1
None
45
46
47
MAC
MOV
MOVSAC
MOV
#lit16,Wn
Move 16-bit literal to Wn
1
1
None
MOV.b
#lit8,Wn
Move 8-bit literal to Wn
1
1
None
MOV
Wn,f
Move Wn to f
1
1
None
MOV
Wso,Wdo
Move Ws to Wd
1
1
None
MOV
WREG,f
Move WREG to f
1
1
None
MOV.D
Wns,Wd
Move Double from W(ns):W(ns + 1) to Wd
1
2
None
MOV.D
Ws,Wnd
Move Double from Ws to W(nd + 1):W(nd)
1
2
None
Prefetch and store accumulator
1
1
None
MOVSAC
DS70000652F-page 274
Acc,Wx,Wxd,Wy,Wyd,AWB
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 24-2:
Base
Instr
#
48
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
MPY
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
Multiply Wm by Wn to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
49
MPY.N
MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
(Multiply Wm by Wn) to Accumulator
1
1
None
50
MSC
MSC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,
AWB
Multiply and Subtract from Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
51
MUL
MUL.SS
Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) * signed(Ws)
1
1
None
MUL.SU
Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws)
1
1
None
MUL.US
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws)
1
1
None
MUL.UU
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(Ws)
1
1
None
MUL.SU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5)
1
1
None
MUL.UU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(lit5)
1
1
None
MUL
f
W3:W2 = f * WREG
1
1
None
NEG
Acc
Negate Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
52
53
54
NEG
NOP
POP
NEG
f
f=f+1
1
1
C,DC,N,OV,Z
NEG
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
NEG
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
NOP
No Operation
1
1
None
NOPR
No Operation
1
1
None
None
POP
f
Pop f from Top-of-Stack (TOS)
1
1
POP
Wdo
Pop from Top-of-Stack (TOS) to Wdo
1
1
None
POP.D
Wnd
Pop from Top-of-Stack (TOS) to
W(nd):W(nd + 1)
1
2
None
Pop Shadow Registers
1
1
All
f
Push f to Top-of-Stack (TOS)
1
1
None
PUSH
Wso
Push Wso to Top-of-Stack (TOS)
1
1
None
PUSH.D
Wns
Push W(ns):W(ns + 1) to Top-of-Stack (TOS)
1
2
None
Push Shadow Registers
1
1
None
Go into Sleep or Idle mode
1
1
WDTO,Sleep
POP.S
55
PUSH
PUSH
PUSH.S
56
PWRSAV
PWRSAV
57
RCALL
RCALL
Expr
Relative Call
1
2
None
RCALL
Wn
Computed Call
1
2
None
REPEAT
#lit14
Repeat Next Instruction lit14 + 1 times
1
1
None
REPEAT
Wn
Repeat Next Instruction (Wn) + 1 times
1
1
None
None
58
REPEAT
#lit1
59
RESET
RESET
Software device Reset
1
1
60
RETFIE
RETFIE
Return from interrupt
1
3 (2)
None
61
RETLW
RETLW
Return with literal in Wn
1
3 (2)
None
62
RETURN
RETURN
Return from Subroutine
1
3 (2)
None
63
RLC
RLC
f
f = Rotate Left through Carry f
1
1
C,N,Z
RLC
f,WREG
WREG = Rotate Left through Carry f
1
1
C,N,Z
RLC
Ws,Wd
Wd = Rotate Left through Carry Ws
1
1
C,N,Z
RLNC
f
f = Rotate Left (No Carry) f
1
1
N,Z
RLNC
f,WREG
WREG = Rotate Left (No Carry) f
1
1
N,Z
64
65
RLNC
RRC
#lit10,Wn
RLNC
Ws,Wd
Wd = Rotate Left (No Carry) Ws
1
1
N,Z
RRC
f
f = Rotate Right through Carry f
1
1
C,N,Z
RRC
f,WREG
WREG = Rotate Right through Carry f
1
1
C,N,Z
RRC
Ws,Wd
Wd = Rotate Right through Carry Ws
1
1
C,N,Z
 2011-2014 Microchip Technology Inc.
DS70000652F-page 275
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 24-2:
Base
Instr
#
66
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
RRNC
Assembly Syntax
# of
# of
Words Cycles
Description
Status Flags
Affected
RRNC
f
f = Rotate Right (No Carry) f
1
1
N,Z
RRNC
f,WREG
WREG = Rotate Right (No Carry) f
1
1
N,Z
RRNC
Ws,Wd
Wd = Rotate Right (No Carry) Ws
1
1
N,Z
67
SAC
SAC
Acc,#Slit4,Wdo
Store Accumulator
1
1
None
SAC.R
Acc,#Slit4,Wdo
Store Rounded Accumulator
1
1
None
68
SE
SE
Ws,Wnd
Wnd = sign-extended Ws
1
1
C,N,Z
69
SETM
SETM
f
f = 0xFFFF
1
1
None
SETM
WREG
WREG = 0xFFFF
1
1
None
SETM
Ws
Ws = 0xFFFF
1
1
None
SFTAC
Acc,Wn
Arithmetic Shift Accumulator by (Wn)
1
1
OA,OB,OAB,
SA,SB,SAB
SFTAC
Acc,#Slit6
Arithmetic Shift Accumulator by Slit6
1
1
OA,OB,OAB,
SA,SB,SAB
SL
f
f = Left Shift f
1
1
C,N,OV,Z
SL
f,WREG
WREG = Left Shift f
1
1
C,N,OV,Z
SL
Ws,Wd
Wd = Left Shift Ws
1
1
C,N,OV,Z
SL
Wb,Wns,Wnd
Wnd = Left Shift Wb by Wns
1
1
N,Z
SL
Wb,#lit5,Wnd
Wnd = Left Shift Wb by lit5
1
1
N,Z
SUB
Acc
Subtract Accumulators
1
1
OA,OB,OAB,
SA,SB,SAB
SUB
f
f = f – WREG
1
1
C,DC,N,OV,Z
SUB
f,WREG
WREG = f – WREG
1
1
C,DC,N,OV,Z
SUB
#lit10,Wn
Wn = Wn – lit10
1
1
C,DC,N,OV,Z
SUB
Wb,Ws,Wd
Wd = Wb – Ws
1
1
C,DC,N,OV,Z
SUB
Wb,#lit5,Wd
Wd = Wb – lit5
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
70
71
72
73
74
75
76
SFTAC
SL
SUB
SUBB
SUBR
SUBBR
SWAP
SUBB
f
f = f – WREG – (C)
1
1
SUBB
f,WREG
WREG = f – WREG – (C)
1
1
C,DC,N,OV,Z
SUBB
#lit10,Wn
Wn = Wn – lit10 – (C)
1
1
C,DC,N,OV,Z
SUBB
Wb,Ws,Wd
Wd = Wb – Ws – (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBB
Wb,#lit5,Wd
Wd = Wb – lit5 – (C)
1
1
SUBR
f
f = WREG – f
1
1
C,DC,N,OV,Z
SUBR
f,WREG
WREG = WREG – f
1
1
C,DC,N,OV,Z
SUBR
Wb,Ws,Wd
Wd = Ws – Wb
1
1
C,DC,N,OV,Z
SUBR
Wb,#lit5,Wd
Wd = lit5 – Wb
1
1
C,DC,N,OV,Z
SUBBR
f
f = WREG – f – (C)
1
1
C,DC,N,OV,Z
SUBBR
f,WREG
WREG = WREG – f – (C)
1
1
C,DC,N,OV,Z
SUBBR
Wb,Ws,Wd
Wd = Ws – Wb – (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBBR
Wb,#lit5,Wd
Wd = lit5 – Wb – (C)
1
1
SWAP.b
Wn
Wn = nibble swap Wn
1
1
None
SWAP
Wn
Wn = byte swap Wn
1
1
None
None
77
TBLRDH
TBLRDH
Ws,Wd
Read Prog<23:16> to Wd<7:0>
1
2
78
TBLRDL
TBLRDL
Ws,Wd
Read Prog<15:0> to Wd
1
2
None
79
TBLWTH
TBLWTH
Ws,Wd
Write Ws<7:0> to Prog<23:16>
1
2
None
80
TBLWTL
TBLWTL
Ws,Wd
Write Ws to Prog<15:0>
1
2
None
81
ULNK
ULNK
Unlink Frame Pointer
1
1
None
82
XOR
XOR
f
f = f .XOR. WREG
1
1
N,Z
XOR
f,WREG
WREG = f .XOR. WREG
1
1
N,Z
XOR
#lit10,Wn
Wd = lit10 .XOR. Wd
1
1
N,Z
XOR
Wb,Ws,Wd
Wd = Wb .XOR. Ws
1
1
N,Z
XOR
Wb,#lit5,Wd
Wd = Wb .XOR. lit5
1
1
N,Z
ZE
Ws,Wnd
Wnd = Zero-extend Ws
1
1
C,Z,N
83
ZE
DS70000652F-page 276
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
25.0
DEVELOPMENT SUPPORT
The PIC® microcontrollers (MCU) and dsPIC® digital
signal controllers (DSC) are supported with a full range
of software and hardware development tools:
• Integrated Development Environment
- MPLAB® X IDE Software
• Compilers/Assemblers/Linkers
- MPLAB XC Compiler
- MPASMTM Assembler
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB X SIM Software Simulator
• Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers/Programmers
- MPLAB ICD 3
- PICkit™ 3
• Device Programmers
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits and Starter Kits
• Third-party development tools
25.1
MPLAB X Integrated Development
Environment Software
The MPLAB X IDE is a single, unified graphical user
interface for Microchip and third-party software, and
hardware development tool that runs on Windows®,
Linux and Mac OS® X. Based on the NetBeans IDE,
MPLAB X IDE is an entirely new IDE with a host of free
software components and plug-ins for highperformance application development and debugging.
Moving between tools and upgrading from software
simulators to hardware debugging and programming
tools is simple with the seamless user interface.
With complete project management, visual call graphs,
a configurable watch window and a feature-rich editor
that includes code completion and context menus,
MPLAB X IDE is flexible and friendly enough for new
users. With the ability to support multiple tools on
multiple projects with simultaneous debugging, MPLAB
X IDE is also suitable for the needs of experienced
users.
Feature-Rich Editor:
• Color syntax highlighting
• Smart code completion makes suggestions and
provides hints as you type
• Automatic code formatting based on user-defined
rules
• Live parsing
User-Friendly, Customizable Interface:
• Fully customizable interface: toolbars, toolbar
buttons, windows, window placement, etc.
• Call graph window
Project-Based Workspaces:
•
•
•
•
Multiple projects
Multiple tools
Multiple configurations
Simultaneous debugging sessions
File History and Bug Tracking:
• Local file history feature
• Built-in support for Bugzilla issue tracker
 2011-2014 Microchip Technology Inc.
DS70000652F-page 277
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
25.2
MPLAB XC Compilers
The MPLAB XC Compilers are complete ANSI C
compilers for all of Microchip’s 8, 16, and 32-bit MCU
and DSC devices. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use. MPLAB XC Compilers run on Windows,
Linux or MAC OS X.
For easy source level debugging, the compilers provide
debug information that is optimized to the MPLAB X
IDE.
The free MPLAB XC Compiler editions support all
devices and commands, with no time or memory
restrictions, and offer sufficient code optimization for
most applications.
MPLAB XC Compilers include an assembler, linker and
utilities. The assembler generates relocatable object
files that can then be archived or linked with other relocatable object files and archives to create an executable file. MPLAB XC Compiler uses the assembler to
produce its object file. Notable features of the assembler include:
•
•
•
•
•
•
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command-line interface
Rich directive set
Flexible macro language
MPLAB X IDE compatibility
25.3
MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code, and COFF files for
debugging.
25.4
MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler. It can link
relocatable objects from precompiled libraries, using
directives from a linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
25.5
MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC DSC devices. MPLAB XC Compiler
uses the assembler to produce its object file. The
assembler generates relocatable object files that can
then be archived or linked with other relocatable object
files and archives to create an executable file. Notable
features of the assembler include:
•
•
•
•
•
•
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command-line interface
Rich directive set
Flexible macro language
MPLAB X IDE compatibility
The MPASM Assembler features include:
• Integration into MPLAB X IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multipurpose
source files
• Directives that allow complete control over the
assembly process
DS70000652F-page 278
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
25.6
MPLAB X SIM Software Simulator
The MPLAB X SIM Software Simulator allows code
development in a PC-hosted environment by simulating the PIC MCUs and dsPIC DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB X SIM Software Simulator fully supports
symbolic debugging using the MPLAB XC Compilers,
and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and
debug code outside of the hardware laboratory environment, making it an excellent, economical software
development tool.
25.7
MPLAB REAL ICE In-Circuit
Emulator System
The MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs all 8, 16 and 32-bit MCU, and DSC devices
with the easy-to-use, powerful graphical user interface of
the MPLAB X IDE.
The emulator is connected to the design engineer’s
PC using a high-speed USB 2.0 interface and is
connected to the target with either a connector
compatible with in-circuit debugger systems (RJ-11)
or with the new high-speed, noise tolerant, LowVoltage Differential Signal (LVDS) interconnection
(CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB X IDE. MPLAB REAL ICE offers
significant advantages over competitive emulators
including full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, logic
probes, a ruggedized probe interface and long (up to
three meters) interconnection cables.
 2011-2014 Microchip Technology Inc.
25.8
MPLAB ICD 3 In-Circuit Debugger
System
The MPLAB ICD 3 In-Circuit Debugger System is
Microchip’s most cost-effective, high-speed hardware
debugger/programmer for Microchip Flash DSC and
MCU devices. It debugs and programs PIC Flash
microcontrollers and dsPIC DSCs with the powerful,
yet easy-to-use graphical user interface of the MPLAB
IDE.
The MPLAB ICD 3 In-Circuit Debugger probe is
connected to the design engineer’s PC using a highspeed USB 2.0 interface and is connected to the target
with a connector compatible with the MPLAB ICD 2 or
MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3
supports all MPLAB ICD 2 headers.
25.9
PICkit 3 In-Circuit Debugger/
Programmer
The MPLAB PICkit 3 allows debugging and programming of PIC and dsPIC Flash microcontrollers at a most
affordable price point using the powerful graphical user
interface of the MPLAB IDE. The MPLAB PICkit 3 is
connected to the design engineer’s PC using a fullspeed USB interface and can be connected to the target via a Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The
connector uses two device I/O pins and the Reset line
to implement in-circuit debugging and In-Circuit Serial
Programming™ (ICSP™).
25.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages, and a modular, detachable socket assembly to support various
package types. The ICSP cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices, and incorporates an MMC card for file
storage and data applications.
DS70000652F-page 279
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
25.11 Demonstration/Development
Boards, Evaluation Kits and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully
functional systems. Most boards include prototyping
areas for adding custom circuitry and provide application firmware and source code for examination and
modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
25.12 Third-Party Development Tools
Microchip also offers a great collection of tools from
third-party vendors. These tools are carefully selected
to offer good value and unique functionality.
• Device Programmers and Gang Programmers
from companies, such as SoftLog and CCS
• Software Tools from companies, such as Gimpel
and Trace Systems
• Protocol Analyzers from companies, such as
Saleae and Total Phase
• Demonstration Boards from companies, such as
MikroElektronika, Digilent® and Olimex
• Embedded Ethernet Solutions from companies,
such as EZ Web Lynx, WIZnet and IPLogika®
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™
demonstration/development board series of circuits,
Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security
ICs, CAN, IrDA®, PowerSmart battery management,
SEEVAL® evaluation system, Sigma-Delta ADC, flow
rate sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
DS70000652F-page 280
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
26.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104 family
electrical characteristics. Additional information will be provided in future revisions of this document as it becomes
available.
Absolute maximum ratings for the dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104 family are
listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional
operation of the device at these, or any other conditions above the parameters indicated in the operation listings of this
specification, is not implied.
Absolute Maximum Ratings(1)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS .......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant with respect to VSS(3)..................................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD  3.0V(3) ................................................... -0.3V to +5.6V
Voltage on any 5V tolerant pin with respect to VSS when VDD  3.0V(3) ........................................ -0.3V to (VDD + 0.3V)
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin(2) ...........................................................................................................................250 mA
Maximum output current sourced and sunk by any I/O pin excluding OSCO .........................................................15 mA
Maximum output current sourced and sunk by OSCO............................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports(2) ...............................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those, or any other conditions
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of the device maximum power dissipation (see Table 26-2).
3: See the “Pin Diagrams” section for 5V tolerant pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 281
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
26.1
DC Characteristics
TABLE 26-1:
OPERATING MIPS vs. VOLTAGE
Max MIPS
VDD Range
(in Volts)
Characteristic
DC5
Note 1:
Temp Range
(in °C)
dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104
VBOR-3.6V(1)
-40°C to +85°C
16
VBOR-3.6V(1)
-40°C to +125°C
16
Overall functional device operation at VBOR < VDD < VDDMIN is ensured but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN.
TABLE 26-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Operating Ambient Temperature Range
TA
-40
—
+85
°C
Operating Junction Temperature Range
TJ
-40
—
+140
°C
Operating Ambient Temperature Range
TA
-40
—
+125
°C
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
PD
PINT + PIO
W
PDMAX
(TJ – TA)/JA
W
I/O Pin Power Dissipation:
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
TABLE 26-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Notes
Package Thermal Resistance, 18-pin PDIP
JA
50
—
°C/W
1
Package Thermal Resistance, 20-pin PDIP
JA
50
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
JA
50
—
°C/W
1
Package Thermal Resistance, 18-pin SOIC
JA
63
—
°C/W
1
Package Thermal Resistance, 20-pin SOIC
JA
63
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
JA
55
—
°C/W
1
Package Thermal Resistance, 20-pin SSOP
JA
90
—
°C/W
1
Package Thermal Resistance, 28-pin SSOP
JA
71
—
°C/W
1
Package Thermal Resistance, 28-pin QFN (6x6 mm)
JA
37
—
°C/W
1
Package Thermal Resistance, 36-pin VTLA (5x5 mm)
JA
31.1
—
°C/W
1
Package Thermal Resistance, 44-pin TQFP
JA
45
—
°C/W
1, 2
Package Thermal Resistance, 44-pin QFN
JA
32
—
°C/W
1, 2
Package Thermal Resistance, 44-pin VTLA
JA
30
—
°C/W
1, 2
Note 1:
2:
Junction to ambient thermal resistance; Theta-JA (JA) numbers are achieved by package simulations.
This package is available in dsPIC33FJ32(GP/MC)104 devices only.
DS70000652F-page 282
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-4:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
Units
—
VBOR
—
3.6
V
Conditions
Operating Voltage
DC10
Supply Voltage(3)
VDD
Voltage(2)
DC12
VDR
RAM Data Retention
1.8
—
—
V
DC16
VPOR
VDD Start Voltage
to Ensure Internal
Power-on Reset Signal
—
1.75
VSS
V
DC17
SVDD
VDD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.024
—
—
V/ms
Note 1:
2:
3:
0-2.4V in 0.1s
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
This is the limit to which VDD may be lowered without losing RAM data.
Overall functional device operation at VBOR < VDD < VDDMIN is ensured but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN.
TABLE 26-5:
ELECTRICAL CHARACTERISTICS: BROWN-OUT RESET (BOR)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
No.
Industrial and Extended
Symbol
Characteristic
BOR Event on VDD Transition
High-to-Low
Min(1)
Typ
Max
Units
2.40
2.48
2.55
V
Conditions
See Note 2
BO10
VBOR
Note 1:
2:
Parameters are for design guidance only and are not tested in manufacturing.
Overall functional device operation at VBOR < VDD < VDDMIN is ensured but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 283
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-6:
DC CHARACTERISTICS: OPERATING CURRENT (IDD)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Operating Current (IDD)(2) – dsPIC33FJ16(GP/MC)10X Devices
DC20d
0.7
1.7
mA
-40°C
DC20a
0.7
1.7
mA
+25°C
DC20b
1.0
1.7
mA
+85°C
DC20c
1.3
1.7
mA
+125°C
DC21d
1.9
2.6
mA
-40°C
DC21a
1.9
2.6
mA
+25°C
DC21b
1.9
2.6
mA
+85°C
DC21c
2.0
2.6
mA
+125°C
DC22d
6.5
8.5
mA
-40°C
DC22a
6.5
8.5
mA
+25°C
DC22b
6.5
8.5
mA
+85°C
DC22c
6.5
8.5
mA
+125°C
DC23d
12.2
16
mA
-40°C
DC23a
12.2
16
mA
+25°C
DC23b
12.2
16
mA
+85°C
DC23c
12.2
16
mA
+125°C
DC24d
16
21
mA
-40°C
DC24a
16
21
mA
+25°C
DC24b
16
21
mA
+85°C
16
21
mA
+125°C
DC24c
Note 1:
2:
3:
3.3V
LPRC
(32.768 kHz)(3)
3.3V
1 MIPS(3)
3.3V
4 MIPS(3)
3.3V
10 MIPS(3)
3.3V
16 MIPS
Data in “Typical” column is at 3.3V, +25°C unless otherwise stated.
IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDD measurements are as follows:
• Oscillator is configured in EC mode, OSC1 is driven with external square wave from rail-to-rail
• CLKO is configured as an I/O input pin in the Configuration Word
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• CPU, SRAM, program memory and data memory are operational
• No peripheral modules are operating; however, every peripheral is being clocked (PMDx bits are all
zeroed)
• CPU executing while(1) statement
These parameters are characterized, but not tested in manufacturing.
DS70000652F-page 284
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-6:
DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Operating Current (IDD)(2) – dsPIC33FJ32(GP/MC)10X Devices
DC20d
1
2
mA
-40°C
DC20a
1
2
mA
+25°C
DC20b
1.1
2
mA
+85°C
DC20c
1.3
2
mA
+125°C
DC21d
1.7
3
mA
-40°C
DC21a
2.3
3
mA
+25°C
DC21b
2.3
3
mA
+85°C
DC21c
2.4
3
mA
+125°C
DC22d
7
8.5
mA
-40°C
DC22a
7
8.5
mA
+25°C
DC22b
7
8.5
mA
+85°C
DC22c
7
8.5
mA
+125°C
DC23d
13.2
17
mA
-40°C
DC23a
13.2
17
mA
+25°C
DC23b
13.2
17
mA
+85°C
DC23c
13.2
17
mA
+125°C
DC24d
17
22
mA
-40°C
DC24a
17
22
mA
+25°C
DC24b
17
22
mA
+85°C
DC24c
17
22
mA
+125°C
Note 1:
2:
3:
3.3V
LPRC
(32.768 kHz)(3)
3.3V
1 MIPS(3)
3.3V
4 MIPS(3)
3.3V
10 MIPS(3)
3.3V
16 MIPS
Data in “Typical” column is at 3.3V, +25°C unless otherwise stated.
IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDD measurements are as follows:
• Oscillator is configured in EC mode, OSC1 is driven with external square wave from rail-to-rail
• CLKO is configured as an I/O input pin in the Configuration Word
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• CPU, SRAM, program memory and data memory are operational
• No peripheral modules are operating; however, every peripheral is being clocked (PMDx bits are all
zeroed)
• CPU executing while(1) statement
These parameters are characterized, but not tested in manufacturing.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 285
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-7:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Idle Current (IIDLE): Core Off, Clock On Base Current(2) – dsPIC33FJ16(GP/MC)10X Devices
DC40d
0.4
1.0
mA
-40°C
DC40a
0.4
1.0
mA
+25°C
DC40b
0.4
1.0
mA
+85°C
DC40c
0.5
1.0
mA
+125°C
DC41d
0.5
1.1
mA
-40°C
DC41a
0.5
1.1
mA
+25°C
DC41b
0.5
1.1
mA
+85°C
DC41c
0.8
1.1
mA
+125°C
DC42d
0.9
1.6
mA
-40°C
DC42a
0.9
1.6
mA
+25°C
DC42b
1.0
1.6
mA
+85°C
DC42c
1.2
1.6
mA
+125°C
DC43a
1.6
2.6
mA
+25°C
DC43d
1.6
2.6
mA
-40°C
DC43b
1.7
2.6
mA
+85°C
DC43c
2
2.6
mA
+125°C
DC44d
2.4
3.8
mA
-40°C
DC44a
2.4
3.8
mA
+25°C
DC44b
2.6
3.8
mA
+85°C
2.9
3.8
mA
+125°C
DC44c
Note 1:
2:
3:
3.3V
LPRC
(32.768 kHz)(3)
3.3V
1 MIPS(3)
3.3V
4 MIPS(3)
3.3V
10 MIPS(3)
3.3V
16 MIPS(3)
Data in “Typical” column is at 3.3V, +25°C unless otherwise stated.
Base Idle current is measured as follows:
• CPU core is off, oscillator is configured in EC mode, OSC1 is driven with external square wave from
rail-to-rail
• CLKO is configured as an I/O input pin in the Configuration Word
• External Secondary Oscillator (SOSC) is disabled (i.e., SOSCO and SOSCI pins are configured as
digital I/O inputs)
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• No peripheral modules are operating; however, every peripheral is being clocked (PMDx bits are all
zeroed)
These parameters are characterized, but not tested in manufacturing.
DS70000652F-page 286
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-7:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Idle Current (IIDLE): Core Off, Clock On Base Current(2) – dsPIC33FJ32(GP/MC)10X Devices
DC40d
0.4
1.0
mA
-40°C
DC40a
0.4
1.0
mA
+25°C
DC40b
0.4
1.0
mA
+85°C
DC40c
0.5
1.0
mA
+125°C
DC41d
0.5
1.1
mA
-40°C
DC41a
0.5
1.1
mA
+25°C
DC41b
0.5
1.1
mA
+85°C
DC41c
0.8
1.1
mA
+125°C
DC42d
0.9
1.6
mA
-40°C
DC42a
0.9
1.6
mA
+25°C
DC42b
1.0
1.6
mA
+85°C
DC42c
1.2
1.6
mA
+125°C
DC43a
1.6
2.6
mA
+25°C
DC43d
1.6
2.6
mA
-40°C
DC43b
1.7
2.6
mA
+85°C
DC43c
2.0
2.6
mA
+125°C
DC44d
2.4
3.8
mA
-40°C
DC44a
2.4
3.8
mA
+25°C
DC44b
2.6
3.8
mA
+85°C
2.9
3.8
mA
+125°C
DC44c
Note 1:
2:
3:
3.3V
LPRC
(32.768 kHz)(3)
3.3V
1 MIPS(3)
3.3V
4 MIPS(3)
3.3V
10 MIPS(3)
3.3V
16 MIPS(3)
Data in “Typical” column is at 3.3V, +25°C unless otherwise stated.
Base Idle current is measured as follows:
• CPU core is off, oscillator is configured in EC mode, OSC1 is driven with external square wave from
rail-to-rail
• CLKO is configured as an I/O input pin in the Configuration Word
• External Secondary Oscillator (SOSC) is disabled (i.e., SOSCO and SOSCI pins are configured as
digital I/O inputs)
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• No peripheral modules are operating; however, every peripheral is being clocked (PMDx bits are all
zeroed)
These parameters are characterized, but not tested in manufacturing.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 287
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-8:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Power-Down Current (IPD)(2) – dsPIC33FJ16(GP/MC)10X Devices
DC60d
27
250
µA
-40°C
DC60a
32
250
µA
+25°C
DC60b
43
250
µA
+85°C
DC60c
150
500
µA
+125°C
DC61d
420
600
µA
-40°C
DC61a
420
600
µA
+25°C
DC61b
530
750
µA
+85°C
DC61c
620
900
µA
+125°C
Power-Down Current
(IPD)(2)
27
250
µA
-40°C
DC60a
32
250
µA
+25°C
DC60b
43
250
µA
+85°C
DC60c
150
500
µA
+125°C
DC61d
420
600
µA
-40°C
DC61a
420
600
µA
+25°C
DC61b
530
750
µA
+85°C
620
900
µA
+125°C
Note 1:
2:
3:
4:
5:
Base Power-Down Current(3,4)
3.3V
Watchdog Timer Current: IWDT(3,5)
3.3V
Base Power-Down Current(3,4)
3.3V
Watchdog Timer Current: IWDT(3,5)
– dsPIC33FJ32(GP/MC)10X Devices
DC60d
DC61c
3.3V
Data in the Typical column is at 3.3V, +25°C unless otherwise stated.
IPD (Sleep) current is measured as follows:
• CPU core is off, oscillator is configured in EC mode, OSC1 is driven with external square wave from
rail-to-rail
• CLKO is configured as an I/O input pin in the Configuration Word
• External Secondary Oscillator (SOSC) is disabled (i.e., SOSCO and SOSCI pins are configured as
digital I/O inputs)
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• All peripheral modules are disabled (PMDx bits are all ones)
• VREGS bit (RCON<8>) = 1 (i.e., core regulator is set to stand-by while the device is in Sleep mode)
• On applicable devices, RTCC is disabled, plus the VREGS bit (RCON<8>) = 1
The  current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but not tested in manufacturing.
DS70000652F-page 288
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-9:
DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter No.
Typical(1)
Max
Doze
Ratio(2)
Units
Conditions
Doze Current (IDOZE)(2) – dsPIC33FJ16(GP/MC)10X Devices
DC73a
13.2
17.2
1:2
mA
DC73f
4.7
DC73g
4.7
6.2
1:64
mA
6.2
1:128
mA
DC70a
13.2
DC70f
4.7
17.2
1:2
mA
6.2
1:64
mA
DC70g
4.7
6.2
1:128
mA
DC71a
13.2
17.2
1:2
mA
DC71f
4.7
6.2
1:64
mA
DC71g
4.7
6.2
1:128
mA
DC72a
13.2
17.2
1:2
mA
DC72f
4.7
6.2
1:64
mA
DC72g
4.7
6.2
1:128
mA
-40°C
3.3V
16 MIPS
+25°C
3.3V
16 MIPS
+85°C
3.3V
16 MIPS
+125°C
3.3V
16 MIPS
-40°C
3.3V
16 MIPS
+25°C
3.3V
16 MIPS
+85°C
3.3V
16 MIPS
+125°C
3.3V
16 MIPS
Doze Current (IDOZE)(2) – dsPIC33FJ32(GP/MC)10X Devices
DC73a
13.2
17.2
1:2
mA
DC73f
4.7
6.2
1:64
mA
DC73g
4.7
6.2
1:128
mA
DC70a
13.2
17.2
1:2
mA
DC70f
4.7
6.2
1:64
mA
DC70g
4.7
6.2
1:128
mA
DC71a
13.2
17.2
1:2
mA
DC71f
4.7
6.2
1:64
mA
DC71g
4.7
6.2
1:128
mA
DC72a
13.2
17.2
1:2
mA
DC72f
4.7
6.2
1:64
mA
DC72g
4.7
6.2
1:128
mA
Note 1:
2:
Data in the Typical column is at 3.3V, +25°C unless otherwise stated.
IDOZE is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDOZE measurements are as follows:
• Oscillator is configured in EC mode, OSC1 is driven with external square wave from rail-to-rail
• CLKO is configured as an I/O input pin in the Configuration Word
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• CPU, SRAM, program memory and data memory are operational
• No peripheral modules are operating; however, every peripheral is being clocked (PMDx bits are all
zeros)
• CPU executing while(1) statement
 2011-2014 Microchip Technology Inc.
DS70000652F-page 289
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-10: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VIL
Characteristic
Min
Typ(1)
Max
Units
Conditions
Input Low Voltage
DI10
I/O Pins
VSS
—
0.2 VDD
V
DI15
MCLR
VSS
—
0.2 VDD
V
DI18
I/O Pins with SDAx, SCLx
VSS
—
0.3 VDD
V
SMBus disabled
DI19
I/O Pins with SDAx, SCLx
VSS
—
0.8
V
SMBus enabled
VIH
Input High Voltage
DI20
I/O Pins Not 5V Tolerant(4)
I/O Pins 5V Tolerant(4)
0.7 VDD
0.7 VDD
—
—
VDD
5.5
V
V
DI28
SDAx, SCLx
0.7 VDD
—
5.5
V
SMBus disabled
DI29
SDAx, SCLx
2.1
—
5.5
V
SMBus enabled
50
250
450
A
VDD = 3.3V, VPIN = VSS
ICNPU
CNx Pull-up Current
DI30
IIL
Input Leakage
Current(2,3)
DI50
I/O Pins 5V Tolerant(4)
—
—
±2
A
VSS  VPIN  VDD,
Pin at high-impedance
DI51
I/O Pins Not 5V Tolerant(4)
—
—
±1
A
VSS  VPIN  VDD,
Pin at high-impedance,
-40°C  TA  +85°C
DI51a
I/O Pins Not 5V Tolerant(4)
—
—
±2
A
Shared with external
reference pins,
-40°C  TA  +85°C
DI51b
I/O Pins Not 5V Tolerant(4)
—
—
±3.5
A
VSS  VPIN  VDD,
Pin at high-impedance,
-40°C  TA  +125°C
DI51c
I/O Pins Not 5V Tolerant(4)
—
—
±8
A
Analog pins shared with
external reference pins,
-40°C  TA  +125°C
DI55
MCLR
—
—
±2
A
VSS VPIN VDD
DI56
OSC1
—
—
±2
A
VSS VPIN VDD,
XT and HS modes
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels
represent normal operating conditions. Higher leakage current can be measured at different input voltages.
Negative current is defined as current sourced by the pin.
See the “Pin Diagrams” section for the 5V tolerant I/O pins.
VIL source < (VSS – 0.3). Characterized but not tested.
Non-5V tolerant pins, VIH source > (VDD + 0.3), 5V tolerant pins, VIH source > 5.5V. Characterized but not
tested.
Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.
Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
Any number and/or combination of I/O pins, not excluded under IICL or IICH conditions, are permitted
provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not
exceed the specified limit. Characterized but not tested.
DS70000652F-page 290
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-10: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)
DC CHARACTERISTICS
Param
Symbol
No.
IICL
Characteristic
IICT
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
Typ(1)
Max
Units
Conditions
0
-5(5,8)
—
mA
All pins except VDD, VSS,
AVDD, AVSS, MCLR,
VCAP, SOSCI, SOSCO
and RB14
0
—
+5(6,7,8)
mA
All pins except VDD,
VSS, AVDD, AVSS,
MCLR, VCAP, SOSCI,
SOSCO, RB14 and
digital 5V tolerant
designated pins
-20(9)
—
+20(9)
mA
Absolute instantaneous
sum of all ± input
injection currents from
all I/O pins
( | IICL + | IICH | )  IICT
Input High Injection Current
DI60b
DI60c
Min
Input Low Injection Current
DI60a
IICH
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Total Input Injection Current
(sum of all I/O and control
pins)
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels
represent normal operating conditions. Higher leakage current can be measured at different input voltages.
Negative current is defined as current sourced by the pin.
See the “Pin Diagrams” section for the 5V tolerant I/O pins.
VIL source < (VSS – 0.3). Characterized but not tested.
Non-5V tolerant pins, VIH source > (VDD + 0.3), 5V tolerant pins, VIH source > 5.5V. Characterized but not
tested.
Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.
Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
Any number and/or combination of I/O pins, not excluded under IICL or IICH conditions, are permitted
provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not
exceed the specified limit. Characterized but not tested.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 291
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-11: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
DO10
DO20
VOL
VOH
Characteristic
Min
Typ(1)
Max
Units
Output Low Voltage
I/O Pins:
4x Sink Driver Pins – All Pins
excluding OSCO
—
—
0.4
V
IOL  6 mA, VDD = 3.3V,
See Note 1
Output Low Voltage
I/O Pins:
8x Sink Driver Pins – OSCO
—
—
0.4
V
IOL  10 mA, VDD = 3.3V,
See Note 1
Output High Voltage
I/O Pins:
4x Source Driver Pins – All
Pins excluding OSCO
2.4
—
—
V
IOL  -6 mA, VDD = 3.3V,
See Note 1
Output High Voltage
I/O Pins:
8x Source Driver Pins – OSCO
2.4
—
—
V
IOL  -10 mA, VDD = 3.3V,
See Note 1
1.5
—
—
2.0
—
—
3.0
—
—
IOH  -3 mA, VDD = 3.3V,
See Note 1
1.5
—
—
IOH  -16 mA, VDD = 3.3V,
See Note 1
2.0
—
—
3.0
—
—
Output High Voltage
I/O Pins:
4x Source Driver Pins – All
Pins excluding OSCO
DO20A VOH1
Note 1:
Output High Voltage
I/O Pins:
8x Source Driver Pins – OSCO
Conditions
IOH  -12 mA, VDD = 3.3V,
See Note 1
V
V
IOH  -11 mA, VDD = 3.3V,
See Note 1
IOH  -12 mA, VDD = 3.3V,
See Note 1
IOH  -4 mA, VDD = 3.3V,
See Note 1
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
DS70000652F-page 292
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-12: DC CHARACTERISTICS: PROGRAM MEMORY
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic(3)
Min
Typ(1)
Max
Units
10,000
—
—
E/W
Conditions
Program Flash Memory
D130a
EP
Cell Endurance
D131
VPR
VDD for Read
VMIN
—
3.6
V
VMIN = Minimum operating
voltage
D132b
VPEW
VDD for Self-Timed Write
VMIN
—
3.6
V
VMIN = Minimum operating
voltage
D134
TRETD
Characteristic Retention
20
—
—
Year
D135
IDDP
Supply Current during
Programming
—
10
—
mA
D137a
TPE
Page Erase Time
20.1
—
26.5
ms
TPE = 168517 FRC cycles,
TA = +85°C, See Note 2
D137b
TPE
Page Erase Time
19.5
—
27.3
ms
TPE = 168517 FRC cycles,
TA = +125°C, See Note 2
D138a
TWW
Word Write Cycle Time
47.4
—
49.3
µs
TWW = 355 FRC cycles,
TA = +85°C, See Note 2
D138b
TWW
Word Write Cycle Time
47.4
—
49.3
µs
TWW = 355 FRC cycles,
TA = +125°C, See Note 2
Note 1:
2:
3:
-40C to +125C
Provided no other specifications
are violated
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
Other conditions: FRC = 7.37 MHz, TUN<5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max).
This parameter depends on the FRC accuracy (see Table 26-18) and the value of the FRC Oscillator
Tuning register (see Register 8-3). For complete details on calculating the Minimum and Maximum time,
see Section 5.3 “Programming Operations”.
These parameters are ensured by design, but are not characterized or tested in manufacturing.
TABLE 26-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
No.
—
Note 1:
Symbol
CEFC
Characteristics
External Filter Capacitor
Value(1)
Min
Typ
Max
Units
4.7
10
—
µF
Comments
Capacitor must be low
series resistance
(< 5 ohms)
Typical VCAP voltage = 2.5V when VDD  VDDMIN.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 293
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
26.2
AC Characteristics and Timing
Parameters
This section defines dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104 family AC
characteristics and timing parameters.
TABLE 26-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Operating voltage VDD range as described in Section 26.1 “DC
Characteristics”.
AC CHARACTERISTICS
FIGURE 26-1:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 – for all pins except OSC2
Load Condition 2 – for OSC2
VDD/2
CL
Pin
RL
VSS
CL
Pin
RL = 464
CL = 50 pF for all pins except OSC2
15 pF for OSC2 output
VSS
TABLE 26-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
Param
Symbol
No.
Characteristic
Min
Typ
Max
Units
Conditions
15
pF
In MS and HS modes when external
clock is used to drive OSC1
COSC2
OSC2/SOSC2 Pin
—
—
DO56
CIO
All I/O Pins and OSC2
—
—
50
pF
EC mode
DO58
CB
SCLx, SDAx
—
—
400
pF
In I2C™ mode
DO50
DS70000652F-page 294
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-2:
EXTERNAL CLOCK TIMING
Q1
Q2
Q3
Q4
Q1
Q2
OS30
OS30
Q3
Q4
OSC1
OS20
OS31
OS31
OS25
CLKO
OS41
OS40
TABLE 26-16: EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
OS10
Symb
FIN
OS20
TOSC
Min
Typ(1)
Max
Units
External CLKI Frequency
(External clocks allowed only
in EC and ECPLL modes)
DC
—
32
MHz
EC
Oscillator Crystal Frequency
3.0
10
31
—
—
—
10
32
33
MHz
MHz
kHz
MS
HS
SOSC
31.25
—
DC
ns
Characteristic
TOSC = 1/FOSC
Time(2,4)
Conditions
OS25
TCY
Instruction Cycle
62.5
—
DC
ns
OS30
TosL,
TosH
External Clock in (OSC1)(5)
High or Low Time
0.45 x TOSC
—
—
ns
EC
OS31
TosR,
TosF
External Clock in (OSC1)(5)
Rise or Fall Time
—
—
20
ns
EC
OS40
TckR
CLKO Rise Time(3,5)
—
6
10
ns
OS41
TckF
CLKO Fall Time(3,5)
—
6
10
ns
OS42
GM
External Oscillator
Transconductance(4)
14
16
18
mA/V
Note 1:
2:
3:
4:
5:
VDD = 3.3V,
TA = +25°C
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
Instruction cycle period (TCY) equals two times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type, under standard operating conditions,
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“max.” cycle time limit is “DC” (no clock) for all devices.
Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.
These parameters are characterized by similarity, but are tested in manufacturing at FIN = 32 MHz only.
These parameters are characterized by similarity, but are not tested in manufacturing.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 295
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-17: PLL CLOCK TIMING SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
Units
Conditions
OS50
FPLLI
PLL Voltage Controlled Oscillator
(VCO) Input Frequency Range(2)
3.0
—
8
MHz ECPLL and MSPLL modes
OS51
FSYS
On-Chip VCO System
Frequency(3)
12
—
32
MHz
OS52
TLOCK
PLL Start-up Time (Lock Time)(3)
—
—
2
mS
-2
1
+2
%
OS53
DCLK
Note 1:
2:
3:
CLKO Stability (Jitter)
(3)
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
These parameters are characterized by similarity, but are tested in manufacturing at 7.7 MHz input only.
These parameters are characterized by similarity, but are not tested in manufacturing. This specification is
based on clock cycle by clock cycle measurements. The effective jitter for individual time bases, or communication clocks used by the user application, are derived from dividing the CLKO stability specification by the
square root of “N” (where “N” is equal to FOSC, divided by the peripheral data rate clock). For example, if
FOSC = 32 MHz and the SPI bit rate is 5 MHz, the effective jitter of the SPI clock is equal to:
2%
D CLK
-------------- = ---------- = 0.79%
2.53
32
-----5
TABLE 26-18: AC CHARACTERISTICS: INTERNAL FAST RC (FRC) ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
-40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Min
Typ
Max
Units
+2
%
Conditions
Internal FRC Accuracy @ 7.37 MHz(1)
-40°C  TA -10°C
F20a
FRC
-2
±0.25
F20b
FRC
-1
±0.25
+1
%
-10°C  TA +85°C
VDD 3.0-3.6V
F20c
FRC
-5
±0.25
+5
%
+85°C  TA +125°C
VDD 3.0-3.6V
Note 1:
VDD 3.0-3.6V
Frequency is calibrated at +25°C and 3.3V. TUNx bits may be used to compensate for temperature drift.
TABLE 26-19: INTERNAL LOW-POWER RC (LPRC) ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Min
Typ
Max
Units
Conditions
±10
+20
%
-40°C  TA -10°C
LPRC @ 32.768 kHz(1,2)
F21a
LPRC
-30
F21b
LPRC
-20
±10
+30
%
-10°C  TA +85°C
VDD 3.0-3.6V
F21c
LPRC
-35
±10
+35
%
+85°C  TA +125°C
VDD 3.0-3.6V
Note 1:
2:
Change of LPRC frequency as VDD changes.
LPRC accuracy impacts the Watchdog Timer Time-out Period (TWDT1). See Section 23.4 “Watchdog
Timer (WDT)” for more information.
DS70000652F-page 296
VDD 3.0-3.6V
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-3:
CLKO AND I/O TIMING CHARACTERISTICS
I/O Pin
(Input)
DI35
DI40
I/O Pin
(Output)
New Value
Old Value
DO31
DO32
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-20: I/O TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(2)
Min
Typ(1)
Max
Units
—
10
25
ns
DO31
TIOR
DO32
TIOF
Port Output Fall Time
—
10
25
ns
DI35
TINP
INTx Pin High or Low Time (input)
25
—
—
ns
TRBP
CNx High or Low Time (input)
2
—
—
TCY
DI40
Note 1:
2:
Port Output Rise Time
Conditions
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
These parameters are characterized, but are not tested in manufacturing.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 297
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-4:
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
SY12
VDD
MCLR
SY10
Internal
POR
SY11
PWRT
Time-out
SY30
OSC
Time-out
Internal
Reset
Watchdog
Timer Reset
SY20
SY13
SY13
I/O Pins
SY35
FSCM
Delay
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Param
Symb
No.
Min
Typ(2)
Max
Units
2
—
—
s
Characteristic(1)
Conditions
SY10
TMCL
SY11
TPWRT Power-up Timer Period
—
64
—
ms
SY12
TPOR
Power-on Reset Delay
3
10
30
s
SY13
TIOZ
I/O High-Impedance from MCLR
Low or Watchdog Timer Reset
—
—
1.2
s
SY20
TWDT1 Watchdog Timer Time-out
Period
—
—
—
ms
See Section 23.4 “Watchdog
Timer (WDT)” and LPRC
Parameter F21a (Table 26-19).
SY30
TOST
—
1024 * TOSC
—
—
TOSC = OSC1 period
SY35
TFSCM Fail-Safe Clock Monitor Delay
—
500
900
s
Note 1:
2:
MCLR Pulse Width (low)
Oscillator Start-up Time
These parameters are characterized but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
DS70000652F-page 298
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-5:
TIMER1/2/3 EXTERNAL CLOCK TIMING CHARACTERISTICS
TxCK
Tx11
Tx10
Tx15
OS60
Tx20
TMRx
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
TA10
Symbol
TTXH
Characteristic(2)
T1CK High
Time
Min
Typ
Max
Units
Synchronous
mode
Greater of:
20 or
(TCY + 20)/N
—
—
ns
Asynchronous
35
—
—
ns
Synchronous
mode
Greater of:
20 ns or
(TCY + 20)/N
—
—
ns
TA11
TTXL
T1CK Low
Time
TA15
TTXP
T1CK Input
Period
OS60
Ft1
SOSC1/T1CK Oscillator
Input Frequency Range
(oscillator enabled by setting
the TCS (T1CON<1>) bit)
TA20
0.75 TCY + 40
TCKEXTMRL Delay from External T1CK
Clock Edge to Timer Increment
Note 1:
2:
Asynchronous
10
—
—
ns
Synchronous
mode
Greater of:
40 or
(2 TCY + 40)/N
—
—
ns
DC
—
50
kHz
—
1.75 TCY + 40
ns
Conditions
Must also meet
Parameter TA15,
N = prescale value
(1, 8, 64, 256)
Must also meet
Parameter TA15,
N = prescale value
(1, 8, 64, 256)
N = prescale value
(1, 8, 64, 256)
Timer1 is a Type A.
These parameters are characterized by similarity, but are not tested in manufacturing.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 299
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-23: TIMER2/4 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
Symbol
No.
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Characteristic(1)
Min
Typ
Max
Units
Conditions
TB10
TtxH
TxCK High Synchronous
Time
mode
Greater of:
20 or
(TCY + 20)/N
—
—
ns
Must also meet
Parameter TB15,
N = prescale value
(1, 8, 64, 256)
TB11
TtxL
TxCK Low
Time
Synchronous
mode
Greater of:
20 or
(TCY + 20)/N
—
—
ns
Must also meet
Parameter TB15,
N = prescale value
(1, 8, 64, 256)
TB15
TtxP
TxCK Input Synchronous
Period
mode
Greater of:
40 or
(2 TCY + 40)/N
—
—
ns
N = prescale value
(1, 8, 64, 256)
TB20
TCKEXTMRL Delay from External TxCK 0.75 TCY + 40
Clock Edge to Timer
Increment
—
1.75 TCY + 40
ns
Note 1:
These parameters are characterized, but are not tested in manufacturing.
TABLE 26-24: TIMER3/5 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
No.
Symbol
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Characteristic(1)
Min
Typ
Max
Units
Conditions
TC10
TtxH
TxCK High Synchronous
Time
TCY + 20
—
—
ns
Must also meet
Parameter TC15
TC11
TtxL
TxCK Low Synchronous
Time
TCY + 20
—
—
ns
Must also meet
Parameter TC15
TC15
TtxP
TxCK Input Synchronous,
Period
with Prescaler
2 TCY + 40
—
—
ns
N = prescale value
(1, 8, 64, 256)
TC20
TCKEXTMRL Delay from External TxCK
Clock Edge to Timer
Increment
0.75 TCY + 40
—
1.75 TCY + 40
ns
Note 1:
These parameters are characterized, but are not tested in manufacturing.
DS70000652F-page 300
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-6:
INPUT CAPTURE x (ICx) TIMING CHARACTERISTICS
ICx
IC10
IC11
IC15
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-25: INPUT CAPTURE x (ICx) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
IC10
TccL
Characteristic(1)
ICx Input Low Time
No Prescaler
With Prescaler
IC11
TccH
ICx Input High Time No Prescaler
With Prescaler
IC15
Note 1:
TccP
ICx Input Period
Min
Max
Units
0.5 TCY + 20
—
ns
10
—
ns
0.5 TCY + 20
—
ns
10
—
ns
(TCY + 40)/N
—
ns
Conditions
N = prescale value
(1, 4, 16)
These parameters are characterized by similarity, but are not tested in manufacturing.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 301
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-7:
OUTPUT COMPARE x (OCx) TIMING CHARACTERISTICS
OCx
(Output Compare
or PWM Mode)
OC11
OC10
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-26: OUTPUT COMPARE x (OCx) MODULE TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Min
Typ
Max
Units
Conditions
OC10
TccF
OCx Output Fall Time
—
—
—
ns
See Parameter DO32
OC11
TccR
OCx Output Rise Time
—
—
—
ns
See Parameter DO31
Note 1:
These parameters are characterized by similarity, but are not tested in manufacturing.
FIGURE 26-8:
OCx/PWMx MODULE TIMING CHARACTERISTICS
OC20
OCFA
OC15
OCx
Active
Tri-State
TABLE 26-27: SIMPLE OCx/PWMx MODE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
No.
Symbol
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Characteristic(1)
Min
Typ
Max
Units
OC15
TFD
Fault Input to PWMx I/O
Change
—
—
TCY + 20 ns
ns
OC20
TFLT
Fault Input Pulse Width
TCY + 20 ns
—
—
ns
Note 1:
These parameters are characterized by similarity, but are not tested in manufacturing.
DS70000652F-page 302
Conditions
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-9:
MOTOR CONTROL PWMx MODULE FAULT TIMING CHARACTERISTICS
MP30
FLTA1
MP20
PWMx
Note 1:
See Note 1
For the logic state after a Fault, refer to the FAOVxH:FAOVxL bits in the PxFLTACON register.
FIGURE 26-10:
MOTOR CONTROL PWMx MODULE TIMING CHARACTERISTICS
MP11
MP10
PWMx
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-28: MOTOR CONTROL PWMx MODULE TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
MP10
TFPWM
PWM Output Fall Time
—
—
—
ns
See Parameter DO32
MP11
TRPWM
PWM Output Rise Time
—
—
—
ns
See Parameter DO31
MP20
TFD
Fault Input  to PWM
I/O Change
—
—
50
ns
MP30
TFH
Minimum Pulse Width
50
—
—
ns
Note 1:
These parameters are characterized by similarity, but are not tested in manufacturing.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 303
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-29: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY FOR dsPIC33FJ16(GP/MC)10X
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Maximum
Data Rate
Master
Transmit Only
(Half-Duplex)
Master
Transmit/Receive
(Full-Duplex)
Slave
Transmit/Receive
(Full-Duplex)
CKE
CKP
SMP
15 MHz
Table 26-30
—
—
0,1
0,1
0,1
10 MHz
—
Table 26-31
—
1
0,1
1
10 MHz
—
Table 26-32
—
0
0,1
1
15 MHz
—
—
Table 26-33
1
0
0
11 MHz
—
—
Table 26-34
1
1
0
15 MHz
—
—
Table 26-35
0
1
0
11 MHz
—
—
Table 26-36
0
0
0
FIGURE 26-11:
SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY, CKE = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ16(GP/MC)10X
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
MSb
SDOx
SP30, SP31
Bit 14 - - - - - -1
LSb
SP30, SP31
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 304
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-12:
SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY, CKE = 1) TIMING
CHARACTERISTICS FOR dsPIC33FJ16(GP/MC)10X
SP36
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
Bit 14 - - - - - -1
MSb
SDOx
LSb
SP30, SP31
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-30: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS
FOR dsPIC33FJ16(GP/MC)10X
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP10
TscP
Maximum SCKx Frequency
—
—
15
MHz
SP20
TscF
SCKx Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV,
TscL2doV
SDOx Data Output Valid after
SCKx Edge
—
6
20
ns
SP36
TdiV2scH,
TdiV2scL
SDOx Data Output Setup to
First SCKx Edge
30
—
—
ns
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 305
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-13:
SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING
CHARACTERISTICS FOR dsPIC33FJ16(GP/MC)10X
SP36
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
Bit 14 - - - - - -1
MSb
SDOx
SP30, SP31
SP40
SDIx
LSb
MSb In
LSb In
Bit 14 - - - -1
SP41
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-31: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING
REQUIREMENTS FOR dsPIC33FJ16(GP/MC)10X
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
See Note 3
See Parameter DO32
and Note 4
See Parameter DO31
and Note 4
See Parameter DO32
and Note 4
See Parameter DO31
and Note 4
SP10
SP20
TscP
TscF
Maximum SCKx Frequency
SCKx Output Fall Time
—
—
—
—
10
—
MHz
ns
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
SP35
TscH2doV, SDOx Data Output Valid after
—
6
20
ns
TscL2doV SCKx Edge
TdoV2sc, SDOx Data Output Setup to
30
—
—
ns
TdoV2scL First SCKx Edge
TdiV2scH, Setup Time of SDIx Data
30
—
—
ns
TdiV2scL Input to SCKx Edge
TscH2diL, Hold Time of SDIx Data Input
30
—
—
ns
TscL2diL
to SCKx Edge
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
SP36
SP40
SP41
Note 1:
2:
3:
4:
DS70000652F-page 306
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-14:
SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING
CHARACTERISTICS FOR dsPIC33FJ16(GP/MC)10X
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
MSb
SDOx
Bit 14 - - - - - -1
SP30, SP31
SDIx
MSb In
LSb
SP30, SP31
LSb In
Bit 14 - - - -1
SP40 SP41
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-32: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING
REQUIREMENTS FOR dsPIC33FJ16(GP/MC)10X
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
-40°C to +125°C,
see Note 3
See Parameter DO32
and Note 4
See Parameter DO31
and Note 4
See Parameter DO32
and Note 4
See Parameter DO31
and Note 4
SP10
TscP
Maximum SCKx Frequency
—
—
10
MHz
SP20
TscF
SCKx Output Fall Time
—
—
—
ns
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
SP35
TscH2doV, SDOx Data Output Valid after
—
6
20
ns
TscL2doV SCKx Edge
TdoV2scH, SDOx Data Output Setup to
30
—
—
ns
TdoV2scL First SCKx Edge
TdiV2scH, Setup Time of SDIx Data
30
—
—
ns
TdiV2scL Input to SCKx Edge
TscH2diL, Hold Time of SDIx Data Input
30
—
—
ns
TscL2diL
to SCKx Edge
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
SP36
SP40
SP41
Note 1:
2:
3:
4:
 2011-2014 Microchip Technology Inc.
DS70000652F-page 307
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-15:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ16(GP/MC)10X
SP60
SSx
SP52
SP50
SCKx
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKx
(CKP = 1)
SP35
MSb
SDOx
Bit 14 - - - - - -1
LSb
SP30,SP31
SDIx
MSb In
Bit 14 - - - -1
SP51
LSb In
SP41
SP40
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 308
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-33: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
REQUIREMENTS FOR dsPIC33FJ16(GP/MC)10X
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscP
Maximum SCKx Input Frequency
—
—
15
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
10
—
50
ns
See Note 4
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
SP60
TssL2doV SDOx Data Output Valid after
SSx Edge
—
—
50
ns
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the SCKx clock generated by the master must
not violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 309
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-16:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ16(GP/MC)10X
SP60
SSx
SP52
SP50
SCKx
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKx
(CKP = 1)
SP35
SP52
SDOx
MSb
Bit 14 - - - - - -1
LSb
SP30,SP31
SDIx
MSb In
Bit 14 - - - -1
SP51
LSb In
SP41
SP40
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 310
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-34: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING
REQUIREMENTS FOR dsPIC33FJ16(GP/MC)10X
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscP
Maximum SCKx Input Frequency
—
—
11
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
10
—
50
ns
See Note 4
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
SP60
TssL2doV SDOx Data Output Valid after
SSx Edge
—
—
50
ns
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 91 ns. Therefore, the SCKx clock generated by the Master must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 311
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-17:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ16(GP/MC)10X
SSX
SP52
SP50
SCKX
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
MSb
SDOX
Bit 14 - - - - - -1
LSb
SP51
SP30,SP31
SDIX
MSb In
Bit 14 - - - -1
LSb In
SP41
SP40
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 312
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-35: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING
REQUIREMENTS FOR dsPIC33FJ16(GP/MC)10X
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscP
Maximum SCKx Input Frequency
—
—
15
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
10
—
50
ns
See Note 4
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the SCKx clock generated by the Master must
not violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 313
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-18:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ16(GP/MC)10X
SSX
SP52
SP50
SCKX
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
MSb
SDOX
Bit 14 - - - - - -1
LSb
SP51
SP30,SP31
SDIX
MSb In
Bit 14 - - - -1
LSb In
SP41
SP40
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 314
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-36: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
REQUIREMENTS FOR dsPIC33FJ16(GP/MC)10X
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscP
Maximum SCKx Input Frequency
—
—
11
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
10
—
50
ns
See Note 4
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 91 ns. Therefore, the SCKx clock generated by the Master must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 315
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-37: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY FOR dsPIC33FJ32(GP/MC)10X
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Maximum
Data Rate
Master
Transmit Only
(Half-Duplex)
Master
Transmit/Receive
(Full-Duplex)
Slave
Transmit/Receive
(Full-Duplex)
CKE
CKP
SMP
15 MHz
Table 26-30
—
—
0,1
0,1
0,1
9 MHz
—
Table 26-31
—
1
0,1
1
9 MHz
—
Table 26-32
—
0
0,1
1
15 MHz
—
—
Table 26-33
1
0
0
11 Mhz
—
—
Table 26-34
1
1
0
15 MHz
—
—
Table 26-35
0
1
0
11 MHz
—
—
Table 26-36
0
0
0
FIGURE 26-19:
SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY, CKE = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ32(GP/MC)10X
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
MSb
SDOx
SP30, SP31
Bit 14 - - - - - -1
LSb
SP30, SP31
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 316
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-20:
SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY, CKE = 1) TIMING
CHARACTERISTICS FOR dsPIC33FJ32(GP/MC)10X
SP36
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
Bit 14 - - - - - -1
MSb
SDOx
LSb
SP30, SP31
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-38: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS
FOR dsPIC33FJ32(GP/MC)10X
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP10
TscP
Maximum SCKx Frequency
—
—
15
MHz
SP20
TscF
SCKx Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV,
TscL2doV
SDOx Data Output Valid after
SCKx Edge
—
6
20
ns
SP36
TdiV2scH,
TdiV2scL
SDOx Data Output Setup to
First SCKx Edge
30
—
—
ns
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 317
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-21:
SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING
CHARACTERISTICS FOR dsPIC33FJ32(GP/MC)10X
SP36
SCKx
(CKP = 0)
SP10
SP21
SP20
SP35
SP20
SP21
SCKx
(CKP = 1)
Bit 14 - - - - - -1
MSb
SDOx
SP30, SP31
SP40
SDIx
LSb
MSb In
LSb In
Bit 14 - - - -1
SP41
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-39: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING
REQUIREMENTS FOR dsPIC33FJ32(GP/MC)10X
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP10
TscP
Maximum SCKx Frequency
—
—
9
MHz
SP20
TscF
SCKx Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2sc,
TdoV2scL
SDOx Data Output Setup to
First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data
Input to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
DS70000652F-page 318
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-22:
SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING
CHARACTERISTICS FOR dsPIC33FJ32(GP/MC)10X
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
MSb
SDOx
Bit 14 - - - - - -1
SP30, SP31
SDIx
MSb In
LSb
SP30, SP31
LSb In
Bit 14 - - - -1
SP40 SP41
Note: Refer to Figure 26-1 for load conditions.
TABLE 26-40: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING
REQUIREMENTS FOR dsPIC33FJ32(GP/MC)10X
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
-40°C to +125°C,
see Note 3
SP10
TscP
Maximum SCKx Frequency
—
—
9
MHz
SP20
TscF
SCKx Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data
Input to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
Note 1:
2:
3:
4:
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 319
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-23:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ32(GP/MC)10X
SP60
SSx
SP52
SP50
SCKx
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKx
(CKP = 1)
SP35
SDOx
MSb
Bit 14 - - - - - -1
LSb
SP30,SP31
SDIx
MSb In
Bit 14 - - - -1
SP51
LSb In
SP41
SP40
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 320
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-41: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
REQUIREMENTS FOR dsPIC33FJ32(GP/MC)10X
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscP
Maximum SCKx Input Frequency
—
—
15
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
10
—
50
ns
See Note 4
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
SP60
TssL2doV SDOx Data Output Valid after
SSx Edge
—
—
50
ns
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the SCKx clock generated by the Master must
not violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 321
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-24:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ32(GP/MC)10X
SP60
SSx
SP52
SP50
SCKx
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKx
(CKP = 1)
SP35
SP52
SDOx
MSb
Bit 14 - - - - - -1
LSb
SP30,SP31
SDIx
MSb In
Bit 14 - - - -1
SP51
LSb In
SP41
SP40
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 322
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-42: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING
REQUIREMENTS FOR dsPIC33FJ32(GP/MC)10X
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscP
Maximum SCKx Input Frequency
—
—
11
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
10
—
50
ns
See Note 4
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
SP60
TssL2doV SDOx Data Output Valid after
SSx Edge
—
—
50
ns
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 91 ns. Therefore, the SCKx clock generated by the master must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 323
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-25:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ32(GP/MC)10X
SSX
SP52
SP50
SCKX
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
SDOX
MSb
Bit 14 - - - - - -1
LSb
SP51
SP30,SP31
SDIX
MSb In
Bit 14 - - - -1
LSb In
SP41
SP40
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 324
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-43: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING
REQUIREMENTS FOR dsPIC33FJ32(GP/MC)10X
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscP
Maximum SCKx Input Frequency
—
—
15
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—w
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
10
—
50
ns
See Note 4
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the SCKx clock generated by the Master must
not violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 325
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-26:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS FOR dsPIC33FJ32(GP/MC)10X
SSX
SP52
SP50
SCKX
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
MSb
SDOX
Bit 14 - - - - - -1
LSb
SP51
SP30,SP31
SDIX
MSb In
Bit 14 - - - -1
LSb In
SP41
SP40
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 326
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-44: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
REQUIREMENTS FOR dsPIC33FJ32(GP/MC)10X
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscP
Maximum SCKx Input Frequency
—
—
11
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See Parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See Parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
10
—
50
ns
See Note 4
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
Note 1:
2:
3:
4:
See Note 3
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 91 ns. Therefore, the SCKx clock generated by the Master must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 327
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-27:
I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
SCLx
IM34
IM31
IM30
IM33
SDAx
Stop
Condition
Start
Condition
Note: Refer to Figure 26-1 for load conditions.
FIGURE 26-28:
I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM20
IM21
IM11
IM10
SCLx
IM11
IM26
IM10
IM25
IM33
SDAx
In
IM40
IM40
IM45
SDAx
Out
Note: Refer to Figure 26-1 for load conditions.
DS70000652F-page 328
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-45: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
IM10
IM11
IM20
IM21
IM25
IM26
IM30
IM31
IM33
IM34
IM40
IM45
IM50
IM51
Note
Characteristic
Min(1)
Max
Units
Conditions
Clock Low Time 100 kHz mode
TCY/2 (BRG + 1)
—
s
400 kHz mode
TCY/2 (BRG + 1)
—
s
(2)
TCY/2 (BRG + 1)
—
s
1 MHz mode
THI:SCL Clock High Time 100 kHz mode
TCY/2 (BRG + 1)
—
s
400 kHz mode
TCY/2 (BRG + 1)
—
s
TCY/2 (BRG + 1)
—
s
1 MHz mode(2)
TF:SCL
SDAx and SCLx 100 kHz mode
—
300
ns
CB is specified to be
Fall Time
from 10 to 400 pF
400 kHz mode
20 + 0.1 CB
300
ns
(2)
—
100
ns
1 MHz mode
TR:SCL
SDAx and SCLx 100 kHz mode
—
1000
ns
CB is specified to be
Rise Time
from 10 to 400 pF
400 kHz mode
20 + 0.1 CB
300
ns
(2)
1 MHz mode
—
300
ns
TSU:DAT Data Input
100 kHz mode
250
—
ns
Setup Time
400 kHz mode
100
—
ns
(2)
1 MHz mode
40
—
ns
THD:DAT Data Input
100 kHz mode
0
—
s
Hold Time
400 kHz mode
0
0.9
s
1 MHz mode(2)
0.2
—
s
TSU:STA Start Condition 100 kHz mode
TCY/2 (BRG + 1)
—
s
Only relevant for
Setup Time
Repeated Start
400 kHz mode
TCY/2 (BRG + 1)
—
s
condition
(2)
1 MHz mode
TCY/2 (BRG + 1)
—
s
THD:STA Start Condition 100 kHz mode
TCY/2 (BRG + 1)
—
s
After this period the first
Hold Time
clock pulse is generated
400 kHz mode
TCY/2 (BRG + 1)
—
s
(2)
1 MHz mode
TCY/2 (BRG + 1)
—
s
TSU:STO Stop Condition 100 kHz mode
TCY/2 (BRG + 1)
—
s
Setup Time
400 kHz mode
TCY/2 (BRG + 1)
—
s
(2)
1 MHz mode
TCY/2 (BRG + 1)
—
s
THD:STO Stop Condition 100 kHz mode
TCY/2 (BRG + 1)
—
ns
Hold Time
400 kHz mode
TCY/2 (BRG + 1)
—
ns
1 MHz mode(2)
TCY/2 (BRG + 1)
—
ns
100 kHz mode
—
3500
ns
TAA:SCL Output Valid
from Clock
400 kHz mode
—
1000
ns
1 MHz mode(2)
—
400
ns
4.7
—
s
Time the bus must be
TBF:SDA Bus Free Time 100 kHz mode
free
before a new
400 kHz mode
1.3
—
s
transmission
can start
(2)
1 MHz mode
0.5
—
s
Bus Capacitive Loading
—
400
pF
CB
TPGD
Pulse Gobbler Delay
65
390
ns
See Note 3
2
1: BRG is the value of the I C™ Baud Rate Generator. Refer to “Inter-Integrated Circuit (I2C™)” (DS70195) in
the “dsPIC33/PIC24 Family Reference Manual”. Please see the Microchip web site for the latest “dsPIC33/
PIC24 Family Reference Manual” sections.
2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
3: Typical value for this parameter is 130 ns.
TLO:SCL
 2011-2014 Microchip Technology Inc.
DS70000652F-page 329
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-29:
I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
SCLx
IS34
IS31
IS30
IS33
SDAx
Stop
Condition
Start
Condition
FIGURE 26-30:
I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS20
IS21
IS11
IS10
SCLx
IS30
IS26
IS31
IS25
IS33
SDAx
In
IS40
IS40
IS45
SDAx
Out
DS70000652F-page 330
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-46: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param. Symbol
IS10
IS11
IS20
IS21
IS25
Characteristic
TLO:SCL Clock Low Time
THI:SCL
TF:SCL
TR:SCL
Min
Max
Units
100 kHz mode
4.7
—
s
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
1.3
—
s
Device must operate at a
minimum of 10 MHz
1 MHz mode(1)
0.5
—
s
Clock High Time 100 kHz mode
4.0
—
s
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
0.6
—
s
Device must operate at a
minimum of 10 MHz
1 MHz mode(1)
0.5
—
s
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
SDAx and SCLx
Fall Time
SDAx and SCLx
Rise Time
TSU:DAT Data Input
Setup Time
1 MHz mode(1)
—
100
ns
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(1)
—
300
ns
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
mode(1)
1 MHz
IS26
THD:DAT Data Input
Hold Time
100
—
ns
100 kHz mode
0
—
s
400 kHz mode
0
0.9
s
0
0.3
s
4.7
—
s
1 MHz
IS30
IS31
IS33
TSU:STA
Start Condition
Setup Time
THD:STA Start Condition
Hold Time
TSU:STO Stop Condition
Setup Time
IS40
IS45
IS50
Note 1:
THD:STO Stop Condition
Hold Time
TAA:SCL
Output Valid
from Clock
TBF:SDA Bus Free Time
CB
mode(1)
100 kHz mode
400 kHz mode
0.6
—
s
1 MHz mode(1)
0.25
—
s
100 kHz mode
4.0
—
s
400 kHz mode
0.6
—
s
1 MHz mode(1)
0.25
—
s
100 kHz mode
4.7
—
s
400 kHz mode
0.6
—
s
0.6
—
s
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
1 MHz mode(1)
250
100 kHz mode
0
3500
ns
400 kHz mode
0
1000
ns
1 MHz mode(1)
0
350
ns
1 MHz
IS34
Conditions
mode(1)
CB is specified to be from
10 to 400 pF
Only relevant for Repeated
Start condition
After this period, the first
clock pulse is generated
ns
100 kHz mode
4.7
—
s
400 kHz mode
1.3
—
s
1 MHz mode(1)
0.5
—
s
—
400
pF
Bus Capacitive Loading
CB is specified to be from
10 to 400 pF
Time the bus must be free
before a new transmission
can start
Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
 2011-2014 Microchip Technology Inc.
DS70000652F-page 331
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-47: ADC MODULE SPECIFICATIONS
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V(6)
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Min.
Typ
Max.
Units
Conditions
Device Supply
AD01
AVDD
Module VDD Supply(2,4)
Greater of:
VDD – 0.3
or 2.9
—
Lesser of:
VDD + 0.3
or 3.6
V
AD02
AVSS
Module VSS Supply(2,5)
VSS – 0.3
—
VSS + 0.3
V
AD09
IAD
Operating Current
—
7.0
9.0
mA
See Note 1
Analog Input
AD12
VINH
Input Voltage Range
VINH(2)
VINL
—
AVDD
V
This voltage reflects S&H
Channels 0, 1, 2 and 3
(CH0-CH3), positive input
AD13
VINL
Input Voltage Range
VINL(2)
AVSS
—
AVSS + 1V
V
This voltage reflects S&H
Channels 0, 1, 2 and 3
(CH0-CH3), negative input
AD17
RIN
Recommended
Impedance of Analog
Voltage Source(3)
—
—
200

Note 1:
2:
3:
4:
5:
6:
These parameters are not characterized or tested in manufacturing.
These parameters are characterized, but are not tested in manufacturing.
These parameters are assured by design, but are not characterized or tested in manufacturing.
This pin may not be available on all devices; in which case, this pin will be connected to VDD internally.
See the “Pin Diagrams” section for availability.
This pin may not be available on all devices; in which case, this pin will be connected to VSS internally. See
the “Pin Diagrams” section for availability.
Overall functional device operation at VBOR < VDD < VDDMIN is ensured but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN.
DS70000652F-page 332
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-48: 10-BIT ADC MODULE SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V(4)
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
10-Bit ADC Accuracy – Measurements with AVDD/AVSS(3)
AD20b
Nr
Resolution
10 Data Bits
bits
AD21b
INL
Integral Nonlinearity
-1
—
+1
LSb
VINL = AVSS = 0V, AVDD = 3.6V
AD22b
DNL
Differential Nonlinearity
>-1
—
<1
LSb
VINL = AVSS = 0V, AVDD = 3.6V
AD23b
GERR
Gain Error
3
7
15
LSb
VINL = AVSS = 0V, AVDD = 3.6V
AD24b
EOFF
Offset Error
1.5
3
7
LSb
VINL = AVSS = 0V, AVDD = 3.6V
Monotonicity
—
—
—
AD25b
—
Dynamic Performance (10-Bit Mode)
—
AD30b
THD
Total Harmonic Distortion
—
—
-64
dB
AD31b
SINAD
Signal to Noise and
Distortion
57
58.5
—
dB
AD32b
SFDR
Spurious Free Dynamic
Range
72
—
—
dB
AD33b
FNYQ
Input Signal Bandwidth
—
—
550
kHz
AD34b
ENOB
Effective Number of Bits
9.16
9.4
—
bits
Note 1:
2:
3:
4:
Guaranteed(1)
(2)
The Analog-to-Digital conversion result never decreases with an increase in the input voltage and has no
missing codes.
These parameters are characterized by similarity, but are not tested in manufacturing.
These parameters are characterized, but are tested at 20 ksps only.
Overall functional device operation at VBOR < VDD < VDDMIN is guaranteed but not characterized. All
device analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN
 2011-2014 Microchip Technology Inc.
DS70000652F-page 333
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-31:
ADC CONVERSION TIMING CHARACTERISTICS
(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)
AD50
ADCLK
Instruction
Execution Set SAMP
Clear SAMP
SAMP
AD61
AD60
TSAMP
AD55
AD55
DONE
ADxIF
1
2
3
4
5
6
7
8
5
6
7
8
1 – Software sets ADxCON. SAMP to start sampling.
2 – Sampling starts after discharge period. TSAMP is described in “Analog-to-Digital Converter (ADC)”
(DS70183) in the “dsPIC33/PIC24 Family Reference Manual”.
3 – Software clears ADxCON. SAMP to start conversion.
4 – Sampling ends, conversion sequence starts.
5 – Convert bit 9.
6 – Convert bit 8.
7 – Convert bit 0.
8 – One TAD for end of conversion.
FIGURE 26-32:
ADC CONVERSION TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0,
ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)
AD50
ADCLK
Instruction
Execution Set ADON
SAMP
TSAMP
AD55
AD55
TSAMP
AD55
ADxIF
DONE
1
2
3
4
5
6
7
3
4
5
6
8
1 – Software sets ADxCON. ADON to start AD operation.
5 – Convert bit 0.
2 – Sampling starts after discharge period. TSAMP is described in
“Analog-to-Digital Converter (ADC)” (DS70183)
in the “dsPIC33/PIC24 Family Reference Manual”.
3 – Convert bit 9.
6 – One TAD for end of conversion.
7 – Begin conversion of next channel.
8 – Sample for time specified by SAMC<4:0>.
4 – Convert bit 8.
DS70000652F-page 334
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-49: 10-BIT ADC CONVERSION TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min.
Typ(1)
Max.
Units
Conditions
Clock Parameters(2)
AD50
TAD
ADC Clock Period
AD51
tRC
ADC Internal RC Oscillator Period
76
—
—
ns
—
250
—
ns
Conversion Rates
AD55
tCONV
Conversion Time
—
12 TAD
—
—
AD56
FCNV
Throughput Rate
—
—
1.1
Msps
AD57
TSAMP
Sample Time
2.0 TAD
—
—
—
Timing Parameters
AD60
tPCS
Conversion Start from Sample
Trigger(1)
2.0 TAD
—
3.0 TAD
—
AD61
tPSS
Sample Start from Setting
Sample (SAMP) bit(1)
2.0 TAD
—
3.0 TAD
—
AD62
tCSS
Conversion Completion to
Sample Start (ASAM = 1)(1)
—
0.5 TAD
—
—
AD63
tDPU
Time to Stabilize Analog Stage
from ADC Off to ADC On(1)
—
—
20
s
Note 1:
2:
Auto-Convert Trigger
(SSRC<2:0> = 111) not
selected
These parameters are characterized but not tested in manufacturing.
Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity
performance, especially at elevated temperatures.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 335
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-50: COMPARATOR TIMING SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
300
TRESP
Response Time(1,2)
—
150
400
ns
301
TMC2OV
Comparator Mode Change
to Output Valid(1)
—
—
10
s
302
TON2OV
Comparator Enabled to
Output Valid(1)
—
—
10
µs
Note 1:
2:
Conditions
Parameters are characterized but not tested.
Response time is measured with one comparator input at (VDD – 1.5)/2, while the other input transitions
from VSS to VDD.
TABLE 26-51: COMPARATOR MODULE SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
No.
Symbol
D300
VIOFF
Input Offset Voltage(1)
D301
VICM
Input Common-Mode Voltage(1)
Characteristic
Ratio(1)
D302
CMRR
Common-Mode Rejection
D305
IVREF
Internal Voltage Reference(1)
Note 1:
Min.
Typ
Max.
Units
-20
0
±10
20
mV
—
AVDD – 1.5V
V
-54
—
—
dB
1.116
1.24
1.364
V
Conditions
Parameters are characterized but not tested.
TABLE 26-52: COMPARATOR VOLTAGE REFERENCE SETTLING TIME SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
VR310
Note 1:
Symbol
TSET
Characteristic
Settling Time(1)
Min.
Typ
Max.
Units
—
—
10
s
Conditions
Settling time measured while CVRR = 1 and the CVR<3:0> bits transition from ‘0000’ to ‘1111’.
DS70000652F-page 336
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-53: COMPARATOR VOLTAGE REFERENCE SPECIFICATIONS
Standard Operating Conditions:3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
VRD310 CVRES
Resolution
CVRSRC/24
—
CVRSRC/32
LSb
VRD311 CVRAA
Absolute Accuracy
—
—
0.5
LSb
VRD312 CVRUR
Unit Resistor Value (R)
—
2k
—

Conditions
TABLE 26-54: CTMU CURRENT SOURCE SPECIFICATIONS
Standard Operating Conditions:3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
CTMU Current Source
CTMUI1
IOUT1
Base Range(1)
Range(1)
320
550
980
na
IRNG<1:0> bits (CTMUICON<9:8>) = 0b01
CTMUI2
IOUT2
10x
3.2
5.5
9.8
µA
IRNG<1:0> bits (CTMUICON<9:8>) = 0b10
CTMUI3
IOUT3
100x Range(1)
32
55
98
µA
IRNG<1:0> bits (CTMUICON<9:8>) = 0b11
CTMUFV1 VF
Forward Voltage(2)
—
0.77
—
V
IRNG<1:0> bits (CTMUICON<9:8>) = 0b11
@ +25°C
CTMUFV2 VFVR
Forward Voltage
Rate(2)
—
-1.38
—
Internal Diode
Note 1:
2:
mV/ºC IRNG<1:0> bits (CTMUICON<9:8>) = 0b11
Nominal value at center point of current trim range (ITRIM<5:0> bits (CTMUICON<15:10>) = 0b000000).
ADC module configured for conversion speed of 500 ksps. Parameters are characterized but not tested in
manufacturing.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 337
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 26-33:
FORWARD VOLTAGE VERSUS TEMPERATURE
0.900
0.850
VF @ IOUT = 55 µA
Forward Voltage (V)
0.800
Forward Voltage @ +25°C
VF = 0.77
0.750
Forward Voltage Rate
VFVR = -1.38 mV/°C
0.700
0.650
0.600
0.550
125
120
115
110
105
95
100
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
5
10
0
-5
-10
-15
-20
-25
-30
-35
-40
0.500
Temperature (°C)
Note:
This graph is a statistical summary based on a limited number of samples and this data is characterized but not
tested in manufacturing.
DS70000652F-page 338
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
27.0
HIGH-TEMPERATURE ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104 family
electrical characteristics for devices operating in an ambient temperature range of -40°C to +150°C.
The specifications between -40°C to +150°C are identical to those shown in Section 26.0 “Electrical Characteristics”
for operation between -40°C to +125°C, with the exception of the parameters listed in this section.
Parameters in this section begin with an H, which denotes: High temperature. For example, Parameter DC10 in
Section 26.0 “Electrical Characteristics” is the Industrial and Extended temperature equivalent of HDC10.
Absolute maximum ratings for the dsPIC33FJ16(GP/MC)101/102 and dsPIC33FJ32(GP/MC)101/102/104 hightemperature devices are listed below. Exposure to these maximum rating conditions for extended periods can affect
device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in
the operation listings of this specification, is not implied.
Absolute Maximum Ratings(1)
Ambient temperature under bias(3) .........................................................................................................-40°C to +150°C
Storage temperature .............................................................................................................................. -65°C to +160°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant with respect to VSS(4) .................................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(4) ....................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD  3.0V(4) .................................................... -0.3V to 5.6V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin(2) ...........................................................................................................................250 mA
Maximum junction temperature............................................................................................................................. +155°C
Maximum current sourced/sunk by any 4x I/O pin ....................................................................................................4 mA
Maximum current sourced/sunk by any 8x I/O pin ....................................................................................................8 mA
Maximum current sunk by all ports combined ........................................................................................................80 mA
Maximum current sourced by all ports combined(2) ................................................................................................80 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those, or any other conditions
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods can affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 27-2).
3: AEC-Q100 reliability testing for devices intended to operate at +150°C is 1,000 hours. Any design in which
the total operating time from +125°C to +150°C will be greater than 1,000 hours is not warranted without
prior written approval from Microchip Technology Inc.
4: Refer to the “Pin Diagrams” section for 5V tolerant pins.
 2011-2014 Microchip Technology Inc.
Preliminary
DS70000652F-page 339
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
27.1
High-Temperature DC Characteristics
TABLE 27-1:
OPERATING MIPS VS. VOLTAGE
Max MIPS
Characteristic
VDD Range
(in Volts)
Temperature Range
(in °C)
HDC5
VBOR – 3.6V(1)
-40°C to +150°C
Note 1:
dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104
5
Overall functional device operation at VBORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules, such as the ADC, etc., may have degraded performances below VDDMIN.
TABLE 27-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Operating Junction Temperature Range
TJ
-40
—
+155
°C
Operating Ambient Temperature Range
TA
-40
—
+150
°C
High Temperature Devices
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD –  IOH)
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
I/O Pin Power Dissipation:
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
TABLE 27-3:
DC CHARACTERISTICS: OPERATING CURRENT (IDD))
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
Typical
Max
Units
Conditions
Operating Current (IDD) – dsPIC33FJ16(GP/MC)10X Devices
DC20e
1.3
1.7
mA
3.3V
LPRC (32.768 kHz)
DC22e
7.0
8.5
mA
3.3V
5 MIPS
DS70000652F-page 340
Preliminary
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 27-4:
DC CHARACTERISTICS: OPERATING CURRENT (IDD))
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
Typical
Max
Units
Conditions
Operating Current (IDD) – dsPIC33FJ32(GP/MC)10X Devices
DC20e
1.3
2.0
mA
3.3V
LPRC (32.768 kHz)
DC22e
7.25
8.5
mA
3.3V
5 MIPS
TABLE 27-5:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE))
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
Typical
Max
Units
Conditions
Idle Current (IIDLE) – dsPIC33FJ16(GP/MC)10X Devices
DC40e
0.5
1.0
mA
3.3V
LPRC (32.768 kHz)
DC22e
1.2
1.6
mA
3.3V
5 MIPS
Idle Current (IIDLE) – dsPIC33FJ32(GP/MC)10X Devices
DC40e
0.5
1.0
mA
3.3V
LPRC (32.768 kHz)
DC22e
1.4
1.8
mA
3.3V
5 MIPS
TABLE 27-6:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Power-Down Current (IPD) – dsPIC33FJXX(GP/MC)10X
DC60e
500
1000
A
3.3V
Base Power-Down Current
DC61e
650
1000
A
3.3V
Watchdog Timer Current: IWDT
Note 1:
Data in the Typical column is 3.3V unless otherwise stated.
 2011-2014 Microchip Technology Inc.
Preliminary
DS70000652F-page 341
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 27-7:
DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Doze Ratio
Units
Conditions
Doze Current (IDOZE) – dsPIC33FJ16(GP/MC)10X Devices
DC74a
4.3
7.2
1:2
mA
3.3V
5 MIPS
DC74f
1.6
6.2
1:64
mA
3.3V
5 MIPS
DC74g
1.5
6.2
1:128
mA
3.3V
5 MIPS
Doze Current (IDOZE) – dsPIC33FJ32(GP/MC)10X Devices
DC74a
4.7
7.2
1:2
mA
3.3V
5 MIPS
DC74f
1.9
6.2
1:64
mA
3.3V
5 MIPS
DC74g
1.4
6.2
1:128
mA
3.3V
5 MIPS
Note 1:
Data in the Typical column is 3.3V unless otherwise stated.
TABLE 27-8:
DC CHARACTERISTICS: PROGRAM MEMORY
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Min
Typ
Max
Units
Conditions
10,000
—
—
E/W
-40C to +150C(2)
20
—
—
Year
1000 E/W cycles or less and no
other specifications are violated
Program Flash Memory
HD130
EP
Cell Endurance
HD134
TRETD
Characteristic Retention
Note 1:
2:
These parameters are assured by design, but are not characterized or tested in manufacturing.
Programming of the Flash memory is allowed up to +150°C.
TABLE 27-9:
AC CHARACTERISTICS: INTERNAL FAST RC (FRC) ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Min
Typ
Max
Units
+8
%
Conditions
Internal FRC Accuracy @ 7.37 MHz(1)
F20d
Note 1:
FRC
-8
±0.25
-40°C  TA +150°C
VDD 3.0-3.6V
Frequency is calibrated at +25°C and 3.3V. TUNx bits may be used to compensate for temperature drift.
TABLE 27-10: INTERNAL LOW-POWER RC (LPRC) ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Min
Typ
Max
Units
±10
+40
%
Conditions
LPRC @ 32.768 kHz(1,2)
LPRC
Note 1:
2:
Change of LPRC frequency as VDD changes.
LPRC accuracy impacts the Watchdog Timer Time-out Period (TWDT1). See Section 23.4 “Watchdog
Timer (WDT)” for more information.
DS70000652F-page 342
-40
-40°C  TA +150°C
F21c
Preliminary
VDD 3.0-3.6V
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
28.0
PACKAGING INFORMATION
28.1
Package Marking Information
18-Lead PDIP
Example
dsPIC33FJ16GP
101-E/P e3
1330235
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
18-Lead SOIC
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
dsPIC33FJ16
GP101-E/SO e3
YYWWNNN
1310017
20-Lead PDIP
Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
20-Lead SSOP
dsPIC33FJ16MC
101-E/P e3
1330235
Example
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
dsPIC33FJ16
MC101-I/SS e3
1330235
20-Lead SOIC
Example
XXXXXXXXXXXXXX
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dsPIC33FJ16
MC101-I/SO e3
1310017
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Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 343
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
28.1
Package Marking Information (Continued)
28-Lead SPDIP
Example
dsPIC33FJ16MC
102-E/SP e3
1330235
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
28-Lead QFN
XXXXXXXX
XXXXXXXX
YYWWNNN
36-Lead VTLA
XXXXXXXX
XXXXXXXX
YYWWNNN
DS70000652F-page 344
Example
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102-E/SO e3
1330235
Example
33FJ16MC
102-E/SS e3
1330235
Example
33FJ16MC
102/ML e3
1330235
Example
33FJ16MC
102/TL e3
1330235
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
28.1
Package Marking Information (Continued)
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
44-Lead TQFP
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
44-Lead VTLA
XXXXXXXX
XXXXXXXX
YYWWNNN
 2011-2014 Microchip Technology Inc.
Example
dsPIC33FJ
32MC104
-E/ML e3
1330235
Example
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32MC104
-E/PT e3
1330235
Example
33FJ32MC
104/TL e3
1330235
DS70000652F-page 345
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
28.2
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 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011-2014 Microchip Technology Inc.
DS70000652F-page 347
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70000652F-page 348
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011-2014 Microchip Technology Inc.
DS70000652F-page 349
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 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011-2014 Microchip Technology Inc.
DS70000652F-page 351
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70000652F-page 352
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011-2014 Microchip Technology Inc.
DS70000652F-page 353
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 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011-2014 Microchip Technology Inc.
DS70000652F-page 355
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
2
3
D
E
A2
A
L
c
b1
A1
b
e
eB
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
28
Pitch
e
Top to Seating Plane
A
–
–
.200
Molded Package Thickness
A2
.120
.135
.150
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.335
Molded Package Width
E1
.240
.285
.295
Overall Length
D
1.345
1.365
1.400
Tip to Seating Plane
L
.110
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.040
.050
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-070B
DS70000652F-page 356
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
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DS70000652F-page 357
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70000652F-page 358
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011-2014 Microchip Technology Inc.
DS70000652F-page 359
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70000652F-page 360
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011-2014 Microchip Technology Inc.
DS70000652F-page 361
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 362
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
DS70000652F-page 363
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 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
DS70000652F-page 365
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 366
 2011-2014 Microchip Technology Inc.
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 2011-2014 Microchip Technology Inc.
DS70000652F-page 369
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70000652F-page 370
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
 2011-2014 Microchip Technology Inc.
DS70000652F-page 371
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 372
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
APPENDIX A:
REVISION HISTORY
Revision A (January 2011)
This is the initial released version of the document.
Revision B (February 2011)
All major changes are referenced by their respective
section in Table A-1.
In addition, minor text and formatting changes were
incorporated throughout the document.
TABLE A-1:
MAJOR SECTION UPDATES
Section Name
High-Performance, Ultra Low Cost 16-bit
Digital Signal Controllers
Section 1.0 “Device Overview”
Update Description
Pin diagram updates (see “Pin Diagrams”):
• 20-pin PDIP/SOIC/SSOP (dsPIC33FJ16MC101):
Removed the FLTB1 pin from pin 10
• 28-pin SPDIP/SOIC/SSOP (dsPIC33FJ16MC102):
Relocated the FLTB1 pin from pin 12 to pin 14;
relocated the FLTA1 pin from pin 16 to pin 15
• 28-pin QFN (dsPIC33FJ16MC102):
Relocated the FLTA1 pin from pin 13 to pin 12;
relocated the FLTB1 pin from pin 9 to pin 11
• 36-pin TLA (dsPIC33FJ16MC102):
Relocated the FLTA1 pin from pin 17 to pin 16;
relocated the FLTB1 pin from pin 10 to pin 15
Added Notes 1, 2, and 3 regarding the FLTA1 and FLTB1 pins to the
Pinout I/O Descriptions (see Table 1-1).
Added Section “”.
Section 4.0 “Memory Organization”
Updated All Resets value for PxFLTACON and PxFLTABCON to the
6-Output PWM1 Register Map (see Table 4-9).
Added Note 1 to the PMD Register Map (see Table 4-29).
Section 6.0 “Resets”
Removed Reset timing sequence information from Section 6.2
“System Reset”, as this information is provided in Figure 6-2.
Section 15.0 “Motor Control PWM Module” Added Note 2 and Note 3 regarding the FLTA1 and FLTB1 pins to the
6-channel PWM Module Block Diagram (see Figure 15-1).
Added Section 15.2 “PWM Faults” and Section 15.3 “Writeprotected Registers”.
Added Note 2 and Note 3 regarding the FLTA1 and FLTB1 pins to the
note boxes located below the PxFLTACON and PxFLTBCON
registers (see Register 15-9 and Register 15-10).
Section 17.0 “Inter-Integrated Circuit™
(I2C™)”
Updated the descriptions for the conditional If STREN = 1 and If
STREN = 0 statements for the SCLREL bit in the I2Cx Control
Register (see Register 17-1).
Section 23.0 “Special Features”
Added the RTSP Effect column to the dsPIC33F Configuration Bits
Description (see Table 23-3).
Section 26.0 “Electrical Characteristics”
Added Parameters 300 and D305 (see Table 26-42 and Table 26-43).
Section 27.0 “Packaging Information”
Modified the pending TLA packaging page.
 2011-2014 Microchip Technology Inc.
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dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Revision C (June 2011)
This revision includes the following global update:
• All JTAG references have been removed
All other major changes are referenced by their
respective section in Table A-2.
In addition, minor text and formatting changes were
incorporated throughout the document.
TABLE A-2:
MAJOR SECTION UPDATES
Section Name
Update Description
High-Performance, Ultra Low Cost
16-bit Digital Signal Controllers
The TMS, TDI, TDO, and TCK pin names were removed from these pin
diagrams:
• 28-pin SPDIP/SOIC/SSOP
• 28-pin QFN
• 36-pin TLA
Section 1.0 “Device Overview”
Updated the Buffer Type to Digital for the CTED1 and CTED2 pins (see
Table 1-1).
Section 4.0 “Memory Organization”
Updated the SFR Address for IC2CON, IC3BUF, and IC3CON in the Input
Capture Register Map (see Table 4-7).
Added the VREGS bit to the RCON register in the System Control Register
Map (see Table 4-27).
Section 6.0 “Resets”
Added the VREGS bit to the RCON register (see Register 6-1).
Section 8.0 “Oscillator Configuration” Updated the definition for COSC<2:0> = 001 and NOSC<2:0> = 001 in
the OSCCON register (see Register 8-1).
Section 15.0 “Motor Control PWM
Module”
Updated the title for Example 15-1 to include a reference to the Assembly
language.
Added Example 15-2, which provides a C code version of the writeprotected register unlock and Fault clearing sequence.
Section 19.0 “10-bit Analog-to-Digital
Converter (ADC)”
Updated the CH0 section and added Note 2 in both ADC block diagrams
(see Figure 19-1 and Figure 19-2).
Updated the multiplexer values in the ADC Conversion Clock Period Block
Diagram (see Figure 19-3.
Added the 01110 bit definitions and updated the 01101 bit definitions for
the CH0SB<4:0> and CH0SA<4:0> bits in the AD1CHS0 register (see
Register 19-5).
Section 22.0 “Charge Time
Measurement Unit (CTMU)”
Removed Section 22.1 “Measuring Capacitance”, Section 22.2 “Measuring
Time”, and Section 22.3 “Pulse Generation and Delay”
Updated the key features.
Added the CTMU Block Diagram (see Figure 22-1).
Updated the ITRIM<5:0> bit definitions and added Note 1 to the CTMU
Current Control register (see Register 22-3).
DS70000652F-page 374
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE A-2:
MAJOR SECTION UPDATES (CONTINUED)
Section Name
Section 23.0 “Special Features”
Update Description
Updated bits 5 and 4 of FPOR, modified Note 2, and removed Note 3 from
the Configuration Shadow Register Map (see Table 23-1).
Updated bit 14 of CONFIG1 and removed Note 5 from the Configuration
Flash Words (see Table 23-2).
Updated the PLLKEN Configuration bit description (see Table 23-3).
Added Note 3 to Connections for the On-Chip Voltage Regulator (see
Figure 23-1).
Section 26.0 “Electrical
Characteristics”
Updated the Standard Operating Conditions to: 3.0V to 3.6V in all tables.
Removed the Voltage on VCAP with respect to VSS entry in Absolute
Maximum Ratings(1).
Updated the VDD Range (in Volts) in Operating MIPS vs. Voltage (see
Table 26-1).
Removed Parameter DC18 and updated the minimum value for
Parameter DC 10 in the DC Temperature and Voltage Specifications (see
Table 26-4).
Updated the Characteristic definition and the Typical value for
Parameter BO10 in Electrical Characteristics: BOR (see Table 26-5).
Updated Note 2 in the DC Characteristics: Operating Current (IDD) (see
Table 26-6).
Updated Note 2 in the DC Characteristics: Idle Current (IIDLE) (see
Table 26-7).
Updated Note 2 and Parameters DC60C and DC61a-DC61d in the DC
Characteristics: Power-Down Current (IPD) (see Table 26-8).
Updated Note 2 in the DC Characteristics: Doze Current (IDOZE) (see
Table 26-9).
Added Note 1 to the Internal Voltage Regulator Specifications (see
Table 26-13).
Updated the Minimum and Maximum values for Parameter F20a and the
Typical value for Parameter F20b in AC Characteristics: Internal Fast RC
(FRC) Accuracy (see Table 26-18).
Updated the Minimum, Typical, and Maximum values for Parameter F21a
and F21b in Internal Low-Power RC (LPRC) Accuracy (see Table 26-19).
Updated the Minimum, Typical, and Maximum values for Parameter D305
in the Comparator Module Specifications (see Table 26-43).
Added Parameters CTMUFV1 and CTMUFV2 and updated Note 1 and the
Conditions for all parameters in the CTMU Current Source Specifications
(see Table 26-46).
Added Forward Voltage Versus Temperature (see Figure 26-25).
 2011-2014 Microchip Technology Inc.
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Revision D (April 2012)
This revision includes updates in support of the
following new devices:
•
•
•
•
•
•
dsPIC33FJ32GP101
dsPIC33FJ32GP102
dsPIC33FJ32GP104
dsPIC33FJ32MC101
dsPIC33FJ32MC102
dsPIC33FJ32MC104
TABLE A-3:
Also, where applicable, new sections were added to
peripheral chapters that provide information and links
to the related resources, as well as helpful tips. For
examples, see Section 18.1 “UART Helpful Tips”
and Section 18.2 “UART Resources”.
This revision includes text and formatting changes that
were incorporated throughout the document.
All other major changes are referenced by their
respective section in Table A-3.
MAJOR SECTION UPDATES
Section Name
Update Description
“16-Bit Digital Signal
The content on the first page of this section was extensively reworked to provide the
Controllers (up to 32reader with the key features and functionality of this device family in an “at-a-glance”
Kbyte Flash and 2-Kbyte format.
SRAM)”
TABLE 2: “dsPIC33FJ32(GP/MC)101/102/104 Device Features” was added, which
provides a feature overview of the new devices.
All pin diagrams were updated (see “Pin Diagrams”).
Section 1.0 “Device
Overview”
Updated the notes in the device family block diagram (see Figure 1-1).
Updated the following pinout I/O descriptions (Table 1-1):
• ANx
• CNx
• RAx
• RCx
• CVREFIN (formerly CVREF)
Relocated 1.1 “Referenced Sources” to the previous chapter (see “Referenced
Sources”).
Section 2.0 “Guidelines
for Getting Started with
16-bit Digital Signal
Controllers”
Updated the Recommended Minimum Connection diagram (see Figure 2-1).
Section 4.0 “Memory
Organization”
Updated the existing Program Memory Map (see Figure 4-1) and added the Program
Memory Map for dsPIC33FJ16(GP/MC)101/102 Devices (see Figure 4-1).
Updated the existing Data Memory Map (see Figure 4-4) and added the Data Memory
Map for dsPIC33FJ32(GP/MC)101/102/104 Devices with 2-Kbyte RAM (see Figure 4-5).
The following Special Function Register maps were updated or added:
• TABLE 4-5: Change Notification Register Map for dsPIC33FJ32(GP/MC)104
Devices
• TABLE 4-6: Interrupt Controller Register Map
• TABLE 4-8: Timers Register Map for dsPIC33FJ32(GP/MC)10X Devices
• TABLE 4-15: ADC1 Register Map for dsPIC33FJXX(GP/MC)101 Devices
• TABLE 4-17: ADC1 Register Map for dsPIC33FJ32(GP/MC)104 Devices
• TABLE 4-22: Peripheral Pin Select Input Register Map
• TABLE 4-26: Peripheral Pin Select Output Register Map for dsPIC33FJ32(GP/
MC)104 Devices
• TABLE 4-28: PORTA Register Map for dsPIC33FJ32(GP/MC)101/102 Devices
• TABLE 4-29: PORTA Register Map for dsPIC33FJ32(GP/MC)104 Devices
• TABLE 4-36: PORTC Register Map for dsPIC33FJ32(GP/MC)104 Devices
• TABLE 4-39: PMD Register Map
DS70000652F-page 376
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE A-3:
MAJOR SECTION UPDATES (CONTINUED)
Section Name
Update Description
Section 7.0 “Interrupt
Controller”
Updated the Interrupt Vectors (see Table 7-1).
Section 9.0 “PowerSaving Features”
Updated 9.5 PMD Control Registers.
Section 10.0 “I/O Ports”
Updated TABLE 10-1: Selectable Input Sources (Maps Input to Function)(1).
The following registers were updated or added:
• Register 7-5: IFS0: Interrupt Flag Status Register 0
• Register 7-11: IEC1: Interrupt Enable Control Register 1
• Register 7-21: IPC6: Interrupt Priority Control Register 6
Updated TABLE 10-2: Output Selection for Remappable Pin (RPn)
The following registers were updated or added:
• Register 10-4: RPINR4: Peripheral Pin Select Input Register 4
• Register 10-6: RPINR8: Peripheral Pin Select Input Register 8
• Register 10-19: RPOR8: Peripheral Pin Select Output Register 8
• Register 10-20: RPOR9: Peripheral Pin Select Output Register 9
• Register 10-21: RPOR10: Peripheral Pin Select Output Register 10
• Register 10-22: RPOR11: Peripheral Pin Select Output Register 11
• Register 10-23: RPOR12: Peripheral Pin Select Output Register 12
Section 12.0 “Timer2/3
and Timer4/5”
The features and operation information was extensively updated in support of Timer4/5
(see Section 12.1 “32-Bit Operation” and Section 12.2 “16-Bit Operation”).
The block diagrams were updated in support of the new timers (see Figure 12-1,
Figure 12-2, and Figure 12-3).
The following registers were added:
• Register 12-3: T4CON: Timer4 Control Register(1)
• Register 12-4: T5CON: Timer5 Control Register(1)
Section 15.0 “Motor
Control PWM Module”
Updated TABLE 15-1: Internal Pull-down resistors on PWM Fault pins.
Section 19.0 “10-Bit
Analog-to-Digital
Converter (ADC)”
The number of available input pins and channels were updated from six to 14.
Note 2 was added to Register 15-5: PWMXCON1: PWMx Control Register 1(1).
Updated FIGURE 19-1: ADC1 Block Diagram for dsPIC33FJXX(GP/MC)101 Devices.
Updated FIGURE 19-2: ADC1 Block Diagram for dsPIC33FJXX(GP/MC)102 Devices.
Added FIGURE 19-3: ADC1 Block Diagram for dsPIC33FJ32(GP/MC)104 Devices.
The following registers were updated:
• Register 19-4: AD1CHS123: ADC1 Input Channel 1, 2, 3 Select Register
• Register 19-5: AD1CHS0: ADC1 INPUT Channel 0 select Register
• Register 19-6: AD1CSSL: ADC1 Input Scan Select Register Low(1,2,3)
• Register 19-7: AD1PCFGL: ADC1 Port Configuration Register Low(1,2,3)
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dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE A-3:
MAJOR SECTION UPDATES (CONTINUED)
Section Name
Section 26.0 “Electrical
Characteristics”
Update Description
Updated the Absolute Maximum Ratings.
Updated TABLE 26-3: Thermal Packaging Characteristics.
Updated TABLE 26-6: DC Characteristics: Operating Current (Idd).
Updated TABLE 26-7: DC Characteristics: Idle Current (Iidle).
Updated TABLE 26-8: DC Characteristics: Power-Down Current (Ipd).
Updated TABLE 26-9: DC Characteristics: Doze Current (Idoze).
Updated TABLE 26-10: DC Characteristics: I/O Pin Input Specifications.
Replaced all SPI specifications and figures (see Table 26-29 through Table 26-44 and
Figure 26-11 through Figure 26-26).
Section 28.0 “Packaging Added the following Package Marking Information and Package Drawings:
Information”
• 44-Lead TQFP
• 44-Lead QFN
• 44-Lead VTLA (referred to as TLA in the package drawings)
DS70000652F-page 378
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Revision E (September 2012)
This revision includes updates to the values in
Section 26.0 “Electrical Characteristics” and
updated packaging diagrams in Section 28.0
“Packaging Information”. There are minor text edits
throughout the document.
Revision F (January 2014)
This revision adds the High-Temperature Electrical
Characteristics chapter and updated packaging
diagrams in Section 28.0 “Packaging Information”.
There are minor text edits throughout the document.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 379
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 380
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
INDEX
A
C
Absolute Maximum Ratings .............................................. 281
AC Characteristics ............................................................ 294
10-Bit ADC Specifications......................................... 333
ADC Specifications ................................................... 332
Internal Fast RC (FRC) Accuracy ..................... 296, 342
Internal Low-Power RC (LPRC) Accuracy ........ 296, 342
Load Conditions ........................................................ 294
PLL Clock.................................................................. 296
Temperature and Voltage Specifications .................. 294
ADC
Control Registers ...................................................... 222
Helpful Tips ............................................................... 221
Initialization ............................................................... 217
Key Features............................................................. 217
Resources................................................................. 221
Alternate Interrupt Vector Table (AIVT) .............................. 95
Analog-to-Digital Converter (ADC).................................... 217
Arithmetic Logic Unit (ALU)................................................. 43
Charge Time Measurement Unit. See CTMU.
Clock Switching ................................................................ 132
Enabling.................................................................... 132
Sequence ................................................................. 132
Code Examples
Assembly Code for Write-Protected Register
Unlock, Fault Clearing Sequence ..................... 184
C Code for Write-Protected Register Unlock,
Fault Clearing Sequence .................................. 184
Port Write/Read ........................................................ 141
PWRSAV Instruction Syntax .................................... 133
Setting the RTCWREN Bit ........................................ 244
Comparator....................................................................... 231
Control Registers...................................................... 234
Configuration Bits ............................................................. 261
Description................................................................ 263
CPU
Control Registers........................................................ 40
Data Addressing
Overview............................................................. 37
DSP Engine ................................................................ 43
Adder/Subtracter
Overflow and Saturation............................. 45
Barrel Shifter....................................................... 47
Data Accumulators
Write Back .................................................. 46
Data Accumulators and Adder/Subtracter .......... 45
Multiplier ............................................................. 45
Overview............................................................. 37
Special MCU Features ............................................... 38
CPU Clocking System ...................................................... 126
Clock Selection......................................................... 126
Clock Sources .......................................................... 126
Configuration Bit Values for Clock Selection ............ 127
PLL Configuration..................................................... 127
CTMU
Control Registers...................................................... 257
Customer Change Notification Service............................. 387
Customer Notification Service .......................................... 387
Customer Support............................................................. 387
B
Bit-Reversed Addressing .................................................... 76
Example ...................................................................... 77
Implementation ........................................................... 76
Sequence Table (16-Entry)......................................... 77
Block Diagrams
16-Bit Timer1 Module................................................ 165
6-Channel PWM1 Module......................................... 182
ADC1 Conversion Clock Period................................ 221
ADC1 for dsPIC33FJ32(GP/MC)104 Devices .......... 220
ADC1 for dsPIC33FJXX(GP/MC)101 Devices.......... 218
ADC1 for dsPIC33FJXX(GP/MC)102 Devices.......... 219
Comparator I/O Operating Modes............................. 231
Comparator Voltage Reference ................................ 232
Connections for On-Chip Voltage Regulator............. 266
CTMU Module........................................................... 256
Digital Filter Interconnect .......................................... 233
DSP Engine ................................................................ 44
dsPIC33FJXX(GP/MC)10X CPU Core ....................... 38
dsPIC33FJXX(GP/MC)10X Devices ........................... 28
I2C Module ................................................................ 204
Input Capture x Module............................................. 175
MCLR Pin Connections............................................... 34
Multiplexing of Remappable Output for RPn............. 144
Oscillator System ...................................................... 125
Output Compare x Module........................................ 177
Real-Time Clock and Calendar (RTCC) Module....... 243
Recommended Minimum Connection......................... 34
Remappable MUX Input for U1RX............................ 142
Reset System.............................................................. 87
Shared Port Structure ............................................... 140
SPIx Module.............................................................. 197
Timer2 and Timer4 (16-Bit)....................................... 169
Timer2/3 and Timer4/5 (32-Bit)................................. 168
Timer3 and Timer5 (16-Bit)....................................... 169
UARTx Simplified...................................................... 211
User-Programmable Blanking Function .................... 232
Watchdog Timer (WDT) ............................................ 267
Brown-out Reset (BOR) .................................................... 266
 2011-2014 Microchip Technology Inc.
D
Data Address Space........................................................... 52
Memory Map for dsPIC33FJ16(GP/MC)101/102
Devices, 1-Kbyte RAM ....................................... 53
Memory Map for dsPIC33FJ32(GP/MC)101/102/104
Devices, 2-Kbyte RAM ............................................ 54
Near Data Space ........................................................ 52
Organization and Alignment ....................................... 52
SFR Space ................................................................. 52
Software Stack ........................................................... 73
Width .......................................................................... 52
X and Y Spaces.......................................................... 55
DS70000652F-page 381
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DC Characteristics ............................................................ 282
Brown-out Reset (BOR) ............................................ 283
Doze Current (IDOZE) ........................................ 289, 342
High Temperature ..................................................... 340
I/O Pin Input Specifications ....................................... 290
I/O Pin Output Specifications .................................... 292
Idle Current (IIDLE) ............................................ 286, 341
Operating Current (IDD)............................. 284, 340, 341
Operating MIPS vs. Voltage.............................. 282, 340
Power-Down Current (IPD) ................................ 288, 341
Program Memory ...................................................... 293
Temperature and Voltage Specifications .................. 283
Thermal Operating Conditions .......................... 282, 340
Thermal Packaging ................................................... 282
Development Support ....................................................... 277
Assembler
MPASM Assembler........................................... 278
C Compilers
MPLAB XC........................................................ 278
Demonstration/Development Boards ........................ 280
Evaluation and Starter Kits ....................................... 280
MPLAB Assembler, Linker, Librarian ........................ 278
MPLAB ICD 3 In-Circuit Debugger System .............. 279
MPLAB PM3 Device Programmer ............................ 279
MPLAB REAL ICE In-Circuit Emulator System......... 279
MPLAB X Integrated Development
Environment Software....................................... 277
MPLINK Object Linker/MPLIB Object Librarian ........ 278
PICkit 3 In-Circuit Debugger/Programmer ................ 279
Software Simulator (MPLAB X SIM) ......................... 279
Third-Party Development Tools ................................ 280
Doze Mode........................................................................ 134
dsPIC33FJ16(GP/MC)101/102
Device Features ............................................................ 2
dsPIC33FJ32(GP/MC)101/102/104
Device Features ............................................................ 3
E
Electrical Characteristics................................................... 281
Equations
Device Operating Frequency .................................... 126
Flash Programming Time............................................ 84
Maximum Row Write Time .......................................... 84
Minimum Row Write Time ........................................... 84
MS with PLL Mode .................................................... 127
Errata .................................................................................. 24
F
Flash Program Memory....................................................... 83
Control Registers ........................................................ 85
Operations .................................................................. 84
Programming Algorithm .............................................. 84
RTSP Operation.......................................................... 84
Table Instructions........................................................ 83
G
Getting Started with 16-Bit DSCs........................................ 33
Analog and Digital Pins Configuration
During ICSP ........................................................ 36
Connection Requirements .......................................... 33
Decoupling Capacitors ................................................ 33
External Oscillator Pins ............................................... 35
ICSP Pins.................................................................... 35
Master Clear (MCLR) Pin............................................ 34
Oscillator Value Conditions on Start-up ...................... 36
Unused I/Os ................................................................ 36
DS70000652F-page 382
H
High-Temperature Electrical Characteristics .................... 339
I
I/O Ports............................................................................ 139
Configuring Analog Port Pins.................................... 141
Open-Drain Configuration......................................... 141
Parallel I/O (PIO) ...................................................... 139
Write/Read Timing .................................................... 141
I2C
Control Registers ...................................................... 205
Operating Modes ...................................................... 203
Registers .................................................................. 203
In-Circuit Debugger........................................................... 268
In-Circuit Serial Programming (ICSP)............................... 268
Input Capture .................................................................... 175
Control Register........................................................ 176
Input Change Notification (ICN)........................................ 141
Instruction Addressing Modes ............................................ 73
File Register Instructions ............................................ 73
Fundamental Modes Supported ................................. 74
MAC Instructions ........................................................ 74
MCU Instructions ........................................................ 73
Move and Accumulator Instructions............................ 74
Other Instructions ....................................................... 74
Instruction Set
Summary .......................................................... 269
Overview................................................................... 272
Symbols Used in Opcode Descriptions .................... 270
Instruction-Based Power-Saving Modes........................... 133
Idle ............................................................................ 134
Sleep ........................................................................ 133
Internet Address ............................................................... 387
Interrupt Controller.............................................................. 95
Interrupt Registers
IECx.................................................................... 98
IFSx .................................................................... 98
INTCON1............................................................ 98
INTCON2............................................................ 98
INTTREG ............................................................ 98
IPCx.................................................................... 98
Interrupt Setup Procedures....................................... 124
Initialization....................................................... 124
Interrupt Disable ............................................... 124
Interrupt Service Routine (ISR) ........................ 124
Trap Service Routine (TSR) ............................. 124
Interrupt Vectors ......................................................... 97
Reset Sequence ......................................................... 95
Interrupt Vector Table (IVT) ................................................ 95
Interrupts Coincident with Power Save Instructions ......... 134
L
LPRC Oscillator
Use with WDT........................................................... 267
M
Memory Organization ......................................................... 49
Microchip Internet Web Site.............................................. 387
Modulo Addressing ............................................................. 75
Applicability................................................................. 76
Operation Example ..................................................... 75
Start and End Address ............................................... 75
W Address Register Selection .................................... 75
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Motor Control PWM .......................................................... 181
6-Channel PWM1 Module......................................... 181
Control Registers ...................................................... 185
Faults ........................................................................ 183
At Reset ............................................................ 183
Write-Protected Registers......................................... 183
O
Oscillator Configuration
Control Registers ...................................................... 128
Output Compare ............................................................... 177
Control Register ........................................................ 179
Modes ....................................................................... 178
Active-High One-Shot ....................................... 178
Active-Low One-Shot ........................................ 178
Continuous Pulse.............................................. 178
Delayed One-Shot ............................................ 178
Module Disabled ............................................... 178
PWM with Fault Protection ............................... 178
PWM without Fault Protection .......................... 178
Toggle ............................................................... 178
P
Packaging ......................................................................... 343
Details ....................................................................... 346
Marking ..................................................... 343, 344, 345
Peripheral Module Disable (PMD) .................................... 134
Peripheral Pin Select (PPS) .............................................. 142
Available Pins ........................................................... 142
Controlling................................................................. 142
Controlling Configuration Changes ........................... 145
Helpful Tips ............................................................... 146
I/O Resources ........................................................... 146
Input Mapping ........................................................... 142
Input Selection Sources for Remappable
Pin (RPn) .......................................................... 143
Output Mapping ........................................................ 144
Output Selection Sources for Remappable
Pin (RPn) .......................................................... 144
Registers................................................................... 147
Pin Diagrams ........................................................................ 4
Pinout I/O Descriptions (table) ............................................ 29
PORTA
Register Map............................................................... 70
Power-Saving Features .................................................... 133
Clock Frequency and Switching................................ 133
Program Address Space ..................................................... 49
Construction................................................................ 78
Data Access from Program Memory Using
Table Instructions ............................................... 80
Data Access from, Address Generation...................... 79
Memory Map
dsPIC33FJ16(GP/MC)101/102 Devices ............. 49
dsPIC33FJ32(GP/MC)101/102/104 Devices ...... 50
PSV Operation ............................................................ 81
Reading Data Using Program Space Visibility............ 81
Table Read Instructions
TBLRDH ............................................................. 80
TBLRDL .............................................................. 80
Program Memory
Interrupt Vector ........................................................... 51
Organization................................................................ 51
Reset Vector ............................................................... 51
Programmer’s Model........................................................... 39
 2011-2014 Microchip Technology Inc.
R
Real-Time Clock and Calendar (RTCC) ........................... 243
Register Maps
6-Output PWM1, dsPIC33FJXXMC10X Devices ....... 61
ADC1, dsPIC33FJ32(GP/MC)104 Devices ................ 65
ADC1, dsPIC33FJXX(GP/MC)101 Devices ............... 63
ADC1, dsPIC33FJXX(GP/MC)102 Devices ............... 64
Change Notification, dsPIC33FJ32(GP/MC)104
Devices............................................................... 58
Change Notification, dsPIC33FJXX(GP/MC)102
Devices............................................................... 58
Change Notification, dsPIC33FJXXGP101
Devices............................................................... 58
Change Notification, dsPIC33FJXXMC101
Devices............................................................... 58
Comparator................................................................. 67
Configuration Flash Words
dsPIC33FJ16(GP/MC)10X Devices ................. 262
dsPIC33FJ32(GP/MC)10X Devices ................. 262
Configuration Shadow Registers .............................. 262
CPU Core ................................................................... 56
CTMU ......................................................................... 66
I2C1 ............................................................................ 62
Input Capture.............................................................. 61
Interrupt Controller...................................................... 59
NVM............................................................................ 72
Output Compare ......................................................... 61
PAD Configuration...................................................... 66
PMD............................................................................ 72
PORTA, dsPIC33FJ16(GP/MC)101/102
Devices............................................................... 69
PORTA, dsPIC33FJ32(GP/MC)101/102
Devices............................................................... 69
PORTA, dsPIC33FJ32(GP/MC)104 Devices ............. 70
PORTB, dsPIC33FJ16GP101 Devices ...................... 70
PORTB, dsPIC33FJ16MC101 Devices ...................... 70
PORTB, dsPIC33FJ32(GP/MC)102 and
dsPIC33FJ32(GP/MC)104 Devices.................... 71
PORTB, dsPIC33FJ32GP101 Devices ...................... 71
PORTB, dsPIC33FJ32MC101 Devices ...................... 71
PORTB, dsPIC33FJXX(GP/MC)102 and
dsPIC33FJ16(GP/MC)102 Devices.................... 70
PORTC, dsPIC33FJ32(GP/MC)104 Devices ............. 71
PPS Input ................................................................... 67
PPS Output, dsPIC33FJ32(GP/MC)104 Devices....... 69
PPS Output, dsPIC33FJXX(GP/MC)102 Devices ...... 68
PPS Output, dsPIC33FJXXGP101 Devices ............... 68
PPS Output, dsPIC33FJXXMC101 Devices............... 68
Real-Time Clock and Calendar .................................. 66
SPI1............................................................................ 62
System Control ........................................................... 72
Timers, dsPIC33FJ16(GP/MC)10X Devices .............. 60
Timers, dsPIC33FJ32(GP/MC)10X Devices .............. 60
UART1........................................................................ 62
Registers
AD1CHS0 (ADC1 Input Channel 0 Select)............... 227
AD1CHS123 (ADC1 Input
Channel 1, 2, 3 Select) ..................................... 226
AD1CON1 (ADC1 Control 1) .................................... 222
AD1CON2 (ADC1 Control 2) .................................... 224
AD1CON3 (ADC1 Control 3) .................................... 225
AD1CSSL (ADC1 Input Scan Select Low) ............... 228
AD1PCFGL (ADC1 Port Configuration Low) ............ 229
DS70000652F-page 383
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
ALCFGRPT (Alarm Configuration)............................ 248
ALRMVAL (Alarm Minutes and Seconds Value,
ALRMPTR Bits = 00) ........................................ 254
ALRMVAL (Alarm Month and Day Value,
ALRMPTR Bits = 10) ........................................ 252
ALRMVAL (Alarm Weekday and Hours Value,
ALRMPTR Bits = 01) ........................................ 253
CLKDIV (Clock Divisor)............................................. 130
CMSTAT (Comparator Status).................................. 234
CMxCON (Comparator x Control) ............................. 235
CMxFLTR (Comparator x Filter Control) ................... 241
CMxMSKCON (Comparator x Mask
Gating Control).................................................. 239
CMxMSKSRC (Comparator x Mask
Source Select) .................................................. 237
CORCON (Core Control) ...................................... 42, 99
CTMUCON1 (CTMU Control 1) ................................ 257
CTMUCON2 (CTMU Control 2) ................................ 258
CTMUICON (CTMU Current Control) ....................... 259
CVRCON (Comparator Voltage
Reference Control)............................................ 242
DEVID (Device ID) .................................................... 265
DEVREV (Device Revision) ...................................... 265
I2CxCON (I2Cx Control) ........................................... 205
I2CxMSK (I2Cx Slave Mode Address Mask) ............ 209
I2CxSTAT (I2Cx Status) ........................................... 207
ICxCON (Input Capture x Control) ............................ 176
IEC0 (Interrupt Enable Control 0) ............................. 108
IEC1 (Interrupt Enable Control 1) ............................. 109
IEC2 (Interrupt Enable Control 2) ............................. 110
IEC3 (Interrupt Enable Control 3) ............................. 110
IEC4 (Interrupt Enable Control 4) ............................. 111
IFS0 (Interrupt Flag Status 0) ................................... 103
IFS1 (Interrupt Flag Status 1) ................................... 105
IFS2 (Interrupt Flag Status 2) ................................... 106
IFS3 (Interrupt Flag Status 3) ................................... 106
IFS4 (Interrupt Flag Status 4) ................................... 107
INTCON1 (Interrupt Control 1) .................................. 100
INTCON2 (Interrupt Control 2) .................................. 102
INTTREG (Interrupt Control and Status)................... 123
IPC0 (Interrupt Priority Control 0) ............................. 112
IPC1 (Interrupt Priority Control 1) ............................. 113
IPC14 (Interrupt Priority Control 14) ......................... 119
IPC15 (Interrupt Priority Control 15) ......................... 120
IPC16 (Interrupt Priority Control 16) ......................... 121
IPC19 (Interrupt Priority Control 19) ......................... 122
IPC2 (Interrupt Priority Control 2) ............................. 114
IPC3 (Interrupt Priority Control 3) ............................. 115
IPC4 (Interrupt Priority Control 4) ............................. 116
IPC5 (Interrupt Priority Control 5) ............................. 117
IPC6 (Interrupt Priority Control 6) ............................. 117
IPC7 (Interrupt Priority Control 7) ............................. 118
IPC9 (Interrupt Priority Control 9) ............................. 119
NVMCON (Flash Memory Control) ............................. 85
NVMKEY (Nonvolatile Memory Key) .......................... 85
OCxCON (Output Compare x Control) ..................... 179
OSCCON (Oscillator Control) ................................... 128
OSCTUN (FRC Oscillator Tuning) ............................ 131
PADCFG1 (Pad Configuration Control) .................... 247
PMD1 (Peripheral Module Disable Control 1) ........... 135
PMD2 (Peripheral Module Disable Control 2) ........... 136
DS70000652F-page 384
PMD3 (Peripheral Module Disable Control 3)........... 137
PMD4 (Peripheral Module Disable Control 4)........... 137
PWMxCON1 (PWMx Control 1)................................ 188
PWMxCON2 (PWMx Control 2)................................ 189
PWMxKEY (PWMx Unlock) ...................................... 196
PxDC1 (PWMx Duty Cycle 1) ................................... 195
PxDC2 (PWMx Duty Cycle 2) ................................... 195
PxDC3 (PWMx Duty Cycle 3) ................................... 195
PxDTCON1 (PWMx Dead-Time Control 1) .............. 190
PxDTCON2 (PWMx Dead-Time Control 2) .............. 191
PxFLTACON (PWMx Fault A Control)...................... 192
PxFLTBCON (PWMx Fault B Control)...................... 193
PxOVDCON (PWMx Override Control) .................... 194
PxSECMP (PWMx Special Event Compare) ............ 187
PxTCON (PWMx Time Base Control)....................... 185
PxTMR (PWMx Timer Count Value)......................... 186
PxTPER (PWMx Time Base Period) ........................ 186
RCFGCAL (RTCC Calibration
and Configuration) ............................................ 245
RCON (Reset Control)................................................ 88
RPINR0 (Peripheral Pin Select Input 0).................... 147
RPINR1 (Peripheral Pin Select Input 1).................... 148
RPINR11 (Peripheral Pin Select Input 11)................ 153
RPINR18 (Peripheral Pin Select Input 18)................ 154
RPINR20 (Peripheral Pin Select Input 20)................ 155
RPINR21 (Peripheral Pin Select Input 21)................ 156
RPINR3 (Peripheral Pin Select Input 3).................... 149
RPINR4 (Peripheral Pin Select Input 4).................... 150
RPINR7 (Peripheral Pin Select Input 7).................... 151
RPINR8 (Peripheral Pin Select Input 8).................... 152
RPOR0 (Peripheral Pin Select Output 0).................. 157
RPOR1 (Peripheral Pin Select Output 1).................. 157
RPOR10 (Peripheral Pin Select Output 10).............. 162
RPOR11 (Peripheral Pin Select Output 11).............. 162
RPOR12 (Peripheral Pin Select Output 12).............. 163
RPOR2 (Peripheral Pin Select Output 2).................. 158
RPOR3 (Peripheral Pin Select Output 3).................. 158
RPOR4 (Peripheral Pin Select Output 4).................. 159
RPOR5 (Peripheral Pin Select Output 5).................. 159
RPOR6 (Peripheral Pin Select Output 6).................. 160
RPOR7 (Peripheral Pin Select Output 7).................. 160
RPOR8 (Peripheral Pin Select Output 8).................. 161
RPOR9 (Peripheral Pin Select Output 9).................. 161
RTCVAL (RTCC Minutes and Seconds Value,
RTCPTR Bits = 00)........................................... 251
RTCVAL (RTCC Month and Day Value,
RTCPTR Bits = 10)........................................... 249
RTCVAL (RTCC Weekdays and Hours Value,
RTCPTR Bits = 01)........................................... 250
RTCVAL (RTCC Year Value,
RTCPTR Bits = 11)........................................... 249
SPIxCON1 (SPIx Control 1)...................................... 200
SPIxCON2 (SPIx Control 2)...................................... 202
SPIxSTAT (SPIx Status and Control) ....................... 199
SR (CPU STATUS)............................................... 40, 99
T1CON (Timer1 Control) .......................................... 166
T2CON (Timer2 Control) .......................................... 170
T3CON (Timer3 Control) .......................................... 171
T4CON (Timer4 Control) .......................................... 172
T5CON (Timer5 Control) .......................................... 173
UxMODE (UARTx Mode).......................................... 213
UxSTA (UARTx Status and Control)......................... 215
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
Resets ................................................................................. 87
BOR (Brown-out Reset) .............................................. 87
BOR and Power-up Timer (PWRT)............................. 92
CM (Configuration Mismatch Reset)........................... 87
Configuration Mismatch (CM) ..................................... 93
External (EXTR).......................................................... 93
Illegal Condition .......................................................... 93
Illegal Opcode ..................................................... 93
Security ......................................................... 93, 94
Uninitialized W Register................................ 93, 94
IOPUWR (Illegal Condition Reset).............................. 87
Illegal Opcode ..................................................... 87
Security ............................................................... 87
Uninitialized W Register...................................... 87
MCLR (Master Clear Pin)............................................ 87
Oscillator Delays ......................................................... 90
POR (Power-on Reset) ............................................... 87
Power-on Reset (POR) ............................................... 92
Software RESET Instruction (SWR) ........................... 93
SWR (RESET Instruction)........................................... 87
System
Cold Reset .......................................................... 90
Warm Reset ........................................................ 90
Trap Conflict................................................................ 93
TRAPR (Trap Conflict Reset)...................................... 87
Watchdog Timer Time-out (WDTO) ............................ 93
WDTO (Watchdog Timer Reset)................................. 87
Revision History ................................................................ 373
RTCC
Control Registers ...................................................... 245
Module Registers ...................................................... 244
Register Mapping...................................................... 244
S
Serial Peripheral Interface (SPI) ....................................... 197
Control Registers ...................................................... 199
Helpful Tips ............................................................... 198
Resources................................................................. 198
Software Stack Pointer, Frame Pointer
CALL Stack Frame...................................................... 73
Special Features ............................................................... 261
Code Protection ........................................................ 261
Flexible Configuration ............................................... 261
In-Circuit Emulation................................................... 261
In-Circuit Serial Programming (ICSP) ....................... 261
Watchdog Timer (WDT) ............................................ 261
T
Timer1 ............................................................................... 165
Control Register ........................................................ 166
Timer2/3 and Timer4/5...................................................... 167
16-Bit Operation........................................................ 167
32-Bit Operation........................................................ 167
Control Registers ...................................................... 170
Timing Diagrams
ADC Conversion Characteristics (CHPS<1:0> = 01,
SIMSAM = 0, ASAM = 0,
SSRC<2:0> = 000) ........................................... 334
ADC Conversion Characteristics (CHPS<1:0> = 01,
SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111,
SAMC<4:0> = 00001) ....................................... 334
Brown-out Reset Situations ........................................ 92
CLKO and I/O ........................................................... 297
External Clock........................................................... 295
I2Cx Bus Data (Master Mode) .................................. 328
I2Cx Bus Data (Slave Mode) .................................... 330
 2011-2014 Microchip Technology Inc.
I2Cx Bus Start/Stop Bits (Master Mode)................... 328
I2Cx Bus Start/Stop Bits (Slave Mode)..................... 330
Input Capture x (ICx) ................................................ 301
Motor Control PWMx ................................................ 303
Motor Control PWMx Fault ....................................... 303
OCx/PWMx............................................................... 302
Output Compare x (OCx).......................................... 302
Output Compare x Operation ................................... 178
Reset, Watchdog Timer, Oscillator Start-up Timer
and Power-up Timer ......................................... 298
SPIx Master Mode (Full-Duplex, CKE = 0, CKP = x,
SMP = 1) for dsPIC33FJ16(GP/MC)10X.......... 307
SPIx Master Mode (Full-Duplex, CKE = 0, CKP = x,
SMP = 1) for dsPIC33FJ32(GP/MC)10X.......... 319
SPIx Master Mode (Full-Duplex, CKE = 1, CKP = x,
SMP = 1) for dsPIC33FJ16(GP/MC)10X.......... 306
SPIx Master Mode (Full-Duplex, CKE = 1, CKP = x,
SMP = 1) for dsPIC33FJ32(GP/MC)10X.......... 318
SPIx Master Transmit Mode (Half-Duplex, CKE = 0)
for dsPIC33FJ16(GP/MC)10X .......................... 304
SPIx Master Transmit Mode (Half-Duplex, CKE = 0)
for dsPIC33FJ32(GP/MC)10X .......................... 316
SPIx Master Transmit Mode (Half-Duplex, CKE = 1)
for dsPIC33FJ16(GP/MC)10X .......................... 305
SPIx Master Transmit Mode (Half-Duplex, CKE = 1)
for dsPIC33FJ32(GP/MC)10X .......................... 317
SPIx Slave Mode (Full-Duplex, CKE = 0, CKP = 0,
SMP = 0) for dsPIC33FJ16(GP/MC)10X.......... 314
SPIx Slave Mode (Full-Duplex, CKE = 0, CKP = 0,
SMP = 0) for dsPIC33FJ32(GP/MC)10X.......... 326
SPIx Slave Mode (Full-Duplex, CKE = 0, CKP = 1,
SMP = 0) for dsPIC33FJ16(GP/MC)10X.......... 312
SPIx Slave Mode (Full-Duplex, CKE = 0, CKP = 1,
SMP = 0) for dsPIC33FJ32(GP/MC)10X.......... 324
SPIx Slave Mode (Full-Duplex, CKE = 1, CKP = 0,
SMP = 0) for dsPIC33FJ16(GP/MC)10X.......... 308
SPIx Slave Mode (Full-Duplex, CKE = 1, CKP = 0,
SMP = 0) for dsPIC33FJ32(GP/MC)10X.......... 320
SPIx Slave Mode (Full-Duplex, CKE = 1, CKP = 1,
SMP = 0) for dsPIC33FJ16(GP/MC)10X.......... 310
SPIx Slave Mode (Full-Duplex, CKE = 1, CKP = 1,
SMP = 0) for dsPIC33FJ32(GP/MC)10X.......... 322
System Reset ............................................................. 91
Timer1/2/3 External Clock ........................................ 299
Timing Requirements
10-Bit ADC Conversion ............................................ 335
Capacitive Loading on Output Pins .......................... 294
CLKO and I/O ........................................................... 297
External Clock .......................................................... 295
I2Cx Bus Data (Master Mode) .................................. 329
I2Cx Bus Data (Slave Mode) .................................... 331
Input Capture x (ICx) ................................................ 301
Motor Control PWMx ................................................ 303
Output Compare x (OCx).......................................... 302
Reset, Watchdog Timer, Oscillator Start-up Timer,
Power-up Timer and Brown-out Reset ............. 298
Simple OCx/PWMx Mode......................................... 302
SPIx Master Mode (Full-Duplex, CKE = 0, CKP = x,
SMP = 1) for dsPIC33FJ16(GP/MC)10X.......... 307
SPIx Master Mode (Full-Duplex, CKE = 0, CKP = x,
SMP = 1) for dsPIC33FJ32(GP/MC)10X.......... 319
SPIx Master Mode (Full-Duplex, CKE = 1, CKP = x,
SMP = 1) for dsPIC33FJ16(GP/MC)10X.......... 306
SPIx Master Mode (Full-Duplex, CKE = 1, CKP = x,
SMP = 1) for dsPIC33FJ32(GP/MC)10X.......... 318
DS70000652F-page 385
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
SPIx Master Transmit Mode (Half-Duplex)
for dsPIC33FJ16(GP/MC)10X .......................... 305
SPIx Master Transmit Mode (Half-Duplex)
for dsPIC33FJ32(GP/MC)10X .......................... 317
SPIx Slave Mode (Full-Duplex, CKE = 0, CKP = 0,
SMP = 0) for dsPIC33FJ16(GP/MC)10X .......... 315
SPIx Slave Mode (Full-Duplex, CKE = 0, CKP = 0,
SMP = 0) for dsPIC33FJ32(GP/MC)10X .......... 327
SPIx Slave Mode (Full-Duplex, CKE = 0, CKP = 1,
SMP = 0) for dsPIC33FJ16(GP/MC)10X .......... 313
SPIx Slave Mode (Full-Duplex, CKE = 0, CKP = 1,
SMP = 0) for dsPIC33FJ32(GP/MC)10X .......... 325
SPIx Slave Mode (Full-Duplex, CKE = 1, CKP = 0,
SMP = 0) for dsPIC33FJ16(GP/MC)10X .......... 309
SPIx Slave Mode (Full-Duplex, CKE = 1, CKP = 0,
SMP = 0) for dsPIC33FJ32(GP/MC)10X .......... 321
SPIx Slave Mode (Full-Duplex, CKE = 1, CKP = 1,
SMP = 0) for dsPIC33FJ16(GP/MC)10X .......... 311
SPIx Slave Mode (Full-Duplex, CKE = 1, CKP = 1,
SMP = 0) for dsPIC33FJ32(GP/MC)10X .......... 323
Timer1 External Clock............................................... 299
Timer2/4 External Clock............................................ 300
Timer3/5 External Clock............................................ 300
Timing Specifications
Comparator Module .................................................. 336
Comparator Timing ................................................... 336
Comparator Voltage Reference ................................ 337
Comparator Voltage Reference Settling Time .......... 336
CTMU Current Source .............................................. 337
DS70000652F-page 386
U
UART
Control Registers ...................................................... 213
Helpful Tips............................................................... 212
Resources ................................................................ 212
Universal Asynchronous Receiver
Transmitter (UART) .................................................. 211
Using the RCON Status Bits............................................... 94
V
Voltage Regulator (On-Chip) ............................................ 266
W
Watchdog Timer (WDT).................................................... 267
Programming Considerations ................................... 267
WWW Address ................................................................. 387
WWW, On-Line Support ..................................................... 24
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2011-2014 Microchip Technology Inc.
DS70000652F-page 387
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 388
 2011-2014 Microchip Technology Inc.
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
dsPIC 33 FJ 16 MC1 02 T E / SP - XXX
Examples:
a)
Microchip Trademark
Architecture
Flash Memory Family
dsPIC33FJ16MC102-E/SP:
Motor Control dsPIC33,
16-Kbyte Program Memory,
28-Pin, Extended Temperature,
SPDIP package.
Program Memory Size (Kbyte)
Product Group
Pin Count
Tape and Reel Flag (if applicable)
Temperature Range
Package
Pattern
Architecture:
33
=
16-bit Digital Signal Controller
Flash Memory Family:
FJ
=
Flash program memory, 3.3V
Product Group:
GP1
MC1
=
=
General Purpose family
Motor Control family
Pin Count:
01
02
=
=
18-pin and 20-pin
28-pin and 32-pin
Temperature Range:
I
E
=
=
-40C to +85C (Industrial)
-40C to +125C (Extended)
Package:
P
SS
SP
SO
ML
PT
TL
=
=
=
=
=
=
=
Plastic Dual In-Line - 300 mil body (PDIP)
Plastic Shrink Small Outline - 5.3 mm body (SSOP)
Skinny Plastic Dual In-Line - 300 mil body (SPDIP)
Plastic Small Outline - Wide - 7.50 mil body (SOIC)
Plastic Quad, No Lead - (28-pin) 6x6 mm body (QFN)
Plastic Thin Quad Flatpack - (44-pin) 10x10 mm body (TQFP)
Very Thin Leadless Array - (36-pin) 5x5 mm body (VTLA)
 2011-2014 Microchip Technology Inc.
DS70000652F-page 389
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
NOTES:
DS70000652F-page 390
 2011-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2011-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-845-6
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2011-2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS70000652F-page 391
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS70000652F-page 392
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Pforzheim
Tel: 49-7231-424750
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
10/28/13
 2011-2014 Microchip Technology Inc.
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