
USER GUIDE
COMe-cKL6
Doc. User Guide, Rev 1.0
Doc. ID: 1061-1955
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COMe-cKL6 – User Guide, Rev 1.0
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COMe-cKL6 – User Guide, Rev 1.0

COME-CKL6 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2017 by Kontron AG
Kontron AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com
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COMe-cKL6 – User Guide, Rev 1.0
High Risk Applications Hazard Notice
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.
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COMe-cKL6 – User Guide, Rev 1.0
Revision History
Revision
Brief Description of Changes
Date of Issue
1.0
Initial version
2017-July-11
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/termsand-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.
www.kontron.com
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COMe-cKL6 – User Guide, Rev 1.0
Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of products. Failure to observe the precautions indicated and/or
prescribed by the law may endanger your life/health and/or result in damage to your
material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.
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COMe-cKL6 – User Guide, Rev 1.0
For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.
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COMe-cKL6 – User Guide, Rev 1.0
Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.

Replace only with same or equivalent battery type recommended by the manufacturer.

Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporateresponsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:

Reduce waste arising from electrical and electronic equipment (EEE)

Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste

Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE

Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.
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COMe-cKL6 – User Guide, Rev 1.0
Table of Contents
Symbols .................................................................................................................................................................................................................6
For Your Safety.................................................................................................................................................................................................... 7
High Voltage Safety Instructions .................................................................................................................................................................. 7
Special Handling and Unpacking Instruction ............................................................................................................................................ 7
Lithium Battery Precautions .......................................................................................................................................................................... 8
General Instructions on Usage...................................................................................................................................................................... 8
Quality and Environmental Management ................................................................................................................................................. 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents ...............................................................................................................................................................................................9
List of Tables.......................................................................................................................................................................................................11
List of Figures .................................................................................................................................................................................................... 12
1/
Introduction .......................................................................................................................................................................................... 13
1.1. Product Description................................................................................................................................................................................... 13
1.2. Product Naming Clarification ................................................................................................................................................................ 13
1.3. COM Express® Documentation ............................................................................................................................................................. 13
1.4. COM Express® Functionality .................................................................................................................................................................14
1.5. COM Express® Benefits ...........................................................................................................................................................................14
2/
Product Specification ........................................................................................................................................................................ 15
2.1. Module Variants ........................................................................................................................................................................................ 15
2.1.1. Commercial Grade Modules (0°C to +60°C) ................................................................................................................................... 15
2.1.2. Extended Temperature Grade Modules (E1, 25°C to 75°C) ....................................................................................................... 15
2.1.3. Industrial Temperature Grade Modules (E2S, 40°C to 85°C) .................................................................................................. 15
2.2. Accessories................................................................................................................................................................................................. 16
2.3. Functional Specification .........................................................................................................................................................................18
2.3.1. Block Diagram COMe-cKL6 .................................................................................................................................................................18
2.3.2. Processor ................................................................................................................................................................................................. 19
2.3.3. Platform Controller Hub .................................................................................................................................................................... 20
2.3.4. System Memory ................................................................................................................................................................................... 20
2.3.5. Graphics................................................................................................................................................................................................... 20
2.3.6. LVDS........................................................................................................................................................................................................... 21
2.3.7. Audio .......................................................................................................................................................................................................... 21
2.3.8. PCI Express (PCIE) Configuration ..................................................................................................................................................... 21
2.3.9. USB............................................................................................................................................................................................................ 23
2.3.10. SATA........................................................................................................................................................................................................ 23
2.3.11. Ethernet.................................................................................................................................................................................................. 23
2.3.12. COMe High-speed Interfaces Overview ...................................................................................................................................... 24
2.3.13. Storage Features ................................................................................................................................................................................ 25
2.3.14. BIOS/Software Features.................................................................................................................................................................. 25
2.3.15. COMe Features .................................................................................................................................................................................... 26
2.3.16. Kontron Features................................................................................................................................................................................ 26
2.4. Electrical Specification .......................................................................................................................................................................... 27
2.4.1. Power Supply Voltage Specifications ............................................................................................................................................ 27
2.4.2. Power Management ........................................................................................................................................................................... 27
2.4.3. Power Supply Control Settings ....................................................................................................................................................... 28
2.4.4. Power Supply Modes.......................................................................................................................................................................... 28
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COMe-cKL6 – User Guide, Rev 1.0
2.4.5. Single Supply Mode ............................................................................................................................................................................. 29
2.5. Thermal Management ........................................................................................................................................................................... 30
2.6. Environmental Specification................................................................................................................................................................ 32
2.6.1. Temperature........................................................................................................................................................................................... 32
2.6.2. Humidity .................................................................................................................................................................................................. 32
2.7. Standards and Certifications ............................................................................................................................................................... 33
2.8. Mechanical Specification ...................................................................................................................................................................... 34
2.8.1. Dimensions ............................................................................................................................................................................................. 34
2.8.2. Height ....................................................................................................................................................................................................... 34
2.8.3. Heatspreader Dimension .................................................................................................................................................................. 35
3/
Features and Interfaces .................................................................................................................................................................. 36
3.1. LPC ................................................................................................................................................................................................................. 36
3.2. Serial Peripheral Interface (SPI).......................................................................................................................................................... 36
3.2.1. SPI Boot .................................................................................................................................................................................................... 37
3.2.2. Using an External SPI Flash .............................................................................................................................................................. 37
3.2.3. External SPI flash on Modules with Intel® ME ........................................................................................................................... 38
3.3. Fast I2C........................................................................................................................................................................................................ 38
3.4. UART ............................................................................................................................................................................................................ 38
3.5. Dual Staged Watchdog Timer (WTD) ................................................................................................................................................ 38
3.5.1. WDT Signal .............................................................................................................................................................................................. 39
3.6. Real Time Clock (RTC) ............................................................................................................................................................................ 39
3.7. Trusted Platform Module (TPM 2.0) ................................................................................................................................................. 39
3.8. Kontron Security Solution .................................................................................................................................................................... 40
3.9. Speedstep® Technology ........................................................................................................................................................................40
3.10. Intel® Optane™ Memory ..................................................................................................................................................................... 40
4/
System Resources..............................................................................................................................................................................41
4.1. Interrupt Request (IRQ) Lines ...............................................................................................................................................................41
4.2. Memory Area .............................................................................................................................................................................................41
4.3. I/O Address Map ...................................................................................................................................................................................... 42
4.4. Peripheral Component Interconnect (PCI) Devices ..................................................................................................................... 43
4.5. I2C Bus......................................................................................................................................................................................................... 43
4.6. System Management (SM) Bus ..........................................................................................................................................................44
5/
COMe Interface Connectors (X1A and X1B) ............................................................................................................................... 45
5.1. X1A and X1B Signals ................................................................................................................................................................................. 45
5.2. X1A and X1B Pin Assignment ................................................................................................................................................................ 46
5.2.1. Connector X1A Row A1 – A110 ........................................................................................................................................................... 47
5.2.2. Connector X1A Row B 1 - B 110 ......................................................................................................................................................... 50
5.2.3. Connector X1B Row C 1 - C 110 .......................................................................................................................................................... 53
5.2.4. Connector X1B Row D 1 - D 110 ......................................................................................................................................................... 56
6/
uEFI BIOS............................................................................................................................................................................................... 59
6.1. Starting the uEFI BIOS ............................................................................................................................................................................. 59
6.2. Setup Menus ............................................................................................................................................................................................. 60
6.2.1. Main Setup Menu ................................................................................................................................................................................... 61
6.2.2. Advanced Setup Menu........................................................................................................................................................................ 63
6.2.3. Chipset Setup Menu ............................................................................................................................................................................ 74
6.2.4. Security Setup Menu ........................................................................................................................................................................... 83
6.2.5. Boot Setup Menu ..................................................................................................................................................................................84
6.2.6. Save and Exit Setup Menu................................................................................................................................................................. 85
6.3. The uEFI Shell............................................................................................................................................................................................ 86
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COMe-cKL6 – User Guide, Rev 1.0
6.3.1. Basic Operation of the uEFI Shell .................................................................................................................................................... 86
6.4. uEFI Shell Scripting ................................................................................................................................................................................. 87
6.4.1. Startup Scripting ................................................................................................................................................................................... 87
6.4.2. Create a Startup Script ....................................................................................................................................................................... 87
6.4.3. Examples of Startup Scripts ............................................................................................................................................................ 87
6.5. Firmware Update .....................................................................................................................................................................................88
6.5.1. Updating Procedure .............................................................................................................................................................................88
Appendix A: List of Acronyms...................................................................................................................................................................... 89
About Kontron ................................................................................................................................................................................................... 91
List of Tables
Table 1: Pin Assignment of Type 6 and COMe-cKL6..............................................................................................................................14
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)................................................................ 15
Table 3: Product Accessories-COMe-cKL6 .............................................................................................................................................. 16
Table 4: COMe Type 6 Accessories ............................................................................................................................................................. 16
Table 5: General Accessories........................................................................................................................................................................ 16
Table 6: Memory Modules - COMe-cKL6 .................................................................................................................................................. 17
Table 7: Processor Specifications ............................................................................................................................................................... 19
Table 8: Premium PCH COM Interface Usage ......................................................................................................................................... 24
Table 9: Base PCH COM Interface Usage ................................................................................................................................................. 25
Table 10: Heatspreader Test Temperature Specifications ................................................................................................................ 30
Table 11: 3-Pin Fan Connector Pin Assignment ...................................................................................................................................... 31
Table 12: Electrical Characteristics of the Fan Connector .................................................................................................................. 31
Table 13: Temperature Grade Specifications ......................................................................................................................................... 32
Table 14: Humidity Specification ................................................................................................................................................................ 32
Table 15: Standards and Certification Compliance ............................................................................................................................... 33
Table 16: Supported BIOS Features ........................................................................................................................................................... 36
Table 17: SPI Boot Pin Configuration ......................................................................................................................................................... 37
Table 18: Supported SPI Boot Flash Types for 8-SOIC Package....................................................................................................... 37
Table 19: Dual Stage Watchdog Timer- Time-out Events.................................................................................................................. 39
Table 20: Interrupt Requests ........................................................................................................................................................................41
Table 21: Designated Memory Locations ..................................................................................................................................................41
Table 22: Designated I/O Port Address Ranges .................................................................................................................................... 42
Table 23: I2C Bus Addresses ........................................................................................................................................................................ 43
Table 24: SMBus Addresses ........................................................................................................................................................................44
Table 25: General Signal Description ........................................................................................................................................................ 46
Table 26: Connector X1A Row A Pin Assignment (A1- A110) .............................................................................................................. 47
Table 27: Connector X1A Row B Pin Assignment (B1-B110) ............................................................................................................... 50
Table 28: Connector X1B Row C Pin Assignment (C1-C110) ............................................................................................................... 53
Table 29: Connector X1B Row C Pin Assignment (D1-D110)............................................................................................................... 56
Table 30: Navigation Hot Keys Available in the Legend Bar ............................................................................................................. 59
Table 31: Main Setup Menu Sub-screens ................................................................................................................................................ 62
Table 32: Advanced Setup menu Sub-screens and Functions ......................................................................................................... 63
Table 33: Chipset Set > System Agent Configuration Sub-screens and Functions ................................................................... 74
Table 34: Chipset Set > PCH-IO Configuration Sub-screens and Functions .................................................................................77
Table 35: Security Setup Menu Functions ............................................................................................................................................... 83
Table 36: Boot Setup Menu Functions......................................................................................................................................................84
Table 37: Save and Exit Setup Menu Functions ..................................................................................................................................... 85
Table 38: List of Acronyms........................................................................................................................................................................... 89
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COMe-cKL6 – User Guide, Rev 1.0
List of Figures
Figure 1: Block Diagram COMe-cKL6 ..........................................................................................................................................................18
Figure 2: Module Dimensions ...................................................................................................................................................................... 34
Figure 3: Module Height ................................................................................................................................................................................ 34
Figure 4: Heatspreader Location and Dimensions ............................................................................................................................... 35
Figure 5: X1A and X1B COMe Interface Connectors .............................................................................................................................. 45
Figure 6: Main Setup Menu Information Initial Screens ...................................................................................................................... 61
Figure 7: Advance Setup Menu Initial Screen ......................................................................................................................................... 63
Figure 8: Chipset>System Agent Configuration Initial Screen.......................................................................................................... 74
Figure 9: PCH-IO Configuration Menu Initial Screen .............................................................................................................................77
Figure 10: Security Setup Menu Initial Screen ........................................................................................................................................ 83
Figure 11: Boot Setup Menu Initial Screen................................................................................................................................................84
Figure 12: Save and Exit Setup Menu Initial Screen .............................................................................................................................. 85
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COMe-cKL6 – User Guide, Rev 1.0
1/ Introduction
1.1. Product Description
The COMe-cKL6 is a basic form factor COM Express® type 6 Computer-On-Module based on the 7th Generation Intel®
Core™ and Celeron processors, with integrated chipset known as Kaby Lake-U in this user guide. The COMe-cKL6
combines increased efficiency and performance with TDP as low as 7.5 W, and no more then 15 W, with Intel’s®
extensive HD Graphics capabilities.
Basic COMe-cKL6 features are:

Intel® 7th Generation Core™ series, Kaby Lake-U family with integrated chipset

Up to 24 GByte DDR4-2133 (8 GByte memory down)

High-speed connectivity includes 5x PCIe 3.0, 1x PEG x16, 4x USB 3.0(incl. USB 2.0) + 4x USB 2.0, and 2x SATA

TPM2.0 and built-in hardware security device
1.2. Product Naming Clarification
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a super component. The product names for Kontron COM Express® Computer-on-Modules
consist of:

Short form of the industry standard



Module form factor

b=basic (125 mm x 95 mm)

c=compact (9 5mm x 95 mm)

m=mini (84 mm x 55 mm)
Intel’s® processor code name



COMe-
KL = Kaby Lake
Pinout type

Type 6

Type10
Available temperature variants

Commercial

Extended (E1)

Industrial (E2)

Screened industrial (E2S) and Rapid shutdown screened industrial (R E2S)

Processor Identifier

Chipset identifier (if chipset assembled)

Memory size

Memory Down + DIMM memory (#GB) / eMMC SLC memory (#S)
1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. The COM Express
document is available at the PICMG® website.
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COMe-cKL6 – User Guide, Rev 1.0
1.4. COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220-pin connector. Each connector has two rows
called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-OnModules feature the following maximum amount of interfaces according to the PICMG module pinout type:
Table 1: Pin Assignment of Type 6 and COMe-cKL6
Feature
Type 6 Pinout
COMe-cKL6 Pinout
HD Audio
1x
1x
Gbit Ethernet
1x
1x
Serial ATA
4x
2x (optional 3rd port)
PCI Express x 1
8x
5x
PCI Express x16 (PEG)
1x
1x
USB Client
1x
1x
USB
4x USB 3.0 (Incl. USB 2.0)
+ 4x USB 2.0
4x USB 3.0 (Incl. USB 2.0)
+ 4x USB 2.0
VGA
1x
LVDS (eDP)
Dual Channel
Dual Channel LVDS with option to overlay
with embedded display port (eDP)
DP++ (DP/HDMI/DVI)
3x
2x
LPC
1x
1x
External SMB
1x
1x
External I2C
1x
1x
GPIO
8x
8x
SDIO shared w/GPIO
1x optional
1x optional
UART (2-wire COM)
2x
2x
FAN PWM out
1x
1x
Express Card
2x
2x
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and
feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each
COM is based on the COM Express® specification. This standardization allows designers to create a single-system
baseboard that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s
packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
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COMe-cKL6 – User Guide, Rev 1.0
2/ Product Specification
2.1. Module Variants
The COMe-cKL6 is available in different processor and temperature variants to cover demands in performance, price
and power.
2.1.1. Commercial Grade Modules (0°C to +60°C)
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)
Product Number
Product Name
Description
36022-8032-28-7
COMe-cKL6 i7-7600U 8GB/32S
COM Express® compact pin-out type 6 Computeron-Module with Intel® Core™ i7-7600U, 2x2.8GHz,
8GB memory down, DDR4 SO DIMM Socket, 32GB
eMMC (SLC)
36022-8000-28-7
COMe-cKL6 i7-7600U 8GB
COM Express® compact pin-out type 6 Computeron-Module with Intel® Core™ i7-7600U, 2x2.8GHz,
8GB memory down, DDR4 SO DIMM Socket
36022-0000-28-7
COMe-cKL6 i7-7600U
COM Express® compact pin-out type 6 Computeron-Module with Intel® Core™ i7-7600U, 2x2.8GHz,
DDR4 SO DIMM Socket
36022-4000-26-5
COMe-cKL6 i5-7300U 4GB
COM Express® compact pin-out type 6 Computeron-Module with Intel® Core™ i5-7300U, 2x2.6GHz,
4GB memory down, DDR4 SO DIMM Socket
36022-0000-26-5
COMe-cKL6 i5-7300U
COM Express® compact pin-out type 6 Computeron-Module with Intel® Core™ i5-7300U, 2x2.6GHz,
DDR4 SO DIMM Socket
36022-0000-24-3
COMe-cKL6 i3-7100U
COM Express® compact pin-out type 6 Computeron-Module with Intel® Core™ i3-7100U, 2x2.4GHz,
DDR4 SO DIMM Socket
36022-0000-22-2
COMe-cKL6 3965U
COM Express® compact pin-out type 6 Computeron-Module with Intel® Celeron 3965U, 2x2.2GHz,
DDR4 SO DIMM Socket
2.1.2. Extended Temperature Grade Modules (E1, 25°C to 75°C)
Extended Temperature grade modules (E1, -25°C to 75°C) are available as a standard product number, on request. For
further information, contact your local Kontron sales representative or Kontron Inside Sales.
2.1.3. Industrial Temperature Grade Modules (E2S, 40°C to 85°C)
Industrial temperature grade modules (E2S, -40°C to 85°C) are available as a project based custom part number. For
further information, contact your local Kontron sales representative or Kontron Inside Sales.
www.kontron.com
// 15
COMe-cKL6 – User Guide, Rev 1.0
2.2. Accessories
Accessories are either COMe-cKL6 product specific, type 6 COMe pinout specific, or general accessories including
memory modules. For more information, contact your local Kontron sales representative or Kontron Inside Sales.
Table 3: Product Accessories-COMe-cKL6
Part Number
Heatspreader (validated ref.types)
Description
36021-0000-99-0
HSP COMe-cSL6/cKL6, thread
Heatspreader for COMe-cKL6, threaded
mounting holes
36021-0000-99-1
HSP COMe-cSL6/cKL6, through
Heatspreader for COMe-cKL6, through holes
Table 4: COMe Type 6 Accessories
Part Number
COMe Carrier
Project Code
Description
38114-0000-00-0
COM Express® Reference Carrier
Type 6
ADAS
mITX carrier with 8 mm
COMe connector
38106-0000-00-0
COM Express® Eval Carrier
Type 6
Topanga
Canyon
ATX carrier with 5 mm
COMe connector
38115-0000-00-x
COM Express® Reference Carrier
-i Type 6
ADTI
Thin-mITX carrier with 5 mm COMe
connector
Part Number
COMe Adapter / Card
Project Code
Description
96007-0000-00-3
ADA-PCIe-DP
APDP
PCIe x16 to DP Adapter for
Evaluation Carrier
96007-0000-00-7
ADA-Type6-DP3
DVO6
(Sandwich) Adapter Card for 3x
Displayport
96006-0000-00-2
COMe POST T6
NFCB
POST Code / Debug Card
38019-0000-00-0
ADA-COMe-Height-dual
EERC
Height Adapter
Part Number
COMe Starter Kit
Project Code
Description
38114-0000-00-S
COMe Ref. Starter kit T6
ADAS
Starter kit with COMe Reference
Carrier T6
38106-0000-00-S
COMe Eval Starter kit T6
Topanga
Canyon
Starter kit with COMe Evaluation
Carrier T6
Table 5: General Accessories
Part Number
Cooling Solutions
Description
36099-0000-99-0
COMe Active Uni cooler
For CPUs up to 20 W TDP, to be mounted on HSP
36099-0000-99-1
COMe Passive Uni Cooler
For CPUs up to 10 W TDP, to be mounted on HSP
Part Number
Mounting
Description
38017-0000-00-5
COMe Mount KIT 5 mm 1 set
Mounting Kit for 1 module including screws for
5 mm connectors
38017-0100-00-5
COMe Mount KIT 5 mm 100 sets
Mounting Kit for 100 modules including screws for
5 mm connectors
38017-0000-00-0
COMe Mount KIT 8 mm 1 set
Mounting Kit for 1 module including screws for
8 mm connectors
38017-0100-00-0
COMe Mount KIT 8 mm 100 sets
Mounting Kit for 100 modules including screws for
8 mm connectors
www.kontron.com
// 16
COMe-cKL6 – User Guide, Rev 1.0
Part Number
Display Adapters
Description
96006-0000-00-8
ADA-DP-LVDS
DP to LVDS adapter
96082-0000-00-0
KAB-ADAPT-DP-DVI
DP to DVI adapter cable
96083-0000-00-0
KAB-ADAPT-DP-VGA
DP to VGA adapter cable
96084-0000-00-0
KAB-ADAPT-DP-HDMI
DP to HDMI adapter cable
Part Number
Cables
Description
96079-0000-00-0
KAB-HSP 200 mm
Cable adapter to connect fan to module
(COMe basic/compact)
96079-0000-00-2
KAB-HSP 40 mm
Cable adapter to connect fan to module
(COMe basic/compact)
Table 6: Memory Modules - COMe-cKL6
Part Number
Memory (validated ref. types)
Description
97017-4096-24-0
DDR4-2400 SODIMM 4 GB_COM
DDR4-2400, 4GB, 260P, 1200MHz, PC4-2400
SODIMM
97017-8192-24-0
DDR4-2400 SODIMM 8 GB_COM
DDR4-2400, 8GB, 260P, 1200MHz, PC4-2400
SODIMM
97017-1600-24-0
DDR4-2400 SODIMM 16 GB_COM
DDR4-2400, 16GB, 260P, 1200MHz, PC4-2400
SODIMM
97017-4096-24-2
DDR4-2400 SODIMM 4 GB E2_COM
DDR4-2400, 4GB, E2, 260P, 1200MHz, PC42400 SODIMM
97017-8192-24-2
DDR4-2400 SODIMM 8 GB E2_COM
DDR4-2400, 8GB, E2, 260P, 1200MHz, PC42400 SODIMM
97017-1600-24-2
DDR4-2400 SODIMM 16 GB E2_COM
DDR4-2400, 16GB, E2, 260P, 1200MHz, PC42400 SODIMM
The COMe-cKL6 supports memory module with a maximum bus frequency of 2133 MHz.
The memory modules above can support bus frequencies up to 2400 MHz but have been
validated for the COMe-cKL6 at a reduced bus frequency of 2133 MHz.
www.kontron.com
// 17
COMe-cKL6 – User Guide, Rev 1.0
2.3. Functional Specification
2.3.1. Block Diagram COMe-cKL6
The following figure displays the system block diagram applicable to all COMe-cKL6 modules.
Figure 1: Block Diagram COMe-cKL6
COM Express® connector CD – Pinout Type 6
2x DP++
VCC
2x CSI2
eDP2LVDS
eDP x2
PTN3460(i)
PEG #0-3
DDR4 SODIMM
SMB
Gen9
iGFX
SPD
USB #0-3
DDR4
Intel® 7th Generation Core
(USB3.0)
Kabylake U-Series i7/i5/i3/Celeron
Premium and Base PCH integrated
xHCI
EHCI
SDIO
LVDS
Security
Chip
USB #8
(USB 2.0)
USB #0-3
eMMC
5.0
(USB2.0)
HWM
SPD
USB #4-7
FAN1
(USB 2.0)
SMB
SATA#0-1
LPC
GP
SPI
GPIO/SDIO
Switch
EEPROM
PWM
FAN2
PCIe #0-3
PCIe #4
TPM
eSPI
UART
GPIO
Ctrl
Mgmt
NCT7802
PCIe #5
HDA
S5eco
eMMC
GBLan
2-64GB
Intel® I219LM
SPI
GPIO
I2C
LPC2I2C
Watchdog
GPIO Buffer
UART
Embedded Controller
SPI
BIOS Flash
GB LAN
(MAX 2/5/10)
Power sequencing
PwrCtrl
SysMgmt
VBAT
LID
Sleep
GPIO
SER0
or
SER1
SDIO
5VSB
VCC
HWM
I2C
COM Express® connector AB – Pinout Type 6
Standard
component
www.kontron.com
Connector
Option
// 18
COMe-cKL6 – User Guide, Rev 1.0
2.3.2. Processor
The Intel® 7th Generation Kaby Lake – U product series of Intel® Core™ and Celeron® processors uses the 14 nm
processor technology with 42 mm x 24 mm package size and BGA 1356.
General processor specifications shared by the Intel® Core™ and Celeron® processor variants are:

Intel® 64 Architecture

Idle States

Intel® Virtualization Technology (VT-x)

Virtualization Technology for Directed I/O (VT-d)

Enhanced Intel Speedstep® Technology

Thermal Monitoring Technology

Intel® AES New Instructions (AES-NI)

Secure Key

OS Guard

Execute Disable Bit
The following table lists the general Intel® Core™ and Celeron®, Kaby Lake – U processor specifications.
Not all the items specified above are compatible with the COMe-cKL6 functional
specification. For more information on features supported by the COMe-cKL6, see the
relevant subheading in Chapter 2.3 Functional Specification.
Table 7: Processor Specifications
Intel® Kaby lake-U
Processor
Core™
i7 –7600U
i5-7300U
i3-7100U
3965U
# of Cores
2
2
2
2
# of Threads
4
4
4
2
Processor Base Frequency
2.8 GHz
2.6 GHz
2.4 GHz
2.2 GHz
Max Turbo Frequency
3.9 GHz
3.5 GHz
Thermal Design Power (TDP)
15 W
15 W
15 W
15 W
TDP-down (Configurable)
7.5 W
7.5 W
7.5 W
10 W
Cache
4 MB
SmartCache
3 MB
SmartCache
3 MB
SmartCache
2 MB
SmartCache
Memory Types
DDR4-2133
LPDDR3-1866
DDR3L-1600
DDR4-2133
LPDDR3-1866
DDR3L-1600
DDR4-2133
LPDDR3-1866
DDR3L-1600
DDR4-2133
LPDDR3-1866
DDR3L-1600
Max.# Mem.Channels
2
2
2
2
Max. Memory Size
32 GB
32 GB
32 GB
32 GB
Max. Memory Bandwidth
34.1 GB/s
34.1 GB/s
34.1 GB/s
34.1 GB/s
ECC Memory
Not Supported
Not supported
Not supported
Not supported
HD Graphics
HD Graphics 620
HD Graphics 620
HD Graphics 620
HD Graphics 610
PCIe Express Configurations
1x4, 2x2, 4x1,
1x2+2x1,
1x4, 2x2, 4x1,
1x2+2x1,
1x4, 2x2, 4x1,
1x2+2x1,
1x4, 2x2, 4x1,
1x2+2x1,
Max. # PCIe Lanes
12
12
12
10
www.kontron.com
Core™
Core™
Celeron®
// 19
COMe-cKL6 – User Guide, Rev 1.0
2.3.3. Platform Controller Hub
The Intel® Kaby Lake -U processor series includes an integrated chipset with the Intel® Platform Controller Hub (PCH).
The following table lists specific PCH features.
Intel® Optane™
Supported
Rapid Storage Technology (RST)
Supported
USB
4x USB 3.0 (Including USB 2.0)
4x USB 2.0
VT-d
Supported
SATA RAID
Supported
2.3.4. System Memory
The system memory supports two memory channels with DDR4-2133 SO-DIMM sockets for a maximum of up to
24 GByte of non ECC memory comprising of 8 GByte soldered down memory and up to 16 GBytes DDR4-2133 non ECC
memory.modules.
The following table lists specific system memory features.
Socket
1x External DDR4-2133 SO-DIMM
Memory Type
Channel 1: DDR4-2133 SO-DIMM up to 16 GB non ECC
Channel 2: 8GByte memory down non ECC
Memory Module Size
4 GBytes, 8 GByte and 16 GByte
Bandwidth
34.1 GB/s at 2133 MT/s
In general, memory modules have a much lower longevity than embedded motherboards, and therefore the EOL of
the memory modules may occur several times during the lifetime of the module. Kontron guarantees to maintain
memory modules by replacing EOL memory module with another qualified similar module.
As a minimum, it is recommend to use Kontron memory modules for prototype system(s) in order to prove the
stability of the system and as a reference.
For volume production, if required, test and qualify other types of RAM. In order to qualify RAM it is recommend to
configure three systems running a RAM Stress Test program in a heat chamber at 60°C, for a minimum of 24 hours.
For a list of Kontron memory modules, see Table 6: Memory Modules.
2.3.5. Graphics
2.3.5.1. Digital Display Interface
Up to three independent Digital Display Interfaces (DDIs) including (eDP) can be used simultaneously and in
combination, to implement an independent or cloned display configuration.
The standard DDIs are:

2x DP 1.2 (++) on DDI1, DDI2

1x eDP 1.4/LVDS
www.kontron.com
// 20
COMe-cKL6 – User Guide, Rev 1.0
2.3.5.2. Display Resolution
The following table lists the maximum display resolutions at a set frequency and bit per pixel (bpp) for the supported
display interfaces.
Display Interfaces
Maximum Resolution
eDP
4096 x 2304 (60 Hz, 24 bpp)
DP 1.2 ( ++)
4096 x 2304 (60 Hz, 24 bpp)
HDMI 1.4 ( native)
4096 x 2160 (24 Hz, 24 bpp)
HDMI 2.0 (via LS-Pcon)
4096 x 2160 (60 Hz, 24 bpp)
At 4K/UHD resolution, a DisplayPort redriver on the carrier is recommended to increase the
link margin.
2.3.6. LVDS
The embedded display port to LVDS bridge (eDP2LVDS) supports dual LVDS 18-bit or 24-bit channels.
The following table lists the basic LVDS features.
LVD Channels
2x
LVDS Bits / Pixel
18-bit; 24-bit
LVDS Maximum Resolution
Up to 1920 x 1200
PWM Backlight Control
I2C/PWM backlight support
Supported Panel Data
JILI2-3, EDI, VESA DID
2.3.7. Audio
Three independent HD Audio (HDA) streams can be supported simultaneously on HDMI/DP. The default for audio
support is over the Display Port (DP), with an additional option for baseboard audio via an external HDA codec
(Realtek ALC886) on the carrier board.
Supported Audio formats:

AC-3 Dolby Digital

Dolby Digital plus

DTS-HD

LPCM 192 kHz/ 24-bit, 8 channel

Dolby TrueHD, DTS-HD Master Audio (Lossless Blu-Ray Disc Audio format)
2.3.8. PCI Express (PCIE) Configuration
The COMe-cKL6 supports five general-purpose PCI Express lanes and one PCI Express Graphic (PEG) port with four
lanes.
2.3.8.1. General-Purpose PCI Express Lanes [0-7]
The COMe connector supports five general-purpose PCIe 3.0 lanes [PCIE0-PCIE4] with an optional sixth generalpurpose PCIe 3.0 lane on PCIE5 if LAN is not included. PCIe lane 6 and PCIe lane 7 are not connected.
www.kontron.com
// 21
COMe-cKL6 – User Guide, Rev 1.0
The following table lists the supported general-purpose PCI-Express lanes.
COMe Lane
PCH
High-speed
I/O Port #
PCH I/O
Function
Comments
PCIE0
5
PCIe #1
PCIE1
6
PCIe #2
PCIE2
7
PCIe #3
PCIE3
8
PCIe #4
PCIE4
10
PCIe #6
PCIE5
9 / NC
PCIe #5
PCIE6
NC
Not available
PCIE7
NC
Not available
PCH HSIO port 9 without Ethernet
NC with Ethernet
2.3.8.2. PCI Express Graphics x16 (PEG) Port
One PCI Express Graphics x 16 (PEG) port is available on the COMe connector. For Premium PCH, PCIe lanes PCIE[9-12]
from the Kaby lake –U PCH are connected to PEG [0-3].
If Base PCH is implemented, then only PCIe lanes PCIE[9-10] from the Kaby lake-U PCH are connected to PEG[0-1]. For
more information, see Chapter 2.3.12 COMe High-speed Interface Overview.
The following table lists the Premium PCI-Express Graphics x 16 (PEG) Port configuration.
COMe
PEG #
PCH I/O
Lane 0
PCIe #9
Lane 1
PCIe #10
Lane 2
PCIe #11
Lane 3
PCIe #12
Lane 4
NC
Lane 5
NC
Lane 6
NC
Lane 7
NC
Lane 8
NC
Lane 9
NC
Lane 10
NC
Lane 11
NC
Lane 12
NC
Lane 13
NC
Lane 14
NC
Lane 15
NC
www.kontron.com
Configuration 0
(1x4) Default
X1
Other Configurations
Contact Kontron Support if you require more information.
Not available
// 22
COMe-cKL6 – User Guide, Rev 1.0
2.3.9. USB
Both USB 3.0 ports and USB 2.0 ports are available, where USB 3.0 ports are backwards compatible with the USB 2.0
specification.
The following table lists the supported USB features.
USB Ports
4x USB 3.0 (Including USB 2.0)
4x USB 2.0
USB Over Current Signals
4x
USB Client Port
1x (optional for all COMe-types)
The following table lists the COMe connector port and PCH port USB 3.0 and USB 2.0 port combinations.
COMe Port
PCH High-speed
I/O Port #
PCH I/O
Function USB
3.0
PCH I/O
Function USB
2.0
Comments
USB0
1
USB3_1
USB2_1
SuperSpeed USB 3.0/2.0
USB1
2
USB3_2
USB2_2
USB2
3
USB3_3
USB2_3
USB3
4
USB3_4
USB2_4
USB4
USB2_5
USB5
USB2_6
USB6
USB2_7
USB7
USB2_8
USB 2.0 exclusive
2.3.10. SATA
The SATA high-speed storage interface supports two SATA Gen3 ports with transfer rates of up to 6 Gb/s. A third
SATA port can be provided on customer request. If the third SATA port is implemented, PEG#3 is not available
The following table lists the COMe connector port and PCH port SATA combinations.
COMe Port
PCH High-speed
I/O Port #
PCH I/O
Function
Comments
SATA0
11
SATA#0
SATA Gen3, 6Gb/s
SATA1
12
SATA#1A
SATA Gen3, 6Gb/s
SATA2
NC / (Optional 16)
NC / SATA#2
Optional SATA#2 connecting to port 16
SATA3
NC
NC
NC
2.3.11. Ethernet
Ethernet connectivity is achieved via a single-port integrated physical layer (PHY) supporting Ethernet Media
Dependent Interfaces [0-3]. The high-speed I/O port 9 is used for the optional Ethernet connection. For more
information, see Chapter2.3.12 COMe High-speed Interfaces Overview.
The following table lists the supported Ethernet features.
Ethernet
10 Base-T/100 Base-TX and 1000 Base-T
Ethernet Controller
Intel® I219LM
www.kontron.com
// 23
COMe-cKL6 – User Guide, Rev 1.0
Additional features of the Ethernet controller are:

Intel® vPRO™

Energy Efficient Ethernet (IEEE 802.3az)

Intel® SIPP Server Operating System Support

Jumbo frames (up to 9 kB)

Reduced power consumption during normal operation

Integrated Intel® Auto Connect battery Saver (ACBS)
If the LAN-Cable is disconnected, the ULP (Ultra Low Power) driver featured in Windows 10
can cause undefined LED behavior. To disable ULP use the “Intel ULPenable-Utility 1.3”.
For more information refer to the EMD Customer Section or contact Kontron Support.
2.3.12. COMe High-speed Interfaces Overview
An over view of the COMe high-speed interfaces for PCH Premium and PCH base is provided in the following tables.
Table 8: Premium PCH COM Interface Usage
COMe
Port
PCH Highspeed I/O
Port#
PEG3/
SATA2
PCIe 3.0
SATA 3.0
16
PCIE#12
Optional
SATA#2
PEG2
15
PCIE#11
PEG1
14
PCIE#10
PEG0
13
PCIE#9
Supports
Rapid
Storage
Technology
and Intel®
Optane™
memory
SATA1
12
SATA#1A
SATA 3.0 (6 Gb/s)
SATA0
11
PCIE4
10
PCIE#6
GBE /
PCIE5
9
Optional
PCIE#5
PCIE3
8
PCIE#4
PCIE2
7
PCIE#3
PCIE1
6
PCIE#2
PCIE0
5
PCIE#1
USB3
4
USB3_4
USB2
3
USB3_3
USB1
2
USB3_2
USB0
1
USB 3_1
www.kontron.com
USB 3.0
LAN
Comment
Optional connection
of HSIO port 16 from
PEG3 to SATA#2
SATA#0
GBE
Onboard GBE or
optional PCIe #5 port
Default x1 configuration and
optional x2 and x4 configuration
SuperSpeed USB 3.0
// 24
COMe-cKL6 – User Guide, Rev 1.0
Table 9: Base PCH COM Interface Usage
COMe
Port
PCH Highspeed I/O
Port#
USB 3.0
PCIe 3.0
PEG1
14
PCIE#10
PEG0
13
PCIE#9
SATA1
12
SATA0
11
PCIE4
10
PCIE#6
GBE /
PCIE5
9
Optional
PCIE#5
PCIE3
8
PCIE#4
PCIE2
7
PCIE#3
PCIE1
6
PCIE#2
PCIE0
5
PCIE#1
USB3
4
USB3_4
USB2
3
USB3_3
USB1
2
USB3_2
USB0
1
USB 3_1
SATA 3.0
LAN
Comment
PCIe 2.0
SATA #1A
SATA 3.0 (6 Gb/s)
SATA#0
SATA 3.0 (6 Gb/s)
GBE
Onboard GBE or
optional PCIe #5 port
Default x1 configuration and
optional x2 and x4 configuration
SuperSpeed USB 3.0
2.3.13. Storage Features
The following table lists the supported storage features.
On-board Storage
Optional up to 32 GB eMMC 5.0 with SLC Flash
SD Card Support
SDIO is shared with GPIO interface
Serial-ATA
2x SATA 6GB/s ( Optional, 3x SATA)
SATA AHCI
NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier
2.3.14. BIOS/Software Features
The following table lists the supported BIOS and software features.
BIOS EFI
AMI Aptio V UEFI
Software
KeAPI 3.0 for all supported OS
EFI Utilities to log and process module information (DMCM tools)
BIOS/EFI Flash utility for EFI Shell, Windows, Linux
BIOS/EFI utility for customers to implement Boot Logo
Operating System (OS)
Windows 10 (64-bit)
Linux 64 bit + LiveCD
VxWorks 7.x (64-bit)
www.kontron.com
// 25
COMe-cKL6 – User Guide, Rev 1.0
2.3.15. COMe Features
The following table lists the supported COM Express® features.
SPI
Boot from an external SPI
LPC
Supported
UART
2x UART (RX/TX)
LID Signals
Supported
Sleep Signals
Supported
Audio
HD Audio for external HAD codecs
SMBus
Supported
2.3.16. Kontron Features
The following table lists the supported Kontron specific product features.
External I2C Bus
Fast I2C, 100 KHz - 400 kHz, MultiMaster capable
Embedded API
KEAPI3
Custom BIOS Settings / Flash
Backup
Supported
Watchdog Support
Dual staged
External SIO
Supported on the base board
GPIO
8x GPIO shared with SDIO, configurable in BIOS setup options
Radip Shutdown
Not supported
www.kontron.com
// 26
COMe-cKL6 – User Guide, Rev 1.0
2.4. Electrical Specification
2.4.1. Power Supply Voltage Specifications
The COMe-cKL6 supports operation in both single supply power supply mode and ATX power supply mode.
Industrial temperature grade modules are validated for 12 V power supply only.
Commercial temperature grade modules support the wide range 8.5 V to 20 V power supply.
The following table lists the power supply specifications.
Supply Voltage Range (VCC)
8.5 V to 20 V
Supply Voltage (VCC)
12 V
Standby Voltage
5 V ± 5%
RTC
2.8 V to 3.47 V
5V Standby voltage is not mandatory for operation.
2.4.1.1. Power Supply Rise Time
The input voltage rise time is 0.1 ms to 20 ms from input voltage ≤10% to nominal VCC. To comply with the ATX
specification there must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of the DC input
voltage final set point.
2.4.1.2. Power Supply Voltage Ripple
The maximum power supply voltage ripple is 100 mV peak-to-peak at 0 MHz – 20 MHz.
2.4.2. Power Management
Power management options are available within the BIOS setup.
ACPI Settings
ACPI 5.0
Miscellaneous Power
Management
Supported in BIOS setup menu
Within the BIOS setup, If VCC power is removed, 5 V ±5 % can be applied to the V_5V_STBY pins to support the
following suspend-states:

Suspend to RAM (S3)

Suspend-to-disk / Hibernate (S4)

Soft-off state (S5)
The Wake-Up event (S0) requires VCC power, as the board is running.
www.kontron.com
// 27
COMe-cKL6 – User Guide, Rev 1.0
2.4.3. Power Supply Control Settings
The power Supply control settings are set in the BIOS and enable the module to shut down, rest and wake from
standby properly.
The following table lists the implemented power supply control settings.
Power Button
(PWRBTN#)
Pin
B12
To start the module using the power button, the PWRBTN# signal must be at
least 50 ms (50 ms ≤ t < 4 s, typical 400 ms) at low level (Power Button
Event). Pressing the power button for at least four seconds turns off power to
the module (Power Button Override).
Power Good
(PWR_OK)
Pin
B24
PWR_OK is internally pulled up to 3.3 V and must be at the high level to power
on the module. This can be driven low to hold the module from powering up as
long as needed. The carrier needs to release the signal when ready.
Low level prevents the module from entering the S0 state. A falling edge during
S0 will cause a direct switch to S5 (Power Failure).
Reset Button
(SYS_RESET#)
Pin
B49
When the SYS_RESET# pin is detected active (falling edge triggered), it allows
the processor to perform a “graceful” reset, by waiting up to 25 ms for the
SMBus to go idle before forcing a reset, even though activity is still occurring.
Once the reset is asserted, it remains asserted for 5 ms to 6 ms regardless of
whether the SYS_RESET# input remains asserted or not.
SM-Bus Alert
(SMB_ALERT#)
Pin
B15
With an external battery manager present and SMB_ALERT #connected, the
module always powers on even if the BIOS switch “After Power Fail” is set to
“Stay Off”.
2.4.4. Power Supply Modes
Setting the power supply controls enables the COMe-cKL6 to operating in either ATX power mode or in single power
supply mode.
2.4.4.1. ATX Mode
To start the module in ATX mode and power VCC, follow the steps below.
1.
Connect the ATX PSU with VCC and 5 VSB to set PWR_OK to low and VCC to 0 V.
2.
Press the power button to set the PWR_OK to high and power VCC.
The PS_ON# signal generated by SUS_S3# (A15) Indicates that the system is in the Suspend to RAM state. An inverted
copy of SUS_S3# on the carrier board may be used to enable non-standby power on a typical ATX supply. The input
voltage must always be higher than 5 V standby (VCC > 5 VSB) for Computer-On-Modules supporting a wide input
voltage range down to 8.5 V.
The following table lists the ATX mode settings.
State
PWRBTN#
PWR_OK
V5_StdBy
PS_ON#
VCC
G3
x
x
0V
x
0V
S5
high
low
5V
high
0V
S5 → S0
PWRBTN Event
low → high
5V
high → low
0 V→ VCC
S0
high
high
5V
low
VCC
x – Signals are not relevant for the specific power state. It makes no difference if the signal is connected or open.
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COMe-cKL6 – User Guide, Rev 1.0
2.4.5. Single Supply Mode
In single supply mode, without 5 V standby, the module starts automatically if VCC power is connected and Power
Good input is open or at the high level (internal pull up (PU) to 3.3 V).
PS_ON# is not used in single supply mode and the input voltage VCC range can be 8.5 V to 20 V.
To power on the module from S5 state, press the power button or reconnect VCC. Suspend/Standby states are not
supported in single supply mode.
The following table lists the single supply mode settings.
State
PWRBTN#
PWR_OK
V5_StdBy
VCC
G3
x/0V
x/0V
x/0V
0V
G3 → S0
high
open / high
open
connecting VCC
S5
high
open / high
open
VCC
S5 → S0
PWRBTN Event
open / high
open
reconnecting VCC
x – Signals are not relevant for the specific power state. It makes no difference if the signal is connected or open.
All ground pins must be connected to the carrier board’s ground plane.
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COMe-cKL6 – User Guide, Rev 1.0
2.5. Thermal Management
2.5.1. Heatspreader and Active or Passive Cooling Solutions
A heatspreader plate assembly is available from Kontron for the COMe-cKL6. The heatspreader plate assembly is
NOT a heat sink. The heatspreader works as a COM Express® standard thermal interface to be use with a heat sink or
external cooling devices.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under
worst-case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on
any spot of the heatspreader's surface according to the module specifications:

60°C for commercial temperature grade modules

75°C for extended temperature grade modules (E1)

85°C for industrial temperature grade modules by screening (E2S)
2.5.2. Active or Passive Cooling Solutions
Both active and passive thermal management approaches can be used with heatspreader plates. The optimum
cooling solution varies, depending on the COM Express® application and environmental conditions. Active or passive
cooling solutions provided from Kontron for the COMe-cKL6 are usually designed to cover the power and thermal
dissipation for a commercial temperature range used in housing with proper airflow. For more information
concerning possible cooling solutions, see Chapter 2.2 Accessories.
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly
The operating temperature defines two requirements:

Maximum ambient temperature with ambient being the air surrounding the module

Maximum measurable temperature on any spot on the heatspreader's surface
The heatspreader is tested for the following temperature specifications.
Table 10: Heatspreader Test Temperature Specifications
Temperature Specification
Validation Requirements
Commercial Grade
at 60°C HSP temperature the CPU @ 100% load needs to run at nominal
frequency
Extended Grade (E1)
at 75°C HSP temperature the CPU @ 75% load is allowed to start
speedstepping for thermal protection
Industrial Grade by screening (E2S)
at 85°C HSP temperature the CPU @ 50% load is allowed to start
throttling for thermal protection
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
www.kontron.com
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COMe-cKL6 – User Guide, Rev 1.0
2.5.5. On-Board Fan Connector
The modules 3-pin fan connector powers, controls and monitors a fan for chassis ventilation.
Table 11: 3-Pin Fan Connector Pin Assignment
Pin
Signal
Description
Type
1
Fan_Tach_IN#
Input voltage
I
2
V_FAN
Limited to a max. 12 V (±10%) across the whole input range
PWR
3
GND
Power GND
PWR
To connect a standard 3-pin connector fan to the module, use one of the following adaptor cables:

KAB-HSP 200 mm (PN 96079-0000-00-0)

KAB-HSP 40 mm (PN 96079-0000-00-2)
If the input voltage is below 13 V, the maximum supply current to the on-board fan connector is 350 mA. The
maximum supply current is limited to 150 mA if the input voltage is between 13 V and 20 V.
Always check the fan specification according to the limitations of the supply current and
supply voltage.
Table 12: Electrical Characteristics of the Fan Connector
Module Input Voltage
<13 V
13 V to 20 V
FAN Output Voltage
8.5 V to 13 V
12 V (±10%)
FAN Output Current
350 mA max.
150 mA
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COMe-cKL6 – User Guide, Rev 1.0
2.6. Environmental Specification
2.6.1. Temperature
Kontron defines the following temperature grades for Computer-On-Modules. For more information on the available
temperature grades for the COMe-cKL6, see Chapter 2.1 Module Variants.
Table 13: Temperature Grade Specifications
Temperature Grades
Operating
Non-operating / Storage
Commercial Grade
0°C to +60°C
-30°C to +85°C
Extended Grade E1
(custom)
-25°C to +75°C
-30°C to +85°C
Industrial Grade E2S
(by screening)
-40°C to +85°C
-40°C to +85°C
2.6.2. Humidity
Table 14: Humidity Specification
Humidity
Relative Humidity
www.kontron.com
93% at 40°C non-condensing (according to IEC 60068-2-78)
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COMe-cKL6 – User Guide, Rev 1.0
2.7. Standards and Certifications
The COMe-cKL6 complies with the following standards and certifications. For more information, contact Kontron
Support.
Table 15: Standards and Certification Compliance
Emission
(EMC)
EN55022:2019 Class B – test in progress
Information technology equipment, radio disturbance characteristics- limits and methods of
measurement
IEC 61000-6-3 – test in progress
EMC generic emissions standard for residential commercial and light industrial environments
Immunity
(EMI)
IEC / EN 61000-6-2: – test in progress
EMC generic standards immunity for industrial environments
Immunity tests:
IEC / EN 61000-4-2 - Electrostatic discharge immunity ESD
IEC / EN 61000-4-3 - Radiated field immunity
IEC / EN 61000-4-4 - Electrical fast transient/burst (EFT) burst
IEC / EN 61000-4-5 - Surge immunity
IEC / EN 61000-4-6 - Immunity to conducted disturbances
IEC / EN 61000-4-8 - Power frequency magnetic field Immunity
IEC / EN 61000-4-11 - Voltage dips, short interruptions, & voltage variation immunity
Safety
EN 62368-1 – test in progress
Safety for audio/video and information technology equipment
UL 60950-1 / CSA 60950-1
Information Technology Equipment Including Electrical Business Equipment
NWGQ2.E304278
NWGQ8.E304278
Shock
IEC / EN 60068-2-27
Non-operating shock – (half-sinusoidal, 11 ms, 15 g)
Vibration
IEC / EN 60068-2-6
Non-operating vibration – (sinusoidal, 10 Hz – 4000 Hz, +/- 0.15 mm, 2 g)
Theoretical
MTBF
System MTBF(hour)=561308 @ 40°C for the COMe-cKL6 i7-7600U 8GB32S
(Reliability report article number: 36022-8032-28-7)
System MTBF(hour)= 693231 @ 40°C for the COMe-cKL6 3965U
(Reliability report article number: 36022-0000-22-2
(RoHS II)
www.kontron.com
Compliant with the directive on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
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COMe-cKL6 – User Guide, Rev 1.0
2.8. Mechanical Specification
2.8.1. Dimensions
The dimensions of the module are:

95.0 mm x 95.0 mm (3.75 ” x 3.75 “)
Figure 2: Module Dimensions
*All dimensions shown in mm.
2.8.2. Height
The height of the module depends on the height of the implemented cooling solution. The height of the cooling
solution is not specified in the COM Express® specification.
The COM Express® specification defines a module height of approximately 13 mm from module PCB bottom to
heatspreader top, as shown in Figure 3: Module Height below.
Figure 3: Module Height
1
2
www.kontron.com
6
3
5
4
1
Heatspreader
4
Carrier Board PCB
2
Heatspreaader standoff(s)
5
Connector standoff(s) 5 or 8 mm
3
Module PCB
6
13 mm +/- 0.65 mm
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COMe-cKL6 – User Guide, Rev 1.0
2.8.3. Heatspreader Dimension
The following figure shows the heatspreader’s dimensions and location on the module.
Figure 4: Heatspreader Location and Dimensions
*All dimensions shown in mm.
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COMe-cKL6 – User Guide, Rev 1.0
3/ Features and Interfaces
3.1. LPC
The Low Pin Count (LPC) interface signals are connected to the LPC bus bridge located in the CPU or chipset. The LPC
low speed interface can be used for peripheral circuits such as an external Super I/O controller that typically
combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM
Express® specification. The COM Express® Design Guide maintained by PICMG provides implementation information
or refer to the official PICMG documentation for more information.
The LPC bus does not support DMA (Direct Memory Access). When more than one device is used on LPC, a zero delay
clock buffer is required. This leads to limitations for ISA bus and SIO (standard I/O(s) like floppy or LPT interfaces)
implementations.
All Kontron COM Express® Computer-On-Modules imply BIOS support for the following external baseboard LPC Super
I/O controller features for the Winbond/Nuvoton 3.3V 83627DHG-P.
Table 16: Supported BIOS Features
3.3V 83627DHG-P
AMI EFI APTIO V
PS/2
Not supported
COM1/COM2
Supported
LPT
Not supported
HWM
Not supported
Floppy
Not supported
GPIO
Not supported
Features marked as not supported do not exclude OS support (e.g., HWM is accessible via SMB). If any other LPC
Super I/O additional BIOS implementations are necessary then contact Kontron Support.
3.2. Serial Peripheral Interface (SPI)
The Serial Peripheral Interface Bus (SPI bus) is a synchronous serial data link standard. Devices communicate in
master/slave mode, where the master device initiates the data frame. Multiple slave devices are allowed with
individual slave select (chip select) lines. SPI is sometimes called a four-wire serial bus, contrasting with three, two
and one-wire serial buses.
The SPI interface can only be used with a SPI flash device to boot from the external BIOS on
the baseboard.
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COMe-cKL6 – User Guide, Rev 1.0
3.2.1. SPI Boot
The COMe-cKL6 supports boot from an external SPI Flash. Pin A34 (BIOS_DIS0#) and pin B88 (BIOS_DIS1#) configure
the SPI Flash as follows:
Table 17: SPI Boot Pin Configuration
Configuration
BIOS_DIS0#
BIOS_DIS1#
Function
1
open
open
Boot on module BIOS
2
GND
open
Not supported
3
open
GND
Boot on baseboard SPI
4
GND
GND
Not supported
BIOS does not support being split between two chips. Booting takes place either from the
module SPI or from the baseboard SPI.
Table 18: Supported SPI Boot Flash Types for 8-SOIC Package
Size
Manufacturer
Part Number
Device ID
16MB
Maxim
MX25L12835F
0x20
16MB
Winbond
W25Q128FV
0x40
16MB
Micron
N25Q128A
0xBA
3.2.2. Using an External SPI Flash
Initially, boot on the EFI Shell with an USB key containing the binary used to flash the SPI, plugged in on the system.
Depending on which SPI you would like to flash, you will need to use the (BIOS_DIS1#) jumper located on the COM
Express® carrier.
To flash the carrier or module Flash chip:
1.
Connect a SPI flash with the correct size (similar to BIOS binary (*.BIN) file size) to the carrier SPI interface.
2.
Open pin A34 (BIOS_DIS0#) and B88 (BIOS_DIS1#) to boot from the module BIOS.
3.
Turn on the system and make sure USB is connected then start the setup.
4.
Change two setup options.
5.
Save and exit setup.
6.
Reboot system into EFI shell.
7.
Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash.
8.
From the EFI shell, enter the name of the partition of your USB Key in this example; Hit FS0: then <enter>.
9.
Type FPT –SAVEMAC –F <biosname.BIN>
10. Wait until the program ends properly and then power cycle the whole system.
The system is now updated.
Depending on the state of the external SPI flash, the program may display up to two warning
messages printed in red. Do not stop the process at this point! After a few seconds of
timeout, flashing proceeds. For more information, refer to the EMD Customer Section.
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COMe-cKL6 – User Guide, Rev 1.0
3.2.3. External SPI flash on Modules with Intel® ME
If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another
module of the same type will cause the Intel® Management Engine (ME) to fail during the next start. This is due to the
design of the ME that bounds itself to every module the ME was flashed to previously. In the case of an external SPI
flash, this is the module present at flash time.
To avoid this issue, conduct a complete flash of the external SPI flash device after changing the COM Express®
module for another module. If disconnecting and reconnecting the same module again, this step is not necessary.
3.3. Fast I2C
Fast I2C supports transfer between components on the same board. The COMe-cKL6 features an onboard I2C
controller connected to the LPC Bus.
The I2C controller supports:

Multimaster transfers

Clock stretching

Collision detection

Interruption on completion of an operation
3.4. UART
The UART implements an interface for serial communications and supports up to two serial RX/TX ports defined in
the COM Express® specification on pins A98 (SERO_TX) /A99 (SERO_RX) for UART0 and pins A101 (SER1_TX)/A102
(SER1_RX) for UART1. The UART controller is fully 16550A compatible.
Features of the UART are:

On-Chip bit rate ( baud rate) generator

No handshake lines

Interrupt function to the host

FIFO buffer for incoming and outgoing data
3.5. Dual Staged Watchdog Timer (WTD)
A watchdog timer or (computer operating properly (COP) timer) is a computer hardware or software timer. If there is
a fault condition in the main program, the watchdog triggers a system reset or other corrective actions. The intention
is to bring the system back from the non-responsive state to normal operation.
Possible fault conditions are a hang or neglecting to service the watchdog regularly. Such as writing a “service pulse”
to it, also referred to as “kicking the dog”, “petting the dog”, “feeding the watchdog” or “triggering the watchdog”).
The COMe-cKL6 offers a watchdog that works with two stages that can be programmed independently and used
stage by stage.
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COMe-cKL6 – User Guide, Rev 1.0
Table 19: Dual Stage Watchdog Timer- Time-out Events
0000b
No action
The stage is off and will be skipped.
0001b
Reset
A reset restarts the module and starts a new POST and operating system.
0010b
NMI
A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be
ignored by standard interrupt masking techniques in the system. It is used typically
to signal attention for non-recoverable hardware errors.
0011b
SMI
A system management interrupt (SMI) makes the processor entering the system
management mode (SMM). As such, specific BIOS code handles the interrupt. The
current BIOS handler for the watchdog SMI currently does nothing. For special
requirements, contact Kontron Support.
0100b
SCI
A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS
using AML code.
0101b
Delay -> No
action*
Might be necessary when an operating system must be started and the time for the
first trigger pulse must be extended. Only available in the first stage.
1000b
WDT Only
This setting triggers the WDT pin on the baseboard connector (COM Express®
pin B27) only.
1001b
Reset + WDT
1010b
NMI + WDT
1011b
SMI + WDT
1100b
SCI + WDT
1101b
DELAY + WDT
-> No action*
3.5.1. WDT Signal
Watchdog time-out event (pin B27) on COM Express® connector offers a signal that can be asserted when a
watchdog timer has not been triggered with a set time. The WDT signal is configurable to any of the two stages. After
reset, the signal is automatically deasserted. If deassertion is necessary during runtime, ask Kontron Support for
further help.
3.6. Real Time Clock (RTC)
The RTC keeps track of the current time accurately. The RTC’s low power consumption means that the RTC can be
powered from an alternate source of power enabling the RTC to continue to keep time while the primary source of
power is off or unavailable.
The RTC battery voltage range is 2.8 V to 3.47 V. A typical RTC voltage is 3 V with a current of >10 μA. If the module is
powered by the mains supply the RTC voltage is generated by on-module regulators to reduce the RTC current draw.
3.7. Trusted Platform Module (TPM 2.0)
A Trusted Platform Module (TPM) stores RSA encryption keys specific to the host system for hardware
authentication. The term TPM refers to the set of specifications applicable to TPM chips. The LPC bus connects the
TPM chip to the CPU.
Each TPM chip contains an RSA key pair called the Endorsement Key (EK). The pair is maintained inside the chip and
cannot be accessed by software. The Storage Root Key (SRK) is created when a user or administrator takes ownership
of the system. This key pair is generated by the TPM based on the Endorsement Key and an owner-specified
password.
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COMe-cKL6 – User Guide, Rev 1.0
A second key, called an Attestation Identity Key (AIK) protects the device against unauthorized firmware and software
modification by hashing critical sections of firmware and software before they are executed. When the system
attempts to connect to the network, the hashes are sent to a server that verifies that they match the expected values.
If any of the hashed components have been modified since the last start, the match fails, and the system cannot gain
entry to the network.
3.8. Kontron Security Solution
Kontron Security Solution is a combined hardware and software solution that includes an embedded hardware
security module and a software framework to provide full protection for your application.
The COMe-cKL6 includes an integrated security module connected to USB2 port 9, supporting the following features:

Copy protection

IP protection

License model enforcement
If required customers can customize the solution to meet specific needs. For more information, contact Kontron
Support.
3.9. Speedstep® Technology
SpeedStep® technology enables the adaption of high performance computing to applications by switching
automatically between maximum performance mode and battery-optimized mode, depending on the needs of the
application. When powered by a battery or running in idle mode, the processor drops to lower frequencies (by
changing the CPU ratios) and voltage, thus conserving battery life while maintaining a high level of performance. The
frequency is automatically set back to the high frequency, allowing you to customize performance.
In order to use the Intel® Enhanced SpeedStep® technology the operating system must support SpeedStep ®
technology.
By deactivating the SpeedStep® feature in the BIOS, manual control or modification of the CPU performance is
possible. Setup the CPU Performance State in the BIOS Setup or use third party software to control the CPU
Performance States.
3.10. Intel® Optane™ Memory
Intel® Optane™ memory is an accelerator for systems with a 7th Gen Intel® Core™ processor. Intel® Optane™
combines the non-volatile 3D XPoint™ memory with advanced system controllers, and interface and software
enhancements to provide a caching solution to accelerate systems with high capacity workloads.
To support Intel® Optane™ or Rapid Storage Technology PCIe lanes [9-12] are connected to PEG[1-3] and used on a
M.2. socket. Due to the PCIe configuration options, the use of Intel® Optane™ memory is only possible with custom
BIOS.
www.kontron.com
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COMe-cKL6 – User Guide, Rev 1.0
4/ System Resources
4.1. Interrupt Request (IRQ) Lines
The following table specifies the device connected to each Interrupt line or if the line is available for new devices.
Table 20: Interrupt Requests
IRQ
General Usage
Project Usage
0
Timer
Timer
1
Keyboard
Keyboard (SuperIO)
2
Redirected secondary PIC
Redirected secondary PIC
3
COM2
COM2
4
COM1
COM1
5
LPT2/PCI devices
One of COM3+4
6
FDD
One of COM3+4 or not used
7
LPT1
LPT1 or one of COM3+4
8
RTC
RTC
9
SCI / PCI devices
Free for PCI devices
10
PCI devices
Free for PCI devices
11
PCI devices
Free for PCI devices
12
PS/2 mouse
Free for PCI devices
13
FPU
FPU
14
IDE0
Not used
15
IDE1
Not used
4.2. Memory Area
The following table specifies the usage of the address ranges within the memory area.
Table 21: Designated Memory Locations
Address Range (hex)
Size
Project Usage
00000000-0009FBFF
639 KB
Real mode memory
0009FC00-0009FFFF
1 KB
Extended BDA
000A0000-000BFFFF
128 KB
Display memory (legacy)
000C0000-000CBFFF
48 KB
VGA BIOS (legacy)
000CC000-000DFFFF
80 KB
Option ROM or XMS (legacy)
000E0000-000EFFFF
64 KB
System BIOS extended space (legacy)
000F0000-000FFFFF
64 KB
System BIOS base segment (legacy)
00100000-7FFFFFFF
128 MB
System memory (Low DRAM)
80000000-FFF00000
2 GB – 1 MB
PCI memory, other extensions (Low MMIO)
FEC00000-FEC00FFF
4 KB
IOxAPIC
FED00000-FED003FF
1 KB
HPET (Timer)
FED40000-FED40FFF
4KB
Always reserved for LPC TPM usage
FEE00000-FEEFFFFF
1MB
Local APIC region
FFFC0000-FFFFFFFF
256 KB
Mapping space for BIOS ROM/Boot vector
100000000-17FFFFFFF
2 GB
System memory (High DRAM)
180000000-F00000000
58 GB
High MMIO
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COMe-cKL6 – User Guide, Rev 1.0
4.3. I/O Address Map
The I/O port addresses are functionally identical to a standard PC/AT. All addresses not mentioned in this table
should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for
compatibility reasons, even if the I/O address is available.
Table 22: Designated I/O Port Address Ranges
I/O Address Range
General Usage
Project Usage
000-00F
DMA-Controller (Master) (8237)
DMA-Controller (Master) (8237)
020-021
024-025
028-029
Interrupt-Controller (Master) (8259)
Interrupt-Controller (Master) (8259)
02C-02D
030-031
034-035
038-039
03C-03D
02E-02F
SuperIO (Winbond)
External SuperIO (Winbond)
040-043
050-053
Programmable Interrupt Timer (8253)
Programmable Interrupt Timer (8253)
04E-04F
2nd SuperIO, TPM etc.
TPM
060, 064
KBD Interface-Controller (8042)
KBD Interface-Controller (8042)
061, 063
065, 067
NMI Controller
NMI Controller
062, 066
Embedded Microcontroller
Not used
070-071
RTC CMOS / NMI mask
RTC CMOS / NMI mask
072-073
RTC Extended CMOS
RTC Extended CMOS
080-083
Debug port
Debug port
0A0-0A1
0A4-0A5
0A8-0A9
Interrupt-Controller (Slave) (8259)
Interrupt-Controller (Slave) (8259)
0AC-0AD
0B0-0B1
0B4-0B5
0B8-0B9
0BC-0BD
0B2-0B3
APM control
APM control
0C0-0DF
DMA-Controller (Slave) (8237)(N/A)
Not used
0F0-0FF
FPU (N/A)
Not used
170-177
HDD-Controller IDE1 Master
Not used
1F0-1F7
HDD-Controller IDE0 Master
Not used
200-207
Gameport
Not used
220-22F
Soundblaster®
Not used
279
ISA PnP
ISA PnP
278-27F
Parallel port LPT2
Not used
295-296
Hardware monitor (Winbond default)
Reserved (If SuperIO present)
2B0-2BF
EGA
Not used
2D0-2DF
EGA
Not used
2E8-2EF
Serial port COM 4
Serial port COM4 (optional)
2F8-2FF
Serial port COM 2
Serial port COM2 from CPLD
300-301
MIDI
Not used
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COMe-cKL6 – User Guide, Rev 1.0
I/O Address Range
General Usage
Project Usage
300-31F
System specific peripherals
Not used
370-377
Floppy disk controller
Not used
376-377
HDD-Controller IDE1 Slave
Not used
378-37F
Parallel port LPT 1
LPT1 (If SuperIO present)
3BC-3BF
Parallel port LPT3
Not used
3C0-3CF
VGA/EGA
VGA/EGA
3D0-3DF
CGA
Not used
3E0-3E1
PCMCIA ExCA interface
Not used
3E8-3EF
Serial port COM3
Serial port COM3 (optional)
3F0-3F7
Floppy Disk Controller
Not used
3F6-3F7
HDD controller IDE0 Slave
Not used
3F8-3FF
Serial Port COM1
Serial port COM1
4D0-4D1
Interrupt-Controller (Slave)
Interrupt-Controller (Slave)
A80-A81
Kontron CPLD
Kontron CPLD control port
CF8
PCI configuration address
PCI configuration address
CF9
Reset control
Reset control
CFC-CFF
PCI configuration data
PCI configuration data
Other PCI device I/O addresses are allocated dynamically and not listed here. For more
information on how to determine I/O address usage, refer to the OS documentation.
4.4. Peripheral Component Interconnect (PCI) Devices
All devices follow the PCI 2.3 and PCI Express (PCIe) Base 1.0a specification. The BIOS and Operating Software (OS)
control the memory and I/O resources. For more details, refer to the PCI 2.3 specification.
4.5. I2C Bus
The following table provides the I2C address for devices connected to the I2C Bus.
Table 23: I2C Bus Addresses
I2C Address
Used For
58h
Available
Comment
No
Internally reserved
A0h
JIDA-EEPROM
No
Module EEPROM
AEh
FRU-EEPROM
No
Recommended for Baseboard EEPROM
www.kontron.com
// 43
COMe-cKL6 – User Guide, Rev 1.0
4.6. System Management (SM) Bus
The 8-bit SMBus address uses the LSB (Bit 0) for the direction of the device.

Bit0 = 0 defines the write address

Bit0 = 1 defines the read address
The 8-bit address listed below shows the write address for all devices. The 7-bit SMBus address shows the device
address without bit0.
Table 24: SMBus Addresses
8-bit
Address
7-bit
Address
Device
Comment
5Ch
A0h
2eh
HWM NCT7802Y
Do not use under any circumstances
50h
SPD DDR Channel 1 (SO-DIMM)
SMBus
SMB
SMB
A4h
52h
SPD DDR Channel 2 (SO-DIMM)
30h
18h
SO-DIMM Thermal Sensor
If available on the used memory-module
SMB
34h
1Ah
SO-DIMM Thermal Sensor channel 2
If available on the used memory-module
SMB
www.kontron.com
SMB
// 44
COMe-cKL6 – User Guide, Rev 1.0
5/ COMe Interface Connectors (X1A and X1B)
The COMe-cKL6 is a COM Express® compact module containing two 220-pin connectors; each with two rows called
row A & B on the primary connector and row C & D on the secondary connector.
The following figure is a view from the bottom of the module showing the position of interface connectors X1A and
X1B and the first pin of row A and row D
Figure 5: X1A and X1B COMe Interface Connectors
Pin
D1
X1B
X1A
Pin
A1
5.1. X1A and X1B Signals
For a description of the terms used in the X1A and X1B pin assignment tables, see the General Signals Description
table below or Appendix A, List of Acronyms. If a more detailed pin assignment description is required, refer to the
PICMG specification COMe Rev 2.1 Type 6 standard.
The information provided under type, module terminations and comments is complimentary
to the COM.0 Rev 2.1 Type 6 standard. For more information, contact Kontron Support.
www.kontron.com
// 45
COMe-cKL6 – User Guide, Rev 1.0
Table 25: General Signal Description
Type
Description
Type
Description
NC
Not Connected (on this product)
O-1,8
1.8 V Output
I/O-3,3
Bi-directional 3.3 V I/O-Signal
O-3,3
3.3 V Output
I/O-5T
Bi-dir. 3.3 V I/O (5 V Tolerance)
O-5
5 V Output
I/O-5
Bi-directional 5V I/O-Signal
DP-I/O
Differential Pair Input/Output
I-3,3
3.3 V Input
DP-I
Differential Pair Input
I/OD
Bi-directional Input/Output Open
Drain
DP-O
Differential Pair Output
I-5T
3.3 V Input (5 V Tolerance)
PU
Pull-Up Resistor
OA
Output Analog
PWR
Power Connection
OD
Output Open Drain
+ and -
Differential Pair
To protect external power lines of peripheral devices, make sure that: the wires have the
right diameter to withstand the maximum available current.
The enclosure of the peripheral device fulfills the fire-protection requirements of
IEC/EN60950.
5.2. X1A and X1B Pin Assignment
For more information regarding the pin assignment of connector X1A (Row A and Row B) and connector X1B (Row C
and Row D), see the pin assignment tables:

Table 26: Connector X1A Row A Pin Assignment (A1- A110)

Table 27: Connector X1A Row B Pin Assignment (B1-B110)

Table 28: Connector X1B Row C Pin Assignment (C1-C110)

Table 29: Connector X1B Row C Pin Assignment (D1-D110)
www.kontron.com
// 46
COMe-cKL6 – User Guide, Rev 1.0
5.2.1. Connector X1A Row A1 – A110
Table 26: Connector X1A Row A Pin Assignment (A1- A110)
Pin
COMe Signal
Description
Type
A1
GND
Power ground
PWR GND
A2
GBE0_MDI3-
Ethernet media dependent interface 3
DP-I/O
A3
GBE0_MDI3+
A4
GBE0_LINK100#
Ethernet controller speed indicator
OD
A5
GBE0_LINK1000#
A6
GBE0_MDI2-
Ethernet media dependent Interface 2
DP-I/O
A7
GBE0_MDI2+
A8
GBE0_LINK#
Ethernet controller link indicator
OD
A9
GBE0_MDI1-
Ethernet media dependent interface 1
DP-I/O
A10
GBE0_MDI1+
A11
GND
Power ground
PWR GND
A12
GBE0_MDI0-
Ethernet media dependent interface 0
DP-I/O
A13
GBE0_MDI0+
A14
GBE0_CTREF
Reference voltage for Carrier Board Ethernet
magnetics center tab. The reference voltage is
determined by the requirements of the module PHY
and may be as low as 0V and as high as 3.3V.
O
A15
SUS_S3#
Indicates system is in Suspend to RAM state. An
inverted copy of SUS_S3# on Carrier Board may be
used to enable non-standby power on a typical
ATX supply.
O-3.3
A16
SATA0_TX+
Serial ATA transmit data pair 0
DP-O
A17
SATA0_TX-
A18
SUS_S4#
Indicates system is in Suspend to Disk state.
O-3.3
A19
SATA0_RX+
Serial ATA receive data pair 0
DP-I
A20
SATA0_RX-
A21
GND
Power ground
PWR GND
A22
SATA2_TX+
Serial ATA transmit data pair 2
DP-O
A23
SATA2_TX-
A24
SUS_S5#
Indicates system is in Soft Off state.
O-3.3
A25
SATA2_RX+
Serial ATA receive data pair 2
DP-I
A26
SATA2_RX-
A27
BATLOW#
Provides a battery-low signal to the module to
indicate external battery is low
I-3.3
PU 10 KΩ, 3.3V
(S5)
Assertion prevents wake
from S3-S5 state
A28
ATA_ACT#
Serial ATA activity LED indicator
OD-3.3
PU 10 KΩ, 3.3V
(S0)
Can sink 15 mA
A29
HDA_SYNC
HD audio sync
O-3.3
PD 20 KΩ in PCH
A30
HDA_RST#
HD audio reset
O-3.3
PD 20 KΩ in PCH
A31
GND
Power ground
PWR GND
A32
HDA_CLK
HD audio bit clock output
O-3.3
PD 20 KΩ in PCH
A33
HDA_SDOUT
HD audio serial data out
O-3.3
PD 20 KΩ in PCH
A34
BIOS_DIS0#
BIOS selection straps to determine the BIOS boot
device
I-3.3
PU 10 KΩ,3.3V
(S5)
The Carrier should only
float these or pull them
low. PU might be
powered during suspend
A35
THRMTRIP#
Thermal trip Indicates CPU has entered thermal
shutdown
O-3.3
PU 10 KΩ, 3.3 V
(S0)
Thermal trip event
transition to S5 indicator
A36
USB6-
USB 2.0 data differential pair port 6
DP-I/O
A37
USB6+
PD 14.25 KΩ to
24.8 KΩ in PCH
A38
USB_6_7_OC#
USB overcurrent indicator port 6/7
I-3.3
PU 10 KΩ, 3.3 V
(S5)
www.kontron.com
Termination
Comment
1 uF capacitor to GND
PD 10 KΩ
PD 10 KΩ
// 47
COMe-cKL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
Termination
A39
USB4-
USB 2.0 data differential pair port 4
DP-I/O
A40
USB4+
PD 14.25 KΩ to
24.8 KΩ in PCH
A41
GND
Power ground
PWR GND
A42
USB2-
USB 2.0 data differential pair port 2
DP-I/O
A43
USB2+
PD 14.25 KΩ to
24.8 KΩ in PCH
A44
USB_2_3_OC#
USB overcurrent indicator port
I-3.3
PU 10 KΩ 3.3V
(S5)
A45
USB0-
USB data differential pairs port 0
DP-I/O
A46
USB0+
PD 14.25 KΩ to
24.8 KΩ in PCH
A47
VCC_RTC
Real Time Clock (RTC) circuit power input
PWR 3V
A48
EXCD0_PERST#
PCI ExpressCard reset port 0
O-3.3
PD 10 KΩ
A49
EXCD0_CPPE#
PCI ExpressCard capable card request port 0
I-3.3
PU 10 KΩ 3.3 V
(S0)
A50
LPC_SERIRQ
Serial interrupt request
I/OD-3.3
PU 8.2 KΩ,3.3 V
(S0)
A51
GND
Power ground
PWR GND
A52
PCIE_TX5+
PCI Express lane 5 transmit
DP-O
A53
PCIE_TX5-
A54
GPI0
General purpose input 0
I-3.3
A55
PCIE_TX4+
PCI Express lane 4 transmit
DP-O
A56
PCIE_TX4-
A57
GND
Power ground
PWR GND
A58
PCIE_TX3+
PCI Express lane 3 transmit
DP-O
A59
PCIE_TX3-
A60
GND
Power Ground
PWR GND
A61
PCIE_TX2+
PCI Express lane 2 transmit
DP-O
A62
PCIE_TX2-
A63
GPI1
General purpose input 1
I-3.3
A64
PCIE_TX1+
PCI Express lane 1 transmit
DP-O
A65
PCIE_TX1-
A66
GND
Power ground
PWR GND
A67
GPI2
General purpose input 2
I-3.3
A68
PCIE_TX0+
PCI Express lane 0 transmit
DP-O
A69
PCIE_TX0-
A70
GND
Power ground
PWR GND
A71
LVDS_A0+
LVDS channel A DAT0 or EDP Lane 2 transmit
DP-O
A72
LVDS_A0-
A73
LVDS_A1+
LVDS channel A DAT1 or EDP Lane 1 transmit
DP-O
A74
LVDS_A1-
A75
LVDS_A2+
LVDS channel A DAT2 or EDP Lane 0 transmit
DP-O
A76
LVDS_A2-
A77
LVDS_VDD_EN
LVDS or EDP panel power control
O-3.3
A78
LVDS_A3+
LVDS channel A DAT3 transmit
DP-O
A79
LVDS_A3-
A80
GND
Power ground
PWR GND
www.kontron.com
Comment
An open drain driver from
a USB current monitor on
the Carrier Board may
drive this line low. Do not
pull this line high on the
Carrier Board.
Voltage range
2.8 V to 3.47 V
NC in BOM option
GbE_i219
PD 20 KΩ, 3.3 V
(S0)
PD 20 KΩ, 3.3V
(S0)
PD 20 KΩ, 3.3V
(S0)
PD 100 KΩ
// 48
COMe-cKL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
A81
LVDS_A_CK+
LVDS Channel A clock or EDP lane 3 transmit
DP-O
Termination
A82
LVDS_A_CK-
A83
LVDS_I2C_CK
I2C Clock for LVDS display or eDP AUX +
I/O-3.3
PU 2.2 KΩ, 3.3V
(S0)
A84
LVDS_I2C_DAT
I2C Data line for LVDS display or eDP AUX -
I/O-3.3
PU 2.2 KΩ, 3.3V
(S0)
A85
GPI3
General purpose input 3
I-3.3
PU 20 KΩ 3.3V
(S0)
A86
RSVD
Reserved
NC
A87
eDP_HPD
Detection of Hot Plug / unplug
I-3.3
A88
PCIE_CK_REF+
PCIE_CK_REF-
Reference PCI Express clock for all PCI Express and
PCI Express graphics lanes
DP-O
A89
A90
GND
Power ground
PWR GND
A91
SPI_POWER
3.3 V power output for external SPI Flash
O-3.3
Comment
Clock 20 MHz to 80 MHz
PD 400 KΩ LVDS
/ 100 KΩ EDP
100 MHz
100 mA maximum
Only use to power SPI
devices on Carrier Board.
I-3.3
A92
SPI_MISO
Data in to module from carrier SPI
(SPI Master IN Slave Out)
A93
GPO0
General purpose output 0
O-3.3
PD 20k
A94
SPI_CLK
Clock from module to carrier SPI
O-3.3
PU 15 KΩ - 40 kΩ
in PCH (S5)
A95
SPI_MOSI
Data out from module to carrier SPI
O-3.3
PU 15 KΩ - 40 KΩ
in PCH (S5)
A96
TPM_PP
TPM physical presence
I-3.3
PD 10KΩ
A97
TYPE10#
Indicates to carrier board that Type 10 module is
installed
NC
A98
SER0_TX
Serial port 0 TXD
O-3.3
A99
SER0_RX
Serial port 0 RXD
I-5T
A100
GND
Power ground
PWR GND
A101
SER1_TX
Serial port 1 TXD
O-3.3
A102
SER1_RX
Serial port 1 RXD
I-5T
PU 47 KΩ, 3.3V
(S0)
A103
LID#
LID switch input
I-3.3
PU 47 KΩ, 3.3V
(S5)
A104
VCC_12V
Main input voltage (4.75 V - 20V)
A105
VCC_12V
A106
VCC_12V
PWR
4.75 V 20 V
A107
VCC_12V
A108
VCC_12V
A109
VCC_12V
A110
GND
Power ground
PWR GND
+ and -
PU 15 KΩ - 40 KΩ
in PCH
All SPI signals tri-stated
until reset deasserted.
All SPI signals tri-stated
with 20 KΩ CPU internal
weak pull-up until reset
deasserted.
TMP does not use this
functionality.
20 V protection circuit
implemented on-module,
PD on carrier boards
needed for proper
operation.
PU 47 KΩ, 3.3V
(S0)
20 V protection circuit
implemented on-module.
20 V protection circuit
implemented on-module,
PD on carrier board
needed for proper
operation.
20 V protection circuit
implemented on-module.
Differential pair differentiator
www.kontron.com
// 49
COMe-cKL6 – User Guide, Rev 1.0
5.2.2. Connector X1A Row B 1 - B 110
Table 27: Connector X1A Row B Pin Assignment (B1-B110)
Pin
COMe Signal
Description
Type
B1
GND
Power ground
PWR GND
B2
GBE0_ACT#
Gigabit Ethernet Controller activity LED indicator
OD
B3
LPC_FRAME#
Indicates the start of an LPC cycle
O-3.3
B4
LPC_AD0
LPC multiplexed command, address and data bus
I/O-3.3
B5
LPC_AD1
LPC serial DMA / Master request
NC
B6
LPC_AD2
B7
LPC_AD3
B8
LPC_DRQ0#
B9
LPC_DRQ1#
B10
LPC_CLK
LPC 24 MHz clock output
O-3.3
B11
GND
Power ground
PWR GND
B12
PWRBTN#
Power Button - a falling edge creates a power
button event
B13
SMB_CLK
B14
Termination
Comment
PU 15 KΩ-40 KΩ in
PCH (S5)
PD 20 KΩ in PCH
24 MHz
I-3.3
PU 10 KΩ, 3.3 V
(S5eco)
Power button events can
be used to bring a system
out of S5 soft-off and
other suspend states, as
well as powering the
system down.
SMBus clock line
O-3.3
PU 2.56 KΩ, 3.3 V
(S5)
SMB_DAT
SMBus bidirectional data line
I/O-3.3
PU 2.56 KΩ, 3.3 V
(S5)
B15
SMB_ALERT#
SMBus alert can be used to generate a SMI# or to
wake the system
I/O-3.3
PU 2.56 KΩ, 3.3 V
(S5)
B16
SATA1_TX+
Serial ATA transmit data pair
DP-O
B17
SATA1_TX-
B18
SUS_STAT#
Indicates imminent suspend operation; used to
notify LPC devices.
O-3.3
B19
SATA1_RX+
Serial ATA receive data pair
DP-I
B20
SATA1_RX-
B21
GND
Power ground
PWR GND
B22
SATA3_TX+
Serial ATA transmit data pair
NC
B23
SATA3_TX-
B24
PWR_OK
Power OK from main power supply.
I-5T
B25
SATA3_RX+
Serial ATA receive data pair
NC
B26
SATA3_RX-
PU 61 KΩ, 3.3 V
B27
WDT
Watchdog time-out event has occurred
O-3.3
B28
HDA_SDIN2
Audio Codec Serial data input 2
NC
B29
HDA_SDIN1
Audio Codec Serial data input
I-3.3
B30
HDA_SDIN0
B31
GND
Power ground
PWR GND
B32
SPKR
Speaker output provides the PC beep signal and
is mainly intended for debugging purposes
O-3.3
PD 20 KΩ in PCH
B33
I2C_CK
General purpose I2C port clock output
O-3.3
PU 2.21 KΩ, 3.3 V
(S5)
B34
I2C_DAT
General purpose I2C port data I/O line
I/O-3.3
PU 2.21 KΩ, 3.3 V
(S5)
B35
THRM#
Input from off-Module temp sensor indicating an
over-temp situation
I-3.3
PU 10 KΩ to 3.3 V
(S0)
B36
USB7-
USB 2.0 differential data pairs port 7
DP-I/O
B37
USB7+
PD 14.25 KΩ to
24.8 KΩ in PCH
www.kontron.com
20 V protection circuit
implemented on module
PD 10 KΩ
Not supported
PD 20 KΩ in PCH
PD is enabled until reset
is deasserted
No function implemented
// 50
COMe-cKL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
Termination
B38
USB_4_5_OC#
USB overcurrent indicator port 4/5
I-3.3
PU 10 KΩ, 3.3 V
(S5)
B39
USB5-
USB 2.0 differential data pairs port 5
DP-I/O
B40
USB5+
PD 14.25 KΩ to
24.8 KΩ in PCH
B41
GND
Power ground
PWR GND
B42
USB3-
USB 2.0 differential data pairs port 3
DP-I/O
B43
USB3+
PD 14.25 KΩ to
24.8 KΩ in PCH
B44
USB_0_1_OC#
USB overcurrent indicator port 0/1
I-3.3
PU 10 KΩ, 3.3 V
(S5)
B45
USB1-
USB 2.0 differential data pairs port
DP-I/O
B46
USB1+
PD 14.25 KΩ to
24.8 KΩ in PCH
B47
EXCD1_PERST#
PCI ExpressCard expansion, reset port 1
O-3.3
PD 10 KΩ
B48
EXCD1_CPPE#
PCI ExpressCard expansion, capable card request
port 1
I-3.3
PU 10KΩ, 3.3 V
(S0)
B49
SYS_RESET#
Reset button input
I-3.3
PU 10 KΩ, 3.3 V
(S5)
B50
CB_RESET#
Reset output from module to carrier board
O-3.3
PU 10 KΩ, 3.3 V
(S5)
B51
GND
Power ground
PWR GND
B52
PCIE_RX5+
PCI Express receive lane. AC coupled off module
DP-I
B53
PCIE_RX5-
B54
GPO1
General Purpose Output 1
O-3.3
B55
PCIE_RX4+
PCI Express receive lane 4
DP-I
B56
PCIE_RX4-
B57
GPO2
General Purpose Output 2
O-3.3
B58
PCIE_RX3+
PCI Express receive lane 3
DP-I
B59
PCIE_RX3-
B60
GND
Power ground
PWR GND
B61
PCIE_RX2+
PCI Express receive lane 2
DP-I
B62
PCIE_RX2-
NC in BOM option
GbE_i219
PD 20 KΩ
AC coupled off module
PD 20 KΩ
AC coupled off module
AC coupled off module
B63
GPO3
General Purpose Output 3
O-3.3
B64
PCIE_RX1+
PCI Express receive lane 1
DP-I
B65
PCIE_RX1-
B66
WAKE0#
PCI Express Wake Event wake up signal
I-3.3
PU 10 KΩ, 3.3 V
(S5)
B67
WAKE1#
General purpose Wake Event wake up signal, to
implement wake-up on PS2 keyboard or mouse
I-3.3
PU 10 KΩ, 3.3 V
(S5)
B68
PCIE_RX0+
PCI Express receive lane 0
DP-I
B69
PCIE_RX0-
B70
GND
Power ground
PWR GND
B71
LVDS_B0+
LVDS Channel B data pair 0
DP-O
B72
LVDS_B0LVDS Channel B data pair 1
DP-O
LVDS Channel B data pair 2
DP-O
LVDS Channel B data pair 3
DP-O
B73
LVDS_B1+
B74
LVDS_B1-
B75
LVDS_B2+
B76
LVDS_B2-
B77
LVDS_B3+
B78
LVDS_B3-
B79
LVDS/BKLT_EN
LVDS or EDP panel backlight enable (ON)
0-3.3
B80
GND
Power ground
PWR GND
B81
LVDS_B_CK+
LVDS Channel B Clock
DP-O
B82
LVDS_B_CK-
B83
LVDS_BKLT_CTRL
LVDS or EDP panel backlight brightness control
O-3.3
www.kontron.com
Comment
PD 20 KΩ
AC coupled off module
AC coupled off module
PD 100 KΩ
20 MHz -80 MHz
// 51
COMe-cKL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
B84
VCC_5V_SBY
5 V Standby
B85
VCC_5V_SBY
PWR 5 V
(S5)
B86
VCC_5V_SBY
B87
VCC_5V_SBY
B88
BIOS_DIS1#
BIOS selection strap to determine BIOS boot
device
I-3.3
B89
VGA_RED
VGA Red / Analog Video RGB-RED
NC
B90
GND
Power ground
PWR GND
B91
VGA_GREEN
VGA Green./ Analog Video RGB-Green
NC
B92
VGA_BLUE
VGA Blue./ Analog Video RGB-Blue
NC
B93
VGA_HSYNC
Analog horizontal sync output to VGA monitor
NC
B94
VGA_VSYNC
Analog vertical sync output to VGA monitor
NC
B95
VGA_DDC_CLK
Display Data Channel (DDC) clock line
NC
B96
VGA_DCC_DATA
Display Data Channel (DDC) data line
NC
B97
SPI_CS#
Chip select for carrier board SPI
0 3.3
B98
RSVD
Reserved for future use
NC
B99
RSVD
B100
GND
Power ground
PWR GND
B101
FAN_PWMOUT
Fan speed control by PWM Output
O-3.3
Termination
Comment
Optional, not necessary in
single supply mode
PU 10 KΩ, 3.3 V
(S0)
PU might be powered
during suspend
20 V protection circuit
implemented on module,
PD on carrier board
needed for proper
operation
B102
FAN_TACHIN
Fan tachometer input for fan with a two-pulse
output
I-3.3
PU 47 KΩ, 3.3 V
(S0)
B103
SLEEP#
Sleep button signal used by ACPI operating
system to bring system to sleep state or wake
system up again
I-3.3
PU 47 KΩ, 3.3 V
(S5)
B104
VCC_12V
Main input voltage (4.75 V - 20 V)
PWR
B105
VCC_12V
B106
VCC_12V
B107
VCC_12V
B108
VCC_12V
B109
VCC_12V
B110
GND
+ and -
20 V protection circuit
implemented on module
4.75 V20 V
Power ground
PWR GND
Differential pair differentiator
www.kontron.com
// 52
COMe-cKL6 – User Guide, Rev 1.0
5.2.3. Connector X1B Row C 1 - C 110
Table 28: Connector X1B Row C Pin Assignment (C1-C110)
Pin
COMe Signal
Description
Type
C1
GND
Power ground
PWR GND
C2
GND
C3
USB_SSRX0-
USB SuperSpeed receive data pair 0
DP-I
C4
USB_SSRX0+
C5
GND
Power ground
PWR GND
C6
USB_SSRX1-
USB SuperSpeed receive data pair 1
DP-I
C7
USB_SSRX1+
C8
GND
Power ground
PWR GND
C9
USB_SSRX2-
USB SuperSpeed receive data pair 2
DP-I
C10
USB_SSRX2+
C11
GND
Power ground
PWR GND
C12
USB_SSRX3-
USB SuperSpeed receive data pair 3
DP-I
C13
USB_SSRX3+
C14
GND
Power ground
PWR GND
C15
DDI1_PAIR6+
DDI1 data pair 6
NC
C16
DDI1_PAIR6-
C17
RSVD
Reserved for future use
NC
C18
RSVD
C19
PCIE_RX6+
PCI Express receive lane 6 pair
NC
C20
PCIE_RX6-
C21
GND
Power ground
PWR GND
C22
PCIE_RX7+
PCI Express receive lane 7 pair
NC
C23
PCIE_RX7-
C24
DDI1_HPD
DDI1 Hotplug Detect
I-3.3
C25
DDI1_PAIR4+
DDI1 data pair 4
NC
C26
DDI1_PAIR4-
C27
RSVD
Reserved for future use
NC
C28
RSVD
C29
DDI1_PAIR5+
DDI1 data pair 5
NC
C30
DDI1_PAIR5-
C31
GND
Power ground
PWR GND
C32
DDI2_CTRLCLK_AUX+
DDI2 clock/Auxilary
I/O-3.3
PD 100 KΩ
C33
DDI2_CTRLDATA_AUX-
DDI2 date/Auxilary
I/O-3.3
PD 100 KΩ,
3.3 V (S0)
C34
DDI2_DDC_AUX_SEL
DDI2 /Auxilary select
I-3.3
PD 1 MΩ
C35
RSVD
Reserved for future use
NC
C36
DDI3_CTRLCLK_AUX+
DDI3 clock/ Auxiliary
NC
C37
DDI3_CTRLDATA_AUX-
DDI3 date / Auxilary
NC
C38
DDI3_DDC_AUX_SEL
DDI3 select / Auxilary
NC
C39
DDI3_PAIR0+
DDI3 data pair 0
NC
C40
DDI3_PAIR0-
C41
GND
Power ground
PWR GND
C42
DDI3_PAIR1+
DDI3 data pair 1
NC
C43
DDI3_PAIR1-
C44
DDI3_HPD
DDI3 Hotplug Detect
NC
C45
RSVD
Reserved for future use
NC
www.kontron.com
Termination
Comment
PD 100 KΩ
// 53
COMe-cKL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
C46
DDI3_PAIR2+
DDI3 data pair 2
NC
Termination
Comment
C47
DDI3_PAIR2-
C48
RSVD
Reserved for future use
NC
C49
DDI3_PAIR3+
DDI3 data pair 3
NC
C50
DDI3_PAIR3-
C51
GND
Power Ground
PWR GND
C52
PEG_RX0+
PCI Express Graphics (PEG) receive lane 0
DP-I
C53
PEG_RX0-
C54
TYPE0#
Indicates the Carrier Board the pinout Type.
Not connected for Type 6.
NC
NC for Type 6 module
C55
PEG_RX1+
PCI Express Graphics (PEG) receive lane 1
DP-I
Connect to:
Connect to:
PCIE_RX9+/CSI2_DATA0+
Connect to:
PCIE_RX9-/CSI2_DATA0-
PCIE_RX10+/CSI2_DATA1+
C56
PEG_RX1-
Connect to:
PCIE_RX10-/CSI2_DATA1-
C57
TYPE1#
Indicates the Carrier Board the pinout Type.
Not connected for Type 6.
NC
NC for Type 6 module
C58
PEG_RX2+
PCI Express Graphics (PEG) receive lane 2
DP-I
Connect to:
PCIE_RX11+/CSI2_DATA2+
C59
PEG_RX2-
Connect to:
C60
GND
Power ground
PWR GND
C61
PEG_RX3+
PCI Express Graphics (PEG) receive lane 3
DP-I
C62
PEG_RX3-
C63
RSVD
C64
RSVD
C65
PEG_RX4+
PCIE_RX11-/CSI2_DATA2Connect to:
PCIE_RX12+/CSI2_DATA3+
Connect to:
PCIE_RX12-/CSI2_DATA3Reserved for future use
NC
PCI Express Graphics (PEG) receive lane 4
DP-I
Connect to:
CSI2_DATA4+
C66
PEG_RX4-
Connect to:
C67
RSVD
Reserved for future use
NC
C68
PEG_RX5+
PCI Express Graphics (PEG) receive lane 5
DP-I
CSI2_DATA4Connect to:
CSI2_DATA5+
C69
PEG_RX5-
Connect to:
C70
GND
Power ground
PWR GND
C71
PEG_RX6+
PCI Express Graphics (PEG) receive lane 6
DP-I
C72
PEG_RX6-
C73
GND
Power ground
PWR GND
C74
PEG_RX7+
PCI Express Graphics(PEG) receive lane 7
DP-I
C75
PEG_RX7-
C76
GND
Power ground
PWR GND
C77
RSVD
Reserved for future use
NC
C78
PEG_RX8+
PCI Express Graphics (PEG) receive lane 8
DP-I
CSI2_DATA5Connect to:
CSI2_DATA6+
Connect to:
CSI2_DATA6Connect to:
CSI2_DATA/+
Connect to:
CSI2_DATA7-
Connect to:
CSI2_DATA8+
www.kontron.com
// 54
COMe-cKL6 – User Guide, Rev 1.0
Pin
COMe Signal
C79
PEG_RX8-
Description
Type
C80
GND
Power ground
PWR GND
C81
PEG_RX9+
PCI Express Graphics(PEG) receive lane 9
DP-I
C82
PEG_RX9-
C83
RSVD
Reserved for future use
NC
C84
GND
Power ground
PWR GND
C85
PEG_RX10+
PCI Express Graphics (PEG) receive lane 10
DP-I
C86
PEG_RX10-
C87
GND
Power ground
PWR GND
C88
PEG_RX11+
PCI Express Graphics (PEG) receive lane 11
DP-I
C89
PEG_RX11-
C90
GND
Power ground
PWR GND
C91
PEG_RX12+
PCI Express Graphics (PEG) receive lane 12
DP-I
C92
PEG_RX12-
C93
GND
Power ground
PWR GND
C94
PEG_RX13+
PCI Express Graphics (PEG) receive lane 13
DP-I
C95
PEG_RX13-
C96
GND
C97
C98
C99
PEG_RX14-
C100
GND
Power ground
PWR GND
C101
PEG_RX15+
PCI Express Graphics(PEG) receive lane 15
DP-I
C102
PEG_RX15-
C103
GND
Power ground
PWR GND
C104
VCC_12V
Main input voltage (4.75 V - 20 V)
PWR
C105
VCC_12V
C106
VCC_12V
C107
VCC_12V
C108
VCC_12V
C109
VCC_12V
C110
GND
Termination
Comment
Connect to:
CSI2_DATA8Connect to:
CSI2_DATA9+
Connect to:
CSI2_DATA9-
Connect to:
CSI2_DATA10+
Connect to:
CSI2_DATA10Connect to:
CSI2_DAT1A11+
Connect to:
CSI2_DATA11Connect to:
CSI2_GPIO1_I2C1_SDA
Connect to:
CSI2_GPIO1_I2C1_SCL
Connect to:
CSI2_GPIO5
Connect to:
CSI2_GPIO7
Power ground
PWR GND
RSVD
Reserved for future use
NC
PEG_RX14+
PCI Express Graphics (PEG) receive lane 14
DP-I
Connect to:
CSI2_GPIO9
Connect to:
CSI2_GPIO11
Connect to:
CSI2_GPIO13_I2C4B_SDA
Connect to:
CSI2_GPIO15_I2C4B_SCL
+ and -
4.75 V- 20 V
Power ground
PWR GND
Differential pair differentiator
www.kontron.com
// 55
COMe-cKL6 – User Guide, Rev 1.0
5.2.4. Connector X1B Row D 1 - D 110
Table 29: Connector X1B Row C Pin Assignment (D1-D110)
Pin
COMe Signal
Description
Type
D1
GND
Power ground
PWR GND
D2
GND
D3
USB_SSTX0-
USB SuperSpeed transmit data path 0
DP-O
D4
USB_SSTX0+
D5
GND
Power ground
PWR GND
D6
USB_SSTX1-
USB SuperSpeed transmit data path 1
DP-O
D7
USB_SSTX1+
D8
GND
Power ground
PWR GND
D9
USB_SSTX2-
USB SuperSpeed transmit data path 2
DP-O
D10
USB_SSTX2+
D11
GND
Power Ground
PWR GND
D12
USB_SSTX3-
USB SuperSpeed transmit data path 3
DP-O
Termination
D13
USB_SSTX3+
D14
GND
Power Ground
PWR GND
D15
DDI1_CTRLCLK_AUX+
DDI1 clock / Auxilary
I/O-3.3
PD 100 KΩ
D16
DDI1_CTRLDATA_AUX-
DDI1 date / Auxilary
I/O-3.3
PU 100 KΩ,
3.3 V (S0)
D17
RSVD
Reserved for future use
NC
D18
RSVD
D19
PCIE_TX6+
PCI Express transmit lane 6 pair
NC
D20
PCIE_TX6-
D21
GND
Power Ground
PWR GND
D22
PCIE_TX7+
PCI Express transmit lane 7 pair
NC
D23
PCIE_TX7-
D24
RSVD
Reserved for future use
NC
D25
RSVD
DDI1 pair 0
DP-O
D26
DDI1_PAIR0+
D27
DDI1_PAIR0-
D28
RSVD
Reserved for future use
NC
D29
DDI1_PAIR1+
DDI1 pair 1
DP-O
D30
DDI1_PAIR1-
D31
GND
Power ground
PWR GND
D32
DDI1_PAIR2+
DDI1 pair
DP-O
D33
DDI1_PAIR2-
D34
DDI1_DDC_AUX_SEL
DDI1 DCC / Auxilary select
I-3.3
D35
RSVD
Reserved for future use
NC
D36
DDI1_PAIR3+
DDI1 pair 3
DP-O
D37
DDI1_PAIR3-
D38
RSVD
Reserved for future use
NC
D39
DDI2_PAIR0+
DDI2 pair 0
DP-O
D40
DDI2_PAIR0-
D41
GND
Power ground
PWR GND
D42
DDI2_PAIR1+
DDI2 pair 1
DP-0
D43
DDI2_PAIR1-
D44
DDI2_HPD
DDI2 Hotplug Detect
I-3.3
D45
RSVD
Reserved for future use
NC
www.kontron.com
Comment
PD 1 MΩ
PD 100 KΩ
// 56
COMe-cKL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
D46
DDI2_PAIR2+
DDI2 pair 2
DP-O
D47
DDI2_PAIR2-
D48
RSVD
Reserved for future use
NC
D49
DDI2_PAIR3+
DDI2 pair 3
DP-0
D50
DDI2_PAIR3-
D51
GND
Power ground
PWR GND
D52
PEG_TX0+
PCI Express Graphics (PEG) transmit lane 0
DP-O
D53
PEG_TX0-
D54
PEG_LANE_RV#
PCI Express Graphics (PEG) Lane Reversal
NC
D55
PEG_TX1+
PCI Express Graphics (PEG) transmit lane 1
DP-O
D56
PEG_TX1-
D57
TYPE2#
Ground for Type 6 modules
GND
D58
PEG_TX2+
PCI Express Graphics (PEG) transmit lane 2
DP-O
Termination
Comment
Connected to:
PCIE_TX9+/CSI2_CLK0+
Connected to:
PCIE_TX9-/CSI2_CLK0Connected to:
PCIE_TX10+
Connected to:
PCIE_TX10-
Connected to:
PCIE_TX11+
D59
PEG_TX2-
Connected to:
D60
GND
Power ground
PWR GND
D61
PEG_TX3+
PCI Express Graphics (PEG) transmit lane 3
DP-O
D62
PEG_TX3-
D63
RSVD
D64
RSVD
D65
PEG_TX4+
D66
PEG_TX4-
D67
GND
Power ground
PWR GND
D68
PEG_TX5+
PCI Express Graphics (PEG) transmit lane 5
NC
D69
PEG_TX5-
D70
GND
Power ground
PWR GND
D71
PEG_TX6+
PCI Express Graphics (PEG) transmit lane 6
NC
D72
PEG_TX6-
D73
GND
Power ground
PWR GND
D74
PEG_TX7+
PCI Express Graphics (PEG) transmit lane 7
NC
D75
PEG_TX7-
D76
GND
Power ground
PWR GND
D77
RSVD
Reserved for future use
NC
D78
PEG_TX8+
PCI Express Graphics (PEG) transmit lane 8
DP-O
D79
PEG_TX8-
PCIE_TX11Connected to:
PCIE_TX12+
Connected to:
PCIE_TX12Reserved for future use
NC
PCI Express Graphics (PEG) transmit lane
DP-O
Connected to:
CSI2_CKL1+
Connected to:
CSI2_CKL1-
-
Connected to:
CSI2_CKL2+
Connected to:
CSI2_CKL2-
D80
GND
Power ground
PWR GND
D81
PEG_TX9+
PCI Express Graphics (PEG) transmit lane 9
NC
D82
PEG_TX9-
D83
RSVD
Reserved for future use
NC
D84
GND
Power ground
PWR GND
www.kontron.com
// 57
COMe-cKL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
D85
PEG_TX10+
PCI Express Graphics (PEG) transmit lane 10
NC
D86
PEG_TX10-
D87
GND
Power ground
PWR GND
D88
PEG_TX11+
PCI Express Graphics (PEG) transmit lane 11
DP-O
Termination
Comment
Connected to:
CSI2_CKL3+
D89
PEG_TX11-
Connected to:
D90
GND
Power ground
PWR GND
D91
PEG_TX12+
PCI Express Graphics (PEG) transmit lane 12
DP-O
D92
PEG_TX12-
D93
GND
Power ground
PWR GND
D94
PEG_TX13+
PCI Express Graphics (PEG) transmit lane 13
DP-O
D95
PEG_TX13-
D96
GND
Power ground
PWR GND
D97
RSVD
Reserved for future use
NC
D98
PEG_TX14+
PCI Express Graphics (PEG) transmit lane 14
DP-O
D99
PEG_TX14-
D100
GND
Power Ground
PWR GND
D101
PEG_TX15+
PCI Express Graphics (PEG) transmit lane 15
NC
D102
PEG_TX15-
CSI2_CKL3Connected to:
CSI2_GPIO0_I2C0_SDA
Connected to:
CSI2_GPIO2_I2C0_SCL
Connected to:
CSI2_GPIO4_FLASHTRIG
Connected to:
CSI2_GPIO6
Connected to:
CSI2_GPIO8
Connected to:
CSI2_GPIO10
D103
GND
Power ground
PWR GND
D104
VCC_12V
Main input voltage (4.75 V - 20 V)
D105
VCC_12V
PWR
4.75 V-20V
Power ground
PWR GND
D106
VCC_12V
D107
VCC_12V
D108
VCC_12V
D109
VCC_12V
D110
GND
+ and -
Differential pair differentiator
www.kontron.com
// 58
COMe-cKL6 – User Guide, Rev 1.0
6/ uEFI BIOS
6.1. Starting the uEFI BIOS
The COMe-cKL6 uses a Kontron-customized, pre-installed and configured version of Aptio ® V uEFI BIOS based on the
Unified Extensible Firmware Interface (uEFI) specification and the Intel® Platform Innovation Framework for EFI. This
uEFI BIOS provides a variety of new and enhanced functions specifically tailored to the hardware features of the
COMe-cKL6.
The BIOS version covered in this document might not be the latest version. The latest
version might have certain differences to the BIOS options and features described in this
chapter.
Register for the EMD Customer Section to get access to BIOS downloads and PCN service.
The uEFI BIOS comes with a Setup program that provides quick and easy access to the individual function settings for
control or modification of the uEFI BIOS configuration. The Setup program allows for access to various menus that
provide functions or access to sub-menus with further specific functions of their own.
To start the uEFI BIOS Setup program, follow the steps below:
1.
Power on the board.
2.
Wait until the first characters appear on the screen (POST messages or splash screen).
3.
Press the <DEL> key.
4.
If the uEFI BIOS is password-protected, a request for password will appear. Enter either the User Password or
Supervisor Password (see Chapter 6.2.4 Security Setup Menu), press <RETURN>, and proceed with step 5.
5.
A Setup menu appears.
The COMe-cKL6 uEFI BIOS Setup program uses a hot key navigation system. The hot key legend bar is located at the
bottom of the Setup screens. The following table provides a list of navigation hot keys available in the legend bar.
Table 30: Navigation Hot Keys Available in the Legend Bar
Sub-screen
Description
<F1>
<F1> key invokes the General Help window
<->
<Minus> key selects the next lower value within a field
<+>
<Plus> key selects the next higher value within a field
<F2>
<F2> key loads previous values
<F3>
<F3> key loads optimized defaults
<F4>
<F4> key Saves and Exits
<→> or <←>
<Left/Right> arrows selects major Setup menus on menu bar, for example, Main or Advanced
<↑> or <↓>
<Up/Down> arrows select fields in the current menu, for example, Setup function or sub-screen
<ESC>
<ESC> key exits a major Setup menu and enters the Exit Setup menu
Pressing the <ESC> key in a sub-menu displays the next higher menu level
<RETURN>
<RETURN> key executes a command or selects a submenu
www.kontron.com
// 59
COMe-cKL6 – User Guide, Rev 1.0
6.2. Setup Menus
The Setup utility features menus listed in the selection bar at the top of the screen are:

Main

Advanced

Chipset

Security

Boot

Save & Exit
The currently active menu and the currently active uEFI BIOS Setup item are highlighted in white. Use the left and right
arrow keys to navigate to the required Setup menu and select the Setup menu by pressing <RETURN>.
Each Setup menu provides two main frames. The left frame displays all available functions. Configurable functions
are displayed in blue. Functions displayed in grey provide information about the status or the operational
configuration. The right frame displays a Help window providing an explanation of the respective function.
www.kontron.com
// 60
COMe-cKL6 – User Guide, Rev 1.0
6.2.1. Main Setup Menu
On entering the uEFI BIOS the Setup program displays the Main Setup menu. This screen lists the Main Setup menu
sub-screens and provides basic system information as well as functions for setting the system language, time and
date.
Figure 6: Main Setup Menu Information Initial Screens
www.kontron.com
// 61
COMe-cKL6 – User Guide, Rev 1.0
The following table shows the Main Menu sub-screens and functions and describes the content. Default options are
displayed bold. Some functions include additional information.
Table 31: Main Setup Menu Sub-screens
Sub-Screen
Description
BIOS
Information>
Read only field
Displays BIOS Information:
BIOS vendor, Core version, Compliancy, Kontron BIOS Version and Access level
Board
Information>
Read only field
Displays Board Information:
Board ID, Fab ID, and LAN PHY revision
Processor
Information>
Read only field
Displays Processor Information:
Name, Type, Speed, ID, Stepping, Number of Processors, Microcode Revision, and GT Info
Displays BIOS Version and Memory RC Version Information:
IGFX VBIOS Version, IGFX GOP Version, Memory RC Version Total Memory and
MemoryFrequency.
PCH
Information>
Read only field
Displays PCH Information:
Name, PCH SKU, Stepping, and Hsio Revision
Displays SPI Clock Information:
Read ID/Status Clock Frequency, Write and Erase Clock Frequency, and Fast Read Clock
Frequency and Read Clock Frequency
Displays Firmware Information:
ME FW Version and ME Firmware SKU
System
Language>
Selects system default language
[English]
Platform
Information>
Read only field
Displays Module Information
Product Name, Revision, Serial # ‚MAC Address, Boot Counter, and CPLD Rev
Additional information for MAC Address
The MAC address entry is the value used by the Ethernet controller and may contain the entry’
Inactive’ - Ethernet chip is inactive.
Activate the Ethernet chip by setting the following to ‘enable’.
Advanced > Network Stack Configuration > Network Stack > Enable
88:88:88:88:87:88 is a special pattern that will be filled in by the Ethernet firmware if there is
no valid entry in the firmware block of the BIOS SPI (i.e. the MAC address has been overwritten
during the last attempt to flash the system). For more information, see Chapter 6.5 Firmware
Update.
System Date>
Displays the system date
[Day mm/dd/yyyy]
System Time>
Displays the system time
[hh:mm:ss]
www.kontron.com
// 62
COMe-cKL6 – User Guide, Rev 1.0
6.2.2. Advanced Setup Menu
The Advanced Setup menu provides sub-screens and second level sub-screens with functions for advanced
configuration.
Setting items, on this screen, to incorrect values may cause system malfunctions.
Figure 7: Advance Setup Menu Initial Screen
The following table shows the Advanced sub-screens and functions, and describes the content. Default settings are
bold. Some functions include additional information.
Table 32: Advanced Setup menu Sub-screens and Functions
Sub-Screen
Function
Second level Sub-Screen / Description
CPU
Configuration>
Read only field
Type, ID, Speed, L1 Data Cache, L1 Instruction Cache, L2 Cache, L3 Cache, L4 Cache, VMX, and
SMX/TXT
Intel (VME)
Virtual
Technology>
Enables VMM to utilize additional hardware capabilities provided by
Vanderpool Technology
[Enabled, Disabled]
Active Processor
Cores>
Displays number of cores to be enabled in each processor package
[All, 1]
Hyperthreading>
Enabled for windows XP and Linux (OS optimized for Hyper-Threading
Technlogy)
Disabled for other Operating Systems (OS not optimized for HyperThreading Technology)
[Enabled, Disabled]
www.kontron.com
// 63
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
Power and
Performance>
CPU Power
management
Control>
Boot
Performance
Mode>
Selects the performance state the BIOS sets before OS
handoff
[Max. Non-Turbo Perf., Max. Battery, Turbo Perf.]
Intel®
Speedstep ™>
Allows support for more than two frequency ranges
[Enabled, Disable]
Intel® Speed
Shift
Technology>
Intel Speed Shift Technology support. Enable exposes
CPPC v2 interface to allow for hardware controlled
P-states.
[Enabled, Disabled]
Turbo Mode>
Enables or disables Processor Turbo mode. Note:
EMTTM must also be enabled.
C States>
Enables or disables CPU power management to allow
CPU to enter C-Sates when not 100% utilized.
[Enabled, Disabled]
Enhanced
C-state>
Enables or disables C1E. If enabled CPU switches to
minimum speed when all cores enter C-state.
[Enabled, Disabled]
Packaged
C-state Limit>
Maximum Package C-State limit setting.
Default: leaves the factory default value.
Auto initializes to deepest available package c-state
limit.
[Auto, Default, C10, C9, C8, C7S, C7, C6, C3, C2, C0/C1]
Thermal
Monitor>
Thermal monitor
[Enabled, Disabled]
EC Turbo
Control Mode>
EC Turbo control mode
[Enabled, Disabled]
RC6 (Render
standby)>
Check to enable render standby support.
[Enabled, Disabled]
Maximum GT
Frequency>
Maximum GT frequency limited by user. Choose from
range 300 MHz (RPN) to 1000 MHz (RPO).
Out of range values are clipped to the minimum. and
maximum range values above.
[Default Max Frequency, 100 MHz – 1200 MHz]
GT Power
management
Control>
PCH-FW
Configuration>
www.kontron.com
Read only fields
ME FW Version, ME Firmware Mode, ME Firmware SKU, ME File System Integrity Value,
ME Firmware Status 1, ME Firmware Status 2 and NFC Support.
ME State>
If disabled, ME enters ME temporarily disabled mode.
[Enabled, Disabled]
ME Unconfig ON
RTC Clear>
If disabled, ME is not unconfigured on RTC clear.
Comms Hub
Support>
Support for Comms hub
[Enabled, Disabled]
JHI Support>
Enables or disables Intel® DAL Host Interface Service (JHI)
[Enabled, Disabled]
Core BIOS Done
Message>
Enables or disables core BIOS done message sent to ME
[Enabled, Disabled]
// 64
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
PCH-FW
Configuration>
(continued)
Firmware
Update
Configuration>
ME FW Image
Re-Flash>
Enables or disables ME FW Image RE-Flash function
[Enabled, Disabled]
Local FW
Update>
Options for local FW update function
[Enabled, Disabled]
Thermal
Configuration>
CPU Thermal
Configuration>
DTS SMM>
ACPI thermal management uses HWM reported values
when disabled and DTS SMM mechanism to obtain CPU
temperatures values when enabled.
Note: Enabling DTS might deteriate the system’s real
time behavior through handling the necessary SMMs.
[Enabled, Disabled, Critical Temp Reporting]
Tcc Activation
Offset>
Displays the offset from the factory TCC (Thermal
Control Circuit) activation temperature.
Note: This values is subtracted from the TCC threshold,
i.e. ‘0’ means maximum allowed temperature.
ACPI T-States>
ACPI T-States
[Enabled , Disabled]
Automatic
Thermal
Reporting>
Configures _CRT, _PSC and _ACO automatically based
on valued recommended in BWG’S Thermal reporting
Management setting. Set to disabled for manual
configuration.
[Enabled, Disabled]
Critical Trip
Point>
Controls the temperature of the ACPI Critical Trip Point
at which OS shuts off the system. The plan of record
(POR) for Intel® Mobile Processors is 119°C.
[127°C, 119°C (POR), 111°C, -----15°C]
Passive Trip
Point>
Controls temperature of ACPI Passive Trip Point at
which OS begins to throttle the processor.
[119°C (POR), 111°C, 103°C, 95°C, -----15°C, Disabled]
Passive TC1
Value>
Sets TC1 /values for ACPI passive cooling formula
(Range: 1-16)
Passive TC2
Value>
Sets TC2 values for ACPI passive cooling formula
(Range: 1-16)
Passive TSP
Value>
Sets TSP value for ACPI passive cooling formula
TSP value represents how often OS reads the
temperature when passive cooling is enabled, in 10ths of
a second. (Range: 2-32).
Passive Trip
Points>
Passive Trip Points
[Enabled, Disabled]
Critical Trip
Points>
Critical Trip Points
[Enabled, Disabled]
Platform
Thermal
Configuration>
Intel ICC>
www.kontron.com
ICC/OC
Watchdog
Timer>
Enabling Exposes the ICC/OC watchdog timer to OS as ACPI device
BIOS always uses WDT HW when changing clock setting.
[Enabled, Disabled]
ICC Locks After
EOP>
Specifies the ICC registers to write to, after end of post.
Default – Dynamic registers for runtime clock adjustments are writable.
All locked - No clock register adjustment allowed after EOP.
All Unlocked - All ICC registers can be written after EOP.
[Default, All Locked, All Unlocked]
// 65
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
Intel ICC>
(continued)
ICC Profile>
Selects the clock profile corresponding to platform configuration.
Profiles are defined by the OEM and platform capabilities.
Typically , profile 0 has failsafe settings.
Other profiles correspond to WiMax, 3G, or overclocking settings.
ICC PLL
Shutdown>
Controls programming of ICC PLL shutdown flow. If enabled this ICC PM
register is programmed on every non-Sx boot.
[Enabled, Disabled]
Additional Information two-staged watchdog
DMI/BCLK/PEG/SATA/USB3/PCIe clock settings
Default clock settings:
100 MHz 0.50%
Downspread
Frequency range limits:
99.50 MHz – 100 MHz
Maximum Spread: %
0.50%
Spread Mode adjustments:
None Allowed
Trusted
Computing>
www.kontron.com
Security Device
Support>
Enables or disables BIOS support for security device. Operating system
will not show security device. TCG EFI protocol and INT1A interface are not
available.
[Enabled, Disabled]
Active PCR
Banks>
Read only field
Displays active PCR Banks
Available PCR
Banks>
Read only field
Displays available PCR Banks
SHA-1 PCR
Bank>
SHA-1 PCR Bank
[Enabled, Disabled]
SHA256 PCR
Bank>
SHA256 PCR Bank
[Enabled, Disabled]
Pending
Operation>
Schedules operation for Security Device Note: Computer reboots on
restart in order to change the state of the security device.
[None, TPM Clear]
Platform
Hierarchy>
Platform Hierarchy
[Enabled, Disabled]
Storage
Hierarchy>
Storage Hierarchy
[Enabled, Disabled]
Endorsement
Hierarchy>
Endorsement Hierarchy
[Enabled, Disabled]
TPM2.0 UEFI
Spec Version>
Selects TCG2 Spec Version. support.
TCG_1_2 is compatible mode for Win8/Win10
TCG_2 supports TCG2 protocol + event format Win 10 or later.
[TCG_1_2, TCG_2]
Physical
Presence Spec
Version>
Select to tell OS to support either PPI Spec 1.2 or 1.3
Note: Some HCK test might not support 1.3.
[1.2, 1.3]
TPM 20
InterfaceType>
Read only field
// 66
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
Trusted
Computing>
(continued)
Device Select>
BIOS support for security devices.

Auto - Supports both TPM 1.2 and TPM 2.0 with TPM 2.0 as default if not
found and TMM 1.2 is enumerated.

TPM 1.2 - Restricts support to TPM 1.2

TPM 2.0 - Restricts support to TPM 2.0
[TPM 1.2, TPM 2.0, Auto]
ACPI settings>
Miscellaneous>
Enable ACPI
Auto
Configuration>
Enables or disables BIOS ACPI auto configuration. If enabled, the system
uses generic ACPI settings that may not fit the system best.
[Enabled, Disabled]
Enable
Hibernation>
Enables or disables systems ability to hibernate (OS/S4 Sleep State)
This option may not be effective with some operating systems.
[Enabled, Disabled]
ACPI Sleep
State>
Selects highest ACPI sleep state that the system enters when suspended
[Suspend Disabled, S3 Suspend to Ram]
Lock Legacy
Resources>
Enables or disable lock of legacy resources
[Enabled, Disabled]
S3 Video
Repost>
Enables or disables S3 video repost
[Enabled, Disabled]
Watchdog>
Auto Reload>
Enables automatic reload of watchdog timers on timeout.
[Enabled, Disabled]
Global Lock>
Enable sets all Watchdog registers (except for WD_KICK)
to read only, until board is reset.
[Enabled, Disabled]
Stage 1
Mode>
Selects action for this Watchdog stage
[Disabled, Reset, NMI, SCI, Delay, WDT Signal only]
Additional Information two-staged watchdog
Programmable stages to trigger different actions - If one stage is disabled, then the next stage
is also disabled.
Common actions for a watchdog trigger events ‘Delay’, ‘Reset’ and ‘Watchdog signal only’
CPLD code allows for triggering NMI or SCI. This needs programming of a predefined action
inside the BIOS and therefore can only be used in a customized BIOS solution.
Timeouts that can be set to eight different fixed values between 1 second and 30 minutes.
www.kontron.com
Reset Button
Behavior>
Selects reset button behavior.
[Chipset reset, Power cycle]
I2C Speed>
Selects internal I2C bus speed between (1 kHz and 400 kHz)
For a default system 200 kHz is an appropriate value.
On-board I2C
Mode>
Keep ‘Multimaster’ setting unless otherwise noted
[MultiMaster, BusClear]
Manufacturing
Mode>
Read only field
Function is disabled
LID Switch
Mode>
Shows or hides Lid Switch Inside ACPI OS. The default setting is disabled.
[Disabled, Active normal, Active inverse]
Sleep Button
Mode>
Shows or hides Sleep Button inside ACPI OS. Default setting is
disabled.[Enabled, Disabled]
// 67
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
Miscellaneous>
(continued)
ACPI
Temperature
Polling>
Sets mode for temperature polling through the OSPM
(0 is disabled and 1 enabled)
[Enabled, Disabled]
TZ00
Temperature
Polling>
Displays the time interval in seconds, between two attempts to measure
temperature in ACPI thermal zone 00 (Ambient temperature)
TZ01
Temperature
Polling>
Displays the time interval in seconds, between two attempts to measure
temperature in ACPI thermal zone 01 (CPU temperature)
SDIO/GPIO
Ouput>
Enables or disables SDIO/COMe-GIO’s output
[Enabled, Disabled]
SDIO/GPIO
Mode>
Enables or disables SDIO/COMe-GIO’s output
[COMe-GPIO, SDIO]
PCI
ExpressCard 0>
Controls PCIe port for ExpressCard support
If not used, keep in the disabled state.
[Port 1, Port 2, Port 3, Port4, Disabled]
PCI
ExpressCard 1>
Controls PCIe port for ExpressCard support
If not used, keep in the disabled state.
[Port 1, Port 2, Port 3, Port4, Disabled]
SMART
Settings>
Smart Self Test>
Runs Smart Self Test on all HDDs during post
[Enabled, Disabled]
H/W Monitor>
CPU
Temperature>
Read only field
Displays CPU temperature in °C
Module
Temperate>
Read only field
Displays module temperature in °C
CPU Fan –
Fan Control>
Sets Fan Control mode for CPU fan:

Disable - stops the fan and

Manual – manually sets the fan

Auto - hardware monitor controls cooling, similar to ACPI based ‘Active
Cooling’, without producing a software load to the system.
[Disable, Manual, Auto]
www.kontron.com
CPU Fan –
Fan Pulse>
Displays number of pulses fan produces during 1 revolution. (Range: 1-4)
CPU Fan –
Fan Trip Point>
Displays temperature at which the fan accelerates. (Range: 20°C – 80°)
CPU Fan – Trip
Point Speed>
Displays Fan speed at trip point in %. Minimum value is 30%
Fan always runs at 100 % at TJmax (-10°C).
CPU Fan – Ref.
Temperature>
Determines temperature source used for automatic fan control
[PCH Temperature, Module Temperature, CPU Temperature]
External FanFan Control>
Sets Fan Control mode for external fan
Disable - stops the fan and Manual – manually sets the fan
Auto - hardware monitor controls cooling, similar to ACPI based ‘Active
Cooling’, without producing a software load to the system.
[Disable, Manual, Auto]
External Fan –
Fan Pulse>
Displays number of pulse fan produces during 1 revolution (Range: 1-4)
// 68
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
H/W Monitor>
(continued)
External FanFan Trip point>
Displays temperature at which fan accelerates. (Range: 20°C to 80°C)
External
Fan-Trip Point
Speed>
Displays fan speed at trip point in %. Minimum value is 30.
Fan always runs at 100% at TJmax (-10°C)
External
Fan Reference
Temperature>
Determines temperature source used for automatic fan control
[PCH Temperature, Module Temperature, CPU Temperature]
Additional information External Fan
An external fan can be connected to baseboard. The external fan’s control lines are routed via
the COMe connector.
Serial Port
Console
Redirection>
5.0V Standby>
Read only field
Displays battery voltage at COMe pin
Batt Volt. at
COMe Pin>
Read only field
Displays widerange VCC
Widerange Vcc>
Read only field
Displays widerange VCC
COM0
Console
Redirection>
Console redirection via COMe module’s COM1.
[Enabled, Disabled]
COM1
Console
Redirection>
Console redirection via COMe module’s COM2
[Enabled, Disabled]
COM2
Console
Redirection>
Console redirection via COMe module’s COM3
[Enabled, Disabled]
COM3
Console
Redirection
Settings>
Console redirection via COMe module’s COM4
[Enabled, Disabled]
Additional Information
If redirection is enabled, then the port settings such as Terminal type, Bits per second, Data bits,
Parity etc. can be adjusted in here. On-module COM ports do not support flow control.
If the Port is disabled, the COM# port is displayed as a read only field with the comment
‘Port is Disabled’.
AMI Graphic
Output Protocol
Policy>
www.kontron.com
Legacy Console
Redirection>
Legacy Serial
Redirection Port>
Serial Port for
Out-of-Band
Management /
Windows EMS>
Console redirection
[Enabled, Disabled]
Output Select>
Selects a COM port to display redirection of
legacy OS and legacy OPROM messages
[COM0, COM1, COM2, COM3]
Selects output interface
[DP2]
// 69
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
SIO
Configuration>
Serial Port 0>
Use This Device>
Enables or disables the use of this logical device.
[Enabled, Disabled]
Logical Device
Settings: Current>
Read only field
IO=3F8h; IRQ=4
Logical Device
Settings: Possible>
Allows the user to change the device’s resource
settings. New settings are reflected on the Setup
page after system restarts.
[Use Automatic Settings,
IO=3F8h; IRQ=4,
IO=3F8h; IRQ=3,4,5,7,9,10,11,12,
IO=2F8h; IRQ=3,4,5,7,9,10,11,12,
IO=3E8h; IRQ=3,4,5,7,9,10,11,12,
IO=2E8h; IRQ=3,4,5,7,9,10,11,12]
Use This Device>
Enables or disables the use of this logical device.
[Enabled, Disabled]
Logical Device
Settings:Current>
Read only field
IO=2F8h; IRQ=3
Logical device
settings:Possible>
Allows the user to change the device’s resource
settings. New settings are reflected on the Setup
page after system restart.
[Use Automatic Settings,
IO=2F8h; IRQ=3,
IO=3F8h; IRQ=3,4,5,7,9,10,11,12,
IO=2F8h; IRQ=3,4,5,7,9,10,11,12,
IO=3E8h; IRQ=3,4,5,7,9,10,11,12,
IO=2E8h; IRQ=3,4,5,7,9,10,11,12]
Serial Port 1>
Serial Port 2>
Serial Port 3>
www.kontron.com
Use This Device>
Enables or disables the use of this logical device.
[Enabled, Disabled]
Logical Device
Settings: Current>
Read only field
IO=3E8h; IRQ10
Logical device
settings: Possible>
Allows the user to change the device’s resource
settings. New settings are reflected on the Setup
page after system restart.
[Use Automatic Settings,
IO=3E8h; IRQ=5; DMA,
IO=3F8h; IRQ=3,4,5,7,9,10,11,1,2; DMA,
IO=2F8h; IRQ=3,4,5,7,9,10,11,12; DMA,
IO=3E8h; IRQ=3,4,5,7,9,10,11,12; DMA,
IO=2E8h; IRQ=3,4,5,7,9,10,11,12; DMA]
Use This Device>
Enables or disables the use of this logical device.
[Enabled, Disabled]
Logical Device
Settings: Current>
Read only field
IO=2E8h; IRQ=7
Logical device
settings: Possible>
Allows the user to change the device’s resource
settings. New settings are reflected on the Setup
page after system restart.
[Use Automatic Settings,
IO=2E8h; IRQ=7; DMA,
// 70
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
SIO
Configuration>
(continued)
Serial Port 3>
(continued)
Logical device
settings: Possible>
(contrinued)
Super IO Configuration
Serial Port 3>IO=3F8h; IRQ=3,4,5,7,9,10,11,1,2; DMA,
IO=2F8h; IRQ=3,4,5,7,9,10,11,12; DMA,
IO=3E8h; IRQ=3,4,5,7,9,10,11,12; DMA,
IO=2E8h; IRQ=3,4,5,7,9,10,11,12; DMA]
Parallel Port>
Use This Device>
Enables or disables the use of this logical device.
[Enabled, Disabled]
Logical Device
Settings: Current>
Read only field
IO=378h; IRQ=5
Logical device
settings: Possible>
Allows the user to change the device’s resource
settings. New settings are reflected on the Setup
page after system restart.
[Use Automatic Settings,
IO=378h; IRQ=5,
IO=378h; IRQ=5,6,7,9,10,11,12,
IO=278h; IRQ=5,6,7,9,10,11,12,
IO=3BCh; IRQ=5,6,7,9,10,11,12]
Additional Information SIO:
Warning: Logical Devices state on the left side of the control reflects the current logical device
state. Changes made during the setup session are shown after restarting the system.
The SIO Configuration menu enables all available serial interfaces to be configured. The
module-based serial interfaces always appear as COM1 and COM2. COM 1 and COM 2 can be
treated as 16550-compatible legacy COM interfaces at the standard I/O addresses and are
based in the on-module CPLD. Note: Hardware flow control is not supported.
Optionally, If the baseboard contains an activated SuperIO of the type Winbond 83627, then its
serial interfaces are added to the system as COM3 and COM4. COM3 and COM4 IRQ and I/O
addresses are configurable in this menu, too.
Although the chipset internal COMs are not supported due to technical constraints their driver
must be installed. Installing the driver does not mean that these serial interfaces are useable.
PCI Subsystem
Settings>
www.kontron.com
PCI Latency
Timer>
Displays value to be programmed into the PCI latency timer register as PCI
Bus Clocks.
[32, 64, 96, 128, 160, 192, 224, 248]
PCI-X Latency
Timer>
Displays value to be programmed into the PCI latency timer register as PCI
Bus Clocks.
[32, 64, 96, 128, 160, 192, 224, 248]
VGA Palette
Snoop>
Enables or disables VGA palette register snooping
[Enabled, Disabled]
PERR#
Generation>
Enables or disables PCI device to generate PERR#
[Enabled, Disabled]
SERR#
Generation>
Enables or disables PCI device to generate SERR#
[Enabled, Disabled]
Above 4G
Decoding>
Enables or disables decoding in Address Space above ‘4G’ for 64 bit
capable devices. Note: Only if system supports 64 bit PCI decoding.
[Enabled, Disabled]
PCI Hot-Plug
Settings>
BIOS Hot –Plug
Support>
If enabled, BIOS builds are allowed in hot-plug support.
Use this feature if OS does not support PCI express and
SHPC hot-plug natively.
[Enabled, Disabled]
// 71
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
PCI Subsystem
Settings>
(continued)
PCI Hot-Plug
Settings>
(continued)
PCI Buses
Padding>
Padd PCI Buses behind the bridge for hot-plug
[Disabled, 1, 2, 3, 4, 5]
I/O Resources
Padding>
Padd PCI resources behind the bridge for hot-plug
[Disabled, 4 k, 8 k, 16 k, 32 k]
MMIO 32 bit
Resources
Padding>
Padd PCI MMIO 32 bit resources behind the bridge for
hot-plug.
[Disabled, 1 M, 2 M, 4 M, 8 M, 16 M, 32 M, 64 M, 128 M]
PFMMIO
32 bit Resources
Padding>
Padd PCI MMIO 32 bit pre-fetchable resources behind
the bridge for hot-plug.
[Disabled, 1 M, 2 M, 4 M, 8 M, 16 M, 32 M, 64 M, 128 M]
Network Stack
Configuration>
Network Stack>
If UEFI network stack is enabled, the Ethernet chip is active.
[Enabled, Disabled]
CSM
Configuration>
CSM Support>
Enables or disables CSM Support
If enabled, the CSM details can be changed. Below ‘Option ROM Execution’
are ‘Network, ‘Storage’, ’Video’ and ‘Other PCI devices’.
Note: ‘Network’ must be changed to’ Legacy’ for legacy boot. (Default
setting is ‘Do not launch’).
[Enabled, Disabled]
Additional Information CSM:
Compatibility Support Module (CSM) configuration is important for legacy operating systems
By default, CSM is disabled for modern OS such as Windows 8, 10 and Linux.
If a legacy OS is used or a Windows or Linux system is run in legacy mode then this menu
allows for detailed option settings.
Note, a change in settings only come into effect after the next restart. Therefore, to be able to
use the actualized settings, it is recommended to save and exit setup and re-enter.
The ‘Optional ROM Execution’ settings require special care. Any OS using an INT10 based display
output needs the ‘Video’ option set to ‘Legacy’, in the same way that PXE boot needs ‘Network’
‘Optional ROM’ to be set to ‘Legacy’.
NVMe
Configuration>
Read only field
Acts as a message showing the connected NVMe (Non-Volatile memory PCIe) devices.
[NO NVME Device Found]
Switchable
Graphics>
Read only field
If no switchable graphics cards are connected to the system,
Set the primary display switch to SG to use switchable graphics cards.
[Muxless]
USB
Configuration>
Read only fields
USB Configuration, UBS Module Version, USB Controllers, and USB devices
www.kontron.com
Legacy USB
Support>
Enable- Supports legacy USB
Auto– disables legacy support, if no USB devices are connected
Disable-keeps USB devices available for EFI applications only
[Enabled, Disabled, Auto]
XHCI Hand-off>
XHCI ownership change claimed by XHCI driver. Note: this is a work around
for OS(s) without XHCI hand-off support.
[Enabled, Disabled]
USB Mass
Storage Driver
Support>
Enables or disables USB mass storage driver support
[Enabled, Disabled]
// 72
COMe-cKL6 – User Guide, Rev 1.0
Sub-Screen
Function
Second level Sub-Screen / Description
USB
Configuration>
(continued)
Port 60/64
Emulation>
Enables I/O port 60h/64h emulation support
Note: Enable for USB keyboard legacy support for non-USB aware OS(s).
[Enabled, Disabled]
USB Transfer
Time-out>
Displays timeout value for control, bulk and interrupt transfers
[1 sec, 5 sec, 10 sec, 20 sec]
Device Reset
Time-out>
Displays USB mass storage device start unit command time-out
[10 sec, 20 sec, 30 sec, 40 sec]
Device Powerup Delay>
Displays maximum time taken for the device to report itself to the host
properly. Auto uses the default value for a root port the default is 100 ms
and for a hub port the delay is taken from Hub descriptor.
[Auto, Manual]
www.kontron.com
// 73
COMe-cKL6 – User Guide, Rev 1.0
6.2.3. Chipset Setup Menu
On entering the Chipset Setup menu, the screen lists two sub-screen options:

System Agent (previously Northbridge)

PCH-IO (previously Southbridge)
6.2.3.1. Chipset > System Agent Configuration
Figure 8: Chipset>System Agent Configuration Initial Screen
The following table shows the System Agent Configuration sub-screens and functions, and describes the content.
Default settings are bold.
Table 33: Chipset Set > System Agent Configuration Sub-screens and Functions
Function
Second level Sub-Screen / Description
SA PCIe Code
Version>
Read only field
States versions of the code
VT-d >
Read only field
States if virtualization is supported
Graphics
Configuration>
Graphics Turbo
IMON Current>
Displays graphics turbo IMON supported values
(14-31)
Skip Scanned for
External GfX
Card>
If enabled, no scan is made for external Gfx cards on PEG or PCH PCIE ports.
Default setting is disabled.
[Enabled, Disabled]
www.kontron.com
// 74
COMe-cKL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
Graphics
Configuration>
(continued)
Primary Display>
Selects which of IGFX / PEG /PCI graphics devices should be the primary
graphics device or SG for switchable Gfx.
[Auto, IGFX, PEG, PCI, SG]
Select PCIE
Card>
Selects the card used on the platform
Auto: skip GPIO based power enable to dGPU
Elk Creek 4: DGPU power enebale = active low
PEG Eval : DGPU power enable = active high
[Auto, Elk Creek 4, PEG Eval]
Internal
Graphics>
To keep IGFX enabled based on setup options
[Auto, Enabled, Disabled]
GTT Size>
Select GTT size
[2 MB, 4 MB, 8 MB]
Aperture Size>
Selects Aperture size.
Note: above 4GB MMIO, BIOS assignment is automatically enabled when
selecting 2048 MB aperture.
Note:To use this feature disable CSM support.
[128 MB, 256 MB, 512 MB, 1024 MB, 2048 MB]
DVMT
Pre-Allocated>
Select DVMT 5.0 pre-allocated (fixed) graphics memory size used by
internal graphics device.
[0 M, 32 M……..60 M]
DVMT
Total Gfx Mem>
Select DVMT 5.0 total graphics memory size used by internal graphics
device
[256 M, 128 M, Max.]
Gfx Low Power
Mode>
Used for SFF only
[Enabled, Disabled]
VDD Enable>
Enables or disables VDD forcing in BIOS
[Enabled, Disabled]
HDCP Support>
HDCP provisioning BIOS support
[Enabled, Disabled]
Algorithm>
HDCP re-encryption flow
[One-time, Periodic]
PM Support>
Enables or disables PM support
[Enabled, Disabled]
PAVP Enable>
Enables or disables PAVP
[Enabled, Disabled]
Cdynmax
Clamping
Enable>
Enables or disabled cdynmax clamping
[Enabled, Disabled]
Cd Clock
Frequency>
Selects highest Cd clock frequency supported by platform
[337.5 MHz, 450 MHz, 540 MHz, 675 MHz]
IGD
Configuration>
Read Only field
LVS EEPROM data, Data format, Resolution; Colour depth, and Channel count
Note : Optionally visible if a LVS display is use in auto mode or if LFP has
been set manually
www.kontron.com
// 75
COMe-cKL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
Graphics
Configuration>
(continued)
IGD
Configuration>
(continued)
Memory
Configuration>
www.kontron.com
Selects the video device activated during post.
If external graphics are present, this has no effect.
[Auto, EFP, LFP, EFP2]
LFP Panel
Type>
Selects panel type connected to eDP port ar native eDP or
LVDS via bridge device. This switch depends on the
module’s hardware option.
[LVDS, eDP ]
Backlight
Control>
Backlight control setting
[None/external, PWM, PWM Inverted, I2C]
PWM
Frequency>
Sets LCD backlight PWM frequency
[200 Hz, 400 Hz, 1 kHz, 2 kHz, 4 kHz, 8 kHz, 20 kHz, 40 kHz]
Backlight
Value>
Sets LCD backlight brightness
Range : (0-255)
LVDS Clock
Center
Spreading>
Selects LVDS clock frequency center speading depth
[No Spreading]
EFP1 Type>
Selects the integrated HDMI/Display port configuration
with external connectors.
[Displayport Only, DP with HDMI/DVI, DMI/DVI]]
EFP1 LSPCON>
Enables or disables HDMI2.0 feture level shifter/protocol
converter.
[Enabled, Disabled]
EFP2 Type>
Selects the integrated HDMI/Display port configuration
with external connectors.
[Displayport Only, DP with HDMI/DVI, HDMI/DVI]
EFP2 LSPCON>
Enables or disables HDMI2.0 feture level shifter/protocol
converter.
[Enabled, Disabled]
Mode
persistence>
Mode persistence
[Enabled, Disabled]
Center Mode>
Selects display device to be centered [Enabled, Disabled]
Read only field
Memory RC version, Memory frequency, Memory timings (tCL, tRCD, tRP, tRAS),
Channel 0 slot 0, Size, Channel 0 slot 1, Channel 1 slot 0 and Channel 1, slot 1.
Max TOLUD>
VT-d>
IGD- Boot
Type>
Sets maximum TOLUD value. Dynamic assignment adjustsTOLUD
automatically, based on largest MMIO length of installed graphic controller.
[Dynamic, 1 GB, 1.25 GB………3.25 GB, 3.5 GB]
VT-d capability
[Enabled, Disabled]
// 76
COMe-cKL6 – User Guide, Rev 1.0
6.2.3.2. Chipset > PCH-IO Configuration
Figure 9: PCH-IO Configuration Menu Initial Screen
The following table shows the PCH-IO sub-screens and functions, and describes the content. Default options are
bold. Some functions include additional information.
Table 34: Chipset Set > PCH-IO Configuration Sub-screens and Functions
Function
Second level Sub-Screen / Description
PCI Express
Configuration>
PCI Express Clock
Gating>
Enables or disables PCI Express clock gating for each root port
[Enabled, Disabled]
Legacy IO Low
Latency>
Set to enable the latency of legacy IO as some systems require lower IO
latency irrespective of power. This is a tradeoff between power and IO
latency. Auto is equal to POR Setting.
[Enabled, Disabled]
DMI Link ASPM
Control>
Enables or disables control of Active State Power Management on SA
side of DMI link
[Enabled, Disabled]
PCIE Port Assigned
to LAN>
Read Only file
(5)
Port8xh Decode>
Enables or disables PCI express port 8xh decode
[Enabled, Disabled]
Peer Memory
Write Enable>
Enables or disables peer memory write
[Enabled, Disabled]
www.kontron.com
// 77
COMe-cKL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
PCI Express
Configuration>
(continued)
Compliance Test
Mode>
Enable when using compliance load board
[Enabled, Disabled]
PCIe-USB Glitch
W/A>
PCIe-USB Glitch work around for bad USB device(s) connected behind
PCIE/PEG port
[Enabled, Disabled]
PCIe Function
Swap>
Disable prevents PCIO Root port function swap.
If any function other than 0th is enabled, 0th becomes visible.
[Enabled, Disabled]
PCI Root Port 1
(COMe PCIe#0)>
or
PCI Root Port 2
(COMe PCIe#1)>
or
PCI Root Port 3
(COMe PCIe#2)>
or
PCI Root Port 4
(COMe PCIe#3)>
or
PCI Root Port 6
(COMe PCIe#4)>
or
PCI Root Port 9
(COMe PCIe#0)>
PCIe Root port[#]>
Controls the PCI Express port
[Enabled, disabled]
Topology>
Identifies the SATA Topology
[Unknown, x1, x4, SATA Express, M.2.]
ASPM>
Sets ASPM level: Auto is BIOS auto configuration,
Force Los forces all links to Los state and Disable
disables the ASPM.
[Auto, LOsL1, L1, LOs, Disabled]
L1 Substates>
PCI Express L1 substrates settings.
[Disabled, L1.1, L1.2, L1.1 &L1.2]
Gen3 Eq Phase3
method>
PCIe Gen3 Equalization phase 3 method
[Hardware, Static Coeff, Software Search]
UPTP>
Upstream Port Transmitter Preset
DPTP>
Downstream Port Transmitter Preset
ACS>
Access Control Service Extended Capability
[Enabled, Disabled]
URR>
PCI Express unsupported request reporting
[Enabled, Disabled]
FER>
PCI Express device fatal error reporting
[Enabled, Disabled]
NFER>
PCI Express device non-fatal error reporting
[Enabled, Disabled]
CER>
PCI Express device correctable error reporting
[Enabled, Disabled]
CT0>
PCIe Express Completion timer (T0)
[Enabled, Disabled]
SEFE>
Root PCI Express System Error on Fatal Error
[Enabled, Disabled]
SENFE>
Root PCI Express System Error on non-Fatal Error
[Enabled, Disabled]
SECE>
Root PCI Express System Error on correctable error
[Enabled, Disabled]
PME SCI>
PCI Express PME SCI [Enabled, Disabled]
Hot Plug>
PCI Express hot plug [Enabled, Disabled]
www.kontron.com
// 78
COMe-cKL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
PCI Express
Configuration>
(continued)
PCI Root Port 1
(COMe PCIe#0)>
or
PCI Root Port 2
(COMe PCIe#1)>
or
PCI Root Port 3
(COMe PCIe#2)>
or
PCI Root Port 4
(COMe PCIe#3)>
or
PCI Root Port 6
(COMe PCIe#4)>
or
PCI Root Port 9
(COMe PCIe#0)>
(continued)
Advanced Error
Reporting>
Advanced error reporting
[Enabled, Disabled]
PCIe Speed>
Configures PCIe speed
[Auto, Gen 1, Gen 2, Gen3]
Transmitter Half
Swing>
Transmitter half swing
[Enabled, Disabled]
Detect Time Out>
No. of mSec. reference code waits for a link to exit
‘detect state’ for enabled ports before assuming
there is no device and potentially disabling the
port.
Extra Bus
Reserved>
Extra bus reseved (0-7) for bridges behind root
bridge.
Reserved
Memory>
Reserved memory for this root bridge
(1 MB-20 MB)
Reserved I/O>
Reserved IO for this root bridge
Range: (4 k, 8 k, 16 k, 20 k)
PCH PCIE1 LTR>
PCH PCIE latency reporting [Enabled, Disabled]
Snoop latency
Override>
Snoop latency or Non Snoop Override for PCH PCIE.
Disabled: to disable override
Manual: to manually enter override values
Auto (default): maintains default BIOS flow
[Disabled, Manual, Auto]
Non Snoop
latency Override>
Force LTR
Override>
Force LTR override for PCH PCIE.
Disabled: LTR override not forced
Enable: LTR overrides values forced and LTR
messages from device are ignored.
[Enabled, Disabled]
www.kontron.com
PCIE1 LTR Lock>
PCIE LTR configuration lock
[Enabled, Disabled]
PCIE CLKREQ
Mapping
Override>
PCIE CLKREQ override for default platform
mapping
[Default, No CLKREQ, Custom number]
Extra Options>
Detect NonCompliance
Device>
Detects non-compliance PCI
express device. If enabled, it takes
more time at post time.
[Enabled, Disabled]
Prefetchable
Memory>
Prefetchable memory range for
this root bridge
Reserved
Memory
Alignment>
Reserved memory alignments
Range:(0 bits -31 bits)
Prefetchable
Memory
Alignments>
Prefetchable memory alignments
Range:(0 bits -31 bits)
// 79
COMe-cKL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
PCI Express
Configuration>
(continued)
Additional Information PCI port
The PCIe menu refers to the different PCIe lanes using their chipset based numbers. For every
lane, the number used on the COMe c..onnector is mentioned. Take care to select the PCIe
lane you require as numbering varies strongly.
The standard layout for PCIe consists of 8 PCIe x 1 lanes. Other layouts may be programmed
by flashing a different descriptor to the Intel firmware on theBIOS SPI flash. Contact Kontron
Support if you require a different PCIe layout with your project.
SATA and RST
Configuration>
SATA Controller>
Enables or disables SATA device [Enabled, Disabled]
SATA Mode
Selection>
Determines SATA controllers operation
[AHCI, Intel RST Premium]
SATA Test Mode>
Test mode enable or disable (loop back). [Enabled, Disabled]
Software Feature
Mask
Configuration>
HDD Unlock>
Enable indicates that HDD password unlock in OS is
enabled.
[Enabled, Disabled]
LED Locate>
Enable indicated that LED/SGPIO hardware is
attached and ping to locate feature is enabled in OS.
[Enabled, Disabled]
www.kontron.com
Aggressive LPM
Support>
Enable PCH to aggressively enter link power state
[Enabled, Disabled]
SATA Controller
Speed>
Displays the maximum sped supported by SATA controller
[Default, Gen1, Gen2, Gen3]
Serial ATA Port 0>
or
Serial ATA Port 1>
Software
Preserve>
Read only field
Port #>
SATA port # [Enabled, Disabled]
Hot Plug>
Designates port as Hot plug
[Enabled, Disabled]
Configured as
eSATA>
Read only field
Spin Up Device>
If enabled staggered spin-up is performed and only
drives with this option enabled will spin up at boot.
Otherwise all drives spin up at boot spin up
device.[Enabled, Disabled]
SATA Device
Type>
Identifies if SATA port is connected to a solid-state
drive (SSD) or hard disk drive (HDD).
[Hard Disk Drive, Solid State Drive]
Topology>
Identify the SATA Topology
[Unknown, ISATA, Direct Connect, FLEX, M2]
SATA Port#
DevSlp>
SATA Port# DevSlp. Board rework for LP needed
before enable. [Enabled, Disabled]
DITO
Configuration>
DITO configuration
[Enabled, Disabled]
DITO Value>
Read only field
DM Value>
Read only field
// 80
COMe-cKL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
USB
Configuration>
XHCI Disable
Compliance Mode>
Option to disable compliance mode Default is false and compliance
mode is not disabled.True disables compliance mode
[False, True]
xDCI Support>
xDCI (USB OTG device)
[Enabled, Disabled]
USB Port Disable
Override>
Selectively enables or disables the corresponding USB port from
reporting a device connection to the controller
[Disabled, Select Per-Pin]
RTC Lock>
Enable locks bytes 38h-3Fh in lower/upper 128 byte bank of RTC RAM
[Enabled, Disabled]
BIOS Lock>
Enables or disables PCH BIOS lock enable feature. Required to be
enabled to ensure SMM protection of flash.
[Enabled, Disabled]
HD Audio>
Controls detection of the HD Audio device.
Auto enables HD if present or disables if not present otherwise HD
Audio is unconditionally enabled or disabled
[Enabled, Disabled, Auto]
Audio DSP>
Audio DSP
[Enabled, Disabled]
HDA-Link Codec
Select>
Selects between Platform on-board codec (single verb table) or
External codec kit (multiple verb table).
[Platform Onboard, External Kit]
iDisplay Audio
Disconnect>
Disconnects SDI2 signal to hide/disable iDisplay audio codec
[Enabled, Disabled]
PME Enable>
Enables PME wake of HD audio controller during POST.
[Enabled, Disabled]
HD Audio Advanced
Configuration>
I/O Buffer
Ownership>
Selects the ownership of the I/O buffer between
Intel HD audio link and I2S port (for bilingual
codecs).
[HD-Audio Link, HD-Audio Link/I2S Port,
I2S Port]
I/O Buffer Volt.
Select>
Selects voltage operation mode of I/O buffer
[3.3 V, 1.8 V]
HD Audio Link
frequency>
Selects HD audio link frequency. Applicable only if
HDA codec supports one of the selected
frequencies.
[6 MHz, 12 MHz, 24 MHz]
iDisplay Link
Frequnecy >
Selects iDisplay Link frequency. Applicable only if
iDisp codec supports selected frequency.
[48 MHz, 96 MHz]
Security
Configuration>
HD Audio
Configuration>
SCS
Configuration>
www.kontron.com
eMMC 5.0
Controller>
SCS emmC 5.0 controller
[Enabled, Disabled]
Driver strength>
Read only field
Displays the value in (Ω)Ohms
// 81
COMe-cKL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
SCS
Configuration>
(continued)
SDCard 3.0
Controller>
SCS SDHC 3.0 controller
[Enabled, Disabled]
SDCard Sideband
Events>
Card detection support
Disabled: uses GPP_G5 in native mode (Inband wake not functional for
SDHC in D3).
GP_B17 – sets GPP_B17 as GPioInt/GPioIO.
Warning:
Requires RVP rework and Thunderbolt (TBT) must be disabled due to
GPOP conflict. GPP_D10 sets: GPP_D10 as GPioInt/GPioIO
[Disabled, use GPP_B17, Use GPP_D10]
PCH LAN
Controller>
On-board NICs
[Enabled, Disabled]
Wake on LAN>
Integrated LAN to wake the system
If ME is on in the Sx state, Wake On LAN cannot be disabled.
[Enabled, Disabled]
Serial IRQ
Mode>
Configure serial IRQ mode
[Quiet, Continuous]
Port 61h Bit-4
Emulation>
Emulates Port 61h bit-4 toggling in SMM
[Enabled, Disabled]
State After G3>
Specifies state to go to when power is re-applied after power failure (G3 State).
[S0 State, S5 State]
Port 80h
Redirection>
Controls where Port 80h cycles are sent
[LPC Bus, PCIE Bus]
Enhanced Port
8h LPC
Decoding>
Supports word/dword decoding of port 80h behind LPC
[Enabled, Disabled]
www.kontron.com
// 82
COMe-cKL6 – User Guide, Rev 1.0
6.2.4. Security Setup Menu
The Security Setup menu provides information about the passwords and functions for specifying the security
settings. The passwords are case-sensitive.
Figure 10: Security Setup Menu Initial Screen
The following table shows the Security set up sub-screens and functions, and describes the content.
Table 35: Security Setup Menu Functions
Function
Description
Administrator Password>
Sets administrator password
User Password>
Sets user password
If only the administrator’s password is set, then only access to setup is limited and
requested when entering the setup.
If only the user’s password is set, then the password is a power on password and must be
entered to boot or enter setup. In the setup the user has administrator rights.
The required password length in characters is max. 20 and min. 3.
6.2.4.1. Remember the Password
It is highly recommended to keep a record of all passwords in a safe place. Forgotten passwords results in the user
being locked out of the system.
If the system cannot be booted because the User Password or the Supervisor Password are not known, clear the uEFI
BIOS settings, or contact Kontron Support for further assistance.
www.kontron.com
// 83
COMe-cKL6 – User Guide, Rev 1.0
6.2.5. Boot Setup Menu
The Boot Setup menu lists dynamically generated boot device priority order.
Figure 11: Boot Setup Menu Initial Screen
The following table shows the Boot set up sub-screens and functions, and describes the content. Default settings are
bold.
Table 36: Boot Setup Menu Functions
Function
Description
Setup Prompt Timeout>
Displays number of seconds that the firmware waits to setup
activation key. 65535(0xFFFF) means indefinite waiting.
Bootup NumLock State>
Selects keyboard NumLock state
[On, Off]
Quiet Boot>
Quiet Boot option
[Enabled, Disabled]
Boot Option #1>
Sets the system boot order
[UEFI: Built-in EFI shell, Disabled]
Fast Boot>
Enables or disables boot with initialization of a minimal set of
devices required to launch active boot option
This has no effect for BBS boot options.
[Enabled, Disabled]
New Boot Option Policy>
Controls placement of newly detected UEFI boot options
[Default, Place First, Place Last]
www.kontron.com
// 84
COMe-cKL6 – User Guide, Rev 1.0
6.2.6. Save and Exit Setup Menu
The Save and Exit setup menu provides functions for handling changes made to the uEFI BIOS settings and exiting the
setup program.
Figure 12: Save and Exit Setup Menu Initial Screen
The following table shows the Boot set up sub-screens and functions, and describes the content.
Table 37: Save and Exit Setup Menu Functions
Function
Description
Save Changes and Exit>
Exits system after saving changes
Discard Changes and Exit>
Exits system setup without saving changes
Save Changes and Reset>
Resets system after saving changes
Discard Changes and Reset>
Resets system setup without saving changes
Save Changes>
Saves changes made so far for any setup options
Discard Changes>
Discards changes made so far for any setup options
Restore Defaults>
Restores/loads standard default values for all setup options
Save as User Defaults>
Saves changes made so far as user defaults
Restore User Defaults>
Restores user defaults to all setup options
UEFI Built-in EFI shell>
Attempts to launch the built-in EFI Shell
Launch EFI Shell from File System Device>
Attempts to launch EFI Shell application (Shell.efi) from one
of the available file system devices
www.kontron.com
// 85
COMe-cKL6 – User Guide, Rev 1.0
6.3. The uEFI Shell
The Kontron uEFI BIOS features a built-in and enhanced version of the uEFI Shell. For a detailed description of the
available standard shell scripting, refer to the EFI Shell User Guide. For a detailed description of the available
standard shell commands, refer to the EFI Shell Command Manual. Both documents can be downloaded from the EFI
and Framework Open Source Community homepage (http://sourceforge.net/projects/efi-shell/files/documents/).
AMI APTIO update utilities for DOS, EFI Shell and Windows are available at AMI.com:
http://www.ami.com/support/downloads/amiflash.zip.
Kontron uEFI BIOS does not provide all shell commands described in the EFI Shell Command
Manual.
6.3.1. Basic Operation of the uEFI Shell
The uEFI Shell forms an entry into the uEFI boot order and is the first boot option by default.
6.3.1.1. Entering the uEFI Shell
To enter the uEFI Shell, follow the steps below:
1.
Power on the board.
1.
Press the <F7> key (instead of <DEL>) to display a choice of boot devices.
2.
Choose ‘UEFI: Built-in EFI shell’.
EFI Shell version 2.40 [5.11]
Current running mode 1.1.2
Device mapping table
Fs0
:HardDisk - Alias hd33b0b0b fs0
Acpi(PNP0A03,0)/Pci(1D|7)/Usb(1, 0)/Usb(1, 0)/HD(Part1,Sig17731773)
Press the ESC key within 5 seconds to skip startup.nsh, and any other key to continue.
3.
The output produced by the device-mapping table can vary depending on the board’s configuration.
4.
If the ESC key is pressed before the 5 second timeout elapses, the shell prompt is shown:
Shell>
6.3.1.2. Exiting the uEFI Shell
To exit the uEFI Shell, follow one of the steps below:
1.
Use the exit uEFI Shell command to select the boot device, in the Boot menu, that the OS will boot from.
2.
Reset the board using the reset uEFI Shell command.
www.kontron.com
// 86
COMe-cKL6 – User Guide, Rev 1.0
6.4. uEFI Shell Scripting
6.4.1. Startup Scripting
If the ESC key is not pressed and the timeout has run out then the uEFI Shell tries to execute some startup scripts
automatically. It searches for scripts and executes them in the following order:
1.
Initially searches for Kontron flash-stored startup script.
2.
If there is no Kontron flash-stored startup script present then the uEFI-specified startup.nsh script is used.
This script must be located on the root of any of the attached FAT formatted disk drive.
3.
If none of the startup scripts are present or the startup script terminates then the default boot order is
continued.
6.4.2. Create a Startup Script
Startup scripts can be created using the uEFI Shell built-in editor edit or under any OS with a plain text editor of your
choice. To create a startup shell script, simply save the script on the root of any FAT-formatted drive attached to the
system. To copy the startup script to the flash, use the kBootScript uEFI Shell command.
In case there is no mass storage device attached, the startup script can be generated in a RAM disk and stored in the
SPI boot flash using the kRamdisk uEFI Shell command.
6.4.3. Examples of Startup Scripts
6.4.3.1. Execute Shell Script on other Harddrive
This example (startup.nsh) executes the shell script named bootme.nsh located in the root of the first detected disc
drive (fs0).
fs0:
bootme.nsh
www.kontron.com
// 87
COMe-cKL6 – User Guide, Rev 1.0
6.5. Firmware Update
Firmware updates are typically delivered as a ZIP archive containing only the firmware images. The content of the
archive with the directory structure must be copied onto a data storage device with FAT partition.
6.5.1. Updating Procedure
BIOS can be updated with the Intel tool fpt.efi using the procedure below:
1.
Copy these files to an USB stick.

flash.nsh (if available)

fpt.efi

fparts.txt

ckl6r<xxx>.bin (where xxx stands for the version #)
2.
Start the system into setup (see Chapter 6.1 Starting the uEFI BIOS).
3.
Change the following setup items:
4.
Chipset > PCH-IO Configuration > BIOS Security Configuration > BIOS Lock > Disabled
Advanced > PCH-FW Configuration > Firmware update configuration > Local FW Update > Enabled
Save and Exit BIOS setup.
5.
On the next start, boot into shell (see Chapter 6.3.1.1 Entering the uEFI Shell.)
6.
Change to the drive representing the USB stick.
fsx:
(x = 0,1,2,etc. represents the USB stick)
Change to the directory where you copied the flash tool.
cd <your_directory>
7.
Start flash.nsh (if available)
OR type
fpt –SAVEMAC –F ckl6r<xxx>.bin
8.
Wait until flashing is successful and then power cycle the board.
Do not switch off the power during the flash process! Doing so leaves your module
unrecoverable.
Changes under point 3 are only effective during the first boot after the changes were
applied. If you fail to flash during the next boot then you might have to repeat steps 3.
Do not forget to apply –SAVEMAC. If SAVEMAC is not applied then your system will lose it’s
system MAC address. If the MAC address is accidentally deleted, contact Kontron Support.
www.kontron.com
// 88
COMe-cKL6 – User Guide, Rev 1.0
Appendix A: List of Acronyms
Table 38: List of Acronyms
ACPI
Advanced Configuration Power
Interface
HBR2
High Bitrate 2
HDA
High Definition Audio (HD Audio)
API
Application Programming Interface
HD/HDD
Hard Disk /Drive
Basic
Module
COM Express® 125 x 95 Module form
factor
HDMI
High Definition Multimedia Interface
BIOS
Basic Input Output System
HPM
PICMG Hardware Platform Management
specification family
BMC
Base Management Controller
I2C
Inter integrated Circuit Communications
BSP
Board Support Package
IOL
IPMI-Over-LAN
BPP
Bit Per Pixel
IOT
Internet of Things
CAN
Controller-area network
IPMI
Carrier
Board
Application specific circuit board that
accepts a COM Express ® module
Intelligent Platform Management
Interface
KCS
Keyboard Controller Style
COM
Computer-on-Module
KVM
Keyboard Video Mouse
Compact
Module
COM Express® 95x95 Module form
factor
LAN
Local Area Network
CNTG
Computer Network Transaction Group
LPC
Low Pin-Count Interface:
DDC
Display Data Control
LVDS
Low Voltage Differential Signaling –
DDI
Digital Display Interface –
M.A.R.S.
Mobile Application for Rechargeable
Systems
DIMM
Dual In-line Memory Module
MDI
Media Dependent Interface
Display
Port
DisplayPort
(digital display interface standard)
MEI
Management Engine Interface
DMA
Direct Memory Access
Mini
Module
COM Express® 84x55mm Module form
factor
DRAM
Dynamic Random Access Memory
MTBF
Mean Time Before Failure
DVI
Digital Visual Interface
NA
Not Available
EAPI
Embedded Application Programming
Interface
NC
Not Connected
NCSI
Network Communications Services
Interface
PATA
Parallel AT Attachment
PCI
Peripheral Component Interface
PCIe
PCI-Express
PECI
Platform Environment Control Interface
PEG
PCI Express Graphics
PICMG®
PCI Industrial Computer Manufacturers
Group
PHY
Ethernet controller physical layer
device
ECC
Error Checking and Correction
EEPROM
Electrically Erasable Programmable
Read-Only Memory
eDP
Embedded Display Port
EMC
Electromagnetic Compatibility (EMC)
ESD
Electro Sensitive Device
Extended
Module
COM Express® 155mm x 110mm Module
form factor.
FIFO
First In First Out
FRU
Field Replaceable Unit
Gb
Gigabit
GBE
Gigabit Ethernet
Pin-out
Type
COM Express® definitions for signals on
COM Express® Module connector pins.
GPI
General Purpose Input
PS2
Personal System 2 ( keyboard & mouse)
GPIO
General Purpose Input Output
PSU
Power Supply Unit
GPO
General Purpose Output
RoHS
Restriction of Hazardous Substances
Graphics Processing Unit
RTC
Real Time Clock
GPU
www.kontron.com
// 89
COMe-cKL6 – User Guide, Rev 1.0
SAS
Serial Attached SCSI – high speed serial
version of SCSI
TPM
Trusted Platform Module
SATA
Serial AT Attachment:
UART
Universal Asynchronous Receiver
Transmitter
SCSI
Small Computer System Interface
UEFI
Unified Extensible Firmware Interface
SEL
System Event Log
UHD
Ultra High Definition
ShMC
Shelf Management Controller
ULP
Ultra Low Power
SMBus
System Management Bus
USB
Universal Serial Bus
SO-DIMM
Small Outline Dual in-line Memory
Module
VGA
Video Graphics Adapter
VLP
Very Low Profile
SOIC
Small Outline Integrated Circuit
WDT
Watch Dog Timer
SOL
Serial Over LAN
WEEE
SPI
Serial Peripheral Interface
Waste Electrical and Electronic
Equipment ( directive)
SSH
Secure Shell
www.kontron.com
// 90
COMe-cKL6 – User Guide, Rev 1.0
About Kontron
Kontron, a global leader in embedded computing technology and trusted advisor in Internet
of Things (IoT), works closely with its customers, allowing them to focus on their core
competencies by offering a complete and integrated portfolio of hardware, software and
services designed to help them make the most of their applications.
With a significant percentage of employees in research and development, Kontron creates
many of the standards that drive the world’s embedded computing platforms; bringing to
life numerous technologies and applications that touch millions of lives. The result is an
accelerated time-to-market, reduced total-cost-of-ownership, product longevity and the
best possible overall application with leading-edge, highest reliability embedded
technology.
Kontron is a listed company. Its shares are traded in the Prime Standard segment of the
Frankfurt Stock Exchange and on other exchanges under the symbol “KBC”. For more
information, please visit: http://www.kontron.com/

CORPORATE OFFICES
EUROPE, MIDDLE EAST
& AFRICA
NORTH AMERICA
ASIA PACIFIC
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
Tel.: + 49 821 4086-0
Fax: + 49 821 4086-111
info@kontron.com
14118 Stowe Drive
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info@kontron.cn
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