COLOR MONITOR SERVICE MANUAL

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E-mail:http://www.LGEservice.com/techsup.html
COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : CL-81
MODEL:
M1717A (M1717A-BZD.AN**LF)
M1917A (M1917A-BZD.AN**LF,AX**LF)
*(
) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
AUTO/SET
CONTENTS
SPECIFICATIONS ................................................... 2
ADJUSTMENT ...................................................... 12
PRECAUTIONS ....................................................... 3
TROUBLESHOOTING GUIDE .............................. 15
SERVICE PRECAUTIONS ...................................... 4
TIMING CHART ....................................................... 7
DISASSEMBLY ....................................................... 8
WIRING DIAGRAM ............................................... 19
EXPLODED VIEW...................................................20
BLOCK DIAGRAM ................................................... 9
REPLACEMENT PARTS LIST ...............................22
DESCRIPTION OF BLOCK DIAGRAM ................. 11
SCHEMATIC DIAGRAM ......................................... 28
SPECIFICATIONS
1. LCD CHARACTERISTICS
Type
: TFT Color LCD Module
Active Video Area : 17.0 inch-M1717A
: 19.0 inch-M1917A
Size
: 358.5(V) x 296.5(H) x 17(D)-M1717A
: 396.0(V) x 324.0(H) x 16.5(D)-M1917A
Pixel Pitch
: 0.264mm x 0.264mm-M1717A
: 0.098mm x RGBmm x 0.294mm-M1917A
Color Depth
: 6Bits with FRC, 16,777,216 colors
Surface Treatment : Anti-Glare(HAZE 3%), Hard Coating (3H)
Operating Mode
: Normally white
Backlight Unit
: 4CCFL
Electrical Interface : LVDS
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥ 10
Left : -60° min., -70° typ / Right : +60° min., +70° typ
Top : +60° min., +75° typ / Bottom : -50° min., -65° typ
2-2. Luminance
2-3 Contrast Ratio
: 200(min.), 250(typ.)
: 300(min.), 550(typ.)
3. SIGNAL (Refer to the Timing Chart)
3-1. Analog Video Input
1) Video Input Range : 0~0.7V ± 5%
2) Video Termination Impedance : 75Ω ± 5%
3) Sync Type : Separate Sync.
4) Sync Level : TTL Low ≤ 0.8V, High ≥ 2.0V
3-2. Operating Frequency
Horizontal : 30 ~ 70kHz
Vertical
: 56 ~ 75Hz
4. RESOLUTION
Analog Max : 1280 x 1024@60Hz
5. POWER SUPPLY
5-1. Power
AC 100-240Vac, 50/60Hz
5-2. Power Consumption
H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
MODE
POWER ON (NORMAL)
less than 45 W
BLUE
OFF
less than 1 W
AMBER
OFF
less than 1 W
OFF
ON/ON ACTIVE
OFF/ON
SLEEP MODE
ON/OFF
OFF/OFF
POWER S/W OFF
-
6. ENVIRONMENT
5-1. Operating Temperature : 10°C ~ 35°C
5-2. Operating Humidity
: 20% ~ 80%
5-3. MTBF
: 50,000 Hours (Min)
7. DIMENSIONS (with TILT/SWIVEL)
M1717A
Width
: 389.5 mm (15.33'')
Depth
: 232 mm (9.13'')
Height
: 437.9 mm (17.24'')
M1917A
Width
Depth
Height
: 443.6 mm (17.46'')
: 232 mm (9.13'')
: 475.6 mm (18.72'')
8. WEIGHT (with TILT/SWIVEL)
M1717A
Net. Weight
: 5.28 kg (11.64 lbs)
Gross Weight
: 6.84 kg (15.08 lbs)
M1917A
Net. Weight
Gross Weight
-2-
: 6.0 kg (13.23 lbs)
: 7.87 kg (17.35 lbs)
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
WARNING
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
AC Volt-meter
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
-3-
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
To Instrument's
exposed
METALLIC PARTS
1.5 Kohm/10W
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
-4-
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
-5-
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
-6-
TIMING CHART
VIDEO
A
E
D
B
SYNC
C
MODE
H/V
Sync
Polarity
Dot
Clock
Frequency
1
H(Pixels)
+
25.175
31.469
Total
Period
(E)
800
V(Lines)
-
70.09
449
2
3
4
5
6
H(Pixels)
-
V(Lines)
+
H(Pixels)
-
V(Lines)
-
H(Pixels)
-
V(Lines)
-
H(Pixels)
+
V(Lines)
+
H(Pixels)
+
V(Lines)
+
7
H(Pixels)
+/-
V(Lines)
+/-
8
H(Pixels)
-
V(Lines)
-
9
H(Pixels)
-
V(Lines)
-
10
H(Pixels)
+/-
V(Lines)
+/-
11
H(Pixels)
+/-
V(Lines)
+/-
12
H(Pixels)
+
V(Lines)
+
28.321
25.175
31.5
Sync
Video
Duration
Active
(D)
Time ( A )
640
16
Front
Porch
(C)
96
Blanking
Time
(B)
48
60
350
37
2
31.468
900
720
18
108
54
70.08
449
400
12
2
35
31.469
800
640
16
96
48
59.94
525
480
10
2
33
37.5
840
640
16
64
120
75
500
480
1
3
16
37.879
1056
800
40
128
88
60.317
628
600
1
4
23
46.875
1056
800
16
80
160
75.0
625
600
1
3
21
57.283
49.725
1152
832
32
64
224
74.55
667
624
1
3
39
65.0
48.363
1344
1024
24
136
160
60.0
806
768
3
6
29
78.75
60.123
1312
1024
16
96
176
40.0
49.5
100.0
75.029
800
768
1
3
28
68.681
1456
1152
32
128
144
75.062
915
870
3
3
39
92.978
61.805
1504
1152
18
134
200
65.96
937
900
2
4
31
108.0
63.981
1688
1280
48
112
248
60.02
1066
1024
1
3
38
-7-
Resolution
640 x 350
720 X 400
640 x 480
640 x 480
800 x 600
800 x 600
832 x 624
1024 x 768
1024 x 768
1152 x 870
1152 x 900
1280 x 1024
DISASSEMBLY
#1
#2
Remove the screws.
1. Remove the screws.
2. Disassembly Hinge Cover.
#4
#3
Remove the screws.
1. Let the all latches are separated
2. Disassemble back cover.
-8-
BLOCK DIAGRAM
-9-
DESCRIPTION OF BLOCK DIAGRAM
1. Power Supply Block (LIPS)
This Block Generates DC Voltage (5V,15V) to Main Control system from AC Power (100-240 V, 50/60 Hz, 1.0A)
Also it has the inverter function that converts input voltage to AC Rms value for the LCD lamp.
2. DC/DC Converter block
DC/DC Converter convert the input 5V,15V to proper 3.3V, 5V, 8V, 12V for Main control system.
For shooting heat trouble, we use the DC/DC converting IC
3. Audio Amplifier
This block is composed of TPA3005D2 and peripheral device.
The function of the audio amplifier is that to amplify audio L / R signal transmitted from audio decoder.
The audio signal is amplified according to pre-defined DC volume control curve.
4. Audio / Video / IF Decoder / Scaler
This block is composed of LOC1 and peripheral devices.
1) Video Decoder
This Block Selects input Video signals (like CVBS, Y/C, SCART RGB) and output RGB signal.
On decoding, We can control signal like Contrast, Brightness, Sharpness, Color, tint signals including
Adaptive Comb Filter
2) Audio Decoder
This block analyzes audio input signal through A/V Jack and PC audio and Tuner IF.
The analyzed signals transmitted to audio amplifier
On decoding, We can control signal like Bass, treble.
3) IF Decoder
This block can change IF signal to audio and video signal that transmitted to Video/audio decoder.
4) Scaler
This IC includes A/D Converter and LVDS Transmitter
This IC is directly Inputted Analog Signal and transmits it to LCD Module
5) Micom
This block controls each IC through IIC communication line.
5. LVDS Rx (DTC34LF86L) - (Not Include, 20LC1R-ZG Only apply)
It is composed of DTC34LF86L/THC63LVDF84B.
The LVDS Rx converts the LVDS data streams back into 24bits of CMOS/TTL data with
Falling edge or rising edge clock for convenient with variety of LCD panel controllers.
6. Switch IC (PI3V512QE)
It is composed of PI3V512QE.
This IC selects between D-sub RGB signal and LOC1 RGB signal, and it transmits the selected signal to video
signal processor.
7. TUNER
Micom controls this through IIC Line.
TUNER makes IF and transmits IF signal to LOC1.
- 10 -
LIPS Board Block Diagram
12V
50 ~ 60Hz
LINE
100 ~ 240V
EMI
COMPONENTS
INPUT RECTIFIER
AND FILTER
HVDC
ENERGY
TRANSFER
100KHz
OUTPUT RECTIFIER
AND FILTER
5V
GND
PWM
COMTROL
CIRCUIT
PHOTOCOUPLER
ISOLATI ON
PRIMARY
SIGNAL
COLLENTION
SECONDARY
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
- 11 -
EDID ADJUSTMENT
Windows EDID V1.0 User Manual
2. EDID Read & Write
1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update” button
c) Click “ Write” button
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
※ If you don't write EDID, check below
1. Enter "SVC Menu" (refer 14page)
- Enter "Etc"
- Enter "Write Protect
1 : EDID protection (No write)
0 : EDID wirte
- Write EDID
2. Escape " SVC Menu" and push "In-stop" Button on SVC-Remote controller.
- 12 -
ADC ADJUSTMENT
1 PC input ADC
1.1 Gain/Offset Adjustment
■ Convert to PC in Input-source
■ Signal equipment displays
Output Voltage : 700mVp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Pattern : gray pattern that left & right is black and center is white signal (Refer below picture).
(Model : 37, Pattern : 29 at MSPG925)
■ Adjust by enter SVC Menu and push right key at "Auto ADC"
1.2 Confirmation
■ We confirm whether "0x00" address of EEPROM "0xA0" is "0xAA" or not.
■ If "0x00" address of EEPROM "0xA0" isn't "0xAA", we adjust once more
■ We can confirm the ADC values from "0x06~0x0B" addresses in a page "0xA0"
2 AV input ADC
2.1 Gain/Offset Adjustment
■ Convert to AV in Input-source
■ Signal equipment displays
Output Voltage : 700mVp-p
Impress Resolution : CVBS 50Hz .
Pattern : gray pattern that left & right is black and center is white signal (Refer below picture).
(Model : 202, Pattern : 29 at MSPG925L)
■ Adjust by enter SVC Menu and push right key at "Auto ADC"
2.2 Confirmation
■ We confirm whether "0x01" address of EEPROM "0xA0" is "0xAA" or not.
■ If "0x01" address of EEPROM "0xA0" isn't "0xAA", we adjust once more
■ We can confirm the ADC values from "0x0C~0x11" addresses in a page "0xA0"
Adjustment pattern (PC and CVBS)
- 13 -
SERVICE OSD
■ Description of operation
Service Menu
- [00 0 0 0000] : Country Option Code
- Option 1 ~ 4 : Detail Country Option 1 ~ 4(Refer Adjust spec sheet)
- Auto ADC : Adjust ADC in PC or AV by SVC Remote Control
- Audio Setup : Only Engineering. Don't setting
- ETC : ETC Setting
- Full Reset : Factory Reset
- 200X. 0X. 0X : Firmware update date
- PAL-XX : 17 or 19 inchi
- LOC Ver : Video & Audio Decoder Firmware Version
- Sedna Ver : Scaler Firmware Version
[00 0 0 0000]
Auto ADC
Option 1
Option 2
Option 3
Option 4
Audio Setup
ETC
Full Reset
200X. 0X. 0X
PAL - XX
LOC Ver X. XX. XX
Sedna Ver X. XX. XX. XX
■ How to enter SVC Menu
1. Push "IN-Start" Key in SVC remote controller.
2. Push "Menu" Key in remote controller over 5 seconds the while pushing "Menu" key of Local button.
(If SVC OSD appear, remove the finger on "Menu" Key in remote controller first of all)
A
9
IBM
Compatible PC
Video Signal
Generator
15
10
5
11
6
1
6
1
5
C
ed
PARALLEL PORT
RS
LL
EL
OFF
14
ON
RA
F
PA
Power inlet (required)
5V
R
220
WE
VG
ST
MO
YN
C
A
PO
S
NI
TO
R
Power Select Switch
(110V/220V)
Power LED
ON
4.7K
OFF
74LS06
B
E ST Switch
B
F V-Sync On/Off Switch
(Switch must be ON.)
Figure 1. Cable Connection
- 14 -
4.7K
4.7K
5V
E
V-S
Control Line
5V
C
1
25
23
No
t
2C
us
13
74LS06
TROUBLESHOOTING GUIDE
No power
(LED indicator off)
Check 15V or 5V
of Lips
:[A]Process
Fail
Check short of main B/D
or Change Lips
Pass
Pass
Check Output of
Q402
Pass
Check Output of
U406
Fail
Change U406
Pass
Check LED Assy
Change LED Assy
Fail
Pass
Check J103, J125, J126
Connector
- 15 -
Change Q402
Fail
No Raster
:[B]Process
Check LED Status
on display unit
Repeat A PROCESS
Fail
Pass
Check
U402, U403, U406
Fail
Change U402, U403,
U406
Pass
Check the input/
Output of U301
Change U301
Fail
Pass
Check inverter
Connector or inverter
Fail
Change inverter
connector or inverter
Fail
Change panel link
cable or module
Pass
Check panel link
Cable or module
Pass
Check input source cable and jack
- 16 -
No Raster on AV Signal
(SCART, CVBS, S-VHS)
Repeat
[A] Process
No Raster on TV(RF) signal
Fail
Check the output of
TU701
Pass
Pass
Check the signal of
L109, L110, L112
R194, R198, R184
Fail
Change L109, L110, L112
R194, R198, R184
Fail
Re-soldering or
Change the defect part
Check X301
Fail
Re-soldering or
Change the defect part
Pass
Check the
input/output of U301
Pass
Check the
input/output of U101
Pass
Check input source cable and
jack
- 17 -
Fail
Check 5V, 33V of TU701
Re-soldering or
Change the defect part
No Sound
Check the
input source
Fail
Change source input
Pass
Check the input/output
of U301
Fail
Re-soldering or
Change the defect part
Check X301
Fail
Re-soldering or
Change the defect part
Pass
Check the input/output
of U201
Pass
Check the speaker
Fail
Pass
Check the speaker wire
- 18 -
Change speaker
WIRING DIAGRAM
6631T11012W
or 6631T11020W
6631900042B
30P
11P
12P
6631900036E
6P
5240T0F006C-M1717A
5240T0F004A-M1917A
L
5240T0F006B-M1717A
5240T0F006C-M1917A
6631900035C
6400GEXX01A
- 19 -
R
010
070
080
020
090
100
130
110
120
030
040
050
060
EXPLODED VIEW
- 20 -
SCHEMATIC DIAGRAM
1. CONNECTOR & JACK
- 28 -
2. AUDIO AMP
- 29 -
3. SCALER & VIDEO DEC (TDA15521)
- 30 -
4. POWER
- 31 -
5. TUNER (TAEW-G053P)
- 32 -
P/NO : 38289S0041C
Apr. 2006
Printed in Korea