
USER GUIDE
COMe-cAL6
Doc. User Guide, Rev 1.0
Doc. ID: 1061-1953
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COMe-cAL6 – User Guide, Rev 1.0

COME-CAL6 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2017 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com
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COMe-cAL6 – User Guide, Rev 1.0
High Risk Applications Hazard Notice
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.
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COMe-cAL6 – User Guide, Rev 1.0
Revision History
Revision
Brief Description of Changes
Date of Issue
1.0
Initial version
2017-Oct-17
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/termsand-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.
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COMe-cAL6 – User Guide, Rev 1.0
Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of products. Failure to observe the precautions indicated and/or
prescribed by the law may endanger your life/health and/or result in damage to your
material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.
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COMe-cAL6 – User Guide, Rev 1.0
For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.
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COMe-cAL6 – User Guide, Rev 1.0
Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.

Replace only with same or equivalent battery type recommended by the manufacturer.

Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See, Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporateresponsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:

Reduce waste arising from electrical and electronic equipment (EEE)

Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste

Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE

Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.
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COMe-cAL6 – User Guide, Rev 1.0
Table of Contents
Symbols .................................................................................................................................................................................................................6
For Your Safety.................................................................................................................................................................................................... 7
High Voltage Safety Instructions .................................................................................................................................................................. 7
Special Handling and Unpacking Instruction ............................................................................................................................................ 7
Lithium Battery Precautions .......................................................................................................................................................................... 8
General Instructions on Usage...................................................................................................................................................................... 8
Quality and Environmental Management ................................................................................................................................................. 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents ...............................................................................................................................................................................................9
List of Tables.......................................................................................................................................................................................................11
List of Figures .................................................................................................................................................................................................... 12
1/
Introduction .......................................................................................................................................................................................... 13
1.1. Product Description................................................................................................................................................................................... 13
1.2. Product Naming Clarification ................................................................................................................................................................ 13
1.3. COM Express® Documentation ............................................................................................................................................................. 13
1.4. Com Express® Functionality ..................................................................................................................................................................14
1.5. COM Express® Benefits ...........................................................................................................................................................................14
2/
Product Specification ........................................................................................................................................................................ 15
2.1. Module Variants ........................................................................................................................................................................................ 15
2.1.1. Commercial Temperature Grade Modules 0°C to +60°C ........................................................................................................... 15
2.1.2. Industrial Temperature Grade Modules E2-40°C to +85°C...................................................................................................... 15
2.2. Accessories................................................................................................................................................................................................. 16
2.3. Functional Specification .........................................................................................................................................................................18
2.3.1. Block Diagram COMe-cAL6 .................................................................................................................................................................18
2.3.2. Processor ................................................................................................................................................................................................. 19
2.3.3. Platform Controller Hub .................................................................................................................................................................... 20
2.3.4. System Memory ................................................................................................................................................................................... 20
2.3.5. Graphics.................................................................................................................................................................................................... 21
2.3.6. LVDS........................................................................................................................................................................................................... 21
2.3.7. AUDIO ........................................................................................................................................................................................................ 21
2.3.8. PCI Express (PCIE) Lanes [0-4] ........................................................................................................................................................ 22
2.3.9. USB............................................................................................................................................................................................................ 22
2.3.10. SATA........................................................................................................................................................................................................ 23
2.3.11. Ethernet.................................................................................................................................................................................................. 23
2.3.12. COMe High-speed Interfaces ......................................................................................................................................................... 24
2.3.13. Storage Features ................................................................................................................................................................................ 24
2.3.14. BIOS/Software Features.................................................................................................................................................................. 24
2.3.15. COM Features ...................................................................................................................................................................................... 25
2.3.16. Kontron Features................................................................................................................................................................................ 25
2.4. Electrical Specification .......................................................................................................................................................................... 26
2.4.1. Power Supply Voltage Specification .............................................................................................................................................. 26
2.4.2. Power Management ........................................................................................................................................................................... 26
2.4.3. Power Supply Control Settings ....................................................................................................................................................... 27
2.4.4. Power Supply Modes.......................................................................................................................................................................... 27
2.5. Thermal Management ........................................................................................................................................................................... 29
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2.6. Environmental Specification................................................................................................................................................................. 31
2.6.1. Temperature............................................................................................................................................................................................ 31
2.6.2. Humidity ................................................................................................................................................................................................... 31
2.7. Standards and Certifications ............................................................................................................................................................... 32
2.8. Mechanical Specification ...................................................................................................................................................................... 33
2.8.1. Dimensions ............................................................................................................................................................................................. 33
2.8.2. Height ....................................................................................................................................................................................................... 33
2.8.3. Heatspreader Dimensions ................................................................................................................................................................ 34
3/
Features and Interfaces .................................................................................................................................................................. 35
3.1. eMMC Flash Memory .............................................................................................................................................................................. 35
3.2. Micro SD Card............................................................................................................................................................................................ 35
3.3. LPC ................................................................................................................................................................................................................ 36
3.4. Serial Peripheral Interface (SPI) ......................................................................................................................................................... 36
3.4.1. SPI Boot .................................................................................................................................................................................................... 36
3.4.2. Booting from an External SPI Flash ............................................................................................................................................... 37
3.4.3. External SPI Flash on Modules with Intel® ME .......................................................................................................................... 38
3.5. Fast I2C ........................................................................................................................................................................................................ 38
3.6. UART ............................................................................................................................................................................................................ 38
3.7. Dual Staged Watchdog Timer (WDT) ................................................................................................................................................ 38
3.7.1. WDT Signal .............................................................................................................................................................................................. 39
3.8. GPIO.............................................................................................................................................................................................................. 39
3.9. Real Time Clock (RTC) ............................................................................................................................................................................ 39
3.10. Trusted Platform Module (TPM 2.0) ............................................................................................................................................... 39
3.11. Kontron Security Solution .................................................................................................................................................................... 40
3.12. SpeedStep® Technology ...................................................................................................................................................................... 40
4/
System Resources..............................................................................................................................................................................41
4.1. Interrupt Request (IRQ) Lines ...............................................................................................................................................................41
4.2. Memory Area .............................................................................................................................................................................................41
4.3. I/O Address Map ...................................................................................................................................................................................... 42
4.4. Peripheral Component Interconnect (PCI) Devices ..................................................................................................................... 43
4.5. I2C Bus......................................................................................................................................................................................................... 43
4.6. System Management (SM) Bus ..........................................................................................................................................................44
5/
COMe Interface Connectors ........................................................................................................................................................... 45
5.1. X1A and X1B Signals ................................................................................................................................................................................. 45
5.2. X1A and X1B Pin Assignment ................................................................................................................................................................ 46
5.2.1. Connector X1A Row A1 – A110 ........................................................................................................................................................... 47
5.2.2. Connector X1A Row B 1 - B 110 ......................................................................................................................................................... 50
5.2.3. Connector X1B Row C 1 - C 110 .......................................................................................................................................................... 53
5.2.4. Connector X1B Row D 1 - D 110 ......................................................................................................................................................... 56
6/
uEFI BIOS............................................................................................................................................................................................... 59
6.1. Starting the uEFI BIOS ............................................................................................................................................................................. 59
6.2. Setup Menus ............................................................................................................................................................................................. 60
6.2.1. Main Setup Menu ................................................................................................................................................................................... 61
6.2.2. Advanced Setup Menu........................................................................................................................................................................ 62
6.2.3. Chipset Setup Menu ............................................................................................................................................................................ 69
6.2.4. Security Setup Menu ........................................................................................................................................................................... 79
6.2.5. Boot Setup Menu ...................................................................................................................................................................................81
6.2.6. Save and Exit Setup Menu................................................................................................................................................................. 83
6.3. The uEFI Shell............................................................................................................................................................................................ 85
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COMe-cAL6 – User Guide, Rev 1.0
6.3.1. Basic Operation of the uEFI Shell .................................................................................................................................................... 85
6.4. uEFI Shell Scripting ................................................................................................................................................................................. 86
6.4.1. Startup Scripting ................................................................................................................................................................................... 86
6.4.2. Create a Startup Script ....................................................................................................................................................................... 86
6.4.3. Example of Startup Scripts............................................................................................................................................................... 86
6.5. Firmware Update ..................................................................................................................................................................................... 86
6.5.1. Updating Procedure ............................................................................................................................................................................. 86
Appendix A: List of Acronyms......................................................................................................................................................................88
About Kontron .................................................................................................................................................................................................. 90
List of Tables
Table 1: Type 6 and COMe-cAL6 Functionality........................................................................................................................................14
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)................................................................ 15
Table 3: Product number for Industrial Grade Modules E2 (-40°C to +85°C operating) .......................................................... 15
Table 4: Product Accessories ....................................................................................................................................................................... 16
Table 5: COMe Type 6 Accessories ............................................................................................................................................................. 16
Table 6: General Accessories........................................................................................................................................................................ 16
Table 7: Memory Modules ............................................................................................................................................................................. 17
Table 8: Intel ® Apollo Lake Processor Specifications ......................................................................................................................... 19
Table 9: Heatspreader Test Temperature Specifications .................................................................................................................. 29
Table 10: 3-Pin Fan Connector Pin Assignment..................................................................................................................................... 30
Table 11: Electrical Characteristics of the Fan Connector .................................................................................................................. 30
Table 12: Temperature Grade Specifications .......................................................................................................................................... 31
Table 13: Humidity Specification.................................................................................................................................................................. 31
Table 14: Supported BIOS Features ........................................................................................................................................................... 36
Table 15: SPI Boot Pin Configuration ......................................................................................................................................................... 37
Table 16: Supported SPI Boot Flash Types for 8-SOIC Package ....................................................................................................... 37
Table 17: Dual Stage Watchdog Timer- Time-out Events .................................................................................................................. 38
Table 18: Interrupt Requests ........................................................................................................................................................................41
Table 19: Designated Memory Locations ..................................................................................................................................................41
Table 20: Designated I/O Port Address.................................................................................................................................................... 42
Table 21: I2C Bus Port Address.................................................................................................................................................................... 43
Table 22: SMBus Address .............................................................................................................................................................................44
Table 23: General Signal Description ........................................................................................................................................................ 46
Table 24: Connector X1A Row A Pin Assignment (A1-A110) ............................................................................................................... 47
Table 25: Connector X1A Row B Pin Assignment (B1 -B110) .............................................................................................................. 50
Table 26: Connector X1B Row C Pin Assignment (C1 -C110) .............................................................................................................. 53
Table 27: Connector X1B Row D Pin Assignment (D1 -D110).............................................................................................................. 56
Table 28: Navigation Hot Keys Available in the Legend Bar ............................................................................................................. 59
Table 29: Main Setup Menu Sub-screens and Functions.................................................................................................................... 61
Table 30: Advanced Setup menu Sub-screens and Functions ......................................................................................................... 62
Table 31: Chipset> North Bridge Sub-screens and Function............................................................................................................. 69
Table 32: Chipset> South Bridge Sub-screens and Functions.......................................................................................................... 70
Table 33: Chipset> Uncore Configuration Sub-screens and Functions ......................................................................................... 72
Table 34: Chipset>South Cluster Configuration Menu Sub-screens and Functions................................................................. 74
Table 35: Security Setup Menu Sub-screens and Functions ............................................................................................................ 79
Table 36: Boot Setup Menu Sub-screens and Functions ....................................................................................................................81
Table 37: Save and Exit Setup Menu Sub-screens and Functions .................................................................................................. 83
Table 38: List of Acronyms ..........................................................................................................................................................................88
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COMe-cAL6 – User Guide, Rev 1.0
List of Figures
Figure 1: Block Diagram COMe-cAL6 ..........................................................................................................................................................18
Figure 2: Module Dimensions ...................................................................................................................................................................... 33
Figure 3: Module Height ................................................................................................................................................................................ 33
Figure 4: Heatspreader Dimensions.......................................................................................................................................................... 34
Figure 5: X1A and X1B COMe Interface Connectors .............................................................................................................................. 45
Figure 6: Main Setup Menu Initial Screen ................................................................................................................................................. 61
Figure 7: Advanced Setup Menu Initial Screen....................................................................................................................................... 62
Figure 8: Chipset > North Bridge Menu Initial Screen.......................................................................................................................... 69
Figure 9: Chipset > South Bridge Menu Initial Screen .......................................................................................................................... 70
Figure 10: Chipset>Uncore Configuration Menu Initial Screens ........................................................................................................ 71
Figure 11: Chipset>South Cluster Configuration Menu Initial Screen ............................................................................................. 74
Figure 12: Security Setup Menu Initial Screen ........................................................................................................................................ 79
Figure 13: Boot Setup Menu Initial Screen ................................................................................................................................................81
Figure 14: Save and Exit Setup Menu Initial Screen.............................................................................................................................. 83
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COMe-cAL6 – User Guide, Rev 1.0
1/ Introduction
1.1. Product Description
The COMe-cAL6 is a compact form factor, COM Express® type 6 Computer-on-Module based on Intel® Apollo Lake®
series of processors Atom™, Pentium® and Celeron®, with an integrated chipset. The COMe-cAL6 combines increased
efficiency and performance with TDP as low as 6 W, and no more than 12 W with Intel’s® extensive HD Graphics
capabilities.
The main COMe-cAL6 features are:

Intel® Apollo Lake® series of processors with integrated chipset

Up to 8 GByte DDR3L 1600/1866 (non-ECC) with 2x SO-DIMM sockets

High-speed connectivity includes: up to 5x PCIe x1, 4x USB 3.0 (including USB 2.0) + 4x USB 2.0, and
2x SATA Gen 3 (6 Gb/s)

Support for both commercial and Industrial temperature grade environments
1.2. Product Naming Clarification
COM Express® defines a Computer-on-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a super component. The product names for Kontron COM Express® Computer-on-Modules
consist of:

Short form of the industry standard



Module form factor

b=basic (125mm x 95mm)

c=compact (95mm x 95mm)

m=mini (84mm x 55mm)
Intel’s processor code name




AL = Apollo Lake
Pinout type

Type 6

Type 7

Type10
Available temperature variants

Commercial

Extended (E1)

Industrial (E2)

Screened industrial (E2S) and Rapid shutdown screened industrial (R E2S)
Processor Identifier


COMe-
Chipset identifier (if chipset assembled)
Memory size

Memory down + DIMM memory (#GB) / eMMC pSLC memory (#S)
1.3. COM Express® Documentation
The COM Express® Specification defines the COM Express® module form factor, pinout and signals. The COM Express
document is available at the PICMG® website.
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1.4. Com Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220-pin connectors; each of it has two rows
called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-onModules feature the following maximum amount of interfaces according to the PICMG module pinout type.
Table 1: Type 6 and COMe-cAL6 Functionality
Feature
Type 6 Pinout
COMe-cAL6 Pinout
HD Audio
1x
1x
Gbit Ethernet
1x
1x
Serial ATA
4x
2x
PCI Express x 1
8x
5x
PCI Express x16 (PEG)
1x
Not supported
USB Client
1x
1x (USB Port 0 is dual role Client/Host)
USB
4x USB 3.0 (Including USB 2.0)
4x USB 2.0
4x USB 3.0 (Including USB 2.0)
4x USB 2.0
VGA
1x
Not supported
LVDS
Dual Channel
Dual Channel LVDS with optional
embedded display port (eDP) overlay
DP++ (eDP/DP/HDMI/DVI/VGA)
3x
2x
LPC
1x
1x
External SMB
1x
1x
External I2C
1x
1x
GPIO
8x
8x (4x GPI, 4x GPO)
SDIO shared w/GPIO
1x optional
Not supported
UART (2-wire COM)
2x
2x
FAN PWM out
1x
1x
Express Card
2x
2x
1.5. COM Express® Benefits
COM Express® defines a Computer-on-Module, or COM, with all the components necessary for a bootable host
computer, packaged as highly integrated computer. All Kontron COM Express® modules are very compact and feature
a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is
based on the COM Express® specification. This standardization allows designers to create a single-system baseboard
that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s
packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
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2/ Product Specification
2.1. Module Variants
The COMe-cAL6 is available in different processor and chipset variants to cover demands in performance, price and
power.
2.1.1. Commercial Temperature Grade Modules 0°C to +60°C
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)
Product Number
Product Name
Description
36023-0000-11-4
COMe-cAL6 N4200
COM Express® compact pin-out type 6 Computer-onModule with Intel® Pentium® N4200, commercial grade
36023-0000-11-2
COMe-cAL6 N3350
COM Express® compact pin-out type 6 Computer-onModule with Intel® Celeron® N3350,commercial grade
2.1.2. Industrial Temperature Grade Modules E2-40°C to +85°C
Table 3: Product number for Industrial Grade Modules E2 (-40°C to +85°C operating)
Product Number
Product Name
Description
36024-0032-16-7
COMe-cAL6 E2 E3950 32S PCIe
COM Express® compact pin-out type 6 Computer-onModule with Intel® Atom™ x7 E3950, 32 GB pSLC eMMC,
PCIe Hub, industrial temperature
36024-0000-16-7
COMe-cAL6 E2 E3950
COM Express® compact pin-out type 6 Computer-onModule with Intel® Atom™ x7 E3950, industrial
temperature
36024-0000-16-5
COMe-cAL6 E2 E3940
COM Express® compact pin-out type 6 Computer-onModule with Intel® Atom™ x5 E3940, industrial
temperature
36024-0000-13-5
COMe-cAL6 E2 E3930
COM Express® compact pin-out type 6 Computer-onModule with Intel® Atom™ x5 E3930, industrial
temperature
www.kontron.com
// 15
COMe-cAL6 – User Guide, Rev 1.0
2.2. Accessories
Accessories are either COMe-cAL6 product specific, COMe type 6 specific, or general accessories including memory
modules. For more information, contact your local Kontron sales representative or Kontron Inside Sales.
Table 4: Product Accessories
Part Number
Heatspreader ( validated ref. types)
Description
36024-0000-99-0
HSP COMe-cAL6 E2 thread
Heatspreader for COMe-cAL6 E2, threaded mounting
holes
36024-0000-99-1
HSP COMe-cAL6 E2 through
Heatspreader for COMe-cAL6 E2, through holes
Table 5: COMe Type 6 Accessories
Part Number
COMe Carrier
Project Code
Description
38115-0000-00-x
COM Express® Ref. Carrier-i Type 6
ADTI
Thin-mITX carrier with 5 mm COMe
connector
38114-0000-00-0
COM Express® Ref. Carrier Type 6
ADAS
mITX carrier with 8 mm COMe
connector
38106-0000-00-0
COM Express® Eval. Carrier Type 6
Topanga
Canyon
ATX carrier with 5 mm COMe
connector
Part Number
COMe Adapter / Card
Project Code
Description
96007-0000-00-3
ADA-PCIe-DP
APDP
PCIe x16 to DP Adapter for Evaluation
carrier
96007-0000-00-7
ADA-Type6-DP3
DVO6
(Sandwich) Adapter Card for 3x
Display Port
96006-0000-00-2
COMe POST T6
NFCB
POST Code / Debug Card
38019-0000-00-0
ADA-COMe-Height-dual
EERC
Height Adapter
Part Number
COMe Starter Kit
Project Code
Description
38114-0000-00-S
COMe Ref. Starter kit T6
ADAS
Starter Kit with COMe Reference
carrier T6
38106-0000-00-S
COMe Eval. Starter kit T6
Topanga
Canyon
Starter Kit with COMe Evaluation
carrier T6
Table 6: General Accessories
Part Number
Cooling Solutions
Description
36099-0000-99-0
COMe Active Uni cooler
For CPUs up to 20 W TDP, to be mounted on HSP
36099-0000-99-1
COMe Passive Uni Cooler
For CPUs up to 10 W TDP, to be mounted on HSP
Part Number
Mounting
Description
38017-0000-00-5
COMe Mount KIT 5 mm 1 set
Mounting Kit for 1 module including screws for
5 mm connectors
38017-0100-00-5
COMe Mount KIT 5 mm 100 sets
Mounting Kit for 100 modules
including screws for 5 mm connectors
38017-0000-00-0
COMe Mount KIT 8 mm 1 set
Mounting Kit for 1 module
including screws for 8 mm connectors
Part Number
Mounting
Description
38017-0100-00-0
COMe Mount KIT 8 mm 100 sets
Mounting Kit for 100 modules including screws for
8 mm connectors
www.kontron.com
// 16
COMe-cAL6 – User Guide, Rev 1.0
Part Number
Display Adapters
Description
96006-0000-00-8
ADA-DP-LVDS
DP to LVDS adapter
96082-0000-00-0
KAB-ADAPT-DP-DVI
DP to DVI adapter cable
96083-0000-00-0
KAB-ADAPT-DP-VGA
DP to VGA adapter cable
96084-0000-00-0
KAB-ADAPT-DP-HDMI
DP to HDMI adapter cable
Part Number
Cables
Description
96079-0000-00-0
KAB-HSP 200 mm
Cable adapter to connect FAN to module
(COMe basic/compact)
96079-0000-00-2
KAB-HSP 40 mm
Cable adapter to connect FAN to module
(COMe basic/compact)
Table 7: Memory Modules
Part Number
Memory (validated reference types)
Description
97015-2048-19-0
DDR3L-1866 SODIMM 2GB_COM
DDR3L SDRAM, 204-pin, Speed = 933 MHz / DDR3L1866 / 1.35 V
97015-2048-19-2
DDR3L-1866 SODIMM 2GB E2_COM
DDR3L SDRAM, 204-pin, Speed = 933 MHz / DDR3L1866 / 1.35 V, industrial temperature -40°C to +85°C
97015-4096-19-0
DDR3L-1866 SODIMM 4GB_COM
DDR3L SDRAM, 204-pin, Speed = 933 MHz / DDR3L1866 / 1.35 V
97015-4096-19-2
DDR3L-1866 SODIMM 4GB E2_COM
DDR3L SDRAM, 204-pin, Speed = 933 MHz / DDR3L1866 / 1.35 V, industrial temperature -40°C to +85°C
97015-8192-19-0
DDR3L-1866 SODIMM 8GB_COM
DDR3L SDRAM, 204-pin, Speed = 933 MHz / DDR3L1866 / 1.35 V
97015-8192-19-2
DDR3L-1866 SODIMM 8GB E2_COM
DDR3L SDRAM, 204-pin, Speed = 933 MHz / DDR3L1866 / 1.35 V, industrial temperature -40°C to +85°C
www.kontron.com
// 17
COMe-cAL6 – User Guide, Rev 1.0
2.3. Functional Specification
2.3.1. Block Diagram COMe-cAL6
Figure 1: Block Diagram COMe-cAL6
www.kontron.com
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COMe-cAL6 – User Guide, Rev 1.0
2.3.2. Processor
The Intel® Apollo Lake® series of processors use the 14 nm processor technology with 24 mm x 31 mm package size
and FCBGA 1296.
In general, the Intel® Apollo Lake series of processors support the following technologies:

Intel® 64 Architecture

Idle States

Intel® Virtualization Technology (VT-x) and Virtualization Technology for Directed I/O (VT-d)

Secure Boot

Enhanced Intel Speedstep® Technology

Thermal Monitoring Technologies

Intel® HD Audio Technology

Intel® Identity Protection Technology

Intel® AES New Instructions

Secure Key
The following table lists the general Intel® Apollo Lake® processor specifications.
Not all the items specified below are compatible with the COMe-cAL6’s functional
specification. For items marked with (*), see the relevant subheading in Chapter 2.3
Functional Specification for COMe-cAL6 specific compatibility information.
Table 8: Intel ® Apollo Lake Processor Specifications
Specifications
Atom™
Atom™
Atom™
Pentium®
Celeron®
x7 E3950
x5 E3940
x5 E3930
N4200
N3350
# of Cores
4
4
2
4
2
# of Threads
4
4
2
4
2
Processor Base
Frequency
1.6 GHz
1.6 GHz
1.3 GHz
1.1 GHz
1.1 GHz
Burst Frequency
2 GHz
1.8 GHz
1.8 GHz
2.5 GHz
2.4 GHz
Thermal Design
Power (TDP)
12 W
9.5 W
6.5 W
6W
6W
Cache
2 MB L2
2 MB L2
2 MB l2
2 MB L2
2 MB LB
Memory Types (*)
DDR3Lup to 1866
LPDDR4
up to 2400
DDR3Lup to 1866
LPDDR4
up to 2133
DDR3Lup to 1866
LPDDR4
up to 2133
DDR3L/LPDDR3up to 1866
DDR3L/LPDDR3up to 1866
Max. Memory
Channels (*)
4
4
4
2
2
Max. Memory Size
8 GB
8 GB
8 GB
8 GB
8 GB
Max. Memory
Bandwidth (*)
38.4 GB/s
34.1 GB/s
34.1 GB/s
29.86 GB/s
29.86 GB/s
ECC Memory (*)
Supported
Supported
Supported
Not supported
Not supported
HD Graphics
HD Graphics 505
HD Graphics
500
HD Graphics
500
HD Graphics
505
HD Graphics 500
PCIe Express
Configurations (*)
x4, x2, x1
x4, x2, x1
x4, x2, x1
4x1 or 1x4+1x2
or 2x1+1x2+1x2
4x1 or 1x4+1x2
or 2x1+1x2+1x2
Max. # PCIe Lanes (*)
6
6
6
6
6
www.kontron.com
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COMe-cAL6 – User Guide, Rev 1.0
2.3.3. Platform Controller Hub
The Intel® Apollo Lake® product family is a System on a Chip (SoC) solution with integrated chipset.
The following table lists specific Platform Controller Hub (PCH) features.
USB
4x USB 3.0 (including USB 2.0)
4x USB 2.0
VT-d
Supported
SATA RAID
Not supported
2.3.4. System Memory
The system memory supports two memory channels with up to 1866 DDR3L, SO-DIMM sockets for a maximum of up
to eight GBytes of non-ECC memory.
The following table lists specific system memory features.
Socket
2x SO-DIMM DDR3L
Memory Type
Channel 1: DDR3L-up to 1866 SO-DIMM, up to 8 GB non-ECC
Channel 2: DDR3L-up to 1866 SO-DIMM, up to 8 GB non-ECC
Memory Module Size
2 GByte, 4 GByte and 8 Gbyte
Peak Bandwidth
29.86 GB/s at 1866 MT/s
25.60 GB/s at 1600 MT/s
In general, memory modules have a much lower longevity than embedded motherboards, and therefore the EOL of
the memory modules may occur several times during the lifetime of the module. Kontron guarantees to maintain
memory modules by replacing EOL memory modules with another similar type of qualified module.
As a minimum, it is recommend to use Kontron memory modules for prototype system(s) in order to prove the
stability of the system and as a reference.
For volume production, if required, test and qualify other types of RAM. In order to qualify RAM it is recommend to
configure three systems running a RAM Stress Test program in a heat chamber at 60°C, for a minimum of 24 hours.
For a list of Kontron memory modules, see Chapter 2.2 Accessories.
www.kontron.com
// 20
COMe-cAL6 – User Guide, Rev 1.0
2.3.5. Graphics
2.3.5.1. Digital Display Interfaces
Up to three independent Digital Display Interfaces (DDIs) can be used simultaneously and in combination, to
implement an independent or cloned display configuration.
Standard DDIs are:

2x DP 1.2 (++) on DDI1/DDI2

1x eDP 1.4/LVDS
For the DP++ interface, it is recommended to use DP-to-HDMI and DP-to-DVI dongles that
are compliant to the VESA DisplayPort Dual-Mode Standard only.
Otherwise, there might be display detection issues, if dongles are used with FET level shifter
for DDC translation.
2.3.5.2. Display Resolution
The following table lists the maximum display resolutions at a set frequency and bit per pixel (bpp) for the supported
display interfaces.
Display Interfaces
Maximum Resolution
eDP
3840 x 2160 (60 Hz, 30 bpp)
DP 1.2 (++)
4096 x 2160 (60 Hz, 30 bpp)
HDMI 1.4
3840 x 2160 (30 Hz, 24 bpp)
DVI-D
3840 x 2160 (30 Hz, 24 bpp)
2.3.6. LVDS
A dual channel LVDS interface with two pixels per clock allows for up to 48-bit color. LVDS channel A and control
signals are shared with eDP signals. The eDP to LVDS bridge is only necessary for LVDS support and can be removed if
LVDS signals are optionally overlaid with eDP signals.
The following table lists basic LVDS features.
LVD Channels
1x or 2x
LVDS Bits / Pixel
Up to 48-bit
LVDS Maximum Resolution
Up to 1920 x 1280 (depending on available panels)
PWM Backlight Control
Configurable LVDS with I2C/PWM backlight support
Supported Panel Data
JILI / EDID / VESA DisplayID
2.3.7. AUDIO
The display controllers DDIs support audio on DP and HDMI. The Intel HDA link allows for the connection of a
maximum of one codec that can be connected to an external third party peripheral audio device via the Intel® HDA
interface.
Audio controller features are:

HD-Audio and LPE Audio for DDI0/DDI1

One external CODEC for external audio devices
www.kontron.com
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COMe-cAL6 – User Guide, Rev 1.0
2.3.8. PCI Express (PCIE) Lanes [0-4]
The COMe connector supports up to five general-purpose PCIe Gen 1 (2.5 GT/s) or PCIe Gen 2 (5 GT/s) lanes. The
number of PCIe lanes varies depending on whether an optional PCIe hub switch and/or LAN is implemented
Four separate external PCIe devices are available on SoC PCIE ports [0-3]. If LAN is implemented, LAN uses
SoC PCIE port 3 and only three external PCI devices can be implemented. Up to five external PCIe devices are available
if a PCIe hub switch is implemented on SoC PCIE port 2.
The following table shows the supported PCIe port options for COMe lanes [0-4].
Number of
PCI Ports
Lane 0
Lane 1
Lane 2
Lane 3
Lane 4
Comments
3x PCIe Ports
(with LAN)
SoC PCIE0
SoC PCIE1
SOC PCIE2
NC
NC
SoC port 3 connected to LAN
4x PCIe Ports
(no LAN and
no PCIe Switch)
SoC PCIE0
SoC PCIE1
SoC PCIE2
SoC PCIe3
NC
No LAN connection
5x PCIe Ports
(with LAN and
with PCIe Switch)
SoC PCIE0
SoC PCIE1
PCIe_SW3
PCIe_SW1
PCIe_SW2
SoC PCIe port 2 connected to PCIe
hub switch and SoC PCIe port 3
connected to LAN
The default PCIe configuration is 3x PCIE ports with LAN. Other PCIe configurations are available for the 4x PCIE port
and 5x PCIE port options. For more configuration information, contact Kontron Support.
The following table shows the PCIe link configurations.
COMe
Lane
PCIe I/O
Port
3x PCIe Ports
4 x PCIe Port
5x PCIe Ports
Configuration
(3x 1) Default
Configuration
(4x 1)
Configuration
(2x 2)
Configuration
(1x 4)
Configuration
(5x 1)
0
0
x1
x1
x2
x4
x1
1
1
x1
x1
2
2
x1
x1
3
3
NC
x1
4
4
NC
NC
x1
x2
x1
x1
NC
NC
x1
2.3.9. USB
Both USB 3.0 ports and USB 2.0 ports are available, where USB 3.0 ports are backwards compatible with the USB 2.0
specification. This allows for either a maximum of four USB 3.0 ports and four USB 2.0 ports, or alternatively eight
USB 2.0 ports. If the optional Kontron security chip is assembled, the number of available USB 2.0 ports is reduced as
USB 2.0 port 6 is no longer available. For more information, see Chapter 3.11 Kontron Security Solution.
The following table lists supported USB features.
USB Ports
4x USB 3.0 ports (Including USB 2.0)
4x USB 2.0 ports
USB Over Current Signals
4x
USB Client Port
1x ( USB Port 0 is dual role Client/Host)
www.kontron.com
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COMe-cAL6 – User Guide, Rev 1.0
The following table lists the COMe connector port and the SoC port USB 3.0 or USB 2.0 combinations.
COMe Port
SoC
High-speed
I/O Port
SoC Function
USB 2.0
USB 3.0
USB_0
USB#_0


USB 2.0/3.0 dual role, device mode can be enabled with
standard BIOS (additional driver support necessary)
USB_1
USB#_1


USB 3.0/USB 2.0
USB_2
USB#_2


USB_3
USB#_3


USB#_4

USB_5
USB#_5

USB_6
USB#_6

USB 2.0 or optional assembly of Kontron’s security chip
connected to SoC USB2 Port 6 and COMe Port 6. If the security
chip is connected, SoC USB2 port 6 is not available.
USB_7
USB#_7

USB 2.0 or on customer request USB 2.0 dual role
USB_4
Comment
USB 2.0
2.3.10. SATA
The SATA high-speed storage interface supports two SATA Gen.3 ports with transfer rates of up to 6 Gb/s. The
following SATA ports are available at the specified COMe connector ports.
The following table lists the COMe connector port and SoC port SATA combinations.
COMe Port
SoC
High-speed
I/O Port
SoC Function
Comment
SATA_0
SATA #0
SATA #0
SATA Gen.3, 6 Gb/s
SATA_1
SATA #1
SATA #1
SATA Gen.3, 6 Gb/s
2.3.11. Ethernet
One Gigabit Ethernet port is implemented on GBE0 and supports 10/ 100/ or 1000 Mbit/sec modes .If LAN is
implemented, then PCIe port 3 is connected to the Ethernet controller.
The following table lists the supported Ethernet features.
Ethernet
10/100/1000 Mbit
Ethernet Controller
Intel ® i211AT Ethernet controller (commercial temperature)
Intel® i210IT Ethernet controller (industrial temp)
Ethernet features are:

Physical layer ports supporting Ethernet Media Dependent Interfaces MDI[10-3]

Energy Efficient Ethernet (IEEE 802.3az)

Jumbo frames (up to 9 kB)

Interrupt moderation, VLAN support, IP checksum

RSS and MSI-X to lower CPU utilization in multi-core systems

Advanced cable diagnostics, auto MDI-X

Error correcting memory (ECC)

IEEE1588/802.1AS precision time synchronization for Time Sensitive Networking (TSN) applications
www.kontron.com
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COMe-cAL6 – User Guide, Rev 1.0
2.3.12. COMe High-speed Interfaces
High-speed serial interfaces, available on the COMe connector include PCI Express Gen. 2, USB 3.0, SATA Gen. 3 and up
to 1 Gb Ethernet.
The following table shows the relationship between the COMe connector ports and the SoC high-speed I/O ports.
COMe
Port
SoC
High-speed
I/O Port
SoC I/O Function
USB 3.0
PCIe
Comments
SATA
LAN
PCIE_0
PCIe #0
PCIe #0
PCI Express Gen. 2
PCIE_1
PCIe #1
PCIe #1
PCI Express Gen. 2
PCIE_2
PCIe #2
PCIe #2
PCI Express Gen. 2
PCIE_3/
GBE0_MDI
PCIe #3
PCIe #3
PCIE_4
PCIe #4
PCIe #4
SATA_0
SATA #0
SATA_1
SATA #1
USB_SS0
USB3_0
USB3_0
USB 3.0
USB_SS1
USB3_1
USB3_1
USB 3.0
USB_SS2
USB3_2
USB3_2
USB 3.0
USB_SS3
USB3_3
USB3_3
USB 3.0
GBE0_MDI
Shared lane 1 Gbit LAN or
PCIe Express Gen 2
Available for PCIe switch
variants only
SATA #0
SATA Gen. 3
SATA #1
2.3.13. Storage Features
The following table lists supported storage features.
eMMC
Optional eMMC 5.0 MLC or pseudo SLC NAND Flash
SD Card Support
Optional on-board micro SD card slot for SD memory card support
compliant to SD memory card specification version 3.01
2.3.14. BIOS/Software Features
The following table lists supported BIOS and software features.
Supported BIOS EFI
AMI Aptio V UEFI
Software
KEAPI 3.0 for all supported OS
Linux PLD driver
BIOS/EFI Flash utility for EFI shell, Windows, Linux
BIOS/EFI Utility for customers to implement Boot Logo
OS Support
Windows 10, (64-bit)
Linux 64 bit + LiveCD
VxWorks 7.X (64-bit)
www.kontron.com
// 24
COMe-cAL6 – User Guide, Rev 1.0
2.3.15. COM Features
The following table lists supported COMe specification features. For more information, refer to the COM Express®
Specification.
SPI
Boot from an external SPI
LPC
Supported
UART
2x UART (RX/TX)
LID Signal
Supported
Sleep Signal
Supported
Audio
1x external HDA codec
SMBus
Supported
2.3.16. Kontron Features
The following table lists supported Kontron specific product features.
External I2C Bus
Fast I2C, 0 KHz - 400 kHz, MultiMaster capable
Embedded API
KEAPI3
Custom BIOS Settings /
Flash Backup
Supported
Watchdog Support
Dual staged
External SIO
Supported on the baseboard
GPIO
8x GPIO (4x GPI and 4X GPO)
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COMe-cAL6 – User Guide, Rev 1.0
2.4. Electrical Specification
2.4.1. Power Supply Voltage Specification
The COMe-cAL6 supports operation in both ATX and single power supply modes.
The following table lists the power supply voltages.
Supply Voltage (VCC)
12 V
Standby Voltage
5 V ±5%
Supply Voltage Range (VCC)
8.5 V to 20 V ( across the whole temperature range)
RTC Voltage Range
2.8 V to 3.47 V
5 V Standby voltage is not mandatory for operation.
2.4.1.1. Power Supply Rise Time
The input voltage rise time is 0.1 ms to 20 ms from input voltage ≤10% to nominal VCC (12 V). To comply with the ATX
specification there must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of the DC input
voltage final set point.
2.4.1.2. Power Supply Voltage ripple
The maximum power supply voltage ripple is 100 mV peak-to-peak at 0 MHz to 20 MHz.
2.4.2. Power Management
Power management options are available within the BIOS setup.
ACPI Settings
ACPI 5.0
Miscellaneous Power
Management
Supported in BIOS setup menu
Within the BIOS setup, If VCC power is removed, 5 V ±5% can be applied to the V_5V_STBY pins to support the
following suspend-states:

Suspend to RAM (S3)

Suspend-to-disk / Hibernate (S4)

Soft-off state (S5)
The Wake-Up event (S0) requires VCC power, as the board is running.
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COMe-cAL6 – User Guide, Rev 1.0
2.4.3. Power Supply Control Settings
The power supply control settings are set in the BIOS and enable the module to shut down, rest and wake from
standby properly.
The following table lists the implemented powersupply control settings.
Power Button
(PWRBTN#)
Pin
B12
To start the module using the power button, the PWRBTN# signal must be at least
50 ms (50 ms ≤ t < 4 s, typical 400 ms) at low level (Power Button Event). Pressing
the power button for at least four seconds turns off power to the module (Power
Button Override).
Power Good
(PWR_OK)
Pin
B24
PWR_OK is internally pulled up to 3.3 V and must be at the high level to power on the
module. This can be driven low to hold the module from powering up as long as
needed. The carrier needs to release the signal when ready.
Low level prevents the module from entering the S0 state. A falling edge during S0
causes a direct switch to S5 (Power Failure). After a power failure (PWR_OK going
HIGH again) the module will not start up automatically.
Reset Button
(SYS_RESET#)
Pin
B49
When the SYS_RESET# pin is detected active (falling edge triggered), it allows the
processor to perform a “graceful” reset, by waiting up to 25 ms for the SMBus to go
idle before forcing a reset, even though activity is still occurring. Once the reset is
asserted, it remains asserted for 5 ms to 6 ms regardless of whether the
SYS_RESET# input remains asserted or not.
SM-Bus Alert
(SMB_ALERT#)
Pin
B15
With an external battery manager present and SMB_ALERT #connected, the
module always powers on even if the BIOS switch “After Power Fail” is set to “Stay
Off”.
The COMe-cAL6 includes an additional cold reset during the first cold boot after a complete
power loss (including battery voltage). This additional reset will not happen on any
subsequent warm or cold reboots.
2.4.4. Power Supply Modes
Setting the power supply controls enables the module to operating in either ATX power mode or in single power
supply mode.
2.4.4.1. ATX Power Mode
To start the module in ATX mode and power VCC, follow the step below.
1.
Connect the ATX PSU with VCC and 5 VSB to set PWR_OK to low and VCC to 0 V.
2.
Pressing the power button then sets the PWR_OK to high and powers VCC.
The PS_ON# signal, generated by SUS_S3# (A15), indicates that the system is in Suspend to RAM state. An inverted
copy of SUS_S3# on the carrier board may be used to enable non-standby power on a typical ATX supply. The input
voltage must always be higher than 5 V standby (VCC > 5 VSB) for Computer-on-Modules supporting a wide input
voltage range down to 8.5 V.
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COMe-cAL6 – User Guide, Rev 1.0
The following table lists the ATX power mode settings.
State
PWRBTN#
PWR_OK
V5_StdBy
PS_ON#
VCC
G3
x
x
0V
x
0V
S5
High
Low
5V
High
0V
S5 → S0
PWRBTN event
Low → High
5V
High → Low
0 V→ VCC
S0
High
High
5V
Low
VCC
(x) – Defines there is no difference if connected or open.
2.4.4.2. Single Supply Power Mode
In single supply mode, without 5 V standby, the module starts automatically if VCC power is connected and the Power
Good input is open or at the high level (internal PU to 3.3 V).
PS_ON# is not used in single supply mode and the input voltage VCC range can be 8.5 V to 20 V.
To power on the module from S5 state, press the power button or reconnect VCC. Suspend/Standby states are not
supported in single supply mode.
The following table lists the single supply power mode settings.
State
PWRBTN#
PWR_OK
V5_StdBy
VCC
G3
0V/x
0V/x
0V/x
0V/x
G3 → S0
High
Open / High
Open
connecting VCC
S5
High
Open / High
Open
VCC
S5 → S0
PWRBTN event
Open / High
Open
reconnecting VCC
(x) – Defines there is no difference if connected or open.
All ground pins must be connected to the carrier board’s ground plane.
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COMe-cAL6 – User Guide, Rev 1.0
2.5. Thermal Management
2.5.1. Heatspreader and Active or Passive Cooling Solutions
A heatspreader plate assembly is available from Kontron for the COMe-cAL6. The heatspreader plate assembly is
NOT a heat sink. The heatspreader works as a COM Express® standard thermal interface to be use with a heat sink or
external cooling devices.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under
worst-case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on
any part of the heatspreader's surface according to the module specifications:

60°C for commercial grade modules

85°C for industrial temperature grade modules (E2S)
2.5.2. Active or Passive Cooling Solutions
Both active and passive thermal management approaches can be used with heatspreader plates. The optimum
cooling solution varies, depending on the COM Express® application and environmental conditions. Active or passive
cooling solutions provided from Kontron for the COMe-cAL6 are usually designed to cover the power and thermal
dissipation for a commercial temperature range used in housing with proper airflow. For more information
concerning possible cooling solutions, see Chapter 2.2 Accessories.
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly
The operating temperature defines two requirements:

Maximum ambient temperature with ambient being the air surrounding the module

Maximum measurable temperature on any part of the heatspreader's surface
The heatspreader is tested for the following temperature specifications.
Table 9: Heatspreader Test Temperature Specifications
Temperature Specification
Validation Requirements
Commercial Grade
At 60°C HSP temperature the CPU @ 100% load needs to run at nominal
frequency
Industrial Grade by screening (E2S)
At 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for
thermal protection
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly
The operating temperature is the maximum measurable temperature on any part of the module's surface.
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COMe-cAL6 – User Guide, Rev 1.0
2.5.5. On-board Fan Connector
The module’s fan connector powers, controls and monitors a fan for chassis ventilation.
Table 10: 3-Pin Fan Connector Pin Assignment
Pin
Signal
Description
Type
1
Fan_Tach_IN#
Input voltage
I
2
V_FAN
Limited to a maximum of 12 V (±10%) across the whole input range
PWR
3
GND
Power GND
PWR
To connect a standard 3-pin connector fan to the module, use one of the following adaptor cables:

KAB-HSP 200 mm (Part number- 96079-0000-00-0)

KAB-HSP 40 mm (Part number - 96079-0000-00-2)
Always check the fan specification according to the limitations of the supply current and
supply voltage.
If the input voltage is below 12 V or equal to 12 V, then the maximum supply current to the on-board fan connector is
350 mA and the fan output voltage is equal to the module input voltage. The maximum supply current is limited to
150 mA if the input voltage is more than 12 V but less than the maximum voltage input of 20 V. For an overview of the
electrical characteristics, see Table 11: Electrical Characteristics of the Fan Connector.
Table 11: Electrical Characteristics of the Fan Connector
Module Input Voltage <= 12 V
FAN Output Voltage
Equal to module‘s input voltage
FAN Output Current
Up to 350 mA
Module Input Voltage >12 V to <=20 V
FAN Output Voltage
12 V (±10%)
FAN Output Current
Limited to 150 mA
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COMe-cAL6 – User Guide, Rev 1.0
2.6. Environmental Specification
2.6.1. Temperature
Kontron defines the following operating and non-operating temperature grades for Computer-on-Modules. For more
information on the available temperature grades for the COMe-cAL6, see Chapter 2.1, Module Variants.
Table 12: Temperature Grade Specifications
Temperature Grades
Operating
Non-operating (Storage Temperature)
Commercial Grade
0°C to +60°C
-30°C to +85°C
Industrial Temperature Grade E2S (by screening)
-40°C to +85°C
-40°C to +85°C
2.6.2. Humidity
Table 13: Humidity Specification
Humidity
Relative Humidity
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93%, at +40°C, non-condensing (according to IEC 60068-2-78)
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COMe-cAL6 – User Guide, Rev 1.0
2.7. Standards and Certifications
The COMe-cAL6 complies with the following standards and certifications. For more information, contact Kontron
Support.
Emission
(EMC)
IEC / EN 61000-6-3
Electromagnetic compatibility (EMC)- Part 6-3:Generic standards – Emission standard for
residential, commercial and light industrial environments
Including the following tests:
EN55032 Class B – Electromagnetic compatibility of multimedia equipment- Emission
requirements CISPR 32 (modified)
IEC / EN 61000-3-2 - Harmonic current emissions
IEC / EN 61000-3-3 - Voltage changes, voltage fluctuations and flicker
Immunity (EMI)
IEC / EN 61000-6-2
Electromagnetic (EMC) – Part 6-2: Generic standards immunity for industrial environments
Including the following tests:
IEC / EN 61000-4-2 - Electrostatic discharge (ESD) immunity
IEC / EN 61000-4-3 – Radiated, radio-frequency, electromagnetic field immunity
IEC / EN 61000-4-4 - Electrical fast transient/burst immunity
IEC / EN 61000-4-5 - Surge immunity test
IEC / EN 61000-4-6 - Immunity to conducted disturbances, induced by radio-frequency fields
IEC / EN 61000-4-8 - Power frequency magnetic field immunity
IEC / EN 61000-4-11 - Voltage dips, short interruptions, and voltage variations immunity
Safety
EN 62368-1
Safety for audio/video and information technology equipment
UL 60950-1 / CSA 60950-1
Information Technology Equipment Including Electrical Business Equipment
NWGQ2.E304278
NWGQ8.E304278
Shock
IEC / EN 60068-2-27
Non-operating shock test – (half-sinusoidal, 11 ms, 15 g)
Vibration
IEC / EN 60068-2-6
Non-operating vibration – (sinusoidal, 10 Hz – 4000 Hz, +/- 0.15 mm, 2 g)
MTBF
(Theoretical)
System MTBF(hour) = 829207 @ 40°C for the COMe-cAL6 N4200
(Reliability report article number: 36023-0000-11-4
System MTBF(hour) = 684743 @ 40°C for the COMe-cAL6 E2 E3950 32S PCIe
(Reliability report article number: 36024-0032-16-7
(RoHS II)
www.kontron.com
2011/65/EU
Compliant with the directive on the restriction of the use of certain hazardous substances in
electrical and electronic equipment
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COMe-cAL6 – User Guide, Rev 1.0
2.8. Mechanical Specification
The COMe-cAL6 is compliant to the mechanical specification of the COM Express® PICMG COM.0 Rev 2.1.
2.8.1. Dimensions
The dimensions of the compact module are:

95.0 mm x 95.0 mm (3.75 ” x 3.75 “)
Figure 2: Module Dimensions
*All dimensions in mm.
2.8.2. Height
The overall height of the module depends on the height of the implemented cooling solution. The COM Express®
Specification does not specify the height of the cooling solution.
The COM Express® specification defines a module height of approximately 13 mm from the bottom of the module’s
PCB board to the top of the heatspreader, as shown in Figure 3: Module Height.
1
Figure 3: Module Height
www.kontron.com
2
6
3
5
4
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COMe-cAL6 – User Guide, Rev 1.0
1
Heatspreader
4
Carrier Board PCB
2
Heatspreaader standoff(s)
5
Connector standoff(s) 5 or 8 mm
3
Module PCB board
6
13 mm +/- 0.65 mm
2.8.3. Heatspreader Dimensions
The following figure shows mounting holes for additional cooling solutions.
Figure 4: Heatspreader Dimensions
*All dimensions shown in mm.
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3/ Features and Interfaces
3.1. eMMC Flash Memory
An optional on-board embedded Multimedia Flash Card (eMMC) solution with up to 64 GByte NAND Flash supporting
a small package sizes, and high reliability is available. The COMe-cAL6 eMMC NAND Flash memory solution
implements a pseudo Single Level Cell (pSLC) solution by reconfiguring Multi Level Cell (MLC) Flash to act as Single
Level Cell (SLC) Flash during the manufacturing process. The pSLD NAND Flash provides improved reliability,
endurance and performance.
Specific eMMC Flash memory features are:

Up to 64 GByte pSLC NAND Flash (128 GByte MLC NAND Flash)

eMMC 5.0 specification

Class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection);
class 7 (lock card)

HS200/HS400 modes

DDR modes up to 52 MHz clock speed

ECC and block management

Boot operation ( High-speed boot)

Sleep mode

Permanent and power-on write protection

Replay-protected memory block (RPMB)

Secure erase and secure trim
3.2. Micro SD Card
An ultra-low micro SD card socket is available as an optional feature on the SD Interface. The micro SD card socket
supports a micro SD Flash memory card that complies with the micro SD 3.01 memory card specification and
supports:

Card detection

Date rates up to 104 MB/s
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3.3. LPC
The Low Pin Count (LPC) interface signals are connected to the LPC bus bridge located in the CPU or CPU’s chipset. The
LPC low speed interface can be used for peripheral circuits such as an external Super I/O controller that typically
combines legacy-device support into a single IC. The implementation of this subsystem complies with the COM
Express® Specification. The COM Express® Design Guide maintained by PICMG provides implementation information
or refer to the official PICMG documentation for more information.
The LPC bus does not support DMA (Direct Memory Access). When more than one device is used on LPC, a zero delay
clock buffer is required. This leads to limitations for the ISA bus and SIO (standard I/O(s) like floppy or LPT interfaces)
implementations.
All Kontron COM Express® Computer-on-Modules imply BIOS support for the following external baseboard LPC Super
I/O controller features for the Winbond/Nuvoton 3.3V 83627DHG-P.
Table 14: Supported BIOS Features
3.3V 83627DHG-P
AMI EFI APTIO V
PS/2 , LPT, HWM, Floppy, GPIO
Not supported
COM1/COM2
Supported
Features marked as not supported do not exclude OS support., except for, HWM that is controlled by the BIOS setup
within the Advanced setup menu and has no OS software support. The HWM is accessible via the System
Management (SM) Bus, for more information, see Chapter 4.6 System Management (SM) Bus. If any other LPC Super
I/O additional BIOS implementations are necessary, contact Kontron Support.
3.4. Serial Peripheral Interface (SPI)
The Serial Peripheral Interface Bus (SPI bus) is a synchronous serial data link standard. Devices communicate in
master/slave mode, where the master device initiates the data frame. Multiple slave devices are allowed with
individual slave select (chip select) lines. SPI is sometimes called a four-wire serial bus, contrasting with three, two
and one-wire serial buses.
The SPI interface can only be used with a SPI flash device to boot from the external BIOS on
the baseboard. No alternative usage is possible.
3.4.1. SPI Boot
It is not possible to flash to a SPI chip that is not the boot SPI flash chip. The only two possible options to flash the SPI
chip are:
1.
Boot from internal SPI Flash chip and flash the internal SPI Flash chip
2.
Boot from external SPI Flash chip and flash the external SPI Flash chip
It is NOT POSSIBLE to flash the SPI chip by booting from an external SPI Flash chip and flash
the internal SPI Flash chip.
The COMe-cAL6 supports boot from an external 16 MB, 3 V serial SPI Flash supports boot from an external SPI Flash,
where pin A34 (BIOS_DIS0#) and pin B88 (BIOS_DIS1#) configure the SPI Flash as shown in Table 15: SPI Boot Pin
Configuration.
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Table 15: SPI Boot Pin Configuration
Configuration
BIOS_DIS0#
BIOS_DIS1#
Function
1
Open
Open
Boot on module SPI
2
GND
Open
Not supported
3
Open
GND
Boot on carrier SPI
4
GND
GND
Not supported
BIOS does not support being split between two chips. Booting takes place either from the
module SPI or from the baseboard SPI.
Table 16: Supported SPI Boot Flash Types for 8-SOIC Package
Size
Manufacturer
Part Number
Device ID
16MB
Maxim
MX25L12835F
0x20
16MB
Winbond
W25Q128FV
0x40
16MB
Micron
N25Q128A
0xBA
3.4.2. Booting from an External SPI Flash
Initially, boot on the EFI Shell with an USB key containing the binary used to flash the SPI, plugged in on the system.
Depending on which SPI you would like to flash, you will need to use the (BIOS_DIS1) selection jumper located on the
COM Express® carrier, to determine BIOS boot device.
To flash the carrier or module Flash chip:
1.
Connect a SPI flash with the correct size (similar to BIOS binary (*.BIN) file size) to the carrier SPI interface.
2.
Open pin A34 (BIOS_DIS0#) and connect pin B88 (BIOS_DIS1#) to ground, to enable the external SPI flash to boot
on carrier SPI.
3.
Turn on the system and make sure that USB is connected then start the uEFI BIOS setup. (See Chapter 6.1 Starting
the uEFI BIOS.)
4.
Disable the BIOS lock:
Chipset > South Cluster Configuration> Miscellaneous Configuration> BIOS Lock > Disabled
5.
Save and exit the setup.
6.
Reboot system into EFI shell.
7.
From the EFI shell, enter the name of the partition of the USB Key in this example; select FS0: then press <enter>.
8.
Enter the following:
FPT –F <biosname.BIN>
9.
Wait until the program ends properly and then power cycle the whole system.
10. The system is now updated.
Depending on the state of the external SPI flash, the program may display up to two warning
messages printed in red. Do not stop the process at this point! After a few seconds of
timeout, flashing proceeds. For more information, refer to the EMD Customer Section.
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3.4.3. External SPI Flash on Modules with Intel® ME
If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another
module of the same type will cause the Intel® Management Engine (ME) to fail during the next start. This is due to the
design of the ME that bounds itself to every module, to which the ME was previously flashed. In the case of an
external SPI flash, this is the module present at flash time.
To avoid this issue, conduct a complete flash of the external SPI flash device after changing the COM Express®
module for another module. If disconnecting and reconnecting the same module again, this step is not necessary.
3.5. Fast I2C
Fast I2C supports transfer between components on the same board. The COMe-cAL6 features an onboard I2C
controller connected to the LPC Bus.
The I2C controller supports:

Multimaster transfers

Clock stretching

Collision detection

Interruption on completion of an operation
3.6. UART
The UART implements an interface for serial communications and supports up to two serial RX/TX ports defined in
the COM Express® specification on pins A98 (SERO_TX) /A99 (SERO_RX) for UART0 and pins A101 (SER1_TX)/A102
(SER1_RX) for UART1. The UART controller is fully 16550A compatible.
Features of the UART are:

On-Chip bit rate ( baud rate) generator

No handshake lines

Interrupt function to the host

FIFO buffer for incoming and outgoing data
3.7. Dual Staged Watchdog Timer (WDT)
A watchdog timer or computer operating properly (COP) timer is a computer hardware or software timer. If there is a
fault condition in the main program, the watchdog triggers a system reset or other corrective actions. The intention is
to bring the system back from the non-responsive state to normal operation.
Possible fault conditions are a hang, neglect to service the watchdog regularly (writing a “service pulse” to it, also
referred to as “kicking the dog”, “petting the dog”, “feeding the watchdog” or “triggering the watchdog”).
The COMe-cAL6 offers a watchdog that works with two stages that can be programmed independently and used
stage-by-stage.
Table 17: Dual Stage Watchdog Timer- Time-out Events
0000b
No action
The stage is off and will be skipped.
0001b
Reset
A reset restarts the module and starts a new POST and operating system.
0101b
Delay ->
No action*
Might be necessary when an operating system must be started and the time for the
first trigger pulse must be extended. Only available in the first stage.
1000b
WDT Only
This triggers the WDT Pin on the baseboard connector (COM Express® pin B27) only.
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COMe-cAL6 – User Guide, Rev 1.0
1001b
Reset + WDT
1101b
DELAY + WDT
-> No action*
3.7.1. WDT Signal
Watchdog time-out event (pin B27) on COM Express® connector offers a signal that can be asserted when a
watchdog timer has not been triggered with a set time. The WDT signal is configurable to any of the two stages. After
reset, the signal is automatically deasserted. If deassertion is necessary during runtime, contact Kontron Support for
further help.
3.8. GPIO
Eight GPIO pins are available, with four pins for the in-direction (pin A54 for GPI0, pin A63 for GPI1, pin A67 for GPI2 and
pin A85 for GPI3) and four pins for the out-direction (pin A93 for GPO0, pin B54 for GPO1, pin B57 for GPO2 and pin B63
for GPO3). The type of termination resistor on the module sets the direction of the GPIO where GPIs are terminated
with pull-up resistors and GPOs are terminated with pull-down resistors.
Due to, the fact that both the pull-up and pull-down termination resistors are weak, it is possible to override the
termination resistors using external pull-ups, pull-downs or IOs. Overriding the termination resistors means that the
eight GPIO pins can be considered as bi-directional since there are no restrictions whether you use the available GPIO
pins in the in-direction or out-direction.
3.9. Real Time Clock (RTC)
The RTC keeps track of the current time accurately. The RTC’s low power consumption means that it can be powered
from an alternate source of power enabling the RTC to continue to keep time while the primary source of power is
“off” or “unavailable”.
The RTC battery voltage range is 2.8 V to 3.47 V. A typical RTC voltage is 3 V with a current of >10 μA. If the module is
powered by the mains supply, the on-module regulators generate the RTC voltage to reduce RTC current draw.
3.10. Trusted Platform Module (TPM 2.0)
The COMe-cAL6 is compliant to Trusted Platform Module TPM 2.0. A TPM stores RSA encryption keys specific to the
host system for hardware authentication. The term TPM refers to the set of specifications applicable to TPM chips.
The LPC bus connects the TPM Chip to the CPU.
Each TPM chip contains an RSA key pair called the Endorsement Key (EK). The pair is maintained inside the chip and
cannot be accessed by software. The Storage Root Key (SRK) is created when a user or administrator takes ownership
of the system. This key pair is generated by the TPM based on the Endorsement Key and an owner-specified
password.
A second key, called an Attestation Identity Key (AIK) protects the device against unauthorized firmware and software
modification by hashing critical sections of firmware and software before they are executed. When the system
attempts to connect to the network, the hashes are sent to a server that verifies that they match the expected values.
If any of the hashed components have been modified since last started, the match fails, and the system cannot gain
entry to the network.
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3.11. Kontron Security Solution
Kontron Security Solution is a combined hardware and software solution that includes an embedded hardware
security module and a software framework to protect applications. The COMe-cAL6 allows for the optional assembly
of an integrated security module connected to SoC USB2 port 6. If the security chip is connected, SoC USB2 port 6 is
not available for use as a USB 2.0 port.
Features of the integrated security solution are:

Copy protection

IP protection

License model enforcement
If required, customers can customize the security solution to meet specific needs. For more information, contact
Kontron Support.
3.12. SpeedStep® Technology
SpeedStep® technology enables the adaption of high performance computing to applications by switching
automatically between maximum performance mode and battery-optimized mode, depending on the needs of the
application. When battery powered or running in idle mode, the processor drops to lower frequencies (by changing
the CPU ratios) and voltage, thus conserving battery life while maintaining a high level of performance. The frequency
is automatically set back to the high frequency, allowing you to customize performance.
In order to use the Intel® Enhanced SpeedStep® technology the operating system must support SpeedStep®
technology.
By deactivating the SpeedStep® feature in the BIOS, manual control or modification of the CPU performance is
possible. Setup the CPU Performance State in the BIOS Setup or use third party software to control the CPU
Performance States.
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4/ System Resources
4.1. Interrupt Request (IRQ) Lines
The following table specifies the device connected to each Interrupt line or if the line is available for new devices.
Table 18: Interrupt Requests
IRQ
General Usage
Project Usage
0
Timer
Timer
1
Keyboard
Keyboard (Super I/O)
2
Redirected secondary PIC
Redirected secondary PIC
3
COM2
COM2
4
COM1
COM1
5
LPT2/PCI devices
One of COM3+4
6
FDD
One of COM3+4 or not used
7
LPT1
LPT1 or one of COM3+4
8
RTC
RTC
9
SCI / PCI devices
Free for PCI devices
10
PCI devices
Free for PCI devices
11
PCI devices
Free for PCI devices
12
PS/2 mouse
Free for PCI devices
13
FPU
FPU
14
IDE0
Not used
15
IDE1
Not used
4.2. Memory Area
The following table specifies the usage of the address ranges within the memory area.
Table 19: Designated Memory Locations
Address Range (hex)
Size
Project Usage
00000000-0009FBFF
639 KB
Real mode memory
0009FC00-0009FFFF
1 KB
Extended BDA
000A0000-000BFFFF
128 KB
Display memory (legacy)
000C0000-000CBFFF
48 KB
VGA BIOS (legacy)
000CC000-000DFFFF
80 KB
Option ROM or XMS (legacy)
000E0000-000EFFFF
64 KB
System BIOS extended space (legacy)
000F0000-000FFFFF
64 KB
System BIOS base segment (legacy)
00100000-7FFFFFFF
128 MB
System memory (Low DRAM)
80000000-FFF00000
2 GB – 1 MB
PCI memory, other extensions (Low MMIO)
FEC00000-FEC00FFF
4 KB
IOxAPIC
FED00000-FED003FF
1 KB
HPET (Timer)
FED40000-FED40FFF
4KB
Always reserved for LPC TPM usage
FEE00000-FEEFFFFF
1MB
Local APIC region
FFFC0000-FFFFFFFF
256 KB
Mapping space for BIOS ROM/Boot vector
100000000-17FFFFFFF
2 GB
System memory (High DRAM)
180000000-F00000000
58 GB
High MMIO
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4.3. I/O Address Map
The I/O port addresses are functionally identical to a standard PC/AT. All addresses not mentioned in this table
should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware, for
compatibility reasons, even if the I/O address is available.
Table 20: Designated I/O Port Address
I/O Address Range
General Usage
Project Usage
000-00F
DMA-Controller (Master) (8237)
DMA-Controller (Master) (8237)
020-021
024-025
028-029
Interrupt-Controller (Master) (8259)
Interrupt-Controller (Master) (8259)
02C-02D
030-031
034-035
038-039
03C-03D
02E-02F
SuperIO (Winbond)
External SuperIO (Winbond)
040-043
050-053
Programmable Interrupt Timer (8253)
Programmable Interrupt Timer (8253)
04E-04F
2nd SuperIO, TPM etc.
TPM
060, 064
KBD Interface-Controller (8042)
KBD Interface-Controller (8042)
061, 063
065, 067
NMI Controller
NMI Controller
062, 066
Embedded Microcontroller
Not used
070-071
RTC CMOS / NMI mask
RTC CMOS / NMI mask
072-073
RTC Extended CMOS
RTC Extended CMOS
080-083
Debug port
Debug port
0A0-0A1
0A4-0A5
Interrupt-Controller (Slave) (8259)
Interrupt-Controller (Slave) (8259)
0A8-0A9
0AC-0AD
0B0-0B1
0B4-0B5
0B8-0B9
0BC-0BD
0B2-0B3
APM control
APM control
0C0-0DF
DMA-Controller (Slave) (8237)(N/A)
Not used
0F0-0FF
FPU (N/A)
Not used
170-177
HDD-Controller IDE1 Master
Not used
1F0-1F7
HDD-Controller IDE0 Master
Not used
200-207
Gameport
Not used
220-22F
Soundblaster®
Not used
279
ISA PnP
ISA PnP
278-27F
Parallel port LPT2
Not used
295-296
Hardware monitor (Winbond default)
Reserved (If SuperIO present)
2B0-2BF
EGA
Not used
2D0-2DF
EGA
Not used
2E8-2EF
Serial port COM 4
Serial port COM4 (optional)
2F8-2FF
Serial port COM 2
Serial port COM2 from CPLD
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COMe-cAL6 – User Guide, Rev 1.0
I/O Address Range
General Usage
Project Usage
300-301
MIDI
Not used
300-31F
System specific peripherals
Not used
370-377
Floppy disk controller
Not used
376-377
HDD-Controller IDE1 Slave
Not used
378-37F
Parallel port LPT 1
LPT1 (If SuperIO present)
3BC-3BF
Parallel port LPT3
Not used
3C0-3CF
VGA/EGA
VGA/EGA
3D0-3DF
CGA
Not used
3E0-3E1
PCMCIA ExCA interface
Not used
3E8-3EF
Serial port COM3
Serial port COM3 (optional)
3F0-3F7
Floppy Disk Controller
Not used
3F6-3F7
HDD controller IDE0 Slave
Not used
3F8-3FF
Serial Port COM1
Serial port COM1
4D0-4D1
Interrupt-Controller (Slave)
Interrupt-Controller (Slave)
A80-A81
Kontron CPLD
Kontron CPLD control port
CF8
PCI configuration address
PCI configuration address
CF9
Reset control
Reset control
CFC-CFF
PCI configuration data
PCI configuration data
Other PCI device I/O addresses are allocated dynamically and not listed here. For more
information on how to determine I/O address usage, refer to the OS documentation.
4.4. Peripheral Component Interconnect (PCI) Devices
All devices follow the PCI 2.3 and PCIe Base 1.0a specification. The BIOS and Operating System (OS) control the
memory and I/O resources. For more information, refer to the PCI 2.3 specification.
4.5. I2C Bus
The following table specifies the devices connected the I2C bus including the I2C address.
Table 21: I2C Bus Port Address
I2C Address
Used For
Available
Comment
A0h
JIDA-EEPROM
No
Module EEPROM
AEh
FRU-EEPROM
No
Recommended for Baseboard EEPROM
www.kontron.com
// 43
COMe-cAL6 – User Guide, Rev 1.0
4.6. System Management (SM) Bus
The 8-bit SMBus address uses the LSB (Bit 0) for the direction of the device.

Bit0 = 0 defines the write address

Bit0 = 1 defines the read address
The 8-bit address listed below shows the write address for all devices. The7-bit SMBus address shows the device
address without bit0.
Table 22: SMBus Address
8-bit
Address
7-bit
Address
Device
Comment
SMBus
5Ch
2Eh
HWM NCT7802Y
Do not use under any circumstances
SMB
ACh
56h
Intenally Reserved
Do not use under any circumstances
SMB
A0h
50h
SPD DDR Channel 1 (SO-DIMM)
SMB
A2h
51h
SPD DDR Channel 2 (SO-DIMM)
SMB
30h
18h
SO-DIMM Thermal Sensor
If available on the used memory-module
SMB
32h
19h
SO-DIMM Thermal Sensor channel 2
If available on the used memory-module
SMB
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// 44
COMe-cAL6 – User Guide, Rev 1.0
5/ COMe Interface Connectors
The COMe-cAL6 is a COM Express® compact module containing two 220-pin connectors; each with two rows called
row A & B on primary connector and row C & D on secondary connector.
The following figure is a view of the bottom of the module showing the position of interface connectors X1A and X1B
and the first pin in row A and row D.
Figure 5: X1A and X1B COMe Interface Connectors
Pin
D1
X1B
X1A
Pin
A1
*All dimensions in mm.
5.1. X1A and X1B Signals
For a description of the terms used in the X1A and X1B pin assignment tables, see Table 23: General Signal Description
or see Table 38: List of Acronyms. If a more detailed pin assignment description is required, refer to the PICMG
specification COMe Rev 2.1 Type 6 standard.
The information provided under type, module terminations and comments is complimentary
to the COM.0 Rev 2.1 Type 6 standard. For more information, contact Kontron Support.
www.kontron.com
// 45
COMe-cAL6 – User Guide, Rev 1.0
Table 23: General Signal Description
Type
Description
Type
Description
NC
Not Connected (on this product)
O-1,8
1.8 V Output
I/O-3,3
Bi-directional 3.3 V I/O-Signal
O-3,3
3.3 V Output
I/O-5T
Bi-dir. 3.3 V I/O (5 V tolerance)
O-5
5 V Output
I/O-5
Bi-directional 5V I/O-Signal
DP-I/O
Differential Pair Input/Output
I-3,3
3.3 V Input
DP-I
Differential Pair Input
I/OD
Bi-directional Input/Output Open
Drain
DP-O
Differential Pair Output
I-5T
3.3 V Input (5 V tolerance)
PU
Pull-Up Resistor
OA
Output Analog
PWR
Power Connection
OD
Output Open Drain
+ and -
Differential Pair Differentiator
To protect external power lines of peripheral devices, make sure that: the wires have the
right diameter to withstand the maximum available current.
The enclosure of the peripheral device fulfills the fire-protection requirements of
IEC/EN60950.
5.2. X1A and X1B Pin Assignment
For more information regarding the pin assignment of connector X1A (Row A and Row B) and connector X1B (Row C
and Row D), see the pin assignment tables listed below:

Table 24: Connector X1A Row A Pin Assignment (A1-A110)

Table 25: Connector X1A Row B Pin Assignment (B1 -B110)

Table 26: Connector X1B Row C Pin Assignment (C1 -C110)

Table 27: Connector X1B Row D Pin Assignment (D1 -D110)
www.kontron.com
// 46
COMe-cAL6 – User Guide, Rev 1.0
5.2.1. Connector X1A Row A1 – A110
Table 24: Connector X1A Row A Pin Assignment (A1-A110)
Pin
COMe Signal
Description
Type
A1
GND
Power ground
PWR GND
A2
GBE0_MDI3-
Ethernet media dependent interface 3
DP-I/O
A3
GBE0_MDI3+
A4
GBE0_LINK100#
Ethernet controller speed indicator
OD
A5
GBE0_LINK1000#
A6
GBE0_MDI2-
Ethernet media dependent Interface 2
DP-I/O
A7
GBE0_MDI2+
A8
GBE0_LINK#
Ethernet controller link indicator
OD
A9
GBE0_MDI1-
Ethernet media dependent interface 1
DP-I/O
Termination
Comment
A10
GBE0_MDI1+
A11
GND
Power ground
PWR GND
A12
GBE0_MDI0-
Ethernet media dependent interface 0
DP-I/O
A13
GBE0_MDI0+
A14
GBE0_CTREF
Reference voltage for Carrier Board Ethernet
magnetics center tab. The reference voltage is
determined by the requirements of the module PHY
and may be as low as 0V and as high as 3.3V.
O
A15
SUS_S3#
Indicates system is in Suspend to RAM (or deeper)
state. An inverted copy of SUS_S3# on Carrier
Board may be used to enable non-standby power
on a typical ATX supply.
O-3.3
A16
SATA0_TX+
Serial ATA transmit data pair 0
DP-O
A17
SATA0_TX-
A18
SUS_S4#
Indicates system is in Suspend to Disk state.
O-3.3
A19
SATA0_RX+
Serial ATA receive data pair 0
DP-I
A20
SATA0_RX-
A21
GND
Power ground
PWR GND
A22
SATA2_TX+
NC
NC
A23
SATA2_TX-
NC
NC
A24
SUS_S5#
Indicates system is in Soft Off state.
O-3.3
A25
SATA2_RX+
NC
NC
A26
SATA2_RX-
NC
NC
A27
BATLOW#
Provides a battery-low signal to the module to
indicate external battery is low
I-3.3
PU 10 KΩ,
3.3 V (S5)
Assertion prevents wake
from S3-S5 state
A28
ATA_ACT#
Serial ATA activity LED indicator
OD-3.3
PU 10 KΩ,
3.3 V (S0)
Can sink 15 mA
A29
HDA_SYNC
HD audio sync
O-3.3
A30
HDA_RST#
HD audio reset
O-3.3
A31
GND
Power ground
PWR GND
A32
HDA_CLK
HD audio bit clock output
O-3.3
A33
HDA_SDOUT
HD audio serial data out
O-3.3
A34
BIOS_DIS0#
BIOS selection strap 0 to determine the BIOS boot
device
I-3.3
PU 10 KΩ,
3.3 V (S5)
A35
THRMTRIP#
Thermal trip Indicates CPU has entered thermal
shutdown
O-3.3
PU 10 KΩ,
3.3 V (S0)
Thermal trip event
transition to S5 indicator
A36
USB6-
USB 2.0 data differential pair port 6
DP-I/O
PD/PU in SoC
A37
USB6+
PD 15 kΩ ±5% on
downstream facing port;
PU 1.5 kΩ ±5% on upsteam
facing port
A38
USB_6_7_OC#
USB overcurrent indicator port 6/7
I-3.3
PU 10 KΩ,
3.3 V (S5)
www.kontron.com
100 nF capacitor to GND
PD 10 KΩ
PD 10 KΩ
// 47
COMe-cAL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
Termination
Comment
A39
USB4-
USB 2.0 data differential pair port 4
DP-I/O
PD/PU in SoC
A40
USB4+
PD 15 kΩ ±5% on
downstream facing port;
PU 1.5 kΩ ±5% on upsteam
facing port
A41
GND
Power ground
PWR GND
A42
USB2-
USB 2.0 data differential pair port 2
DP-I/O
PD/PU in SoC
A43
USB2+
PD 15 kΩ ±5% on
downstream facing port;
PU 1.5 kΩ ±5% on upsteam
facing port
A44
USB_2_3_OC#
USB overcurrent indicator port 2/3
I-3.3
PU 10 KΩ
3.3V (S5)
A45
USB0-
USB data differential pairs port 0
DP-I/O
PD/PU in SoC
A46
USB0+
A47
VCC_RTC
Real Time Clock (RTC) circuit power input
PWR 3V
A48
EXCD0_PERST#
PCI ExpressCard reset port 0
O-3.3
PD 10 KΩ
A49
EXCD0_CPPE#
PCI ExpressCard capable card request port 0
I-3.3
PU 10 KΩ
3.3 V (S0)
A50
LPC_SERIRQ
Serial interrupt request
I/OD-3.3
PU 8.2 KΩ,
3.3 V (S0)
A51
GND
Power ground
PWR GND
A52
RSVD
Reserved for future use
NC
A53
RSVD
Reserved for future use
NC
A54
GPI0
General purpose input 0
I-3.3
A55
PCIE_TX4+
PCI Express lane 4 transmit
DP-O
A56
PCIE_TX4-
A57
GND
Power ground
PWR GND
A58
PCIE_TX3+
PCI Express lane 3 transmit
DP-O
A59
PCIE_TX3-
A60
GND
Power Ground
PWR GND
A61
PCIE_TX2+
PCI Express lane 2 transmit
DP-O
A62
PCIE_TX2-
A63
GPI1
General purpose input 1
I-3.3
A64
PCIE_TX1+
PCI Express lane 1 transmit
DP-O
A65
PCIE_TX1-
A66
GND
Power ground
PWR GND
A67
GPI2
General purpose input 2
I-3.3
A68
PCIE_TX0+
PCI Express lane 0 transmit
DP-O
A69
PCIE_TX0-
A70
GND
Power ground
PWR GND
A71
LVDS_A0+
LVDS channel A DAT0 or EDP Lane 2 transmit
DP-O
A72
LVDS_A0-
A73
LVDS_A1+
LVDS channel A DAT1 or EDP Lane 1 transmit
DP-O
A74
LVDS_A1-
A75
LVDS_A2+
LVDS channel A DAT2 or EDP Lane 0 transmit
DP-O
A76
LVDS_A2-
A77
LVDS_VDD_EN
LVDS or EDP panel power control
O-3.3
A78
LVDS_A3+
LVDS channel A DAT3
DP-O
A79
LVDS_A3-
A80
GND
Power ground
PWR GND
www.kontron.com
PD 15 kΩ ±5% on
downstream facing port;
PU 1.5KΩ ±5% on upsteam
facing port
Voltage range
2.8 V to 3.47 V
PU 20 KΩ,
3.3 V (S0)
PU 20 KΩ,
3.3V (S0)
PU 20 KΩ,
3.3V (S0)
PD 100 KΩ
// 48
COMe-cAL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
A81
LVDS_A_CK+
LVDS Channel A clock or EDP lane 3 transmit
DP-O
Termination
A82
LVDS_A_CK-
A83
LVDS_I2C_CK
I2C Clock for LVDS display (DDC) or eDP AUX +
I/O-3.3
PU 2.2 KΩ,
3.3V (S0)
A84
LVDS_I2C_DAT
I2C Data line for LVDS display (DDC) or eDP AUX -
I/O-3.3
PU 2.2 KΩ,
3.3V (S0)
A85
GPI3
General purpose input 3
I-3.3
PU 20 KΩ
3.3V (S0)
A86
RSVD
Reserved for future use
NC
A87
eDP_HPD
Detection of Hot Plug / unplug
I-3.3
A88
PCIE_CK_REF+
PCIE_CK_REF-
Reference PCI Express clock for all PCI Express and
PCI Express graphics lanes
DP-O
A89
A90
GND
Power ground
PWR GND
A91
SPI_POWER
3.3 V power output for external SPI Flash
O-3.3
100 mA maximum
A92
SPI_MISO
Data in to module from carrier SPI
(SPI Master IN Slave Out)
I-3.3
.
A93
GPO0
General purpose output 0
O-3.3
A94
SPI_CLK
Clock from module to carrier SPI
O-3.3
Clock 20 MHz to 80 MHz
100 KΩ EDP
100 MHz
PD 20k
A95
SPI_MOSI
Data out from module to carrier SPI
O-3.3
A96
TPM_PP
TPM physical presence
I-3.3
A97
TYPE10#
NC
NC
A98
SER0_TX
Serial port 0 TXD
O-3.3
A99
SER0_RX
Serial port 0 RXD
I-5T
A100
GND
Power ground
PWR GND
A101
SER1_TX
Serial port 1 TXD
O-3.3
A102
SER1_RX
Serial port 1 RXD
I-5T
PU 47 KΩ,
3.3 V (S0)
A103
LID#
LID switch input
I-3.3
PU 47 KΩ,
3.3 V (S5)
A104
VCC_12V
Main input voltage (8.5 V - 20V)
A105
VCC_12V
A106
VCC_12V
PWR
8.5 V to
20 V
A107
VCC_12V
A108
VCC_12V
A109
VCC_12V
A110
GND
Power ground
PWR GND
+ and -
Comment
PD 10KΩ
TMP does not use this
functionality.
20 V protection circuit
implemented on-module,
PD on carrier board needed
for proper operation.
PU 47 KΩ,
3.3V (S0)
20 V protection circuit
implemented on-module.
20 V protection circuit
implemented on-module,
PD on carrier board needed
for proper operation.
20 V protection circuit
implemented on-module.
Differential pair differentiator
www.kontron.com
// 49
COMe-cAL6 – User Guide, Rev 1.0
5.2.2. Connector X1A Row B 1 - B 110
Table 25: Connector X1A Row B Pin Assignment (B1 -B110)
Pin
COMe Signal
Description
Type
B1
GND
Power ground
PWR GND
B2
GBE0_ACT#
Gigabit Ethernet Controller activity LED indicator
OD
B3
LPC_FRAME#
Indicates the start of an LPC cycle
O-3.3
B4
LPC_AD0
LPC multiplexed command, address and data
I/O-3.3
B5
LPC_AD1
Termination
B6
LPC_AD2
B7
LPC_AD3
B8
LPC_DRQ0#
NC
NC
B9
LPC_DRQ1#
NC
NC
B10
LPC_CLK
LPC 24 MHz clock output
O-3.3
B11
GND
Power ground
PWR GND
B12
PWRBTN#
Power Button - a falling edge creates a power
button event
I-3.3
PU 10 KΩ,
3.3 V (S5eco)
B13
SMB_CLK
SMBus clock line
O-3.3
PU 2.56 KΩ,
3.3 V (S5)
B14
SMB_DAT
SMBus bidirectional data line
I/O-3.3
PU 2.56 KΩ,
3.3 V (S5)
B15
SMB_ALERT#
SMBus alert can be used to generate a SMI# or to
wake the system
I/O-3.3
PU 2.2 KΩ,
3.3 V (S5)
B16
SATA1_TX+
Serial ATA transmit data pair
DP-O
B17
SATA1_TX-
B18
SUS_STAT#
Indicates imminent suspend operation; used to
notify LPC devices.
O-3.3
B19
SATA1_RX+
Serial ATA receive data pair 1
DP-I
B20
SATA1_RX-
B21
GND
Power ground
PWR GND
B22
SATA3_TX+
NC
NC
B23
SATA3_TX-
NC
NC
B24
PWR_OK
Power OK from main power supply.
I-5T
B25
SATA3_RX+
NC
NC
B26
SATA3_RX-
NC
NC
Comment
Not supported on Apollo Lake
SoC
PD 20 KΩ in
Soc
PU 61 KΩ,
3.3 V
25 MHz
20 V protection circuit
implemented on module
B27
WDT
Watchdog time-out event has occurred
O-3.3
B28
HDA_SDIN2
NC
NC
B29
HDA_SDIN1
NC
NC
B30
HDA_SDIN0
Audio Codec Serial data input 0
I-3.3
B31
GND
Power ground
PWR GND
B32
SPKR
Speaker output provides the PC beep signal and
is mainly intended for debugging purposes
O-3.3
B33
I2C_CK
General purpose I2C port clock output
O-3.3
PU 2.21 KΩ,
3.3 V (S5)
B34
I2C_DAT
General purpose I2C port data I/O line
I/O-3.3
PU 2.21 KΩ,
3.3 V (S5)
B35
THRM#
Input from off-Module temp sensor indicating an
over-temp situation
I-3.3
PU 10 KΩ to
3.3 V (S0)
No function implemented
B36
USB7-
USB 2.0 differential data pairs port 7
DP-I/O
PD/PU in SoC
B37
USB7+
PD 15 kΩ ±5% on downstream
facing port;
PU 1.5KΩ ±5% on upsteam
facing port
www.kontron.com
PD 10 KΩ
Not supported on Apollo Lake
SoC
// 50
COMe-cAL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
Termination
B38
USB_4_5_OC#
USB overcurrent indicator port 4/5
I-3.3
PU 10 KΩ,
3.3 V (S5)
B39
USB5-
USB 2.0 differential data pairs port 5
DP-I/O
PD/PU in SoC
B40
USB5+
PD 15 kΩ ±5% on downstream
facing port;
PU 1.5KΩ ±5% on upsteam
facing port
PD 15 kΩ ±5% on downstream
facing port;
PU 1.5KΩ ±5% on upsteam
facing port
B41
GND
Power ground
PWR GND
B42
USB3-
USB 2.0 differential data pairs port 3
DP-I/O
PD/PU in SoC
B43
USB3+
B44
USB_0_1_OC#
USB overcurrent indicator port 0/1
I-3.3
PU 10 KΩ,
3.3 V (S5)
B45
USB1-
USB 2.0 differential data pairs port
DP-I/O
PD/PU in SoC
B46
USB1+
B47
EXCD1_PERST#
PCI ExpressCard expansion, reset port 1
O-3.3
PD 10 KΩ
B48
EXCD1_CPPE#
PCI ExpressCard expansion, capable card request
port 1
I-3.3
PU 10KΩ,
3.3 V (S0)
B49
SYS_RESET#
Reset button input
I-3.3
PU 3.48 KΩ,
3.3 V (S5)
B50
CB_RESET#
Reset output from module to carrier board
O-3.3
B51
GND
Power ground
PWR GND
B52
PCIE_RX5+
Reserved for future use
NC
B53
PCIE_RX5-
Reserved for future use
NC
B54
GPO1
General Purpose Output 1
O-3.3
B55
PCIE_RX4+
PCI Express receive lane 4
DP-I
B56
PCIE_RX4-
B57
GPO2
General Purpose Output 2
O-3.3
B58
PCIE_RX3+
PCI Express receive lane 3
DP-I
B59
PCIE_RX3-
B60
GND
Power ground
PWR GND
B61
PCIE_RX2+
PCI Express receive lane 2
DP-I
B62
PCIE_RX2-
PD 20 KΩ
GPO3
General Purpose Output 3
O-3.3
B64
PCIE_RX1+
PCI Express receive lane 1
DP-I
B65
PCIE_RX1-
B66
WAKE0#
PCI Express Wake Event wake up signal
I-3.3
PU 10 KΩ,
3.3 V (S5)
B67
WAKE1#
General purpose Wake Event wake up signal, to
implement wake-up on PS2 keyboard or mouse
I-3.3
PU 10 KΩ,
3.3 V (S5)
B68
PCIE_RX0+
PCI Express receive lane 0
DP-I
B69
PCIE_RX0-
B70
GND
Power ground
PWR GND
B71
LVDS_B0+
LVDS Channel B data pair 0
DP-O
B72
LVDS_B0LVDS Channel B data pair 1
DP-O
LVDS Channel B data pair 2
DP-O
LVDS Channel B data pair 3
DP-O
LVDS_B1+
B74
LVDS_B1-
B75
LVDS_B2+
B76
LVDS_B2-
B77
LVDS_B3+
B78
LVDS_B3-
B79
LVDS/BKLT_EN
LVDS or EDP panel backlight enable (ON)
0-3.3
B80
GND
Power ground
PWR GND
www.kontron.com
PD 15 kΩ ±5% on downstream
facing port;
PU 1.5KΩ ±5% on upsteam
facing port
PD 20 KΩ
B63
B73
Comment
PD 20 KΩ
PD 100 KΩ
// 51
COMe-cAL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
B81
LVDS_B_CK+
LVDS Channel B Clock
DP-O
Termination
Comment
B82
LVDS_B_CK-
B83
LVDS_BKLT_CTRL
LVDS or EDP panel backlight brightness control
O-3.3
B84
VCC_5V_SBY
5 V Standby
B85
VCC_5V_SBY
PWR 5 V
(S5)
B86
VCC_5V_SBY
B87
VCC_5V_SBY
B88
BIOS_DIS1#
BIOS selection strap 1 to determine BIOS boot
device
I-3.3
B89
VGA_RED
NC
NC
B90
GND
Power ground
PWR GND
B91
VGA_GREEN
NC
NC
B92
VGA_BLUE
NC
NC
B93
VGA_HSYNC
NC
NC
B94
VGA_VSYNC
NC
NC
Optional connection to
USB2_OTG_ID
B95
VGA_DDC_CLK
NC
NC
Not supported on Apollo Lake
SoC
B96
VGA_DCC_DATA
NC
NC
B97
SPI_CS#
Chip select for carrier board SPI
0 3.3
B98
RSVD
Reserved for future use
NC
B99
RSVD
B100
GND
Power ground
PWR GND
B101
FAN_PWMOUT
Fan speed control by PWM Output
O-3.3
20 MHz -80 MHz
Optional, not necessary in
single supply mode
PU 10 KΩ,
3.3 V (S5)
Not supported on Apollo Lake
SoC
Not supported on Apollo Lake
SoC
PD 10KΩ
(optional)
Optional connection to
USB2_VBUS_SNS
20 V protection circuit
implemented on module,
PD on carrier board needed
for proper operation
Default frequency of PWM
signal is 25kHz.
B102
FAN_TACHIN
Fan tachometer input for fan with a two-pulse
output
I-3.3
PU 47 KΩ,
3.3 V (S0)
B103
SLEEP#
Sleep button signal used by ACPI operating
system to bring system to sleep state or wake
system up again
I-3.3
PU 47 KΩ,
3.3 V (S5)
B104
VCC_12V
Main input voltage (8.5 V - 20 V)
PWR
B105
VCC_12V
B106
VCC_12V
B107
VCC_12V
B108
VCC_12V
B109
VCC_12V
B110
GND
+ and -
20 V protection circuit
implemented on module
8.5 V20 V
Power ground
PWR GND
Differential pair differentiator
www.kontron.com
// 52
COMe-cAL6 – User Guide, Rev 1.0
5.2.3. Connector X1B Row C 1 - C 110
Table 26: Connector X1B Row C Pin Assignment (C1 -C110)
Pin
COMe Signal
Description
Type
C1
GND
Power ground
PWR GND
C2
GND
C3
USB_SSRX0-
USB SuperSpeed receive data pair 0
DP-I
C4
USB_SSRX0+
C5
GND
Power ground
PWR GND
C6
USB_SSRX1-
USB SuperSpeed receive data pair 1
DP-I
C7
USB_SSRX1+
C8
GND
Power ground
PWR GND
C9
USB_SSRX2-
USB SuperSpeed receive data pair 2
DP-I
C10
USB_SSRX2+
C11
GND
Power ground
PWR GND
C12
USB_SSRX3-
USB SuperSpeed receive data pair 3
DP-I
C13
USB_SSRX3+
C14
GND
Power ground
PWR GND
C15
DDI1_PAIR6+
NC
NC
C16
DDI1_PAIR6-
NC
NC
C17
RSVD
Reserved for future use
NC
C18
RSVD
C19
PCIE_RX6+
NC
NC
C20
PCIE_RX6-
NC
NC
C21
GND
Power ground
PWR GND
C22
PCIE_RX7+
NC
NC
C23
PCIE_RX7-
NC
NC
C24
DDI1_HPD
DDI1 Hotplug Detect
I-3.3
C25
DDI1_PAIR4+
NC
NC
C26
DDI1_PAIR4-
NC
NC
C27
RSVD
Reserved for future use
NC
C28
RSVD
C29
DDI1_PAIR5+
NC
NC
C30
DDI1_PAIR5-
NC
NC
C31
GND
Power ground
PWR GND
C32
DDI2_CTRLCLK_AUX+
DDI2 clock/Auxilary
I/O-3.3
PD 100 KΩ
C33
DDI2_CTRLDATA_AUX-
DDI2 date/Auxilary
I/O-3.3
PD 100 KΩ,
3.3 V (S0)
C34
DDI2_DDC_AUX_SEL
DDI2 /Auxilary select
I-3.3
PD 1 MΩ
C35
RSVD
Reserved for future use
NC
C36
DDI3_CTRLCLK_AUX+
NC
NC
C37
DDI3_CTRLDATA_AUX-
NC
NC
C38
DDI3_DDC_AUX_SEL
NC
NC
C39
DDI3_PAIR0+
NC
NC
C40
DDI3_PAIR0-
NC
NC
C41
GND
Power ground
PWR GND
C42
DDI3_PAIR1+
NC
NC
C43
DDI3_PAIR1-
NC
NC
C44
DDI3_HPD
NC
NC
C45
RSVD
Reserved for future use
NC
C46
DDI3_PAIR2+
NC
NC
C47
DDI3_PAIR2-
NC
NC
www.kontron.com
Termination
Comment
PD 100 KΩ
// 53
COMe-cAL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
C48
RSVD
Reserved for future use
NC
C49
DDI3_PAIR3+
NC
NC
C50
DDI3_PAIR3-
NC
NC
C51
GND
Power Ground
PWR GND
C52
PEG_RX0+
NC
NC
Optional connection to
MCSI_DP0_+ (MCSI data lane
0 D_PHY1.1
C53
PEG_RX0-
NC
NC
Optional connection to
MCSI_DP0_- (MCSI data lane
0 D_PHY1.1
C54
TYPE0#
Indicates the Carrier Board the pinout Type.
Not connected for Type 6.
NC
NC for Type 6 module
C55
PEG_RX1+
NC
NC
Optional connection to
MCSI_DP1_+ (MCSI data lane 1
D_PHY1.1
C56
PEG_RX1-
NC
NC
Optional connection to
MCSI_DP1_- (MCSI data lane 1
D_PHY1.1
C57
TYPE1#
Indicates the Carrier Board the pinout Type.
Not connected for Type 6.
NC
NC for Type 6 module
C58
PEG_RX2+
NC
NC
Optional connection to
MCSI_DP2_+ (MCSI data lane
2 D_PHY1.1
C59
PEG_RX2-
NC
NC
Optional connection to
MCSI_DP2_- (MCSI data lane
2 D_PHY1.1
C60
GND
Power ground
PWR GND
C61
PEG_RX3+
NC
NC
Optional connection to
MCSI_DP3_+ (MCSI data lane
3 D_PHY1.1
C62
PEG_RX3-
NC
NC
Optional connection to
MCSI_DP3_- (MCSI data lane
3 D_PHY1.1
C63
RSVD
Reserved for future use
NC
C64
RSVD
C65
PEG_RX4+
NC
NC
Optional connection to
MCSI_RX_DATA0_+ (MCSI
data lane 0 D_PHY1.2
C66
PEG_RX4-
NC
NC
Optional connection to
MCSI_RX_DATA0_- (MCSI
data lane 0 D_PHY1.2
C67
RSVD
Reserved for future use
NC
C68
PEG_RX5+
NC
NC
Optional connection to
MCSI_RX_DATA1_+ (MCSI
data lane 1 D_PHY1.2
C69
PEG_RX5-
NC
NC
Optional connection to
MCSI_RX_DATA1_- (MCSI
data lane 1 D_PHY1.2
C70
GND
Power ground
PWR GND
C71
PEG_RX6+
NC
NC
Optional connection to
MCSI_RX_DATA2_+ (MCSI
data lane 2 D_PHY1.2
C72
PEG_RX6-
NC
NC
Optional connection to
MCSI_RX_DATA2_- (MCSI
data lane 2 D_PHY1.2
C73
GND
Power ground
PWR GND
C74
PEG_RX7+
NC
NC
www.kontron.com
Termination
Comment
Optional connection to
MCSI_RX_DATA3_+ (MCSI
data lane 3 D_PHY1.2
// 54
COMe-cAL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
C75
PEG_RX7-
NC
NC
C76
GND
Power ground
PWR GND
C77
RSVD
Reserved for future use
NC
C78
PEG_RX8+
NC
NC
C79
PEG_RX8-
NC
NC
C80
GND
Power ground
PWR GND
C81
PEG_RX9+
NC
NC
C82
PEG_RX9-
NC
NC
C83
RSVD
Reserved for future use
NC
C84
GND
Power ground
PWR GND
C85
PEG_RX10+
NC
NC
C86
PEG_RX10-
NC
NC
C87
GND
Power ground
PWR GND
C88
PEG_RX11+
NC
NC
C89
PEG_RX11-
NC
NC
C90
GND
Power ground
PWR GND
C91
PEG_RX12+
NC
NC
Termination
Comment
Optional connection to
MCSI_RX_DATA3_- (MCSI
data lane 3 D_PHY1.2
-
Optional connection to:
CSI2_I2C1_SDA
C92
PEG_RX12-
NC
NC
Optional connect to:
CSI2__I2C1_SCL
C93
GND
Power ground
PWR GND
C94
PEG_RX13+
NC
NC
Optional connection to:
GP_CAMERASB8 (MIPI camera
sideband signal)
C95
PEG_RX13-
NC
NC
Optional connection to:
GP_CAMERASB9 (MIPI camera
sideband signal)
C96
GND
Power ground
PWR GND
C97
RSVD
Reserved for future use
NC
C98
PEG_RX14+
NC
NC
Optional connection to:
GP_CAMERASB10 (MIPI
camera sideband signal
C99
PEG_RX14-
NC
NC
Optional connection to:
GP_CAMERASB11 (MIPI
camera sideband signal
C100
GND
Power ground
PWR GND
C101
PEG_RX15+
NC
NC
Optional connection to:
CSI2_I2C2_SDA
C102
PEG_RX15-
NC
NC
Optional connect to:
CSI2__I2C2_SCL
C103
GND
Power ground
PWR GND
C104
VCC_12V
Main input voltage (8.5 V - 20 V)
PWR
C105
VCC_12V
C106
VCC_12V
C107
VCC_12V
C108
VCC_12V
C109
VCC_12V
C110
GND
+ and -
8.5 V-to
20 V
Power ground
PWR GND
Differential pair differentiator
www.kontron.com
// 55
COMe-cAL6 – User Guide, Rev 1.0
5.2.4. Connector X1B Row D 1 - D 110
Table 27: Connector X1B Row D Pin Assignment (D1 -D110)
Pin
COMe Signal
Description
Type
D1
GND
Power ground
PWR GND
D2
GND
D3
USB_SSTX0-
USB SuperSpeed transmit data path 0
DP-O
D4
USB_SSTX0+
D5
GND
Power ground
PWR GND
D6
USB_SSTX1-
USB SuperSpeed transmit data path 1
DP-O
D7
USB_SSTX1+
Termination
D8
GND
Power ground
PWR GND
D9
USB_SSTX2-
USB SuperSpeed transmit data path 2
DP-O
D10
USB_SSTX2+
D11
GND
Power Ground
PWR GND
D12
USB_SSTX3-
USB SuperSpeed transmit data path 3
DP-O
D13
USB_SSTX3+
D14
GND
Power Ground
PWR GND
D15
DDI1_CTRLCLK_AUX+
DDI1 clock / Auxilary
I/O-3.3
PD 100 KΩ
D16
DDI1_CTRLDATA_AUX-
DDI1 date / Auxilary
I/O-3.3
PU 100 KΩ,
3.3 V (S0)
D17
RSVD
Reserved for future use
NC
D18
RSVD
D19
PCIE_TX6+
NC
NC
D20
PCIE_TX6-
NC
NC
D21
GND
Power Ground
PWR GND
D22
PCIE_TX7+
NC
NC
D23
PCIE_TX7-
NC
NC
D24
RSVD
Reserved for future use
NC
D25
RSVD
DDI1 pair 0
DP-O
D26
DDI1_PAIR0+
D27
DDI1_PAIR0-
D28
RSVD
Reserved for future use
NC
D29
DDI1_PAIR1+
DDI1 pair 1
DP-O
D30
DDI1_PAIR1-
D31
GND
Power ground
PWR GND
D32
DDI1_PAIR2+
DDI1 pair 2
DP-O
D33
DDI1_PAIR2-
D34
DDI1_DDC_AUX_SEL
DDI1 DCC / Auxilary select
I-3.3
D35
RSVD
Reserved for future use
NC
D36
DDI1_PAIR3+
DDI1 pair 3
DP-O
D37
DDI1_PAIR3-
D38
RSVD
Reserved for future use
NC
D39
DDI2_PAIR0+
DDI2 pair 0
DP-O
D40
DDI2_PAIR0-
D41
GND
Power ground
PWR GND
D42
DDI2_PAIR1+
DDI2 pair 1
DP-0
D43
DDI2_PAIR1-
D44
DDI2_HPD
DDI2 Hotplug Detect
I-3.3
D45
RSVD
Reserved for future use
NC
D46
DDI2_PAIR2+
DDI2 pair 2
DP-O
D47
DDI2_PAIR2-
www.kontron.com
Comment
PD 1 MΩ
PD 100 KΩ
// 56
COMe-cAL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
D48
RSVD
Reserved for future use
NC
Termination
Comment
D49
DDI2_PAIR3+
DDI2 pair 3
DP-0
D50
DDI2_PAIR3-
D51
GND
Power ground
PWR GND
D52
PEG_TX0+
NC
NC
Optional connection to
MCSI_CLK0+(MCSI clock 0
D_PHY1.1)
D53
PEG_TX0-
NC
NC
Optional connection to
MCSI_CLK0-(MCSI clock 0
D_PHY1.1)
D54
PEG_LANE_RV#
PCI Express Graphics (PEG) Lane Reversal
NC
D55
PEG_TX1+
NC
NC
Optional connection to
MCSI_CLK0
D56
PEG_TX1-
NC
NC
D57
TYPE2#
Ground for Type 6 modules
GND
GND for Type 6 module
D58
PEG_TX2+
NC
NC
Optional connection to
MCSI_CLK1
D59
PEG_TX2-
NC
NC
D60
GND
Power ground
PWR GND
D61
PEG_TX3+
NC
NC
D62
PEG_TX3-
D63
RSVD
Reserved for future use
NC
D64
RSVD
D65
PEG_TX4+
NC
NC
Optional connection to
MCSI_CLK2+(MCSI clock 2
D_PHY1.1)
D66
PEG_TX4-
NC
NC
Optional connection to
MCSI_CLK2-(MCSI clock 2
D_PHY1.1)
D67
GND
Power ground
PWR GND
D68
PEG_TX5+
NC
NC
D69
PEG_TX5-
NC
NC
PWR GND
-
D70
GND
Power ground
D71
PEG_TX6+
NC
NC
D72
PEG_TX6-
NC
NC
D73
GND
Power ground
PWR GND
D74
PEG_TX7+
NC
NC
Optional connection to
CSI2_I2C3_SDA
D75
PEG_TX7-
NC
NC
Optional connection to
CSI2_I2C3_SCL
D76
GND
Power ground
PWR GND
D77
RSVD
Reserved for future use
NC
D78
PEG_TX8+
NC
NC
Optional connection to
MCSI_RX_CLK0+(MCSI clock 0
D_PHY1.2)
D79
PEG_TX8-
NC
NC
Optional connection to
MCSI_RX_CLK0-(MCSI clock 0
D_PHY1.2)
D80
GND
Power ground
PWR GND
D81
PEG_TX9+
NC
NC
Optional connection to:
GP_CAMERASB0 (MIPI camera
sideband signal)
D82
PEG_TX9-
NC
NC
Optional connection to:
GP_CAMERASB1 (MIPI camera
sideband signal)
D83
RSVD
www.kontron.com
Reserved for future use
NC
// 57
COMe-cAL6 – User Guide, Rev 1.0
Pin
COMe Signal
Description
Type
D84
GND
Power ground
PWR GND
D85
PEG_TX10+
NC
NC
Termination
Comment
Optional connection to:
GP_CAMERASB2 (MIPI camera
sideband signal)
D86
PEG_TX10-
NC
NC
Optional connection to:
GP_CAMERASB3 (MIPI camera
sideband signal)
D87
GND
Power ground
PWR GND
D88
PEG_TX11+
NC
NC
Optional connection to
MCSI_RX_CLK1_+ (MCSI
clock 1 D_PHY1.2)
D89
PEG_TX11-
NC
NC
Optional connection to
MCSI_RX_CLK1_- (MCSI
D90
GND
Power ground
PWR GND
D91
PEG_TX12+
NC
NC
clock 1 D_PHY1.2)
Optional connection to:
CSI2_I2C0_SDA
D92
PEG_TX12-
NC
NC
D93
GND
Power ground
PWR GND
D94
PEG_TX13+
NC
NC
Optional connection to:
CSI2_I2C0_SCL
Optional connection to:
GP_CAMERASB4 (MIPI camera
sideband signal)
D95
PEG_TX13-
NC
NC
Optional connection to:
GP_CAMERASB5 (MIPI camera
sideband signal)
D96
GND
Power ground
PWR GND
D97
RSVD
Reserved for future use
NC
D98
PEG_TX14+
NC
NC
Optional connection to:
GP_CAMERASB6 (MIPI camera
sideband signal)
D99
PEG_TX14-
NC
NC
Optional connection to:
GP_CAMERASB7 (MIPI camera
sideband signal)
D100
GND
Power Ground
PWR GND
D101
PEG_TX15+
NC
NC
D102
PEG_TX15-
NC
NC
D103
GND
Power ground
PWR GND
D104
VCC_12V
Main input voltage (8.5 V - 20 V)
D105
VCC_12V
PWR
8.5 V-20V
Power ground
PWR GND
D106
VCC_12V
D107
VCC_12V
D108
VCC_12V
D109
VCC_12V
D110
GND
+ and -
Differential pair differentiator
www.kontron.com
// 58
COMe-cAL6 – User Guide, Rev 1.0
6/ uEFI BIOS
6.1. Starting the uEFI BIOS
The COMe-cAL6 uses a Kontron-customized, pre-installed and configured version of Aptio® V uEFI BIOS based on the
Unified Extensible Firmware Interface (uEFI) specification and the Intel® Platform Innovation Framework for EFI. This
uEFI BIOS provides a variety of new and enhanced functions specifically tailored to the hardware features of the
COMe-cAL6.
The BIOS version covered in this document might not be the latest version. The latest
version might have certain differences to the BIOS options and features described in this
chapter.
Register for the EMD Customer Section to get access to BIOS downloads and PCN service.
The uEFI BIOS comes with a Setup program that provides quick and easy access to the individual function settings for
control or modification of the uEFI BIOS configuration. The Setup program allows for access to various menus that
provide functions or access to sub-menus with further specific functions of their own.
To start the uEFI BIOS Setup program, follow the steps below:
1.
Power the board.
2.
Wait until the first characters appear on the screen (POST messages or splash screen).
3.
Press the <DEL> key.
4.
If the uEFI BIOS is password-protected, a request for password will appear. Enter either the User Password or the
Supervisor Password (see Chapter 6.2.4: Security Setup Menu), press <RETURN>, and proceed with step 5.
5.
A Setup menu appears.
The COMe-cAL6 uEFI BIOS Setup program uses a hot key navigation system. The hot key legend bar is located at the
bottom of the Setup screens. The following table provides a list of navigation hot keys available in the legend bar.
Table 28: Navigation Hot Keys Available in the Legend Bar
Sub-screen
Description
<F1>
<F1> key invokes the General Help window
<->
<Minus> key selects the next lower value within a field
<+>
<Plus> key selects the next higher value within a field
<F2>
<F2> key loads previous values
<F3>
<F3> key loads optimized defaults
<F4>
<F4> key Saves and Exits
<→> or <←>
<Left/Right> arrows selects major Setup menus on menu bar, for example, Main or Advanced
<↑> or <↓>
<Up/Down> arrows select fields in the current menu, for example, Setup function or sub-screen
<ESC>
<ESC> key exits a major Setup menu and enters the Exit Setup menu
Pressing the <ESC> key in a sub-menu displays the next higher menu level
<RETURN>
<RETURN> key executes a command or selects a submenu
www.kontron.com
// 59
COMe-cAL6 – User Guide, Rev 1.0
6.2. Setup Menus
The Setup utility features menus listed in the selection bar at the top of the screen The setup menus listed are:

Main

Advanced

Chipset

Security

Boot

Save & Exit
The currently active menu is highlighted in white. To change the Setup menu use the left and right arrow keys to
select the required Setup menu.
Each Setup menu provides two main frames. The left frame displays all available functions. With configurable
functions displayed in blue and functions displayed in grey that provide information about the status or the
operational configuration. The right frame displays a Help window explaining about the respective function.
www.kontron.com
// 60
COMe-cAL6 – User Guide, Rev 1.0
6.2.1. Main Setup Menu
On entering the uEFI BIOS, the setup program displays the Main Setup menu. This screen lists the Main Setup menu
sub-screens and provides basic system information as well as functions for setting the system language, time and
date.
Figure 6: Main Setup Menu Initial Screen
The following table shows the Main menu sub-screens and functions and describes the content.
Table 29: Main Setup Menu Sub-screens and Functions
Sub-Screen
Description
BIOS
Information>
Read only field
BIOS vendor, Core version, Compliancy, Project version, Build date and time, and Access level
Memory
Information>
Read only field
Total memory and Memory speed
Platform
Information>
Read only field
Module Information
Product name, Revision, Serial # ‚MAC address, Boot counter, and CPLD rev
Additional information for MAC Address
The MAC address entry is the value used by the Ethernet controller and may contain the entry
‘Inactive’ - Ethernet chip is inactive. To activate the Ethernet chip set the following:
Advanced > Network Stack Configuration > Network Stack > Enable
88:88:88:88:87:88 is a special pattern that will be filled in by the Ethernet firmware if there is
no valid entry in the firmware block of the BIOS SPI (i.e. the MAC address has been overwritten
during the last attempt to flash the system).
System Date>
Displays the system date [Week day mm/dd/yyyy]
System Time>
Displays the system time [hh:mm:ss]
www.kontron.com
// 61
COMe-cAL6 – User Guide, Rev 1.0
6.2.2. Advanced Setup Menu
The Advanced Setup menu screen displays sub-screens and second level sub-screens with functions, for advanced
configurations.
Setting items, on this screen, to incorrect values may cause system malfunctions.
Figure 7: Advanced Setup Menu Initial Screen
The following table shows the Advanced sub-screens and functions and describes the content. Default settings are
bold. Some functions include additional information.
Table 30: Advanced Setup menu Sub-screens and Functions
Sub-Screen
Function
Trusted
Computing>
Read only Information
TPM20 device, Vendor and Firmware version
www.kontron.com
Second level Sub-Screen / Description
Security Device
Support>
Enables or disables BIOS support for security device
Operating System will not show security device, and TCG EFI protocol
and INT1A interface are not available.
[Enabled, Disabled]
Active PCR
Banks>
Read only field
Displays active PCR Banks
Available PCR
Banks>
Read only field
Displays available PCR Banks
SHA-1 PCR Bank>
SHA-1 PCR Bank
[Enabled, Disabled]
SHA256 PCR
Bank>
SHA256 PCR Bank
[Enabled, Disabled]
// 62
COMe-cAL6 – User Guide, Rev 1.0
Sub-Screen
Trusted
Computing>
(continued)
ACPI Settings>
Miscellaneous>
Function
Second level Sub-Screen / Description
Pending
Operation>
Schedules an operation for security device Note: Computer reboots on
restart to change the state of the security device.
[None, TPM Clear]
Platform
Hierarchy>
Platform Hierarchy
[Enabled, Disabled]
Storage
Hierarchy>
Storage Hierarchy
[Enabled, Disabled]
Endorsement
Hierarchy>
Endorsement Hierarchy
[Enabled, Disabled]
TPM2.0 UEFI
Spec. Version>
Selects TCG2 Spec Version support:
TCG_1_2: Compatible mode for Win8/Win10
TCG_2: Supports TCG2 protocol and event format Win 10 or later.
[TCG_1_2, TCG_2]
Physical
Presence Spec
Version>
Select to inform OS to support either PPI Spec 1.2 or 1.3
Note: Some HCK tests might not support 1.3.
[1.2, 1.3]
TPM 20 Interface
Type>
Read only field
Device Select>
Selects BIOS support for security devices.
Auto: Supports TPM 1.2 and TPM 2.0 with default set to TPM2.0
TPM 1.2: Restricts support to TPM 1.2 devices
TPM 2.0: Restricts support to TPM 2.0 devices
[TPM 1.2, TPM 2.0, Auto]
Enable ACPI Auto
Configuration>
BIOS ACPI auto configuration.
If enabled, the system uses generic ACPI settings that may not fit the
system best.
[Enabled, Disabled]
Enable
Hibernation>
Enables or disables systems ability to hibernate (OS/S4 Sleep State)
This option may not be effective with some operating systems.
[Enabled, Disabled]
ACPI Sleep
State>
Selects highest ACPI sleep state the system enters when
SUSPEND button is pressed
[Suspend Disabled, S3 Suspend to Ram]
Lock Legacy
Resources>
Lock of legacy resources
[Enabled, Disabled]
Watchdog>
Auto
Reload>
Enables automatic reload of watchdog timers on timeout
[Enabled, Disabled]
Global
Lock>
Sets all Watchdog registers (except for WD_KICK) to read
only, until the module is reset.
[Enabled, Disabled]
Stage 1
Mode>
Selects action for Watchdog stage 1
[Disable, Reset, Delay, WDT Signal only]
Additional Information two-staged watchdog
Programmable stages to trigger different actions - If one stage is disabled, then the next
stage is also disabled. Common actions for a watchdog trigger events are ‘Delay’, ‘Reset’
and ‘Watchdog signal only’. Timeouts can be set to eight different fixed values between
1 second and 30 minutes.
www.kontron.com
// 63
COMe-cAL6 – User Guide, Rev 1.0
Sub-Screen
Miscellaneous>
(continued)
H/W Monitor>
Function
Second level Sub-Screen / Description
Reset Button
Behavior>
Selects reset button behavior
[Chipset Reset, Power Cycle]
I2C Speed>
Selects internal I2C bus speed between (1 kHz and 400 kHz)
For a default system 200 kHz is an appropriate value.
On-board I2C
Mode>
Keep ‘Multimaster’ setting unless otherwise noted
[MultiMaster, BusClear]
Manufacturing
Mode>
Read only field
Function is disabled
LID Switch
Mode>
Shows or hides Lid Switch Inside ACPI OS.
[Enabled, Disabled]
Sleep Button
Mode>
Shows or hides Sleep Button inside ACPI OS.
[Enabled, Disabled]
MBus device
ACPI Output>
Hides the SMBus device from OS if set to hidden.
Otherwise, the device is visible in OS.
[Hidden, Normal]
CPLD device ACPI
Mode>
Hides the CPLD device from OS if set to hidden. Otherwise the device is
visible in OS.
[Hidden, Normal]
CPU
Temperature>
Read only field
CPU temperature (°C) and Module temperature (°C)
Module
Temperature>
Read only field
Module temperature (°C)
CPU Fan –
Fan Control>
Sets CPU Fan Control mode
Disable - Stops fan.
Manual – Manually sets the fan
Auto – Hardware monitor controls cooling, similar to ACPI based
‘Active Cooling’, without producing a software load to the system.
[Disabled, Manual, Auto]
CPU Fan –
Fan Pulse>
Displays number of pulses the fan produces during one revolution.
(Range: 1-4)
CPU Fan –
Fan Trip Point>
Displays temperature at which the fan accelerates.
(Range: 20°C – 80°)
CPU Fan –
Trip Point
Speed>
Displays Fan speed at trip point in %. Minimum value is 30%.
Fan always runs at 100% at (TJmax.-10°C).
CPU Fan – Ref.
Temperature>
Determines temperature source used for automatic fan control
[Module Temperature, CPU Temperature]
Additional Information CPU Temperature
The CPU temperature value is taken from a thermal resistor (NTC) that is placed very close
to the CPU. The NTC resistor is not capable of measuring very fast rises and falls in
temperature and measurements show a certain non-linearity. The NTC thermal resistor
gives a general indication of the temperature close to the CPU. If the NTC thermal resistor
value is compared to internal CPU values (i.e. DTS based values) certain differences are
expected. These differences are due to the design and are not a bug. The thermal resistor
method was chosen because the CPU does not support PECI based temperature
measurement, and does not supply an internal diode on the CPU’s die that can be used
instead of PECI. Reading the DTS based values would harm the system’s real-time behavior
and is therefore not used.
www.kontron.com
// 64
COMe-cAL6 – User Guide, Rev 1.0
Sub-Screen
H/W Monitor>
(continue)
Function
Second level Sub-Screen / Description
External FanFan Control>
Sets Fan Control mode for external fan
Disable - Stops the fan
Manual – Manually set the fan
Auto - Hardware monitor controls cooling, similar to ACPI based ‘Active
Cooling’, without producing a software load to the system.
[Disable, Manual, Auto]
External Fan–
Fan Pulse>
Displays number of pulse the fan produces during one revolution
(Range: 1-4)
External FanFan Trip point>
Displays temperature at which fan accelerates.
(Range: 20°C to 80°C)
External FanTrip Point
Speed>
Displays fan speed at trip point in %. Minimum value is 30%
Fan always runs at 100% at (TJmax.-10°C)
External Fan
Reference
Temperature>
Determines temperature source used for automatic fan control
[Module Temperature, CPU Temperature]
Additional Information External Fan
An external fan can be connected to baseboard. The external fan’s control lines are routed
via the COMe connector.
Serial Port Console
Redirection>
5.0V Standby>
Read only field
Displays standby voltage
Batt. Volt. at
COMe pin>
Read only field
Displays battery voltage at COMe pin
Wide range VCC>
Read only field
Displays wide range VCC
COM0 Console
Redirection>
Console redirection via COMe module’s COM1.
[Enabled, Disabled]
COM1 Console
Redirection>
Console redirection via COMe module’s COM2.
[Enabled, Disabled]
COM2 Console
Redirection>
Console redirection via COMe module’s COM3.
[Enabled, Disabled]
COM3 Console
Redirection>
Console redirection via COMe module’s COM4
[Enabled, Disabled]
Additional Information COM # Console
If redirection is enabled then the port settings such as Terminal type, Bits per second, Data
bits, Parity etc. can be adjusted here. On-module COM ports do not support flow control.
If the Port is disabled, the COM# port is displayed as a read only field.
www.kontron.com
Legacy Console
Redirection
settings>
Legacy Serial
Redirection
Port>
Serial Port for
Out-of-Band
Management /
Windows EMS
Console
Redirection>
Console redirection
[Enabled, Disabled]
Selects a COM port to display redirection of legacy
OS and legacy OPROM messages
[COM0, COM1, COM2, COM3]
// 65
COMe-cAL6 – User Guide, Rev 1.0
Sub-Screen
Function
CPU Configuration>
Socket 0 CPU
Information>
Second level Sub-Screen / Description
Read only field
Processor Type, CPU signature, Microcode patch, Max. CPU Speed, Min.
CPU speed, Processor Cores, Intel HT technology, Intel VT-x technology,
L1 Data Cache, L1 Code Cache, L2 Cache and L3 Cache.
Read only field
Speed and 64 bit
CPU Power
Management
Configuration>
www.kontron.com
EIST>
Intel Speedstep®
[Enabled, Disabled]
Turbo Mode>
Turbo mode Note: EMTTM must also be enabled.
Auto means enabled unless the max. turbo ratio is
bigger than 16-SKL A0 W/A.
[Enabled, Disabled]
Boot
Performance
Mode>
Selects the performance state the BIOS sets before
OS handoff
[Max. Performance, Max. Battery]
C-States>
Enables or disables CPU power management to
allow CPU to enter C-State
[Enabled, Disabled]
Enhanced
C-States>
Enables or disables C1E. If enabled CPU switches to
minimum speed when all cores enter C-state.
[Enabled, Disabled]
Max. Package
C-States>
Controls maximum package C-state that the
processor supports
[PC2, PC1, C0]
Max. Core
C-State>
Controls max. core C-state that cores support.
[Fused value, Core C10, Core C9, Core C8 ,Core C7,
Core C6, Core C1, Unlimited]
C-State
Auto Demotion>
Configures C-state auto demotion
[Disabled, C1]
C-State
Un-demotion>
Configures C-state un-demotion
[Disabled, C1]
Active Processor
Cores>
Number of cores to enable in each processor package
[Enabled, Disabled]
Intel (VME)
Virtual
Technology>
Enables VMM to utilize additional hardware capabilities provided by
Vanderpool Technology
[Enabled, Disabled]
VT-D>
CPU VT-d
[Enabled, Disabled]
PROCHOT>
Enables external agents can drive PROCHOT# to throttle the processor
[Enabled, Disabled]
Monitor MWait>
Monitor Mwait
[Enabled, Disabled, Auto]
P-State
Coordinator>
Changes P-State coordination type
[HW_ALL, SW_ALL, SW_ANY]
DTS>
Digital Thermal Sensor (DTS)
[Enabled, Disabled]
// 66
COMe-cAL6 – User Guide, Rev 1.0
Sub-Screen
Function
SIO Configuration>
Read only field
AMI SIO driver version
Serial Port 0>
Serial Port 1>
Second level Sub-Screen / Description
Use This Device>
Enables or disables the use of this logical device
[Enabled, Disabled]
Logical Device
Settings: Current>
Read only field
IO=3F8h; IRQ=4
Logical Device
Settings: Possible>
Allows the user to change the device’s resource
settings. New settings are reflected on the setup
page after system restarts.
[Use Automatic Settings,
IO=3F8h; IRQ=4,
IO=3F8h; IRQ=3,4,5,7,9,10,11,12
IO=2F8h; IRQ=3,4,5,7,9,10,11,12,
IO=3E8h; IRQ=3,4,5,7,9,10,11,12,
IO=2E8h; IRQ=3,4,5,7,9,10,11,12]
Use This Device>
Enables or disables the use of this logical device
[Enabled, Disabled]
Logical Device
Settings: Current>
Read only field
IO=2F8h; IRQ=3
Logical Device
Setting: Possible>
Allows the user to change the device’s resource
settings. New settings are reflected on the setup
page after system restart.
[Use Automatic Settings,
IO=2F8h; IRQ=3,
IO=3F8h; IRQ=3,4,5,7,9,10,11,12
IO=2F8h; IRQ=3,4,5,7,9,10,11,12,
IO=3E8h; IRQ=3,4,5,7,9,10,11,12,
IO=2E8h; IRQ=3,4,5,7,9,10,11,12]
Additional Information SIO:
Warning: Logical Devices state on the left side of the control reflects the current logical
device state. Changes made during the setup session are shown after restarting the system.
Disabling SIO logical devices may have unwanted effects.
The SIO Configuration menu enables all available serial interfaces to be configured. The
module-based serial interfaces always appear as COM1 and COM2. COM 1 and COM 2 can be
treated as 16550-compatible legacy COM interfaces at the standard I/O addresses and are
based in the on-module CPLD. Note: Hardware flow control is not supported.
Optionally, If the baseboard contains an activated SuperIO of the type Winbond 83627, then
its serial interfaces are added to the system as COM3 and COM4. COM3 and COM4 IRQ and
I/O addresses are configurable in this menu, too.
Although the chipset internal COMs are not supported due to technical constraints their
driver must be installed. Installing the driver does not mean that these serial interfaces are
useable.
Network Stack
Configuration>
Network Stack>
USB Configuration>
Read only fields
USB Configuration, UBS module version, USB controllers, and USB devices
XHCI Hand-off>
www.kontron.com
UEFI network stack
[Enabled, Disabled]
XHCI ownership change claimed by XHCI driver
Note: This is a work around for OS(s) without XHCI hand-off support.
[Enabled, Disabled]
// 67
COMe-cAL6 – User Guide, Rev 1.0
Sub-Screen
USB Configuration>
(continued)
www.kontron.com
Function
Second level Sub-Screen / Description
USB Mass
Storage Driver
Support>
USB mass storage driver support
[Enabled, Disabled]
USB Transfer
Time-out>
Displays timeout value for control, bulk and interrupt transfers
[1 sec, 5 sec, 10 sec, 20 sec]
Device Reset
Time-out>
Displays USB mass storage device start unit command time-out
[10 sec, 20 sec, 30 sec, 40 sec]
Device Power-up
Delay>
Displays maximum time device takes to report to the host properly.
Auto uses the default values of 100 ms for a root port and for a hub
port the delay is taken from hub port descriptor.
[Auto, Manual]
// 68
COMe-cAL6 – User Guide, Rev 1.0
6.2.3. Chipset Setup Menu
The Chipset Setup menu screen lists four sub-screen options North Bridge, South Bridge, Uncore Configuration and
South Cluster Configuration..
6.2.3.1. Chipset>North Bridge
Figure 8: Chipset > North Bridge Menu Initial Screen
The following table shows the North bridge sub-screens and functions, and describes the content. Default settings
are bold.
Table 31: Chipset> North Bridge Sub-screens and Function
Function
Second level Sub-Screen / Description
Memory
Configuration>
Read only field
Total memory, Memory slot 0, Memory slot 1.
www.kontron.com
Max TOLUD>
Sets the maximum TOLUD value
Dynamic assignment adjusts TOLUD automatically, based on largest
MMIO length of the installed graphic controller
[2 GB, 2.25 GB, 2.5 GB, 2,75 GB, 3 GB]
Above 4GB MMIO
BIOS Assignment>
Enables or disables above 4 GB memory mapped IO BIOS assignment.
This is disabled automatically when aperture size is set to 2048 MB.
[Enabled, Disabled]
PCIE VGA
Workaround>
Enable If PCIe card cannot boot in DOS. For test purposes only.
[Enabled, Disabled]
// 69
COMe-cAL6 – User Guide, Rev 1.0
6.2.3.2. Chipset> South Bridge
Figure 9: Chipset > South Bridge Menu Initial Screen
The following table shows the South bridge sub-screens and functions, and describes the content. Default settings
are bold.
Table 32: Chipset> South Bridge Sub-screens and Functions
Function
Second level Sub-Screen / Description
OS Selection>
Selects target OS.
[Windows, Android, Intel Linux]
The OS Selection function must but be selected in the setup to reflect the Operating System
(OS) in use. Otherwise, the correct functionality might not be possible.
www.kontron.com
// 70
COMe-cAL6 – User Guide, Rev 1.0
6.2.3.3. Chipset>Uncore Configuration
Figure 10: Chipset>Uncore Configuration Menu Initial Screens
www.kontron.com
// 71
COMe-cAL6 – User Guide, Rev 1.0
The following table shows the Uncore Configuration sub-screens and functions, and describes the content. Default
settings are bold.
Table 33: Chipset> Uncore Configuration Sub-screens and Functions
Function
Second level Sub-Screen / Description
Read only field
GOP Configuration data and IGD managed by Intel® GOP driver Information
IGD–Boot Type>
Selects the internal video device activated during POST
This has no effect if external graphics are present.
[Auto, LFP, EFP1, EFP2]
IGD-Secondary
Boot Type
Selects the second internal video device activated during post.
[Disabled, EFP1, EFP2]
LFP Resolution>
Selects LFP used by Internal Graphics device by selecting the appropriate setup item
Default is [Auto]
Backlight
Control>
Backlight control setting
[None/External, PWM, PWM Inverted, I2C, I2C Inverted]
PWM Frequency>
Sets LCD backlight PWM frequency
[200 Hz, 400 Hz, 1 kHz, 2 kHz, 4 kHz, 8 kHz, 20 kHz, 40 kHz]
Backlight Value>
Sets LCD backlight brightness
Range: (0-255)
LVDS Clock
Center
Spreading>
Selects LVDS clock frequency center spreading depth
[No Spreading, 0.5%, 1.0%, 1.5%, 2.0%, 2.5%]
EFP1 Type>
Integrated HDMI/Display Port configuration with external connectors
[No Device, DisplayPort Only, DP with HDMI/DVI, DP with DVI, HDMI/DVI, DVI Only]
EFP1 LSPCON>
HDMI 2.0 feature Level shifter/Protocol converter
[Enabled, Disabled]
EFP2 Type>
Integrated HDMI/Display Port configuration with external connectors
[No Device, DisplayPort Only, DP with HDMI/DVI, HDMI/DVI,]
EFP2 LSPCON>
HDMI 2.0 feature Level shifter/Protocol converter
[Enabled, Disabled]
LFP Type>
LFP Configuration
[No Device, EDP]
LFP Panel Type>
Selects panel type connected to eDP port as native eDP or LVDS via bridge device. This switch
depends on the modules H/W option.
[LVDS, eDP]
RC6 (render
Standby)>
Check to enable render standby support. IF SOix is enabled, RC6 should be enabled.
This function is read only if SOix is enabled.
[Enabled, Disabled]
GTT Size>
Selects the GTT size
[2 MB, 4 MB, 8 MB]
Aperture Size>
Selects the aperture size
[128 MB, 256 MB, 512 MB]
www.kontron.com
// 72
COMe-cAL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
DVMT PreAllocated>
Selects DVMT 5.0 pre-allocated (fixed) graphics memory size used by Internal graphics
[64 M, 96 M, 128 M, 160 M, 192 M, 224 M, 256 M, 288 M, 320 M, 352 M 384 M, 416 M,
448 M, 480M, 512 M]
DVMT Total Gfx
Mem>
Selects DVMT 5.0 total graphics memory size used by internal graphics device
[128 M, 256 M, MAX]
Cd Clock
Frequency>
Selects the highest Cd clock frequency supported by the platform
[144 MHz, 288 MHz, 384 MHz, 576 MHz, 624 MHz]
GT PM Support>
GT PM Support
[Enabled, Disabled]
BIA>
Auto: GMCH uses VBIOS default
Level n: is enabled with selected aggressiveness level
[Auto, Disabled, Level 1, Level 2, Level 3, Level 4, Level5]
Panel Scaling>
Sets Panel scaling
[Auto, Centering, Stretching]
GMCH BLC
Control>
Backlight control settings
[PWM-Inverted, GMBus-Inverted, PWM-Normal, GMBus-Normal]
Memory
Scrambler>
Memory scrambler support
[Enabled, Disabled]
www.kontron.com
// 73
COMe-cAL6 – User Guide, Rev 1.0
6.2.3.4. Chipset>South Cluster Configuration
Figure 11: Chipset>South Cluster Configuration Menu Initial Screen
The following table shows the South Cluster Configuration sub-screens and functions, and describes the content.
Default settings are bold.
Table 34: Chipset>South Cluster Configuration Menu Sub-screens and Functions
Function
Second level Sub-Screen / Description
HD Audio
Configuration>
HD-Audio Support>
HD-Audio support
[Enabled, Disabled]
HD-Audio CSME
memory Transfers>
Sets HD-Audio CSME memory transfers to VC0/VC2
[VC0, VC2]
HD-Audio CSME
Memory Transfers>
Sets HD-Audio CSME memory transfers to VC0/VC2
[VC0, VC2]
HD-Audio Host
Memory Transfers>
Sets HD-Audio Host memory transfers to VC0/VC2
[VC0, VC2]
HD-Audio I/O Buffer
Ownership Select>
Sets HD-Audio I/O buffer ownership
[HD-Audio link owns all the I/O buffers,
I2S port owns all the I/O buffers]
HD-Audio Clock
Gating>
HD-Audio Clock gating
[Enabled, Disabled]
HD-Audio Power
Gating>
HD-Audio Power gating
[Enabled, Disabled]
www.kontron.com
// 74
COMe-cAL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
HD Audio
Configuration>
(continued)
HD-Audio PME>
HD-Audio PME
[Enabled, Disabled]
HD-Audio Link
Frequency>
Selects HD-Audio link frequency
Applicable only if HDA codec supports selected frequency.
[6 MHz, 12 MHz, 24 MHz]
iDisplay Link
Frequency>
Selects iDisplay Link frequency
Applicable only if iDisp codec supports selected frequency.
[48 MHz, 96 MHz]
PCI Express Clock
Gating>
PCI Express clock gating for each root port
[Enabled, Disabled]
Port8xh Decode>
PCI express port 8xh decode
[Enabled, Disabled]
Peer Memory Write
Enable>
Peer memory write
[Enabled, Disabled]
Compliance
Mode>
Enable when using compliance load board
[Enabled, Disabled]
PCI Root Port 3
(COMe PCIe#1)>
or
PCI Root Port 4
(COMe PCIe#2)>
or
PCI Root Port 5
(COMe PCIe#3)>
or
PCI Root Port 6
(GbE)>
PCI Express
Root Port[#]>
Controls the PCI Express port
[Enabled, Disabled]
ASPM>
PCI Express Active State Power Management
(ASPM) level settings
[Disabled, L0s, L1, L0sL1, Auto]
L1 Substates>
PCI Express L1 substrates settings
[Disabled, L1.1, L1.2, L1.1 & L1.2]
ACS>
Access Control Service Extended Capability
[Enabled, Disabled]
URR>
PCI Express unsupported request reporting
[Enabled, Disabled]
FER>
PCI Express device fatal error reporting
[Enabled, Disabled]
NFER>
PCI Express device non-fatal error reporting
[Enabled, Disabled]
CER>
PCI Express device correctable error reporting
[Enabled, Disabled]
CT0>
PCI Express completion timer (T0)
[Default Setting, 16 ms55 ms, 65ms210 ms, 260
ms900 ms, 1 s-3.5 s, Disabled]
SEFE>
Root PCI Express System Error on Fatal Error
[Enabled, Disabled]
SENFE>
Root PCI Express System Error on non-Fatal Error
[Enabled, Disabled]
SECE>
Root PCI Express System Error on correctable error
[Enabled, Disabled]
PCI Express
Configuration>
www.kontron.com
// 75
COMe-cAL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
PCI Express
Configuration>
(continued)
PCI Root Port 3
(COMe PCIe#1)>
or
PCI Root Port 4
(COMe PCIe#2)>
or
PCI Root Port 5
(COMe PCIe#3)>
or
PCI Root Port 6
(GbE)>
(continued)
PME SCI>
PCI Express PME SCI
[Enabled, Disabled]
PCIe Speed>
Configures PCIe speed
[Auto, Gen 1, Gen2]
Transmitter Half
Swing>
Transmitter half swing
[Enabled, Disabled]
Extra Bus
Reserved>
Extra bus reserved for bridges behind this root
bridge. (0-7)
Reserved
Memory>
Reserved memory and prefetchable memory for this
root bridge
Range: (1 MB-20 MB)
Reserved I/O>
Reserved I/O for this root bridge
Range: (4 k, 8 k, 16 k, 20 k)
PCH PCIE1 LTR>
PCH PCIE latency reporting
[Enabled, Disabled]
Snoop Latency
Override>
Snoop latency override or Non Snoop override for
PCH PCIE.
Disabled: disables override
Manual: manually enters override values
Auto: maintains default BIOS flow.
[Disabled, Manual, Auto]
Non Snoop
Latency
Override>
SATA Drivers>
www.kontron.com
PCIE1 LTR Lock>
PCIE LTR configuration lock
[Enabled, Disabled]
PCIE Selectable
De-emphasis>
Selects level of de-emphasis for an upstream
component, if the Link operates at 5.0 GT/s speed.
(1b – 3.5 dB, 0b – 6 dB)
[Enabled, Disabled]
Chipset SATA>
Enables or disables the Chipset SATA controller.
Chipset SATA controller supports two black internal SATA ports (up to 3
Gb/s per port.)
[Enabled, Disabled]
SATA Test Mode>
Test mode [Enabled, Disabled]
Aggressive LPM>
Enable PCH to aggressively enter link power state
[Enabled, Disabled]
SATA Port 0>
or
SATA Port 1>
SATA Port #>
Read only field
SATA port installed/Not Installed and software
preserve
Port #>
SATA port #
[Enabled, Disabled]
SATA Port # Hot
Plug Capability>
Reports SATA port as Hot Plug capable
[Enabled, Disabled]
Configured as
eSATA>
Read only field
// 76
COMe-cAL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
SATA Drivers>
(continued)
SATA Port 0>
or
SATA Port 1>
(continued)
SCC
Configuration>
USB
Configuration>
Miscellaneous
Configuration>
www.kontron.com
Mechanical
Presence
Switch>
Controls reporting if port has a mechanical presence
switch
Note: Requires hardware support.
[Enabled, Disabled]
Spin Up Device>
If enabled for any port, staggered spin-up is
performed and only drives with this option enabled
will spin up at boot.
Note: Otherwise, all drives spin up at boot.
[Enabled, Disabled]
SATA Device
Type>
Identifies if SATA port is connected to a solid-state
drive or hard disk drive.
[Hard Disk Drive, Solid State Drive]
SATA Port#
DevSlp>
SATA Port # DevSlp
Note: Board rework needed for LP before enabling.
[Enabled, Disabled]
DITO
Configuration>
DITO configuration
[Enabled, Disabled]
DITO Value>
Read only field
DM Value>
Read only field
SCC SD Card
Support (D27:F0)>
SCC card support
[Enabled, Disabled]
SCC eMMC Support
(D28:F0)>
SCC eMMC Support
[Enabled, Disabled]
eMMC Max Speed>
Selects the eMMC max. speed allowed
[HS400, HS200, DDR50]
XHCI Pre-Boot
Driver>
XHCI pre-boot driver support
[Enabled, Disabled]
xHCI Mode>
Disable- disables XHCI controller function and USB devices are NOT
detectable or usable during boot and in OS.
Note: Do not disable unless required for debugging purposes.
[Enabled, Disabled]
USB VBUS>
VBus should be ‘ON’ in host mode and ‘OFF’ in OTG device mode
[Off, ON]
USB Port Disable
Override>
Selectively enables or disables the corresponding USB port from
reporting a device connection to the controller.
[Enabled, Disabled]
xDCI Support>
XDCI
[Disable, PCI Mode]
USB HW Mode AFE
Comparators>
USB HW mode AFE comparators
[Enabled, Disabled]
8254 Clock Gating>
8254 Clock gating
[Enabled, Disabled]
// 77
COMe-cAL6 – User Guide, Rev 1.0
Function
Second level Sub-Screen / Description
Miscellaneous
Configuration>
(continued)
State After G3>
Specifies which state to go to if power is reapplied after power failure
(G3 state)
S0 state: System boots directly as soon as power is applied.
S5 state: System remains in power-off states until the power button is
pressed.
[S0 State, S5 State]
Board Clock Spread
Spectrum>
Clock chip’s spread spectrum feature
[Enabled, Disabled]
Wake On LAN>
Wake on LAN
[Enabled, Disabled]
BIOS Lock>
SC BIOS Lock features
NOTE: Required to be enabled to ensure SMM protection of flash.
[Enabled, Disabled]
DCI Enable
(HDCIEN)>
If enabled, the user is considered to have consented to enable DCI and
allows debug over the USB 3 interface.
If disabled, the host controller does not enable the DCI feature.
[Enabled, Disabled]
DCI Auto Detect
Enable>
If set, DCI Auto detects if DCI is connected during BIOS post time and
enables DCI. If not set, DCI is disabled.
[Enabled, Disabled]
www.kontron.com
// 78
COMe-cAL6 – User Guide, Rev 1.0
6.2.4. Security Setup Menu
The Security Setup menu provides information about passwords and functions for specifying the security settings.
Figure 12: Security Setup Menu Initial Screen
The following table shows the Security set up sub-screens and functions, and describes the content.
Table 35: Security Setup Menu Sub-screens and Functions
Function
Description
Setup Administrator Password>
Sets administrator password
User Password>
Sets user password
HDD Security Configuration>
Read Only Information
Allows access to set, modify and clear Hard Disk user and master passwords.
User Passwords need to be installed for Enabling Security. Master Password can
be modified only when successfully unlocked with the Master Password in Post.
If the ‘Set HDD Password’ is grayed out, then perform a power cycle to enable the
option again.
HDD Password Configuration
Security Supported
:
Security Enabled
:
Security Locked
:
Security Frozen
:
HDD User Pwd Status
:
HDD Master Pwd Status
:
Set User
Password>
www.kontron.com
Yes
No
No
No
Not Installed
Installed
Sets HDD password.
Note: It is advisable to power cycle the system after setting
// 79
COMe-cAL6 – User Guide, Rev 1.0
Function
Description
HDD Security Configuration>
(continued)
Set User
Password>
(continued)
Hard Disk passwords.
The ‘Discard or Save Changes’ setup option does not have an
impact on HDD when the password is set or removed.
Note: If the ‘Set HDD User Password’ option is grayed out,
perform a power cycle to enable the option again.
If only the administrator’s password is set, then only access to setup is limited. The
password is only entered when entering the setup.
If only the user’s password is set, then the password is a power on password and must be
entered to boot or enter setup. Within the setup menu the user has administrator rights.
Password length requirements are maximum length 20 and minimum length 3.
6.2.4.1. Remember the Password
It is recommended to keep a record of all passwords in a safe place. Forgotten passwords results in the user being
locked out of the system. If the system cannot be booted because the User Password or the Supervisor Password are
not known, clear the uEFI BIOS settings, or contact Kontron Support for further assistance.
HDD security passwords cannot be cleared using the above method.
www.kontron.com
// 80
COMe-cAL6 – User Guide, Rev 1.0
6.2.5. Boot Setup Menu
The Boot Setup menu lists the dynamically generated boot device priority order.
Figure 13: Boot Setup Menu Initial Screen
The following table shows the Boot Setup sub-screens and functions and describes the content. Default settings are
bold.
Table 36: Boot Setup Menu Sub-screens and Functions
Function
Description
Setup Prompt Timeout>
Displays number of seconds the firmware waits for setup activation key
The value 65535(0xFFFF) means an indefinite wait.
Bootup NumLock State>
Selects keyboard NumLock state
[ON, OFF]
Quiet Boot>
Quiet Boot
[Enabled, Disabled]
Boot Option #1>
Sets the system boot order
[UEFI: KingstonDataTraveler 3.0PMAP, partition 1
UEFI: Built in EFI Shell
Windows Boot Manager (PO: Samsung MZ5PA128HMCD-01000)
Disabled]
Boot Option #2>
Sets the system boot order
[UEFI: KingstonDataTraveler 3.0PMAP, partition 1
UEFI: Built in EFI Shell
Windows Boot Manager (PO: Samsung MZ5PA128HMCD-01000)
Disabled]
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Function
Description
Boot Option #3>
Sets the system boot order
[UEFI: KingstonDataTraveler 3.0PMAP, partition 1
UEFI: Built in EFI Shell
Windows Boot Manager (PO: Samsung MZ5PA128HMCD-01000)
Disabled]
Fast Boot>
Enables or disables FastBoot features
Note: Most probes are skipped to reduce time and cost during boot.
[Enabled, Disabled]
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6.2.6. Save and Exit Setup Menu
The Save and Exit Setup menu provides functions for handling changes made to the settings and exiting the program.
Figure 14: Save and Exit Setup Menu Initial Screen
The following table shows the Save and Exit Setup sub-screens and functions.
Table 37: Save and Exit Setup Menu Sub-screens and Functions
Function
Description
Save Changes and Exit >
Exits system after saving changes
Discard Changes and Exit>
Exits system setup without saving changes
Save Changes and Reset>
Resets system after saving changes
Discard Changes and Reset>
Resets system setup without saving changes
Save Changes>
Saves changes made so far for any setup options
Discard Changes>
Discards changes made so far for any setup options
Restore Defaults>
Restores/loads standard default values for all setup options
Save as User Defaults>
Saves changes made so far as user defaults
Restore User Defaults>
Restores user defaults to all setup options
Boot override
UEFI: KingstonDataTraveler 3.0PMAP,
Partition 1>
Attempts to launch the boot option #2
Boot override
UEFI: Built in EFI Shell>
Attempts to launch the boot option #3
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Function
Description
Boot override
Windows Boot Manager (PO: Samsung
MZ5PA128HMCD-01000)>
Attempts to launch the boot option #1
Boot override
Launch EFI Shell from File System Device>
Attempts to launch EFI Shell application (Shell.efi) from one of the
available file system devices
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6.3. The uEFI Shell
The Kontron uEFI BIOS features a built-in and enhanced version of the uEFI Shell. For a detailed description of the
available standard shell scripting, refer to the EFI Shell User Guide. For a detailed description of the available
standard shell commands, refer to the EFI Shell Command Manual. Both documents can be downloaded from the EFI
and Framework Open Source Community homepage (http://sourceforge.net/projects/efi-shell/files/documents/).
AMI APTIO update utilities for DOS, EFI Shell and Windows are available at AMI.com:
http://www.ami.com/support/downloads/amiflash.zip.
Kontron uEFI BIOS does not provide all shell commands described in the EFI Shell Command
Manual.
6.3.1. Basic Operation of the uEFI Shell
The uEFI Shell forms an entry into the uEFI boot order and is the first boot option by default.
6.3.1.1. Entering the uEFI Shell
To enter the uEFI Shell, follow the steps below:
1.
Power the board.
2.
Press the <F7> key (instead of <DEL>) to display a choice of boot devices.
3.
Choose ‘UEFI: Built-in EFI shell’.
EFI Shell version 2.40 [5.11]
Current running mode 1.1.2
Device mapping table
Fs0
:HardDisk - Alias hd33b0b0b fs0
Acpi(PNP0A03,0)/Pci(1D|7)/Usb(1, 0)/Usb(1, 0)/HD(Part1,Sig17731773)
4.
Press the <ESC> key within 5 seconds to skip startup.nsh, and any other key to continue.
5.
The output produced by the device mapping table can vary depending on the board’s configuration.
6.
If the <ESC> key is pressed before the 5 second timeout elapses, the shell prompt is shown:
Shell>
6.3.1.2. Exiting the uEFI Shell
To exit the uEFI Shell, follow one of the steps below:
1.
Use the exit uEFI Shell command to select the boot device, in the Boot menu, that the OS boots from.
2.
Reset the board using the reset uEFI Shell command.
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6.4. uEFI Shell Scripting
6.4.1. Startup Scripting
If the <ESC> key is not pressed and the timeout has run out then the uEFI Shell automatically tries to execute some
startup scripts. It searches for scripts and executes them in the following order:
1.
Initially searches for Kontron flash-stored startup script.
2.
If there is no Kontron flash-stored startup script present, then the uEFI-specified startup.nsh script is used. This
script must be located on the root of any of the attached FAT formatted disk drive.
3.
If none of the startup scripts are present or the startup script terminates then the default boot order is
continued.
6.4.2. Create a Startup Script
Startup scripts can be created using the uEFI Shell built-in editor edit or under any OS with a plain text editor of your
choice. To create a startup shell script, simply save the script on the root of any FAT-formatted drive attached to the
system. To copy the startup script to the flash, use the kBootScript uEFI Shell command.
In case there is no mass storage device attached, the startup script can be generated in a RAM disk and stored in the
SPI boot flash using the kRamdisk uEFI Shell command.
6.4.3. Example of Startup Scripts
6.4.3.1. Execute Shell Script on other Hard Drive
This example (startup.nsh) executes the shell script named bootme.nsh located in the root of the first detected disc
drive (fs0).
fs0:
bootme.nsh
6.5. Firmware Update
Firmware updates are typically delivered as a ZIP archive containing only the firmware images. The content of the
archive with the directory structure must be copied onto a data storage device with FAT partition.
6.5.1. Updating Procedure
BIOS can be updated with the Intel tool fpt.efi using the procedure below:
1.
Copy the following files to an USB stick:

flash.nsh (if available)

fpt.efi

fparts.txt

cAL6r<xxx>.bin (where xxx stands for the version #)
2.
Start the system into uEFI BIOS setup. (see Chapter 6.1: Starting the uEFI BIOS).
3.
Disable the BIOS lock.
Chipset > South Cluster Configuration> Miscellaneous Configuration> BIOS Lock > Disabled
4.
Save and Exit the BIOS setup.
5.
On the next start, boot into shell. (see Chapter 6.3.1.1: Entering the uEFI Shell).
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6.
Change to the drive representing the USB stick:
fsx:
(x = 0,1,2,etc. represents the USB stick)
and then change to the directory where you copied the flash tool:
cd <your_directory>
7.
Start flash.nsh (if available) or enter the following:
fpt
8.
–F cal6r<xxx>.bin
Wait until flashing is successful and then power cycle the board.
Do not switch off the power during the flash process!
Doing so leaves your module unrecoverable.
Changes made after step 3 above are only effective during the first boot after applying the
changes. If you fail to flash during the next boot, you might have to repeat the steps under 3.
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Appendix A: List of Acronyms
Table 38: List of Acronyms
ACPI
Advanced Configuration Power
Interface
HPM
PICMG Hardware Platform Management
specification family
BIOS
Basic Input Output System
HWM
Hardware Monitor
BSP
Board Support Package
IC
Integrated Circuit
Carrier
Board
Application specific circuit board that
accepts a COM Express ® module
I2C
Inter integrated Circuit Communications
IOT
Internet of Things
COM
Computer-on-Module
ISA
Industry Standard Architecture
COMe-b
COM Express® b=basic
125 mm x 95 mm module form factor
LAN
Local Area Network
COMe-c
COM Express® c=compact
95 mm x 95 mm module form factor
LPC
Low Pin-Count Interface:
LPT
Line Print Terminal
COMe-m
COM Express® m=mini
84 mm x 55 mm module form factor
LVDS
Low Voltage Differential Signaling –
M.A.R.S.
Mobile Application for Rechargeable
Systems
MDI
Media Dependent Interface
MLC
Multi Level Cell
MTBF
Mean Time Before Failure
NA
Not Available
NC
Not Connected
NC-SI
Network Communications - Services
Interface
PCI
Peripheral Component Interface
PCIe
PCI-Express
PEG
PCI Express Graphics
PICMG®
PCI Industrial Computer Manufacturers
Group
PHY
Ethernet controller physical layer
device
COP
Computer Operating Properly
DDC
Display Data Control
DDI
Digital Display Interface
DDIO
Digital Display Input/Output
DIMM
Dual In-line Memory Module
DP
DisplayPort
DMA
Direct Memory Access
DMIC
Digital Microphone
DRAM
Dynamic Random Access Memory
DVI
Digital Visual Interface
EAPI
Embedded Application Programming
Interface
ECC
Error Checking and Correction
EEPROM
Electrically Erasable Programmable
Read-Only Memory
eDP
Embedded Display Port
Pin-out
Type
COM Express® definitions for signals on
COM Express® Module connector pins.
EMC
Electromagnetic Compatibility (EMC)
pSLC
pseudo Single Level Cell
eMMC
Embedded Multimedia Card
PSU
Power Supply Unit
ESD
Electro Sensitive Device
RoHS
FAT
File Allocation Table
Restriction of the use of certain
Hazardous Substances
Gb
Gigabit
RTC
Real Time Clock
GbE
Gigabit Ethernet
SATA
Serial AT Attachment:
GPI
General Purpose Input
SLC
Single Level Cell
GPIO
General Purpose Input Output
SMB
System Management Bus
GPO
General Purpose Output
SoC
System on a Chip
GPU
Graphics Processing Unit
SO-DIMM
HDA
High Definition Audio (HD Audio)
Small Outline Dual In-line Memory
Module
HD/HDD
Hard Disk / Hard Disk Drive
SOL
Serial Over LAN
HDMI
High Definition Multimedia Interface
SPI
Serial Peripheral Inteface
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TPM
Trusted Platform Module
UART
Universal Asynchronous Receiver
Transmitter
UEFI
Unified Extensible Firmware Interface
UHD
Ultra High Definition
USB
Universal Serial Bus
VGA
Video Graphics Adapter
VLP
Very Low Profile
WDT
Watch Dog Timer
WEEE
Waste Electrical and Electronic
Equipement ( directive)
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About Kontron
Kontron, a global leader in embedded computing technology and trusted advisor in Internet
of Things (IoT), works closely with its customers, allowing them to focus on their core
competencies by offering a complete and integrated portfolio of hardware, software and
services designed to help them make the most of their applications.
With a significant percentage of employees in research and development, Kontron creates
many of the standards that drive the world’s embedded computing platforms; bringing to
life numerous technologies and applications that touch millions of lives. The result is an
accelerated time-to-market, reduced total-cost-of-ownership, product longevity and the
best possible overall application with leading-edge, highest reliability embedded
technology.
Kontron is a listed company. Its shares are traded in the Prime Standard segment of the
Frankfurt Stock Exchange and on other exchanges under the symbol “KBC”. For more
information, please visit: http://www.kontron.com/

GLOBAL HEADQUARTERS
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
Tel.: + 49 821 4086-0
Fax: + 49 821 4086-111
info@kontron.com
www.kontron.com
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