NEX 615

NEX 615
Mini-ITX, On-board Intel® Atom™ Processor E3800 Product Family, 2 x DDR3L SO-DIMM,
VGA/2 x LVDS, mPCIe, 2 x GbE/1 x SATA1.0/4 x USB3.0/4 x COM/mSATA
Main Features
ŒŒ On-board Intel® Atom™ processor E3800 product family
ŒŒ 2 x 204-pin SO-DIMM socket supports up to 8GB DDR3L 1066/1333
MHz SDRAM
ŒŒ Display: VGA/2 x LVDS (2 x DF13 20-pin 18/24-bit single channel)
ŒŒ 1 x Mini-PCIe (full size), 1 x mSATA, 1 x SATA2.0
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2 x Intel® i210 PCI Express Gigabit Ethernet
4 x USB3.0, 2 x USB2.0, 4-in/4-out GPIO, Mic-in , Speak out
Serial port: 3 x RS232, 1 x RS232/422/485 port
Support AT/ATX mode and dual +12VDC/+24VDC input
Product Overview
NEX 615 is Thin Mini-ITX form factor with onboard Intel® Atom™ processor E3800 product family, which support 2 x DDR3L 1066/1333MHz memory,
along with Intel® Gen. 7 Graphics Engine Enhanced Gfx & Video, support DX 11, OGL3.2, Full HD decode (MPEG2, VC1, AVC, H.264), along with integrated
graphics for large display applications to support multiple displays.
Intel® Atom™ processor E3800 product family provides 1 x SATA 2.0, 1 x mSATA, 6 x USB (4 x USB3.0/2 x USB2.0) ports, 4 x COM, 1 x Mini-PCIe(full size), 2 x
GbE. NEX 615 could be integrated into 1U/2U/4U rack mounted chassis or Desktop Towers as completed system solution for widely industrial applications
in the new era of digital infrastructure with NEXCOM.
Specifications
CPU Support
On-board LAN
ŒŒ Support Intel® Atom™ processor E3800 product family
ŒŒ 2 x Intel® i210 Gigabit Ethernet
ŒŒ Support PXE boot from LAN, wake on LAN function
Main Memory
ŒŒ 2 x 204-pin SO-DIMM socket supports up to 8GB DDR3L 1066/1333
MHz SDRAM
ŒŒ Platform Control Hub
ŒŒ Intel® Atom™ processor E3800 product family
BIOS
ŒŒ AMI System BIOS
ŒŒ Plug and play support
ŒŒ Advanced Power Management and Advanced Configuration & Power
Display
ŒŒ Integrated Intel® Gen.7 graphics engine, supports VGA/2 x LVDS
interfaces
ŒŒ Analog VGA interface: 1 x DB-15 connector, resolution up to 1920 x
1200
ŒŒ LVDS interface: 2 x dual (18/24bit) LVDS panel, resolution up to 1920
x 1200
Audio
ŒŒ Realtek ALC886 CODEC for high definition:
1 x 5 2.0 pitch pin-header for Mic-in
1 x 4 2.0 pitch pin-header for Line-out
1 x 5 2.0 pitch pin-header for speaker out
Indutrial Mother Board
I/O Interface
ŒŒ Serial port: 4 ports
COM2 : RS232/422/485 with DB9 male connector on edge I/O
COM1/3/4 : RS232 2 x 5/2.54mm box header
ŒŒ USB2.0/3.0: 6 ports
4 x USB3.0 ports by edge connectors
2 x USB2.0 ports by 2 x 5-pin header pitch 2.54mm
ŒŒ GPIO: Support 4 x GPI and 4 x GPO with TTL level (0/5V)
ŒŒ Onboard Power LED and HDD Active LED Pin Header
ŒŒ 1 x 4-pin fan connector (for CPU)
ŒŒ 1 x keyboard/mouse pin header
ŒŒ Onboard Buzzer/reset SW/o n & Off switch button
Power Requirements
ŒŒ Power requirement: dual +12VDC/+24VDC input
ŒŒ One 4-pin power connector
Dimensions
ŒŒ 170mm (L) x 170mm (W)
Environment
ŒŒ Board level operating temperatures: -15°C to 60°C
ŒŒ Storage temperatures: -20°C to 80°C
www.nexcom.com
Block Diagram
VGA
VGA
DDR3L
LVDS1
CH7511B
LVDS2
CH7511B
USB3.0 X4
TUSB8040A
USB2.0 X2
SATA x1
MSATA x1
LAN1
Intel I210
LAN2
Intel I210
DP
DDR3L
DDR3L
SO-DIMM1
DDR3L
DDR3L
SO-DIMM2
Display
DP
HDA
AUDIO
ALC886
TPA6047A4RHBR
MIC IN
USB3.0
USB2.0
USB
LPC
LPC
SATA 2.0
MSATA 2.0
LINE OUT
Bay Trail
GPIO/COM1/COM3/COM4
COM2 RS232/422/485
SATA
HW Monitor
PCIe x1
PCIe x1
PCIe
PCIe
PCIe x1
PCIe x1
ŒŒ Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
ITE8786
MiniPCie
PCI-E
X1 CON
Ordering Information
ŒŒ NEX 615-E3826 (P/N: TBD)
Thin Mini ITX, Intel® Atom™ processor E3826 and based on Intel®
integrated graphics engine w/ VGA/two 18/24bit LVDS/4x USB3.0/
2 x USB2.0/4 x COMs/1 x Mini-PCIe/2 x Gigabit LAN/1 x SATA2.0/ 1 x
mSATA
Certifications
ŒŒ Meet CE
ŒŒ FCC Class A
ŒŒ NEX 615-E3845 (P/N: TBD)
Thin Mini ITX, Intel® Atom™ processor E3845 and based on Intel®
integrated graphics engine w/ VGA/two 18/24bit LVDS/4 x USB3.0/2 x
USB2.0/4x COMs/1 x Mini-PCIe/2 x Gigabit LAN/1 x SATA2.0/1 x mSATA
Indutrial Mother Board
We reserve the right to change specifications and product descriptions at any time without prior notice.
Last update: 03/05/2014

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