PROCELERANT CE738A-E
Extended Temperature Range COM Express Module
PRODUCT DESCRIPTION
FEATURE SUMMARY
1.4GHz Low Power Pentium M
738 combined with Intel 915GM
Chipset on a COM Express
Module
Extended Temperature
Range:
-25°C to 70°C
Intel ICH6M I/O Hub
PICMG COM Express Compliant
Basic Form Factor (95 x 125mm)
Type 2 COM Express Pin-out
Intel 82573 10/100/1000BaseTX
Ethernet controller
One SODIMM Socket for up to
1GB Memory
Flexible PCI-Express Options
3*PCI-Express x1
1*PCI-Express x16
Integrated Graphics
Dual SVDO
Analog VGA
LVDS
COM Express Standard Features
8 USB Ports
2 SATA Ports
1 ATA 100 Port
PCI 32-bit/33MHz PCI Bus
8 GPIO Lines
Phoenix BIOS with ACPI 2.0
Power Management
Win XP/ Win XP Embedded /
Red Hat Desktop Linux
Optimized Passive and Active
Heatsinks Available
ROHS Compliant
Based on the open PICMG standard, the RadiSys Procelerant CE738A-E modules are rugged, low power, high
performance COM Express modules with key features vital for today’s embedded applications. Paired with a
RadiSys Procelerant CR carrier board, the RadiSys family of COM Express modules provides a final production or
a design-specific development platform
PICMG STANDARD
COM Express is the PICMG standard for a Computer-On-Module (COM) base on new serial differential signaling
technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and Serial DVO. The COM Express modular
concept enables OEMs to reduce time to market by reducing the time spent on processor design and enabling
OEMs to focus on their core competencies and product differentiation. The modularity provides the ability for an
OEM to plan for feature changes, demand fluctuations and performance upgrades without having to re-design
their product. The RadiSy COM Express modules can reduce service repair inventories, simplify debugging and
reduce field service time contributing to the success of the product over its lifetime.
APPLICATIONS
RadiSys CE738AI COM Express modules are ideal for rugged embedded applications that require extended
temperature operations in addition to the small footprint and modular flexibility benefits of COM Express. These
modules are compact and reliable solutions for meeting the rigors of transportation, military, industrial and medical
applications requirements.
CARRIER DESIGNS SUPPORTED BY RADISYS
Whether customers design their own carrier board or utilize RadiSys Design Services to design one, RadiSys
supports the design each step of the way. Tools such as the Carrier Design Guide and Thermal Design Guide, as
well as schematics and Gerber files are available for customers committed to using RadiSys Procelerant CE
processor modules. Ask your RadiSys Sales Manager for more information.
PROCELERANT CE738A-E DATA SHEET | © 2006 RadiSys Corporation | ID: 02-08-2007 7 | Page 1 of 3
Procelerant CE738A-E Specifications
Physical
Processor
Dimensions
95mm x 125mm – COM Express Basic Form Factor
Compliance
PICMG COM Express R1.0 Basic Form Factor, Type 2
Options
LV Pentium-M 738
Performance
CE738AI LV Pentium-M: 1.4GHz / 667MHz FSB/ 2MB Cache
Clock Speed
/
FSB / Cache
Package
BGA
Power
10W (Processor only)
Supplier
Intel 915GM and ICH6M I/O Hub
Features
Integrated video, PCI, IDE, PCI-Express, SATA, USB, LPC, GPIO
Type
Single 200-pin SODIMM socket, supports 400, 533, and 667MHz Memory
Capacity
Up to 1GB DDR2 in a single channel (Market Availability)
BIOS
Type
1MB, Phoenix Technologies
Audio
Compliance
AC ‘ 97 Intel High Definition Audio via ICH6M I/O Hub
Video
Type
Dual Independent Displays via Intel 915GM Chipst
Features
Dual SVDO, LVDS 18-bit dual channel, Analog VGA, TV Out
External
PCI-Express x16 Graphics Port, Multi-plexed on SDVO interface pins
Networking
Type
IEEE 802.3 10/100/1000BaseT Compliant Physical Layer via Intel 82573V - Utilizes (1) PCI-Express x1 interface
I/O
USB
Eight USB 2.0 / 1.1 Ports
SATA
One SATA 150 Port
IDE
One Ultra ATA 100/66/33 Ports
OTHER
LPC, Smbus/I2C Bus,
Super I/O
BIOS
Support
National Semiconductor PC8374, Ask about support for Winbond W83627HF-AW
Expansion
PCI Express
3*PCI-Express x1 and 1*PCI-Express x16
PCI
PCI 2.3 32-bit 33MHz, four logical devices
Connectors
COM
Express
(2) 220 pin COM Express standard connectors. Module connector pn: Tyco 3-1827231-6, Carrier connector pn: Tyco 3-3-1827233-6
Power
Input
12V
Dissipation:
20.7W
Chipset
Memory
3D Mark
(Max)
Environment
Regulatory
Warranty
Temperature
–25° to 70°C (operating), -40° – 85°C (non-operating)
Humidity
5%-95% Condensing (Operating), 5% - 90% RH Non-Condensing at 40C
Shock
Operating: 30G, half sine 11ms duration, Storage: 50G, half sine 11ms duration 30G
Vibration
5-2000Hz Random, 0.5g, 10min min. in each of 3 axes (Operating), 5g acceleration over 5-2000Hz Sine Wave (P-P), 1 oct/min Sine Sweep (Storage)
Safety
UL60950-1, EN60950-1, IEC60950-1
EMC
EN55022, EN55024, and FCC Part 15, Subpart B, Class B
Standard
Two years, parts only
PROCELERANT CE738A-E DATA SHEET | © 2006 RadiSys Corporation | ID: 02-08-2007 7 | Page 2 of 3
Ordering Information
Toll-Free: 800-950-0044
Phone: 503-615-1100
Support: 866-385-6167
Call for pricing and availability. Refer to the order codes below.
ORDER CODes / description:
Module Order Codes:
CE738A-E-512 1.4Ghz LV Pentium-M, Extended Temperature
Range, 512MB
Supporting Products:
CR100-2DVI: Development ATX Carrier Board with Dual DVI
Connectors
CR100-PCIE16:
Development ATX Carrier Board with 16-bit
PCI-Express
CE-PHSA:
Passive Heatsink & Assembly
CE-PHS17A:
Low Profile Passive
CE-TIM:
Thermal Interface Material, required with Heatsinks
CE-DVI-VGA: DVI to VGA cable
CE-TIMHeatsink and Assembly
CE-AHS: Active Heatsink and Assembly
CE-TIM: Thermal Interface Material, Required for Heatsink
Assembly
CE-DVI-VGA: DVI to VGA Cable
Contact Information
www.radisys.com
info@radisys.com
Channels and other locations
Corporate Headquarters
5445 NE Dawson Creek Dr.
Hillsboro, OR 97124 USA
Phone: 503-615-1100
Fax: 503-615-1121
Toll-Free: 800-950-0044
Support: 866-385-6167
EMEA: +49 811 555457-0
China: 86.21.50804062
2006 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and
OS-9 are registered trademarks of RadiSys Corporation. Promentum, and Procelerant are trademarks of
RadiSys Corporation. *All other trademarks are the properties of their respective owners. All specifications within
this document are subject to change without notice.
PROCELERANT CE738A-E DATA SHEET | © 2006 RadiSys Corporation | ID: 02-08-2007 7 | Page 3 of 3