PRO DUCT GUIDE
INDEX
Qseven®
ETX®
Q7-B03p.12
Q7-974p.13
Q7-A36p.14
Q7-A29p.15
Q7-928p.16
Q7-922p.17
ETX-A61p.40
μQseven®
μQ7-A76-Jp.18
μQ7-962p.19
μQ7-A75-Jp.20
Carrier Board
CQ7-A42p.21
Single Board Computer
SBC-B68-eNUCp.44
SBC-A80-eNUCp.45
SBC-B47-eNUCp.46
SBC-A44-pITXp.47
SBC-949-pITXp.48
SBC-992-pITXp.49
SBC-A62-Jp.50
SBC-B08p.51
Development Kit
Q7 DEV KIT 2.0
Q7 STARTER KIT 2.0
p.22
p.23
Modular HMI & Boxed Solutions
SYS-A62-10p.53
SYS-B08-7p.54
SYS-A62-GWp.55
SMARC
SM-B69p.26
SM-B71p.27
Legend
COM Express™
Type6
COMe-B09-BT6p.30
COMe-A98-CT6p.31
COMe-A41-CT6p.32
COMe-A81-CT6p.33
COMe-953-BT6p.34
COMe-948-BT6p.35
All components qualified for industrial
temperature range
(-40°C ÷ +85°C)
“Ready-to-use” and “ready-to-market”
cost effective products which
exclusively support SoC native features
Carrier Board
CCOMe-965p.36
Development Kit
COM EXP T6 DEV KIT
p.37
Cross-compatible platform with
x86 and ARM solutions
ABOUT SECO
SECO is a world-leader in
electronic embedded solutions
Spanning its 38+ years of experience, SECO has shown the
ability to adapt its know-how to new, challenging customers’
needs, and to provide cutting edge solutions to its partners.
Creativity and innovation
with a strong R&D area
Partnership with
the most important
technological players
Collaboration
with important
research institutes
In house
manufacturing and
Worldwide
presence
System Integration Plants
Manufacturing Unit
Reliable and safe embedded
solutions
SECO is a world-leader in
electronic embedded solutions
SECO’s in-house manufacturing process is 100%
compliant to ROHS regulationsSpanning
and not
only:
the
its 35+
years
of experience, SECO has shown the ability to
adapt
its
know-how
to new, challenging customers’ needs, and to
high quality and reliability of SECO’s products are
provide cutting edge solutions to its partners.
guaranteed by each manufacturing unit through
standard industry certifications,
UNI
EN and in contrast with recent outsourcing
Onincluding
the strength of
its know-how
trends, SECO has always set the entire production cycle in house, from
ISO 9001:2008 and UNI EN ISO 13485:2012.
Certified UNI EN ISO 9001:2008
Quality management systems
the development stage to mass distribution. Thanks to new, innovative
solutions and great research and design activities together with the
partnership with major scientific Universities and world-leading
companies, SECO went International becoming a global market-leader
UNI EN ISO 13485:2012
providing solutions
toENmodern
challenges.
UNI
ISO 14001
Quality management systems in
the field of medical equipment
(in progress)
Dodd-Frank Act
Standard products
Standard products, custo
Qseven®
SBC
PRODUCT LINES
STANDARDS
ETX ® 3.0 / XTX™
Design, development and implementation
of CUSTOM EMBEDDEDDesign,
SYSTEMS
development and imp
Development Kits
of CUSTOM EMBEDDED SYS
When the cu
When the customer needs require customization,
SECO develops end-to-end “tailored” solutions.
customizat
end-to-end “
In addition to the creation of an embedded system in
compliance with the latest technological standards,
SECO supports its customers with a range of solutions
that allow to configure certain aspects ad hoc, in order
to tailor and integrate it to their products.
In addition to the cr
with the latest techn
customers with a ra
aspects ad hoc, in or
their products.
Thanks to a team of
within the company o
areas, SECO is thus a
assistance and supp
Thanks to a team of highly qualified collaborators and
the presence within the company of R&D departments
specializing in different areas, SECO is thus able to
provide its customers with timely assistance and
support in:
- Hardware Engineering & Development
- BIOS Engineering & Development
- Drivers Engineering & Development
- Hardware Engineer
- BIOS Engineering &
- Drivers Engineerin
- Software Developm
- Firmware Developm
- Mechanical Engine
- Software Development
w w w. s e c o . c o m
- Firmware Development
- Mechanical Engineering & Development
company_profile_SECO_A4_new_2.indd 2
Our Partners
Over the years, SECO has established and consolidated
relationships with major international companies in the
electronics industry as well as centers of excellence,
universities and research institutes that support the
company’s direct and dynamic vision for continued
research regarding new technologies to be integrated
into increasingly complex projects.
Technological Partners
Intel® NXP AMD NVIDIA® Qualcomm® Xilinx®
Supported OS
Microsoft® Windows Linux
Yocto
Android
Main fields of application
Innovation, creativity and constant awareness of the needs of a constantly evolving market stimulate SECO to
develop state of the art solutions and products tailored to best satisfy its customers’ needs in a multitude of
different fields of application.
Turning ideas into solutions and products capable of improving the efficiency and performance of the
technologies all around us: this is the challenge that SECO has taken on for over thirty-eight years and which
makes it a benchmark in the embedded sector.
Automation
Automotive
Avionics
Biomedical/Medical
devices
Digital signage Infotainment
E - health
Telecare
Energy
Fitness
Equipment
Gaming
HMI
Home
Automation
Home
Entertainment
Industrial Automation
and Control
Info Kiosks
Internet of Things
In-Vehicle Infotainment
Systems
Measuring
instruments
Mobile devices
Multimedia
devices
PDA Electronics
Point of Sales
Portable devices
Robotics
Surveillance
Telco
Thin clients
Transportation
Vending
Visual Computing
Wireless
Technologies
Qseven
®
Computer-On-Module approach
Consolidated
Standard form factors
ARM and x86 cross
compatibility
Design investment limited
to the carrier board
Multi-vendor solution
Scalable and future proof
Accelerated
time-to-market
Highly configurable
Long term
availability
Innovative and
upgradable
Qseven® Standard advantages
Cost effective solution for
high volume projects
Low profile design
Low power consumption
Excellent for IoT projects
Compact form factor
High speed MXM edge
connector
SECO is one of the founding members of SGET and
a co-founder of the Qseven® standard
Qseven 70 x 70 mm
μQseven 40 x 70 mm
®
® Features
Qseven
standard
specifications
Qseven
Overview
70 mm - 2,76”
Qseven
70 mm - 2,76”
x86
μQseven
40 mm - 1,57”
Also available
in Industrial
temperature range,
-40°C ÷ +85°C
®
Audio
GBE
Qseven® Rev. 2.1 Supported Features
The Qseven® mandatory and optional features. The table shows the minimum and maximum required
configuration of the feature set.
ARM/RISC
Based
Min Config.
X86 Based
Min
Config.
Max Config.
ARM/RISC
Based
Min Config.
X86 Based
Min
Config.
Max Config.
PCI Express lanes
0
1 (x1 link)
4
I²C Bus
1
1
1
Serial ATA channels
0
0
2
SPI Bus
0
0
1
USB 2.0 ports
3
4
8
CAN Bus
0
0
1
USB 3.0 ports
0
0
3
Watchdog Trigger
1
1
1
LVDS channels
0
0
Dual Channel
24 bits
Power Button
1
1
1
Embedded
DisplayPort
0
0
2
Power Good
1
1
1
DisplayPort, TMDS
0
0
1
Reset Button
1
1
1
High Definition
Audio / I2S
LID Button
0
0
1
0
0
1
Sleep Button
0
0
1
Suspend To RAM
(S3 mode)
0
0
1
Wake
0
0
1
Battery low alarm
0
0
1
Thermal control
0
0
1
FAN control
0
0
1
System I/O Interface
Ethernet 10/100
Mbit/Gigabit
0
0
1 (Gigabit
Ethernet)
UART
0
0
1
Low Pin Count bus
0
0
1
Secure Digital I/O 4-bit
for SD/MMC cards
0
0
1
System Management
Bus
0
1
1
System I/O Interface
Qseven
®
Qseven® Rel. 2.1 compliant module with the Intel® Atom™ E39xx family, Intel®
Celeron® N3350 and Intel® Pentium® N4200 (formerly code name Apollo Lake) SoCs
Q7-B03
High graphics performance and extreme temperature for low power designs
HIGHLIGHTS
Compliant to the most recent Qseven® rel. 2.1 specs
Industrial grade and connectivity capable
4K HW Video both decoding and encoding
Support for the most popular operating systems
MAIN FIELDS OF APPLICATION
Internet of
Things
Biomedical/
Medical devices
Digital Signage Infotainment
HMI
Automotive
Gaming
Industrial
Visual
Computing
Multimedia
devices
Mobile
devices
FEATURES
Processor
Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz),
2MB L2 Cache, 5.5W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz),
2MB L2 Cache, 9W TDP
Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz),
2MB L2 Cache, 12W TDP
Intel® Pentium® N4200 Quad Core @1.1GHz (burst 2.5GHz),
2MB L2 Cache, 6W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (burst 2.4GHz),
2MB L2 Cache, 6W TDP
HD Audio interface
Serial Ports
1 x UART, TTL interface
Other
Interfaces
I2C Bus
LPC Bus
SM Bus
SPI interface
Watch Dog Timer
Thermal / FAN management
Power Management Signals
Power
Supply
+5VDC and +5VSB (optional)
Microsoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT Core
Linux (64 bit)
Yocto (64 bit)
Android (planning)
Max Cores
4
Memory
Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB
Graphics
Integrated Gen9-LP Graphics controller, with 18 Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8,
SVC, MVC
Operating
System
Video
Interfaces
eDP interface or Single/Dual Channel 18/24bit LVDS interface
through eDP-to-LVDS bridge
HDMI or DP++ interface
Video
Resolution
HDMI, eDP:
DP++:
LVDS:
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Up to 3840 x 2160 (4K)
Up to 4096 x 2160
Up to 1920 x 1200
2 x external S-ATA Gen3 Channel
Mass Storage SD interface
Optional eMMC disc soldered onboard
Networking
USB
PCI-e
Dimensions
70 x 70 mm (2.76” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
Gigabit Ethernet interface
Intel® I210 or I211 Controller (MAC + PHY)
6 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports (*)
(*) Second USB 3.0 Host port can be exploited only using
Qseven® Rel. 2.1 compliant Carrier boards
4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
Ethernet controller)
www.seco.com
12
Audio
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Extreme graphics for low power embedded
applications
Qseven
Qseven
®
®
Qseven® standard module with the Intel® Atom™ E3800 and Celeron®
families (“Bay Trail”) SoC
Q7-974
x86 performance on a low-power module
Moon Island platform Intel IoT gateway solution
HIGHLIGHTS
SATA Flash Drive soldered on-board
Integrated 64-bit memory controller
Security enhancement and content protection
Low power solution
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Available in Industrial temperature range
MAIN FIELDS OF APPLICATION
HMI
Biomedical/
Industrial Automation
Medical devices
and Control
Measuring
Instruments
FEATURES
Processor
Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP
Max Cores
4
Max Thread
4
Memory
Soldered on-board DDR3L memory
E3845, E3827, J1900, N2930: up to 8GB Dual-Channel
DDR3L @ 1333MHz
E3826: up to 8GB Dual-Channel DDR3L @ 1066MHz
N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz
Graphics
Integrated Intel® HD Graphics 4000 series controller
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats
Video
Interfaces
HDMI or Multimode Display Port interface
Embedded Display Port or 18 / 24 bit dual channel LVDS
interface
Additional VGA interface (optional external adapter is required)
Video
Resolution
HDMI:
Display Port, eDP, CRT:
Optional LVDS interface:
Up to 1920x1080p@60Hz
Up to 2560x1600@60Hz
Up to 1920x1200@60Hz
Up to 2 x external SATA channels
Mass Storage SD interface
Optional SATA Flash Drive soldered on-board
Networking
Gigabit Ethernet interface
USB
1 x USB 3.0 Host port
6 x USB 2.0 Host ports (one shared with USB 3.0 interface)
PCI-e
3 x PCI-e x1 lanes
Audio
HD Audio interface
Serial Ports
1 x Serial port (TTL interface)
Other
Interfaces
I2C Bus
LPC Bus
SM Bus
Thermal / FAN management
SPI interface
Power Management Signals
Power
Supply
+5VDC ± 5%
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Microsoft® Windows Embedded Compact 7
Linux (32 / 64 bit)
Yocto
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Dimensions
70 x 70 mm (2.76” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
13
Qseven
®
Qseven® standard module with the Intel® Atom™ E3800 and Celeron®
families (“Bay Trail”) SoC, with eMMC and Camera Interface
Q7-A36
Mobile-oriented with eMMC and Camera Interface
Moon Island platform Intel IoT gateway solution
HIGHLIGHTS
eMMC drive on-board
Camera Interface
Available in Industrial temperature range
Integrated 64-bit memory controller
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Low power solution
MAIN FIELDS OF APPLICATION
HMI
Industrial Automation
and Control
Portable
Devices
In-vehicle infotainment
systems
FEATURES
Processor
Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP
Max Cores
4
Max Thread
4
Memory
Soldered on-board DDR3L memory
E3845, E3827, J1900, N2930: up to 8GB Dual-Channel
DDR3L 1333MHz
E3826: up to 8GB Dual-Channel DDR3L 1066MHz
N2807: up to 4GB Single-Channel DDR3L 1333MHz
E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz
Graphics
Integrated Intel® HD Graphics 4000 series controller
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats
Video
Interfaces
HDMI or Multimode Display Port interface
Embedded Display Port or 18 / 24 bit dual channel LVDS interface
Optional Camera interface
Video
Resolution
HDMI:
Display Port, eDP:
Optional LVDS interface:
Up to 1920x1080p@60Hz
Up to 2560x1600@60Hz
Up to 1920x1200@60Hz
2 x external SATA channels
Mass Storage SD interface
Optional eMMC Drive soldered on-board
Networking
Gigabit Ethernet interface
USB
1 x USB 3.0 Host port
6 x USB 2.0 Host ports (one shared with USB 3.0 interface)
www.seco.com
14
PCI-e
3 x PCI-e x1 lanes
Audio
HD Audio interface
Serial Ports
1 x Serial port (TTL interface)
Other
Interfaces
I2C Bus
LPC Bus
SM Bus
Thermal / FAN management
SPI interface
Power Management Signals
Power
Supply
+5VDC ± 5%
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Microsoft® Windows Embedded Compact 7
Linux (32 / 64 bit)
Yocto
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Dimensions
70 x 70 mm (2.76” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Qseven
Qseven
®
®
Qseven® standard module with the 1st and 2nd Generation (“eKabini” and
“Steppe Eagle”) AMD Embedded G-Series SOCs
Q7-A29
Powerful graphics, ECC Ram, Highly expandable
eKabini
Steppe Eagle
HIGHLIGHTS
FEATURES
Processor
Combines the I / O controller onto the same chip
as the APU, making it the ideal fit for applications
requiring ultra-low power and small form factor
processors
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Combines a low-power Multi Core CPU and advanced
GPU onto a single chip
MAIN FIELDS OF APPLICATION
AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W
AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W
AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W
AMD GX-210JA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 6W
AMD GX-411GA, Quad Core @1.1GHz, 2MB L2 Cache, TDP 15W,
industrial grade temperature
AMD GX-209HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W,
industrial grade temperature
Automation
Industrial Automation
and Control
Thin client
Information and
point-of-sale kiosks
AMD GX-412HC, Quad Core @ 1.2GHz, 2MB L2 Cache, TDP 7W
AMD GX-222GC, Dual Core @ 2.2GHz, 1MB L2 Cache, TDP 15W
AMD GX-216HC, Dual Core @ 1.6GHz, 1MB L2 Cache, TDP 10W,
industrial grade temperature
AMD GX-212JC, Dual Core @ 1.2GHz, 1MB L2 Cache, TDP 6W
AMD GX-210JC, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 6W,
industrial grade temperature
Max Cores
4
Networking
Gigabit Ethernet interface
Memory
Up to 8GB DDR single-channel memory soldered on-board,
with optional ECC
Up to 1600MHz DDR frequency
USB
1 x USB 3.0 Host port
6 x USB 2.0 Host ports
PCI-e
4 x PCI-e x1 groupable lanes
(3 x PCI-e x1 lanes with GX-210JA and GX-212JC)
Audio
HD Audio interface
Serial Ports
1 x Optional UART (TTL level) + SPI interface
Graphics
Embedded AMD HD RADEON™ GPUs
GX-415GA - HD8330e @ 500MHz
GX-217GA - HD8280E @ 450MHz
GX-210HA, GX-411GA - HD8210E @ 300MHz
GX-210JA, GX-209HA - HD8180 @ 225MHz
GX-412HC - RADEON™ R3E @ 267/350 MHz
GX-222GC - RADEON™ R5E @ 655/800 MHz
GX-216HC - RADEON™ R4E @ 300 MHz
GX-212JC - RADEON™ R2E @ 267/300 MHz
GX-210JC - RADEON™ R1E @ 267 MHz
Dual independent display support
Supports DirectX® 11.1, OpenGL rel. 4.2 and OpenCL™ rel. 1.2
Other
Interfaces
I2C / LPC / SM Bus
Thermal / FAN management
Optional SPI + UART interface
Power Management Signals
Watchdog
Power
Supply
+5VDC ± 5%
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Linux 32 / 64 bit
Video
Interfaces
Video
Resolution
HDMI or Multimode DisplayPort (DP++) interface
embedded DisplayPort or 18 / 24 bit single / dual channel
LVDS interface
Additional VGA interface (optional external adapter is required)
HDMI:
Up to 4096x2160 @ 24Hz (Steppe Eagle SOCs)
Up to 1920x1200 @ 60Hz (eKabini SOCs)
DP++:
Up to 4096x2160 @ 30Hz (Steppe Eagle SOCs)
Up to 2560x1600 @ 60Hz (eKabini SOCs)
eDP:
Up to 2560x1600 @ 60Hz
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
VGA:
Up to 2048x1536 @ 60Hz
Dimensions
Optional LVDS:
Up to 1920x1200 @ 60Hz
Up to 2 x external SATA channels
Mass Storage SD interface
Optional SATA Flash Drive soldered on-board
70 x 70 mm (2.76” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
15
Qseven
®
Q7-928
Qseven® standard module with NXP i.MX6 Processor
Optimal balance of performance and power
NXP
i.MX6 DualPlus
NOW
AVAILABLE
HIGHLIGHTS
A scalable multi-core ARM® Cortex™-A9 architecture
in Qseven® standard modular form factor
Flexible solution: from multi-display platforms to
mobile fanless applications
Combines high-graphics performance with
power-efficient processing capabilities
Enhanced 2D and 3D graphics with i.MX6DP
MAIN FIELDS OF APPLICATION
Industrial Automation Digital Signage Infotainment
and Control
Automotive
Avionics
Energy
Surveillance
Transportation
Robotics
FEATURES
Processor
NXP i.MX6 Family, based on ARM® CORTEX-A9 processors
- i.MX6S Solo - Single core up to 1GHz
- i.MX6DL Dual Lite - Dual core up to 1GHz per core
- i.MX6D Dual - Dual core up to 1GHz per core
- i.MX6DP DualPlus - Dual core up to 1GHz per core
- i.MX6Q Quad - Quad core up to 1GHz per core
Max Cores
4
Memory
Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG™
(only i.MX6D, i.MX6DP and i.MX6Q)
Enhanced 2D and 3D graphics with i.MX6DP
Supports up to 3 independent displays with i.MX6D, i.MX6DP
and i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S
Video
Interfaces
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24
bit interface
HDMI Interface 1.4
Video Input Port / Camera Connector
Video
Resolution
LVDS, up to 1920x1200
HDMI, up to 1080p
Mass Storage
On-board eMMC drive, up to 32 GB
SD / MMC / SDIO interface
1 x μSD Card Slot on-board
1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
Networking
Gigabit Ethernet interface
USB
1 x USB OTG interface
4 x USB 2.0 Host interfaces
PCI-e
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
www.seco.com
16
Audio
AC’97 Audio interface
I2S
Serial Ports
2 x Serial ports (TTL interface)
CAN port interface
Other
Interfaces
I2C Bus
LPC Bus
SM Bus
Power Management Signals
Power
Supply
+5VDC ± 5%
Operating
System
Linux
Yocto
Microsoft® Windows Embedded Compact 7
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Dimensions
70 x 70 mm (2.76” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
OpenGL (FULL) and OpenGL ES 2.0 3D Graphics
supporting up to 3 independent displays (only up to 2
displays with i.MX6DL and i.MX6S)
Qseven
Qseven
®
®
Q7-922
Qseven® standard module with NVIDIA® Tegra® T30 Processor
High performance graphics, low power solution
HIGHLIGHTS
A Quad-Core ARM® Cortex™-A9 Low Power CPU for
powerful graphics and Extreme Multitasking
Capable of reproducing High Resolution 3D Videos
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Graphics engine powered by the 12 cores-ULP
GeForce GPU with dedicated Processors for 1080p
Video Playback
MAIN FIELDS OF APPLICATION
Gaming
Digital Signage Infotainment
Thin client
FEATURES
Processor
NVIDIA® Tegra® T30 with Quad ARM® CORTEX-A9 MPCore®
CPU, 1.3GHz per Core
Max Cores
4
Memory
Graphics
Other
Interfaces
I2C, SM Bus, LPC, SPI
One Wire Interface
Thermal Cooling Interface
Power management signals
Up to 2 GB DDR3 on-board soldered memory
Power
Supply
+5VDC ± 5%
Embedded NVIDIA® ULP GeForce® GPU
Integrated High Definition Audio-Video Processor
Dual independent display support
Operating
System
Linux
Video
Interfaces
LVDS Single / Dual Channel 18 / 24 Bit interface
HDMI 1.4a Interface
Video Input Port / Camera Connector
Video
Resolution
HDMI:
LVDS:
up to 1920 x 1080p
up to 2048 x 1536
Up to 16 GB on-board soldered eMMC drive
1 x SATA Channel
Mass Storage
microSD Slot on-board
4-bit SD / MMC interface
Networking
Gigabit Ethernet interface
USB
6 x USB 2.0 Host ports
PCI-e
1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
(with support for 2 x PCI-e x1 devices)
Audio
HD Audio Interface
Serial Ports
2 serial ports (Tx, Rx signals)
CAN Bus Interface
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -20°C ÷ +70°C (Extended version)
Dimensions
70 x 70 mm (2.76” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
17
μQseven
®
μQseven® standard module with the Intel® Atom™ E3800 and Celeron®
families (“Bay Trail”)
μQ7-A76-J
Smallest x86 standard module at proprietary costs
“Ready-to-use” and “ready-to-market”
cost-effective product which
exclusively supports SoC native features
HIGHLIGHTS
Industrial Internet of Things
(IIoT) basic building block
High performance-power ratio for compact or portable
devices
Cost-effective solution for
low budget designs
Moon Island platform Intel IoT gateway solution
MAIN FIELDS OF APPLICATION
Industrial Automation
and Control
Internet of
Things
PDA
Electronics
Biomedical/Medical
devices
Surveillance
Transportation
Robotics
FEATURES
Processor
Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP
Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
Max Cores
2
Max Thread
2
Memory
Soldered on-board DDR3L memory
E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz
N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
Graphics
Integrated Intel® HD Graphics 4000 series controller
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats
Video
Interfaces
Multimode Display Port interface
18 / 24 bit dual channel LVDS interface
Video
Resolution
DP++ (HDMI compatible):
LVDS interface:
Up to 2560x1600@60Hz
Up to 1920x1200@60Hz
2 x external SATA channels
Mass Storage SD interface
Optional eMMC drive soldered on-board
Networking
Gigabit Ethernet interface
USB
1 x USB 3.0 Host port
4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
PCI-e
3 x PCI-e x1 lanes Gen2
Audio
HD Audio interface
Serial Ports
1 x Serial port (TTL interface, Tx / Rx only)
www.seco.com
18
Other
Interfaces
I2C Bus
LPC Bus
SM Bus
Thermal / FAN management
Power Management Signals
Power
Supply
+5VDC ± 5%
Operating
System
Microsoft® Windows 7
Microsoft® Windows 8.1
Microsoft® Windows 10
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7
Microsoft® Windows Embedded Standard 8
Microsoft® Windows Embedded Compact 7
Linux
Yocto
Operating
0°C ÷ +60°C
Temperature*
Dimensions
40 x 70 mm (1.57” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
The smallest Intel 64-bit SoC based standard module
on the market
μQseven
μQseven
®
®
μQ7-962
μQseven® standard module with NXP i.MX6 Processor
Optimal balance of performance and size
HIGHLIGHTS
µQseven® module based on the ARM® Cortex™-A9
i.MX6 SoC, a fully scalable solution from a high
performance Quad Core CPU to an energy-efficient
and cost-effective Solo Core solution
A flexible solution, suitable for high end, multi display
solutions as well as energy-saving smart portable devices
Available in Industrial Temperature range
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
OpenGL / ES 2.0 3D Graphics and up to 3
independent displays
MAIN FIELDS OF APPLICATION
HMI
Automation
PDA
Electronics
Biomedical/Medical
devices
Wireless
Technologies
FEATURES
Processor
NXP i.MX6 Family, based on ARM® CORTEX-A9 processors
- i.MX6S Solo - Single core up to 1GHz
- i.MX6DL Dual Lite - Dual core up to 1GHz per core
- i.MX6D Dual - Dual core up to 1GHz per core
- i.MX6Q Quad - Quad core up to 1GHz per core
Max Cores
4
Memory
Up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG™
(only i.MX6D and i.MX6Q)
Supports up to 3 independent displays with i.MX6D and i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S
Video
Interfaces
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24
bit interface
HDMI Interface 1.4
Video
Resolution
LVDS
HDMI
Mass Storage
Up to 8 GB eMMC drive soldered on-board
SD / MMC / SDIO interface
1 x External SATA Channel (only available with i.MX6D and
i.MX6Q)
Networking
Gigabit Ethernet interface
USB
1 x USB OTG interface
4 x USB 2.0 Host interfaces
PCI-e
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
Audio
I2S / AC’97 Audio interface
Serial Ports
2 x Serial ports (TTL interface)
CAN port interface
Other
Interfaces
I2C Bus
SM Bus
Power Management Signals
Power
Supply
+5VDC ± 5%
Operating
System
Linux
Yocto
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Dimensions
40 x 70 mm (1.57” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
up to 1920x1200
up to 1080p
www.seco.com
19
μQseven
®
μQ7-A75-J
μQseven® standard module with NXP i.MX6 Processor
Small, flexibile OTS module at proprietary costs
“Ready-to-use” and “ready-to-market”
cost-effective product which
exclusively supports SoC native features
HIGHLIGHTS
The best combination of low power consumption, size
and price
Complete BSP, easy migration between the entire
i.MX6 product family
MAIN FIELDS OF APPLICATION
HMI
Internet of
Things
PDA
Electronics
Wireless
Technologies
FEATURES
Processor
NXP i.MX6 Family, based on ARM® CORTEX-A9 processors
- i.MX6S Solo - Single core up to 1GHz
- i.MX6DL Dual Lite - Dual core up to 1GHz per core
Max Cores
2
Memory
Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
Supports 2 independent displays
Video
Interfaces
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit
interface
HDMI Interface
Video
Resolution
LVDS, resolution up to 1920x1200
HDMI, resolution up to 1080p
On-board eMMC drive, up to 8 GB
Mass Storage SD / MMC / SDIO interface
Internal SPI Flash for booting
Networking
FastEthernet (10 / 100 Mbps) interface
USB
1 x USB OTG interface
1 x USB 2.0 Host interface
PCI-e
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
Audio
I2S / AC’97 Audio interface
www.seco.com
20
Other
Interfaces
On the card edge connector, many pins can be used as
General Purpose I / Os or to implement some(*) of the
following extra functionalities:
- Additional SD interface
- Up to 4 UARTs
- CAN interface
- Watchdog(s)
- I2C interfaces
- PWM outputs
- SPI interface
- Additional Audio interface
(*) not all the combinations are allowed simultaneously
Power Management Signals
Power
Supply
+5VDC ± 5%
Optional Low Power RTC
Operating
System
Linux
Yocto
Operating
0°C ÷ +60 °C (Commercial temp.)
Temperature* For Industrial temp. (-40°C ÷ +85°C) please contact us
Dimensions
40 x 70 mm (1.57” x 2.76”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Excellent price-performance ratio
Qseven
Qseven
®
®
Carrier Board
Carrier Board
CQ7-A42
Carrier Board for Qseven® Rev. 2.0 Compliant modules on 3.5” Form factor
Feature rich for fast Time-to-market
HIGHLIGHTS
3.5” Form Factor Carrier Board for Qseven® Modules
Multiport Video Interfaces
Connectivity oriented
Embedded industrial interfaces
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Industrial temperature range
FEATURES
Video
Interfaces
LVDS Dual Channel 24-bit + backlight connectors or 2 x eDP
connectors
Multimode Display Port or HDMI Connector
1 x SATA connector with HDD Power connector
Mass Storage 1 x mSATA Slot
microSD Slot on combo microSD + SIM connector
Networking
Up to 2 x Gigabit Ethernet connectors
USB
1 x USB 3.0 Host port on type-A socket
2 x USB 2.0 Host ports on double Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 2.0 OTG port on micro-AB socket (USB port shared
with miniPCI-e slot)
PCI-e
miniPCI-e slot Full / Half Size, combined with SIM card slot
Audio
Audio interface on internal pin header
Serial Ports
4-wire RS-232 / RS-422 / RS-485 configurable serial port on
DB9 male connector
2 x RS-232 Full-modem serial ports on internal header (need
LPC interface from Qseven® module)
CAN interface on PCB terminal block
Other
Interfaces
SPI internal pin header
LPC Bus internal pin header
SM Bus / I2C GPIO expander, makes available 16 x GPIOs on
internal pin header
Front Panel Header
1 x 28 pin connector for additional features (I2C, ACPI
signals, SM Bus, Watch Dog, Thermal Management)
+12V Tachometric FAN connector
Optional Debug USB port on miniB socket
Optional MFG connector for JTAG programming of Qseven®
module
Power
Supply
+12VDC Mini-fit Standard ATX power connector
Coin cell battery Holder for CMOS and RTC
Operating
-40°C ÷ +85°C (Industrial temperature range)
Temperature*
Dimensions
146 x 102 mm (5.75” x 4.02”)
*All carrier board components must remain within the operating temperature at
any and all times, including start-up; carrier operating temperature is independent
of the module installed. Please refer to the specific module for more details. Actual
temperature will widely depend on application, enclosure and/or environment.
Upon customer to consider specific cooling solutions for the final system.
www.seco.com
21
Qseven
®
Development Kit
Q7 DEV KIT 2.0
Cross Platform Development Kit for Qseven® philosophy, compatible with both x86 and
ARM Rev. 2.0 Qseven® modules
Everything you need for flexible development
DEVELOPMENT KIT CONTENTS
The Development kit contains the following material:
Module not included. Must be purchased separately
Cross Platform Carrier Board CQ7-A30
LVDS optional Display
One 12VDC Notebook Power Adapter
Add-on modules for LVDS / eDP and HDMI / DP
SCHEMATICS
PUBLICLY AVAILABLE
FEATURES OF CQ7-A30
Video
Interfaces
HDMI / Display Port interface on PCI-e x16 slot
LVDS / eDP interface on PCI-e x8 slot
SATA Female 7p connector with dedicated Power connector,
interface shared with mSATA Slot
SATA Male 7+15p connector
Mass Storage
SD / MMC Card Slot
SPI Flash Socket
I2C EEPROM Socket
Networking
USB
PCI-e
Audio
Serial Ports
Other
Interfaces
Gigabit Ethernet connector
1 x USB 3.0 Host Type-A socket
1 x USB 3.0 OTG micro-AB socket
2 x USB 2.0 Host ports on internal pin header (alternative to
USB 3.0 port #0)
Up to 4 x USB 2.0 Host ports on quad Type-A socket
PCI-e x4 interface on dedicated PCI-e x16 slot shared with 3 x
PCI-e x1 slots + miniPCI-e slot (selection via jumper)
Embedded HD Audio Codec, Realtek ALC888
2 x Triple HD Audio jacks
2 S / PDIF connectors (In & Out)
Audio Expansion Slot
CAN Bus (both TTL interface and with CAN transceiver)
3 x RS-232 only ports
2 x RS-232 / RS-422 / RS-485 configurable serial ports
Feature Connector, with I2C , SM Bus, Watchdog, Thermal
and Power Management Signals
LPC Bus Header
SPI Pin Header
SIM Card slot
4 x 7-segment LCD displays for POST codes
PS / 2 Mouse / keyboard pin header
2 x tachometric FAN connectors
Debug Port on mini-B USB connector
Power, Reset, LID and Sleep Buttons
www.seco.com
22
Power
Supply
+12VDC
Coin cell battery Holder for CMOS and RTC
Operating
0° C ÷ 60° C
Temperature*
Dimensions
345 x 170 mm (13.58” x 6.69”)
*All carrier board components must remain within the operating temperature at
any and all times, including start-up; carrier operating temperature is independent
of the module installed. Please refer to the specific module for more details. Actual
temperature will widely depend on application, enclosure and/or environment.
Upon customer to consider specific cooling solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Cable kit
Qseven
Qseven
®
®
Development Kit
Development Kit
Q7 STARTER KIT 2.0
Cross Platform Starter Kit compatible with both x86 and ARM Rev. 2.0 Qseven® modules:
a complete package including the basic components necessary to start developing
Quickly “start” prototyping for short Time-to-market
STARTER KIT CONTENTS
Carrier board for Qseven® Rev. 2.0 compliant
modules CQ7-A42 (DP or HDMI version)
Module not included. Must be purchased separately
7” LVDS optional Display (800x480)
UMSH-8596MD-20T
LVDS display adapter + connection cable to
CQ7-A42 carrier board
HD Audio module
I2S Audio module
One 12VDC Notebook Power Adapter
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Cable kit
SCHEMATICS
PUBLICLY AVAILABLE
FEATURES OF CQ7-A42
Video
Interfaces
LVDS Dual Channel 24-bit + backlight connectors or 2 x eDP
connectors
Multimode Display Port or HDMI Connector
1 x SATA connector with HDD Power connector
Mass Storage 1 x mSATA Slot
microSD Slot on combo microSD + SIM connector
Networking
Up to 2 x Gigabit Ethernet connectors
USB
1 x USB 3.0 Host port on type-A socket
2 x USB 2.0 Host ports on double Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 2.0 OTG port on micro-AB socket (USB port shared
with miniPCI-e slot)
PCI-e
miniPCI-e slot Full / Half Size, combined with SIM card slot
Audio
Audio interface on internal pin header
Serial Ports
4-wires RS-232 / RS-422 / RS-485 configurable serial port on
DB9 male connector
2 x RS-232 Full-modem serial ports on internal header (need
LPC interface from Qseven® module)
CAN interface on PCB terminal block
Other
Interfaces
SPI internal pin header
LPC Bus internal pin header
SM Bus / I2C GPIO expander, makes available 16 x GPIOs on
internal pin header
Front Panel Header
1 x 28 pin connector for additional features (I2C, ACPI
signals, SM Bus, Watch Dog, Thermal Management)
+12V Tachometric FAN connector
Optional Debug USB port on miniB socket
Optional MFG connector for JTAG programming of Qseven®
module
Power
Supply
+12VDC Mini-fit Standard ATX power connector
Coin cell battery Holder for CMOS and RTC
Operating
-40°C ÷ +85°C (Industrial temperature range)
Temperature*
Dimensions
146 x 102 mm (5.75” x 4.02”)
*All carrier board components must remain within the operating temperature at
any and all times, including start-up; carrier operating temperature is independent
of the module installed. Please refer to the specific module for more details. Actual
temperature will widely depend on application, enclosure and/or environment.
Upon customer to consider specific cooling solutions for the final system.
www.seco.com
23
SMARC
Computer-On-Module approach
Consolidated
Standard form factors
ARM and x86 cross
compatibility
Design investment limited
to the carrier board
Multi-vendor solution
Scalable and future proof
Accelerated
time-to-market
Highly configurable
Long term
availability
Innovative and
upgradable
SMARC Standard advantages
Extreme low
power design
Low profile design
Dedicated battery
management signals
Up to four
display interfaces
Dual Ethernet
SMARC Compact
82 mm × 50 mm
SMARC Supported Features
System I/O interface
PCI Express lanes
Serial ATA channels
USB 2.0 ports
USB 3.0 ports
LVDS channels
embedded DisplayPort
DP++ / HDMI
Camera interfaces
High Definition Audio / I2S
Ethernet 10/100/1000 Mbps
UARTs
Secure Digital I/O 4-bit
# of interfaces
4
1
6
2
2
System I/O interface
I²C Bus
SPI Bus
CAN Bus
Watchdog Timer
Boot selection signals
GPIOs
5
2
2
1
3
12 (some with alternate functions)
System and Power
management signals
Reset out and Reset in
Power button in
Power source status
Module power state status
System management pins
Battery and battery charger
management pins
Carrier Power On control
1 dedicated DP++
1 shared DP++ / HDMI
2 MIPI CSI
1 I2S + 1 shared I2S / HD Audio
2
# of interfaces
2 x 4-Wire + 2 x 2-Wire
1
SECO is one of the founding
members of SGET
SMARC
SM-B69
SMARC Rel. 2.0 compliant module with the Intel® Atom™ E39xx family, Intel®
Celeron® N3350 and Intel® Pentium® N4200 (formerly code name Apollo Lake) SoCs
High performance, low power and feature-rich
HIGHLIGHTS
Up to 3 independent displays
4K HW decoding and encoding of HEVC(H.265),
H.264, VP8, SVC, MVC
Quad Channel Soldered Down LPDDR4-2400
memory, up to 8GB
Up to 2 x Gigabit Ethernet interfaces
MAIN FIELDS OF APPLICATION
Robotics
Internet of
Things
Biomedical/
Medical devices
Digital Signage Infotainment
HMI
Automotive
Gaming
Industrial
Visual
Computing
Mobile
devices
Multimedia
devices
FEATURES
Processor
Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz),
2MB L2 Cache, 12W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz),
2MB L2 Cache, 9.5W TDP
Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz),
2MB L2 Cache, 5.5W TDP
Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz),
2MB L2 Cache, 6W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz),
2MB L2 Cache, 6W TDP
Max Cores
4
Memory
Quad Channel Soldered Down LPDDR4-2400 memory, up to 8GB
Graphics
Up to 3 independent displays
Integrated Gen9-LP HD Graphics controller, with 18 Execution
Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8,
SVC, MVC
Video
Interfaces
eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
HDMI 1.4b or DP++ 1.2 interface
DP++ 1.2 interface
2 x CSI interfaces
Video
Resolution
HDMI, eDP:
DP++:
MIPI-DSI, LVDS:
Up to 3840 x 2160 (4K)
Up to 4096 x 2160
Up to 1920 x 1200
Audio
HD Audio interface
I2S Audio interface
Serial Ports
2 x HS-UART Tx/Rx/RTS/CTS, TTL interfaces
1 x HS-UART Tx/Rx, TTL interfaces
Other
Interfaces
I2C Bus
SM Bus
SPI interface
LPC Bus
FAN management
Power Management Signals
Power
Supply
+5VDC and +3.3V_RTC
Operating
System
Microsoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT Core
Linux (64 bit)
Yocto (64 bit)
Android (planning)
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Dimensions
50 x 82 mm (1.97” x 3.23”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
1 x external S-ATA Gen3 Channel
Mass Storage SD interface
Optional eMMC 5.0 drive soldered on-board
Networking
Up to 2 x Gigabit Ethernet interfaces
Intel® I210 or I211 Controller (MAC + PHY)
USB
6 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports
PCI-e
4 x PCI-e Root Ports
www.seco.com
26
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
2 x MIPI CSI interfaces
SMARC
SMARC
SM-B71
SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC
Flexibile ARM + FPGA Heterogeneous Processing in a Standard Form Factor
HIGHLIGHTS
Wide scalability from cost effective Dual-Core to high
performance Quad-Core ARM® Cortex®-A53 MPSoCs
with GPU/VCU
Extreme flexibility: up to 256k FPGA logic cells
LVDS and DP video interfaces up to 4K resolution
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
High-speed interfaces
Dedicated Real-Time ARM® Cortex®-R5 processors
MAIN FIELDS OF APPLICATION
Internet of
Things
Industrial Automation
and Control
Biomedical/
Medical devices
Visual
Computing
Robotics
Telco
Automotive
Avionics
FEATURES
Xilinx® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +
Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
Processor
Xilinx® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or
ZU5EV MPSoCs:
Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +
Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
Memory
Soldered Down DDR4-2400 memory
Up to 8GB for Processing System Unit + up to 2GB for
Programmable Logic
Graphics
Only on EG and EV MPSOcs:
Integrated ARM Mali-400 MP2 Graphics Processing Unit
Multicore 2D/3D acceleration at 667MHz
OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
On EV MPSoCs only, H.264/H.265 integrated video codec
Video
Interfaces
18- / 24-bit Dual Channel LVDS interface
DP interface
2 x CSI interfaces
Video
Resolution
DP:
LVDS:
Up to 4096 x 2160
Dependent on the IP implemented in the
programmable logic
Mass Storage
1 x external S-ATA Gen3 Channel
SD interface
QSPI Flash soldered-onboard
Optional eMMC 4.51 drive soldered on-board
Networking
Up to 2 x Gigabit Ethernet interfaces
USB
4 x USB 2.0 Host Ports
1 x USB 3.0 Host Ports
PCI-e
PCI-e x2 interface
Audio
Dependent on the IP implemented in the programmable logic
Serial Ports
1 x HS-UART Tx/Rx/RTS/CTS
1 x HS-UART Tx/Rx
2 x CAN Bus
Other
Interfaces
I2C Bus
SM Bus
2 x SPI interfaces
12 x GPI/Os
Boot select signals
Power Management Signals
Power
Supply
+3÷+5.25VDC
+3.3V_RTC
Operating
System
Linux
Android
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Dimensions
50 x 82 mm (1.97” x 3.23”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
27
COM
Express
™
Computer-On-Module approach
Consolidated
Standard form factors
ARM and x86 cross
compatibility
Design investment limited
to the carrier board
Multi-vendor solution
Scalable and future proof
Accelerated
time-to-market
Highly configurable
Long term
availability
Innovative and
upgradable
COM Express™ Standard advantages
For high-end designs
and markets
High graphics
computing
For high performance
project requirements
Extremely
feature-rich
Basic 125 x 95 mm
Compact 95 x 95 mm
COM Express™ Interfaces
Interface
PCI Express Lanes
PCI Express Graphics (PEG)
SDVO Channels on PEG
PCI Bus - 32 Bit
LVDS
eDP on LVDS 1st channel
VGA Port
Digital Display Interfaces
Serial Ports
CAN interface
SATA ports
PATA Port
AC’97 / HDA Digital Interface
*Mandatory interface
Type 2
Type 6
Min / Max
1* / 6
0/1
0/2
1*
0/1
N.A.
0/1
N.A.
N.A.
N.A.
N.A.
1*
0/1
Min / Max
1* / 8
0/1
N.A.
N.A.
0/1
0/1
0/1
0/3
0/2
0/1
1* / 4
N.A.
0/1
Interface
USB 2.0 Ports
USB Client
USB 3.0 Ports
LAN Ports
Express Card
LPC Bus
SPI
GPIO
SDIO Muxed on GPIO
SM Bus
I2C
Watchdog Timer
Speaker Out
Type 2
Type 6
Min / Max
4/8
0/1
N.A.
1*
1/2
1*
1/2
8*
N.A.
1*
1*
0/1
1*
Min / Max
4/8
0/1
0/4
1*
1/2
1*
1/2
8*
0/1
1*
1*
0/1
1*
COM Express
™
™
COMe-B09-BT6
Type 6
COM Express™ Basic Type 6 with Intel® 6th generation Core™ / Xeon®
(”Skylake-H”) CPUs
When high graphics and Hyper-threading matter
Intel® 6th generation Core™ (”Skylake-H”) Platform
H.265 / HEVC HW Transcoder
Up to 4 Cores + HD Graphics 530 / P530
Up to 3 independent displays supported
DDR4 RAM TECHNOLOGY
Resolution up to 4096x2304 @60Hz, 24bpp
MAIN FIELDS OF APPLICATION
Biomedical/
Medical
devices
Gaming
HMI
Digital
Signage Infotainment
Telco
FEATURES
Processor
Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in
Turbo Boost), 8MB Cache, 45W TDP
Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo
Boost), 8MB Cache, 25W TDP
Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in
Turbo Boost), 6MB Cache, 45W TDP
Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in
Turbo Boost), 6MB Cache, 25W TDP
Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in
Turbo Boost), 8MB Cache, 45W TDP
Intel® Xeon® E3-1535M V5, Quad Core @ 2.9GHz (3.8GHz in
Turbo Boost), 8MB Cache, 45W TDP
eDP, DP:
HDMI:
LVDS, VGA:
up to 4096x2304 @60Hz, 24bpp
up to 4096x2160 @60Hz, 24bpp
up to 1920 x 1200 @60Hz
Mass Storage 4 x SATA Gen3 Channels
Networking
USB
Gigabit Ethernet interface
Intel® I219-LM GbE Controller
4 x USB 3.0 Host ports
8 x USB 2.0 Host ports
PCI-e
8 x PCI-e x1 Gen3 lanes
Audio
HD Audio Interface
Serial Ports
2 x UARTs
Max Cores
4
Max Thread
8 (HT not available with Core™ i5 Processors)
Platform
Controller
Hub (PCH)
Other
Interfaces
Intel® QM170, HM170 or CM236 PCH
2 x SPI, I2C, SM Bus, LPC Bus, 2 x Express Card, FAN management
Optional TPM 1.2
LID# / SLEEP# / PWRBTN#, Watchdog
4x GPI, 4 x GPO
+12VDC ± 10% and +5VSB (optional)
Memory
Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 Memory
ECC DDR4 memory modules supported only with Xeon® and
Core™ i3 processors combined with CM236 PCH
Power
Supply
Operating
System
Graphics
Intel® HD Graphics 530 (Core™ processors), P530 (Xeon® processors)
Up to 3 independent displays supported
DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264,
VP8, JPEG / MJPEG, HEVC / H.265, VP9
HW accelerated video encode MPEG2, AVC / H.264, VP8,
JPEG / MJPEG, HEVC / H.265, VP9
Microsoft® Windows 7
Microsoft® Windows 8.1
Microsoft® Windows 10
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7
Microsoft® Windows Embedded Standard 8
Linux
Video
Interfaces
Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2,
DVI and HDMI 1.4
eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or
LVDS + VGA interface
PCI-express Graphics (PEG) Gen3 x16
www.seco.com
30
Video
Resolution
Operating
0°C ÷ +60°C (Commercial version)
Temperature*
Dimensions
125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
HIGHLIGHTS
COM Express
™
COMe-A98-CT6
COM Express
™
Type 6
Type 6
COM Express™ Compact Type 6 with the AMD Embedded 3rd generation
R-Series SOC (“Merlin Falcon”) or G-Series SOC-I (“Brown Falcon”)
When scalable graphics performance makes the difference
Merlin Falcon
Brown Falcon
HIGHLIGHTS
Configurable TDP
Available in Industrial Temperature Range
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Up to 4 Excavator x86 CPU cores with the latest
Radeon graphics and I / O Controller on a single Chip
MAIN FIELDS OF APPLICATION
Medical
Gaming
Digital Signage Infotainment
FEATURES
Processor
AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
AMD RX-416GD, Quad Core @ 1.6 GHz (2.0GHz Max), TDP 15W,
Industrial Temperature range
AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W
USB
4 x USB 3.0 Host ports
8 x USB 2.0 Host ports
PCI-e
3 x PCI-e x1 Gen3 lanes
Audio
HD Audio Interface
Other
Interfaces
SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN
management
LID# / SLEEP# / PWRBTN#, Watchdog
4 x GPI, 4 x GPO (multiplexed with SD interface)
Max Cores
4
Memory
Two SO-DIMM slots supporting DDR4 ECC / non-ECC
modules up to 2133MHz (up to 1600MHz with GX217GI)
Power
Supply
+12VDC ± 10% and +5VSB (optional)
Graphics
AMD Radeon 3rd -Generation Graphics Core Next (GCN)
AMD RX-421BD - Radeon™ R7
AMD RX-418GD, RX-416GD - Radeon™ R6
AMD GX-217GI - Radeon™ R6E
Up to 3 independent displays supported (up to 2 with
GX217GI)
DirectX® 12 supported
UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4K
H.264 encode) supported
Operating
System
Microsoft® Windows 7
Microsoft® Windows 8.1
Microsoft® Windows 10
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7
Microsoft® Windows Embedded Standard 8
Linux
Video
Interfaces
Up to 3 x Digital Display Interfaces (DDIs), supporting eDP
1.4, DP 1.2, DVI and HDMI 1.4b/2.0
Optional VGA interface (excludes one DDI Port)
Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS
interface (R-Series SOCs only, excludes one DDI Port)
PCI-express Graphics (PEG) x 8 (x4 with GX217GI)
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Video
Resolution
DDIs:
LVDS, VGA:
Mass Storage
2 x SATA Gen3 Channels
SD interface shared with GPI/Os
Networking
Gigabit Ethernet interface
Intel® I210 / I211 GbE Controller
up to 4K
up to 1920 x 1200
Dimensions
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
31
COM Express
™
™
Type 6
COM Express™ Compact Type 6 with Intel® Atom™ E3800 and Celeron®
families (“Bay Trail”)
COMe-A41-CT6
Versatile and rugged
Moon Island platform Intel IoT gateway solution
HIGHLIGHTS
Also available in Industrial temperature range
Optional eMMC drive soldered on-board
MAIN FIELDS OF APPLICATION
Industrial
Automation and
Control
Biomedical/
Medical
devices
Gaming
Automotive
Digital Signage Infotainment
Avionics
Transportation
FEATURES
Processor
Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
Max Cores
4
Memory
DDRL non-ECC SO-DIMM slots, 4GB modules supported per
each slot
E3845, E3827, J1900, N2930: up to 8GB Dual-Channel
DDR3L 1333MHz
E3826: up to 8GB Dual-Channel DDR3L 1066MHz
N2807: up to 4GB Single-Channel DDR3L 1333MHz
E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz
Audio
HD Audio interface
PCI-e
Up to 4 x PCI-e x1 Gen2 lanes
Serial Ports
2 x Serial ports (TX / RX only, TTL interface)
Other
Interfaces
2 x Express Card interfaces
I2C Bus
LPC Bus
SM Bus
4 x GPI, 4 x GPO
Thermal / FAN management
Watch Dog timer
Power Management Signals
Power
Supply
+12VDC ± 10% and + 5VSB (optional)
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Microsoft® Windows Embedded Compact 7
Linux (32 / 64 bit)
Yocto
Intel®
Graphics
HD Graphics 4000 series controller
Integrated
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats
Video
Interfaces
1 x Digital Display Interface (DDI) able to drive HDMI / DVI /
DP++ interface
Additional DDI, can be switched to manage embedded
Display Port or 18 / 24 bit single / dual channel LVDS interface
CRT interface
Video
Resolution
CRT Interface:
HDMI:
Display Port, eDP:
Optional LVDS interface:
Up to 2560x1600@60Hz
Up to 1920x1080p@60Hz
Up to 2560x1600@60Hz
Up to 1920x1200@60Hz
Optional eMMC drive soldered on-board
Mass Storage 2 x external SATA channels
SD Card interface (multiplexed with GPIO signals)
Networking
Optional Gigabit Ethernet interface (uses one PCI-e lane)
USB
7 x USB 2.0 Host ports
4 x USB 3.0 Host ports
www.seco.com
32
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Dimensions
95 x 95 mm (Com Express™ Compact Form factor, Type 6
pinout, 3.74” x 3.74”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Dual independent display support, with broad
connectivity options (HDMI, DVI, DP, DP++, LVDS, CRT)
COM Express
™
COMe-A81-CT6
COM Express
™
Type 6
Type 6
COM Express™ Compact Type 6 based on NVIDIA® Tegra® K1 Mobile
Processor SoC
Supreme Visual computing with ARM efficiency
HIGHLIGHTS
Integrates 192 CUDA® cores and a Low-power NVIDIA®
Kepler™ GPU for Extreme performance and powerful
computing with extraordinary power efficiency
COM Express™ Cross Platform compatible with all COM
Express™ type 6 standard carrier boards
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Supports OpenGL® ES 3.0, OpenGL® 4.4, DirectX®
11.1, CUDA® 7; up to 2160p30 HW decoding; up to
2160p24 HW encoding
MAIN FIELDS OF APPLICATION
Automotive
In-Vehicle
Infotainment
Systems
Visual
Computing
Surveillance
Medical
Gaming
Digital
Signage Infotainment
Measuring
Instruments
FEATURES
Processor
NVIDIA® Tegra® K1 Mobile Processor Quad-core, 4-Plus-1™
ARM® Cortex –A15 MPCore R3 processor
Max Cores
4
Memory
Dual Channel Soldered Down DDR3L-1833 memory, up to 4GB
Graphics
Low-power NVIDIA® Kepler™ -based GeForce® graphics
processor with 192 CUDA® cores
Supports OpenGL® ES 3.0, OpenGL® 4.4, DirectX® 11.1,
Tessellation CUDA® 7
Up to 2160p30 HW decoding; up to 2160p24 HW encoding
Video
Interfaces
eDP interface or native Single Channel 18 / 24 bit LVDS
interface or Single / Dual Channel 18 / 24bit LVDS interface
HDMI interface
2 x MIPI CSI Camera interfaces
Video
Resolution
HDMI:
eDP:
LVDS:
up to 4096 x 2160 (4K)
up to 3840 x 2160
up to 1920 x 1200
1 x external SATA Gen2 Channel
Mass Storage Optional eMMC drive soldered on-board, up to 32GB
SD Card interface (multiplexed with GPIO signals)
Networking
Gigabit Ethernet interface
Realtek RTL8111G Controller (MAC + PHY)
USB
8 x USB 2.0 Host ports
4 x USB 3.0 Host ports
PCI-e
Up to four PCI-express x1 interfaces (factory options)
Audio
HD Audio interface
Serial Ports
2 x UARTS, TX / RX signals only, TTL interface
Other
Interfaces
I2C Bus
LPC Bus
SM Bus
4 x GPI, 4 x GPO
SPI Interface
Watch Dog Timer
Real Time Clock (optional, additional Low Power RTC)
Power Management Signals
Thermal / Fan Management
On-board FAN connector
Power
Supply
+12VDC and +5VSB (optional)
Operating
System
Linux for Tegra (L4T) provides flashing utilities, bootloader,
Linux kernel, Tegra hardware acceleration libraries for
graphics, multimedia and compute (EGL, OpenGL-ES, GLX,
OpenGL), and a reference File System for evaluating Linux on
the Tegra platform
Operating
0°C ÷ +60°C (Commercial version)
Temperature*
Dimensions
95 x 95 mm (COM Express Compact, 3.74” x 3.74”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
33
COM Express
™
™
COMe-953-BT6
Type 6
COM Express™ Basic Type 6 Module with Intel® Haswell family CPUs
High performance for any design in a scalable form factor
HIGHLIGHTS
Optional DDR3L ECC SO-DIMM module support
(MB28 modules)
Supports enhanced high-end media and graphics
capabilities and performance
MAIN FIELDS OF APPLICATION
Biomedical/
Medical
devices
Gaming
Digital
Signage Infotainment
HMI
FEATURES
Processor
Intel® Core™ i3-4100E, Dual Core with HT @ 2.4GHz, 3MB
Cache, 37W TDP
Intel® Core™ i3-4102E, Dual Core with HT @ 1.6GHz, 3MB
Cache, 25W TDP
Intel® Core™ i5-4400E Dual Core with HT @ 2.7GHz, 3MB
Cache, 37W TDP
Intel® Core™ i5-4402E Dual Core with HT @ 1.6GHz, 3MB
Cache, 25W TDP
Intel® Core™ i7-4700EQ Quad Core with HT @ 2.4GHz, 6MB
Cache, 47W TDP
Intel® Celeron® 2002E Dual Core @1.5GHz, 2MB Cache, 25W TDP
Intel® Celeron® 2000E Dual Core @2.2GHz, 2MB Cache, 37W TDP
Max Cores
4
Chipset
Intel® QM87 Chipset
Memory
Up to 16GB 1.35V DDR3L-1600 on two SO-DIMM slots,
supporting Dual-Channel
M953 modules support non-ECC SO-DIMMs only, MB28
modules support ECC modules only
Graphics
Integrated Intel® HD Graphics
Up to 3 independent displays supported
DirectX® 11, OpenGL4.0 supported
Video
Interfaces
3 x HDMI / DVI / Multimode Display Port interfaces
embedded Display Port or 18 / 24 bit single / dual channel
LVDS interface
CRT interface
PCI Express Graphics (PEG) x 16 interface
Video
Resolution
CRT Interface:
HDMI:
DVI:
Display Port:
LVDS, eDP:
up to 1920 x 1200 @ 60Hz
up to 4096x2304 @ 24Hz / 2560x1600 @ 60Hz
up to 1920x1200 @ 60Hz
up to 3840 x 2160 @ 60Hz
up to 1920 x 1200 @ 60Hz
Mass Storage 4 x external SATA channels
Networking
Gigabit Ethernet interface
Supports remote management (Intel® AMT Technology)
www.seco.com
34
USB
8 x USB 2.0 Host ports
4 x USB 3.0 Host ports
PCI-e
7 x PCI-e x1 lanes (configurable as 1 PCI-e x4 + 3 PCI-e x1)
Audio
HD Audio interface
Serial Ports
2 x serial ports (Tx/Rx only, TTL interface) (MB28 module only)
Other
Interfaces
2 x Express Card interfaces
I2C Bus
LPC Bus
SM Bus
4 x GPI, 4 x GPO
Thermal / FAN management
Watch Dog timer
Optional TPM on-board (M953 modules only)
Power Management Signals
Power
Supply
+12VDC ± 10% and + 5VSB (optional)
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Microsoft® Windows Embedded Compact 7
Linux
Operating
0°C ÷ +60°C (Commercial version)
Temperature*
Dimensions
125 x 95 mm (4.92” x 3.74”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
High performance computing and graphics
COM Express
™
COMe-948-BT6
COM Express
™
Type 6
Type 6
COM Express™ Basic Type 6 Module based on AMD Embedded R-Series
Platform
Powerful integrated graphics for multi-display designs
HIGHLIGHTS
Up to 4 independent displays, up to 2560x1600
resolution
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Designed for digital signage, gaming and multimedia
applications
AMD R-series APU (CPU+GPU) architecture
MAIN FIELDS OF APPLICATION
Biomedical/
Medical
devices
Gaming
Digital Signage Infotainment
FEATURES
Processor
AMD R-464L, Quad Core @ 3.2 GHz, TDP 35W
AMD R-460L, Quad Core @ 2.8 GHz, TDP 25W
AMD R-452L, Quad Core @ 2.4 GHz, TDP 19W
AMD R-260H, Dual Core @ 2.6 GHz, TDP 17W
AMD R-252F, Dual Core @ 2.4 GHz, TDP 17W
Max Cores
4
Chipset
AMD A70M Controller Hub
Memory
Up to 8GB of 1600MHz DDR3 on two SO-DIMM slots @1.5V,
supporting Dual-Channel
Graphics
AMD Radeon HD7000G Series:
HD7660G - AMD R-464L
HD7620G - AMD R-460L / HD7600G - AMD R-452L
HD7500G - AMD R-260H / HD7400G - AMD R-252F
Up to 4 independent displays supported
DirectX® 11, OpenGL4.2, OpenCL™ 1.1 supported
Video
Interfaces
3 x Digital Display interfaces
18 / 24 bit single / dual channel LVDS interface
CRT interface
PCI Express Graphics (PEG) x 8 interface
Video
Resolution
Digital Display interfaces:
CRT:
LVDS:
up to 2560 x 1600
up to 1920 x 1600
up to 1920 x 1200
Mass Storage 4 x external SATA channels
Networking
Gigabit Ethernet interface
USB
8 x USB 2.0 Host ports
4 x USB 3.0 Host ports
PCI-e
7 x PCI-e x1 lanes (configurable as 1 PCI-e x4 + 3 PCI-e x1)
Audio
HD Audio interface
Serial Ports
2 x optional Serial ports (TX / RX only, TTL interface)
Other
Interfaces
2 x Express Card interfaces
I2C Bus
LPC Bus
SM Bus
4 x GPI, 4 x GPO
Thermal / FAN management
SPI Interface
Watch Dog timer
Real Time Clock
Optional Trusted Platform Module (TPM)
Power Management Signals
Power
Supply
+12VDC ± 10% and + 5VSB (optional)
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Linux
Operating
0°C ÷ +60°C
Temperature*
Dimensions
125 x 95 mm (4.92” x 3.74”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
35
COM Express
™
Type 6
Carrier Board
CCOMe-965
Carrier Board for COM-Express™ Type 6 modules on miniITX form factor
Platform independent carrier board for quick prototyping
HIGHLIGHTS
COM Express™ Type 6 carrier board
mini-ITX form factor
FEATURES
Video
Interfaces
1 x LVDS (18bit / 24bit, single / dual channel) 34 pin connector
1 x eDP connector
1 x backlight connector
2 x combo DP / HDMI Connectors
1x multimode Display Port Connector
1 x VGA connector
8-pin socket for external DID EEPROM
PCI Express Graphics x16 slot
Mass Storage
2 x SATA connectors
1 x mSATA Slot
Networking
2 x Gigabit Ethernet ports
USB
4 x USB 3.0 Host ports on type-A sockets
2 x USB 2.0 Host ports on internal pin header
PCI-e
1 x PCI-e x4 slot, Gen2 compatible
2 x miniPCI-e slot Full / Half Size, (one combined with SIM
card slot), Gen2 compatible
Audio
Internal HD Audio Codec
Triple Audio jack
S / P-DIF Out 3 pin header for digital Audio
Internal pin header for audio jacks’ remoting
Other
Interfaces
I2C EEPROM Socket
LPC Bus internal pin header
Front Panel Header
1 x 28 pin connector for additional features (I2C, ACPI
signals, SM Bus, Watch Dog, Thermal Management)
Internal pin header for GPIO / SDIO + 2 x RS-232 Serial ports
(Tx / Rx signals)
SIM Card slot
Tachometric FAN connector, selectable +12V or +5V
www.seco.com
36
Power
Supply
ATX Standard power connector 24 poles (AT mode configurable)
+12V auxiliary power connector
Coin cell battery Holder for CMOS and RTC
Operating
0°C ÷ +60°C
Temperature*
Dimensions
170 x 170 mm (6.69” x 6.69”)
*All carrier board components must remain within the operating temperature at
any and all times, including start-up; carrier operating temperature is independent
of the module installed. Please refer to the specific module for more details. Actual
temperature will widely depend on application, enclosure and/or environment.
Upon customer to consider specific cooling solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Broad choice of Video Interfaces
COM Express
™
COM Express
™
Type 6
Type 6
Development Kit
Development Kit
COM EXP T6 DEV KIT
Cross Platform Development Kit compatible with both x86 and ARM COM Express™ Type 6 modules
Platform independent kit for fast Time-to-market
DEVELOPMENT KIT CONTENTS
The Development kit contains the following material:
Module not included. Must be purchased separately
CCOMe-965 carrier board
HDMI Cable High-Speed 19p to 19p 1m
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
DP Cable 1m
SCHEMATICS
PUBLICLY AVAILABLE
FEATURES OF CCOMe-965
Video
Interfaces
1 x LVDS (18bit / 24bit, single / dual channel) 34 pin connector
1 x eDP connector
1 x backlight connector
2 x combo DP / HDMI Connectors
1x multimode Display Port Connector
1 x VGA connector
8-pin socket for external DID EEPROM
PCI Express Graphics x16 slot
Mass Storage
2 x SATA connectors
1 x mSATA Slot
Networking
2 x Gigabit Ethernet ports
USB
4 x USB 3.0 Host ports on type-A sockets
2 x USB 2.0 Host ports on internal pin header
PCI-e
1 x PCI-e x4 slot, Gen2 compatible
2 x miniPCI-e slot Full / Half Size, (one combined with SIM
card slot), Gen2 compatible
Audio
Internal HD Audio Codec
Triple Audio jack
S / P-DIF Out 3 pin header for digital Audio
Internal pin header for audio jacks’ remoting
Other
Interfaces
I2C EEPROM Socket
LPC Bus internal pin header
Front Panel Header
1 x 28 pin connector for additional features (I2C, ACPI
signals, SM Bus, Watch Dog, Thermal Management)
Internal pin header for GPIO / SDIO + 2 x RS-232 Serial ports
(Tx / Rx signals)
SIM Card slot
Tachometric FAN connector, selectable +12V or +5V
Power
Supply
ATX Standard power connector 24 poles (AT mode configurable)
+12V auxiliary power connector
Coin cell battery Holder for CMOS and RTC
Operating
0°C ÷ +60°C
Temperature*
Dimensions
170 x 170 mm (6.69” x 6.69”)
*All carrier board components must remain within the operating temperature at
any and all times, including start-up; carrier operating temperature is independent
of the module installed. Please refer to the specific module for more details. Actual
temperature will widely depend on application, enclosure and/or environment.
Upon customer to consider specific cooling solutions for the final system.
www.seco.com
37
ETX
®
Computer-On-Module approach
Consolidated
Standard form factors
Design investment limited
to the carrier board
Scalable and future proof
Multi-vendor solution
Highly configurable
Accelerated
time-to-market
Long term
availability
ETX® Standard advantages
For legacy designs
X86 based CoM
Proven and
established standard
Extend the life of existing
ETX-based projects
ISA bus support
Innovative and
upgradable
ETX
®
ETX-A61
ETX® Module with the Intel® Atom™ E3800 and Celeron® families (“Bay Trail”) SoC
Update your legacy design
Moon Island platform Intel IoT gateway solution
HIGHLIGHTS
Rugged design (DDR3L memory soldered on-board,
exclusively ceramic capacitors, high quality
AEC-Q200 grade inductors)
State-of-the-art replacement solution for legacy
projects in ETX form factor with dual channel memory
On-board eMMC for storage and operating system
booting support
MAIN FIELDS OF APPLICATION
Robotics
Automotive
Surveillance
Biomedical/
Medical
devices
Industrial
Automation and
Control
Automation
HMI
Avionics
FEATURES
Processor
Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP
Max Cores
4
Max Thread
4
Memory
Graphics
Video
Interfaces
Video
Resolution
DDR3L memory soldered on-board
E3845, E3827, J1900, N2930: up to 8GB Dual-Channel
DDR3L 1333MHz
E3826: up to 8GB Dual-Channel DDR3L 1066MHz
N2807: up to 4GB Single-Channel DDR3L 1333MHz
E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz
Integrated Intel® HD Graphics 4000 series controller
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats
VGA standard analog video interface
18 / 24 bit single / dual channel LVDS interface (VESA and
JEIDA color mapping compatible)
CRT Interface:
LVDS interface:
Up to 2560 x 1600 @ 60Hz
Up to 1920 x 1200 @ 60Hz
Optional eMMC drive soldered on-board
2 x external SATA or 2 x PATA or 1 x PATA + 1 x SATA
Mass Storage
channels (factory options)
μSD Card Slot
Gigabit Ethernet controller, makes available a 10 / 100Mbps
Networking
Ethernet interface
USB
HD Audio codec, Realtek ALC262
Serial Ports
2 x Serial ports (TX / RX / RTS / CTS signals, TTL interface)
Other
Interfaces
PCI Bus rel. 2.3 compliant
ISA Bus
LPT interface shared with Floppy Drive interface
PS / 2 mouse and keyboard interface
I2C Bus
SM Bus
Watch Dog timer
Power Management Signals
Power
Supply
+5VDC ± 5% and + 5VSB (optional)
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Microsoft® Windows Embedded Compact 7
Linux (32 / 64 bit)
Yocto
Operating
0°C ÷ +60°C (Commercial version)
Temperature* Optionally available in -40°C ÷ +85°C temperature range
Dimensions
114 x 95 mm (4.49” x 3.74”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
4 x USB 2.0 Host ports
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40
Audio
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Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Intel® Atom™ E3800 and Celeron® families (“Bay Trail”)
Single Board
Computer
Single Board Computer advantages
Ready for systems
integration
Reduced time-to-market
Very low engineering
design investment
Best price point for
low volume projects
Off-the-shelf solutions
Single Board
Board Computer
Computer
SBC-B68-eNUC
SBC with the Intel® Atom™ E39xx family, Intel® Celeron® N3350 and
Intel® Pentium® N4200 (formerly code name Apollo Lake) SoCs in the
embedded NUC™ form factor
Flexible and expandable full industrial x86 eNUC SBC
HIGHLIGHTS
Quad Channel Soldered Down LPDDR4-2400 memory,
up to 8GB
Wide input voltage range
Wide range of connectivity options through WLAN and
WWAN M.2 slots
Versatile expansion capabilities
MAIN FIELDS OF APPLICATION
Multimedia
devices
HMI
Industrial Internet of
Things
Industrial
Automation and
Control
Info Kiosks
Digital Signage Infotainment
Point of Sales
Automotive
FEATURES
Processor
Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz),
2MB L2 Cache, 12W TDP
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz),
2MB L2 Cache, 9W TDP
Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz),
2MB L2 Cache, 5.5W TDP
Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz),
2MB L2 Cache, 6W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz),
2MB L2 Cache, 6W TDP
PCI-e
1 x PCI-e x2 port on M.2 SSD/WWAN Slot
1 x PCI-e x1 port on WLAN M.2 Slot
Audio
HD Audio codec / Cirrus Logic CS4207
Mic In and Line Out Audio jacks
Amplified Speaker output on internal pin header
Serial Ports
2 x RS-232/RS-422/RS-485 UARTS software configurable, on
internal Pin Header
Max Cores
4
Max Thread
4
Memory
Quad Channel soldered down LPDDR4 memory, up to 8GB
Other
Interfaces
Graphics
Integrated Gen9-LP Graphics controller, with up to 18
Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8,
SVC, MVC
Three independent display support
2 x I2C + 8 x GPI/Os on Feature connector
Button / LED front panel header
CIR (Consumer InfraRed) sensor
microSIM slot for M.2 WWAN Modem
Power
Supply
+18VDC ÷ +32 VDC recommended
+15VDC ÷ +36 VDC absolute
RTC battery
Video
Interfaces
Two DP++ 1.2 interfaces on miniDP connectors
(supports HDMI displays through external adapter)
Embedded Display Port (eDP) internal connector
LVDS through optional external adapter
Operating
System
Microsoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT Core
Linux (64 bit)
Yocto (64 bit)
Android (planning)
Video
Resolution
DP++:
eDP, HDMI:
LVDS:
Operating
0°C ÷ +60°C (Commercial version)
Temperature* -40°C ÷ +85°C (Industrial version)
Up to 4096 x 2160
Up to 3840 x 2160
Up to 1920 x 1200
Optional eMMC drive onboard
M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
Mass Storage
microSD Card slot
SATA 7p M connector
Networking
2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)
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44
USB
2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 3.0 Host port on SSD/WWAN M.2 slot
1 x USB 2.0 Host port on WLAN M.2 Slot
Dimensions
101.6 x 101.6 mm (4” x 4”)
* Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application, enclosure
and/or environment. Upon customer to consider specific cooling solutions for the
final system.
** SATA SSD and WWAN functionalities share the same slot and are therefore
mutually exclusive
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Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Industrial temperature range
Single Board Computer
Single Board Computer
SBC-A80-eNUC
SBC with the N-series Intel® Pentium® / Celeron® and x5-Series Atom™
SOCs in the embedded NUC™ form factor
Multifunctional SBC on the eNUC form factor
HIGHLIGHTS
embedded NUC™ Type 2 “Connectivity” module, 101.6
x 101.6 mm (4” x 4”)
M.2 SSD and M.2 connectivity (PCI-e + USB) slots
Industrial range power supply
USB 3.0 Connectivity
Long lifetime
SBC-A80-eNUC is Microsoft Azure Certified for IoT
Dual Gigabit Ethernet
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
HDMI, miniDP++ and eDP video connectors
MAIN FIELDS OF APPLICATION
HMI
Multimedia
devices
Industrial Internet of
Things
Industrial
Automation and
Control
Info Kiosks
Digital Signage Infotainment
Point of Sales
FEATURES
Processor
Max Cores
Intel® Pentium® N3710, Quad Core @ 1.6GHz (Turbo Boost
2.56GHz), 2MB Cache, 6W TDP
Intel® Celeron® N3160, Quad Core @ 1.6GHz (Turbo Boost
2.24GHz), 2MB Cache, 6W TDP
Intel® Celeron® N3060, Dual Core @ 1.6GHz (Turbo Boost
2.48GHz), 2MB Cache, 6W TDP
Intel® Celeron® N3010, Dual Core @ 1.04GHz (Turbo Boost
2.24GHz), 2MB Cache, 4W TDP
Intel® Atom™ x5-E8000, Quad Core @ 1.04GHz (Turbo Boost
2.00GHz), 2MB Cache, 5W TDP
4
Memory
2 x DDR3L SO-DIMM Slots with Dual Channel Support, up to
8GB DDR3L-1600
Graphics
Integrated Graphics
Three independent display support
HW decoding of HEVC(H.265), H.264, MPEG2, MVC, VC-1,
VP8, WMV9, JPEG/MJPEG formats
HW encoding of H.264, MVC and JPEG/MPEG formats
Video
Interfaces
HDMI connector
miniDP++ connector
embedded Display Port (eDP) internal connector
Mass Storage
Networking
2 x USB 3.0 Host ports on Type-A sockets
2 x USB 2.0 Host ports on internal pin header
1 x USB 2.0 Host port on M.2 Connectivity Slot
PCI-e
1 x PCI-e x1 port on M.2 Connectivity Slot
Audio
Audio available on HDMI and miniDP++ interfaces
HD Audio codec
Combo TRSS connector with LineOut and MicIn support
Serial Ports
2 x RS-232 / RS-422 / RS-485 UARTS, on internal Pin Header
Other
Interfaces
I2C Touch Panel connector
Front Panel Pin Header
CIR (Consumer InfraRed) sensor
8 x GPI/Os
Power
Supply
+18VDC ÷ +32VDC recommended
+15VDC ÷ +36VDC absolute
RTC Battery
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Linux
Yocto
4
Max Thread
Video
Resolution
USB
HDMI, DP:
eDP:
up to 3840x2160 24bpp @30Hz, 2560x1600
24bpp @60Hz
up to 2560x1440 24bpp @60Hz
Optional eMMC drive on-board
M.2 SATA SSD slot (Socket 2 Key B Type 2242 or 2260)
microSD Card slot
SATA 7p M connector
2 x Gigabit Ethernet ports
Operating
0°C ÷ +60 °C
Temperature*
Dimensions
101.6 x 101.6 mm (4” x 4”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
45
Single Board
Board Computer
Computer
SBC-B47-eNUC
SBC with the Qualcomm® Snapdragon™ 410E processor in the embedded
NUC™ form factor
Connectivity oriented embedded NUC™ with Qualcomm® Snapdragon™ 410E
Ultra-low power solution
WiFi + BT LE 4.0 module on-board
Excellent as IoT gateway
Li-Ion Battery connector
MAIN FIELDS OF APPLICATION
Home
Automation
Robotics
Gaming
Internet of Things
Digital Signage Infotainment
Info Kiosks
PDA electronics
HMI
Point of Sales
Industrial
Automation and
Control
FEATURES
Processor
Qualcomm® Snapdragon™ 410E
Quad-core ARM® Cortex®-A53 at up to 1.2 GHz per core, 32bit and 64-bit capable
512KB L2 cache
Memory
Soldered down LP-DDR3 memory, up to 2GB
Graphics
Qualcomm® Adreno™ 306 GPU; up to 400 MHz 3D graphics
accelerator
OpenGL ES 3.0, OpenCL, content security, decreased power
consumption
Video
Interfaces
miniDP or embedded Display Port connector
LVDS connector
2-lane MIPI_CSI Camera interface
4-lane MIPI_CSI Camera interface
Video
Resolution
Up to 1920 x 1080
Mass Storage
Optional eMMC drive on-board
microSD Card slot
Networking
WiFi only or WiFi + BT LE 4.0 module on-board (factory
alternatives)
Optional 10/100 Ethernet port
USB
USB Client port on USB 2.0 micro-AB connector
1x USB 2.0 Host port on USB 2.0 Type-A socket
Optional:
2x USB 2.0 Host ports on USB 2.0 Type-A sockets +
1x USB 2.0 Host port on internal pin header (alternative
to Arduino interface)
Audio
Speaker + Microphone + Earphone interfaces on internal pin
header
Line Out + Mic In combo TRRS audio jack
1x I2S Audio interfaces on dedicated pin header
www.seco.com
46
Serial Ports
RS-232 or RS-485 connector (factory alternatives)
Optional debug UART on internal pin header
Other
Interfaces
2 x I2C
2 x SPI
Touch Screen dedicated connector
8 x GPI/Os
Optional Arduino Interface
Optional InfraRed receiver
Watchdog
Power
Supply
+12VDC
Li-Ion Battery connector
Operating
System
Linux
Android
Operating
0°C ÷ +60°C (Commercial version)
Temperature*
Dimensions
101.6 x 101.6 mm (4” x 4”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
HIGHLIGHTS
Single Board Computer
Single Board Computer
SBC-A44-pITX
Pico-ITX SBC with Intel® Atom™ E3800 family SOCs and ECC DDR3L memory
Limitless Embedded applications
Moon Island platform Intel IoT gateway solution
HIGHLIGHTS
Born for the industrial market with native -40° to +85 °C
temperature range
Designed for harsh environments
ECC memory support
For designs that require data coherence and security
Broad range of video and native serial connectivity options
Also for headless applications and IIoT smart gateways
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Ideal for critical applications
MAIN FIELDS OF APPLICATION
Transportation
Telco
Surveillance
Internet of
Things
Industrial
Automation and
Control
Info Kiosks
FEATURES
Processor
Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Intel® Atom™ E3805, Dual Core @1.33GHz, 1MB Cache, 3W TDP
Max Cores
4
Max Thread
4
Memory
Graphics
Up to 8GB on DDR3L-1333 ECC SO-DIMM Slot
(DDR3L-1333 with E3845 and E3827, DDR3L-1067 the others)
Integrated Intel® HD Graphics 4000 series controller
Dual independent display support
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
HW encoding of H.264, MPEG2 and MVC formats
Video
Interfaces
HDMI connector
Single / Dual Channel 18- / 24-bit LVDS connector
Video
Resolution
HDMI, resolution up to 1080p @ 60Hz
LVDS, resolution up to 1920 x 1200
Optional eMMC drive on-board
1 x standard SATA connector
Mass Storage
mini mSATA interface on miniCard slot (shared with miniPCI-e)
microSD Card slot
Networking
Dual Gigabit Ethernet connector
USB
2 x USB 3.0 Host ports on Dual Type-A socket
2 x USB 2.0 Host ports on internal pin header
1 x USB 2.0 Host port on miniPCI-e slot
PCI-e
Half miniPCI-e slot (shared with mSATA)
Audio
Optional HD Audio Codec Cirrus Logic CS4207
Mic In, Line out internal pin header connector
Other
Interfaces
Serial Ports
8 x GPI/O
FAN connector
Switch / LED Front Header
I2C connector with INT and RST# signals
2 x optional RS-232 / RS-422 / RS-485 Serial ports on internal
pin Header
Power
Supply
12VDC ± 5%
RTC Battery with lead cable and connector
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Microsoft® Windows Embedded Compact 7
Linux (32 / 64 bit)
Yocto
Operating
0°C ÷ +60°C (Commercial temperature)
Temperature* -40° ÷ +85°C (Industrial temperature)
Dimensions
72 x 100 mm (2.83” x 3.93”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
47
Single Board
Board Computer
Computer
SBC-949-pITX
Pico-ITX SBC with Intel® Atom™ Cedar View family Processors
Low-cost x86 fanless solution
HIGHLIGHTS
Space and power saving SBC with long term support
Impressive performance/power consumption ratio
Based on the Intel® Atom™ Cedar View dual core
N2000 and D2000 CPU family
Suitable for fanless and low budget applications
MAIN FIELDS OF APPLICATION
HMI
Energy
Digital Signage Infotainment
Robotics
Point of Sales
FEATURES
Processor
Intel® Atom™ D2550 @1.86GHz, 1MB Cache, 10W TDP
Intel® Atom™ N2800 @1.86GHz, 1MB Cache, 6.5W TDP
Intel® Atom™ N2600 @1.6GHz, 1MB Cache, 3.5W TDP
Max Cores
2
Max Thread
4
Chipset
Intel®
Memory
Up to 4GB DDR3 1066MHz SO-DIMM (up to 2GB with N2600)
Graphics
Video
Interfaces
Video
Resolution
NM10 Express Chipset
Integrated Intel® HD Graphics controller
Dual independent display support
Supports DirectX 9 Shader Model 3.0 and OpenGL rel. 3.0
HDMI connector
LVDS connector
VGA interface
N2xx CPU
D2550CPU
HDMI, CRT:
Up to 1920x1200
Up to 1920x1200
LVDS interface: Up to 1366x768
Up to 1440x900
Operating
System
Microsoft® Windows XP
Microsoft® Windows 7
Microsoft® Windows Embedded Standard 2009
Microsoft® Windows Embedded Standard 7
Microsoft® Windows Embedded Compact 7
Linux
Operating
0°C ÷ +60°C
Temperature*
Dimensions
72 x 100 mm (2.83” x 3.94”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
Mass Storage 2 x SATA connectors
Networking
USB
Audio
Up to 2 x Gigabit Ethernet connector
2 x USB 2.0 Type A
4 x internal USB 2.0 ports
HD Audio Codec Realtek ALC886
Mic In, Line out internal pin header
Other
Interfaces
FAN connector
Front Header Expansion connector
Power
Supply
+12VDC ± 10%
RTC Battery with lead cable and connector
www.seco.com
48
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
64-bit instruction set and Hyper Threading
Single Board Computer
Single Board Computer
SBC-992-pITX
SBC with AMD Embedded G-Series SoC in Pico-ITX form factor
RADEON GPU and Multi-core processing
HIGHLIGHTS
Smallest standard SBC in the market
Dual LAN
Connectivity-oriented
Multi-display support (LVDS - HDMI - eDP - VGA)
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
USB 3.0 support
MAIN FIELDS OF APPLICATION
Gaming
Digital Signage Infotainment
Thin Clients
Point of Sales
FEATURES
Processor
Max Cores
AMD GX-420CA, Quad Core @ 2.0GHz, 2MB L2 Cache, TDP 25W
AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W
AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W
AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W
AMD GX-210JA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 6W
Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V
(DDR3-1333MHz with GX-210HA, DDR3-1066MHz with
GX-210JA)
Embedded AMD HD RADEON GPUs
HD8400E @ 600MHz (GX-420CA), HD8330E @ 500MHz (GX-415GA)
HD8280E @ 450MHz (GX-217GA), HD8210E @ 300MHz (GX-210HA)
Graphics
HD8180 @ 225MHz (GX-210JA),
Dual independent display support
Supports DirectX® 11.1, OpenGL rel. 4.2 and OpenCL™ rel. 1.2
HDMI connector
Video
Single Channel 18bit LVDS connector or embedded Display Port
connector
Interfaces
CRT interface (requires external Video Adapter)
HDMI, resolution up to 1920 x 1200
LVDS, resolution up to 1600 x 900 (up to 1920 x 1200
Video
through external adapter)
Resolution
eDP, resolution up to 2560 x 1600
CRT, resolution up to 2048 x 1536
2 x standard SATA connectors
Mass Storage
microSD Card slot (combo connector)
USB
Audio
PCI-e
miniSIM slot (combo connector)
FAN connector
Front Header Expansion connector
Power
Supply
12VDC ± 10%
RTC Battery with lead cable and connector
Operating
System
Microsoft® Windows 7 (32 / 64 bit)
Microsoft® Windows 8.1 (32 / 64 bit)
Microsoft® Windows 10 (32 / 64 bit)
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Linux (32 / 64 bit)
4
Memory
Networking
Other
Interfaces
Operating
0°C ÷ +60°C
Temperature*
Dimensions
72 x 100 mm (2.83” x 3.94”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
Up to 2 x Gigabit Ethernet connector
2 x standard USB 3.0 Type A
4 x internal USB 2.0 ports
USB 2.0 interface on miniPCI-e Slot
HD Audio Codec Realtek ALC886
Mic In, Line out internal pin header connector
Half miniPCI-e slot
www.seco.com
49
Single Board
Board Computer
Computer
SBC-A62-J
Single Board Computer with NXP i.MX6 Processor
Flexible, Open-source, Industrial SBC
NXP
i.MX6 DualPlus
“Ready-to-use” and “ready-to-market”
cost-effective product which
exclusively supports SoC native features
NOW
AVAILABLE
HIGHLIGHTS
From the successful DIY community board,
born for the Industrial market
,
The first open source embedded board on the market
Fully scalable solution from high performance Quad
Core CPU to an energy-efficient Solo Core
Cost-effective
Operating Systems: Linux, Yocto, Android, WEC7
This board is available in 4 configurations:
MAIN FIELDS OF APPLICATION
Point of Sales
Digital Signage Infotainment
SBC-A62-J-SOLO
SBC-A62-J-LITE
SBC-A62-J-PLUS
SBC-A62-J-QUAD
Industrial Internet of
Things
FEATURES
Processor
NXP i.MX6 Family, based on ARM Cortex-A9 processors:
SBC-A62-J-SOLO: Single Core (i.MX6S) @1GHz
SBC-A62-J-LITE: Dual Core Lite (i.MX6DL) @1GHz
SBC-A62-J-PLUS: Dual Core Plus (i.MX6DP) @1GHz
SBC-A62-J-QUAD: Quad Core (i.MX6Q) @1GHz
Max Cores
4
Memory
Graphics
Video
Interfaces
Video
Resolution
Soldered on-board DDR3L memory***:
SBC-A62-J-SOLO: 512MB 32-bit interface
SBC-A62-J-LITE: 1GB 64-bit interface
SBC-A62-J-PLUS: 2GB 64-bit interface
SBC-A62-J-QUAD: 1GB 64-bit interface
Integrated Graphics, with up to 3 separate HW accelerators for
2D, OpenGL® ES2.0 3D
OpenVG™ accelerator (only SBC-A62-J-PLUS and SBC-A62J-QUAD)
HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
SBC-A62-J-SOLO and SBC-A62-J-LITE support up to 2
independent displays
SBC-A62-J-PLUS and SBC-A62-J-QUAD support up to 3
independent displays
1 x Dual Channel or 2 x Single Channel 18 / 24 bit LVDS
interface
HDMI interface 1.4
HDMI:
LVDS:
up to 1920 x 1080p
up to 1920 x 1200
4GB eMMC drive soldered on-board***
Mass Storage microSD Card slot
SBC-A62-J-PLUS and SBC-A62-J-QUAD: SATA connector
Gigabit Ethernet connector
Networking
Internal USB connector for Wi-Fi Module
2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
USB
USB micro-B Client port
SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD:
Audio
AC’97 Audio Codec Realtek ALC655 with Mic-In, Line-Out
audio Jacks
www.seco.com
50
Serial Ports
Other
Interfaces
Power
Supply
Operating
System
Debug UART interface, TTL voltage level.
SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD:
dedicated CAN Bus connector (Transceiver CAN 3.3V)
Other serial interfaces on the expansion connector:
SBC-A62-J-SOLO: 1 x Serial (TTL level) - 2 x Serial (RS-232) 2 x CAN (TTL level);
SBC-A62-J-LITE: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 1
x CAN (TTL level);
SBC-A62-J-PLUS and SBC-A62-J-QUAD: 1 x Serial (RS-485) 2 x Serial (RS-232) - 1 x CAN (TTL level)
Dedicated connector (I2C, GPIO signals) for external Touch
Screen controller; MIPI-CSI Camera connector;
Configurable* expansion connector with: Up to 28 GPIO - SPI
interface - SPDIF Audio interface - CAN interface (TTL level) SDIO interface - 3 x PWM - I2C - UARTs
+12VDC; Additional embedded Low Power RTC;
SBC-A62-J-SOLO and SBC-A62-J-LITE: internal i.MX6 Real
Time Clock (external battery required for time/date retention,
not included)
SBC-A62-J-PLUS and SBC-A62-J-QUAD: low power Real Time
Clock with onboard battery
Free Android and Linux community BSP available at UDOO.org
SECO Android (under development) and Linux BSP / WEC7 on
request.
Yocto Guideline valid for SECO BSP
Operating
0°C ÷ +60 °C (Commercial temp.)
Temperature** For Industrial temp. (-40°C ÷ +85°C) please contact us
Dimensions
110 x 86.5 mm (4.5” x 3.7”)
* Please note that some of these interfaces are factory options, other configurations
are made via SW.
** Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
*** For additional configurability please contact us
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
A flexible solution, with a configurable expansion
connector
Single Board Computer
Single Board Computer
SBC-B08
Single Board Computer with NXP i.MX 6SoloX Processor
All-in-one IoT hybrid computing solution
HIGHLIGHTS
, the SBC born for
NE O
Wireless connectivity
Linux or Android running on the Cortex®-A9 core
The ideal building block for any IoT project
Real-time OS on the Cortex®-M4 core
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
From the success of
Industry
MAIN FIELDS OF APPLICATION
Industrial Internet of
Things
Digital Signage Infotainment
Home
entertainment
Info Kiosks
Multimedia
devices
FEATURES
Processor
NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @
1GHz + Cortex®-M4 core @ 227MHz
Max Cores
1+1
Memory
32-bit DDR3L memory soldered on-board, up to 1GB
Graphics
Integrated Graphics Vivante GC400T, 2D and 3D HW
accelerator
OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported
Video
Interfaces
Single Channel 18- / 24- bit LVDS connector + Touch Screen
(I2C signals)
24-bit Parallel RGB Connector
Video ADC input (PAL and NTSC formats supported)
Video
Resolution
LVDS: up to 1366x768 @60Hz, 24bpp
RGB: up to 1920x1080p @60Hz, 24bpp
16MB NOR Quad-SPI Flash soldered on-board
Mass Storage eMMC soldered on-board, up to 8GB
μSD Card slot
Networking
Up to two Fast Ethernet RJ-45 connectors
WiFi (802.11 b / g / n) +BT LE combo module + antenna
on-board
USB
1 x USB 2.0 OTG port
3 x USB 2.0 Host ports on standard Type-A socket
1 x USB 2.0 Host port on internal pin header
Audio
I2S Audio interface on programmable pin header
S / PDIF interface (In and Out) on programmable pin header
Serial Ports
1 x CAN Port with CAN transceiver on dedicated connector,
optional
1 x CAN Port reconfigurable as GPIO
3 x UARTS on programmable pin header (optionally available
with RS-232 or RS-485 interface)
Other
Interfaces
2 x I2C dedicated connectors (one reserved for Touch Screen)
6 analog inputs for A / D Conversion
Programmable (*) expansion pin header connector, able to offer:
• Up to 26 GPIO
• SPI interface
• SPDIF Audio interface
• I2S Audio interface
• CAN interface (TTL level)
• 3 x PWM
• 2 x I2C
• 3 x UARTs (TTL, RS-232 or RS-485 interface)
(*) Please note that some of these interfaces are factory
options, other configurations are made via SW using the pin
multiplexing possibilities of the i.MX6SX processor.
Integrated
Sensors
Optional 9-Axis Motion Sensors (Accelerometer,
Magnetometer and Digital Gyroscope)
Power
Supply
+12VDC nominal voltage
Optional additional embedded Low Power RTC
Operating
System
Android
Linux
Operating
0°C ÷ +60°C (Commercial version)
Temperature*
Dimensions
89.5 x 87 mm (3.52” x 3.43”)
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
51
Modular HMI &
Boxed Solutions
Modular HMI
SYS-A62-10
Modular HMI
Embedded Panel with 10.1” LCD display based on the Multicore
NXP i.MX6 SoC family
Flexible, Open-source, Industrial system
HIGHLIGHTS
Flexible HMI solution
Long-endurance display (30K hours)
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Easy to integrate
MAIN FIELDS OF APPLICATION
Point of Sales
Digital Signage Infotainment
Industrial Internet
of Things
Vending
HMI
FEATURES
Multicore NXP i.MX6 processor family
SYS-A62-10/SOLO: i.MX6S Solo, 1 x ARM Cortex-A9 @1 GHz Core
SYS-A62-10/LITE: i.MX6DL Dual Lite, 2 x ARM Cortex-A9 @1 GHz Cores
SYS-A62-10/QUAD: i.MX6Q Quad, 4 x ARM Cortex-A9 @1 GHz Cores
On-board DDR3L soldered memory;
SYS-A62-10/SOLO: 512MB 32-bit
Memory
SYS-A62-10/LITE: 1GB 64-bit
SYS-A62-10/QUAD: 1GB 64-bit
2D, OpenGL® ES2.0 3D HW accelerator
Embedded
OpenVG™ accelerator (SYS-A62/10/QUAD only)
HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
Graphics
HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
10,1” LVDS display, resolution 1280 x 800, 30K hours life
Video
P-Cap (Projected Capacitive touch screen), with 2mm glass cover
Section
Glass Hardness IK08, Surface Hardness 8H (450g)
On-board 4GB eMMC drive
Mass Storage microSD Card Slot
SATA Connector (SYS-A62-10/QUAD only)
Gigabit Ethernet connector
Networking
Optional WiFi pluggable module
2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
USB
USB micro-B Client port
SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655
Audio
AC’97 Audio Codec with Mic-In, Line-Out audio Jacks
Dedicated Serial ports:
SYS-A62-10/SOLO: 2 x RS-232 ports
SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port
Serial Ports
SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port
Other serial ports can be realised on expansion connector (see
“Other interfaces”)
Processor
Other
Interfaces
Power
Supply
Operating
System
MIPI-CSI Camera connector
Programmable expansion connector with:
SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x
UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART
TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x
PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
+12VDC
SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.MX6 RTC,
require external battery for time/data retention
SYS-A62-10/QUAD: low power RTC with on-board battery
Linux
Yocto
Windows® Embedded Compact 7
Operating
Temperature
0°C ÷ 50°C
Dimensions
269,60 x 189,20 x 17,17 mm
www.seco.com
53
ModularHMI
HMI
Modular
SYS-B08-7
Embedded Panel with 7” LCD display based on the NXP i.MX 6SoloX Processor
Smart, compact, industrial 7” touch system built for IoT
HIGHLIGHTS
7” capacitive full-flat multi-touch screen
Lightweight and easy installation with integrated HW
accelerator, also suitable for 24-hr digital signage usage
Low power consumption and fanless system
Connectivity oriented
MAIN FIELDS OF APPLICATION
Industrial
Automation
Industrial Internet of
Things
Digital Signage Infotainment
Home
Automation
Info Kiosks
Multimedia
devices
HMI
FEATURES
Processor
NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @
1GHz + Cortex®-M4 core @ 200MHz
Memory
32-bit DDR3L memory soldered on-board, up to 1GB
Graphics
Integrated Graphics Vivante GC400T, 2D and 3D HW
accelerator
OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported
Video
Section
7” LVDS display, resolution 800 x 480, 50K hours life
5-point multitouch Capacitive touch screen, with AsaHi
tempered glass cover
Other
Interfaces
16MB NOR Quad-SPI Flash soldered on-board
Mass Storage eMMC soldered on-board, up to 8GB
μSD Card slot
Networking
Up to two Fast Ethernet RJ-45 connectors
WiFi (802.11 b / g / n) +BT LE combo module + antenna
on-board
USB
1 x USB 2.0 OTG port
3 x USB 2.0 Host ports on standard Type-A socket
1 x USB 2.0 Host port on internal pin header
Audio
I2S Audio interface on programmable pin header
S / PDIF interface (In and Out) on programmable pin header
Serial Ports
1 x CAN Port with CAN transceiver on dedicated connector,
optional
1 x CAN Port reconfigurable as GPIO
3 x UARTS on programmable pin header (optionally available
with RS-232 or RS-485 interface)
www.seco.com
54
I2C dedicated connector
6 analog inputs for A / D Conversion
Programmable (*) expansion pin header connector, able to offer:
• Up to 26 GPIO
• SPI interface
• SPDIF Audio interface
• I2S Audio interface
• CAN interface (TTL level)
• 3 x PWM
• 2 x I2C
• 3 x UARTs (TTL, RS-232 or RS-485 interface)
(*) Please note that some of these interfaces are factory
options, other configurations are made via SW using the pin
multiplexing possibilities of the i.MX6SX processor.
Power
Supply
+12VDC nominal voltage
Optional additional embedded Low Power RTC
Operating
System
Android
Linux
Operating
0°C ÷ +60°C (Commercial version)
Temperature*
Dimensions
189.60 x 121.40 x 28.20 mm
*Measured at any point of the heatspreader/heatsink during any and all times
(including start-up). Actual temperature will widely depend on application,
enclosure and/or environment. Upon customer to consider specific cooling
solutions for the final system.
www.seco.com
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Android and Linux ready for quick system deployment
Boxed Solutions
SYS-A62-GW
Boxed Solutions
Gateway solution based on the NXP i.MX6 Single Core Processor
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
Industrial IoT gateway solution
MAIN FIELDS OF APPLICATION
Home Automation
Telco
Surveillance
Internet of
Things
Industrial
Automation and
Control
Energy
Automation
Wireless
Technologies
FEATURES
Processor
i.MX6S Solo - Single core up to 1GHz
Memory
512MB 32-bit interface DDR3L memory soldered on-board
Mass Storage
Networking
USB
Serial Ports
Other
Interfaces
4GB eMMC drive soldered on-board
microSD Card slot
Gigabit Ethernet connector
Wi-Fi Module with external antenna
2 x USB 2.0 Type-A ports
USB micro-B Client port
Power
Supply
+12VDC;
Internal i.MX6 Real Time Clock (external battery required for
time/date retention, not included)
Operating
System
Linux IoT BSP
Operating
Temperature
0°C ÷ +60 °C (Commercial temp.)
Dimensions
146.6 x 95 x 41.8 mm (5.77” x 3.73” x 1.64”)
Internal debug UART interface, TTL voltage level
Configuration type A
20 poles 3.81 mm terminal block with:
1 x UART RS-485 Half Duplex
1 x UART RS-232
1 x UART CMOS 3.3V
2 x CAN Bus
1 x USB 2.0 Type-A connector or 1 x RJ-45 10/100 Ethernet
connector (factory alternatives)
Configuration type B
20 poles 3.81 mm terminal block with:
1 x UART RS-485 Half Duplex
1 x UART RS-232 (tx and rx)
8 x analog inputs (Vmax 12V Imax 80 mA)
4 x optoisolated digital inputs
1 x USB 2.0 Type-A connector
For further configurations please contact us
www.seco.com
55
145.17
Information subject to change.
Please visit www.seco.com to find the latest version of the SECO PRODUCT LINE datasheets.