LASYSTEMS - Brusselsesteenweg 208 - 1730 Asse - Belgium Phone: +32-2-4531312 - Fax: +32-2-4531763 E-mail: firstname.lastname@example.org Intel HNS2600BPS24 server/workstation motherboard (HNS2600BPS24) Compute Module HNS2600BPS24 PDF generated on: 30 March, 2018 Price details: Price excl. VAT: 900.18 € Eco fees: 0.37 € VAT 21 %: 189.12 € Product details: Product code: HNS2600BPS24 EAN: 5032037104067 Manufacturer: Intel 1,089.67 € * VAT included A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600BPS for large memory capability and flexible configuration options for the Intel® Server Chassis H2224XXLR3. Main specifications: Design Component for: Chassis type: Product family: Product series: Product codename: Server 2U Rack Intel compute module Intel® Compute Module HNS2600BP Family Buchanan Pass Processor Processor manufacturer: Processor socket: Number of processors supported: Processor number of cores supported: Number of QPI links: CPU configuration (max): Intel Socket P 2 4,6,8,10,12,14,16,18,20,22 2 2 Memory Supported memory types: Supported memory clock speeds: Number of DIMM slots: Maximum internal memory: ECC: Supported RDIMM clock speeds: Supported LRDIMM clock speeds: DDR4-SDRAM 2133,2400,2666 MHz 16 1280 GB Y 2133,2400,2666 MHz 2133,2400,2666 MHz Storage controllers Hard drive interface: RAID levels: Serial ATA 0,1,5,10,50 Back panel I/O ports USB 3.0 (3.1 Gen 1) Type-A ports quantity: VGA (D-Sub) ports quantity: Ethernet LAN (RJ-45) ports: Serial ports quantity: 2 1 2 1 Performance Trusted Platform Module (TPM): Y Trusted Platform Module (TPM) version: Integrated systems available: Rack-Friendly board: Integrated BMC with IPMI: InfiniBand: Embedded options available: Embedded USB (eUSB) SSD option: Motherboard ARK ID: 2.0 Y Y Y N N N 96350 Processor special features Y Intel Fast Memory Access: Y Intel Flex Memory Access: Y Intel I/O Acceleration Technology: Y support: Intelligent Platform Management Interface (IPMI) Y Intel Advanced Management Technology: Intel® AES New Instructions (Intel® AES-NI): Y Y Intel Intelligent Power Node Manager: Y Intel Trusted Execution Technology: Y Intel Server Management Software: Intel Remote Management Module Support: Y Y Intel Quiet Thermal Technology: Y Intel Efficient Power Technology: Y Intel Build Assurance Technology: Y Intel Server Customization Technology: Y Intel Rapid Storage Technology enterprise: Y Intel® Optane™ Memory Ready: Expansion slots PCI Express x16 (Gen 3.x) slots: PCI Express slots version: 2 3.0 Networking Ethernet LAN: Wi-Fi: Ethernet interface type: Y N Gigabit Ethernet Graphics On-board graphics adapter: N Weight & dimensions Width: Depth: 172.72 mm 485.14 mm BIOS BIOS type: UEFI Technical details N Intel Rapid Storage Technology: Custom 6.8" x 19.1" Form factor: N Halogen free: Intel Virtualization Technology for Directed I/O Y (VT-d): 96 Maximum number of PCI Express lanes: (1) 1U node tray(1) Intel Server Board S2600BPS(1) Power Docking Packaging content: Board FHWBPNPB24, (3) 40x56mm dual rotor managed fans FXX4056DRFAN2(1) 1U passive Rear heat sink – CPU #1 – CuAL – FXXHP78X108HS(1) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS(1) Air duct(1) External VGA port bracket (1) Slot 2 riser card w/80mm M.2 SSD slot. Required Items – Sold Separately: One (1) bridge board option AHWBPBGB24, AHWBPBGB24R OR AHWBPBGB24P; One or two Intel Xeon Scalable family,Up to Sixteen (16) DDR4 RDIMM/LRDIMM 50 bit Physical Address Extension (PAE): 12 Product type: 165 W Thermal Design Power (TDP): 2 USB ports quantity: Y ECC supported by processor: 255.94 GB/s Memory bandwidth supported by processor (max): 8 Total number of SATA connectors: 1280 GB Maximum internal memory supported by processor: Launched Status: *PLEASE NOTE: Every effort has been made to ensure the accuracy of all information contained herein. Lasystems makes no warranty expressed or implied with respect to accuracy of the information, including price, editorials or specifications. Lasystems or its suppliers shall not be liable for incidental, consequential or special damages arising from, or as a result of, any electronic transmission or the accuracy of the information contained herin, even if Lasystems has been advised of the possibility of such damages. Product and manufacturer names are used only for the purpose of identification.