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HP ProLiant DL360 Generation 4p Server
Maintenance and Service Guide
August 2005 (Second Edition)
Part Number 383863-002
© Copyright 2005 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft, Windows, and Windows NT are U.S. registered trademarks of Microsoft Corporation.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Linux is a U.S. registered trademark of Linus Torvalds.
August 2005 (Second Edition)
Part Number 383863-002
Audience assumptions
This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
Contents
Contents 3
Contents 4
Illustrated parts catalog
In this section
Customer self repair
What is customer self repair?
HP's customer self-repair program offers you the fastest service under either warranty or contract. It enables HP to ship replacement parts directly to you so that you can replace them. Using this program, you can replace parts at your own convenience.
A convenient, easy-to-use program:
•
An HP support specialist will diagnose and assess whether a replacement part is required to address a system problem. The specialist will also determine whether you can replace the part.
•
Replacement parts are express-shipped. Most in-stock parts are shipped the very same day you contact HP. You may be required to send the defective part back to HP, unless otherwise instructed.
•
Available for most HP products currently under warranty or contract. For information on the warranty service, refer to the HP website
( http://h18004.www1.hp.com/products/servers/platforms/warranty/index.html
).
For more information about HP's customer self-repair program, contact your local service provider. For the
North American program, refer to the HP website ( http://www.hp.com/go/selfrepair ).
Customer replaceable parts are identified in the following tables.
Illustrated parts catalog 5
Mechanical components
Item Description
a) Optical drive ejector assembly b) PCI card guide * c) Diskette blank * d) Optical device blank * a) Screws, 6-32X0.25, T10 (4) * b) Screw, 6-32X.187, T15 (4) * c) Screw, M3X0.5X4, T10 (4) * d) Expansion slot covers (2) * e) Power supply blanking panel *
Rack Mounting Hardware
5 Rack mounting hardware kit *
6 Cable management arm *
*Not shown
Spare Part
Number
Customer Self
Repair
361400-001 Yes
361396-001 Yes
361397-001 Yes
361397-001 Yes
360105-001 Yes
Illustrated parts catalog 6
System components
6
7
8
1
2
3
4
Item Description
System Components
Power supply fan assembly
Processor fan assembly
Hot-plug power supply, 460 W
PCI riser bracket, with PCI riser boards a) Intel® 3.40-GHz Xeon™ 2-MB L2 cache * b) Intel® 3.60-GHz Xeon™ 2-MB L2 cache * c) Intel® 3.80-GHz Xeon™ 2-MB L2 cache 800 MHz FSB * d) Intel® 3.00-GHz Xeon™ 2-MB L2 cache LV * e) Intel® 2.80-GHz Xeon™ 2-MB L2 cache * a) 3.6-V 500 mAh NiMh battery * b) Universal battery housing with cable
Smart Array 6i 128-MB DDR 40-bit memory module
Boards
System board, with processor cages and system battery
Spare Part
Number
Customer Self
Repair
361399-001 Yes
361390-001 Yes
361392-001 Yes
361387-001 Yes
381800-001 Yes
381799-001 Yes
381798-001 Yes
397864-001 Yes
403625-001 Yes
307132-001 Yes
349989-001 Yes
351518-001 Yes
Illustrated parts catalog 7
Item Description
10
11
12
9 a) SCSI models b) SATA models *
Power converter module
Backplanes a) SCSI backplane b) SATA backplane with data and power cables *
Optical device/diskette drive interface
Media Devices
Diskette drive, slimline, 1.44 MB a) CD-ROM drive, removable slimline, IDE, 24X b) DVD-ROM drive, removable slimline, 8X *
15
16
14
Memory
DIMM, PC2-3200 registered DDR2 SDRAM a) 512 MB * b) 1 GB * c) 2 GB (single rank) * d) 2 GB (dual rank) *
Hard drives
SCSI Ultra320 universal hot-plug hard drive a) 36.4-GB 15K rpm b) 72.8-GB 10K rpm * c) 72.8-GB 15K rpm * d) 146.8-GB 10K rpm *
SATA hot-plug hard drive a) 80-GB 7.2K rpm * b) 160-GB 7.2K rpm * c) 250-GB 7.2K rpm *
Cables
17 Diskette drive/optical drive cable *
Miscellaneous
18
19
20
AC power cord *
Battery, 3.3 V, lithium *
Country kit *
21 Return kit, pack box, and cushions *
*Not shown
Spare Part
Number
Customer Self
Repair
383699-001 Yes
383698-001 Yes
361393-001 Yes
305443-001 Yes
361389-001 Yes
361395-001 Yes
361402-001 Yes
228508-001 Yes
268795-001 Yes
359241-001 Yes
359242-001 Yes
359243-001 Yes
378021-001 Yes
289241-001 Yes
289042-001 Yes
289243-001 Yes
289044-001 Yes
353042-001 Yes
353043-001 Yes
353044-001 Yes
361391-001 Yes
187335-001 Yes
234556-001 Yes
361401-001 Yes
371695-001 Yes
Illustrated parts catalog 8
Removal and replacement procedures
In this section
Required tools
You need the following items for some procedures:
•
•
•
T-10 Torx screwdriver
T-15 Torx screwdriver
Diagnostics Utility
Safety considerations
Before performing service procedures, review all the safety information.
Removal and replacement procedures 9
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
To prevent electrostatic damage:
•
•
•
•
•
Avoid hand contact by transporting and storing products in static-safe containers.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
Place parts on a grounded surface before removing them from their containers.
Avoid touching pins, leads, or circuitry.
Always be properly grounded when touching a static-sensitive component or assembly.
Server warnings and cautions
Before installing a server, be sure that you understand the following warnings and cautions.
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Do not disable the power cord grounding plug. The grounding plug is an important
safety feature.
• Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.
• Unplug the power cord from the power supply to disconnect power to the equipment.
• Do not route the power cord where it can be walked on or pinched by items placed
against it. Pay particular attention to the plug, electrical outlet, and the point where
the cord extends from the server.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and
the internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.
Preparation procedures
To access some components and perform certain service procedures, you must perform one or more of the following procedures:
•
Extend the server from the rack ("
Extending the server from the rack " on page 11 ).
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.
•
•
For more information about telco rack solutions, refer to the RackSolutions.com website
( http://www.racksolutions.com/hp ).
Power down the server ("
Powering down the server " on page 11 ).
If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.
Remove the server from the rack.
If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.
Removal and replacement procedures 10
Powering down the server
WARNING: To reduce the risk of personal injury, electric shock, or damage to the
equipment, remove the power cord to remove power from the server. The front panel
Power On/Standby button does not completely shut off system power. Portions of the
power supply and some internal circuitry remain active until AC power is removed.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.
1.
Back up the server data.
2.
3.
Shut down the operating system as directed by the operating system documentation.
If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate on the front and rear panels of the server.
4.
5.
6.
Press the Power On/Standby button to place the server in standby mode. When the server activates standby power mode, the system power LED changes to amber.
If the server is installed in a rack, locate the server by identifying the illuminated rear UID LED button.
Disconnect the power cords.
The system is now without power.
Extending the server from the rack
NOTE: If the optional cable management arm option is installed, you can extend the server without powering down the server or disconnecting peripheral cables and power cords. These steps are only necessary with the standard cable management solution.
1.
2.
3.
4.
Power down the server ("
Powering down the server " on page 11 ).
Disconnect all peripheral cables and power cords from the server rear panel.
Loosen the thumbscrews that secure the server faceplate to the front of the rack.
Extend the server on the rack rails until the server rail-release latches engage.
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the
rack is adequately stabilized before extending a component from the rack.
WARNING: To reduce the risk of personal injury, be careful when pressing the server
rail-release latches and sliding the server into the rack. The sliding rails could pinch your
fingers.
5.
After performing the installation or maintenance procedure, slide the server back into the rack:
Removal and replacement procedures 11
a.
Press the server rail-release latches and slide the server fully into rack.
6. b.
Secure the server by tightening the thumbscrews.
Reconnect the peripheral cables and power cords.
Accessing the product rear panel
NOTE: To access some components, you may need to remove the cable management arm.
To open the arm:
Removal and replacement procedures 12
To close the arm:
Removing the access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and
the internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.
1.
Power down the server if the standard cable management solution is installed ("
Powering down the server " on page 11 ).
NOTE: If the optional cable management arm is installed, you can extend the server and perform hot-plug installation or maintenance procedures without powering down the server.
2.
3.
Extend the server from the rack, if applicable ("
Extending the server from the rack " on page 11 ).
Lift up on the hood latch handle and remove the access panel.
Hard drive blank
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
1.
Remove one of the following:
Removal and replacement procedures 13
•
Remove the SCSI hard drive blank.
•
Remove the SATA hard drive blank.
To replace the blank, slide the blank into the bay until it locks into place.
Hard drive
CAUTION: Always power down the server if the boot partition resides on the drive you are replacing or if you are replacing the only drive in the server.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
1.
Determine the status of the hard drive from the hot-plug hard drive LEDs ("
LED combinations " on page 51 , " Hot-plug SCSI hard drive LEDs " on page 51 ).
2.
3.
Back up all server data on the hard drive.
Remove one of the following:
Removal and replacement procedures 14
•
Remove the SCSI hard drive.
•
Remove the SATA hard drive.
IMPORTANT: When SATA hard drives are installed, SATA LED functionality and SATA hot-plug capability are not supported currently.
To replace the drive, slide the drive into the bay until the latch mechanism engages the server chassis, then close the latch handle to lock the drive in the server chassis.
Diskette drive blank
1.
2.
3.
Power down the server ("
Powering down the server " on page 11 ).
Extend the server from the rack ("
Extending the server from the rack " on page 11 ).
Remove one of the following from the left hard drive bay:
•
•
Hard drive blank (on page
Hard drive (on page
Removal and replacement procedures 15
4.
5.
Use a Torx T-10 screwdriver to remove the locking screw.
Remove the diskette drive blank.
To replace the component, reverse the removal procedure.
Diskette drive
1.
2.
3.
4.
5.
Power down the server ("
Powering down the server " on page 11 ).
Extend the server from the rack. ("
Extending the server from the rack " on page 11 )
Remove one of the following from the left hard drive bay:
•
•
Hard drive blank (on page
Hard drive (on page
Use a Torx T-10 screwdriver to remove the locking screw.
Remove the diskette drive.
To replace the component, reverse the removal procedure.
Removal and replacement procedures 16
Optical device blank
IMPORTANT: The ejector button is recessed to prevent accidental ejection; it may be helpful to use a pen or similar shaped object to access the button.
1.
2.
Press the ejector button.
Remove the optical device blank.
To replace the blank, slide the blank into the bay until it locks into place.
Optical device
1.
Power down the server ("
Powering down the server " on page 11 ).
IMPORTANT: The ejector button is recessed to prevent accidental ejection; it may be helpful to use a pen or similar shaped object to access the button.
2.
Press the ejector button.
Removal and replacement procedures 17
3.
Remove the optical device.
To replace the drive, slide the drive into the bay until it clicks.
Optical device ejector
1.
2.
3.
4.
5.
6.
7.
8.
Power down the server ("
Powering down the server " on page 11 ).
Remove all hard drives ("
Hard drive " on page 14 ) and the hard drive blank (on page
Eject the optical device (on page
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
Remove the diskette drive ("
Diskette drive " on page 16 ).
Use a T-10 Torx screwdriver to remove the screws that secure the optical device ejector to the server chassis.
Press the tab on the side of the optical device ejector to release it from the chassis.
Remove the optical device ejector.
Removal and replacement procedures 18
To replace the component, reverse the removal procedure.
Hot-plug AC power supply
This procedure assumes that the server is configured with two power supplies.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
1.
Perform one of the following:
•
If a conventional cable management solution is in place, unfasten the cable management solution to access the power supply bays.
•
If the cable management arm is in place, access the rear panel ("
2.
3.
Disconnect the power cord.
Press the power supply release lever, then pull the power supply from the server.
To replace the component, reverse the removal procedure.
Power supply fan assembly
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.
1.
2.
Power down the server ("
Powering down the server " on page 11 ).
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
3.
4.
5.
Remove the access panel ("
Removing the access panel " on page 13 ).
On models equipped with SATA drives, remove the SATA cable from the cable clip. For cable locations, refer to the SATA cable routing information ("
SATA cable routing " on page 36 ).
Press the latches and lift to release the power supply fan assembly from the server.
Removal and replacement procedures 19
6.
Remove the component from the server.
CAUTION: When replacing the component, be sure the power converter module is properly seated in the server chassis.
To replace the component, reverse the removal procedure.
Processor fan assembly
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.
To remove the component:
1.
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
2.
3.
4.
Remove the access panel ("
Removing the access panel " on page 13 ).
Loosen the thumbscrew that secures the processor fan assembly to the server.
Push on the sheet metal tab near the thumbscrew to separate the fan tray connector from the system board connector.
Removal and replacement procedures 20
5.
Remove the component from the server.
To replace the component, reverse the removal procedure.
Optical device and diskette drive interface
5.
6.
7.
8.
9.
1.
2.
3.
4.
Power down the server ("
Powering down the server " on page 11 ).
Remove all hard drives and hard drive blanks ("
Eject the optical device ("
Optical device " on page 17 ).
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
Remove the diskette drive ("
Diskette drive " on page 16 ).
Disconnect the cable from the optical device and diskette drive interface board.
Use a T-15 Torx screwdriver to remove the two screws securing the board to the server chassis.
Slide the board toward the front edge of the server, lift up, then slide the board toward the rear of the server to remove the component.
Removal and replacement procedures 21
To replace the component, reverse the removal procedure.
SCSI backplane
5.
6.
7.
1.
2.
3.
4.
Power down the server ("
Powering down the server " on page 11 ).
Remove all hot-plug SCSI hard drives ("
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
Remove the power supply fan module ("
Processor fan assembly " on page 20 ).
Disconnect the cable from the optical device and diskette drive interface board.
Remove the component from the server.
To replace the component, reverse the removal procedure.
SATA backplane
1.
2.
3.
4.
5.
6.
7.
Power down the server ("
Powering down the server " on page 11 ).
Remove all SATA hard drives ("
Eject the optical device ("
Optical device " on page 17 ).
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
Remove the optical device and diskette drive interface ("
Optical device and diskette drive interface " on page 21 ).
Disconnect all cables connected to the SATA backplane. For cable locations, refer to the SATA cable
routing (on page 36 ) information.
Removal and replacement procedures 22
8.
Remove the component from the server.
To replace the component, reverse the removal procedure.
PCI riser board assembly
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all
AC power cords before removing or installing the PCI riser cage.
IMPORTANT: Be sure that all DIMM slot latches are closed to provide adequate clearance before removing the PCI riser board assembly with a half-length expansion board.
1.
2.
3.
4.
Power down the server ("
Powering down the server " on page 11 ).
Extend the server from the rack, if applicable ("
Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
Remove the PCI riser board assembly:
a.
Disconnect any internal or external cables connected to any existing expansion boards.
b.
Loosen the four PCI riser board assembly thumbscrews.
Removal and replacement procedures 23
c.
Lift the front of the assembly slightly and unseat the riser boards from the PCI riser board connectors.
To replace the component, reverse the removal procedure.
PCI expansion slot definitions
PCI-X expansion slot 1
PCI-X expansion slot 2
PCI Express expansion slot 1 (optional)
PCI Express expansion slot 2 (optional)
Half-length
Full-length
Half-length
Full-length
133 MHz, 3.3 V 64-bit
133 MHz, 3.3 V 64-bit x8 x1, x4, or x8 x8 x1, x4, or x8
PCI-X or PCI Express expansion board
1.
Remove the PCI Riser Board Assembly ("
PCI riser board assembly " on page 23 ).
Removal and replacement procedures 24
2.
Remove any expansion board installed in the assembly.
To replace the component, reverse the removal procedure.
PCI riser board
1.
2.
3.
Remove the PCI Riser Board Assembly ("
PCI riser board assembly " on page 23 ).
Remove any expansion board installed in the assembly ("
PCI-X or PCI Express expansion board " on page 24 ).
Remove the applicable PCI riser boards from the assembly:
IMPORTANT: When removing the two parts of the riser board, pay attention to the orientation of the slots on each side. This information is important for subsequent procedures.
a.
Remove the riser board with the slot for full-length expansion boards.
b.
Repeat the previous step for the riser board with the slot for half-length expansion boards, if needed.
Removal and replacement procedures 25
To replace the component, reverse the removal procedure.
Power converter module
1.
2.
3.
4.
5.
Power down the server ("
Powering down the server " on page 11 ).
Remove all hot-plug power supplies ("
Hot-plug AC power supply " on page 19 ).
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
Disconnect all internal power cables.
6.
7.
Remove the fan module ("
Processor fan assembly " on page 20 ).
Slide the power converter module toward the back of the server, then lift the power converter module from the server.
NOTE: Cables are removed for clarity.
To replace the component, reverse the removal procedure.
Removal and replacement procedures 26
Battery-Backed Write Cache Enabler
The Battery-Backed Write Cache Enabler, also called the battery pack, works with the cache module to provide transportable data protection, increase overall controller performance, and maintain any cached data for up to 72 hours. The NiMH batteries in the battery pack are continuously recharged through a trickle-charging process whenever the system power is on. Under normal operating conditions, the battery pack lasts for 3 years before replacement is necessary.
CAUTION: To prevent damage to the equipment or server malfunction, do not add or remove the battery module while an array capacity expansion, RAID level migration, or stripe size migration is in progress.
IMPORTANT: The battery module may have a low charge when installed. In this case, a POST error message is displayed when the server is powered up, indicating that the battery module is temporarily disabled. No action is necessary on your part. The internal circuitry automatically recharges the batteries and enables the battery module. This process may take up to 4 hours. During this time, the array controller will function properly, but without the performance advantage of the battery module.
NOTE: The data protection and the time limit also apply if a power outage occurs. When power is restored to the system, an initialization process writes the preserved data to the hard drives.
1.
2.
3.
Power down the server ("
Powering down the server " on page 11 ).
Extend the server from the rack, if applicable ("
Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
IMPORTANT: Data in the BBWCE will be erased when you disconnect the battery.
4.
Disconnect the battery module cable from the BBWCE and from the Smart Array 6i memory connector on the system board.
5.
6.
7.
Remove the battery module cable from the cable clip on the system board.
Remove the Smart Array 6i memory module.
Turn the quarter-turn fasteners counter-clockwise to unlock the module.
Removal and replacement procedures 27
8.
Lift the battery module from the server.
9.
Remove the battery from the module.
To replace the component, reverse the removal procedure.
Memory options
You can expand server memory by installing PC2-3200 DDR2 SDRAM DIMMs. The system supports up to six ECC Registered DDR2 SDRAM DIMMs.
NOTE: The Advanced Memory Protection option in RBSU provides additional memory protection beyond
Advanced ECC. By default, the server is set to Advanced ECC Support. Refer to "ROM-Based Setup
Utility ("
HP ROM-Based Setup Utility " on page 38 )," on the Documentation CD, for more information.
The server supports two types of memory configurations:
•
Standard memory configuration for maximum performance with up to 12 GB of active memory (six
2-GB memory modules)
•
Online spare memory configuration for maximum availability with up to 6 GB of active memory while simultaneously supporting up to 6 GB of online spare memory
NOTE: When configuring the memory sub-system to run in Online Spare mode, only single rank DIMMs can be installed in the system. Online Spare Mode will not work with dual rank DIMMs installed in the system.
Single- and Dual-rank DIMMs
PC2-3200 DIMMs can either be single- or dual-rank. While it is not normally important for you to differentiate between these two types of DIMMs, certain DIMM configuration requirements are based on these classifications.
Certain configuration requirements exist with single- and dual-rank DIMMs that allow the architecture to optimize performance. A dual-rank DIMM is similar to having two separate DIMMs on the same module.
Although only a single DIMM module, a dual-rank DIMM acts as if it were two separate DIMMs. The primary reason for the existence of dual-rank DIMMs is to provide the largest capacity DIMM given the current DIMM technology. If the maximum DIMM technology allows for creating 2-GB single-rank DIMMs, a dual-rank DIMM using the same technology would be 4-GB.
Removal and replacement procedures 28
DIMM installation guidelines
You must observe the following guidelines when installing additional memory:
•
•
•
•
•
DIMMs installed in the server must be Registered DDR2 DRAM, 2.5 volts, 64 bits wide, and ECC.
DIMMs in slots 1A and 2A must match and must be installed as a pair.
DIMMs in slots 3B and 4B must match and must be installed as a pair.
DIMMs in slots 5C and 6C must match and must be installed as a pair.
All DIMMs installed must be the same speed. Do not install DIMM modules supporting different speeds.
•
Install DIMMs into both slots within a single bank. DIMMs must be installed in order. Upgrade memory by installing DIMM pairs into banks in sequential bank order, starting with bank B.
DIMM
1.
2.
3.
Power down the server ("
Powering down the server " on page 11 ).
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
NOTE: The server ships with at least two DIMMs installed in DIMM slots 1A and 2A.
4.
If necessary, remove the PCI Riser Board Assembly ("
PCI riser board assembly " on page 23 ).
5.
Remove the DIMM.
CAUTION: Be sure to install DIMMs in the proper configuration. Refer to the Documentation CD.
CAUTION: Use only Compaq branded or HP DIMMs. DIMMs from other sources may adversely affect data integrity.
IMPORTANT: DIMMs do not seat fully if turned the wrong way.
To replace a DIMM, align the DIMM with the slot and insert the DIMM firmly. When fully seated, the
DIMM slot latches lock into place.
Removal and replacement procedures 29
Processor
To remove a processor:
1.
Power down the server ("
Powering down the server " on page 11 ).
2.
3.
4.
Extend the server from the rack, if applicable ("
Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
Rotate the baffle upward.
5.
Release the processor retaining clips and processor locking lever.
6.
Lift the heatsink and processor from the server.
To install the processor in the server:
CAUTION: To prevent thermal instability and damage to the server, do not separate the processor from the heatsink. The processor, heatsink, and retaining clip make up a single assembly.
CAUTION: To prevent possible server malfunction and damage to the equipment, do not mix processors of different types.
Removal and replacement procedures 30
1.
Remove the protective cover from the processor.
2.
Align the holes in the heatsink with the guiding pegs on the processor cage.
CAUTION: To prevent possible server malfunction or damage to the equipment, be sure to align the processor pins with the corresponding holes in the socket.
Removal and replacement procedures 31
3.
Install the processor and close the processor locking lever and processor retaining clips.
4.
5.
Rotate the baffle into position
Install the access panel ("
Extending the server from the rack " on page 11 ).
Battery
If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack
is not properly handled. To reduce the risk of personal injury:
• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or
water.
• Replace only with the spare designated for this product.
1.
2.
3.
4.
Power down the server ("
Powering down the server " on page 11 ).
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
Remove the PCI riser cage ("
PCI riser board assembly " on page 23 ).
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all
AC power cords before removing or installing the PCI riser cage.
Removal and replacement procedures 32
5.
Remove the battery.
IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU.
To replace the component, reverse the removal procedure.
For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
System board
1.
2.
3.
4.
Power down the server ("
Powering down the server " on page 11 ).
Extend or remove the server from the rack (" Extending the server from the rack " on page 11 ).
Remove the access panel ("
Removing the access panel " on page 13 ).
Remove the PCI Riser Board Assembly ("
PCI riser board assembly " on page 23 ).
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all
AC power cords before removing or installing the PCI riser cage.
5.
6.
Remove the processor fan module ("
Processor fan assembly " on page 20 ).
Remove the BBWCE ("
Battery-Backed Write Cache Enabler " on page 27 ).
7.
8.
Remove any DIMMs ("
Remove the processors ("
9.
Disconnect all cables connected to the system board. For additional information, refer to "Server
Cabling (on page
Removal and replacement procedures 33
10.
Remove the system board.
IMPORTANT: If replacing the system board or clearing NVRAM, you must re-enter the server serial number
through RBSU (" Re-entering the server serial number and product ID " on page 34 ).
To replace the component, reverse the removal procedure.
Re-entering the server serial number and product ID
After you replace the system board, you must re-enter the server serial number and the product ID.
1.
During the server startup sequence, press the F9 key to access RBSU.
2.
Select the Advanced Options menu.
3.
Select Serial Number. The following warning is displayed:
Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis.
4.
Press the Enter key to clear the warning.
5.
Enter the serial number.
6.
Select Product ID. The following warning is displayed.
Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.
7.
Enter the product ID and press the Enter key.
8.
9.
Press the Escape key to close the menu.
Press the Escape key to exit RBSU.
10.
Press the F10 key to confirm exiting RBSU. The server will automatically reboot.
Removal and replacement procedures 34
Server cabling
In this section
Cabling overview
This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance.
For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website ( http://www.hp.com/products/servers/platforms ).
Server cable routing
CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
Server cabling 35
SATA cable routing
CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
Server cabling 36
Diagnostic tools
In this section
SmartStart software
SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent way to deploy server configuration. SmartStart has been tested on many ProLiant server products, resulting in proven, reliable configurations.
•
•
•
•
•
SmartStart assists the deployment process by performing a wide range of configuration activities, including:
Configuring hardware using embedded configuration utilities, such as RBSU and ORCA
Preparing the system for installing "off-the-shelf" versions of leading operating system software
Installing optimized server drivers, management agents, and utilities automatically with every assisted installation
Testing server hardware using the Insight Diagnostics Utility ("
HP Insight Diagnostics " on page
Installing software drivers directly from the CD. With systems that have internet connection, the
SmartStart Autorun Menu provides access to a complete list of ProLiant system software.
•
Enabling access to the Array Configuration Utility, Array Diagnostic Utility, and Erase Utility
SmartStart is included in the HP ProLiant Essentials Foundation Pack. For more information about
SmartStart software, refer to the HP ProLiant Essentials Foundation Pack or the HP website
( http://www.hp.com/servers/smartstart ).
SmartStart Scripting Toolkit
The SmartStart Scripting Toolkit is a server deployment product that delivers an unattended automated installation for high-volume server deployments. The SmartStart Scripting Toolkit is designed to support
Diagnostic tools 37
ProLiant BL, ML, and DL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these new tools to build an automated server deployment process.
Using SmartStart technology, the Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are used to automate many of the manual steps in the server configuration process. This automated server configuration process cuts time from each server deployed, making it possible to scale server deployments to high volumes in a rapid manner.
For more information, and to download the SmartStart Scripting Toolkit, refer to the HP website
( http://www.hp.com/servers/sstoolkit ).
HP Instant Support Enterprise Edition
ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and devices, a feature of HP support. ISEE provides continuous hardware event monitoring and automated notification to identify and prevent potential critical problems. Through remote diagnostic scripts and vital system configuration information collected about your systems, ISEE enables fast restoration of your systems.
Install ISEE on your systems to help mitigate risk and prevent potential critical problems.
For more information on ISEE, refer to the HP website
( http://www.hp.com/hps/hardware/hw_enterprise.html
).
To download HP ISEE, visit the HP website ( http://www.hp.com/hps/hardware/hw_downloads.html
).
For installation information, refer to the HP ISEE Client Installation and Upgrade Guide
( ftp://ftp.hp.com/pub/services/hardware/info/isee_client.pdf
).
Option ROM Configuration for Arrays
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign
RAID levels, and establish online spare configurations.
The utility also provides support for the following functions:
•
•
•
•
Reconfiguring one or more logical drives
Viewing the current logical drive configuration
Deleting a logical drive configuration
Setting the controller to be the boot controller
If you do not use the utility, ORCA will default to the standard configuration.
For more information regarding array controller configuration, refer to the controller user guide.
For more information regarding the default configurations that ORCA uses, refer to the HP ROM-Based
Setup Utility User Guide on the Documentation CD.
HP ROM-Based Setup Utility
•
•
•
•
•
RBSU, an embedded configuration utility, performs a wide range of configuration activities that may include:
Configuring system devices and installed options
Displaying system information
Selecting the primary boot controller
Configuring memory options
Language selection
Diagnostic tools 38
For more information on RBSU, refer to the HP ROM-Based Setup Utility User Guide on the Documentation
CD or the HP website ( http://www.hp.com/servers/smartstart ).
ROMPaq utility
Flash ROM enables you to upgrade the firmware (BIOS) with system or option ROMPaq utilities. To upgrade the BIOS, insert a ROMPaq diskette into the diskette drive and boot the system.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available ROM revisions. This procedure is the same for both system and option ROMPaq utilities.
For more information about the ROMPaq utility, refer to the HP website
( http://www.hp.com/servers/manage ).
System Online ROM flash component utility
•
•
The Online ROM Flash Component Utility enables system administrators to efficiently upgrade system or controller ROM images across a wide range of servers and array controllers. This tool has the following features:
Works offline and online
Supports Microsoft® Windows NT®, Windows® 2000, Windows® Server 2003, Novell Netware, and Linux operating systems
IMPORTANT: This utility supports operating systems that may not be supported by the server. For operating systems supported by the server, refer to the HP website ( http://www.hp.com/go/supportos ).
•
•
Integrates with other software maintenance, deployment, and operating system tools
Automatically checks for hardware, firmware, and operating system dependencies, and installs only the correct ROM upgrades required by each target server
To download the tool and for more information, refer to the HP website
( http://h18000.www1.hp.com/support/files/index.html
).
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
•
From within HP SIM ("
HP Systems Insight Manager " on page 40 )
•
From within Survey Utility
•
From within operating system-specific IML viewers
•
•
•
For NetWare: IML Viewer
For Windows®: IML Viewer
For Linux: IML Viewer Application
•
From within HP Insight Diagnostics (on page
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.
Diagnostic tools 39
Integrated Lights-Out technology
The iLO subsystem is a standard component of selected ProLiant servers that provides server health and remote server manageability. The iLO subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO independent of the host server and its operating system. The iLO subsystem provides remote access to any authorized network client, sends alerts, and provides other server management functions.
Using iLO, you can:
•
•
•
•
Remotely power up, power down, or reboot the host server.
Send alerts from iLO regardless of the state of the host server.
Access advanced troubleshooting features through the iLO interface.
Diagnose iLO using HP SIM through a web browser and SNMP alerting.
For more information about iLO features, refer to the iLO documentation on the Documentation CD or on the HP website ( http://www.hp.com/servers/lights-out ).
Automatic Server Recovery
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System
Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.
ASR increases server availability by restarting the server within a specified time after a system hang or shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or through RBSU.
HP Systems Insight Manager
HP SIM is a web-based application that allows system administrators to accomplish normal administrative tasks from any remote location, using a web browser. HP SIM provides device management capabilities that consolidate and integrate management data from HP and third-party devices.
IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for processors,
SCSI hard drives, and memory modules.
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or the HP SIM website ( http://www.hp.com/go/hpsim ).
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the
OS is not running. To run this utility, launch the SmartStart CD.
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft® Windows® and
Linux versions, the utility helps to ensure proper system operation.
Diagnostic tools 40
For more information or to download the utility, refer to the HP website
( http://www.hp.com/servers/diags ).
USB support
HP provides both standard USB support and legacy USB support. Standard support is provided by the operating system through the appropriate USB device drivers. HP provides support for USB devices before the operating system loads through legacy USB support, which is enabled by default in the system ROM.
HP hardware supports USB version 1.1 or 2.0, depending on the version of the hardware.
•
•
•
•
•
Legacy USB support provides USB functionality in environments where USB support is normally not available. Specifically, HP provides legacy USB functionality for:
POST
RBSU
Diagnostics
DOS
Operating environments which do not provide native USB support
For more information on ProLiant USB support, refer to the HP website
( http://h18004.www1.hp.com/products/servers/platforms/usb-support.html
).
Internal USB functionality
An internal USB connector is available for use with USB drive keys only. The internal connector shares the same bus with the front external USB connector, and connecting a device to both the front internal and front external USB connectors is not supported. This solution provides for use of a permanent boot drive from a USB drive key installed in the front internal connector, avoiding issues of clearance on the front of the rack and physical access to secure data.
For additional security, you can disable the front USB connectors through RBSU. Disabling external USB ports in RBSU disables both the front external and front internal USB ports.
Diagnostic tools 41
Server component identification
In this section
Front panel components
Item Description
1 Diskette drive bay
3
4
Front USB port
Hard drive bay 0
Server component identification 42
Item Description
5 Hard drive bay 1
Front panel LEDs and buttons
Item Description
1 Power On/Standby button and system power LED
2
3
4
5
UID button/LED
Internal health LED
External health LED
(power supply)
NIC 1 link/activity LED
Status
Green = System is on.
Amber = System is shut down, but power is still applied.
Off = Power cord is not attached, power supply failure has occurred, no power supplies are installed, facility power is not available, or the DC-to-DC converter is not installed.
Blue = Identification is activated.
Flashing blue = System is being remotely managed.
Off = Identification is deactivated.
Green = System health is normal.
Amber = System is degraded. To identify the component in a
degraded state, refer to system board LEDs (on page 47 ).
Red = System critical. To identify the component in a critical state,
refer to system board LEDs (on page 47 ).
Off = System health is normal (when in standby mode).
Green = Power supply health is normal.
Amber = Power redundancy failure occurred.
Off = Power redundancy failure has occurred. When the server is in standby mode, power supply health is normal.
Green = Network link exists.
Flashing green = Network link and activity exist.
Off = No link to network exists.
If power is off, view the LEDs on the RJ-45 connector for status by
referring to the rear panel LEDs (" Rear panel LEDs and buttons " on page 45 ).
Server component identification 43
Item Description
6 NIC 2 link/activity LED
Rear panel components
Status
Green = Network link exists.
Flashing green = Network link and activity exist.
Off = No link to network exists.
If power is off, the front panel LED is not active. View the LEDs on the RJ-45 connector for status by referring to the rear panel LEDs
("
Rear panel LEDs and buttons " on page 45 ).
2
6
7
8
3
4
5
Item Description
1 PCI-X expansion slot 1, 64-bit/133-MHz 3.3V (optional
PCI Express slot 1, x8)
PCI-X expansion slot 2, 64-bit/133-MHz 3.3V (optional
PCI Express slot 2, x8)
Power supply bay 2
Power supply bay 1 (populated)
Rear USB connector
10/100/1000 NIC 2
10/100/1000 NIC 1 iLO management port
Server component identification 44
Rear panel LEDs and buttons
Item Description Status
1 iLO activity Green = Activity exists.
Flashing green = Activity exists.
Off = No activity exists.
2 iLO link Green = Link exists.
Off = No link exists.
NIC 2 activity Flashing green = Activity exists.
Off = No link exists.
7
NIC 2 link
NIC 1 link
NIC 1 activity
UID button/LED
Off = No link exists.
Off = No link exists.
Flashing green = Activity exists.
Off = No activity exists.
Blue = Identification is activated.
Flashing blue = System is being managed remotely.
Off = Identification is deactivated.
Server component identification 45
System board components
Item Description
1 DIMM slots (1-6)
2
3
4
5
NMI switch
System maintenance switch
(SW2)
Processor 1 socket
Processor 2 socket
6
7
Processor zone fan module connector
SCSI backplane connector*
8 Optical device connector
* For SCSI models only
Item Description
9 Power supply connector
10
11
12
13
14
Power supply signal connector
Smart Array 6i memory module connector*
Remote management connector
SATA connectors (SATA model only)
PCI riser board assembly connector (for slot 2 riser board)
15
16
PCI riser board assembly connector (for slot 1 riser board)
System battery
System maintenance switch
S1 Off Off = iLO security is enabled.
On = iLO security is disabled. changed.
On = System configuration is locked.
Server component identification 46
S6 Off
Off, Off enabled.
On = Power-on password is disabled.
Off = No function
On = ROM treats the system configuration as invalid.
Debug LEDs S7, S8
NMI switch
The NMI switch allows administrators to perform a memory dump before performing a hard reset. Crash dump analysis is an essential part of eliminating reliability problems, such as hangs or crashes in operating systems, device drivers, and applications. Many crashes freeze a system, requiring you to do a hard reset. Resetting the system erases any information that would support root cause analysis.
Systems running Microsoft® Windows® operating systems experience a blue screen trap when the operating system crashes. When this happens, Microsoft® recommends that system administrators perform an NMI event by pressing a dump switch. The NMI event enables a hung system to become responsive again.
System board LEDs
Item LED Status
1 DIMM 6C failure Amber = DIMM has failed.
Off = DIMM is operating normally.
2 DIMM 5C failure
3 DIMM 4B failure
Amber = DIMM has failed.
Off = DIMM is operating normally.
Amber = DIMM has failed.
Off = DIMM is operating normally.
Server component identification 47
Item LED Status
4
5
DIMM 3B failure
DIMM 2A failure
Amber = DIMM has failed.
Off = DIMM is operating normally
Amber = DIMM has failed.
Off = DIMM is operating normally.
6 DIMM 1A failure Amber = DIMM has failed.
Off = DIMM is operating normally
8
9
10
11
12
13
14
Processor 1 failure
PPM 1 failure
PPM 2 failure
Processor 2 failure
Power supply signal connector interlock failure
Standby power good
Power supply fan module failure critical temperature level.
Off = Temperature is OK.
.Amber = Processor has failed.
Off = Processor is operating normally.
Amber = PPM has failed.
Off = PPM is operating normally.
Amber = PPM has failed.
Off = PPM is operating normally
Amber = Processor has failed.
Off = Processor is operating normally.
Amber = Power supply signal cable is not connected.
Off = Power supply signal cable is connected.
Green = Auxiliary power is applied.
Off = Auxiliary power is not applied.
Amber = One fan in this module has failed.
Red = Multiple fans in this module have failed.
Off = All fans in this module are operating normally.
16
17
Online spare memory
Riser interlock
User Guide on the Documentation CD.
Amber = Failover has occurred. Online spare memory is in use.
Green = Online spare memory is enabled, but not in use.
Off = Online spare memory is disabled.
Amber = PCI riser assembly is not seated.
Off = PCI riser assembly is seated.
System LEDs and internal health LED combinations
When the internal health LED on the front panel illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated system LEDs and the internal health LED indicate system status.
The front panel health LEDs indicate only the current hardware status. In some situations, HP SIM may report server status differently than the health LEDs because the software tracks more system attributes.
Server component identification 48
System LED and Color Internal Health
LED Color
Processor failure, socket X (Amber)
Red
Processor failure, both sockets (Amber)
PPM failure (Amber)
DIMM failure, slot X
(Amber)
DIMM failure, all slots in one bank (Amber)
Overtemperature
(Amber)
Amber
Red
Red
Red
Amber
Red
Amber
Red
Riser interlock
(Amber)
Online spare memory
(Amber)
Power converter module interlock
(Amber)
Fan module (Amber)
Fan module (Red)
Red
Red
Amber
Red
Power supply signal interlock (Amber)
Red
Status
One or more of the following conditions may exist:
•
Processor in socket X has failed.
•
Processor in socket X failed over to the offline spare.
•
Processor X is not installed in the socket.
•
Processor X is unsupported.
•
ROM detects a failed processor during POST.
Processor in socket X is in a pre-failure condition.
Processor types are mismatched.
PPM has failed.
•
DIMM in slot X has failed.
•
DIMM in slot X is an unsupported type, and no valid memory exists in another bank.
•
DIMM in slot X has reached single-bit correctable error threshold.
•
DIMM in slot X is in a pre-failure condition.
•
DIMM in slot X is an unsupported type, but valid memory exists in another bank.
No valid or usable memory is installed in the system.
The Health Driver has detected a cautionary temperature level.
The server has detected a hardware critical temperature level.
The PCI riser board assembly is not seated.
The power converter module is not seated.
A redundant fan has failed.
The minimum fan requirements are not being met in one or more of the fan modules. One or more fans have failed or are missing.
The power supply signal cable is not connected to the system board.
Server component identification 49
Internal USB connector
The front internal USB connector is located in the processor zone fan module.
For more information, refer to "Internal USB Functionality (on page
SCSI IDs and SATA device numbers
Item SCSI device number
1 0
2 1
SATA device number
1
2
Server component identification 50
Hot-plug SCSI hard drive LEDs
1
3
Activity status
Fault status
Status
On = Drive activity
Flashing = High activity on the drive or drive is being configured as part of an array.
Off = No drive activity
On = Drive is part of an array and is currently working.
Flashing = Drive is actively online.
Off = Drive is offline.
On = Drive failure
Flashing = Fault-process activity
Off = No fault-process activity
Hot-plug SCSI hard drive LED combinations
Activity
LED (1)
Online LED
(2)
Fault LED
(3)
Interpretation
On, off, or flashing
On, off, or flashing
On or flashing
On or off Flashing A predictive failure alert has been received for this drive.
Replace the drive as soon as possible.
On Off The drive is online and is configured as part of an array.
If the array is configured for fault tolerance and all other drives in the array are online, and a predictive failure alert is received or a drive capacity upgrade is in progress, you may replace the drive online.
Flashing Off
Do not remove the drive. Removing a drive may terminate the current operation and cause data loss.
The drive is rebuilding or undergoing capacity expansion.
Server component identification 51
Activity
LED (1)
Online LED
(2)
Fault LED
(3)
Interpretation
On Off Off Do not remove the drive.
The drive is being accessed, but (1) it is not configured as part of an array; (2) it is a replacement drive and rebuild has not yet started; or
(3) it is spinning up during the POST sequence.
Flashing Flashing Flashing Do not remove the drive. Removing a drive may cause
data loss in non-fault-tolerant configurations.
Either (1) the drive is part of an array being selected by an array configuration utility; (2) Drive Identification has been selected in
HP SIM; or (3) drive firmware is being updated.
Off Off On The drive has failed and has been placed offline.
You may replace the drive.
Off Off Off Either (1) the drive is not configured as part of an array; (2) the drive is configured as part of an array, but it is a replacement drive that is not being accessed or being rebuilt yet; or (3) the drive is configured as an online spare.
If the drive is connected to an array controller, you may replace the drive online.
Optional Battery-Backed Write Cache Enabler LEDs
1 Amber
2 Green
For LED status information, refer to "Battery-Backed Write Cache Enabler LED statuses (on page
Server component identification 52
Battery-Backed Write Cache Enabler LED statuses
Server Status LED Status Battery Module Status
Green = On Fast charging Server is on and has normal run time
Green = Off
Amber = On
Trickle charging
Amber = Blinking
Amber = Off
A short exists in the connection of one or more of the four button cells within the battery module
An open exists in the circuit between the positive and negative terminals of the battery module
Normal
Server is on and is in the first 30 seconds after power up
Green = On
Amber = On
Server is off and is in data retention mode
Temporary lock-out state; data was lost due to cable being detached
Amber = Blinking every User data held in write cache is being backed
15 seconds up
Fan module locations
Item Description
1
2
Power supply zone fan module
Processor zone fan module
Server component identification 53
Processor zone fan module LED
Status
Amber = One fan in this module has failed.
Red = Multiple fans in this module have failed.
Off = All fans in this module are operating normally.
For power supply zone fan module LED information, refer to "System Board LEDs (on page
Server component identification 54
Specifications
In this section
Server specifications
NOTE: The Intel® Low Voltage Xeon™ processor requires 55 W instead of 110 W as required by standard Intel® Xeon™ processors.
Specification Value
Dimension
Height
Depth
4.32 cm (1.70 in)
69.22 cm (27.25 in)
Width
Weight (maximum)
42.62 cm (16.78 in)
16.78 kg (37 lb)
Weight (no drives installed) 12.47 kg (27.5 lb)
Input requirement
Rated input voltage
Rated input frequency
Rated input current
Rated input power
BTUs per hour
Power supply output
Rated steady-state power
100 VAC to 240 VAC
50 Hz to 60 Hz
6.0 A (110 V) to 3.0 A (220 V)
580 W
1990
460 W
Environmental specifications
Specification Value
Temperature range*
Operating 10°C to 35°C (50°F to 95°F)
Shipping -40°C to 70°C (-40°F to 158°F)
Specifications 55
Specification Value
Maximum wet bulb temperature 28°C (82.4°F)
Relative humidity
(noncondensing)**
Operating 10% to 90%
Non-operating 5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to
3048 m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 KPa.
Hot-plug power supply calculations
For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website ( http://h30099.www3.hp.com/configurator/ ).
DDR2 SDRAM DIMM specifications
NOTE: Use only 256-MB, 512-MB, 1-GB, or 2-GB; 72-bit wide; 2.5-V; PC2-3200 Registered ECC DDR2
SDRAM. Use HP DDR2 SDRAM only.
Item Description
Size 256 MB, 512 MB, 1 GB, 2 GB
Upgrade requirement Any combination of like-paired DDR2 SDRAM DIMMs that provide a minimum of 512 MB
1.44-MB diskette drive specifications
Specification Value
Dimensions
Height
Width
Depth
LEDs (front panel)
Read/write capacity per
diskette
High density
Low density
Drives supported
Drive height
Drive rotation
Transfer rate
12.7 mm (0.5 in)
96 mm (3.8 in)
130 mm (5.1 in)
Green = On
1.44 MB
720 KB
1
One-third height
300 rpm
Specifications 56
Specification Value
Bytes/sector 512
Sectors per track (high/low)
Tracks per side (high/low)
18/9
80/80
Access times
Track-to-track (high/low)
Average (high/low)
3 ms/6 ms
169 ms/94 ms
Setting time
Latency average
Cylinders (high/low)
Read/write heads
15 ms
100 ms
80/80
2
CD-ROM drive specifications
Specification Value
Disk formats
Capacity
Block size
CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA;
Photo CD (single/multiple-session), CD-XA ready; CDi ready
550 MB (mode 1, 12 cm)
640 MB (mode 2, 12 cm)
2368, 2352 bytes (mode 0)
2352, 2340, 2336, 2048 bytes (mode 1)
2352, 2340, 2336, 2048 bytes (mode 2)
Dimensions
Height
Depth
12.7 mm (0.50 in)
132.08 mm (5.20 in)
Width
Weight
132.08 mm (5.20 in)
0.34 kg (0.75 lb)
Data transfer rate
Sustained 150 KB/s (sustained 1X), 1500/3600 KB/s (10X to 24X)
Access times
(typical)
Full stroke
Diameter
Thickness
Track pitch
300 ms
12 cm, 8 cm (4.70 in, 3.15 in)
1.2 mm (0.05 in)
1.6 µm (6.3 × 10 -7 in)
Startup time
Stop time
Laser parameters
< 10 s
< 5 s (single); < 30 s (multisession)
Specifications 57
Specification Value
Wave length
Divergence angle
Output power
Operating
conditions
Temperature
Humidity
700 ± 25 nm
53.5° ± 1.5°
0.14 mW
5°C to 45°C (41°F to 118°F)
5% to 90%
DVD-ROM drive specifications
Specification Value
Disk formats
Capacity
Block size
Random
Diameter
Thickness
Track pitch
DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode
1 & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2), CD-I (Mode 2, Form 1 & 2), CD-I ready, CD-Bridge, CD-R, PhotoCD (single and multi-session)
4.7 GB (DVD-5), 8.5 GB (DVD-9), 9.4 GB (DVD10), 550 Mb (Mode 1, 12 cm),
640 Mb (Mode 2, 12 cm), 180 Mb (8 cm)
2352 bytes (mode 0)
2352, 2340, 2336, 2048 bytes (mode 1)
2352, 2340, 2336, 2048 bytes (mode 2)
2048 bytes (DVD)
Dimensions
Height
Depth
Width
12.7 mm (0.50 in)
132.08 mm (5.20 in)
132.08 mm (5.20 in)
Weight
Data transfer rate
0.34 kg (0.75 lb)
Sustained 4463 - 10,800 KB/s (8X CAV DVD mode), 150 KB/s (sustained 1X CD-ROM),
1552 3600 KB/s (24X CAV CD-ROM)
Burst
Access times
(typical)
Full stroke
16.6 MB/s with DMA support
<200 ms CD
<300 ms DVD
<110 ms CD
<180 ms DVD
12 cm, 8 cm (4.70 in, 3.15 in)
1.2 mm (0.05 in)
0.74 µm (3.15 × 10
-7
in) DVD-ROM
1.6 µm (6.3 × 10
-7
in) CD-ROM
Startup time < 10 s
Stop time
Laser parameters
< 5 s (single); < 30 s (multisession)
Specifications 58
Specification Value
Wave length
Divergence angle
Output power
Operating
conditions
Temperature
Humidity
700 ± 25 nm
53.5° ± 1.5°
0.14 mW
5°C to 45°C (41°F to 118°F)
5% to 90%
Ultra320 SCSI hard drive specifications
Item 36.4-GB Ultra320
SCSI Drive
72.8-GB Ultra320
SCSI Drive
72.8-GB Ultra320
SCSI Drive
Capacity
Height
36,419.6 MB
1.0 in (One-third height)
Width
Interface
4.0 in
Ultra320 SCSI
Transfer rate 320 MB/sec
72,837.2 MB
1.0 in (One-third height)
4.0 in
Ultra320 SCSI
320 MB/sec
72,837.2 MB
1.0 in (One-third height)
4.0 in
Ultra320 SCSI
320 MB/sec
146.8-GB Ultra320
SCSI Drive
146,815.74 MB
One-third, 1.0 in
4.0 in
Ultra320SCSI
320 MB/sec
Rotational speed
Bytes per sector
15,000 rpm
Logical blocks 71,132,000
Operating temperature
10°C to 35°C
(50°F to 95°F)
10,000 rpm
512 512 512 512
142,264,000
10°C to 35°C
(50°F to 95°F)
15,000 rpm
142,264,000
10°C to 35°C
(50°F to 95°F)
10,000 rpm
286,749,488
10°C to 35°C
(50°F to 95°F)
Serial ATA hard drive specifications
Item 80-GB SATA Drive
Capacity
Height
Width
80,000 MB
1.028 in
4.0 in
Interface Serial ATA
Transfer rate 1.5 GB/s
160-GB SATA Drive
160,000 MB
1.028 in
4.0 in
Serial ATA
1.5 GB/s
250-GB SATA Drive
250,000 MB
1.028 in
4.0 in
Serial ATA
1.5 GB/s
Rotational speed
Bytes per sector
7,200 rpm
Logical blocks 156,301,488
7,200 rpm
512 512 512
312,581,808
7,200 rpm
488,397,168
Operating temperature
5°C to 55°C
(41°F to 131°F)
5°C to 55°C
(41°F to 131°F)
5°C to 55°C
(41°F to 131°F)
Specifications 59
Acronyms and abbreviations
ABEND abnormal end
ACU
Array Configuration Utility
ASR
Automatic Server Recovery
BBWC battery-backed write cache
DDR double data rate
DU driver update
EFS
Extended Feature Supplement
IEC
International Electrotechnical Commission iLO
Integrated Lights-Out
IML
Integrated Management Log
IPL initial program load
IRQ interrupt request
Acronyms and abbreviations 60
MPS multi-processor specification
NEMA
National Electrical Manufacturers Association
NFPA
National Fire Protection Association
NIC network interface controller
NVRAM non-volatile memory
ORCA
Option ROM Configuration for Arrays
PCI Express peripheral component interconnect express
PCI-X peripheral component interconnect extended
PDU power distribution unit
POST
Power-On Self Test
PPM
Processor Power Module
PSP
ProLiant Support Pack
PXE preboot eXecution environment
RBSU
ROM-Based Setup Utility
Acronyms and abbreviations 61
RILOE II
Remote Insight Lights-Out Edition II
SATA serial ATA
SCSI small computer system interface
SDRAM synchronous dynamic RAM
SIM
Systems Insight Manager
SIMM single inline memory module
SPM system power module
SSD support software diskette
TMRA recommended ambient operating temperature
UID unit identification
USB universal serial bus
VCA
Version Control Agent
VHDCI very high density cable interconnect
WOL
Wake-on LAN
Acronyms and abbreviations 62
Index
A
ASR (Automatic Server Recovery) 40, 60
Automatic Server Recovery (ASR) 40, 60
B
Battery-Backed Write Cache Enabler 27
Battery-Backed Write Cache Enabler LEDs 52, 53
C
component identification 42, 43, 44, 45, 46, 47 components 42 connectors 42
CSR (customer self repair) 5 customer self repair 5
D
DIMMs, single- and dual-rank 28
E
environmental specifications 55
F
H
hard drives, determining status of 51
HP ProLiant Essentials Foundation Pack 40
HP Systems Insight Manager, overview 40
I
iLO (Integrated Lights-Out) 40, 44
Instant Support Enterprise Edition 38
K
Index 63
L
LEDs 42, 43, 45, 48, 50, 51, 54
M
memory dump 47 memory slot LEDs 47
N
NIC (network interface controller) 61
O
Online ROM Flash Component Utility 39
online spare memory LED 47 operating system crash 47
Option ROM Configuration for Arrays (ORCA) 38
ORCA (Option ROM Configuration for Arrays) 38
P
power converter module cabling 35
Power On/Standby button 11, 42, 43
power supply signal connector 46
R
RBSU (ROM-Based Setup Utility) 38
remote support and analysis tools 38
removal and replacement procedures 9 required tools 9
resetting the system 47 riser interlock LED 47
RJ-45 network connector LEDs 45
ROM-Based Setup Utility (RBSU) 38
S
serial number 34 server asset text 34
Smart Array 6i memory connector 46
SmartStart Scripting Toolkit 37
system maintenance switch 46 system power connector 46
T
temperature, overtemperature LED 47, 51
Index 64
U
utilities 37, 38, 39, 40 utilities, deployment 37, 38
V
VHDCI SCSI connector 44 video connector 44
Index 65
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Table of contents
- 1 HP ProLiant DL360 Generation 4p Server Maintenance and Service Guide
- 2 Notice
- 3 Contents
- 5 Illustrated parts catalog
- 5 Customer self repair
- 6 Mechanical components
- 7 System components
- 9 Removal and replacement procedures
- 9 Required tools
- 9 Safety considerations
- 10 Preventing electrostatic discharge
- 10 Server warnings and cautions
- 10 Preparation procedures
- 11 Powering down the server
- 11 Extending the server from the rack
- 12 Accessing the product rear panel
- 13 Removing the access panel
- 13 Hard drive blank
- 14 Hard drive
- 15 Diskette drive blank
- 16 Diskette drive
- 17 Optical device blank
- 17 Optical device
- 18 Optical device ejector
- 19 Hot-plug AC power supply
- 19 Power supply fan assembly
- 20 Processor fan assembly
- 21 Optical device and diskette drive interface
- 22 SCSI backplane
- 22 SATA backplane
- 23 PCI riser board assembly
- 24 PCI expansion slot definitions
- 24 PCI-X or PCI Express expansion board
- 25 PCI riser board
- 26 Power converter module
- 27 Battery-Backed Write Cache Enabler
- 28 Memory options
- 28 Single- and Dual-rank DIMMs
- 29 DIMM installation guidelines
- 29 DIMM
- 30 Processor
- 32 Battery
- 33 System board
- 34 Re-entering the server serial number and product ID
- 35 Server cabling
- 35 Cabling overview
- 35 Server cable routing
- 36 SATA cable routing
- 37 Diagnostic tools
- 37 SmartStart software
- 37 SmartStart Scripting Toolkit
- 38 HP Instant Support Enterprise Edition
- 38 Option ROM Configuration for Arrays
- 38 HP ROM-Based Setup Utility
- 39 ROMPaq utility
- 39 System Online ROM flash component utility
- 39 Integrated Management Log
- 40 Integrated Lights-Out technology
- 40 Automatic Server Recovery
- 40 HP Systems Insight Manager
- 40 HP Insight Diagnostics
- 41 USB support
- 41 Internal USB functionality
- 42 Server component identification
- 42 Front panel components
- 43 Front panel LEDs and buttons
- 44 Rear panel components
- 45 Rear panel LEDs and buttons
- 46 System board components
- 46 System maintenance switch
- 47 NMI switch
- 47 System board LEDs
- 48 System LEDs and internal health LED combinations
- 50 Internal USB connector
- 50 SCSI IDs and SATA device numbers
- 51 Hot-plug SCSI hard drive LEDs
- 51 Hot-plug SCSI hard drive LED combinations
- 52 Optional Battery-Backed Write Cache Enabler LEDs
- 53 Battery-Backed Write Cache Enabler LED statuses
- 53 Fan module locations
- 54 Processor zone fan module LED
- 55 Specifications
- 55 Server specifications
- 55 Environmental specifications
- 56 Hot-plug power supply calculations
- 56 DDR2 SDRAM DIMM specifications
- 56 1.44-MB diskette drive specifications
- 57 CD-ROM drive specifications
- 58 DVD-ROM drive specifications
- 59 Ultra320 SCSI hard drive specifications
- 59 Serial ATA hard drive specifications
- 60 Acronyms and abbreviations