CPB909
CPU MODULE
User Manual
Revision 0.2
May 2017
The product described in this manual is compliant
with all related CE standards.
CPB909 CPU Module
Specification
Product Title:
CPB909
Document name: CPB909 User Manual
Manual version: 0.2
Copyright © 2017 Fastwel Co. Ltd. All rights reserved.
Revision Record
Revision
No.
Brief description of changes
Board index
Revision date
0.1
Initial version of CPB909 User Manual
CPB909
April 2016
0.2
Compliance assessment
CPB909
May 2017
Contact Information
Address:
Fastwel Co. Ltd
Fastwel Corporation US
108 Profsoyuznaya st.,
6108 Avenida Encinas,
Moscow 117437,
Suite B, Carlsbad,
Russian Federation
CA92011, USA
Tel.:
+7 (495) 232-1681
Fax:
+7 (495) 232-1654
E-mail:
info@fastwel.com
Web:
http://www.fastwel.com/
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Email:
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info@fastwel.com
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TABLE OF CONTENTS
Trademarks.................................................................................................................7
Ownership Rights........................................................................................................7
General Board Operation Rules ..................................................................................8
TRANSPORTATION, UNPACKING AND STORAGE ................................................................9
Transportation.............................................................................................................9
Unpacking ...................................................................................................................9
Storage ..................................................................................................................... 10
MANUFACTURER'S GUARANTEES ...................................................................................... 11
Warranty Liabilities.………………………………………………………………………….11
Liability Limitation Right ............................................................................................ 11
Warranty Period ....................................................................................................... 11
Limitation of warranty liabilities.................................................................................. 11
Returning a product for repair ................................................................................... 12
1. INTRODUCTION .................................................................................................................. 13
1.1. Purpose…………………....……………………………………………………………13
1.2. Versions, delivery checklist, ordering information……………………………….…14
2. SPECIFICATIONS ................................................................................................................ 16
2.1 Functional structure ............................................................................................ 16
2.2 Power supply ……………….……………………………….…………………………..17
2.3 Operation conditions …….……………………………………………………………..18
2.4 Mechanical features ……………………………………………………………………19
2.5 Module dimensions…..………………………………………………………………...19
2.6 MTBF…………………………………………………………………………………….19
3. STRUCTURE AND OPERATION……...…………………………………………………………..20
3.1. Module’s block diagram …………………………...…………...………….………….20
3.2. Location of module’s main components ……………….……………………………21
3.3. Aspects of functional units operation …...……………………………………….…..23
3.4. Interfaces and connectors of module …………………………….....………….……25
3.5 LEDs ……………………...……………………………………………………..….……44
3.6 Watchdog timers …..…………………..……………………………………………….44
3.7 Module address space …...…………………..………………………………………..44
4. INSTALLATION OF CPB909………………………………………………………….…………...47
4.1. Safety requirements……...………………………...…………...………….………….47
4.2. Heat removal ………………..……………...…………….……………………………48
4.3. Module installation procedure ……………………………………………………......48
4.4. Module removal procedure……………………………………………………………49
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4.5. Installation of peripheral devices ……………………………………………………..49
5. CPB909 CONFIGURATION….…..……………………………...…………………………………52
5.1 Selection of power supply voltage for the buffers on PCI bus for PC/104-Plus
modules …………………………………………….………..…...……………………………………..52
5.2 Return to CMOS factory settings (Clear CMOS)..……..…………………………….52
5.3 BIOS update …………………….…………………..…………..………………………53
6. CPB909 PROGRAMMING ……………...………………………………………………………….54
6.1 Operations with digital I/O port ………………………………………………………..54
6.2 Operations with watchdog timers..…………………………………………………….54
7. BIOS …………………………………………………………………………………………………..55
7.1 Accessing BIOS SETUP ………..……………………………………………………..55
7.2 Main …………...…………………...…………………………………………………….56
7.3 Advanced …………………..……..……………………………………………………..57
7.4 Chipset …………...…………...…...…………………………………………………….69
7.5 Security …………………….……..……………………………………………………..79
7.6 Boot …………...…………………...…………………………………………………….80
7.7 Advanced …………………..……..……………………………………………………..81
ANNEX B DISCLAIMER……………………………………………………………………………….82
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List of tables
Table 1-1: Ordering information …………….…………………………………………………………………….….....14
Table 1-2: Delivery checklist ………….………………………………………………….………………………..……..14
Table 1-3: Additional accessories ………………………………………………………………………………..…..,....15
Table 2-1: Requirements to power source parameters……………………………… ..……………………….…......18
Table 2-2: Weight and size of the module ……………………………………………………………………………..19
Table 3-1: Purpose of StackPC connector’s contacts (XP10)………………………………………………….…......25
Table 3-2: Purpose of PCI-104 connector contacts (XS3) …………………………………………………………….28
Table 3 3: Purpose of Mini PCI Express connector contacts (XS1) ………………………………………………….30
Table 3-4: Purpose of VGA connector contacts (XP17) ……………………………………………………………….31
Table 3-5: Purpose of DisplayPort connector contacts (XS10)………………………………………………………..31
Table 3-6: Purpose of LVDS connector contacts (XP15, XP16)………………………………………………………32
Table 3-7: Purpose of Audio-connector contacts………………………………………………………………………..33
Table 3-8: Purpose of COM1 (XP20) connector contacts………………………………………………………………34
Table 3-9: Purpose of COM2 (XP19) connector contacts……………………………………………………………....34
Table 3-10: Purpose of contacts of COM3 and COM4 connectors (XP14, XP12, XP11 и XP9)…………………...35
Table 3-11: Purpose of USB1, USB2 (XS9, XS8) connectors contacts ………………………………………………38
Table 3-12: Purpose of USB3.0 (XS6) connectors contacts …………………………………………………………....38
Table 3-13: Purpose of contacts of Gigabit Ethernet connector (XS7) ……………………………………………......39
Table 3-14: Purpose of CFast connector’s contacts (XS11) …………………………………………………………....40
Table 3-15: Purpose of PS/2 connector contacts (XP15) ………………………………………………………………41
Table 3-16: Purpose of XP25 power connector’s contacts ……………………………………………………………..42
Table 3-17: Purpose of contacts of XP5 digital I/O port connector …………………………………………………….42
Table 3-18: Purpose of LEDs ………………………………………………………………………………………………45
Table 3 19: Allocation of memory address space ……………………………………………………………………….45
Table 3 20: Allocation of I/O address space ……………………………………………………………………………..45
Table 6 1: Control registers for WDT2 watchdog timers ………………………………………………………………..54
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List of Figures
Fig. 2 1: Location of the area for measuring of the heat-spreader temperature ……………………………..18
Fig. 3-1: Module block diagram ………………………………………………………………………….……….…20
Fig. 3-2: Location of connectors and main components on the TOP side …………………………………….22
Fig. 3-3: Location of connectors and main components on the BOTTOM side ……………………………….22
Fig. 3-4: StackPC connector (XP10) ………………………………………………………………………………..25
Fig. 3-5: Contacts of PCI-104 connector (XS3) …………………………………………………………………...27
Fig. 3 6: Contacts of Mini PCI Express connector (XS1) ………………………………………………………...29
Fig. 3-7: VGA CRT connector (XP17) ……………………………………………………………………………...31
Fig. 3-8: LVDS connectors (XP15, XP16) ………………………………………………………………………….32
Fig. 3-9: Audio-connector XP7 ……………………………………………………………………………………...33
Fig. 3-11: Connectors COM1/COM2 (XP20 and XP19)0: Audio-connector XP8 ……………………………...34
Fig. 3-12: Connectors of COM3 – COM6 ports (XP14, XP12, XP11 и XP9) …………………………………..35
Fig. 3-13 Point-to-point connection of two devices using RS 422 interface ……………………………………36
Fig. 3-14: Combining several devices via RS 485 interface …………………………………………………….37
Fig. 3-15: Gigabit Ethernet connector (XS7) ……………………………………………………………………….39
Fig. 3-16: CFast XS11 connector ……………………………………………………………………………………39
Fig. 3 17: MicroSD XS2 connector …………………………………………………………………………………40
Fig. 3-18: PS/2 connector (XP2) …………………………………………………………………………………….41
Fig. 3-19: XP6 power supply connector …………………………………………………………………………….41
Fig. 3-20: Connector of XP5 digital I/O port ………………………………………………………………………..42
Fig. 3-21: Optoisolated external reset input XP18 …………………………………………………………………43
Fig. 3-22: Diagram for implementation of module’s digital input optical isolation ……………………………43
Fig. 3-23: Location of LEDs on CPB909 …………………………………………………………………...……….44
Fig. 4 1: Holding connector for SIM-cards (XS12) ………………………………………………………………..50
Fig. 5-1: State of contacts of PCI VIO switch (XP1) ……………………………………………………………….52
Fig. 7 1: Screen during the POST procedure ……………………………………………………………………..55
Fig. 7 2: Screen of the “Main” menu tab …………………………………………………………………………...56
Fig. 7 3: Screen of the “Advanced” menu tab ………………………………………………………………….…57
Fig. 7 4: Screen of “ACPI Settings” submenu ……………………………………………………………………..58
Fig. 7 5: Screen of the “Onboard Device Configuration” submenu ……………………………………………..59
Fig. 7 6: Screen of the “SCH3114x Super IO Configuration” submenu ……………………………………...…60
Fig. 7 7: Screen of the “Hardware Monitor” submenu ……………………………………………………………61
Fig. 7 8: Screen of the “Serial Port Console Redirection” submenu …………………………………………....62
Fig. 7 9: Screen of the “Serial Port Console Redirection” submenu ……………………………………………63
Fig. 7 10: Screen of the “SATA Configuration” submenu ……………………………………………………….64
Fig. 7 11: Screen of the “Miscellaneous Configuration” submenu ………………………………………………65
Fig. 7 12: Screen of the “LPSS & SCC Configuration” submenu ……………………………………………….66
Fig. 7 13: Screen of the “CSM Configuration” submenu …………………………………………………………67
Fig. 7 14: Screen of the “USB Configuration” submenu ………………………………………………………….68
Fig. 7 15: Screen of the “Chipset” tab menu ……………………………………………………………………....69
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Fig. 7 16: Screen of the “North Bridge” submenu …………………………………………………………………70
Fig. 7 17: Screen of the “Intel IGD Configuration” submenu …………………………………………………….71
Fig. 7 18: Screen of the “LVDS Control” submenu ……………………………………………………………….73
Fig. 7 19: Screen of the “South Bridge” submenu ………………………………………………………………...75
Fig. 7 20: Screen of the “Azalia HD Audio” submenu …………………………………………………………….76
Fig. 7 21: Screen of the “USB Configuration” submenu ………………………………………………………….77
Fig. 7 22: Screen of the “Security” menu tab ……………………………………………………………………...79
Fig. 7 23: Screen of the “Boot" menu tab ………………………………………………………………………….80
Fig. 7 24: Screen of the “Save & Exit” menu tab ………………………………………………………………….81
All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information
has been thoroughly checked and is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no
responsibility for inaccuracies, omissions or their consequences, as well as liability arising from the use or application of any product or example
described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion
without further notice. Software described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for
consequential or incidental damages originated by the use of this software.
This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to
translate the document or to convert it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its
officially authorized agents.
Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of
Xerox Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc. Intel is a trademark of Intel Corporation.
Pentium M and Celeron M are trademarks of Intel Corporation. Microsoft is a trademark of the Microsoft corporation. In addition, this document may
include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their respective owners.
Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.
Trademarks
"Fastwel" logotype is a trademark belonging to Fastwel Group Co. Ltd., Moscow, Russian
Federation.
Besides, this document may contain names, corporate logotypes and trademarks being
registered trademarks; consequently, property rights to them belong to their respective
legitimate owners.
Ownership Rights
This document contains information being the property of Fastwel Group Co. Ltd. It can
neither be copied nor transferred with the utilization of known media nor be stored in data
storage and search systems without the prior written authorization of Fastwel Group Co. Ltd. To
our best knowledge, the data in this document does not contain errors. However, Fastwel Group
Co. Ltd cannot take responsibility for any inaccuracies and their consequences, as well as
responsibility arising as a result of utilization or application of any diagram, product or example
cited in this document. Fastwel Group Co. Ltd reserves the right to alter and update both this
document and the product presented therein at its own discretion without additional notification.
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General Board Operation Rules

To keep the warranty, the product should not be altered or revised in any way. Any
alterations or improvements not authorized by Fastwel LLC, except for those specified in
this document or obtained from the technical support department of Fastwel LLC as a set
of instructions for their implementation, cancel the warranty.

This device should be installed and connected only to the systems, meeting all the
necessary
technical
and
climatic
requirements.
This above is also true of the operating temperature range of a particular version of the
board.

While performing all the required operations for installation and adjustment, please follow
the instructions specified only in this document.

Keep the original package for subsequent storage of the device and transportation in the
warranty event. If it is necessary to transport or store the board, please pack it the same
way as it was packed upon delivery.

Exercise special care when unpacking and handling the device. Act in accordance with
the instructions given in the paragraph above.
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TRANSPORTATION, UNPACKING AND STORAGE
Transportation
The module should be transported in a separate packaging box (transport packaging) of
the manufacturing facility, which consists of an individual antistatic bag and a cardboard box, in
the closed transport (automobile, railway, air transportation in heated and pressurized
compartments) in storage conditions 5 defined in the GOST standard 15150-69 (IEC 721-2-1
standard) or in storage conditions 3 during sea transportation.
It is possible to transport modules, packaged in individual antistatic packages, in multiple
packaging (transport packaging) of the manufacturing facility.
The packaged modules should be transported in accordance with the shipping rules,
operating with this particular type of transport.
During handling and transportation operations, the packaged modules should not
undergo sharp pounding, falls, shocks and exposure to atmospheric precipitation. The
packaged modules should be stored in a carrier vehicle in such a manner which will prevent
their moving.
Unpacking
Prior to unpacking, before transportation at subzero temperature of ambient air the
modules should be kept within 6 hours under storage conditions 1 defined in the GOST
standard 15150-69 (IEC 721-2-1 standard).
It is prohibited to place the packaged module close to the heat source, prior to
unpacking.
While unpacking, it is required to comply with all safety precautions, which ensure its
safety, as well as marketable condition of consumer packaging of the manufacturing company.
At the time of unpacking it is required to check the module that it has no external
mechanical damages after transportation.
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Storage
Module storage conditions for group 1 are defined in the GOST standard 15150-69 (IEC
721-2-1 standard).
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MANUFACTURER'S WAARRANTY
Warranty Liabilities

The Manufacturer hereby guarantees the product conformity with the requirements of the
ТУ 4013-006-52415667-05 technical conditions provided that the Consumer complies with the
operating, storage, transportation and installation conditions and procedures, specified by the
accompanying documents.

The Manufacturer hereby guarantees that the products supplied thereby are free from
defects in workmanship and materials, provided operation and maintenance norms were
observed during the currently established warranty period. The Manufacturer's obligation under
this warranty is to repair or replace free of charge any defective electronic component being a
part of a returned product.

Products that broke down through the Manufacturer's fault during the warranty period will
be repaired free of charge. Otherwise the Consumer will be invoiced as per the current labor
remuneration rates and expendable materials cost
Liability Limitation Right

The Manufacturer shall not be liable for the damage inflicted to the Consumer's property
because of the product breakdown in the process of its utilization.
Warranty Period

The warranty period for the products made by Fastwel LLC is 36 months since the sale
date (unless otherwise provided by the supply contract).

The warranty period for the custom-made products is 60 months since the sale date
(unless otherwise provided by the supply contract.
Limitation of warranty liabilities
The above warranty liabilities shall not be applied:

To the products (including software), which were repaired or were amended by the
employees, that do not represent the manufacturer. Exceptions are the cases where the
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customer has made repairs or made amendments to the devices in the strict compliance with
instructions, preliminary agreed and approved by the manufacturer in writing;

To the products, broken down due to unacceptable polarity reversal (to the opposite
sign) of the power supply, improper operation, transportation, storage, installation, mounting or
accident.
Returning a product for repair
1.
Apply to Fastwel company or to any of the Fastwel's official representatives for the
Product Return Authorization.
2.
Attach a failure inspection report with a product to be returned in the form, accepted by
the Manufacturer, with a description of the failure circumstances and symptoms.
3.
Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then package the
product in a safe container for shipping.
4. The customer pays for shipping the product to Fastwel or to an official Fastwel representative
or dealer
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1 INTRODUCTION
1.1 Purpose
This User Manual (hereinafter referred to as the User Manual) is designed for providing you with
valuable information on the device, principle of operation and other data, required for
commissioning, intended use and maintenance of CPB909 CPU Module (hereinafter referred to
as the “module”).
The module is 3.5” single-board computer and is designed for embedded applications that
require high-performance and low power consumption.
Module contains: CFast connector, 2x Ethernet channels, 7x USB ports, 1x Serial ATA port, 8x
serial ports, NAND Flash drive.
Extension of module’s functional capabilities is possible when connecting additional modules of
StackPC, StackPC-PCI, PCI-104, PCIe/104, PCI/104- Express formats.
The module is supplied with the installed operating system (hereinafter referred to as the OS)
FreeDOS 2) and is compatible with the following ones: QNX 6.5, Windows Еmbedded Standart
7, Linux 2.6.
The User Manual contains guidelines for proper and safe installation, module switching-in and
configuring, connection and interaction with extension modules or external devices.
The manual also covers issues related to running, debussing and use of programs from among
base and service software (hereinafter referred to as the ‘”software”).
For safe and proper operation of the module within the specified life period, it is necessary to
previously read and understand the contents of this User Manual.
WARNING: USING THE MODULE WITHOUT OBSERVING SAFETY REQUIREMENTS,
OPERATION AND APPLICATION NOTES IS NOT ALLOWED! 3)
ATTENTION: MODULE CONTAINS COMPONENTS, SENSITIVE TO ELECTROSTATIC
DISCHARGE! 4)
PROHIBITED: TO OPERATE, MAINTAIN AND PERFORM REPAIRS OF THE MODULE BY
PERSONS WHO LACK PROPER QUALIFICATION AND TRAINING! 5)
2) If no particular OS pre-installation options have been ordered, see table 1-1 below.
3) From this point on in text, graphic character (safety sign as per the GOST R standard 12.4.026-2001) is used
together with the warning term “WARNING” and warning text (as per the GOST standard Т 2.601-2006).
4) From this point on in text, graphic character (safety sign as per the GOST R standard 12.4.026-2001) is used
together with the warning term “ATTENTION” and warning text (as per the GOST standard 2.601-2006). 
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1.2 Versions, delivery checklist, ordering information
1.2.1 Versions, ordering information
Module versions and their ordering names (ordering information) are specified in the table and
in the figure below:
Table 1-1: Ordering information
Name
Reference
name
CPB909 CPU Module
CPB909
Ordering name
Note
1)
CPB909-01
2)
CPB909-02
CPB909-xx\Coated
3)
Intel Atom E3845 /4GB DDR3
RAM ECC/ 16GB NAND Flash/
CFast/ SATA/ Discrete IO/ 2x
Ethernet/ 6x USB 2.0/ 1xUSB 3.0/
4x RS232/ 4x RS422/485/ VGA/
DisplayPort/ 2xLVDS
Intel Atom E3825 /2GB DDR3
RAM ECC/ 4GB NAND Flash/
CFast/ SATA/ Discrete IO/ 2x
Ethernet/ 6x USB 2.0/ 1xUSB 3.0/
4x RS232/ 4x RS422/485/ VGA/
DisplayPort/ 2xLVDS
Conformal coating option
1)
Module contains a complete set of integrated interfaces and functional elements.
Module differs from CPB909-01 by the installed 2-core CPU Intel Atom E3825, RAM 2GB, and NAND
Flash 4GB.
3)
Where xx – module’s version (01, 02).
2)
1.2.2 Delivery checklist
The delivery checklist for all module versions is specified in the table below:
Table 1-2: Delivery checklist
Ordering name
CPB909-01,
CPB909-02
-
Decimal number
IMES.467444.078,
IMES.467444.078-01
-
Description
CPB909 CPU Module
Packaging
1.2.3 Additional accessories
Additional accessories for connection to the module are specified in the table below.
5) From this point on in text, graphic character (safety sign as per the GOST R standard 12.4.026-2001) is used
together with a warning term “PROHIBITED” and warning text (as per the GOST standard 2.601-2006).
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Table 1-3: Additional accessories
Ordering name
ACS00031-01
ACS00031-02
ACS00031-03
ACS00023-04
ACS00027-02
ACS00043
Description
Installation kit ACS00031-01. The kit contains JST PHR-5 socket and a
set of contacts SPH-002T-P0.5S for connection to XP7, XP9, XP11, XP12
and XP14 (COM3 – COM6, Audio) of the module
Installation kit ACS00031-02. The kit contains JST PHR-6 socket and a
set of contacts SPH-002T-P0.5S for connection to XP2 (KB/Mouse) of the
module
Installation kit ACS00031-03. The kit contains JST PHR-2 and a set of
contacts SPH-002T-P0.5S for connection to XP8, XP13, XP18 (Ext BAT,
Mic In, Opto Reset) of the module
Cable adapter for connection to COM2 (DB9M – IDC10)
Cable adapter for connection of VGA display (DB15F – IDC10)
Cable adapter for connection of PS/2 keyboard and mouse
NOTE: ADDITIONAL ACCESSORIES FOR CONNECTION TO THE MODULE ARE NOT
INCLUDED INTO THE SCOPE OF DELIVERY AND ARE OFFERED AS AN OPTION.
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2 Specifications
2.1 Functional structure
The module’s structure includes main functional elements:
• CPU: Intel Atom E38451) or Intel Atom E38252):
– 4x 32-/64 -bit x86 cores (for E3845),
– 2x 32-/64-bit x86 cores (for E3825),
– 64-bit memory bus,
– L1 cache:– 32 KB for program area, 24 KB for data area),
– L2 cache: – 1 MB,
– SSE4.1, SSE4.2 support,
– Support of Intel SpeedStep;
• DDR3 SDRAM 1066 MHz with ECC (soldered on board) – 4 GB (for CPB909-01);
• DDR3 SDRAM 1066 MHz with ECC (soldered on board) – 2 GB (for CPB909-02);
• Flash BIOS:
– 64 Mb,
– Modifiable within the system;
• Interface SATA (switched to CFast connector), routed to StackPC connector:
– Support of SATA II specification;
• NAND Flash drive (soldered and connected to SATA interface) – 16 GB (for CPB909-01):
– Support of SATA II specification; I
• NAND Flash drive (soldered and connected to SATA interface) – 4 GB (for CPB909-02):
– Support of SATA II specification;
• Connector for CFast (switched to SATA interface):
– Support of SATA II specification;
• MicroSD drive (support of MicroSDHC, MicroSDXC);
• PCI bus:
– Support of v.3.0 specification,
– 32-bit/33MHz,
– Connection of up to 4х bus master devices;
• PCI-E bus:
– Support of v.2.0 specification,
– Connection of up to 5x devices in x1 mode (5Gb/sec),
– Support Mini PCI Express card;
• LPC bus:
______________________________
1) Installed
2) Installed
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– Support of v.1.1 specification;
• SMBUS:
– Support of v.2.0 specification,
– Rate of up to 100Kb/sec;
• Video controller:
– 2D/3D accelerator,
– VGA output (resolution of up to 2560x1600, 60Hz),
– DisplayPort (resolution of up to 2560x1600, 60Hz),
– 2x LVDS ports (one port is switched with DisplayPort interface), resolution up to 1920x1200,
60Hz, 18/24 bit;
• 2x Ethernet controllers 10/100/1000 Mb;
• USB ports:
– Connection of up to 7x devices,
– Support of USB 1.1 specification, USB 2.0, USB3.0 (one port),
– Support of OS booting from USB;
• Serial ports:
– СОМ1, COM2: RS 232, 9-wires (full), with possibility of console I/O, with data exchange rate
of no more than – 115,2 Kb/sec,
– COM3 – COM6: RS 422/485, with galvanic isolation (breakdown voltage of 500
V), with data exchange rate of no more than – 921 Kb/sec,
– СОМ7, COM8 TTL UART (TX/RX/RTS) up to 3,6 Mb/sec;
• HD Audio controller:
– Linear stereo I/O,
– Input for MIC connection;
• PS/2 keyboard and mouse port;
• Digital I/O port:
– 16 separately programmed I/O lines;
• Opto-isolated input of external reset/interrupt:
– Insulation breakdown voltage – 500 V;
• Real-Time-Clock (RTC);
• Serial FRAM (for storing user configuration);
• Two watchdog timers (WDT):
– WDT1 – with fixed actuation interval – 1,6 sec,
– WDT2 – With programmed actuation interval – from 1 sec to 255 min.;
Module is software-compatible with OS: FreeDOS, QNX 6.5, Windows Еmbedded Standard 7,
Linux 2.6.
2.2 Power supply
Module’s power supply should correspond to the requirements, specified in the table below.
The module can be fed with power via a power supply connector (XP6). Maximum consumption
current value of the module is 3,9 A for CPB909-01 and 2,8 A for CPB909-02, without
considering connected external devices.
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Table 2-1: Requirements to power source parameters
Output voltage, V
Rated load current, A
From +4,75 to +5,25
6
Output voltage buildup time to
the level of +4,75 V, ms
No more than 10
PROHIBITED: TO RESTART THE MODULE LESS THAN 5 SECONDS AFTER ITS SHUTDOWN.
2.3 Operation conditions
Module should be used under the following operation conditions:
– Operating temperature range – from - 40 to + 85 °С, in this case the temperature on the heatspreader should not exceed the value of +90°С. The plate temperature is ensured by device
form-factor, in which this module is used. Temperature control in this board is carried out at the
point, specified in Figure 2-1.
– Modules are resistant to changes of ambient temperatures within the specified temperature
range, with the relative humidity of up to 80% without condensation.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-1: Location of the area for
measuring of the heat-spreader temperature
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2.4 Mechanical features
The module corresponds to the following mechanical features:
– Vibration resistance, acceleration amplitude, no more than – 5g,
– Single shock resistance, peak acceleration is no more than – 100 g,
– Multiple shock resistance, peak acceleration is no more than – 50 g.
2.5 Module dimensions
Weight and size values for module’s versions are specified in the table below:
Table 2-2: Weight and size of the module
Module
Weight in kg, no
more than
Packed weight, in
kg
Overall
dimensions, in mm,
no more than
Box overall
dimensions, in mm
CPB909
0,5
-
113,2 x 149,7 x 28,6
230x155x45
General overall and connecting dimensions of the module are shown in figures below.
2.6 MTBF
MTBF value for this module: 130 000 hours
 Note: THIS
MTBF VALUE IS CALCULATED USING THE TELCORDIA ISSUE 1 MODEL,
CALCULATION METHOD I CASE 3, DESIGNED FOR CONTINUOUS OPERATION IN CASE OF THE
GROUND_BASED DEPLOYMENT UNDER THE CONDITIONS CORRESPONDING TO THE
“MODERATELY COLD CLIMATE 4” IN ACCORDANCE WITH THE GOST STANDARD 15150-69, AT
AMBIENT TEMPERATURE + 30 °С.
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3 Structure and operation
3.1 Module’s block diagram
Module’s block diagram is shown in the figure below:
Fig. 3-1: Module block diagram
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The module' block diagram shows main functional units:
– Intel Atom E3845 or Intel Atom E3825 CPU (depending on module’s version);
– DDR3 SDRAM (up to 4 GB);
– Flash BIOS (64 Mb);
– NAND Flash drive (8 GB);
– VGA display port (XP17);
– DisplayPort (XS10);
– Connectors for TFT panels with LVDS interface (XP15, XP16);
– Connector for CFast drive (XS11);
– Connector for MicroSD drive (XS2);
– Two Ethernet 10/100/1000 Mb channels (XS7);
– 6x USB 2.0 ports (XS9, XS8, XP10);
– 1x USB 3.0 port (XS6);
– Serial ports СОМ1 (RS232) (XP20), COM2 (RS 232) (XP19), COM3 (RS422/285) (XP14),
COM4 (RS 422/485) (XP12), COM5 (RS422/285) (XP11), COM6 (RS 422/485) (XP9), COM7,
COM8 (TTL UART) (XP10);
–PS/2 keyboard/mouse port (XP2);
– Digital I/O port (XP5);
– HD audio controller with linear I/O and MIC connectors (XP7 и XP8);
– StackPC connector (XP10);
– PCI-104 connector PCI bus 32 bit 33 MHz (XS3);
– Serial FRAM (for storing user configuration).
Technical features of main functional units of the module are specified in subsection 2.1 of this
Manual.
3.2 Location of module’s main components
Location of main components, their corresponding connectors, as well as commutator bars from
the side of components (TOP) and from the assembly side (BOTTOM) of the module is shown
in Fig. 3-2 and Fig. 3-3.
Location of jumpers in commutator bars of the module is also by default shown in Fig. 3-2, and
information on installation of jumpers in module’s commutator bars based on their functions is
shown in Section 5 CPB909 configuration.
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Fig. 3-2: Location of connectors and main components on the TOP side
Fig. 3-3: Location of connectors and main components on the BOTTOM side
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3.3 Aspects of functional units operation

Intel Atom E38xx
32-bit Intel CPU: manufactured at 22 nm, with low power consumption (TDP <6 W for 2 core
CPU and <10 W for 4 core CPU); industrial operating temperature range (-40 … +85ºС).
Represents a single-chip solution that combines up to 4x improved Intel Atom cores, 64-bit
memory controller DDR3L SDRAM (up to 4 GB, 1066/1333) with ECC support, modern graphics
system with 2D/3D acceleration Gen7 (video processor frequency up to 700 MHz), I/O
subsystem (PCI-E, USB, SATA) and a standard hardware support of the platform (RTC, UART,
Timers, GPIO etc.). Video coding hardware support (MPEG-2 / H.263 / H.264) as well as
hardware acceleration of video decoding (H.264 / MPEG2 / MPEG4 / VC1 / WMV9) has been
implemented in the CPU.
The CPU is implemented in the FCBGA-1170 enclosure, 25 x 27 mm, 0.6 mm ball pitch.
DDR3L SDRAM
9 DDR3L1066/1333 SDRAM with a total volume of up to 4 GB are installed (soldered) on the
board. Operation mode – single-channel, with ECC support.
BIOS
For storing main (working) copy of BIOS, SPI-Flash 64 Mbit microchip is used. BIOS booting
from LPC bus is supported (via StackPC connector).
RTC, CMOS
Real-Time Clock is integrated into the CPU. When the power is switched off, RTC operability is
ensured by lithium battery, installed into the board. CMOS settings are stored in the SPI Flash
non-volatile memory.
SPI FRAM
The module has the installed non-volatile memory 32 Kbyte (Ramtron, FM25V02), this memory
can be used for storing user data.
PCI-E 2.0 ports
StackPC connector has 4x PCI-E Gen2 ports routed to it, with a bandwidth of up to 5Gb/sec. In
addition, 1x PCI-E port is also routed to Mini PCI Express connector.
SATA ports
1x SATA port (this port is switched with the CFast drive connector) is routed to StackPC
connector. SATA I, SATA II specifications (up to 3 Gbit/s) are supported.
NAND Flash Disk
The module is equipped with the installed NAND Flash Disk drive connected to SATA interface
(SATA II is supported). Data transfer rate reached up to 116 MB/sec (read) and up to 70MB/sec.
(write). This drive’s volume depends on the module’s version (16GB for CPB909-01, 4 GB for
CPB909-02).
CFast
The module is equipped with the connector for CFast drive (SATA II is supported). This
connector is switched with the SATA port, which is routed to StackPC connector.
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USB 2.0 port
Module’s connectors (Type A, StackPC, Mini PCI Express) have 6x USB 2.0 ports routed to
them, equipped with the short-circuit protection.
USB 3.0 port
Type A connector has 1x USB 3.0 port (Super Speed) routed to it, which also supports USB 2.0
specification (High Speed).
Gbit Ethernet ports
The module is equipped with 2 Gbit Ethernet channels. It uses external controllers Gigabit
Ethernet I210 connected both to the RG-45 connector and to the StackPC connector (switching
is carried out in the BIOS SETUP).
COM1, COM2 ports
COM1/COM2 – 9-wire RS232 interface. COM1 is routed to the DSUB connector on the board.
COM2 is routed to the IDC10 connector with a contact pitch of 2 mm on the board.
COM3 – COM6 ports
COM3-COM6 – galvanic isolated RS422/485, isolation voltage up to 500V.
Transmitter is controlled in automatic mode. Each port is routed to the straight 5-contact
connector with a pitch of 2 mm. Matching resistors of interfaces (RS422/485) can be connected
in BIOS SETUP.
COM7, COM8 ports
COM7/COM8 – 3-wire (TX/RX/RTS) RS232 interface (TTL level). Routed to the StackPC
connector.
PS/2 Keyboard & Mouse
Designed for connection of PS/2-keyboard and mouse to the module, single-row straight 6contact connector with a pitch of 2 mm is used.
Video ports
The ports are designed for the connection of analog or digital monitor with VGA or DisplayPort
interfaces, as well as for the connection of matrix with LVDS interface. Two-monitor
configurations are supported: clone/extended desktop..
Audio port
The support is implemented via Audio Codec HD Audio. The board has installed connectors
with signals: linear input, linear output (5-contact connector with a pitch of 2 mm), as well as
microphone input (2-contact connector with a pitch of 2 mm).
GPIO port (16x input/output channels)
I2C GPIO microchip is used, generation of event interrupts at input is supported.
Watchdog
The module has two watchdog timers, one (WDT1) of them is integrated into the supervisor’s
microchip and has a fixed actuation interval (1.6 sec), another one is integrated into the SIO
microchip and has a programmable actuation interval (up to 255 min).
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Indication
The module is equipped with LEDs for indication of module’s operation mode (module is ON,
SLEEP mode, StackPC error), indication of SATA drives activity, two controlled use LEDs, as
well as LEDs for state indication and connection activity over LAN.
Reset and power supply monitoring
CPU reset signals is generated from the following sources:
From supervisor by switching on the power supply;
From the “Reset” button;
From watchdog timers;
From the external signal of isolated reset.
Switches (jumpers)
The module has switches of the following functionality:
Switch “PCI VIO Selector” (XP1);
Switch “CMOS Reset” (XP3);
Switch “BIOS select” (XP4).
3.4 Interfaces and connectors of module
3.4.1 StackPC-PCI connectors
The module is equipped with standard connectors of StackPC-PCI format, which are used for
connecting CPB909 with such devices as analog-to-digital converters, digital I/O modules etc.
According to StackPC specification (detailed description is given at: http://www.stackpc.org/),
module of such a format includes StackPC and PCI-104 connectors, described below.
3.4.1.1 StackPC interface
Availability of StackPC connector makes it possible to connect additional extension modules to
CPB909 (interfaces 4x1 PCI-E, 3xUSB, 1xSATA, 2xEthernet, SMBUS, SPI, LPC, 2xUART).
Location of StackPC connector contacts is shown in Fig. 3-4. Purpose of the contacts is
specified in Table 3-1.
Fig. 3-4: StackPC connector (XP10)
Table 3-1: Purpose of StackPC connector’s contacts (XP10)
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3.4.1.2 PCI-104 interface
PCI-104 interface uses 120-pin (30х4) XS3 connector, located on the upper part of the board.
The connector serves for transferring all required signals of 32-bit PCI bus on a frequency of 33
MHz. 4 Bus Master devices are supported.
Layout of contacts of PCI-104 connector is shown in the figure below. Purpose of connector’s
contacts is specified in Table 3-2: Purpose of PCI-104 connector contacts (XS3).
Fig. 3-5: Contacts of PCI-104 connector (XS3)
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Table 3-2: Purpose of PCI-104 connector contacts (XS3)
“PCI VIO” switch (XP1) is located in the upper part of the board (near XS3 connector, see Fig.
3-2: Location of connectors and main components on the TOP side) and serves for choosing
power supply voltage of PCI interface’s buffers of StackPC-PCI, PCI-104, PCI\104-Express
modules.
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The following contacts states of XP1 switch are possible:
Contacts 1-2 are locked – PCI bus signals levels: +5 V;
Contacts 2-3 – PCI bus signals levels: +3.3 V.
The more detailed description of XP1 is given in subsection 5.1 Selecting power supply of the
buffers on PCI bus of PC/104-Plus modules. Please note the following:
Note
Jumper from XP1 switch must be installed in position 1-2 or 23, see Fig. 5-1: State of contacts of PCI VIO switch (XP1).
3.4.2 Mini PCI Express connector
The module supports Mini PCI Express extension cards, for this purpose it has a relevant XS1
connector on it. The cards with both PCI Express and USB 2.0 interfaces are supported. The
form-factor of the extension cards should correspond to the Full-Mini Card format, installation of
cards in Half-Mini Card format is allowed using the special-purpose adapter in order to ensure
that the card is properly fastened on the module. Location of Mini PCI Express connector
contacts is shown in the figure below. Purpose of connector’s contacts is shown in the Table 3
3: Purpose of Mini PCI Express connector contacts (XS1).
Fig. 3 6: Contacts of Mini PCI Express connector (XS1)
1
2
Table Ошибка! Текст указанного стиля в документе отсутствует.-1: Purpose of Mini PCI Express connector
contacts (XS1)
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In order to support card modems of GSM, 3G, LTE and other standards, the reverse side of the
module (under XS1 Mini PCI Express connector) is equipped with a connector holder for SIMcards (XS12).
3.4.3 Graphics controller
Intel Atom CPU is a highly integrated solution, combining the CPU core itself, as well as
SDRAM/DDR3 controller and graphics adapter with 3D/2D acceleration.
Due to this controller, the module has a high-performance 2D/3D graphics processing. The
embedded graphics controller allows a direct operation with both a standard analog monitor,
connected via VGA (XP17) on the board, and a standard digital display, connected via
DisplayPort (XS10) on the board. It is also possible to connect digital TFT panels via LVDS
connectors. Support of two-display configurations is ensured: clone/extended desktop.
3.4.3.1 VGA CRT interface
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For connection of the analog display to CPB909, the upper side of the board is equipped with
10-contact XP17 connector of IDC10 type with a pitch of 2 mm.
Fig. 3-7: VGA CRT connector (XP17)
1
Table 3-4: Purpose of VGA connector contacts (XP17)
Display is connected using the ACS00027-02 accessory from the kit of additional accessories
(see Table 1-3), or a proprietary manufactured cable. It is recommended to use 89947-710 LF
(FCI) socket.
3.4.3.2 DisplayPort interface
Table 3-5: Purpose of DisplayPort connector contacts (XS10)
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3.4.3.3LVDS interface
The top side of the board is equipped with 2x 30-contact connectors of LVDS interface designed
for the connection of digital TFT-panels wire crimping with a contact pitch of 1.25 mm. Support
of Single/Dual LVDS modes, 18/24 bit/pixel is ensured.
Fig. 3-8: LVDS connectors (XP15, XP16)
30-pin LVDS connector for digital TFT panel.
Table 3-6: Purpose of LVDS connector contacts (XP15, XP16)
During cable manufacturing, it is recommended to use connector of DF13-30DS-1.25C (Hirose)
type with DF13-2630SCF (Hirose) contacts.
3.4.4 Audio interface
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The module is equipped two Audio-connectors for wire crimping (support is implemented via
Audio Codec HD Audio):
with linear input and linear output signals (5-contact connector with a pitch of 2 mm XP7);
with microphone input signals (2-contact connector with a pitch of 2 mm XP8);
Fig. 3-9: Audio-connector XP7
1
Fig. 3-10: Audio-connector XP8
1
The table below specifies the purpose of Audio-connector contacts.
Table 3-7: Purpose of Audio-connector contacts
When manufacturing cable adapters, for connection to XP7 and XP8 it is recommended to use
sockets of PHR-5 (JST) / PHR-2 (JST) type accordingly, for crimping wires with contacts SPH002T-P0.5S (JST), or ACS00031-01 and ACS00031-03 accessories accordingly (see Table 13).
3.4.5 Serial interfaces
The module is equipped with eight serial ports: COM1 – COM8.
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3.4.5.1 COM1 and COM2 ports
COM1 and COM2 ports are functioning in the full (9-wire) RS 232-interface mode and have
basic addresses and interrupts standard for PC/AT. The ports can also be used for console I/O.
In this case, a number of the used COM-port for the connection of a remote console to: COM1
(XP20), COM2 (XP19) is selected by means of the relevant adjustment made in the BIOS
SETUP of the module.
Rate of data exchange for COM1 and COM2 ports is no more than – 115,2 Kb/sec. The ports
are program-compatible with UART 16550 version.
COM1 port is routed to the 9-contact DSUB (XP20) connector, COM2 port is routed to the XP19
connector of IDC10 type (with a pitch of 2 mm). Purpose of XP20 and XP19 connector contacts
for the connection to COM1, COM2 ports is specified in Table 3-8 and Table 3-9.
Figure 3-11: Connectors COM1/COM2 (XP20 and XP19)
1
5
6
9
1
Table 3-8: Purpose of COM1 (XP20) connector contacts
Table 3-9: Purpose of COM2 (XP19) connector contacts
With XP19 (IDC10) connector, it is also recommended to use the accessory ACS00040-01 from
among the additional accessories (see Table 1-3).
3.4.5.2 COM3 – COM6 ports
Serial ports: COM3 – COM6 are designed for operation in modes of RS 422/485 interfaces and
ensure galvanic isolations (optoisolation with breakdown voltage of 500 V). The ports have
addresses and interrupts standard for PC/AT. The data exchange rate is no more than 230
Kb/sec. In RS485 mode, control of the receivers is carried out automatically. Each port can
operate either with a continuously switched-on receiver (ECHO mode), or with a receiver
switched off at the time of data transfer.
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Deactivation of the ECHO mode as well as control of connecting consistent resistors 120 Ohm
(terminators) for each single port is carried out using the SETUP BIOS program.
Each port is routed to a direct 5-pin connector with a pitch of 2 mm.
Fig. 3-12: Connectors of COM3 – COM6 ports (XP14, XP12, XP11 и XP9)
1
The purpose of connectors’ contacts is specified below.
Table 3-10: Purpose of contacts of COM3 and COM4 connectors (XP14, XP12, XP11 и XP9)
Schematic diagrams, which clarify the structure of RS 422 and RS 485 interfaces, are shown in
Fig. 3-13 and Fig. 3-14.
“Point-to-point” connection of two devices using RS 422 interfaces is shown in Fig. 3-13.
Terminator is installed on receiver’s side (along the RX+ and RX- lines). Combination of several
devices using RS 485 interface is shown in Fig. 3-14. The terminator is installed only in the
devices connected to line ends.
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Fig. 3-13 Point-to-point connection of two devices using RS 422 interface
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Fig. 3-14: Combining several devices via RS 485 interface
When manufacturing cable adapters for XP14, XP12, XP11 and XP9 connectors, it is
recommended to use a socket of PHR-5 (JST) type for crimping wires with SPH-002T-P0.5S
(JST) contacts, or ACS00031-01 accessory (see Table 1-3).
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3.4.6 COM7 and COM8 ports
COM7 and COM8 ports have 3 signal interfaces UART: RX, TX, RTS with a logic level of TTL
3.3V.
Maximum data exchange rate is up to 3.6 Mb/sec. The ports are software compatible with
UART 16550.
3.4.7 USB interfaces
The module is equipped with 6x USB 2.0 channels and 1x USB 3.0 channel. 3 channels are
routed to the StackPC connector (see Table 3 1), 2 channels are routed to standard Type A
connectors (XS8 and XS9), one channel is routed for support of Mini PCI Express modules.
USB 3.0 channel is routed to a standard Type A connector (XS6), corresponding to USB 3.0
specification. All the channels support booting OS from a USB carrier.
The tables below demonstrate the purpose of USB connectors contacts.
Table 3-11: Purpose of USB1, USB2 (XS9, XS8) connectors contacts
Table 3-12: Purpose of USB3.0 (XS6) connectors contacts
3.4.6 Gigabit Ethernet interface
The module has two ports 10Base-T/100Base-TX/1000Base-T Ethernet, based on Intel®
Ethernet Controllers i210. Architecture of the controllers is optimized for reaching high
performance at minimum power consumption. Controllers connected to the systems using high
performance PCI-Е bus. Intel® i210 architecture includes independent send/receive queues for
limiting traffic over PCI Е bus, as well as PCI-Е interface, which maximizes the use of packages
for efficient bus load.
Interfaces are routed to a standard double RJ-45 (XS7) connector, as well as can be switched
to StackPC connector (XP10).
Fig. 3-15: Gigabit Ethernet connector (XS7)
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Interfaces ensure automatic determination of exchange rate and switching among the data
transfer modes 10Base-T, 100Base-TX and 1000Base-T. Using the BIOS adjustment program
or user program, each of the two Ethernet channels can be switched off independently in order
to release system resources.
Table 3-13: Purpose of contacts of Gigabit Ethernet connector (XS7)
3.4.9 CFast connector
The flash memory card is a compact removable device designed for storing information. For
using the memory cards as disc storage units, the lower part of CPB909 is equipped with a
CFast pin connector (XS11):
Fig. 3-16: CFast XS11 connector
Attention!
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When using the module in harsh environments, additional measures for fixing CFast device in
the connector are required!
Purpose of CompactFlash connector’s contacts is specified in the table below.
Table 3-14: Purpose of CFast connector’s contacts (XS11)
3.4.10 MicroSD connector
The MicroSD flash memory card is a compact removable device for storing information. In order
to use the memory card as a disk drive, the top side of the board is equipped with MicroSD
(XS2) connector. The external view of the connector with the installed memory card is shown
below:
Fig. 3 17: MicroSD XS2 connector
XS2
3.4.11 PS/2 keyboard/mouse interface
In the module, PS/2 keyboard and PS/2 mouse ports are combined in a single connector and
ensure possibility of connecting input devices: PS/2 keyboard and PS/2 mouse. In terms ode
design, PS/2 keyboard and mouse port represents 6-output single row connector with a pitch of
2 mm for crimping (XP2). For connection to PS/2 keyboard to the module, use of ACS00043
cable adapter (included into additional kit) is recommended, if PS/2 mouse connection is also
required we recommend using ACS00043 together with Y-cable (offered as an option).
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CPB909 CPU Module
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When a proprietary made cable is used, we recommend either use PHR-6 (JST) socket for
crimping the wires with contacts SPH-002T-P0.5S (JST), or ACS00031-02 accessory (see
Table 1-3).
Fig. 3-18: PS/2 connector (XP2)
1
Table 3-15: Purpose of PS/2 connector contacts (XP15)
Note
Keyboard/mouse power supply source is protected with a fuse of 500 mA. All signals
lines have electromagnetic filtration.
3.4.12 Power supply connector
Module’s power supply should comply with the requirements specified in Table 2-1.
The power supply is carried out via power supply connector (XP6)
Fig. 3-19: XP6 power supply connector
1
4
Table 3-16: Purpose of XP25 power connector’s contacts
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CPB909 CPU Module
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3.4.13 Digital I/O port
The digital I/O port has 16 separately programmed I/O lines. In the output mode, each line can
be programmed either to the “Push-pull” or “Open Drain” mode.
Digital I/O port is routed to XP5 connector of IDC20 type (with a pitch of 2 mm) in the upper part
of the board.
Fig. 3-20: Connector of XP5 digital I/O port
1
Purpose of the digital I/O port connector is specified in the table below.
Table 3-17: Purpose of contacts of XP5 digital I/O port connector
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3.4.14 Optoisolated external reset input
Module’s optoisolated digital input is routed to a separated connector, designed for the
connection of remote (external) RESET devices and ensures galvanic isolation (optoisolation
with a breakdown voltage of 500 V) when connecting relevant devices to the module.
In terms of its design, the optoisolated digital input represents Isolated Reset (XP18) two-pin
plug with a pitch of 2 mm.
Fig. 3-21: Optoisolated external reset input XP18
1
A fragment of a schematic diagram for implementation of module’s digital input optical isolation
is shown in the figure below:
Fig. 3-22: Diagram for implementation of module’s digital input optical isolation
When manufacturing the cable, it is recommended to use PHR-2 socket (JST) for crimping the
wires with SPH-002T-P0.5S (JST) contacts, or ACS00031-03 accessory (see Table 1-3).
3.5 LEDs
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CPB909 CPU Module
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CPB909 is equipped with 5 LED indicators. Their functional purpose is specified in the table
below. Two software-controlled LEDs are designed for user needs.
Fig. 3-23: Location of LEDs on CPB909
Table 3-18: Purpose of LEDs
Name
HL3 (green, red, orange)
Purpose
Power supply LED
HL1 (red)
HL4 (yellow)
LED of SATA drives activity
LED for operation of one of
watchdog timers
User LEDs
HL5 green
HL2 yellow
Functions
Green – power supply is
activated
Red – error of StackPC stack
Orange – module is in sleep
mode
Watchdog timer actuation
3.6 Watchdog timers
In CPB909 there are two watchdog timers, one (WDT1) is integrated into supervisor’s microchip
and has a fixed actuation interval (1.6 sec), the other one is integrated into SIO microchip and
has a programmed actuation interval (from 1 sec to 255 min).
3.7 Module address space
3.7.1 Allocation of memory address space
Allocation of memory address space is given in the table below:
Table Ошибка! Текст указанного стиля в документе отсутствует.-2: Allocation of memory address space
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CPB909 CPU Module
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Range of addresses
Size
Description
00000h – 9FFFFh
640 KB
Main RAM
A0000h – BFFFFh
128 KB
Video memory
C0000h – С7FFFh
32 KB
BIOS video memory
C8000h – СBFFFh
16 KB
BIOS video memory
CC000h - CFFFFh
16 KB
Reserved
D0000h – D3FFFh
16 KB
Reserved
D4000h – D7FFFh
16 KB
Reserved
D8000h – DBFFFh
16 KB
Reserved
DC000h - DFFFFh
16 KB
Reserved
E0000h – EFFFFh
65 KB
BIOS POST
F0000h – FFFFFh
65 KB
ROM BIOS
3.7.2 Allocation of module’s I/O address space
Allocation of module’s I/O address space is given in the table below:
Table Ошибка! Текст указанного стиля в документе отсутствует.-3: Allocation of I/O address space
Range of addresses
Function
0000h – 001Fh
DMA Master
0020h – 0021h
PIC MASTER
0022h – 003Fh
Reserved
0040h – 005Fh
TIMER
0060h – 006Fh
POST, Keyboard, Speaker, Shadow registers
0070h – 007Fh
CMOS, NMI Mask control registers
0081h – 008Fh
DMA page registers
0090h – 009Fh
Reserved
00A0h – 00BFh
PIC SLAVE
00C0h – 00DFh
DMA slave
00F0h – 00FEh
NUMERIC COPROCESSOR
0100h – 01EFh
Reserved
01F0h – 01F7h
PRIMARY IDE
01F8h – 01FFh
Reserved
0200h – 020Fh
Access to the external LPC bus
0210h – 02EFh
Reserved
02E8h – 02EFh
COM4
02F0h – 02F7h
Reserved
02F8h – 02FFh
COM2
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CPB909 CPU Module
Range of addresses
Function
0300h – 031Fh
Access to the external LPC bus
0320h – 0377h
Reserved
0378h – 037Fh
Access to the external LPC bus
03B0h – 03DFh
VIDEO
03E0h – 03E7h
Reserved
03E8h – 03EFh
COM3
03F0h – 03F7h
Access to the external LPC bus
03F8h – 03FFh
COM1
0400h – 04FFh
Reserved
0500h – 057Fh
Super IO Runtime registers
0580h – 0FFFh
Reserved
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CPB909 CPU Module
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4 Installation of CPB909
You should strictly observe the below rules, warnings and procedures in order to properly
install the module, avoid damages to the device, system components as well as injuries of the
staff.
Installation procedure of the drivers of all the peripheral devices mounted to the module, is
given in the descriptions, provided with these drivers. This User Manual also has no
description of the procedure of operating systems installation. Please see the documentation
attached to the operating system.
4.1. Safety requirements
When handling the CPB909 board, you should strictly follow the below safety
requirements. Fastwel Group is not responsible for any damages occurred as the result of
these requirements.
Careful!
Be careful when handling the module, since the heat-spreading plate
becomes too hot. Do not touch it during module’s installation or
removal.
In addition, the module should not be placed on any surface or in
any container until temperature of the both module and plate will go
down to the ambient temperature.
Attention!
Always turn off the power supply of the system before connection
and disconnection of the power supply cable. Violation of this rule
can pose a threat to your life and health, as well lead to system and
module damages.
Electrostatic Sensitive Device (ESD)!
The module contains elements, sensitive to the effects of
electrostatic charges. In order to prevent module damages, the
following safety precautions should be observed:
Before touching the module, remove the static charge from
your clothes as well as remove the charge from the tools
prior to the use.
Do not touch the electronic components and contact
connectors.
Disconnect the power supply cable prior to the installation/
removal of extension modules.
If you work at a professional workplace equipped with the antistatic
protection, do not disregard the opportunity to use it.
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Heat removal
4.2
The module is equipped with a heat-spreading plate, which removes heat from the CPU
and microchip of PCI-Express bridge. Under conditions of module’s operation at elevated
ambient temperatures, temperature on the heat-spreading plate could reach 90°C and more.
In order to prevent this, it is required to remove heat from the plate by device’s external cooling
system where this module is used.
The Annex A contains technical recommendations, which should be considered during the
development of the proprietary cooling system. The temperature should be controlled using
the temperature-sensing element.
There are two options of heat removal from heat-spreading plate:
1. Heat removal using the air-cooler installed on the plate and fastened by six M4 screws. In
this case it is recommended to use thermal grease. The module itself with its racks is
fastened by seven M3 screws to unit’s structure, where this module should be installed.
2. Heat removal using the device’s enclosure, where module is installed (the enclosure fulfils
the function of the large heatsink). In this case the module is fastened to the enclosure of
the heat-spreading plate using six M4 screws.
Module installation procedure
4.3
In order to install the module into the system, please follow the below operational
procedure:
1.
Please make sure that safety requirements have been observed listed in section 0.
Attention!
Non-compliance with this instruction could result in module’s damages and
improper system operation.
2.
Prior to installation please make sure that the module is configured in accordance with
Section Ошибка! Источник ссылки не найден.. Information on installation of
peripheral devices, extension modules and I/O devices is given in the relevant
paragraphs of Section Ошибка! Источник ссылки не найден. of this User Manual.
3.
To install the module, the following actions should be performed:
Prior to installation please make sure that the system power supply is off.
Depending on the application, system configuration, temperature requirements
install the module according to the fastening methods described in Section Ошибка!
Источник ссылки не найден..
Ensure conditions for sufficient air cooling.
Connect the required external interface cables and power cable to module’s
connectors. Please make sure that the module and all the cables are properly fixed.
Now the module is ready for operation. Use the documentation for programs, devices and
to the system in general to know what to do next.
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Attention!
Improper power-on could damage the module.
Attention!
When the module is installed inside a sealed enclosure it is especially
important to ensure minimum heat resistance between the module’s heatspreading plate and heat-removal wall of the enclosure. This will prevent
system components inside the enclosure from excessive heating.
Module removal procedure
4.4
In order to remove the module, the following operations should be performed:
1.
2.
4.5
Make sure that all safety precautions listed in Section 0 have been complied
with. Particular attention should be given to the warning related to
temperature of the heatsink!
Prior to operations please make sure that the system power supply is off.
3.
Disconnect all the interface cables from the module.
4.
Remove the fastening screws. Do not touch the heatsink, since it could get too
hot during operation.
5.
Handle the module as you think fit. Do not put it in a box or container till the
module and container reach ambient temperature.
Installation of peripheral devices
The module enables to connect a large amount of various peripheral devices to it, which
installation methods can differ sufficiently. Therefore, in further sections there are general
instructions for installation instead of detailed algorithms. The detailed information on
connection of external devices can be found in the attached documents.
4.5.1
Installation of CFast cards
Carefully push the properly positioned memory card along the guiderails into the XS11
connector and slightly press on it to let the contacts come to it to the full.
Attention!
Installation of the CFast card when the power is on can damage the
system
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CPB909 CPU Module

Specification
Note
It is recommended to use the CFast cards, preset and formatted on
CPB909.
In order to remove the memory card, press the special-purpose
pushbutton close to the XS11 connector.
4.5.2
Installation of MicroSD memory cards
4.5.3
Installation of SIM-cards
On the reverse side of module’s board there is a holding connector for SIM card (XS12).
The figure shows the holding connector.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-2: Holding connector for SIM-cards (XS12)
Button for removal
of SIM-card tray
Place for SIM-card
SIM-card tray
In order to install the SIM card, it is required to remove the SIM-card tray from the
connector, pressing the special-purpose button (see Fig. 4-1), place the SIM card in the tray
(with contacts faced down) and push the tray together SIM-card to the holding connector up to
the full.
In order to remove the SIM-card, it is required to repeat the above procedure with SIMcard removal from the removed tray.
Attention!
All operations with SIM-card should be performed only with module power
supply off.
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CPB909 CPU Module
4.5.4
Specification
Battery change
In order to change the lithium battery, use Renata CR2032.
The expected time of battery operation with a capacity of 190 mA·h is approximately 5 years.
However, battery life service depends on operating temperature, as well as on the time during
which the system is off.

Note
It is recommended to replace the battery every 4 years, prior to the
end of its life.
Attention!
Observe polarity when during battery replacement, make sure the
polarity is properly chosen ("+" is at the top).
Utilize the used battery in accordance with the established regulations.
4.5.5
Installation of StackPC extension etc.
The extension modules are installed into the relevant connectors. The modules can be installed
in sequence (except for Mini PCI-Express modules) for receipt of highly-integrated control
systems. Prior to installation, read section Ошибка! Источник ссылки не найден..
Attention!
The extension modules are installed when the power supply is off.
Attention!
During installation of extension modules, the contacts should be
matched properly and use the required fastening devices.

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Prior to installation and operation of StackPC-PCI, PCI-104, PCI/104Express extension modules it is required to choose the voltage fed to
the I/O buffer of PCI interface (PCI VIO Selector switch is used
(XP13). Thoroughly read section Ошибка! Источник ссылки не
найден. Ошибка! Источник ссылки не найден. modules.
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5 CPB909 configuration
5.1 Selection of power supply voltage for the buffers on PCI bus for
PC/104-Plus modules
Prior to installation of PC/104-Plus extension modules it is required to choose power
supply voltage of PCI bus buffers by XP1 switch (PCI VIO).
Attention!
All the actions should be performed when the module’s power supply is switched off.
The XP1 switch is located in the upper part of the board, see Fig. 3-2: Location of connectors
and main components on the TOP side (pay attention to a note in the end of this subsection).
Fig. 5-1: State of contacts of PCI VIO switch (XP1)
Closed contacts 1-2 – PCI bus signal levels: +5 V
Closed contacts 2-3 – PCI bus signal levels: +3.3 V
Attention!
Jumper on XP1 switch should be installed in 1-2 or 2-3 positions.
5.2 Return to CMOS factory settings (Clear CMOS)
If the system fails to boot (e.g. due to misconfiguration of BIOS or invalid password), the
settings parameters saved in CMOS, can be cleared using CMOS Reset switch (XP3), see Fig.
3-2: Location of connectors and main components on the TOP side.
CMOS reset sequence:
1. Turn off the power supply.
2. Close the CMOS Reset (XP3) switch by a jumper included into the module’s delivery
checklist.
3. Turn on the power supply.
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CPB909 CPU Module
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4. Turn off the power supply.
5. Disconnect the switch CMOS Reset (XP3).
6. Turn on the power supply.
7. Further loading is carried out using CMOS factory settings.
8. The factory setting will be saved in Flash-memory upon POST completion.
9. If it is required to change CMOS parameters, start BIOS Setup.
5.3 BIOS update
BIOS is updated using Flash Programming Tool utility (written on the disk from among the
delivery checklist, is available on file servers of manufacturer and official distributor), which is
launch from EFI Shell console.

Action for updating BIOS:
1. Copy EFI64 utility to the root directory of USB drive.
2. Copy file with the new BIOS to EFI64 catalog.
3. Connect USB drive to CPB909 module.
4. In BIOS SETUP select the menu "Save & Exit -> Launch EFI Shell from filesystem
device".
5. In command line type the following:
fs0:
cd efi64
fpt64.efi -f <file name>
6. Wait for update completion and show "FPT Operation Passed" on the screen.
7. Restart the system.
WHEN THERE ARE BIOS UPGRADE ERROR MESSAGES SHOWN ON THE SCREEN IT IS
REQUIRED TO REPEATEDLY START EFI64 UTILITY ON THE SCREEN
(WITHOUT MODULE’S POWER OFF)!
WRITE BIOS FILES, EXCEPT FOR THOSE SPECIFIED FOR USE BY MAUFACTURER, INCLUDED
INTO THE DELIVERY CHECKLIST OF THE MODULE OR AVAILABLE ON
NETWORK FILE SERVERS OF MANUFACTURER AND OFFICIAL
DISTRIBUTOR!
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6. CPB909 programming
6.1 Operations with digital I/O port
Digital I/O port has 16 separately programmed I/O lines. In output mode each line can be
programmed either into the Push-pull or Open Drain mode. Description and example of the
programming are specified in BSP description of the relevant OS, supporting this port.
6.2
Operations with watchdog timers
The module has two watchdog timers. One (WDT1) is installed into the supervisor
microchip and has a fixed actuation interval (1.6 sec), the other one (WDT2) is installed in the
Super IO SMSC3116 microchip and has a programmed actuating interval (from 1 sec up to
255 min). Descriptions and examples of watchdog timers programming are shown in BSP
description of the relevant OS, which supports them. For configuration and control of WDT2
watchdog timer, register in module’s I/O space can be used, the below table contains the
purpose and addresses of these registers
Table Ошибка! Текст указанного стиля в документе отсутствует.-1: Control registers for WDT2 watchdog
timers
Name
Address
WDT2_TIMEOUT A65h
WDT2_VAL
A66h
Description
Register for configuring resolution capability of WDT2 watchdog timer actuation time
Bits
[6:2]
Reserved
Bit [7]
“0” – time is counted in minutes
”1” - time is counted in seconds
Register for setting actuation time of WDT2 watchdog timer
Bits
[7:0]
WDT2_CFG
A67h
The relevant time value is written to the register, e.g.:
1)
01h – actuation time is either 1 minute or second ;
FFh –actuation time is either 255 minutes or seconds
When the 00h value is written the watchdog timer is switched off
Register for setting the WDT2 watchdog timer
Bit[0]
Reserved
Bit[1]
“0” – disables to reset the watchdog timer from keyboard interrupt
“1” –watchdog timer can be reset from keyboard interrupt
Bit[2]
“0” – disables to reset the watchdog timer from mouse interrupt
“1» - watchdog timer can be reset from mouse interrupt
Bit[3]
Reserved
Bits[7:4 Reserved (should be “0”)
]
WDT2_CTRL
1)
A68h
Register for WDT2 watchdog timer control
Bit[0]
By reading: “0” – counting of the watchdog timer is carried out
“1” – watchdog timer’s counting was performed
Bit[1]
Reserved
Bit[2]
By writing “1” - immediately, the counting of the watchdog timer is finished
(watchdog timer’s actuation is carried out)
Bit[3]
“1” – watchdog timer’s counting is finished by pressing the keyboard button
“0” – keyboard does not depend on operation of the watchdog timer
Time is counted in seconds, if bit [7] is set in register A65h
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7 BIOS
The module has an adapted version of AMI® BIOS, which is a standard system for IBM
PC AT-compatible computers. It supports Intel®x86 CPUs and CPUs compatible with them,
ensures a low-level support for CPU, memory and I/O subsystems.
By using the BIOS Setup program you can change BIOS parameters and control specialpurpose operation modes of the module. It makes it possible for you to change the main
system setting parameters.
7.1
Accessing BIOS SETUP
In order to enter the BIOS Setup you need to press Del or ESC button on keyboard during
system booting at the time of the POST (Power On Self-Test) procedure. Example of the
screen during the POST procedure is shown in figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-3: Screen during the POST procedure
After pressing DEL or ESC button, menu of the BIOS Setup program with an active Main
tab will appear.
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CPB909 CPU Module
7.2
Specification
Main
This BIOS Setup tab is a title tab during entering. In this tab you can enter information on
the version and date of BIOS release, on the size of RAM installed in the module etc., as well
as current time and date.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-4: Screen of the “Main” menu tab
In order to move between menu items use the cursor control keys “Up”, “Down”. For moving
between the menu items: use cursor keys “Left”, “Right”. In order to enter the setup submenu
use “Enter” key, to exit the setting submenu use the “Escape” key. In order to change any
values in the selected menu item, use the “+” and “-“ keys on the digital section of keyboard.
Note
This algorithm of menu operation applies to all other tabs of BIOS
Setup programs.
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CPB909 CPU Module
7.3
Specification
Advanced
This tab is used for additional module’s settings. The figure below shows the screen of the
“Advanced” menu tab.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-5: Screen of the “Advanced” menu tab
This tab has available submenus for additional settings.
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7.3.1 ACPI Settings
Submenu of ACPI parameters settings. The submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-6: Screen of “ACPI Settings” submenu
Where:
Enable ACPI Auto Conf – Submenu for actuation of ACPI automatic configuration.
[Disabled] – ACPI automatic configuration is disabled.
[Enabled] – ACPI automatic configuration is enabled.
Enable Hibernation – Submenu for enabling the module to pass to the hibernation
mode.
[Enabled] – Passing to the Hibernation mode is enabled.
[Disabled] – Passing to the Hibernation mode is disabled.
ACPI Sleep State – Submenu of enabling passing the module to hibernation mode.
[S3 (Suspend to RAM)] – Passing to the hibernation mode (S3) is
enabled.
[Disabled] – Passing to the hibernation mode is disabled.
Lock Legacy Resources – Locking allocation of system resources.
[Enabled] – Fixed.
[Disabled] – Unblock.
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7.3.2 Onboard Device Configuration
Submenu of setting parameters of additional devices, integrated into the module. The submenu
is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-7: Screen of the “Onboard Device
Configuration” submenu
Where:
Beep after POST – Submenu of buzzer’s activation indicating completion of the POST
procedure and transfer of the control to operating system.
[Enabled] – Buzzer is ON.
[Disabled] – Buzzer is OFF.
SATA0 Direction – Submenu of switching the SATA0 channel operation mode.
[CFAST] – SATA0 channel is connected to XS11 (CFAST) connector.
[SATA0] – SATA0 channel is connected to circuits SATA_T0, SATA_R0 of XP10
(StackPC) connector.
LAN0 Interface – Submenu of LAN0 (Ethernet) interface control.
[Onboard Connector] – LAN0 interface is connected to XS7 connector.
[StackPC Connector] – LAN0 interface is connected to XR10 connector
(StackPC).
[Disabled] – LAN0 interface is ON.
LAN1 Interface – Submenu of LAN1 (Ethernet) interface control.
[Onboard Connector] – LAN1 interface is connected to the XS7 connector.
[StackPC Connector] – LAN1 interface is connected to the XR10 (StackPC)
connector.
[Disabled] – LAN1 interface is ON.
DDI Direction – Submenu of control of DDI1 digital video interface.
[DisplayPort] – DDI1 interface is connected to the XS10 (DisplayPort)
connector.
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[LVDS0] – DDI1 interface is connected to the XP15 (LVDS0) connector.
SPI CS Destination – Submenu for control of CS (Chipselect) signal of SPI interface.
[Onboard FRAM] – CS is used by the soldered FRAM memory.
[StackPC SPI_SS0] – CS is connected to the SPI_SS0# circuit of XP10 (CS0 on
StackPC) connector.
[StackPC SPI_SS1] – CS is connected to the SPI_SS1# circuit of XP10 (CS1 on
StackPC) connector.
[StackPC SPI_SS2] – CS is connected to the SPI_SS2# circuit of XP10 (CS2 on
StackPC) connector.
7.3.3 SCH311x Super IO Configuration
Submenu of parameters configuration of UART (COM1, COM2, COM3, COM4, COM5, COM6)
serial interfaces of Super IO SCH3116 microchip. Submenu screen is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-8: Screen of the “SCH3114x Super IO
Configuration” submenu
Where:
COM1 – UART1 (RS232) Configuration – Submenu for UART1 (RS232) port
configuration. It enables/disables the port, information on the assigned base address,
interrupt request lines is displayed.
COM2 – UART3 (RS232) Configuration – Submenu for UART3 (RS232) port
configuration. It enables/disables the port, information on the assigned base address,
interrupt request lines is displayed
COM3 – UART2 Configuration – Submenu for UART2 (RS422/485) port configuration.
It enables/disables the port, enables/disables “terminator”, enables/disables the ECHO
mode, information on the assigned base address, interrupt request lines is displayed.
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CPB909 CPU Module
Specification
COM4 – UART4 Configuration – Submenu for UART4 (RS422/485) port configuration.
It enables/disables the port, enables/disables “terminator”, enables/disables the ECHO
mode, information on the assigned base address, interrupt request lines is displayed.
COM5 – UART5 Configuration – Submenu for UART5 (RS422/485) port configuration.
It enables/disables the port, enables/disables “terminator”, enables/disables the ECHO
mode, information on the assigned base address, interrupt request lines is displayed.
COM6 – UART6 Configuration – Submenu for UART6 (RS422/485) port configuration.
It enables/disables the port, enables/disables “terminator”, enables/disables the ECHO
mode, information on the assigned base address, interrupt request lines is displayed.
7.3.4
Hardware Monitor
Submenu for displaying system state information.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-9: Screen of the “Hardware Monitor” submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ Pc Health Status
│
│
│
│
│
│ SIO Remote1 Temperature
: +51 C
│
│
│ SIO Internal Temperature
: +48 C
│
│
│ SIO Remote2 Temperature
: +48 C
│
│
│
│
│
│ 1.8V
: +1.809 V
│
│
│ 1.0V
: +0.99 V
│
│
│ 3.3V
: +3.263 V
│
│
│ 5V
: +4.947 V
│
│
│ 3.3V HVTR
: +3.246 V
│
│
│
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
This submenu shows information on temperatures of PCB under CPU (Remote 1), PCB
in the RAM area (Remote 2), PCB in the Super IO SCH3116 (Internal) microchip area.
It also shows information on the voltage levels of key nodes.
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CPB909 CPU Module
7.3.5
Specification
Serial Port Console Redirection
Configuration submenu and console I/O actuation via serial ports COM1, COM3. The submenu
is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-10: Screen of the “Serial Port Console
Redirection” submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│
│ Console Redirection Enable or │
│ COM1 (Serial Port 1)
│ Disable.
│
│ Console Redirection
[Disabled]
│
│
│► Console Redirection Settings
│
│
│
│
│
│ COM2 (Serial Port 3)
│
│
│ Console Redirection
[Disabled]
│
│
│► Console Redirection Settings
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
COM1 (Serial Port 1) – Submenu for activation and control of console I/O via COM1
serial port. At activation (Console redirection “Enabled”), submenu “Console redirection
Settings” becomes available, where parameters of the console I/O terminal are
configured.
COM2 (Serial Port3) – Submenu for activation and control of console I/O via COM2
serial port. At activation (Console redirection “Enabled”), submenu “Console redirection
Settings” becomes available, where parameters of the console I/O terminal are
configured.
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CPB909 CPU Module
Specification
7.3.6 CPU Configuration
Submenu for configuration of CPU parameters. This submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-11: Screen of the “Serial Port Console
Redirection” submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ CPU Configuration
│Socket specific CPU Information │
│
│
│
│► Socket 0 CPU Information
│
│
│► CPU Thermal Configuration
│
│
│
│
│
│ CPU Speed
1918 MHz
│
│
│ 64-bit
Supported
│
│
│
│
│
│ Limit CPUID Maximum
[Disabled]
│
│
│ Execute Disable Bit
[Enabled]
│
│
│ Intel Virtualization Technology
[Enabled]
│
│
│ Power Technology
[Disabled]
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Socket 0 CPU Information – Submenu for displaying information on the CPU installed
into the module.
CPU Thermal Configuration – Submenu for the connection of CPU digital temperature
sensor.
Limit CPUID Maximum – Setting the maximum value of CPU identifier (for support of
legacy operating systems):
[Enabled] – ON.
[Disabled] – OFF (Using Windows XP and older OS).
Execute Disable Bit – Control of the program code executing from data region:
[Enabled] – Prohibition is ON.
[Disabled] – Prohibition is OFF.
Intel Virtualization Technology – Activation of the virtualization technology (for
hardware support of virtual machines):
[Enabled] – ON.
[Disabled] – OFF.
Power Technology – Configuration of CPU power saving functions:
[Disabled] – Power saving functions are OFF.
[Energy Efficient] – Maximum power saving mode.
[Custom] – Manual configuration of the power saving mode.
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CPB909 CPU Module
Specification
7.3.7 SATA Configuration
Submenu of SATA interface configuration. This submenu shows information on the connected
SATA devices, as well as has separate configurations available. This submenu is shown in the
figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-12: Screen of the “SATA Configuration”
submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ SATA Configuration
│Enable / Disable Serial ATA
│
│
│
│
│ Serial-ATA (SATA)
[Enabled]
│
│
│ SATA Test Mode
[Disabled]
│
│
│
│
│
│ SATA Speed Support
[Gen2]
│
│
│ SATA ODD Port
[No ODD]
│
│
│ SATA Mode
[AHCI Mode]
│
│
│
│
│
│ Serial-ATA Port 0
[Enabled]
│
│
│ SATA Port0 HotPlug
[Disabled]
│
│
│
│
│
│ Serial-ATA Port 1
[Enabled]
│────────────────────────────────│
│ SATA Port1 HotPlug
[Disabled]
│→←: Select Screen
│
│
│↑↓: Select Item
│
│ SATA Port0
│Enter: Select
│
│ Not Present
│+/-: Change Opt.
│
│
│F1: General Help
│
│ SATA Port1
│F2: Previous Values
│
│ RunCore SSD
(15.8GB)
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Serial-ATA (SATA) – Enabling/disabling SATA controller:
[Enabled] – ON.
[Disabled] – OFF.
SATA Speed Support – Selection of SATA interface specification:
[GEN1] – Specification SATA Revision 1.0 (speed up to 1.5Gb/sec).
[GEN2] – Specification SATA Revision 2.0 (speed up to 3.0Gb/sec).
SATA ODD Port – Selection of SATA port to which disk drive on optical carrier
(CD/DVD-ROM) is connected:
[No ODD] – Disk drive is not connected.
[Port0 ODD] – Disk drive is connected to the Port0 port.
[Port1 ODD] – Disk drive is connected to the Port1 port.
SATA Mode – SATA controller operation mode:
[AHCI Mode] – AHCI mode is ON.
[IDE Mode] – IDE emulation mode is ON.
For each port there is a separate On/Off “Serial-ATA Port 0,1” and On/Off of the Hot Swap
mode of the device “SATA Port0,1 HotPlug” are available.
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CPB909 CPU Module
7.3.8
Specification
Miscellaneous Configuration
Submenu for miscellaneous configuration. The submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-13: Screen of the “Miscellaneous
Configuration” submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ Miscellaneous Configuration
│Enable or Disable the High
│
│ High Precision Timer
[Enabled]
│Precision Event Timer
│
│ Boot Timer with HPET Timer
[Disabled]
│
│
│ PCI Express Dynamic Clock Gating
[Disabled]
│
│
│ OS Selection
[Windows 7]
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
High Precision Timer – Enables/Disables high precision timer:
[Enabled] – Timer is ON.
[Disabled] – Timer is OFF.
Boot Timer with HPET Timer – Enables/Disables of the launch time count by HPET
timer:
[Enabled] – ON.
[Disabled] – OFF.
PCI Express Dynamic Clock Gating – Enables/Disables clocking signal in the unused
PCI Express circuits:
[Enabled] – ON.
[Disabled] – OFF.
OS Selection – Selection of OS type for booting:
[Windows 7] – Selection of Microsoft Windows 7.
[Windows 8.X] – Microsoft Windows 8 or 8.1 is selected.
[Android] – OS Android is selected.
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CPB909 CPU Module
7.3.9
Specification
LPSS & SCC Configuration
Submenu for configuration of serial interfaces subsystem and storage system (High speed
UART, I2C, SPI, MicroSD). This submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-14: Screen of the “LPSS & SCC Configuration”
submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ LPSS & SCC Devices Mode
[PCI mode]
│LPSS & SCC Devices Mode
│
│
│Settings
│
│ CSS Configuration
│
│
│ SCC SDIO Support
[Enabled]
│
│
│ SCC SD Card Support
[Enabled]
│
│
│ SDR25 Support for SDCard
[Disabled]
│
│
│ DDR50 Support for SDCard
[Enabled]
│
│
│ MIPI HSI Support
[Disabled]
│
│
│
│
│
│ LPSS Configuration
│
│
│
│
│
│ LPSS HSUART #1 Support
[Enabled]
│
│
│ LPSS HSUART #2 Support
[Enabled]
│────────────────────────────────│
│ LPSS SPI Support
[Enabled]
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
LPSS & SCC Devices Mode – Mode of subsystems operation:
[PCI Mode] – PCI mode (as PCI device).
[ACPI Mode] – ACPI mode.
SDR25 Support for SDCard – Enables/Disables SDR25 mode support:
[Enabled] – ON.
[Disabled] – OFF.
DDR50 Support for SDCard – Enables/Disables DDR50 mode support:
[Enabled] – ON.
[Disabled] – OFF.
MIPI HSI Support – Enables/Disables HSI high-speed mode:
[Enabled] – ON.
[Disabled] – OFF.
LPSS HSUART #1,2 Support – Enables/Disables High Speed UART interfaces:
[Enabled] – ON.
[Disabled] – OFF.
LPSS SPI Support – Enables/Disables SPI interface
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CPB909 CPU Module
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CPB909 CPU Module
Specification
7.3.10 CSM Configuration
Submenu for configuration of the Compatibility Support Module.
The submenu is used for booting of legacy operating systems and interaction with the old
integrated software. This submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-15: Screen of the “CSM Configuration”
submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ Compatibility Support Module Configuration
│Enable/Disable CSM Support.
│
│
│
│
│ CSM Support
[Enabled]
│
│
│
│
│
│ CSM16 Module Version
07.76
│
│
│
│
│
│ GateA20 Active
[Upon Request]
│
│
│ Option ROM Messages
[Force BIOS]
│
│
│
│
│
│ Boot option filter
[UEFI and Legacy]
│
│
│
│
│
│ Option ROM execution
│
│
│
│────────────────────────────────│
│ Network
[UEFI]
│→←: Select Screen
│
│ Storage
[UEFI]
│↑↓: Select Item
│
│ Video
[Legacy]
│Enter: Select
│
│ Other PCI devices
[UEFI]
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
CSM Support – Enables/Disables CSM:
[Enabled] – ON.
[Disabled] – OFF.
GateA20 Active –Control of A20 gate:
[Upon Request] – The gate can be switched by means of BIOS.
[Always] – The gate is constantly on.
Option ROM Messages –Mode for displaying Option ROM:
[Force BIOS] – Output of Option ROM information is ON.
[Keep Current] – Output of Option ROM is OFF.
Boot option filter – Boot mode filter:
[UEFI and Legacy] – Support of the both UEFI booting and Legacy.
[Legacy only] – Support of Legacy booting only.
[UEFI only] – Support of UEFI booting only.
Further, Option ROM execution modes configurations from various devices (Network –
network controllers, Storage – data storage controllers, Video – video controllers, Other PCI
devices) are shown. Configuration is available for every single device:
[Do not launch] – Do not launch Option ROM for this type of devices.
[UEFI] – Launch Option ROM for this type of devices in the UEFI mode.
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CPB909 CPU Module
Specification
[Legacy] – Launch Option ROM for this type of devices in the Legacy mode.
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CPB909 CPU Module
7.3.11
Specification
USB Configuration
Submenu of USB configuration. This submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-16: Screen of the “USB Configuration”
submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ USB Configuration
│Enables Legacy USB support.
│
│
│AUTO option disables legacy
│
│ USB Module Version
8.11.02
│support if no USB devices are
│
│
│connected. DISABLE option will │
│ USB Devices:
│keep USB devices available
│
│
2 Hubs
│only for EFI applications.
│
│
│
│
│ Legacy USB Support
[Enabled]
│
│
│ XHCI Hand-off
[Enabled]
│
│
│ EHCI Hand-off
[Disabled]
│
│
│ USB Mass Storage Driver Support
[Enabled]
│
│
│
│
│
│ USB hardware delays and time-outs:
│────────────────────────────────│
│ USB transfer time-out
[20 sec]
│→←: Select Screen
│
│ Device reset time-out
[20 sec]
│↑↓: Select Item
│
│ Device power-up delay
[Auto]
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Legacy USB Support – Enables/Disables support of USB devices by means of BIOS:
[Enabled] – ON.
[Disabled] – OFF.
[Auto] – Switched on automatically, if necessary.
XHCI Hand-off – Enables/Disables prohibition of BIOS transfer of control by XHCI to
operating system:
[Upon Request] – The gate can be switched off by means of BIOS.
[Always] – The gate is always on.
Option ROM Messages –Display of Option ROM mode:
[Force BIOS] – Output of Option ROM information is ON.
[Keep Current] – Output of Option ROM information is OFF.
Boot option filter – Boot mode filter:
[UEFI and Legacy] – Support of both UEFI boot and Legacy boot.
[Legacy only] – Support of Legacy boot only.
[UEFI only] – Support of UEFI boot only.
Further, Option ROM execution modes configurations from various devices (Network –
network controllers, Storage – data storage controllers, Video – video controllers, Other PCI
devices) are shown. Configuration is available for every single device:
[Do not launch] – Do not launch Option ROM for this type of devices.
[UEFI] – Launch Option ROM for this type of devices in the UEFI mode.
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CPB909 CPU Module
Specification
[Legacy] – Launch Option ROM for this type of devices in the Legacy mode.
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CPB909 CPU Module
7.4
Specification
Chipset
This tab is used for the configuration of the north and south bridges integrated into the CPU.
The figure below shows the Chipset tab menu.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-17: Screen of the “Chipset” tab menu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│► North Bridge
│North Bridge Parameters
│
│► South Bridge
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Menu of this tab has two additional submenus: configuration of the North Bridge and South
Bridge.
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CPB909 CPU Module
7.4.1
Specification
North Bridge
This submenu is used for configuration of the North Bridge, as well as output of information on
the installed RAM. This submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-18: Screen of the “North Bridge” submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│► Intel IGD Configuration
│Config Intel IGD Settings.
│
│► IGD - LCD Control
│
│
│► LVDS Control
│
│
│
│
│
│
│
│
│ Memory Information
│
│
│
│
│
│ Total Memory
4096 MB (LPDDR3)
│
│
│
│
│
│ Memory Slot0
4096 MB (LPDDR3)
│
│
│ Memory Slot2
Not Present
│
│
│
│
│
│ Max TOLUD
[Dynamic]
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Intel IGD Configuration – Calls submenu for configuration of the integrated Intel video
display adapter (see subsection 0).
LVDS Control – Calls submenu for configuration of LVDS panels connection to XP15,
XP16 (see subsection 0).
Max TOLUD – Installation of maximum upper physical memory for the use (the upper is
assigned for PCI devices and Video):
[Dynamic] – TOLUD value is set automatically, depending on the memory
volume occupied by external PCI devices and Video.
[2 GB … 3 GB] – Setting the TOLUD value manually.
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CPB909 CPU Module
Specification
7.4.1.1 Intel IGD Configuration
This submenu is used for configuration of the integrated Intel video adapter. This submenu is
shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-19: Screen of the “Intel IGD Configuration”
submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ GOP Configuration
│Enable GOP Driver will unload
│
│ GOP Driver
[Enabled]
│VBIOS; Disable it will load
│
│
│VBIOS
│
│ Intel IGD Configuration
│
│
│
│
│
│ Integrated Graphics Device
[Enabled]
│
│
│
│
│
│ IGD Turbo Enable
[Enabled]
│
│
│ Primary Display
[IGD]
│
│
│ DVMT Pre-Allocated
[64M]
│
│
│ DVMT Total Gfx Mem
[256MB]
│
│
│ Aperture Size
[256MB]
│
│
│ Spread Spectrum clock
[Disabled]
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
GOP Driver – Enables/Disables boot of GOP driver instead of VBIOS at system start:
[Enabled] – Boot of GOP driver.
[Disabled] – Boot of VBIOS.
Integrated Graphics Device – Enables/Disables IGD:
[Enabled] – IGD is ON.
[Disabled] – IGD is OFF.
IGD Turbo Enable – Enables/Disables Turbo Mode (maximum frequency) of IGD:
[Enabled] – Turbo Mode is ON.
[Disabled] – Turbo Mode is OFF.
Primary Display – Selection of video adapter “by default”:
[Auto] – Selected automatically.
[IGD] – IGD is selected.
[PCIe] – External video adapter on PCI Express bus is selected.
DVMT Pre-Allocated – Configuration of the fixed allocated video memory size from
RAM for IGD:
[64M … 512M] – Selection of video memory size.
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CPB909 CPU Module
Specification
DVMT Total Gfx Mem – Configuration of maximum dynamically allocated size of video
memory from RAM:
[128MB, 256MB, Max] – Selection of 128 MB, 256 MB, maximum size of RAM.
Aperture Size – Configuration of the size of video memory size, allocated for
textures:
[128MB … 512MB] – Selection of video memory size.
Spread Spectrum clock – Enables / Disables the mode of reducing the level of EMI
from integrated IGD:
[Enabled] – ON.
[Disabled] – OFF.
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CPB909 CPU Module
Specification
7.4.1.2 LVDS Control
This submenu is used for configuration of LVDS panels connection to XP15, XP16. This
submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-20: Screen of the “LVDS Control” submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ LVDS Control
│LVDS1 - XP16
│
│
│
│
│ LVDS1 - XP16
[Disabled]
│
│
│ EDID Emulation
[Disabled]
│
│
│ Panel Color Depth
[VESA and JEIDA 18 bpp]
│
│
│ Backlight
[Enabled]
│
│
│ LVDS bus mode
[Single bus mode]
│
│
│ Data Enable polarity
[active Low]
│
│
│
│
│
│ LVDS0 - XP15
│
│
│ EDID Emulation
[Disabled]
│
│
│ Panel Color Depth
[VESA and JEIDA 18 bpp]
│
│
│ Backlight
[Enabled]
│────────────────────────────────│
│ LVDS bus mode
[Single bus mode]
│→←: Select Screen
│
│ Data Enable polarity
[active Low]
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Connection of LVDS panels to XP15, XP16 is configured separately and has an equal
array of settings.
Configuration of LVDS panel connection to XP16 becomes available when “LVDS1 –
XP16” menu item is set to the “Enabled” position.
Configuration of LVDS panel connection to XP15 becomes available when “DDI0
Direction” in menu “Advanced\Onboard device\” is set to the “LVDS0” position.
Below is the description of the set of configurations for connection of LVDS panels to
XP15, XP16, where:
EDID Emulation – Enables and configures emulation of EDID:
[Disabled] – OFF.
Panel Color Depth – Configuration of the amount of bits of the connected panel:
[VESA 24 bpp] – The connected panel has 24 bits according to the VESA
standard.
[JEIDA 24 bpp] – The connected panel has 24 bits according to the JEIDA
standard.
[VESA and JEIDA 18 bpp] – The connected panel has 18 bits.
LVDS bus mode – Operation mode of LVDS bus:
[Single bus mode] – Single bus mode.
[Dual bus mode] – Dual bus mode.
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CPB909 CPU Module
Specification
Data Enable polarity – Specifies polarity of signal synchronization (HSYNC, VSYNC):
[active Low] – Active “0”.
[active High] – Active “1”.
.
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CPB909 CPU Module
Specification
7.4.2 South Bridge
Submenu for configuration of the South Bridge. This submenu is shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-21: Screen of the “South Bridge” submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│► Azalia HD Audio
│Azalia HD Audio Options
│
│► USB Configuration
│
│
│
│
│
│ BIOS Read/Write Protection
[Disabled]
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Azalia HD Audio – Calls submenu for configuration of the integrated Azalia audio
controller (see subsection 0).
USB Configuration – Calls submenu for configuration of USB controller (see subsection
0).
BIOS Read/Write Protection – Enables/Disables of the BIOS SPI area protection:
[Enabled] – Protection is ON.
[Disabled] – Protection is OFF.
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CPB909 CPU Module
Specification
7.4.2.1 Azalia HD Audio
This submenu is sued for configuration of Azalia integrated audio controller. This submenu is
shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-22: Screen of the “Azalia HD Audio” submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ Audio Configuration
│Control Detection of the
│
│ Audio Controller
[Enabled]
│Azalia device.
Disabled =
│
│
Azalia VCi Enable
[Enabled]
│Azalia will be unconditionally │
│
Azalia PME Enable
[Enabled]
│disabled.
Enabled = Azalia
│
│
Azalia HDMI Codec
[Enabled]
│will be unconditionally
│
│
HDMI Port B
[Enabled]
│Enabled. Auto = Azalia will
│
│
│be enabled if present disabled │
│
│otherwise.
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Audio Controller – Enables/Disables integrated audio controller:
[Enabled] – Audio controller is ON.
[Disabled] – Audio controller is OFF.
Azalia HDMI Codec – Enables/Disables audio transfer via digital display interface
(DisplayPort):
[Enabled] – ON.
[Disabled] – OFF.
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CPB909 CPU Module
Specification
7.4.2.2 USB Configuration
This submenu is used for configuration of USB controller. This submenu is shown in the figure
below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-23: Screen of the “USB Configuration”
submenu
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ USB Configuration
│Control the USB EHCI (USB 2.0) │
│
│functions. One EHCI
│
│ XHCI Mode
[Disabled]
│controller must always be
│
│
│enabled
│
│ USB 2.0(EHCI) Support
[Enabled]
│
│
│ USB Port 0
[Enabled]
│
│
│ USB Port 1
[Enabled]
│
│
│ USB Port 2
[Enabled]
│
│
│ USB Port 3
[Enabled]
│
│
│
│
│
│
│
│
│
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
XHCI Mode – Enables/Disables XHCI controller (available with the EHCI controller is
switched off):
[Enabled] – XHCI controller is on.
[Disabled] – XHCI controller is off.
USB 2.0(EHCI) Support – Enables/Disables EHCI controller (available with the XHCI
controller is switched off):
[Enabled] – XHCI controller is on.
[Disabled] – XHCI controller is off.
USB Port 0 – Enables/Disables USB Port 0 (XS9 connector):
[Enabled] – USB Port 0 is on.
[Disabled] – USB Port 0 is off.
USB Port 1 – Enables/Disables USB Port 0 (XS8 connector):
[Enabled] – USB Port 1 is on.
[Disabled] – USB Port 1 is off.
USB Port 2 – Enables/Disables USB Port 2 (USB2.0 mode in XS6 connector):
[Enabled] – USB Port 2 is on.
[Disabled] – USB Port 2 is off.
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CPB909 CPU Module
Specification
USB Port 3 – Enables/Disables USB Port 3 (USB on StackPC and MiniPCIe):
[Enabled] – USB Port 3 is on.
[Disabled] – USB Port 3 is off.
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CPB909 CPU Module
C P B 9 0 9
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CPB909 CPU Module
7.5
Specification
Security
This tab is designed for configuration of module’s protection functions. The menu of this tab is
shown in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-24: Screen of the “Security” menu tab
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ Password Description
│Set Administrator Password
│
│
│
│
│ If ONLY the Administrator's password is set,
│
│
│ then this only limits access to Setup and is
│
│
│ only asked for when entering Setup.
│
│
│ If ONLY the User's password is set, then this
│
│
│ is a power on password and must be entered to
│
│
│ boot or enter Setup. In Setup the User will
│
│
│ have Administrator rights.
│
│
│ The password length must be
│
│
│ in the following range:
│
│
│ Minimum length
3
│
│
│ Maximum length
20
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│ Administrator Password
│Enter: Select
│
│ User Password
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Administrator Password: setting password for entry to BIOS Setup with Administrator
permission.
User Password: setting password for start of OS and entry to BIOS Setup with user
permission.
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CPB909 CPU Module
7.6
Specification
Boot
Tab for configuration of booting mode and module boot devices. The menu of this tab is shown
in the figure below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-25: Screen of the “Boot" menu tab
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ Boot Configuration
│Number of seconds to wait for
│
│ Setup Prompt Timeout
1
│setup activation key.
│
│ Bootup NumLock State
[On]
│65535(0xFFFF) means indefinite │
│
│waiting.
│
│ Quiet Boot
[Disabled]
│
│
│ Fast Boot
[Disabled]
│
│
│
│
│
│
│
│
│ Boot Option Priorities
│
│
│ Boot Option #1
[P1: RunCore SSD
...] │
│
│ Boot Option #2
[UEFI: Built-in EFI ...] │
│
│
│
│
│
│────────────────────────────────│
│
│→←: Select Screen
│
│
│↑↓: Select Item
│
│
│Enter: Select
│
│
│+/-: Change Opt.
│
│
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Setup Promt Timeout: Configuration of timeout (in seconds) for displaying invitation to
enter BIOS SETUP.
Bootup NumLock State: Installation of the “NumLock” LED on keyboard “by default” at
start.
[On] – LED is on.
[Off] – LED is off.
Quiet Boot: Enables/Disables of “silent” boot mode, without displaying BIOS
information.
[Enabled] – ON.
[Disabled] – OFF.
Fast Boot: Enables/Disables fast boot mode, with initialization of minimum number of
devices.
[Enabled] – ON.
[Disabled] – OFF.
Boot Option Priorities: This submenu is used for OS boot from devices (P1: Runcore
SSD – integrated data storage device Onboard NAND Flash).
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CPB909 CPU Module
7.7
Specification
Save & Exit
Tab of parameters for exit the BIOS Setup program. The menu of this tab is shown in the figure
below.
Fig. Ошибка! Текст указанного стиля в документе отсутствует.-26: Screen of the “Save & Exit” menu tab
|
Aptio Setup Utility - Copyright (C) 2016 American Megatrends, Inc.
|
Main Advanced Chipset Security Boot Save & Exit
|
┌─────────────────────────────────────────────────────────────────┬────────────────────────────────┐
│ Save Changes and Exit
│Exit system setup after saving │
│ Discard Changes and Exit
│the changes.
│
│ Save Changes and Reset
│
│
│ Discard Changes and Reset
│
│
│
│
│
│ Save Options
│
│
│ Save Changes
│
│
│ Discard Changes
│
│
│
│
│
│ Restore Defaults
│
│
│ Save as User Defaults
│
│
│ Restore User Defaults
│
│
│
│────────────────────────────────│
│ Boot Override
│→←: Select Screen
│
│ P1: RunCore SSD
│↑↓: Select Item
│
│ UEFI: Built-in EFI Shell
│Enter: Select
│
│
│+/-: Change Opt.
│
│ Launch EFI Shell from filesystem device
│F1: General Help
│
│
│F2: Previous Values
│
│
│F3: Optimized Defaults
│
│
│F4: Save & Exit
│
│
│ESC: Exit
│
│
│
│
│
│
│
│
│
│
│
│
│
└─────────────────────────────────────────────────────────────────┴────────────────────────────────┘
|
Version 2.17.1245. Copyright (C) 2016 American Megatrends, Inc.
|
Where:
Save Changes and Exit: Exit from BIOS Setup with the changes saved
Discard Changes and Exit: Discard changes and exit from BIOS Setup
Save Changes and Reset: Save changes and restart
Discard Changes and Exit: Discard changes and restart
Save Changes: Save changes
Discard Changes: Discard changes
Restore Defaults: Boot settings made by manufacturer by default.
Save as User Defaults: Save changes as user defaults
Restore User Defaults: Boot user defaults
BOOT Override: This menu is used for compulsory selection of the device for
immediate OS boot
Launch EFI Shell from filesystem device: Launch of EFI console
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CPB909 CPU Module
ANNEX B
Specification
DISCLAIMER
This Disclaimer contains special operating conditions of Fastwel in the following areas: intellectual property, warranty
policy, conditions of the order and delivery.
1 INTELLECTUAL PRORETY
1.1 If any infraction, interference, improper use, illegitimate exploitation and/or violation of the industrial and/or
intellectual property rights of any third party and/or property, exploitation during the use of Fastwel Embedded Module
will take place – Fastwel does not guarantee to replace the materials, computer programs, procedures or equipment
affected by the complaint and under no circumstances doesn't bear responsibility in any form for possible refusal in
case of such a replacement.
1.2 Use of the Fastwel products as well as the objects of intellectual property containing in them, in the ways and for
the purposes, not provided by the present user manual and datasheet isn't allowed without preliminary written
approval of Fastwel.
1.3 Fastwel is not responsible for possible incidents and losses, related to the operation of end devices, in which the
original Fastwel equipment is used.
2 WARRANTY POLICY
2.1 When the detected flaws in an element can be corrected without decreasing the foreseen technical features and
functionality for it, User may demand Fastwel the urgent correction of the failures in additionally agreed period and an
increasing of the period of the guarantee of the element equal as the time elapsed from the formal request to repair
the failures, until the receipt of the repaired element. All costs associated to the correction of failures, included those
of assembly, dismantle, transport, tests, etc, if they exist, shall be prosecuted according the Warranty Policy of
Fastwel.
3 ORDER AND DELIVERY CONDITIONS
3.1 The general rule is that all Fastwel equipment prices are determined with due consideration of delivery under the
EXW terms and conditions (Incoterms 2010). Delivery of the products under other terms and conditions should be
preliminary agreed and stated in writing between the parties.
3.2 Unless otherwise expressly agreed with Fastwel, all the deliveries of Fastwel equipment will be carried out only
after the official purchase order is obtained and provided that the ordered products have been prepaid in full. Other
terms and conditions of cooperation should be made in writing.
3.3 Any delivery of Fastwel electronics is submitted with the right package in accordance with the current rules and
standards in the Member States of the European Economic Area. The purchaser independently bears all risks
regarding the compliance of package and marking of Fastwel products with legislation requirements being in effect at
the place of purchased products destination (in the buyer’s country). The specified condition excludes unequivocally
any liability of Fastwel for possible non-compliance of package and marking of products with the requirements of
legislation of the country of products destination.
3.4 In general, all components of the supply are properly protected with respect to freight, in order to avoid any
damage to the supply, third parties, environmental damages or unrelated goods, as consequence of wrong
packaging.
3.5 Each package unit is labeled on the exterior area with the indications of product’s Part Number and Serial
Number.
3.6 The support documents for the order should be made either in English or in Russian unless otherwise agreed
between parties in writing.
3.7 Fastwel does not pay penalties and does not cover costs associated with delay in the delivery of the products
caused by actions of the third parties, force-majeure etc. - Fastwel doesn't bear any responsibility for non-execution
or inadequate execution of the obligations in a case when it is caused by actions of the third parties (for example
producers or suppliers of accessories), force majeure etc.
3.8 Fastwel declares that independently and at any time without damage, it has an exclusive right to define and
change functionality architecture, bill of materials of its products without any preliminary coordination and approvals of
the third parties.
4 OTHER CONDITIONS
4.1 Fastwel has the obligation to respect the current Russian legislation (including, but not limited to environmental,
labor, social laws) in each moment and to apply it to its embedded electronics considering all and each execution
phase, that is to say, from the design until the commissioning and subsequent maintenance. In this regard Fastwel is
not liable to the user or other persons in connection with possible changes of the company’s rules (including, but not
limited to warranty, ordering policy) caused by changes of the Russian legislation.
4.2 Unless otherwise expressly agreed in writing, Fastwel provides no training for
assembly\installation\adjustment\operation of its equipment.
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