HUAWEI Tecal E9000 Converged Infrastructure Blade Server

HUAWEI Tecal E9000
Converged Infrastructure Blade Server
Professional • Trusted Future-oriented
HUAWEI TECHNOLOGIES CO., LTD.
The E9000 is a new-generation blade server that integrates computing, storage, switching, and management subsystems to form
a powerful converged infrastructure platform. The E9000 is an industry-leading hardware computing platform that improves
competitiveness based on its availability, computing density, energy consumption, low emissions, midplane bandwidth, intelligent
management and services, elastic configuration, flexible computing and storage expansion capabilities, low network latency, and
acceleration functions.
Chassis
E9000 chassis
Compute
node
CH121
Compute node
CH140
compute node
CH220
I/O expansion
compute node
CX110
GE switch module
Switch
module
CX311
10GE/FCoE/FC converged
switch module
CH221
I/O expansion
compute node
CH222
Storage expansion
compute node
CX116
GE pass through module
CX317
10GE pass through module
CH240
Compute node
CH242
compute node
CX310
10GE/FCoE converged switch module
CX610
InfiniBand QDR/FDR
converged switch module
CX911/CX912
10GE/FC multi-plane
switch module
Underpinned by leading technology and architecture, the E9000 applies Huawei's extensive technical experience in the ICT field coupled with Huawei's
proprietary technologies and solutions to ensure industry-leading quality and distinctive functionality.
Highest computing density in a chassis
Best internal storage capability
• Supports Intel® Xeon® E5 and E7 series processors.
• Supports 2 x 2.5" hard disks on a half-width compute node.
• Supports two small 2-socket compute nodes in a half-width slot.
• Supports 8 x 2.5" hard disks on a full-width, 4-socket compute node.
• Supports large-capacity, cost-effective DIMMs at 1.5 times the usual
• Supports 15 x 2.5" hard disks on a full-width storage expansion
height.
compute node.
Best scalability
Highest switching and I/O capability
• Supports free combinations of 2-socket and 4-socket compute nodes.
• Supports a midplane capable of 15.6Tbit/s.
• Supports standard PCIe card expansion on half-width compute nodes.
• Provides 128 x 10GE ports on a chassis.
• Supports 4 standard PCIe card expansion on full-width compute nodes.
• Supports 10GE/FCoE/FC/InfiniBand switching and evolution to 100GE/
InfiniBand EDR.
Typical applications
The E9000 integrates computing, storage, and networking resources to meet carriers' and enterprises' requirements for high-end core applications such as
private clouds and high-performance computing.
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HUAWEI Tecal E9000 Chassis
(E9000 chassis)
Superb performance
•• Supports evolution based on three generations of high-performance Intel processors.
•• Supports 48 DIMMs in a full-width slot with up to 1.5 TB of highly cost-effective
memory capacity.
•• Supports 15 x 2.5" hard disks in a full-width slot.
•• Supports I/O acceleration using GPUs, PCIe SSDs, and DSP.
•• Supports half-width/700 W and full-width/1400 W for heat dissipation and
power supply.
•• Supports 40GE and InfiniBand FDR (56G) and evolution to 100GE and InfiniBand EDR.
Converged architecture
•• Adopts a modular design for computing, storage, switching, power supply,
and cooling.
•• Supports a dynamically scalable architecture by providing 2-socket and 4-socket
compute nodes.
•• Provides various switch modules (such as GE, 10GE, FC, FCoE, and InfiniBand) that
can be flexibly configured based on service requirements.
The E9000 chassis is 12 U high and features
an optimized layout structure to maximally use
space. It provides 16 slots and redundant power
supply modules (PSMs), heat dissipation modules,
Green and Reliable
management modules, and switch modules. The
•• Adopts efficient Platinum AC PSMs with more than 95% power conversion efficiency.
•• Implements dynamic energy saving management functions.
•• Optimizes system air ducts to optimize heat dissipation.
•• Supports fully redundant function modules to enable seamless switchover.
•• Uses a passive midplane to prevent single point of failures.
E9000 chassis can be installed in a standard 19-inch
rack at a depth of at least 1,000 mm. Two types of
E9000 chassis are provided: AC and DC.
Technical Specifications
Form factor
Blade
12 U
16 half-width slots or 8 full-width slots; supports flexible configurations of single-slot, dual-slot, full-width, and half-width nodes and can
accommodate up to 16 Huawei CH series half-width compute nodes
4 slots for Huawei CX series switch modules (or eight sub switch modules) provide a midplane switching capability of 15.6 Tbit/s.
CX110 GE switch module: 12 x GE + 4 x 10GE uplink, 32 x GE downlink
CX116 GE pass through module: 32 x GE uplink, 32 x GE downlink
Switch module
CX310 10GE switch module: 16 x 10GE uplink, 32 x 10GE downlink
CX311 10GE/FCoE converged switch module: 16 x 10GE + 8 x 8G FC uplink, 32 x 10GE downlink
CX317 10GE pass through module: 32 x 10GE uplink, 32 x 10GE downlink
CX610 InfiniBand switch module (QDR 40Gbit/s, FDR 56Gbit/s): 18 x QDR/FDR uplink, 16 x QDR/FDR downlink
CX911/CX912 multi-plane switch module; supports FC ports: 16 x 10GE + 8 x 8G FC uplink, 32 x 10GE/16 x 8G FC downlink
PSM
AC/DC PSM: Maximum six 3000 W AC or six 2500 W DC hot-swappable PSUs, N+N or N+M redundant
Fan module
Provides 14 hot-swappable fan modules in N+1 redundancy mode
Complies with IPMI v2.0 and supports management functions such as remote startup, shutdown, reset, logging, hardware monitoring, SOL,
Management
KVM over IP, virtual media, fan module monitoring, and PSM monitoring
Supports 1+1 redundancy
Provides a local KVM port for server management
Power supply
110 V/220 V AC or –48 V DC
Operating temperature
5°C to 40°C
Height: 530 mm (20.87 in.)
Dimensions
Width: 442 mm (17.40 in.)
Depth: 840 mm (33.07 in.)
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HUAWEI Tecal
CH121 Compute Node
High density and large memory
•• Supports the full series of Intel® Xeon® E5-2600 series quad-core, six-core, and
eight-core processors to deliver up to 2*eight-core 2.9 GHz of computing power.
•• Provides 24 DIMMs at 1.5 times the usual height. These apply mainstream
granules and double the memory capacity to up to 768 GB DDR3 (providing the
highest cost-efficiency for large-memory applications).
•• Supports 2 x 2.5" SAS/SATA HDDs or SSDs.
Minimum energy for maximum efficiency
•• Adopts the dynamic energy saving and power capping technologies to optimally
manage and control power consumption with power remarkably reduced in lowload operating.
•• Applies carrier-class design, manufacturing processes, and components to ensure
high quality.
•• Reduces O&M costs by supporting remote deployment and fault location technologies
such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
•• Provides efficient and secure power consumption analysis and control capabilities.
•• Complies with Intel® NM 2.0.
•• Provides a sub-3s power capping response on each compute node to optimize
power consumption control.
•• Supports an intelligent and secure power-off mode for compute nodes.
•• Supports the black box function to facilitate quick fault location and service recovery.
Technical Specifications
Form factor
Half-width 2-socket compute node
Number of processors
1 or 2
Intel® Xeon® E5-2600 series
Core options: 4, 6, or 8
Number of DIMMs
24 DDR3 DIMMs, providing a maximum memory capacity of 768 GB
Number of hard disks
2 x 2.5" SAS/SATA HDDs or SSDs
RAID support
RAID 0 and 1
PCIe expansion
2 PCIe x16 mezz modules
1 standard PCIe x8 full-height half-length card
Microsoft Windows Server 2008 R2 Enterprise/Standard Edition 32/64bit
Operating systems
supported
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware
Operating temperature
5°C to 40°C
Height: 60.46 mm (2.38 in.)
Dimensions
Width: 215 mm (8.46 in.)
Depth: 525 mm (20.67 in.)
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enterprise service applications such as virtualization,
cloud computing, and high-performance computing,
Intelligent platform for strong management
Processor model
The CH121 combines dense computing capabilities
with an ultra-large memory capacity. Optimized for
the CH121 employs Intel ® Xeon® E5-2600 series
processors (up to 135 W) and supports up to 24
DIMM slots, 2 internal hard disks, and 1 standard
PCI x8 full-height half-length card.
HUAWEI Tecal
CH140 Compute Node
Outstanding computing performance based on ultra high density
•• Supports Intel® Xeon® E5-2600 full series of 4-core, 6-core, and 8-core processors
(up to 130 W) to deliver up to 4 x 8-core 2.7 GHz computing capabilities; a halfwidth slot supports two small slots in two layers for installing two independent
2-socket compute nodes.
•• provides eight DIMM slots on a 2-socket compute node, supporting a DDR3
memory capacity of up to 256 GB on a 2-socket compute node.
•• Supports one internal 2.5" SSD on a 2-socket compute node.
High efficiency and energy-saving
•• Uses the dynamic energy saving and power capping technologies to optimally
manage and control power consumption with power reduced in low-load operating.
Optimized for HPC and computing-dense enterprise
•• Adopts the carrier-class design, manufacturing process, and component selection
services, the CH140 provides ultra high computing
capabilities. A half-width slot supports two 2-socket
to ensure high quality.
compute nodes. Each compute node can be
Easy management with the intelligent platform
maintained independently. The CH140 uses Intel®
•• Reduces O&M costs by using remote deployment and fault locating methods including
Xeon® E5-2600 series processors and supports eight
SOL, KVM over IP, virtual CD-ROM drive, and WebUIs in compliance with IPMI 2.0.
DIMM slots and one hard disk.
•• Supports efficient and secure power consumption analysis and control capabilities.
•• Complies with Intel® NM 2.0.
•• Implements efficient power consumption control by supporting power capping
operations within 3s on a compute node.
•• Supports an intelligent and secure power-on mode for compute nodes.
•• Supports the black box function to facilitate fault location, quickly recovering services.
Technical Specifications
Form factor
Two 2-socket compute nodes in a half-width slot
Number of processors
4
Processor model
Intel® Xeon® E5-2600 series 4-core, 6-core, and 8-core processors
Number of DIMMs
8 DDR3 DIMMs for each 2-socket compute node, up to 512 GB in a half-width slot
Number of hard disks
One 2.5" SSD for each 2-socket compute node
PCIe expansion
2 PCIe x8 mezz module for each 2-socket compute node
Microsoft Windows Server 2008 R2 Enterprise/Standard Edition 32/64bit
Operating systems
supported
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
Operating temperature
5°C to 35°C
Height: 60.46 mm (2.38 in.)
Dimensions
Width: 215 mm (8.46 in.)
Depth: 525 mm (20.67 in.)
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HUAWEI Tecal
CH220 I/O Expansion Compute Node
Large memory and outstanding expandability
•• Supports the full series of Intel® Xeon® E5-2600 series quad-core, six-core, and
eight-core processors to deliver up to 2*eight-core 2.9 GHz of computing power.
•• Provides 24 DIMMs at 1.5 times the usual height. These apply mainstream
granules and double the memory capacity to up to 768 GB DDR3 (providing the
highest cost-efficiency for large-memory applications).
•• Provides 4 PCIe x8 full-height half-length slots for installing 4 GPUs or PCIe SSDs,
providing the best possible PCIe expansion capability on a single compute node.
(Note: card quantity is determined by card's physical size and the signal bandwidth.)
Minimum energy for maximum efficiency
Designed for application acceleration scenarios,
•• Adopts the dynamic energy saving and power capping technologies to optimally
VDI, virtualization and databases, the CH220
manage and control power consumption with power remarkably reduced in low-
provides superior scalability and a huge memory
load operating.
capacity. Featuring Intel ® Xeon® E5-2600 series
•• Applies carrier-class design, manufacturing processes, and components to ensure
high quality.
DIMM slots, 2 internal hard disks, and 4 standard
Intelligent platform for strong management
•• Reduces O&M costs by supporting remote deployment and fault location technologies
such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
•• Provides efficient and secure power consumption analysis and control capabilities.
•• Complies with Intel® NM 2.0.
•• Provides a sub-3s power capping response on each compute node to optimize
power consumption control.
•• Supports an intelligent and secure power-off mode for compute nodes.
•• Supports the black box function to facilitate quick fault location and service recovery.
Technical Specifications
Form factor
Full-width 2-socket compute node
Number of processors
1 or 2
Processor model
Intel® Xeon® E5-2600 series
Core options: 4, 6, or 8
Number of DIMMs
24 DDR3 DIMMs, providing a maximum memory capacity of 768 GB
Number of hard disks
2 x 2.5" SAS/SATA HDDs or SSDs
RAID support
RAID 0 and 1
PCIe expansion
2 PCIe x16 mezz modules (Note: One module has been occupied)
4 standard PCIe x8 full-height half-length cards
Microsoft Windows Server 2008 R2 Enterprise/Standard Edition 32/64bit
Operating systems
supported
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware
Operating temperature
5°C to 40°C
Height: 60.46 mm (2.38 in.)
Dimensions
Width: 423 mm (16.65 in.)
Depth: 525 mm (20.67 in.)
5
processors (up to 135 W) and support for up to 24
PCI x8 full-height half-length cards, the CH220 can
be expanded for I/O acceleration components such
as PCIe SSDs and GPUs.
HUAWEI Tecal
CH221 I/O Expansion Compute Node
Large memory and outstanding expandability
•• Supports the full series of Intel® Xeon® E5-2600 series quad-core, six-core, and
eight-core processors to deliver up to 2*eight-core 2.9 GHz of computing power.
•• Provides 24 DIMMs at 1.5 times the usual height. These apply mainstream
granules and double the memory capacity to up to 768 GB DDR3 (providing the
highest cost-efficiency for large-memory applications).
•• Provides 2 PCIe x16 full-height full-length slots or 1 PCIe x16 full-height full-length
dual-slot card expansion slot for installing 2 full-height full-length GPUs or PCIe
SSDs or 1 full-height full-length dual-slot GPGPU card.
Minimum energy for maximum efficiency
•• Adopts the dynamic energy saving and power capping technologies to optimally
manage and control power consumption with power remarkably reduced in lowload operating.
•• Applies carrier-class design, manufacturing processes, and components to ensure
The CH221 provides superior scalability and an
outstanding memory capacity. Featuring Intel® Xeon®
E5-2600 series processors (up to 135 W) and support
for up to 24 DIMM slots, 2 internal hard disks, and
2 standard PCI x16 full-height full-length cards, the
CH221 is suitable for high-performance computing
high quality.
applications that require graphics processing and
Intelligent platform for strong management
application performance acceleration, such as
•• Reduces O&M costs by supporting remote deployment and fault location technologies
oil exploration, animation rendering, scientific
such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
computing, and seismic processing.
•• Provides efficient and secure power consumption analysis and control capabilities.
•• Complies with Intel® NM 2.0.
•• Provides a sub-3s power capping response on each compute node to optimize
power consumption control.
•• Supports an intelligent and secure power-off mode for compute nodes.
•• Supports the black box function to facilitate quick fault location and service recovery.
Technical Specifications
Form factor
Full-width 2-socket compute node
Number of processors
1 or 2
Processor model
Intel® Xeon® E5-2600 series
Core options: 4, 6, or 8
Number of DIMMs
24 DDR3 DIMMs, providing a maximum memory capacity of 768 GB
Number of hard disks
2 x 2.5" SAS/SATA HDDs or SSDs
RAID support
RAID 0 and 1
PCIe expansion
2 PCIe x16 mezz modules (Note:One module has been occupied)
2 standard PCIe x16 full-height full-length cards
Microsoft Windows Server 2008 R2 Enterprise/Standard Edition 32/64bit
Operating systems
supported
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware
Operating temperature
5°C to 40°C
Height: 60.46 mm (2.38 in.)
Dimensions
Width: 423 mm (16.65 in.)
Depth: 525 mm (20.67 in.)
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HUAWEI Tecal
CH222 Storage Expansion Compute Node
Huge storage and computing capabilities
•• Supports the full series of Intel® Xeon® E5-2600 series quad-core, six-core, and
eight-core processors to deliver up to 2*eight-core 2.9 GHz of computing power.
•• Provides 24 DIMMs at 1.5 times the usual height. These apply mainstream
granules and double the memory capacity to up to 768 GB DDR3 (providing the
highest cost-efficiency for large-memory applications).
•• Supports 15 x 2.5" SAS/SATA HDDs or SSDs, which provide the highest storage
capacity on a single node.
Minimum energy for maximum efficiency
•• Adopts the dynamic energy saving and power capping technologies to optimally
manage and control power consumption with power remarkably reduced in low-
performance and a large storage capacity. Featuring
load operating.
Intel® Xeon® E5-2600 series processors (up to 135
•• Applies carrier-class design, manufacturing processes, and components to ensure
high quality.
•• Reduces O&M costs by supporting remote deployment and fault location technologies
such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
•• Provides efficient and secure power consumption analysis and control capabilities.
•• Complies with Intel® NM 2.0.
•• Provides a sub-3s power capping response on each compute node to optimize
power consumption control.
•• Supports an intelligent and secure power-off mode for compute nodes.
•• Supports the black box function to facilitate quick fault location and service recovery.
Technical Specifications
Form factor
Full-width 2-socket compute node
Number of processors
1 or 2
Processor model
Intel® Xeon® E5-2600 series
Core options: 4, 6, or 8
Number of DIMMs
24 DDR3 DIMMs, providing a maximum memory capacity of 768 GB
Number of hard disks
15 x 2.5" SAS/SATA HDDs or SSDs
RAID support
RAID 0, 1, 10, 5, 50, 6, and 60 with a 512 MB/1 GB RAID cache
PCIe expansion
2 PCIe x16 mezz modules
1 standard PCIe x8 full-height half-length card
Microsoft Windows Server 2008 R2 Enterprise/Standard Edition 32/64bit
Operating systems
supported
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware
Operating temperature
5°C to 40°C
Height: 60.46 mm (2.38 in.)
Dimensions
W) and support for up to 24 DIMM slots, 15 x 2.5"
hard disks, and a 1 GB RAID cache, the CH222
Intelligent platform for strong management
Width: 423 mm (16.65 in.)
Depth: 525 mm (20.67 in.)
7
The CH222 provides superior computing
is suitable for big-data analysis and processing
applications that require large storage capacity
and high computing performance, such as videos,
searches, and biological sciences.
HUAWEI Tecal
CH240 Compute Node
Super large memory and strong computing capabilities
•• Supports Intel® Xeon® E5-4600 series processors, with up to 8 cores each, a 20
MB L3 cache, 8 GT/s QPI, hyper-threading, and Turbo acceleration technology.
•• Provides 48 DIMMs at 1.5 times the usual height. These apply mainstream
granules and provide the memory capacity of up to 1.5 TB DDR3 (providing the
highest cost-efficiency for large-memory applications).
•• Supports up to 8 x 2.5" SAS/SATA HDDs or SSDs, or SSDs (twice as many hard
disks as competitors' 4-socket blade servers).
Minimum energy for maximum efficiency
The CH240 delivers outstanding computing
•• Adopts the dynamic energy saving and power capping technologies to optimally
performance and a large memory capacity. It adopts
manage and control power consumption with power remarkably reduced in lowload operating.
•• Applies carrier-class design, manufacturing processes, and components to ensure
high quality.
Intel® Xeon ® E5-4600 series high-performance
processors and supports 48 DDR3 DIMM slots, 8 hard
disks, and RAID 0 1, 10, 5, 50, 6, and 60. The CH240
is designed for virtualization, cloud computing, high-
Intelligent platform for strong management
performance computing, and cluster deployment
•• Reduces O&M costs by supporting remote deployment and fault location technologies
to meet high-end enterprise service requirements.
such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.
It is particularly suitable for applications with high
•• Provides efficient and secure power consumption analysis and control capabilities.
performance requirements, such as image and signal
•• Complies with Intel® NM 2.0.
•• Provides a sub-3s power capping response on each compute node to optimize
power consumption control.
processing, financial algorithms, scientific computing,
and seismic processing.
•• Supports an intelligent and secure power-off mode for compute nodes.
•• Supports the black box function to facilitate quick fault location and service recovery.
Technical Specifications
Form factor
Full-width 4-socket compute node
Number of processors
2 or 4
Processor model
Intel® Xeon® E5-4600 series
Core options: 4, 6, or 8
Number of DIMMs
48 DDR3 DIMMs, providing a maximum memory capacity of 1.5 TB
Number of hard disks
8 x 2.5" SAS/SATA HDDs or SSDs
RAID support
RAID 0, 1, 10, 5, 50, 6, and 60 with a 512 MB/1 GB RAID cache
PCIe expansion
2 PCIe x16 mezz modules
Microsoft Windows Server 2008 R2 Enterprise/Standard Edition 32/64bit
Operating systems
supported
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware
Operating temperature
5°C to 40°C
Height: 60.46 mm (2.38 in.)
Dimensions
Width: 423 mm (16.65 in.)
Depth: 525 mm (20.67 in.)
8
HUAWEI Tecal
CH242 Compute Node
Excellent computing capabilities and ultra large memory
•• Supports up to four Intel® Xeon® E7-4800 series processors, with up to ten cores
each, a L3 cache capacity of 30 MB, 6.4 GT/s QPI, hyper-threading, and Turbo
acceleration technology.
•• Provides 32 DIMM slots, supporting a DDR3 memory capacity of up to 1 TB.
•• Supports up to 8 x 2.5" SAS/SATA HDDs, or SSDs (twice as many disks as
competitors' servers).
•• Provides one standard full-height, half-length PCIe x8 slot.
High efficiency and energy-saving
•• Adopts the dynamic energy-saving solution to greatly reduce power consumption
in low-load operating.
•• Applies the carrier-class design, manufacturing process, and component selection
to ensure high quality.
•• Reduces O&M costs by using remote deployment and fault locating methods
including SOL, KVM over IP, virtual CD-ROM drive, and WebUIs in compliance with
IPMI 2.0.
•• Support the black box function to facilitate fault location, quickly recovering services.
Technical Specifications
Form factor
Full-width 4-socket compute node
Number of processors
2 or 4
Processor model
Intel® Xeon® E7-4800 series 6-core, 8-core, and 10-core processors
Number of DIMMs
32 DDR3 DIMMs, up to 1 TB
Number of hard disks
8 x 2.5" SAS/SATA HDDs, or SSDs
RAID support
RAID 0, 1, 10, 5, 50, 6, and 60 with a 1 GB RAID cache
4 PCIe x8 mezz modules
1 standard PCIe x8 full-height half-length card
Microsoft Windows Server 2008 R2 Enterprise/Standard Edition 32/64bit
Operating systems
supported
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
Operating temperature
5°C to 40°C
Height: 60.46 mm (2.38 in.)
Dimensions
Width: 423 mm (16.65 in.)
Depth: 525 mm (20.67 in.)
9
large memory capacity, the CH242 uses Intel® Xeon®
E7-4800 series processors, provides 32 DDR3 DIMM
Easy management with the intelligent platform
PCIe expansion
With excellent computing capabilities and a ultra
slots, and supports eight hard disks and RAID 0,
1, 10, 5, 50, 6, and 60. It is suitable for high-end
enterprise applications such as ERP and CRM.
HUAWEI Tecal E9000
Switch Module
The E9000 supports nine types of switch modules: CX110 GE switch module, CX111 GE switch module,CX116 GE pass through
module, CX310 10GE switch module, CX311 10GE/FCoE converged switch module, CX317 10GE pass through module, CX610
InfiniBand switch module, and CX911/CX912 10GE/FC multi-plane switch module. You can select the one that best suits your service
requirements for network I/O. Their detailed specifications are described in the tables below:
CX110 GE switch module
Network ports
12 x GE +4 x 10GE SFP+ uplink
32 x GE downlink
L2: VLAN/MSTP/LACP/TRILL/Stack/IGMP
Network features
L3: RIP/OSPF/ISIS/BGP/VRRP/BFD/PIM
QoS: ACL/CAR/ DiffServ
Security: IPSG/MFF/DAI /DHCP Snooping
Management port
2 x RS232 management serial ports (one each for services and management)
Dimensions
Height: 388.6 mm (15.30 in.), width: 35.1 mm (1.38 in.), depth: 255.4 mm (10.06 in.)
CX116 GE pass through module
Network port
Dimensions
32 x GE uplink
32 x GE downlink
Height: 388.6 mm (15.30 in.), width: 35.1 mm (1.38 in.), depth: 255.4 mm (10.06 in.)
CX310 10GE converged switch module
Network port
16 x 10GE uplink
32 x 10GE downlink
L2: VLAN/MSTP/LACP/TRILL/Stack/IGMP
Network features
L3: RIP/OSPF/ISIS/BGP/VRRP/BFD/PIM
QoS: DCBX/PFC/ETS/ACL/CAR/DiffServ
Security: IPSG/MFF/DAI/FSB/DHCP Snooping
Management port
2 x RS232 management serial ports (one each for services and management)
Dimensions
Height: 388.6 mm (15.30 in.), width: 35.1 mm (1.38 in.), depth: 255.4 mm (10.06 in.)
10
CX311 10GE/FCoE converged switch module
Network port
16 x 10GE SFP+ and 8 x 8G FC SFP+ uplink; 32 x 10GE downlink
L2: VLAN/MSTP/LACP/TRILL/Stack/IGMP
Network features
L3: RIP/OSPF/ISIS/BGP/VRRP/BFD/PIM
QoS: DCBX/PFC/ETS/ACL/CAR/DiffServ
Security: IPSG/MFF/DAI/FSB/FCF/DHCP Snooping
Management port
2 x RS232 management serial ports (one each for services and management)
Dimensions
Height: 388.6 mm (15.30 in.), width: 35.1 mm (1.38 in.), depth: 255.4 mm (10.06 in.)
CX317 10GE pass through module
Network port
Dimensions
32 x 10GE uplink
32 x 10GE downlink
Height: 388.6 mm (15.30 in.), width: 35.1 mm (1.38 in.), depth: 255.4 mm (10.06 in.)
CX610 Infiniband QDR/ FDR switch module
Network port
Network features
18 QDR/FDR InfiniBand QSFP+ uplink
16 QDR/FDR InfiniBand downlink
multicast forwarding and replication/load balancing/re-route around failed link/VL/SL/SL to VL
mapping/SM/SMA/Low latency forwarding/credit based flow control
Management port
In-band management
Dimensions
Height: 388.6 mm (15.30 in.), width: 35.1 mm (1.38 in.), depth: 255.4 mm (10.06 in.)
CX911/CX912 10GE/FC multi-plane switch module
Network port
16 x 10GE SFP+ and 8 x 8G FC SFP+ uplink
32 x 10GE/16 x 8G FC downlink
L2: VLAN/MSTP/LACP/MonitorLink/SmartLink
Network features
QoS: ACL/CAR/DiffServ
Security: SSH/DDoS Defense
CX911: integrates a Qlogic FC switch; CX912: integrates a Brocade FC switch
Management port
2 x RS232 management serial ports (one each for services and management)
Dimensions
Height: 388.6 mm (15.30 in.), width: 35.1 mm (1.38 in.), depth: 255.4 mm (10.06 in.)
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