HP ProLiant DL380p Gen8 Server User Guide

HP ProLiant DL380p Gen8 Server
User Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
Part Number: 661848-003
November 2012
Edition: 3
© Copyright 2012 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
Microsoft®, Windows®, and Windows Server® are U.S. registered trademarks of Microsoft Corporation.
Contents
Component identification ............................................................................................................... 7
Front panel components ............................................................................................................................. 7
Front panel LEDs and buttons ...................................................................................................................... 9
Access the Systems Insight Display............................................................................................................. 10
Systems Insight Display LEDs ..................................................................................................................... 11
Systems Insight Display LED combinations ................................................................................................... 12
Rear panel components ............................................................................................................................ 13
Rear panel LEDs and buttons ..................................................................................................................... 14
Non-hot-plug PCI riser board slot definitions................................................................................................ 14
System board components ........................................................................................................................ 15
System maintenance switch ............................................................................................................. 16
NMI functionality ........................................................................................................................... 17
DIMM slot locations ....................................................................................................................... 18
SAS and SATA device numbers ................................................................................................................. 18
Drive LED definitions ................................................................................................................................ 19
PCI riser cage LED ................................................................................................................................... 20
FBWC module LEDs (P222, P420, P421) ................................................................................................... 21
Hot-plug fans .......................................................................................................................................... 21
Operations................................................................................................................................. 23
Power up the server ................................................................................................................................. 23
Power down the server ............................................................................................................................. 23
Extend the server from the rack ................................................................................................................. 23
Remove the access panel.......................................................................................................................... 24
Install the access panel............................................................................................................................. 25
Access the product rear panel ................................................................................................................... 25
Opening the cable management arm ............................................................................................... 25
Remove the hot-plug fan cage ................................................................................................................... 26
Remove the hot-plug fan ........................................................................................................................... 27
Remove the full-length expansion board...................................................................................................... 28
Remove the PCI riser cage ........................................................................................................................ 29
Install the PCI riser cage ........................................................................................................................... 30
Secure the full-length expansion board retainer ........................................................................................... 31
Remove the air baffle ............................................................................................................................... 32
Setup......................................................................................................................................... 34
Optional installation services .................................................................................................................... 34
Rack planning resources........................................................................................................................... 34
Optimum environment .............................................................................................................................. 34
Space and airflow requirements ...................................................................................................... 35
Temperature requirements ............................................................................................................... 35
Power requirements ....................................................................................................................... 36
Electrical grounding requirements .................................................................................................... 36
Connecting a DC power cable to a DC power source ........................................................................ 36
Rack warnings ........................................................................................................................................ 37
Identifying the contents of the server shipping carton .................................................................................... 38
Installing hardware options ....................................................................................................................... 38
Contents
3
Installing the server into the rack................................................................................................................ 38
Installing the operating system................................................................................................................... 40
Powering on and selecting boot options ..................................................................................................... 40
Registering the server ............................................................................................................................... 41
Hardware options installation ....................................................................................................... 42
Introduction ............................................................................................................................................ 42
Processor and fan option .......................................................................................................................... 42
Memory options ...................................................................................................................................... 49
HP SmartMemory .......................................................................................................................... 50
Memory subsystem architecture ....................................................................................................... 50
Single-, dual-, and quad-rank DIMMs ............................................................................................... 51
DIMM identification ....................................................................................................................... 51
Memory configurations................................................................................................................... 52
General DIMM slot population guidelines ......................................................................................... 53
Installing a DIMM .......................................................................................................................... 55
Hot-plug hard drive options ...................................................................................................................... 55
Installing a hot-plug SAS or SATA hard drive .................................................................................... 56
Removing a hot-plug SAS or SATA hard drive ................................................................................... 57
Controller options .................................................................................................................................... 57
Installing the flash-backed write cache module................................................................................... 58
Installing the flash-backed write cache capacitor pack ........................................................................ 59
Optical drive option ................................................................................................................................ 63
Redundant hot-plug power supply option .................................................................................................... 65
FlexibleLOM option ................................................................................................................................. 66
Expansion board options.......................................................................................................................... 68
Removing the expansion slot blanks ................................................................................................. 68
Installing a half-length expansion board ........................................................................................... 69
Installing a full-length expansion board ............................................................................................. 69
Secondary PCI riser cage option ............................................................................................................... 70
Hard drive cage option ............................................................................................................................ 72
2U rack bezel option ............................................................................................................................... 81
HP Trusted Platform Module option ............................................................................................................ 82
Installing the Trusted Platform Module board ..................................................................................... 83
Retaining the recovery key/password .............................................................................................. 84
Enabling the Trusted Platform Module............................................................................................... 84
Cabling ..................................................................................................................................... 86
SAS hard drive cabling ............................................................................................................................ 86
Optical drive cabling ............................................................................................................................... 87
FBWC cabling ........................................................................................................................................ 88
Chipset SATA cable option ....................................................................................................................... 89
150W PCIe power cable option ............................................................................................................... 92
Software and configuration utilities ............................................................................................... 94
Server mode ........................................................................................................................................... 94
HP product QuickSpecs............................................................................................................................ 94
HP iLO Management Engine ..................................................................................................................... 94
HP iLO ......................................................................................................................................... 94
Intelligent Provisioning .................................................................................................................... 96
Erase Utility .................................................................................................................................. 97
Scripting Toolkit ............................................................................................................................ 97
HP Service Pack for ProLiant ..................................................................................................................... 98
HP Smart Update Manager ............................................................................................................. 98
Contents
4
HP ROM-Based Setup Utility ..................................................................................................................... 99
Using RBSU .................................................................................................................................. 99
Auto-configuration process .............................................................................................................. 99
Boot options ............................................................................................................................... 100
Configuring AMP modes .............................................................................................................. 100
Re-entering the server serial number and product ID ......................................................................... 100
Utilities and features .............................................................................................................................. 101
Array Configuration Utility ............................................................................................................ 101
Option ROM Configuration for Arrays ........................................................................................... 102
ROMPaq utility ............................................................................................................................ 102
Automatic Server Recovery ........................................................................................................... 102
USB support ................................................................................................................................ 103
Redundant ROM support .............................................................................................................. 103
Keeping the system current ..................................................................................................................... 103
Drivers ....................................................................................................................................... 103
Software and firmware ................................................................................................................. 104
Version control ............................................................................................................................ 104
HP operating systems and virtualization software support for ProLiant servers ...................................... 104
HP Technology Service Portfolio .................................................................................................... 105
Change control and proactive notification ...................................................................................... 105
Troubleshooting ........................................................................................................................ 106
Troubleshooting resources ...................................................................................................................... 106
Battery replacement .................................................................................................................. 107
Regulatory compliance notices ................................................................................................... 108
Regulatory compliance identification numbers ........................................................................................... 108
Federal Communications Commission notice ............................................................................................. 108
FCC rating label .......................................................................................................................... 108
FCC Notice, Class A Equipment .................................................................................................... 108
FCC Notice, Class B Equipment .................................................................................................... 108
Declaration of conformity for products marked with the FCC logo, United States only ..................................... 109
Modifications ........................................................................................................................................ 109
Cables ................................................................................................................................................. 109
Canadian notice (Avis Canadien) ............................................................................................................ 109
European Union regulatory notice ........................................................................................................... 110
Disposal of waste equipment by users in private households in the European Union ....................................... 110
Japanese notice .................................................................................................................................... 111
BSMI notice .......................................................................................................................................... 111
Korean notice ....................................................................................................................................... 111
Chinese notice ...................................................................................................................................... 112
Laser compliance .................................................................................................................................. 112
Battery replacement notice...................................................................................................................... 112
Taiwan battery recycling notice ............................................................................................................... 113
Power cord statement for Japan............................................................................................................... 113
Electrostatic discharge ............................................................................................................... 114
Preventing electrostatic discharge ............................................................................................................ 114
Grounding methods to prevent electrostatic discharge ................................................................................ 114
Specifications ........................................................................................................................... 115
Environmental specifications ................................................................................................................... 115
Mechanical specifications ...................................................................................................................... 115
Power supply specifications .................................................................................................................... 115
Contents
5
HP
HP
HP
HP
HP
HP
460 W CS HE Power Supply (92%) specifications ...................................................................... 116
460 W CS Platinum Power Supply (94%) specifications .............................................................. 116
750 W CS HE Power Supply (92%) specifications ...................................................................... 116
750 W CS Platinum Power Supply (94%) specifications .............................................................. 117
750 W 48V CS Power Supply specifications ............................................................................. 117
1200 W CS HE Power Supply (94%) specifications .................................................................... 118
Support and other resources ...................................................................................................... 119
Before you contact HP............................................................................................................................ 119
HP contact information ........................................................................................................................... 119
Customer Self Repair ............................................................................................................................. 119
Acronyms and abbreviations ...................................................................................................... 127
Documentation feedback ........................................................................................................... 130
Index ....................................................................................................................................... 131
Contents
6
Component identification
Front panel components
•
SFF model (8-drive)
Item
Description
1
Video connector
2
SATA optical drive bay
3
Drive bays
4
Systems Insight Display
5
USB connectors (2)
•
SFF model with optional hard drive cage (16-drive)
Item
Description
1
Video connector
2
Drive bays (box 1)
3
Drive bays (box 2)
4
Systems Insight Display
5
USB connectors (2)
Component identification 7
•
SFF model (25-drive)
Item
Description
1
Video connector
2
Quick release levers (2)
3
Drive bays
4
USB connector
•
LFF model (8-drive)
Item
Description
1
Video connector
2
SATA optical drive bay
3
Drive bays
4
Systems Insight Display
5
USB connectors (2)
Component identification 8
•
LFF model (12-drive)
Item
Description
1
Video connector
2
Quick-release levers (2)
3
Drive bays
4
USB connector
Front panel LEDs and buttons
Item
Description
Status
1
Power On/Standby button
and system power LED
Solid green = System on
Flashing green (1 Hz/cycle per sec) = Performing power on sequence
Solid amber = System in standby
Off = No power present*
Component identification 9
Item
Description
Status
2
Health LED
Solid green = Normal
Flashing amber = System degraded
Flashing red (1 Hz/cycle per sec) = System critical
Fast-flashing red (4 Hz/cycles per sec) = Power fault**
3
NIC status LED
Solid green = Link to network
Flashing green (1 Hz/cycle per sec) = Network active
Off = No network activity
4
UID button/LED
Solid blue = Activated
Flashing blue (1 Hz/cycle per sec) = Remote management or
firmware upgrade in progress
Off = Deactivated
*Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has
occurred, or the power button cable is disconnected.
**To identify components in a degraded or critical state, see the Systems Insight Display LEDs, check iLO/BIOS logs, and
reference the server troubleshooting guide.
Access the Systems Insight Display
To access a pop-out HP Systems Insight Display:
1.
Press and release the panel.
2.
After the display fully ejects, rotate the display downward to view the LEDs.
Component identification 10
Systems Insight Display LEDs
The HP Systems Insight Display LEDs represent the system board layout. The display enables diagnosis with
the access panel installed.
Item
Description
Status
1
Power cap
Off = System is in standby, or no cap is set.
Solid green = Power cap applied
2
NIC link/activity
Off = No link to network. If the power is off,
view the rear panel RJ-45 LEDs for status
("Rear panel LEDs and buttons" on page
14).
Flashing green = Network link and activity
Solid green = Network link
3
AMP status
Off = AMP modes disabled
Solid green = AMP mode enabled
Solid amber = Failover
Flashing amber = Invalid configuration
4
Over temp
Off = Normal
Solid amber = High system temperature
detected
—
All other LEDs
Off = Normal
Amber = Failure
For more information on the activation of
these LEDs, see "Systems Insight Display
LED combinations (on page 12)."
Component identification 11
Systems Insight Display LED combinations
When the health LED on the front panel illuminates either amber or red, the server is experiencing a health
event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED
indicate system status.
Systems Insight Display Health LED
LED and color
Processor (amber)
Red
System power
LED
Status
Amber
One or more of the following conditions may
exist:
•
•
•
•
Processor in socket X has failed.
Processor X is not installed in the socket.
Processor X is unsupported.
ROM detects a failed processor during
POST.
Processor (amber)
Amber
Green
Processor in socket X is in a pre-failure
condition.
DIMM (amber)
Red
Green
One or more DIMMs have failed.
DIMM (amber)
Amber
Green
DIMM in slot X is in a pre-failure condition.
Over temp (amber)
Amber
Green
The Health Driver has detected a cautionary
temperature level.
Over temp (amber)
Red
Amber
The server has detected a hardware critical
temperature level.
PCI riser (amber)
Red
Green
The PCI riser cage is not seated properly.
Fan (amber)
Amber
Green
One fan has failed or has been removed.
Fan (amber)
Red
Green
Two or more fans have failed or been
removed.
Power supply (amber)
Red
Amber
One or more of the following conditions may
exist:
•
•
•
Power supply (amber)
Amber
Green
Only one power supply is installed and
that power supply is in standby.
Power supply fault
System board fault
One or more of the following conditions may
exist:
•
•
•
•
Redundant power supply is installed and
only one power supply is functional.
AC power cord is not plugged into
redundant power supply.
Redundant power supply fault
Power supply mismatch at POST or
power supply mismatch through hot-plug
addition
Power cap (off)
—
Amber
Standby
Power cap (green)
—
Flashing green
Waiting for power
Power cap (green)
—
Green
Power is available.
Power cap (flashing
amber)
—
Amber
Power is not available.
Component identification 12
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing
each DIMM in a bank with a known working DIMM.
Rear panel components
Item
Description
1
PCIe slots 1–3 (top to bottom)
2
PCIe slots 4–6 (top to bottom)
3
Power supply 1 (PS1)
4
PS1 power connector
5
PS2 power connector
6
Power supply 2 (PS2)
7
USB connectors (4)
8
Video connector
9
iLO connector
10
Serial connector
11
FlexibleLOM ports (Shown: 4x1Gb/Optional: 2x10Gb); port 1 on right side
Component identification 13
Rear panel LEDs and buttons
Item
Description
Status
1
UID LED/button
Off = Deactivated
Solid blue = Activated
Flashing blue = System being managed remotely
2
Power supply 2
LED
Off = System is off or power supply has failed.
Solid green = Normal
3
Power supply 1
LED
Off = System is off or power supply has failed.
Solid green = Normal
4
NIC activity LED
Off = No network activity
Solid green = Link to network
Flashing green = Network activity
5
NIC link LED
Off = No network link
Green = Network link
Non-hot-plug PCI riser board slot definitions
•
Primary riser cage connector, connected to processor 1 or the southbridge
PCIe 3-slot riser cage*
PCIe 2-slot x16 riser cage
1 - FL/FH
PCIe2 or PCIe3** x16 (16,8,4,2,1)
—
2 - HL/FH
PCIe2 or PCIe3** x8 (8,4,2,1)
—
3 - HL/FH
PCIe2 x8 (4,2,1)†
—
•
Secondary riser cage connector, connected to processor 2 (Processor 2 must be installed)
PCIe 3-slot riser cage*
PCIe 2-slot x16 riser cage
4 - FL/FH
PCIe2 or PCIe3** x16 (16,8,4,2,1)
PCIe2 or PCIe3** x16 (16,8,4,2,1)
5 - HL/FH
PCIe2 or PCIe3** x8 (8,4,2,1)
PCIe2 or PCIe3** x16 (16,8,4,2,1)
6 - HL/FH
PCIe2 or PCIe3** x8 (8,4,2,1)
—
Component identification 14
*The server ships with one PCIe3 riser cage installed in the primary riser cage connector.
**These slots can run 8 GT/s signaling rate in either PCIe2 or PCIe3 mode, depending on the capability of
the installed processor.
†PCIe slot 3 is connected to the southbridge and runs at the Gen2 signaling rate.
Notes:
•
"Primary" denotes the riser cage is installed in the primary riser connector.
•
"Secondary" denotes the riser cage is installed in the secondary riser connector.
•
Installing the riser cages listed in the table above in either the primary or secondary riser connectors
determines the form factor of the PCI cards supported by those riser cages.
•
FL/FH denotes full-length, full-height. HL/FH denotes half-length, full-height. LP denotes low profile.
•
The PCIe2 x16 riser cage supports a maximum power of 150 W with an HP power cable. This cable
must be used for PCIe card wattages greater than 75 W.
System board components
Component identification 15
Item
Description
1
Fan connector 6
2
Systems Insight Display connector
3
Fan connector 5
4
Processor 1 DIMM slots
5
Fan connector 4
6
Front I/O connector
7
Front USB connector
8
Fan connector 3
9
First drive cage, box 2 power connector
10
Fan connector 2
11
Processor 2 DIMM slots
12
Second drive cage, box 1 power connector
13
Fan connector 1
14
Discovery services connector
15
Front video connector
16
USB connector
17
Power supply backplane connector
18
SATA optical drive connector
19
NMI jumper
20
System battery
21
SD card slot
22
Secondary (processor 2) PCI riser connector
23
System maintenance switch
24
Processor 2 socket
25
TPM connector
26
Primary (processor 1) PCI riser connector
27
FlexibleLOM
28
SAS connector 1
29
SAS connector 2
30
Cache module connector
31
Processor 1 socket
32
RDX power connector
System maintenance switch
Position
Default
Function
S1
Off
Off = HP iLO security is enabled.
On = HP iLO security is disabled.
S2
Off
Off = System configuration can be
changed.
On = System configuration is locked.
S3
Off
Reserved
S4
Off
Reserved
Component identification 16
Position
Default
Function
S5
Off
Off = Power-on password is enabled.
On = Power-on password is disabled.
S6
Off
Off = No function
On = ROM reads system configuration
as invalid.
S7
—
Reserved
S8
—
Reserved
S9
—
Reserved
S10
—
Reserved
S11
—
Reserved
S12
—
Reserved
To access redundant ROM, set S1, S5, and S6 to on.
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all
system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to
properly configure the server or data loss could occur.
NMI functionality
An NMI crash dump enables administrators to create crash dump files when a system is hung and not
responding to traditional debug mechanisms.
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for
administrators is to cycle the system power. Resetting the system erases any information that could support
problem analysis, but the NMI feature preserves that information by performing a memory dump before a
hard reset.
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the iLO
Virtual NMI feature.
For more information, see the white paper on the HP website
(http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf).
Component identification 17
DIMM slot locations
DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the
letter assignments for population guidelines.
SAS and SATA device numbers
•
SFF 8-device bay numbering
•
Optional SFF 16-device bay numbering
•
SFF 25-device bay numbering
Component identification 18
•
LFF 8-device bay numbering
•
LFF 12-device bay numbering
Drive LED definitions
Item
LED
Status
1
Locate
Solid blue
The drive is being identified by a host application.
Flashing blue
The drive carrier firmware is being updated or requires an update.
Rotating green
Drive activity
Off
No drive activity
2
Activity ring
Definition
Component identification 19
Item
LED
Status
Definition
3
Do not remove
Solid white
Do not remove the drive. Removing the drive causes one or more of
the logical drives to fail.
Off
Removing the drive does not cause a logical drive to fail.
Solid green
The drive is a member of one or more logical drives.
Flashing green
The drive is rebuilding or performing a RAID migration, stripe size
migration, capacity expansion, or logical drive extension, or is
erasing.
Flashing
amber/green
The drive is a member of one or more logical drives and predicts
the drive will fail.
Flashing amber
The drive is not configured and predicts the drive will fail.
Solid amber
The drive has failed.
Off
The drive is not configured by a RAID controller.
4
Drive status
PCI riser cage LED
CAUTION: To prevent damage to the server or expansion boards, power down the server and
remove all AC power cords before removing or installing the PCI riser cage.
Status
On = AC power is connected.
Off = AC power is disconnected.
Component identification 20
FBWC module LEDs (P222, P420, P421)
The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the
reverse side of the cache module to facilitate status viewing.
1 - Amber
2 - Green
3 - Green
Interpretation
Off
Off
Off
The cache module is not powered.
Off
Flashing 0.5 Hz
Flashing 0.5 Hz
The cache microcontroller is executing from within its
boot loader and receiving new flash code from the host
controller.
Off
Flashing 1 Hz
Flashing 1 Hz
The cache module is powering up, and the capacitor
pack is charging.
Off
Off
Flashing 1 Hz
The cache module is idle, and the capacitor pack is
charging.
Off
Off
On
The cache module is idle, and the capacitor pack is
charged.
Off
On
On
The cache module is idle, the capacitor pack is charged,
and the cache contains data that has not yet been
written to the drives.
Off
Flashing 1 Hz
Off
A backup is in progress.
Off
On
Off
The current backup is complete with no errors.
Flashing 1 Hz
Flashing 1 Hz
Off
The current backup failed, and data has been lost.
Flashing 1 Hz
Flashing 1 Hz
On
A power error occurred during the previous or current
boot. Data may be corrupt.
Flashing 1 Hz
On
Off
An overtemperature condition exists.
Flashing 2 Hz
Flashing 2 Hz
Off
The capacitor pack is not attached.
Flashing 2 Hz
Flashing 2 Hz
On
The capacitor has been charging for 10 minutes, but
has not reached sufficient charge to perform a full
backup.
On
On
Off
The current backup is complete, but power fluctuations
occurred during the backup.
On
On
On
The cache module microcontroller has failed.
Hot-plug fans
Component identification 21
CAUTION: To avoid damage to server components, fan blanks must be installed in fan bays 1
and 2 in a single-processor configuration.
The only two valid fan configurations are listed in the following table.
Configuration
Fan bay 1
Fan bay 2
Fan bay 3
Fan bay 4
Fan bay 5
Fan bay 6
1 processor
Fan blank
Fan blank
Fan
Fan
Fan
Fan
2 processors
Fan
Fan
Fan
Fan
Fan
Fan
For a single-processor configuration, four fans and two blanks are required in specific fan bays for
redundancy. A fan failure or missing fan causes a loss of redundancy. A second fan failure or missing fan
causes an orderly shutdown of the server.
Installing more than the required number of fans in a single-processor configuration is not a supported
configuration.
For a dual-processor configuration, six fans are required for redundancy. A fan failure or missing fan causes
a loss of redundancy. A second fan failure or missing fan causes an orderly shutdown of the server.
The server supports variable fan speeds. The fans operate at minimum speed until a temperature change
requires a fan speed increase to cool the server. The server shuts down during the following
temperature-related scenarios:
•
At POST and in the OS, HP iLO performs an orderly shutdown if a cautionary temperature level is
detected. If the server hardware detects a critical temperature level before an orderly shutdown occurs,
the server performs an immediate shutdown.
•
When the Thermal Shutdown feature is disabled in RBSU, HP iLO does not perform an orderly shutdown
when a cautionary temperature level is detected. Disabling this feature does not disable the server
hardware from performing an immediate shutdown when a critical temperature level is detected.
CAUTION: A thermal event can damage server components when the Thermal Shutdown feature
is disabled in RBSU.
Component identification 22
Operations
Power up the server
To power up the server, press the Power On/Standby button.
Power down the server
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical
server data and programs.
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the
system.
To power down the server, use one of the following methods:
•
Press and release the Power On/Standby button.
This method initiates a controlled shutdown of applications and the OS before the server enters standby
mode.
•
Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter
standby mode.
This method forces the server to enter standby mode without properly exiting applications and the OS.
If an application stops responding, you can use this method to force a shutdown.
•
Use a virtual power button selection through HP iLO.
This method initiates a controlled remote shutdown of applications and the OS before the server enters
standby mode.
Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.
Extend the server from the rack
1.
Pull down the quick release levers on each side of the server.
2.
Extend the server from the rack.
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is
adequately stabilized before extending a component from the rack.
Operations
23
3.
After performing the installation or maintenance procedure, slide the server back into the rack, and then
press the server firmly into the rack to secure it in place.
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release
latches and sliding the server into the rack. The sliding rails could pinch your fingers.
Remove the access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize
the amount of time the access panel is open.
Operations
24
To remove the component:
1.
Power down the server if performing a non-hot-plug installation or maintenance procedure ("Power
down the server" on page 23).
2.
Extend the server from the rack (on page 23).
3.
Use the T-15 Torx screwdriver attached to the rear of the server to loosen the security screw on the hood
latch.
4.
Lift up on the hood latch handle, and then remove the access panel.
Install the access panel
1.
Place the access panel on top of the server with the hood latch open. Allow the panel to extend past the
rear of the server approximately 1.25 cm (0.5 in).
2.
Push down on the hood latch. The access panel slides to a closed position.
3.
Use the T-15 Torx screwdriver attached to the rear of the server to tighten the security screw on the hood
latch.
Access the product rear panel
Opening the cable management arm
To access the server rear panel:
1.
Release the cable management arm.
Operations
25
2.
Open the cable management arm. Note that the cable management arm can be right-mounted or
left-mounted.
Remove the hot-plug fan cage
To remove the component:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend ("Extend the server from the rack" on page 23) or remove the server from the rack.
4.
Remove the access panel (on page 24).
5.
Remove the air baffle (on page 32).
Operations
26
6.
Remove the fan cage.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
IMPORTANT: For optimum cooling, install fans in all primary fan locations. For more
information, refer to the fan locations table ("Hot-plug fans" on page 21).
To replace the component, reverse the removal procedure.
Remove the hot-plug fan
To remove the component:
1.
Extend or remove the server from the rack ("Extend the server from the rack" on page 23).
2.
Remove the access panel (on page 24).
Operations
27
3.
Remove the fan.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
IMPORTANT: For optimum cooling, install fans in all primary fan locations. For more
information, refer to the fan locations table ("Hot-plug fans" on page 21).
To replace the component, reverse the removal procedure.
Remove the full-length expansion board
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
To remove the component:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend ("Extend the server from the rack" on page 23) or remove the server from the rack.
4.
Remove the access panel (on page 24).
5.
Disconnect any external cables that are connected to the expansion board.
6.
Disconnect any internal cables that are connected to the expansion board.
Operations
28
7.
Release the full-length expansion board retainer, and then remove the PCIe riser cage.
8.
Remove the full-length expansion board.
To replace the component, reverse the removal procedure.
Remove the PCI riser cage
CAUTION: To prevent damage to the server or expansion boards, power down the server and
remove all AC power cords before removing or installing the PCI riser cage.
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
Operations
29
5.
Release the full-length expansion board retainer, and then remove the PCI riser cage.
6.
Remove the full-length expansion board.
Install the PCI riser cage
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
Operations
30
5.
Install the PCI riser cage.
6.
Install the access panel (on page 25).
7.
Install the server into the rack ("Installing the server into the rack" on page 38).
8.
Connect each power cord to the server.
9.
Connect each power cord to the power source.
10.
Power up the server (on page 23).
Secure the full-length expansion board retainer
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
5.
Install a full-length expansion board ("Installing a full-length expansion board" on page 69).
6.
Install the PCI riser cage (on page 30).
Operations
31
7.
Secure the full-length expansion board retainer.
8.
Install the access panel (on page 25).
9.
Install the server into the rack ("Installing the server into the rack" on page 38).
10.
Connect each power cord to the server.
11.
Connect each power cord to the power source.
12.
Power up the server (on page 23).
Remove the air baffle
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize
the amount of time the access panel is open.
To remove the component:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend or remove the server from the rack ("Extend the server from the rack" on page 23).
4.
Remove the access panel (on page 24).
CAUTION: Do not detach the cable that connects the battery pack to the cache module.
Detaching the cable causes any unsaved data in the cache module to be lost.
IMPORTANT: It is necessary to remove the PCI riser cage only if there is a full-length expansion
board installed.
Operations
32
5.
Release the full-length expansion board retainer, and then remove the PCI riser cage.
6.
Remove the air baffle.
To replace the component, reverse the removal procedure.
Operations
33
Setup
Optional installation services
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and
running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate
both hardware and software support into a single package. A number of service level options are available
to meet your needs.
HP Care Pack Services offer upgraded service levels to expand your standard product warranty with
easy-to-buy, easy-to-use support packages that help you make the most of your server investments. Some of
the Care Pack services are:
•
•
•
•
Hardware support
o
6-Hour Call-to-Repair
o
4-Hour 24x7 Same Day
o
4-Hour Same Business Day
Software support
o
Microsoft®
o
Linux
o
HP ProLiant Essentials (HP SIM and RDP)
o
VMware
Integrated hardware and software support
o
Critical Service
o
Proactive 24
o
Support Plus
o
Support Plus 24
Startup and implementation services for both hardware and software
For more information on HP Care Pack Services, see the HP website
(http://www.hp.com/services/carepack).
Rack planning resources
The rack resource kit ships with all HP branded or Compaq branded 9000, 10000, and H9 series racks. For
more information on the content of each resource, see the rack resource kit documentation.
Optimum environment
When installing the server in a rack, select a location that meets the environmental standards described in
this section.
Setup
34
Space and airflow requirements
To allow for servicing and adequate airflow, observe the following space and airflow requirements when
deciding where to install a rack:
•
Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.
•
Leave a minimum clearance of 76.2 cm (30 in) behind the rack.
•
Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack
or row of racks.
HP servers draw in cool air through the front door and expel warm air through the rear door. Therefore, the
front and rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and
the rear door must be adequately ventilated to allow the warm air to escape from the cabinet.
CAUTION: To prevent improper cooling and damage to the equipment, do not block the
ventilation openings.
When vertical space in the rack is not filled by a server or rack component, the gaps between the
components cause changes in airflow through the rack and across the servers. Cover all gaps with blanking
panels to maintain proper airflow.
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement
ensures proper airflow. Using a rack without blanking panels results in improper cooling that can
lead to thermal damage.
The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the front
and rear doors that provide 64 percent open area for ventilation.
CAUTION: When using a Compaq branded 7000 series rack, install the high airflow rack door
insert (PN 327281-B21 for 42U rack, PN 157847-B21 for 22U rack) to provide proper
front-to-back airflow and cooling.
CAUTION: If a third-party rack is used, observe the following additional requirements to ensure
adequate airflow and to prevent damage to the equipment:
• Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow
5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit adequate
airflow (equivalent to the required 64 percent open area for ventilation).
• Side—The clearance between the installed rack component and the side panels of the rack
must be a minimum of 7 cm (2.75 in).
IMPORTANT: The HP ProLiant DL380p Gen8 Server cable management arm is not supported on
Compaq branded 7000 series racks.
Temperature requirements
To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated,
climate-controlled environment.
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).
Setup
35
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
• Do not permit optional equipment to impede airflow around the server or to increase the
internal rack temperature beyond the maximum allowable limits.
• Do not exceed the manufacturer’s TMRA.
Power requirements
Installation of this equipment must comply with local and regional electrical regulations governing the
installation of information technology equipment by licensed electricians. This equipment is designed to
operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on
options, refer to the product rating label or the user documentation supplied with that option.
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not
overload the AC supply branch circuit that provides power to the rack. Consult the electrical
authority having jurisdiction over wiring and installation requirements of your facility.
CAUTION: Protect the server from power fluctuations and temporary interruptions with a
regulating uninterruptible power supply. This device protects the hardware from damage caused
by power surges and voltage spikes and keeps the system in operation during a power failure.
When installing more than one server, you may need to use additional power distribution devices to safely
provide power to all devices. Observe the following guidelines:
•
Balance the server power load between available AC supply branch circuits.
•
Do not allow the overall system AC current load to exceed 80 percent of the branch circuit AC current
rating.
•
Do not use common power outlet strips for this equipment.
•
Provide a separate electrical circuit for the server.
Electrical grounding requirements
The server must be grounded properly for proper operation and safety. In the United States, you must install
the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as
any local and regional building codes. In Canada, you must install the equipment in accordance with
Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must
install the equipment in accordance with any regional or national electrical wiring codes, such as the
International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure
that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed
or certified grounding-type devices.
Because of the high ground-leakage currents associated with multiple servers connected to the same power
source, HP recommends the use of a PDU that is either permanently wired to the building’s branch circuit or
includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those
complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for
the server is not recommended.
Connecting a DC power cable to a DC power source
Setup
36
WARNING: To reduce the risk of electric shock or energy hazards:
• This equipment must be installed by trained service personnel, as defined by the NEC and IEC
60950-1, Second Edition, the standard for Safety of Information Technology Equipment.
• Connect the equipment to a reliably grounded SELV source. An SELV source is a secondary
circuit that is designed so normal and single fault conditions do not cause the voltages to
exceed a safe level (60 V direct current).
• The branch circuit overcurrent protection must be rated 20A.
WARNING: When installing a DC power supply, the ground wire must be connected before the
positive or negative leads.
WARNING: Remove power from the power supply before performing any installation steps or
maintenance on the power supply.
CAUTION: The server equipment connects the earthed conductor of the DC supply circuit to the
earthing conductor at the equipment. For more information, see the HP 750W Common Slot -48V
DC Input Hot-Plug Power Supply Kit Installation Instructions.
CAUTION: If the DC connection exists between the earthed conductor of the DC supply circuit and
the earthing conductor at the server equipment, the following conditions must be met:
• This equipment must be connected directly to the DC supply system earthing electrode
conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply
system earthing electrode conductor is connected.
• This equipment should be located in the same immediate area (such as adjacent cabinets) as
any other equipment that has a connection between the earthed conductor of the same DC
supply circuit and the earthing conductor, and also the point of earthing of the DC system. The
DC system should be earthed elsewhere.
• The DC supply source is to be located within the same premises as the equipment.
• Switching or disconnecting devices should not be in the earthed circuit conductor between the
DC source and the point of connection of the earthing electrode conductor.
To connect a DC power cable to a DC power source:
1.
Cut the DC power cord ends no shorter than 150 cm (59.06 in).
2.
If the power source requires ring tongues, use a crimping tool to install the ring tongues on the power
cord wires.
IMPORTANT: The ring tongues must be UL approved and accommodate 12 gauge wires.
IMPORTANT: The minimum nominal thread diameter of a pillar or stud type terminal must be 3.5
mm (0.138 in); the diameter of a screw type terminal must be 4.0 mm (0.157 in).
3.
Stack each same-colored pair of wires and then attach them to the same power source. The power cord
consists of three wires (black, red, and green).
For more information, see the HP 750W Common Slot -48V DC Input Hot-Plug Power Supply Installation
Instructions.
Rack warnings
Setup
37
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
•
•
•
•
•
The leveling jacks are extended to the floor.
The full weight of the rack rests on the leveling jacks.
The stabilizing feet are attached to the rack if it is a single-rack installation.
The racks are coupled together in multiple-rack installations.
Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:
• At least two people are needed to safely unload the rack from the pallet. An empty 42U rack
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might
become unstable when being moved on its casters.
• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle
the rack from both sides.
Identifying the contents of the server shipping carton
Unpack the server shipping carton and locate the materials and documentation necessary for installing the
server. All the rack mounting hardware necessary for installing the server into the rack is included with the
rack or the server.
The contents of the server shipping carton include:
•
Server
•
Power cord
•
Hardware documentation, Documentation CD, and software products
•
Rack-mounting hardware
In addition to the supplied items, you might need:
•
Operating system or application software
•
Hardware options
Installing hardware options
Install any hardware options before initializing the server. For options installation information, refer to the
option documentation. For server-specific information, refer to "Hardware options installation (on page 42)."
Installing the server into the rack
CAUTION: Always plan the rack installation so that the heaviest item is on the bottom of the rack.
Install the heaviest item first, and continue to populate the rack from the bottom to the top.
1.
Install the server and cable management arm into the rack. For more information, see the installation
instructions that ship with the 2U Quick Deploy Rail System.
2.
Connect peripheral devices to the server. For information on identifying connectors, see "Rear panel
components (on page 13)."
Setup
38
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug
telephone or telecommunications connectors into RJ-45 connectors.
3.
Connect the power cord to the rear of the server.
4.
Install the power cord anchors.
5.
Secure the cables to the cable management arm.
IMPORTANT: When using cable management arm components, be sure to leave enough slack
in each of the cables to prevent damage to the cables when the server is extended from the rack.
6.
Connect the power cord to the AC power source.
Setup
39
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all
times.
• Unplug the power cord from the power supply to disconnect power to the equipment.
• Do not route the power cord where it can be walked on or pinched by items placed against it.
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from
the server.
Installing the operating system
This ProLiant server does not ship with provisioning media. Everything needed to manage and install the
system software and firmware is preloaded on the server.
To operate properly, the server must have a supported operating system. For the latest information on
operating system support, see the HP website (http://www.hp.com/go/supportos).
To install an operating system on the server, use one of the following methods:
•
Intelligent Provisioning—The iLO Management Engine is a new feature on ProLiant servers that contains
Intelligent Provisioning for embedded deployment, updating, and provisioning capabilities. Intelligent
Provisioning can configure the server and install an operating system, eliminating the need for
SmartStart CDs and Smart Update Firmware DVDs.
To install an operating system on the server with Intelligent Provisioning (local or remote):
a. Connect the Ethernet cable, and then power on the server.
b. During server POST, press the F10 key.
c.
Complete the initial Preferences and Registration portion of Intelligent Provisioning (on page 96).
d. At the 1 Start screen, click the Configure and Install button.
e. To finish the installation, follow the onscreen prompts. An Internet connection is required to update
the firmware and systems software.
•
Remote deployment installation—To remotely deploy an operating system, use Insight Control server
deployment for an automated solution.
For additional system software and firmware updates, download the HP Service Pack for ProLiant from the HP
website (http://www.hp.com/go/spp/download). Software and firmware must be updated before using
the server for the first time, unless any installed software or components require an older version. For more
information, see "Keeping the system current (on page 103)."
The Smart Update Firmware DVD ISO is also available at the download tab on the HP website
(http://www.hp.com/go/foundation).
For more information on using these installation methods, see the HP website (http://www.hp.com/go/ilo).
Powering on and selecting boot options
1.
Connect the Ethernet cable.
2.
Press the Power On/Standby button.
3.
During the initial boot:
Setup
40
o
To modify the server configuration ROM default settings, press F9 when prompted from the start up
sequence to enter the RBSU. By default, RBSU runs in the English language.
o
If you do not need to modify the server configuration and are ready to install the system software,
press F10 to access Intelligent Provisioning.
NOTE: If an HP Smart Array controller has been added or is embedded in the system, the
controller defaults to a RAID configuration based on the size and number of hard drives installed.
For more information on modifying the controller default settings, see the documentation on the
Documentation CD.
For more information on automatic configuration, see the HP ROM-Based Setup Utility User Guide on the
Documentation CD or the iLO Management Engine Information Library
(http://www.hp.com/go/ilomgmtengine/docs).
Registering the server
To register the server, refer to the HP Registration website (http://register.hp.com).
Setup
41
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options and
identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Processor and fan option
The server supports single- and dual-processor operation.
CAUTION: To avoid damage to the processor and system board, only authorized personnel
should attempt to replace or install the processor in this server.
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor
configurations must contain processors with the same part number.
IMPORTANT: If installing a processor with a faster speed, update the system ROM before
installing the processor.
To install a processor:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
Hardware options installation
42
5.
If any full-length PCI riser boards are installed, release the full-length expansion board retainer, and then
remove the PCI riser cage.
6.
Remove the air baffle (on page 32).
7.
Open the heatsink retaining bracket, and then remove the blank.
CAUTION: The pins on the processor socket are very fragile. Any damage to them may require
replacing the system board.
Hardware options installation
43
8.
Open each of the processor locking levers in the order indicated, and then open the processor retaining
bracket.
9.
Remove the clear processor socket cover. Retain the processor socket cover for future use.
Hardware options installation
44
10.
Install the processor. Verify that the processor is fully seated in the processor retaining bracket by
visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To
avoid damage to the system board, do not touch the processor or the processor socket contacts.
11.
Close the processor retaining bracket. When the processor is installed properly inside the processor
retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause
damage to the processor socket and the system board. Press only in the area indicated on the
processor retaining bracket.
Hardware options installation
45
12.
Press and hold the processor retaining bracket in place, and then close each processor locking lever.
Press only in the area indicated on the processor retaining bracket.
13.
Remove the thermal interface protective cover from the heatsink.
Hardware options installation
46
14.
Install the heatsink.
15.
Remove the two fan blanks.
Hardware options installation
47
16.
Install the two additional fans included with the processor.
You can install memory ("Installing a DIMM" on page 55) on the second processor. HP recommends
balancing memory between both processors for improved performance. For more information on
memory configurations, see "Memory Options (on page 49)."
17.
Install the air baffle ("Remove the air baffle" on page 32).
18.
Install any full-length expansion boards ("Installing a full-length expansion board" on page 69), if
previously removed.
19.
Install the access panel (on page 25).
20.
Install the server into the rack ("Installing the server into the rack" on page 38).
21.
Connect each power cord to the server.
22.
Connect each power cord to the power source.
23.
Power up the server (on page 23).
Hardware options installation
48
Memory options
IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, UDIMMs, or HDIMMs.
Attempting to mix any combination of these DIMMs can cause the server to halt during BIOS
initialization.
The memory subsystem in this server can support LRDIMMs, RDIMMs, UDIMMs, or HDIMMs:
•
UDIMMs represent the most basic type of memory module and offer lower latency in one DIMM per
channel configurations and (relatively) low power consumption, but are limited in capacity.
•
RDIMMs offer larger capacities than UDIMMs and include address parity protection.
•
LRDIMMs support higher densities than single- and dual-rank RDIMMs, and higher speeds than
quad-rank RDIMMs. This support enables you to install more high capacity DIMMs, resulting in higher
system capacities and higher bandwidth.
•
HDIMMs provide faster speeds than other DIMMs. 12 DIMMs per processor are required with
HDIMMs.
All types are referred to as DIMMs when the information applies to all types. When specified as LRDIMM,
RDIMM, UDIMM, or HDIMM, the information applies to that type only. All memory installed in the server must
be the same type.
The server supports the following DIMM speeds:
•
Single- and dual-rank PC3-10600 (DDR-1333) RDIMMs operating at up to 1333 MT/s
•
Single- and dual-rank PC3-12800 (DDR-1600) RDIMMs operating at up to 1600 MT/s
•
Single- and dual-rank PC3-10600 (DDR-1333) UDIMMs operating at up to 1333 MT/s
•
Quad-rank PC3L-10600 (DDR3-1333) LRDIMMs, operating as dual-rank DIMMs, at up to 1333 MT/s
Speed, voltage, and capacity
DIMM type
DIMM rank
DIMM capacity
Native speed (MT/s)
Voltage
RDIMM
Dual-rank
8 GB
1333
LV
RDIMM
Single-rank
8 GB
1600
STD
RDIMM
Dual-rank
16 GB
1333
LV
LRDIMM
Quad-rank
32 GB
1333
LV
UDIMM
Dual-rank
8 GB
1333
LV
HDIMM
Dual-rank
16 GB
1333
STD
Depending on the processor model, the number of DIMMs installed, and whether LRDIMMs, UDIMMs,
RDIMMs, or HDIMMs are installed, the memory clock speed can be reduced to 1333 or 1066 MT/s.
Populated DIMM speed (MT/s)
DIMM type DIMM rank
1 DIMM per channel
2 DIMMs per channel
3 DIMMs per channel
RDIMM
Dual-rank (8 GB)
1333
1333
1066
RDIMM
Single-rank (8 GB) 1600
1600
1066
RDIMM
Dual-rank (16 GB) 1333
1333
1066
LRDIMM
Quad-rank (32
GB)
Dual-rank (8 GB)
UDIMM
1333
1333
2
1333
2
1066
1333
3
—
1
1
Hardware options installation
49
DIMM type DIMM rank
HDIMM
1 DIMM per channel
Dual-rank (16 GB) N/A
2 DIMMs per channel
3 DIMMs per channel
N/A
1333
4
RDIMM supports 1.35V 3DPC at 1066. Third-party memory supports 1.5V 3DPC at 1066 MT/s.
LRDIMM enables 3 DIMMs per channel. HP SmartMemory supports up to 3DPC at 1066 MT/s at 1.35V. Third-party
memory supports 1.5V only.
3
UDIMM is supported at 2DPC at 1333 MT/s using HP SmartMemory only. Third-party memory supports up to 2DPC at
1066 MT/s.
4
HDIMM memory requires 12 DIMMs per processor.
1
2
HP SmartMemory
HP SmartMemory, introduced for Gen8 servers, authenticates and unlocks certain features available only on
HP Qualified memory and verifies whether installed memory has passed HP qualification and test processes.
Qualified memory is performance-tuned for HP ProLiant and BladeSystem servers and provides future
enhanced support through HP Active Health and manageability software.
Certain performance features are unique with HP SmartMemory. HP SmartMemory 1.35V DDR3-1333
Registered memory is engineered to achieve the same performance level as 1.5V memory. For example,
while the industry supports DDR3-1333 RDIMM at 1.5V, this Gen8 server supports DDR3-1333 RDIMM up
to 3 DIMMs per channel at 1066 MT/s running at 1.35V. This equates to up to 20% less power at the DIMM
level with no performance penalty. In addition, the industry supports UDIMM at 2 DIMMs per channel at
1066 MT/s. HP SmartMemory supports 2 DIMMs per channel at 1333 MT/s, or 25% greater bandwidth.
Memory subsystem architecture
The memory subsystem in this server is divided into channels. Each processor supports four channels, and
each channel supports three DIMM slots, as shown in the following table.
Channel
Population order
Slot number
1
A
E
I
12
11
10
2
B
F
J
9
8
7
3
C
G
K
1
2
3
4
D
H
L
4
5
6
For the location of the slot numbers, see "DIMM slot locations (on page 18)."
This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture
also enables Lockstep and Online Spare Memory modes.
DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slot
numbers indicate the DIMM slot ID for spare replacement.
Hardware options installation
50
Single-, dual-, and quad-rank DIMMs
To understand and configure memory protection modes properly, an understanding of single-, dual-, and
quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the
memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only one
rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same module. Only
one rank is accessible at a time. The server memory control subsystem selects the proper rank within the
DIMM when writing to or reading from the DIMM.
Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For
example, if current DRAM technology supports 8-GB single-rank DIMMs, a dual-rank DIMM would be 16
GB, and a quad-rank DIMM would be 32 GB.
LRDIMMs are labeled as quad-rank DIMMs; however, they function more like dual-rank DIMMs. There are
four ranks of DRAM on the DIMM, but the LRDIMM buffer creates an abstraction that allows the DIMM to
appear as a dual-rank DIMM to the system. The LRDIMM buffer also isolates the electrical loading of the
DRAM from the system to allow for faster operation. These two changes allow the system to support up to
three LRDIMMs per memory channel, providing for up to 50% greater memory capacity and higher memory
operating speed compared to quad-rank RDIMMs.
DIMM identification
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and
table.
Item
Description
Definition
1
Size
—
2
Rank
1R = Single-rank
2R = Dual-rank
4R = Quad-rank
3
Data width
x4 = 4-bit
x8 = 8-bit
Hardware options installation
51
Item
Description
Definition
4
Voltage rating
L = Low voltage (1.35v)
U = Ultra low voltage (1.25v)
Blank or omitted = Standard
5
Memory speed
12800 = 1600-MT/s
10600 = 1333-MT/s
8500 = 1066-MT/s
6
DIMM type
R = RDIMM (registered)
E = UDIMM (unbuffered with ECC)
L = LRDIMM (load reduced)
H = HDIMM (HyperCloud)
For the latest supported memory information, see the QuickSpecs on the HP website
(http://h18000.www1.hp.com/products/quickspecs/ProductBulletin.html). At the website, choose the
geographic region, and then locate the product by name or product category.
Memory configurations
To optimize server availability, the server supports the following AMP modes:
•
Advanced ECC—provides up to 4-bit error correction and enhanced performance over Lockstep mode.
This mode is the default option for this server.
•
Online spare memory—provides protection against failing or degraded DIMMs. Certain memory is
reserved as spare, and automatic failover to spare memory occurs when the system detects a DIMM that
is degrading. This allows DIMMs that have a higher probability of receiving an uncorrectable memory
error (which would result in system downtime) to be removed from operation.
Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported
by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see
"HP ROM-Based Setup Utility (on page 99)."
The server also can operate in independent channel mode or combined channel mode (lockstep). When
running in lockstep mode, you gain reliability in one of two ways:
•
If running with UDIMMs (built with x8 DRAM devices), the system can survive a complete DRAM failure
(SDDC). In independent channel mode, this failure would be an uncorrectable error.
•
If running with RDIMM (built with x4 DRAM devices), the system can survive the complete failure of two
DRAM devices (DDDC). Running in independent mode, the server can only survive the complete failure
of a single DRAM device (SDDC).
Maximum capacity
DIMM type
DIMM rank
One processor
Two processors
RDIMM
Single-rank
96 GB
192 GB
RDIMM
Dual-rank
192 GB
384 GB
LRDIMM
Quad-rank
384 GB
768 GB
UDIMM
Single-rank
32 GB
64 GB
UDIMM
Dual-rank
64 GB
128 GB
HDIMM
Dual-rank
192 GB
384 GB
For the latest memory configuration information, see the QuickSpecs on the HP website
(http://www.hp.com).
Hardware options installation
52
Advanced ECC memory configuration
Advanced ECC memory is the default memory protection mode for this server. Standard ECC can correct
single-bit memory errors and detect multi-bit memory errors. When multi-bit errors are detected using
Standard ECC, the error is signaled to the server and causes the server to halt.
Advanced ECC protects the server against some multi-bit memory errors. Advanced ECC can correct both
single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM device on the DIMM.
Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain
memory errors that would otherwise be uncorrected and result in a server failure. Using HP Advanced
Memory Error Detection technology, the server provides notification when a DIMM is degrading and has a
higher probability of uncorrectable memory error.
Online Spare memory configuration
Online spare memory provides protection against degraded DIMMs by reducing the likelihood of
uncorrected memory errors. This protection is available without any operating system support.
Online spare memory protection dedicates one rank of each memory channel for use as spare memory. The
remaining ranks are available for OS and application use. If correctable memory errors occur at a rate
higher than a specific threshold on any of the non-spare ranks, the server automatically copies the memory
contents of the degraded rank to the online spare rank. The server then deactivates the failing rank and
automatically switches over to the online spare rank.
Lockstep memory configuration
Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device.
Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in each
channel must have identical HP part numbers.
General DIMM slot population guidelines
Observe the following guidelines for all AMP modes:
•
Install DIMMs only if the corresponding processor is installed.
•
When two processors are installed, balance the DIMMs across the two processors.
•
White DIMM slots denote the first slot of a channel (Ch 1-A, Ch 2-B, Ch 3-C, Ch 4-D).
•
Do not mix LRDIMMs, UDIMMs, RDIMMs, or HDIMMs.
•
Do not install more than two UDIMMs per channel. UDIMMs should not be installed in slots Ch 1-I, Ch
2-J, Ch 3-K, or Ch 4-L.
•
HDIMMs require 12 DIMMs per processor.
•
When two processors are installed, install the DIMMs in sequential alphabetical order balanced
between the two processors: P1-A, P2-A, P1-B, P2-B, P1-C, P2-C, and so on.
For detailed memory configuration rules and guidelines, use the Online DDR3 Memory Configuration Tool
on the HP website (http://www.hp.com/go/ddr3memory-configurator).
DIMM speeds are supported as indicated in the following table.
Hardware options installation
53
Populated slots
(per channel)
Rank
Speeds supported (MT/s)
1
Single- or dual-rank
1333, 1600
1
Quad-rank
1333
2
Single- or dual-rank
1333
3
Single- or dual-rank
1066
Advanced ECC population guidelines
For Advanced ECC mode configurations, observe the following guidelines:
•
Observe the general DIMM slot population guidelines.
•
DIMMs may be installed individually.
Online spare population
For Online Spare memory mode configurations, observe the following guidelines:
•
Observe the general DIMM slot population guidelines.
•
Each channel must have a valid online spare configuration.
•
Each channel can have a different valid online spare configuration.
•
Each populated channel must have a spare rank:
o
A single dual-rank DIMM is not a valid configuration.
o
LRDIMMs are treated as dual-rank DIMMs.
Lockstep Memory population guidelines
For Lockstep memory mode configurations, observe the following guidelines:
•
Observe the general DIMM slot population guidelines.
•
DIMM configuration on all channels of a processor must be identical.
•
In multi-processor configurations, each processor must have a valid Lockstep Memory configuration.
•
In multi-processor configurations, each processor may have a different valid Lockstep Memory
configuration.
Population order
For memory configurations with a single processor or multiple processors, populate the DIMM slots in the
following order:
•
LRDIMM: Sequentially in alphabetical order (A through L)
•
RDIMM: Sequentially in alphabetical order (A through L)
•
UDIMM: A through H, sequentially in alphabetical order. Do not populate DIMM slots I through L.
•
HDIMM: All 12 DIMMs per processor must be populated.
After installing the DIMMs, use RBSU to configure Advanced ECC, online spare, or lockstep memory support.
Hardware options installation
54
Installing a DIMM
The server supports up to 24 DIMMs. To install a DIMM:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
5.
Remove the air baffle (on page 32).
6.
Open the DIMM slot latches..
7.
Install the DIMM.
8.
Install the access panel (on page 25).
9.
Install the server into the rack ("Installing the server into the rack" on page 38).
10.
Connect each power cord to the server.
11.
Connect each power cord to the power source.
12.
Power up the server (on page 23).
Use RBSU ("HP ROM-Based Setup Utility" on page 99) to configure the memory mode.
For more information about LEDs and troubleshooting failed DIMMs, see "Systems Insight Display LED
combinations (on page 12)."
Hot-plug hard drive options
When adding hard drives to the server, observe the following general guidelines:
•
The system automatically sets all device numbers.
•
If only one hard drive is used, install it in the bay with the lowest device number.
Hardware options installation
55
•
Drives should be the same capacity to provide the greatest storage space efficiency when drives are
grouped together into the same drive array.
Installing a hot-plug SAS or SATA hard drive
The server can support 8 SAS or SATA hard drives in a SFF or LFF configuration, or 16 drives in a SFF
configuration with the optional hard drive cage ("Hard drive cage option" on page 72).
To install the component:
1.
Remove the drive blank.
2.
Prepare the drive.
3.
Install the drive.
4.
Determine the status of the drive from the drive LED definitions (on page 19).
Hardware options installation
56
Removing a hot-plug SAS or SATA hard drive
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize
the amount of time the access panel is open.
1.
Determine the status of the drive from the hot-plug SAS hard drive LED combinations ("Drive LED
definitions" on page 19).
2.
Back up all server data on the drive.
3.
Remove the drive.
Controller options
The server ships with an embedded Smart Array P420i controller. For more information about the controller
and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guide on the HP website
(http://www.hp.com/support/SAC_UG_ProLiantServers_en). To configure arrays, see the Configuring
Arrays on HP Smart Array Controllers Reference Guide on the HP website
(http://www.hp.com/support/CASAC_RG_en).
Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs
on the HP website (http://www.hp.com/support).
The server supports FBWC. FBWC consists of a cache module and a capacitor pack. The DDR cache module
buffers and stores data being written by the controller. When the system is powered on, the capacitor pack
charges fully in about 5 minutes. In the event of a system power failure, a fully charged capacitor pack
provides power for up to 80 seconds. During that interval, the controller transfers the cached data from DDR
memory to flash memory, where the data remains indefinitely or until a controller retrieves the data.
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMM
pinout. Do not use the controller with cache modules designed for other controller models,
because the controller can malfunction and you can lose data. Also, do not transfer this cache
module to an unsupported controller model, because you can lose data.
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove
the battery pack while an array capacity expansion, RAID level migration, or stripe size migration
is in progress.
Hardware options installation
57
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do
not remove the cable from the cache module. The cache module is backing up data, and data is
lost if the cable is detached.
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST
error message is displayed when the server is powered up, indicating that the battery pack is
temporarily disabled. No action is necessary on your part. The internal circuitry automatically
recharges the batteries and enables the battery pack. This process might take up to four hours.
During this time, the cache module functions properly, but without the performance advantage of
the battery pack.
NOTE: The data protection and the time limit also apply if a power outage occurs. When power
is restored to the system, an initialization process writes the preserved data to the hard drives.
Installing the flash-backed write cache module
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMM
pinout. Do not use the controller with cache modules designed for other controller models,
because the controller can malfunction and you can lose data. Also, do not transfer this cache
module to an unsupported controller model, because you can lose data.
To install the component:
1.
Back up all data.
2.
Close all applications.
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be
powered down and the last to be powered back up. Taking this precaution ensures that the system
does not erroneously mark the drives as failed when the server is powered up.
3.
Power down the server (on page 23).
4.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
5.
Extend the server from the rack (on page 23).
6.
Remove the access panel (on page 24).
Hardware options installation
58
7.
Install the cache module.
8.
Connect the capacitor pack cable to the connector on the top of the cache module.
9.
Install the access panel (on page 25).
10.
Install the server into the rack ("Installing the server into the rack" on page 38).
11.
Connect each power cord to the server.
12.
Connect each power cord to the power source.
13.
Power up the server (on page 23).
Installing the flash-backed write cache capacitor pack
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMM
pinout. Do not use the controller with cache modules designed for other controller models,
because the controller can malfunction and you can lose data. Also, do not transfer this cache
module to an unsupported controller model, because you can lose data.
Hardware options installation
59
To install the component:
1.
Back up all data.
2.
Close all applications.
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be
powered down and the last to be powered back up. Taking this precaution ensures that the system
does not erroneously mark the drives as failed when the server is powered up.
3.
Power down the server (on page 23).
4.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
5.
Extend the server from the rack (on page 23).
6.
Remove the access panel (on page 24).
7.
Install the FBWC module ("Installing the flash-backed write cache module" on page 58), if it is not
already installed.
8.
Connect the capacitor pack cable to the connector on the top of the cache module.
Hardware options installation
60
9.
Install one or two FBWC capacitor packs into the FBWC capacitor pack holder.
10.
Install the FBWC capacitor pack holder into the server:
o
8 or 16 drive SFF
Hardware options installation
61
o
8 drive LFF
o
12 drive LFF or 25 drive SFF, or secondary location for 8 or 16 drive SFF or 8 drive LFF
o
Secondary location for 12 drive LFF or 25 drive SFF:
Hardware options installation
62
a. Remove the Velcro liner.
b. Install the FBWC capacitor pack holder into the server.
11.
Install the access panel (on page 25).
12.
Install the server into the rack ("Installing the server into the rack" on page 38).
13.
Connect each power cord to the server.
14.
Connect each power cord to the power source.
15.
Power up the server (on page 23).
Optical drive option
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
Hardware options installation
63
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
5.
Remove the existing media drive option or blank.
6.
Slide the optical drive into the drive bay.
Hardware options installation
64
7.
Connect the power and data cable to the system board and the optical drive.
8.
Install the access panel (on page 25).
9.
Install the server into the rack ("Installing the server into the rack" on page 38).
10.
Connect each power cord to the server.
11.
Connect each power cord to the power source.
12.
Power up the server (on page 23).
Redundant hot-plug power supply option
CAUTION: All power supplies installed in the server must have the same output power capacity.
Verify that all power supplies have the same part number and label color. The system becomes
unstable and may shut down when it detects mismatched power supplies.
Label color
Output
Blue
460W
Orange
750W
White
750W 48V DC
Green
1,200W
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To install the component:
1.
Access the product rear panel (on page 25).
2.
Remove the blank.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or
power supply blank to cool before touching it.
Hardware options installation
65
3.
Insert the power supply into the power supply bay until it clicks into place.
4.
Connect the power cord to the power supply.
5.
Route the power cord. Use best practices when routing power cords and other cables. A cable
management arm is available to help with routing. To obtain a cable management arm, contact an HP
authorized reseller.
6.
Connect the power cord to the AC power source.
7.
Be sure that the power supply LED is green ("Rear panel LEDs and buttons" on page 14).
FlexibleLOM option
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
Hardware options installation
66
3.
Remove any attached network cables.
4.
Extend the server from the rack (on page 23).
5.
Remove the access panel (on page 24).
6.
Loosen the thumbscrew.
7.
Remove the existing FlexibleLOM.
To replace the component:
1.
Firmly seat the FlexibleLOM in the slot, and then tighten the thumbscrew.
2.
Install the access panel (on page 25).
3.
Slide the server into the rack.
4.
Connect the LAN segment cables.
5.
Connect each power cord to the server.
6.
Connect each power cord to the power source.
Hardware options installation
67
7.
Power up the server (on page 23).
Expansion board options
The server supports PCI Express expansion boards. The server ships with PCIe riser boards and expansion
slots. PCIe expansion boards are supported with optional riser boards.
Removing the expansion slot blanks
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize
the amount of time the access panel is open.
To remove the component:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend ("Extend the server from the rack" on page 23) or remove the server from the rack.
4.
Remove the access panel (on page 24).
5.
Disconnect any external cables that are connected to the expansion board.
6.
Disconnect any internal cables that are connected to the expansion board.
7.
Remove the PCIe riser cage ("Remove the PCI riser cage" on page 29).
8.
Remove the expansion slot blank.
To replace the component, reverse the removal procedure.
Hardware options installation
68
Installing a half-length expansion board
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
5.
Remove the PCI riser cage (on page 29).
6.
Remove the expansion slot blank ("Removing the expansion slot blanks" on page 68).
7.
Install the expansion board.
8.
Connect any required internal or external cables to the expansion board. See the documentation that
ships with the expansion board.
9.
Install the PCI riser cage (on page 30).
10.
Install the access panel (on page 25).
11.
Install the server into the rack ("Installing the server into the rack" on page 38).
12.
Connect each power cord to the server.
13.
Connect each power cord to the power source.
14.
Power up the server (on page 23).
Installing a full-length expansion board
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
Hardware options installation
69
5.
Release the full-length expansion board retainer, and then remove the PCI riser cage.
6.
Remove the expansion slot cover ("Removing the expansion slot blanks" on page 68).
7.
Install the expansion board.
8.
Connect any required internal or external cables to the expansion board. See the documentation that
ships with the expansion board.
9.
Install the PCI riser cage (on page 30).
10.
Secure the full-length expansion board retainer (on page 31) if any full-length expansion boards are
installed.
11.
Install the access panel (on page 25).
12.
Install the server into the rack ("Installing the server into the rack" on page 38).
13.
Connect each power cord to the server.
14.
Connect each power cord to the power source.
15.
Power up the server (on page 23).
Secondary PCI riser cage option
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all PCI slots have either an expansion slot cover or an expansion board installed.
IMPORTANT: The secondary PCI riser cage option requires both processors.
To install the component:
1.
Power down the server (on page 23).
Hardware options installation
70
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
5.
Remove the PCI riser blank.
6.
Remove the blank from the optional secondary PCI riser cage.
Hardware options installation
71
7.
Install an expansion board into the PCI riser cage.
8.
Install the optional secondary PCI riser cage.
9.
If not already installed, install the secondary processor ("Processor and fan option" on page 42).
10.
Install the access panel (on page 25).
11.
Install the server into the rack ("Installing the server into the rack" on page 38).
12.
Connect each power cord to the server.
13.
Connect each power cord to the power source.
14.
Power up the server (on page 23).
Hard drive cage option
A SAS expander card or an additional SAS controller option is required to support the hard drive cage
option.
Hardware options installation
72
To install the component:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
5.
Release the full-length expansion board retainer, and then remove the PCI riser cage.
6.
Remove the air baffle.
Hardware options installation
73
7.
Remove the fan cage.
8.
Disconnect and remove the optical drive cable, if installed.
Hardware options installation
74
9.
Using a T-15 Torx screwdriver, remove the two optical drive retaining screws, and then remove the
optical drive cage.
10.
Install the optional hard drive cage.
11.
Install the hard drives and hard drive blanks.
Hardware options installation
75
12.
To access the cables, remove the fan bracket on the right side of the chassis.
13.
Connect the cables:
a. Connect one end of the power cable to the SAS backplane and the other end to the power
connector on the system board.
Hardware options installation
76
b. Remove the existing SAS cable from the cable guide and from the system board.
14.
Connect the end of each SAS signal cable to the SAS backplane, and then route the SAS signal cables
behind the cable guide. Do not connect the other ends yet.
Hardware options installation
77
15.
Install the fan bracket. Be sure that the cables are properly routed in the channel along the fan bracket.
16.
Remove the blank from the PCI riser cage.
Hardware options installation
78
17.
Install the SAS controller board into the PCI riser cage.
18.
Install the fan cage.
19.
Install the air baffle.
Hardware options installation
79
If you do not have a full-length expansion board, the air baffle can be installed last.
20.
Connect the other end of the SAS signal cables to the SAS controller board and to the system board.
Then, install the PCI riser cage.
SAS cables can be connected to the PCI riser cage and the system board before or after the PCI riser
cage is installed. For ease of accessing connectors, HP recommends connecting the cables before the
PCI riser cage is installed.
Hardware options installation
80
Completed SAS cabling:
21.
Make sure any installed full-length expansion boards are seated in the retainer clip on the air baffle.
22.
Install the access panel (on page 25).
23.
Install the server into the rack.
24.
Connect each power cord to the server.
25.
Connect each power cord to the power source.
26.
Power up the server (on page 23).
2U rack bezel option
The 2U rack bezel helps prevent any unauthorized physical access to the server in the rack configuration. To
access the hard drive cage, you must unlock and open the 2U rack bezel.
To unlock the 2U rack bezel, use the key provided with the kit.
Hardware options installation
81
Install the 2U rack bezel into the chassis, and then lock the 2U rack bezel with the key.
HP Trusted Platform Module option
Use these instructions to install and enable a TPM on a supported server. This procedure includes three
sections:
1.
Installing the Trusted Platform Module board.
2.
Retaining the recovery key/password (on page 84).
3.
Enabling the Trusted Platform Module (on page 84).
Enabling the TPM requires accessing RBSU ("HP ROM-Based Setup Utility" on page 99). For more
information about RBSU, see the HP website (http://www.hp.com/go/ilomgmtengine/docs).
TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLocker
Drive Encryption feature. For more information on BitLocker, see the Microsoft website
(http://www.microsoft.com).
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines
can cause hardware damage or halt data access.
When installing or replacing a TPM, observe the following guidelines:
•
Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system
board.
•
When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption
technology. For security reasons, only the customer can enable these features.
•
When returning a system board for service replacement, do not remove the TPM from the system board.
When requested, HP Service provides a TPM with the spare system board.
•
Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security
rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the
system compromised and take appropriate measures to ensure the integrity of the system data.
•
When using BitLocker, always retain the recovery key/password. The recovery key/password is
required to enter Recovery Mode after BitLocker detects a possible compromise of system integrity.
Hardware options installation
82
•
HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see the
encryption technology feature documentation provided by the operating system.
Installing the Trusted Platform Module board
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until AC power is removed.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Remove the server from the rack, if necessary.
4.
Place the server on a flat, level work surface.
5.
Remove the access panel (on page 24).
6.
Remove the PCI riser cage (on page 29).
7.
Remove the air baffle (on page 32).
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,
administrators should consider the system compromised and take appropriate measures to ensure
the integrity of the system data.
8.
Install the TPM board. Press down on the connector to seat the board ("System board components" on
page 15).
Hardware options installation
83
9.
Install the TPM security rivet by pressing the rivet firmly into the system board.
10.
Install the air baffle.
11.
Install the PCI riser cage (on page 30).
12.
Install the access panel (on page 25).
13.
Install the server into the rack ("Installing the server into the rack" on page 38).
14.
Connect each power cord to the server.
15.
Connect each power cord to the power source.
16.
Power up the server (on page 23).
Retaining the recovery key/password
The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after
BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery
key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system
integrity.
To help ensure maximum security, observe the following guidelines when retaining the recovery
key/password:
•
Always store the recovery key/password in multiple locations.
•
Always store copies of the recovery key/password away from the server.
•
Do not save the recovery key/password on the encrypted hard drive.
Enabling the Trusted Platform Module
1.
When prompted during the start-up sequence, access RBSU by pressing the F9 key.
2.
From the Main Menu, select Server Security.
3.
From the Server Security Menu, select Trusted Platform Module.
4.
From the Trusted Platform Module Menu, select TPM Functionality.
5.
Select Enable, and then press the Enter key to modify the TPM Functionality setting.
Hardware options installation
84
6.
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.
7.
Reboot the server.
8.
Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.
CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail
to follow the proper procedures for updating the system or option firmware, replacing the system
board, replacing a hard drive, or modifying OS application TPM settings.
For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module
Best Practices White Paper on the HP website (http://www.hp.com/support).
For more information on adjusting TPM usage in BitLocker™, see the Microsoft website
(http://technet.microsoft.com/en-us/library/cc732774.aspx).
Hardware options installation
85
Cabling
SAS hard drive cabling
•
SFF hard drive cabling
•
SFF cabling, with optional drive cage
Cabling 86
•
LFF hard drive cabling
Optical drive cabling
Cabling 87
FBWC cabling
•
8 or 16 drive SFF
•
8 drive LFF
Cabling 88
•
12 drive LFF or 25 drive SFF
•
PCIe option
Depending on the server configuration, you may need to remove the primary PCI riser cage ("Remove
the PCI riser cage" on page 29) before cabling to a PCIe expansion board.
Chipset SATA cable option
With the chipset SATA cable option, the chipset SATA controller can be used with a single SATA hard drive
that is installed in one hard drive bay of the SFF or LFF hard drive cage.
•
When using the chipset SATA configuration, the following conditions apply:
o
Only drive bay 5 is enabled. The remaining drive bays are disabled.
o
The optical bay is disabled because the chipset SATA controller port on the system board is
redirected from the optical bay to the drive cage.
Cabling 89
•
o
Hard drive status LEDs are not supported.
o
Hard drive thermal status monitoring is not supported.
o
Hot-plug operation is not supported.
Because only one drive bay is enabled, all remaining drives can be removed.
For proper thermal cooling, install blanks in all bays that do not have a drive installed. Order a sufficient
number of 6.35-cm (2.5-in) or 8.89-cm (3.5-in) hard drive blank option kits from an HP authorized
reseller. For more information, see the server maintenance and service guide.
•
The standard SATA driver is included with supported operating systems. No additional driver is
required.
To install the component:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend the server from the rack (on page 23).
4.
Remove the access panel (on page 24).
WARNING: Eliminate the risk of electric shock by removing all AC power from the system before
installing or replacing any non-hot-plug hardware option. Disconnect all power cords to
completely remove power from the server.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
IMPORTANT: It is necessary to remove the PCI riser cage only if there is a full-length expansion
board installed.
5.
Release the full-length expansion board retainer, and then remove the PCI riser cage.
6.
Remove the air baffle (on page 32).
7.
Remove the fan cage.
Cabling 90
8.
Disconnect any SAS cables from the hard drive cage and either the embedded SAS controller or an
optional SAS controller. Do not disconnect the power cable.
9.
Disconnect the SATA cable from the optical drive and the SATA connector on the system board. The
optical bay is disabled with the chipset SATA cable option.
10.
Connect the chipset SATA cable:
a. Connect the chipset SATA cable connector to the chipset SATA controller port on the system board.
The chipset SATA connector on the SATA cable is narrower than the chipset SATA controller port
header on the system board.
Cabling 91
b. Connect the remaining chipset SATA cable connector to the SATA header on the hard drive cage.
11.
Coil the cables behind the hard drive backplane to minimize airflow impact.
12.
Install the fan cage.
13.
Install the air baffle ("Remove the air baffle" on page 32).
14.
Install the PCI riser cage (on page 30), if removed.
15.
Secure any full-length PCI expansion boards with the retaining latch on the air baffle ("Secure the
full-length expansion board retainer" on page 31).
16.
Install the access panel (on page 25).
17.
Install the server in the rack ("Installing the server into the rack" on page 38).
18.
Remove any installed hard drives ("Removing a hot-plug SAS or SATA hard drive" on page 57).
19.
Install a SATA hard drive ("Installing a hot-plug SAS or SATA hard drive" on page 56) in hard drive bay
5.
20.
Install hard drive blanks in any empty hard drive bays.
21.
Connect each power cord to the server.
22.
Connect each power cord to the power source.
23.
Power up the server (on page 23).
24.
Using the HP ROM-Based Setup Utility (on page 99), disable the embedded HP Smart Array P420i
Controller, if necessary.
150W PCIe power cable option
CAUTION: To prevent damage to the server or expansion boards, power down the server and
remove all AC power cords before removing or installing the PCI expansion cage.
Cabling 92
Connect the cable as indicated.
Cabling 93
Software and configuration utilities
Server mode
The software and configuration utilities presented in this section operate in online mode, offline mode, or in
both modes.
Software or configuration utility
Server mode
HP iLO (on page 94)
Online and Offline
Active Health System (on page 95)
Online and Offline
Integrated Management Log (on page 96)
Online and Offline
Intelligent Provisioning (on page 96)
Offline
HP Insight Diagnostics (on page 96)
Online and Offline
Erase Utility (on page 97)
Offline
Scripting Toolkit (on page 97)
Online
HP Service Pack for ProLiant (on page 98)
Online and Offline
HP Smart Update Manager (on page 98)
Online and Offline
HP ROM-Based Setup Utility (on page 99)
Offline
Array Configuration Utility (on page 101)
Online and Offline
Option ROM Configuration for Arrays (on page 102)
Offline
ROMPaq utility (on page 102)
Offline
HP product QuickSpecs
For more information about product features, specifications, options, configurations, and compatibility, see
the product QuickSpecs on the HP Product Bulletin website (http://www.hp.com/go/productbulletin).
HP iLO Management Engine
The HP iLO Management Engine is a set of embedded management features supporting the complete
lifecycle of the server, from initial deployment through ongoing management.
HP iLO
The HP iLO subsystem is a standard component of selected HP ProLiant servers that simplifies initial server
setup, server health monitoring, power and thermal optimization, and remote server administration. The HP
iLO subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface.
This design makes HP iLO independent of the host server and its operating system.
HP iLO enables and manages the Active Health System (on page 95) and also features Agentless
Management. All key internal subsystems are monitored by HP iLO. SNMP alerts are sent directly by HP iLO
regardless of the host operating system or even if no host operating system is installed.
Software and configuration utilities
94
Using HP iLO, you can do the following:
•
Access a high-performance and secure Remote Console to the server from anywhere in the world.
•
Use the shared HP iLO Remote Console to collaborate with up to six server administrators.
•
Remotely mount high-performance Virtual Media devices to the server.
•
Securely and remotely control the power state of the managed server.
•
Have true Agentless Management with SNMP alerts from HP iLO regardless of the state of the host
server.
•
Access Active Health System troubleshooting features through the HP iLO interface.
For more information about HP iLO features (which may require an iLO Advanced Pack or iLO Advanced for
BladeSystem license), see the HP iLO documentation on the Documentation CD or on the HP website
(http://www.hp.com/go/ilo/docs).
Active Health System
HP Active Health System provides the following features:
•
Combined diagnostics tools/scanners
•
Always on, continuous monitoring for increased stability and shorter downtimes
•
Rich configuration history
•
Health and service alerts
•
Easy export and upload to Service and Support
The HP Active Health System monitors and records changes in the server hardware and system configuration.
The Active Health System assists in diagnosing problems and delivering rapid resolution when server failures
occur.
The Active Health System collects the following types of data:
•
Server model
•
Serial number
•
Processor model and speed
•
Storage capacity and speed
•
Memory capacity and speed
•
Firmware/BIOS
HP Active Health System does not collect information about Active Health System users' operations, finances,
customers, employees, partners, or data center, such as IP addresses, host names, user names, and
passwords. HP Active Health System does not parse or change operating system data from third-party error
event log activities, such as content created or passed through by the operating system.
The data that is collected is managed according to the HP Data Privacy policy. For more information see the
HP website (http://www.hp.com/go/privacy).
The Active Health System log, in conjunction with the system monitoring provided by Agentless Management
or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status,
and service alerts for various server components.
Software and configuration utilities
95
The Agentless Management Service is available in the SPP, which is a disk image (.iso) that you can
download from the HP website (http://www.hp.com/go/spp/download). The Active Health System log can
be downloaded manually from HP iLO or HP Intelligent Provisioning and sent to HP. For more information,
see the HP iLO User Guide or HP Intelligent Provisioning User Guide on the HP website
(http://www.hp.com/go/ilo/docs).
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event
with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
•
From within HP SIM
•
From within operating system-specific IML viewers
o
For Windows: IML Viewer
o
For Linux: IML Viewer Application
•
From within the HP iLO user interface
•
From within HP Insight Diagnostics (on page 96)
Intelligent Provisioning
Several packaging changes have taken place with HP ProLiant Gen8 servers: SmartStart CDs and the Smart
Update Firmware DVD will no longer ship with these new servers. Instead, the deployment capability is
embedded in the server as part of HP iLO Management Engine’s Intelligent Provisioning.
Intelligent Provisioning is an essential single-server deployment tool embedded in HP ProLiant Gen8 servers
that simplifies HP ProLiant server setup, providing a reliable and consistent way to deploy HP ProLiant server
configurations.
•
Intelligent Provisioning assists with the OS installation process by preparing the system for installing
"off-the-shelf" versions of leading operating system software and automatically integrating optimized
HP ProLiant server support software from SPP. SPP is the installation package for operating
system-specific bundles of HP ProLiant optimized drivers, utilities, management agents, and system
firmware.
•
Intelligent Provisioning provides maintenance-related tasks through Perform Maintenance features.
•
Intelligent Provisioning provides installation help for Microsoft Windows, Red Hat and SUSE Linux, and
VMware. For specific OS support, see the HP Intelligent Provisioning Release Notes.
For more information on Intelligent Provisioning software, see the HP website (http://www.hp.com/go/ilo).
For more information about Intelligent Provisioning drivers, firmware, and SPP, see the HP website
(http://www.hp.com/go/spp/download).
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server
installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS
is not running. To run this utility, boot the server using Intelligent Provisioning (on page 96).
Software and configuration utilities
96
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and
other related data needed for effective server management. Available in Microsoft Windows and Linux
versions, the utility helps to ensure proper system operation.
For more information or to download the utility, see the HP website (http://www.hp.com/servers/diags). HP
Insight Diagnostics Online Edition is also available in the SPP. For more information, see the HP website
(http://www.hp.com/go/spp/download).
HP Insight Diagnostics survey functionality
HP Insight Diagnostics (on page 96) provides survey functionality that gathers critical hardware and software
information on ProLiant servers.
This functionality supports operating systems that are supported by the server. For operating systems
supported by the server, see the HP website (http://www.hp.com/go/supportos).
If a significant change occurs between data-gathering intervals, the survey function marks the previous
information and overwrites the survey data files to reflect the latest changes in the configuration.
Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation,
or it can be installed through the SPP ("HP Service Pack for ProLiant" on page 98).
Erase Utility
CAUTION: Perform a backup before running the System Erase Utility. The utility sets the system
to its original factory state, deletes the current hardware configuration information, including
array setup and disk partitioning, and erases all connected hard drives completely. Refer to the
instructions for using this utility.
The Erase utility enables you to erase system CMOS, NVRAM, and hard drives. Run the Erase Utility if you
must erase the system for the following reasons:
•
You want to install a new operating system on a server with an existing operating system.
•
You encounter an error when completing the steps of a factory-installed operating system installation.
To access the Erase Utility, click the Perform Maintenance icon from the Intelligent Provisioning home screen
and then select Erase.
Run the Erase utility to:
•
Reset all settings — erases all drives, NVRAM, and RBSU
•
Reset all disks — erases all drives
•
Reset RBSU — erases current RBSU settings
After selecting the appropriate option, click Erase System. Click Exit to reboot the server after the erase task
is completed. Click Cancel Erase to exit the utility without erasing.
Scripting Toolkit
The Scripting Toolkit is a server deployment product that enables you to build an unattended automated
installation for high-volume server deployments. The Scripting Toolkit is designed to support ProLiant BL, ML,
DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes
how to apply these tools to build an automated server deployment process.
Software and configuration utilities
97
The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are
used to automate many of the manual steps in the server configuration process. This automated server
configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server
deployments.
For more information, and to download the Scripting Toolkit, see the HP website
(http://www.hp.com/go/ProLiantSTK).
HP Service Pack for ProLiant
SPP is a release set that contains a comprehensive collection of firmware and system software components,
all tested together as a single solution stack for HP ProLiant servers, their options, BladeSystem enclosures,
and limited HP external storage.
SPP has several key features for updating HP ProLiant servers. Using HP SUM as the deployment tool, SPP can
be used in an online mode on a Windows or Linux hosted operating system, or in an offline mode where the
server is booted to the ISO so that the server can be updated automatically with no user interaction or
updated in interactive mode.
For more information or to download SPP, see the HP website (http://www.hp.com/go/spp).
HP Smart Update Manager
The HP SUM provides intelligent and flexible firmware and software deployment. This technology assists in
reducing the complexity of provisioning and updating HP ProLiant Servers, options, and Blades within the
data center. HP SUM is used to deploy firmware and software in SPP.
HP SUM enables system administrators to upgrade ROM images efficiently across a wide range of servers
and options. This tool has the following features:
•
Enables GUI and a command-line, scriptable interface
•
Provides scriptable, command-line deployment
•
Requires no agent for remote installations
•
Enables dependency checking, which ensures appropriate install order and dependency checking
between components
•
Deploys software and firmware on Windows and Linux operating systems
•
Performs local or remote (one-to-many) online deployment
•
Deploys firmware and software together
•
Supports offline and online deployment
•
Deploys necessary component updates only
•
Downloads the latest components from Web
•
Enables direct update of BMC firmware (HP iLO)
For more information about HP SUM and to access the HP Smart Update Manager User Guide, see the HP
website (http://www.hp.com/go/hpsum/documentation).
Software and configuration utilities
98
HP ROM-Based Setup Utility
RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration
activities that can include the following:
•
Configuring system devices and installed options
•
Enabling and disabling system features
•
Displaying system information
•
Selecting the primary boot controller
•
Configuring memory options
•
Language selection
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or
the HP website (http://www.hp.com/support/rbsu).
Using RBSU
To use RBSU, use the following keys:
•
To access RBSU, press the F9 key during power-up when prompted.
•
To navigate the menu system, use the arrow keys.
•
To make selections, press the Enter key.
•
To access Help for a highlighted configuration option, press the F1 key.
IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does
not prompt you for confirmation of settings before you exit the utility. To change a selected setting,
you must select a different setting and press the Enter key.
Default configuration settings are applied to the server at one of the following times:
•
Upon the first system power-up
•
After defaults have been restored
Default configuration settings are sufficient for proper typical server operation, but configuration settings can
be modified using RBSU. The system will prompt you for access to RBSU with each power-up.
Auto-configuration process
The auto-configuration process automatically runs when you boot the server for the first time. During the
power-up sequence, the system ROM automatically configures the entire system without needing any
intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a
default setting based on the number of drives connected to the server.
NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not
automatically configure the array. You must run ORCA to configure the array settings.
NOTE: The server may not support all the following examples.
Software and configuration utilities
99
Drives installed
Drives used
RAID level
1
1
RAID 0
2
2
RAID 1
3, 4, 5, or 6
3, 4, 5, or 6
RAID 5
More than 6
0
None
To change any ORCA default settings and override the auto-configuration process, press the F8 key when
prompted.
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or
the HP website (http://www.hp.com/support/rbsu).
Boot options
Near the end of the boot process, the boot options screen is displayed. This screen is visible for several
seconds before the system attempts to boot from a supported boot device. During this time, you can do the
following:
•
Access RBSU by pressing the F9 key.
•
Access Intelligent Provisioning Maintenance Menu by pressing the F10 key.
•
Access the boot menu by pressing the F11 key.
•
Force a PXE Network boot by pressing the F12 key.
Configuring AMP modes
Not all HP ProLiant servers support all AMP modes. RBSU provides menu options only for the modes
supported by the server. Advanced memory protection within RBSU enables the following advanced memory
modes:
•
Advanced ECC Mode—Provides memory protection beyond Standard ECC. All single-bit failures and
some multi-bit failures can be corrected without resulting in system downtime.
•
Online Spare Mode—Provides protection against failing or degraded DIMMs. Certain memory is set
aside as spare, and automatic failover to spare memory occurs when the system detects a degraded
DIMM. DIMMs that are likely to receive a fatal or uncorrectable memory error are removed from
operation automatically, resulting in less system downtime.
For DIMM population requirements, see the server-specific user guide.
Re-entering the server serial number and product ID
After you replace the system board, you must re-enter the server serial number and the product ID.
1.
During the server startup sequence, press the F9 key to access RBSU.
2.
Select the Advanced Options menu.
3.
Select Service Options.
4.
Select Serial Number. The following warnings appear:
WARNING! WARNING! WARNING! The serial number is loaded into the system during
the manufacturing process and should NOT be modified. This option should only
Software and configuration utilities
100
be used by qualified service personnel. This value should always match the
serial number sticker located on the chassis.
Warning: The serial number should ONLY be modified by qualified service
personnel. This value should always match the serial number located on the
chassis.
5.
Press the Enter key to clear the warning.
6.
Enter the serial number and press the Enter key.
7.
Select Product ID. The following warning appears:
Warning: The Product ID should ONLY be modified by qualified service
personnel. This value should always match the Product ID on the chassis.
8.
Enter the product ID and press the Enter key.
9.
Press the Esc key to close the menu.
10.
Press the Esc key to exit RBSU.
11.
Press the F10 key to confirm exiting RBSU. The server automatically reboots.
Utilities and features
Array Configuration Utility
ACU is a utility with the following features:
•
Runs as a local application or remote service accessed through the HP System Management Homepage
•
Supports online array capacity expansion, logical drive extension, assignment of online spares, and
RAID or stripe size migration
•
Suggests the optimum configuration for an unconfigured system
•
For supported controllers, provides access to licensed features, including:
o
Moving and deleting individual logical volumes
o
Advanced Capacity Expansion (SATA to SAS and SAS to SATA)
o
Offline Split Mirror
o
RAID 6 and RAID 60
o
RAID 1 (ADM) and RAID 10 (ADM)
o
HP Drive Erase
o
Video-On-Demand Advanced Controller Settings
•
Provides different operating modes, enabling faster configuration or greater control over the
configuration options
•
Remains available any time that the server is on
•
Displays on-screen tips for individual steps of a configuration procedure
•
Provides context-sensitive searchable help content
•
Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab
ACU is now available as an embedded utility, starting with HP ProLiant Gen8 servers. To access ACU, use
one of the following methods:
•
If an optional controller is not installed, press F10 during boot.
Software and configuration utilities
101
•
If an optional controller is installed, when the system recognizes the controller during POST, press F5.
For optimum performance, the minimum display settings are 1024 × 768 resolution and 16-bit color. Servers
running Microsoft® operating systems require one of the following supported browsers:
•
Internet Explorer 6.0 or later
•
Mozilla Firefox 2.0 or later
For Linux servers, see the README.TXT file for additional browser and support information.
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP
website (http://www.hp.com/support/CASAC_RG_en).
Option ROM Configuration for Arrays
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign
RAID levels, and establish online spare configurations.
The utility also provides support for the following functions:
•
Reconfiguring one or more logical drives
•
Viewing the current logical drive configuration
•
Deleting a logical drive configuration
•
Setting the controller to be the boot controller
•
Selecting the boot volume
If you do not use the utility, ORCA will default to the standard configuration.
For more information regarding the default configurations that ORCA uses, see the HP ROM-Based Setup
Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu).
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP
website (http://www.hp.com/support/CASAC_RG_en).
ROMPaq utility
The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert a
ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online Flash
Components for Windows and Linux operating systems are available for updating the system firmware.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available firmware
revisions.
For more information, go to the HP website (http://www.hp.com/go/hpsc) and click on Drivers, Software
& Firmware. Then, enter your product name in the Find an HP product field and click Go.
Automatic Server Recovery
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as
a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the
Software and configuration utilities
102
ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the
operating system is functioning properly, the system periodically resets the timer. However, when the
operating system fails, the timer expires and restarts the server.
ASR increases server availability by restarting the server within a specified time after a system hang. At the
same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR
has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.
USB support
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB
devices through legacy USB support, which is enabled by default in the system ROM.
Legacy USB support provides USB functionality in environments where USB support is not available normally.
Specifically, HP provides legacy USB functionality for the following:
•
POST
•
RBSU
•
Diagnostics
•
DOS
•
Operating environments which do not provide native USB support
Redundant ROM support
The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server has
a single ROM that acts as two separate ROM images. In the standard implementation, one side of the ROM
contains the current ROM program version, while the other side of the ROM contains a backup version.
NOTE: The server ships with the same version programmed on each side of the ROM.
Safety and security benefits
When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a
backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for
any reason. This feature protects the existing ROM version, even if you experience a power failure while
flashing the ROM.
Keeping the system current
Drivers
IMPORTANT: Always perform a backup before installing or updating device drivers.
The server includes new hardware that may not have driver support on all OS installation media.
Software and configuration utilities
103
If you are installing an Intelligent Provisioning-supported OS, use Intelligent Provisioning (on page 96) and its
Configure and Install feature to install the OS and latest supported drivers.
If you do not use Intelligent Provisioning to install an OS, drivers for some of the new hardware are required.
These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded as
part of an SPP.
If you are installing drivers from SPP, be sure that you are using the latest SPP version that your server
supports. To verify that your server is using the latest supported version and for more information about SPP,
see the HP website (http://www.hp.com/go/spp/download).
To locate the drivers for a particular server, go to the HP website (http://www.hp.com/go/hpsc) and click
on Drivers, Software & Firmware. Then, enter your product name in the Find an HP product field and click
Go.
Software and firmware
Software and firmware should be updated before using the server for the first time, unless any installed
software or components require an older version. For system software and firmware updates, download the
SPP ("HP Service Pack for ProLiant" on page 98) from the HP website (http://www.hp.com/go/spp).
Version control
The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule
software update tasks to the entire enterprise.
•
VCRM manages the repository for SPP. Administrators can view the SPP contents or configure VCRM to
automatically update the repository with internet downloads of the latest software and firmware from
HP.
•
VCA compares installed software versions on the node with updates available in the VCRM managed
repository. Administrators configure VCA to point to a repository managed by VCRM.
For more information about version control tools, see the HP Systems Insight Manager User Guide, the HP
Version Control Agent User Guide, and the HP Version Control Repository User Guide on the HP website
(http://www.hp.com/go/hpsim).
HP operating systems and virtualization software support for
ProLiant servers
For information about specific versions of a supported operating system, see the HP website
(http://www.hp.com/go/ossupport).
Software and configuration utilities
104
HP Technology Service Portfolio
HP Technology Services offers a targeted set of consultancy, deployment, and service solutions designed to
meet the support needs of the most business and IT environments.
Foundation Care services deliver scalable hardware and software support packages for HP ProLiant server
and industry-standard software. You can choose the type and level of service that is most suitable for your
business needs.
HP Collaborative Support —With a single call, HP addresses initial hardware and software support needs
and helps to quickly identify if a problem is related to hardware or software. If the problem is identified as
hardware, HP will resolve as per service level commitments. If the reported incident is related to HP or
supported 3rd party software product and cannot be resolved by applying known fixes, HP will contact the
third-party vendor and create a problem incident on the your behalf.
HP Proactive Care — For customers running business critical environments where down time is not an option,
then HP Proactive Care helps to deliver high levels of application availability. Key to these service options is
the delivery of proactive service management offers to help you avoid the causes of down time. If a problems
arises than HP offers advanced technical response from critical system support specialist for fast problem
identification and resolution.
HP Support Center — All service options include HP Support Center delivering information, tools, and
experts required to support HP business products.
HP Insight Remote Support — Provides 24x7 secure remote monitoring, diagnosis and problem resolution.
For more information, see the HP website (http://www.hp.com/services/proliant) or the HP website for the
HP BladeSystem (http://www.hp.com/services/bladesystem).
Change control and proactive notification
HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of
upcoming hardware and software changes on HP commercial products.
For more information, refer to the HP website (http://www.hp.com/go/pcn).
Software and configuration utilities
105
Troubleshooting
Troubleshooting resources
The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving
common problems and comprehensive courses of action for fault isolation and identification, issue resolution,
and software maintenance on ProLiant servers and server blades. To view the guide, select a language:
•
English (http://www.hp.com/support/ProLiant_TSG_v1_en)
•
French (http://www.hp.com/support/ProLiant_TSG_v1_fr)
•
Spanish (http://www.hp.com/support/ProLiant_TSG_v1_sp)
•
German (http://www.hp.com/support/ProLiant_TSG_v1_gr)
•
Japanese (http://www.hp.com/support/ProLiant_TSG_v1_jp)
•
Simplified Chinese (http://www.hp.com/support/ProLiant_TSG_v1_sc)
The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages
and information to assist with interpreting and resolving error messages on ProLiant servers and server
blades. To view the guide, select a language:
•
English (http://www.hp.com/support/ProLiant_EMG_v1_en)
•
French (http://www.hp.com/support/ProLiant_EMG_v1_fr)
•
Spanish (http://www.hp.com/support/ProLiant_EMG_v1_sp)
•
German (http://www.hp.com/support/ProLiant_EMG_v1_gr)
•
Japanese (http://www.hp.com/support/ProLiant_EMG_v1_jp)
•
Simplified Chinese (http://www.hp.com/support/ProLiant_EMG_v1_sc)
Troubleshooting
106
Battery replacement
If the server no longer automatically displays the correct date and time, you may need to replace the battery
that provides power to the real-time clock.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
•
•
•
•
Do not attempt to recharge the battery.
Do not expose the battery to temperatures higher than 60°C (140°F).
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
Replace only with the spare designated for this product.
To remove the component:
1.
Power down the server (on page 23).
2.
Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3.
Extend ("Extend the server from the rack" on page 23) or remove the server from the rack.
4.
Remove the access panel (on page 24).
5.
If installed, remove the secondary PCIe riser cage.
6.
Locate the battery ("System board components" on page 15).
7.
Remove the battery.
To replace the component, reverse the removal procedure.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
Battery replacement
107
Regulatory compliance notices
Regulatory compliance identification numbers
For the purpose of regulatory compliance certifications and identification, this product has been assigned a
unique regulatory model number. The regulatory model number can be found on the product nameplate
label, along with all required approval markings and information. When requesting compliance information
for this product, always refer to this regulatory model number. The regulatory model number is not the
marketing name or model number of the product.
Federal Communications Commission notice
Part 15 of the Federal Communications Commission (FCC) Rules and Regulations has established Radio
Frequency (RF) emission limits to provide an interference-free radio frequency spectrum. Many electronic
devices, including computers, generate RF energy incidental to their intended function and are, therefore,
covered by these rules. These rules place computers and related peripheral devices into two classes, A and
B, depending upon their intended installation. Class A devices are those that may reasonably be expected
to be installed in a business or commercial environment. Class B devices are those that may reasonably be
expected to be installed in a residential environment (for example, personal computers). The FCC requires
devices in both classes to bear a label indicating the interference potential of the device as well as additional
operating instructions for the user.
FCC rating label
The FCC rating label on the device shows the classification (A or B) of the equipment. Class B devices have
an FCC logo or ID on the label. Class A devices do not have an FCC logo or ID on the label. After you
determine the class of the device, refer to the corresponding statement.
FCC Notice, Class A Equipment
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses,
and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. Operation of this equipment in a residential area
is likely to cause harmful interference, in which case the user will be required to correct the interference at
personal expense.
FCC Notice, Class B Equipment
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
Regulatory compliance notices
108
radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
•
Reorient or relocate the receiving antenna.
•
Increase the separation between the equipment and receiver.
•
Connect the equipment into an outlet on a circuit that is different from that to which the receiver is
connected.
•
Consult the dealer or an experienced radio or television technician for help.
Declaration of conformity for products marked with
the FCC logo, United States only
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
this device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
For questions regarding this product, contact us by mail or telephone:
•
Hewlett-Packard Company
P. O. Box 692000, Mail Stop 530113
Houston, Texas 77269-2000
•
1-800-HP-INVENT (1-800-474-6836). (For continuous quality improvement, calls may be recorded or
monitored.)
For questions regarding this FCC declaration, contact us by mail or telephone:
•
Hewlett-Packard Company
P. O. Box 692000, Mail Stop 510101
Houston, Texas 77269-2000
•
1­281-514-3333
To identify this product, refer to the part, series, or model number found on the product.
Modifications
The FCC requires the user to be notified that any changes or modifications made to this device that are not
expressly approved by Hewlett-Packard Company may void the user’s authority to operate the equipment.
Cables
Connections to this device must be made with shielded cables with metallic RFI/EMI connector hoods in
order to maintain compliance with FCC Rules and Regulations.
Canadian notice (Avis Canadien)
Class A equipment
Regulatory compliance notices
109
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment
Regulations.
Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur
du Canada.
Class B equipment
This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment
Regulations.
Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur
du Canada.
European Union regulatory notice
Products bearing the CE marking comply with the following EU Directives:
•
Low Voltage Directive 2006/95/EC
•
EMC Directive 2004/108/EC
•
Ecodesign Directive 2009/125/EC, where applicable
•
RoHS Directive 2011/65/EU
CE compliance of this product is valid if powered with the correct CE-marked AC adapter provided by HP.
Compliance with these directives implies conformity to applicable harmonized European standards
(European Norms) that are listed in the EU Declaration of Conformity issued by HP for this product or product
family and available (in English only) either within the product documentation or at the following HP website
(http://www.hp.eu/certificates) (type the product number in the search field).
Compliance is indicated by the CE marking as shown below. Where applicable for telecommunications
products, a 4-digit notified body number may follow it as a suffix.
Please refer to the regulatory label provided on the product.
The point of contact for regulatory matters is Hewlett-Packard GmbH, Dept./MS: HQ-TRE, Herrenberger
Strasse 140, 71034 Boeblingen, GERMANY.
Disposal of waste equipment by users in private
households in the European Union
This symbol on the product or on its packaging indicates that this product must not be disposed of
with your other household waste. Instead, it is your responsibility to dispose of your waste
equipment by handing it over to a designated collection point for the recycling of waste electrical
and electronic equipment. The separate collection and recycling of your waste equipment at the
time of disposal will help to conserve natural resources and ensure that it is recycled in a manner
that protects human health and the environment. For more information about where you can drop
off your waste equipment for recycling, please contact your local city office, your household
waste disposal service or the shop where you purchased the product.
Regulatory compliance notices
110
Japanese notice
BSMI notice
Korean notice
Class A equipment
Class B equipment
Regulatory compliance notices
111
Chinese notice
Class A equipment
Laser compliance
This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic
transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance
with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.
Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser
Notice No. 50, dated June 24, 2007; and with IEC 60825-1:2007.
WARNING: Use of controls or adjustments or performance of procedures other than those
specified herein or in the laser product's installation guide may result in hazardous radiation
exposure. To reduce the risk of exposure to hazardous radiation:
• Do not try to open the module enclosure. There are no user-serviceable components inside.
• Do not operate controls, make adjustments, or perform procedures to the laser device other
than those specified herein.
• Allow only HP Authorized Service technicians to repair the unit.
The Center for Devices and Radiological Health (CDRH) of the U.S. Food and Drug Administration
implemented regulations for laser products on August 2, 1976. These regulations apply to laser products
manufactured from August 1, 1976. Compliance is mandatory for products marketed in the United States.
Battery replacement notice
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
Batteries, battery packs, and accumulators should not be disposed of together with the general
household waste. To forward them to recycling or proper disposal, use the public collection system or
return them to HP, an authorized HP Partner, or their agents.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
Regulatory compliance notices
112
Taiwan battery recycling notice
The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of the
Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or promotion.
Contact a qualified Taiwanese recycler for proper battery disposal.
Power cord statement for Japan
Regulatory compliance notices
113
Electrostatic discharge
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system
or handling parts. A discharge of static electricity from a finger or other conductor may damage system
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
To prevent electrostatic damage:
•
Avoid hand contact by transporting and storing products in static-safe containers.
•
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
•
Place parts on a grounded surface before removing them from their containers.
•
Avoid touching pins, leads, or circuitry.
•
Always be properly grounded when touching a static-sensitive component or assembly.
Grounding methods to prevent electrostatic discharge
Several methods are used for grounding. Use one or more of the following methods when handling or
installing electrostatic-sensitive parts:
•
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist
straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To
provide proper ground, wear the strap snug against the skin.
•
Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when
standing on conductive floors or dissipating floor mats.
•
Use conductive field service tools.
•
Use a portable field service kit with a folding static-dissipating work mat.
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install
the part.
For more information on static electricity or assistance with product installation, contact an authorized
reseller.
Electrostatic discharge
114
Specifications
Environmental specifications
Specification
Value
Temperature range*
—
Operating
10°C to 35°C (50°F to 95°F)
Non-operating
-30°C to 60°C (-22°F to 140°F)
Relative humidity
(noncondensing)
—
Operating
10% to 90%
28°C (82.4°F), maximum wet bulb
temperature
Non-operating
5% to 95%
38.7°C (101.7°F), maximum wet
bulb temperature
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048
m (10,000 ft) is applicable. No direct sunlight allowed.
Mechanical specifications
Specification
Value
Height
8.73 cm (3.44 in)
Depth, SFF
69.85 cm (27.54 in)
Depth, LFF
74.93 cm (29.5 in)
Width
44.54 cm (17.54 in)
Weight (maximum—all LFF
drives)
27.66 kg (61.0 lb)
Weight (minimum—one SFF
drive)
18.59 kg (41.0 lb)
Power supply specifications
Depending on installed options, the server is configured with one of the following power supplies:
•
HP 460 W CS HE Power Supply (92%) specifications (on page 116)
•
HP 460 W CS Platinum Power Supply (94%) specifications (on page 116)
•
HP 750 W CS HE Power Supply (92%) specifications (on page 116)
•
HP 750 W CS Platinum Power Supply (94%) specifications (on page 117)
•
HP 750 W 48V CS Power Supply specifications (on page 117)
•
HP 1200 W CS HE Power Supply (94%) specifications (on page 118)
Specifications
115
HP 460 W CS HE Power Supply (92%) specifications
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
5.5 A at 100 VAC
2.6 A at 200 VAC
Rated input power
526 W at 100V AC input
505 W at 200V AC input
BTUs per hour
1794 at 100V AC input
1725 at 200V AC input
Power supply output
Rated steady-state power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
Maximum peak power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
HP 460 W CS Platinum Power Supply (94%) specifications
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
5.2 A at 100 VAC
2.5 A at 200 VAC
Rated input power
517 W at 100V AC input
496 W at 200V AC input
Btus per hour
1764 at 100V AC input
1694 at 200V AC input
Power supply output
Rated steady-state power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
Maximum peak power
460 W at 100V to 120V AC input
460 W at 200V to 240V AC input
HP 750 W CS HE Power Supply (92%) specifications
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Specifications
116
Rated input current
8.9 A at 100 VAC
4.3 A at 200 VAC
Rated input power
857 W at 100V AC input
824 W at 200V AC input
BTUs per hour
2925 at 100V AC input
2812 at 200V AC input
Power supply output
Rated steady-state power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
Maximum peak power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
HP 750 W CS Platinum Power Supply (94%) specifications
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
8.5 A at 100 VAC
4.1 A at 200 VAC
Maximum rated input power
843 W at 100V AC input
811 W at 200V AC input
Btus per hour
2878 at 100V AC input
2769 at 200V AC input
Power supply output
Rated steady-state power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
Maximum peak power
750 W at 100V to 120V AC input
750 W at 200V to 240V AC input
HP 750 W 48V CS Power Supply specifications
Specification
Value
Input requirements
Rated input voltage
100 to 240 VAC
Rated Input frequency
50 HZ to 60 HZ
Rated input current
9 to 4.5 A
Maximum rated input power
815 W at 36 VDC input
805 W at 48 VDC input
795 W at 72 VDC input
Btus per hour
2780 at 36 VDC input
2740 at 48 VDC input
2720 at 72 VDC input
Power supply output
Rated steady-state power
750 W
Specifications
117
Maximum peak power
750 W
HP 1200 W CS HE Power Supply (94%) specifications
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
9.1 A at 100 VAC
6.7 A at 200 VAC
Maximum rated input power
897 W at 100V AC input
1321 W at 200V AC input
Btus per hour
3408 at 120V AC input
4433 at 200V to 240V AC input
Power supply output
Rated steady-state power
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC
input
Maximum peak power
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC
input
Specifications
118
Support and other resources
Before you contact HP
Be sure to have the following information available before you call HP:
•
Active Health System log (HP ProLiant Gen8 or later products)
Download and have available an Active Health System log for 3 days before the failure was detected.
For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP
website (http://www.hp.com/go/ilo/docs).
•
Onboard Administrator SHOW ALL report (for HP BladeSystem products only)
For more information on obtaining the Onboard Administrator SHOW ALL report, see the HP website
(http://h20000.www2.hp.com/bizsupport/TechSupport/Document.jsp?lang=en&cc=us&objectID=c
02843807).
•
Technical support registration number (if applicable)
•
Product serial number
•
Product model name and number
•
Product identification number
•
Applicable error messages
•
Add-on boards or hardware
•
Third-party hardware or software
•
Operating system type and revision level
HP contact information
For United States and worldwide contact information, see the Contact HP website
(http://www.hp.com/go/assistance).
In the United States:
•
To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be
recorded or monitored.
•
If you have purchased a Care Pack (service upgrade), see the Support & Drivers website
(http://www8.hp.com/us/en/support-drivers.html). If the problem cannot be resolved at the website,
call 1-800-633-3600. For more information about Care Packs, see the HP website
(http://pro-aq-sama.houston.hp.com/services/cache/10950-0-0-225-121.html).
Customer Self Repair
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service
Support and other resources
119
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will
ship that part directly to you for replacement. There are two categories of CSR parts:
•
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,
you will be charged for the travel and labor costs of this service.
•
Optional—Parts for which customer self repair is optional. These parts are also designed for customer
self repair. If, however, you require that HP replace them for you, there may or may not be additional
charges, depending on the type of warranty service designated for your product.
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the
Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective
part back to HP within a defined period of time, normally five (5) business days. The defective part must be
returned with the associated documentation in the provided shipping material. Failure to return the defective
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping
and part return costs and determine the courier/carrier to be used.
For more information about HP's Customer Self Repair program, contact your local service provider. For the
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).
Réparation par le client (CSR)
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à
votre produit.
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de
retour, et détermine la société de courses ou le transporteur à utiliser.
Support and other resources
120
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP
(http://www.hp.com/go/selfrepair).
Riparazione da parte del cliente
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per
la sostituzione. Vi sono due categorie di parti CSR:
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono
identificate da un "No" nel Catalogo illustrato dei componenti.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il
corriere/vettore da utilizzare.
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).
Customer Self Repair
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen
Service berechnet.
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche
Kosten anfallen.
Support and other resources
121
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den
Kurier-/Frachtdienst.
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter
(http://www.hp.com/go/selfrepair).
Reparaciones del propio cliente
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se
clasifican en dos categorías:
•
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de
desplazamiento y de mano de obra de dicho servicio.
•
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de
servicio de garantía correspondiente al producto.
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el
catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas
Support and other resources
122
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite
la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Customer Self Repair
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het
product.
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).
Reparo feito pelo cliente
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.
Existem duas categorias de peças CSR:
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,
serão cobradas as despesas de transporte e mão-de-obra do serviço.
Support and other resources
123
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço
postal a ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP
(http://www.hp.com/go/selfrepair).
Support and other resources
124
Support and other resources
125
Support and other resources
126
Acronyms and abbreviations
ABEND
abnormal end
ACU
Array Configuration Utility
AMP
Advanced Memory Protection
ASR
Automatic Server Recovery
CSA
Canadian Standards Association
CSR
Customer Self Repair
DDDC
Double Device Data Correction
DDR
double data rate
FBWC
flash-backed write cache
HDIMM
HyperCloud DIMM
IEC
International Electrotechnical Commission
iLO
Integrated Lights-Out
Acronyms and abbreviations 127
IML
Integrated Management Log
ISEE
Instant Support Enterprise Edition
LFF
large form factor
NMI
nonmaskable interrupt
NVRAM
nonvolatile memory
ORCA
Option ROM Configuration for Arrays
PCIe
peripheral component interconnect express
POST
Power-On Self Test
PSP
HP ProLiant Support Pack
RBSU
ROM-Based Setup Utility
RDIMM
registered dual in-line memory module
RDP
Rapid Deployment Pack
SAS
serial attached SCSI
SATA
serial ATA
Acronyms and abbreviations 128
SDDC
Single Device Data Correction
SELV
separated extra low voltage
SFF
small form factor
SIM
Systems Insight Manager
TMRA
recommended ambient operating temperature
TPM
Trusted Platform Module
UDIMM
unregistered dual in-line memory module
UID
unit identification
UPS
uninterruptible power system
USB
universal serial bus
VCA
Version Control Agent
Acronyms and abbreviations 129
Documentation feedback
HP is committed to providing documentation that meets your needs. To help us improve the documentation,
send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com).
Include the document title and part number, version number, or the URL when submitting your feedback.
Documentation feedback
130
Index
A
D
AC power supply 116, 117, 118
access panel 24, 25
Advanced ECC memory 53, 54, 100
air baffle 32
Array Configuration Utility (ACU) 101
ASR (Automatic Server Recovery) 102
authorized reseller 119
auto-configuration process 99
Automatic Server Recovery (ASR) 102
DC power supply 36
default settings 53
diagnostic tools 94, 96, 102
diagnostics utility 96
DIMM identification 51
DIMM population guidelines 53
DIMM slot locations 18
DIMMs 18, 51
DIMMs, installation 55
DIMMs, single- and dual-rank 51
drive LEDs 19
drivers 103
drives 19
B
battery 107, 112
before you contact HP 119
BIOS upgrade 94, 102
blue screen event 17
boot options 40, 100
BSMI notice 111
buttons 7
C
cable management arm 25, 38
cables 86, 109
cabling 86, 87, 89, 92
Canadian notice 109
capacitor pack 58, 59
Care Pack 34, 105
Change Control 105
Chinese notice 112
chipset SATA cable 89
components 7
components, identification 7
configuration of system 40, 94
connectors 7
contacting HP 119
controller 57
crash dump analysis 17
CSR (customer self repair) 119
customer self repair (CSR) 119
E
electrical grounding requirements 36
electrostatic discharge 114
enabling the Trusted Platform Module 84
environmental requirements 34
environmental specifications 115
Erase Utility 94, 97
error messages 106
European Union regulatory notice 110
expansion board options 68
expansion boards 68
expansion slot blanks 68
expansion slots 69
extending server from rack 23
F
fan cage 26
fans 42
fans, installing 42
FBWC cabling 88
FBWC module 21, 58, 59
FCC rating label 108
features 7, 101
Federal Communications Commission (FCC)
notice 108, 109
firmware 104
firmware update 98, 104
Index
131
firmware, updating 98, 104
FlexibleLOM 66
front panel buttons 9
front panel components 7
front panel LEDs 9
full-length expansion board 28, 31
G
grounding methods 114
grounding requirements 36
H
hard drive bays 7
hard drive cage 72
hard drive LEDs 19
hard drives, determining status of 19
hardware options installation 38, 42
health driver 102
health LEDs 9
help resources 119
hot-plug fans 21, 25, 27
hot-plug SAS hard drive options 55
HP Insight Diagnostics 96, 97
HP Insight Remote Support software 105
HP Service Pack for ProLiant 94, 98
HP Smart memory 50
HP Smart Update Manager overview 94, 98
HP technical support 105, 119
I
identification number 108
iLO (Integrated Lights-Out) 94, 95, 96
IML (Integrated Management Log) 94, 96
Insight Diagnostics 96, 97, 103
installation services 34
installation, server options 38, 42
installing a hot-plug SAS hard drive 56
installing hardware 42
installing the full-length expansion board retainer 30
installing the server into the rack 38
installing the Trusted Platform Module board 83
Integrated Lights-Out (iLO) 94
Integrated Management Log (IML) 96
Intelligent Provisioning 94, 96
J
Japanese notice 111
K
Korean notices 111
L
laser devices 112
LEDs 12, 19
LEDs, front panel 19
LEDs, hard drive 19
LEDs, SAS hard drive 19
LEDs, troubleshooting 20, 106
lockstep memory 53, 54
M
mechanical specifications 115
memory 49, 51, 53
memory configurations 52, 53
memory dump 17
memory subsystem architecture 50
memory, configuration requirements 52, 54
memory, configuring 52, 53
memory, lockstep 53, 54
memory, online spare 53, 100
N
NMI header 17
O
online spare memory 53, 54, 100
operating system crash 17
operating systems 40, 104
optical drive 7, 63
optical drive cable 87
optimum environment 34
Option ROM Configuration for Arrays (ORCA) 94,
102
options installation 38, 42
ORCA (Option ROM Configuration for Arrays) 94,
102
P
PCI expansion slots 14, 23
PCI riser cage 29, 30, 70
power cabling 92
power cord 113
power distribution unit (PDU) 36
Power On button 23, 40
power requirements 36
Index
132
power supply 65
power supply LEDs 14
power supply specifications 115, 116, 117, 118
powering down 23
preparation procedures 23
problem diagnosis 106
processor option 42
processors 42
Q
support 119
supported operating systems 104
switches 17
system battery 107
system board components 15
system components 7
system maintenance switch 16, 17
system power LED 9
Systems Insight Display 10, 11, 12
Systems Insight Display LEDs 11, 12
QuickSpecs 94
T
R
Taiwan battery recycling notice 113
technical support 105, 119
telephone numbers 119
temperature requirements 35
TPM (Trusted Platform Module) 82, 84
troubleshooting 106
rack bezel 81
rack installation 34, 37
rack mounting hardware 38
rack resources 34
rack warnings 37
RBSU (ROM-Based Setup Utility) 99, 100
rear panel buttons 14
rear panel components 13
rear panel LEDs 14
rear panel, accessing 25
redundant ROM 103
registering the server 41
regulatory compliance notices 108, 110
removing a hot-plug SAS hard drive 57
removing the access panel 24
retaining the recovery key/password 84
ROM redundancy 103
ROMPaq utility 94, 102, 103
S
safety considerations 37, 103
SAS and SATA device numbers 18
scripted installation 97
serial number 100
series number 108
server features and options 42
Service Packs 98
shipping carton contents 38
space and airflow requirements 35
specifications 115, 116, 117, 118
specifications, environmental 115
specifications, mechanical 115
specifications, power 115, 116, 117, 118
specifications, server 115
SPP 94, 98
static electricity 114
U
UID LED 17
updating the system ROM 103
USB connectors 7
USB support 103
utilities 94, 101
utilities, deployment 94, 97, 99
V
ventilation 34
Version Control 104
video connector 7
W
warnings 37
website, HP 119
Index
133