Ampro by ADLINK™ services and customizations help

Ampro by ADLINK™ Extreme Rugged™
10
Ampro by ADLINK™ services and
customizations help you build a better
product faster
We continue to expand our product lines based on Ampro’s heritage
as the leading developer of industry standards including PC/104
(founder of the consortium), EBX and EPIC form factors. Ampro has
contributed to the success of many manufacturing companies, large
and small, by providing highly reliable single board computers (SBCs),
computer-on-modules (COMs) and industrial systems.
Most Extreme Rugged™ Products in the
Industry
Many commercial board manufacturers claim that they offer
“ruggedized” products which give the impression of durability under
tough conditions. The term ‘ruggedized’ however often refers to
desktop grade designs which are screened at high temperatures
with high yield fallout. Do not be fooled by these claims. Ruggedness
should be inherent in the design. Our Extreme Rugged products are
subjected to extensive voltage and temperature margin tests during
the new product development process along with Highly Accelerated
Life Test (HALT) and shock and vibration testing.
10-1
http://www.adlinktech.com/ampro/
1
AdvancedTCA
Procucts
2
6U cPCI Blades
3
6U cPCI
Platforms
4
Configuration Control
Worldwide Development Centers and
Manufacturing
ADLINK now has design-for-ruggedness and design-forcost engineering departments, fortified by world class
PCB assembly and system-level integration. Our thorough
supply chain management program helps ADLINK deliver
high quality products that adhere to the company’s strict
development and production quality standards including
ISO 9001:2000.
Extending the Life of Our Products
ADLINK designs products with attention to long product
lifetimes by providing comprehensive lifecycle support and
management assistance to customers. When changes are
necessary, we provide advance notification and guidance
through the transition. And our dedication to industry
standards provides new products and product roadmaps
that enable smooth resolution to end-of-life (EOL) migration
issues.
10-2
7
8
9
10
Ampro by ADLINK
Extreme Rugged
Optional conformal coating is a protective material applied
over electronic circuitry and can prevent short circuits,
corrosion, dendritic growth and electromigration of metals
between conductors. Conformal coating from ADLINK is
applied by spraying, clipping or flow coating the circuit
board assembly.
ADLINK invests significantly in integrating drivers and
developing, testing, documenting and supporting BSPs for
more operating systems than any other supplier in today’s
marketplace. We work with both small and large operating
systems. Please check our Web site for the most up-to-date
OS version information for a particular product.
Computer-OnModules
Conformal Coating Protects
Your Computers in the Harshest
Conditions
6
Embedded OS Support
IPC
Accessories
Strict change control and 60 day advance notification of
changes sets us apart from other suppliers. We give you the
opportunity to understand changes to Ampro by ADLINK
products before they are rolled into production.
5
Industrial
Chassis
We offer optional Extended Temperature Testing (ETT) for
selected Ampro by ADLINK products. By testing each unit
in production, we verify that all boards will operate and
function at temperatures up to –40° to +85°C. For specific
board information, please refer to datasheet.
Rather than simply using desktop BIOS, ADLINK adds BIOS
extensions that support the development and deployment
of embedded systems. Additionally, ADLINK has a proven
track record of offering BIOS customizations to meet
unique requirements giving our customers a competitive
advantage.
Industrial SBCs
& MBs
Extended Temperature Testing
Embedded BIOS
3U cPCI
Platforms
We subject our Extreme Rugged products to HALT during
the product development process. This testing is performed
at an outside test lab managed by industry experts. This
process consists of progressively increased extremes of
temperature (both high and low), rapid thermal transition,
six-axis vibration, and finally, combined temperature and
vibration stress.
3U cPCI Blades
Highly Accelerated Life Test
Ampro by ADLINK™ Extreme Rugged™
10
Extreme Rugged™ and Rugged grade
embedded solutions for a variety of markets
Medical
In the medical industry, time is of the essence and nothing less than
perfection is acceptable. Ampro by ADLINKTM embedded computer
boards and systems are utilized in a variety of medical applications
and delicate procedures. Our products adhere to the strictest of
medical standards and provide unsurpassed reliability.
Military
At the frontline or back home training, Ampro by ADLINKTM Extreme
RuggedTM boards withstand intensities of military environments. With
the ability to endure temperatures of -40°C to +85°C, our boards are
able to perform precisely in harsh conditions experienced all over the
world. For specific board information, please refer to datasheet.
10-3
http://www.adlinktech.com/ampro/
1
AdvancedTCA
Procucts
2
6U cPCI Blades
3
6U cPCI
Platforms
4
Homeland Security
Homeland security has never been more important and
extensive. With millions of people passing through security
checkpoints every day, the large gathering of people creates
a natural target for terrorism and other forms of crime.
5
3U cPCI
Platforms
ADLINK’s broad range of form factors provide scalability in
performance, connectivity, size and energy requirements
along with modular flexibility, longevity and ruggedness to
ensure our products meet the needs of your company. With
designs based upon open standards, ADLINK boards and
systems are easy to maintain and upgrade.
3U cPCI Blades
Industrial
6
Industrial SBCs
& MBs
7
On board many of the aircraft that take to the skies
everyday, Ampro by ADLINKTM single board computers
(SBCs) and computer-on-modules (COMs) easily perform
under the extreme conditions of fight. Able to withstand a
temperature range of –40° to +85°C, our Extreme RuggedTM
boards operates in the temperatures experienced at high
altitudes. For specific board information, please refer to
datasheet.
It does not matter if your audience is one or one million,
you want to ensure its members enjoy themselves and
are provided with the best quality performance. Used in
a variety of sports and entertainment venues, ADLINK’s
boards complete the assigned tasks quickly and efficiently.
8
IPC
Accessories
Entertainment
Industrial
Chassis
Aviation
9
Computer-OnModules
Transportation
Test and Measurement
Moving people and goods from one place to another is a
critical part of every society. One mistake can cause a ripple
effect through an entire economy. In both public and private
transportation, Ampro by ADLINKTM boards provide rugged
quality and comprehensive data processing.
Companies expose their products to a gauntlet of tests
to reduce the flaws of the end products, and ADLINK is
right there aiding in the test and measurement processes.
Able to withstand the 24 hours a day, 7 days a week mass
production environment, our SBCs and COMs provide
unparalleled reliability and quality.
10
Ampro by ADLINK
Extreme Rugged
10-4
True Ruggedness by Design
• vs. just ruggedized
Ampro by ADLINK™ Extreme Rugged™
10
Many commercial board manufacturers claim that they
offer “ruggedized” products which gives the impression
of durability and reliability under tough conditions. The
term “ruggedized,” however, often refers to
desktop-grade designs which are screened at high
temperatures with high yield fallout.
ADLINK believes that ruggedness should be inherent in
the design. Ampro by ADLINKTM products are subjected
to extensive voltage and temperature margin tests
along with shock and vibration testing and HALT testing
during the new product development process.
ADLINK HALT Test Program
In order to maximize product reliability and durability,
ADLINK subjects Ampro by ADLINKTM products to a
comprehensive Highly Accelerated Life Test (HALT)
program during the product development process.
The HALT process consists of progressively increased
extremes of temperatures (both high and low), rapid
thermal transitions, six-axis vibration, and finally,
combined temperature and vibration stress. At each
stress dwell extreme, power to the unit is margined at
±5 percent. During each test, stress is progressively
increased while the unit is operating in a continuous
functional test loop that exercises key subsystems
such as the CPU, I/O ports, disk controllers and video.
If a failure is detected, the failure is evaluated and
immediate fixes are made and the test is continues until
destruct limits are reached. Failures and the physical
damage found at the destruct limits provide data which
is used to improve the ruggedness of the product
design.
10-5
http://www.adlinktech.com/ampro/
Random Vibration
Ampro by ADLINKTM products are vibration-tested in
accordance with the specifications of MIL-STD-202F,
Method 214A, Table 214-1, Condition D for Random
Vibration for five minutes on each axis. This equates to
a RMS value of 11.95G of random vibration between
100Hz and 1000Hz along each axis. The units under
test are operational during the tests, performing
functional diagnostics on all hardware subsystems.
The test routine runs continuously to verify functionality
of the system and catch any intermittent failures.
External peripherals (Ethernet Server, hard drive, etc.)
are mounted adjacent to the vibration table and are not
subjected to the test conditions.
Mechanical Shock
Mechanical Shock testing is performed on Ampro
by ADLINKTM products per MIL-STD-202F, Method
213B, Table 213-1, Condition A. This specifies three
50G shocks (peak value, 11ms duration, half-sine
waveform) along each of the three axes. The unit under
test is mounted on a shock machine and subjected to
shock pulses of 50g-peak value, 11 ms duration with
half-sine waveforms. Three shocks in each direction,
for a total of 18 shocks, are applied along the three
mutually perpendicular axes. After shocks in two
directions (+ and –) along each axis, the products are
tested for functionality.
Voltage and Temperature Margin Test Suite
During the margin test suite, the Unit Under Test
(UUT) is subjected to temperatures well outside the
“Extended” (–40° to +85°C) operating temperature
range offered for Ampro by ADLINKTM products. The
UUT is simultaneously subjected to minimum and
maximum rated voltages (±5%). This process verifies
that Ampro by ADLINKTM products are functional and
stable over combined extremes of both temperature
and voltage. In also ensures wide design margins
resulting in long-term reliability under all specified
operating conditions.
Extended Temperature Testing of Boards
AdvancedTCA
Procucts
• Your assurance that Ampro by ADLINKTM products will function in extreme
temperatures
1
2
3
4
3U cPCI Blades
All boards are ramped to the specific temperature
profile and soaked before power is applied. This
ensures that the BIOS properly initializes all hardware
and the boards are ready for diagnostic testing. This
process distinguishes ADLINK from other companies
that rely on a single power cycle while testing at
extended temperatures. ADLINK identifies each board
that passes testing with a label that indicates the
boards fulfill ADLINK’s stringent quality standards.
6U cPCI
Platforms
5
3U cPCI
Platforms
100% ADLINK Quality
Each Ampro by ADLINKTM product is fully functionally
tested during the entire range of extended temperature
operation. Using the custom-designed application user
interface, the board’s test results are scanned into a
database.
This data is used for internal quality assurance audits.
Customers who require this level of detail may request
summarized test results.
6U cPCI Blades
ADLINK provides optional Extended Temperature Testing
to our customers for Ampro by ADLINKTM products.
By testing each unit in production, the Extended
Temperature Test verifies that all boards will operate
at temperatures from –40° to +85°C or other ranges.
ADLINK uses a leading-edge custom-designed modular
card cage system in a state-of-the-art environmental
chamber to test Ampro by ADLINKTM products over the
entire extended temperature range. This leading edge
design is fully automated and utilizes custom-designed
test software.
6
Industrial SBCs
& MBs
7
Industrial
Chassis
8
IPC
Accessories
9
Computer-OnModules
10
Ampro by ADLINK
Extreme Rugged
Extended Temperature Testing verifies that all boards will operate and function
at temperatures from –40° to +85°C or other ranges.
10-6
Conformal Coating Protects Your
Computers in the Harshest Conditions
Ampro by ADLINK™ Extreme Rugged™
10
• Prevent short circuits, corrosion, dendritic growth and electromigration
Embedded single board computers are often
deployed in harsh environments. Industrial, military,
naval and airborne applications often expose
boards to corrosive conditions including humidity,
salt spray, fungus and other contaminants.
Conformal coating, a protective material applied
over electronic circuitry, can prevent short circuits,
corrosion, dendritic growth and electromigration of
metals between conductors.
Conformal coating from ADLINK is applied by
spraying, dipping or flow coating the circuit board
assembly. This coating is typically three mils
(0.003”) thick. ADLINK generally uses HumiSeal
1B31 Acrylic coating, although epoxy, urethane,
paraxylylene and silicone based coatings are also
available upon request. Acrylic coatings are fast
drying and offer high moisture resistance, excellent
flexibility and superior dielectric properties.
The coating is also easy to repair, making
them extremely useful in a wide variety of high
performance situations. HumiSeal 1B31 contains
a UV safety tracer for ease of inspection under a
blacklight.
Enhanced Reliability for Over 20 Years.
Based on Ampro’s proven heritage, ADLINK’s
conformal coating process has provided enhanced
reliability and corrosion protection for over 20
years.
10-7
http://www.adlinktech.com/ampro/
7-Step Conformal Coating Process
1
Preparation
Separable parts are removed and cleaned.
2
Surface Treatment
Low frequency plasma gas is used to etch the solder
mask and improve adhesion.
3
4
Masking
All interface mating surfaces, mounting holes, fans
and heatsinks are masked based on ADLINK’s
detailed specifications.
Spray Coating
Using state-of-the-art spray guns and booths, boards
and thickness coupons are coated.
5
6
Curing
Boards are cured per manufacturers’ specifications.
Some cures are thermal, with temperatures not to
exceed 150°F (65°C).
Inspection
Coating thickness is verified on the coupons and
board coverage is verified using a blacklight.
7
Test
Previously removed parts are re-installed and the
boards are fully tested.
2
• Extend the life of your systems
5
3U cPCI
Platforms
6
Industrial SBCs
& MBs
7
Industrial
Chassis
8
IPC
Accessories
9
Computer-OnModules
Long Live Your Next Project
The Lifecycle SolutionsSM program for Ampro
by ADLINKTM products takes the pain out of
manufacturing and servicing embedded systems for
extended lifecycles. For over 20 years, Ampro helped
large and small system OEMs succeed. From now
on, ADLINK will continue helping you to build a better
product and keep it in production longer.
4
3U cPCI Blades
Derive Greater Value from Your Systems
ADLINK understands that assembling, supporting
and servicing a system for five to ten years or more
can be challenging when building blocks are typically
in production for only several years. Whether or not
government approvals or field trials are involved,
product redesigns are time consuming and expensive.
The Lifecycle SolutionsSM program for Ampro by
ADLINKTM products offers numerous long-term
benefits, including:
• ADLINK strives for a 7-year lifecycle for
standard and semi-custom boards and
systems. Many Ampro by ADLINKTM products
have remained in production for longer.
3
6U cPCI
Platforms
From component selection to strategic partnerships
to component lifecycle management, ADLINK goes
the extra mile to ensure that standard, semi-custom
and custom boards can be produced with no more
than minor changes for years to come. When changes
are necessary, ADLINK provides advance notification
and guidance through the transition to new hardware
or BIOS extensions. And our dedication to industry
standards enables us to provide new products and
product roadmaps that enable smooth resolution of
end-of-life (EOL) migration issues.
• During that period, ADLINK builds boards with
the same components so that you do not have
to worry about new components with each
board shipment.
• For Ampro by ADLINKTM products, ADLINK
provides 60-day written notice of necessary
changes that affect form, fit or function of the
board.
• For End of Life (EOL) Ampro by ADLINKTM
products, ADLINK gives you as much notice as
possible to place orders and up to one full year
to receive shipments.
• ADLINK secures long-term commitments from
component suppliers before components
are designed in, and works closely with
manufacturers and distributors to ensure longterm availability.
• When suppliers notify us about upcoming
component obsolescence, we determine
migration alternatives and work with you early
on rather than delaying notification that can
result in higher costs and inconvenience to you.
• For Ampro by ADLINKTM products, ADLINK
develops new products with the same form
factors, mounting holes, connector locations
and bus interfaces to simplify migration issues
when EOL becomes necessary.
6U cPCI Blades
For over 20 years, Ampro contributed to the success
of many companies, large and small, by designing
products with attention to long product lifetimes and
by providing comprehensive lifecycle support and
management assistance to customers. To support your
ongoing production needs, the Lifecycle SolutionsSM
program has been created for Ampro by ADLINKTM
products.
1
AdvancedTCA
Procucts
Lifecycle SolutionsSM
for Ampro by ADLINKTM Products
10
Ampro by ADLINK
Extreme Rugged
10-8
Ampro by ADLINK™ Methodology
• Ampro by ADLINK™ Product Classifications
Ampro by ADLINK™ Extreme Rugged™
Extreme Rugged™
Our Extreme Rugged boards and systems are designed for harsh environments from the ground up. To support the
extremes of shock, vibration, humidity, and temperature, care is given to component selection, circuit design, PCB layout
and materials, thermal solutions, enclosure design, and manufacturing process. Robust test methods, including Highly
Accelerated Life Testing (HALT), ensure optimal product design phases and meet stringent requirements such as -40˚C to
+85˚C operating temperature range(1), MIL-STD, shock & vibration, and long-term reliability.
Rugged
Our Rugged products achieve a middle ground between industrial and Extreme Rugged applications that experience less
shock and vibration and operate within a -20˚C to +70˚C temperature range. PC-style connectors are used to simplify
cabling because shock and vibration are minimal. Thermal solutions and other system components are designed for
indoor and light outdoor environments.
• Ampro by ADLINK™ Product Lines
Ampro by ADLINK products include the most rugged computer-on-module (COM) offerings in the industry, Single Board Computers (SBC) in popular
compact form factors for embedded applications, and rugged systems with field-proven reliability, durability, and performance.
The following table summarizes Ampro by ADLINK’s product lines, form factors, and supported standards.
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Product Line
Form Factor
Features/
Specification
COM
COM Express™
(125 x 95 mm - Basic)
(95 x 95 mm - Compact)
PICMG COM.0 R1.0
ETX
ETX®
(114 x 95 mm)
ETX® Specification
Rev. 3.0
LittleBoard™
EBX™
(203 x 146 mm)
PC/104 expansion(2)
ReadyBoard™
EPIC™
(165 × 115 mm)
PC/104 expansion(2)
CoreModule®
PC/104 – ISM™
(90 × 96 mm)
PC/104 expansion*
SUMIT™ expansion
RuffSystem™
Conduction-cooled Sealed Enclosure
Extreme Rugged™ computer system
w/ PC-style connectors
MilSystem™
Conduction-cooled Sealed Enclosure
Extreme Rugged™ military computer
w/ MIL-STD connectors
Computer-on-Modules
Single Board Computers
Systems
(1) Some board-level products are limited to -40˚C to +80˚C operating temperature range due to CPU constraints. Extreme Rugged™ systems have an operating
temperature range of -40˚C to +75˚C.
(2) SBCs with PC/104 expansion capability may support PC/104 (ISA), PCI-104 (PCI) or PC/104-Plus (ISA + PCI) connectors, depending on the specific model.
Computer-on-Module
COM ExpressTM; ETX®
• 125 x 95 mm; 114 x 95 mm; 95 x 95 mm
10-9
CoreModule®
LittleBoard™
ReadyBoard™
ISM
EBX
EPIC
• 90 x 96 mm
• 203 x 146 mm
• 165 x 115 mm
RuffSystemTM
MilSystemTM
http://www.adlinktech.com/ampro/
Computer-on-Modules
General Overview
3
6U cPCI
Platforms
COM Express™ offers the modular architecture for the latest and next generation
technologies, giving OEMs the flexibility to optimally design systems based on current and
future applications. It is suited for high-end graphics applications, military computers, high
speed communications and other applications. ADLINK offers the COM Express™ form
factor in an Extreme Rugged™ version with Type II pinout.
4
CD Connector
One Gigabit Ethernet port
Parallel ATA, IDE port
Alternatedefinition assigns this to two
additional Gigabit Ethernet ports
LPC interface
Four Serial ATA channels
Six PCI Express® Lanes x1
Dual 24-bit LVDS channels
95 mm
Eight USB 2.0 ports
PCI Express® x16 for Graphics
These pins can also be assigned to
two SDVO extensions (multiplexed)
Analog VGA
TV-out ports (SDTV/HDTV)
SMB and I2C bus
Keyboard
Power / Thermal control
+12 V primary power input
+12 V primary power input
+5 V standby and 3.3 V RTC
Above connector assignments comply with
COM Express™ Module, Basic Form Factor
COM.0
7
Industrial
Chassis
ETX®
PICMG®
Ampro by ADLINK™ ETX® products are designed for Extreme Rugged™ applications. Our
ETX® COMs enable short time-to-market and with future upgradeability. Ampro by ADLINK™
Extreme Rugged™ modules are designed specifically for harsh environments and placed
through a series of tests including the Highly Accelerated Life Test (HALT) and MIL-STD-202F
for shock and vibration.
8
IPC
Accessories
114 mm
X4
X2
9
ISA bus
Ethernet
Computer-OnModules
IDE1 / IDE2
Power Signals
Speaker, Battery
10
ETX® Core Module
(Top View)
Ampro by ADLINK
Extreme Rugged
VGA / LCD/ Video
95 mm
I2C & SMB bus
X3
6
Industrial SBCs
& MBs
Eight GPIO pins
5
3U cPCI
Platforms
32-bit PCI™ v2.3 bus
Alternate definition assigns this to ten
additional PCI Express® x1 lanes
High Definition Audio
3U cPCI Blades
125 mm
AB Connector
2
6U cPCI Blades
COM Express™
AdvancedTCA
Procucts
Ampro by ADLINK™ products include the most rugged computer-on-module (COM) offerings in the industry, featuring the
most popular form factors and designed to provide fast time-to-market. Our ETX® modules are available for Extreme
Rugged™ applications, with an array of features all the while providing the ability to upgrade your core system
without a complete redesign. Based on the PICMG® COM Express™ specification, ADLINK’s COM Express™ modules feature
the latest technology in CPUs and chipsets, providing Extreme Rugged™ computer-on-module solutions for applications in
harsh environments.
1
X1
COM1 / COM2
32-bit PCI™ bus
LPT1/FDD
USB
IrDA
Audio
Mouse
Keyboard
10-10
Ampro by ADLINK™
Computer-on-Modules
Ampro by ADLINK™ Extreme Rugged™
COM Express™
ETX®
Express-CBR
Express-ATR
COM 840
ETX 802
2.0GHz Core™ i7
1.6GHz Atom™
1.6GHz Core™2 Duo
1.06GHz Core™2 Duo
1.4GHz Pentium® M
1.0GHz Celeron® M
800MHz Celeron® M
4MB
512KB
4MB / 1MB
2MB / 512KB / 0KB
DRAM
Up to 8GB DDR3
Up to 2GB DDR2
Up to 4GB DDR2
Up to 1GB DDR
PATA
Yes
Yes
Yes
Yes
SATA
4
2
2
N/A
N/A
Yes (up to 8GB)
N/A
N/A
6 PCI Express x1
1 PCI Express x8
3 PCI Express x1
5 PCI Express x1
1 PCI Express x16
N/A
ISA
N/A
N/A
N/A
Yes
PCI
Yes
Yes
Yes
Yes
USB
8
8
8
4
LPC
Yes
Yes
Yes
N/A
SMBus
Yes
Yes
Yes
Yes
I2C
Yes
Yes
N/A
Yes
GPIO
8
8
8
N/A
TPM
Yes
Yes
N/A
N/A
Flat Panel
Dual Channel 24-bit LVDS
Single Channel 18-bit
LVDS
Dual Channel 24-bit LVDS
Dual Channel 24-bit LVDS
Graphics
SDVO, PCIe x8, eDP,
Analog VGA, TV-Out
SDVO, Analog VGA,
TV-Out
PCIe x16, SDVO,
Analog VGA, TV-Out
Analog VGA
HD Audio
HD Audio
HD Audio
AC’97 Audio
Gigabit Ethernet
Gigabit Ethernet
Gigabit Ethernet
10/100 BaseT
Operating
Temperature
-20°C to +70°C (std.)
-40°C to +85°C (opt.)
-20°C to +70°C (std.)
-40°C to +80°C (opt.)
-20°C to +70°C (std.)
-40°C to +85°C (opt.)
-20°C to +70°C (std.)
-40°C to +85°C (opt.)
Dimensions
125mm x 95mm
95mm x 95mm
125mm x 95mm
114mm x 95mm
10-12
10-13
10-14
10-16
CPU
L2 Cache
Solid State Disk
PCI Express
10
Selection Guide
Audio
Network
Page
10-11
http://www.adlinktech.com/ampro/
Express-CBR
COM Express™ Module with Intel® Core™ i7
Processor and QM57 Chipset
1
AdvancedTCA
Procucts
Features
2
3
6U cPCI
Platforms
Intel® Core™ i7 Processor
Dual Channel DDR3 SODIMM up to 8GB
Onboard Gigabit Ethernet
Embedded Display Port (eDP) or PCI
Express x8
Dual Channel 24-bit LVDS, VGA, TV-Out and
SDVO
6U cPCI Blades
4
Modular, ultra high performance applications that require a
low power platform for harsh environments.
Dual Channel 24-bit LVDS
Analog VGA, TV-Out
SDVO
Embedded Display Port (eDP) (multiplexed w/ PCI Express x8)
Description
Software & Development Tools
Specifications
Mechanical
Bus Interface
Six PCI Express x1, 32-bit PCI at 33MHz, LPC, SMBus, I2C, PCI Express x8
(multiplexed w/ eDP)
I/O
TPM
Ordering Information
7
8
9
Model Number
Description/Configuration
Express-CBR-R-20
Express-CBR, Intel® Core™ i7-620LE, 2.0GHz, Dual Core,
no RAM
Express-CBRE-L-20
Quick Start Kit (Express-CBR-R-20, 2.0GHz, 2GB RAM,
cable kit, software, thermal module, Extreme Rugged EBX
baseboard, documentation)
Express-CBR-L-20
Quick Start Kit (Express-CBR-R-20, 2.0GHz, 2GB RAM,
cable kit, software, thermal module, Express-Base ATX
baseboard, documentation)
Note: Available upon request. Contact us for additional processors support.
Network Interface
Ethernet - Intel® 82574IT Gigabit Ethernet Controller
10-12
10
Ampro by ADLINK
Extreme Rugged
Chipset – Infineon SLB9635TT1.2
Type – TPM 1.2
Size – COM Express™ basic form factor 125mm x 95mm with Type II pin out
Board Thickness – .093” (2.36mm thick)
Temperature
• Standard: –20°C to +70°C
• Extended: -40°C to +85°C
• Storage: -55°C to +85°C
Humidity – 90% at 60°C
Shock
• Non-operation: 50G peak-to-peak, 11ms duration, MIL-STD-202G Method 213B
Vibration
• Operation: 11.95 Grms, 50-2000 Hz, each axis, MIL-STD-202G Method 214A
Computer-OnModules
IDE – Single channel IDE (SATA to IDE conversion)
SATA – Four channels
USB – Eight USB 2.0 ports
Audio – High Definition Audio
GPIO - Eight general-purpose digital I/O pins
Input Power – 9-16 V wide range input support, with optional 5Vsb for ATX power supply
Power States – Supports S0, S1, S3, S4, S5
6
IPC
Accessories
CPU – Intel® Core™ i7 Dual Core Processor
– 4MB L2 cache
– Integrated graphics processor and memory controller
DRAM – Up to 8GB Dual Channel DDR3 800/1066 SODIMM
Chipset – Intel® QM57 Express Chipset
BIOS – AMI with CMOS backup in 16 Mbit SPI BIOS
Power Specifications
Industrial
Chassis
Core System
OS Support – Linux / Windows® CE 6.0 / XPe / VxWork 6.6 / QNX 6.4*
BIOS – AMI with ACPI 2.0
*Note: Available upon request. Contact us for additional software support.
Industrial SBCs
& MBs
The Ampro by ADLINK™ Express-CBR leverages the Intel®
Core™ i7 processor for ultra high performance and the
Intel® 82574IT GbE Controller for wide range temperature
applications. USB 2.0, SATA and PICMG® COM Express™
COM.0 compliance. Also featured are Intel® Turbo Boost,
Hyper-Threading Technology, USB 2.0, SATA and PICMG®
COM Express™ COM.0 compliance.
5
3U cPCI
Platforms
Video Interface
3U cPCI Blades
Choose the Ampro by ADLINK™ Express-CBR for…
Express-ATR
COM Express™ Module with Intel® Atom™
Processor N270 and 945GSE / ICH7-M Chipset
Features
Ampro by ADLINK™ Extreme Rugged™
10
Up to 2GB DDR2 memory
True PICMG COM ExpressTM COM.0 compliance
PCI Express, SATA II
Single Channel 18-bit LVDS, VGA, TV-Out and
SDVO
50% thicker PCB
Choose the Ampro by ADLINK™ Express-ATR for …
Software & Development Tools
Modular, feature-rich applications that require integrated
graphics, wide temperature range operation, and shock and
vibration resistance.
OS Support – ADLINUX™, Embedded Linux®, Windows® CE 6.0, XP, XPe, VxWorks®
6.6, QNX® 6.4
BIOS – AMI with ACPI 2.0 including S0, S1, S3, S4, S5
Description
The Ampro by ADLINK™ Express-ATR is a compact, high
performance module featuring the Intel® Atom™ processor
with Gigabit Ethernet and high performance I/O.
Specifications
Core System
CPU – Intel® Atom™ Processor N270 at 1.6GHz
– 512KB L2 cache
DRAM – Up to 2GB DDR2 533 SODIMM
Chipset – Intel® 945GSE/ICH7-M
FSB - 533MHz
System Controller - PC-compatible DMA and interrupt controllers and timers
Powerfail Reset - Triggers when key voltage drops below predetermined threshold
Bus Interface
Power Specifications
Input Power - AT mode (12 V) and ATX mode (12 V and 5 Vsb)
Power States - Supports S0, S1, S3, S4, S5
Power Consumption - 9 W typical (with Atom® N270 and 1 GB memory)
Mechanical and Environmental
Size - 95x95mm (3.7x3.7”); COM Express™ Type 2, compact form factor
Board Thickness – .093” (2.36mm)
Temperature (with adequate thermal solution and air flow)
• Standard: –20°C to +70°C
• Extended: –40°C to +80°C
• Storage: –55°C to +85°C
Humidity - Up to 90% at 60°C
Shock
• Non-operation: 50G peak-to-peak, 11ms duration, MIL-STD-202G Method 213B
Vibration
• Operation: 11.95 Grms, 50-2000 Hz, each axis, MIL-STD-202G Method 214A
Certifications - CE, FCC
3 PCI Express x1 lanes, PCI, and LPC
Ordering Information
I/O
Model Number
Description/Configuration
PATA - 1 channel IDE, supports optional SSD up to 8GB
SATA - 2 channels
USB - 8 USB 2.0 ports
Audio - High Definition Audio per COM.0 standard
GPIO - Eight general-purpose digital I/O pins
Express-ATR-R-16
Express-ATR 1.6 GHz Intel® Atom™ N270 CPU, 512kB
L2 Cache, PCI Express, PCI, LPC, SSD
Express-ATR-R-15
Express-ATR 1.6 GHz Intel® Atom™ N270 CPU, 512kB
L2 Cache, PCI Express, PCI, LPC, without SSD
Express-ATRE-L-16
Express-ATR-R-16 QuickStart Kit (Express-ATR, 1GB
DDR2 RAM, EBX Baseboard, heat spreader for Extreme
Rugged Extended Temperature installed, documentation,
software, ATX power supply)
Network Interface
Ethernet: Intel® 82574 IT Gigabit Ethernet controller on PCIe x1
Video Interface
Intel® GMA 950
3D and 2D engine, HW rotation
Dual panel display with independent pipes, HDTV support, SDVO
CRT resolution up to QXGA
Single Channel 18-bit LVDS
10-13
http://www.adlinktech.com/ampro/
COM 840
COM Express™ Module with Intel® Core™2 Duo
Processor and GME965/ICH8-M Chipset
1
AdvancedTCA
Procucts
Features
2
6U cPCI Blades
3
6U cPCI
Platforms
Up to 4GB DDR2 memory
True PICMG COM ExpressTM COM.0 compliance
PCI Express, SATA II
ACPI 2.0 with S3 support
PCI Express x16 graphics (on baseboard)
50% thicker PCB
4
Modular, ultra high performance applications that require
high end graphics.
Intel® GMA X3100, 384MB (DVMT 4.0)
3D and 2D engine, HW rotation
Intel® Clear Video Technology: MPEG-2 HW acceleration and decoding
WMV9 HW acceleration, sharpness enhancement, film mode detection
Dual panel display with independent pipes, HD TV support, supports PCIe x16 and
SDVO graphics
CRT resolution up to 2048 x 1536 @ 60Hz
Description
The Ampro by ADLINK™ COM 840 is an ultra high
performance module featuring the Intel® Core™2 Duo
processor with Gigabit Ethernet and high end chipset
graphics or PCI Express x16 graphics on the baseboard.
Software & Development Tools
Size – 125x95mm (4.9x3.7”); COM ExpressTM basic form factor, Type II pinout
Power Requirements (with 2GB RAM, 100% Loaded)
-1.6GHz 1.8A @ 12V
-1.06GHz 0.8A @ 12V
Temperature (with adequate thermal solution and air flow)
• Standard: –20°C to +70°C
• Extended: –40°C to +85°C
• Storage: –55°C to +85°C
Board Thickness – .093” (2.36mm)
Bus Interface
Ordering Information
PCIe x16, 5 PCIe x1 PCI and LPC
I/O
Network Interface
Ethernet - One Intel® 82566 Gigabit port
8
Description/Configuration
COM-840-R-32
COM 840, 1.6GHz Core™2 Duo CPU, 4MB L2 Cache, PCI
Express, PCI, LPC
COM-840-R-12
COM 840, 1.06GHz ULV Core™2 Duo CPU, 4MB L2
Cache, PCI Express, PCI, LPC, 2 SODIMM sockets
COM-840-R-11
COM 840, 1.06GHz ULV Core™2 Duo CPU, 4MB L2
Cache, PCI Express, PCI, LPC, 1 SODIMM socket
COM-840-L-32
1.6GHz QuickStart Kit (R-32 Module, 2GB RAM, software,
documentation, COM Express Baseboard, heatsink w/ fan)
COM-840E-L-32
1.6GHz QuickStart Kit (R-32 Module, 2GB RAM, software,
documentation, EBX Baseboard, heatsink w/ fan)
COM-840E-L-12
1.06GHz QuickStart Kit (R-12 Module, 2GB RAM, software,
documentation, EBX Baseboard, heatsink w/ fan)
10-14
9
10
Ampro by ADLINK
Extreme Rugged
Model Number
Computer-OnModules
PATA – Single Ultra DMA 66/100 IDE interface, supports up to two hard drives
SATA II – 2 ports
USB – 8 USB 2.0 ports
Audio – High Definition Audio
GPIO - Eight general-purpose digital I/O pins
7
IPC
Accessories
Mechanical
Choice of
- 1.6GHz Core™2 Duo L7500
- 1.06GHz ULV Core™2 Duo U7500
Cache – 4MB, 1MB Level 2
DRAM – Up to 4GB DDR2 667 SODIMM
Chipset – Intel® GME965/ICH8-M
FSB – 800MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Watchdog Timer
Industrial
Chassis
Core System
6
Industrial SBCs
& MBs
Specifications
OS Support – Ampro by ADLINKTM Embedded Linux®, Windows® CE 6.0, 5.0, XP,
XPe, VxWorks® 6.6
BIOS – AMI with ACPI 2.0 including S3
5
3U cPCI
Platforms
Video Interface
3U cPCI Blades
Choose the Ampro by ADLINK™ COM 840 for …
EBX Baseboard
EBX Carrier Board
for COM Express™ Type II Module
Features
Ampro by ADLINK™ Extreme Rugged™
10
COM ExpressTM carrier board for Ampro by
ADLINKTM Type II COM ExpressTM modules
EBX form factor for compact designs
2 SATA, 1 PCIe x1, Mini PCI, PCIe Mini Card
Dual independent LVDS, DVI
IEEE 1394
HD Audio 7.1 channels
Legacy Super I/O
Specifications
Software & Development Tools
BIOS – AMI (on COM Express™ module)
Form Factor
Mechanical
EBX 5.75x8”
Supports COM Express™ Basic Type II
Size – 203x146mm (8x5.75”); EBX form factor
Power Requirements – ATX power supply
Environmental
–Temperature
• Standard: –20° to +70°C
• Extended: –40° to +85°C
• Storage: –40° to +85°C
Board Thickness – .093” (2.36mm)
Bus Interface
PCI Express x1
Expansion
CompactFlash Socket
PCI Express Mini Card Socket
Mini PCI Socket
Ordering Information
I/O
PATA – One EIDE device with Ultra DMA 100/66/33
SATA – 2 ports
PC-style connectors:
– IEEE 1394 single port
– 2 SATA
– 2 Gigabit Ethernet with PXE
On pin header
– 8 USB 2.0 - 1 dedicated to Mini PCIe
– Serial – 4 ports: 2 RS-232, 2 RS-232/422/485
– Parallel Port
– 1 IDE supports 2 devices
Keyboard/Mouse – PS/2 interface
Audio – High Definition 7.1 channels
Model Number
Description/Configuration
COM-EBX-R-00
EBX form factor board for COM Express™ Type II module
Supported COM Express™ Modules
Model Number
Description/Configuration
COM 840
COM Express™ Module with Intel® Core™2 Duo Processor
and GME965 chipset
Express-CBR
COM Express™ Module with Intel® Core™ i7 Processor
and QM57 Chipset
Express-ATR
COM Express™ Module with Intel® Atom™ Processor
N270 and 945GSE / ICH7-M Chipset
Audio In
LVDS 2
7 USB Ports
Dual Gigabit Ethernet
IEEE 1394
Network Interface
Ethernet - Dual GbE : one from the module and one Intel® 82572EI on PCIe x1 lane;
dual RJ-45 connectors with two LED indicators
On Back:
Mini PCI
Compact Flash
PCI Express
Mini Card
HD Audio 7.1
Video Interface
Supports VGA, dual LVDS interfaces with dual display capability, SDVO-DVI, TV-out
(composite, S-Video, component)
VGA
GPIO
PCIe x1 slot
Other features
LVDS 1
System front panel connector
–System speaker, HDD LED, Pwr LED, Reset
3 Fan Headers (CPU, NB & System)
ACPI w/S3 support
SMBus support
ATX Power Supply
DVI
SATA
Keyboard/Mouse
Serial
COM 1
COM 2
10-15
http://www.adlinktech.com/ampro/
Serial
COM 3
COM 4
COM Express
Type II Connector
TV-Out
Composite
S-Video
Component
ETX 802
®
ETX® Module with Intel® Pentium® Processor and
855GME / ICH4 Chipset
1
AdvancedTCA
Procucts
Features
2
6U cPCI Blades
Up to 1GB DDR memory, ECC support
On-board ISA bridge and legacy I/O
50% thicker PCB
ACPI 2.0 with S3 support
Industry’s lowest ETX® S3 current draw
3
6U cPCI
Platforms
4
Network Interface
Modular, high performance applications that require a
5 volt supply, legacy I/O, and full notebook-style power
management.
Ethernet – Intel® 82551QM (10/100 BaseT) Ethernet with Wake-on-LAN
Controller – Integrated Intel® Extreme Graphics 2
– AGP 128-bit 3D engine
– Supports resolutions to 2048x1536
– Up to 64MB UMA Frame Buffer
– Dual channel LVDS flat panel support
6
Software & Development Tools
Specifications
OS Support – Ampro by ADLINK Embedded Linux , VxWorks v5.5.1, QNX v6.3,
Windows® CE 5.0, XP, XPe
BIOS – AMI with ACPI 2.0 including S3
Core System
Mechanical
Choice of
– 1.4GHz LV Pentium® M 738
– 1.0GHz ULV Celeron® M 373
– 800MHz ULV Celeron® M
Cache – 2MB, 512KB or 0KB Level 2
DRAM – Up to 1GB PC2700 DDR333 SODIMM, ECC or non-ECC
Chipset – Intel® 855GME/ICH4
FSB – 400MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Watchdog Timer
Powerfail Reset –Triggers when input voltage drops below predetermined threshold
Size – 114x95mm (4.5x3.7”); ETX® form factor
Power Requirements (with 128MB RAM, 100% Loaded)
– 1.4GHz 3.3A @ 5V
– 1.0GHz 2.8A @ 5V
– 800MHz 2.7A @ 5V
Temperature (100 LFM system air flow)*
• Standard: −20° to +70°C
• Extended: –40° to +85°C
• Storage: –55° to +85°C
Board Thickness – .093” (2.36mm)
7
8
* As measured with Ampro by ADLINKTM Heatsink Kit and 100 LFM or adequate thermal solution
Ordering Information
9
Model Number
Description/Configuration
ET1-802-R-08
ETX® 802, 800MHz ULV Celeron® M CPU, 0KB L2 Cache,
ISA, PCI, ACPI
ET1-802-R-12
ETX® 802, 1.0GHz ULV Celeron® M CPU, 512KB L2 Cache,
ISA, PCI, ACPI
ET1-802-R-22
ETX® 802, 1.4GHz LV Pentium® M CPU, 2MB L2 Cache,
ISA, PCI, ACPI
ET1-802-L-22
1.4GHz QuickStart Kit (R-22 Module, 512MB RAM,
software, documentation, Ampro by ADLINKTM AC
Baseboard)
10-16
10
Ampro by ADLINK
Extreme Rugged
PATA Ultra DMA 33/66/100 IDE interfaces, supports up to two hard drives
Serial – 2 ports, TTL, transceivers on baseboard
Parallel – EPP/ECP bidirectional port
Floppy – Supports 1 or 2 drives, shared with parallel
USB – 4 USB 2.0 ports (four root hubs)
Keyboard/Mouse – PS/2 interface
Audio – AC’97 ALC202A audio codec
®
Computer-OnModules
I/O
®
IPC
Accessories
ISA and PCI
®
Industrial
Chassis
Bus Interface
TM
Industrial SBCs
& MBs
The Ampro by ADLINK™ ETX® 802 is a high-performance,
low-power Centrino® processor module with advanced
networking and high-performance graphics in a modular
format that plugs into your custom baseboard.
5
Video Interface
3U cPCI
Platforms
Description
3U cPCI Blades
Choose the Ampro by ADLINK™ ETX® 802 for…
Single Board Computers
Ampro by ADLINK™ Extreme Rugged™
10
General Overview
After merging with Ampro, ADLINK is the leading developer of industry standards for the most widely used
off-the-shelf embedded system boards, such as PC/104, EBX and EPIC. We offer a form factor for every need:
the ReadyBoard™ (EPIC) family of products is designed for high-volume commercial applications, and the
LittleBoard™ (EBX) line is for applications exposed to harsh environments.
PC/104
Ampro by ADLINKTM CoreModule® products provide
unmatched fanless operation over temperature extremes,
resistance to shock and vibration, conformal coating, no
wings, embedded BIOS, and a long product life reputation.
The CoreModule® continues to distinguish itself as an
Extreme Rugged™ product for a multitude of applications.
CoreModule®
EBX
The high-performance, feature-rich LittleBoard™ SBCs are
based on the industry standard EBX form factor, co-invented
by Ampro. Since 1984, LittleBoard™ SBCs have been used
stand-alone or as a base with stacked electronics for long
lifecycle embedded applications, requiring extreme
ruggedness, ruggedness, reliability, high-performance
processing, networking and video. Using identical
mechanical format, connector placement and pinout, for 25
years, these Extreme Rugged™ SBCs are unique in offering
only low-power processors for high-reliability applications.
LittleBoard™
EPIC
Featuring high performance and a standard interface, EPIC
ReadyBoard™ SBC products are very cost-effective for
common applications. The ReadyBoard™ family is a great
platform for applications such as user interface
terminals for medical equipment, networked systems,
building automation, kiosks, gaming, industrial applied
computing and control devices. The ReadyBoard™ would
benefit any high-volume embedded application that requires
high performance and low cost.
ReadyBoard™
10-17
http://www.adlinktech.com/ampro/
What are ISM™ & SUMIT™
What is SUMIT™?
46.*5"
4
-1$
1$*FY
3U cPCI Blades
64#Y
EBX • 203mmx146mm
3
46.*5#
1$*FY
LittleBoard™
2
6U cPCI
Platforms
SUMIT™ is one of many board-to-board expansion
interfaces that are permitted with ISM™. SUMIT™,
short for Stackable Unified Module Interconnect
Technology, offers PCI Express®, USB, SPI, I2C, and
LPC Bus expansion using, footprint-efficient, 52-pin,
high-bandwidth rugged Samtec Q2-series connectors.
This mix of high-speed and low-speed buses simplifies
the task of attaching many types of I/O without
complex bridges and software.
6U cPCI Blades
ISM™, short for Industry Standard Module™, is a pure
90mm x 96mm form factor (compatible with PC/104)
that addresses shortcomings of existing small form
factors:
• Fitting circuitry without extending beyond the board
outline.
• Meeting top-and bottom-side component height
restrictions.
• Decoupling form factors from expansion interfaces.
• Enabling flexible expansion bus and I/O
connectorization.
• Allowing bus combinations that were previously
undefined and unnamed.
AdvancedTCA
Procucts
What is ISM™?
1
41* •8JSF
4.#VT* $#VT
1$*FY
ReadyBoard™
EPIC • 165mmx115mm
5
3U cPCI
Platforms
&YQSFTT$BSE%FUFDU
"$1*8BLFVQ
.JTD
6
ISM • 90mmx96mm
9
Computer-OnModules
10
Ampro by ADLINK
Extreme Rugged
What interfaces are allowed?
ISM™ allows many combinations of bus and I/O connectors as long
as those interfaces reside within the defined “expansion zones”.
ISM™ also offers a choice of using right-angle connectors that
overhang the board edges, or extending the circuit board if vertical /
non-overhang connectors are used.
8
IPC
Accessories
What is included in the specification?
The ISM™ Specification defines the board size, four fixed mounting
holes, component height limits, and flexible “expansion zones” for I/O
and/or bus connectors. The fixed corner mounting holes allow re-use
of enclosures without modifications in the future.
Who manages these standards?
A new, independent standards organization called the Small Form
Factor Special Interest Group, or SFF-SIG, creates, adopts, and
maintains a number of emerging standards for the low power, small
form factor market. As consumer technology is often inappropriate
for the embedded market, the standards feature re-usable modular
building blocks, developed by embedded vendors for embedded
OEMs. Many of these are optimized for ultra low power processors
and controllers, yet scale up to multi-core processor environments.
For more information about the specifications, visit www.sff-sig.org.
7
Industrial
Chassis
SBC manufacturers have struggled to fit modern
legacy-free platforms onto small form factors without
protruding beyond the allowed board outlines with
“wings”. With the ISA bus, serial ports, and even the
PCI bus no longer integrated into low power chipsets,
it takes extra circuitry to meet the needs of many
embedded applications.
What is SUMIT-ISM™?
An ISM-size SBC with SUMIT™ expansion is called a “SUMIT-ISM™
SBC”. An ISM-size I/O card is similarly called a “SUMIT-ISM™ I/O
module”. A more general naming scheme handles SBCs that accepts
smaller boards as I/O cards, or SBCs with multiple buses, in a
descriptive manner by mentioning the form factor first, followed by a
list of expansion interfaces. For example, “ISM™ SBC with SUMIT™
and PC/104 expansion”, and “EPIC SBC with SUMIT™ and PC/104
expansion” are some of the possibilities. The notations “SUMIT-ISM™”
or “SUMIT™ on ISM™” are contracted forms for a special case, while
boards with multiple interfaces could be more confusing to label with
contracted names.
Industrial SBCs
& MBs
CoreModule®
What architectures are allowed?
ISM™ boards can be SBCs, stackable CPU and I/O cards, and even
computer-on-modules (COMs). This flexibility allows easy migration
from SBCs to COMs and vice-versa, or from processor to processor,
while preserving investments in mechanical designs.
10-18
Ampro by ADLINK™
PC/104, EBX, and EPIC
Ampro by ADLINK™ Extreme Rugged™
10
CoreModule®
The CoreModule® family excels in Extreme Rugged™
applications and is frequently used in compact stacks
where all the functions of the application are contained
within the PC/104-ISM footprint. Stacks consist of a
CoreModule® CPU and one or more off-the-shelf PC/104
(or SUMIT-ISM) I/O expansion modules. The stack
requires a small footprint and can be mounted
directly inside the system enclosure for a durable,
dependable PC-compatible ­assembly.
CoreModule®
740
730
430
800
CPU
1.6GHz Atom™
1.6GHz Atom™ or
1.1GHz Atom™
300MHz or 800MHz
Vortex86
1.0GHz
Celeron® M
Cache
512KB Level 2
512KB Level 2
16KB Level 1
512KB or 0KB Level 2
DRAM
512MB soldered DDR2 RA
Up to 2GB DDR2
256MB soldered DDR2 RA
Up to 1GB DDR
PC/104-Plus
SUMIT-AB
PC/104
PCI-104
(1) EIDE
(1) EIDE
Ultra DMA 100
2 drives
Ultra DMA 33/66/100
2 drives
No
Compact Flash
DiskOnChip and
Compact Flash
IDE Module
(2) RS-232
No
(2) RS-232,
(2) RS-232/422/485
(1) RS-232,
(1) RS-232/422/485
Parallel Port
Yes
No
No
EPP/ECP bidirectional
Floppy
Yes
No
Shared with parallel
Shared with parallel
(2) USB 2.0
(4) USB 2.0
(plus 4 on SUMIT)
(2) USB 2.0
(2) USB 2.0
PS/2
No
PS/2
PS/2
GPIO
No
8
8
No
Audio
No
No
No
No
Ethernet not supported
(on request)
Gigabit Ethernet on
PCIe x1
10/100BaseT Ethernet
Gigabit Ethernet
Integrated Intel® Graphics
Controller
Intel® GMA 500
Optional, 1600 x1200
AGP 128-bit, 2048x1536
Single Channel LVDS
Dual Channel LVDS
TLL
Dual Channel LVDS
Standard Operating
Temperature
-20°C to +70°C
-20°C to +70°C
-20°C to +70°C
-20°C to +70°C
Optional Extended
Temperature
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
10-21
10-22
10-23
10-24
Bus Interface
PATA/ SATA
Solid State Disk
Serial Port
USB
Keyboard / Mouse
Network
Video
Flat Panel
Page Number
10-19
http://www.adlinktech.com/ampro/
Selection Guide
1
AdvancedTCA
Procucts
850
820
2.26GHz Core™2 Duo
(Socket P)
1.5GHz Core™2 Duo
L7400 or 1.06GHz
Celeron® M ULV 423
1.4GHz Pentium®
M 738 or 1.0GHz
Celeron® M 1.0GHz
512KB Level 2
2MB (Pentium® M) 512KB
(Celeron® M) or 0KB Level 2
128KB Level 2
3MB Level 2
2MB Core™2 Duo,
1MB Celeron® M
2MB (Pentium® M),
512KB (Celeron® M) Level 2
Up to 2GB DDR
Up to 1GB DDR
Up to 1GB DDR
Up to 4GB DDR3
Up to 4GB DDR2
Up to 2GB DDR2
PC/104-Plus
(PCI and ISA)
PC/104-Plus
(PCI and ISA)
PC/104-Plus
(PCI and ISA)
PCI-104, SUMIT
PCI/104
PCI/104
(1) EIDE
(2) SATA
Ultra DMA 33/66/100
(4 drives)
(1) EIDE
No
(2) SATA
(1) Ultra DMA 33/66/100
(2 drives) (2) SATA
Compact Flash
Compact Flash
Compact Flash
Compact Flash
Compact Flash
Compact Flash
(2) RS-232,
(2) RS-232/422/485
(4) RS-232/422/485
(2) RS-232,
(2) RS-232/422/485
(2) RS-232/422/485
(2) RS-232,
(2) RS-232/422/485
(2) RS-232,
(2) RS-232/422/485
Floppy shared
Shared with parallel
EPP/ECP bidirectional EPP/ECP bidirectional
Shared with parallel
No
5
6
7
Industrial
Chassis
500MHz Geode™
LX 800
Industrial SBCs
& MBs
1.4GHz Pentium® M 738,
1.0GHz Celeron® M 373
or 800MHz Celeron® M
4
3U cPCI
Platforms
1.6GHz Atom™
3
3U cPCI Blades
620
ReadyBoard™
830
2
6U cPCI
Platforms
735
LittleBoard™
800
ReadyBoard™
The ReadyBoard™ line of SBCs follow the EPIC
standard form factor and are very cost-effective for
standard applications providing a great platform for
applications such as user interface terminals
networked systems, building automation,
kiosk/point-of-information, gaming, industrial applied
computing and medical devices. Truly any application
would benefit from a fully-featured, low-cost
embedded solution.
6U cPCI Blades
LittleBoard™
The high-performance, highly integrated LittleBoard™
SBCs are based on the industry-standard EBX form
factor. A LittleBoard™ SBC can be used as a
standalone product or as a base with stacked
electronics for long lifecycle embedded applications,
requiring ruggedness, high performance processing,
networking and video.
EPP/ECP bidirectional EPP/ECP bidirectional
No
Shared with parallel
Shared with parallel
(6) USB 2.0
(4) USB 2.0
(4) USB 2.0
PS/2
PS/2
PS/2
PS/2
PS/2
PS/2
8
No
22
8
8
8
AC97
AC97
AC97
High Definition Audio
AC97
AC97
Gigabit Ethernet and
10/100BaseT
Gigabit Ethernet and
10/100BaseT
10/100BaseT
Ethernet
Dual Gigabit Ethernet
Gigabit Ethernet
Gigabit Ethernet and
10/100BaseT
Intel® GMA 950 core
AGP 128-bit,
2048x1536
AGP 24-bit,
1600x1200
Integrated Intel®
4500MHD engines
Integrated Intel® 950
GMA engines
Integrated Intel® 900
GMA engines
Dual Channel LVDS
Dual Channel LVDS
TTL, LVDS
Dual Channel LVDS
LVDS /DVI
LVDS , DVI
-20°C to +70°C
-20°C to +70°C
-20°C to +70°C
0°C to +60°C
0°C to +60°C
0°C to +60°C
-40°C to +80°C
-40°C to +85°C
-40°C to +85°C
-20°C to +70°C
N/A
-20°C to +65°C
10-25
10-26
10-27
10-28
10-29
10-30
10-20
9
10
Ampro by ADLINK
Extreme Rugged
(4) USB 2.0
8
Computer-OnModules
(7) USB 2.0
(4) USB 2.0
(plus 4 on SUMIT-A)
IPC
Accessories
Shared with parallel
CoreModule 740
®
Atom™ PC/104-Plus Single Board Computer
with ICH8-M Chipset
Features
Ampro by ADLINK™ Extreme Rugged™
10
Intel® Atom™ N450 1.6GHz Processor
Onboard single channel DDR2 SDRAM
PC/104-Plus Expansion
Integrated graphics DirectX 9 controller at
200MHz
Single Channel 18-bit LVDS and Analog VGA
Choose Ampro by ADLINK™ CoreModule™ 740 for…
Video Interface
Low power performance Atom™ platform targeting Extreme
Rugged™ and space-constrained applications.
Integrated DirectX 9 graphics controller in Intel® Atom™ Pineview-M N450 processor
Single Channel 18-bit LVDS / Analog VGA
Description
Software & Development Tools
Ampro by ADLINK™ CoreModule 740 SBC uses an Intel
Luna Pier platform with 1.6GHz Atom™ N450 Pineview-M
processor and ICH8M I/O Control Hub. It includes USB
2.0, Single channel IDE, LPC, Floppy, Parallel, Serial ports,
LPT, Stack-through connectors and integrated graphics in a
compact ISM form factor SBC.
®
®
Specifications
Core System
CPU - 1.6GHz Intel® Atom™ N450 Processor
Cache – 512KB L2 Cache
Memory – On board 512MB soldered DDR2 RAM for rugged applications
Chipset – Intel® ICH8-M I/O Control Hub
FSB – 1066MHz
BIOS – AMI with CMOS backup in 16 Mbit SPI BIOS
Hardware Monitor – DC voltages, CPU temperature
Bus Interface
OS Support – Linux / Windows® CE 6.0 / XPe / VxWork 6.6 / QNX 6.4**
BIOS – AMI with ACPI 2.0
**Note: Available upon request. Contact us for additional software support.
Power Specifications
Input Power - AT mode (12 V +/- 5%), ATX mode (12 V and 5 Vsb +/- 5%)
Power States - Supports S0, S1, S3, S4, S5
Mechanical
Size – 90x96mm (3.6x3.8”), PC/104-Plus form factor
Board Thickness – .093” (2.36mm thick)
Temperature
• Standard: -20°C to +70°C
• Extended: -40°C to +85°C
• Storage: -55°C to +85°C
Humidity – 90% at 60°C
Shock
Non-operation: 50G peak-to-peak, 11ms duration, MIL-STD-202G Method 213B
Vibration
Operation: 11.95 Grms, 50-2000 Hz, each axis, MIL-STD-202G Method 214A
PC/104-Plus, IDE, LPC, Parallel
Ordering Information
I/O
Model Number
Description/Configuration
USB - 2 USB 2.0 Ports
Floppy
Serial – 2 RS232
Keyboard/Mouse – PS/2 interface
CM-740-R-16
CoreModule™ 740, Intel® Atom™ N450, 1.6GHz,
PC/104-Plus, 512MB soldered DDR2 RAM
CM-740-L-16
Quick Start Kit (CoreModule™ 740, 1.6 GHz, 1GB RAM,
cable kit, software, documentation)
Network Interface
Ethernet not supported*
*Note: contact us for Ethernet function support
10-21
http://www.adlinktech.com/ampro/
CoreModule 730
®
Atom™ SUMIT-ISM™ Single Board Computer
Highly Integrated
1
AdvancedTCA
Procucts
Features
2
6U cPCI Blades
Ultra low power Atom™ SBC
Gigabit Ethernet
4 USB, 8 GPIO
IDE, CompactFlash
SUMIT™ expansion
ISM™ form factor
Single-board Solution
3
6U cPCI
Platforms
4
Network Interface
Space-constrained systems targeting the lowest-power
Atom™ chipset in the new ISM™ (Industry Standard
Module) form factor, without a custom baseboard.
Ethernet – Intel® 82574IT Gigabit Ethernet on PCIe x1
Core System
Software & Development Tools
OS Support – Ampro by ADLINKTM Embedded Linux Windows® CE 6.0, 5.0, XP, XPe
BIOS – AMI BIOS
7
Mechanical
Size – 90x96mm (3.6x3.8”); ISM™ form factor
Power Requirements – (with 2GB RAM, 100% loading)
- 1.6GHz: 0.7A @ 5V
- 1.1GHz: 0.6A @ 5V
Temperature (100 LFM system air flow)
• Standard: −20°C to +70°C
• Extended: –40°C to +85°C
• Storage: –55°C to +85°C
Board Thickness – .093” (2.36mm)
8
IPC
Accessories
Ordering Information
Description/Configuration
CM-730-R-11
CoreModule® 730, 1.1 GHz Atom™ CPU, 0MB RAM, Video,
Ethernet, SUMIT-A
CM-730-R-15
CoreModule® 730, 1.6 GHz Atom™ CPU, 0MB RAM, Video,
Ethernet, without SUMIT
Bus Interface
CM-730-R-16
CoreModule® 730, 1.6 GHz Atom™ CPU, 0MB RAM, Video,
Ethernet, SUMIT-AB
SUMIT-AB (PCIe, LPC, SPI, I2C, USB), SUMIT-A only for R-11 model
CM-730-L-16
I/O
MM-SIO
1.6 GHz QuickStart Kit (R-16 SBC, 1GB RAM, cable
kit, software)
MiniModule™ Serial I/O Card, stackable legacy I/O
SUMIT™ board for CoreModule® 730
PATA – Single Ultra DMA IDE (1 drive)
CompactFlash socket
USB – 4 USB 2.0 ports (plus 4 on SUMIT™)
GPIO – Eight general-purpose digital I/O pins
10-22
9
10
Ampro by ADLINK
Extreme Rugged
Model Number
Computer-OnModules
Choice of
-1.6GHz Atom™ Z530
-1.1GHz Atom™ Z510
Cache – 512KB Level 2
DRAM – Up to 2GB DDR2 533 SODIMM
Chipset – Intel® US15W SCH
FSB – 533 / 400MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Real Time Clock – Battery-backed RTC / CMOS
Watchdog Timer
Powerfail Reset – Triggers when key voltage drops below predetermined threshold
6
Industrial
Chassis
Specifications
Controller - Integrated on US15W SCH
Intel® GMA 500 ultra low power core
3D and 2D engine
HD hardware video decode
18/24-bit LVDS, up to 112MHz pixel clock
Dual display with independent pipes
CRT via Chrontel CH7317 RGB DAC
Industrial SBCs
& MBs
Based on the Intel® Atom™ CPU and US15W System
Controller Hub (SCH), the Ampro by ADLINK™ CoreModule®
730 provides a mid-performance control and compute
platform for a wide range of applications. Featuring the new
SUMIT™ expansion interface for legacy I/O and PCI Express
support, this tiny 90x96mm footprint SBC is well-rounded
with Gigabit Ethernet, CRT and flat panel video, 4 USB
ports, IDE interface, CompactFlash socket, GPIO support,
and optional 4 serial port PC/104 add-on card.
5
Video Interface
3U cPCI
Platforms
Description
3U cPCI Blades
Choose the Ampro by ADLINK™ CoreModule® 730 for…
CoreModule 430
®
486 PC/104 Single Board Computer
Highly Integrated, Low Power
Features
Ampro by ADLINK™ Extreme Rugged™
10
–40°C to +85°C
10/100 Ethernet, 3D Video
4 Serial, 2 USB, 8 GPIOs
PC/104 Expansion
Ultra Low Power
486 migration
Choose the Ampro by ADLINK™ CoreModule® 430 for…
Network Interface
Rugged, space-constrained, legacy-friendly embedded
systems with modest CPU performance requirements.
Ethernet - One integrated Vortex86 port
Description
Controller – Integrated
– 64-bit single-cycle 100MHz 2D graphics engine
– Supports resolutions to 1600x768
– 32MB / 64MB DDR2 video memory
– Supports TFT panels
– Supports 3.3V, 5V flat panels
Based on the Vortex86SX 300MHz or Vortex86DX 800MHz
processor, the Ampro by ADLINK™ CoreModule® 430
provides 4 serial ports (two with RS-422/485 capability),
10/100BaseT Ethernet, CRT and flat panel video, 2 USB,
IDE, floppy and GPIO support in a PC/104 form factor.
Video Interface
Software & Development Tools
Specifications
OS Support – QNX® v6.3, Windows® CE 5.0, 6.0
BIOS – AMI BIOS
Core System
Mechanical
CPU – 300MHz Vortex86SX or 800MHz Vortex86DX
Cache – 16kB I-cache, 16kB D-cache
DRAM – 256MB soldered DDR2
System Controllers – PC-compatible DMA and interrupt controller and timers
Real Time Clock – Battery-backed RTC/CMOS
Watchdog Timer
Powerfail Reset – Triggers when key voltage drops below predetermined thresholds
Size – 90x96mm (3.6x3.8”); PC/104 form factor
Power Requirements – 1.3A @ 5V
Temperature (100 LFM system air flow)
• Standard: −20° to +70°C
• Extended: –40° to +85°C
• Storage: –55° to +85°C
Board Thickness – .093” (2.36mm)
Bus Interface
Ordering Information
PC/104 (ISA)
I/O
PATA – DMA 100 IDE interface supports up to two hard drives
CompactFlash socket
Serial – 4 ports, two RS-232/422/485
Parallel – EPP /ECP bidirectional port, shared with floppy interface
Floppy – Supports 1 to 2 drives, shared with parallel port
USB – 2 USB 2.0 ports
Keyboard/Mouse – PS/2 interface
GPIO – Eight general-purpose digital I/O pins
10-23
http://www.adlinktech.com/ampro/
Model Number
Description/Configuration
CM3-430-R-10
CoreModule® 430, 300MHz Vortex CPU, 256MB RAM,
Ethernet
CM3-430-R-11
CoreModule® 430, 300MHz Vortex CPU, 256MB RAM,
Video, Ethernet
CM3-430-R-12
CoreModule® 430, 800MHz Vortex CPU, 256MB RAM,
Video, Ethernet
CM3-430-L-12
800MHz QuickStart Kit (R‑12 SBC, cable kit, software,
documentation)
CoreModule 800
®
Celeron® M PCI-104 Single Board Computer
Ultra-High Performance
1
AdvancedTCA
Procucts
Features
2
6U cPCI Blades
Gigabit Ethernet
High Performance Video
2 RS-232/422/485 Serial ports
2 USB 2.0 ports
PC/104 without wings
HALT report available
3
6U cPCI
Platforms
4
Network Interface
Extreme Rugged™ embedded applications that need ultrahigh performance in a compact module that does not violate
PC/104 outline specifications. Contact Ampro by ADLINK™
for HALT report.
Ethernet – Intel® 82541 (1000BaseT) Ethernet
Specifications
Core System
6
Software & Development Tools
OS Support – Ampro by ADLINK
Windows® CE 5.0, XP, XPe
BIOS – AMI
TM
Embedded Linux , VxWorks v5.5.1, QNX v6.3,
®
®
®
Mechanical
Size – 90x96mm (3.6x3.8”); PCI-104 form factor
Power Requirements – (with 512MB RAM, 100% CPU load) –2.8A @5V
Temperature (100 LFM system air flow)
• Standard: –20° to +70°C
• Extended: –40° to +85°C
• Storage: –55° to +85°C
(See manual for thermal operating requirements)
Board Thickness – .120” (3.05mm)
Description/Configuration
PCI/104 (PCI), downward-stacking
PC/104 to PC/104-Plus bridge through optional MiniModule™ ISA card
CM3-800-R-10
CoreModule® 800, 1GHz ULV Celeron® M CPU, 512KB L2
cache, PC/104, Ethernet, 2 COM
CM3-800-L-10
1GHz 512KB Cache QuickStart Kit (R-10 SBC, 512MB
RAM, cable kit, software, documentation)
MM3-ISA-R-11
MiniModule ISA: PCI-104 to PC/104-Plus Bridge
9
Computer-OnModules
Model Number
10
Ampro by ADLINK
Extreme Rugged
PATA – Single Ultra DMA 33/66/100 IDE interface, supports up to two hard drives
Serial – 2 ports, RS-232/422/485
Parallel – EPP/ECP bidirectional port
Floppy – Supports 1 or 2 drives, shared with parallel
USB – 2 USB 2.0 ports (two root hubs)
Keyboard/Mouse – PS/2 interface
8
IPC
Accessories
Ordering Information
Bus Interface
I/O
7
Industrial
Chassis
CPU – 1.0GHz ULV Celeron® M 373
Cache – 512KB or 0KB Level 2
DRAM – Up to 1GB PC2700 DDR333 SODIMM
Chipset – Intel® 855GME/ICH4M
FSB – 400MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Real Time Clock – Battery-backed RTC/CMOS
Watchdog timer
Powerfail Reset – Triggers when input voltage drops below predetermined thresholds
Controller – Integrated Intel® Extreme Graphics 2-AGP 4X 128-bit 3D engine
– Supports resolutions to 2048x1536
– Up to 64MB UMA Frame Buffer
– Dual channel LVDS
– Supports 3.3V or 5V flat panels
Industrial SBCs
& MBs
The Ampro by ADLINK™ CoreModule® 800 PCI-104
compatible SBC offers ultra low power Centrino performance
with advanced networking, high-performance graphics and
all the requisite PC-compatible component subsystems.
5
Video Interface
3U cPCI
Platforms
Description
3U cPCI Blades
Choose the Ampro by ADLINK™ CoreModule® 800 for…
10-24
LittleBoard™ 735
Atom™ EBX Single Board Computer
Feature Rich, Legacy Friendly
Features
Ampro by ADLINK™ Extreme Rugged™
10
Legacy migration solution
Dual Ethernet – Gigabit and 10/100BaseT
4 COM, 4 USB, audio
SATA, IDE, Compact Flash
PCIe Mini Card socket
PC/104-Plus expansion
Full-featured AtomTM platform
Choose the Ampro by ADLINK™ LittleBoardTM 735 for…
Migrating legacy EBX systems to the latest lowest-power
Atom™ platform.
Description
Based on the Intel® Atom™ CPU and 945GSE chipset, the
Ampro by ADLINK™ LittleBoard™ 735 provides a featurerich mid-performance SBC for a wide range of legacyfriendly applications. Featuring a PC/104-Plus expansion
interface for legacy PC/104 and PC/104-Plus modules, this
SBC is well-rounded with dual Ethernet, CRT and flat panel
video, 4 serial ports, 4 USB ports, SATA and IDE interfaces,
Compact-Flash socket, PCIe Mini Card socket, High
Definition Audio and GPIO support for an easy upgrade from
older EBX SBCs.
USB – 7 USB 2.0 ports
Keyboard/Mouse – PS/2 interface
HD Audio – AC97 High Definition Audio
GPIO – Eight general-purpose digital I/O pins
Network Interface
Ethernet – One Intel® 82574IT Gigabit Ethernet on PCIe x1, one Intel® 82562
10/100BaseT
Video Interface
Controller – Integrated
Intel® GMA 950 core
3D and 2D engine
HD hardware video decode
Dual Channel 18-bit LVDS
Dual display with independent pipes
CRT via chipset DACs
Software & Development Tools
Specifications
OS Support – Ampro by ADLINKTM Embedded Linux Windows® CE 6.0, 5.0, XP, XPe
BIOS – AMI with ACPI 2.0
Processor
Mechanical
CPU – 1.6GHz Atom™ N270
Cache – 512KB Level 2
DRAM – Up to 2GB DDR2 667 SODIMM
Size – 203x146mm (8.00x5.75”); EBX form factor
Power Requirements – (with 2GB RAM, 100% Loaded)
– 2.4A @5V
Temperature (100 LFM system air flow)
• Standard: −20°C to +70°C
• Extended: –40°C to +80°C
• Storage: –55°C to +85°C
Board Thickness - .093” (2.36mm)
Chipset – Intel® 945GSE
FSB – 533MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Real Time Clock – Battery-backed RTC / CMOS
Watchdog Timer
Powerfail Reset – Triggers when key voltage drops below predetermined threshold
Bus Interface
PC/104-Plus (PCI and ISA)
I/O
PATA – Single Ultra DMA
CompactFlash socket
SATA – 2 devices
PCIe Mini Card socket
Serial – 4 ports, two are RS-232/422/485
Parallel-floppy shared
10-25
http://www.adlinktech.com/ampro/
Ordering Information
Model Number
Description/Configuration
LB-735-R-16
LittleBoard™ 735, 1.6 GHz Atom™ CPU, 0MB RAM, video,
Ethernet, passive heatsink for -20°C to +70°C
LB-735-F-16
LittleBoard™ 735, 1.6 GHz Atom™ CPU, 0MB RAM, video,
Ethernet, heatsink w/ fan for -40°C to +80°C
LB-735-L-16
1.6 GHz QuickStart Kit (R-16 board, 1GB RAM, cable kit,
software, passive heatsink)
LittleBoard™ 800
Pentium® M EBX Single Board Computer
High Performance
1
AdvancedTCA
Procucts
Features
2
6U cPCI Blades
Intel® Extreme Graphics (CRT and LVDS flat panel)
Dual Ethernet – Gigabit and 10/100BaseT
4 RS-232/422/485 Serial, 4 USB 2.0 ports
PC/104-Plus expansion
3
6U cPCI
Platforms
4
Network Interface
Compact, full featured, rugged embedded applications
that need ultra-high performance, high speed I/O, and full
PC/104-Plus expandability.
Ethernet – Dual, Intel® 82541 (Gigabit) and Intel® 82551ER (10/100BaseT)
Specifications
Core System
I/O
Size – 203x146mm (8.0x5.75”); EBX form factor
Power Requirements (with 128MB RAM, 100% Loaded)
– 1.4GHz 3.4A @5V
– 1.0GHz 2.8A @5V
– 800MHz 3.0A @5V
Temperature (100 LFM system air flow)
• Standard: –20° to +70°C
• Extended: –40° to +85°C (F-21 model)
• Storage: –55° to +85°C
Board Thickness – .093” (2.36mm)
8
Ordering Information
9
Model Number
Description/Configuration
LB3-800-R-08
LittleBoardTM 800, 800MHz ULV Celeron® M CPU,
PC/104-Plus, dual Ethernet, video, 4 COM
LB3-800-R-10
LittleBoardTM 800, 1.0GHz ULV Celeron® M CPU,
PC/104-Plus, dual Ethernet, video, 4 COM
LB3-800-R-21
LittleBoardTM 800, 1.4GHz LV Pentium® M CPU,
PC/104-Plus, dual Ethernet, video, 4 COM
LB3-800-F-21
LittleBoardT™ 800, 1.4GHz LV Pentium® M CPU,
PC/104-Plus, dual Ethernet, video, 4 COM with fan for
above +70°C
LB3-800-L-21
1.4GHz QuickStart Kit (R-21 SBC 512MB RAM, cable kit,
software, documentation)
LB3-ALL-X-01
LittleBoardTM 800 cable kit
10-26
10
Ampro by ADLINK
Extreme Rugged
PATA – Two Ultra DMA 33/66/100 IDE interfaces,
supports up to two hard drives each (four total)
CompactFlash on Secondary IDE
Serial – 4 ports, RS-232/422/485
Parallel – EPP/ECP bidirectional port
Floppy – Supports 1 or 2 drives
USB – 4 USB 2.0 ports (four root hubs)
Keyboard/Mouse – PS/2 interface
Audio – AC97 High Definition Audio
7
Mechanical
Computer-OnModules
PC/104-Plus (PCI and ISA)
OS Support – Ampro by ADLINK™ Embedded Linux®, VxWorks® v5.5.1, QNX® v6.3,
Windows® CE 6.0, 5.0, XP, XPe
BIOS – AMI
IPC
Accessories
Bus Interface
6
Software & Development Tools
Industrial
Chassis
Choice of
–1.4GHz LV Pentium® M 738
–1.0GHz UL V Celeron® M 373
–800MHz ULV Celeron® M
Cache – 2MB, 512KB or 0KB Level 2
DRAM – Up to 1GB PC2700 DDR333 DIMM
Chipset – Intel® 855GME/ICH4M
FSB – 400MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Real Time Clock – Battery-backed RTC/CMOS
Watchdog Timer
Powerfail Reset –Triggers when input voltage drops below predetermined threshold
Controller – Integrated Intel® Extreme Graphics 2
– AGP 128-bit 3D engine
– Supports resolutions to 2048x1536
– Up to 64MB UMA Frame Buffer
– Dual channel LVDS
– Supports 3.3V and 5V flat panels
Industrial SBCs
& MBs
The Ampro by ADLINK™ LittleBoard™ 800 EBX SBC offers
you a choice of high performance, low voltage Centrino®
processors, advanced networking, and high performance
graphics.
5
Video Interface
3U cPCI
Platforms
Description
3U cPCI Blades
Choose the Ampro by ADLINK™ LittleBoard™ 800 for…
LittleBoard™ 620
Geode™ EBX Single Board Computer
Low Power, Easy Interface
Features
Ampro by ADLINK™ Extreme Rugged™
10
ISA DDMA support
Dual 10/100 Ethernet
PC/104-Plus expansion
Fanless operation
Mini PCI socket
SATA support
Choose the Ampro by ADLINK™ LittleBoard™ 620 for…
Video Interface
High volume embedded applications that need high
performance and low power.
Controller - Integrated in LX 800
– Hardware Video Accelerator
– Supports resolutions to 1600x1200
– Up to 4MB UMA Frame Buffer
– Supports 24-bit TTL and LVDS
– LVDS transceiver onboard
Description
The Ampro by ADLINK™ LittleBoard™ 620 provides
high-performance, low-power processing with advanced
networking and all the requisite PC-compatible component
subsystems with PC-style connectors.
Specifications
Software
OS Support – Ampro by ADLINKTM Embedded Linux®, VxWorks®, QNX®, Windows®
CE 6.0, 5.0, XP, XPe
BIOS – AMI with Ampro by ADLINKTM extensions including ISA DMA
Mechanical
Core System
500MHz Geode™ LX 800
Cache – 128KB Level 2
DRAM – Up to 1GB DDR333 DIMM
Chipset – AMD CS5536
FSB – 400MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Real Time Clock – Battery-backed RTC/CMOS
Watchdog Timer
Powerfail Reset –Triggers when key voltage drops below predetermined threshold
Size – 203x146mm (8.00x5.75”); EBX form factor
Power Requirements (with 512MB RAM, 100% Loaded)
–500MHz 2.2A @ 5V
Temperature (100 LFM system air flow)
• Standard: –20° to +70°C
• Extended: –40° to +85°C
• Storage: –55° to +85°C
Board Thickness – .093” (2.36mm)
Ordering Information
Bus Interface
Model Number
Description/Configuration
PC/104-Plus and Mini PCI socket
LB3-620-R-12
I/O
LittleBoardTM 620, 500MHz GeodeTM, dual Ethernet, SATA,
no RAM, PC/104-Plus
LB3-620-L-12
500MHz QuickStart Kit (R-12 SBC, 512MB RAM, cable kit,
software, documentation)
LB3-ALL-X-01
LittleBoardTM 620 cable kit (RoHS)
PATA – Single Ultra DMA
CompactFlash socket
SATA optional
Serial – 4 ports, two are RS-232/422/485
Parallel – floppy shared
USB – 4 USB 2.0 ports
IrDA – Dedicated IrDA
Keyboard/Mouse – PS/2 interface
Audio – AC97 High Definition Audio
GPIO – 22
Network Interface
Dual Ethernet – Intel® 82551 10/100BaseT
10-27
http://www.adlinktech.com/ampro/
ReadyBoard™ 850
Core™2 Duo EPIC Single Board Computer with
SUMIT™ Expansion and GM45/ICH9-M Chipset
1
AdvancedTCA
Procucts
Features
2
6U cPCI Blades
Intel® Core™2 Duo Processor Supported
Dual Channel DDR3 SODIMM up to 4GB
PCI-104 and SUMIT Expansion
Dual Gigabit LAN
Single/Dual Channel 18/24-bit LVDS and
Analog VGA
3
6U cPCI
Platforms
4
Compact embedded applications that need ultra high CPU
performance and high speed I/O
Mobile Intel® Graphic Media Accelerator 4500MHD
Intel® Clear Video Technology
Graphics core speeds up to 533MHz
Dual panel display with two independent pipelines
Single/Dual Channel 18/24-bit LVDS
CRT resolutions up to QVGA
Description
Software & Development Tools
OS Support – Linux / Windows® CE 6.0 / XPe / VxWork 6.6 / QNX 6.4*
BIOS – AMI with ACPI 2.0
Power Specifications
Core System
Mechanical
CPU – Intel® Core™2 Duo up to 2.26GHz (Socket P)
Cache – 3MB L2 Cache
DRAM – Up to 4GB Dual Channel DDR3 800/1066 SODIMM
Chipset – Intel® GM45 Express GMCH/ICH9-M
FSB – 1066MHz
BIOS - AMI with CMOS backup in 16 Mbit SPI BIOS
Hardware Monitor - Supplies voltages and CPU temperature
Size – 165.1x114.3mm (6.5x4.5”); EPIC form factor
Board Thickness – .062” (1.6mm)
Temperature
• Standard: 0°C to +60°C
• Extended: -20°C to +70°C
• Storage: -20°C to +75°C
Humidity – 90% at 60°C
Shock - 15G peak-to-peak, 11ms duration, non-operation
Random Vibration - MIL-STD-202G, Method 214A, Table 214-1, Condition A (5Grms)
Bus Interface
PCI-104, SUMIT™
I/O
8
Ordering Information
9
Model Number
Description/Configuration
RB-850-S
ReadyBoard™ 850, Socket, dual Gigabit Ethernet, no RAM
RB-850-S-P8400
ReadyBoard™ 850, 2.26 GHz CPU, dual Gigabit Ethernet,
no RAM
RB-850-L-P8400
Quick Start Kit (ReadyBoard™ 850, 2.26 GHz, 1GB RAM,
cable kit, software, documentation)
10
Ampro by ADLINK
Extreme Rugged
Network Interface
Computer-OnModules
SATA – 2 devices
USB – 4 USB 2.0 Ports, plus 4 more on SUMIT-A
Serial – 2 are RS232/422/485
LED & reset – Power, IDE(CF) active, SATA active, reset button
Keyboard/Mouse – PS/2 interface
GPIO – 8
Audio – High Definition Audio
7
IPC
Accessories
Input Power – AT mode (12 V +/- 5%), ATX mode (12 V and 5 Vsb +/- 5%)
Power States – Supports S0, S1, S3, S4, S5
Industrial
Chassis
Specifications
6
Industrial SBCs
& MBs
The Ampro by ADLINK™ ReadyBoard™ 850 SBC uses an
Intel® Core™2 Duo processor for ultra high performance.
It includes dual Gigabit Ethernet, USB 2.0, SATA and high
end graphics in a compact EPIC form factor SBC with PC
style connectors. Featured is the new SUMIT™ expansion
interface for legacy I/O and PCI Express support.
5
3U cPCI
Platforms
Video Interface
3U cPCI Blades
Choose the Ampro by ADLINK™ ReadyBoard™ 850 for…
Ethernet – Dual Intel® 82574L Gigabit ports
10-28
ReadyBoard™ 830
Core™2 Duo EPIC Single Board Computer
Ultra High I/O Bandwidth, Easy Interface
Features
Ampro by ADLINK™ Extreme Rugged™
10
ACPI Power Management
Gigabit Ethernet
Two SATA ports
PCI Express Mini Card socket
LVDS and DVI support
Choose the Ampro by ADLINKTM ReadyBoardTM 830 for…
Network Interface
Compact embedded applications that need ultra high CPU
performance and high speed I/O.
Ethernet - Dual Intel® 82573V Gigabit ports
Description
Intel® GMA 950, 224 MByte 64 Bit Video RAM (DVMT 3.0)
Dual panel display with two independent pipelines
Flat panel interface, resolutions up to 1920x1200
HD hardware motion compensation to support HD high-bit-rate MPEG2 media
playback
HDTV (1080i/p) support
CRT resolutions up to 2048x1536 @ 75 Hz, including 1920x1080 @ >85 Hz (HDTV)
Onboard TV encoder supports HDTV (420p, 720p and 1080i), component and S-Video
for TV-Out
DVI Interface
The Ampro by ADLINKTM ReadyBoardTM 830 SBC uses an
Intel® CoreTM2 Duo processor for ultra high performance. It
includes dual Gigabit Ethernet, USB 2.0, SATA and high end
graphics in a compact EPIC form factor SBC with PC style
connectors.
Specifications
Software & Development Tools
Core System
Choice of
–1.50GHz CoreTM2 Duo L7400
–1.06GHz ULV Celeron® M 423
Cache – 2MB CoreTM Duo, 1MB Celeron® M
DRAM – Up to 4GB DDR2 533 SODIMM
Chipset – Intel® 945GME/ICH7-M
FSB – 667MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Real Time Clock – Battery-backed RTC/CMOS
Enhanced Power Management with full support of ACPI 2.0
Watchdog Timer
Powerfail Reset –Triggers when input voltage drops below predetermined threshold
Bus Interface
OS Support – Ampro by ADLINKTM Embedded Linux®, Windows® CE 6.0, 5.0, XP,
XPe®
BIOS – AMI with ACPI 2.0
Mechanical
Size – 165.1x114.3mm (6.5x4.5”); EPIC form factor
Power Requirements (with 512MB RAM, 100% Loaded)
–1.50GHz 2.2A @ 12V
–1.06GHz 2.1A @12V
Temperature (100 LFM system air flow)
• Standard: 0°C to +60°C
• Storage: –20°C to +75°C
Board Thickness – .062” (1.6mm)
Ordering Information
PC/104, PCIe Mini Card
I/O
SATA – 2 devices
CompactFlash
Serial – 4 ports, 2 are RS-232/422/485
Parallel – EPP/ECP bidirectional port shared with floppy interface
Floppy – Supports 1 or 2 drives, shared with parallel port
USB – 6 USB 2.0 ports
Keyboard/Mouse – PS/2 interface
GPIO – 8
Audio – AC97: Line-in, Line-out, Mic
10-29
Video Interface
http://www.adlinktech.com/ampro/
Model Number
Description/Configuration
RB4-830-R-30
ReadyBoardTM 830, 1.5GHz LV CoreTM2 Duo L7400, dual
Gigabit Ethernet, no RAM
RB4-830-R-10
ReadyBoardTM 830, 1.06GHz ULV Celeron® M 423, dual
Gigabit Ethernet, no RAM
RB4-830-L-30
1.50GHz QuickStart Kit (R-30 SBC, 1GB RM, cable kit,
software, documentation)
ReadyBoard™ 820
Pentium® M EPIC Single Board Computer
High I/O Bandwidth, Easy Interface
1
AdvancedTCA
Procucts
Features
2
6U cPCI Blades
ACPI 2.0 power management
Dual Ethernet – Gigabit and 10/100BaseT
4 USB 2.0
2 SATA ports
3
6U cPCI
Platforms
4
3U cPCI Blades
Network Interface
High volume, compact embedded applications that need
high CPU performance and I/O bandwidth along with RoHS
compliance.
Ethernet - One Intel® 82573V Gigabit port on PCIe x1 lane; one Intel® 82551QM
10/100BaseT port
Description
Controller – Integrated Intel® 2D/3D engines
– Supports CRT and DVI display interfaces
– Supports Intel® DVMT 3.0 (Dynamic Video Memory Technology which allows
maximum memory allocation support based on total system memory
– Supports 3.3V and 5V LVDS flat panels
Specifications
Core System
I/O
7
Size – 165.1x114.3mm (6.50x4.50”); EPIC form factor
Power Requirements (with 512MB RAM, 100% Loaded)
-1.4GHz 4.2A @ 5V
-1.0GHz 3.6A @ 5V
Temperature (100 LFM system air flow)
• Standard: 0°C to +60°C
• Extended: –20°C to +65°C
• Storage: –20°C to +75°C
Board Thickness – .062” (1.6mm)
8
Ordering Information
Model Number
Description/Configuration
RB4-820-R-21
ReadyBoardTM 820, 1.4GHz Pentium® M, dual Ethernet,
no RAM
RB4-820-R-10
ReadyBoard
no RAM
RB4-820-L-21
1.4GHz QuickStart Kit (R-21 SBC, 1G RAM, cable kit,
software, documentation)
TM
820, 1.0GHz Celeron M, dual Ethernet,
®
PATA –Single Ultra DMA 33/66/100 channel supports up to two devices
SATA – 2 devices
CompactFlash
Serial – 4 ports, 2 are RS-232/422/485
Parallel – EPP/ECP bidirectional port shared with floppy interface
Floppy – Supports 1 or 2 drives, shared with parallel port
USB – 4 USB 2.0 ports
Keyboard/Mouse – PS/2 interface
GPIO – 8
Audio – AC’97: Line-in, Line-out, Mic
9
Computer-OnModules
PC/104
Mechanical
IPC
Accessories
Bus Interface
OS Support – Ampro by ADLINKTM Embedded Linux®, Windows® CE 5.0, XP, XPe
BIOS – AMI with ACPI 2.0
6
Industrial
Chassis
Choice of
–1.4GHz LV Pentium® M 738
–1.0GHz Celeron® M
Cache – 2MB Level 2
DRAM – 1GB DDR2 533 SODIMM
Chipset – Intel® 915GME/ICH6M
FSB – 400MHz
System Controllers – PC-compatible DMA and interrupt controllers and timers
Real Time Clock – Battery-backed RTC/CMOS
Enhanced Power Management with full support of ACPI 2.0
Watchdog Timer
Powerfail Reset –Triggers when input voltage drops below predetermined threshold
Software & Development Tools
5
Industrial SBCs
& MBs
The Ampro by ADLINK™ ReadyBoard™ 820 SBC uses
a high performance, low-power Centrino® processor.
It includes Gigabit Ethernet, USB 2.0, SATA and high
performance graphics in an easy to use EPIC form factor
SBC.
Video Interface
3U cPCI
Platforms
Choose the Ampro by ADLINK™ ReadyBoard™ 820 for…
10
Ampro by ADLINK
Extreme Rugged
10-30
Ampro by ADLINK™
Computer Systems
Ampro by ADLINK™ Extreme Rugged™
10
General Overview
Ampro by ADLINK™ provides system products that deliver quality, reliability, durability, compatibility, high
performance and long product lifecycle. The heart of every one of our systems is a reliable, field-proven single
board computer (SBC).
RuffSystem™
Designed to tolerate the harshest environments, ADLINK’s RuffSystem™
products are truly rugged by design. These Extreme Rugged™ systems
provide passive convection cooling, use Ampro by ADLINK™ Extreme
Rugged system boards, and meet MIL-STD-810 requirements for shock and
vibration over wide temperature and humidity ranges.
MilSystem™
MilSystem mission computers are high-performance systems designed for
tight integration into military vehicle and other platforms. MIL-STD-D38999
connectors, rugged-by-design internal components, and completely passive
cooling maximize reliability for operations in harsh conditions. MilSystems
provide shock and vibration immunity exceeding MIL-STD-810F standards,
and operate at full CPU speed over a wide temperature range of -40 to
+75°C.
10-31
http://www.adlinktech.com/ampro/
Selection Guide
1
AdvancedTCA
Procucts
RuffSystem™
2
MilSystem™
Form Factor
EBX with
COM Express
EBX
EBX with
COM Express
EBX
CPU
Up to 1.66GHz
Core™2 Duo
1.6GHz Atom™ N270
Up to 1.66GHz
Core™2 Duo
1.6GHz Atom™ N270
Maximum Memory
4GB DDR2 667
2GB DDR2 533
4GB DDR2 667
2GB DDR2 533
Expansion
Mini PCI,
PCIe Mini Card
PC/104-Plus,
PCIe Mini Card
Mini PCI,
PCIe Mini Card
PC/104-Plus,
PCIe Mini Card
128GB SSD
128GB SSD
128GB SSD
128GB SSD
CompactFlash
CompactFlash
CompactFlash
CompactFlash
Single 2.5”
Single 2.5”
Single 2.5”
Single 2.5”
2x 1000BaseT
1x 1000BaseT
1x 10/100BaseT
2x 1000BaseT
1x 1000BaseT
1x 10/100BaseT
2x RS-232
2xRS-232/422/485
4x USB, Parallel, Audio
2x RS-232
2x RS-232/422/485
4x USB, Parallel, Audio
2x RS-232
2xRS-232/422/485
4x USB, Parallel, Audio
2x RS-232
2x RS-232/422/485
4x USB, Parallel, Audio
Standard OS
Windows® XP or
Ubuntu Linux®
(Windows® CE,
QNX, and VxWorks
supported)
Windows® XP or
Ubuntu Linux®
(Windows® CE,
QNX, and VxWorks
supported)
Windows® XP or
Ubuntu Linux®
(Windows® CE,
QNX, and VxWorks
supported)
Windows® XP or
Ubuntu Linux®
(Windows® CE,
QNX, and VxWorks
supported)
Power Supply
Wide-range 14 to 32
or 12 to 25 VDC
Wide-range 14 to 32
or 12 to 25 VDC
Wide-range 14 to 32
or 12 to 25 VDC
Wide-range 14 to 32
or 12 to 25 VDC
Cooling
Convection Cooled
Convection Cooled
Convection Cooled
Convection Cooled
Environment
Extreme RuggedTM
Extreme Rugged™
Extreme RuggedTM
Extreme Rugged™
Standard Operating Temp.
-20°C to +65°C
-20°C to +65°C
-20°C to +65°C
-20°C to +65°C
Extended Operating Temp.
-40°C to +75°C
-40°C to +75°C
-40°C to +75°C
-40°C to +75°C
Size (WxHxD)
8x10 x3”
8x10x3”
8x10 x3”
8x10x3”
Page Number
10-33
10-34
10-35
10-36
Maximum Storage
Optional Drive
Internal Drive Bay
Ethernet
I/O
3
4
5
6
7
8
9
Computer-OnModules
LittleBoard™ 735
IPC
Accessories
COM 840 with rugged
EBX Carrier
Industrial
Chassis
LittleBoard™ 735
Industrial SBCs
& MBs
COM 840 with rugged
EBX Carrier
Internal Board
3U cPCI
Platforms
735
3U cPCI Blades
840
6U cPCI
Platforms
735
6U cPCI Blades
840
10
Ampro by ADLINK
Extreme Rugged
10-32
RuffSystem™ 840
Extreme Rugged™
Intel® Core™2 Duo Computer System
Features
Ampro by ADLINK™ Extreme Rugged™
10
Passive convection-cooled chassis
Intel® Core™2 Duo processor
Mini PCI and PCIe Mini Card expansion 
Tested to MIL-STD-810F standards
Wide range input: 12 to 32 VDC
Windows® XP Professional or Ubuntu Linux®
Preinstalled
Windows® CE, QNX®, and VxWorks® supported
Featuring: COM 840 with Intel® Core™2 Duo 1.6GHz and
Intel® 965GME Chipset
Designed with Ampro by ADLINK™ Extreme Rugged™
COM 840 and EBX baseboard
Operating Systems
Available with Windows® XP Professional or Ubuntu Linux® pre-installed
Support for Windows® CE, QNX® or VxWorks®
Mechanical
• Size (WxHxD): 8x10x3”
Size (WxHxD): 8x10x3”
• IP50 rated chassis
Environmental
Specifications
Board Compatibility
COM 840 with rugged EBX Carrier Board
High performance, conduction cooled 1.6GHz Intel® Core™2 Duo L7500 processor
Chipset – Intel® GME965/ICH8
Modular/Expandable
Temperature
• Standard: –20°C to +65°C
• Extended: –40°C to +75°C
• Storage: –40°C to +85°C
IP50 rated
Meets MIL-STD-810 (shock, vibration, temperature) testing
Power
Mini PCI and PCI Express Mini Card
• 14~32 VDC (standard)
• 12~25 VDC (optional)
I/O
Ordering Information
SATA - Internal HDD or SSD (up to 128GB)
CompactFlash
VGA - supports up to 2048 x 1536 resolution
Ethernet – 2x GbE
Serial – 4 ports, 2 supporting RS-232/422/485
Parallel – EPP/ECP bidirectional port
Floppy – Supported by USB (bootable)
USB – 4 USB 2.0 ports (4 root hubs)
PS/2 – Keyboard, Mouse
Audio – Speaker-out, Line-in, Mic
Network Interface
Ethernet - Dual Gigabit Ethernet: Intel® 82572EI and Intel® 82566
10-33
http://www.adlinktech.com/ampro/
Model Number
Description/Configuration
RUF840W-02010-1101
RuffSystem™ 840, 1.6GHz Core 2 Duo L7500, 32GB SSD,
2GB RAM, WinXP Professional, 14-32VDC, RoHS
RUF840W-02010-A101 RuffSystem™ 840, 1.6GHz Core 2 Duo L7500, 32GB SSD,
2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
RUF840W-03030-1101
RuffSystem™ 840, 1.6GHz Core 2 Duo L7500, 128GB SSD,
4GB RAM, WinXP Professional, 14-32VDC, RoHS
RUF840W-03030-A101 RuffSystem™ 840, 1.6GHz Core 2 Duo L7500, 128GB
RUF-ACC-US
SSD, 4GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
RuffSystem™ Starter Kit: AC adapter, software, and
documentation
Other configurations available. Please contact your salesperson.
RuffSystem™ 735
Extreme Rugged™
Intel® Atom™ Computer System
1
AdvancedTCA
Procucts
Features
2
3
6U cPCI
Platforms
Passive convection-cooled chassis
Intel® Atom™ system
Tested to MIL-STD-810F standards
Internal expansion for two PC/104-Plus cards
Wide range input: 12 to 32 VDC
Windows® XP Professional or Ubuntu Linux®
Pre-installed
Windows® CE, QNX®, and VxWorks® supported
6U cPCI Blades
4
3U cPCI Blades
Operating Systems
Available with Windows® XP Professional or Ubuntu Linux® pre-installed
Support for Windows® CE, QNX® or VxWorks®
5
• Size (WxHxD): 8x10x3”
Mechanical
• IP50 rated chassis
Size (WxHxD): 8x10x3”
3U cPCI
Platforms
Featuring: LittleBoard™ 735 with Intel® Atom™ 1.6GHz
and 945GSE Chipset
Designed with Ampro by ADLINK™ LittleBoard™ 735
Specifications
LittleBoardTM 735 EBX SBC
Low power, conduction cooled Intel® Atom™ processor
–Intel® Atom™ processor N270 at 1.6GHz
Chipset – Intel® 945GSE/ICH7-M
Modular/Expandable
I/O
Ethernet – Dual, Intel® 82541 (Gigabit) and Intel® 82551ER (10/100BaseT)
Ordering Information
Model Number
Description/Configuration
RUF735W-02010-1101
RuffSystem™ 735, 1.6 GHz Atom™ N270, 32GB SSD,
2GB RAM, WinXP Professional, 14-32VDC, RoHS
RUF735W-02010-A101
RuffSystem™ 735, 1.6 GHz Atom™ N270, 32GB SSD,
2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
RUF735W-02100-1101
RuffSystem™ 735, 1.6 GHz Atom™ N270, 80GB HDD,
2GB RAM, WinXP Professional, 14-32VDC, RoHS
RUF735W-02100-A101
RuffSystem™ 735, 1.6 GHz Atom™ N270, 80GB HDD,
2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
RUF-ACC-US
RuffSystem™ Starter Kit: AC adapter, software, and
documentation
Other configurations available. Please contact your salesperson.
8
9
Computer-OnModules
Network Interface
• 14~32 VDC (standard)
• 12~25 VDC (optional)
IPC
Accessories
SATA – Internal HDD or SSD (up to 128GB)
CompactFlash
VGA – supports up to 2048 x 1536 resolution
Ethernet – 1xGbE, 1x10/100
Serial – 4 ports, 2 supporting RS-232/422/485
Parallel – EPP/ECP bidirectional port
Floppy – Supported by USB (bootable)
USB – 4 USB 2.0 ports (4 root hubs)
PS/2 – Keyboard, Mouse
Audio – Speaker-out, Line-in, Mic
7
Power
Industrial
Chassis
Support for two PC/104-Plus expansion cards
6
Temperature
• Standard: –20°C to +65°C
• Extended: –40°C to +75°C
• Storage: –40°C to +85°C
IP50 rated
Meets MIL-STD-810 (shock, vibration, temperature) testing
Industrial SBCs
& MBs
Board Compatibility
Environmental
10
Ampro by ADLINK
Extreme Rugged
10-34
MilSystem™ 840
Extreme Rugged™ Intel® Core™2 Duo
COTS Military Computer
Features
Ampro by ADLINK™ Extreme Rugged™
10
Passive convection-cooled chassis
Intel® Core™2 Duo system
Tested to MIL-STD-810F standards
Uniquely-keyed D38999 connectors
Internal expansion for Mini PCI and PCIe Mini Card
Wide range input: 12 to 32 VDC
Windows® XP Professional or Ubuntu Linux®
Preinstalled
Windows® CE, QNX®, and VxWorks® supported
Featuring: COM 840 with Intel® Core™2 Duo 1.6GHz and
965GME Chipset
Designed with Ampro by ADLINK™ Extreme Rugged™
COM 840 and EBX baseboard
Operating Systems
Available with Windows® XP Professional or Ubuntu Linux® pre-installed
Support for Windows® CE, QNX® or VxWorks®
Mechanical
• Size (WxHxD): 8x10x3”
Size (WxHxD): 8x10x3”
• IP50 rated chassis
Environmental
Specifications
Board Compatibility
COM 840 with rugged EBX Carrier Board
High performance, conduction cooled 1.6GHz Intel® Core™2 Duo L7500 processor
Chipset – Intel® GME965/ICH8
Modular/Expandable
Temperature
• Standard: –20°C to +65°C
• Extended: –40°C to +75°C
• Storage: –40°C to +85°C
IP50 rated
Meets MIL-STD-810 (shock, vibration, temperature) testing
Power
• 14~32 VDC (standard)
• 12~25 VDC (optional)
Mini PCI and PCI Express Mini Card
I/O
Ordering Information
SATA – 1x Internal HDD or SSD (up to 128GB)
– 1x External
CompactFlash
VGA – supporting up to 2048 x 1536 resolution
Ethernet – 2xGbE
Serial – 4 ports, 2 supporting RS-232/422/485
Parallel – EPP/ECP bidirectional port
Floppy – Supported by USB (bootable)
USB – 4 USB 2.0 ports (4 root hubs)
PS/2 – Keyboard
Audio – Speaker-out, Line-in, Mic
LVDS
Remote ATX power and indicators
Network Interface
Ethernet – Dual, Intel® 82541 (Gigabit) and Intel® 82551ER (10/100BaseT)
10-35
http://www.adlinktech.com/ampro/
Model Number
Description/Configuration
MIL840W-02010-1101
MilSystem™ 840, 1.6GHz Core 2 Duo L7500, 32GB SSD,
2GB RAM, WinXP Professional, 14-32VDC, RoHS
MIL840W-02010-A101
MilSystem™ 840, 1.6GHz Core 2 Duo L7500, 32GB SSD,
2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
MIL840W-03030-1101
MilSystem™ 840, 1.6GHz Core 2 Duo L7500, 128GB SSD,
4GB RAM, WinXP Professional, 14-32VDC, RoHS
MIL840W-03030-A101
MilSystem™ 840, 1.6GHz Core 2 Duo L7500, 128GB SSD,
4GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
MIL-ACC-US
MilSystem™ Starter Kit: MC1, MC2, MC3 breakout cables,
AC adapter, software, and documentation
Other configurations available. Please contact your salesperson.
MilSystem™ 735
Extreme Rugged™
Intel® Atom™ COTS Military Computer
2
3
6U cPCI
Platforms
Passive convection-cooled chassis
Intel® Atom™ system
Tested to MIL-STD-810F standards
Uniquely-keyed D38999 connectors
Internal expansion for two PC/104-Plus cards
Wide range input: 12 to 32 VDC
Windows® XP Professional or Ubuntu Linux®
Pre-installed
Windows® CE, QNX®, and VxWorks® supported
6U cPCI Blades
AdvancedTCA
Procucts
Features
1
4
Designed with Ampro by ADLINK™ LittleBoard™ 735
Operating Systems
Available with Windows® XP Professional or Ubuntu Linux® pre-installed
Support for Windows® CE, QNX® or VxWorks®
• IP50 rated chassis
Size (WxHxD): 8x10x3”
LittleBoard™ 735 EBX SBC
Low power, conduction cooled Intel® Atom™ processor
Intel® Atom™ processor N270 at 1.6GHz
Chipset – Intel® 945GSE / ICH7M
Modular/Expandable
I/O
6
Power
7
• 14~32 VDC (standard)
• 12~25 VDC (optional)
Ordering Information
Model Number
Description/Configuration
MIL735W-02010-1101 MilSystem™ 735, 1.6 GHz Atom™ N270, 32GB SSD,
2GB RAM, WinXP Professional, 14-32VDC, RoHS
MIL735W-02010-A101 MilSystem™ 735, 1.6 GHz Atom™ N270, 32GB SSD,
2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
MIL735W-02100-1101 MilSystem™ 735, 1.6 GHz Atom™ N270, 80GB HDD,
2GB RAM, WinXP Professional, 14-32VDC, RoHS
MIL735W-02100-A101 MilSystem™ 735, 1.6 GHz Atom™ N270, 80GB HDD,
2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS
MilSystem™ Starter Kit: MC1, MC2, MC3 breakout
cables, AC adapter, software, and documentation
Other configurations available. Please contact your salesperson.
Network Interface
Ethernet – Dual, Intel® 82541 (Gigabit) and Intel® 82551ER (10/100BaseT)
9
Computer-OnModules
MIL-ACC-US
8
IPC
Accessories
SATA – 1x Internal HDD or SSD (up to 128GB)
– 1x External
CompactFlash
VGA – Supporting up to 2048 x 1536 resolution
Ethernet – 1xGbE, 1x10/100
Serial – 4 ports, 2 supporting RS-232/422/485
Parallel – EPP/ECP bidirectional port
Floppy – Supported by USB (bootable)
USB – 4 USB 2.0 ports (4 root hubs)
PS/2 – Keyboard
Audio – Speaker-out, Line-in, Mic
LVDS
Temperature
• Standard: –20°C to +65°C
• Extended: –40°C to +75°C
• Storage: –40°C to +85°C
IP50 rated
Meets MIL-STD-810 (shock, vibration, temperature) testing 
Industrial
Chassis
Support for two PC/104-Plus expansion cards
Environmental
Industrial SBCs
& MBs
Board Compatibility
5
3U cPCI
Platforms
• Size (w,h,d): 8x10x3”
Mechanical
Specifications
3U cPCI Blades
Featuring: LittleBoard™ with Intel® Atom™ 1.6GHz
1.6GHz and 945GSE Chipset
10
Ampro by ADLINK
Extreme Rugged
10-36