Motherboard
H170-PRO/USB 3.1
E10989
First Edition
November 2015
Copyright © 2015 ASUSTeK COMPUTER INC. All Rights Reserved.
No part of this manual, including the products and software described in it, may be reproduced,
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ii
Contents
Safety information ...................................................................................... iv
About this guide ......................................................................................... iv
Package contents ....................................................................................... vi
H170-PRO/USB 3.1 specifications summary............................................ vi
Chapter 1:
Product introduction
Motherboard overview ............................................................................. 1-1
Central Processing Unit (CPU) ................................................................ 1-9
System memory ...................................................................................... 1-10
Chapter 2:
BIOS information
BIOS setup program ................................................................................. 2-1
EZ Mode ..................................................................................................... 2-2
Advanced Mode ........................................................................................ 2-3
Exit menu................................................................................................... 2-4
Appendices
Notices .......................................................................................................A-1
ASUS contact information .......................................................................A-4
iii
Safety information
Electrical safety
•
Topreventelectricalshockhazard,disconnectthepowercablefromtheelectricaloutlet
before relocating the system.
•
When adding or removing devices to or from the system, ensure that the power cables
for the devices are unplugged before the signal cables are connected. If possible,
disconnect all power cables from the existing system before you add a device.
•
Before connecting or removing signal cables from the motherboard, ensure that all
power cables are unplugged.
•
Seek professional assistance before using an adapter or extension cord. These devices
could interrupt the grounding circuit.
•
Ensure that your power supply is set to the correct voltage in your area. If you are not
sure about the voltage of the electrical outlet you are using, contact your local power
company.
•
Ifthepowersupplyisbroken,donottrytofixitbyyourself.Contactaqualifiedservice
technician or your retailer.
Operation safety
•
Before installing the motherboard and adding components, carefully read all the manuals
that came with the package.
•
Before using the product, ensure all cables are correctly connected and the power
cables are not damaged. If you detect any damage, contact your dealer immediately.
•
To avoid short circuits, keep paper clips, screws, and staples away from connectors,
slots, sockets and circuitry.
•
Avoid dust, humidity, and temperature extremes. Do not place the product in any area
where it may be exposed to moisture.
•
Place the product on a stable surface.
•
Ifyouencountertechnicalproblemswiththeproduct,contactaqualifiedservice
technician or your retailer.
About this guide
Thisuserguidecontainstheinformationyouneedwheninstallingandconfiguringthe
motherboard.
How this guide is organized
This guide contains the following parts:
•
Chapter1:Productintroduction
This chapter describes the features of the motherboard and the new technology it
supports. It includes descriptions of the switches, jumpers, and connectors on the
motherboard.
•
Chapter2:BIOSinformation
This chapter discusses changing system settings through the BIOS Setup menus.
Detailed descriptions for the BIOS parameters are also provided.
iv
Where to find more information
Refer to the following sources for additional information and for product and software
updates.
1.
ASUS websites
The ASUS website provides updated information on ASUS hardware and software
products. Refer to the ASUS contact information.
2.
Optional documentation
Yourproductpackagemayincludeoptionaldocumentation,suchaswarrantyflyers,
that may have been added by your dealer. These documents are not part of the
standard package.
Conventions used in this guide
To ensure that you perform certain tasks properly, take note of the following symbols used
throughout this manual.
DANGER/WARNING: Information to prevent injury to yourself when
completing a task.
CAUTION: Information to prevent damage to the components when
completing a task
IMPORTANT: Instructions that you MUST follow to complete a task.
NOTE: Tips and additional information to help you complete a task.
Typography
Bold text
Indicates a menu or an item to select.
Italics
Usedtoemphasizeawordoraphrase.
<Key>
Keys enclosed in the less-than and greater-than sign
means that you must press the enclosed key.
Example: <Enter> means that you must press the Enter or
Return key.
<Key1> + <Key2> + <Key3>
If you must press two or more keys simultaneously, the key
names are linked with a plus sign (+).
v
Package contents
Check your motherboard package for the following items.
Motherboard
ASUS H170-PRO/USB 3.1 motherboard
Cables
2 x Serial ATA 6.0 Gb/s cables
Accessories
1 x I/O Shield
1 x M.2 screw package
Application DVD
Support DVD
Documentation
User Guide
If any of the above items is damaged or missing, contact your retailer.
H170-PRO/USB 3.1 specifications summary
LGA1151 socket for 6th Generation Intel® Core™ i7 / i5 / i3, Pentium®, and
Celeron® processors
CPU
Supports Intel® 14nm CPU
Supports Intel® Turbo Boost Technology 2.0*
* The Intel® Turbo Boost Technology 2.0 support depends on the CPU types.
** Refer to www.asus.com for Intel® CPU support list.
Chipset
Intel® H170 Express Chipset
4xDIMM,maximum64GB,DDR42133MHz,non-ECC,un-bufferedmemory*
Dual-channel memory architecture
Memory
Supports Intel®ExtremeMemoryProfile(XMP)
* Refer to www.asus.com for the latest Memory QVL (Qualified Vendors List).
** The maximum memory frequency supported varies per CPU.
1 x PCI Express 3.0/2.0 x16 slot (at x16 mode)
Expansion
slots
1 x PCI Express 3.0/2.0 x16 slot* (max. at x4 mode, compatible with PCIe x1 and x4
devices)
2 x PCI Express 3.0/2.0 x1 slots
2 x PCI slots
* When PCIe x16_2 is occupied by x4 or faster devices, PCIe x1_1 and PCIe x1_2 are
disabled.
Multi-GPU
Support
Supports AMD® CrossFireX™ Technology
Integrated graphics processor - Intel® HD Graphics support
Graphics
Multi-VGA output support: DisplayPort, HDMI, DVI-D ports
-SupportsDisplayPortwithmaximumresolutionof4096x2304@60Hz
-SupportsHDMIwithmaximumresolutionof4096x2160@24Hz/2560x1600@
60Hz
-SupportsDVI-Dwithmaximumresolutionof1920x1200@60Hz
Supports Intel® InTruTM 3D, Quick Sync Video, Intel® Clear Video HD Technology, and
Intel® InsiderTM
Supports up to 3 displays simultaneously
Maximum shared memory of 1024 MB
(continued on the next page)
vi
H170-PRO/USB 3.1 specifications summary
Storage
Intel® H170 Express Chipset with RAID 0, 1, 5, 10 and Intel Rapid Storage
Technology 14 support
- 1 x SATA Express port (compatible with 2 x SATA 6.0 Gb/s ports)
- 1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support
(both SATA & PCIE mode)*
- 6 x SATA 6.0 Gb/s ports (gray, 2 from SATA Express)
- Supports Intel® Smart Response Technology**
* M.2 Socket and SATA Express connector support PCIe mode and share bandwidth in
SATA mode. By default, the device detection priority of the system is: SATA Mode M.2 >
SATA Mode SATA Express.
** This function works depending on the type of CPU installed.
Intel® 1219V Gigabit LAN supports LANGuard
LAN
Dual interconnect between the integrated Media Access Controller (MAC) and
physical layer (PHY)
Realtek®ALC887-8-channelHighDefinitionAudioCODEC
- LED-illuminated audio: Brighten up your build with the gorgeous illuminated
audio trace path
Audio
- Dedicated audio PCB layers: Separate layers for left and right channels to guard
the quality of the sensitive audio signals
- Premium Japanese-made audio capacitors: Provide warm, natural and
immersivesoundwithexceptionalclarityandfidelity
- Audio-Shielding: Ensures precision analog/digital separation and greatly reduces
multi-lateral interference
ASMedia USB 3.1 Controllers - supports ASUS USB 3.1 Boost
- 2 x 10 Gb/s USB 3.1/3.0/2.0 ports at the rear panel (teal blue, Type A)
USB
Intel® H170 Express Chipset
- 6xUSB3.0/2.0ports(4portsatmid-board;2portsattherearpanel,blue,
Type A)
- 1 x 5 Gb/s USB Type C port (@ the rear panel), supports 3A power output
- 6 x USB 2.0/1.1 ports (4portsatmid-board;2portsattherearpanel)
Proven Quality
ASUS 5X PROTECTION II
- ASUS LANGuard - Protects against LAN surges, lightning strikes, and staticelectricity discharges
- ASUS Overvoltage Protection - World-class circuit-protecting power design
- ASUS DIGI+ VRM - 4+2+1 Phase digital power design
- ASUS DRAM Overcurrent Protection - Enhanced DRAM overcurrent
protection
ASUS unique
features
- ASUS Stainless Steel Back I/O - 3x corrosion-resistant coating
Superb Performance
M.2 onboard
- The latest transfer technologies with up to 32Gb/s data transfer speeds
SATA Express onboard
- The latest transfer technologies with up to 16Gb/s data transfer speeds
ASUS Fan Xpert 3
- Featuring Fan Auto Tuning function and multiple thermistors selection for
optimizedsystemcoolingcontrol
(continued on the next page)
vii
H170-PRO/USB 3.1 specifications summary
Superb Performance
ASUS EPU
- EPU
PC Cleaner
- Fastandeasywaytogetridofunnecessaryjunkfiles
UEFI BIOS
- Most advanced options with fast response time
USB 3.1 Boost
- featuring speedy USB 3.1 transmission
Gaming Scenario
Audio Features
- Audiothatroarsonthebattlefield
Media Streamer
ASUS
unique
features
- Pipe music or movies from your PC to a smart TV
- Media Streamer app for portable smartphone/tablet, supporting iOS7 and
Android 4.0 system
ASUS Exclusive Features
- ASUS AI Charger+
- ASUS AI Suite 3
- ASUS Disk Unlocker featuring 3 TB + HDD support
EZ DIY
Push Notice
- Monitor your PC status with smart devices in real time
UEFI BIOS EZ Mode
- Featuring friendly graphics user interface
- ASUS CrashFree BIOS 3
- ASUS EZ Flash 3
Q-Design
- ASUS Q-Slot
- ASUS Q-DIMM
1 x PS/2 Keyboard/mouse port
1 x DisplayPort
1 x HDMI port
1 x DVI-D port
2 x 10 Gb/s USB 3.1/3.0/2.0 ports (teal blue, Type A)
Rear panel
I/O ports
1 x USB 5 Gb/s Type C port
1 x LAN (RJ-45) port
2 x USB 3.0/2.0 ports (blue, Type A)
2 x USB 2.0/1.1 ports
3 x Audio jacks support 8-channel audio output*
* Use a chassis with HD audio module in the front panel to support a 8-channel audio
output.
(continued on the next page)
viii
H170-PRO/USB 3.1 specifications summary
Quiet Thermal Design
ASUS quiet
thermal
solution
- ASUS Fan Xpert 3
- Stylish Fanless Design: PCH heatsink & MOS Heatsink solution
2 x USB 3.0 / 2.0 connectors support additional 4 USB 3.0/ 2.0 ports (19-pin)
2 x USB 2.0 / 1.1 connectors support additional 4 USB 2.0/ 1.1 ports
1 x SATA Express connector
6 x SATA 6.0 Gb/s connectors (gray)
1 x M.2 Socket 3 (for M Key, type 2242/2260/2280 devices)
1 x 4-pin CPU fan connector for both 3-pin (DC mode) and 4-pin (DC & PWM
mode) CPU coolers control*
2 x 4-pin Chassis fan connectors 3-pin (DC mode) and 4-pin (DC & PWM mode)
coolers control
Internal
connectors
1 x Front panel audio connector (AAFP)
1 x System panel connector
1 x S/PDIF out header
1 x 24-pin EATX power connector
1 x 8-pin EATX 12V power connector
1 x COM header
1 x Clear CMOS header
* By default, the CPU Q-Fan control is set in Auto mode to detect the CPU installed and
change to the control mode automatically.
BIOS features
128 Mb Flash ROM, UEFI AMI BIOS, PnP, DMI 3.0, WfM2.0, SM BIOS 3.0,
ACPI 5.0, Multi-language BIOS, ASUS EZ Flash 3, ASUS CrashFree BIOS 3,
F11EZTuningWizard,F6QfanControl,F3MyFavorites,QuickNote,Last
ModifiedLog,F12PrintScreenfunction,andASUSDRAMSPD(SerialPresence
Detect) memory information
Manageability
WfM 2.0, DMI 3.0, WOL by PME, PXE
Drivers
Support DVD
ASUS utilities
EZ Update
Anti-virus software (OEM version)
Windows® 10 (64-bit),
Windows® 8.1 (64-bit),
OS support
Windows® 7 (32-bit / 64-bit)*
* Please refer to ASUS website and download “Window® 7 installation guide” and
“ASUS EZ installer” to install Windows® 7.
Form factor
ATX form factor: 12.0 in. x 8.8 in. (30 cm x 22.4 cm)
Specificationsaresubjecttochangewithoutnotice.
ix
x
1
Product introduction
Motherboard overview
•
Unplugthepowercordfromthewallsocketbeforetouchinganycomponent.
•
Beforehandlingcomponents,useagroundedwriststraportouchasafelygrounded
objectorametalobject,suchasthepowersupplycase,toavoiddamagingthemdue
tostaticelectricity.
•
Beforeyouinstallorremoveanycomponent,ensurethattheATXpowersupplyis
switchedofforthepowercordisdetachedfromthepowersupply.Failuretodoso
maycauseseveredamagetothemotherboard,peripherals,orcomponents.
•
Unplugthepowercordbeforeinstallingorremovingthemotherboard.Failuretodoso
cancauseyouphysicalinjuryanddamagetomotherboardcomponents.
1
2
3
2
4
22.4cm(8.8in)
KBMS_USB910
CPU_FAN
DIGI
+VRM
CHA_FAN1
AUDIO
M.2(SOCKET3)
CHA_FAN2
18
PCIEX1_1
2280
2260
2242
30.5cm(12in)
5
6
Intel®
I219V
PCIEX16_1
ASM
1083
H170-PRO/USB 3.1
BATTERY
Intel®
H170
18
PCIEX16_2
17
16
128Mb
BIOS
PCI1
SATA6G_2
Super
I/O
SATA6G_1
PCIEX1_2
SATAEXPRESS
17
1
USB3_12
LAN_USB3_56
LANGuard
ASM
1142
USB3.1
_E12
DDR4 DIMM_B2 (64bit, 288-pin module)
USB3_C7
EATXPWR
LGA1151
Place this
side towards
the rear of the
chassis
DDR4 DIMM_B1 (64bit, 288-pin module)
ASM
1442K
HDMI_DP
DDR4 DIMM_A2 (64bit, 288-pin module)
DDR4 DIMM_A1 (64bit, 288-pin module)
DVI
EATX12V
7
8
ALC
887
16
PCI2
SATA6G_4 SATA6G_3
SPDIF_OUT
COM
USB1112 USB1314
USB3_34
CLRTC
12
5
11
SB_PWR
PANEL
SATA6G_6 SATA6G_5
9
AAFP
15 14 13
10
ScantheQRcodetogetthedetailedpindefinitions.
ASUS H170-PRO/USB 3.1
1-1
ATX power connectors (24-pin EATXPWR, 8-pin EATX12V)
CorrectlyorienttheATXpowersupplyplugsintotheseconnectorsandpushdown
firmlyuntiltheconnectorscompletelyfit.
•
Forafullyconfiguredsystem,werecommendthatyouuseapowersupply
unit(PSU)thatcomplieswithATX12VSpecification2.0(orlaterversion)
andprovidesaminimumpowerof350W.
•
Ifyouareuncertainabouttheminimumpowersupplyrequirementforyour
system,refertotheRecommendedPowerSupplyWattageCalculator
athttp://support.asus.com/PowerSupplyCalculator/PSCalculator.
aspx?SLanguage=en-usfordetails.
CPU and chassis fan connectors (4-pin CPU_FAN, 4-pin CHA_FAN 1/2)
Connectthefancablestothefanconnectorsonthemotherboard,ensuringthat
theblackwireofeachcablematchesthegroundpinoftheconnector.
Donotforgettoconnectthefancablestothefanconnectors.Insufficientair
flowinsidethesystemmaydamagethemotherboardcomponents.Theseare
notjumpers!Donotplacejumpercapsonthefanconnectors!TheCPU_FAN
connectorsupportsaCPUfanofmaximum1A(12W)fanpower.
Intel® LGA1151 CPU socket
InstallIntel®LGA1151CPUintothissurfacemountLGA1151socket,whichis
designedfor6thGenerationIntel®Core™i7/i5/i3,Pentium®,andCeleron®
processors.
Formoredetails,refertoCentral Processing Unit (CPU).
DDR4 DIMM slots
Install2GB,4GB,8GB,and16GBunbufferednon-ECCDDR4DIMMsintothese
DIMMsockets.
Formoredetails,refertoSystem memory.
USB 3.0 connectors (20-1 pin USB3_12, USB3_34)
ConnectaUSB3.0moduletoanyoftheseconnectorsforadditionalUSB3.0
frontorrearpanelports.TheseconnectorscomplywithUSB3.0specifications
andprovidefasterdatatransferspeedsofupto5Gbps,fasterchargingtimefor
USB-chargeabledevices,optimizedpowerefficiency,andbackwardcompatibility
withUSB2.0.
1-2
Chapter 1: Product introduction
M.2 socket 3
M.2(SOCKET3)
ThissocketallowsyoutoinstallanM.2(NGFF)SSD
module.
•
ThissocketsupportsMKeyand2242/2260/2280
storagedevices.
•
WhenusingIntel®DesktopResponsiveness
technologieswithPCIeM.2device,ensuretoset
uptheWindows®UEFIoperatingsystemunder
RAIDmode.
Standby Power LED (SB_PWR)
ThestandbypowerLEDlightsuptoindicate
thatthesystemisON,insleepmode,orin
soft-offmode.Thisisareminderthatyou
shouldshutdownthesystemandunplugthe
powercablebeforeremovingorpluggingin
anymotherboardcomponent.
SB_PWR
ON
Standby Power
SATAEXPRESS connector
ThisconnectorconnectstoSATAEXPRESSharddisk
drivesviaSATAEXPRESSsignalcables.
OFF
Powered Off
SATA6G_1
SATA6G_2
GND
RSATA_TXP1
RSATA_TXN1
GND
RSATA_RXN1
RSATA_RXP1
GND
GND
RSATA_TXP2
RSATA_TXN2
GND
RSATA_RXN2
RSATA_RXP2
GND
Floating
Device_Reset
GND
Detection
SATAEXPRESS
TheseconnectorsconnecttoSerialATA6.0Gb/sharddisk
drivesviaSerialATA6.0Gb/ssignalcables.
SATA6G
GND
RSATA_RXP4
RSATA_RXN4
GND
RSATA_TXN4
RSATA_TXP4
GND
Serial ATA 6.0Gb/s connectors (7-pin SATA6G_3~6)
System panel connector (20-5 pin PANEL)
Thisconnectorsupportsseveralchassis-mountedfunctions.
ASUS H170-PRO/USB 3.1
1-3
Clear RTC RAM (2-pin CLRTC)
CLRTC
+3V_BAT
GND
ThisheaderallowsyoutocleartheCMOSRTCRAMdataof
thesystemsetupinformationsuchasdate,time,andsystem
passwords.
To erase the RTC RAM:
PIN 1
1.
TurnOFFthecomputerandunplugthepowercord.
2.
Useametalobjectsuchasascrewdrivertoshortthe
twopins.
3.
PlugthepowercordandturnONthecomputer.
4.
Holddownthe<Del>keyduringthebootprocessand
enterBIOSsetuptore-enterdata.
Ifthestepsabovedonothelp,removetheonboardbatteryandshortthe
twopinsagaintocleartheCMOSRTCRAMdata.AfterclearingtheCMOS,
reinstallthebattery.
USB 2.0 connectors (10-1 pin USB1112, USB1314)
ConnecttheUSBmodulecabletoanyoftheseconnectors,theninstallthemodule
toaslotopeningatthebackofthesystemchassis.TheseUSBconnectorscomply
withUSB2.0specificationsandsupportsupto480Mbpsconnectionspeed.
Serial port connector (10-1 pin COM)
Digital audio connector (4-1 pin SPDIF_OUT)
+5V
ConnecttheS/PDIFOutmodulecabletothisconnector,
theninstallthemoduletoaslotopeningatthebackofthe
systemchassis.
SPDIFOUT
GND
Connecttheserialportmodulecabletothisconnector,theninstallthemoduletoa
slotopeningatthebackofthesystemchassis.
PIN 1
SPDIF_OUT
Front panel audio connector (10-1 pin AAFP)
Thisconnectorisforachassis-mountedfrontpanelaudioI/Omodulethatsupports
eitherHDAudioorlegacyAC`97audiostandard.Connectoneendofthefront
panelaudioI/Omodulecabletothisconnector.
1-4
•
Werecommendthatyouconnectahigh-definitionfrontpanelaudio
moduletothisconnectortoavailofthemotherboard’shigh-definitionaudio
capability.
•
Ifyouwanttoconnectahigh-definitionfrontpanelaudiomoduleto
thisconnector,settheFrontPanelTypeitemintheBIOSsetupto[HD
Audio].IfyouwanttoconnectanAC’97frontpanelaudiomoduletothis
connector,settheitemto[AC97].Bydefault,thisconnectorissetto[HD
Audio].
Chapter 1: Product introduction
PCI slots
ThePCIslotssupportcardssuchasaLANcard,SCSIcard,USBcard,andother
cardsthatcomplywithPCIspecifications.
PCI Express 3.0/2.0 x16 slots
ThismotherboardhastwoPCIExpress3.0/2.0x16slotsthatsupportPCIExpress
3.0/2.0x16graphiccardscomplyingwiththePCIExpressspecifications.
VGA configuration
PCI Express operating mode
PCIe 3.0 x16_1 (gray)
PCIe 3.0 x16_2
Single VGA/PCIe card
x16(Recommendedfor
singleVGAcard)
N/A
Dual VGA/PCIe cards
x16
x4
•
InsingleVGAcardmode,usethePCIe3.0x16_1slot(gray)foraPCIExpressx16
graphicscardtogetbetterperformance.
•
WerecommendthatyouprovidesufficientpowerwhenrunningCrossFireX™mode.
•
ConnectachassisfantothemotherboardconnectorlabeledCHA_FAN1/2when
usingmultiplegraphicscardsforbetterthermalenvironment.
PCI Express 3.0/2.0 x1 slots
ThismotherboardsupportsPCIExpressx1networkcards,SCSIcards,andother
cardsthatcomplywiththePCIExpressspecifications
ASUS H170-PRO/USB 3.1
1-5
IRQ assignments for this motherboard
A
B
C
D
SATAController
shared
–
–
–
XHCIController
shared
–
–
–
HDAudio
ASM1142
ASM1083
Intel®LAN
PCIEx16_1
PCIEx16_2
PCIEx1_1
PCIEx1_2
shared
–
–
shared
shared
shared
–
–
–
–
–
–
–
–
–
–
–
–
shared
–
shared
–
–
–
–
–
–
–
shared
–
–
shared
WhenusingPCIcardsonsharedslots,ensurethatthedriverssupport“ShareIRQ”orthat
thecardsdonotneedIRQassignments.Otherwise,conflictswillarisebetweenthetwoPCI
groups,makingthesystemunstableandthecardinoperable.
Rear panel connectors
2
1
12
1-6
11
10
3
9
8
1.
PS/2 Keyboard/Mouse combo port.Thisportconnectstoa
PS/2mouseorPS/2keyboard.
2
DisplayPort.Thisportconnectsadisplaymonitororahometheatersystem.
3.
LAN (RJ-45) port.ThisportallowsGigabitconnectiontoa
LocalAreaNetwork(LAN)throughanetworkhub.
4 5
6
7
Activity Link
LED
Speed
LED
LAN port
Chapter 1: Product introduction
LAN port LED indications
Activity/Link LED
Status
Off
Orange
Orange(Blinking)
Orange(Blinking
thensteady)
Description
Nolink
Linked
Dataactivity
Readytowakeup
fromS5mode
Speed LED
Status
OFF
ORANGE
GREEN
_
Description
10Mbpsconnection
100Mbpsconnection
1Gbpsconnection
_
4.
Line In port (light blue).Thisportconnectstothetape,CD,DVDplayer,orother
audiosources.
5.
Line Out port (lime).Thisportconnectstoaheadphoneoraspeaker.Inthe4.1,5.1
and7.1-channelconfigurations,thefunctionofthisportbecomesFrontSpeakerOut.
6.
Microphone port (pink).Thisportconnectstoamicrophone.
Refertotheaudioconfigurationtableforthefunctionoftheaudioportsin2.1,4.1,5.1,or
7.1-channelconfiguration.
Audio 2.1, 4.1, 5.1, or 7.1-channel configuration
Port
LightBlue(Rearpanel)
Lime(Rearpanel)
Pink(Rearpanel)
Lime(Frontpanel)
Headset
2.1-channel
LineIn
LineOut
MicIn
-
4.1-channel
RearSpeakerOut
FrontSpeakerOut
MicIn
-
5.1-channel
RearSpeakerOut
FrontSpeakerOut
Bass/Center
-
7.1-channel
RearSpeakerOut
FrontSpeakerOut
Bass/Center
SideSpeakerOut
To configure a 7.1-channel audio output:
7.
UseachassiswithHDaudiomoduleinthefrontpaneltosupporta7.1-channelaudio
output.
USB 3.0 ports.These9-pinUniversalSerialBus(USB)portsareforUSB3.0devices.
•
USB3.0devicescanonlybeusedfordatastorage.
•
WestronglyrecommendthatyouconnectUSB3.0devicestoUSB3.0portsforfaster
andbetterperformancefromyourUSB3.0devices.
•
DuetothedesignoftheIntel®100serieschipset,allUSBdevicesconnectedtothe
USB2.0andUSB3.0portsarecontrolledbythexHCIcontroller.SomelegacyUSB
devicesmustupdatetheirfirmwareforbettercompatibility.
ASUS H170-PRO/USB 3.1
1-7
8.
USB 3.1 Type A port.sThesesUniversalSerialBus(USB)TypeAportsareforUSB
3.1peripheraldevices.
9.
USB 3.0 Type C port.ThisUniversalSerialBus(USB)portisforUSB3.0devices.
10.
HDMI port.ThisportisforaHigh-DefinitionMultimediaInterface(HDMI)connector,
andisHDCPcompliantallowingplaybackofHDDVD,Blu-ray,andotherprotected
content.
11. DVI-D port.ThisportisforanyDVI-Dcompatibledevice.
DVI-DcannotbeconvertedtooutputfromRGBSignaltoCRTandisnotcompatiblewith
DVI-I.
12.
1-8
USB 2.0 ports.These4-pinUniversalSerialBus(USB)portsareforUSB2.0/1.1
devices.
Chapter 1: Product introduction
Central Processing Unit (CPU)
ThismotherboardcomeswithasurfacemountLGA1151socket
designedfor6thGenerationIntel®Core™i7/i5/i3,Pentium®,and
Celeron®processors.
UnplugallpowercablesbeforeinstallingtheCPU.
•
EnsurethatyouinstallthecorrectCPUdesignedfortheLGA1151socketonly.DO
NOTinstallaCPUdesignedforLGA1150,LGA1155andLGA1156socketsonthe
LGA1151socket.
•
Uponpurchaseofthemotherboard,ensurethatthePnPcapisonthesocketand
thesocketcontactsarenotbent.ContactyourretailerimmediatelyifthePnPcap
ismissing,orifyouseeanydamagetothePnPcap/socketcontacts/motherboard
components.
•
Keepthecapafterinstallingthemotherboard.ASUSwillprocessReturnMerchandise
Authorization(RMA)requestsonlyifthemotherboardcomeswiththecaponthe
LGA1151socket.
•
Theproductwarrantydoesnotcoverdamagetothesocketcontactsresultingfrom
incorrectCPUinstallation/removal,ormisplacement/loss/incorrectremovalofthePnP
cap.
Installing the CPU
1
A
B
4
2
A
4
C
3
5
D5
B
4
ApplytheThermalInterfaceMaterialtotheCPUheatsinkandCPUbeforeyouinstallthe
heatsinkandfanifnecessary.
ASUS H170-PRO/USB 3.1
1-9
System memory
Overview
ThismotherboardcomeswithtwoDoubleDataRate4(DDR4)DualInlineMemoryModule
(DIMM)sockets.ADDR4moduleisnotcheddifferentlyfromaDDR,DDR2,orDDR3module.
DONOTinstallaDDR,DDR2,orDDR3memorymoduletotheDDR4slot.
DIMM_A1
DIMM_A2
DIMM_B1
DIMM_B2
Channel
ChannelA
ChannelB
Sockets
DIMM_A1&DIMM_A2
DIMM_B1&DIMM_B2
•
YoumayinstallvaryingmemorysizesinChannelAandChannelB.Thesystem
mapsthetotalsizeofthelower-sizedchannelforthedual-channelconfiguration.Any
excessmemoryfromthehigher-sizedchannelisthenmappedforsingle-channel
operation.
•
AlwaysinstalltheDIMMSwiththesameCASLatency.Foranoptimumcompatibility,
werecommendthatyouinstallmemorymodulesofthesameversionordatacode
(D/C)fromthesamevendor.Checkwiththevendortogetthecorrectmemory
modules.
•
AccordingtoIntel®CPUspec,DIMMvoltagebelow1.35Visrecommendedtoprotect
theCPU.
•
Duetothememoryaddresslimitationon32-bitWindows®OS,whenyouinstall4GB
ormorememoryonthemotherboard,theactualusablememoryfortheOScanbe
about3GBorless.Foreffectiveuseofmemory,werecommendthatyoudoanyofthe
following:
-
Useamaximumof3GBsystemmemoryifyouareusinga32-bitWindows®OS.
-
Installa64-bitWindows®OSifyouwanttoinstall4GBormoreonthe
motherboard.
-
Formoredetails,refertotheMicrosoft®supportsiteathttp://support.microsoft.
com/kb/929605/en-us.
VisittheASUSwebsiteatwww.asus.comforthelatestQVL.
Installing a DIMM
1
2
A
A
B
To remove a DIMM
A
B
1-10
Chapter 1: Product introduction
BIOS information
•
ScantheQRcodetoviewtheBIOSupdateguide.
•
BeforeusingtheASUSCrashFreeBIOS3utility,renamethe
BIOSfileintheremovabledeviceintoH17PU.CAP.
2
BIOS setup program
UsetheBIOSSetupprogramtoupdatetheBIOSorconfigureitsparameters.TheBIOS
screensincludenavigationkeysandbriefonlinehelptoguideyouinusingtheBIOSSetup
program.
Entering BIOS Setup at startup
To enter BIOS Setup at startup:
Press<Delete>or<F2>duringthePower-OnSelfTest(POST).Ifyoudonotpress<Delete>
or<F2>,POSTcontinueswithitsroutines.
Entering BIOS Setup after POST
To enter BIOS Setup after POST:
•
Press<Ctrl>+<Alt>+<Del>simultaneously.
•
Presstheresetbuttononthesystemchassis.
•
Pressthepowerbuttontoturnthesystemoffthenbackon.Dothisoptiononlyifyou
failedtoenterBIOSSetupusingthefirsttwooptions.
Usingthepowerbutton,resetbutton,orthe<Ctrl>+<Alt>+<Del>keystoforceresetfroma
runningoperatingsystemcancausedamagetoyourdataorsystem.Werecommendyou
alwaysshutdownthesystemproperlyfromtheoperatingsystem.
•
TheBIOSsetupscreensshowninthissectionareforreferencepurposesonly,and
maynotexactlymatchwhatyouseeonyourscreen.
•
VisittheASUSwebsiteatwww.asus.comtodownloadthelatestBIOSfileforthis
motherboard.
•
IfthesystembecomesunstableafterchanginganyBIOSsetting,loadthedefault
settingstoensuresystemcompatibilityandstability.SelecttheLoad Optimized
DefaultsitemundertheExitmenuorpresshotkeyF5.
•
IfthesystemfailstobootafterchanginganyBIOSsetting,trytocleartheCMOSand
resetthemotherboardtothedefaultvalue.SeesectionMotherboard overviewfor
informationonhowtoerasetheRTCRAM.
BIOS menu screen
TheBIOSsetupprogramcanbeusedundertwomodes:EZ ModeandAdvanced Mode.
Press<F7>tochangebetweenthetwomodes.
ASUS H170-PRO/USB 3.1
2-1
EZ Mode
Bydefault,theEZModescreenappearswhenyouentertheBIOSsetupprogram.TheEZ
Modeprovidesyouanoverviewofthebasicsysteminformation,andallowsyoutoselectthe
displaylanguage,systemperformancemode,fanprofileandbootdevicepriority.Toaccess
theAdvancedMode,clickAdvanced Mode(F7)orpress<F7>.
ThedefaultscreenforenteringtheBIOSsetupprogramcanbechanged.Refertothe
Setup Modeiteminsection2.8 Boot menufordetails.
Displays the CPU/motherboard
temperature, CPU voltage output,
CPU/chassis fan speed, and SATA
information
Selects the display
language of the BIOS
setup program
Enables or disables the Intel
Rapid Storage Technology
Displays the CPU Fan’s speed.
Click the button to manually
tune the fans
Loads optimized
default settings
Displays the system properties of
the selected mode. Click <Enter> to
switch EZ System Tuning modes
Creates storage RAID and
configures system overclocking
Displays the
Shows the
Advanced mode
bootable
menus
devices
Search on FAQs
Saves the changes
and resets the
Selects the boot
system
device priority
Thebootdeviceoptionsvarydependingonthedevicesyouinstalledtothesystem.
2-2
Chapter 2: Getting started
Advanced Mode
TheAdvancedModeprovidesadvancedoptionsforexperiencedend-userstoconfigurethe
BIOSsettings.ThefigurebelowshowsanexampleoftheAdvanced Mode.Refertothe
followingsectionsforthedetailedconfigurations.
ToaccesstheEZMode,clickEzMode(F7)orpress<F7>.
MyFavorite
Language
Menu bar
Sub-menu item
General help
Q-Fan control
EZ Tuning
Wizard
Configuration fields
Scroll bar
Popup window
Last modified
settings
Menu items
Quick Note
Hot Keys
Goes back
to EZ Mode
Search on FAQs
Displays the CPU/motherboard
temperature, CPU and memory
voltage output
ASUS H170-PRO/USB 3.1
2-3
Search on FAQ
MoveyourmouseoverthisbuttontoshowaQRcode.ScanthisQRcodewithyourmobile
devicetoconnecttotheASUSBIOSFAQwebpage.YoucanalsoscantheQRcodebelow.
Exit menu
TheExitmenuitemsallowyoutoloadtheoptimaldefaultvaluesfortheBIOSitems,and
saveordiscardyourchangestotheBIOSitems.
Load Optimized Defaults
ThisoptionallowsyoutoloadthedefaultvaluesforeachoftheparametersontheSetup
menus.Whenyouselectthisoptionorifyoupress<F5>,aconfirmationwindowappears.
SelectOKtoloadthedefaultvalues.
Save Changes & Reset
Onceyouarefinishedmakingyourselections,choosethisoptionfromtheExitmenuto
ensurethevaluesyouselectedaresaved.Whenyouselectthisoptionorifyoupress<F10>,
aconfirmationwindowappears.SelectOKtosavechangesandexit.
Discard Changes and Exit
ThisoptionallowsyoutoexittheSetupprogramwithoutsavingyourchanges.Whenyou
selectthisoptionorifyoupress<Esc>,aconfirmationwindowappears.SelectOKtodiscard
changesandexit.
Launch EFI Shell from USB drives
ThisoptionallowsyoutoattempttolaunchtheEFIShellapplication(shellx64.efi)fromoneof
theavailableUSBdevices.
2-4
Chapter 2: Getting started
Appendices
Notices
Federal Communications Commission Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
•
This device may not cause harmful interference.
•
This device must accept any interference received including interference that may cause
undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with manufacturer’s instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
•
Reorient or relocate the receiving antenna.
•
Increase the separation between the equipment and receiver.
•
Connect the equipment to an outlet on a circuit different from that to which the receiver
is connected.
•
Consult the dealer or an experienced radio/TV technician for help.
The use of shielded cables for connection of the monitor to the graphics card is required
toassurecompliancewithFCCregulations.Changesormodificationstothisunitnot
expressly approved by the party responsible for compliance could void the user’s authority
to operate this equipment.
IC: Canadian Compliance Statement
ComplieswiththeCanadianICES-003ClassBspecifications.ThisdevicecomplieswithRSS
210 of Industry Canada. This Class B device meets all the requirements of the Canadian
interference-causing equipment regulations.
This device complies with Industry Canada license exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
Cut appareil numérique de la Classe B est conforme à la norme NMB-003 du Canada.
Cet appareil numérique de la Classe B respecte toutes les exigences du Règlement sur le
matériel brouilleur du Canada.
Cet appareil est conforme aux normes CNR exemptes de licence d’Industrie Canada. Le
fonctionnement est soumis aux deux conditions suivantes :
(1) cet appareil ne doit pas provoquer d’interférences et
(2) cet appareil doit accepter toute interférence, y compris celles susceptibles de provoquer
un fonctionnement non souhaité de l’appareil.
ASUS H170-PRO/USB 3.1
A-1
Canadian Department of Communications Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian Department
of Communications.
This class B digital apparatus complies with Canadian ICES-003.
VCCI: Japan Compliance Statement
VCCI Class B Statement
This is a Class B product based on the standard of the VCCI Council. If this is used near a
radio or television receiver in a domestic environment, it may cause radio interference. Install
and use the equipment according to the instruction manual.
KC: Korea Warning Statement
REACH
Complying with the REACH (Registration, Evaluation, Authorisation, and Restriction of
Chemicals) regulatory framework, we published the chemical substances in our products at
ASUS REACH website at http://csr.asus.com/english/REACH.htm.
DO NOT throw the motherboard in municipal waste. This product has been designed to
enable proper reuse of parts and recycling. This symbol of the crossed out wheeled bin
indicates that the product (electrical and electronic equipment) should not be placed in
municipal waste. Check local regulations for disposal of electronic products.
DO NOT throw the mercury-containing button cell battery in municipal waste. This symbol
of the crossed out wheeled bin indicates that the battery should not be placed in municipal
waste.
ASUS Recycling/Takeback Services
ASUS recycling and takeback programs come from our commitment to the highest standards
for protecting our environment. We believe in providing solutions for you to be able to
responsibly recycle our products, batteries, other components as well as the packaging
materials. Please go to http://csr.asus.com/english/Takeback.htm for detailed recycling
information in different regions.
A-2
Appendices
Google™ License Terms
Copyright© 2014 Google Inc. All Rights Reserved.
LicensedundertheApacheLicense,Version2.0(the“License”);youmaynotusethisfile
except in compliance with the License. You may obtain a copy of the License at:
http://www.apache.org/licenses/LICENSE-2.0
Unless required by applicable law or agreed to in writing, software distributed under the
License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR CONDITIONS OF
ANY KIND, either express or implied.
SeetheLicenseforthespecificlanguagegoverningpermissionsandlimitationsunderthe
License.
English AsusTek Inc. hereby declares that this device is in compliance with
the essential requirements and other relevant provisions of CE Directives.
Please see the CE Declaration of Conformity for more details.
Latviski Līdz ar šo AsusTek Inc. paziņo, ka šī ierīce atbilst būtiskajām
prasībām un citiem saistošajiem nosacījumiem, kas norādīti CE direktīvā. Lai
uzzinātu vairāk, skatiet CE Atbilstības deklarāciju.
Français AsusTek Inc. déclare par la présente que cet appareil est
conforme aux critères essentiels et autres clauses pertinentes des directives
européennes. Veuillez consulter la déclaration de conformité CE pour plus
d’informations.
Lietuvių Šiuo dokumentu bendrovė „AsusTek Inc.“ pareiškia, kad šis
įrenginys atitinka pagrindinius CE direktyvų reikalavimus ir kitas susijusias
nuostatas. Daugiau informacijos rasite CE atitikties deklaracijoje.
Deutsch AsusTek Inc. erklärt hiermit, dass dieses Gerät mit den
wesentlichen Anforderungen und anderen relevanten Bestimmungen der
CE-Richtlinien übereinstimmt. Weitere Einzelheiten entnehmen Sie bitte der
CE-Konformitätserklärung.
Italiano AsusTek Inc. con la presente dichiara che questo dispositivo
è conforme ai requisiti essenziali e alle altre disposizioni pertinenti alle
direttive CE. Per maggiori informazioni fate riferimento alla dichiarazione
di conformità CE.
Компания ASUS заявляет, что это устройство соответствует основным
требованиям и другим соответствующим условиям европейских
директив. Подробную информацию, пожалуйста, смотрите в декларации
соответствия.
Norsk AsusTek Inc. erklærer herved at denne enheten er i samsvar med
hovedsaklige krav og andre relevante forskrifter i CE-direktiver. Du finner
mer informasjon i CE-samsvarserklæringen.
Polski Niniejszym AsusTek Inc. deklaruje, że to urządzenie jest zgodne z
istotnymi wymaganiami oraz innymi powiązanymi zaleceniami Dyrektyw
CE. W celu uzyskania szczegółów, sprawdź Deklarację zgodności CE.
Português A AsusTek Inc. declara que este dispositivo está em
conformidade com os requisitos essenciais e outras disposições relevantes
das Diretivas da CE. Para mais detalhes, consulte a Declaração de
Conformidade CE.
Română Prin prezenta, AsusTek Inc. declară faptul că acest dispozitiv
respectă cerinţele esenţiale şi alte prevederi relevante ale directivelor CE.
Pentru mai multe detalii, consultaţi declaraţia de conformitate CE.
Български С настоящото AsusTek Inc. декларира, че това устройство
е в съответствие със съществените изисквания и другите приложими
постановления на директивите CE. Вижте CE декларацията за
съвместимост за повече информация.
Srpski AsusTek Inc. ovim izjavljuje da je ovaj uređaj u saglasnosti sa
ključnim zahtevima i drugim relevantnim odredbama CE Direktiva. Molimo
vas, pogledajte CE Deklaraciju o usklađenosti za više detalja.
Hrvatski AsusTek Inc. ovim izjavljuje da je ovaj uređaj sukladan s bitnim
zahtjevima i ostalim odgovarajućim odredbama CE direktiva. Više
pojedinosti potražite u CE izjavi o sukladnosti.
Slovensky Spoločnosť AsusTek Inc. týmto prehlasuje, že toto zariadenie
vyhovuje príslušným požiadavkám a ďalším súvisiacim ustanoveniam
smerníc ES. Viac podrobností si pozrite v prehlásení o zhode ES.
Čeština Společnost AsusTek Inc. tímto prohlašuje, že toto zařízení
splňuje základní požadavky a další příslušná ustanovení směrnic CE. Další
podrobnosti viz Prohlášení o shodě CE.
Slovenščina AsusTek Inc. tukaj izjavlja, da je ta naprava skladna s
temeljnimi zahtevami in drugimi relevantnimi določili direktiv CE. Za več
informacij glejte Izjavo CE o skladnosti.
Dansk AsusTek Inc. Erklærer hermed, at denne enhed er i
overensstemmelse med hovedkravene and andre relevante bestemmelser i
CE-direktiverne. Du kan læse mere i CE-overensstemmelseserklæring.
Español Por la presente, AsusTek Inc. declara que este dispositivo cumple
los requisitos básicos y otras disposiciones relevantes de las directivas
de la CE. Consulte la Declaración de conformidad de la CE para obtener
más detalles.
Nederlands AsusTek Inc. verklaart hierbij dat dit apparaat compatibel
is met de essentiële vereisten en andere relevante bepalingen van CErichtlijnen. Raadpleeg de CE-verklaring van conformiteit voor meer details.
Eesti Käesolevaga kinnitab AsusTek Inc., et see seade vastab CE direktiivide
oluliste nõuetele ja teistele asjakohastele sätetele. Vt üksikasju CE
vastavusdeklaratsioonist.
Suomi AsusTek Inc. vakuuttaa täten, että tämä laite on CE-direktiivien
olennaisten vaatimusten ja muiden asiaan kuuluvien lisäysten mukainen.
Katso lisätietoja CE-vaatimustenmukaisuusvakuutuksesta.
Ελληνικά Με το παρόν, η AsusTek Inc. Δηλώνει ότι αυτή η συσκευή
συμμορφώνεται με τις θεμελιώδεις απαιτήσεις και άλλες σχετικές διατάξεις
των Οδηγιών της ΕΕ. Για περισσότερες λεπτομέρειες ανατρέξτε στην
Δήλωση Συμμόρφωσης ΕΕ.
Svenska AsusTek Inc. förklarar härmed att denna enhet är i
överensstämmelse med de grundläggande kraven och andra relevanta
bestämmelser i CE-direktiven. Se CE-försäkran om överensstämmelse för
mer information.
Українська AsusTek Inc. заявляє, що цей пристрій відповідає основним
вимогам відповідних Директив ЄС. Будь ласка, див. більше подробиць у
Декларації відповідності нормам ЄС.
Türkçe AsusTek Inc., bu aygıtın temel gereksinimlerle ve CE Yönergelerinin
diğer ilgili koşullarıyla uyumlu olduğunu beyan eder. Daha fazla ayrıntı için
lütfen CE Uygunluk Beyanına bakın.
Bosanski AsusTek Inc. ovim potvrđuje da je ovaj uređaj usklađen s
osnovnim zahtjevima i drugim relevantnim propisima Direktiva EK. Za više
informacija molimo pogledajte Deklaraciju o usklađenosti EK.
Magyar Az AsusTek Inc. ezennel kijelenti, hogy a készülék megfelel
a CE-irányelvek alapvető követelményeinek és ide vonatkozó egyéb
rendelkezéseinek. További részletekért tekintse meg a CE-megfelelőségi
nyilatkozatot.
ASUS H170-PRO/USB 3.1
A-3
ASUS contact information
ASUSTeK COMPUTER INC.
Address
Telephone
Fax
E-mail
Web site
15 Li-Te Road, Peitou, Taipei, Taiwan 11259
+886-2-2894-3447
+886-2-2890-7798
info@asus.com.tw
http://www.asus.com
Technical Support
Telephone
Fax
Online support
+86-21-3842-9911
+86-21-5866-8722 ext. 9101#
http://support.asus.com/techserv/techserv.aspx
ASUS COMPUTER INTERNATIONAL (America)
Address
Telephone
Fax
Web site
800 Corporate Way, Fremont, CA 94539, USA
+1-510-739-3777
+1-510-608-4555
http://www.asus.com/us/
Technical Support
Support fax
General support
Online support
+1-812-284-0883
+1-812-282-2787
http://www.service.asus.com/
ASUS COMPUTER GmbH (Germany and Austria)
Address
Fax
Web site
Online contact
Harkort Str. 21-23, D-40880 Ratingen, Germany
+49-2102-959931
http://www.asus.com/de
http://eu-rma.asus.com/sales
Technical Support
Telephone
Support Fax
Online support
A-4
+49-2102-5789555
+49-2102-959911
http://www.asus.com/de/support/
Appendices
ASUS H170-PRO/USB 3.1
A-5
(510)739-3777/(510)608-4555
800 Corporate Way, Fremont, CA 94539.
Asus Computer International
Date :
Signature :
Representative Person’s Name :
Nov. 04, 2015
Steve Chang / President
This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference,
and (2) this device must accept any interference received, including interference
that may cause undesired operation.
Supplementary Information:
FCC Part 15, Subpart B, Unintentional Radiators
Conforms to the following specifications:
Model Number : H170-PRO/USB 3.1
Product Name : Motherboard
hereby declares that the product
Phone/Fax No:
Address:
Responsible Party Name:
Per FCC Part 2 Section 2. 1077(a)
DECLARATION OF CONFORMITY
Ver. 140331
HARKORT STR. 21-23, 40880 RATINGEN
GERMANY
Country:
H170-PRO/USB 3.1
Regulation (EU) No. 617/2013
Declaration Date: 04/11/2015
Year to begin affixing CE marking: 2015
CE marking
Signature : __________
CEO
Jerry Shen
Name :
Ver. 151019
Position :
(EC conformity marking)
Regulation (EC) No. 278/2009
2011/65/EU-RoHS Directive
Regulation (EC) No. 642/2009
EN 60065:2002 / A12: 2011
EN 301 489-1 V1.9.2(2011-09)
EN 301 489-3 V1.6.1(2013-12)
EN 301 489-4 V2.1.1(2013-12)
EN 301 489-7 V1.3.1(2005-11)
EN 301 489-9 V1.4.1(2007-11)
EN 301 489-17 V2.2.1(2012-09)
EN 301 489-24 V1.5.1(2010-09)
EN 301 357-2 V1.4.1(2008-11)
EN 302 291-2 V1.1.1(2005-07)
EN 302 623 V1.1.1(2009-01)
EN 50566:2013/AC:2014
EN 50385:2002
EN 55024:2010
EN 61000-3-3:2008
EN 55020:2007+A11:2011
Regulation (EC) No. 1275/2008
2009/125/EC-ErP Directive
EN 60950-1: 2006 / A2: 2013
EN 60950-1: 2006 / A12: 2011
2014/35/EU-LVD Directive
EN 300 328 V1.8.1(2012-06)
EN 300 440-1 V1.6.1(2010-08)
EN 300 440-2 V1.4.1(2010-08)
EN 301 511 V9.0.2(2003-03)
EN 301 908-1 V6.2.1(2013-04)
EN 301 908-2 V6.2.1(2013-10)
EN 301 908-13 V6.2.1(2014-02)
EN 301 893 V1.7.1(2012-06)
EN 300 330-2 V1.5.1(2010-02)
EN 50360:2001/A1:2012
EN 62479:2010
EN 62311:2008
1999/5/EC-R&TTE Directive
EN 55022:2010+AC:2011
EN 61000-3-2:2006+A2:2009
EN 55013:2001+A1:2003+A2:2006
2004/108/EC-EMC Directive
conform with the essential requirements of the following directives:
Model name :
Product name :
Motherboard
ASUS COMPUTER GmbH
Address, City:
declare the following apparatus:
4F, No. 150, LI-TE Rd., PEITOU, TAIPEI 112, TAIWAN
Address:
Manufacturer:
Authorized representative in Europe:
ASUSTeK COMPUTER INC.
EC Declaration of Conformity
We, the undersigned,
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