ICES 668
COM Express Type 6 Basic Module with Intel® QM77,
Intel® 3rd Generation Core™ i7/i5/i3 Processors with ECC
Main Features
ŒŒ Embedded Intel® 3rd generation Core™ i7/i5/i3 processor,
Ivy Bridge Mbl + ECC
ŒŒ Intel® QM77 PCH chipset support PICMG COM.0 Rev. 2.0
Type 6 pin-outs
ŒŒ Support Dual channel DDR3 with ECC SO-DIMMs 1333/1600MHz
up to 16GB
ŒŒ Support PCIex16, 7 x PCIex1, 4 x USB3.0/8 x USB2.0, 2 x SATA 3.0/2
x SATA 2.0 and GbE
ŒŒ Up to 3 x Independent Displays, VGA, Dual Channels 18/24-bit
LVDS, DVI, HDMI, DisplayPort
ŒŒ Dimension 95mm (W) x 125mm (L)
Product Overview
The ICES 668 is a Type 6 pin-outs COM Express Basic module featuring Intel® QM77 PCH chipset supports Intel® 3rd generation Intel® Core™ processor
with Dual DDR3 SO-DIMM socket up to 16GB DDR3 1333/1600MHz SDRAM with ECC support. The ICES 668 integrated Intel ® HD graphics with
DX11 support or expands via PCI Express Graphic 1 x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG
COM.0 Rev. 2.0 specification. It allows type 6 pin-out Carrier board to implement HDMI, DVI, Display Port, SDVO and legacy VGA, 18/24 bits LVDS interface.
The high performance ICES 668 COM Express Basic Module supports 4 x USB3.0/8 x USB2.0, 2 x SATA 3.0/2 x SATA 2.0 and 7 x PCIex1 lanes through our
NEXCOM in-house designed ICEB 8060 evaluation carrier MB as well as customized solution for your embedded OEM/ODM projects.
Specifications
CPU Support
Audio
ŒŒ Support Intel® BGA 1023, 3rd generation Intel® Core™ processor
-- Intel® Core™ i7 3615QE (4C/6M cache/2.3GHz/Max. TDP 45W)
-- Intel® Core™ i7 3555LE (2C/4M cache/2.5GHz/Max. TDP 25W)
-- Intel® Core™ i7 3517UE (2C/4M cache/1.7GHz/Max. TDP 17W)
-- Intel® Core™ i3 3217UE (2C/3M cache/1.6GHz/Max. TDP 17W)
-- Intel® Core™ i5 3610ME (2C/3M cache/2.7GHz/Max. TDP 35W)
ŒŒ HD audio interface
Main Memory
ŒŒ Dual DDR3/SO-DIMMs, support 1333/1600MHz ECC system memory
up to 16GB
Platform Control Hub
ŒŒ Intel® QM77 PCH chipset
BIOS
ŒŒ AMI System UEFI BIOS
ŒŒ Plug and play support
ŒŒ Advanced power management and advanced configuration & power
interface support
Display
ŒŒ
ŒŒ
ŒŒ
ŒŒ
Intel® HD graphics with DX11 support up to triple independent displays
One PCI Express x16 Lane down to the carried board
Supports VGA and single/dual channel s 18/24 bit LVDS interface
3 x DDI (Digital Display Interface) supports HDMI/DVI, DisplayPort and
SVDO interfaces
COM Express
On-board LAN
ŒŒ Intel® 82579LM Gigabit Ethernet, support iAMT 8.0
ŒŒ Support PXE boot from LAN, wake on LAN function
ŒŒ Signals down to I/O board
COM Express Connector
ŒŒ AB
VGA/LVDS/8 x USB2.0/2 x Serial Port/HD Audio/4 x SATA/GbE/GPIO/
LPC bus, 1 x PCIex4/2 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out
ŒŒ CD
PCIex16/3 x DDI/4 x USB3.0/1 x PCIex1
Power Requirements
ŒŒ +12V, +5VSB, +3.3V RTC power
Dimensions
ŒŒ 95mm (W) x 125mm (L)
Environment
ŒŒ Board level operating temperatures: 0°C to 60°C
ŒŒ Storage temperatures: -20°C to 80°C
ŒŒ Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
www.nexcom.com
Block Diagram
DDR3 Channel A
DDR3 CH A
DDR3 1066/1333 MHz ECC DIMM0
GFXCORE
DDR3 CH B
DDR3 Channel B
DDR3 1066/1333 MHz ECC DIMM1
31 x 24 mm (BGA1023)
PCIex16
Vcore
IMVP 7
CORE POWER
Ivy Bridge
FDI
PCIex16 BUS
DMI
Flexible
DMI(X4)
Display
LPC BUS
DISPLAY
PORT D
USB3.0
DISPLAY PORT B
USB3.0 BUS
PORT:0-3
PCIE*1 BUS
PORT:7
25 x 25 mm
FCBGA(Mobile only)
PCIE BUS
USB (12)
USB2.0 BUS
DISPLAY PORT C
LPC
PORT:0-7
LVDS
QM77
PORT C
LVDS BUS
DISPLAY PORT D
DISPLAY
PORT:A.B
DMI
Panther Point
PORT B
SATA BUS
FDI
DISPLAY
HDA
VGA
HDA BUS
PORT:0-3
SATA
VGA BUS
COM Express connector C and D
COM Express connector A and B
Interface
PCIE BUS
SMBUS
SPI
LPC TO COM
SERIAL PORT:1.2
F81216
PCI-E*1 BUS PORT:1,2,3,4,5,6
TYPE 6
BIOS
HWM
INTEL WG82579LM
MDI BUS
GbE PHY
NCT7802Y
PCI-E*1 BUS PORT:8
iAMT
TYPE 6
SPI ROM
SMBUS
SPI BUS
Certifications
ŒŒ Meet CE
ŒŒ FCC Class A
Ordering Information
ŒŒ ICES 668-3610ME (P/N: 10K00066806X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation
Intel® Core™ i5-3610ME (2 x 2.7GHz, 3MB Cache, 35W) processor, ECC
DDR3/2 x SO-DIMMs
ŒŒ ICES 668-3615QE (P/N: 10K00066805X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation
Intel® Core™ i7-3615QE (4 x 2.3GHz, 6MB Cache, 45W) processor, ECC
DDR3/2 x SO-DIMMs
ŒŒ ICES 668-3555LE (P/N: 10K00066804X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation
Intel® Core™ i7-3555LE (2 x 2.5GHz, 4MB Cache, 25W) processor, ECC
DDR3/2 x SO-DIMMs
ŒŒ ICES 668-3517UE (P/N: 10K00066803X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation
Intel® Core™ i7-3517UE (2 x 1.7GHz, 4MB Cache, 17W) processor, ECC
DDR3/2 x SO-DIMMs
ŒŒ ICES 668-3217UE (P/N: 10K00066801X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation
Intel® Core™ i3-3217UE (2 x 1.6GHz, 3MB Cache, 17W) processor, ECC
DDR3/2 x SO-DIMMs
ŒŒ ICES 668 F- kit (P/N: 10K00066807X0)
Active Fan Kits with heat- spreader, heat-sink and cooling fan for
ICES 668 series
ŒŒ ICEB 8060 (P/N: 10KB0806000X0) RoHS Compliant
COM Express Type 6, COM.0 Rev. 2.0 Evaluation CRB, 3 x DDI/VGA/
LVDS/4 x USB3.0/8 x USB2.0/6 x COM/2 xGbE/5.1 HD, SPDIF/2 x
SATA3.0/mSATA/CFast/PCIex16/PCIex4/PCIex1/mPCIe, ATX power
input
COM Express
We reserve the right to change specifications and product descriptions at any time without prior notice.
Last update: 03/05/2014