Texas Instruments | LMV71x-N Low-Power, RRIO Operational Amplifiers With High Output Current Drive and Shutdown Option (Rev. K) | Datasheet | Texas Instruments LMV71x-N Low-Power, RRIO Operational Amplifiers With High Output Current Drive and Shutdown Option (Rev. K) Datasheet

Texas Instruments LMV71x-N Low-Power, RRIO Operational Amplifiers With High Output Current Drive and Shutdown Option (Rev. K) Datasheet
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LMV710-N, LMV711-N, LMV715-N
SNOS519K – APRIL 2000 – REVISED AUGUST 2016
LMV71x-N Low-Power, RRIO Operational Amplifiers
With High Output Current Drive and Shutdown Option
1 Features
3 Description
•
•
•
•
•
•
•
The LMV710-N, LMV711-N, and LMV715-N are
BiCMOS operational amplifiers with a CMOS input
stage. These devices have greater than RR input
common mode voltage range, rail-to-rail output and
high output current drive. They offer a bandwidth of
5 MHz and a slew rate of 5 V/µs.
1
•
•
•
•
Low Offset Voltage: 3 mV (Maximum)
Gain-Bandwidth Product: 5 MHz (Typical)
Slew Rate: 5 V/µs (Typical)
Space-Saving Packages: 5-Pin and 6-Pin SOT-23
Turnon Time From Shutdown: <10 µs
Industrial Temperature Range: −40°C to 85°C
Supply Current in Shutdown Mode: 0.2 µA
(Typical)
Ensured 2.7-V and 5-V Performance
Unity Gain Stable
Rail-to-Rail Input and Output
Capable of Driving 600-Ω Load
On the LMV711 and LMV715, a separate shutdown
pin can be used to disable the device and reduces
the supply current to 0.2 µA (typical). They also
feature a turnon time of less than 10 µs. It is an ideal
solution for power-sensitive applications, such as
cellular phone, pager, palm computer, and so forth. In
addition, once the LMV715 is in shutdown the output
is tri-stated.
The LMV710 is offered in the space-saving, 5-pin
SOT-23 package. The LMV711 and LMV715 are
offered in the space saving 6-pin SOT-23 package.
2 Applications
•
•
•
•
•
•
•
Wireless Phones
GSM, TDMA, and CDMA Power Amp Controls
AGC and RF Power Detectors
Temperature Compensation
Wireless LAN
Bluetooth
HomeRF
The LMV71x-N devices are designed to meet the
demands of low power, low cost, and small size
required by cellular phones and similar batterypowered portable electronics.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMV710-N
SOT-23 (5)
2.92 mm × 1.50 mm
LMV711-N
LMV715-N
SOT-23 (6)
2.92 mm × 1.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic – LMV711
V+
Ip
VBIAS
IN-
IN+
Class AB
Control
IN
VBIAS
OUT
(LMV711 ONLY)
V-
SD
Bias
Control
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMV710-N, LMV711-N, LMV715-N
SNOS519K – APRIL 2000 – REVISED AUGUST 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
4
5
6
6
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Electrical Characteristics – 2.7 V ..............................
Electrical Characteristics – 3.2 V ..............................
Electrical Characteristics – 5 V .................................
Typical Characteristics ..............................................
Detailed Description ............................................ 14
7.1 Overview ................................................................ 14
7.2 Functional Block Diagram ....................................... 14
7.3 Feature Description ................................................ 14
7.4 Device Functional Modes ....................................... 16
8
Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Applications ................................................ 19
9 Power Supply Recommendations...................... 22
10 Layout................................................................... 22
10.1 Layout Guidelines ................................................ 22
10.2 Layout Example ................................................... 22
11 Device and Documentation Support ................. 23
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
Device Support ....................................................
Documentation Support .......................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
23
23
23
23
23
23
24
24
12 Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision J (March 2013) to Revision K
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
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SNOS519K – APRIL 2000 – REVISED AUGUST 2016
5 Pin Configuration and Functions
LMV710 DBV Package
5-Pin SOT-23
Top View
LMV711, LMV715 DBV Package
6-Pin SOT-23
Top View
Pin Functions
PIN
NAME
TYPE (1)
DESCRIPTION
DBV (5)
DBV (6)
+IN
3
3
I
Noninverting input
–IN
4
4
I
Inverting input
Output
1
1
O
Output
Shutdown
—
5
I
Active low enable input
V+
5
6
P
Positive supply input
V–
2
2
P
Supply negative input
(1)
I = Input, O = Output, P = Power
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SNOS519K – APRIL 2000 – REVISED AUGUST 2016
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
Differential input voltage
MAX
UNIT
±Supply voltage
(V–) − 0.4
(V+) + 0.4
V
5.5
V
Current at input pin
±10
mA
Mounting temperature, infrared or convection (20 sec)
235
°C
150
°C
150
°C
Voltage at input or output pin
+
−
Supply voltage (V - V )
Output short circuit to V+
See (3)
Output short circuit to V−
See (4)
Junction temperature, TJ(MAX)
(5)
Storage temperature, Tstg
(1)
(2)
(3)
(4)
(5)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Shorting circuit output to V+ will adversely affect reliability.
Shorting circuit output to V− will adversely affect reliability.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) – T A) / RθJA. All numbers apply for packages soldered directly into a PCB.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
Human-body model (HBM) (1) (2)
±2000
Machine model (MM) (3)
±100
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
Human-body model, 1.5 kΩ in series with 100 pF.
Machine model, 0 Ω in series with 100 pF.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
Supply voltage
2.7
5
UNIT
V
Temperature
–40
85
°C
6.4 Thermal Information
THERMAL METRIC (1)
LMV710-N
LMV711-N
LMV715-N
DBV (SOT-23)
DBV (SOT-23)
DBV (SOT-23)
5 PINS
6 PINS
6 PINS
265
265
265
°C/W
UNIT
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
131.6
139
156.6
°C/W
RθJB
Junction-to-board thermal resistance
35.1
38.5
32.8
°C/W
ψJT
Junction-to-top characterization parameter
22.2
28.6
34
°C/W
ψJB
Junction-to-board characterization parameter
34.5
37.9
32.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
—
—
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SNOS519K – APRIL 2000 – REVISED AUGUST 2016
6.5 Electrical Characteristics – 2.7 V
TJ = 25°C, V+ = 2.7 V, V− = 0 V, VCM = 1.35 V, and RL > 1 MΩ (unless otherwise noted)
PARAMETER
VOS
Input offset voltage
IB
Input bias current
CMRR
PSRR
Common-mode
rejection ratio
Power supply rejection ratio
Input common-mode
voltage range
VCM
TEST CONDITIONS
VCM = 0.85 V and
VCM = 1.85 V
TYP (2)
0.4
TJ = –40°C to 85°C
MAX (1)
3
3.2
4
50
TJ = –40°C to 85°C
45
2.7 V ≤ V+ ≤ 5 V,
VCM = 0.85 V
TJ = 25°C
70
TJ = –40°C to 85°C
68
2.7 V ≤ V+ ≤ 5 V,
VCM = 1.85 V
TJ = 25°C
70
0 V ≤ VCM ≤ 2.7 V
For CMRR ≥ 50 dB
Output short-circuit current
Sinking, VO = 2.7 V
VO
TJ = 25°C
TJ = 25°C
Sourcing, VO = 0 V
ISC
MIN (1)
TJ = –40°C to 85°C
V–
15
TJ = –40°C to 85°C
12
TJ = 25°C
25
RL = 10 kΩ to 1.35 V
VID = 100 mV
RL = 10 kΩ to 1.35 V
VID = –100 mV
TJ = 25°C
RL = 600 Ω to 1.35 V
VID = 100 mV
TJ = 25°C
RL = 600 Ω to 1.35 V
VID = –100 mV
TJ = 25°C
Output swing
TJ = –40°C to 85°C
dB
110
dB
95
–0.3
2.9
V
28
mA
40
22
2.62
2.68
2.6
0.01
TJ = –40°C to 85°C
TJ = –40°C to 85°C
pA
75
3
TJ = 25°C
TJ = 25°C
mV
68
–0.2
V+
TJ = –40°C to 85°C
UNIT
0.12
0.15
2.52
2.55
V
2.5
0.05
TJ = –40°C to 85°C
0.23
0.3
VO(SD)
Output voltage level in
shutdown mode
LMV711 only
50
IO(SD)
Output leakage current in
shutdown mode
LMV715 only
1
pA
CO(SD)
Output capacitance in
shutdown mode
LMV715 only
32
pF
IS
Supply current
ON mode
TJ = 25°C
1.22
TJ = –40°C to 85°C
SR
Slew rate (3)
GBWP
Gain-bandwidth product
φm
Phase margin
TON
Turnon time from shutdown
(1)
(2)
(3)
0.002
Sourcing, RL = 10 kΩ,
VO = 1.35 V to 2.3 V
TJ = 25°C
80
TJ = –40°C to 85°C
76
Sinking, RL = 10 kΩ,
VO = 0.4 V to 1.35 V
TJ = 25°C
80
TJ = –40°C to 85°C
76
Sourcing, RL = 600 Ω,
VO = 1.35 V to 2.2 V
TJ = 25°C
80
TJ = –40°C to 85°C
76
Sinking, RL = 600 Ω,
VO = 0.5 V to 1.35 V
TJ = 25°C
80
TJ = –40°C to 85°C
76
Large signal voltage
1.7
1.9
Shutdown mode, VSD = 0 V
AV
200
10
mV
mA
µA
115
113
110
dB
100
5
V/µs
5
MHz
60
°
<10
µs
All limits are specified by testing or statistical analysis.
Typical values represent the most likely parametric norm.
Number specified is the slower of the positive and negative slew rates.
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Electrical Characteristics – 2.7 V (continued)
TJ = 25°C, V+ = 2.7 V, V− = 0 V, VCM = 1.35 V, and RL > 1 MΩ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VSD
Shutdown pin voltage range
en
Input-referred voltage noise
ON mode
Shutdown mode
MIN (1)
TYP (2)
MAX (1)
2.4
1.5
2.7
0
1
0.8
f = 1 kHz
20
UNIT
V
nV/√Hz
6.6 Electrical Characteristics – 3.2 V
TJ = 25°C, V+ = 3.2 V, V− = 0 V, and VCM = 1.6 V (unless otherwise noted)
PARAMETER
IO = 6.5 mA
VO
MIN (1)
TYP (2)
TJ = 25°C
2.95
3
TJ = –40°C to 85°C
2.92
TEST CONDITIONS
Output Swing
TJ = 25°C
0.01
TJ = –40°C to 85°C
(1)
(2)
MAX (1)
0.18
UNIT
V
0.25
All limits are specified by testing or statistical analysis.
Typical values represent the most likely parametric norm.
6.7 Electrical Characteristics – 5 V
TJ = 25°C, V+ = 5 V, V− = 0 V, VCM = 2.5 V, and RL > 1 MΩ (unless otherwise noted)
PARAMETER
VOS
Input offset voltage
IB
Input bias current
CMRR
PSRR
Common-mode
rejection ratio
Power supply rejection ratio
Input common-mode
voltage range
VCM
TEST CONDITIONS
VCM = 0.85 V and
VCM = 1.85 V
0.4
3
TJ = 25°C
TJ = –40°C to 85°C
3.2
4
50
TJ = –40°C to 85°C
48
2.7 V ≤ V+ ≤ 5 V,
VCM = 0.85 V
TJ = 25°C
70
TJ = –40°C to 85°C
68
2.7 V ≤ V+ ≤ 5 V,
VCM = 1.85 V
TJ = 25°C
70
0 V ≤ VCM ≤ 5 V
For CMRR ≥ 50 dB
Output short-circuit current
Sinking, VO = 5 V
VO
MAX (1)
TJ = 25°C
Sourcing, VO = 0 V
ISC
MIN (1) TYP (2)
TJ = –40°C to 85°C
V–
TJ = 25°C
25
TJ = –40°C to 85°C
21
TJ = 25°C
25
TJ = 25°C
RL = 10 kΩ to 2.5 V
VID = –100 mV
TJ = 25°C
RL = 600 Ω to 2.5 V
VID = 100 mV
TJ = 25°C
RL = 600 Ω to 2.5 V
VID = –100 mV
TJ = 25°C
Output swing
110
–0.3
V
mA
40
4.98
4.9
TJ = –40°C to 85°C
0.12
0.15
4.82
4.85
V
4.8
0.05
TJ = –40°C to 85°C
0.23
0.3
VO(SD)
LMV711 only
50
IO(SD)
Output leakage current in
shutdown mode
LMV715 only
1
6
5.2
35
Output voltage level in
shutdown mode
(1)
(2)
dB
95
0.01
TJ = –40°C to 85°C
dB
21
4.92
TJ = –40°C to 85°C
pA
70
5.3
TJ = –40°C to 85°C
mV
68
–0.2
V+
RL = 10 kΩ to 2.5 V
VID = 100 mV
UNIT
200
mV
pA
All limits are specified by testing or statistical analysis.
Typical values represent the most likely parametric norm.
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Electrical Characteristics – 5 V (continued)
TJ = 25°C, V+ = 5 V, V− = 0 V, VCM = 2.5 V, and RL > 1 MΩ (unless otherwise noted)
PARAMETER
CO(SD)
Output capacitance in
shutdown mode
IS
Supply current
TEST CONDITIONS
MIN (1) TYP (2)
LMV715 only
ON mode
TJ = 25°C
1.17
TJ = –40°C to 85°C
SR
Slew rate (3)
GBWP
Gain-bandwidth product
φm
Phase margin
TON
Turnon time from shutdown
VSD
Shutdown pin voltage range
en
Input-referred voltage noise
(3)
0.2
Sourcing, RL = 10 kΩ,
VO = 2.5 V to 4.6 V
80
TJ = –40°C to 85°C
76
Sinking, RL = 10 kΩ,
VO = 0.4 V to 2.5 V
TJ = 25°C
80
TJ = –40°C to 85°C
76
Sourcing, RL = 600 Ω,
VO = 2.5 V to 4.5 V
TJ = 25°C
80
TJ = –40°C to 85°C
76
Sinking, RL = 600 Ω,
VO = 0.5 V to 2.5 V
TJ = 25°C
80
TJ = –40°C to 85°C
76
ON mode
Shutdown mode
f = 1 kHz
pF
1.7
mA
1.9
TJ = 25°C
Large signal voltage gain
UNIT
32
Shutdown mode
AV
MAX (1)
10
µA
123
120
dB
110
118
5
V/µs
5
MHz
60
°
<10
µs
2.4
2
5
0
1.5
0.8
20
V
nV/√Hz
Number specified is the slower of the positive and negative slew rates.
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6.8 Typical Characteristics
VS = 5 V, single supply, TA = 25°C (unless otherwise noted)
8
Figure 1. Supply Current
vs Supply Voltage (ON Mode)
Figure 2. LMV711, LMV715 Supply Current
vs Supply Voltage (Shutdown Mode)
Figure 3. Output Positive Swing vs Supply Voltage
Figure 4. Output Negative Swing vs Supply Voltage
Figure 5. Output Positive Swing vs Supply Voltage
Figure 6. Output Negative Swing vs Supply Voltage
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Typical Characteristics (continued)
VS = 5 V, single supply, TA = 25°C (unless otherwise noted)
Figure 7. Output Positive Swing vs Supply Voltage
Figure 8. Output Negative Swing vs Supply Voltage
Figure 9. Input Voltage Noise vs Frequency
Figure 10. PSRR vs Frequency
Figure 11. CMRR vs Frequency
Figure 12. LMV711 and LMV715 Turnon Characteristics
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Typical Characteristics (continued)
VS = 5 V, single supply, TA = 25°C (unless otherwise noted)
10
Figure 13. Sourcing Current vs Output Voltage
Figure 14. Sinking Current vs Output Voltage
Figure 15. Thd+N vs Frequency (VS = 5 V)
Figure 16. Thd+N vs Frequency (VS = 2.7 V)
Figure 17. Thd+N vs VOUT
Figure 18. Thd+N vs VOUT
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Typical Characteristics (continued)
VS = 5 V, single supply, TA = 25°C (unless otherwise noted)
Figure 19. CCM vs VCM
Figure 20. CCM vs VCM
Figure 21. CDIFF vs VCM (VS = 2.7 V)
Figure 22. CDIFF vs VCM (VS = 5 V)
Figure 23. Open-Loop Frequency Response
Figure 24. Open-Loop Frequency Response
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Typical Characteristics (continued)
VS = 5 V, single supply, TA = 25°C (unless otherwise noted)
12
Figure 25. Open-Loop Frequency Response
Figure 26. Open-Loop Frequency Response
Figure 27. Open-Loop Frequency Response
Figure 28. Open-Loop Frequency Response
Figure 29. Noninverting Large
Signal Pulse Response
Figure 30. Noninverting Small
Signal Pulse Response
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Typical Characteristics (continued)
VS = 5 V, single supply, TA = 25°C (unless otherwise noted)
Figure 31. Inverting Large-Signal Pulse Response
Figure 32. Inverting Small-Signal Pulse Response
Figure 33. VOS vs VCM
Figure 34. VOS vs VCM
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7 Detailed Description
7.1 Overview
The LMV710-N, LMV711-N, and LMV715-N operational amplifiers provide a CMOS input stage, high current
drive rail-to-rail output, and a greater than RR input common mode voltage range. They also provide a slew rate
of 5 V/µs at a bandwidth of 5 MHz.
7.2 Functional Block Diagram
V+
Ip
VBIAS
IN-
IN+
Class AB
Control
IN
OUT
VBIAS
(LMV711 ONLY)
V-
SD
Bias
Control
Copyright © 2016, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Supply Bypassing
The application circuits in this datasheet do not show the power supply connections and the associated bypass
capacitors for simplification. When the circuits are built, it is always required to have bypass capacitors. Ceramic
disc capacitors (0.1 µF) or solid tantalum (1 µF) with short leads, and located close to the IC are usually
necessary to prevent interstage coupling through the power supply internal impedance. Inadequate bypassing
will manifest itself by a low frequency oscillation or by high frequency instabilities. Sometimes, a 10-µF (or larger)
capacitor is used to absorb low frequency variations and a smaller 0.1-µF disc is paralleled across it to prevent
any high frequency feedback through the power supply lines.
7.3.2 Shutdown Mode
The LMV711 and LMV715 have a shutdown pin. To conserve battery life in portable applications, they can be
disabled when the shutdown pin voltage is pulled low. For LMV711 during shutdown mode, the output stays at
about 50 mV from the lower rail, and the current drawn from the power supply is 0.2 µA (typical). This makes the
LMV711 an ideal solution for power sensitive applications. For the LMV715 during shutdown mode, the output is
tri-stated.
The shutdown pin must never be left unconnected. In applications where shutdown operation is not required and
the LMV711 or LMV715 is used, the shutdown pin must be connected to V+. Leaving the shutdown pin floating
results in an undefined operation mode and the device may oscillate between shutdown and active modes.
14
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Feature Description (continued)
7.3.3 Rail-to-Rail Input
The rail-to-rail input is achieved by using paralleled PMOS and NMOS differential input stages (see Functional
Block Diagram). When the common mode input voltage changes from ground to the positive rail, the input stage
goes through three modes. First, the NMOS pair is cutoff and the PMOS pair is active. At around 1.4 V, both
PMOS and NMOS pairs operate, and finally the PMOS pair is cutoff and NMOS pair is active. Because both
input stages have their own offset voltage (VOS), the offset of the amplifier becomes a function of the commonmode input voltage (see Figure 33 and Figure 34 in Typical Characteristics).
As shown in the curve, the VOS has a crossover point at 1.4 V above V–. Proper design must be done in both
DC- and AC-coupled applications to avoid problems. For large input signals that include the VOS crossover point
in their dynamic range, it causes distortion in the output signal. One way to avoid such distortion is to keep the
signal away from the crossover point. For example, in a unity-gain buffer configuration and with VS = 5 V, a 3-V
peak-to-peak signal center at 2.5 V contains input-crossover distortion. To avoid this, the input signal must be
centered at 3.5 V instead. Another way to avoid large signal distortion is to use a gain of −1 circuit which avoids
any voltage excursions at the input terminals of the amplifier (see Figure 35). In this circuit, the common-mode
DC voltage (VCM) can be set at a level away from the VOS crossover point.
Figure 35. Inverting Configuration
When the input is a small signal and this small signal falls inside the VOS transition range, the gain, CMRR and
some other parameters is degraded. To resolve this problem, the small signal must be placed such that it avoids
the VOS crossover point.
To achieve maximum output swing, the output must be biased at mid-supply. This is normally done by biasing
the input at mid-supply. But with supply voltage range from 2 V to 3.4 V, the input of the op amp must not be
biased at mid-supply because of the transition of the VOS. Figure 36 shows an example of how to get away from
the VOS crossover point and maintain a maximum swing with a 2.7-V supply. Figure 37 shows the waveforms of
VIN and VOUT.
Figure 36. Vout biasing Example
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Feature Description (continued)
Figure 37. Vout biasing Output Results
The inputs can be driven 300 mV beyond the supply rails without causing phase reversal at the output. However,
the inputs must not be allowed to exceed the maximum ratings.
7.4 Device Functional Modes
7.4.1 Compensation of Input Capacitance
In the application (Figure 38) where a large feedback resistor is used, the feedback resistor can react with the
input capacitance of the op amp and introduce an additional pole to the close loop frequency response.
Figure 38. Cancelling the Effect of Input Capacitance
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Device Functional Modes (continued)
This pole occurs at frequency fp with Equation 1.
fP =
1
2p(RIN P RF )CIN
(1)
Any stray capacitance due to external circuit board layout, any source capacitance from transducer or
photodiode connected to the summing node is added to the input capacitance. If fp is less than or close to the
unity-gain bandwidth (5 MHz) of the op amp, the phase margin of the loop is reduced and can cause the system
to be unstable.
To avoid this problem, make sure that fp occurs at least 2 octaves beyond the expected −3 dB frequency corner
of the close loop frequency response. If not, a feedback capacitor CF can be placed in parallel with RF such that
Equation 2.
1
1
=
2pRFCF 2p(RIN P RF ) (CF + CIN )
(2)
The paralleled RF and CF introduce a zero, which cancels the effect from the pole.
7.4.2 Capacitive Load Tolerance
The LMV71x-N can directly drive 200 pF in unity-gain without oscillation. The unity-gain follower is the most
sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers.
The combination of the amplifier's output impedance and the capacitive load induces phase lag. This results in
either an underdamped pulse response or oscillation. To drive a heavier capacitive load, circuit in Figure 39 can
be used.
Figure 39. Indirectly Driving a Capacitive Load Using Resistive Isolation
In Figure 39, the isolation resistor RISO and the load capacitor CL form a pole to increase stability by adding more
phase margin to the overall system. The desired performance depends on the value of RISO. The bigger the RISO
resistor value, the more stable VOUT is. But the DC accuracy is not great when the RISO gets bigger. If there were
a load resistor in Figure 39, the output would be voltage divided by RISO and the load resistor.
The circuit in Figure 40 is an improvement to the one in Figure 39 because it provides DC accuracy as well as
AC stability. In this circuit, RF provides the DC accuracy by using feed-forward techniques to connect VIN to RL.
CF and RISO serve to counteract the loss of phase margin by feeding the high-frequency component of the output
signal back to the inverting input of the amplifier, thereby preserving phase margin in the overall feedback loop.
Increased capacitive drive is possible by increasing the value of CF . This in turn slows down the pulse response.
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Device Functional Modes (continued)
Figure 40. Indirectly Driving a Capacitive a Load With DC Accuracy
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LMV71x family of amplifiers features low voltage, low power, and rail-to-rail output operational amplifiers
designed for low-voltage portable applications.
8.2 Typical Applications
8.2.1 High-Side Current-Sensing
V
+
+
R1
±
2 kŸ
RSENSE
±
0.2
Q1
2N3906
R2
+
2 kŸ
VOUT
Load
R3
10 kŸ
ICHARGE
VOUT
RSENSE x R3
x ICh arg e 1 : x ICh arg e
R1
Copyright © 2016, Texas Instruments Incorporated
Figure 41. High-Side, Current-Sensing Schematic
8.2.1.1 Design Requirements
The high-side, current-sensing circuit (Figure 41) is commonly used in a battery charger to monitor charging
current to prevent over charging. A sense resistor RSENSE is connected to the battery directly. This system
requires an op amp with rail-to-rail input. The LMV71x are ideal for this application because its common-mode
input range goes up to the rail.
8.2.1.2 Detailed Design Procedure
As seen in (Figure 41), the ICHARGE current flowing through sense resistor RSENSE develops a voltage drop equal
to VSENSE. The voltage at the negative sense point is now less than the positive sense point by an amount
proportional to the VSENSE voltage.
The low-bias currents of the LMV71x cause little voltage drop through R2, so the negative input of the LMV71x
amplifier is at essentially the same potential as the negative sense input.
The LMV71x detects this voltage error between its inputs and servo the transistor base to conduct more current
through Q1, increasing the voltage drop across R1 until the LMV71x inverting input matches the noninverting
input. At this point, the voltage drop across R1 now matches VSENSE.
IG, a current proportional to ICHARGE, flows according to Equation 3.
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Typical Applications (continued)
IG = VRSENSE / R1 = ( RSENSE × ICHARGE ) / R1
(3)
IG also flows through the gain resistor R3 developing a voltage drop equal to Equation 4.
V3 = IG × R3 = ( VRSENSE / R1 ) × R3 = ( ( RSENSE × ICHARGE ) / R2 ) × R3
VOUT = (RSENSE × ICHARGE ) × G
(4)
where
•
G = R3 / R1
(5)
The other channel of the LMV71x may be used to buffer the voltage across R3 to drive the following stages.
8.2.1.3 Application Curve
5
VOUT (V)
VOUT (V)
4
3
2
1
1
2
3
4
5
ILOAD (A)
C003
Figure 42. High-Side Current-Sensing Results
8.2.2 Peak Detector
R4
10 k
R2
V+
10 k
V+
-
R1
VIN
D1
R3
LMV71x
(A1)
+
LMV71x
(A2)
VO
+
1N914A
R5
C1
10 k
10 k
Reset
2N2945
Copyright © 2016, Texas Instruments Incorporated
Figure 43. Peak Detector
8.2.2.1 Design Requirements
A peak detector outputs a DC voltage equal to the peak value of the applied AC signal. Peak detectors are used
in many applications, such as test equipment, measurement instrumentation, ultrasonic alarm systems, and so
forth. Figure 43 shows the schematic diagram of a peak detector using LMV71x-N. This peak detector basically
consists of a clipper, a parallel RC network, and a voltage follower.
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Typical Applications (continued)
8.2.2.2 Detailed Design Procedure
An AC voltage source applied to VIN charges capacitor C1 to the peak of the input. Diode D1 conducts positive
half cycles, charging C1 to the waveform peak. Including D1 inside the feedback loop of the amplifier removes
the voltage drop of D1 and allows an accurate peak detection of VIN on C1. When the input waveform falls below
the DC peak stored on C1, D1 is reverse biased. The low input bias current of A1 and the reverse biasing of D1
limits current leakage from C1. As a result, C1 retains the peak value even as the waveform drops to zero. A2
further isolates the peak value on C1 while completing the peak detector circuit by operating as a voltage
follower and reporting the peak voltage of C1 at its output.
R5 and C1 are properly selected so that the capacitor is charged rapidly to VIN. During the holding period, the
capacitor slowly discharge through C1, through leakage of the capacitor and the reverse-biased diode, or op amp
bias currents. In any cases the discharging time constant is much larger than the charge time constant. And the
capacitor can hold its voltage long enough to minimize the output ripple.
Resistors R2 and R3 limit the current into the inverting input of A1 and the noninverting input of A2 when power
is disconnected from the circuit. The discharging current from C1 during power off may damage the input circuitry
of the op amps.
The peak detector is reset by applying a positive pulse to the reset transistor. The charge on the capacitor is
dumped into ground, and the detector is ready for another cycle.
The maximum input voltage to this detector must be less than (V+ – VD), where VD is the forward voltage drop of
the diode. Otherwise, the input voltage must be scaled down before applying to the circuit.
8.2.3 GSM Power Amplifier Control Loop
GSM
ANTENNA
U1
U2
GSM PA
C2
RF Signal
Input
Output
Directional Coupler
IN OUT
C3
Coupled
VPC
VCC
R2
R1
VCC
R3
C4
Load
R5
BIAS
Schottky Diode
Detector
V+
±
OUT
SD
+
V-
U3
RLOAD
C5
R4
Shut Down
Ramp
Up/Down
Copyright © 2016, Texas Instruments Incorporated
Figure 44. GSM P.A. Control Loop
8.2.3.1 Design Requirements
The control loop in Figure 44 controls the output power level of a GSM mobile phones. The control loop is used
to avoid intermodulation of Base Station receivers, to prevent intermodulation with other mobile phones, and to
minimize power consumption depending on the distance between mobile and base station
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Typical Applications (continued)
8.2.3.2 Detailed Design Procedure
There are four critical sections in the GSM Power Amplifier Control Loop. The class-C RF power amplifier
provides amplification of the RF signal. A directional coupler couples small amount of RF energy from the output
of the RF P. A. to an envelope detector diode. The detector diode senses the signal level and rectifies it to a DC
level to indicate the signal strength at the antenna. An op amp is used as an error amplifier to process the diode
voltage and ramping voltage. This loop control the power amplifier gain through the op amp and forces the
detector diode voltage and ramping voltage to be equal. Power control is accomplished by changing the ramping
voltage.
The LMV71x-N are well suited as an error amplifier in this application. The LMV711 or LMV715 have an extra
shutdown pin to switch the op amp to shutdown mode. In shutdown mode, the LMV711 or LMV715 consume
very low current. The LMV711 provides a ground voltage to the power amplifier control pin VPC. Therefore, the
power amplifier can be turned off to save battery life. The LMV715 output is tri-stated when in shutdown.
9 Power Supply Recommendations
For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, TI
recommends that 10-nF capacitors be placed as close as possible to the power supply pins of the operational
amplifier. For single supply, place a capacitor between V+ and V– supply leads. For dual supplies, place one
capacitor between V+ and ground, and one capacitor between V– and ground.
10 Layout
10.1 Layout Guidelines
To properly bypass the power supply, several locations on a printed-circuit board must be considered. A 6.8-µF
or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is introduced
onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power supply pin of
the amplifier. If the amplifier is operated in a single power supply, only the V+ pin requires a bypass with a 0.1-µF
capacitor. If the amplifier is operated in a dual power supply, both V+ and V– pins must be bypassed. It is good
practice to use a ground plane on a printed-circuit board to provide all components with a low inductive ground
connection.
10.2 Layout Example
Rf
Cf
V+
Cbyp
GND
OUTPUT
GND
SHDN
INPUT
Rin
Figure 45. LMV711 Layout Example
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SNOS519K – APRIL 2000 – REVISED AUGUST 2016
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
For development support see the following:
• LMV710 PSPICE Model (applicable for LMV711 and LMV715)
• SPICE-based analog simulation program, TINA-TI
• DIP adapter evaluation module, DIP Adapter EVM
• TI universal operational amplifier evaluation module, Op Amp EVM
• TI software, FilterPro
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation see the following:
• Absolute Maximum Ratings for Soldering (SNOA549)
• AN-29 IC Op Amp Beats FETs on Input Current (SNOA624)
• AN-31 Op Amp Circuit Collection (SNLA140)
• AN-71 Micropower Circuits Using the LM4250 Programmable Op Amp (SNOA652)
• AN-127 LM143 Monolithic High Voltage Operational Amplifier Applications (SNVA516)
11.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LMV710-N
Click here
Click here
Click here
Click here
Click here
LMV711-N
Click here
Click here
Click here
Click here
Click here
LMV715-N
Click here
Click here
Click here
Click here
Click here
11.4 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.5 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.6 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
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11.7 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
24
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMV710M5
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 85
A48A
LMV710M5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
A48A
LMV710M5X/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
A48A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2017
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LMV710M5
SOT-23
DBV
5
1000
178.0
8.4
LMV710M5/NOPB
SOT-23
DBV
5
1000
178.0
LMV710M5X/NOPB
SOT-23
DBV
5
3000
178.0
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV710M5
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMV710M5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMV710M5X/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
5
2X 0.95
1.9
1.45
0.90
3.05
2.75
1.9
2
4
0.5
5X
0.3
0.2
3
(1.1)
C A B
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214839/E 09/2019
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X(0.95)
4
3
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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