Texas Instruments | OPA657-DIE 1.6-GHz, Low-Noise, FET-Input Operational Amplifier | Datasheet | Texas Instruments OPA657-DIE 1.6-GHz, Low-Noise, FET-Input Operational Amplifier Datasheet

Texas Instruments OPA657-DIE 1.6-GHz, Low-Noise, FET-Input Operational Amplifier Datasheet
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OPA657-DIE
SBOS787 – AUGUST 2016
OPA657-DIE 1.6-GHz, Low-Noise, FET-Input Operational Amplifier
1 Features
3 Description
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•
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The OPA657 device combines a high gain-bandwidth,
low-distortion, voltage-feedback operational amplifier
with a low voltage noise JFET-input stage to offer a
very high dynamic range amplifier for high-precision
analog-to-digital converter (ADC) driving or wideband
transimpedance applications. Photodiode applications
achieve improved noise and bandwidth using this
decompensated, high gain-bandwidth amplifier.
1
High Gain Bandwidth Product: 1.6 GHz
High Bandwidth 275 MHz (G = 10)
Slew Rate 700 V/µs (G = 10, 1-V Step)
Low-Input Offset Voltage: ±250 µV
Low-Input Bias Current: 2 pA
Low-Input Voltage Noise: 4.8 nV/√Hz
High-Output Current: 70 mA
Fast Overdrive Recovery
Very low level signals can be significantly amplified in
a single OPA657 gain stage with exceptional
bandwidth and accuracy. The very low input bias
current and capacitance supports this performance
even for relatively high source impedance.
Broadband photodetector applications benefit from
the low voltage noise JFET inputs for the OPA657.
The JFET input contributes virtually no current noise,
which makes the device ideal for high-gain
photodiode applications.
2 Applications
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•
•
•
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(1)
(2)
Wideband Photodiode Amplifiers
Wafer Scanning Equipment
ADC Input Amplifiers
Test and Measurement Front Ends
High Gain Precision Amplifiers
Optical Time Domain Reflectometry (OTDR)
Ordering Information (1)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
OPA657
TD
Bare Die in Gel Pak VR (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
OPA657TD1
324
OPA657TD2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
OPA657-DIE
SBOS787 – AUGUST 2016
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4 Bare Die Information
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
15 mils.
Silicon with backgrind
VS-
TiW/AlCu (0.5%)
1100 nm
Bond Pad Coordinates in Microns (1)
(1)
2
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
Inverting input
1
27
623
127
723
NonInverting input
2
27
53
127
153
N/C
3
181
53
281
153
Output
4
723
27
823
127
VS–
5
723
337
823
439
VS+
6
723
649
823
749
N/C
7
181
623
281
723
Substrate is VS–.
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: OPA657-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA657TD1
ACTIVE
0
324
TBD
Call TI
Call TI
-40 to 85
OPA657TD2
ACTIVE
0
120
TBD
Call TI
Call TI
-40 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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