Texas Instruments | TLV370x-Q1 Nanopower Push-Pull Output Comparators (Rev. E) | Datasheet | Texas Instruments TLV370x-Q1 Nanopower Push-Pull Output Comparators (Rev. E) Datasheet

Texas Instruments TLV370x-Q1 Nanopower Push-Pull Output Comparators (Rev. E) Datasheet
TLV3701-Q1
TLV3702-Q1
TLV3704-Q1
SGLS154E − NOVEMBER 2000 − REVISED MAY 2010
FAMILY OF NANOPOWER PUSH-PULL OUTPUT COMPARATORS
FEATURES
D Qualified for Automotive Applications
D ESD Protection Exceeds 2000 V Per
D
D
D
D
D
D
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
800
I CC − Supply Current/Ch − nA
D
D
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Low Supply Current . . . 560 nA/Per Channel
Input Common-Mode Range Exceeds the
Rails . . . −0.1 V to VCC + 5 V
Supply Voltage Range . . . 2.7 V to 16 V
Reverse Battery Protection Up to 18 V
Push-Pull CMOS Output Stage
Specified Temperature Range
− −40°C to 125°C − Automotive Grade
Ultrasmall Packaging
− 5-Pin SOT-23 (TLV3701)
Universal Op-Amp EVM (Reference SLOU060
for more information)
TA = 125°C
700
TA = 70°C
600
TA = 25°C
500
TA = 0°C
400
TA = −40°C
300
200
VID = −1 V
100
0
APPLICATIONS
D Low Power Automotive Electronics
D Security Detection Systems
2
4
6
8
10
12
14
16
VCC − Supply Voltage − V
high side voltage sense circuit
R1
1 MΩ
DESCRIPTION
The TLV370x is Texas Instruments’ first family of
nanopower comparators with only 560 nA per channel
supply current, which make this device ideal for low
power applications.
R3
100 kΩ
VCC +
TLV370X
R2
1 MΩ
Vref
0
µP
D1
0
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2010, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
TLV3701-Q1
TLV3702-Q1
TLV3704-Q1
SGLS154E − NOVEMBER 2000 − REVISED MAY 2010
DESCRIPTION (continued)
The TLV370x has a minimum operating supply voltage of 2.7 V over the extended automotive temperature range
(TA = −40°C to 125°C), while having an input common-mode range of −0.1 to VCC + 5 V. The low supply current makes
it an ideal choice for low power applications where quiescent current is the primary concern. Reverse battery
protection guards the amplifier from an over-current condition due to improper battery installation. For harsh
environments, the inputs can be taken 5 V above the positive supply rail without damage to the device.
Devices are available in SOIC with the singles in the small SOT-23 package. Other package options may be made
available upon request.
A SELECTION OF OUTPUT COMPARATORS†
†
DEVICE
VCC
(V)
VIO
(µV)
ICC/Ch
(µA)
IIB
(pA)
tPLH
(µs)
tPHL
(µs)
tf
(µs)
tr
(µs)
RAIL-TORAIL
OUTPUT
STAGE
TLV370x
2.5 − 16
250
0.56
80
56
83
22
8
I
PP
TLV340x
2.5 − 16
250
0.47
80
55
30
5
−
I
OD
TLC3702/4
3 − 16
1200
9
5
1.1
0.65
0.5
0.125
−
PP
TLC393/339
3 − 16
1400
11
5
1.1
0.55
0.22
−
−
OD
TLC372/4
3 − 16
1000
75
5
0.65
0.65
−
−
−
OD
All specifications are typical values measured at 5 V.
TLV3701 AVAILABLE OPTIONS†
PACKAGED DEVICES‡
TA
VIOmax
AT 25°C
- 40°C to 125°C
5000 µV
SMALL OUTLINE
(D)
TLV3701QDRQ1§
SOT-23
(DBV)¶
SYMBOL
TLV3701QDBVRQ1
VBCQ
†
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see
the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
§ Product Preview
¶ This package is only available taped and reeled with standard quantities of 3000 pieces per reel.
TLV3702 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
−40°C to 125°C
5000 µV
SMALL OUTLINE
(D)
TLV3702QDRQ1
TLV3704 AVAILABLE OPTIONS
PACKAGED DEVICES
†
2
TA
VIOmax
AT 25°C
−40°C to 125°C
5000 µV
Product Preview
www.ti.com
SMALL OUTLINE
(D)
TLV3704QDRQ1†
SYMBOL
3702Q1
TLV3701-Q1
TLV3702-Q1
TLV3704-Q1
SGLS154E − NOVEMBER 2000 − REVISED MAY 2010
TLV3701
D PACKAGE
(TOP VIEW)
TLV3701
DBV PACKAGE
(TOP VIEW)
OUT
GND
IN+
1
5
VCC
NC
IN −
IN +
GND
2
3
4
IN −
1
8
2
7
3
6
4
5
TLV3702
D PACKAGE
(TOP VIEW)
NC
VCC
OUT
NC
1OUT
1IN −
1IN +
GND
1
8
2
7
3
6
4
5
VCC
2OUT
2IN −
2IN+
TLV3704
D PACKAGE
(TOP VIEW)
1OUT
1IN −
1IN+
VCC
2IN+
2IN −
2OUT
1
14
2
13
3
12
4
11
5
10
6
9
7
8
4OUT
4IN −
4IN+
GND
3IN+
3IN −
3OUT
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 V
Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 V
Input voltage range, VI (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 5 V
Input current range, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA
Output current range, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: Q suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to GND.
2. Input voltage range is limited to 20 V max or VCC + 5 V, whichever is smaller.
DISSIPATION RATING TABLE
PACKAGE
θJC
(°C/W)
θJA
(°C/W)
TA ≤ 25°C
POWER RATING
TA = 125°C
POWER RATING
D (8)
38.3
176
710 mW
142 mW
D (14)
26.9
122.6
1022 mW
204.4 mW
DBV (5)
55
324.1
385 mW
77.1 mW
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3
TLV3701-Q1
TLV3702-Q1
TLV3704-Q1
SGLS154E − NOVEMBER 2000 − REVISED MAY 2010
recommended operating conditions
Single supply
Supply voltage
voltage, VCC
Split supply
Common-mode input voltage range, VICR
Operating free-air temperature, TA
Q-suffix
MIN
MAX
2.7
16
UNIT
±1.35
±8
−0.1
VCC+5
V
−40
125
°C
V
electrical characteristics at specified operating free-air temperature, VCC = 2.7 V, 5 V, 15 V (unless
otherwise noted)
dc performance
PARAMETER
TEST CONDITIONS
TA†
MIN
25°C
VIO
Input offset voltage
αVIO
Offset voltage drift
RS = 50 Ω
VIC = VCC/2,
CMRR
AVD
†
Common mode rejection ratio
Common-mode
RS = 50 Ω
VIC = 0 to 5 V
V,
RS = 50 Ω
VIC = 0 to 15 V
V,
RS = 50 Ω
Large-signal differential voltage
amplification
MAX
250
5000
Full range
7000
25°C
VIC = 0 to 2.7
2 7 V,
V
TYP
55
Full range
50
25°C
60
Full range
55
25°C
65
Full range
60
25°C
V
µV
µV/°C
3
25°C
UNIT
72
76
dB
88
1000
V/mV
Full range is − 40°C to 125°C for Q suffix.
input/output characteristics
PARAMETER
TEST CONDITIONS
TA†
MIN
25°C
IIO
Input offset current
/2
VIC = VCC/2,
IIB
Input bias current
ri(d)
Differential input resistance
VIC = VCC/2,
†
4
IOH = 2 µA, VID = 1 V
High-level output voltage
/2
VIC = VCC/2,
VOL
Low-level output
p voltage
g
MAX
20
100
Full range
1000
25°C
80
Full range
VIC = VCC/2,
VOH
RS = 50 Ω
TYP
VIC = VCC/2,
/2
300
25°C
VCC−
0.08
25°C
VCC−
320
Full range
VCC−
450
50 µA,
A VID = 1 V
IOH = −50
IOH = 2 µA, VID = −1 V
IOH = 50 µA,
µA VID = −1
1V
Full range is − 40°C to 125°C for Q suffix.
www.ti.com
pA
MΩ
mV
25°C
8
25°C
80
Full range
pA
250
2000
25°C
UNIT
200
300
mV
TLV3701-Q1
TLV3702-Q1
TLV3704-Q1
SGLS154E − NOVEMBER 2000 − REVISED MAY 2010
electrical characteristics at specified operating free-air temperature, VCC = 2.7 V, 5 V, 15 V (unless
otherwise noted) (continued)
power supply
PARAMETER
TA†
TEST CONDITIONS
MIN
25°C
ICC
PSRR
Supply current (per channel)
Power supply rejection ratio
Output state high
VCC = 5 V to 15 V
†
560
Full range
VCC = 2
2.7
7 V to 5 V
VIC = VCC/2 V,
No load
TYP
MAX
800
1200
25°C
75
Full range
70
25°C
85
Full range
80
UNIT
nA
100
dB
105
Full range is − 40°C to 125°C for Q suffix.
switching characteristics at recommended operating conditions, VCC = 2.7 V, 5 V, 15 V, TA = 25°C
(unless otherwise noted)
PARAMETER
t(PLH)
TEST CONDITIONS
Propagation
P
ti response titime, llow-to-high-level
t hi h l
l
output (see Note 3)
MIN
TYP
Overdrive = 2 mV
240
Overdrive = 10 mV
64
MAX
UNIT
150†
t(PHL)
P
ti response titime, hi
ht l
l
l
Propagation
high-to-low-level
output (see Note 3)
f = 1 kHz,
VSTEP = 100 mV,
CL = 10 pF,
pF
VCC = 2.7 V,
VIC = VCC/2
tr
Rise time
CL = 10 pF,
VCC = 2.7 V
7
µs
tf
Fall time
CL = 10 pF,
VCC = 2.7 V
9
µs
Overdrive = 50 mV
36
Overdrive = 2 mV
167
Overdrive = 10 mV
67
Overdrive = 50 mV
37
µss
150†
NOTE 3: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. Propagation
responses are longer at higher supply voltages, refer to Figures 11−16 for further details.
† This limit applies to the TLV3701-Q1 only.
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Input bias/offset current
vs Free-air temperature
VOL
Low-level output voltage
vs Low-level output current
2, 4, 6
VOH
High-level output voltage
vs High-level output current
3, 5, 7
ICC
Supply current
vs Supply voltage
Output fall time/rise time
1
8
vs Free-air temperature
9
vs Supply voltage
10
Low-to-high level output response for various input overdrives
11, 13, 15
High-to-low level output response for various input overdrives
12, 14, 16
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5
TLV3701-Q1
TLV3702-Q1
TLV3704-Q1
SGLS154E − NOVEMBER 2000 − REVISED MAY 2010
TYPICAL CHARACTERISTICS
INPUT BIAS/OFFSET CURRENT
vs
FREE-AIR TEMPERATURE
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
2.7
VOL − Low-Level Output Voltage − V
VCC = 15 V
1000
800
IIB
600
400
200
IIO
0
VCC = 2.7 V
VID = −1 V
2.4
TA = 125°C
2.1
TA = 70°C
1.8
TA = 25°C
1.5
1.2
TA = 0°C
0.9
0.6
TA = −40°C
0.3
0.0
−200
−40 −25 −10 5 20 35 50 65 80 95 110 125
TA − Free-Air Temperature − °C
0
0.1
0.2
Figure 1
TA = −40°C
TA = 0°C
1.8
1.5
TA = 25°C
1.2
0.9
TA = 70°C
0.6
0.3
TA = 125°C
0.0
VCC = 5 V
VID = −1 V
4.5
4
TA = 125°C
3.5
TA = 70°C
3
2.5
2
TA = 25°C
1.5
TA = 0°C
1
TA = −40°C
0.5
0
IOH − High-Level Output Current − mA
0.4
0.8
TA = 70°C
TA = 25°C
6
4.5
TA = 0°C
3
TA = −40°C
1.5
0
1
2
3
4
5
6
7
8
IOL − Low-Level Output Current − mA
Figure 6
6
VOH − High-Level Output Voltage − V
VOL − Low-Level Output Voltage − V
TA = 125°C
7.5
0
1.2
1.6
2.0
2.4
TA = −40°C
TA = 0°C
3
TA = 25°C
2.5
2
TA = 70°C
1.5
1
TA = 125°C
0.5
0
2.8
0.2 0.4
Figure 5
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
800
9
TA = 125°C
TA = 0°C
13.5
12
TA = −40°C
10.5
9
TA = 25°C
7.5
6
TA = 70°C
4.5
3
TA = 125°C
VCC = 15 V
VID = −1 V
1.5
0
0.6 0.8 1.0 1.2 1.4 1.6 1.8
IOH − High-Level Output Current − mA
15
VCC = 15 V
VID = −1 V
9
4
3.5
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
15
12
VCC = 5 V
VID = −1 V
Figure 4
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
10.5
0.8
4.5
IOL − Low-Level Output Current − mA
Figure 3
13.5
0.7
0
0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45
I CC − Supply Current/Ch − nA
0
0.6
5
5
VOL − Low-Level Output Voltage − V
VOH − High-Level Output Voltage − V
2.1
0.5
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
VCC = 2.7 V
VID = −1 V
2.4
0.4
Figure 2
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
2.7
0.3
IOL − Low-Level Output Current − mA
VOH − High-Level Output Voltage − V
I IB / I IO − Input Bias/Offset Current − pA
1200
0
1
2
700
TA = 70°C
600
TA = 25°C
500
TA = 0°C
400
TA = −40°C
300
200
VID = −1 V
100
3
4
5
6
7
8
IOH − High-Level Output Current − mA
Figure 7
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9
0
2
4
6
8
10
12
VCC − Supply Voltage − V
Figure 8
14
16
TLV3701-Q1
TLV3702-Q1
TLV3704-Q1
SGLS154E − NOVEMBER 2000 − REVISED MAY 2010
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
OUTPUT RISE/FALL TIME
vs
SUPPLY VOLTAGE
120
VCC = 2.7 V, 5 V, 15 V
VID = −1 V
600
t r(f) − Output Rise/Fall Time − µ s
I CC − Supply Current /Ch − nA
700
500
400
300
200
100
VID= 1 V to −1 V
Input Rise/Fall Time = 4 µs
CL = 10 pF
TA = 25°C
100
80
60
Fall Time
40
20
Rise Time
0
20 35 50 65 80 95 110 125
0
TA − Free-Air Temperature − °C
Figure 9
V O − Output Voltage − V
VO − Output Voltage − V
15
HIGH-TO-LOW LEVEL OUTPUT RESPONSE
FOR VARIOUS INPUT OVERDRIVES
50 mV
2 mV
10 mV
0
VCC = 2.7 V
CL = 10 pF
TA = 25°C
3
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
−0.3
−0.05
−0.10
−0.15
25 50 75 100125150175200225250275300
50 mV
2 mV
10 mV
0.15
VID − Differential
Input Voltage − V
0.05
0
5
7.5
10
12.5
VCC − Supply Voltage − V
Figure 10
LOW-TO-HIGH OUTPUT RESPONSE
FOR VARIOUS INPUT OVERDRIVES
3
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
2.5
VCC = 2.7 V
CL = 10 pF
TA = 25°C
0.10
0.05
0
−0.05
0 25 50 75 100125150175200225250275300
VID − Differential
Input Voltage − V
0
−40 −25 −10 5
Figure 12
LOW-TO-HIGH LEVEL OUTPUT RESPONSE
FOR VARIOUS INPUT OVERDRIVES
HIGH-TO-LOW LEVEL OUTPUT RESPONSE
FOR VARIOUS INPUT OVERDRIVES
6
5
4
3
2
50 mV
10 mV
2 mV
1
0
VCC = 5 V
CL = 10 pF
TA = 25°C
−0.05
−0.10
−0.15
0 25 50 75 100125150175200225250275300
Input Voltage − V
0.05
VID − Differential
0
6
5
4
50 mV
3
2
2 mV
10 mV
1
0
VCC = 5 V
CL = 10 pF
TA = 25°C
0.10
0.05
0
−0.05
0 25 50 75 100125150175200225250275300
t − Time − µs
VID − Differential
Input Voltage − V
V O − Output Voltage − V
t − Time − µs
Figure 11
V O − Output Voltage − V
t − Time − µs
t − Time − µs
Figure 13
Figure 14
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7
TLV3701-Q1
TLV3702-Q1
TLV3704-Q1
SGLS154E − NOVEMBER 2000 − REVISED MAY 2010
TYPICAL CHARACTERISTICS
2 mV
10 mV
VCC = 15 V
CL = 10 pF
TA = 25°C
0.04
0
−0.04
−0.08
−0.12
0 25 50 75 100125150175200225250275300
2 mV
0.12
0.08
0.04
0
−0.04
100 150 200 250 300 350 400
VCC = 15 V
CL = 10 pF
TA = 25°C
0
t − Time − µs
50
t − Time − µs
Figure 15
8
10 mV
Input Voltage − V
4
2
0
50 mV
Figure 16
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Input Voltage − V
50 mV
16
14
12
10
8
6
4
2
0
V ID − Differential
V O − Output Voltage − V
16
14
12
10
8
6
HIGH-TO-LOW LEVEL OUTPUT RESPONSE
FOR VARIOUS INPUT OVERDRIVES
V ID − Differential
V O − Output Voltage − V
LOW-TO-HIGH LEVEL OUTPUT RESPONSE
FOR VARIOUS INPUT OVERDRIVES
PACKAGE OPTION ADDENDUM
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25-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLV3701QDBVRG4Q1
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VBCQ
TLV3701QDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VBCQ
TLV3702QDRG4Q1
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
3702Q1
TLV3702QDRQ1
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
3702Q1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2019
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLV3701-Q1, TLV3702-Q1 :
• Catalog: TLV3701, TLV3702
• Enhanced Product: TLV3701-EP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TLV3701QDBVRG4Q1
SOT-23
DBV
5
3000
180.0
TLV3701QDBVRQ1
SOT-23
DBV
5
3000
TLV3702QDRG4Q1
SOIC
D
8
2500
TLV3702QDRQ1
SOIC
D
8
2500
B0
(mm)
K0
(mm)
P1
(mm)
9.0
3.15
3.2
1.4
4.0
180.0
9.0
3.15
3.2
1.4
330.0
12.5
6.4
5.2
2.1
330.0
12.5
6.4
5.2
2.1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
8.0
Q3
4.0
8.0
Q3
8.0
12.0
Q1
8.0
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV3701QDBVRG4Q1
SOT-23
DBV
5
3000
182.0
182.0
20.0
TLV3701QDBVRQ1
SOT-23
DBV
5
3000
182.0
182.0
20.0
TLV3702QDRG4Q1
SOIC
D
8
2500
340.5
338.1
20.6
TLV3702QDRQ1
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
5
2X 0.95
1.9
1.45
0.90
3.05
2.75
1.9
2
4
0.5
5X
0.3
0.2
3
(1.1)
C A B
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214839/E 09/2019
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X(0.95)
4
3
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
A
.004 [0.1] C
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.150
[3.81]
.189-.197
[4.81-5.00]
NOTE 3
4X (0 -15 )
4
5
B
8X .012-.020
[0.31-0.51]
.010 [0.25]
C A B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 -8
.016-.050
[0.41-1.27]
DETAIL A
(.041)
[1.04]
TYPICAL
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
6X (.050 )
[1.27]
SYMM
5
4
(R.002 ) TYP
[0.05]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
.0028 MAX
[0.07]
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED
METAL
.0028 MIN
[0.07]
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
6X (.050 )
[1.27]
SYMM
5
4
(R.002 ) TYP
[0.05]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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