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Texas Instruments THS3491RGT EVM User guides
User's Guide
SLOU483 – August 2017
THS3491RGT Evaluation Module
This document provides information about the evaluation module of the amplifier under test. Additionally,
this document provides a good example of printed-circuit board (PCB) design for high-speed applications.
Remember the following points:
• TI recommends initially reviewing the data sheet of the device under test.
• Review the schematic and layout of the THS3491RGT EVM to determine the design techniques used
in the evaluation board.
• The high-speed amplifier PCB design should be approached with care and special attention must be
provided to the board parasitic which impacts the overall system performance.
1
2
3
4
5
Contents
Introduction ...................................................................................................................
EVM Default Configuration .................................................................................................
Using the THS3491 EVM ...................................................................................................
High-Speed Amplifier PCB Layout Tips...................................................................................
EVM Hardware Description .................................................................................................
2
3
5
6
7
List of Figures
1
THS3491RGT EVM Default Configuration Setup Block Diagram ..................................................... 3
2
Output Interface to the Measuring Instrument ........................................................................... 4
3
Full Schematic of the THS3491RGT EVM ............................................................................... 9
4
Top Components and Silk Screen Layer................................................................................ 10
5
Layer 2 - GND .............................................................................................................. 10
6
Layer 3 - GND .............................................................................................................. 11
7
Layer 4 - GND/Signal ...................................................................................................... 11
8
Layer 5 - GND .............................................................................................................. 12
9
Layer 6 - GND .............................................................................................................. 12
10
Layer 7 - GND .............................................................................................................. 13
11
Bottom Components and Silk Screen Layer ............................................................................ 13
List of Tables
1
THS3491RGT EVM Bill of Materials ...................................................................................... 7
Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
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1
Introduction
1
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Introduction
The Texas Instruments THS3491RGT evaluation module (EVM) helps designers evaluate the
performance of the THS3491 high-speed, high-voltage, and low-distortion current feedback amplifier in a
16-pin RGT package. This document details the THS3491RGT EVM and should be a good starting point
for high-speed PCB design involving the THS3491RGT device. The document includes a brief description
of the module and a list of EVM features, followed by EVM specifications and default EVM configuration,
details on connecting and using the EVM, and a discussion of high-speed amplifier PCB design
considerations.
1.1
Description
The THS3491RGT evaluation module (EVM) is used to evaluate the THS3491 device, which is a highspeed, high-voltage and low-distortion current-feedback amplifier in a 16-pin RGT package. The EVM is
designed to quickly and easily demonstrate the functionality and performance of THS3491 in a gain of 5 V
/ V, driving an equivalent RLOAD = 100 Ω. The EVM is ready to connect to power supplies, signal source,
and test instruments through the use of onboard connectors. The board is set up for single-ended input
and output operation for interfacing with 50-Ω test equipment. By default, the THS3491EVM comes with a
heat-sink attached on the bottom of the board directly underneath the device that helps in the overall
device thermal dissipation for high-output voltage swings.
1.2
Evaluation Module Features
The THS3491 high-speed operational amplifier EVM features include:
• Configured for split-supply operation and easily modified for single supply
• Designed for single-ended 50-Ω input and output connection
• Configured for non-inverting gain of 5 V / V configuration and easily modified for inverting gain
configuration
• Simple interface to the inputs and outputs through the SMA connectors
• Heat-sink on the bottom of the board to help with the overall device thermal dissipation for high-output
voltage swings
1.3
THS3491 Operating Conditions
Supply voltage range, ±VCC = ±7 to ±16 Vdc (see the device data sheet for min and max values).
Supply current, IQ = 17.4 mA (see the device data sheet for min and max values).
For complete THS3491 amplifier IC specifications, parameter measurement information, and additional
application information, see the THS3491 data sheet (SBOS875).
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EVM Default Configuration
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2
EVM Default Configuration
As delivered, the EVM has a fully functional example circuit; just provide power supplies, a signal source,
and a measuring instrument as shown in Figure 1. Some components, such as supply bypass capacitors
and test points, are omitted on the application schematics of Figure 1 for clarity.
See Figure 3 for the default schematic diagram of the THS3491RGT EVM.
+/-15V Split Bench
Power Supply
Signal Generator
THS3491RGT EVM
(VS+)
(VS-)
GND
-15V
+15V
50 Q
Source
Oscilloscope
0Q
J1
124 Q
50 Q
499 Q
FB
50 Q
Term
240Q
ININ+
J2
+
OUT
THS3491RGT
287Q
240Q
287Q
J3
54.9Q
50Q
Voltage Gain = +5 V/V or 14 dB
Voltage Gain = 0.0436 V/V or -27.2 dB
Figure 1. THS3491RGT EVM Default Configuration Setup Block Diagram
2.1
Standard Non-Inverting Gain Configuration
The THS3491RGT EVM default configuration is a single-ended input, single-ended output non-inverting
gain of 5 from SMA input (J2) to the THS3491 device output pins as shown in Figure 1. The default
configuration for non-inverting gain of 5 is determined by R3, and R4 in Figure 3. This gain is calculated
according to Equation 1 that is given below for non-inverting op-amp.
where
•
•
2.2
RF = 499 Ω
RG = 124 Ω
(1)
Output Voltage Loss Calculation to the Measuring Instrument
The THS3491RGT device output is driving an equivalent RLOAD = 100 Ω determined by the output series
and parallel matching resistor network as shown in Figure 2. The output resistor network affects the
voltage that is measured at the SMA connector (J3). The designer should take into account the voltage
division from the device output to the SMA connector (J3) which is approximately 0.0436 or -27.2 dB given
by Equation 2. As a result, an overall voltage gain of –13.2 dB is achieved from SMA connector J2 to J3
for single-ended 50-Ω input and output.
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EVM Default Configuration
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Remember, the output resistor network is only present to protect the measuring instrument from being
over-driven by the device output for high-output signal swings. Desoldering the output matching resistor
and replacing it with a single 50-Ω series output resistor that gives only 6-dB output voltage loss at the
measuring instrument is easily done.
Measuring Instrument
240Q
THS3491RGT OUT
287Q
240Q
287Q
J3
54.9Q
50 Q Term
Figure 2. Output Interface to the Measuring Instrument
(2)
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Using the THS3491 EVM
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3
Using the THS3491 EVM
This section describes how to connect the THS3491 EVM to test equipment. TI recommends connecting
the EVM as described in this section to avoid damage to the EVM or the THS3491 installed on the board.
CAUTION
Caution hot surface. The PCB surface can get very
hot while passing high-output voltage swings.
Contact may cause burns. Do not touch
3.1
Required Equipment
The following equipment is required:
• Dual dc output power supply (±15 V, 200-mA output minimum).
• Two dc current meters with resolution to 1 mA and capable of a maximum current which the dc power
supply can supply. If available, set the current limit on the dc power supply to 200 mA.
NOTE: Some power supplies incorporate current meters which may be applicable to this test.
•
•
3.2
50-Ω source impedance signal generator (10 MHz, up to 4 VPP sine wave).
Oscilloscope (100-MHz bandwidth minimum, 50-Ω terminated BNC input).
Power Supply Setup (Reference Figure 1)
Use the following procedure for power supply setup:
• Before connecting the power supply cables to the EVM, set the dual dc output power supply to ±15 V.
• Make sure the dc power supply is turned off before proceeding to the next step.
• Connect the +15-V power supply to the +Vs of the power supply port on the EVM.
• Connect the –15-V power supply to the -Vs of the power supply port on the EVM.
• Connect the grounds of the +15-V and –15-V power supply to the GND port on the EVM.
• Make sure the dc current meters on the dual dc output power supply are set to at least 1-mA resolution
and are set to 200-mA minimum output current capability.
• Turn-on the dual dc power supply to ±15 V
3.3
Input and Output Test Setup (Reference Figure 1)
Use the following procedure for input and output test setup:
• Set the signal generator to a 10 MHz, ±1.14 V (2.28 VPP or 11.1 dBm) sine wave with no dc offset. The
signal generator output should be set in 50-Ω termination mode.
• Turn off the signal generator before proceeding to the next step.
• Connect the signal generator output to SMA connector J2 on the EVM.
• Oscilloscope channel 1 should be connected to SMA connector J3 on the EVM. Set the oscilloscope to
500 mV / division and a time-base of 1 μs / division.
NOTE: The oscilloscope must be set in a 50-Ω termination for proper operation.
•
Turn on the signal generator. The measured output on the scope channel 1 at SMA connector J3
should approximately be ±250 mV (500 mVPP).
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High-Speed Amplifier PCB Layout Tips
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High-Speed Amplifier PCB Layout Tips
The THS3491 EVM layout, designed for use with high-speed signals, can be used as an example when
designing PCBs incorporating the THS3491. Careful attention has been given to component selection,
grounding, power supply bypassing, and signal path layout. Disregarding these basic design
considerations could result in less than optimum performance of the THS3491 high-speed operational
amplifier. Surface-mount components were selected because of the extremely low lead inductance
associated with this technology. This helps minimize both stray inductance and capacitance. Also,
because surface-mount components are physically small, the layout can be very compact.
Tantalum power supply bypass capacitors at the power input pads help filter switching transients from the
laboratory power supply. Power supply bypass capacitors are placed as close as possible to the IC power
input pins to minimize the return path impedance. This improves high-frequency bypassing and reduces
harmonic distortion. The GND side of these capacitors should be located close to each other, minimizing
the differential current loops associated with differential output currents. If poor high-frequency
performance is observed, replace the 0.1-μF capacitors with microwave capacitors with a self-resonance
at the frequency that produces trouble. A proper ground plane on both sides of the PCB should be used
with high-speed circuit design. This provides low-inductive ground connections for return current paths.
In the area of the amplifier input pins, the ground plane has been removed to minimize stray capacitance
and to reduce ground plane noise coupling into these pins. This is especially important for the inverting
input pin. A capacitance as low as 1 pF at the inverting input can significantly affect the response of the
amplifier or even cause oscillation.
In general, it is best to keep signal lines as short and as straight as possible. Incorporation of microstrip or
stripline techniques is also recommended when signal lines are greater than 1 inch in length. These traces
must be designed with a characteristic impedance of either 50 Ω or 75 Ω, as required by the application.
Such a signal line must also be properly terminated with an appropriate resistor.
The PCB that is used with PowerPAD™ packages must have features included in the design to remove
the heat from the package efficiently. As a minimum, there must be an area of solder-tinned-copper
underneath the PowerPAD package. This area is called the thermal land. The thermal land varies in size
depending on the PowerPAD package being used, the PCB construction, and the amount of heat to be
removed. In addition, this thermal land may or may not contain thermal vias, depending on PCB
construction. The requirements for thermal lands and thermal vias are detailed in PowerPAD™Thermally
Enhanced Package (SLMA002) and PowerPAD™ Made Easy (SLMA004).
Finally, all inputs and outputs must be properly terminated, either in the layout or in the load
instrumentation. Unterminated lines, such as coaxial cable, can appear to be a reactive load to the
amplifier. By terminating a transmission line with its characteristic impedance, the load of the amplifier
then appears to be purely resistive, and reflections are absorbed at each end of the line. Another
advantage of using an output termination resistor is that capacitive loads are isolated from the amplifier
output. This isolation helps minimize the reduction in the phase-margin of the amplifier and improves the
amplifier stability, resulting in reduced peaking and settling times.
On boards operated from dual power supplies, it is helpful to place a capacitor directly across the positive
and negative power supplies. This helps the fully differential drive.
6
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EVM Hardware Description
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5
EVM Hardware Description
This section describes the EVM hardware. It includes the EVM parts list, and PCB layout.
5.1
Bill of Materials
Table 1 lists the EVM bill of materials.
Table 1. THS3491RGT EVM Bill of Materials
Item #
Designator
Qty
Part Number
Manufacturer
Description
HSP006
Any
Printed Circuit Board
4.7uF
GRM319R61H475KA12D00
MuRata
CAP, CERM, 4.7 µF, 50 V, ±10%, X5R, 1206
1206
1uF
C2012X5R1H105K125AB
TDK
CAP, CERM, 1 µF, 50 V, ±10%, X5R, 0805
0805
2
0.1uF
C0603C104Z3VACTU
Kemet
CAP, CERM, 0.1 µF, 25 V, +80/-20%, Y5V, 0603
0603
C7
1
0.01uF
06031C103KAT2A
AVX
CAP, CERM, 0.01 µF, 100 V, ±10%, X7R, 0603
0603
6
C8
1
0.1uF
GRM155R61E104KA87D
MuRata
CAP, CERM, 0.1 µF, 25 V, ±10%, X5R, 0402
0402
7
H1, H2, H3, H4
4
PMSSS 440 0025 PH
B&F Fastener Supply
Machine Screw Pan Phillips 4-40
Machine Screw, 4-40,
1/4 inch
8
H5, H6, H7, H8
4
2204
Keystone
Hex Standoff 4-40 Aluminum 3/4"
Hex Standoff 4-40
Aluminum 3/4 inch
9
H9
1
7109DG
Aavid
Surface mount heat sink for D2PAK
Surface mount heat
sink for D2PAK
10
J1, J2, J3
3
142-0701-851
Emerson Network Power
Connector, End launch SMA, 50 ohm, SMT
SMA End Launch
11
J4
1
SPC15363
Tenma
BANANA JACK, SOLDER LUG, RED, TH
Red Insulated Banana
Jack
12
J5
1
6095
Keystone
Standard Banana Jack, Uninsulated
Keystone_6095
13
J6
1
SPC15354
Tenma
BANANA JACK, SOLDER LUG, BLACK, TH
Black Insulated
Banana Jack
14
L1, L2
2
BLM21PG221SN1D
MuRata
Ferrite Bead, 220 ohm @ 100 MHz, 2 A, 0805
0805
15
LBL1
1
THT-14-423-10
Brady
Thermal Transfer Printable Labels, 0.650" W x 0.200" PCB Label 0.650"H x
H - 10,000 per roll
0.200"W
16
R1, R7
2
49.9
CRCW060349R9FKEA
Vishay-Dale
RES, 49.9, 1%, 0.1 W, 0603
0603
17
R2, R6, R8
3
0
CRCW06030000Z0EA
Vishay-Dale
RES, 0, 5%, 0.1 W, 0603
0603
18
R3
1
124
RC0603FR-07124RL
Yageo America
RES, 124, 1%, 0.1 W, 0603
0603
19
R4
1
499
RCS0603499RFKEA
Vishay-Dale
RES, 499, 1%, 0.25 W, 0603
0603
20
R9, R10
2
240
CRCW2512240RJNEG
Vishay-Dale
RES, 240, 5%, 1 W, AEC-Q200 Grade 0, 2512
2512
21
R11, R12
2
287
CRCW1206287RFKEA
Vishay-Dale
RES, 287, 1%, 0.25 W, 1206
1206
22
R13
1
54.9
CRCW060354R9FKEA
Vishay-Dale
RES, 54.9, 1%, 0.1 W, 0603
0603
23
TP1
1
TP105-01-09
Components Corporation
Test Point, Miniature, White, TH
Test-Point, Dia
100mil, TH
24
TP3
1
5000
Keystone
Test Point, Miniature, Red, TH
Red Miniature
Testpoint
1
!PCB1
1
2
C1, C2
2
3
C3, C4
2
4
C5, C6
5
Value
220 ohm
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Package Reference
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EVM Hardware Description
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Table 1. THS3491RGT EVM Bill of Materials (continued)
Item #
8
Designator
Qty
25
U1
1
26
C9
0
27
FID1, FID2, FID3,
FID4, FID5, FID6
0
28
R5
0
Value
100pF
49.9
Part Number
Manufacturer
Description
Package Reference
THS3491IRGT
Texas Instruments
High Voltage, Low Distortion, Current-Feedback
Amplifier, RGT0016A
RGT0016A
C0603C101J5GACTU
Kemet
CAP, CERM, 100 pF, 50 V, ±5%, C0G/NP0, 0603
0603
N/A
N/A
Fiducial mark. There is nothing to buy or mount.
Fiducial
CRCW060349R9FKEA
Vishay-Dale
RES, 49.9, 1%, 0.1 W, 0603
0603
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5.2
Schematic
Figure 3 illustrates the EVM schematic.
Figure 3. Full Schematic of the THS3491RGT EVM
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EVM Hardware Description
5.3
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Circuit Board Layout
Figure 4 through Figure 11 illustrate the EVM PCB layout.
Figure 4. Top Components and Silk Screen Layer
Figure 5. Layer 2 - GND
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Figure 6. Layer 3 - GND
Figure 7. Layer 4 - GND/Signal
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Figure 8. Layer 5 - GND
Figure 9. Layer 6 - GND
12
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Figure 10. Layer 7 - GND
Figure 11. Bottom Components and Silk Screen Layer
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13
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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