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Texas Instruments TSW3070EVM: Amplifier Interface to Current Sink DAC - (Rev. A) User guides
User's Guide
SLWU055A – May 2008 – Revised May 2016
TSW3070EVM: Amplifier Interface to Current Sink DAC Arbitrary Waveform Generator Demonstration
The TSW3070 is an evaluation module (EVM) that shows how to use an active interface with the current
sink output of the DAC5682Z. The EVM includes the DAC5682Z for digital-to-analog conversion, an
OPA695 to demonstrate an active interface implementation using a wide bandwidth operational amplifier
and a THS3091 and THS3095 to showcase an operational amplifier with large voltage swing. Also
included on board are a CDCM7005, VCXO and Reference for clock generation, and linear regulators for
voltage regulation. Communication to the EVM is accomplished via a USB interface and GUI software.
TSW3070EVM
1
2
3
4
5
Contents
TSW3070EVM Configuration Options .................................................................................... 3
1.1
DAC Component .................................................................................................... 3
1.2
Board Configuration ................................................................................................ 3
1.3
VCXO ................................................................................................................. 3
Block Diagrams .............................................................................................................. 4
2.1
System Block Diagram ............................................................................................. 4
Key Texas Instruments Components ..................................................................................... 4
3.1
CDCM7005 .......................................................................................................... 4
3.2
DAC5682Z ........................................................................................................... 4
3.3
TPS76xxx, TPS5430, UCC284-5 ................................................................................. 4
3.4
OPA695, THS3091, THS30915 ................................................................................... 5
Software Installation ......................................................................................................... 5
4.1
DAC5682Z USB Control Software Installation .................................................................. 5
4.2
DAC5682Z EVM Driver Installation............................................................................... 8
Software Introduction ........................................................................................................ 9
5.1
Modes of Operation ............................................................................................... 10
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TSW3070EVM (continued)
6
7
8
9
10
5.2
Software Boxes ....................................................................................................
5.3
Complete Software Overview ....................................................................................
TSW3070EVM Introduction ...............................................................................................
6.1
Jumper Settings ...................................................................................................
6.2
Input and Output Connectors ....................................................................................
6.3
USB Interface ......................................................................................................
6.4
Power Management...............................................................................................
Demonstration Kit Test Configuration Test Equipment 7.1 Test .....................................................
7.1
Test Setup ..........................................................................................................
7.2
Test Equipment ....................................................................................................
7.3
Calibration ..........................................................................................................
7.4
Typical Performance Measurements ...........................................................................
Initial Power Up and Test .................................................................................................
8.1
Initial Inspection ...................................................................................................
8.2
Engage Power Supplies ..........................................................................................
8.3
Verify Status of the Board ........................................................................................
8.4
Program the CDCM7005 .........................................................................................
8.5
Program the DAC5682Z ..........................................................................................
8.6
Program TSW3100 ................................................................................................
Optional Configurations....................................................................................................
9.1
External VCXO ....................................................................................................
9.2
Transformer Passive Output .....................................................................................
9.3
Higher Amplifier Voltage Supplies ..............................................................................
9.4
Baseband Filter ....................................................................................................
Schematic, Bill of Materials and Printed-Circuit Board Layout .......................................................
10.1 Design Resources .................................................................................................
10
13
17
17
17
18
18
18
18
18
18
19
23
23
23
23
23
24
24
25
25
25
26
27
27
27
List of Figures
1
Block Diagram................................................................................................................ 4
2
Home Menu Showing EVM Status ....................................................................................... 10
3
DAC5682Z Register Configuration and Block Diagram Menu
4
5
6
7
8
.......................................................
DAC5682Z Register and CDCM7005 Configuration Menu ...........................................................
DAC5682Z Register Configuration and TSW3100 Pattern Generator Control Menu. ............................
TSW3070EVM Driven by TSW3100 Pattern Generator ..............................................................
Typical THS3091 and THS3095 Voltage Output, Default Gain 3.3x ................................................
THS3091 and THS3095 With ±15-V External Supplies, 50-Ω Input, Gain at 10x .................................
11
12
13
18
19
19
9
THS3091 and THS3095 LPF Filter Shape Evaluated With Multi-tone Input Signal From the TSW3100
Pattern Generator .......................................................................................................... 20
10
OPA695 LPF Filter Shape Evaluated With Multi-tone Signal ........................................................ 20
11
IMD3 Plot for THS3095 .................................................................................................... 21
12
IMD3 Plot for OPA695 ..................................................................................................... 21
13
Summary of IMD3 for Passive Transformer, OPA695, THS3091, and THS3095 Output ........................ 22
14
Summary of Harmonic Distortion for Passive Transformer, OPA695, THS3091, and THS3095 Output ....... 22
15
CDCM7005, 800M VCXO, 10M Ref, Locked Condition LEDs ....................................................... 23
16
DAC5682 and CDCM7005 Example Register Settings ............................................................... 24
17
DAC5682Z Resistor Jumper Configuration ............................................................................. 25
18
Position of Ferrite Beads for Power Options............................................................................ 26
1
Software Main Settings .................................................................................................... 10
2
Software Box Descriptions ................................................................................................ 10
List of Tables
2
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TSW3070EVM (continued)
1
3
Software Feature Descriptions ........................................................................................... 13
4
Jumper List .................................................................................................................. 17
5
Input and Output Connections ............................................................................................ 17
6
Optional Output Signal Path .............................................................................................. 25
TSW3070EVM Configuration Options
The TSW3070EVM can be configured to evaluate the two active output stages. This section outlines the
various component configurations. Based on the configuration, testing and board setup must be altered to
accommodate the given components and features.
1.1
DAC Component
The TSW3070EVM uses the 1-GSPS LVDS DAC5682Z with a current sink output.
1.2
Board Configuration
The analog output of the DAC employs a current sink structure which requires the dc common mode of
the DAC to be kept at 3.3 V with a maximum compliance voltage at 3.8 V and a minimum voltage at 2.8 V.
The resistor bias network between the DAC5682Z and the OPA695 or THS3095 assume that the DAC
has maximum current set at 20 mA. For the OPA695 output stage, this network combined with the filter
termination provides a combined ac impedance of about 25 Ω, resulting in a maximum voltage of 500
mVpp on each DAC output pin. For the THS3091 and THS3095, the network is different and provides a
combined 50-Ω load, resulting in a 1-Vpp signal on each of the DAC output pins. By design, in order to
preserve the proper dc levels, the DAC coarse gain should be kept at the maximum (15), though deviation
by a few steps is generally acceptable with no degradation in performance.
The OPA circuits have been designed to have a combined output gain of 2.2x, whereas the THS3091 and
THS3095 circuit has a gain of 3.3x. The resistor networks and gain can be modified as necessary for
custom applications. However, special care must be taken to ensure that the 3.3-Vdc common mode
voltage is maintained at the DAC output and the DAC compliance voltages are met.
1.2.1
Using Optional Passive Transformer Output
The resistor network can be configured such that the DAC output is routed to a transformer which enables
measurements of the DAC output to be made using a passive transformer output. Either of the outputs
can be configured for this (see Section 9).
1.2.2
Using External Operational Amplifier Supplies
By default, both amplifiers are set up to operate with a ±5 V. This is adequate in most cases for evaluation
purposes. However, both the OPA695 and THS3095 can be operated at higher voltages; the OPA can be
used with a ±6-V supply, and the THS3095 can be used with a ±15-V supply. Ferrite beads allow the use
of a different ±Vamp supply for both amplifiers. If the THS3095 is being evaluated at voltages higher than
±6 V, the OPA695 power ferrite beads should be removed to isolate the OPA695 from the higher supply
voltages (see Section 9).
1.3
VCXO
The CDCM7005 requires a VCXO source to derive its output clock signals. The VCXO is at reference
designator U6. There is an onboard 10-MHz reference as well as an onboard 800-MHz VCXO. These can
be locked together using the CDCM7005 with the appropriate programming via the DAC5682Z GUI.
An external VCXO clock source can be used. In this mode, the CDCM7005 only acts as a clock divider or
buffer to provide the necessary clocks to the TSW3100 LVDS pattern generator, and sampling clock to the
DAC5682Z.
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Block Diagrams
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2
Block Diagrams
2.1
System Block Diagram
Figure 1 shows the functions on the TSW3070EVM board. The Texas Instruments ICs are listed on the
board for reference.
USB
Ext
CLK
PWR
CDCM 7005
VCXO
REF
DC regulation
TPS76XXX
TPS5430
UCC284
OPA 695
Amp
Out 1
DAC 5682
DAC
Input
In Dual
DAC 5681
mode
Xformer
THS3095
Xformer
Passive
Out 1
Amp
Out 2
Passive
Out 2
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Figure 1. Block Diagram
3
Key Texas Instruments Components
3.1
CDCM7005
The CDCM7005 clock distribution integrated circuit (IC) is used to generate and synchronize the clock
outputs to the system. The device has five outputs which can be either LVPECL or LVCMOS and can be
divided down by 1, 2, 3, 4, 6, 8, and 16. The divide by 16 can be replaced with a divide by 4 or 8 with a 90
degree phase shift, if desired. This device is used to lock the onboard 800-MHz VCXO and 10-MHz
reference. For further information about the CDCM7005 device, see the device data sheet, SCAS793.
3.2
DAC5682Z
The DAC5682Z is a 16-bit interpolating dual digital-to-analog converter (DAC) with a high-speed LVDS
data interface. The device incorporates a digital complex coarse mixer, independent differential offset
control, and I/Q amplitude control. The device can be used with excellent results in baseband mode, low
IF mode, and high IF mode. The digital circuits can be manipulated such that it has the functionality of a
DAC5681. For further information about the DAC5682Z device, see the device datasheet, SLLS853.
3.3
TPS76xxx, TPS5430, UCC284-5
The TPS76xxx devices provide 1.8-V, 3.3-V, and 5-V linear regulation for the DAC5682Z, CDCM7005,
and V+ amplifier supplies. The TPS5430 generate –5.5 V from 6-V input followed by the UCC284-5 which
provides linear -5-V regulation for the V– amplifier supply. More information about the TPS5430 and
UCC284-5 devices is found in the respective datasheets, SLVS632 and SLUS234.
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3.4
OPA695, THS3091, THS30915
These both provide the differential-to-single-ended conversion for the DAC5682Z output. The OPA695 is a
wide bandwidth (1400 MHz) high-performance operational amplifier (see data sheet SBOS693). The
THS3095 is high-performance operational amplifier capable of driving large voltages (20+ V). For more
information about the THS3091 and THS3095 devices, see the data sheet, SLOS423.
Both DAC outputs have optional transformer outputs to bypass the operational amplifiers, if needed. There
are also options to bypass the onboard supplies to use higher external operational amplifier supplies.
The amplifier circuits can be further optimized by following the guidelines in the application report,
SBAA135. This optimization can be performed once the final filter and gain components have been
selected.
4
Software Installation
The enclosed CD-ROM contains all of the necessary software that is needed for the host personal
computer (PC) to control the DAC5682Z and CDCM7005 on the TSW3070EVM. The interface software is
a graphical user interface (GUI) that allows all the registers to be programmed in the CDCM7005 and the
DAC5682Z. Once the software is installed, the GUI is accessible from the Start → All Programs → Texas
Instruments DACs → DAC5682z EVM Control. This GUI was originally used for the TSW3082
(DAC5682+RF modulator) but is also applicable for the TSW3070EVM.
4.1
DAC5682Z USB Control Software Installation
Copy the DAC5682z software from the provide CD to a local drive on a PC. Execute the setup.exe file.
This starts the DAC5682Z control software installation.
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The destination directory for the installer is displayed. It is recommended to leave the default folder
location. Any necessary folders are created by the installation if they do not exist. Click Next.
Accept the EULA, and click Next.
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Click Next again to start the installation.
Click Continue to complete the installation.
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Restart the PC as directed.
4.2
DAC5682Z EVM Driver Installation
Once the PC has restarted, connect the provided USB cable to the PC and connector J13 of the EVM.
Power up TSW3070EVM using the provide +6-V power supply. After power is applied, the USB driver
installation process will start. The hardware wizard detects the EVM. When asked if it should connect to
the update server to locate drivers, click NO, and then Next.
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Install the drivers automatically as recommended. Click Next.
Click Continue for the digital signature. The drivers were installed during the software installation and will
be installed automatically. If asked to overwrite newer drivers, click Yes. Click Finish to complete the
driver installation. If a DAC5682 EVM driver has been previously installed, Windows Hardware Wizard
may not require the drivers to be installed and these steps will not be required.
The software can now be started from Start → All Programs → Texas Instruments DACs → DAC5682z
EVM Control.
5
Software Introduction
The DAC5682Z EVM control software allows you to:
• Configure the DAC5682Z and CDCM7005 registers
• Save and load these register settings to/from the text files
• Visualize the data path through the DAC5682Z
• Download a pattern to the Texas Instruments TSW3100 Pattern Generator System, an FPGA-based
LVDS/CMOS pattern generator, from the TSW3100 EVM tool folder
(http://www.ti.com/tool/tsw3100evm).
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5.1
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Modes of Operation
The software has five main settings that allow you to modify the functionality of the active panels. You can
switch between these settings by selecting one of the options on the Menu box. The five settings are
described in Table 1.
Table 1. Software Main Settings
5.2
Setting
Top Panel
Bottom Panel
EVM Home
EVM and DAC5682Z serial information. EVM
communication status
Not used
DAC5682Z Diagram
DAC5682Z register settings
DAC5682Z data path under the current register settings
Register Config
DAC5682Z register settings
CDCM7005 register settings
TSW3100 Config
DAC5682Z register settings
TSW3100 settings
Help
DAC5682Z register settings
DAC5682Z data path and help window
Software Boxes
The DAC5682Z software interface controls are divided into boxes. The functionality of these boxes is
described in Table 2.
Table 2. Software Box Descriptions
Box
Description
Menu
Switch between main functionality settings.
Home
Show serial information and EVM status.
USB/Readback
Reset the USB port to begin a new data session. Disable DAC5682Z read capabilities (simulation
mode).
DAC5682Z Register Table
Show the DAC5682Z register settings in binary and hex formats.
DAC5682Z Register
Configuration
Read/Write DAC5682Z register configuration.
CDCM7005 Register
Configuration
Write CDCM7005 register configuration (no read capability).
DAC5682Z Diagram
Graphical representation of the DAC5682Z data path under current register configuration.
TSW3100 Configuration
Control a TSW3100 pattern generation system – refer to TSW3100 users guide for more
information
Help
Display information on the DAC5682Z register configuration box controls.
A diagram of each of these Menu choices is shown in the following illustrations.
Figure 2. Home Menu Showing EVM Status
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Figure 3. DAC5682Z Register Configuration and Block Diagram Menu
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Figure 4. DAC5682Z Register and CDCM7005 Configuration Menu
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Figure 5. DAC5682Z Register Configuration and TSW3100 Pattern Generator Control Menu.
The TSW3100 can be loaded with a custom pattern file using the GUI options. For further details on the
format of this file, see the TSW3100 user's guide (SLLU101).
5.3
Complete Software Overview
Table 3 contains a complete reference of all the software controls.
Table 3. Software Feature Descriptions
Control Name
Input/Output Description
MENU BOX
EVM Home
Input
Displays EVM Home Box.
DAC5682Z
Diagram
Input
Displays DAC5682Z Register Configuration and DAC5682Z Diagram boxes.
Register Config
Input
Displays DAC5682Z and CDCM7005 Register Configuration boxes.
TSW3100 Config
Input
Displays DAC5682Z Register Configuration and TSW3100 Configuration boxes.
Help
Input
Displays Help box.
HOME BOX
Functionality
Output
DAC device.
Version
Output
Chip version.
Wafer number
Output
DAC5682Z wafer number.
Column (x)
Output
DAC5682Z column position.
Row (y)
Output
DAC5682Z row position.
Lot Number
Output
DAC5682Z lot number.
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Table 3. Software Feature Descriptions (continued)
Control Name
Input/Output Description
Fab
Output
Fab where the DAC5682Z was manufactured.
EVM Serial
Number
Output
Serial number of the EVM.
Status Messages
Output
Displays the status of the communication session.
USB/READBACK BOX
Reset USB Port
Input
Readback
Input/Output
Begins a new USB session. Press this if you see a status error message.
Disables DAC5682Z register reads (simulation mode)
DAC5682Z REGISTER TABLE BOX
Register Table
Output
Displays the DAC5682Z register configuration.
DAC5682Z REGISTER CONFIGURATION BOX
PLL SETTINGS
PLL
Input/Output
When disabled, the PLL is bypassed
PLL Sleep
Input/Output
When set, the PLL is put into sleep mode.
PLL Lock
Output
PLL Reset
Input/Output
When set, the PLL loop filter is pulled down to 0V. Toggle to restart the PLL if an over-speed
lock-up occurs.
VCO Frequency
Input/Output
When set to 2x, the PLL clock output is 1/2 the PLL VCO frequency. Used to run the VCO at
2X the needed clock frequency to reduce phase noise for lower input clock rates.
PLL Gain (MHz/V)
Input/Output
Used to adjust the PLL Voltage Controlled Oscillator (VCO) gain.
PLL Range (MHz)
Input/Output
Sets the PLL VCO frequency range.
M value
Input/Output
M portion of the M/N divider of the PLL.
N value
Input/Output
N portion of the M/N divider of the PLL. This value should be chosen to divide down the input
CLKIN to maintain a maximum PFD of 160 MHz.
DLL
Input/Output
When disabled, the DLL is bypassed and the LVDS data source is responsible for providing
correct setup and hold timing.
DLL Sleep
Input/Output
When set, the DLL is put into sleep mode.
Auto-DLL
Input
Turns green when the internal PLL is locked.
DLL SETTINGS
When set, the DLL is restarted automatically when there is a change in the DLL settings, so
there is no need to press the DLL restart control.
DLL Lock
Output
DLL restart
Input/Output
Turns green when the internal DLL is locked.
Restarts the DLL
DLL Delay (deg.)
Input/Output
Used to manually adjust the DLL delay = from the DLL fixed current delay.
DLL fixed current
delay (ps/µA)
Input/Output
Adjusts the DLL delay line bias current. Used in conjunction with the DLL inv clock to select
appropriate delay range for a given DCLK frequency
DLL inv clock
Input/Output
Used to invert the internal DLL clock to force convergence to a different solution. This can be
used in the case where the DLL delay adjustment has exceeded the limits of its range
INPUT SETTINGS
format
Input/Output
Selects between 2’s complement and offset binary formats.
reverse bus
Input/Output
When enabled, reverses the LVDS input data bus so that the MSB to LSB order is swapped.
swap data
Input/Output
When enabled, the A/B data paths are swapped prior to routing to the DACA and DACB
outputs.
same data
Input/Output
When enabled, the data routed to DACA is also routed to DACB.
FIFO offset
Input/Output
Sets the FIFO’s output pointer location, allowing the input pointer to be shifted –4 to +3
positions upon SYNC. Default offset is 0 and is updated upon each sync event.
digital logic
Input/Output
Enables the interpolation filters on the device.
interpolation
Input/Output
Selects the interpolation rate.
CM0 mode
Input/Output
Determines the mode of FIR0 and CMIX0 blocks. Since CMIX0 is located between FIR0 and
FIR1, its output is half-rate. Settings apply to both A and B channels.
CM1 mode
Input/Output
Determines the mode of FIR1 and final CMIX1 blocks. Settings apply to both A and B
channels.
DIGITAL SETTINGS
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Table 3. Software Feature Descriptions (continued)
Control Name
Input/Output Description
digital delay
Input/Output
DAC data delay adjustment (0–3 periods of the DAC clock). This can be used to adjust system
level output timing. The same delay is applied to both DACA and DACB data paths.
clock delay
Input/Output
Changes the number of buffers that the input clock goes through. This allows some adjustment
of the setup/hold of the handoff between the receivers and the digital section.
DAC mode
Input/Output
Selects between dual DAC mode and single DAC mode. It is also used to select input
interleaved data (dual DAC mode).
DACA Sleep
Input/Output
When set, DACA is put into sleep mode.
DACB Sleep
Input/Output
When set, DACB is put into sleep mode. DACB is not automatically set into sleep mode when
configured for single DAC mode. Set this control in single DAC mode to get the lowest power
configuration since the output is on DACA only.
DACA Gain
Input/Output
Scales the DACA output current in 16 equal steps.
DACB Gain
Input/Output
Scales the DACB output current in 16 equal steps.
Offset
Input/Output
When enabled, the Offset A and Offset B values are summed into the DACA and DACB data
paths. This provides a system-level offset adjustment capability that is independent of the input
data.
offset sync
Input/Output
Transfers the Offset A and Offset B values to the registers used in the DACA and DACB offset
calculations. This control is enabled automatically every time there is a change in the Offset A
or Offset B values.
Offset A
Input/Output
Offset adjustment value for the A data path.
Offset B
Input/Output
Offset adjustment value for the B data path.
DAC A LPF
Input/Output
Enables a 95-kHz low-pass filter corner on the DACA current source bias. When disabled a
472-Hz filter corner is used.
DAC B LPF
Input/Output
Enables a 95-kHz low-pass filter corner on the DACB current source bias. When disabled a
472-Hz filter corner is used.
— DAC SETTINGS
— ERROR SETTINGS
SLFST Error
Input/Output
Masks out SLFTST Errors
FIFO Error
Input/Output
Masks out FIFO Errors
Setup/Hold Error
Input/Output
Masks out Setup/Hold Errors.
SLFST error reset
Input/Output
Asserted when the Digital Self Test (SLFTST) fails. Clear to reset a SLFST error.
FIFO error reset
Input/Output
Asserted when the FIFO pointers overrun each other causing a sample to be missed. Clear to
reset a FIFO error.
Setup/Hold error
reset
Input/Output
Any received data pattern other than 0xAAAA or 0x5555 causes this bit to be set. Clear to
reset a Setup/Hold error.
SDO
Input/Output
Selects the output signal on the SDO pin.
Serial interface
Input/Output
Selects between 3 pin or 4 pin serial interface mode.
sync source
Input/Output
Selects the synchronization signal source. If soft sync is selected the software sync control is
used as the only synchronization input and the LVDS external SYNC input pins are ignored.
software sync
Input/Output
This control can be used as a substitute for the LVDS external SYNC input pins for both
synchronization and transmit enable control.
— SYNC SETTINGS
hold sync
Input/Output
Enables the sync to the FIFO output HOLD block.
clk div sync
Input/Output
Enables the clock divider sync.
FIFO sync
Input/Output
Enables the FIFO offset sync.
self test
Input/Output
Enables a Digital Self Test (SLFTST) of the core logic
FA002
Input/Output
Keep disabled. Used only for factory test purposes.
Fuse A
Input/Output
Keep disabled. Used only for factory test purposes.
Fuse B
Input/Output
Keep disabled. Used only for factory test purposes.
ATEST
Input/Output
Keep disabled. Used only for factory test purposes.
— SEND/SAVE SETTINGS
Send All
Input
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Writes all registers to the DAC5682Z device.
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Table 3. Software Feature Descriptions (continued)
Control Name
Input/Output Description
Read All
Input
Reads all registers from the DAC5682Z device. It is rarely necessary to use this as the
registers are read every time a DAC5682Z control changes.
Load Regs
Input
Loads a DAC5682Z register configuration from a text file. Files need to consist of a single
column with the register values in hexadecimal format.
Save Regs
Input
Saves a DAC5682Z register configuration to a text file.
CDCM7005 REGISTER CONFIGURATION BOX
— GENERAL SETTINGS
Output Settings
Input
Switches the display between the CDCM7005 output register settings and advanced register
settings.
CDCM7005
Operation
Input
Select Buffer Mode when there is no VCXO installed or the VCXO is enabled. In this case the
CDCM7005 operates as a buffer. Select PLL Mode when a VCXO is being used by the
CDCM7005.
M & N Selection
Input
When Auto is selected the M and N divider values are calculated automatically based on the
Reference and VCXO frequencies.
Ref. Freq. (MHz)
Input
Frequency of the reference oscillator given to the CDCM7005.
VCXO Freq.
(MHz)
Input
Frequency of the VCXO used.
M Divider
Input/Output
M divider value.
N Divider
Input/Output
N divider value.
FB_MUX
Input/Output
Feedback MUX select.
Phase Shift
Input
Output Freq
(MHz)
Output
— PLL SETTINGS
Phase shift select.
Output frequency of the CDCM7005 based on the Reference and VCXO frequencies, and M
and N values. If this frequency differs from the VCXO frequency it is displayed in red.
— OUTPUT SETTINGS
Y0-Y4 Dividers
Input
Selects the output dividers of the CDCM7005 outputs.
Y0-Y4 Levels
Input
Selects between CMOS or LVPECL levels of the CDCM7005 outputs.
Y0-Y4 States
Input
Selects the operating state of the CDCM7005 outputs.
— ADVANCED SETTINGS
Advanced
Registers
Input
CDCM7005 advanced registers. See the CDCM7005 datasheet (SCAS793) for more
information on these registers.
TSW3100 CONFIGURATION BOX
16
File Format
Input
Selects between binary and 16-bit signed integer format. If binary is selected the file must
comply with the requirements described on the TSW3100 documentation. If integer format is
selected, the file must consist of a single column for a real signal or two columns for a twochannel or complex signal.
Column Delimiter
Input
Indicates the column separator used in the two-channel or complex integer input file.
File Browser
Input
Used to browse the input pattern file.
Output Level
Input
Selects between LVDS or CMOS outputs. Only LVDS is available for the DAC5682Z
Data Format
Input
Selects between 2s complement or offset binary format.
IP Address
Input
IP address of the TSW3100 pattern generator.
TSW3100 State
Input
Selects between Master or Slave mode. The default state is Master mode. See the TSW3100
documentation for more information.
Load and Start
Input
Select this to load a pattern file and start the TSW3100.
Stop Pattern
Input
Select this to stop the pattern.
Re-start Pattern
Input
Select this to re-start the pattern. A loaded must be loaded in memory for this to work.
Command
Output
Shows a list of the commands sent to the TSW3100.
Status
Output
Status of the TSW3100 transaction.
Bytes loaded
Output
Displays the number of bytes loaded to the TSW3100.
TSW3070EVM: Amplifier Interface to Current Sink DAC - Arbitrary Waveform
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TSW3070EVM Introduction
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6
TSW3070EVM Introduction
The TSW3070EVM was designed to provide a robust yet flexible evaluation system for the DAC5682Z as
used in an arbitrary waveform generation system. The EVM includes, in addition to the DAC5682Z, a
CDCM7005 for clock distribution, an OPA695, THS3091, and THS3095 active output interface designed to
drive into a 50-Ω termination. For a complete hardware description, consult the schematics and layout
documents included on the provided CD.
6.1
Jumper Settings
The TSW3070EVM has onboard jumpers that allow you to modify the board configuration. Table 4
explains the functionality of the jumpers.
Table 4. Jumper List
6.2
Jumper
Label
Function
Condition
Default
JP8
EXTLO
Internal (GND) or external (3.3V) voltage reference
GND
Pin 2-3
JP10
VFUSE
Factory use only. Connect to 1.8VDD for normal operation.
1.8 VDD
Pin 1-2
JP11
THS PD
Low-active power down of THS3091 and THS3095
+Vamp
Pin 1-2
JP12
CDC_PD
Low-active power down of CDCM7005
3.3 VCLK
Pin 1-2
JP13
VCXOB
Choose internal VCXO or external VCXO INB
Internal VCXO
Pin 1-2
JP14
VCXO_P
Choose internal VCXO or external VCXO positive input
Internal VCXO
Pin 1-2
JP15
VCXO_N
Choose CDCM7005 or external VBB
CDCM7005
Pin 1-2
JP16
REF_CLK
Choose internal 10-MHz ref or external ref
Internal Ref
Pin 2-3
JP19
+3.3VCLK
VCXO power supply
VCXO on
Pin 1-2
Input and Output Connectors
Table 5 lists the input and output connectors.
Table 5. Input and Output Connections
Reference
Designator
Label
Connector Type
J1
IOUTB2
SMA
DACB transformer output. Optional IOUTB2 output.
J3
IOUTA2
SMA
DACA transformer output. Optional IOUTA2 output.
J5
SAMTEC
Description
Input LVDS data to DAC682z. Output clock to data source.
J6
EXT_VCXO_P
SMA
External main clock input.
J7
EXT_VCXO_N
SMA
External VCXO negative connection. Not required.
J8
Y2A_CLK
SMA
Optional CDCM7005 clock output.
J9
EXT_REF_C
SMA
External reference clock input.
J10
Y2B_CLK
SMA
Optional CDCM7005 clock output.
J13
USB_CONN
USB
USB connector for software communication.
J12, J25
6-V input and return
Banana Plug
J16
THS3091, THS3095
OUT
SMA
Output of the THS3091 and THS3095 amplifier
J11
OPA695 OUT
SMA
Output of the OPA695 amplifier
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TSW3070EVM Introduction
6.3
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USB Interface
The TSW3070EVM contains a 4-pin USB port connector to interface to a USB 1.1 or later compliant USB
port. Programming of the CDCM7005 and DAC5682Z is accomplished through this port.
6.4
Power Management
The TSW3070 EVM requires an input of 6 VDC (refer to Section 8.2 for details). A current rating of at
least 2 A is recommended for the 6-V supply. The rest of the supplies: 3.3, 1.8, ±5 V are all generated on
the board with linear regulators.
7
Demonstration Kit Test Configuration Test Equipment 7.1 Test
7.1
Test Setup
The test setup for the TSW3070EVM is shown in Figure 6. This setup shows the TSW3100 pattern
generator supplying an LVDS signal to the TSW3070EVM (see the TSW3100 product folder,
http://www.ti.com/tool/tsw3100evm).
Figure 6. TSW3070EVM Driven by TSW3100 Pattern Generator
7.2
Test Equipment
The following test equipment is required for testing the .TSW3070EVM. Some other equipment may be
used; however, results may vary due to limitations of the instruments.
• Power supply 6 VDC at 2 A
• Spectrum Analyzer: Rhode & Schwarz FSU, FSQ, or equivalent
• Pattern generator: TSW3100 using LVDS mode, or some other LVDS capable pattern generator
• Oscilloscope: Probe clock and data lines for trouble shooting, measure voltage waveform in time
domain
• Digital voltmeter to verify signal levels
7.3
Calibration
In order to measure the proper output power, the insertion loss of the analyzer cable must be calibrated.
Measure a calibrated 0-dBm source to see how much loss is in the cable at the frequency of interest.
18
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7.4
Typical Performance Measurements
The TSW3070EVM ac measurements at the transformer outputs can be used to verify the performance of
the DAC5682Z if necessary, or if a reference signal is needed when measuring the performance at the
OPA695, THS3091 or THS3095 output. The OPA695, THS3091 and THS3095 are both implemented in a
differential-in to single-ended-out configuration. The gain of the OPA695 has been set to 2.2x, and the
THS3091 and THS3095 have been set to a gain of 3.3x. The input on the OPA695 has an effective 25-Ω
load on a 20-mA ac signal. The inputs of the THS3091 and THS3095 have an effective 50-Ω load with a
20-mA ac signal.
Using the TSW3100 in the Multi-Tone GUI mode, a single tone can be generated and measured at both
outputs. This measurement must be verified first before any other testing or modification of the board is
attempted to ensure that all hardware and software interfaces are operational. The OPA695 output is
about 1.8 Vpp, whereas the THS3095 is about 5 Vpp.
Figure 7. Typical THS3091 and THS3095 Voltage Output, Default Gain 3.3x
Figure 8. THS3091 and THS3095 With ±15-V External Supplies, 50-Ω Input, Gain at 10x
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A low-pass filter (LPF) is between the DAC outputs and the OPA695, THS3091, and THS3095. This
prevents any higher frequency DAC images from affecting performance of the amplifiers. The wide
bandwidth OPA695 is typically operated at lower gains with smaller output swings with a wider input LPF,
about 200 MHz. The THS3095 is normally operated at larger gains (larger feedback resistor) and larger
output swings which results in narrower output bandwidth. Consequently, the LPF for the THS3091 and
THS3095 is set lower at 100 MHz. Both LPFs are 50-Ω differential, fifth-order Chebyshev filters with a 0.1dB ripple. Filter design can be done according to application report SLWA053
Marker 1 [T1]
-16.14 dBm
5.07815631 MHz
Ref Lvl
0 dBm
RBW
VBW
SWT
20 kHz
20 kHz
1.25 s
RF Att
50 dB
Unit
dBm
0
1 [T1]
-10
1 [T1]
1
2 [T1]
-20
-16.14
5.07815631
-34.61
5.10000000
-35.25
10.26813627
dBm A
MHz
dB
MHz
dB
MHz
-30
1VIEW
2VIEW
-40 3VIEW
1AP
2AP
3AP
1 2
-50
-60
-70
-80
-90
-100
Start 1 MHz
Date:
25.APR.2008
19.9 MHz/
Stop 200 MHz
12:50:56
Figure 9. THS3091 and THS3095 LPF Filter Shape Evaluated With Multi-tone Input Signal From the
TSW3100 Pattern Generator
RBW
VBW
SWT
Ref Lvl
0 dBm
30 kHz
30 kHz
1.15 s
RF Att
Unit
30 dB
dBm
0
A
-10
-20
-30
1VIEW
2VIEW
-40 3VIEW
1AP
2AP
3AP
4AP
-50
-60
-70
-80
-90
-100
Start 1 MHz
Date:
28.MAR.2008
39.9 MHz/
Stop 400 MHz
11:54:59
Figure 10. OPA695 LPF Filter Shape Evaluated With Multi-tone Signal
20
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Demonstration Kit Test Configuration Test Equipment 7.1 Test
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Some typical IMD3 data was obtained for both devices configured with 25-Ω input impedances and
identical gains of 2.2x using ±5-V onboard supplies.
* RBW 500 Hz
Ref
5 dBm
Att
2
0
1 AP
CLRWR
30 dB
VBW 2 kHz
SWT 40 s
1
-10
-20
Delta 4 [T1 ]
-79.19 dB
-4.006410256 MHz
Marker 1 [T1 ]
-2.28
11.093589744
Delta 2 [T1 ]
-0.02
-2.003205128
Delta 3 [T1 ]
-80.00
2.003205128
dBm
MHz
A
dB
MHz
dB
MHz
-30
-40
EXREF
EXT
-50
3DB
-60
-70
4
-80
3
-90
Center 10.1 MHz
1 MHz/
Span 10 MHz
Figure 11. IMD3 Plot for THS3095
* RBW 500 Hz
Ref
5 dBm
* Att
VBW 2 kHz
SWT 40 s
1
2
0
1 AP
CLRWR
30 dB
-10
-20
Delta 3 [T1 ]
-87.71 dB
-4.022435897 MHz
Marker 1 [T1 ]
-2.17
11.109615385
Delta 2 [T1 ]
-0.01
-2.003205128
Delta 4 [T1 ]
-85.55
1.987179487
dBm
MHz
∗
A
dB
MHz
dB
MHz
-30
-40
-50
3DB
-60
-70
-80
4
3
-90
Center
10.1 MHz
Date: 7.APR.2008
1 MHz/
Span 10 MHz
22:50:03
Figure 12. IMD3 Plot for OPA695
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Demonstration Kit Test Configuration Test Equipment 7.1 Test
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-40
THS3095
-50
dBc
-60
OPA695
-70
DAC5682
-80
-90
-100
1
10
100
f - Frequency - MHz
1000
Figure 13. Summary of IMD3 for Passive Transformer, OPA695, THS3091, and THS3095 Output
30
THS3095
HD2
HD - Harmonic Distortion - dBc
40
THS3095
HD3
OPA695
HD2
50
OPA695
HD3
60
70
DAC5682
HD3
80
DAC5682
HD2
90
100
1
100
10
f - Frequency - MHz
1000
Figure 14. Summary of Harmonic Distortion for Passive Transformer, OPA695, THS3091, and THS3095
Output
22
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Initial Power Up and Test
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8
Initial Power Up and Test
This section outlines the basic power up and test procedure to ensure that the EVM is in an operational
state.
8.1
Initial Inspection
Inspect the board to determine which VCXO is on the board. This is useful information when programming
the CDCM7005 to lock the DAC clock to the reference. Typically, the board is populated with an 800-MHz
VCXO.
8.2
Engage Power Supplies
1. Connect the EVM supplied 18-AWG wires to the DC plug cable (Tensility 10-01776) to a qualified lab
bench power supply. The 18-AWG red wire is the 6-V wire while the 18-AWG black wire is the ground
wire.
2. Connect the 6-V power supply to J12, the Power In jack of the TSW3070 EVM.
3. Connect the PC USB port to J4 USB port of the TSW3070 EVM.
8.3
Verify Status of the Board
The DAC software will detect if the USB port is active and if it is capable of reading the serial number from
the EVM. This determines if the communication between the board and the PC is correct. The HOME
menu of the DAC GUI software indicates this status. The VCXO and Reference LEDs (D1, D2) must be lit
as well as the power LED (D18).
8.4
Program the CDCM7005
On the DAC5682z EVM GUI, click on Register Config which is located on the left side of the GUI.
Program the registers as necessary manually or load a saved configuration file. An example file for
loading the CDCM7005 called CDCM7005_4X_Interp.reg7005 can be found on the provided CD. To load
this file, click on the Load Regs button on the lower center of the GUI. Navigate to the correct location,
select this file, then click on OK. The default mode of GUI has the CDCM7005 Operation set to Buffer
Mode. Click on this button and change the setting to PLL Mode. Next, change the VCXO Freq (MHz)
default value of 983.04 to 800 by either clicking on the down arrow of this button or entering 800 manually.
Hit enter and the new settings will be sent to the CDCM7005. Note that the CDCM7005 LOCK LED (D3) is
now lit as it achieves lock between the VCXO and 10-MHz reference. This LED does not illuminate when
using external VCXO.
Figure 15. CDCM7005, 800M VCXO, 10M Ref, Locked Condition LEDs
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Initial Power Up and Test
8.5
www.ti.com
Program the DAC5682Z
On the DAC5682z EVM GUI, click on DAC5682 Diagram which is located on the left side of the GUI.
Program the DAC5682z registers as necessary manually or load a saved configuration file. An example
file for loading the DAC5682z called DLL_4X_Interp.reg5682 can be found on the provided CD. To load
this file, click on the Load Regs button on the right center side of the GUI. Navigate to the correct location,
select this file, then click on OK. The registers will be loaded and the GUI should now look as shown in
Figure 16. If the DLL Lock light is red, make sure the pattern generator is providing a proper DCLK to the
TSW3070EVM.
Figure 16. DAC5682 and CDCM7005 Example Register Settings
8.6
Program TSW3100
Use the TSW3100 GUI to generate and load a test pattern, either a tone, multi-tones, or modulated
waveforms. This input is required to provide the DCLK to the DAC5682z.
24
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9
Optional Configurations
9.1
External VCXO
It is possible to configure the TSW3070EVM to use an external VCXO for application flexibility. J13 and
J14 can be used in position 2-3 to select an external VCXO or clock signal.
9.2
Transformer Passive Output
The board is by default set up to output signals through the OPA695, THS3091, and THS3095. These
devices can be individually bypassed to a transformer output, if needed. To bypass the OPA695, move R6
to R109, and R15 to R134. To bypass the THS3091 and THS3095, move R20 to R135, and R27 to R136.
Figure 17. DAC5682Z Resistor Jumper Configuration
The blue denotes the default configuration (operational amplifier output), whereas the yellow denotes the
transformer output option.
Table 6. Optional Output Signal Path
R109
R134
R15
R6
Bypass OPA695
Install
Install
Remove
Remove
Use OPA695 (default)
Remove
Remove
Install
Install
R135
R136
R20
R27
Bypass THS3091 and THS3095
Install
Install
Remove
Remove
Use THS3095 (default)
Remove
Remove
Install
Install
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Optional Configurations
9.3
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Higher Amplifier Voltage Supplies
When changing the amplifier power supplies from the onboard ±5 V to some external supply, it is
important to ensure that the voltages to the OPA695 do not exceed ±6.5 V as this could damage the
device. When the situation merits, remove the ferrite beads that connect the OPA695 to the ±VAMP
supplies (FB10, FB11).
To connect external supplies, the ±VAMP amplifier net must be disconnected from the onboard ±5V net.
This involves removing ferrite beads FB7 and FB13. The external supply can then be connected to TP3
and TP9. Keep in mind that the maximum supply voltages for the OPA695 (±6.5 V) and the THS3095 (33
V between +Vs and –Vs).
Internal Supply, Connect VAMP to ±5 V (default)
FB7
FB13
Install
Install
Remove
Remove
Connect OPA695 to VAMP (default)
External Supply, disconnect VAMP from ±5 V
Disconnect OPA695 from VAMP
FB11
FB10
Install
Install
Remove
Remove
Figure 18. Position of Ferrite Beads for Power Options
26
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9.4
Baseband Filter
The TSW3070EVM has been designed to allow a fifth-order differential LC filter. The filter for the OPA695
is a fifth-order, low-pass filter with a corner at 200 MHz. This filter was designed with a 25-Ω source and
termination impedance to account for the DAC load and the operational amplifier input. The THS3091 and
THS3095 filters are a fifth-order, low-pass filter with a corner at 100 MHz. This filter was designed with a
50-Ω impedance in mind. These filters can only be modified by bearing in mind the design of the DAC
termination and operational amplifier configuration. Both outputs of the amplifiers are intended to drive 50Ω test equipment.
10
Schematic, Bill of Materials and Printed-Circuit Board Layout
The TSW3070EVM schematic, bill of materials, and board CAD design files can be found on the provided
compact disc.
10.1 Design Resources
TSW3070EVM
CDCM7005
DAC5682Z
OPA695
THS3091
THS3095
TPS5430
Product Folder
Product Folder
Product Folder
Product Folder
Product Folder
Product Folder
Product Folder
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (May 2008) to A Revision ........................................................................................................... Page
•
•
•
Changed the first sentence of Section 6.4 ........................................................................................... 18
Deleted text "Plug in the 6-Vdc wall plug." and Added list items to Section 8.2................................................. 23
Added Section 10.1...................................................................................................................... 27
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27
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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