Texas Instruments | TAS5760M-Q1 2x25-W Digital Input Closed-Loop Automotive Class-D Audio Amplifier (Rev. B) | Datasheet | Texas Instruments TAS5760M-Q1 2x25-W Digital Input Closed-Loop Automotive Class-D Audio Amplifier (Rev. B) Datasheet

Texas Instruments TAS5760M-Q1 2x25-W Digital Input Closed-Loop Automotive Class-D Audio Amplifier (Rev. B) Datasheet
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TAS5760M-Q1
SLOS988B – SEPTEMBER 2017 – REVISED NOVEMBER 2019
TAS5760M-Q1 2x25-W Digital Input Closed-Loop Automotive Class-D Audio Amplifier
1 Features
2 Applications
•
•
•
•
•
Qualified for Automotive Applications
– Temperature grade 1: –40°C to +125°C
Minimum Supply Voltage down to 4.5 V
Adjustable Switching Frequencies
Selectable Hardware or Software Control
Audio Performance (PVDD = 12 V, RSPK = 8 Ω,
SPK_GAIN[1:0] Pins = 00)
– Idle Channel Noise = 66 µVrms (A-Wtd)
– THD+N = 0.02% (at 1 W, 1 kHz)
– SNR = 99.7 dB A-Wtd (Ref. to THD+N = 1%)
Audio I/O Configuration:
– Single Stereo I²S Input
– Stereo Bridge Tied Load (BTL) or Mono
Parallel Bridge Tied Load (PBTL) Operation
– 32, 44.1, 48, 88.2, 96 kHz Sample Rates
General Operational Features:
– Integrated Digital Output Clipper
– Programmable I²C Address (1101100[R/W] or
1101101[R/W])
– Closed-Loop Amplifier Architecture
Robustness Features:
– Clock Error, DC, and Short-Circuit Protection
– Overtemperature and Programmable
Overcurrent Protection
1
•
•
•
•
•
•
•
Automotive Telematics
eCall (Emergency Call)
Acoustic Vehicle Alerting System (AVAS)
EV/HEV Sound Generation
3 Description
The TAS5760M-Q1 is a stereo digital input Class-D
audio amplifier which is ideal for use in automotive
emergency call (eCall), telematics, acoustic vehicle
alerting system (AVAS) and EV/HEV sound
generation applications. The device provides up to 25
W instantaneous power into 4 Ω at 10% THD+N at
14.4 V. The TAS5760M-Q1 also includes hardware
and software (I²C) control modes, an integrated digital
clipper, selectable gain options, and a wide power
supply operating range (4.5 V – 26.4 V).
An optimal mix of thermal performance and device
cost is provided in the 120-mΩ RDS(ON) of the output
MOSFETs.
The device is offered in a thermally enhanced 32-Pin
HTSSOP (DAP) package.
Device Information(1)
PART NUMBER
TAS5760M-Q1
Internal
Voltage
Supplies
AVDD
Internal Reference
Regulators
50
Serial
Audio
Port
Digital
Boost
&
Volume
Control
Digital
Clipper
Soft
Clipper
Analog
Gain
Gate
Drives
Gate
Drives
11 mm × 6.2 mm
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
4 Ω Thermal Limit
6 Ω Thermal Limit
8 Ω Thermal Limit
45
Internal Gate
Drive Regulator
Digital to
PWM
Conversion
HTSSOP (32)
Power at 10% THD+N vs PVDD
GVDD_REG
Closed Loop Class D Amplifier
SFT_CLIP
MCLK
SCLK
LRCK
SDIN
PVDD
Full Bridge
Power Stage
A
SPK_OUTA+
OverCurrent
Protection
Full Bridge
Power Stage
B
SPK_OUTASPK_OUTB+
SPK_OUTB-
Clock Monitoring
Die
Temp. Monitor
Internal Control Registers and State Machines
PBTL/ SPK_GAIN0 SPK_GAIN1 SPK_SD SPK_FAULT SPK_SLEEP/ FREQ/
ADR
SDA
SCL
Maximum Output Power (W)
ANA_REG
BODY SIZE (NOM)
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Functional Block Diagram
DVDD
PACKAGE
40
35
30
25
20
15
10
5
0
THD+N = 10%
4
6
8
10
12 14 16 18
Supply Voltage (V)
20
22
24
26
G001
NOTE: Thermal Limits were determined via the
TAS5760xxEVM
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TAS5760M-Q1
SLOS988B – SEPTEMBER 2017 – REVISED NOVEMBER 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
Absolute Maximum Ratings ..................................... 4
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 5
Thermal Information .................................................. 5
Digital I/O Pins .......................................................... 5
Master Clock ............................................................. 6
Serial Audio Port ....................................................... 7
Protection Circuitry.................................................... 7
Speaker Amplifier in All Modes ................................. 8
Speaker Amplifier in Stereo Bridge Tied Load (BTL)
Mode .......................................................................... 9
6.11 Speaker Amplifier in Mono Parallel Bridge Tied
Load (PBTL) Mode................................................... 11
6.12 I²C Control Port ..................................................... 13
6.13 Typical Idle, Mute, Shutdown, Operational Power
Consumption ............................................................ 14
6.14 Typical Characteristics (Stereo BTL Mode):
fSPK_AMP = 384 kHz .................................................. 18
6.15 Typical Characteristics (Stereo BTL Mode):
fSPK_AMP = 768 kHz .................................................. 20
6.16 Typical Characteristics (Mono PBTL Mode):
fSPK_AMP = 384 kHz .................................................. 23
6.17 Typical Characteristics (Mono PBTL Mode):
fSPK_AMP = 768 kHz .................................................. 24
7
8
Parameter Measurement Information ................ 25
Detailed Description ............................................ 26
8.1
8.2
8.3
8.4
8.5
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Register Maps .........................................................
26
26
27
31
40
Application and Implementation ........................ 48
9.1 Application Information............................................ 48
9.2 Typical Applications ................................................ 48
10 Power Supply Recommendations ..................... 59
10.1 DVDD Supply ........................................................ 59
10.2 PVDD Supply ........................................................ 59
11 Layout................................................................... 59
11.1 Layout Guidelines ................................................. 59
11.2 Layout Example .................................................... 62
12 Device and Documentation Support ................. 64
12.1
12.2
12.3
12.4
12.5
Documentation Support ........................................
Support Resources ...............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
64
64
64
64
64
13 Mechanical, Packaging, and Orderable
Information ........................................................... 64
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2018) to Revision B
Page
•
Added Feature: Temperature grade 1: –40°C to +125°C....................................................................................................... 1
•
Changed Features list item, Audio Performance From: RLOAD = 8Ω To: RSPK = 8Ω .............................................................. 1
•
Added Junction Temperature, TJ to the Absolute Maximum Ratings .................................................................................... 4
•
Added HBM and CDM classification levels to the ESD Ratings ........................................................................................... 5
•
Changed Note 2 From: JEDEC Standard 4 Layer Board To: JEDEC Standard 2 Layer Board in the Thermal Information. 5
•
Deleted the 48-pin packaged from the Thermal Information .................................................................................................. 5
•
Changed the Stereo BTL Using Software Control to remove the 48-Pin information .......................................................... 49
•
Changed the Stereo BTL Using Hardware Control to remove the 48-Pin information......................................................... 52
•
Changed the Mono PBTL Using Software Control to remove the 48-Pin information ......................................................... 54
•
Changed the Mono PBTL Using Hardware Control to remove the 48-Pin information........................................................ 57
•
Deteted the 48-Pin DCA package BTL and PBTL images from the Layout Examples ....................................................... 63
Changes from Original (September 2017) to Revision A
•
2
Page
Released as Production Data ................................................................................................................................................ 1
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SLOS988B – SEPTEMBER 2017 – REVISED NOVEMBER 2019
5 Pin Configuration and Functions
DAP PACKAGE
32-PIN TSSOP
TOP VIEW
AVDD
1
32
GVDD_REG
SFT_CLIP
2
31
GGND
ANA_REG
3
30
BSTRPA+
VCOM
4
29
SPK_OUTA+
ANA_REF
5
28
PVDD
SPK_FAULT
6
27
PGND
SPK_SD
7
26
SPK_OUTA-
FREQ/SDA
8
25
BSTRPA-
PBTL/SCL
9
24
BSTRPB-
DVDD
10
23
SPK_GAIN0
11
PowerPAD 22
PGND
SPK_OUTB-
SPK_GAIN1
12
21
PVDD
SPK_SLEEP/ADR
13
20
SPK_OUTB+
MCLK
14
19
BSTRPB+
SCLK
15
18
DGND
SDIN
16
17
LRCK
Pin Functions
TAS5760MQ1
NO.
TYP
E (1)
INTERNAL
TERMINATION
AVDD
1
P
-
Power supply for internal analog circuitry
ANA_REF
5
P
-
Connection point for internal reference used by ANA_REG and VCOM filter
capacitors
ANA_REG
3
P
-
Voltage regulator derived from AVDD supply (NOTE: This terminal is provided
as a connection point for filtering capacitors for this supply and must not be
used to power any external circuitry)
BSTRPA–
25
P
-
Connection point for the SPK_OUTA– bootstrap capacitor, which is used to
create a power supply for the high-side gate drive for SPK_OUTA–
BSTRPA+
30
P
-
Connection point for the SPK_OUTA+ bootstrap capacitor, which is used to
create a power supply for the high-side gate drive for SPK_OUTA
BSTRPB–
24
P
-
Connection point for the SPK_OUT bootstrap capacitor, which is used to
create a power supply for the high-side gate drive for SPK_OUT
BSTRPB+
19
P
-
Connection point for the SPK_OUTB+ bootstrap capacitor, which is used to
create a power supply for the high-side gate drive for SPK_OUTB+
DGND
18
G
-
Ground for digital circuitry (NOTE: This terminal should be connected to the
system ground)
DVDD
10
P
-
Power supply for the internal digital circuitry
FREQ/SDA
8
DI
Weak Pull-Down
Dual function terminal that functions as an I²C data input terminal in I²C Control
Mode or as a Frequency Select terminal when in Hardware Control Mode.
GGND
31
G
-
Ground for gate drive circuitry (this terminal should be connected to the system
ground)
GVDD_REG
32
P
-
Voltage regulator derived from PVDD supply (NOTE: This terminal is provided
as a connection point for filtering capacitors for this supply and must not be
used to power any external circuitry)
LRCK
17
DI
Weak Pull-Down
Word select clock for the digital signal that is active on the serial port's input
data line
MCLK
14
DI
Weak Pull-Down
Master Clock used for internal clock tree, sub-circuit/state machine, and Serial
Audio Port clocking
NAME
(1)
DESCRIPTION
AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, P = Power, G = Ground (0V)
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Pin Functions (continued)
TAS5760MQ1
NO.
TYP
E (1)
INTERNAL
TERMINATION
PBTL/SCL
9
DI
Weak Pull-Down
PGND
22, 27
G
-
Ground for power device circuitry (NOTE: This terminal should be connected to
the system ground)
PVDD
21, 28
P
-
Power Supply for internal power circuitry
SCLK
15
DI
Weak Pull-Down
Bit clock for the digital signal that is active on the serial data port's input data
line
SDIN
16
DI
Weak Pull-Down
Data line to the serial data port
NAME
DESCRIPTION
Dual function terminal that functions as an I²C clock input terminal in I²C
Control Mode or configures the device to operate in pre-filter Parallel Bridge
Tied Load (PBTL) mode when in Hardware Control Mode
SFT_CLIP
2
AI
-
SPK_FAULT
6
DO
Open Drain
Sets the maximum output voltage before clipping
SPK_GAIN0
11
DI
Weak Pull-Down
Adjusts the LSB of the multi-bit gain of the speaker amplifier
SPK_GAIN1
12
DI
Weak Pull-Down
Adjusts the MSB of the multi-bit gain of the speaker amplifier
SPK_SLEEP/
ADR
13
DI
Weak Pull-Up
SPK_OUTA–
26
AO
-
Negative terminal for differential speaker amplifier output A
SPK_OUTA+
29
AO
-
Positive terminal for differential speaker amplifier output A
SPK_OUTB–
23
AO
-
Negative terminal for differential speaker amplifier output B
SPK_OUTB+
20
AO
-
Positive terminal for differential speaker amplifier output B
SPK_SD
7
DI
-
Places the device in shutdown when pulled LOW
VCOM
4
P
-
Bias voltage for internal PWM conversion block
PowerPAD™
-
G
-
Provides both electrical and thermal connection from the device to the board. A
matching ground pad must be provided on the PCB and the device connected
to it via solder.
Fault terminal, which is pulled LOW when an internal fault occurs
Places the speaker amplifier in mute
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
Ambient Operating Temperature, TA
–40
105
°C
Ambient Storage Temperature, TS
–40
125
°C
Junction Temperature, TJ
–40
150
°C
AVDD Supply
–0.3
30
V
PVDD Supply
–0.3
30
V
DVDD Supply
–0.3
4
V
DVDD Referenced Digital
Input Voltages
Digital Inputs referenced to DVDD supply
–0.5
DVDD + 0.5
V
Speaker Amplifier Output
Voltage
VSPK_OUTxx, measured at the output pin
–0.3
32
V
–40
125
°C
Temperature
Supply Voltage
Storage temperature range, Tstg
(1)
4
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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6.2 ESD Ratings
VALUE
V(ESD)
(1)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
HBM ESD Classification Level 3A
4000
Charged-device model (CDM), per JEDEC specification JESD22-C101
CDM ESD Classification Level C5
1000
UNIT
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
TA
Ambient Operating Temperature
–40
105
°C
AVDD
AVDD Supply
4.5
26.4
V
PVDD
PVDD Supply
4.5
26.4
V
DVDD
DVDD Supply
3
3.63
V
VIH(DR)
Input Logic HIGH for DVDD Referenced Digital Inputs
DVDD
V
VIL(DR)
Input Logic LOW for DVDD Referenced Digital Inputs
0
V
RSPK
(BTL)
Minimum Speaker Load in BTL Mode
4
Ω
RSPK
(PBTL)
Minimum Speaker Load in PBTL Mode
2
Ω
6.4 Thermal Information
TAS5760M-Q1
THERMAL METRIC
(1)
DAP [HTSSOP]
DAP [HTSSOP]
32-PIN (2)
32-PIN (3)
UNIT
60.3
31.9
°C/W
16
16
°C/W
θJA
Junction-to-ambient thermal resistance
θJC(top)
Junction-to-case (top) thermal resistance
θJB
Junction-to-board thermal resistance
12
17
°C/W
ψJT
Junction-to-top characterization parameter
0.4
0.4
°C/W
ψJB
Junction-to-board characterization parameter
11.9
16.8
°C/W
θJC(botto
Junction-to-case (bottom) thermal resistance
0.8
0.81
°C/W
m)
(1)
(2)
(3)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
JEDEC Standard 2 Layer Board
JEDEC Standard 4 Layer Board
6.5 Digital I/O Pins
Test conditions (unless otherwise noted): TC = 25°C
PARAMETER
TEST CONDITIONS
VIH1
Input Logic HIGH threshold for DVDD
Referenced Digital Inputs
All digital pins
VIL1
Input Logic LOW threshold for DVDD
Referenced Digital Inputs
All digital pins
IIH1
Input Logic HIGH Current Level
IIL1
Input Logic LOW Current Level
VOH
Output Logic HIGH Voltage Level
IOH = 2 mA
VOL
Output Logic LOW Voltage Level
IOH = -2 mA
MIN
TYP
MAX
70
UNIT
%DVDD
30
%DVDD
All digital pins
15
µA
All digital pins
–15
µA
90
%DVDD
10
%DVDD
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6.6 Master Clock
Test conditions (unless otherwise noted): TC = 25°C
PARAMETER
DMCLK
fMCLK
6
TEST CONDITIONS
Allowable MCLK Duty Cycle
Supported MCLK Frequencies
Values include: 128, 192, 256,
384, 512.
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MIN
TYP
MAX
45%
50%
55%
128
512
UNIT
fS
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6.7 Serial Audio Port
Test conditions (unless otherwise noted): TC = 25°C
PARAMETER
DSCLK
tHLD
tsu
TEST CONDITIONS
Allowable SCLK Duty Cycle
MIN
TYP
MAX
45%
50%
55%
UNIT
Required LRCK to SCLK Rising Edge
15
ns
Required SDIN Hold Time after SCLK
Rising Edge
15
ns
Required SDIN Setup Time before SCLK
Rising Edge
15
ns
fS
Supported Input Sample Rates
Sample rates above 48kHz
supported by "double speed
mode," which is activated
through the I²C control port
fSCLK
Supported SCLK Frequencies
Values include: 32, 48, 64
32
96
kHz
32
64
fS
6.8 Protection Circuitry
Test conditions (unless otherwise noted): TC = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OVERTHRES(PVDD)
PVDD Overvoltage Error Threshold
PVDD Rising
28
V
OVEFTHRES(PVDD)
PVDD Overvoltage Error Threshold
PVDD Falling
27.3
V
UVEFTHRES(PVDD)
PVDD Undervoltage Error (UVE)
Threshold
PVDD Falling
3.95
V
UVERTHRES(PVDD)
PVDD UVE Threshold (PVDD Rising)
PVDD Rising
4.15
V
OTETHRES
Overtemperature Error (OTE)
Threshold
150
°C
OTEHYST
Overtemperature Error (OTE)
Hysteresis
15
°C
7
A
OCETHRES
Overcurrent Error (OCE) Threshold for
PVDD= 15V, TA = 25 °C
each BTL Output
DCETHRES
DC Error (DCE) Threshold
PVDD= 12V, TA = 25 °C
2.6
V
TSPK_FAULT
Speaker Amplifier Fault Time Out
period
DC Detect Error
650
ms
OTE or OCP Fault
1.3
s
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6.9 Speaker Amplifier in All Modes
Test conditions (unless otherwise noted): TC = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
AV00
Speaker Amplifier Gain with
SPK_GAIN[1:0] Pins = 00
Hardware Control Mode
(Additional gain settings
available in Software Control
Mode) (1)
25.2
dBV
AV01
Speaker Amplifier Gain with
SPK_GAIN[1:0] Pins = 01
Hardware Control Mode
(Additional gain settings
available in Software Control
Mode) (1)
28.6
dBV
AV10
Speaker Amplifier Gain with
SPK_GAIN[1:0] Pins = 10
Hardware Control Mode
(Additional gain settings
available in Software Control
Mode) (1)
31
dBV
AV11
Speaker Amplifier Gain with
SPK_GAIN[1:0] Pins = 11
(This setting places the device
in Software Control Mode)
|VOS|(SPK_
Speaker Amplifier DC Offset
AMP)
(Set via I²C)
BTL, Worst case over voltage,
gain settings
10
mV
PBTL, Worst case over voltage,
gain settings
15
mV
fSPK_AMP(0)
Speaker Amplifier Switching Frequency
when PWM_FREQ Pin = 0
(Hardware Control Mode.
Additional switching rates
available in Software Control
Mode.)
16
fS
fSPK_AMP(1)
Speaker Amplifier Switching Frequency
when PWM_FREQ Pin = 1
(Hardware Control Mode.
Additional switching rates
available in Software Control
Mode.)
8
fS
RDS(ON)
fC
On Resistance of Output MOSFET (both
high-side and low-side)
–3-dB Corner Frequency of High-Pass
Filter
PVDD = 15 V, TA = 25 °C, Die
Only
120
mΩ
PVDD= 15V, TA = 25 °C,
Includes: Die, Bond Wires,
Leadframe
150
mΩ
fS = 44.1 kHz
3.7
fS = 48 kHz
fS = 88.2 kHz
fS = 96 kHz
(1)
8
4
7.4
Hz
8
The digital boost block contributes +6dB of gain to this value. The audio signal must be kept below -6dB to avoid clipping the digital
audio path.
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6.10 Speaker Amplifier in Stereo Bridge Tied Load (BTL) Mode
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
PARAMETER
ICN(SPK)
Po(SPK)
Po(SPK)
SNR(SPK)
(1)
Idle Channel Noise
Maximum Instantaneous
Output Power Per. Ch.
Maximum Continuous
Output Power Per. Ch. (1)
Signal to Noise Ratio
(Referenced to THD+N =
1%)
TEST CONDITIONS
MIN
TYP
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8 Ω, A-Weighted
66
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, A-Weighted
75
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, A-Weighted
79
PVDD = 24 V, SPK_GAIN[1:0] Pins =10,
RSPK = 8 Ω, A-Weighted
120
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 4 Ω, THD+N = 0.1%,
14.2
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8 Ω, THD+N = 0.1%
8
MAX
UNIT
µVrms
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4 Ω, THD+N = 0.1%,
21.9
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, THD+N = 0.1%
12.5
W
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4 Ω, THD+N = 0.1%,
33.5
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, THD+N = 0.1%
20
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 4 Ω, THD+N = 0.1%,
55.2
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8 Ω, THD+N = 0.1%
31.8
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 4 Ω, THD+N = 0.1%,
14
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8 Ω, THD+N = 0.1%
8
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4 Ω, THD+N = 0.1%,
13.25
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, THD+N = 0.1%
12.5
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4 Ω, THD+N = 0.1%,
12.25
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, THD+N = 0.1%
20
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 4 Ω, THD+N = 0.1%,
11
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8 Ω, THD+N = 0.1%
24
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8 Ω, A-Weighted, -60dBFS Input
99.7
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, A-Weighted, -60dBFS Input
98.2
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, A-Weighted, -60dBFS Input
100.4
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8 Ω, A-Weighted, -60dBFS Input
98.8
W
dB
The continuous power output of any amplifier is determined by the thermal performance of the amplifier as well as limitations placed on
it by the system around it, such as the PCB configuration and the ambient operating temperature. The performance characteristics listed
in this section are achievable on the TAS5760M-Q1's EVM, which is representative of the poplular "2 Layers / 1oz Copper" PCB
configuration in a size that is representative of the amount of area often provided to the amplifier section of popular consumer audio
electronics. As can be seen in the instantaneous power portion of this table, more power can be delivered from the TAS5760M-Q1 if
steps are taken to pull more heat out of the device. For instance, using a board with more layers or adding a small heatsink will result in
an increase of continuous power, up to and including the instantaneous power level. This behavior can also been seen in the POUT vs.
PVDD plots shown in the Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 384 kHz section of this data sheet.
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Speaker Amplifier in Stereo Bridge Tied Load (BTL) Mode (continued)
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
PARAMETER
THD+N(SPK)
X-Talk(SPK)
10
Total Harmonic Distortion
and Noise
Cross-talk (worst case
between LtoR and RtoL
coupling)
TEST CONDITIONS
MIN
TYP
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 4 Ω, Po = 1 W
0.02%
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8 Ω, Po = 1 W
0.03%
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4 Ω, Po = 1 W
0.03%
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, Po = 1 W
0.03%
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4 Ω, Po = 1 W
0.03%
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, Po = 1 W
0.04%
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 4 Ω, Po = 1 W
0.03%
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8 Ω, Po = 1 W
0.04%
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8 Ω, Input Signal 250 mVrms, 1kHz
Sine
–92
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, Input Signal 250 mVrms, 1kHz
Sine
–93
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8 Ω, Input Signal 250 mVrms, 1kHz
Sine
–94
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8 Ω, Input Signal 250 mVrms, 1kHz
Sine
–93
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UNIT
dB
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SLOS988B – SEPTEMBER 2017 – REVISED NOVEMBER 2019
6.11 Speaker Amplifier in Mono Parallel Bridge Tied Load (PBTL) Mode
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
PARAMETER
TEST CONDITIONS
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8Ω, A-Weighted
ICN
PO(SPK)
Idle Channel Noise
Maximum Instantaneous Output
Power
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, A-Weighted
MIN
TYP
MAX
UNIT
69
85
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, A-Weighted
85
PVDD = 24 V, SPK_GAIN[1:0] Pins =10,
RSPK = 8Ω, A-Weighted
131
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 2Ω, THD+N = 0.1%,
28.6
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 4Ω, THD+N = 0.1%,
15.9
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8Ω, THD+N = 0.1%
8.4
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 2Ω, THD+N = 0.1%,
43.2
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4Ω, THD+N = 0.1%,
25
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, THD+N = 0.1%
13.3
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 2Ω, THD+N = 0.1%,
68.3
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4Ω, THD+N = 0.1%,
40
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, THD+N = 0.1%
21.3
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 2Ω, THD+N = 0.1%,
114.7
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 4Ω, THD+N = 0.1%,
63.5
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8Ω, THD+N = 0.1%
34.1
µVrms
W
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Speaker Amplifier in Mono Parallel Bridge Tied Load (PBTL) Mode (continued)
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
PARAMETER
PO(SPK)
SNR
(1)
12
Maximum Continuous Output
Power (1)
Signal to Noise Ratio (Referenced
to THD+N = 1%)
TEST CONDITIONS
MIN
TYP
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 2Ω, THD+N = 0.1%,
30
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 4Ω, THD+N = 0.1%,
15.9
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8Ω, THD+N = 0.1%
8.4
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 2Ω, THD+N = 0.1%,
28.5
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4Ω, THD+N = 0.1%,
25
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, THD+N = 0.1%
13.3
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 2Ω, THD+N = 0.1%,
26.5
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4Ω, THD+N = 0.1%,
40
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, THD+N = 0.1%
21.3
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 2Ω, THD+N = 0.1%,
24
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 4Ω, THD+N = 0.1%,
40
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8Ω, THD+N = 0.1%
34.1
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8Ω, A-Weighted, -60dBFS Input
100.4
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, A-Weighted, -60dBFS Input
99.5
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, A-Weighted, -60dBFS Input
100.1
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8Ω, A-Weighted, -60dBFS Input
99.5
MAX
UNIT
W
dB
The continuous power output of any amplifier is determined by the thermal performance of the amplifier as well as limitations placed on
it by the system around it, such as the PCB configuration and the ambient operating temperature. The performance characteristics listed
in this section are achievable on the TAS5760M-Q1's EVM, which is representative of the poplular "2 Layers / 1oz Copper" PCB
configuration in a size that is representative of the amount of area often provided to the amplifier section of popular consumer audio
electronics. As can be seen in the instantaneous power portion of this table, more power can be delivered from the TAS5760M-Q1 if
steps are taken to pull more heat out of the device. For instance, using a board with more layers or adding a small heatsink will result in
an increase of continuous power, up to and including the instantaneous power level. This behavior can also been seen in the POUT vs.
PVDD plots shown in the Typical Characteristics (Mono PBTL Mode): fSPK_AMP = 384 kHz section of this data sheet.
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SLOS988B – SEPTEMBER 2017 – REVISED NOVEMBER 2019
Speaker Amplifier in Mono Parallel Bridge Tied Load (PBTL) Mode (continued)
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
PARAMETER
THD+N(SPK)
Total Harmonic Distortion and
Noise
TEST CONDITIONS
MIN
TYP
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 2Ω, Po = 1 W
0.03%
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 4Ω, Po = 1 W
0.02%
PVDD = 12 V, SPK_GAIN[1:0] Pins = 00,
RSPK = 8Ω, Po = 1 W
0.02%
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 2Ω, Po = 1 W
0.03%
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4Ω, Po = 1 W
0.02%
PVDD = 15 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, Po = 1 W
0.02%
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 2Ω, Po = 1 W
0.03%
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 4Ω, Po = 1 W
0.02%
PVDD = 19 V, SPK_GAIN[1:0] Pins = 01,
RSPK = 8Ω, Po = 1 W
0.03%
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 2Ω, Po = 1 W
0.03%
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 4Ω, Po = 1 W
0.02%
PVDD = 24 V, SPK_GAIN[1:0] Pins = 10,
RSPK = 8Ω, Po = 1 W
0.03%
MAX
UNIT
MAX
UNIT
400
pF
400
kHz
6.12 I²C Control Port
Test conditions (unless otherwise noted): TC = 25°C
PARAMETER
CL(I²C)
Support SCL frequency
tbuf
Bus Free time between STOP and
START conditions
No Wait States
Hold Time, SCL to SDA
th2(I²C)
Hold Time, START condition to SCL
TYP
1.3
Rise Time, SCL and SDA
th1(I²C)
tI²C(start)
MIN
Allowable Load Capacitance for Each I²C
Line
fSCL
tf(I²C)
TEST CONDITIONS
µS
300
0
ns
0.6
I²C Startup Time
ns
µs
12
mS
300
ns
tr(I²C)
Rise Time, SCL and SDA
tsu1(I²C)
Setup Time, SDA to SCL
100
ns
tsu2(I²C)
Setup Time, SCL to START condition
0.6
µS
tsu3(I²C)
Setup Time, SCL to STOP condition
0.6
µS
Tw(H)
Required Pulse Duration, SCL HIGH
0.6
µS
Tw(L)
Required Pulse Duration, SCL LOW
1.3
µS
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6.13 Typical Idle, Mute, Shutdown, Operational Power Consumption
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
VPVDD
[V]
RSPK
[Ω]
SPEAKER AMPLIFIER STATE
4
Idle
8
4
8
4
Mute
fSPK_AMP =
384kHz
Sleep
8
4
Shutdown
8
4
Idle
8
4
6
8
4
Mute
fSPK_AMP =
768kHz
Sleep
8
4
Shutdown
8
4
Idle
8
4
8
4
8
4
8
14
Mute
fSPK_AMP =
1152kHz
Sleep
Shutdown
IPVDD+AVDD
[mA]
IDVDD
[mA]
PDISS
[W]
23.48
3.73
0.15
23.44
3.72
0.15
23.53
3.72
0.15
23.46
3.72
0.15
13.26
0.48
0.08
13.27
0.53
0.08
0.046
0.04
0
0.046
0.03
0
30.94
3.71
0.2
30.94
3.71
0.2
29.37
3.71
0.19
29.39
3.71
0.19
13.24
0.5
0.08
13.23
0.52
0.08
0.046
0.03
0
0.046
0.03
0
39.39
3.7
0.25
39.43
3.7
0.25
36.91
3.7
0.23
36.9
3.69
0.23
13.17
0.53
0.08
13.13
0.45
0.08
0.046
0.03
0
0.046
0.03
0
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SLOS988B – SEPTEMBER 2017 – REVISED NOVEMBER 2019
Typical Idle, Mute, Shutdown, Operational Power Consumption (continued)
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
VPVDD
[V]
RSPK
[Ω]
SPEAKER AMPLIFIER STATE
4
Idle
8
4
8
4
Mute
fSPK_AMP =
384kHz
Sleep
8
4
Shutdown
8
4
Idle
8
4
12
8
4
Mute
fSPK_AMP =
768kHz
Sleep
8
4
Shutdown
8
4
Idle
8
4
8
4
Mute
fSPK_AMP =
1152kHz
8
4
8
Sleep
Shutdown
IPVDD+AVDD
[mA]
IDVDD
[mA]
PDISS
[W]
32.95
3.74
0.41
32.93
3.73
0.41
32.98
3.73
0.41
32.97
3.73
0.41
12.71
0.47
0.15
12.75
0.5
0.15
0.053
0.04
0
0.053
0.04
0
44.84
3.73
0.55
44.82
3.73
0.55
42.71
3.72
0.52
42.66
3.72
0.52
12.71
0.49
0.15
12.73
0.52
0.15
0.063
0.03
0
0.053
0.03
0
59.3
3.73
0.72
59.3
3.73
0.72
55.74
3.72
0.68
55.74
3.72
0.68
12.67
0.49
0.15
12.61
0.43
0.15
0.053
0.02
0
0.053
0.03
0
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Typical Idle, Mute, Shutdown, Operational Power Consumption (continued)
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
VPVDD
[V]
RSPK
[Ω]
SPEAKER AMPLIFIER STATE
4
Idle
8
4
8
4
Mute
fSPK_AMP =
384kHz
Sleep
8
4
Shutdown
8
4
Idle
8
4
19
8
4
Mute
fSPK_AMP =
768kHz
Sleep
8
4
Shutdown
8
4
Idle
8
4
8
4
8
4
8
16
Mute
fSPK_AMP =
1152kHz
Sleep
Shudown
IPVDD+AVDD
[mA]
IDVDD
[mA]
PDISS
[W]
42
3.73
0.81
41.92
3.73
0.81
41.93
3.73
0.81
41.97
3.72
0.81
12.95
0.47
0.25
13
0.52
0.25
0.072
0.04
0
0.072
0.03
0
55.86
3.73
1.07
55.82
3.73
1.07
51.72
3.72
0.99
51.69
3.72
0.99
12.96
0.47
0.25
12.95
0.51
0.25
0.072
0.03
0
0.062
0.03
0
74.87
3.72
1.43
74.81
3.72
1.43
67.96
3.71
1.3
67.91
3.71
1.3
12.94
0.51
0.25
12.84
0.42
0.25
0.062
0.03
0
0.062
0.03
0
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SLOS988B – SEPTEMBER 2017 – REVISED NOVEMBER 2019
Typical Idle, Mute, Shutdown, Operational Power Consumption (continued)
Test conditions (unless otherwise noted): TC = 25°C, input signal is 1 kHz Sine
VPVDD
[V]
RSPK
[Ω]
IPVDD+AVDD
[mA]
IDVDD
[mA]
PDISS
[W]
48.03
3.73
1.17
47.98
3.73
1.16
Mute
47.99
3.72
1.16
48
3.72
1.16
Sleep
13.12
0.49
0.32
13.14
0.48
0.32
0
SPEAKER AMPLIFIER STATE
4
Idle
8
4
8
4
fSPK_AMP =
384kHz
8
4
0.088
0.03
8
Shutdown
0.088
0.03
0
4
62.84
3.72
1.52
62.84
3.72
1.52
57.12
3.71
1.38
57.07
3.71
1.38
13.19
0.47
0.32
13.14
0.49
0.32
0.078
0.03
0
0.078
0.03
0
84.86
3.71
2.05
84.83
3.71
2.05
75.07
3.7
1.81
75.01
3.71
1.81
13.11
0.51
0.32
13.03
0.43
0.31
0.078
0.03
0
0.078
0.03
0
Idle
8
4
24
8
4
Mute
fSPK_AMP =
768kHz
Sleep
8
4
Shutdown
8
4
Idle
8
4
8
4
Mute
fSPK_AMP =
1152kHz
8
4
8
Sleep
Shutdown
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6.14 Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 384 kHz
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for 8 Ω = 22 µH + 0.68 µF,
Filter used for 6 Ω = 15 µH + 0.68 µF, Filter used for 4 Ω = 10 µH + 0.68 µF unless otherwise noted.
50
40
35
30
25
20
15
5
THD+N = 10%
4
6
8
10
12 14 16 18
Supply Voltage (V)
20
22
24
Noise (µVRMS)
1
0.1
0.01
100
1k
Frequency (Hz)
10k
20k
G025
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
8
1
1
THD+N (%)
THD+N (%)
10
0.1
1
Output Power (W)
10
10
G024
12
14
16
18
Supply Voltage (V)
20
22
24
G026
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
0.1
50
0.001
0.01
G027
PVDD = 12 V, Both Channels Driven
Figure 5. THD+N vs Output Power
18
20k
0.01
RL = 4Ω
RL = 6Ω
RL = 8Ω
0.1
10k
Figure 4. Idle Channel Noise vs PVDD
10
0.001
0.01
1k
Frequency (Hz)
Ch1 ICN @ Gain = 00
Ch2 ICN @ Gain = 00
Ch1 ICN @ Gain = 01
Ch2 ICN @ Gain = 01
Ch1 ICN @ Gain = 10
Ch2 ICN @ Gain = 10
Idle Channel
RL = 8 Ω
PVDD = 24 V, POSPK = 1 W
Figure 3. THD+N vs Frequency
0.01
100
PVDD = 12 V, POSPK = 1 W
Figure 2. THD+N vs Frequency
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
20
20
G001
10
THD+N (%)
0.001
26
Thermal Limits are referenced to TAS5760xxEVM Rev D
Figure 1. Output Power vs PVDD
0.001
0.1
0.01
10
0
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
1
THD+N (%)
Maximum Output Power (W)
10
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
4 Ω Thermal Limit
6 Ω Thermal Limit
8 Ω Thermal Limit
45
0.1
1
Output Power (W)
10
50
G028
PVDD = 18 V, Both Channels Driven
Figure 6. THD+N vs Output Power
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Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 384 kHz (continued)
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for 8 Ω = 22 µH + 0.68 µF,
Filter used for 6 Ω = 15 µH + 0.68 µF, Filter used for 4 Ω = 10 µH + 0.68 µF unless otherwise noted.
10
RL = 8 Ω
95
90
Power Efficiency (%)
1
THD+N (%)
100
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
0.1
0.01
85
80
75
70
65
PVDD = 12 V
PVDD = 18 V
PVDD = 24 V
60
0.001
0.01
55
0.1
1
Output Power (W)
10
80
50
G029
0
5
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
−110
−120
−130
−140
0
PVCC = 24 V
RL = 4 Ω
Right−to−Left
Left−to−Right
15
20 25 30 35 40 45
Total Output Power (W)
RL = 8 Ω
−10
50
55
60
G030
PVDD = 12 V
PVDD = 18 V
PVDD = 24 V
−20
−30
−40
−50
−60
−70
−80
20
100
1k
Frequency (Hz)
10k
−90
20k
20
100
G031
Figure 9. Crosstalk vs Frequency
0
RL = 8 Ω
DVDD = 3.3 V + 200 mVP-P
−10
−20
1k
Frequency (Hz)
10k
20k
G019
Figure 10. PVDD PSRR vs Frequency
40
PVDD = 12 V
PVDD = 18 V
PVDD = 24 V
RL = 8 Ω
35
−30
Current (mA)
PSRR (dB)
10
Figure 8. Efficiency vs Output Power
PSRR (dB)
Crosstalk (dB)
PVDD = 24 V, Both Channels Driven
Figure 7. THD+N vs Output Power
−40
−50
−60
30
25
−70
−80
−90
20
100
1k
Frequency (Hz)
10k
20k
20
8
G020
Figure 11. DVDD PSRR vs Frequency
10
12
14
16
18
PVDD (V)
20
22
24
G042
Figure 12. Idle Current Draw vs PVDD (Filterless)
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Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 384 kHz (continued)
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for 8 Ω = 22 µH + 0.68 µF,
Filter used for 6 Ω = 15 µH + 0.68 µF, Filter used for 4 Ω = 10 µH + 0.68 µF unless otherwise noted.
40
60
RL = 8 Ω
55
Current (µA)
35
Current (mA)
RL = 8 Ω
30
50
45
25
40
20
8
10
12
14
16
18
PVDD (V)
20
22
24
35
G023
With LC Filter as Shown on the EVM
Figure 13. Idle Current Draw vs PVDD
8
10
12
14
16
18
PVDD (V)
20
22
24
G022
Figure 14. Shutdown Current Draw vs PVDD (Filterless)
6.15 Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 768 kHz
At TA = 25°C, fSPK_AMP = 768 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for 8 Ω = 22 µH + 0.68 µF,
Filter used for 6 Ω = 15 µH + 0.68 µF, Filter used for 4 Ω = 10 µH + 0.68 µF unless otherwise noted.
50
40
35
30
25
20
15
5
THD+N = 10%
4
6
8
10
12 14 16 18
Supply Voltage (V)
20
22
24
Noise (µVRMS)
THD+N (%)
1
0.1
0.01
100
100
1k
Frequency (Hz)
10k
20k
G003
PVDD = 24 V, POSPK = 1 W
Figure 17. THD+N vs Frequency
1k
Frequency (Hz)
10k
20k
G002
PVDD = 12 V, POSPK = 1 W
Figure 16. THD+N vs Frequency
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
20
20
G039
10
20
0.001
26
Thermal Limits are referenced to TAS5760xxEVM Rev D
Figure 15. Output Power vs PVDD
0.001
0.1
0.01
10
0
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
1
THD+N (%)
Maximum Output Power (W)
10
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
4 Ω Thermal Limit
6 Ω Thermal Limit
8 Ω Thermal Limit
45
130
120
110
100
90
80
70
60
50
40
30
20
10
0
Idle Channel
RL = 8 Ω
Ch1 ICN @ Gain = 00
Ch2 ICN @ Gain = 00
Ch1 ICN @ Gain = 01
Ch2 ICN @ Gain = 01
Ch1 ICN @ Gain = 10
Ch2 ICN @ Gain = 10
8
10
12
14
16
18
PVDD (V)
20
22
24
G006
Figure 18. Idle Channel Noise vs PVDD
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Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 768 kHz (continued)
At TA = 25°C, fSPK_AMP = 768 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for 8 Ω = 22 µH + 0.68 µF,
Filter used for 6 Ω = 15 µH + 0.68 µF, Filter used for 4 Ω = 10 µH + 0.68 µF unless otherwise noted.
10
0.1
0.01
0.1
0.01
0.001
0.01
0.1
1
Output Power per Channel (W)
10
10
0.001
0.01
30
10
100
G009
RL = 8 Ω
95
90
85
Efficiency (%)
0.1
80
75
70
65
0.01
PVDD = 12 V
PVDD = 18 V
PVDD = 24 V
60
0.001
0.01
55
0.1
1
10
Output Power per Channel (W)
60
50
G010
0
PVDD = 24 V, Both Channels Driven
Figure 21. THD+N vs Output Power
0
PVDD = 24 V
RL = 4 Ω
−20
Right-to-Left
Left-to-Right
10
15
20
Output Power per Channel (W)
RL = 8 Ω
−10
25
30
G014
PVDD = 12 V
PVDD = 18 V
PVDD = 24 V
−20
−30
−40
PSRR (dB)
Crosstalk (dB)
5
Figure 22. Efficiency vs Output Power
0
−10
−50
−60
−70
−30
−40
−50
−60
−80
−70
−90
−80
−100
−110
40
PVDD = 18 V, Both Channels Driven
Figure 20. THD+N vs Output Power
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
1
0.1
1
Output Power per Channel (W)
G008
PVDD = 12 V, Both Channels Driven
Figure 19. THD+N vs Output Power
THD+N (%)
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
1
THD+N (%)
1
THD+N (%)
10
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
20
100
1k
Frequency (Hz)
10k
20k
−90
20
G018
Figure 23. Crosstalk vs Frequency
100
1k
Frequency (Hz)
10k
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G019
Figure 24. PVDD PSRR vs Frequency
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Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 768 kHz (continued)
At TA = 25°C, fSPK_AMP = 768 kHz, input signal is 1 kHz Sine, unless otherwise noted. Filter used for 8 Ω = 22 µH + 0.68 µF,
Filter used for 6 Ω = 15 µH + 0.68 µF, Filter used for 4 Ω = 10 µH + 0.68 µF unless otherwise noted.
60
RL = 8 Ω
65
55
60
50
Current (mA)
Current (mA)
70
55
50
45
RL = 8 Ω
45
40
35
30
40
25
35
20
30
8
10
12
14
16
18
PVDD (V)
20
22
G045
Figure 25. Idle Current Draw vs PVDD (Filterless)
60
8
10
12
14
24
16
18
PVDD (V)
20
22
24
G044
With LC Filter as Shown on EVM
Figure 26. Idle Current Draw vs PVDD
RL = 8 Ω
Current (µA)
55
50
45
40
35
8
10
12
14
16
18
PVDD (V)
20
22
24
G022
Figure 27. Shutdown Current Draw vs PVDD (Filterless)
22
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6.16 Typical Characteristics (Mono PBTL Mode): fSPK_AMP = 384 kHz
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine unless otherwise noted.
10
0.1
0.01
0.001
20
100
1k
Frequency (Hz)
10k
0.001
20k
100
1k
Frequency (Hz)
10k
20k
G033
PVDD = 24 V, POSPK = 1 W
Figure 29. THD+N vs Frequency
1
THD+N (%)
Noise (µVRMS)
20
G032
10
RL = 2 Ω
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
0.1
0.01
Gain = 00
Gain = 01
Gain = 10
Idle Channel
RL = 8 Ω
8
10
12
14
16
18
Supply Voltage (V)
20
22
0.001
0.01
G034
50
G035
1
0.01
0.1
0.01
0.1
10
10
RL = 2 Ω
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
0.1
0.001
0.01
1
Output Power (W)
PVDD = 12 V With 1 kHz Sine Input
Figure 31. THD+N vs Output Power
THD+N (%)
1
0.1
24
Figure 30. Idle Channel Noise vs PVDD
10
THD+N (%)
0.1
0.01
PVDD = 12 V, POSPK = 1 W
Figure 28. THD+N vs Frequency
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
RL = 2 Ω
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
1
THD+N (%)
1
THD+N (%)
10
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
1
Output Power (W)
10
100
0.001
0.01
G036
PVDD = 18 V With 1 kHz Sine Input
Figure 32. THD+N vs Output Power
RL = 2 Ω
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
0.1
1
10
Output Power (W)
100 200
G037
PVDD = 24 V With 1 kHz Sine Input
Figure 33. THD+N vs Output Power
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Typical Characteristics (Mono PBTL Mode): fSPK_AMP = 384 kHz (continued)
At TA = 25°C, fSPK_AMP = 384 kHz, input signal is 1 kHz Sine unless otherwise noted.
100
RL = 4 Ω
95
Power Efficiency (%)
90
85
80
75
70
65
PVDD = 12 V
PVDD = 18 V
PVDD = 24 V
60
55
50
0
5
10
15
20 25 30 35 40 45
Total Output Power (W)
50
55
60
G038
Figure 34. Efficiency vs Output Power
6.17 Typical Characteristics (Mono PBTL Mode): fSPK_AMP = 768 kHz
At TA = 25°C, fSPK_AMP = 768 kHz, input signal is 1 kHz Sine unless otherwise noted.
10
0.1
0.01
0.001
20
100
1k
Frequency (Hz)
10k
0.001
20k
100
1k
Frequency (Hz)
10k
20k
G005
PVDD = 24 V, POSPK = 1 W
Figure 36. THD+N vs Frequency
10
1
THD+N (%)
Noise (µVRMS)
20
G004
RL = 2 Ω
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
0.1
0.01
ICN @ Gain = 00
ICN @ Gain = 01
ICN @ Gain = 10
Idle Channel
RL = 8 Ω
8
10
12
14
16
18
PVDD (V)
20
22
24
0.001
0.01
G007
Figure 37. Idle Channel Noise vs PVDD
24
0.1
0.01
PVDD = 12 V, POSPK = 1 W
Figure 35. THD+N vs Frequency
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
RL = 2 Ω
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
1
THD+N (%)
1
THD+N (%)
10
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
0.1
1
Output Power (W)
10
50
G011
Figure 38. THD+N vs Output Power With PVDD = 12 V
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Typical Characteristics (Mono PBTL Mode): fSPK_AMP = 768 kHz (continued)
At TA = 25°C, fSPK_AMP = 768 kHz, input signal is 1 kHz Sine unless otherwise noted.
THD+N (%)
1
10
RL = 2 Ω
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
0.1
0.01
0.001
0.01
RL = 2 Ω
RL = 4 Ω
RL = 6 Ω
RL = 8 Ω
1
THD+N (%)
10
0.1
0.01
0.1
1
Output Power (W)
10
100
0.001
0.01
0.1
1
10
Output Power (W)
G012
Figure 39. THD+N vs Output Power With PVDD = 18 V
100
100 200
G013
Figure 40. THD+N vs Output Power With PVDD = 24 V
RL = 4 Ω
95
Efficiency (%)
90
85
80
75
70
65
PVDD = 12 V
PVDD = 18 V
PVDD = 24 V
60
55
50
0
10
20
30
40
Output Power (W)
50
60
G015
Figure 41. Efficiency vs Output Power
7 Parameter Measurement Information
All parameters are measured according to the conditions described in Specifications.
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8 Detailed Description
8.1 Overview
The TAS5760M-Q1 is a flexible and easy-to-use stereo class-D speaker amplifier with an I²S input serial audio
port. The TAS5760M-Q1 supports a variety of audio clock configurations via two speed modes. In Hardware
Control mode, the device only operates in single-speed mode. When used in Software Control mode, the device
can be placed into double speed mode to support higher sample rates, such as 88.2 kHz and 96 kHz. The
outputs of the TAS5760M-Q1 can be configured to drive two speakers in stereo Bridge Tied Load (BTL) mode or
a single speaker in Parallel Bridge Tied Load (PBTL) mode.
Only two power supplies are required for the TAS5760M-Q1. They are a 3.3-V power supply, called VDD, for the
small signal analog and digital and a higher voltage power supply, called PVDD, for the output stage of the
speaker amplifier. To enable use in a variety of applications, PVDD can be operated over a large range of
voltages, as specified in the Recommended Operating Conditions.
To configure and control the TAS5760M-Q1, two methods of control are available. In Hardware Control Mode,
the configuration and real-time control of the device is accomplished through hardware control pins. In Software
Control mode, the I²C control port is used both to configure the device and for real-time control. In Software
Control Mode, several of the hardware control pins remain functional, such as the SPK_SD, SPK_FAULT, and
SFT_CLIP pins.
8.2 Functional Block Diagram
Functional Block Diagram
DVDD
ANA_REG
Internal
Voltage
Supplies
AVDD
Internal Reference
Regulators
GVDD_REG
Internal Gate
Drive Regulator
Closed Loop Class D Amplifier
SFT_CLIP
MCLK
SCLK
LRCK
SDIN
PVDD
Serial
Audio
Port
Digital
Boost
&
Volume
Control
Digital
Clipper
Digital to
PWM
Conversion
Soft
Clipper
Analog
Gain
Gate
Drives
Gate
Drives
Full Bridge
Power Stage
A
SPK_OUTA+
OverCurrent
Protection
Full Bridge
Power Stage
B
SPK_OUTASPK_OUTB+
SPK_OUTB-
Clock Monitoring
Die
Temp. Monitor
Internal Control Registers and State Machines
PBTL/ SPK_GAIN0 SPK_GAIN1 SPK_SD SPK_FAULT SPK_SLEEP/ FREQ/
ADR
SDA
SCL
26
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8.3 Feature Description
8.3.1 Power Supplies
The power supply requirements for the TAS5760M-Q1 consist of one 3.3-V supply to power the low voltage
analog and digital circuitry and one higher-voltage supply to power the output stage of the speaker amplifier.
Several on-chip regulators are included on the TAS5760M-Q1 to generate the voltages necessary for the internal
circuitry of the audio path. It is important to note that the voltage regulators which have been integrated are sized
only to provide the current necessary to power the internal circuitry. The external pins are provided only as a
connection point for off-chip bypass capacitors to filter the supply. Connecting external circuitry to these regulator
outputs may result in reduced performance and damage to the device.
8.3.2 Speaker Amplifier Audio Signal Path
Figure 42 shows a block diagram of the speaker amplifier of the TAS5760M-Q1. In Hardware Control mode, a
limited subset of audio path controls are made available via external pins, which are pulled HIGH or LOW to
configure the device. In Software Control Mode, the additional features and configurations are available. All of
the available controls are discussed in this section, and the subset of controls that available in Hardware Control
Mode are discussed in the respective section below.
Digital Gain
(GDIG)
Analog Gain
(GANA)
Closed Loop Class D Amplifier
HPF
Serial
Audio In
Serial
Audio
Port
Digital
Boost
&
Volume
Control
Interpolation
Filter
123456
Digital
Clipper
Digital to PWM
Conversion
011010..
.
Gate
Drives
Gate
Drives
Full Bridge
Power Stage
A
Full Bridge
Power Stage
B
PWM
Audio Out
SFT_CLIP
Figure 42. Speaker Amplifier Audio Signal Path
8.3.2.1 Serial Audio Port (SAP)
The serial audio port (SAP) receives audio in either I²S, Left Justified, or Right Justified formats. In Hardware
Control mode, the device operates only in 32, 48 or 64 x fS I²S mode. In Software Control mode, additional
options for left-justified and right justified audio formats are available. The supported clock rates and ratios for
Hardware Control Mode and Software Control Mode are detailed in their respective sections below.
8.3.2.1.1 I²S Timing
I²S timing uses LRCK to define when the data being transmitted is for the left channel and when it is for the right
channel. LRCK is LOW for the left channel and HIGH for the right channel. A bit clock, called SCLK, runs at 32,
48, or 64 × fS and is used to clock in the data. There is a delay of one bit clock from the time the LRCK signal
changes state to the first bit of data on the data lines. The data is presented in 2's-complement form (MSB-first)
and is valid on the rising edge of bit clock.
8.3.2.1.2 Left-Justified
Left-justified (LJ) timing also uses LRCK to define when the data being transmitted is for the left channel and
when it is for the right channel. LRCK is HIGH for the left channel and LOW for the right channel. A bit clock
running at 32, 48, or 64 × fS is used to clock in the data. The first bit of data appears on the data lines at the
same time LRCK toggles. The data is written MSB-first and is valid on the rising edge of the bit clock. The
TAS5760M-Q1 can accept digital words from 16 to 24 bits wide and pads any unused trailing data-bit positions in
the L/R frame with zeros before presenting the digital word to the audio signal path.
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Feature Description (continued)
8.3.2.1.3 Right-Justified
Right-justified (RJ) timing also uses LRCK to define when the data being transmitted is for the left channel and
when it is for the right channel. LRCK is HIGH for the left channel and LOW for the right channel. A bit clock
running at 32, 48, or 64 × fS is used to clock in the data. The first bit of data appears on the data 8 bit-clock
periods (for 24-bit data) after LRCK toggles. In RJ mode the LSB of data is always clocked by the last bit clock
before LRCK transitions. The data is written MSB-first and is valid on the rising edge of bit clock. The
TAS5760M-Q1 pads unused leading data-bit positions in the left/right frame with zeros before presenting the
digital word to the audio signal path.
8.3.2.2 DC Blocking Filter
Excessive DC content in the audio signal can damage loudspeakers and even small amounts of DC offset in the
signal path cause cause audible artifacts when muting and unmuting the speaker amplifier. For these reasons,
the amplifier employs two separate DC blocking methods for the speaker amplifier. The first is a high-pass filter
provided at the front of the data path to remove any DC from incoming audio data before it is presented to the
audio path. The –3 dB corner frequencies for the filter are specified in the speaker amplifier electrical
characteristics table. In Hardware Control mode, the DC blocking filter is active and cannot be disabled. In
Software Control mode, the filter can be bypassed by writing a 1 to bit 7 of register 0x02. The second method is
a DC detection circuit that will shutdown the power stage and issue a latching fault if DC is found to be present
on the output due to some internal error of the device. This DC Error (DCE) protection is discussed in the
Protection Circuitry section below.
8.3.2.3 Digital Boost and Volume Control
Following the high-pass filter, a digital boost block is included to provide additional digital gain if required for a
given application as well as to set an appropriate clipping point for a given GAIN[1:0] pin configuration when in
Hardware Control mode. The digital boost block defaults to +6dB when the device is in Hardware Mode. In most
use cases, the digital boost block will remain unchanged when operating the device in Software Control mode, as
the volume control offers sufficient digital gain for most applications. The TAS5760M-Q1's digital volume control
operates from Mute to 24 dB, in steps of 0.5 dB. The equation below illustrates how to set the 8-bit volume
control register at address 0x04:
DVC [Hex Value] = 0xCF + (DVC [dB] / 0.5 [dB] )
(1)
Transitions between volume settings will occur at a rate of 0.5 dB every 8 LRCK cycles to ensure no audible
artifacts occur during volume changes. This volume fade feature can be disabled via Bit 7 of the Volume Control
Configuration Register.
8.3.2.4 Digital Clipper
A digital clipper is integrated in the oversampled domain to provide a component-free method to set the clip point
of the speaker amplifier. Through the "Digital Clipper Level x" controls in the I²C control port, the point at which
the oversampled digital path clips can be set directly, which in turns sets the 10% THD+N operating point of the
amplifier. This is useful for applications in which a single system is designed for use in several end applications
that have different power rating specifications. Its place in the oversampled domain ensures that the digital
clipper is acoustically appealing and reduces or eliminates tones which would otherwise foldback into the audio
band during clipping events. Figure 43 shows a block diagram of the digital clipper.
Digital Clipper
Digital to PWM
Conversion
22 Bit Audio Sample in Data Path
Mux
20 Bit Digital Clipper Level in Control Port
011010..
.
Digital
Comparator
Figure 43. Digital Clipper Simplified Block Diagram
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Feature Description (continued)
As mentioned previously, the audio signature of the amplifier when the digital clipper is active is very smooth,
owing to its place in the signal chain. Figure 44 shows the typical behavior of the clipping events.
no liminting
PLI MIT = 6D
PLI MIT = 4D
PLI MIT = 2D
Figure 44. Digital Clipper Example Waveform for Various Settings of Digital Clip Level [19:0]
It is important to note that the actual signal developed across the speaker will be determined not only by the
digital clipper, but also the analog gain of the amplifier. Depending on the analog gain settings and the PVDD
level applied, clipping could occur as a result of the voltage swing that is determined by the gain being larger
than the available PVDD supply rail. The gain structures are discussed in detail below for both Hardware Control
Mode and Software Control Mode.
8.3.2.5 Closed-Loop Class-D Amplifier
Following the digital clipper, the interpolated audio data is next sent to the Closed-Loop Class-D amplifier, whose
first stage is Digital to PWM Conversion (DPC) block. In this block, the stereo audio data is translated into two
pairs of complimentary pulse width modulated (PWM) signals which are used to drive the outputs of the speaker
amplifer. Feedback loops around the DPC ensure constant gain across supply voltages, reduce distortion, and
increase immunity to power supply injected noise and distortion. The analog gain is also applied in the Class-D
amplifier section of the device. The gain structures are discussed in detail below for both Hardware Control Mode
and Software Control Mode.
The switching rate of the amplifier is configurable in both Hardware Control Mode and Software Control Mode. In
both cases, the PWM switching frequency is a multiple of the sample rate. This behavior is described in the
respective Hardware Control Mode and Software Control Mode sections below.
8.3.3 Speaker Amplifier Protection Suite
The speaker amplifier in the TAS5760M-Q1 includes a robust suite of error handling and protection features. It is
protected against Over-Current, Under-Voltage, Over-Voltage, Over-Temperature, DC, and Clock Errors. The
status of these errors is reported via the SPK_FAULT pin and the appropriate error status register in the I²C
Control Port. The error or handling behavior of the device is characterized as being either "Latching" or "NonLatching" depending on what is required to clear the fault and resume normal operation (that is playback of
audio).
For latching errors, the SPK_SD pin or the SPK_SD bit in the control port must be toggled in order to clear the
error and resume normal operation. If the error is still present when the SPK_SD pin or bit transitions from LOW
back to HIGH, the device will again detect the error and enter into a fault state resulting in the error status bit
being set in the control port and the SPK_FAULT line being pulled LOW. If the error has been cleared (for
example, the temperature of the device has decreased below the error threshold) the device will attempt to
resume normal operation after the SPK_SD pin or bit is toggled and the required fault time out period
(TSPK_FAULT ) has passed. If the error is still present, the device will once again enter a fault state and must be
placed into and brought back out of shutdown in order to attempt to clear the error.
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Feature Description (continued)
For non-latching errors, the device will automatically resume normal operation (that is playback) once the error
has been cleared. The non-latching errors, with the exception of clock errors will not cause the SPK_FAULT line
to be pulled LOW. It is not necessary to toggle the SPK_SD pin or bit in order to clear the error and resume
normal operation for non-latching errors. Table 1 details the types of errors protected by the TAS5760M-Q1's
Protection Suite and how each are handled.
8.3.3.1 Speaker Amplifier Fault Notification (SPK_FAULT Pin)
In both Hardware and Software Control mode, the SPK_FAULT pin of the TAS5760M-Q1 serves as a fault
indicator to notify the system that a fault has occurred with the speaker amplifier by being actively pulled LOW.
This pin is an open-drain output pin and, unless one is provided internal to the receiver, requires an external
pullup to set the net to a known value. The behavior of this pin varies based upon the type of error which has
occurred.
In the case of a latching error, the fault line will remain LOW until such time that the TAS5760M-Q1 has resumed
normal operation (that is the SPK_SD pin has been toggled and TSPK_FAULT has passed).
With the exception of clock errors, non-latching errors will not cause the SPK_FAULT pin to be pulled LOW.
Once a non-latching error has been cleared, normal operation will resume. For clocking errors, the SPK_FAULT
line will be pulled LOW, but upon clearing of the clock error normal operation will resume automatically, that is,
with no TSPK_FAULT delay.
One method which can be used to convert a latching error into an auto-recovered, non-latching error is to
connect the SPK_FAULT pin to the SPK_SD pin. In this way, a fault condition will automatically toggle the
SPK_SD pin when the SPK_FAULT pin goes LOW and returns HIGH after the TSPK_FAULT period has passed.
Table 1. Protection Suite Error Handling Summary
ERROR
CAUSE
FAULT TYPE
ERROR IS CLEARED BY:
Overvoltage Error
(OVE)
PVDD level rises above that specified by
OVERTHRES(PVDD)
Non-Latching
(SPK_FAULT
Pin is not pulled
LOW)
PVDD level returning below OVETHRES(PVDD)
Undervoltage Error
(UVE)
PVDD voltage level drops below that
specified by UVEFTHRES(SPK)
Non-Latching
(SPK_FAULT
Pin is not pulled
LOW)
PVDD level returning above UVETHRES(PVDD)
Non-Latching
(SPK_FAULT
Pin is pulled
LOW)
Clocks returning to valid state
Speaker Amplifier output current has
increased above the level specified by
OCETHRES
Latching
TSPK_FAULT has passed AND SPK_SD Pin or Bit
Toggle
DC Detect Error
(DCE)
DC offset voltage on the speaker
amplifier output has increased above the
level specified by the DCETHRES
Latching
TSPK_FAULT has passed AND SPK_SD Pin or Bit
Toggle
Overtemperature Error
(OTE)
The temperature of the die has increased
above the level specified by the
OTETHRES
Latching
TSPK_FAULT has passed AND SPK_SD Pin or Bit
Toggle AND the temperature of the device has
reached a level below that which is dictated by the
OTEHYST specification
Clock Error
(CLKE)
Overcurrent Error
(OCE)
One or more of the following errors has
occured:
1. Non-Supported MCLK to LRCK
and/or SCLK to LRCK Ratio
2. Non-Supported MCLK or LRCK rate
3. MCLK, SCLK, or LRCK has stopped
8.3.3.2 DC Detect Protection
The TAS5760M-Q1 has circuitry which will protect the speakers from DC current which might occur due to an
internal amplifier error. The device behavior in response to a DCE event is detailed in the table in the previous
section.
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A DCE event occurs when the output differential duty-cycle of either channel exceeds 60% for more than 420
msec at the same polarity. The table below shows some examples of the typical DCE Protection threshold for
several values of the supply voltage. This feature protects the speaker from large DC currents or AC currents
less than 2 Hz.
The minimum output offset voltages required to trigger the DC detect are listed in Table 2. The outputs must
remain at or above the voltage listed in the table for more than 420 msec to trigger the DC detect.
Table 2. DC Detect Threshold
PVDD [V]
|VOS|- OUTPUT OFFSET VOLTAGE [V]
4.5
0.96
6
1.30
12
2.60
18
3.90
8.4 Device Functional Modes
8.4.1 Hardware Control Mode
For systems which do not require the added flexibility of the I²C control port or do not have an I²C host controller,
the TAS5760M-Q1 can be used in Hardware Control Mode. In this mode of operation, the device operates in its
default configuration and any changes to the device are accomplished via the hardware control pins, described
below. The audio performance between Hardware and Software Control mode is identical, however more
features and functionality are available when the device is operated in Software Control mode. The behavior of
these Hardware Control Mode pins is described in the sections below.
Several static I/O's are present on the TAS5760M-Q1 which are meant to be configured during PCB design and
not changed during normal operation. Some examples of these are the GAIN[1:0] and PBTL/SCL pins. These
pins are often referred to as being tied or pulled LOW or tied or pulled HIGH. A pin which is tied or pulled LOW
has been connected directly to the system ground. The TAS5760M-Q1 is configured such that the most popular
use cases for the device (that is BTL mode, 768-kHz switching frequency, and so forth) require the static I/O
lines to be tied LOW. This ensures optimum thermal performance as well as BOM reduction.
Device pins that need to be tied or pulled HIGH should be connected to DVDD. For these pins, a pull-up resistor
is recommended to limit the slew rate of the voltage which is presented to the pin during power up. Depending
on the output impedance of the supply, and the capacitance connected to the DVDD net on the board, slew rates
of this node could be high enough to trigger the integrated ESD protection circuitry at high current levels, causing
damage to the device. It is not necessary to have a separate pull-up resistor for each static digital I/O pin.
Instead, a single resistor can be connected to DVDD and all static I/O lines which are to be tied HIGH can be
connected to that pull-up resistor. This connectivity is shown in the Typical Application Circuits. These pullup
resistors are not required when the digital I/O pins are driven by a controlled driver, such as a digital control line
from a systems processor, as the output buffer in the system processor will ensure a controlled slew rate.
8.4.1.1 Speaker Amplifier Shut Down (SPK_SD Pin)
In both Hardware and Software Control mode, the SPK_SD pin is provided to place the speaker amplifier into
shutdown. Driving this pin LOW will place the device into shutdown, while pulling it HIGH (to DVDD) will bring the
device out of shutdown. This is the lowest power consumption mode that the device can be placed in while the
power supplies are up. If the device is placed into shutdown while in normal operation, an audible artifact may
occur on the output. To avoid this, the device should first be placed into sleep mode, by pulling the
SPK_SLEEP/ADR pin HIGH before pulling the SPK_SD low.
8.4.1.2 Serial Audio Port in Hardware Control Mode
When used in Hardware Control Mode, the Serial Audio Port (SAP) accepts only I2S formatted data. Additionally,
the device operates in Single-Speed Mode (SSM), which means that supported sample rates, MCLK rates, and
SCLK rates are limited to those shown in the table below. Additional clocking options, including higher sample
rates, are available when operating the device in Software Control Mode.
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Device Functional Modes (continued)
Table 3 details the supported SCLK rates for each of the available sample rate and MCLK rate configurations.
For each fS and MCLK rate, the supported SCLK rates are shown and are represented in multiples of the sample
rate, which is written as "x fS".
Table 3. Supported SCLK Rates in Hardware Control Mode (Single Speed Mode)
MCLK Rate
[x fS]
Sample Rate [kHz]
128
192
12
N/S
N/S
16
N/S
N/S
24
N/S
32, 48, 64
32
32, 48, 64
38
32, 48, 64
44.1
48
256
384
512
N/S
N/S
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
8.4.1.3 Soft Clipper Control (SFT_CLIP Pin)
The TAS5760M-Q1 has a soft clipper that can be used to clip the output voltage level below the supply rail.
When this circuit is active, the amplifier operates as if it was powered by a lower supply voltage, and thereby
enters into clipping sooner than if the circuit was not active. The result is clipping behavior very similar to that of
clipping at the PVDD rail, in contrast to the digital clipper behavior which occurs in the oversampled domain of
the digital path. The point at which clipping begins is controlled by a resistor divider from GVDD_REG to ground,
which sets the voltage at the SFT_CLIP pin. The precision of the threshold at which clipping occurs is dependent
upon the voltage level at the SFT_CLIP pin. Because of this, increasing the precision of the resistors used to
create the voltage divider, or using an external reference will increase the precision of the point at which the
device enters into clipping. To ensure stability, and soften the edges of the clipping event, a capacitor should be
connected from pin SFT_CLIP to ground.
Figure 45. Soft Clipper Example Wave Form
To move the output stage into clipping, the soft clipper circuit limits the duty cycle of the output PWM pulses to a
fixed maximum value. After filtering this limit applied to the duty cycle resembles a clipping event at a voltage
below that of the PVDD level. The peak voltage level attainable when the soft clipper circuit is active, called VP in
the example below, is approximately 4 times the voltage at the SFT_CLIP pin, noted as VSFT_CLIP. This voltage
can be used to calculate the maximum output power for a given maximum input voltage and speaker impedance,
as shown in the equation below.
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POUT
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ææ
ö
ö
RL
çç ç
÷ ´ VP ÷÷
è RL + 2 ´ RS ø
ø
= è
2 ´ RL
2
for unclipped power
(2)
Where:
RS is the total series resistance including RDS(on), and output filter resistance.
RL is the load resistance.
VP is the peak amplitude achievable when the soft clipper circuit is active (As mentioned previously, VP = [4 x
VSFT_CLIP], provided that [4 x VSFT_CLIP] < PVDD.)
POUT (10%THD) ≈ 1.25 × POUT (unclipped)
If the PVDD level is below (4 x VSFT_CLIP) clipping will occur due to clipping at PVDD before the clipping due to
the soft clipper circuit becomes active.
Table 4. Soft Clipper Example
(1)
PVDD [V]
SFT_CLIP Pin Voltage
[V] (1)
Resistor to GND
[kΩ]
24
GVDD
24
3.3
Resistor to GVDD [kΩ]
Output Voltage [Vrms]
(Open)
0
17.90
45
51
12.67
24
2.25
24
51
9.00
12
GVDD
(Open)
0
10.33
12
2.25
24
51
9.00
12
1.5
18
68
6.30
Output voltage measurements are dependent upon gain settings.
8.4.1.4 Speaker Amplifier Switching Frequency Select (FREQ/SDA Pin)
In Hardware Control mode, the PWM switching frequency of the TAS5760M-Q1 is configurable via the
FREQ/SDA pin. When connected to the system ground, the pin sets the output switching frequency to 16 × fS.
When connected to DVDD through a pull-up resistor, as shown in the Typical Application Circuits, the pin sets
the output switching frequency to 8 × fS. More switching frequencies are available when the TAS5760M-Q1 is
used in Software Control Mode.
8.4.1.5 Parallel Bridge Tied Load Mode Select (PBTL/SCL Pin)
The TAS5760M-Q1 can be configured to drive a single speaker with the two output channels connected in
parallel. This mode of operation is called Parallel Bridge Tied Load (PBTL) mode. This mode of operation
effectively reduces the output impedance of the amplifier in half, which in turn reduces the power dissipated in
the device due to conduction losses through the output FETs. Additionally, since the output channels are working
in parallel, it also doubles the amount of current the speaker amplifier can source before hitting the over-current
error threshold.
The device can be placed operated in PBTL mode in either Hardware Control Mode or in Software Control Mode,
via the I²C Control Port. For instructions on placing the device in PBTL via the I²C Control Port, see Software
Control Mode.
To place the TAS5760M-Q1 into PBTL Mode when operating in Hardware Control Mode, the PBTL/SCL pin
should be pulled HIGH (that is, connected to the DVDD supply through a pull-up resistor). If the device is to
operate in BTL mode instead, the PBTL/SCL pin should be pulled LOW, that is connected to the system supply
ground. When operated in PBTL mode, the output pins should be connected as shown in the Typical Application
Circuit Diagrams.
In PBTL mode, the amplifier selects its source signal from the right channel of the stereo signal presented on the
SDIN line of the Serial Audio Port. To select the right channel of the stereo signal, the LRCK can be inverted in
the processor that is sending the serial audio data to the TAS5760M-Q1.
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8.4.1.6 Speaker Amplifier Sleep Enable (SPK_SLEEP/ADR Pin)
In Hardware Control mode, pulling the SPK_SLEEP/ADR pin HIGH gracefully transitions the switching of the
output devices to a non-switching state or "High-Z" state. This mode of operation is similar to mute in that no
audio is present on the outputs of the device. However, unlike the 50/50 mute available in the I²C Control Port,
sleep mode saves quiescent power dissipation by stopping the speaker amplifier output transitors from switching.
This mode of operation saves quiescent current operation but keeps signal path blocks active so that normal
operation can resume more quickly than if the device were placed into shutdown. It is recommended to place the
device into sleep mode before stopping the audio signal coming in on the SDIN line or before bringing down the
power supplies connected to the TAS5760M-Q1 in order to avoid audible artifacts.
8.4.1.7 Speaker Amplifier Gain Select (SPK_GAIN [1:0] Pins)
In Hardware Control Mode, a combination of digital gain and analog gain is used to provide the overall gain of
the speaker amplifier. The decode of the two pins "SPK_GAIN1" and "SPK_GAIN0" sets the gain of the speaker
amplifier. Additionally, pulling both of the SPK_SPK_GAIN[1:0] pins HIGH places the device into software control
mode.
As seen in Figure 46, the audio path of the TAS5760M-Q1 consists of a digital audio input port, a digital audio
path, a digital to PWM converter (DPC), a gate driver stage, a Class D power stage, and a feedback loop which
feeds the output information back into the DPC block to correct for distortion sensed on the output pins. The total
amplifier gain is comprised of digital gain, shown as GDIG in the digital audio path and the analog gain from the
input of the analog modulator GANA to the output of the speaker amplifier power stage.
Digital Gain
(GDIG)
Analog Gain
(GANA)
Closed Loop Class D Amplifier
HPF
Serial
Audio In
Serial
Audio
Port
Digital
Boost
&
Volume
Control
Interpolation
Filter
123456
Digital
Clipper
Digital to PWM
Conversion
011010..
.
Gate
Drives
Gate
Drives
Full Bridge
Power Stage
A
Full Bridge
Power Stage
B
PWM
Audio Out
SFT_CLIP
Figure 46. Speaker Amplifier Gain Select (SPK_GAIN [1:0] Pins)
As shown in Figure 46, the first gain stage for the speaker amplifier is present in the digital audio path. It consists
of the volume control and the digital boost block. The volume control is set to 0dB by default and, in Hardware
Control mode, it does not change. For all settings of the SPK_GAIN[1:0] pins, the digital boost block remains at
+6 dB as analog gain block is transitioned through 19.2, 22.6, and 25 dBV.
The gain configurations provided in Hardware Control mode were chosen to align with popular power supply
levels found in many consumer electronics and to balance the trade-off between maximum power output before
clipping and noise performance. These gain settings ensure that the output signal can be driven into clipping at
those popular PVDD levels. If the power level required is lower than that which is possible with the PVDD level, a
lower gain setting can be used. Additionally, if clipping at a level lower than the PVDD supply is desired, the
digital clipper or soft clipper can be used.
The values of GDIG and GANA for each of the SPK_GAIN[1:0] settings are shown in the table below. Additionally,
the recommended PVDD level for each gain setting, along with the typical unclipped peak to peak output voltage
swing for a 0dBFS input signal is provided. The peak voltage levels in the table below should only be used to
understand the peak target output voltage swing of the amplifier if it had not been limited by clipping at the PVDD
rail.
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Table 5. Gain Structure for Hardware Control Mode
PVDD Level
Recommended
SPK_GAIN[1:0] Pins Setting
Digital
Boost
[dB]
A_GAIN
[dBV]
VPk Acheivable Voltage Swing
(If output is not clipped at PVDD)
12
00
6
19.2
12.90
19
01
6
22.6
19.08
24
10
6
25
25.15
-
11
(Gain is controlled via I²C Port)
8.4.1.8 Considerations for Setting the Speaker Amplifier Gain Structure
Configuration of the gain of the amplifier is important to the overall noise and output power performance of the
TAS5760M-Q1. Higher gain settings mean that more power can be driven from an amplifier before it becomes
voltage limited. Moreover, when output clipping "at the rail" is desired, it becomes important that there be enough
voltage gain in the signal path to drive the output signal above the PVDD level in order to "clip" the output signal
at the PVDD level in the output stage. Another desirable aspect of higher gain settings is that the dynamic
headroom of an amplifier is increased with higher gain settings, which increases the overall dynamic audio
quality of the signal being amplified.
With these advantages in mind, it may seem that setting the gain at the highest setting available would be
appropriate. However, there are some drawbacks to having a gain that is set arbitrarily high. The first drawback
is that a higher gain setting results in increased amplification of any noise that is present in the signal path. If the
gain is set too high, and the speaker is sensitive enough, this may result in an audible "hiss" at the speakers
when no audio is playing. Another consideration is that the speakers used in the system may not be rated for
operation at the power levels which would be possible for the given PVDD supply that is present in the system.
For this reason, it may be necessary to limit the voltage swing of the amplifier via a lower gain setting to reduce
the voltage presented, and therefore, the power delivered, to the speaker.
8.4.1.8.1 Recommendations for Setting the Speaker Amplifier Gain Structure in Hardware Control Mode
1. Determine the maximum power target and the speaker impedance which is required for the application.
2. Calculate the required output voltage swing for the given speaker impedance which will deliver the target
maximum power.
3. Chose the lowest gain setting via the SPK_GAIN[1:0] pins that produces an output voltage swing higher than
the required output voltage swing for the target maximum power.
NOTE
A higher gain setting can be used, provided the noise performance is acceptable and the
power delivered to the speaker remains within the safe operating area (SOA) of the
speaker, using the soft clipper if necessary to set the clip point within the SOA of the
speaker.
4. Characterize the clipping behavior of the system at the rated power.
– If the system does not produce the target power before clipping that is required, increase the gain setting.
– If the system meets the power requirements, but clipping is preferred at the rated power, use the soft
clipper to set the clip point
– If the system makes more power than is required but the noise performance is too high, consider
reducing the gain.
5. Repeat Step 4 until the optimum balance of power, noise, and clipping behavior is achieved.
8.4.2 Software Control Mode
The TAS5760M-Q1 can be used in Hardware Control Mode or Software Control Mode. In order to place the
device in software control mode, the two gain pins (GAIN[1:0]) should be pulled HIGH. When this is done, the
PBTL/SCL and FREQ/SDA pins are allocated to serve as the clock and data lines for the I²C Control Port.
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8.4.2.1 Speaker Amplifier Shut Down (SPK_SD Pin)
In both hardware and Software Control mode, the SPK_SD pin is provided to place the speaker amplifier into
shutdown. Driving this pin LOW will place the device into shutdown, while driving it HIGH (DVDD) will bring the
device out of shutdown. This is the lowest power consumption mode that the device can be placed in while the
power supplies are up. If the device is placed into shutdown while in normal operation, an audible artifact may
occur on the output. To avoid this, the device should first be placed into sleep mode, by pulling the
SPK_SLEEP/ADR pin HIGH before pulling the SPK_SD low.
8.4.2.2 Serial Audio Port Controls
In Software Control mode, additional digital audio data formats and clock rates are made available via the I²C
control port. With these controls, the audio format can be set to left justified, right justified, or I²S formatted data.
8.4.2.2.1 Serial Audio Port (SAP) Clocking
When used in Software Control mode, the device can be placed into double speed mode to support higher
sample rates, such as 88.2 kHz and 96 kHz. The tables below detail the supported SCLK rates for each of the
available sample rate and MCLK rate configurations. For each fS and MCLK Rate the support SCLK rates are
shown and are represented in multiples of the sample rate, which is written as "x fS".
Table 6. Supported SCLK Rates in Single-Speed Mode
MCLK Rate [x fS]
Sample Rate [kHz]
128
192
256
384
512
12
N/S
N/S
N/S
N/S
32, 48, 64
16
N/S
N/S
32, 48, 64
32, 48, 64
32, 48, 64
24
N/S
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
38
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
44.1
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
48
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
32, 48, 64
Table 7. Supported SCLK Rates in Double-Speed Mode
MCLK Rate [x fS]
Sample Rate [kHz]
128
192
256
88.2
32, 48, 64
32, 48, 64
32, 48, 64
96
32, 48, 64
32, 48, 64
32, 48, 64
8.4.2.3 Parallel Bridge Tied Load Mode via Software Control
The TAS5760M-Q1 can be configured to drive a single speaker with the two output channels connected in
parallel. This mode of operation is called Parallel Bridge Tied Load (PBTL) mode. This mode of operation
effectively reduces the on resistance of the amplifier in half, which in turn reduces the power dissipated in the
device due to conduction losses through the output FETs. Additionally, since the output channels are working in
parallel, it also doubles the amount of current the speaker amplifier can source before hitting the over-current
error threshold.
It should be noted that the device can be placed operated in PBTL mode in either Hardware Control Mode or in
Software Control Mode, via the I²C Control Port. For instructions on placing the device in PBTL via the
PBTL/SCL Pin, see Hardware Control Mode.
To place the TAS5760M-Q1 into PBTL Mode when operating in Software Control Mode, the Bit 7 of the Analog
Control Register (0x06) should be set in the control port. This bit is cleared by default to configure the device for
BTL mode operation. An additional control available in software mode control is PBTL Channel Select, which
selects which of the two channels presented on the SDIN line will be used for the input signal for the amplifier.
This is found at Bit 1 of the Analog Control Register (0x06).
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8.4.2.4 Speaker Amplifier Gain Structure
As shown in Figure 47, the audio path of the TAS5760M-Q1 consists of a digital audio input port, a digital audio
path, a digital to analog converter, an analog modulator, a gate driver stage, a Class D power stage, and a
feedback loop which feeds the output information back into the analog modulator to correct for distortion sensed
on the output pins. The total amplifier gain is comprised of digital gain, shown as GDIG in the digital audio path
and the analog gain from the input of the analog modulator GANA to the output of the speaker amplifier power
stage.
Digital Gain
(GDIG)
Analog Gain
(GANA)
Closed Loop Class D Amplifier
HPF
Serial
Audio In
Serial
Audio
Port
Digital
Boost
&
Volume
Control
Interpolation
Filter
Digital
Clipper
123456
Gate
Drives
Digital to PWM
Conversion
Gate
Drives
011010..
.
Full Bridge
Power Stage
A
Full Bridge
Power Stage
B
PWM
Audio Out
SFT_CLIP
Figure 47. Speaker Amplifier Gain Structure
8.4.2.4.1 Speaker Amplifier Gain in Software Control Mode
The analog and digital gain are configured directly when operating in Software Control mode. It is important to
note that the digital boost block is separate from the volume control. The digital boost block should be set before
the speaker amplifier is brought out of mute and not changed during normal operation. In most cases, the digital
boost can be left in its default configuration, and no further adjustment is necessary. As mentioned previously,
the analog gain is directly set via the I²C control port in software control mode.
8.4.2.4.2 Considerations for Setting the Speaker Amplifier Gain Structure
Configuration of the gain of the amplifier is important to the overall noise and output power performance of the
TAS5760M-Q1. Higher gain settings mean that more power can be driven from an amplifier before it becomes
voltage limited. Moreover, when output clipping "at the rail" is desired, it becomes important that there be enough
voltage gain in the signal path to drive the output signal above the PVDD level in order to "clip" the output signal
at the PVDD level in the output stage. Another desirable aspect of higher gain settings is that the dynamic
headroom of an amplifier is increased with higher gain settings, which increases the overall dynamic audio
quality of the signal being amplified.
With these advantages in mind, it may seem that setting the gain at the highest setting available would be
appropriate. However, there are some drawbacks to having a gain that is set arbitrarily high. The first drawback
is that a higher gain setting results in increased amplification of any noise that is present in the signal path. If the
gain is set too high, and the speaker is sensitive enough, this may result in an audible "hiss" at the speakers
when no audio is playing. Another consideration is that the speakers used in the system may not be rated for
operation at the power levels which would be possible for the given PVDD supply that is present in the system.
For this reason it may be necessary to limit the voltage swing of the amplifier via a lower gain setting to reduce
the voltage presented, and therefore the power delivered, to the speaker.
8.4.2.4.3 Recommendations for Setting the Speaker Amplifier Gain Structure in Software Control Mode
1. Determine the maximum power target and the speaker impedance which is required for the application.
2. Calculate the required output voltage swing for the given speaker impedance which will deliver the target
maximum power.
3. Chose the lowest analog gain setting via the A_GAIN[3:2] bits in the control port which will produce an output
voltage swing higher than the required output voltage swing for the target maximum power.
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NOTE
A higher gain setting can be used, provided the noise performance is acceptable and the
power delivered to the speaker remains within the safe operating area (SOA) of the
speaker, using the soft clipper if necessary to set the clip point within the SOA of the
speaker.
4. Characterize the clipping behavior of the system at the rated power.
– If the system does not produce the target power before clipping that is required, increase the analog gain.
– If the system meets the power requirements, but clipping is preferred at the rated power, use the soft
clipper or the digital clipper to set the clip point
– If the system makes more power than is required but the noise performance is too high, consider
reducing the analog gain.
5. Repeat Step 4 until the optimum balance of power, noise, and clipping behavior is achieved.
8.4.2.5 I²C Software Control Port
The TAS5760M-Q1 includes an I²C control port for increased flexibility and extended feature set.
8.4.2.5.1 Setting the I²C Device Address
Each device on the I²C bus has a unique address that allows it to appropriately transmit and receive data to and
from the I²C master controller. As part of the I²C protocol, the I²C master broadcast an 8-bit word on the bus that
contains a 7-bit device address in the upper 7 bits and a read or write bit for the LSB. The TAS5760M-Q1 has a
configurable I²C address. The SPK_SLEEP/ADR can be used to set the device address of the TAS5760M-Q1. In
Software Control mode, the seven bit I²C device address is configured as “110110x[R/W]”, where “x” corresponds
to the state of the SPK_SLEEP/ADR pin at first power up sequence of the device. Upon application of the power
supplies, the device latches in the value of the SPK_SLEEP/ADR pin for use in determining the I²C address of
the device. If the SPK_SLEEP/ADR pin is tied LOW at power up (that is connected to the system ground), the
device address will be set to 1101100[R/W]. If it is pulled HIGH (that is connected to the DVDD supply), the
address will be set to 1101101[R/W] at power up.
8.4.2.5.2 General Operation of the I²C Control Port
The TAS5760M-Q1 device has a bidirectional I²C interface that is compatible with the Inter IC (I²C) bus protocol
and supports both 100-kHz and 400-kHz data transfer rates. This is a slave-only device that does not support a
multimaster bus environment or wait-state insertion. The control interface is used to program the registers of the
device and to read device status.
The I²C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a
system. Data is transferred on the bus serially, one bit at a time. The address and data can be transferred in byte
(8-bit) format, with the most significant bit (MSB) transferred first. In addition, each byte transferred on the bus is
acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master
device driving a START condition on the bus and ends with the master device driving a stop condition on the
bus. The bus uses transitions on the data pin (SDA) while the clock is HIGH to indicate START and STOP
conditions. A high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal
data-bit transitions must occur within the low time of the clock period. These conditions are shown in Figure 48.
The master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another
device and then waits for an acknowledge condition. The TAS5760M-Q1 holds SDA LOW during the
acknowledge clock period to indicate an acknowledgment. When this occurs, the master transmits the next byte
of the sequence. All compatible devices share the same signals via a bidirectional bus using a wired-AND
connection. An external pullup resistor must be used for the SDA and SCL signals to set the HIGH level for the
bus.
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SDA
R/
A
W
7-Bit Slave Address
7
5
6
4
3
2
1
0
8-Bit Register Address (N)
7
6
5
4
3
2
1
8-Bit Register Data For
Address (N)
A
0
7
6
5
4
3
2
1
8-Bit Register Data For
Address (N)
A
7
0
6
5
4
3
2
1
A
0
SCL
Start
Stop
T0035-01
Figure 48. Typical I²C Sequence
There is no limit on the number of bytes that can be transmitted between START and STOP conditions. When
the last word transfers, the master generates a STOP condition to release the bus. A generic data transfer
sequence is shown in Figure 48.
8.4.2.5.3 Writing to the I²C Control Port
As shown in Figure 49, a single-byte data-write transfer begins with the master device transmitting a START
condition followed by the I²C and the read/write bit. The read/write bit determines the direction of the data
transfer. For a data-write transfer, the read/write bit is a 0. After receiving the correct I²C and the read/write bit,
the TAS5760M-Q1 responds with an acknowledge bit. Next, the master transmits the address byte
corresponding to the TAS5760M-Q1 register being accessed. After receiving the address byte, the TAS5760MQ1 again responds with an acknowledge bit. Next, the master device transmits the data byte to be written to the
memory address being accessed. After receiving the data byte, the TAS5760M-Q1 again responds with an
acknowledge bit. Finally, the master device transmits a STOP condition to complete the single-byte data-write
transfer.
Start
Condition
Acknowledge
A6
A5
A4
A3
A2
A1
A0
R/W ACK A7
2
Acknowledge
A6
A5
A4
A3
A2
A1
A0 ACK D7
Subaddress
I C Device Address and
Read/Write Bit
Acknowledge
D6
D5
D4
D3
Data Byte
D2
D1
D0 ACK
Stop
Condition
T0036-01
Figure 49. Write Transfer
8.4.2.5.4 Reading from the I²C Control Port
As shown in Figure 50, a data-read transfer begins with the master device transmitting a START condition,
followed by the I²C device address and the read/write bit. For the data read transfer, both a write followed by a
read are actually done. Initially, a write is done to transfer the address byte of the internal register to be read. As
a result, the read/write bit becomes a 0. After receiving the TAS5760M-Q1 address and the read/write bit,
TAS5760M-Q1 responds with an acknowledge bit. In addition, after sending the internal memory address byte or
bytes, the master device transmits another START condition followed by the TAS5760M-Q1 address and the
read/write bit again. This time, the read/write bit becomes a 1, indicating a read transfer. After receiving the
address and the read/write bit, the TAS5760M-Q1 again responds with an acknowledge bit. Next, the
TAS5760M-Q1 transmits the data byte from the register being read. After receiving the data byte, the master
device transmits a not-acknowledge followed by a STOP condition to complete the data-read transfer.
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Repeat Start
Condition
Start
Condition
Acknowledge
A6
A5
A1
Acknowledge
A0 R/W ACK A7
A6
2
A5
A4
A0 ACK
A6
A0 R/W ACK D7
A1
A5
2
I C Device Address and
Read/Write Bit
Subaddress
I C Device Address and
Read/Write Bit
Not
Acknowledge
Acknowledge
D6
D1
D0 ACK
Stop
Condition
Data Byte
T0036-03
Figure 50. Read Transfer
8.5 Register Maps
8.5.1 Control Port Registers - Quick Reference
Table 8. Control Port Quick Reference Table
Adr.
(Dec)
Adr.
(Hex)
0
0
Device
Identification
1
1
Power Control
2
2
Default (Binary)
Register Name
Digital Control
B7
B6
B5
0
0
0
1
1
HPF
Bypass
Reserved
0
0
Fade
0
Left Channel
Volume Control
1
1
0
5
5
Right Channel
Volume Control
1
1
0
6
6
Analog Control
PBTL
Enable
1
0
1
0
0
0
0
0
0
SPK_SL
EEP
SPK_SD
0
1
1
SS/DS
Serial Audio Input Format
0
1
0
0
0
Mute R
Mute L
0
0
0
1
1
1
1
1
1
1
1
Reserved Reserved
Fault
Configuration and
Error Status
0
0
0
9
Reserved
-
-
Reserved
-
-
Reserved
-
-
-
0
Reserved
1
Reserved
8
0
0
PBTL Ch
Reserved
Sel
A_GAIN
0
8
Digital Clipper 1
1
PWM Rate Select
Reserved
11
0
Volume Right
7
17
1
0
7
Digital Clipper 2
B0
Volume Left
0
10
B1
Reserved Reserved Reserved Reserved Reserved
4
16
1
Digital Boost
4
F
0
1
Volume Control
Configuration
15
B2
DigClipLev[19:14]
3
...
B3
Device Identification
3
9
B4
0
0
0
1
0x80
0xCF
0xCF
0x51
0x00
0
0
CLKE
OCE
DCE
OTE
0
0
0
0
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1
1
1
1
0
0
1
1
1
DigClipLev[5:0]
1
0x14
0
OCE Thres
1
0xFD
0
DigClipLev[13:6]
1
0x00
1
Reserved Reserved Reserved Reserved
0
Default
(Hex)
1
1
1
0x00
0xFF
0xFC
8.5.2 Control Port Registers - Detailed Description
8.5.2.1 Device Identification Register (0x00)
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Figure 51. Device Identification Register
7
6
5
4
3
Device Identification
R
2
1
0
1
SPK_SLEEP
R/W
0
SPK_SD
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 9. Device Identification Register Field Descriptions
Bit
Field
Type
Reset
Description
7:0
Device Identification
R
0
Device Identification - TAS5760Mx
8.5.2.2 Power Control Register (0x01)
Figure 52. Power Control Register
7
6
5
4
DigClipLev[19:14]
R/W
3
2
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 10. Power Control Register Field Descriptions
Bit
Field
Type
Reset
Description
7:2
DigClipLev[19:14]
R/W
1
The digital clipper is decoded from 3 registersDigClipLev[19:14], DigClipLev[13:6], and DigClipLev[5:0].
DigClipLev[19:14], shown here, represents the upper 6 bits of
the total of 20 bits that are used to set the Digital Clipping
Threshold.
SPK_SLEEP
R/W
0
Sleep Mode
1
0: Device is not in sleep mode.
1: Device is placed in sleep mode (In this mode, the power
stage is disabled to reduce quiescent power consumption over a
50/50 duty cycle mute, while low-voltage blocks remain on
standby. This reduces the time required to resume playback
when compared with entering and exiting full shut down.).
0
SPK_SD
R/W
1
Speaker Shutdown
0: Speaker amplifier is shut down (This is the lowest power
mode available when the device is connected to power supplies.
In this mode, circuitry in both the DVDD and PVDD domain are
powered down to minimize power consumption.).
1: Speaker amplifier is not shut down.
8.5.2.3 Digital Control Register (0x02)
Figure 53. Digital Control Register
7
HPF Bypass
R/W
6
Reserved
R
5
4
3
SS/DS
R/W
Digital Boost
R/W
2
1
Serial Audio Input Format
R/W
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 11. Digital Control Register Field Descriptions
Bit
7
Field
Type
Reset
Description
HPF Bypass
R/W
0
High-Pass Filter Bypass
0: The internal high-pass filter in the digital path is not bypassed.
1: The internal high-pass filter in the digital path is bypassed.
6
Reserved
R
0
This control is reserved and must not be changed from its
default setting.
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Table 11. Digital Control Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
5:4
Digital Boost
R/W
01
Digital Boost
00: +0 dB is added to the signal in the digital path.
01: +6 dB is added to the signal in the digital path. (Default)
10: +12 dB is added to the signal in the digital path.
11: +18 dB is added to the signal in the digital path.
3
SS/DS
R/W
0
Single Speed / Double Speed Mode Select
0: Serial Audio Port will accept single speed sample rates (that
is 32 kHz, 44.1 kHz, 48 kHz)
1: Serial Audio Port will accept double speed sample rates (that
is 88.2 kHz, 96 kHz)
2:0
Serial Audio Input Format
R/W
100
Serial Audio Input Format
000: Serial Audio Input Format is 24 Bits, Right Justified
001: Serial Audio Input Format is 20 Bits, Right Justified
010: Serial Audio Input Format is 18 Bits, Right Justified
011: Serial Audio Input Format is 16 Bits, Right Justified
100: Serial Audio Input Format is I²S (Default)
101: Serial Audio Input Format is 16-24 Bits, Left Justified
Settings above 101 are reserved and must not be used
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8.5.2.4 Volume Control Configuration Register (0x03)
Figure 54. Volume Control Configuration Register
7
Fade
R/W
6
5
4
Reserved
R
3
2
1
Mute R
R/W
0
Mute L
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 12. Volume Control Configuration Register Field Descriptions
Bit
Field
Type
Reset
Description
7
Fade
R/W
1
Volume Fade Enable
0: Volume fading is disabled.
1: Volume fading is enabled.
6:2
1
Reserved
R
0
This control is reserved and must not be changed from its
default setting.
Mute R
R/W
0
Mute Right Channel
0: The right channel is not muted
1: The right channel is muted (In software mute, most analog
and digital blocks remain active and the speaker amplifier
outputs transition to a 50/50 duty cycle.)
0
Mute L
R/W
0
Mute Left Channel
0: The left channel is not muted
1: The left channel is muted (In software mute, most analog and
digital blocks remain active and the speaker amplifier outputs
transition to a 50/50 duty cycle.)
8.5.2.5 Left Channel Volume Control Register (0x04)
Figure 55. Left Channel Volume Control Register
7
6
5
4
3
2
1
0
Volume Left
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 13. Left Channel Volume Control Register Field Descriptions
Bit
Field
Type
Reset
Description
7:0
Volume Left
R/W
11001111
Left Channel Volume Control
11111111: Channel Volume is +24 dB
11111110: Channel Volume is +23.5 dB
11111101: Channel Volume is +23.0 dB
...
11001111: Channel Volume is 0 dB (Default)
...
00000111: Channel Volume is -100 dB
Any setting less than 00000111 places the channel in Mute
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8.5.2.6 Right Channel Volume Control Register (0x05)
Figure 56. Right Channel Volume Control Register
7
6
5
4
3
2
1
0
Volume Right
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 14. Right Channel Volume Control Register Field Descriptions
Bit
Field
Type
Reset
Description
7:0
Volume Right
R/W
11001111
Right Channel Volume Control
11111111: Channel Volume is +24 dB
11111110: Channel Volume is +23.5 dB
11111101: Channel Volume is +23.0 dB
...
11001111: Channel Volume is 0 dB (Default)
...
00000111: Channel Volume is -100 dB
Any setting less than 00000111 places the channel in Mute
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8.5.2.7 Analog Control Register (0x06)
Figure 57. Analog Control Register
7
PBTL Enable
R/W
6
5
PWM Rate Select
R/W
4
3
2
1
PBTL Ch Sel
R/W
A_GAIN
R/W
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 15. Analog Control Register Field Descriptions
Bit
7
Field
Type
Reset
Description
PBTL Enable
R/W
0
PBTL Enable
0: Device is placed in BTL mode.
1: Device is placed in PBTL mode.
6:4
PWM Rate Select
R/W
101
PWM Rate Select
000: Output switching rate of the Speaker Amplifier is 6 * LRCK.
001: Output switching rate of the Speaker Amplifier is 8 * LRCK.
010: Output switching rate of the Speaker Amplifier is 10 *
LRCK.
011: Output switching rate of the Speaker Amplifier is 12 *
LRCK.
100: Output switching rate of the Speaker Amplifier is 14 *
LRCK.
101: Output switching rate of the Speaker Amplifier is 16 *
LRCK. (Default)
110: Output switching rate of the Speaker Amplifier is 20 *
LRCK.
111: Output switching rate of the Speaker Amplifier is 24 *
LRCK.
Note that all rates listed above are valid for single speed mode.
For double speed mode, switching frequency is half of that
represented above.
3:2
A_GAIN
R/W
00
00: Analog Gain Setting is 19.2 dBV.(Default)
01: Analog Gain Setting is 22.6 dBV.
10: Analog Gain Setting is 25 dBV.
11: This setting is reserved and must not be used.
1
PBTL Ch Sel
R/W
0
Channel Selection for PBTL Mode
0: When placed in PBTL mode, the audio information from the
Right channel of the serial audio input stream is used by the
speaker amplifier.
1: When placed in PBTL mode, the audio information from the
Left channel of the serial audio input stream is used by the
speaker amplifier.
0
Reserved
R/W
1
This control is reserved and must not be changed from its
default setting.
8.5.2.8 Reserved Register (0x07)
The controls in this section of the control port are reserved and must not be used.
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8.5.2.9 Fault Configuration and Error Status Register (0x08)
Figure 58. Fault Configuration and Error Status Register
7
6
Reserved
R
5
4
3
CLKE
R
OCE Thres
R/W
2
OCE
R
1
DCE
R
0
OTE
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 16. Fault Configuration and Error Status Register Field Descriptions
Bit
Field
Type
Reset
Description
7:6
Reserved
R
0
This control is reserved and must not be changed from its
default setting.
5:4
OCE Thres
R/W
00
OCE Threshold
00: Threshold is set to the default level specified in the electrical
characteristics table. (Default)
01: Threshold is reduced to 75% of the evel specified in the
electrical characteristics table.
10: Threshold is reduced to 50% of the evel specified in the
electrical characteristics table.
11: Threshold is reduced to 25% of the evel specified in the
electrical characteristics table.
3
CLKE
R
0
Clock Error Status
0: Clocks are valid and no error is currently detected.
1: A clock error is occuring (This error is non-latching, so
intermittent clock errors will be cleared when clocks re-enter
valid state and the device will resume normal operation
automatically. This bit will likewise be cleared once normal
operation resumes.).
2
OCE
R
0
Over Current Error Status
0: The output current levels of the speaker amplifier outputs are
below the OCE threshold.
1: The DC offset level of the outputs has exceeded the OCE
threshold, causing an error (This is a latching error and SPK_SD
must be toggled after an OCE event for the device to resume
normal operation. This bit will remain HIGH until SPK_SD is
toggled.).
1
DCE
R
0
Output DC Error Status
0: The DC offset level of the speaker amplifier outputs are below
the DCE threshold.
1: The DC offset level of the speaker amplifier outputs has
exceeded the DCE threshold, causing an error (This is a latching
error and SPK_SD must be toggled after an DCE event for the
device to resume normal operation. This bit will remain HIGH
until SPK_SD is toggled.).
0
OTE
R
0
Over-Temperature Error Status
0: The temperature of the die is below the OTE threshold.
1: The temperature of the die has exceeded the level specified
in the electrical characteristics table. (This is a latching error and
SPK_SD must be toggled for the device to resume normal
operation. This bit will remain HIGH until SPK_SD is toggled.).
8.5.2.10 Reserved Controls (9 / 0x09) - (15 / 0x0F)
The controls in this section of the control port are reserved and must not be used.
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8.5.2.11 Digital Clipper Control 2 Register (0x10)
Figure 59. Digital Clipper Control 2 Register
7
6
5
4
3
DigClipLev[13:6]
R/W
2
1
0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 17. Digital Clipper Control 2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7:0
DigClipLev[13:6]
R/W
1
The digital clipper is decoded from 3 registersDigClipLev[19:14], DigClipLev[13:6], and DigClipLev[5:0].
DigClipLev[13:6], shown here, represents the [13:6] bits of the
total of 20 bits that are used to set the Digital Clipping
Threshold.
8.5.2.12 Digital Clipper Control 1 Register (0x11)
Figure 60. Digital Clipper Control 1 Register
7
6
5
4
3
2
1
DigClipLev[5:0]
R/W
0
Reserved
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 18. Digital Clipper Control 1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7:2
DigClipLev[5:0]
R/W
1
The digital clipper is decoded from 3 registersDigClipLev[19:14], DigClipLev[13:6], and DigClipLev[5:0].
DigClipLev[5:0], shown here, represents the [5:0] bits of the total
of 20 bits that are used to set the Digital Clipping Threshold.
1:0
Reserved
R/W
0
These controls are reserved and should not be changed from
there default values.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
These typical connection diagrams highlight the required external components and system level connections for
proper operation of the device in several popular use cases.
Each of these configurations can be realized using the Evaluation Modules (EVMs) for the device. These flexible
modules allow full evaluation of the device in all available modes of operation. Additionally, some of the
application circuits are available as reference designs and can be found on the TI website. Also see the
TAS5760M-Q1's product page for information on ordering the EVM. Not all configurations are available as
reference designs; however, any design variation can be supported by TI through schematic and layout reviews.
Visit support.ti.com for additional design assistance. Also, join the audio amplifier discussion forum at
http://e2e.ti.com.
9.2 Typical Applications
These application circuits detail the recommended component selection and board configurations for the
TAS5760M-Q1 device. Note that in Software Control mode, the clipping point of the amplifier and thus the rated
power of the end equipment can be set using the digital clipper if desired. Additionally, if the sonic signature of
the soft clipper is preferred, it can be used in addition to or in lieu of the digital clipper. The software control
application circuit detailed in this section shows the soft clipper in its bypassed state, which results in a lower
BOM count than when using the soft clipper. The trade-off between the sonic characteristics of the clipping
events in the amplifier and BOM minimization can be chosen based upon the design goals related to the end
product.
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Typical Applications (continued)
9.2.1 Stereo BTL Using Software Control, 32-Pin DAP Package Option
PVDD
VDD
1
2
1.0 …F
10 lQ
1.0 …F
3
4
5
6
7
8
VDD
9
1.0 …F
System Processor
&
Associated Passive
Components
HIGH Æ 1101101[R/W]
LOW Æ 1101100[R/W]
10
11
10 lQ
12
13
14
15
16
AVDD
SFT_CLIP
ANA_REG
VCOM
ANA_REF
SPK_FAULT
SPK_SD
FREQ/SDA
PBTL/SCL
DVDD
SPK_GAIN0
SPK_GAIN1
SPK_SLEEP/ADR
MCLK
SCLK
SDIN
GVDD_REG
GGND
BSTRPA+
SPK_OUTA+
PVDD
PGND
SPK_OUTABSTRPABSTRPBSPK_OUTBPGND
PVDD
SPK_OUTB+
BSTRPB+
DGND
LRCK
1.0 …F
32
31
30
0.22…F
0.1 …F
LFILT
29
CFILT
28
27
CFILT
26
25
24
0.22…F
0.22…F
LFILT
470 …F
LFILT
23
CFILT
22
21
CFILT
20
19
0.22…F
LFILT
18
17
0.1 …F
Figure 61. Stereo BTL using Software Control, 32-Pin DAP Package Option
9.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 19 as the input parameters.
Table 19. Design Parameters
PARAMETER
EXAMPLE
Low Power Supply
3.3 V
High Power Supply
5 V to 24V
Host Processor
I2C Compliant Master
I2S Compliant Master
GPIO Control
Output Filters
Inductor-Capacitor Low Pass Filter
Speakers
4 Ω to 8 Ω
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Startup Procedures- Software Control Mode
1. Configure all digital I/O pins as required by the application using PCB connections (that is SPK_GAIN[1:0] =
11, ADR, etc.)
2. Start with SPK_SD Pin = LOW
3. Bring up power supplies (it does not matter if PVDD/AVDD or DVDD comes up first, provided the device is
held in shutdown.)
4. Once power supplies are stable, start MCLK, SCLK, LRCK
5. Configure the device via the control port in the manner required by the use case, making sure to mute the
device via the control port
6. Once power supplies and clocks are stable and the control port has been programmed, bring SPK_SD HIGH
7. Unmute the device via the control port
8. The device is now in normal operation
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NOTE
Control port register changes should only occur when the device is placed into shutdown.
This can be accomplished either by pulling the SPK_SD pin LOW or clearing the SPK_SD
bit in the control port.
9.2.1.2.2 Shutdown Procedures- Software Control Mode
1.
2.
3.
4.
5.
The device is in normal operation
Mute via the control port
Pull SPK_SD LOW
The clocks can now be stopped and the power supplies brought down
The device is now fully shutdown and powered off
NOTE
Any control port register changes excluding volume control changes should only occur
when the device is placed into shutdown. This can be accomplished either by pulling the
SPK_SD pin LOW or clearing the SPK_SD bit in the control port.
9.2.1.2.3 Component Selection and Hardware Connections
Figure 61 details the typical connections required for proper operation of the device. It is with this list of
components that the device was simulated, tested, and characterized. Deviation from this typical application
circuit unless recommended by this document may produce unwanted results, which could range from
degradation of audio performance to destructive failure of the device.
9.2.1.2.3.1 I²C Pullup Resistors
It is important to note that when the device is operated in Software Control Mode, the customary pullup resistors
are required on the SCL and SDA signal lines. They are not shown in the Typical Application Circuits, because
they are shared by all of the devices on the I²C bus and are considered to be part of the associated passive
components for the System Processor. These resistor values should be chosen per the guidance provided in the
I²C Specification.
9.2.1.2.3.2 Digital I/O Connectivity
The digital I/O lines of the TAS5760M-Q1 are described in previous sections. As discussed, whenever a static
digital pin (that is a pin that is hardwired to be HIGH or LOW) is required to be pulled HIGH, it should be
connected to DVDD through a pullup resistor to control the slew rate of the voltage presented to the digital I/O
pins. It is not, however, necessary to have a separate pullup resistor for each static digital I/O line. Instead, a
single resistor can be used to tie all static I/O lines HIGH to reduce BOM count. For instance, if Software Control
Mode is desired both the GAIN[1:0] and the PBTL/SCL pins can both be pulled HIGH through a single pullup
resistor.
9.2.1.2.4 Recommended Startup and Shutdown Procedures
The start up and shutdown procedures for both Hardware Control Mode and Software Control Mode are shown
below.
50
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9.2.1.3 Application Curve
Table 20. Relevant Performance Plots
PLOT TITLE
PLOT NUMBER
Figure 1. Output Power vs PVDD
G001
Figure 2. THD+N vs Frequency With PVDD = 12 V, POSPK = 1 W
G024
Figure 3. THD+N vs Frequency With PVDD = 24 V, POSPK = 1 W
G025
Figure 5. THD+N vs Output Power With PVDD = 12 V, Both Channels Driven
G027
Figure 6. THD+N vs Output Power With PVDD = 18 V, Both Channels Driven
G028
Figure 7. THD+N vs Output Power With PVDD = 24 V, Both Channels Driven
G029
Figure 8. Efficiency vs Output Power
G030
Figure 9. Crosstalk vs Frequency
G031
Figure 10. PVDD PSRR vs Frequency
G019
Figure 11. DVDD PSRR vs Frequency
G020
Figure 12. Idle Current Draw vs PVDD (Filterless)
G042
Figure 13. Idle Current Draw vs PVDD (With LC Filter as Shown on the EVM)
G023
Figure 14. Shutdown Current Draw vs PVDD (Filterless)
G022
Figure 15. Output Power vs PVDD
G039
Figure 16. THD+N vs Frequency With PVDD = 12 V, POSPK = 1 W
G002
Figure 17. THD+N vs Frequency With PVDD = 24 V, POSPK = 1 W
G003
Figure 19. THD+N vs Output Power With PVDD = 12 V, Both Channels Driven
G008
Figure 20. THD+N vs Output Power With PVDD = 18 V, Both Channels Driven
G009
Figure 21. THD+N vs Output Power With PVDD = 24 V, Both Channels Driven
G010
Figure 22. Efficiency vs Output Power
G014
Figure 23. Crosstalk vs Frequency
G018
Figure 24. PVDD PSRR vs Frequency
G019
Figure 25. Idle Current Draw vs PVDD (Filterless)
G045
Figure 26. Idle Current Draw vs PVDD (With LC Filter as Shown on EVM)
G044
Figure 27. Shutdown Current Draw vs PVDD (Filterless)
G022
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9.2.2 Stereo BTL Using Hardware Control, 32-Pin DAP Package Option
RCLIP1
1.0 …F
PVDD
RCLIP2
HIGH Æ fSPK_AMP = 8 * fS
LOW Æ fSPK_AMP = 16 * fS
VDD
1
2
1.0 …F
1.0 …F
10 lQ
3
4
5
6
7
VDD
8
9
1.0 …F
System Processor
&
Associated Passive
Components
10
11
Gain Set by Pin Decode
12
13
14
15
16
AVDD
SFT_CLIP
ANA_REG
VCOM
ANA_REF
SPK_FAULT
SPK_SD
FREQ/SDA
PBTL/SCL
DVDD
SPK_GAIN0
SPK_GAIN1
SPK_SLEEP/ADR
MCLK
SCLK
SDIN
GVDD_REG
GGND
BSTRPA+
SPK_OUTA+
PVDD
PGND
SPK_OUTABSTRPABSTRPBSPK_OUTBPGND
PVDD
SPK_OUTB+
BSTRPB+
DGND
LRCK
1.0 …F
32
31
30
0.22…F
0.1 …F
LFILT
29
CFILT
28
27
CFILT
26
25
24
0.22…F
LFILT
470 …F
0.22…F
LFILT
23
CFILT
22
21
CFILT
20
19
0.22…F
LFILT
18
17
0.1 …F
Figure 62. Stereo BTL using Hardware Control, 32-Pin DAP Package Option
9.2.2.1 Design Requirements
For this design example, use the parameters listed in Table 21 as the input parameters.
Table 21. Design Parameters
PARAMETER
EXAMPLE
Low Power Supply
3.3 V
High Power Supply
5 V to 24 V
I2S Compliant Master
Host Processor
GPIO Control
Output Filters
Inductor-Capacitor Low Pass Filter
Speakers
4 Ω to 8 Ω
9.2.2.2 Detailed Design Procedure
9.2.2.2.1 Startup Procedures - Hardware Control Mode
1. Configure all hardware pins as required by the application using PCB connections (that is PBTL, FREQ,
GAIN, etc.)
2. Start with SPK_SD pin pulled LOW and SPK_SLEEP/ADR pin pulled HIGH
3. Bring up power supplies (it does not matter if PVDD/AVDD or DVDD comes up first, provided the device is
held in shutdown.)
4. Once power supplies are stable, start MCLK, SCLK, LRCK
5. Once power supplies and clocks are stable and all hardware control pins have been configured, bring
SPK_SD HIGH
6. Once the device is out of shutdown mode, bring SPK_SLEEP/ADR LOW
7. The device is now in normal operation
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9.2.2.2.2 Shutdown Procedures - Hardware Control Mode
1.
2.
3.
4.
5.
The device is in normal operation
Pull SPK_SLEEP/ADR HIGH
Pull SPK_SD LOW
The clocks can now be stopped and the power supplies brought down
The device is now fully shutdown and powered off
9.2.2.2.3 Digital I/O Connectivity
The digital I/O lines of the TAS5760M-Q1 are described in previous sections. As discussed, whenever a static
digital pin (that is a pin that is hardwired to be HIGH or LOW) is required to be pulled HIGH, it should be
connected to DVDD through a pullup resistor in order to control the slew rate of the voltage presented to the
digital I/O pins. It is not, however, necessary to have a separate pullup resistor for each static digital I/O line.
Instead, a single resistor can be used to tie all static I/O lines HIGH to reduce BOM count. For instance, if
Software Control Mode is desired both the GAIN[1:0] and the PBTL/SCL pins can both be pulled HIGH through a
single pullup resistor.
9.2.2.3 Application Curve
Table 22. Relevant Performance Plots
PLOT TITLE
PLOT NUMBER
Figure 1. Output Power vs PVDD
G001
Figure 2. THD+N vs Frequency With PVDD = 12 V, POSPK = 1 W
G024
Figure 3. THD+N vs Frequency With PVDD = 24 V, POSPK = 1 W
G025
Figure 4. Idle Channel Noise vs PVDD
G026
Figure 5. THD+N vs Output Power With PVDD = 12 V, Both Channels Driven
G027
Figure 6. THD+N vs Output Power With PVDD = 18 V, Both Channels Driven
G028
Figure 7. THD+N vs Output Power With PVDD = 24 V, Both Channels Driven
G029
Figure 8. Efficiency vs Output Power
G030
Figure 9. Crosstalk vs Frequency
G031
Figure 10. PVDD PSRR vs Frequency
G019
Figure 11. DVDD PSRR vs Frequency
G020
Figure 12. Idle Current Draw vs PVDD (Filterless)
G042
Figure 13. Idle Current Draw vs PVDD (With LC Filter as Shown on the EVM)
G023
Figure 14. Shutdown Current Draw vs PVDD (Filterless)
G022
Figure 15. Output Power vs PVDD
G039
Figure 16. THD+N vs Frequency With PVDD = 12 V, POSPK = 1 W
G002
Figure 17. THD+N vs Frequency With PVDD = 24 V, POSPK = 1 W
G003
Figure 18. Idle Channel Noise vs PVDD
G006
Figure 19. THD+N vs Output Power With PVDD = 12 V, Both Channels Driven
G008
Figure 20. THD+N vs Output Power With PVDD = 18 V, Both Channels Driven
G009
Figure 21. THD+N vs Output Power With PVDD = 24 V, Both Channels Driven
G010
Figure 22. Efficiency vs Output Power
G014
Figure 23. Crosstalk vs Frequency
G018
Figure 24. PVDD PSRR vs Frequency
G019
Figure 25. Idle Current Draw vs PVDD (Filterless)
G045
Figure 26. Idle Current Draw vs PVDD (With LC Filter as Shown on EVM)
G044
Figure 27. Shutdown Current Draw vs PVDD (Filterless)
G022
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9.2.3 Mono PBTL Using Software Control, 32-Pin DAP Package Option
PVDD
VDD
1
2
1.0 …F
1.0 …F
10 lQ
3
4
5
6
7
System Processor
&
Associated Passive
Components
8
VDD
9
1.0 …F
10
11
R
HIGH Æ 1101101[ /W]
LOW Æ 1101100[R/W]
10 lQ
12
13
14
15
16
AVDD
SFT_CLIP
ANA_REG
VCOM
ANA_REF
SPK_FAULT
SPK_SD
FREQ/SDA
PBTL/SCL
DVDD
SPK_GAIN0
SPK_GAIN1
SPK_SLEEP/ADR
MCLK
SCLK
SDIN
GVDD_REG
GGND
BSTRPA+
SPK_OUTA+
PVDD
PGND
SPK_OUTABSTRPABSTRPBSPK_OUTBPGND
PVDD
SPK_OUTB+
BSTRPB+
DGND
LRCK
1.0 …F
32
31
30
0.22…F
0.1 …F
LFILT
29
CFILT
28
27
26
25
24
0.22…F
470 …F
0.22…F
23
22
CFILT
21
20
19
LFILT
0.22…F
18
17
0.1 …F
Figure 63. Mono PBTL using Software Control, 32-Pin DAP Package Option
9.2.3.1 Design Requirements
For this design example, use the parameters listed in Table 23 as the input parameters.
Table 23. Design Parameters
PARAMETER
EXAMPLE
Low Power Supply
3.3 V
High Power Supply
5 V to 24 V
Host Processor
I2C Compliant Master
Output Filters
Inductor-Capacitor Low Pass Filter
Speakers
4 Ω to 8 Ω
I2S Compliant Master
GPIO Control
9.2.3.2 Detailed Design Procedure
9.2.3.2.1 Startup Procedures - Software Control Mode
1. Configure all digital I/O pins as required by the application using PCB connections (that is SPK_GAIN[1:0] =
11, ADR, etc.)
2. Start with SPK_SD Pin = LOW
3. Bring up power supplies (it does not matter if PVDD/AVDD or DVDD comes up first, provided the device is
held in shutdown.)
4. Once power supplies are stable, start MCLK, SCLK, LRCK
5. Configure the device via the control port in the manner required by the use case, making sure to mute the
device via the control port
6. Once power supplies and clocks are stable and the control port has been programmed, bring SPK_SD HIGH
7. Unmute the device via the control port
8. The device is now in normal operation
54
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NOTE
Control port register changes should only occur when the device is placed into shutdown.
This can be accomplished either by pulling the SPK_SD pin LOW or clearing the SPK_SD
bit in the control port.
9.2.3.2.2 Shutdown Procedures - Software Control Mode
1.
2.
3.
4.
5.
The device is in normal operation
Mute via the control port
Pull SPK_SD LOW
The clocks can now be stopped and the power supplies brought down
The device is now fully shutdown and powered off
NOTE
Any control port register changes excluding volume control changes should only occur
when the device is placed into shutdown. This can be accomplished either by pulling the
SPK_SD pin LOW or clearing the SPK_SD bit in the control port.
9.2.3.2.3 Component Selection and Hardware Connections
Figure 63 above details the typical connections required for proper operation of the device. It is with this list of
components that the device was simulated, tested, and characterized. Deviation from this typical application
circuit unless recommended by this document may produce unwanted results, which could range from
degradation of audio performance to destructive failure of the device.
9.2.3.2.3.1 I²C Pull-Up Resistors
It is important to note that when the device is operated in Software Control Mode, the customary pull-up resistors
are required on the SCL and SDA signal lines. They are not shown in the Typical Application Circuits, since they
are shared by all of the devices on the I²C bus and are considered to be part of the associated passive
components for the System Processor. These resistor values should be chosen per the guidance provided in the
I²C Specification.
9.2.3.2.3.2 Digital I/O Connectivity
The digital I/O lines of the TAS5760M-Q1 are described in previous sections. As discussed, whenever a static
digital pin (that is a pin that is hardwired to be HIGH or LOW) is required to be pulled HIGH, it should be
connected to DVDD through a pullup resistor in order to control the slew rate of the voltage presented to the
digital I/O pins. It is not, however, necessary to have a separate pullup resistor for each static digital I/O line.
Instead, a single resistor can be used to tie all static I/O lines HIGH to reduce BOM count. For instance, if
Software Control Mode is desired both the GAIN[1:0] and the PBTL/SCL pins can both be pulled HIGH through a
single pullup resistor.
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9.2.3.3 Application Curves
Table 24. Relevant Performance Plots
PLOT TITLE
56
PLOT NUMBER
Figure 28. THD+N vs Frequency With PVDD = 12 V, POSPK = 1 W
G032
Figure 29. THD+N vs Frequency With PVDD = 24 V, POSPK = 1 W
G033
Figure 31. THD+N vs Output Power With PVDD = 12 V With 1 kHz Sine Input
G035
Figure 32. THD+N vs Output Power With PVDD = 18 V With 1 kHz Sine Input
G036
Figure 33. THD+N vs Output Power With PVDD = 24 V With 1 kHz Sine Input
G037
Figure 34. Efficiency vs Output Power
G038
Figure 35. THD+N vs Frequency With PVDD = 12 V, POSPK = 1 W
G004
Figure 36. THD+N vs Frequency With PVDD = 24 V, POSPK = 1 W
G005
Figure 38. THD+N vs Output Power With PVDD = 12 V
G011
Figure 39. THD+N vs Output Power With PVDD = 18 V
G012
Figure 40. THD+N vs Output Power With PVDD = 24 V
G013
Figure 41. Efficiency vs Output Power
G015
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9.2.4 Mono PBTL Using Hardware Control, 32-Pin DAP Package Option
RCLIP1
1.0 …F
VDD
PVDD
RCLIP2
HIGH Æ fSPK_AMP = 8 * fS
LOW Æ fSPK_AMP = 16 * fS
1
1.0 …F
2
1.0 …F
10 lQ
3
4
5
6
7
VDD
10 lQ
8
9
1.0 …F
System Processor
&
Associated Passive
Components
10
11
Gain Set by Pin Decode
12
13
14
15
16
AVDD
SFT_CLIP
ANA_REG
VCOM
ANA_REF
SPK_FAULT
SPK_SD
FREQ/SDA
PBTL/SCL
DVDD
SPK_GAIN0
SPK_GAIN1
SPK_SLEEP/ADR
MCLK
SCLK
SDIN
GVDD_REG
GGND
BSTRPA+
SPK_OUTA+
PVDD
PGND
SPK_OUTABSTRPABSTRPBSPK_OUTBPGND
PVDD
SPK_OUTB+
BSTRPB+
DGND
LRCK
1.0 …F
32
0.1 …F
31
30
0.22…F
LFILT
29
28
CFILT
27
26
25
24
0.22…F
470 …F
0.22…F
23
22
CFILT
21
20
19
0.22…F
LFILT
18
17
0.1 …F
Figure 64. Mono PBTL using Hardware Control, 32 Pin DAP Package Option
9.2.4.1 Design Requirements
For this design example, use the parameters listed in Table 25 as the input parameters.
Table 25. Design Parameters
PARAMETER
EXAMPLE
Low Power Supply
3.3 V
High Power Supply
5 V to 24 V
I2S Compliant Master
Host Processor
GPIO Control
Output Filters
Inductor-Capacitor Low Pass Filter
Speakers
4 Ω to 8 Ω
9.2.4.2 Detailed Design Procedure
9.2.4.2.1 Startup Procedures - Hardware Control Mode
1. Configure all hardware pins as required by the application using PCB connections (that is PBTL, FREQ,
GAIN, etc.)
2. Start with SPK_SD pin pulled LOW and SPK_SLEEP/ADR pin pulled HIGH
3. Bring up power supplies (it does not matter if PVDD/AVDD or DVDD comes up first, provided the device is
held in shutdown.)
4. Once power supplies are stable, start MCLK, SCLK, LRCK
5. Once power supplies and clocks are stable and all hardware control pins have been configured, bring
SPK_SD HIGH
6. Once the device is out of shutdown mode, bring SPK_SLEEP/ADR LOW
7. The device is now in normal operation
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9.2.4.2.2 Shutdown Procedures - Hardware Control Mode
1.
2.
3.
4.
5.
The device is in normal operation
Pull SPK_SLEEP/ADR HIGH
Pull SPK_SD LOW
The clocks can now be stopped and the power supplies brought down
The device is now fully shutdown and powered off
9.2.4.2.3 Digital I/O Connectivity
The digital I/O lines of the TAS5760M-Q1 are described in previous sections. As discussed, whenever a static
digital pin (that is a pin that is hardwired to be HIGH or LOW) is required to be pulled HIGH, it should be
connected to DVDD through a pullup resistor in order to control the slew rate of the voltage presented to the
digital I/O pins. It is not, however, necessary to have a separate pullup resistor for each static digital I/O line.
Instead, a single resistor can be used to tie all static I/O lines HIGH to reduce BOM count. For instance, if
Software Control Mode is desired both the GAIN[1:0] and the PBTL/SCL pins can both be pulled HIGH through a
single pullup resistor.
9.2.4.3 Application Curves
Table 26. Relevant Performance Plots
PLOT TITLE
58
PLOT NUMBER
Figure 28. THD+N vs Frequency With PVDD = 12 V, POSPK = 1 W
G032
Figure 29. THD+N vs Frequency With PVDD = 24 V, POSPK = 1 W
G033
Figure 30. Idle Channel Noise vs PVDD
G034
Figure 31. THD+N vs Output Power With PVDD = 12 V With 1 kHz Sine Input
G035
Figure 32. THD+N vs Output Power With PVDD = 18 V With 1 kHz Sine Input
G036
Figure 33. THD+N vs Output Power With PVDD = 24 V With 1 kHz Sine Input
G037
Figure 34. Efficiency vs Output Power
G038
Figure 35. THD+N vs Frequency With PVDD = 12 V, POSPK = 1 W
G004
Figure 36. THD+N vs Frequency With PVDD = 24 V, POSPK = 1 W
G005
Figure 37. Idle Channel Noise vs PVDD
G007
Figure 38. THD+N vs Output Power With PVDD = 12 V
G011
Figure 39. THD+N vs Output Power With PVDD = 18 V
G012
Figure 40. THD+N vs Output Power With PVDD = 24 V
G013
Figure 41. Efficiency vs Output Power
G015
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10 Power Supply Recommendations
The TAS5760M-Q1 device requires two power supplies for proper operation. A high-voltage supply called PVDD
is required to power the output stage of the speaker amplifier and its associated circuitry. Additionally, one low
voltage power supply called DVDD is required to power the various low-power portions of the device. The
allowable voltage range for both the PVDD and the DVDD supply are listed in the Recommended Operating
Conditions table.
10.1 DVDD Supply
The DVDD supply required from the system is used to power several portions of the device it provides power to
the DVDD pin. Proper connection, routing, and decoupling techniques are highlighted in the TAS5760xx EVM
User's Guide, SLOU371 (as well as the Application and Implementation section and Layout Example section)
and must be followed as closely as possible for proper operation and performance. Deviation from the guidance
offered in the TAS5760xx EVM User's Guide, which followed the same techniques as those shown in the
Application and Implementation section, may result in reduced performance, errant functionality, or even damage
to the TAS5760M-Q1 device. Some portions of the device also require a separate power supply which is a lower
voltage than the DVDD supply. To simplify the power supply requirements for the system, the TAS5760M-Q1
device includes an integrated low-dropout (LDO) linear regulator to create this supply. This linear regulator is
internally connected to the DVDD supply and its output is presented on the ANA_REG pin, providing a
connection point for an external bypass capacitor. It is important to note that the linear regulator integrated in the
device has only been designed to support the current requirements of the internal circuitry, and should not be
used to power any additional external circuitry. Additional loading on this pin could cause the voltage to sag,
negatively affecting the performance and operation of the device.
10.2 PVDD Supply
The output stage of the speaker amplifier drives the load using the PVDD supply. This is the power supply which
provides the drive current to the load during playback. Proper connection, routing, and decoupling techniques are
highlighted in the TAS5760xx EVM and must be followed as closely as possible for proper operation and
performance. Due the high-voltage switching of the output stage, it is particularly important to properly decouple
the output power stages in the manner described in the TAS5760xx EVM User's Guide, SLOU371. The lack of
proper decoupling, like that shown in the EVM User's Guide, can results in voltage spikes which can damage the
device. A separate power supply is required to drive the gates of the MOSFETs used in the output stage of the
speaker amplifier. This power supply is derived from the PVDD supply via an integrated linear regulator. A
GVDD_REG pin is provided for the attachment of decoupling capacitor for the gate drive voltage regulator. It is
important to note that the linear regulator integrated in the device has only been designed to support the current
requirements of the internal circuitry, and should not be used to power any additional external circuitry. Additional
loading on this pin could cause the voltage to sag, negatively affecting the performance and operation of the
device.
11 Layout
11.1 Layout Guidelines
11.1.1 General Guidelines for Audio Amplifiers
Audio amplifiers which incorporate switching output stages must have special attention paid to their layout and
the layout of the supporting components used around them. The system level performance metrics, including
thermal performance, electromagnetic compliance (EMC), device reliability, and audio performance are all
affected by the device and supporting component layout. Ideally, the guidance provided in the applications
section with regard to device and component selection can be followed by precise adherence to the layout
guidance shown in Layout Example. These examples represent exemplary baseline balance of the engineering
trade-offs involved with laying out the device. These designs can be modified slightly as needed to meet the
needs of a given application. In some applications, for instance, solution size can be compromised in order to
improve thermal performance through the use of additional contiguous copper near the device. Conversely, EMI
performance can be prioritized over thermal performance by routing on internal traces and incorporating a via
picket-fence and additional filtering components. In all cases, it is recommended to start from the guidance
shown in the Layout Example section and the TAS5760xx EVM, and work with TI field application engineers or
through the E2E community in order to modify it based upon the application specific goals.
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Layout Guidelines (continued)
11.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
Placing the bypassing and decoupling capacitors close to supply has been long understood in the industry. This
applies to DVDD and PVDD. However, the capacitors on the PVDD net for the TAS5760M-Q1 device deserve
special attention. It is imperative that the small bypass capacitors on the PVDD lines of the DUT be placed as
close the PVDD pins as possible. Not only does placing these devices far away from the pins increase the
electromagnetic interference in the system, but doing so can also negatively affect the reliability of the device.
Placement of these components too far from the TAS5760M-Q1 device may cause ringing on the output pins that
can cause the voltage on the output pin to exceed the maximum allowable ratings shown in the Absolute
Maximum Ratings table, damaging the device. For that reason, the capacitors on the PVDD net must be no
further away from their associated PVDD pins than what is shown in the example layouts in the Layout Example
section.
11.1.3 Optimizing Thermal Performance
Follow the layout examples shown in the Layout Example section of this document to achieve the best balance
of solution size, thermal, audio, and electromagnetic performance. In some cases, deviation from this guidance
may be required due to design constraints which cannot be avoided. In these instances, the system designer
should ensure that the heat can get out of the device and into the ambient air surrounding the device.
Fortunately, the heat created in the device would prefer to travel away from the device and into the lower
temperature structures around the device.
11.1.3.1 Device, Copper, and Component Layout
Primarily, the goal of the PCB design is to minimize the thermal impedance in the path to those cooler structures.
These tips should be followed to achieve that goal:
• Avoid placing other heat producing components or structures near the amplifier (including above or below in
the end equipment).
• If possible, use a higher layer count PCB to provide more heat sinking capability for the TAS5760M-Q1device
and to prevent traces and copper signal and power planes from breaking up the contiguous copper on the top
and bottom layer.
• Place the TAS5760M-Q1 device away from the edge of the PCB when possible to ensure that heat can travel
away from the device on all four sides.
• Avoid cutting off the flow of heat from the TAS5760M-Q1 device to the surrounding areas with traces or via
strings. Instead, route traces perpendicular to the device and line up vias in columns which are perpendicular
to the device.
• Unless the area between two pads of a passive component is large enough to allow copper to flow in
between the two pads, orient it so that the narrow end of the passive component is facing the TAS5760M-Q1
device.
• Because the ground pins are the best conductors of heat in the package, maintain a contiguous ground plane
from the ground pins to the PCB area surrounding the device for as many of the ground pins as possible.
11.1.3.2 Stencil Pattern
The recommended drawings for the TAS5760M-Q1 device PCB footprint and associated stencil pattern are
shown at the end of this document in the package addendum. Additionally, baseline recommendations for the via
arrangement under and around the device are given as a starting point for the PCB design. This guidance is
provided to suit the majority of manufacturing capabilities in the industry and prioritizes manufacturability over all
other performance criteria. In elevated ambient temperatures or under high-power dissipation use-cases, this
guidance may be too conservative and advanced PCB design techniques may be used to improve thermal
performance of the system. It is important to note that the customer must verify that deviation from the guidance
shown in the package addendum, including the deviation explained in this section, meets the customer’s quality,
reliability, and manufacturability goals.
60
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Layout Guidelines (continued)
11.1.3.2.1 PCB Footprint and Via Arrangement
The PCB footprint (also known as a symbol or land pattern) communicates to the PCB fabrication vendor the
shape and position of the copper patterns to which the TAS5760M-Q1 device will be soldered to. This footprint
can be followed directly from the guidance in the package addendum at the end of this data sheet. It is important
to make sure that the thermal pad, which connects electrically and thermally to the PowerPAD of the TAS5760MQ1 device, be made no smaller than what is specified in the package addendum. This ensures that the
TAS5760M-Q1 device has the largest interface possible to move heat from the device to the board. The via
pattern shown in the package addendum provides an improved interface to carry the heat from the device
through to the layers of the PCB, because small diameter plated vias (with minimally-sized annular rings) present
a low thermal-impedance path from the device into the PCB. Once into the PCB, the heat travels away from the
device and into the surrounding structures and air. By increasing the number of vias, as shown in Layout
Example, this interface can benefit from improved thermal performance.
NOTE
Vias can obstruct heat flow if they are not constructed properly.
•
•
•
•
•
Remove thermal reliefs on thermal vias, because they impede the flow of heat through the via.
Vias filled with thermally conductive material are best, but a simple plated via can be used to avoid the
additional cost of filled vias.
The drill diameter should be no more than 8mils in diameter. Also, the distance between the via barrel and
the surrounding planes should be minimized to help heat flow from the via into the surrounding copper
material. In all cases, minimum spacing should be determined by the voltages present on the planes
surrounding the via and minimized wherever possible.
Vias should be arranged in columns, which extend in a line radially from the heat source to the surrounding
area. This arrangement is shown in the Layout Example section.
Ensure that vias do not cut-off power current flow from the power supply through the planes on internal
layers. If needed, remove some vias which are farthest from the TAS5760M-Q1 device to open up the current
path to and from the device.
11.1.3.2.1.1 Solder Stencil
During the PCB assembly process, a piece of metal called a stencil on top of the PCB and deposits solder paste
on the PCB wherever there is an opening (called an aperture) in the stencil. The stencil determines the quantity
and the location of solder paste that is applied to the PCB in the electronic manufacturing process. In most
cases, the aperture for each of the component pads is almost the same size as the pad itself.
However, the thermal pad on the PCB is quite large and depositing a large, single deposition of solder paste
would lead to manufacturing issues. Instead, the solder is applied to the board in multiple apertures, to allow the
solder paste to outgas during the assembly process and reduce the risk of solder bridging under the device. This
structure is called an aperture array, and is shown in the Layout Example section. It is important that the total
area of the aperture array (the area of all of the small apertures combined) covers between 70% and 80% of the
area of the thermal pad itself.
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11.2 Layout Example
10k
10 F
10 F
1
32
2
31
3
30
4
29
5
28
6
27
7
26
8
25
9
24
10
23
11
22
0.22uF
47 Ÿ
10 F
10 F
0.22uF
0.22uF
12
21
13
20
14
19
15
18
16
17
0.22uF
TAS5760M-Q1
System Processor
Top Layer Ground and PowerPad
Via to bottom Ground Plane
Top Layer Ground Pour
Via to PVDD
Top Layer Signal Traces
Figure 65. DAP Package BTL Configuration
62
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Layout Example (continued)
10k
10 F
10 F
1
3232
2
3131
3
3030
4
2929
5
2828
6
2727
7
2626
8
2525
9
2424
10
2323
11
2222
0.22uF
47 Ÿ
10 F
10 F
0.22uF
0.22uF
12
2121
13
2020
14
1919
15
1818
16
1717
0.22uF
TAS5760M-Q1
System Processor
Top Layer Ground and PowerPad
Via to bottom Ground Plane
Top Layer Ground Pour
Via to PVDD
Top Layer Signal Traces
Figure 66. DAP Package PBTL Configuration
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
• TI FilterPro program available at: http://focus.ti.com/docs/toolsw/folders/print/filterpro.html
• TAS5760xx EVM User's Guide, SLOU371
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
64
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PACKAGE OPTION ADDENDUM
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15-Oct-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TAS5760MTDAPQ1
ACTIVE
HTSSOP
DAP
32
46
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
5760MQ1
TAS5760MTDAPRQ1
ACTIVE
HTSSOP
DAP
32
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
5760MQ1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2019
OTHER QUALIFIED VERSIONS OF TAS5760M-Q1 :
• Catalog: TAS5760M
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TAS5760MTDAPRQ1
Package Package Pins
Type Drawing
SPQ
HTSSOP
2000
DAP
32
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
11.5
1.6
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TAS5760MTDAPRQ1
HTSSOP
DAP
32
2000
350.0
350.0
43.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
TM
DAP 32
PowerPAD
TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
8.1 x 11, 0.65 mm pitch
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225303/A
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PACKAGE OUTLINE
DAP0032B
PowerPAD TM TSSOP - 1.2 mm max height
SCALE 1.500
PLASTIC SMALL OUTLINE
8.3
TYP
7.9
PIN 1 ID AREA
A
30X 0.65
32
1
11.1
10.9
NOTE 3
2X
9.75
16
B
17
6.2
6.0
32X
0.30
0.19
0.1
C A
B
0.1 C
SEATING PLANE
(0.15) TYP
C
SEE DETAIL A
4.16
3.32
EXPOSED
THERMAL PAD
5.72
4.88
0.25
GAGE PLANE
0 -8
2X (0.7)
NOTE 5
2X (0.15)
NOTE 5
1.2 MAX
0.75
0.50
0.15
0.05
DETAIL A
TYPICAL
4222438/A 11/2015
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153, variation DCT.
5. Features may not present.
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EXAMPLE BOARD LAYOUT
DAP0032B
PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
(5.2)
NOTE 9
SOLDER MASK
DEFINED PAD
(4.16)
SYMM
32X (1.5)
SEE DETAILS
1
32
32X (0.45)
30X (0.65)
(11)
NOTE 9
SYMM
(0.65) TYP
(5.72)
(1.3) TYP
( 0.2) TYP
VIA
(R0.05) TYP
17
16
METAL COVERED
BY SOLDER MASK
(0.65) TYP
(1.3) TYP
(7.5)
LAND PATTERN EXAMPLE
SCALE:8X
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
0.05 MIN
AROUND
0.05 MAX
AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4222438/A 11/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
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EXAMPLE STENCIL DESIGN
DAP0032B
PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
(4.16)
BASED ON
0.125 THICK
STENCIL
32X (1.5)
1
32
32X (0.45)
30X (0.65)
SYMM
(5.72)
BASED ON
0.125 THICK
STENCIL
17
16
METAL COVERED
BY SOLDER MASK
SYMM
(7.5)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
0.125
0.15
0.175
4.65 X 6.4
4.16 X 5.72 (SHOWN)
3.8 X 5.22
3.52 X 4.83
4222438/A 11/2015
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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