Texas Instruments | TPA6120A2 High Fidelity Headphone Amplifier (Rev. B) | Datasheet | Texas Instruments TPA6120A2 High Fidelity Headphone Amplifier (Rev. B) Datasheet

Texas Instruments TPA6120A2 High Fidelity Headphone Amplifier (Rev. B) Datasheet
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TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
TPA6120A2 High Fidelity Headphone Amplifier
1 Features
3 Description
•
•
•
•
In applications requiring a high-power output, very
high fidelity headphone amplifier, the TPA6120A2
replaces a costly discrete design and allows music,
not the amplifier, to be heard. The TPA6120A2's
current-feedback AB amplifier architecture delivers
high bandwidth, extremely low noise, and up to
128dB of dynamic range.
1
•
•
•
•
SNR of 128dB A-Weighted.
THD of 112.5dB
Current-Feedback Architecture
Output Voltage Noise of 0.9µVrms at
Gain = 1V/V (16Ω Load)
Power Supply Range: ±5V to ±15V
1300V/µs Slew Rate
Can be configured for Single Ended or Differential
Inputs
Independent Power Supplies for Low Crosstalk
Three key features make current-feedback amplifiers
outstanding for audio. The first feature is the high
slew rate that prevents odd order distortion
anomalies. The second feature is current-on-demand
at the output that enables the amplifier to respond
quickly and linearly when necessary without risk of
output distortion. When large amounts of output
power are suddenly needed, the amplifier can
respond extremely quickly without raising the noise
floor of the system and degrading the signal-to-noise
ratio. The third feature is the gain-independent
frequency response that allows the full bandwidth of
the amplifier to be used over a wide range of gain
settings.
2 Applications
•
•
•
•
Professional Audio Equipment
HiFi Smartphone
Consumer Home Audio Equipment
Headphone Drivers
Device Information(1)
PART NUMBER
TPA6120A2
PACKAGE
BODY SIZE (NOM)
HSOP (20)
7.5mm x 12.82mm
VQFN (14)
3.5mm x 3.5mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
Filter and I/V Gain Stage
1/2 OPA4134
CF
2.7 nF
RF
1 kW
Stereo Hi−Fi
Headphone Driver
AUDIO DAC
LRCK
PCM
Audio
Data
Source
TPA6120A2
IOUT L−
−IN A
RF
OUT A
RI
OUT B
RI
+IN A
1 kW
BCK
+IN B
DATA
IOUT L+
SCK
LIN−
RO
1 kW
RF
1 kW
CF
2.7 nF
39.2 W
RF
1 kW
1/2 OPA4134
ZEROL
CF
2.7 nF
RF
1 kW
RF
1 kW
ZEROR
+IN C
IOUT R+
OUT C
RI
RIN+
1 kW
RIN−
RO
−IN C
Controller
MDI
+IN D
MC
OUT D
MDO
RST
LOUT
LIN+
−IN B
PCM1792
or
DSD1792
MS
1 kW
IOUT R−
RI
−IN D
1 kW
RF
1 kW
CF
2.7 nF
RF
ROUT
39.2 W DYR > 120 dB
for Whole
System!
1 kW
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
4
4
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 8
Detailed Description .............................................. 8
9.1 Overview ................................................................... 8
9.2 Functional Block Diagram ......................................... 8
9.3 Feature Description................................................... 8
9.4 Device Functional Modes.......................................... 9
10 Applications and Implementation........................ 9
10.1 Application Information............................................ 9
10.2 Typical Application .................................................. 9
11 Power Supply Recommendations ..................... 16
11.1 Independent Power Supplies ................................ 16
11.2 Power Supply Decoupling ..................................... 16
12 Layout................................................................... 17
12.1 Layout Guidelines ................................................. 17
12.2 Layout Example .................................................... 18
13 Device and Documentation Support ................. 20
13.1
13.2
13.3
13.4
Documentation Support ........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
20
20
20
20
14 Mechanical, Packaging, and Orderable
Information ........................................................... 20
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2014) to Revision B
Page
•
Changed the Device Information Packages From: DWP (20) and RGY (14) To: HSOP (20) and VQFN (14) ..................... 1
•
Changed QFN to VQFN in the Pin Functions table ............................................................................................................... 3
•
Added a NOTE to the Applications and Implementation section ........................................................................................... 9
•
Added Title: Application Information....................................................................................................................................... 9
•
Deleted Title: Application Circuit............................................................................................................................................. 9
•
Changed the Design Requirements ..................................................................................................................................... 10
•
Deleted Title: Application Circuit........................................................................................................................................... 14
•
Moved two paragraphs following Figure 19 to proceed Figure 19 ....................................................................................... 14
Changes from Original (March 2004) to Revision A
Page
•
Changed Added ESD Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
•
Added the VQFN package information .................................................................................................................................. 1
•
Updated Pin descriptions to clarify power supply. ................................................................................................................. 3
•
Lowered minimum VIC(±5Vcc) From: ±3.6 To: ±3.4 .............................................................................................................. 5
•
Lowered minimum VIC(±15Vcc) From: ±13.4V To: ±13.2V ................................................................................................... 5
•
Deleted IMD (Intermodulation Distortion), ±12Vcc data, Dynamic Range (replaced with SNR, in 1V/V gain) ...................... 5
•
Changed the THD=N UNIT From: % To: dB .......................................................................................................................... 5
•
Changed the SNR to show the latest data from newer QFN based EVM. ........................................................................... 5
2
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SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
6 Pin Configuration and Functions
DWP Package
20-Pin HSOP
Top View
9 ROUT
RVCC–
RVCC−
ROUT
RVCC+
RIN+
RIN−
NC
NC
NC
NC
NC
NC
20
19
18
17
16
15
14
13
12
11
LVCC–
1
2
3
4
5
6
7
8
9
10
13 LOUT
LVCC−
LOUT
LVCC+
LIN+
LIN−
NC
NC
NC
NC
NC
RGY Package
14-Pin VQFN with Thermal PAD
Top View
8 RVCC+
LVCC+ 14
LIN+ 1
7 RIN+
RIN– 6
NC
NC
NC
LIN– 2
NC − No internal connection
Pin Functions
PIN
NAME
I/O
DESCRIPTIONS
HSOP NO.
VQFN NO.
LVCC-
1
12
I
Left channel negative power supply – must be kept at the same
potential as RVCC- if both amplifiers are to be used.
LOUT
2
13
O
Left channel output
LVCC+
3
14
I
Left channel positive power supply – must be kept at the same
potential as RVCC+ if both amplifiers are to be used.
LIN+
4
1
I
Left channel positive input
LIN-
5
2
I
Left channel negative input
NC
6,7,8,9,10,11,
12,13,14,15
3, 4, 5, 11
-
Not internally connected
RIN-
16
6
I
Right channel negative input
RIN+
17
7
I
Right channel positive input
RVCC+
18
8
I
Right channel positive power supply - must be kept at the same
potential as LVCC+ if both amplifiers are to be used.
ROUT
19
9
O
Right channel output
RVCC-
20
10
I
Right channel negative power supply - must be kept at the same
potential as LVCC- if both amplifiers are to be used.
-
-
-
Connect to ground. The thermal pad must be soldered down in all
applications to properly secure device on the PCB.
Thermal Pad
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SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
9
33
V
Supply voltage, xVCC+ to xVCC- Where x=L or R channel
Input voltage, VI
(2)
± VCC
Differential input voltage, VID
6
V
Minimum load impedance
8
Ω
Continuous total power dissipation
See Thermal Information
Operating free–air temperature range, TA
–40
85
°C
Operating junction temperature range, TJ (3)
–40
150
°C
Storage Temperature, Tstg
–40
125
°C
(1)
(2)
(3)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
When the TPA6120A2 is powered down, the input source voltage must be kept below 600mV peak.
The TPA6120A2 incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a
thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that
could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally
enhanced package.
7.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS- For Pins: LVCC+, RVCC+,
001 (1)
LVCC-, RVCC
V(ESD)
(1)
Electrostatic
Discharge
UNIT
±500
For all pins except:
Human body model (HBM), per ANSI/ESDA/JEDEC JSLVCC+, RVCC+, LVCC-,
001, all other pins
RVCC
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101
±1500
V
Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows
safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
±5
±15
Single Supply
10
30
VCC = ±5V or ±15V
16
Supply voltage, VCC+ and VCCLoad impedance
NOM
Split Supply
Operating free–air temperature, TA
UNIT
V
Ω
–40
85
°C
7.4 Thermal Information
THERMAL METRIC (1)
TPA6120A2
TPA6120A2
DWP [HSOP]
RGY [VQFN]
20 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
44.5
49.4
RθJCtop
Junction-to-case (top) thermal resistance
55.2
62.0
RθJB
Junction-to-board thermal resistance
36.1
25.4
ψJT
Junction-to-top characterization parameter
23.1
1.6
ψJB
Junction-to-board characterization parameter
36.2
25.5
RθJCbot
Junction-to-case (bottom) thermal resistance
7.6
6.2
(1)
4
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
|VIO|
Input offset voltage (measured
differentially)
VCC = ±5V or ±15V
PSRR
Power supply rejection ratio
VCC = ±5V to±15V
MIN
TYP
MAX
2
5
UNIT
mV
75
VCC = ±5V
±3.4
±3.7
VCC = ±15V
±13.2
±13.5
dB
VIC
Common mode input voltage
ICC
Supply current (each channel)
IO
Output current (per channel)
VCC= ±5V to ±15V
700
mA
Input offset voltage drift
VCC = ±5V or ±15V
20
µV/°C
300
kΩ
13
Ω
12.5 to -12.2
V
VCC = ±5V
V
11.5
13
VCC= ±15V
mA
15
ri
Input resistance
ro
Output resistance
Open Loop
VO
Output voltage swing
VCC = ±15V, RL = 25Ω
11.8 to -11.5
7.6 Operating Characteristics (1)
TA = 25°C, RL = 25Ω, Gain = 1V/V (unless otherwise noted)
PARAMETER
THD+N
kSVR
Total harmonic distortion
plus noise
Supply voltage rejection
ratio
CMRR
Common mode rejection
ratio (differential)
SR
Slew rate
Vn
SNR
MIN
TYP
RL = 32Ω
f = 1kHz
VCC = ±5V PO = 10mW
VCC = ±15V PO = 100mW
90
RL = 64Ω
f = 1kHz
VCC = ±5V PO = 10mW
104
VCC = ±15V PO = 100mW
94
VCC = ±5V,
Gain = 1V/V
VO = 3VPP,
RL = 10kΩ
f = 1kHz
104
VCC = ±15V,
Gain = 1V/V
VO = 10VPP,
RL = 10kΩ
f = 1kHz
108
VCC = ±15V,
Gain = 1V/V
VO = 2VPP,
RL = 10kΩ
f = 1kHz
112.5
RL = 32Ω
f = 1kHz
V(RIPPLE) = 1VPP
VCC= ±5V
–75
VCC= ±15V
–78
RL = 64Ω
f = 1kHz
V(RIPPLE) = 1VPP
VCC= ±5V
–75
VCC= ±15V
–75
100
VCC = ±15V, Gain = 5V/V, VO = 20 VPP
1300
VCC = ±5V, Gain = 2V/V, VO = 5 VPP
900
Output noise voltage
VCC = ±5V to ±15V
RL = 16Ω
Gain = 1V/V
0.9
RL = 32Ω to 64Ω
f = 1kHz
VCC = ±15V, Gain = 1V/V. A
Weighted
128
Signal-to-noise ratio
VCC = ±5V, Gain = 1V/V. A
Weighted
116
VCC = ±15V
-112
VCC = ±5V
-105
VI = 1VRMS
RF = 1kΩ
RL = 32Ω to 64Ω
f = 1kHz
MAX
UNIT
101
VCC = ±5V or ±15V
Crosstalk
(1)
TEST CONDITIONS
dB
dB
dB
V/µs
μVrms
dB
dB
For THD+N, kSVR, and crosstalk, the bandwidth of the measurement instruments was set to 80kHz.
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0
VCC = ± 5 V ; VO = 3VPP
VCC = ± 5 V ; VO = 6VPP
-20
VCC = ± 15 V; VO = 5VPP
VCC = ± 15 V ; VO = 10VPP
-40
-60
-80
-100
-120
-140
10
100
1k
10k
f - Frequency - Hz
RL = 10kΩ
RI = 1kΩ
C001
Gain = 3V/V
BW = 80kHz
THD+N - Total Harmonic Distortion + Noise - dB
THD+N - Total Harmonic Distortion + Noise - dB
7.7 Typical Characteristics
RF = 2kΩ
THD+N - Total Harmonic Distortion + Noise - dB
VCC = ± 5 ; PO = 20mW
-20
VCC = ± 15 ; PO = 100 mW
VCC = ± 15 ; PO = 200 mW
-40
-60
-80
-100
-120
-140
10
100
1k
10k
f - Frequency - Hz
RL = 32Ω
RI = 1kΩ
Gain = 3V/V
BW = 80kHz
THD+N - Total Harmonic Distortion + Noise - dB
VCC = ± 5 V
-40
-60
-80
-100
0.01
0.1
PO - Output Power - W
RL = 64Ω
RI = 1kΩ
Gain = 3V/V
BW = 80kHz
1
C007
RF = 2kΩ
f = 1kHz
Figure 5. Total Harmonic Distortion + Noise versus Output
Power
6
VCC = ± 15 ; PO = 200mW
-60
-80
-100
-120
-140
10
100
1k
10k
f - Frequency - Hz
-20
Gain = 3V/V
BW = 80kHz
C003
RF = 2kΩ
VCC = ± 5 V
VCC = ± 15 V
-40
-60
-80
-100
-120
0.2
2
20
VO - Output Voltage - VPP
RL = 10kΩ
RI = 1kΩ
RF = 2kΩ
VCC = ± 15V
-120
0.001
VCC = ± 15 ; PO = 100mW
-40
C004
Figure 3. Total Harmonic Distortion + Noise versus
Frequency
-20
VCC = ± 5 ; PO = 20mW
-20
Figure 2. Total Harmonic Distortion + Noise versus
Frequency
Gain = 3V/V
BW = 80kHz
C005
RF = 2kΩ
f = 1kHz
Figure 4. Total Harmonic Distortion + Noise versus Output
Voltage
THD+N - Total Harmonic Distortion + Noise - dB
THD+N - Total Harmonic Distortion + Noise - dB
VCC = ± 5 ; PO = 10mW
VCC = ± 5 ; PO = 10mW
RL = 64Ω
RI = 1kΩ
Figure 1. Total Harmonic Distortion + Noise versus
Frequency
0
0
-20
VCC = ± 5 V
VCC = ± 15V
-40
-60
-80
-100
-120
0.001
0.01
0.1
PO - Output Power - W
RL = 32Ω
RI = 1kΩ
Gain = 3V/V
BW = 80kHz
1
C008
RF = 2kΩ
f = 1kHz
Figure 6. Total Harmonic distortion + Noise versus Output
Power
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2.0
2.0
1.8
1.8
PD - Power Dissipation - W
PD - Power Dissipation - W
Typical Characteristics (continued)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.6
0.4
Vcc = +/- 15 V; RL = 32
Vcc = +/- 15 V; RL = 64
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Po - Total Output Power - W
VCC = ±15V
1.0
C009
VCC = ±12V
V(ripple) = 1VPP
Gain = 2V/V
BW = 80kHz
Representative of both positive and negative supplies
Figure 8. Power Dissipation versus Total Output Power
-40
VCC=5V, RL = 32
VCC=5V, RL = 64
VCC=15V, RL = 32
VCC=15V, RL = 64
-50
±20
-60
±30
Crosstalk - dB
kSVR - Supply Voltage Rejection Ratio - dB
0.8
C009
RL = 32
RL = 64
±10
1.0
1.0
Figure 7. Power Dissipation versus Output Power
0
1.2
0.0
Po - Total Output Power - W
Mono
1.4
0.2
Vcc = +/- 15 V; RL = 32
Vcc = +/- 15 V; RL = 64
0.0
1.6
±40
±50
±60
-70
-80
-90
-100
±70
-110
±80
-120
±90
10
100
1k
10k
10
f - Frequency - Hz
VCC = ±5V
BW = 80kHz
100
V(ripple) = 1VPP
Gain = 2V/V
RF = 1kΩ
Figure 9. Supply Voltage rejection Ratio versus Frequency
1.20
10k
Gain = 2V/V
C014
BW = 80kHz
Figure 10. Crosstalk versus Frequency
Vcc = +/- 5 V; RL = 32
Vcc = +/- 5 V; RL = 64
Vcc = +/- 15 V; RL = 32
Vcc = +/- 15 V; RL = 64
1.10
PD - Power Dissipation - W
1k
f - Frequency - Hz
C011
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0
5
10
15
20
25
30
35
40
Po - Total Output Power - mW
45
50
C009
Figure 11. Power Dissipation versus Power Output - 50mW Scale
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8 Parameter Measurement Information
TPA6120A2
CI
+
LEFTINM
Audio Precision
Measurement
Output
HPLEFT
+
Rseries
CI
LEFTINP
-
Load
Low Pass
Filter
Audio Precision
Measurement
Input
VDD
GND
1uf
+
External Power
Supply
-
A.
Separate power supply decoupling capacitors are used on all Vcc pins.
B.
The low-pass filter is used to remove harmonic content above the audible range.
Figure 12. Test Circuit
9 Detailed Description
9.1 Overview
The TPA6120A2 is a current-feedback amplifier with differential inputs and single-ended outputs.
9.2 Functional Block Diagram
LVCC+
LIN+
LIN+
LOUT
LIN–
LIN−
LVCC–
RVCC+
TPA6120A2
RIN+
RIN+
ROUT
RIN–
RIN−
RVCC–
9.3 Feature Description
9.3.1 Current-Feedback Amplifier
Current feedback results in low voltage noise, low distortion, high open-loop gain throughout a large frequency
range, and can be used in a similar fashion as voltage-feedback amplifiers. The low distortion of the TPA6120A2
results in a signal-to-noise ratio of 128 dB.
9.3.2 Independent Power Supplies
Because the power supplies for the two amplifiers are available separately, one amplifier can be turned off to
conserve power.
See Power Supply Recommendations.
8
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9.4 Device Functional Modes
This device operates as a wide-bandwidth, current-feedback amplifier.
10 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
In many applications, the audio source is digital, and must go through a digital-to-analog converter (DAC) so that
traditional analog amplifiers can drive the speakers or headphones.
10.2 Typical Application
10.2.1 High Voltage, High Fidelity DAC + Headphone Amplifier Solution
Figure 13 shows a complete circuit schematic for such a system. The digital audio is fed into a high performance
DAC. The PCM1792, a Burr-Brown product from TI, is a 24-bit, stereo DAC.
OPA4134
TPA6120A2
12 V
−12 V
10 mF
10 mF
10 mF
100 mF
100 mF
+
0.1 mF
+
0.1 mF
+
+
−5 V
+
5V
10 mF
VCC−
VCC+
V−
+
V+
CF 2.7 nF
RF 1 kW
V−
−INA
2
3
−
RF
1k
11
1
OUTA
VCC−
+
RI
1 kW
4
5V
V+
LIN−
LIN+
1
ZEROL
VCC2L
28
2
ZEROR
AGND3L
27
3
MSEL
IOUTL− 26
4
LRCK
IOUTL+
+
0.1 mF
CF 2.7 nF
10 mF
AGND2
−INB
25
5
DATA
6
BCK
VCC1
23
7
SCK
VCOML
22
8
DGND
VCOMR
21
9
VDD
IREF
20
10 MS
AGND1
19
11 MDI
IOUTR−
18
5V
24
5
0.1 mF
VCC+
11
−
7
+
OUTB
V+
+
47 mF 10 mF
+
CF 2.7 nF
47 mF
RF 1 kW
10 kW
Controller
RO 39.2 W
3
4
PCM1792
0.1 mF
6
+
+
PCM
Audio
Data
Source
LOUT
2
RF
1k
V−
mF
−
4
RI
1 kW
RF 1 kW
0.1
4
5
IOUTR+
12 MC
V−
9
−INC
17
0.1 mF
13 MDO
10
AGND3R
16
VCC2R
15
RF
1 kW
11
−
8
OUTC
VCC−
+
RI
1 kW
4
5V
0.1 mF
20
16
V+
−
ROUT
RIN−
CF 2.7 nF
+
14 RST
RIN+
10 mF
3.3 V
RI
1 kW
1 kW
RF
13
10 mF
−IND
12
+
RO 39.2 W
18
17
RF
1 kW
V−
+
19
0.1
mF
VCC+
11
−
14
+
OUTD
4
V+
Figure 13. Typical Application Circuit
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Typical Application (continued)
10.2.1.1 Design Requirements
• ±12V Operation from bipolar power supply
• Differential voltage source
• Be transparent to the user
10.2.1.2 Detailed Design Procedure
The output of the PCM1792 is current, not voltage, so the OPA4134 is used to convert the current input to a
voltage output. The OPA4134 (SBOS058), is a low-noise, high-speed, high-performance operational amplifier. CF
and RF are used to set the cutoff frequency of the filter. The RC combination in Figure 13 has a cutoff frequency
of 59 kHz. All four amplifiers of the OPA4134 are used so the TPA6120A2 can be driven differentially.
The output of the OPA4134 goes into the TPA6120A2. The TPA6120A2 is configured for use with differential
inputs, stereo use, and a gain of 2V/V. Note that the 0.1µF capacitors are placed at every supply pin of the
TPA6120A2, as well as the 39.2Ω series output resistor.
Each output goes to one channel of a pair of stereo headphones, where the listener enjoys crisp, clean, virtually
noise free music with a dynamic range greater than the human ear is capable of detecting.
10.2.1.2.1 Resistor Values
RF = 1 kW
VCC−
RI = 1 kW
−
VI
RO = 39.2 W
+
RS = 50 W
RL
VCC+
Figure 14. Single-Ended Input With A Noninverting Gain Of 2V/V
In the most basic configuration (see Figure 14), four resistors must be considered, not including the load
impedance. The feedback and input resistors, RF and RI, respectively, determine the closed-loop gain of the
amplifier. RO is a series output resistor designed to protect the amplifier from any capacitance on the output path,
including board and load capacitance. RS is a series input resistor.
The series output resistor should be between 10Ω and 100Ω. The output series resistance eases the work of the
output power stage by increasing the load when low impedance headphones are connected, as well as isolating
any capacitance on the following traces and headphone cable.
Because the TPA6120A2 is a current-feedback amplifier, take care when choosing the feedback resistor. TI
recommends a lower level of 800Ω for the feedback resistance. No capacitors should be used in the feedback
path, as they will form a short circuit at high frequencies.
The value of the feedback resistor should be chosen by using Figure 17 as a guideline. The gain can then be set
by adjusting the input resistor. The smaller the feedback resistor, the less noise is introduced into the system.
However, smaller values move the dominant pole to higher and higher frequencies, making the device more
susceptible to oscillations. Higher feedback resistor values add more noise to the system, but pull the dominant
pole down to lower frequencies, making the device more stable. Higher impedance loads tend to make the
device more unstable. One way to combat this problem is to increase the value of the feedback resistor. It is not
recommended that the feedback resistor exceed a value of 10kΩ. The typical value for the feedback resistor for
the TPA6120A2 is 1kΩ. In some cases, where a high-impedance load is used along with a relatively large gain
and a capacitive load, it may be necessary to increase the value of the feedback resistor from 1kΩ to 2kΩ, thus
adding more stability to the system. Another method to deal with oscillations is to increase the size of RO.
CAUTION
Do not place a capacitor in the feedback path. Doing so can cause oscillations.
10
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Typical Application (continued)
Capacitance at the outputs can cause oscillations. Capacitance from some sources, such as layout, can be
minimized. Other sources, such as those from the load (for example, the inherent capacitance in a pair of
headphones), cannot be easily minimized. In this case, adjustments to RO and/or RF may be necessary.
The series output resistor should be kept at a minimum of 10Ω; small enough so that the effect on the load is
minimal, but large enough to provide the protection necessary such that the output of the amplifier sees little
capacitance. The value can be increased to provide further isolation, up to 100Ω. Care should be taken in
selecting the thermal capacity of the output series resistor, as it will create a potential divider with the load and
dissipate power.
The series resistor, RS, should be used for two reasons:
1. It prevents the positive input pin from being exposed to capacitance from the line and source.
2. It prevents the source from seeing the input capacitance of the TPA6120A2.
The 50Ω resistor was chosen because it provides ample protection without interfering in any noticeable way with
the signal. Not shown is another 50Ω resistor that can be placed on the source side of RS to ground. In that
capacity, it serves as an impedance match to any 50Ω source. See Figure 15.
RF = 1 kW
VCC−
RI = 1 kW
VI
−
RO = 39.2 W
+
RL
VCC+
Figure 15. Single-Ended Input With A Noninverting Gain Of –1V/V
Figure 16 shows the TPA6120A2 connected with differential inputs. Differential inputs are useful because they
take the greatest advantage of the high CMRR of the device. The two feedback resistor values must be kept the
same, as do the input resistor values.
RF = 1 kW
VCC−
RI= 1 kW
VI−
−
VI+
+
RO = 39.2 W
RI = 1 kW
RL
VCC+
RF = 1 kW
Figure 16. Differential Input With A Noninverting Gain Of 2V/V
Special note regarding mono operation:
• If both amplifiers are powered on, but only one channel is to be used, the unused amplifier MUST have a
feedback resistor from the output to the negative input. Additionally, the positive input should be grounded as
close to the pin as possible. Terminate the output as close to the output pin as possible with a 25Ω load to
ground.
• These measures should be followed to prevent the unused amplifier from oscillating. If it oscillates, and the
power pins of both amplifiers are tied together, the performance of the amplifier could be seriously degraded.
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Typical Application (continued)
10.2.1.2.2 Checking For Oscillations And Instability
Checking the stability of the amplifier setup is recommended. High frequency oscillations in the megahertz region
can cause undesirable effects in the audio band.
Sometimes, the oscillations can be quite clear. An unexpectedly large draw from the power supply may be an
indication of oscillations. These oscillations can be seen with an oscilloscope. However, if the oscillations are not
obvious, or there is a chance that the system is stable but close to the edge, placing a scope probe with 10pF of
capacitance can make the oscillations worse, or actually cause them to start.
A network analyzer can be used to determine the inherent stability of a system. An output versus frequency
curve generated by a network analyzer can be a good indicator of stability. At high frequencies, the curve shows
whether a system is oscillating, close to oscillation, or stable. In Figure 17 the system is stable because the high
frequency rolloff is smooth and has no peaking. Increasing RF decreases the frequency at which this rolloff
occurs (see the Resistor Values section). Another scenario shows some peaking at high frequency. If the
peaking is 2dB, the amplifier is stable as there is still 45 degrees of phase margin. As the peaking increases, the
phase margin shrinks, causing the amplifier and the system to approach instability. The same system that
normally has a 2dB peak has an increased peak when a capacitor is added to the output, indicating that the
system is either on the verge of oscillation or is oscillating; corrective action is required.
2
Output Amplitude − dB
1
0
−1
−2
−3
−4
RF = 620 W
R F = 1 kW
RF = 1.5 kW
−5
−6
10
VCC = ±5V
100
1k
10k
100k 1M
f − Frequency − Hz
10M 100M 500M
Gain = 1V/V
RL = 25Ω
VIN = 200mV
Figure 17. High Frequency Peaking for Oscillation and Instability
12
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Typical Application (continued)
10.2.1.2.3 Thermal Considerations
There is no one to one relationship between output power and heat dissipation, so the following equations must
be used:
Efficiency of an amplifier =
PL
PSUP
(1)
Where
2
V
V
V 2
PL = LRMS , and VLRMS = P , therefore, PL = P per channel
RL
2R
2
L
(2)
PSUP = VCC ICCavg + VCC ICC(q)
(3)
p
p
V
V
1 2 VP
ICCavg =
sin(t) dt = - P [cos(t)] 2 = P
p 0 RL
pRL
pRL
0
(4)
ò
Where
VP = 2 PL RL
(5)
Therefore,
V
V
PSUP = CC P + VCC ICC(q)
pRL
(6)
PL = Power delivered to load (per channel)
PSUP = Power drawn from power supply
VLRMS = RMS voltage on the load
RL = Load resistance
VP = Peak voltage on the load
ICCavg = Average current drawn from the power supply
ICC(q) = Quiescent current (per channel)
VCC = Power supply voltage (total supply voltage = 30 V if running on a ±15-V power supply
η = Efficiency of a SE amplifier
For stereo operation, the efficiency does not change because both PL and PSUP are doubled, affecting the
amount of power dissipated by the package in the form of heat.
A simple formula for calculating the power dissipated, PDISS, is shown in Equation 7:
PDISS = (1- h) PSUP
(7)
In stereo operation, PSUP is twice the quantity that is present in mono operation.
The maximum ambient temperature, TA, depends on the heat-sinking ability of the system. RθJA for a 20-pin
DWP, whose thermal pad is properly soldered down, is shown in Thermal Information. Also see Figure 18.
TA Max = TJ Max - qJA PDISS
(8)
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10.2.1.3 Application Performance Plots
2.0
PD - Power Dissipation - W
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
Vcc = +/- 15 V; RL = 32
Vcc = +/- 15 V; RL = 64
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Po - Total Output Power - W
C009
Figure 18. Power Dissipation versus Output Power
10.2.2 High Fidelity Smartphone Application
A new trend in portable applications are termed "Hifi Smartphones". In these systems, a standard portable audio
codec continues to be used for telephony, while a separate, higher performance DAC and Headphone Amplifier
is used for music playback.
Figure 19 shows a complete circuit schematic for such a system. The digital audio is fed into a high performance
DAC. The PCM5242, a Burr-Brown product from TI, is a 32-bit, stereo DAC.
Vcc+
Vcc-
1.0mF
0603
10mF/25V
10mF/25V
+3.3V
0603 X5R
0603 X5R
0.1mF/16V
TPA6120A2RGY
10mF/10V
0603 X5R
0.1mF/25V
0402 X7R
AGND
AVDD
OUTRP
NC
QFN32-RHB
OUTLN
LRCK
ADR1/MISO/FMT
1
2
3
4
5
6
CPGND
PCM5242RHB
OUTRN
7
CAPM
NC
8
OUTLP
VNEG
402W
16
15
0402 X7R
0402 X7R
13
OUTRP
12
OUTRN
11
OUTLN
10
OUTLP
402W
0603
402W
402W
0603
402W
2.2mF/25V
1000pF/50V
402W
RIN+
1
RIN-
2
LIN-
6
LIN+
7
LIN+
0603 COG
0603
9
0603
1000pF/50V
402W
0603 COG
0603
0603
8
12
10
LINRIN-
HEADPHONE OUTPUT
3
NC
4
NC
5
NC
11
NC
LOUT
1
39.2W
13
ROUT
RIN+
3
RIGHT
2
LEFT
0805 1/8W
TPA6120A2
39.2W
9
0805 1/8W
3.5mm
806W
0603
806W
806W
0603
+1.8V
0603
0805 X7R
806W
+1.8V
10.0kW
XSMT
0402 X7R
0603
14
14
QFN14-RGY
PowerPAD
0.1mF/25V
402W
0603
LVCC-
SDA/MOSI/ATT2
DIN
VCOM/DEMP
LVCC+
GPIO5/ATT0
GPIO4/MAST
GPIO3/AGNS
SCL/MC/ATT1
MODE1
17
CAPP
32
19 18
CPVDD
31
20
GND
30
BCK
21
DVDD
29
SCK
22
LDOO
28
MODE2/MS
27
23
XSMT
26
GPIO6/FLT
GPIO2/GPO
24
25
0.1mF/25V
0.1mF/25V
RVCC-
0402 X7R
RVCC+
QFN32-RHB
PowerPAD
Shield
PCM5242RHB
0603
0402
2.2mF/25V
0805 X7R
SOFT MUTE
2
1
0.1mF/16V
2.2mH
+3.3V
TPS65135
0402 X7R
0.1mF/16V
0402 X7R
2.2mF/25V
+3.3V to +5/-5V POWER SUPPLY
15
0805 X7R
1
+3.3V
TPS65135
0402 X7R
10mF/10V
8
10mF/6.3V
+1.8V
0.1mF/16V
16
QFN16-RTE
PowerPAD
0.1mF/16V
0603 X5R
100LS
0402 X7R
4
11
12
0603 X5R
0.1mF/16V
5
L1
L2
L1
L2
VIN
OUTP
EN
OUTP
VAUX
FB
PGND
FBG
PGND
OUTN
GND
OUTN
Vcc+
14
13
10
9
365kW
0805 1/8W
7
10mF/6.3V
0603 X5R
6
3
120kW
0805 1/8W
2
0402 X7R
487kW
0805 1/8W
10mF/6.3V
0603 X5R
Vcc-
Figure 19. Typical Application Circuit
14
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10.2.2.1 Design Requirements
• ±5V Operation from an over system power supply of 3.3V
• Stereo differential inputs (DAC is differential)
• Be transparent to the user. (DAC SNR and THD+N performance all the way to the headphone)
10.2.2.2 Detailed Design Procedure
For optimal performance, the TPA6120A2 is configured for use with differential inputs, stereo use, and a gain of
1V/V.
The TPA6120A2 requires a bipolar power supply to drive a ground centered output. The application employs a
TPS65135 DC-DC converter that generates ±5V from a single 3.3V supply.
The PCM5242 DAC is configured for a 1VRMS output so that clipping is avoided should the 3.3V power supply
sag. The PCM5242 offers a ground centered output, so that no DC blocking capacitors are required between it
and the TPA6120A2.
Resistor values around the TPA6120A2 of 806Ω and a 39.2Ω were found to offer the optimal conditions of SNR
and THD. Starting with 1KΩ resistors for input and feedback, and 10Ω output resistance, the feedback resistance
was lowered to increase the amount of current in the feedback network. The output resistance was increased to
ease the load on the headphone amplifier when low impedance headphones are connected. Both of these
additions contribute to the excellent SNR and THD of the TPA6120A2 in such a low voltage application.
Note that the 0.1-uF X7R capacitors are placed at every supply pin of the TPA6120A2.
Using such a solution makes the TPA6120A2 transparent in the circuit, even into a low impedance 32Ohm load.
The remaining steps are the same as those described in Resistor Values.
10.2.2.3 Application Performance Plots
1.20
Vcc = +/- 5 V; RL = 32
Vcc = +/- 5 V; RL = 64
Vcc = +/- 15 V; RL = 32
Vcc = +/- 15 V; RL = 64
PD - Power Dissipation - W
1.10
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0
5
10
15
20
25
30
35
Po - Total Output Power - mW
40
45
50
C009
Figure 20. Power Dissipation versus Power Output - 50mW Scale
In this particular application, the TPA6120A2's performance is transparent and the performance of the system is
dictated by the PCM5242 DAC.
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11 Power Supply Recommendations
11.1 Independent Power Supplies
The TPA6120A2 consists of two independent high-fidelity amplifiers. Each amplifier has its own voltage supply,
allowing the user to leave one of the amplifiers off, saving power, reducing the generated heat, and reducing
crosstalk.
Although the power supplies are independent, there are some limitations. When both amplifiers are used, the
same voltage must be applied to each amplifier. For example, if the left channel amplifier is connected to a ±12-V
supply, the right channel amplifier must also be connected to a ±12-V supply. If the device is connected to a
different supply voltage, it may not operate properly and consistently.
When the use of only one amplifier is preferred, it must be the left amplifier. The voltage supply to the left
amplifier is also responsible for internal start-up and bias circuitry of the device. Regardless of whether one or
both amplifiers are used, the VCC- pins of both amplifiers must always be at the same potential.
To power down the right channel amplifier, disconnect the VCC+ pin from the power source.
The two independent power supplies can be tied together on the board to receive their power from the same
source.
11.2 Power Supply Decoupling
As with any design, proper power supply decoupling is essential. Decoupling prevents noise from entering the
device via the power traces and provides the extra power the device can sometimes require in a rapid fashion,
preventing the device from being momentarily current-starved. Both of these functions serve to reduce distortion,
leaving a clean, uninterrupted signal at the output.
Bulk decoupling capacitors should be used where the main power is brought to the board. Smaller capacitors
should be placed as close as possible to the actual power pins of the device. Because the TPA6120A2 has four
power pins, use four surface mount capacitors. Both types of capacitors should be low ESR.
16
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12 Layout
12.1 Layout Guidelines
Proper board layout is crucial to getting the maximum performance out of the TPA6120A2.
A ground plane should be used on the board to provide a low inductive ground connection. Having a ground
plane underneath traces adds capacitance, so care must be taken when laying out the ground plane on the
underside of the board (assuming a 2-layer board). The ground plane is necessary on the bottom for thermal
reasons.
Stray capacitance can still make its way onto the sensitive outputs and inputs. Place components as close as
possible to the pins and reduce trace lengths. See Figure 21 and Figure 22. Place the feedback resistor and the
series output resistor extremely close to the pins. The input resistor should also be placed close to the pin. If the
amplifier is to be driven in a noninverting configuration, ground the input close to the device so the current has a
short, straight path to the PowerPAD (gnd).
Too Long
Too Long
RF
RI
VI
−
+
TPA6120A2
Too Long
RO
Too Long
RL
Figure 21. Layout That Can Cause Oscillation
Minimized Length of
Feedback Path
Short Trace
Before Resistors
VI
RF
−
RO
RI
+
RL
TPA6120A2
Ground as Close to
the Pin as Possible
Minimized Length of
the Trace Between
Output Node and RO
Figure 22. Layout Designed To Reduce Capacitance On Critical Nodes
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12.2 Layout Example
This is part of a 4-layer board, where ground, V+, V- are on the bottom and two middle traces, respectively. Key
items to note in this layout:
1. R4 and R3 are the output resistors in the schematic. They are sized as 0603 surface mount resistors instead
of 0402 for their thermal capacity, as they will be dissipating heat, depending on the output power.
2. Traces are kept as short as possible to avoid any capacitance or oscillation issues.
3. In systems that may be using the DWP package with through hole resistors, it's strongly suggested that the
input and output pins and components do not have a ground plane directly beneath them, to avoid stray
capacitance.
Figure 23. PCB Layout Example
Figure 24. Example PCB Layout, Top Layer and
Silkscreen, Top View
18
Figure 25. Example PCB Layout, Middle-1 Layer
and Silkscreen, Top View
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Layout Example (continued)
Figure 26. Example PCB Layout, Middle-2 Layer
and Silkscreen, Top View
Figure 27. Example PCB Layout, Bottom Layer and
Silkscreen, Top View
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13 Device and Documentation Support
13.1 Documentation Support
13.1.1 Related Documentation
Headphone Amplifier Parametric Table
SoundPlus™ High Performance Audio Operational Amplifiers, SBOS058
13.2 Trademarks
All trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
20
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PACKAGE OUTLINE
DWP0020B
PowerPAD TM SOIC - 2.65 mm max height
SCALE 1.200
PLASTIC SMALL OUTLINE
10.65
TYP
10.16
A
PIN 1 ID AREA
18X 1.27
20
1
12.95
12.70
NOTE 3
2X
11.43
10
B
11
7.59
7.45
0.51
0.35
0.25
20X
C A
B
0.1 C
SEATING PLANE
SEE DETAIL A
C
(0.25) TYP
2X
0.13 MAX
NOTE 5
2.79
1.91
3.81
2.81
EXPOSED
THERMAL PAD
2.65
MAX
0.25
GAGE PLANE
2X
0.86 MAX
NOTE 5
0 -8
1.27
0.40
DETAIL A
TYPICAL
4218913/A 12/2015
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Features may not present.
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EXAMPLE BOARD LAYOUT
DWP0020B
PowerPAD TM SOIC - 2.65 mm max height
PLASTIC SMALL OUTLINE
(6.5)
NOTE 8
SOLDER MASK
DEFINED PAD
(2.79)
SYMM
20X (2)
SEE DETAILS
1
20
20X (0.6)
18X (1.27)
(12.83)
NOTE 8
(0.55)
TYP
SYMM
(3.81)
( 0.2) TYP
VIA
(R0.05) TYP
(1.1)
TYP
10
METAL COVERED
BY SOLDER MASK
11
(0.55) TYP
(1.1) TYP
(9.4)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
0.07 MIN
AROUND
0.07 MAX
AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4218913/A 12/2015
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
7. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
8. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
DWP0020B
PowerPAD TM SOIC - 2.65 mm max height
PLASTIC SMALL OUTLINE
(2.79)
BASED ON 0.125 THICK STENCIL
20X (2)
1
20
20X (0.6)
18X (1.27)
(3.81)
BASED ON
0.125 THICK
STENCIL
SYMM
11
10
SYMM
METAL COVERED
BY SOLDER MASK
(9.4)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:6X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
0.125
0.15
0.175
3.12 X 4.26
2.79 X 3.81 (SHOWN)
2.55 X 3.48
2.36 X 3.22
4218913/A 12/2015
NOTES: (continued)
9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
10. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPA6120A2DWP
ACTIVE SO PowerPAD
DWP
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
6120A2
TPA6120A2DWPG4
ACTIVE SO PowerPAD
DWP
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
6120A2
TPA6120A2DWPR
ACTIVE SO PowerPAD
DWP
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
6120A2
TPA6120A2RGYR
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
6120A2
TPA6120A2RGYT
ACTIVE
VQFN
RGY
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
6120A2
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPA6120A2DWPR
SO
Power
PAD
DWP
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
TPA6120A2RGYR
VQFN
RGY
14
3000
330.0
12.4
3.75
3.75
1.15
8.0
12.0
Q2
TPA6120A2RGYT
VQFN
RGY
14
250
180.0
12.4
3.75
3.75
1.15
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPA6120A2DWPR
SO PowerPAD
DWP
20
2000
350.0
350.0
43.0
TPA6120A2RGYR
VQFN
RGY
14
3000
367.0
367.0
35.0
TPA6120A2RGYT
VQFN
RGY
14
250
210.0
185.0
35.0
Pack Materials-Page 2
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