Texas Instruments | TPA313xD2 4-W, 25-W Filter-Free Class-D Stereo Amplifier With AM Avoidance (Rev. B) | Datasheet | Texas Instruments TPA313xD2 4-W, 25-W Filter-Free Class-D Stereo Amplifier With AM Avoidance (Rev. B) Datasheet

Texas Instruments TPA313xD2 4-W, 25-W Filter-Free Class-D Stereo Amplifier With AM Avoidance (Rev. B) Datasheet
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TPA3131D2, TPA3132D2
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
TPA313xD2 4-W, 25-W Filter-Free Class-D Stereo Amplifier With AM Avoidance
1 Features
2 Applications
•
•
•
•
1
•
•
•
•
•
•
•
•
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Supports Multiple Output Configurations
– 2 × 4 W into a 8-Ω BTL Load at 7.4 V
(TPA3131D2)
– 2 × 25 W into a 8-Ω BTL Load at 19 V
(TPA3132D2)
Wide Voltage Range: 4.5 V to 26 V
Automotive Load-Dump Compliant
Efficient Class-D Operation
– >90% Power Efficiency Combined With Low
Idle Loss for Heat Sink free Operation
– Advanced Modulation Schemes
Multiple Switching Frequencies
– AM Avoidance
– Master and Slave Synchronization
– Up to 1.2-MHz Switching Frequency
Feedback Power Stage Architecture With High
PSRR Reduces PSU Requirements
Programmable Power Limit
Differential and Single-Ended Inputs
Stereo and Mono Mode With Single-Filter Mono
Configuration
Single Power Supply Reduces Component Count
Integrated Self-Protection Circuits Including
Overvoltage, Undervoltage, Overtemperature, DCDetect, and Short Circuit With Error Reporting
Thermally Enhanced Package
– 32-Pin VQFN Pad-Down
–40°C to 85°C Ambient Temperature Range
Laptop Computers and Ultrabooks
Flatpanel TV
Consumer Audio Applications
3 Description
The TPA313xD2 are efficient, stereo digital amplifier
power stages for driving speakers with up to
2x42W/4Ω peak power. TPA3131/32D2 operates
heatsink-free with cooling to PCB through the bottom
side PowerPAD™ with sustained output power from 2
× 4 W / 8 Ω (TPA3131D2) to 2 × 25 W / 8 Ω
(TPA3132D2).
The TPA313xD2 advanced oscillator/PLL circuit
employs a multiple switching frequency option to
avoid AM interferences; this is achieved together with
an option of Master and Slave synchronization,
making it possible to synchronize multiple devices.
The TPA313xD2 are fully protected against faults with
short-circuit protection and thermal protection as well
as overvoltage, undervoltage, and DC protection.
Faults are reported back to the processor to prevent
devices from being damaged during overload
conditions.
For feature compatible devices see: PowerPAD up
device 2 × 50-W TPA3116D2, PowerPAD down 2 ×
15-W TPA3130D2 and 2 × 30-W TPA3118D2.
Device Information(1)
PART NUMBER
TPA3131D2
TPA3132D2
PACKAGE
BODY SIZE (NOM)
VQFN (32)
5.00 mm × 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Application Circuit
Audio Processor
And control
Right
Audio Source
TPA3131D2
TPA3132D2
PBTL
Detect
Left
4.5V-26V
PSU
Right
LC Filter
Left
LC Filter
SDZ
MUTE
FAULTZ
AM/FM Avoidance
Control
GAIN control and Master/Slave setting
Power Limit
Capable of synchronizing to other devices
AM2,1,0
GAIN / SLV
PLIMIT
Sync
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA3131D2, TPA3132D2
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
5
5
5
5
6
6
8
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
DC Electrical Characteristics ....................................
AC Electrical Characteristics.....................................
Typical Characteristics ..............................................
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 20
8
Applications and Implementation ...................... 21
8.1 Application Information............................................ 21
8.2 Typical Application .................................................. 21
9 Power Supply Recommendations...................... 23
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Example .................................................... 24
10.3 Thermal Design..................................................... 25
11 Device and Documentation Support ................. 27
11.1
11.2
11.3
11.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
27
27
27
27
12 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
Changes from Revision A (September 2013) to Revision B
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Changed Gain (BTL) to Gain (MSTR) .................................................................................................................................... 6
•
Changed Gain (MSTR) R1 values to R2 values and R2 values to R1 values ....................................................................... 6
•
Changed Gain (SLV) R1 values to R2 values and R2 values to R1 values .......................................................................... 6
•
Deleted BD Mode from TYPICAL CHARACTERISTICS conditions....................................................................................... 8
•
Changed legends in Figure 13 ............................................................................................................................................... 9
2
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SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
5 Pin Configuration and Functions
INNR
INPR
FAULTZ
SDZ
PVCC
PVCC
BSPR
OUTPR
32
31
30
29
28
27
26
25
RHB Packaged
32-Pin VQFN With Exposed Thermal Pad
Top View
PLIMIT
1
24
GND
GVDD
2
23
OUTNR
GAIN/SLV
3
22
BSNR
GND
4
21
GND
INNL
5
20
GND
INPL
6
19
BSNL
MUTE
7
18
OUTNL
AM2
8
17
GND
BSPL
16
OUTPL
14
15
PVCC
PVCC
13
12
AVCC
SYNC
AM0
11
10
AM1
9
Exposed Thermal Pad
Pin Functions
PIN
NO.
NAME
TYPE (1)
DESCRIPTION
1
PLIMIT
I
Power limit level adjust. Connect a resistor divider from GVDD to GND to set power limit. Connect directly
to GVDD for no power limit.
2
GVDD
PO
Internally generated gate voltage supply. Not to be used as a supply or connected to any component other
than a 1uF X7R ceramic decoupling capacitor.
3
GAIN/SLV
I
Sets Gain and selects between Master and Slave mode depending on pin voltage divider.
4
GND
G
Ground
5
INNL
I
Negative audio input for left channel. Biased at 3V.
6
INPL
I
Positive audio input for left channel. Biased at 3V.
7
MUTE
I
Mute signal for fast disable/enable of outputs: HIGH = outputs OFF (high-Z), LOW = outputs ON. TTL logic
levels with compliance to AVCC.
8
AM2
I
AM Avoidance Frequency Selection
9
AM1
I
AM Avoidance Frequency Selection
10
AM0
I
AM Avoidance Frequency Selection
11
SYNC
DIO
12
AVCC
P
Analog Supply
13
PVCC
P
Power supply
14
PVCC
P
Power supply
15
BSPL
BST
Boot strap for positive left channel output, connect to 220nF X7R ceramic cap to OUTPL
16
OUTPL
PO
Positive left channel output
17
GND
18
OUTNL
PO
Negative left channel output
19
BSNL
BST
Boot strap for negative left channel output, connect to 220nF X7R ceramic cap to OUTNL
20
GND
G
Ground
21
GND
G
Ground
22
BSNR
BST
(1)
G
Clock input/output for synchronizing multiple class-D devices. Direction determined by GAIN/SLV pin. Input
signal not to exceed GVDD (7V)
Ground
Boot strap for negative right channel output, connect to 220nF X7R ceramic cap to OUTNR
TYPE: DO = Digital Output, I = Analog Input, G = General Ground, PO = Power Output, BST = Boot Strap.
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Pin Functions (continued)
PIN
NO.
NAME
TYPE (1)
23
OUTNR
24
GND
25
OUTPR
PO
Positive right channel output
26
BSPR
BST
Boot strap for positive right channel output, connect to 220nF X7R ceramic cap to OUTPR
27
PVCC
PI
Power supply
28
PVCC
PI
Power supply
29
SDZ
30
FAULTZ
31
INPR
I
Positive audio input for right channel. Biased at 3V.
32
INNR
I
Negative audio input for right channel. Biased at 3V.
33
Thermal pad
G
Connect to GND for best system performance. If not connected to GND, leave floating.
4
PO
DESCRIPTION
G
I
DO
Negative right channel output
Ground
Shutdown logic input for audio amp (LOW = outputs Hi-Z, HIGH = outputs enabled). TTL logic levels with
compliance to AVCC.
General fault reporting including Over-current_PVCC, OVP_DVDD
FAULT1Z = High, normal operation
FAULT1Z = Low, fault condition
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SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC
Input voltage, VI
Slew rate, maximum
MIN
MAX
UNIT
PVCC, AVCC
–0.3
30
V
INPL, INNL, INPR, INNR
–0.3
6.3
V
PLIMIT, GAIN / SLV, SYNC
–0.3
GVDD+0.3
V
AM0, AM1, AM2, MUTE, SDZ
–0.3
PVCC+0.3
V
10
V/ms
Operating free-air temperature, TA
AM0, AM1, AM2, MUTE, SDZ
–40
85
°C
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–40
125
°C
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
UNIT
VCC
Supply voltage
PVCC, AVCC
VIH
High-level input
voltage
AM0, AM1, AM2, MUTE, SDZ, SYNC
VIL
Low-level input
voltage
AM0, AM1, AM2, MUTE, SDZ, SYNC
0.8
V
VOL
Low-level output
voltage
FAULTZ, RPULL-UP = 100 kΩ, PVCC = 26 V
0.8
V
IIH
High-level input
current
AM0, AM1, AM2, MUTE, SDZ (VI = 2 V, VCC = 18 V)
50
µA
RL(BTL)
Minimum load
RL(PBTL) Impedance
Output-filter
Inductance
Lo
4.5
MAX
26
V
2
Output filter: L = 10 µH, C = 680 nF
3.2
Output filter: L = 10 µH, C = 1 µF
1.6
Minimum output filter inductance under short-circuit condition
V
4
Ω
1
µH
6.4 Thermal Information
TPA313xD2
THERMAL METRIC (1) (2)
VQFN
UNIT
32 PINS
RθJA
Junction-to-ambient thermal resistance
31.3
ψJT
Junction-to-top characterization parameter
0.2
ψJB
Junction-to-board characterization parameter
5.5
(1)
(2)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The heat sink drawing used for the thermal model data are shown in the application section, size: 14mm wide, 50mm long, 25mm high.
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6.5 DC Electrical Characteristics
TA = 25°C, AVCC = PVCC = 7.4 V to 26 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
| VOS |
ICC
TEST CONDITIONS
Class-D output offset voltage (measured
differentially)
Quiescent supply current
MIN
TYP
MAX
VI = 0 V, Gain = 36 dB
1.5
15
SDZ = 2 V, No load or filter, PVCC = 7.4 V
(TPA3131D2)
16
SDZ = 2 V, No load or filter, PVCC = 19 V
(TPA3132D2)
27
UNIT
mV
mA
ICC(SD)
Quiescent supply current in shutdown
mode
SDZ = 0.8 V, No load or filter
<50
µA
rDS(on)
Drain-source on-state resistance,
measured pin to pin
PVCC = 7.4V to 19V V, Iout = 500 mA, TJ = 25°C
120
mΩ
G
G
Gain (MSTR)
Gain (SLV)
R1 = 5.6 kΩ, R2 = Open
19
20
21
R1 = 20 kΩ, R2 = 100 kΩ
25
26
27
R1 = 39 kΩ, R2 = 100 kΩ
31
32
33
R1 = 47 kΩ, R2 = 75 kΩ
35
36
37
R1 = 51 kΩ, R2 = 51 kΩ
19
20
21
R1 = 75 kΩ, R2 = 47 kΩ
25
26
27
R1 = 100 kΩ, R2 = 39 kΩ
31
32
33
R1 = 100 kΩ, R2 = 16 kΩ
35
36
37
ton
Turn-on time
SDZ = 2 V
tOFF
Turn-off time
SDZ = 0.8 V
10
GVDD
Gate drive supply
IGVDD < 200 µA
VO
Output voltage maximum under PLIMIT
control
V(PLIMIT) = 2 V; VI = 1 Vrms
dB
dB
dB
dB
ms
2
µs
6.4
6.9
7.4
V
6.75
7.90
8.75
V
TYP
MAX
UNIT
6.6 AC Electrical Characteristics
TA = 25°C, AVCC = PVCC = 7.4 V to 24 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
KSVR
PO
Power supply ripple rejection
Continuous output power
TEST CONDITIONS
MIN
200 mVPP ripple at 1 kHz, Gain = 20 dB, Inputs ACcoupled to GND
RL = 8 Ω, THD+N = 10%, f = 1 kHz, PVCC = 7.4 V
(TPA3131D2)
4
RL = 4 Ω, THD+N = 10%, f = 1 kHz, PVCC = 7.4 V
(TPA3131D2)
7.3
RL = 8 Ω, THD+N = 10%, f = 1 kHz, PVCC = 19V
(TPA3132D2)
25
RL = 4 Ω, THD+N = 10%, f = 1 kHz, PVCC = 19V
(TPA3132D2)
42
THD+N
Total harmonic distortion + noise
RL = 8 Ω, f = 1 kHz, PO = 0.1W to 2 W (TPA3132D2)
RL = 8 Ω, f = 1 kHz, PO = 0.1W to 12.5 W (TPA3131D2)
Vn
Output integrated noise
20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB
Crosstalk
VO = 1 Vrms, Gain = 20 dB, f = 1 kHz
SNR
6
Signal-to-noise ratio
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–70
dB
W
0.1%
70
µV
–80
dBV
–100
dB
Maximum output at THD+N < 1%, f = 1 kHz, Gain = 20 dB,
A-weighted (TPA3131D2, PVCC = 7.4V)
98
Maximum output at THD+N < 1%, f = 1 kHz, Gain = 20 dB,
A-weighted (TPA3131D2, PVCC = 19V)
105
dB
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AC Electrical Characteristics (continued)
TA = 25°C, AVCC = PVCC = 7.4 V to 24 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
fOSC
Oscillator frequency
TEST CONDITIONS
MIN
TYP
MAX
AM2=0, AM1=0, AM0=0
376
400
424
AM2=0, AM1=0, AM0=1
470
500
530
AM2=0, AM1=1, AM0=0
564
600
636
AM2=0, AM1=1, AM0=1
940 1000
1060
AM2=1, AM1=0, AM0=0
1128 1200
1278
UNIT
kHz
AM2=1, AM1=0, AM0=1
AM2=1, AM1=1, AM0=0
Reserved
AM2=1, AM1=1, AM0=1
Thermal trip point
Thermal hysteresis
Over current trip point
150+
°C
15
°C
TPA3131D2
3.4
TPA3132D2
7
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6.7 Typical Characteristics
fs = 400 kHz (unless otherwise noted)
10
10
Gain = 26 dB
PVCC = 7.4 V
TA = 25 °C
f = 1 kHz
1
THD+N (%)
1
THD+N (%)
PO = 0.5 W
PO = 1 W
PO = 2.5 W
Gain =26 dB
PVCC = 7.4 V
TA = 25 °C
RL = 8 Ω
0.1
0.01
0.1
0.01
RL = 4 Ω
RL = 8 Ω
0.001
0.01
0.1
1
Output Power per Channel (W)
0.001
10
20
100
1k
Frequency (Hz)
10k
20k
G003
Figure 1. Total Harmonic Distortion + Noise (BTL) vs Output
Power
G001
Figure 2. Total Harmonic Distortion + Noise (BTL) vs
Frequency
10
100
PO = 1 W
PO = 2.5 W
PO = 5 W
Gain = 26 dB
PVCC = 7.4 V
TA = 25 °C
RL = 4 Ω
90
80
1
60
THD+N (%)
Power Efficiency (%)
70
50
40
0.1
30
0.01
20
Gain = 26 dB
TA = 25 °C
PVCC = 7.4 V
10
0
0
2
4
RL = 4 Ω
RL = 8 Ω
6
8
10
Total Output Power (W)
12
0.001
14 15
20
100
1k
Frequency (Hz)
10k
20k
G004
Figure 3. Power Efficiency (BTL) vs Supply Voltage
G002
Figure 4. Total Harmonic Distortion + Noise (BTL) vs
Frequency
10
10
Gain = 26 dB
PVCC = 19 V
TA = 25 °C
f = 1 kHz
1
THD+N (%)
1
THD+N (%)
PO = 1 W
PO = 5 W
PO =10 W
Gain = 26 dB
PVCC = 19 V
TA = 25 °C
RL = 8 Ω
0.1
0.01
0.1
0.01
RL = 4 Ω
RL = 8 Ω
0.001
0.01
0.1
1
Output Power per Channel (W)
10
50
0.001
20
100
G007
Figure 5. Total Harmonic Distortion + Noise (BTL) vs Output
Power
8
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1k
Frequency (Hz)
10k
20k
G005
Figure 6. Total Harmonic Distortion + Noise (BTL) vs
Frequency
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Typical Characteristics (continued)
fs = 400 kHz (unless otherwise noted)
10
100
PO = 1 W
PO = 10 W
PO = 20 W
Gain =26dB
PVCC = 19 V
TA = 25 °C
RL = 4 Ω
90
80
1
60
THD+N (%)
Power Efficiency (%)
70
50
40
0.1
30
0.01
20
Gain = 26 dB
TA = 25 °C
PVCC = 19 V
10
0
0
5
RL = 4 Ω
RL = 8 Ω
10
15
20
Total Output Power (W)
25
0.001
30
20
100
1k
Frequency (Hz)
10k
20k
G008
Figure 7. Power Efficiency (BTL) vs Output Power
G006
Figure 8. Total Harmonic Distortion + Noise (BTL) vs
Frequency
10
10
Gain = 26 dB
PVCC = 19 V
TA = 25 °C
f = 1 kHz
1
THD+N (%)
1
THD+N (%)
PO = 1 W
PO = 10 W
PO = 20 W
Gain = 26 dB
PVCC = 19 V
TA = 25 °C
RL = 4 Ω
0.1
0.01
0.1
0.01
RL = 2 Ω
RL = 4 Ω
0.001
0.01
0.1
1
Output Power (W)
10
0.001
100
20
100
1k
Frequency (Hz)
10k
20k
G011
Figure 9. Total Harmonic Distortion + Noise (TPA3132D2
PBTL) vs Output Power
G009
Figure 10. Total Harmonic Distortion + Noise (TPA3132D2
PBTL) vs Frequency
10
100
PO = 1W
PO = 20W
PO = 40W
Gain = 26dB
PVCC = 19V
TA = 25°C
RL = 2Ω
90
80
1
60
THD+N (%)
Power Efficiency (%)
70
50
40
0.1
30
0.01
20
Gain = 26 dB
TA = 25 °C
PVCC = 19 V
10
0
0
5
10
RL = 2 Ω
RL = 4 Ω
15
20
25
30
35
Total Output Power (W)
40
45
50
0.001
20
G012
Figure 11. Power Efficiency (TPA3132D2 PBTL) vs Output
Power
100
1k
Frequency (Hz)
10k
20k
G010
Figure 12. Total Harmonic Distortion + Noise (TPA3132D2
PBTL) vs Frequency
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Typical Characteristics (continued)
fs = 400 kHz (unless otherwise noted)
30
RL = 8 Ω, THD = 1 %
RL = 8 Ω, THD = 10 %
RL = 4 Ω, THD = 1 %
RL = 4 Ω, THD = 10 %
RL = 4 Ω, Current Limit TPA3131
RL = 8 Ω, Current Limit TPA3131
50
240.0
20
40
140.0
10
Gain (dB)
Output Power (W)
340.0
30
Gain = 26 dB
TA = 25 °C
PVCC = 26 V
20
40.0
0
−60.0
Phase (°)
60
−10
−160.0
10
0
0
1
2
3
4
5
PLIMIT Voltage (V)
−30
10
−260.0
Gain
Phase
100
1k
Frequency (Hz)
10k
−360.0
100k
G013
G016
Figure 13. Maximum Output Power (BTL) vs PLimit Voltage
Figure 14. Gain/Phase (BTL) vs Frequency
60
40
THD+N = 1 %
THD+N = 10 %
THD+N = 1 % ;PLIMIT = 1.85 V
THD+N = 10 % ;PLIMIT = 1.85 V
THD+N = 1 % ;PLIMIT = 4.25 V
THD+N = 10 % ;PLIMIT = 4.25 V
30
25
20
Gain = 26 dB
TA = 25 °C
RL = 8 Ω
15
THD+N = 1 %
THD+N = 10 %
THD+N = 1 % ;PLIMIT = 1.85 V
THD+N = 10 % ;PLIMIT = 1.85 V
THD+N = 1 % ;PLIMIT = 4.25 V
THD+N = 10 % ;PLIMIT = 4.25 V
55
Maximum Output Power per Channel (W)
35
Maximum Output Power per Channel (W)
Gain = 26 dB
PVCC = 12 V
TA = 25 °C
RL = 8 Ω
−20
10
50
45
40
35
30
Gain = 26 dB
TA = 25 °C
RL = 4 Ω
25
20
15
10
5
5
0
4
6
8
10
12 14 16 18
Supply Voltage (V)
20
22
24
0
26
0
2
4
6
8
10 12 14 16 18 20 22 24 26
Supply Voltage (V)
G014
Figure 15. Maximum Output Power (BTL) vs Supply Voltage
G015
Figure 16. Maximum Output Power (BTL) vs Supply Voltage
0
0
Gain = 26 dB
PVCC = 24 V
TA = 25 °C
RL = 8 Ω
−10
−20
Gain = 26 dB
PVCC = 12 DC + 200 mVpp
TA = 25 °C
RL = 8Ω
−10
−20
−30
−30
−50
kSVR (dB)
Crosstalk (dB)
−40
−60
−70
−80
−40
−50
−60
−70
−90
−80
−100
−110
−120
−90
Right to Left
Left to Right
20
100
1k
Frequency (Hz)
10k
20k
−100
Left Channel
Right Channel
20
100
1k
Frequency (Hz)
10k
G017
Figure 17. Crosstalk (BTL) vs Frequency
10
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20k
G018
Figure 18. PSRR vs Frequency
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7 Detailed Description
7.1 Overview
The TPA3132D2 device is a high-efficiency stereo Class-D audio power amplifier optimized for high-transient
power capability to utilize the dynamic power headroom of small loudspeakers. It’s capable of delivering high
peak power into a 4-Ω speaker.
The device can be configured for either master or slave operation by using the SYNC pin. This helps to prevent
audible beats noise.
7.2 Functional Block Diagram
GVDD
SDZ
MUTE
PVCC
BSPR
PVCC
TTL
Buffer
Gain
Control
PBTL Select
OUTPR_FB
Gate
Drive
GAIN
OUTPR
+
OUTPR FB
–
RINN
RINP
Gain
Control
+
–
+
–
+
PLIMIT
–
+
–
GND
PWM
Logic
GVDD
–
PVCC
BSNR
PVCC
OUTPNR FB
OUTNR_
FB
+
FAULTZ
Gate
Drive
OUTNR
SC Detect
GND
SYNC
GAIN/SLV
Ramp
Generator
AM<2:0>
Startup Protection
Logic
Biases and
References
PLIMIT
Reference
PLIMIT
DC Detect
Thermal
Detect
UVLO/OVLO
GVDD
AVDD
AVCC
PVCC
LDO
Regulator
GVDD
Gate
Drive
GVDD
OUTNL
+
OUTNL_FB
OUTNL_
FB
–
–
LINP
LINN
BSNL
PVCC
Gain
Control
–
+
+
+
–
GND
PWM
Logic
PLIMIT
GVDD
+
PVCC
BSPL
PVCC
OUTPL_FB
–
Input
Sense
Gate
Drive
OUTPL
PBTL Select
PBTL
Select
OUTPL_FB
GND
GND
Thermal
Pad
7.3 Feature Description
7.3.1 Gain Setting and Master and Slave
The gain of the TPA3131D2 is set by the voltage divider connected to the GAIN/SLV control pin. Master or Slave
mode is also controlled by the same pin. An internal ADC is used to detect the 8 input states. The first four
stages sets the GAIN in Master mode in gains of 20, 26, 32, 36 dB respectively, while the next four stages sets
the GAIN in Slave mode in gains of 20, 26, 32, 36 dB respectively. The gain setting is latched during power-up
and cannot be changed while device is powered. shows the recommended resistor values and the state and
gain:
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Feature Description (continued)
Table 1. Gain and Master/Slave
MASTER / SLAVE
MODE
GAIN
R1 (to GND)
R2 (to GVDD)
INPUT IMPEDANCE
Master
20 dB
5.6 kΩ
OPEN
60 kΩ
Master
26 dB
20 kΩ
100 kΩ
30 kΩ
Master
32 dB
39 kΩ
100 kΩ
15 kΩ
Master
36 dB
47 kΩ
75 kΩ
9 kΩ
Slave
20 dB
51 kΩ
51 kΩ
60 kΩ
Slave
26 dB
75 kΩ
47 kΩ
30 kΩ
Slave
32 dB
100 kΩ
39 kΩ
15 kΩ
Slave
36 dB
100 kΩ
16 kΩ
9 kΩ
R2
100k
PLIMIT
1µF
R1
20k
GVDD
GAIN/SLV
AGND
GND
INNL
INPL
1
2
3
4
5
6
Figure 19. Gain and Master/Slave Select Resistors
In Master mode, SYNC terminal is an output, in Slave mode, SYNC terminal is an input for a clock input. TTL
logic levels with compliance to GVDD.
7.3.2 Input Impedance
The TPA313xD2 input stage is a fully differential input stage and the input impedance changes with the gain
setting from 9 kΩ at 36 dB gain to 60 kΩ at 20 dB gain. Table 1 lists the values from min to max gain. The
tolerance of the input resistor value is ±20% so the minimum value will be higher than 7.2 kΩ. The inputs need to
be AC-coupled to minimize the output dc-offset and ensure correct ramping of the output voltages during powerON and power-OFF. The input ac-coupling capacitor together with the input impedance forms a high-pass filter
with the following cut-off frequency:
1
ƒf =
2pZiCi
(1)
If a flat bass response is required down to 20 Hz the recommended cut-off frequency is a tenth of that, 2 Hz. lists
the recommended ac-couplings capacitors for each gain step. If a -3 dB is accepted at 20 Hz 10 times lower
capacitors can used – for example, a 1 µF can be used.
Table 2. Recommended Input AC-Coupling Capacitors
12
GAIN
INPUT IMPEDANCE
INPUT CAPACITANCE
HIGH-PASS FILTER
20 dB
60 kΩ
1.5 µF
1.8 Hz
26 dB
30 kΩ
3.3 µF
1.6 Hz
32 dB
15 kΩ
5.6 µF
2.3 Hz
36 dB
9 kΩ
10 µF
1.8 Hz
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Zf
Ci
IN
Input
Signal
Zi
Figure 20. Input AC Coupling
The input capacitors used should be a type with low leakage, like quality electrolytic, tantalum or ceramic. If a
polarized type is used the positive connection should face the input pins which are biased to 3 Vdc.
7.3.3 Start-up/Shutdown Operation
The TPA313xD2 employs a shutdown mode of operation designed to reduce supply current (Icc) to the absolute
minimum level during periods of nonuse for power conservation. The SDZ input terminal should be held high
(see specification table for trip point) during normal operation when the amplifier is in use. Pulling SDZ low will
put the outputs to mute and the amplifier to enter a low-current state. It is not recommended to leave SDZ
unconnected, because amplifier operation would be unpredictable.
For the best power-off pop performance, place the amplifier in the shutdown mode prior to removing the power
supply. The gain setting is selected at the end of the start-up cycle. At the end of the start-up cycle, the gain is
selected and cannot be changed until the next power-up.
7.3.4 PLIMIT Operation
The TPA313xD2 has a built-in voltage limiter that can be used to limit the output voltage level below the supply
rail, the amplifier simply operates as if it was powered by a lower supply voltage, and thereby limits the output
power. Add a resistor divider from GVDD to ground to set the voltage at the PLIMIT pin. An external reference
may also be used if tighter tolerance is required. Add a 1 µF capacitor from pin PLIMIT to ground to ensure
stability.
Figure 21. Power Limit Example
The PLIMIT circuit sets a limit on the output peak-to-peak voltage. The limiting is done by limiting the duty cycle
to a fixed maximum value. This limit can be thought of as a "virtual" voltage rail which is lower than the supply
connected to PVCC. This "virtual" rail is approximately 4 times the voltage at the PLIMIT pin. This output voltage
can be used to calculate the maximum output power for a given maximum input voltage and speaker impedance.
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ææ
ö
ö
RL
çç ç
÷ ´ VP ÷÷
è RL + 2 ´ RS ø
ø
= è
2 ´ RL
POUT
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2
for unclipped power
where
•
•
•
•
•
POUT (10%THD) = 1.25 × POUT (unclipped)
RL is the load resistance.
RS is the total series resistance including RDS(on), and output filter resistance.
VP is the peak amplitude
VP = 4 × PLIMIT voltage if PLIMIT < 4 × VP
(2)
7
7
6
6
5
5
PLIMIT [V]
PLIMIT [V]
Increasing the PLIMIT voltage from a given value increases the maximum output voltage swing until it equals
PVCC. Adjusting PLIMIT to a higher value will disable the PLIMIT function and will offer highest available output
power, however for TPA3131D2 and TPA3132D2 it is always advised to use the PLIMIT function if PVCC is
higher than nominal value to prevent shutdown due to over current protection. If PLIMIT is disabled on
TPA3131D2 and TPA3132D2 an over current shutdown can occur with minimum recommended load impedance
when PVCC is higher than its nominal value. To disable the PLIMIT function, the PLIMIT pin is simply connected
to GVDD.
4
3
2
4
3
2
TPA3131D2 8Ÿ
1
TPA3131D2 4Ÿ
1
TPA3132D2 8Ÿ
TPA3132D2 4Ÿ
0
0
0
5
10
15
20
25
OUTPUT POWER [W]
30
0
10
20
Figure 22. PLIMIT vs. Max. Output Power, 8Ω load
30
40
50
OUTPUT POWER [W]
C001
60
C002
Figure 23. PLIMIT vs. Max. Output Power, 4Ω load
Table 3. Power Limit Example
(1)
MINIMUM
PVCC (V)
PART NUMBERS
PLIMIT VOLTAGE (V) (1)
R to GND
R to GVDD
7.4 V
TPA3131D2, TPA3132D2
1.85
27 kΩ
75 kΩ
4
12 V
TPA3132D2
2.87
39 kΩ
56 kΩ
10
19 V
TPA3132D2
4.26
56 kΩ
36 kΩ
25
OUTPUT POWER 8Ω (W)
PLIMIT measurements taken with EVM gain set to 26dB and input level adjusted for 10% THD.
7.3.5 GVDD Supply
The GVDD Supply is used to power the gates of the output full bridge transistors. It can also be used to supply
the PLIMIT and GAIN/SLV voltage dividers. Decouple GVDD with a X5R ceramic 1 µF capacitor to GND. The
GVDD supply is not intended to be used for external supply. It is recommended to limit the current consumption
by using resistor voltage dividers for GAIN/SLV and PLIMIT of 100 kΩ or more.
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7.3.6 BSPx and BSNx Capacitors
The full H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the
high side of each output to turn on correctly. A 220 nF ceramic capacitor of quality X5R or better, rated for at
least 16 V, must be connected from each output to its corresponding bootstrap input. (See the application circuit
diagram in Figure 29.) The bootstrap capacitors connected between the BSxx pins and corresponding output
function as a floating power supply for the high-side N-channel power MOSFET gate drive circuitry. During each
high-side switching cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the highside MOSFETs turned on.
7.3.7 Differential Inputs
The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To
use the TPA313xD2 with a differential source, connect the positive lead of the audio source to the RINP or LINP
input and the negative lead from the audio source to the RINN or LINN input. To use the TPA313xD2 with a
single-ended source, ac ground the negative input through a capacitor equal in value to the input capacitor on
positive and apply the audio source to either input. In a single-ended input application, the unused input should
be ac grounded at the audio source instead of at the device input for best noise performance. For good transient
performance, the impedance seen at each of the two differential inputs should be the same.
The impedance seen at the inputs should be limited to an RC time constant of 1 ms or less if possible. This is to
allow the input dc blocking capacitors to become completely charged during the 10 ms power-up time. If the input
capacitors are not allowed to completely charge, there will be some additional sensitivity to component matching
which can result in pop if the input components are not well matched.
7.3.8 Device Protection System
The TPA313xD2 contains a complete set of protection circuits carefully designed to make system design efficient
as well as to protect the device against any kind of permanent failures due to short circuits, overload, over
temperature, and under-voltage. The FAULTZ pin will signal if an error is detected according to the fault table
below:
Table 4. Fault Reporting
FAULT
TRIGGERING CONDITION
(typical value)
FAULTZ
ACTION
LATCHED/SELFCLEARING
Over Current
Output short or short to PVCC or GND
Low
Output high impedance
Latched
Over Temperature
Tj > 150°C
Low
Output high impedance
Latched
Too High DC Offset
DC output voltage
Low
Output high impedance
Latched
Under Voltage on
PVCC
PVCC < 4.5V
–
Output high impedance
Self-clearing
Over Voltage on
PVCC
PVCC > 27V
–
Output high impedance
Self-clearing
7.3.9 DC Detect Protection
The TPA313xD2 has circuitry which will protect the speakers from DC current which might occur due to defective
capacitors on the input or shorts on the printed circuit board at the inputs. A DC detect fault will be reported on
the FAULT pin as a low state. The DC Detect fault will also cause the amplifier to shutdown by changing the
state of the outputs to Hi-Z.
If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the
SDZ pin. This allows the DC Protection function to automatically drive the SDZ pin low which clears the DC
Detect protection latch.
A DC Detect Fault is issued when the output differential duty-cycle of either channel exceeds 60% for more than
420 msec at the same polarity. Table x below shows some examples of the typical DC Detect Protection
threshold for several values of the supply voltage. This feature protects the speaker from large DC currents or
AC currents less than 2Hz. To avoid nuisance faults due to the DC detect circuit, hold the SD pin low at powerup until the signals at the inputs are stable. Also, take care to match the impedance seen at the positive and
negative inputs to avoid nuisance DC detect faults.
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The minimum output offset voltages required to trigger the DC detect are show in Table 5. The outputs must
remain at or above the voltage listed in the table for more than 420 msec to trigger the DC detect.
Table 5. DC Detect Threshold
PVCC (V)
VOS - OUTPUT OFFSET VOLTAGE (V)
4.5
0.96
6
1.3
12
2.6
18
3.9
7.3.10 Short-Circuit Protection and Automatic Recovery Feature
The TPA313xD2 has protection from over current conditions caused by a short circuit on the output stage. The
short circuit protection fault is reported on the FAULTZ pin as a low state. The amplifier outputs are switched to a
high impedance state when the short circuit protection latch is engaged. The latch can be cleared by cycling the
SDZ pin through the low state.
If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the
SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the shortcircuit protection latch.
In systems where a possibility of a permanent short from the output to PVDD or to a high voltage battery like a
car battery can occur, pull the MUTE pin low with the FAULTZ signal with a inverting transistor to ensure a highZ restart, like shown in the figure below:
> 1.4sec
/FAULTZ
1µF
100k
INPR
100k
INNR
1µF
/FAULTZ
IN_P_RIGHT
IN_N_RIGHT
SDZ
mP
MUTE
TPA3131/32D2
FAULTZ
INPL
1µF
MUTE
AM2
30
31
5
6
7
8
AM1
11
INNL
FAULTZ
4
10
GND
3
9
IN_N_LEFT
IN_P_LEFT
MUTE
GAIN/SLV
GND
1µF
MUTE
SYNC
100k 1µF
1
2
AM0
GVDD
32
SDZ
PLIMIT
GND
Figure 24. MUTE Driven by Inverted FAULTZ
Figure 25. Timing Requirement for SDZ
7.3.11 Thermal Protection
Thermal protection on the TPA313xD2 prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a
latched fault.
Thermal protection faults are reported on the FAULTZ terminal as a low state.
If automatic recovery from the thermal protection latch is desired, connect the FAULTZ pin directly to the SDZ
pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the thermal
protection latch.
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7.3.12 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
The main reason that the traditional class-D amplifier-based on AD modulation needs an output filter is that the
switching waveform results in maximum current flow. This causes more loss in the load, which causes lower
efficiency. The ripple current is large for the traditional modulation scheme, because the ripple current is
proportional to voltage multiplied by the time at that voltage. The differential voltage swing is 2 × VCC, and the
time at each voltage is half the period for the traditional modulation scheme. An ideal LC filter is needed to store
the ripple current from each half cycle for the next half cycle, while any resistance causes power dissipation. The
speaker is both resistive and reactive, whereas an LC filter is almost purely reactive.
The TPA313xD2 modulation scheme has little loss in the load without a filter because the pulses are short and
the change in voltage is VCC instead of 2 × VCC. As the output power increases, the pulses widen, making the
ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most
applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow
through the filter instead of the load. The filter has less resistance but higher impedance at the switching
frequency than the speaker, which results in less power dissipation, therefore increasing efficiency.
7.3.13 Ferrite Bead Filter Considerations
Using the Advanced Emissions Suppression Technology in the TPA313xD2 amplifier it is possible to design a
high efficiency class-D audio amplifier while minimizing interference to surrounding circuits. It is also possible to
accomplish this with only a low-cost ferrite bead filter. In this case it is necessary to carefully select the ferrite
bead used in the filter. One important aspect of the ferrite bead selection is the type of material used in the ferrite
bead. Not all ferrite material is alike, so it is important to select a material that is effective in the 10 to 100 MHz
range which is key to the operation of the class-D amplifier. Many of the specifications regulating consumer
electronics have emissions limits as low as 30 MHz. It is important to use the ferrite bead filter to block radiation
in the 30 MHz and above range from appearing on the speaker wires and the power supply lines which are good
antennas for these signals. The impedance of the ferrite bead can be used along with a small capacitor with a
value in the range of 1000 pF to reduce the frequency spectrum of the signal to an acceptable level. For best
performance, the resonant frequency of the ferrite bead/ capacitor filter should be less than 10 MHz.
Also, it is important that the ferrite bead is large enough to maintain its impedance at the peak currents expected
for the amplifier. Some ferrite bead manufacturers specify the bead impedance at a variety of current levels. In
this case it is possible to make sure the ferrite bead maintains an adequate amount of impedance at the peak
current the amplifier will see. If these specifications are not available, it is also possible to estimate the bead
current handling capability by measuring the resonant frequency of the filter output at low power and at maximum
power. A change of resonant frequency of less than fifty percent under this condition is desirable. Examples of
ferrite beads which have been tested and work well with the TPA3130D2 can be seen in the TPA3130D2EVM
user guide SLOU341.
A high quality ceramic capacitor is also needed for the ferrite bead filter. A low ESR capacitor with good
temperature and voltage characteristics will work best.
Additional EMC improvements may be obtained by adding snubber networks from each of the class-D outputs to
ground. Suggested values for a simple RC series snubber network would be 18 Ω in series with a 330 pF
capacitor although design of the snubber network is specific to every application and must be designed taking
into account the parasitic reactance of the printed circuit board as well as the audio amp. Take care to evaluate
the stress on the component in the snubber network especially if the amp is running at high PVCC. Also, make
sure the layout of the snubber network is tight and returns directly to the GND pins on the IC.
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Figure 26. TPA311xD2 Radiated Emissions
7.3.14 When to Use an Output Filter for EMI Suppression
The TPA313xD2 has been tested with a simple ferrite bead filter for a variety of applications including long
speaker wires up to 125 cm and high power. The TPA313xD2 EVM passes FCC class-B specifications under
these conditions using twisted speaker wires. The size and type of ferrite bead can be selected to meet
application requirements. Also, the filter capacitor can be increased if necessary with some impact on efficiency.
There may be a few circuit instances where it is necessary to add a complete LC reconstruction filter. These
circumstances might occur if there are nearby circuits which are sensitive to noise. In these cases a classic
second order Butterworth filter similar to those shown in the figures below can be used.
Some systems have little power supply decoupling from the AC line but are also subject to line conducted
interference (LCI) regulations. These include systems powered by "wall warts" and "power bricks." In these
cases, LC reconstruction filters can be the lowest cost means to pass LCI tests. Common mode chokes using
low frequency ferrite material can also be effective at preventing line conducted interference.
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10 µH
OUTP
L1
C2
0.68 µF
4W-8W
10 µH
OUTN
L2
C3
0.68 µF
Ferrite
Chip Bead
OUTP
1 nF
4W-8W
Ferrite
Chip Bead
OUTN
1 nF
Figure 27. Output Filter Configurations
7.3.15 AM Avoidance EMI Reduction
To reduce interference in the AM radio band, the TPA313xD2 has the ability to change the switching frequency
via AM<2:0> pins. The recommended frequencies are listed in Table 6. The fundamental frequency and its
second harmonic straddle the AM radio band listed. This eliminates the tones that can be present due to the
switching frequency being demodulated by the AM radio.
Table 6. AM Frequencies
US
EUROPEAN
AM FREQUENCY (kHz)
AM FREQUENCY (kHz)
SWITCHING FREQUENCY (kHz)
AM2
AM1
AM0
500
0
0
1
0
1
0
0
0
0
0
0
1
0
1
0
0
0
0
0
1
0
0
0
1
522-540
540-917
540-914
917-1125
914-1122
600 (or 400)
1125-1375
1122-1373
500
1375-1547
1373-1548
1547-1700
1548-1701
600 (or 400)
600 (or 500)
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7.4 Device Functional Modes
7.4.1 Mono Mode (PBTL)
The TPA313xD2 can be connected in MONO mode enabling up to 85W output power. This is done by:
• Connect INPL and INNL directly to Ground (without capacitors) this sets the device in Mono mode during
power up.
• Connect OUTPR and OUTNR together for the positive speaker terminal and OUTNL and OUTPL together for
the negative terminal.
• Analog input signal is applied to INPR and INNR.
TPA3131D2
TPA3132D2
4.5V-26V
PSU
Right
Left
PBTL
Detect
OUTPR
OUTNR
LC Filter
OUTPL
OUTNL
Figure 28. Output Mode select
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SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
8 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
This section describes a typical stereo speaker application with differential inputs. The amplifier gain is set to
26 dB and the output PWM is set to 400 kHz.
8.2 Typical Application
PVCC
PVCC DECOUPLING
PVCC
OUTPUT FILTER
10nF
1nF
100nF
220µF
EMI R-C SNUBBER
10µH
100k
GND
3.3R
GND
FAULTZ
1µF
680nF
PVCC
RP1
RP1
TPA3131D2
7.4V
75kQ
27kQ
TPA3132D2
19V
56kQ
39kQ
BSPR
PVCC
OUTPR
25
26
27
FAULTZ
INPR
PVCC
28
29
30
18
GND
17
GND
GND
GND
1nF
10nF
3.3R
OUTNR
BSNR
10µH
220nF
GND
GND
220nF
BSNL
10µH
OUTNL
GND
GND
3.3R
16
8
AM1
3.3R
31
7
9
AM2
680nF
OUTPL
MUTE
20
19
14
1µF
5
21
6
15
INPL
BSPL
INNL
TPA3131D2
TPA3132D2
4
13
GND
22
PVCC
IN_N_LEFT
IN_P_LEFT
MUTE
3
PVCC
1µF
GND
24
23
12
GAIN/SLV
1
1nF
10nF
GND
2
AVCC
GVDD
11
RP2
SYNC
20k
10
PLIMIT
1µF
32
RP1
AM0
100k
INNR
1µF
SDZ
220nF
IN_P_RIGHT
IN_N_RIGHT
680nF
1nF
10nF
220nF
GND
680nF
GND
1nF
10nF
3.3R
PVCC
10µH
1nF
100nF
220µF
GND
PVCC DECOUPLING
Figure 29. Typical Application Schematic
8.2.1 Design Requirements
DESIGN PARAMETERS
EXAMPLE VALUE
Input voltage range PVCC
4.5 V to 26 V
PWM output frequencies
400 kHz, 500 kHz, 600 kHz, 1 MHz or 1.2 MHz
Maximum output power
25 Wx2 (TPA3132D2) or 4 Wx2 (TPA3131D2)
Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: TPA3131D2 TPA3132D2
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SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
www.ti.com
8.2.2 Detailed Design Procedure
The TPA31xxD2 is a very flexible and easy to use Class D amplifier; therefore the design process is
straightforward. Before beginning the design, gather the following information regarding the audio system.
• PVCC rail planned for the design
• Speaker or load impedance
• Maximum output power requirement
• Desired PWM frequency
8.2.2.1 Select the PWM Frequency
Set the PWM frequency by using AM0, AM1 and AM2 pins.
8.2.2.2 Select the Amplifier Gain and Master/Slave Mode
In order to select the amplifier gain setting, the designer must determine the maximum power target and the
speaker impedance. Once these parameters have been determined, calculate the required output voltage swing
which delivers the maximum output power.
Choose the lowest analog gain setting that corresponds to produce an output voltage swing greater than the
required output swing for maximum power. The analog gain and master/slave mode can be set by selecting the
voltage divider resistors (R1 and R2) on the Gain/SLV pin.
8.2.2.3 Select Input Capacitance
Select the bulk capacitors at the PVCC inputs for proper voltage margin and adequate capacitance to support the
power requirements. In practice, with a well-designed power supply, two 100-μF, 50-V capacitors should be
sufficient. One capacitor should be placed near the PVCC inputs at each side of the device. PVCC capacitors
should be a low ESR type because they are being used in a high-speed switching application.
8.2.2.4 Select Decoupling Capacitors
Good quality decoupling capacitors need to be added at each of the PVCC inputs to provide good reliability,
good audio performance, and to meet regulatory requirements. X5R or better ratings should be used in this
application. Consider temperature, ripple current, and voltage overshoots when selecting decoupling capacitors.
Also, these decoupling capacitors should be located near the PVCC and GND connections to the device in order
to minimize series inductances.
8.2.2.5 Select Bootstrap Capacitors
Each of the outputs require bootstrap capacitors to provide gate drive for the high-side output FETs. For this
design, use 0.22-μF, 25-V capacitors of X5R quality or better.
8.2.3 Application Curves
10
10
Gain = 26 dB
PVCC = 7.4 V
TA = 25 °C
f = 1 kHz
Gain = 26 dB
PVCC = 19 V
TA = 25 °C
f = 1 kHz
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
RL = 4 Ω
RL = 8 Ω
0.001
0.01
RL = 4 Ω
RL = 8 Ω
0.1
1
Output Power per Channel (W)
10
0.001
0.01
G003
Figure 30. Total Harmonic Distortion + Noise (BTL) vs
Output Power
22
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0.1
1
Output Power per Channel (W)
10
50
G007
Figure 31. Total Harmonic Distortion + Noise (BTL) vs
Output Power
Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: TPA3131D2 TPA3132D2
TPA3131D2, TPA3132D2
www.ti.com
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
9 Power Supply Recommendations
The power supply requirements for the TPA313xD2 device consist of one higher-voltage supply to power the
output stage of the speaker amplifier. Several on-chip regulators are included on the TPA3116D2 device to
generate the voltages necessary for the internal circuitry of the audio path. It is important to note that the voltage
regulators which have been integrated are sized only to provide the current necessary to power the internal
circuitry. The external pins are provided only as a connection point for off-chip bypass capacitors to filter the
supply. Connecting external circuitry to these regulator outputs may result in reduced performance and damage
to the device. The high voltage supply, between 4.5 V and 26 V, supplies the analog circuitry (AVCC) and the
power stage (PVCC). The AVCC supply feeds internal LDO including GVDD. This LDO output are connected to
external pins for filtering purposes, but should not be connected to external circuits. GVDD LDO output have
been sized to provide current necessary for internal functions but not for external loading.
10 Layout
10.1 Layout Guidelines
The TPA313xD2 can be used with a small, inexpensive ferrite bead output filter for most applications. However,
since the class-D switching edges are fast, it is necessary to take care when planning the layout of the printed
circuit board. The following suggestions will help to meet EMC requirements.
• Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC
and AVCC terminals as possible. Large (100 μF or greater) bulk power supply decoupling capacitors should
be placed near the TPA313xD2 on the PVCC supplies. Local, high-frequency bypass capacitors should be
placed as close to the PVCC pins as possible. These caps can be connected to the IC GND pad directly for
an excellent ground connection. Consider adding a small, good quality low ESR ceramic capacitor between
220 pF and 1 nF and a larger mid-frequency cap of value between 100 nF and 1 µF also of good quality to
the PVCC connections at each end of the chip.
• Keep the current loop from each of the outputs through the ferrite bead and the small filter cap and back to
GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna.
• Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at
the IC GND, which should be used as a central ground connection or star ground for the TPA313xD2.
• Output filter — The ferrite EMI filter (see Figure 27) should be placed as close to the output terminals as
possible for the best EMI performance. The LC filter should be placed close to the outputs. The capacitors
used in both the ferrite and LC filters should be grounded.
For an example layout, see the TPA313xD2 Evaluation Module (TPA313xD2EVM) User Manual. Both the EVM
user manual and the thermal pad application report are available on the TI Web site at http://www.ti.com.
Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: TPA3131D2 TPA3132D2
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TPA3131D2, TPA3132D2
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
www.ti.com
10.2 Layout Example
Figure 32. Layout Example Top
24
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Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: TPA3131D2 TPA3132D2
TPA3131D2, TPA3132D2
www.ti.com
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
Layout Example (continued)
Figure 33. Layout Example Bottom
10.3 Thermal Design
Main thermal path for cooling the device is from the bottom side PowerPAD through multiple via connections in
the PCB to the bottom side ground plane. The high power efficiency allows TPA3131D2 to be operated
continuously at rated output power into both 4-Ω and 8-Ω load, and TPA3132D2 into 8-Ω load using a PCB
layout similar to what is used in the TPA3131D2/32D2 EVMs. The rated output power of TPA3132D2 into 4-Ω
load will be available only for a limited duration of time when using a PCB layout similar to the EVM layout.
Sustained power output into 4 Ω needs to be limited to prevent excess heating of the device. TPA3132D2 will be
able to output full output power for a limited duration of time. The duration depends on the actual PCB layout. For
the TPA3132D2 EVM layout the TPA3132D2 full output power with 4-Ω load can be illustrated with a burst test at
room temp (25°C):
Table 7. TPA3132D2 EVM Burst Output Power
BURST
RATIO
FULL POWER 1kHz
REDUCED POWER 1kHz
(1/8 of full power)
MAXIMUM DEVICE
TEMPERATURE
1:3
1 Cycle 44 W / 4 Ω
2 Cycles 5.25 W / 4 Ω
116°C
85°C
2:5
2 Cycles 44 W / 4 Ω
3 Cycles 5.25 W / 4 Ω
143°C
102°C
Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: TPA3131D2 TPA3132D2
PCB TEMPERATURE
(Bottom Side, Under Device)
Submit Documentation Feedback
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TPA3131D2, TPA3132D2
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
www.ti.com
It is not recommended to operate the device with a maximum temperature above 150°C.
Figure 34. TPA3132D2 EVM Temperature with 2:5 (42W/5.25W/4Ω) Burst Power
It is advised to use the PLIMT function to avoid thermal shutdown in system designs not using signal processing
to limit the average output power. Such systems can accidentally exceed the thermal limits of the amplifier and a
OTE shutdown will occur.
26
Submit Documentation Feedback
Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: TPA3131D2 TPA3132D2
TPA3131D2, TPA3132D2
www.ti.com
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 8. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPA3131D2
Click here
Click here
Click here
Click here
Click here
TPA3132D2
Click here
Click here
Click here
Click here
Click here
11.2 Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: TPA3131D2 TPA3132D2
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27
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPA3131D2RHBR
ACTIVE
VQFN
RHB
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3131
TPA3131D2RHBT
ACTIVE
VQFN
RHB
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3131
TPA3132D2RHBR
ACTIVE
VQFN
RHB
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3132
TPA3132D2RHBT
ACTIVE
VQFN
RHB
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3132
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Aug-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPA3131D2RHBR
VQFN
RHB
32
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
330.0
12.4
5.3
5.3
1.1
8.0
12.0
Q2
TPA3131D2RHBT
VQFN
RHB
32
250
180.0
12.4
5.3
5.3
1.1
8.0
12.0
Q2
TPA3132D2RHBR
VQFN
RHB
32
3000
330.0
12.4
5.3
5.3
1.1
8.0
12.0
Q2
TPA3132D2RHBT
VQFN
RHB
32
250
180.0
12.4
5.3
5.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Aug-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPA3131D2RHBR
VQFN
RHB
32
3000
367.0
367.0
35.0
TPA3131D2RHBT
VQFN
RHB
32
250
210.0
185.0
35.0
TPA3132D2RHBR
VQFN
RHB
32
3000
367.0
367.0
35.0
TPA3132D2RHBT
VQFN
RHB
32
250
210.0
185.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RHB 32
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
5 x 5, 0.5 mm pitch
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224745/A
www.ti.com
PACKAGE OUTLINE
RHB0032E
VQFN - 1 mm max height
SCALE 3.000
PLASTIC QUAD FLATPACK - NO LEAD
5.1
4.9
A
B
PIN 1 INDEX AREA
(0.1)
5.1
4.9
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS
20.000
C
1 MAX
SEATING PLANE
0.05
0.00
0.08 C
2X 3.5
(0.2) TYP
3.45 0.1
9
EXPOSED
THERMAL PAD
16
28X 0.5
8
17
2X
3.5
SEE SIDE WALL
DETAIL
SYMM
33
32X
24
1
PIN 1 ID
(OPTIONAL)
32
0.3
0.2
0.1
0.05
C A B
C
25
SYMM
32X
0.5
0.3
4223442/B 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RHB0032E
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 3.45)
SYMM
32
25
32X (0.6)
1
24
32X (0.25)
(1.475)
28X (0.5)
33
SYMM
(4.8)
( 0.2) TYP
VIA
8
17
(R0.05)
TYP
9
(1.475)
16
(4.8)
LAND PATTERN EXAMPLE
SCALE:18X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4223442/B 08/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RHB0032E
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X ( 1.49)
(0.845)
(R0.05) TYP
32
25
32X (0.6)
1
24
32X (0.25)
28X (0.5)
(0.845)
SYMM
33
(4.8)
17
8
METAL
TYP
16
9
SYMM
(4.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 33:
75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4223442/B 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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