Texas Instruments | Gnd-Ref Ultra Hi PSRR, 35mW/Ch Stereo Hdph Amp w/Com Mode Sense & I2C Vol Ctrl (Rev. C) | Datasheet | Texas Instruments Gnd-Ref Ultra Hi PSRR, 35mW/Ch Stereo Hdph Amp w/Com Mode Sense & I2C Vol Ctrl (Rev. C) Datasheet

Texas Instruments Gnd-Ref Ultra Hi PSRR, 35mW/Ch Stereo Hdph Amp w/Com Mode Sense & I2C Vol Ctrl (Rev. C) Datasheet
LM48822, LM48822TLEVAL
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SNAS456C – MAY 2008 – REVISED MAY 2013
LM48822 Boomer ™ Ground-Referenced, Ultra High PSRR, Ultra Low Noise,
35mW/Channel Stereo Headphone Amplifier with Common Mode Sense, and I2C Volume
Control
Check for Samples: LM48822, LM48822TLEVAL
FEATURES
DESCRIPTION
•
The LM48822 is a single supply, ground-referenced
stereo headphone amplifier designed for portable
devices, such as cell phones, where board space is
at a premium. The LM48822 features TI’s groundreferenced architecture, which eliminates the large
DC blocking capacitor required by traditional
headphone amplifiers, saving board space and
minimizing system cost.
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•
•
•
•
•
•
•
•
•
•
Ground Referenced Outputs – Eliminates
Output Coupling Capacitors
Common-Mode Sense
Ultra-High PSRR
I2C Volume and Mode Control
High Output Impedance in Shutdown
Differential Inputs
Advanced Click-and-Pop Suppression
Low Supply Current
Minimum External Components
Micro-Power Shutdown
Available in Space-Saving 16-Bump DSBGA
Package
APPLICATIONS
•
•
•
•
•
Mobile Phones
PDAs
Notebook PCs
Portable Electronic Devices
MP3 Players
KEY SPECIFICATIONS
•
•
•
•
•
Output Power/Channel at VDD = 3.6V
– RL = 16Ω, THD+N ≤ 1%: 35mW (typ)
Output Power/Channel at VDD = 3.6V
– RL = 32Ω, THD+N ≤ 1%: 40mW (typ)
Quiescent Power Supply Current at 3.6V:
3.5mA (typ)
PSRR at 217Hz: 110dB (typ)
Shutdown Current: 0.06μA (typ)
The LM48822 features common-mode sensing that
corrects for any differences between the amplifier
ground and the potential at the headphone return
terminal, minimizing noise created by any ground
mismatches.
The LM48822 delivers 35mW/channel into a 16Ω
load with <1% THD+N with a 3.6V supply. High
power supply rejection ratio (PSRR), of 110dB at
217Hz, allows the device to operate in noisy
environments without additional power supply
conditioning. Flexible power supply requirements
allow operation from 2.4V to 5.5V. The LM48822 has
a differential inputs for improved noise rejection. High
output impedance in Shutdown mode, combined with
a charge pump-only mode allows the LM48822's
outputs to be driven by an external source without
degrading the source signal. Additionally, the
LM48822 features a 64-step I2C volume control and
mute function. The low power Shutdown mode
reduces supply current consumption to 0.06µA.
Superior click and pop suppression eliminates audible
transients on power-up/down and during shutdown.
The LM48822 is available in an ultra-small 16-bump
DSBGA package (2mmx2mm).
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
is a trademark of ~ Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2013, Texas Instruments Incorporated
LM48822, LM48822TLEVAL
SNAS456C – MAY 2008 – REVISED MAY 2013
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Typical Application
+2.4V to +5.5V
CS
VDD
BIAS
BIASING
CBIAS
CIN
INL+
VOLUME
CONTROL AND
MIXER
INL-
OUTL
CIN
SDA
SCL
I2C
INTERFACE
COM
CIN
INR+
VOLUME
CONTROL AND
MIXER
INR-
OUTR
CIN
CHARGE PUMP
C1P
C1N
C2
CPVSS
CPGND
GND
C1
Figure 1. Typical Audio Amplifier Application Circuit
2
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Connection Diagram
Top View
4
VDD
INL-
INR-
COM
3
CPGND
INL+
INR+
SDA
2
C1P
CPVSS
GND
SCL
1
C1N
OUTL
BIAS
OUTR
A
B
C
D
Figure 2. DSBGA Package
2mm x 2mm x 0.8mm
See Package Number YZR001611A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2) (3)
Supply Voltage (1)
6V
−65°C to +150°C
Storage Temperature
Input Voltage
-0.3V to VDD + 0.3V
Power Dissipation (4)
ESD Rating
Internally Limited
(5)
2000V
ESD Rating (6)
150V
Junction Temperature
150°C
Thermal Resistance
θJA YZR001611A
63°C/W
Soldering Information See AN-1112 “DSBGA Wafer Level Chip Scale package”
(1)
(2)
(3)
(4)
(5)
(6)
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum
RatingsRatings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The
Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond
such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified
The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Maximum allowable power dissipation is PDMAX = (TJMAX - TA) / θJA or the number given in Absolute Maximum Ratings, whichever is
lower.
Human body model, applicable std. JESD22-A114C.
Machine model, applicable std. JESD22-A115-A.
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Operating Ratings
Temperature Range
TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ +85°C
2.4V ≤ VDD ≤ 5.5V
Supply Voltage (VDD)
Electrical Characteristics VDD = 3.6V (1) (2)
The following specifications apply for AV = 0dB, RL = 16Ω, f = 1kHz, unless otherwise specified. Limits apply to TA = 25°C.
Parameter
LM48822
Test Conditions
Typ (3)
Limit (4)
Units
(Limits)
mA (max)
mA (max)
IDD
Quiescent Power Supply Current
VIN = 0V, both channels active
RL = 16Ω
RL = ∞
3.5
3.5
4.5
4.5
ISD
Shutdown Current
Shutdown Enabled
0.06
1.2
µA (max)
VOS
Differential Output Offset Voltage
VIN = 0V, RL = 16Ω
1
5
mV (max)
TWU
Wake Up Time
dB (max)
dB (min)
AV
Minimum Gain Setting
–59.5
+0.5
–0.5
Maximum Gain Setting
3.8
+0.5
–0.5
dB (max)
dB (min)
AV = 4dB
AV = –60dB
25
60
30
70
kΩ (max)
kΩ (max)
RL= 16Ω, f = 1kHz, THD+N = 1%
Single channel
Two channels in phase
70
35
27
mW
mW (min)
RL= 32Ω, f = 1kHz, THD+N = 1%
Single channel
Two channels in phase
65
40
mW
mW
PO = 50mW, f = 1kHz, RL = 16Ω
single channel
0.04
%
PO = 40mW, f = 1kHz, RL = 32Ω
single channel
0.02
%
Voltage Gain
RIN
Input Resistance
PO
Output Power
THD+N
PSRR
CMRR
μs
200
Total Harmonic Distortion + Noise
Power Supply Rejection Ratio
Common Mode Rejection Ratio
VRIPPLE = 200mVP-P, Inputs AC GND
CIN = 1μF, input referred, SD_BIAS = 0
fRIPPLE = 217Hz
fRIPPLE = 1kHz
110
100
VRIPPLE = 1VP-P
95
RL ≥ 16Ω, POUT = 1.6mW, f = 1kHz
100
dB (min)
dB
80
70
dB (min)
RL ≥ 10kΩ, VOUT = 1VRMS, f = 1kHz
95
85
dB (min)
dB
XTALK
Crosstalk
SNR
Signal-to-Noise Ratio
RL = 16Ω, f = 1kHz
100
dB
∈OS
Output Noise
AV = 4dB, Input referred
A-Weighted Filter
7
μV
ROUT
Output Impedance
Charge pump-only mode enabled
40
VOUT
Maximum Voltage Swing
Voltage applied to amplifier outputs in
charge pump-only mode
(1)
(2)
(3)
(4)
4
25
kΩ (min)
2
VRMS (min)
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum
RatingsRatings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The
Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond
such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified
The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of
product characterization and are not specified.
Datasheet min/max specification limits are ensured by test or statistical analysis.
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I2C Interface Characteristics VDD = 3.6V (1) (2)
The following specifications apply for AV = 0dB, RL = 16Ω, f = 1kHz, unless otherwise specified. Limits apply to TA = 25°C.
Parameter
Test Conditions
LM48822
Typ
(3)
Limit (4)
Units
(Limits)
t1
SCL Period
2.5
μs (min)
t2
SDA Setup Time
100
ns (min)
t3
SDA Stable Time
0
ns (min)
t4
Start Condition Time
100
ns (min)
t5
Stop Condition Time
100
ns (min)
VIH
Input High Voltage
1.3
V (min)
VIL
Input Low Voltage
0.4
V (max)
(1)
(2)
(3)
(4)
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum
RatingsRatings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The
Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond
such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified
The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of
product characterization and are not specified.
Datasheet min/max specification limits are ensured by test or statistical analysis.
Bump Descriptions
Pin
Name
A1
C1N
Charge Pump Flying Capacitor Negative Terminal
Function
A2
C1P
Charge Pump Flying Capacitor Positive Terminal
A3
CPGND
Charge Pump Ground
A4
VDD
B1
OUTL
Power Supply
Left Channel Output
B2
CPVSS
Charge Pump Output
B3
INL+
Left Channel Non-Inverting Input
B4
INL-
Left Channel Inverting Input
C1
BIAS
Bias Voltage Bypass
C2
GND
Ground
C3
INR+
Right Channel Non-Inverting Input
C4
INR-
Right Channel Inverting Input
D1
OUTR
Right Channel Output
D2
SCL
I2C Serial Clock Input
D3
SDA
I2C Serial Data Input
D4
COM
Common-Mode Sense Input
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Typical Performance Characteristics
100
THD+N vs Frequency
VDD = 2.5V, POUT = 10mW, RL = 32Ω
THD+N vs Frequency
VDD = 2.5V, POUT = 12mW, RL = 16Ω
100
10
1
THD+N (%)
THD+N (%)
10
0.1
1
0.1
0.01
0.01
0.001
10
100
1000
10000
100000
0.001
10
100
FREQUENCY (Hz)
100
Figure 4.
THD+N vs Frequency
VDD = 3.6V, POUT = 20mW, RL = 16Ω
THD+N vs Frequency
VDD = 3.6V, POUT = 30mW, RL = 32Ω
100
10
THD+N (%)
THD+N (%)
100000
FREQUENCY (Hz)
1
0.1
1
0.1
0.01
0.01
0.001
10
100
1000
10000
0.001
10
100000
100
1000
10000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 5.
Figure 6.
THD+N vs Frequency
VDD = 5.0V, POUT = 20mW, RL = 16Ω
100
100000
THD+N vs Frequency
VDD = 5.0V, POUT = 30mW, RL = 32Ω
10
THD+N (%)
10
THD+N (%)
10000
Figure 3.
10
100
1000
1
0.1
1
0.1
0.01
0.01
0.001
10
0.001
10
100
1000
10000
100
100000
1000
10000
100000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 7.
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Figure 8.
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Typical Performance Characteristics (continued)
THD+N vs Output Power
AV = 0dB, RL = 16Ω, f = 1kHz
Both Outputs in Phase
100
THD+N vs Output Power
AV = 0dB, RL = 32Ω, f = 1kHz
Both Outputs in Phase
100
VDD = 5V
VDD = 3.6V
VDD = 3.6V
10
THD+N (%)
10
THD+N (%)
VDD = 5V
VDD = 2.5V
1
VDD = 2.5V
1
0.1
0.1
0.01
0.1
1
10
0.01
0.1
100
1
OUTPUT POWER (mW)
Figure 10.
THD+N vs Output Power
AV = 9dB, RL = 16Ω, f = 1kHz
Both Outputs in Phase
Power Dissipation vs Output Power
RL = 16Ω, f = 1kHz
450
HPVDD = 2.55V
400
POWER DISSIPATION (mW)
THD+N (%)
TWO CHANNELS
10 IN PHASE
HPVDD = 2.0V
1
0.1
VDD = 5V
350
300
250
200
VDD = 3.6V
150
100
VDD = 2.5V
50
0.01
0.001
0.01
POUT = POUTL + POUTR
0
0.1
0
25
OUTPUT POWER (W)
50
75
100
OUTPUT POWER (mW)
Figure 11.
Figure 12.
Power Dissipation vs Output Power
RL = 32Ω, f = 1kHz
Output Power vs Supply Voltage
RL = 16Ω, f = 1kHz
60
VDD = 5V
250
50
OUTPUT POWER (mW)
POWER DISSIPATION (mW)
100
Figure 9.
100
300
10
OUTPUT POWER (mW)
200
150
VDD = 3.6V
100
50
THD+N = 10%
40
30
THD+N = 1%
20
10
VDD = 2.5V
POUT = POUTL + POUTR
0
0
25
50
75
100
0
2.5
OUTPUT POWER (mW)
Figure 13.
3
3.5
4
4.5
5
5.5
SUPPLY VOLTAGE (V)
Figure 14.
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Typical Performance Characteristics (continued)
80
Output Power vs Supply Voltage
RL = 32Ω, f = 1kHz
-10
THD+N = 10%
60
-20
50
-30
CMRR(dB)
OUTPUT POWER (mW)
70
40
THD+N = 1%
30
-40
-50
20
-60
10
-70
0
2.5
3
3.5
CMRR vs Frequency
VDD = 3.6V, VCM = 1VP-P, RL = 32Ω
0
4
4.5
5
-80
10
5.5
100
1000
10000
100000
FREQUENCY (Hz)
SUPPLY VOLTAGE (V)
Figure 15.
Figure 16.
PSRR vs Frequency
VDD = 3.6V, VRIPPLE = 20mVP-P, RL = 32Ω
Crosstalk vs Frequency
VDD = 3.6V, VRIPPLE = 1VP-P, RL = 32Ω
0
0
-10
-20
CROSSTALK (dB)
-20
PSRR (dB)
-40
-60
-80
-30
-40
-50
-60
-70
-80
-100
-90
-120
10
100
1000
10000
-100
10
100000
100
Figure 17.
Ground Noise vs Frequency
VDD = 3.6V, VRIPPLE = 20mVP-P, RL = 32Ω
8
-10
Supply Current vs Supply Voltage
No Load
7
-20
SUPPLY CURRENT (mA)
NOISE REJECTION (dB)
100000
Figure 18.
0
-30
-40
-50
-60
-70
-80
6
5
4
3
2
1
-90
10
100
1000
10000
100000
0
2.5
FREQUENCY (Hz)
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3
3.5
4
4.5
5
5.5
SUPPLY VOLTAGE (V)
Figure 19.
8
10000
FREQUENCY (Hz)
FREQUENCY (Hz)
-100
1000
Figure 20.
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APPLICATION INFORMATION
I2C COMPATIBLE INTERFACE
The LM48822 is controlled through an I2C compatible serial interface that consists of a serial data line (SDA) and
a serial clock (SCL). The clock line is uni-directional. The data line is bi-directional (open collector). The LM48822
and the master can communicate at clock rates up to 400kHz. Figure 21 shows the I2C interface timing diagram.
Data on the SDA line must be stable during the HIGH period of SCL. The LM48822 is a transmit/receive slaveonly device, reliant upon the master to generate the SCL signal. Each transmission sequence is framed by a
START condition and a STOP condition Figure 22. Each data word, device address and data, transmitted over
the bus is 8 bits long as is always followed by an acknowledge pulse (Figure 23). The LM48822 device address
is 1100000.
I2C BUS FORMAT
The I2C bus format is shown in Figure 23. The START signal, the transition of SDA from HIGH to LOW while
SDA is HIGH, is generated, altering all devices on the bus that a device address is being written to the bus.
The 7-bit device address is written to the bus, most significant bit (MSB) first, followed by the R/W bit. R/W = 0
indicates the master is writing to the slave device, R/W = 1 indicates the master wants to read data from the
slave device. The LM48822 is a WRITE-ONLY device and will not respond the R/W = 1. The data is latched in
on the rising edge of the clock. Each address bit must be stable while SDA is HIGH. After the last address bit is
transmitted, the master device releases SDA, during which time, an acknowledge clock pulse is generated by the
slave device. If the LM48822 receives the correct address, the device pulls the SDA line low, generating and
acknowledge bit (ACK).
Once the master device registers the ACK bit, the 8-bit register data word is sent. Each data bit should be stable
while SCL is HIGH. After the 8-bit register data word is sent, the LM48822 sends another ACK bit. Following the
acknowledgement of the register data word, the master issues a STOP bit, allowing SDA to go high while SDA is
high.
Figure 21. I2C Timing Diagram
SDA
SCL
S
P
START condition
STOP condition
Figure 22. Start and Stop Diagram
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SCL
SDA
START
MSB
DEVICE ADDRESS
LSB
R/W
ACK
MSB
REGISTER DATA
LSB
ACK
STOP
Figure 23. Example I2C Write Cycle
Table 1. Device Address
Device
Address
B7
B6
B5
B4
B3
B2
B1
B0 (R/W)
1
1
0
0
0
0
0
0
Table 2. I2C Control Registers
Register
Address
Register
Name
B7
B6
B5
B4
B3
B2
B1
B0
0
MODE
CONTROL
0
SDL
SD_BIAS
CP_ONLY
0
MUTE_
LEFT
SDR
MUTE_
RIGHT
1
VOLUME
CONTROL
1
SHDN
VOL5
VOL4
VOL3
VOL2
VOL1
VOL0
Table 3. Mode Control Register
Bit
Name
B6
SDL
B5
SD_BIAS
B4
CP_ONLY
B3
UNUSED
B2
Value
MUTE_LEFT
B1
SDR
B0
MUTE_RIGHT
Description
0
Left channel enabled
1
Left channel disabled
0
Bias enabled
1
Bias disabled
0
Normal operation
1
Charge-pump only mode. Amplifiers and Bias disabled.
0
Set B3 to 0
0
Left channel Normal Operation
1
Left channel Mute
0
Right channel enabled
1
Right channel disabled. Right channel audio inputs summed with
left channel audio inputs and routed to OUTL
0
Right channel Normal Operation
1
Right channel Mute
GENERAL AMPLIFIER FUNCTION
The LM48822 headphone amplifier feature TI’s ground referenced architecture that eliminates the large DCblocking capacitors required at the outputs of traditional headphone amplifiers. A low-noise inverting charge
pump creates a negative supply (CPVSS) from the positive supply voltage (VDD). The headphone amplifiers
operate from these bipolar supplies, with the amplifier outputs biased about GND, instead of a nominal DC
voltage (typically VDD/2), like traditional amplifiers. Because there is no DC component to the headphone output
signals, the large DC-blocking capacitors (typically 220μF) are not necessary, conserving board space and
system cost, while improving frequency response.
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GENERAL AMPLIFIER EXPLANATION
The LM48822 features a differential input stage, which offers improved noise rejection compared to a singleended input amplifier. Because a differential input amplifier amplifies the difference between the two input
signals, any component common to both signals is cancelled. An additional benefit of the differential input
structure is the possible elimination of the DC input blocking capacitors. Since the DC component is common to
both inputs, and thus cancelled by the amplifier, the LM48822 can be used without input coupling capacitors
when configured with a differential input signal.
CHARGE PUMP ONLY MODE
In applications where the headphone jack is used as both an output and input port, signals such as a microphone
input can appear on the headphone amplifier output. Traditional charge pump headphone amplifiers can clamp
or distort the signals that appear on their output. Without the charge pump active, generating the negative
voltage supply, the internal protection diodes of the amplifier clamp the incoming signal, distorting the negative
half cycle, see Figure 24. The LM48822 charge pump only mode eliminates this problem. In charge pump only
mode, the amplifiers are disabled, while the charge pump remains active. The disabled amplifier outputs present
a high impedance (1MΩ) load to the incoming signal. The charge pump maintains the negative rail, allowing the
incoming signal to swing between VDD and VSS without any interference from the device.
Set bit B4 (CP_ONLY) of the MODE CONTROL register to 1 for charge pump only mode. Setting CP_ONLY = 1
disables both the left and right channels, regardless of the status of the shutdown control bits. Set CP_ONLY = 0
for normal operation.
VDD
OUT_
INCOMING AUDIO
SIGNAL
HI-Z
VSS
CHARGE PUMP
C1P
C1N
CPVSS
C2
C1
Figure 24. Back-Driving the LM48822 Outputs
COMMON MODE SENSE
The LM48822 features a ground (common mode) sensing feature. In noisy applications, or where the headphone
jack is used as a line out to other devices, noise pick up and ground imbalance can degrade audio quality. The
LM48822 COM input senses and corrects any noise at the headphone return, or any ground imbalance between
the headphone return and device ground, improving audio reproduction. Connect COM directly to the headphone
return terminal of the headphone jack Figure 25. No additional external components are required. Connect COM
to GND if the common-mode sense feature is not in use.
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AUDIO
INPUT
COM
COMMON MODE SENSE
EQUIVALENT CIRCUIT
Figure 25. COM Connection Example
VOLUME CONTROL
Table 4. Volume Control Table
VOLUME STEP
VOL5
VOL4
VOL3
VOL2
VOL1
VOL0
HP GAIN (dB)
1
0
0
0
0
0
0
–96
2
0
0
0
0
0
1
–60
3
0
0
0
0
1
0
–57
4
0
0
0
0
1
1
–54
5
0
0
0
1
0
0
–51
6
0
0
0
1
0
1
–48
7
0
0
0
1
1
0
–45
8
0
0
0
1
1
1
–42
9
0
0
1
0
0
0
–39
10
0
0
1
0
0
1
–36
11
0
0
1
0
1
0
–34.5
12
0
0
1
0
1
1
–33
13
0
0
1
1
0
0
–31.5
14
0
0
1
1
0
1
–30
15
0
0
1
1
1
0
–28.5
16
0
0
1
1
1
1
–27
17
0
1
0
0
0
0
–25.5
18
0
1
0
0
0
1
–24
19
0
1
0
0
1
0
–22.5
20
0
1
0
0
1
1
–21
21
0
1
0
1
0
0
–19.5
22
0
1
0
1
0
1
–18
23
0
1
0
1
1
0
–16.5
24
0
1
0
1
1
1
–16
25
0
1
1
0
0
0
–15.5
26
0
1
1
0
0
1
–15
27
0
1
1
0
1
0
–14.5
28
0
1
1
0
1
1
–14
29
0
1
1
1
0
0
–13.5
30
0
1
1
1
0
1
–13
31
0
1
1
1
1
0
–12.5
12
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Table 4. Volume Control Table (continued)
VOLUME STEP
VOL5
VOL4
VOL3
VOL2
VOL1
VOL0
HP GAIN (dB)
32
0
1
1
1
1
1
–12
33
1
0
0
0
0
0
–11.5
34
1
0
0
0
0
1
–11
35
1
0
0
0
1
0
–10.5
36
1
0
0
0
1
1
–10
37
1
0
0
1
0
0
–9.5
38
1
0
0
1
0
1
–9
39
1
0
0
1
1
0
–8.5
40
1
0
0
1
1
1
–8
41
1
0
1
0
0
0
–7.5
42
1
0
1
0
0
1
–7
43
1
0
1
0
1
0
–6.5
44
1
0
1
0
1
1
–6
45
1
0
1
1
0
0
–5.5
46
1
0
1
1
0
1
–5
47
1
0
1
1
1
0
–4.5
48
1
0
1
1
1
1
–4
49
1
1
0
0
0
0
–3.5
50
1
1
0
0
0
1
–3
51
1
1
0
0
1
0
–2.5
52
1
1
0
0
1
1
–2
53
1
1
0
1
0
0
–1.5
54
1
1
0
1
0
1
–1
55
1
1
0
1
1
0
–0.5
56
1
1
0
1
1
1
0
57
1
1
1
0
0
0
0.5
58
1
1
1
0
0
1
1
59
1
1
1
0
1
0
1.5
60
1
1
1
0
1
1
2
61
1
1
1
1
0
0
2.5
62
1
1
1
1
0
1
3
63
1
1
1
1
1
0
3.5
64
1
1
1
1
1
1
4
SHUTDOWN FUNCTION
The LM48822 features three shutdown controls. Bits B6 (SDL) and B1 (SDR) of the MODE CONTROL register
control the left and right channels, respectively. Set the control bits to 1 to disable the corresponding channel.
When SDR = 1 and SDL = 0, the right channel is disabled, the right and left inputs are summed and output as a
mono signal on the OUTL. When SDL = 1 and SDR = 0, the left channel is disabled, while only the right input
signal is output on OUTR. Setting both SDL and SDR = 1 disables both channels, while the charge pump
remains active. Bit B6 (SHDN) of the VOLUME CONTROL register is the global shutdown control for the entire
device. Set SHDN = 1 to disable the entire device; both amplifiers and charge pump are disabled. Set SHDN = 0
for normal operation. SHDN = 1 overrides any other shutdown control bit.
MUTE FUNCTION
Set bits B2 (MUTE_LEFT) and B0 (MUTE_RIGHT) of the MODE CONTROL register to 1 to mute the respective
channels. Set MUTE_LEFT and MUTE_RIGHT to 0 for normal operation.
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SD_BIAS FUNCTION
The LM48822 BIAS is controlled through the I2C interface. Set bit B5 (SD_BIAS) of the MODE CONTROL
register to 1 to enable the LM48822 BIAS. BIAS provides the voltage for both the amplifiers and the charge
pump. When enabled, VBIAS will track VDD for VDD < 3V. Once VDD exceeds 3V, VBIAS remains fixed at 3V, limiting
the output swing of the device the 6VP-P. Set SD_BIAS = 0 to disable BIAS. Disabling BIAS allows the amplifier
and charge pump to track VDD, increasing output swing; however, a slight degradation in PSSR will occur. Limit
VDD to 4.2V or less when BIAS is disabled.
PROPER SELECTION OF EXTERNAL COMPONENTS
Power Supply Bypassing/Filtering
Proper power supply bypassing is critical for low noise performance and high PSRR. Place the supply bypass
capacitors as close to the supply pins as possible. Place a 1μF ceramic capacitors from VDD to GND. Additional
bulk capacitance may be added as required.
Charge Pump Capacitor Selection
Use low ESR ceramic capacitors (less than 100mΩ) for optimum performance.
Charge Pump Flying Capacitor (C1)
The flying capacitor (C1) affects the load regulation and output impedance of the charge pump. A C1 value that
is too low results in a loss of current drive, leading to a loss of amplifier headroom. A higher valued C1 improves
load regulation and lowers charge pump output impedance to an extent. Above 2.2μF, the RDS(ON) of the charge
pump switches and the ESR of C1 and C2 dominate the output impedance. A lower value capacitor can be used
in systems with low maximum output power requirements.
Charge Pump Flying Capacitor (C2)
The value and ESR of the hold capacitor (C2) directly affects the ripple on CPVSS. Increasing the value of C2
reduces output ripple. Decreasing the ESR of C2 reduces both output ripple and charge pump output impedance.
A lower value capacitor can be used in systems with low maximum output power requirements.
Input Capacitor Selection
Input capacitors may be required for some applications, or when the audio source is single-ended. Input
capacitors block the DC component of the audio signal, eliminating any conflict between the DC component of
the audio source and the bias voltage of the LM48822. The input capacitors create a high-pass filter with the
input resistors RIN. The -3dB point of the high pass filter is found using Equation 1 below.
f = 1 / 2πRINCIN
(Hz)
(1)
where:
the value of RIN is given in the Electrical Characteristics Table.
High pass filtering the audio signal helps protect the speakers. When the LM48822 is using a single-ended
source, power supply noise on the ground is seen as an input signal. Setting the high-pass filter point above the
power supply noise frequencies, 217Hz in a GSM phone, for example, filters out the noise such that it is not
amplified and heard on the output. Capacitors with a tolerance of 10% or better are recommended for impedance
matching and improved CMRR and PSRR.
SINGLE-ENDED AUDIO AMPLIFIER CONFIGURATION
The LM48822 is compatible with single-ended sources. Figure 26 shows the typical single-ended applications
circuit.
14
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SNAS456C – MAY 2008 – REVISED MAY 2013
CIN
IN_+
VOLUME
CONTROL AND
MIXER
IN_-
OUT_
CIN
Figure 26. Single-Ended Input Configuration
PCB LAYOUT CONFIGURATION
Minimize trace impedance of the power, ground and all output traces for optimum performance. Voltage loss due
to trace resistance between the LM48822 and the load results in decreased output power and efficiency. Trace
resistance between the power supply and ground has the same effect as a poorly regulated supply, increased
ripple and reduced peak output power. Use wide traces for power supply inputs and amplifier outputs to minimize
losses due to trace resistance, as well as route heat away from the device. Proper grounding improves audio
performance, minimizes crosstalk between channels and prevents switching noise from interfering with the audio
signal. Use of power and ground planes is recommended.
Place all digital components and route digital signal traces as far as possible from analog components and
traces. Do not run digital and analog traces in parallel on the same PCB layer. If digital and analog signal lines
must cross either over or under each other, ensure that they cross in a perpendicular fashion.
LM48822TL Demoboard of Materials
Table 5. LM48822TL Demoboard Bill of Materials
Designator
Quantity
Description
C1
1
10µF ±10% 16V 500Ω Tantalum Capacitor (B Case) AVX
TPSB106K016R0500
C2
1
1μF ±10% 16V X5R Ceramic Capacitor (603) Panasonic
ECJ-1VB1C105K
C3, C8, C9
3
2.2μF ±10% 10V X5R Ceramic Capacitor (603) Panasonic
ECJ-1VB1A225K
C4 — C7
4
1μF ±10% 16V X7R Ceramic Capacitor (1206) Panasonic
ECJ-3YB1C105K
R1, R2
2
5kΩ ±5% 1/10W Thick Film Resistor (603) Vishay
CRCW06035R1KJNEA
J1
1
Stereo Headphone Jack
J2
1
16-Pin Boardmount Socket 3M 8516-4500JL
JU1
1
3 Pin Header
JU2
1
2 Pin Header
LM4822TL
1
LM48822TL (16-Bump DSBGA)
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Demoboard Schematic
U1
VDD
OUTL
A4
VDD
C1
10 PF
VDD
OUTR
J1
C2
1 PF
C2
GND
OUTL
BIAS
OUTR
B1
2
L
GND
C3
2.2 PF
5
C1
3
4
C4
B3
INL+
INL+
A1
D1
CRT
R
COM D4
1
1 PF
JU1
GND
1
C5
B4
INL-
INL-
C1P
A2
2
C9
2.2 PF
C6
C3
INR+
HEADPHONE_JACK
3
1 PF
INR+
C1N
INR-
CPVSS
HPGND
A1
1 PF
COM
C7
C4
INR-
B2
1 PF
C8
2.2 PF
D2
SCL
SCL
CPGND
A3
VDD
GND
D3
SDA
R1
5k
SDA
SCL
R2
5k
SDA
J2
JU2
1
3
5
7
9
11
13
15
2
4
6
8
10
12
14
16
LM48822TL
MOUNTING
SUPPORT
Figure 27. LM48822 Demoboard Schematic
Demonstration Board PCB Layout
Figure 28. Solder Mask
16
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Figure 29. Top Silkscreen
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SNAS456C – MAY 2008 – REVISED MAY 2013
Figure 30. Top Layer
Figure 31. Layer 2 (GND)
Figure 32. Layer 3 (VDD)
Figure 33. Bottom Layer
Figure 34. Bottom Silkscreen
Revision History
Rev
Date
0.1
04/15/08
Initial PDF.
Description
0.2
04/23/08
Added the demo boards and schematic.
0.3
04/30/08
Text edits.
0.4
07/10/08
Text edits.
0.5
03/09/11
Changed the bit B7 into B6 under the SHUTDOWN FUNCTION section.
C
05/02/2013
Changed layout of National Data Sheet to TI format.
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PACKAGE OPTION ADDENDUM
www.ti.com
2-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM48822TL/NOPB
ACTIVE
DSBGA
YZR
16
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
GK1
LM48822TLX/NOPB
ACTIVE
DSBGA
YZR
16
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
GK1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM48822TL/NOPB
DSBGA
YZR
16
250
178.0
8.4
LM48822TLX/NOPB
DSBGA
YZR
16
3000
178.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2.08
2.08
0.76
4.0
8.0
Q1
2.08
2.08
0.76
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM48822TL/NOPB
DSBGA
YZR
LM48822TLX/NOPB
DSBGA
YZR
16
250
210.0
185.0
35.0
16
3000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
YZR0016xxx
D
0.600±0.075
E
TLA16XXX (Rev C)
D: Max = 1.99 mm, Min = 1.93 mm
E: Max = 1.99 mm, Min = 1.93 mm
4215051/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
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