Texas Instruments | LM4927 2.5 Watt Fully Differential Audio Power Amplifier With Shutdown (Rev. B) | Datasheet | Texas Instruments LM4927 2.5 Watt Fully Differential Audio Power Amplifier With Shutdown (Rev. B) Datasheet

Texas Instruments LM4927 2.5 Watt Fully Differential Audio Power Amplifier With Shutdown (Rev. B) Datasheet
LM4927
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SNAS318B – JUNE 2005 – REVISED APRIL 2013
LM4927 Boomer™ Audio Power Amplifier Series 2.5 Watt Fully Differential Audio Power
Amplifier With Shutdown
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FEATURES
DESCRIPTION
•
•
The LM4927 is a fully differential audio power
amplifier
primarily
designed
for
demanding
applications in mobile phones and other portable
communication device applications. It is capable of
delivering 2.5 watts of continuous average power to a
4Ω load with less than 10% distortion (THD+N) from
a 5VDC power supply.
1
23
•
•
•
•
•
Fully Differential Amplification
Available in Space-Saving Micro-Array WSON
Package
Ultra Low Current Shutdown Mode
Can Drive Capacitive Loads up to 100pF
Improved Pop & Click Circuitry Eliminates
Noises During Turn-On and Turn-Off
Transitions
2.4 - 5.5V Operation
No Output Coupling Capacitors, Snubber
Networks or Bootstrap Capacitors Required
APPLICATIONS
•
•
•
Mobile Phones
PDAs
Portable Electronic Devices
KEY SPECIFICATIONS
•
•
•
•
Improved PSRR at 217Hz, 85dB (Typ)
Power Output at 5.0V @ 10% THD (4Ω), 2.5W
(Typ)
Power Output at 3.3V @ 1% THD, 550mW (Typ)
Shutdown Current, 0.1µA (Typ)
Boomer audio power amplifiers were designed
specifically to provide high quality output power with a
minimal amount of external components. The
LM4927 does not require output coupling capacitors
or bootstrap capacitors, and therefore is ideally suited
for mobile phone and other low voltage applications
where minimal power consumption is a primary
requirement.
The LM4927 features a low-power consumption
shutdown mode. To facilitate this, Shutdown may be
enabled by logic low. Additionally, the LM4927
features an internal thermal shutdown protection
mechanism.
The LM4927 contains advanced pop & click circuitry
which eliminates noises which would otherwise occur
during turn-on and turn-off transitions.
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Boomer is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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LM4927
SNAS318B – JUNE 2005 – REVISED APRIL 2013
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Typical Application
VDD
CS
1 PF
Ri
+
Rf
-IN
- Differential Input
Vo2
+
Shutdown
Bias
RL
Common
Mode
8:
Bypass *
Vo1
+ Differential Input
+
+IN
Ri
-
Rf
GND
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
SD
1
8
Vo-
BYP
2
7
GND
IN+
3
6
VDD
IN-
4
5
Vo+
Figure 2. 8 Pin WSON Package
Top View
See Package Number NGQ0008A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1) (2)
Supply Voltage
6.0V
−65°C to +150°C
Storage Temperature
−0.3V to VDD +0.3V
Input Voltage
Power Dissipation (3)
Internally Limited
(4)
2000V
ESD Susceptibility
ESD Susceptibility (5)
200V
Junction Temperature
150°C
Thermal Resistance
θJA (SD)
Soldering Information (6)
See AN-1187 (SNOA401)
(1)
(2)
(3)
(4)
(5)
(6)
63°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX – TA) / θJA or the number given in Absolute Maximum Ratings,
whichever is lower. For the LM4927, see power derating curve for additional information.
Human body model, 100pF discharged through a 1.5kΩ resistor.
Machine Model, 220pF – 240pF discharged through all pins.
When driving 4Ω loads from a 5V power supply, the LM4927LD must be mounted to a circuit board with the exposed-DAP area soldered
down to a 1in2 plane of 1oz, copper.
Operating Ratings
Temperature Range
TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ 85°C
2.4V ≤ VDD ≤ 5.5V
Supply Voltage
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Electrical Characteristics VDD = 5V (1) (2)
The following specifications apply for VDD = 5V, AV = 1, and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
Symbol
Parameter
Conditions
LM4927
Typical
(3)
Limit (4)
Units
(Limits)
IDD
Quiescent Power Supply Current
VIN = 0V, no load
VIN = 0V, RL = 8Ω
2.2
2.2
4.5
4.5
mA (max)
ISD
Shutdown Current
VSHUTDOWN = GND
0.1
1
µA (max)
THD = 1% (max); f = 1 kHz
RL = 4Ω
RL = 8Ω
2.1
1.30
1.20
W (min)
THD = 10% (max); f = 1 kHz
RL = 4Ω
RL = 8Ω
2.5
1.6
W
Po = 1 Wrms; f = 1kHz
0.03
%
Po
Output Power
THD+N
Total Harmonic Distortion+Noise
PSRR
Power Supply Rejection Ratio
Vripple = 200mV sine p-p
f = 217Hz (5)
90
f = 1kHz (5)
85
71
dB (min)
CMRR
Common-Mode Rejection Ratio
f = 217Hz, VCM = 200mVpp
60
VOS
Output Offset
VIN = 0V
4
VSDIH
Shutdown Voltage Input High
1.4
V (min)
VSDIL
Shutdown Voltage Input Low
0.4
V (max)
SNR
Signal-to-noise ratio
37
kΩ (min)
47
kΩ (max)
–0.68
1.4
dB (min)
dB (max)
PO = 1W, f = 1kHz
Internal Feedback Resistance
Ri = 40kΩ
40
AV
Gain
Ri = 40kΩ
0
TWU
Wake-up time from Shutdown
Cbypass = 1μF
14
(3)
(4)
(5)
4
mV
110
RF
(1)
(2)
dB
dB
ms
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Typicals are measured at 25°C and represent the parametric norm.
Limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level).
10Ω terminated input.
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Electrical Characteristics VDD = 3V (1) (2)
The following specifications apply for VDD = 3V, AV = 1, and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
Symbol
Parameter
Conditions
LM4927
Typical
(3)
Limit (4)
Units
(Limits)
IDD
Quiescent Power Supply Current
VIN = 0V, no load
VIN = 0V, RL = 8Ω
2
2
4.3
4.3
mA (max)
ISD
Shutdown Current
VSHUTDOWN = GND
0.1
1
µA (max)
Po
Output Power
THD+N
Total Harmonic Distortion+Noise
PSRR
Power Supply Rejection Ratio
THD = 1% (max); f = 1 kHz
RL = 4Ω
RL = 8Ω
0.650
0.450
W
THD = 10% (max); f = 1 kHz
RL = 4Ω
RL = 8Ω
0.800
0.550
W
Po = 0.25Wrms; f = 1kHz
0.04
%
Vripple = 200mV sine p-p
f = 217Hz (5)
85
f = 1kHz (5)
80
dB
CMRR
Common-Mode Rejection Ratio
f = 217Hz, VCM = 200mVpp
60
VOS
Output Offset
VIN = 0V
4
VSDIH
Shutdown Voltage Input High
1.4
V (min)
VSDIL
Shutdown Voltage Input Low
0.4
V (max)
TWU
Wake-up time from Shutdown
(1)
(2)
(3)
(4)
(5)
Cbypass
8
dB
mV (max)
ms
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Typicals are measured at 25°C and represent the parametric norm.
Limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level).
10Ω terminated input.
External Components Description
(See Figure 1)
Components
Functional Description
1.
CS
Supply bypass capacitor which provides power supply filtering. Refer to the POWER SUPPLY BYPASSING section for
information concerning proper placement and selection of the supply bypass capacitor.
2.
CB
Bypass pin capacitor which provides half-supply filtering. Refer to the section, PROPER SELECTION OF EXTERNAL
COMPONENTS, for information concerning proper placement and selection of CB.
3.
Ri
Inverting input resistance which sets the closed-loop gain in conjunction with Rf.
4.
Rf
Internal feedback resistance which sets the closed-loop gain in conjunction with Ri.
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Typical Performance Characteristics (1)
10
THD+N vs Frequency
VDD = 2.6V, RL = 8Ω, PO = 150mW
10
1
THD+N (%)
THD+N (%)
1
0.1
0.1
0.01
0.01
0.001
20
THD+N vs Frequency
VDD = 2.6V, RL = 4Ω, PO = 150mW
100
1k
0.001
20
10k 20k
100
Figure 4.
THD+N vs Frequency
VDD = 5V, RL = 8Ω, PO = 1W
THD+N vs Frequency
VDD = 5V, RL = 4Ω, PO = 1W
10
1
1
THD+N (%)
THD+N (%)
Figure 3.
10
0.1
0.01
0.001
20
0.01
100
1k
0.001
20
10k 20k
100
Figure 6.
THD+N vs Frequency
VDD = 3V, RL = 8Ω, PO = 275mW
THD+N vs Frequency
VDD = 3V, RL = 4Ω, PO = 225mW
10
THD+N (%)
THD+N (%)
1
0.1
0.1
0.01
100
1k
10k 20k
0.001
20
FREQUENCY (Hz)
100
1k
10k 20k
FREQUENCY (Hz)
Figure 7.
6
10k 20k
Figure 5.
0.01
(1)
1k
FREQUENCY (Hz)
1
0.001
20
10k 20k
0.1
FREQUENCY (Hz)
10
1k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 8.
Data taken with BW = 80kHz and AV = 1/1 except where specified.
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Typical Performance Characteristics(1) (continued)
10
THD+N vs Output Power
VDD = 2.6V, RL = 8Ω
10
THD+N vs Output Power
VDD = 2.6V, RL = 4Ω
20 kHz
20 kHz
1
THD+N (%)
THD+N (%)
1
1 kHz
0.1
1 kHz
0.1
20 Hz
0.01
0.001
10m
20 Hz
0.01
100m
0.001
10m
1
OUTPUT POWER (W)
100m
Figure 9.
Figure 10.
THD+N vs Output Power
VDD = 5V, RL = 8Ω
1
20 kHz
0.1
1 kHz
10
1 kHz
20 Hz
20 Hz
0.01
100m
1
0.001
10m
2
OUTPUT POWER (W)
10
20 kHz
0.1
0.01
0.001
10m
THD+N vs Output Power
VDD = 5V, RL = 4Ω
1
THD+N (%)
THD+N (%)
10
1
OUTPUT POWER (W)
100m
1
3
OUTPUT POWER (W)
Figure 11.
Figure 12.
THD+N vs Output Power
VDD = 3V, RL = 8Ω
THD+N vs Output Power
VDD = 3V, RL = 4Ω
10
20 kHz
20 kHz
1
1 kHz
THD+N (%)
THD+N (%)
1
1 kHz
0.1
0.1
20 Hz
20 Hz
0.01
0.001
10m
0.01
100m
1
0.001
10m
OUTPUT POWER (W)
100m
1
OUTPUT POWER (W)
Figure 13.
Figure 14.
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Typical Performance Characteristics(1) (continued)
PSRR vs Frequency
VDD = 3V, RL = 8Ω
Inputs terminated to GND, BW = 500kHz
0
0
-10
-10
-20
-20
-30
-30
PSRR (dB)
PSRR (dB)
PSRR vs Frequency
VDD = 5V, RL = 8Ω
Inputs terminated to GND, BW = 500kHz
-40
-50
-60
-40
-50
-60
-70
-70
-80
-80
-90
-90
-100
20
-100
20
100
1k
10k
100
100
1k
FREQUENCY (Hz)
2
Figure 16.
Output Power vs Supply Voltage
RL = 8Ω
Output Power vs Supply Voltage
RL = 4Ω
OUTPUT POWER (W)
OUTPUT POWER (W)
1.6
1.4
1.2
10% THD+N
1
800m
1% THD+N
600m
400m
200m
0
2.4
3
3.5
4.5
4
5
5.5
3
2.8
2.6
2.4
2.2
2
1.8
1.6
1.4
1.2
1
800m
600m
400m
200m
0
2.4
SUPPLY VOLTAGE (V)
3
3.5
4.5
4
Figure 18.
CMRR vs Frequency
VDD = 5V, RL = 8Ω
CMRR vs Frequency
VDD = 3V, RL = 8Ω
5
5.5
0
-10
-20
-20
-30
-30
CMRR (dB)
CMRR (dB)
1% THD+N
Figure 17.
-40
-50
-60
-40
-50
-60
-70
-70
-80
-80
-90
-90
100
1k
10k 20k
-100
20
FREQUENCY (Hz)
100
1k
10k 20k
FREQUENCY (Hz)
Figure 19.
8
10% THD+N
SUPPLY VOLTAGE (V)
-10
-100
20
100
Figure 15.
1.8
0
10k
FREQUENCY (Hz)
Figure 20.
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Typical Performance Characteristics(1) (continued)
PSRR vs Common Mode Voltage
VDD = 3V, RL = 8Ω, f = 217Hz
-10
-10
-20
-20
-30
-30
-40
-50
-60
-40
-50
-60
-70
-70
-80
-80
-90
-90
-100
-100
0
1
0.5
1.5
2
2.5
PSRR vs Common Mode Voltage
VDD = 5V, RL = 8Ω, f = 217Hz
0
PSRR (dB)
PSRR (dB)
0
3
0
DC COMMON-MODE VOLTAGE (V)
POWER DISSIPATION (W)
5
Power Dissipation vs Output Power
VDD = 2.6V, RL = 8Ω and 4Ω
Power Dissipation vs Output Power
VDD = 5V, RL = 8Ω
1.4
RL = 4:
1.2
0.3
0.25
0.2
0.15
RL = 8:
0.1
RL = 4:
1.0
0.8
0.6
RL = 8:
0.4
0.2
0.05
0
0
0
0.1
0.2
0.3
0.5
0.4
0
0.6
0.5
OUTPUT POWER (W)
2.5
Figure 24.
Power Derating Curve
1.4
0.45
1.2
POWER DISSIPATION (W)
RL = 4:
0.35
0.3
0.25
0.2
RL = 8:
0.15
2.0
OUTPUT POWER (W)
Power Dissipation vs Output Power
VDD = 3V, RL = 8Ω
0.4
1.5
1.0
Figure 23.
POWER DISSIPATION (W)
4
Figure 22.
0.35
0.5
3
2
Figure 21.
POWER DISSIPATION (W)
0.4
1
DC COMMON-MODE VOLTAGE (V)
0.1
1.0
RL = 4:
0.8
0.6
0.4
RL = 8:
0.2
0.05
0
0
0
0.2
0.4
0.6
0.8
0
20
40
60
80
100 120 140 160
AMBIENT TEMPERATURE (°C)
OUTPUT POWER (W)
Figure 25.
Figure 26.
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Typical Performance Characteristics(1) (continued)
Noise Floor
VDD = 5V
Vo1 + Vo2
10u
Shutdown On
1u
100n
20
100
Noise Floor
VDD = 3V
100u
OUTPUT NOISE VOLTAGE (V)
OUTPUT NOISE VOLTAGE (V)
100u
1k
Vo1 + Vo2
10u
Shutdown On
1u
100n
20
10k 20k
100
FREQUENCY (Hz)
1k
10k 20k
FREQUENCY (Hz)
Figure 27.
Figure 28.
Clipping Voltage vs Supply Voltage
Output Power vs Load Resistance
3
0.8
5V, 10% THD+N
2.5
RL = 4: Top
0.6
OUTPUT POWER (W)
DROPOUT VOLTAGE (V)
0.7
RL = 4: Bottom
0.5
0.4
0.3
RL = 8: Top
0.2
0
1.5
3V, 1% THD+N
1.5
2.6V, 10% THD+N
1.0
2.6V, 1% THD+N
0
2
2.5
3
3.5
4
4.5
5
5.5
6
4
8
12
16
20
24
28
32
LOAD RESISTANCE (:)
SUPPLY VOLTAGE (V)
Figure 29.
10
3V, 10% THD+N
0.5
RL = 8: Bottom
0.1
5V, 1% THD+N
2.0
Figure 30.
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APPLICATION INFORMATION
DIFFERENTIAL AMPLIFIER EXPLANATION
The LM4927 is a fully differential audio amplifier that features differential input and output stages. Internally this is
accomplished by two circuits: a differential amplifier and a common mode feedback amplifier that adjusts the
output voltages so that the average value remains VDD / 2. When setting the differential gain, the amplifier can be
considered to have "halves". Each half uses an input and feedback resistor (Ri1 and RF1) to set its respective
closed-loop gain (see Figure 1). With Ri1 = Ri2 and RF1 = RF2, the gain is set at -RF / Ri for each half. This results
in a differential gain of
AVD = -RF/Ri
(1)
It is extremely important to match the input resistors to each other, as well as the feedback resistors to each
other for best amplifier performance. See the PROPER SELECTION OF EXTERNAL COMPONENTS section for
more information. A differential amplifier works in a manner where the difference between the two input signals is
amplified. In most applications, this would require input signals that are 180° out of phase with each other. The
LM4927 can be used, however, as a single ended input amplifier while still retaining its fully differential benefits.
In fact, completely unrelated signals may be placed on the input pins. The LM4927 simply amplifies the
difference between them.
All of these applications provide what is known as a "bridged mode" output (bridge-tied-load, BTL). This results in
output signals at Vo1 and Vo2 that are 180° out of phase with respect to each other. Bridged mode operation is
different from the single-ended amplifier configuration that connects the load between the amplifier output and
ground. A bridged amplifier design has distinct advantages over the single-ended configuration: it provides
differential drive to the load, thus doubling maximum possible output swing for a specific supply voltage. Four
times the output power is possible compared with a single-ended amplifier under the same conditions. This
increase in attainable output power assumes that the amplifier is not current limited or clipped. In order to choose
an amplifier's closed-loop gain without causing excess clipping, please refer to the AUDIO POWER AMPLIFIER
DESIGN section.
A bridged configuration, such as the one used in the LM4927, also creates a second advantage over singleended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased at half-supply, no net DC voltage exists
across the load. This assumes that the input resistor pair and the feedback resistor pair are properly matched
(see PROPER SELECTION OF EXTERNAL COMPONENTS). BTL configuration eliminates the output coupling
capacitor required in single-supply, single-ended amplifier configurations. If an output coupling capacitor is not
used in a single-ended output configuration, the half-supply bias across the load would result in both increased
internal IC power dissipation as well as permanent loudspeaker damage. Further advantages of bridged mode
operation specific to fully differential amplifiers like the LM4927 include increased power supply rejection ratio,
common-mode noise reduction, and click and pop reduction.
EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS
The LM4927's exposed-DAP (die attach paddle) package (WSON) provide a low thermal resistance between the
die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the
surrounding PCB copper traces, ground plane and, finally, surrounding air. Failing to optimize thermal design
may compromise the LM4927's high power performance and activate unwanted, though necessary, thermal
shutdown protection. The WSON package must have its DAP soldered to a copper pad on the PCB. The DAP's
PCB copper pad is connected to a large plane of continuous unbroken copper. This plane forms a thermal mass
and heat sink and radiation area. Place the heat sink area on either outside plane in the case of a two-sided
PCB, or on an inner layer of a board with more than two layers. Connect the DAP copper pad to the inner layer
or backside copper heat sink area with a thermal via. The via diameter should be 0.012in - 0.013in. Ensure
efficient thermal conductivity by plating-through and solder-filling the vias.
Best thermal performance is achieved with the largest practical copper heat sink area. In all circumstances and
conditions, the junction temperature must be held below 150°C to prevent activating the LM4927's thermal
shutdown protection. The LM4927's power de-rating curve in the Typical Performance Characteristics shows the
maximum power dissipation versus temperature. Example PCB layouts are shown in the Demonstration Board
Layout section. Further detailed and specific information concerning PCB layout, fabrication, and mounting an
WSON package is available from Texas Instruments' package Engineering Group under application note
AN1187.
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PCB LAYOUT AND SUPPLY REGULATION CONSIDERATIONS FOR DRIVING 4Ω LOADS
Power dissipated by a load is a function of the voltage swing across the load and the load's impedance. As load
impedance decreases, load dissipation becomes increasingly dependent on the interconnect (PCB trace and
wire) resistance between the amplifier output pins and the load's connections. Residual trace resistance causes
a voltage drop, which results in power dissipated in the trace and not in the load as desired. This problem of
decreased load dissipation is exacerbated as load impedance decreases. Therefore, to maintain the highest load
dissipation and widest output voltage swing, PCB traces that connect the output pins to a load must be as wide
as possible.
Poor power supply regulation adversely affects maximum output power. A poorly regulated supply's output
voltage decreases with increasing load current. Reduced supply voltage causes decreased headroom, output
signal clipping, and reduced output power. Even with tightly regulated supplies, trace resistance creates the
same effects as poor supply regulation. Therefore, making the power supply traces as wide as possible helps
maintain full output voltage swing.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifer, whether the amplifier is bridged or
single-ended. Equation 2 states the maximum power dissipation point for a single-ended amplifier operating at a
given supply voltage and driving a specified output load.
PDMAX = (VDD)2 / (2π2RL) Single-Ended
(2)
However, a direct consequence of the increased power delivered to the load by a bridge amplifier is an increase
in internal power dissipation versus a single-ended amplifier operating at the same conditions.
PDMAX = 4 * (VDD)2 / (2π2RL) Bridge Mode
(3)
Since the LM4927 has bridged outputs, the maximum internal power dissipation is 4 times that of a single-ended
amplifier. Even with this substantial increase in power dissipation, the LM4927 does not require additional
heatsinking under most operating conditions and output loading. From Equation 3, assuming a 5V power supply
and an 8Ω load, the maximum power dissipation point is 625mW. The maximum power dissipation point obtained
from Equation 3 must not be greater than the power dissipation results from Equation 4:
PDMAX = (TJMAX - TA) / θJA
(4)
The LM4927's θJA in an NGQ0008A package is 63°C/W. Depending on the ambient temperature, TA, of the
system surroundings, Equation 4 can be used to find the maximum internal power dissipation supported by the
IC packaging. If the result of Equation 3 is greater than that of Equation 4, then either the supply voltage must be
decreased, the load impedance increased, the ambient temperature reduced, or the θJA reduced with
heatsinking. In many cases, larger traces near the output, VDD, and GND pins can be used to lower the θJA. The
larger areas of copper provide a form of heatsinking allowing higher power dissipation. For the typical application
of a 5V power supply, with an 8Ω load, the maximum ambient temperature possible without violating the
maximum junction temperature is approximately 110°C provided that device operation is around the maximum
power dissipation point. Recall that internal power dissipation is a function of output power. If typical operation is
not around the maximum power dissipation point, the LM4927 can operate at higher ambient temperatures.
Refer to the Typical Performance Characteristics curves for power dissipation information.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection ratio (PSRR). The capacitor location on both the bypass and power supply pins should be as close to
the device as possible. A larger half-supply bypass capacitor improves PSRR because it increases half-supply
stability. Typical applications employ a 5V regulator with 10µF and 0.1µF bypass capacitors that increase supply
stability. This, however, does not eliminate the need for bypassing the supply nodes of the LM4927. The LM4927
will operate without the bypass capacitor CB, although the PSRR may decrease. A 1µF capacitor is
recommended for CB. This value maximizes PSRR performance. Lesser values may be used, but PSRR
decreases at frequencies below 1kHz. The issue of CB selection is thus dependant upon desired PSRR and click
and pop performance as explained in the section PROPER SELECTION OF EXTERNAL COMPONENTS.
12
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Product Folder Links: LM4927
LM4927
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SNAS318B – JUNE 2005 – REVISED APRIL 2013
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4927 contains shutdown circuitry that is used to
turn off the amplifier's bias circuitry. The device may then be placed into shutdown mode by toggling the
Shutdown Select pin to logic low. The trigger point for shutdown is shown as a typical value in the Supply
Current vs Shutdown Voltage graphs in the Typical Performance Characteristics section. It is best to switch
between ground and supply for maximum performance. While the device may be disabled with shutdown
voltages in between ground and supply, the idle current may be greater than the typical value of 0.1µA. In either
case, the shutdown pin should be tied to a definite voltage to avoid unwanted state changes.
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry, which
provides a quick, smooth transition to shutdown. Another solution is to use a single-throw switch in conjunction
with an external pull-up resistor. This scheme ensures that the shutdown pin will not float, thus preventing
unwanted state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical when
optimizing device and system performance. Although the LM4927 is tolerant to a variety of external component
combinations, consideration of component values must be made when maximizing overall system quality.
The LM4927 is unity-gain stable, giving the designer maximum system flexibility. The LM4927 should be used in
low closed-loop gain configurations to minimize THD+N values and maximize signal to noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than
1Vrms are available from sources such as audio codecs. Please refer to the Audio Power Amplifier Design
section for a more complete explanation of proper gain selection. When used in its typical application as a fully
differential power amplifier the LM4927 does not require input coupling capacitors for input sources with DC
common-mode voltages of less than VDD. Exact allowable input common-mode voltage levels are actually a
function of VDD, Ri, and Rf and may be determined by Equation 5:
VCMi < (VDD-1.2)*((Rf+(Ri)/(Rf)-VDD*(Ri / 2Rf)
-RF / RI = AVD
(5)
(6)
Special care must be taken to match the values of the input resistors (Ri1 and Ri2) to each other. Because of the
balanced nature of differential amplifiers, resistor matching differences can result in net DC currents across the
load. This DC current can increase power consumption, internal IC power dissipation, reduce PSRR, and
possibly damaging the loudspeaker. The chart below demonstrates this problem by showing the effects of
differing values between the feedback resistors while assuming that the input resistors are perfectly matched.
The results below apply to the application circuit shown in Figure 1, and assumes that VDD = 5V, RL = 8Ω, and
the system has DC coupled inputs tied to ground.
Tolerance
Ri1
Ri2
V02 - V01
ILOAD
20%
0.8R
1.2R
-0.500V
62.5mA
10%
0.9R
1.1R
-0.250V
31.25mA
5%
0.95R
1.05R
-0.125V
15.63mA
1%
0.99R
1.01R
-0.025V
3.125mA
0%
R
R
0
0
Since the same variations can have a significant effect on PSRR and CMRR performance, it is highly
recommended that the input resistors be matched to 1% tolerance or better for best performance.
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13
LM4927
SNAS318B – JUNE 2005 – REVISED APRIL 2013
www.ti.com
AUDIO POWER AMPLIFIER DESIGN
Design a 1W/8Ω Audio Amplifier
Given:
Power Output
1Wrms
Load Impedance
8Ω
Input Level
1Vrms
Input Impedance
20kΩ
Bandwidth
100Hz–20kHz ± 0.25dB
A designer must first determine the minimum supply rail to obtain the specified output power. The supply rail can
easily be found by extrapolating from the Output Power vs Supply Voltage graphs in the Typical Performance
CharacteristicsTypical Performance Characteristics (1) section. A second way to determine the minimum supply
rail is to calculate the required VOPEAK using Equation 7 and add the dropout voltages. Using this method, the
minimum supply voltage is (Vopeak + (VDO TOP + (VDO BOT )), where VDO BOT and VDO TOP are extrapolated from
the Dropout Voltage vs Supply Voltage curve in the Typical Performance Characteristics section.
(7)
Using the Output Power vs Supply Voltage graph for an 8Ω load, the minimum supply rail just about 5V. Extra
supply voltage creates headroom that allows the LM4927 to reproduce peaks in excess of 1W without producing
audible distortion. At this time, the designer must make sure that the power supply choice along with the output
impedance does not violate the conditions explained in the POWER DISSIPATION section. Once the power
dissipation equations have been addressed, the required differential gain can be determined from Equation 8.
(8)
(9)
Rf / Ri = AVD
From Equation 8, the minimum AVD is 2.83. A ratio of Rf to Ri of 2.83 gives Ri = 14kΩ. The final design step is to
address the bandwidth requirement which must be stated as a single -3dB frequency point. Five times away from
a -3dB point is 0.17dB down from passband response which is better than the required ±0.25dB specified.
fH = 20kHz * 5 = 100kHz
(10)
The high frequency pole is determined by the product of the desired frequency pole, fH , and the differential gain,
AVD . With a AVD = 2.83 and fH = 100kHz, the resulting GBWP = 150kHz which is much smaller than the LM4927
GBWP of 10MHz. This figure displays that if a designer has a need to design an amplifier with a higher
differential gain, the LM4927 can still be used without running into bandwidth limitations.
Revision History
(1)
14
Rev
Date
Description
0.1
06/01/05
1st time WEB release for this project. (MC)
0.2
04/07/06
Edited the Rf spec (5V EC table) to reveal max and
min limits of 47 and 37 kΩ respectively (per Bic and
Daniel).
0.3
04/14/06
Added Ri = 40kohm (Conditions for Rf) per Bic and
WC Pua, then re-released D/S.
B
04/05/13
Changed layout of National Data Sheet to TI format
Data taken with BW = 80kHz and AV = 1/1 except where specified.
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Product Folder Links: LM4927
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jan-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
LM4927SD/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
WSON
NGQ
8
1000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
L4927
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
20-Jan-2017
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM4927SD/NOPB
Package Package Pins
Type Drawing
WSON
NGQ
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
178.0
12.4
Pack Materials-Page 1
3.3
B0
(mm)
K0
(mm)
P1
(mm)
3.3
1.0
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4927SD/NOPB
WSON
NGQ
8
1000
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
NGQ0008A
WSON - 0.8 mm max height
SCALE 4.000
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
B
A
PIN 1 INDEX AREA
3.1
2.9
C
0.8
0.7
SEATING PLANE
0.08 C
1.6 0.1
(0.1) TYP
SYMM
EXPOSED
THERMAL PAD
0.05
0.00
4
5
SYMM
9
2X
1.5
2 0.1
8
1
6X 0.5
8X
PIN 1 ID
8X
0.5
0.3
0.3
0.2
0.1
0.05
C A B
C
4214922/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
NGQ0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.6)
SYMM
8X (0.6)
1
8
(0.75)
8X (0.25)
9
SYMM
(2)
6X (0.5)
5
4
(R0.05) TYP
( 0.2) VIA
TYP
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214922/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
NGQ0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.6)
SYMM
9
METAL
TYP
8
1
8X (0.25)
SYMM
(1.79)
6X (0.5)
5
4
(R0.05) TYP
(1.47)
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 9:
82% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4214922/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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