Texas Instruments | TAS5414B-Q1, TAS5424B-Q1 Four-Channel Automotive Digital Amplifiers | Datasheet | Texas Instruments TAS5414B-Q1, TAS5424B-Q1 Four-Channel Automotive Digital Amplifiers Datasheet

Texas Instruments TAS5414B-Q1, TAS5424B-Q1 Four-Channel Automotive Digital Amplifiers Datasheet
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
FOUR-CHANNEL AUTOMOTIVE DIGITAL AMPLIFIERS
Check for Samples: TAS5414B-Q1, TAS5424B-Q1
FEATURES
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TAS5414B-Q1 – Single-Ended Input
TAS5424B-Q1 – Differential Input
Four-Channel Digital Power Amplifier
Four Analog Inputs, Four BTL Power Outputs
Typical Output Power at 10% THD+N
– 28 W/Ch Into 4 Ω at 14.4 V
– 50 W/Ch Into 2 Ω at 14.4 V
– 79 W/Ch Into 4 Ω at 24 V
– 150 W/Ch Into 2 Ω at 24 V (PBTL)
Channels Can Be Paralleled (PBTL) for High
Current Applications
THD+N < 0.02%, 1 kHz, 1 W Into 4 Ω
Patented Pop- and Click-Reduction
Technology
– Soft Muting With Gain Ramp Control
– Common-Mode Ramping
Patented AM Interference Avoidance
Patented Cycle-by-Cycle Current Limit
75-dB PSRR
Four-Address I2C Serial Interface for Device
Configuration and Control
Channel Gains: 12-dB, 20-dB, 26-dB, 32-dB
Load Diagnostic Functions:
– Output Open and Shorted Load
– Output-to-Power and -to-Ground Shorts
– Patented Tweeter Detection
Protection and Monitoring Functions:
– Short-Circuit Protection
– Load-Dump Protection to 50 V
– Fortuitous Open Ground and Power
Tolerant
– Patented Output DC Level Detection While
Music Playing
– Over-temperature Protection
– Over- and Undervoltage Conditions
– Clip Detection
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36-Pin PSOP3 (DKD) Power SOP Package With
Heat Slug Up for the TAS5414B-Q1
44-Pin PSOP3 (DKD) Power SOP Package With
Heat Slug Up for the TAS5424B-Q1
44-Pin PSOP3 (DKE) Low-Standoff Power SOP
Package With Heat Slug Up for the
TAS5424B-Q1
64-Pin QFP (PHD) Power Package With Heat
Slug Up for TAS5414B-Q1
Designed for Automotive EMC Requirements
Qualified According to AEC-Q100
ISO9000:2002 TS16949 Certified
–40°C to 105°C Ambient Temperature Range
APPLICATIONS
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OEM/Retail Head Units and Amplifier Modules
Where Feature Densities and System
Configurations Require Reduction in Heat
From the Audio Power Amplifier
DESCRIPTION
The
TAS5414B-Q1
and
TAS5424B-Q1
are
four-channel digital audio amplifiers designed for use
in automotive head units and external amplifier
modules. They provide four channels at 23 W
continuously into 4 Ω at less than 1% THD+N from a
14.4-V supply. Each channel can also deliver 38 W
into 2 Ω at 1% THD+N. The TAS5414B-Q1 uses
single-ended analog inputs, while the TAS5424B-Q1
employs differential inputs for increased immunity to
common-mode system noise. The digital PWM
topology of the device provides dramatic
improvements in efficiency over traditional linear
amplifier solutions. This reduces the power dissipated
by the amplifier by a factor of ten under typical music
playback conditions. The device incorporates all the
functionality needed to perform in the demanding
OEM applications area. They have built-in load
diagnostic functions for detecting and diagnosing
misconnected outputs to help to reduce test time
during the manufacturing process.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTIONAL BLOCK DIAGRAM
2
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
PIN ASSIGNMENTS AND FUNCTIONS
The pin assignments are shown as follows.
TAS5414B
DKD Package
(Top View)
OSC_SYNC
I2C_ADDR
SDA
SCL
FAULT
MUTE
STANDBY
D_BYP
CLIP_OTW
GND
GND
REXT
A_BYP
IN1_P
IN2_P
IN_M
IN3_P
IN4_P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Copyright © 2011, Texas Instruments Incorporated
TAS5424B
DKD Package
(Top View)
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
PVDD
PVDD
OUT1_M
OUT1_P
GND
OUT2_M
OUT2_P
CPC_TOP
CP
CPC_BOT
GND
OUT3_M
OUT3_P
GND
OUT4_M
OUT4_P
PVDD
PVDD
OSC_SYNC
I2C_ADDR
SDA
SCL
FAULT
MUTE
GND
STANDBY
D_BYP
CLIP_OTW
GND
GND
REXT
A_BYP
IN1_P
IN1_M
IN2_P
IN2_M
IN3_P
IN3_M
IN4_P
IN4_M
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
PVDD
PVDD
PVDD
OUT1_M
OUT1_P
GND
GND
OUT2_M
OUT2_P
CPC_TOP
CP
CP_BOT
GND
OUT3_M
OUT3_P
GND
GND
OUT4_M
OUT4_P
PVDD
PVDD
PVDD
3
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
GND
GND
GND
PVDD
PVDD
PVDD
GND
GND
GND
GND
GND
GND
OSC_SYNC
SDA
I2C_ADDR
SCL
TAS5414B
PHD Package
(Top View)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
FAULT
1
48
OUT1_M
MUTE
2
47
OUT1_P
GND
3
46
GND
STANDBY
4
45
OUT2_M
D_BYP
5
44
OUT2_P
CLIP_OTW
6
43
GND
GND
7
42
CPC_TOP
GND
8
41
CP
GND
9
40
CP_BOT
REXT
10
39
GND
A_BYP
11
38
GND
GND
12
37
OUT3_M
IN1_P
13
36
OUT3_P
GND
14
35
GND
IN2_P
15
34
OUT4_M
GND
16
33
OUT4_P
4
GND
GND
GND
PVDD
PVDD
PVDD
GND
GND
GND
GND
GND
GND
IN4_P
IN_M
IN3_P
GND
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Table 1. PIN FUNCTIONS
PIN
NAME
DKD/DKE
PACKAGE
PHD PACKAGE
TAS54 TAS54
14B-Q1 24B-Q1
NO.
NO.
TAS5414B-Q1
NO.
TYPE (1)
DESCRIPTION
A_BYP
13
14
11
PBY
Bypass pin for the AVDD analog regulator
CLIP_OTW
9
10
6
DO
Reports CLIP, OTW, or both. It also reports tweeter detection during
tweeter mode. Open-Drain.
CP
28
34
41
CP
Top of main storage capacitor for charge pump (bottom goes to
PVDD)
CPC_BOT
27
33
40
CP
Bottom of flying capacitor for charge pump
CPC_TOP
29
35
42
CP
Top of flying capacitor for charge pump
D_BYP
8
9
5
PBY
Bypass pin for DVDD regulator output
FAULT
5
5
1
DO
Global fault output (open drain): UV, OV, OTSD, OCSD, DC
10, 11,
23, 26,
32
7, 11,
12, 28,
29, 32,
38, 39
3, 7, 8, 9, 12, 14,
16, 17, 21, 22, 23,
24, 25, 26, 30, 31,
32, 35, 38, 39, 43,
46, 49, 50, 51, 55,
56, 57, 58, 59, 60
GND
2
2
62
AI
I2C address bit
IN1_M
N/A
16
N/A
AI
Inverting analog input for channel 1 (TAS5424B-Q1 only)
IN1_P
14
15
13
AI
Non-inverting analog input for channel 1
IN2_M
N/A
18
N/A
AI
Inverting analog input for channel 2 (TAS5424B-Q1 only)
IN2_P
15
17
15
AI
Non-inverting analog input for channel 2
IN3_M
N/A
20
N/A
AI
Inverting analog input for channel 3 (TAS5424B-Q1 only)
IN3_P
17
19
19
AI
Non-inverting analog input for channel 3
IN4_M
N/A
22
N/A
AI
Inverting analog input for channel 4 (TAS5424B-Q1 only)
IN4_P
18
21
20
AI
Non-inverting analog input for channel 4
IN_M
16
N/A
18
ARTN
MUTE
6
6
2
AI
OSC_SYNC
1
1
61
DI/DO
OUT1_M
34
41
48
PO
– polarity output for bridge 1
OUT1_P
33
40
47
PO
+ polarity output for bridge 1
OUT2_M
31
37
45
PO
– polarity output for bridge 2
OUT2_P
30
36
44
PO
+ polarity output for bridge 2
OUT3_M
25
31
37
PO
– polarity output for bridge 3
OUT3_P
24
30
36
PO
+ polarity output for bridge 3
OUT4_M
22
27
34
PO
– polarity output for bridge 4
OUT4_P
21
26
33
PO
+ polarity output for bridge 4
PVDD
19, 20,
35, 36
23, 24,
25, 42,
43, 44
27, 28, 29, 52, 53,
54
PWR
REXT
12
13
10
AI
Precision resistor pin to set analog reference
SCL
4
4
64
DI
I2C clock input from system I2C master
SDA
3
3
63
DI/DO
STANDBY
7
8
4
DI
GND
I2C_ADDR
(1)
Ground
Signal return for the 4 analog channel inputs (TAS5414B-Q1 only)
Gain ramp control: mute (low), play (high)
Oscillator input from master or output to slave amplifiers
PVDD supply
I2C data I/O for communication with system I2C master
Active-low STANDBY pin. Standby (low), power up (high)
DI = digital input, DO = digital output, AI = analog input, ARTN = analog signal return, PWR = power supply, PBY = power bypass, PO =
power output, GND = ground, CP = charge pump.
Copyright © 2011, Texas Instruments Incorporated
5
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
PVDD
DC supply voltage range
Relative to GND
PVDDMAX
Pulsed supply voltage range
t ≤ 100 ms exposure
PVDDRAMP
VALUE
UNIT
–0.3 to 30
V
–1 to 50
V
Supply voltage ramp rate
15
V/ms
IPVDD
Externally imposed dc supply current per PVDD or GND pin
±12
A
IPVDD_MAX
Pulsed supply current per PVDD pin (one shot)
IO
Maximum allowed dc current per output pin
IO_MAX
(1)
t < 100 ms
Pulsed output current per output pin (single pulse)
(2)
17
A
±13.5
A
±17
A
DC or pulsed
±1
mA
DC or pulsed
±20
mA
7
mA
t < 100 ms
IIN_MAX
Maximum current, all digital and analog input pins
IMUTE_MAX
Maximum current on MUTE pin
IIN_ODMAX
Maximum sink current for open-drain pins
VLOGIC
Input voltage range for pin relative to GND (SCL, SDA,
I2C_ADDR pins)
Supply voltage range:
6V < PVDD < 24 V
–0.3 to 6
V
VMUTE
Voltage range for MUTE pin relative to GND
Supply voltage range:
6 V < PVDD < 24 V
–0.3 to 7.5
V
VSTANDBY
Input voltage range for STANDBY pin
Supply voltage range:
6 V < PVDD < 24 V
–0.3 to 5.5
V
VOSC_SYNC
Input voltage range for OSC_SYNC pin relative to GND
Supply voltage range:
6 V < PVDD < 24 V
–0.3 to 3.6
V
VGND
Maximum voltage between GND pins
±0.3
V
VAIN_AC_MAX_5414
Maximum ac-coupled input voltage for TAS5414B-Q1 (2),
analog input pins
Supply voltage range:
6 V < PVDD < 24 V
1.9
Vrms
VAIN_AC_MAX_5424
Maximum ac-coupled differential input voltage for
TAS5424B-Q1 (2), analog input pins
Supply voltage range:
6 V < PVDD < 24 V
3.8
Vrms
TJ
Maximum operating junction temperature range
–55 to 150
°C
Tstg
Storage temperature range
–55 to 150
°C
(1)
(2)
Pulsed current ratings are maximum survivable currents externally applied to the device. High currents may be encountered during
reverse battery, fortuitous open ground, and fortuitous open supply fault conditions.
See Application Information section for information on analog input voltage and ac coupling.
THERMAL CHARACTERISTICS
PARAMETER
VALUE (Typical)
RθJC
Junction-to-case (heat slug) thermal
resistance, DKD package
1.0
RθJC
Junction-to-case (heat slug) thermal
resistance, PHD package
1.2
RθJA
Junction-to-ambient thermal resistance
6
UNIT
°C/W
This device is not intended to be used without a heatsink. Therefore, RθJA
is not specified. See the Thermal Information section.
Exposed pad dimensions, DKD package
13.8 × 5.8
Exposed pad dimensions, PHD package
8×8
mm
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
ELECTROSTATIC DISCHARGE (ESD)
PARAMETER
Human Body Model
(HBM)
AEC-Q100-002
Package
All
DKD/DKE
Charged Device Model
(CDM)
AEC-Q100-011
PHD
Machine Model (MM)
AEC-Q100-003
Pins
VALUE
(Typical)
All
3000
Corner Pins excluding OSC_SYNC
1000
All other pins (including OSC_SYNC) except CP pin
500
CP Pin (Non-Corner Pin)
400
Corner Pins excluding SCL
750
All Pins (including SCL) except CP and CP_Top
600
CP and CP_Top Pins
400
DKD/DKE
150
PHD
100
UNIT
V
RECOMMENDED OPERATING CONDITIONS (1)
PVDDOP
DC supply voltage range relative to GND
MIN
TYP
MAX
6
14.4
24
UNIT
V
(2)
Analog audio input signal level (TAS5414B-Q1)
AC-coupled input voltage
0
0.25–1 (3)
Vrms
VAIN_5424 (2)
Analog audio input signal level (TAS5424B-Q1)
AC-coupled input voltage
0
0.5–2(3)
Vrms
TA
Ambient temperature
–40
105
°C
–40
115
°C
VAIN_5414
An adequate heat sink is required
to keep TJ within specified range.
TJ
Junction temperature
RL
Nominal speaker load impedance
2
4
VPU
Pullup voltage supply (for open-drain logic outputs)
3
3.3 or 5
RPU_EXT
External pullup resistor on open-drain logic outputs
RPU_I2C
I2C pullup resistance on SDA and SCL pins
Resistor connected between
open-drain logic output and VPU
supply
10
1
4.7
Ω
5.5
V
50
kΩ
10
kΩ
50
kΩ
20.2
kΩ
120
nF
680
nF
2
RI2C_ADD
Total resistance of voltage divider for I C address
slave 1 or slave 2, connected between D_BYP and
GND pins
RREXT
External resistance on REXT pin
CD_BYP , CA_BYP
External capacitance on D_BYP and A_BYP pins
COUT
External capacitance to GND on OUT_X pins
150
CIN
External capacitance to analog input pin in series
with input signal
0.47
CFLY
Flying capacitor on charge pump
CP
Charge pump capacitor
CMUTE
MUTE pin capacitor
COSCSYNC_MAX
Allowed loading capacitance on OSC_SYNC pin
(1)
(2)
(3)
10
1% tolerance required
19.8
20
10
50V needed for Load Dump
μF
0.47
1
1.5
μF
0.47
1
1.5
μF
100
220
1000
nF
75
pF
The Recommended Operating Conditions table specifies only that the device is functional in the given range. See the Electrical
Characteristics table for specified performance limits.
Signal input for full unclipped output with gains of 32 dB, 26 dB, 20 dB, and 12 dB
Maximum recommended input voltage is determined by the gain setting.
Copyright © 2011, Texas Instruments Incorporated
7
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
Test conditions (unless otherwise noted): TCase = 25°C, PVDD = 14.4 V, RL = 4 Ω, fS = 417 kHz, Pout = 1 W/ch, Rext = 20 kΩ,
AES17 Filter, default I2C settings, master mode operation (see application diagram)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
170
220
UNIT
OPERATING CURRENT
IPVDD_IDLE
IPVDD_Hi-Z
IPVDD_STBY
PVDD idle current
PVDD standby current
All four channels in MUTE mode
All four channels in Hi-Z mode
93
STANDBY mode, TJ ≤ 85°C
2
10
mA
μA
OUTPUT POWER
4 Ω, PVDD = 14.4 V, THD+N ≤ 1%, 1 kHz, Tc = 75°C
23
4 Ω, PVDD = 14.4 V, THD+N = 10%, 1 kHz, Tc = 75°C
25
28
4 Ω, PVDD = 24 V, THD+N = 10%, 1 kHz, Tc = 75°C
63
79
2 Ω, PVDD = 14.4 V, THD+N = 1%, 1 kHz, Tc = 75°C
POUT
Output power per channel
2 Ω, PVDD = 14.4 V, THD+N = 10%, 1 kHz, Tc = 75°C
38
40
PBTL 2-Ω operation, PVDD = 24 V, THD+N = 10%,
1 kHz, Tc = 75°C
150
PBTL 1-Ω operation, PVDD = 14.4 V, THD+N = 10%,
1 kHz, Tc = 75°C
EFFP
Power efficiency
W
50
90
4 channels operating, 23-W output power/ch, L = 10 μH,
TJ ≤ 85°C
90%
AUDIO PERFORMANCE
VNOISE
Noise voltage at output
Zero input, and A-weighting
60
100
μV
2
Crosstalk
Channel crosstalk
P = 1W, f = 1 kHz, Enhanced Crosstalk Enabled via I C
(reg 0x10)
70
85
dB
CMRR5424
Common-mode rejection ratio
(TAS5424B-Q1)
f = 1 kHz, 1 Vrms referenced to GND, G = 26 dB
60
75
dB
PSRR
Power supply rejection ratio
PVDD = 14.4 Vdc + 1 Vrms, f = 1 kHz
60
THD+N
Total harmonic distortion + noise
P = 1W, f = 1 kHz
fS
Switching frequency
Switching frequency selectable for AM interference
avoidance
RAIN
Analog input resistance
Internal shunt resistance on each input pin
VIN_CM
Common-mode input voltage
AC coupled common-mode input voltage (zero
differential input)
VCM_INT
Internal common-mode input bias voltage
Internal bias applied to IN_M pin
75
dB
0.02%
0.1%
336
357
378
392
417
442
470
500
530
63
85
106
1.3
Voltage gain (VO/VIN)
Source impedance = 0 Ω, gain measurement taken at 1
W of power per channel
GCH
Channel-to-channel variation
Any gain commanded
kΩ
Vrms
3.3
G
kHz
V
11
12
13
19
20
21
25
26
27
31
32
33
–1
0
1
dB
dB
PWM OUTPUT STAGE
RDSon
FET drain-to-source resistance
Not including bond wire resistance, TJ = 25°C
VO_OFFSET
Output offset voltage
Zero input signal, G = 26 dB
65
90
mΩ
±10
±50
mV
PVDD OVERVOLTAGE (OV) PROTECTION
VOV_SET
PVDD overvoltage shutdown set
24.6
26.4
28.2
VOV_CLEAR
PVDD overvoltage shutdown clear
24.4
25.9
27.4
V
PVDD UNDERVOLTAGE (UV) PROTECTION
VUV_SET
PVDD undervoltage shutdown set
4.9
5.3
5.6
V
VUV_CLEAR
PVDD undervoltage shutdown clear
6.2
6.6
7.0
V
AVDD
VA_BYP
A_BYP pin voltage
6.5
V
VA_BYP_UV_SET
A_BYP UV voltage
4.8
V
VA_BYP_UV_CLEAR
Recovery voltage A_BYP UV
5.3
V
D_BYP pin voltage
3.3
V
DVDD
VD_BYP
8
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Test conditions (unless otherwise noted): TCase = 25°C, PVDD = 14.4 V, RL = 4 Ω, fS = 417 kHz, Pout = 1 W/ch, Rext = 20 kΩ,
AES17 Filter, default I2C settings, master mode operation (see application diagram)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER-ON RESET (POR)
VPOR
PVDD voltage for POR
VPOR_HY
PVDD recovery hysteresis voltage for POR
I2C active above this voltage
3.5
V
0.1
V
1.27
V
REXT
VREXT
Rext pin voltage
CHARGE PUMP (CP)
VCPUV_SET
CP undervoltage
4.8
V
VCPUV_CLEAR
Recovery voltage for CP UV
4.9
V
OVERTEMPERATURE (OT) PROTECTION
TOTW1_CLEAR
TOTW1_SET /
TOTW2_CLEAR
TOTW2_SET /
TOTW3_CLEAR
Junction temperature for overtemperature
warning
TOTW3_SET /
TOTSD_CLEAR
TOTSD
Junction temperature for overtemperature
shutdown
TFB
Junction temperature for overtemperature
foldback
Per channel
96
112
128
106
122
138
116
132
148
126
142
158
136
152
168
130
150
170
°C
CURRENT LIMITING PROTECTION
ILIM
Current limit (load current)
Level 1
Level 2 (default)
5.5
7.3
9.0
10.6
12.7
15.0
7.8
9.8
12.2
11.9
14.8
17.7
330
445
560
A
OVERCURRENT (OC) SHUTDOWN PROTECTION
Level 1
IMAX
Maximum current (peak output current)
Level 2 (default), Any short to supply, ground, or other
channels
A
TWEETER DETECT
ITH_TW
Load current threshold for tweeter detect
ILIM_TW
Load current limit for tweeter detect
2.1
mA
A
STANDBY MODE
VIH_STBY
STANDBY input voltage for logic-level high
VIL_STBY
STANDBY input voltage for logic-level low
ISTBY_PIN
STANDBY pin current
2
V
0.1
0.7
V
0.2
μA
MUTE MODE
GMUTE
Output attenuation
MUTE pin ≤ 0.5 V + 200mS or I2C Mute Enabled
100
dB
25
%
DC DETECT
VTH_DC_TOL
DC detect threshold tolerance
tDCD
DC detect step response time for four
channels
5.3
s
CLIP_OTW REPORT
VOH_CLIPOTW
CLIP_OTW pin output voltage for logic level
high (open-drain logic output)
VOL_CLIPOTW
CLIP_OTW pin output voltage for logic level
low (open-drain logic output)
tDELAY_CLIPDET
CLIP_OTW signal delay when output
clipping detected
2.4
V
External 47-kΩ pullup resistor to 3 V–5.5 V
0.5
V
20
μs
FAULT REPORT
VOH_FAULT
VOL_FAULT
FAULT pin output voltage for logic-level high
(open-drain logic output)
FAULT pin output voltage for logic-level low
(open-drain logic output)
2.4
External 47-kΩ pullup resistor to 3 V–5.5 V
V
0.5
OPEN/SHORT DIAGNOSTICS
Copyright © 2011, Texas Instruments Incorporated
9
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Test conditions (unless otherwise noted): TCase = 25°C, PVDD = 14.4 V, RL = 4 Ω, fS = 417 kHz, Pout = 1 W/ch, Rext = 20 kΩ,
AES17 Filter, default I2C settings, master mode operation (see application diagram)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
200
Ω
RS2P, RS2G
Maximum resistance to detect a short from
OUT pin(s) to PVDD or ground
ROPEN_LOAD
Minimum load resistance to detect open
circuit
Including speaker wires
300
740
1300
Ω
RSHORTED_LOAD
Maximum load resistance to detect short
circuit
Including speaker wires
0.5
1.0
1.5
Ω
2
I C ADDRESS DECODER
tLATCH_I2CADDR
Time delay to latch I2C address after POR
μs
300
Voltage on I2C_ADDR pin for address 0
Connect to GND
0%
0%
15%
Voltage on I2C_ADDR pin for address 1
25%
35%
45%
Voltage on I2C_ADDR pin for address 2
External resistors in series between D_BYP and GND as
a voltage divider
55%
65%
75%
Voltage on I2C_ADDR pin for address 3
Connect to D_BYP
85%
100%
100%
tHOLD_I2C
Power-on hold time before I2C
communication
STANDBY high
fSCL
SCL clock frequency
VIH_SCL
SCL pin input voltage for logic-level high
VIL_SCL
SCL pin input voltage for logic-level low
VI2C_ADDR
VD_BYP
I2C
1
RPU_I2C = 5-kΩ pullup, supply voltage = 3.3 V or 5 V
ms
400
kHz
2.1
5.5
V
–0.5
1.1
V
2
VOH_SDA
VOL_SDA
SDA pin output voltage for logic-level high
I C read, RI2C = 5-kΩ pullup,
supply voltage = 3.3 V or 5 V
2.4
V
2
SDA pin output voltage for logic-level low
I C read, 3-mA sink current
VIH_SDA
SDA pin input voltage for logic-level high
I2C write, RI2C = 5-kΩ pullup,
supply voltage = 3.3 V or 5 V
VIL_SDA
SDA pin input voltage for logic-level low
I2C write, RI2C = 5-kΩ pullup,
supply voltage = 3.3 V or 5 V
Ci
Capacitance for SCL and SDA pins
0.4
V
2.1
5.5
V
–0.5
1.1
V
10
pF
OSCILLATOR
VOH_OSCSYNC
OSC_SYNC pin output voltage for
logic-level high
VOL_OSCSYNC
OSC_SYNC pin output voltage for
logic-level low
VIH_OSCSYNC
OSC_SYNC pin input voltage for logic-level
high
VIL_OSCSYNC
OSC_SYNC pin input voltage for logic-level
low
fOSC_SYNC
OSC_SYNC pin clock frequency
10
2.4
V
I2C_ADDR pin set to MASTER mode
0.5
2
V
V
I2C_ADDR pin set to SLAVE mode
0.8
I2C_ADDR pin set to MASTER mode, fS = 500 kHz
3.76
4.0
4.24
I2C_ADDR pin set to MASTER mode, fS = 417 kHz
3.13
3.33
3.63
I2C_ADDR pin set to MASTER mode, fS = 357 kHz
2.68
2.85
3.0
V
MHz
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
TIMING REQUIREMENTS FOR I2C INTERFACE SIGNALS
over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
TYP
MAX
UNIT
ns
tr
Rise time for both SDA and SCL signals
300
tf
Fall time for both SDA and SCL signals
300
tw(H)
SCL pulse duration, high
0.6
μs
tw(L)
SCL pulse duration, low
1.3
μs
tsu2
Setup time for START condition
0.6
μs
th2
START condition hold time after which first clock pulse is generated
0.6
μs
tsu1
Data setup time
100
ns
(1)
ns
μs
th1
Data hold time
0
tsu3
Setup time for STOP condition
0.6
CB
Load capacitance for each bus line
(1)
ns
400
pF
A device must internally provide a hold time of at least 300 ns for the SDA signal to bridge the undefined region of the falling edge of
SCL.
tw(H)
tw(L)
tf
tr
SCL
tsu1
th1
SDA
T0027-01
Figure 1. SCL and SDA Timing
SCL
t(buf)
th2
tsu2
tsu3
SDA
Start
Condition
Stop
Condition
T0028-01
Figure 2. Timing for Start and Stop Conditions
Copyright © 2011, Texas Instruments Incorporated
11
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
12
THD+N
vs
BTL OUTPUT POWER at 1kHz
THD+N
vs
PBTL OUTPUT POWER at 1kHz
Figure 3.
Figure 4.
THD+N
vs
FREQUENCY at 1 Watt
TAS5424B-Q1
COMMON-MODE REJECTION RATIO
vs
FREQUENCY
Figure 5.
Figure 6.
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
CROSSTALK
vs
FREQUENCY
NOISE FFT
Figure 7.
Figure 8.
EFFICIENCY,
FOUR CHANNELS AT 4 Ω EACH
DEVICE POWER DISSIPATION
FOUR CHANNELS AT 4 Ω EACH
100
12
90
10
80
Power Dissipation − W
Efficiency − %
70
60
50
40
30
20
8
6
4
2
10
0
0
0
4
8
12
16
20
24
28
32
P − Power Per Channel − W
G007
Figure 9.
Copyright © 2011, Texas Instruments Incorporated
0
5
10
15
20
P − Power Per Channel − W
G008
Figure 10.
13
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
DESCRIPTION OF OPERATION
OVERVIEW
The TAS5414B-Q1 and TAS5424B-Q1 are single-chip, four-channel, analog-input audio amplifiers for use in the
automotive environment. The design uses an ultra-efficient class-D technology developed by Texas Instruments,
but with changes needed by the automotive industry. This technology allows for reduced power consumption,
reduced heat, and reduced peak currents in the electrical system. The device realizes an audio sound system
design with smaller size and lower weight than traditional class-AB solutions.
There are eight core design blocks:
• Preamplifier
• PWM
• Gate drive
• Power FETs
• Diagnostics
• Protection
• Power supply
• I2C serial communication bus
Preamplifier
The preamplifier is a high-input-impedance, low-noise, low-offset-voltage input stage with adjustable gain. The
high input impedance allows the use of low-cost input capacitors while still achieving extended low-frequency
response. The preamplifier is powered by a dedicated, internally regulated supply, which gives it excellent noise
immunity and channel separation. Also included in the preamp are:
1. Mute Pop-and-Click Control— The device ramps the gain gradually when a mute or play command is
received. Another form of click and pop can be caused by the start or stopping of switching in a class-D
amplifier. The TAS5414B-Q1 and TAS5424B-Q1 incorporate a patented method to reduce the pop energy
during the switching startup and shutdown sequence. Fault conditions require rapid protection response by
the TAS5414B-Q1 and the TAS5424B-Q1, which do not have time to ramp the gain down in a pop-free
manner. The device transitions into Hi-Z mode when an OV, UV, OC, OT, or DC fault is encountered. Also,
activation of the STANDBY pin may not be pop-free.
2. Gain Control—The four gain settings are set in the preamplifier via I2C control registers. The gain is set
outside of the global feedback resistors of the device, thus allowing for stability of the system at all gain
settings with properly loaded conditions.
Pulse-Width Modulator (PWM)
The PWM converts the analog signal from the preamplifier into a switched signal of varying duty cycle. This is
the critical stage that defines the class-D architecture. In the TAS5414B-Q1 and TAS5424B-Q1, the modulator is
an advanced design with high bandwidth, low noise, low distortion, excellent stability, and full 0–100%
modulation capability. The patented PWM uses clipping recovery circuitry to eliminate the deep saturation
characteristic of PWMs when the input signal exceeds the modulator waveform.
Gate Drive
The gate driver accepts the low-voltage PWM signal and level shifts it to drive a high-current, full-bridge, power
FET stage. The device uses proprietary techniques to optimize EMI and audio performance.
Power FETs
The BTL output for each channel comprises four rugged N-channel 30-V 65 mΩ FETs for high efficiency and
maximum power transfer to the load. These FETs are designed to handle large voltage transients during load
dump.
14
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Load Diagnostics
The device incorporates load diagnostic circuitry designed to help pinpoint the nature of output misconnections
during installation. The TAS5414B-Q1 and the TAS5424B-Q1 include functions for detecting and determining the
status of output connections. The following diagnostics are supported:
• Short to GND
• Short to PVDD
• Short across load
• Open load
• Tweeter detection
The presence of any of the short or open conditions is reported to the system via I2C register read. The tweeter
detect status can be read from the CLIP_OTW pin when properly configured.
1. Output Short and Open Diagnostics—The device contains circuitry designed to detect shorts and open
conditions on the outputs. The load diagnostic function can only be invoked when the output is in the Hi-Z
mode. There are four phases of test during load diagnostics and two levels of test. In the full level, all
channels must be in the Hi-Z state. All four phases are tested on each channel, all four channels at the same
time. When fewer than four channels are in Hi-Z, the reduced level of test is the only available option. In the
reduced level, only short to PVDD and short to GND can be tested. Load diagnostics can occur at power up
before the amplifier is moved out of Hi-Z mode. If the amplifier is already in play mode, it must Mute and then
Hi-Z before the load diagnostic can be performed. By performing the mute function, the normal pop- and
click-free transitions occur before the diagnostics begin. The diagnostics are performed as shown in
Figure 11. Figure 12 shows the impedance ranges for the open-load and shorted-load diagnostics. The
results of the diagnostic are read from the diagnostic register for each channel via I2C. With the default
settings and MUTE capacitor the S2G and S2P phase take ~20mS each, the OL phase takes ~100mS, and
the SL takes ~230mS.
Figure 11. Load Diagnostics Sequence of Events
Copyright © 2011, Texas Instruments Incorporated
15
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Figure 12. Open and Shorted Load Detection
2. Tweeter Detection—Tweeter detection is an alternate operating mode that is used to determine the proper
connection of a frequency dependent load (such as a speaker with a crossover). Tweeter detection is
invoked via I2C, and all four channels should be tested individually. Tweeter detection uses the average
cycle-by-cycle current limit circuit (see CBC section) to measure the current delivered to the load. The proper
implementation of this diagnostic function is dependent on the amplitude of a user-supplied test signal and
on the impedance versus frequency curve of the acoustic load. The system (external to the TAS5414B-Q1
and TAS5424B-Q1) must generate a signal to which the load will respond. The frequency and amplitude of
this signal must be calibrated by the user to result in a current draw that is greater than the tweeter detection
threshold when the load under test is present, and less than the detection threshold if the load is not properly
connected. The current level for the tweeter detection threshold, as well as the maximum current that can
safely be delivered to a load when in tweeter detection mode, can be found in the Electrical Characteristics
section of the datasheet. The tweeter detection results are reported on the CLIP_OTW pin during the
application of the test signal. When tweeter detection is activated (indicating that the tested load is present),
pulses on the CLIP_OTW pin begin to toggle. The pulses on the CLIP_OTW pins will report low whenever
the current detection threshold is exceeded, and the pin will remain low until the threshold is no longer
exceeded. The minimum low-pulse period that can be expected is equal to one period of the switching
frequency. Having an input signal that increases the amount of time that the detector is activated (e. g.
increasing the amplitude of the input signal) will increase the amount of time for which the pin reports low.
NOTE: Because tweeter detection is an alternate operating mode, the channels to be tested must be placed
in Play mode (via register 0x0C) after tweeter detection has been activated in order to commence the
detection process. Additionally, the CLIP_OTW pin must be set up via register 0x0A to report the results of
tweeter detection.
Protection and Monitoring
1. Cycle-By-Cycle Current Limit (CBC)—The CBC current-limiting circuit terminates each PWM pulse to limit
the output current flow when the average current limit (ILIM) threshold is exceeded. The overall effect on the
audio in the case of a current overload is quite similar to a voltage-clipping event, where power is temporarily
limited at the peaks of the musical signal and normal operation continues without disruption when the
overload is removed. The TAS5414B-Q1 and TAS5424B-Q1 do not prematurely shut down in this condition.
All four channels continue in play mode and pass signal.
2. Overcurrent Shutdown (OCSD)—Under severe short-circuit events, such as a short to PVDD or ground, a
peak-current detector is used, and the affected channel shuts down in 200 μs to 390 μs if the conditions are
severe enough. The shutdown speed depends on a number of factors, such as the impedance of the short
circuit, supply voltage, and switching frequency. Only the shorted channels are shut down in such a scenario.
16
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
www.ti.com
3.
4.
5.
6.
7.
SLOS673 – DECEMBER 2011
The user may restart the affected channel via I2C. An OCSD event activates the fault pin, and the affected
channel(s) are recorded in the I2C fault register. If the supply or ground short is strong enough to exceed the
peak current threshold but not severe enough to trigger the OCSD, the peak current limiter prevents excess
current from damaging the output FETs, and operation returns to normal after the short is removed.
DC Detect—This circuit detects a dc offset continuously during normal operation at the output of the
amplifier. If the dc offset reaches the level defined in the I2C registers for the specified time period, the circuit
triggers. By default a dc detection event does not shut the output down. The shutdown function can be
enabled or disabled via I2C. If enabled, the triggered channel shuts down, but the others remain playing and
the FAULT pin is asserted. The dc level is defined in I2C registers.
Clip Detect—The clip detect circuit alerts the user to the presence of a 100% duty-cycle PWM due to a
clipped waveform. When this occurs, a signal is passed to the CLIP_OTW pin and it is asserted until the
100% duty-cycle PWM signal is no longer present. All four channels are connected to the same CLIP_OTW
pin. Through I2C, the CLIP_OTW signal can be changed to clip-only, OTW-only, or both. A fourth mode,
used only during diagnostics, is the option to report tweeter detection events on this pin (see the Tweeter
Detection section). The microcontroller in the system can monitor the signal at the CLIP_OTW pin and may
be configured to reduce the volume to all four channels in an active clipping-prevention circuit.
Overtemperature Warning (OTW), Overtemperature Shutdown (OTSD) and Thermal Foldback—By
default, the CLIP_OTW pin is set to indicate an OTW. This can be changed via I2C commands. If selected to
indicate a temperature warning, the CLIP_OTW pin is asserted when the die temperature reaches warning
level 1 as shown in the electrical specs. The OTW has three temperature thresholds with a 10°C hysteresis.
Each threshold is indicated in I2C register 0x04 bits 5, 6, and 7. The device still functions until the
temperature reaches the OTSD threshold, at which time the outputs are placed into Hi-Z mode and the
FAULT pin is asserted. I2C is still active in the event of an OTSD and the registers can be read for faults, but
all audio ceases abruptly. After the OTSD resets the device can be turned back on through I2C. The OTW is
still indicated until the temperature drops below warning level 1. The Thermal Foldback decreases the
channel gain.
Undervoltage (UV) and Power-on-Reset (POR)—The undervoltage (UV) protection detects low voltages on
PVDD, AVDD, and CP. In the event of an undervoltage, the FAULT pin is asserted and the I2C register is
updated, depending on which voltage caused the event. Power-on-reset (POR) occurs when PVDD drops
low enough. A POR event causes the I2C to go into a high-impedance state. After the device recovers from
the POR event, the device must be re-initialized via I2C.
Overvoltage (OV) and Load Dump—The OV protection detects high voltages on PVDD. If PVDD reaches
the overvoltage threshold, the FAULT pin is asserted and the I2C register is updated. The device can
withstand 50-V load-dump voltage spikes. Also depicted in this graph are the voltage thresholds for normal
operation region, overvoltage operation region, and load-dump protection region. Figure 11 shows the
regions of operating voltage and the profile of the load dump event.
Power Supply
The power for the device is most commonly provided by a car battery that can have a large voltage range. PVDD
is a filtered battery voltage, and it is the supply for the output FETS and the low-side FET gate driver. The
high-side FET gate driver is supplied by a charge pump (CP) supply. The charge pump supplies the gate drive
voltage for all four channels. The analog circuitry is powered by AVDD, which is a provided by an internal linear
regulator. A 0.1μF/10V external bypass capacitor is needed at the A_BYP pin for this supply. It is recommended
that no external components except the bypass capacitor be attached to this pin. The digital circuitry is powered
by DVDD, which is provided by an internal linear regulator. A 0.1μF/10V external bypass capacitor is needed at
the D_BYP pin. It is recommended that no external components except the bypass capacitor be attached to this
pin.
The TAS5414B-Q1 and TAS5424B-Q1 can withstand fortuitous open ground and power conditions. Fortuitous
open ground usually occurs when a speaker wire is shorted to ground, allowing for a second ground path
through the body diode in the output FETs. The diagnostic capability allows the speakers and speaker wires to
be debugged, eliminating the need to remove the amplifier to diagnose the problem.
Copyright © 2011, Texas Instruments Incorporated
17
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
I2C Serial Communication Bus
The device communicates with the system processor via the I2C serial communication bus as an I2C slave-only
device. The processor can poll the device via I2C to determine the operating status. All fault conditions and
detections are reported via I2C. There are also numerous features and operating conditions that can be set via
I2C.
The I2C bus allows control of the following configurations:
• Independent gain control of each channel. The gain can be set to 12 dB, 20 dB, 26 dB, and 32 dB.
• Select AM non-interference switching frequency
• Select the function of OTW_CLIP pin
• Enable or disable dc detect function with selectable threshold
• Place channel in Hi-Z (switching stopped) mode (mute)
• Select tweeter detect, set detect threshold and initiate function
• Initiate open/short load diagnostic
• Reset faults and return to normal switching operation from Hi-Z mode (unmute)
In addition to the standard SDA and SCL pins for the I2C bus, the TAS5414B-Q1 and the TAS5424B-Q1 include
a single pin that allows up to four devices to work together in a system with no additional hardware required for
communication or synchronization. The I2C_ADDR pin sets the device in master or slave mode and selects the
I2C address for that device. Tie I2C_ADDR to DGND for master, to 1.2 Vdc for slave 1, to 2.4 Vdc for slave 2,
and to D_BYP for slave 3. The OSC_SYNC pin is used to synchronize the internal clock oscillators and thereby
avoid beat frequencies. An external oscillator can also be applied to this pin for external control of the switching
frequency.
Table 2. Table 7. I2C_ADDR Pin Connection
DESCRIPTION
I2C ADDRESS
I2C_ADDR PIN CONNECTION
TAS5414B-Q1/5424 0 (OSC
MASTER)
To SGND pin
0xD8/D9
TAS5414B-Q1/5424 1 (OSC
SLAVE1)
35% DVDD (resistive voltage divider between D_BYP pin and SGND pin) (1)
0xDA/DB
TAS5414B-Q1/5424 2 (OSC
SLAVE2)
65% DVDD (resistive voltage divider between D_BYP pin and SGND pin) (1)
0xDC/DD
TAS5414B-Q1/5424 3 (OSC
SLAVE3)
To D_BYP pin
0xDE/DF
(1)
RI2C_ADDR with 5% or better tolerance is recommended.
I2C Bus Protocol
The TAS5414B-Q1 and TAS5424B-Q1 have a bidirectional serial control interface that is compatible with the
Inter IC (I2C) bus protocol and supports 400-kbps data transfer rates for random and sequential write and read
operations. This is a slave-only device that does not support a multimaster bus environment or wait state
insertion. The control interface is used to program the registers of the device and to read device status.
The I2C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a
system. Data is transferred on the bus serially, one bit at a time. The address and data are transferred in byte
(8-bit) format with the most-significant bit (MSB) transferred first. In addition, each byte transferred on the bus is
acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master
device driving a start condition on the bus and ends with the master device driving a stop condition on the bus.
The bus uses transitions on the data terminal (SDA) while the clock is HIGH to indicate a start and stop
conditions. A HIGH-to-LOW transition on SDA indicates a start, and a LOW-to-HIGH transition indicates a stop.
Normal data bit transitions must occur within the low time of the clock period. These conditions are shown in
Figure 13. The master generates the 7-bit slave address and the read/write (R/W) bit to open communication
with another device and then wait for an acknowledge condition. The TAS5414B-Q1 and TAS5424B-Q1 hold
SDA LOW during the acknowledge-clock period to indicate an acknowledgment. When this occurs, the master
18
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
transmits the next byte of the sequence. Each device is addressed by a unique 7-bit slave address plus R/W bit
(1 byte). All compatible devices share the same signals via a bidirectional bus using a wired-AND connection. An
external pullup resistor must be used for the SDA and SCL signals to set the HIGH level for the bus. There is no
limit on the number of bytes that can be transmitted between start and stop conditions. When the last word
transfers, the master generates a stop condition to release the bus.
SDA
R/
A
W
7-Bit Slave Address
7
5
6
4
3
2
1
8-Bit Register Address (N)
7
0
6
5
4
3
2
1
8-Bit Register Data For
Address (N)
A
0
7
6
5
4
3
2
1
8-Bit Register Data For
Address (N)
A
7
0
6
5
4
3
2
1
A
0
SCL
Start
Stop
T0035-01
2
Figure 13. Typical I C Sequence
Use the I2C_ADDR pin (pin 2) to program the device for one of four addresses. These four addresses are
licensed I2C addresses and do not conflict with other licensed I2C audio devices. To communicate with the
TAS5414B-Q1 and the TAS5424B-Q1, the I2C master uses addresses shown in Figure 13. Read and write data
can be transmitted using single-byte or multiple-byte data transfers.
Random Write
As shown in Figure 14, a single-byte data-write transfer begins with the master device transmitting a start
condition followed by the I2C device address and the read/write bit. The read/write bit determines the direction of
the data transfer. For a write data transfer, the read/write bit is a 0. After receiving the correct I2C device address
and the read/write bit, the TAS5414B-Q1 or TAS5424B-Q1 device responds with an acknowledge bit. Next, the
master transmits the address byte or bytes corresponding to the internal memory address being accessed. After
receiving the address byte, the TAS5414B-Q1 or TAS5424B-Q1 again responds with an acknowledge bit. Next,
the master device transmits the data byte to be written to the memory address being accessed. After receiving
the data byte, the TAS5414B-Q1 or TAS5424B-Q1 again responds with an acknowledge bit. Finally, the master
device transmits a stop condition to complete the single-byte data-write transfer.
Start
Condition
Acknowledge
A6
A5
A4
A3
A2
A1
A0
R/W ACK A7
2
I C Device Address and
Read/Write Bit
Acknowledge
A6
A5
A4
A3
A2
A1
A0 ACK D7
Subaddress
Acknowledge
D6
D5
D4
D3
Data Byte
D2
D1
D0 ACK
Stop
Condition
T0036-01
Figure 14. Random Write Transfer
Sequential Write
A sequential data-write transfer is identical to a single-byte data-write transfer except that multiple data bytes are
transmitted by the master device to TAS5414B-Q1 or TAS5424B-Q1 as shown in Figure 14. After receiving each
data byte, the TAS5414B-Q1 or TAS5424B-Q1 responds with an acknowledge bit and the I2C subaddress is
automatically incremented by one.
Copyright © 2011, Texas Instruments Incorporated
19
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Start
Condition
Acknowledge
A6
A5
A1
A6
A0 R/W ACK A7
A5
2
A4
A3
A1
Acknowledge
Acknowledge
Acknowledge
Acknowledge
A0 ACK D7
D0 ACK D7
D0 ACK D7
D0 ACK
Other Data Bytes
First Data Byte
Subaddress
I C Device Address and
Read/Write Bit
Last Data Byte
Stop
Condition
T0036-02
Figure 15. Sequential Write Transfer
Random Read
As shown in Figure 16, a single-byte data-read transfer begins with the master device transmitting a start
condition followed by the I2C device address and the read/write bit. For the data-read transfer, both a write
followed by a read are actually done. Initially, a write is done to transfer the address byte or bytes of the internal
memory address to be read. As a result, the read/write bit is a 0. After receiving the address and the read/write
bit, the TAS5414B-Q1 or TAS5424B-Q1 responds with an acknowledge bit. In addition, after sending the internal
memory address byte or bytes, the master device transmits another start condition followed by the
TAS5414B-Q1 or TAS5424B-Q1 address and the read/write bit again. This time the read/write bit is a 1,
indicating a read transfer. After receiving the address and the read/write bit, the TAS5414B-Q1 or TAS5424B-Q1
again responds with an acknowledge bit. Next, the TAS5414B-Q1 or TAS5424B-Q1 transmits the data byte from
the memory address being read. After receiving the data byte, the master device transmits a not-acknowledge
followed by a stop condition to complete the single-byte data-read transfer.
Repeat Start
Condition
Start
Condition
Acknowledge
A6
A5
A1
A0 R/W ACK A7
Acknowledge
A6
2
A5
A4
A0 ACK
A6
A5
A1
A0 R/W ACK D7
D6
2
I C Device Address and
Read/Write Bit
Subaddress
I C Device Address and
Read/Write Bit
Not
Acknowledge
Acknowledge
D1
D0 ACK
Stop
Condition
Data Byte
T0036-03
Figure 16. Random Read Transfer
Sequential Read
A sequential data-read transfer is identical to a single-byte data-read transfer except that multiple data bytes are
transmitted by the TAS5414B-Q1 or TAS5424B-Q1 to the master device as shown in Figure 17. Except for the
last data byte, the master device responds with an acknowledge bit after receiving each data byte and
automatically increments the I2C subaddress by one. After receiving the last data byte, the master device
transmits a not-acknowledge followed by a stop condition to complete the transfer.
Repeat Start
Condition
Start
Condition
Acknowledge
A6
2
A0 R/W ACK A7
I C Device Address and
Read/Write Bit
Acknowledge
A6
A5
Subaddress
A6
A0 ACK
2
Acknowledge
Acknowledge
Acknowledge
Not
Acknowledge
A0 R/W ACK D7
D0 ACK D7
D0 ACK D7
D0 ACK
I C Device Address and
Read/Write Bit
First Data Byte
Other Data Bytes
Last Data Byte
Stop
Condition
T0036-04
Figure 17. Sequential Read Transfer
20
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Table 3. TAS5414B-Q1/5424 I2C Addresses
SELECTABLE WITH
ADDRESS PIN
FIXED ADDRESS
DESCRIPTION
READ/WRITE
BIT
MSB
6
5
4
3
2
1
LSB
2
I2C
ADDRESS
TAS5414B-Q1/5424B 0
(OSC MASTER)
I C WRITE
1
1
0
1
1
0
0
0
I2C READ
1
1
0
1
1
0
0
1
0xD9
TAS5414B-Q1/5424B 1
(OSC SLAVE1)
I2C WRITE
1
1
0
1
1
0
1
0
0xDA
I2C READ
1
1
0
1
1
0
1
1
0xDB
TAS5414B-Q1/5424B 2
(OSC SLAVE2)
I2C WRITE
1
1
0
1
1
1
0
0
0xDC
I2C READ
1
1
0
1
1
1
0
1
0xDD
I C WRITE
1
1
0
1
1
1
1
0
0xDE
I2C READ
1
1
0
1
1
1
1
1
0xDF
TAS5414B-Q1/5424B 3
(OSC SLAVE3)
2
0xD8
Table 4. I2C Address Register Definitions
ADDRESS
R/W
0x00
R
Latched fault register 1, global and channel fault
REGISTER DESCRIPTION
0x01
R
Latched fault register 2, dc offset and overcurrent detect
0x02
R
Latched diagnostic register 1, load diagnostics
0x03
R
Latched diagnostic register 2, load diagnostics
0x04
R
External status register 1, temperature and voltage detect
0x05
R
External status register 2, Hi-Z and low-low state
0x06
R
External status register 3, mute and play modes
0x07
R
External status register 4, load diagnostics
0x08
R/W
External control register 1, channel gain select
0x09
R/W
External control register 2, over current control
0x0A
R/W
External control register 3, switching frequency and clip pin select
0x0B
R/W
External control register 4, load diagnostic, master mode select
0x0C
R/W
External control register 5, output state control
0x0D
R/W
External control register 6, output state control
0x0E, 0x0F
-
0x10
R/W
0x13
R
Not Used
External control register 7, DC detect threshold selection
External status register 5, over temperature shutdown and thermal foldback
Table 5. Fault Register 1 (0x00) Protection
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
No protection-created faults, default value
FUNCTION
–
–
–
–
–
–
–
1
Overtemperature warning has occurred
–
–
–
–
–
–
1
–
DC offset has occurred in any channel
–
–
–
–
–
1
–
–
Overcurrent shutdown has occurred in any channel
–
–
–
–
1
–
–
–
Overtemperature shutdown has occurred
–
–
–
1
–
–
–
–
Charge pump undervoltage has occurred
–
–
1
–
–
–
–
–
AVDD, analog voltage, undervoltage has occurred
–
1
–
–
–
–
–
–
PVDD undervoltage has occurred
1
–
–
–
–
–
–
–
PVDD overvoltage has occurred
Table 6. Fault Register 2 (0x01) Protection
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
No protection-created faults, default value
–
–
–
–
–
–
–
1
Overcurrent shutdown channel 1 has occurred
Copyright © 2011, Texas Instruments Incorporated
FUNCTION
21
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Table 6. Fault Register 2 (0x01) Protection (continued)
D7
D6
D5
D4
D3
D2
D1
D0
–
–
–
–
–
–
1
–
Overcurrent shutdown channel 2 has occurred
FUNCTION
–
–
–
–
–
1
–
–
Overcurrent shutdown channel 3 has occurred
–
–
–
–
1
–
–
–
Overcurrent shutdown channel 4 has occurred
–
–
–
1
–
–
–
–
DC offset channel 1 has occurred
–
–
1
–
–
–
–
–
DC offset channel 2 has occurred
–
1
–
–
–
–
–
–
DC offset channel 3 has occurred
1
–
–
–
–
–
–
–
DC offset channel 4 has occurred
Table 7. Diagnostic Register 1 (0x02) Load Diagnostics
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
No load-diagnostic-created faults, default value
FUNCTION
–
–
–
–
–
–
–
1
Output short to ground channel 1 has occurred
–
–
–
–
–
–
1
–
Output short to PVDD channel 1 has occurred
–
–
–
–
–
1
–
–
Shorted load channel 1 has occurred
–
–
–
–
1
–
–
–
Open load channel 1 has occurred
–
–
–
1
–
–
–
–
Output short to ground channel 2 has occurred
–
–
1
–
–
–
–
–
Output short to PVDD channel 2 has occurred
–
1
–
–
–
–
–
–
Shorted load channel 2 has occurred
1
–
–
–
–
–
–
–
Open load channel 2 has occurred
Table 8. Diagnostic Register 2 (0x03) Load Diagnostics
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
No load-diagnostic-created faults, default value
FUNCTION
–
–
–
–
–
–
–
1
Output short to ground channel 3 has occurred
–
–
–
–
–
–
1
–
Output short to PVDD channel 3 has occurred
–
–
–
–
–
1
–
–
Shorted load channel 3 has occurred
–
–
–
–
1
–
–
–
Open load channel 3 has occurred
–
–
–
1
–
–
–
–
Output short to ground channel 4 has occurred
–
–
1
–
–
–
–
–
Output short to PVDD channel 4 has occurred
–
1
–
–
–
–
–
–
Shorted load channel 4 has occurred
1
–
–
–
–
–
–
–
Open load channel 4 has occurred
Table 9. External Status Register 1 (0x04) Fault Detection
22
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
No protection-created faults are present, default value
FUNCTION
–
–
–
–
–
–
–
1
PVDD overvoltage fault is present
–
–
–
–
–
–
1
–
PVDD undervoltage fault is present
–
–
–
–
–
1
–
–
AVDD, analog voltage fault is present
–
–
–
–
1
–
–
–
Charge-pump voltage fault is present
–
–
–
1
–
–
–
–
Overtemperature shutdown is present
–
–
1
–
–
–
–
–
Overtemperature warning
–
1
1
–
–
–
–
–
Overtemperature warning level 1
1
0
1
–
–
–
–
–
Overtemperature warning level 2
1
1
1
–
–
–
–
–
Overtemperature warning level 3
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Table 10. External Status Register 2 (0x05) Output State of Individual Channels
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
1
1
1
1
Output is in Hi-Z mode, not in low-low mode(1), default value
–
–
–
–
–
–
–
0
Channel 1 Hi-Z mode (0 = not Hi-Z, 1 = Hi-Z)
–
–
–
–
–
–
0
–
Channel 2 Hi-Z mode (0 = not Hi-Z, 1 = Hi-Z)
–
–
–
–
–
0
–
–
Channel 3 Hi-Z mode (0 = not Hi-Z, 1 = Hi-Z)
–
–
–
–
0
–
–
–
Channel 4 Hi-Z mode (0 = not Hi-Z, 1 = Hi-Z)
–
–
–
1
–
–
–
–
Channel 1 low-low mode (0 = not low-low, 1 = low-low) (1)
–
–
1
–
–
–
–
–
Channel 2 low-low mode (0 = not low-low, 1 = low-low)(1)
–
1
–
–
–
–
–
–
Channel 3 low-low mode (0 = not low-low, 1 = low-low)(1)
1
–
–
–
–
–
–
–
Channel 4 low-low mode (0 = not low-low, 1 = low-low)(1)
(1)
FUNCTION
Low-low is defined as both outputs actively pulled to ground.
Table 11. External Status Register 3 (0x06) Play and Mute Modes
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
Mute mode is disabled, play mode disabled, default value, (Hi-Z mode)
FUNCTION
–
–
–
–
–
–
–
1
Channel 1 play mode is enabled
–
–
–
–
–
–
1
–
Channel 2 play mode is enabled
–
–
–
–
–
1
–
–
Channel 3 play mode is enabled
–
–
–
–
1
–
–
–
Channel 4 play mode is enabled
–
–
–
1
–
–
–
–
Channel 1 mute mode is enabled
–
–
1
–
–
–
–
–
Channel 2 mute mode is enabled
–
1
–
–
–
–
–
–
Channel 3 mute mode is enabled
1
–
–
–
–
–
–
–
Channel 4 mute mode is enabled
Table 12. External Status Register 4 (0x07) Load Diagnostics
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
No channels are set in load diagnostics mode, default value
FUNCTION
–
–
–
–
–
–
–
1
Channel 1 is in load diagnostics mode
–
–
–
–
–
–
1
–
Channel 2 is in load diagnostics mode
–
–
–
–
–
1
–
–
Channel 3 is in load diagnostics mode
–
–
–
–
1
–
–
–
Channel 4 is in load diagnostics mode
–
–
–
1
–
–
–
–
Channel 1 is in Over Temperature Foldback
–
–
1
–
–
–
–
–
Channel 2 is in Over Temperature Foldback
–
1
–
–
–
–
–
–
Channel 3 is in Over Temperature Foldback
1
–
–
–
–
–
–
–
Channel 4 is in Over Temperature Foldback
Table 13. External Control Register 1 (0x08) Gain Select
D7
D6
D5
D4
D3
D2
D1
D0
1
0
1
0
1
0
1
0
Set gain for all channels to 26 dB, default value
–
–
–
–
–
–
0
0
Set channel 1 gain to 12 dB
–
–
–
–
–
–
0
1
Set channel 1 gain to 20 dB
–
–
–
–
–
–
1
1
Set channel 1 gain to 32 dB
–
–
–
–
0
0
–
–
Set channel 2 gain to 12 dB
–
–
–
–
0
1
–
–
Set channel 2 gain to 20 dB
–
–
–
–
1
1
–
–
Set channel 2 gain to 32 dB
–
–
0
0
–
–
–
–
Set channel 3 gain to 12 dB
–
–
0
1
–
–
–
–
Set channel 3 gain to 20 dB
–
–
1
1
–
–
–
–
Set channel 3 gain to 32 dB
Copyright © 2011, Texas Instruments Incorporated
FUNCTION
23
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Table 13. External Control Register 1 (0x08) Gain Select (continued)
D7
D6
D5
D4
D3
D2
D1
D0
0
0
–
–
–
–
–
–
Set channel 4 gain to 12 dB
FUNCTION
0
1
–
–
–
–
–
–
Set channel 4 gain to 20 dB
1
1
–
–
–
–
–
–
Set channel 4 gain to 32 dB
Table 14. External Control Register 2(0x09) Over Current Control
D7
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
0
0
0
0
FUNCTION
Current Limit Level 2 for all channels
0
Set Channel 1 Over Current Limit ( 0 - level 1, 1 - level 2)
0
Set Channel 2Over Current Limit ( 0 - level 1, 1 - level 2)
0
Set Channel 3Over Current Limit ( 0 - level 1, 1 - level 2)
0
Set Channel 4Over Current Limit ( 0 - level 1, 1 - level 2)
X
X
X
X
Reserved
Table 15. External Control Register 3 (0x0A) Switching Frequency Select and Clip_OTW Configuration
D7
D6
D5
D4
D3
D2
D1
D0
FUNCTION
0
0
0
0
1
1
0
1
Set fS = 417 kHz, report clip and OTW, 45° phase, disable hard stop
–
–
–
–
–
–
0
0
Set fS = 500 kHz
–
–
–
–
–
–
1
0
Set fS = 357 kHz
–
–
–
–
–
–
1
1
Invalid frequency selection (do not set)
–
–
–
–
0
0
–
–
Configure CLIP_OTW pin to report tweeter detect only
–
–
–
–
0
1
–
–
Configure CLIP_OTW pin to report clip detect only
–
–
–
–
1
0
–
–
Configure CLIP_OTW pin to report overtemperature warning only
–
–
–
1
–
–
–
–
Enable hard-stop mode
–
–
1
–
–
–
–
–
Set fS to a 180° phase difference between adjacent channels
–
1
–
–
–
–
–
–
Send Sync Pulse from OSC_SYNC pin (Device must be in master mode)
X
–
–
–
–
–
–
–
Reserved
Table 16. External Control Register 4 (0x0B) Load Diagnostics and Master/Slave Control
D7
D6
D5
D4
D3
D2
D1
D0
0
1
0
1
0
0
0
0
Clock output disabled, Master clock mode, DC Detection Enabled, Load
diagnostics disabled
FUNCTION
–
–
–
–
–
–
–
1
Run channel 1 load diagnostics
–
–
–
–
–
–
1
–
Run channel 2 load diagnostics
–
–
–
–
–
1
–
–
Run channel 3 load diagnostics
–
–
–
–
1
–
–
–
Run channel 4 load diagnostics
–
–
–
0
–
–
–
–
Disable dc detection on all channels
–
–
1
–
–
–
–
–
Enable tweeter-detect mode
–
0
–
–
–
–
–
–
Enable slave mode (external oscillator must be provided)
1
–
–
–
–
–
–
–
Enable clock output on OSC_SYNC pin (valid only in master mode)
Table 17. External Control Register 5 (0x0C) Output Control
24
D7
D6
D5
D4
D3
D2
D1
D0
FUNCTION
0
0
0
1
1
1
1
1
All channels, Hi-Z, mute, reset disabled
–
–
–
–
–
–
–
0
Set channel 1 to mute mode, non-Hi-Z
–
–
–
–
–
–
0
–
Set channel 2 to mute mode, non-Hi-Z
–
–
–
–
–
0
–
–
Set channel 3 to mute mode, non-Hi-Z
–
–
–
–
0
–
–
–
Set channel 4 to mute mode, non-Hi-Z
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Table 17. External Control Register 5 (0x0C) Output Control (continued)
D7
D6
D5
D4
D3
D2
D1
D0
–
–
–
0
–
–
–
–
Set non-Hi-Z channels to play mode, (unmute)
FUNCTION
–
1
1
–
–
–
–
–
Reserved
1
–
–
–
–
–
–
–
Reset device
Table 18. External Control Register 6 (0x0D) Output Control
D7
D6
D5
D4
D3
D2
D1
D0
FUNCTION
0
0
0
0
0
0
0
0
Low-low state disabled all channels
–
–
–
–
–
–
–
1
Set channel 1 to low-low state
–
–
–
–
–
–
1
–
Set channel 2 to low-low state
–
–
–
–
–
1
–
–
Set channel 3 to low-low state
–
–
–
–
1
–
–
–
Set channel 4 to low-low state
X
X
X
X
–
–
–
–
Reserved
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
1
Normal speed CM ramp, normal S2P & S2G timing, no delay between
LDG phases, Crosstalk Enhancement Disabled, Default DC detect value
(1.6V)
-
-
-
-
-
-
0
0
Minimum DC detect value (0.8V)
-
-
-
-
-
-
1
0
Maximum DC detect value (2.4V)
-
-
-
-
-
1
-
-
Enable Crosstalk Enhancement
-
-
-
-
1
-
-
-
Adds a 20mS delay between load diagnostic phases
-
-
-
1
-
-
-
-
Short-to-Power (S2P) and Short-to-Ground (S2G) Load Diagnostic
phases take 4x longer
1
-
-
-
-
-
-
-
Slower common mode (CM) ramp down from Mute mode
X
X
Table 19. External Control Register 7 (0x10) Miscellaneous Selection
FUNCTION
Reserved
Table 20. External Status Register 5 (0x13) Over Temperature and Thermal Foldback Status
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
Default Over temperature foldback status, no channel is in foldback
FUNCTION
0
0
0
0
0
0
0
1
Channel 1 in thermal foldback
0
0
0
0
0
0
1
0
Channel 2 in thermal foldback
0
0
0
0
0
1
0
0
Channel 3 in thermal foldback
0
0
0
0
1
0
0
0
Channel 4 in thermal foldback
0
0
0
1
0
0
0
0
Channel 1 in Over temperature shutdown
0
0
1
0
0
0
0
0
Channel 2 in Over temperature shutdown
0
1
0
0
0
0
0
0
Channel 3 in Over temperature shutdown
1
0
0
0
0
0
0
0
Channel 4 in Over temperature shutdown
Hardware Control Pins
There are four discrete hardware pins for real-time control and indication of device status.
FAULT pin: This active-low open-drain output pin indicates the presence of a fault condition that requires the
device to go into the Hi-Z mode or standby mode. When this pin is asserted, the device has protected itself
and the system from potential damage. The exact nature of the fault can be read via I2C with the exception
of PVDD under-voltage faults below POR in which case the I2C bus is no longer operational. However, the
fault is still indicated due to the fact that the FAULT pin is asserted.
Copyright © 2011, Texas Instruments Incorporated
25
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
CLIP_OTW pin: This active-low open-drain pin is configured via I2C to indicate one of the following
conditions: overtemperature warning, the detection of clipping, or the logical OR of both of these conditions.
During tweeter detect diagnostics, this pin also is asserted when a tweeter is present.
MUTE pin: This active-low pin is used for hardware control of the mute/unmute function for all four channels.
Capacitor CMUTE is used to control the time constant for the gain ramp needed to produce a pop- and
click-free mute function. For pop- and click-free operation, the mute function should be implemented through
I2C commands. The use of a hard mute with an external transistor does not ensure pop- and click-free
operation, and is not recommended unless an emergency hard mute function is required in case of a loss of
I2C control. The CMUTE capacitor may not be shared between multiple devices.
STANDBY pin: When this active-low pin is asserted, the device goes into a complete shutdown, and current
draw is limited to 2 μA, typical. It can be used to shut down the device rapidly. If all channels are in Hi-Z the
device will enter standby in ~1mS and if not a quick ramp down will occur that takes ~20mS. The outputs are
ramped down quickly if not already in Hi-Z so externally biasing the MUTE pin will prevent the device from
entering standby. All I2C register content is lost when this pin is asserted. The I2C bus goes into the
high-impedance state when the STANDBY pin is asserted.
EMI Considerations
Automotive level EMI performance depends on both careful integrated circuit design and good system level
design. Controlling sources of electromagnetic interference (EMI) was a major consideration in all aspects of the
design.
The design has minimal parasitic inductances due to the short leads on the package. This dramatically reduces
the EMI that results from current passing from the die to the system PCB. Each channel also operates at a
different phase. The phase between channels is I2C selectable to either 45° or 180°, to reduce EMI caused by
high-current switching. The design also incorporates circuitry that optimizes output transitions that cause EMI.
AM Radio Avoidance
To reduce interference in the AM radio band, the device has the ability to change the switching frequency via I2C
commands. The recommended frequencies are listed in Table 21. The fundamental frequency and its second
harmonic straddle the AM radio band listed. This eliminates the tones that can be present due to the switching
frequency being demodulated by the AM radio.
Table 21. Recommended Switching Frequencies for AM Mode Operation
US
EUROPEAN
AM FREQUENCY
(kHz)
SWITCHING
FREQUENCY
(kHz)
AM FREQUENCY
(kHz)
SWITCHING
FREQUENCY
(kHz)
540 - 670
417
522 - 675
417
680 - 980
500
676 - 945
500
990 - 1180
417
946 - 1188
417
1190 - 1420
500
1189 - 1422
500
1430 - 1580
417
1423 - 1584
417
1590 – 1700
500
1585 - 1701
500
Operating Modes and Faults
The operating modes and faults are depicted in the following tables.
Table 22. Operating Modes
OUTPUT FETS
CHARGE PUMP
OSCILLATOR
I2C
AVDD and DVDD
STANDBY
Hi-Z, floating
Stopped
Stopped
Stopped
OFF
Hi-Z
Hi-Z, weak pulldown
Active
Active
Active
ON
Mute
Switching at 50%
Active
Active
Active
ON
STATE NAME
26
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Table 22. Operating Modes (continued)
STATE NAME
OUTPUT FETS
CHARGE PUMP
OSCILLATOR
I2C
AVDD and DVDD
Normal operation
Switching with audio
Active
Active
Active
ON
Table 23. Global Faults and Actions
FAULT/
EVENT
FAULT/EVENT
CATEGORY
POR
Voltage fault
UV
REPORTING
METHOD
ACTION
TYPE
ACTION
RESULT
LATCHED/
SELFCLEARING
All
FAULT pin
Hard mute (no ramp)
Standby
Self-clearing
Hi-Z, mute, normal
I2C + FAULT pin
Hi-Z
Latched
MONITORING
MODES
CP UV
OV
Load dump
All
FAULT pin
Standby
Self-clearing
OTW
Thermal warning
Hi-Z, mute, normal
I2C + CLIP_OTW pin
None
None
Self-clearing
OTSD
Thermal fault
Hi-Z, mute, normal
I2C + FAULT pin
Hard mute (no ramp)
Standby
Latched
Table 24. Channel Faults and Actions
FAULT/
EVENT
FAULT/EVENT
CATEGORY
MONITORING
MODES
REPORTING
METHOD
ACTION
TYPE
ACTION
RESULT
LATCHED/
SELFCLEARING
Open/short
diagnostic
Diagnostic
Hi-Z (I2C activated)
I2C
None
None
Latched
Mute / Play
CLIP_OTW pin
Clipping
Warning
CBC load current
limit
Online protection
OC fault
Output channel fault
I2C + FAULT pin
DC detect
OT Foldback
Warning
I2C + CLIP_OTW
pin
None
None
Self-clearing
Current Limit
Start OC
timer
Self-clearing
Hard mute
Hi-Z
Latched
Hard mute
Hi-Z
Latched
Reduce Gain
None
Self-clearing
Audio Shutdown and Restart Sequence
The gain ramp of the filtered output signal and the updating of the I2C registers correspond to the MUTE pin
voltage during the ramping process. The length of time that the MUTE pin takes to complete its ramp is dictated
by the value of the external capacitor on the MUTE pin. With the default 220nF capacitor the turn-on common
mode ramp takes ~26mS and the gain ramp takes ~76mS.
Copyright © 2011, Texas Instruments Incorporated
27
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
tGAIN
www.ti.com
tCM
tCM
tGAIN
HIZ_Report_x
(All Channels)
LOW_LOW_Report_x
(All Channels)
MUTE_Report_x
(All Channels)
PLAY_Report_x
MUTE Pin
OUTx_P (Filtered)
(All Channels)
OUTx_M (Filtered)
(All Channels)
T0192-02
Figure 18. Click- and Pop-Free Shutdown and Restart Sequence Timing Diagram
28
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
Latched Fault Shutdown and Restart Sequence Control
tI2C_CL
tDEGLITCH
tCM
tDEGLITCH
PVDD
UV
Detect
tGAIN
PVDD Normal Operating Region
UV
Reset
VUV + VUV_HY
PVDD UV Hysteresis Region
VUV
VPOR
HIZ_x
2
Internal I C Write
MUTE_Report
UV_DET
Cleared by
2
UV_LATCH
External I C Read
to Fault Register 1
2
External I C Read
FAULT Pin
MUTE Pin
Pop
OUTx_P (Filtered)
T0194-02
Figure 19. Latched Global Fault Shutdown and Restart Timing Diagram
(UV Shutdown and Recovery)
Copyright © 2011, Texas Instruments Incorporated
29
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
tI2C_CL
tDEGLITCH
tCM
tDEGLITCH
PVDD
VUV + VUV_HY
UV
Detect
tGAIN
PVDD Normal Operating Region
UV
Reset
PVDD UV Hysteresis Region
VUV
VPOR
2
HIZ_Report_1
Internal I C Write
HIZ_Report_2,3,4
MUTE_Report
UV_DET
Cleared by
2
UV_LATCH
External I C Read
to Fault Register 1
2
External I C Read
FAULT Pin
MUTE Pin
OUT1_P (Filtered)
OUT2,3,4_P (Filtered)
Pop
Pop
Pop
T0195-02
Figure 20. Latched Global Fault Shutdown and Individual Channel Restart Timing Diagram
(UV Shutdown and Recovery)
30
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
APPLICATION INFORMATION
Figure 21. TAS5414B-Q1 Typical Application Schematic
Parallel Operation (PBTL)
The device can drive more current paralleling BTL channels on the load side of the LC output filter. For parallel
operation, identical I2C settings are required for any two paralleled channels in order to have reliable system
Copyright © 2011, Texas Instruments Incorporated
31
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
performance and even power dissipation on multiple channels. For smooth power up, power down, and mute
operation, the same control commands (such as mute, play, Hi-Z, etc.) should be sent to the paralleled channels
at the same time. Load diagnostic is also supported for parallel connection. Paralleling on the device side of the
LC output filter is not supported, and can result in device failure. When paralleling channels it is important to
monitor channels for thermal foldback and lower the system gain for paralleled channels.
Input Filter Design
For the TAS5424B-Q1 device, the input filter for a single channel's P and M inputs should be identical. For the
TAS5414B-Q1 the IN_M pin should have an impedance to GND that is equivalent to the parallel combination of
the input impedances of all IN_P channels combined, including any source impedance from the previous stage in
the system design. For example, if each of the 4 IN_P channels have a 1uF DC blocking capacitor, 1kΩ of series
resistance due to an input RC filter, and 1kΩ of source resistance from the DAC supplying the audio signal, then
the IN_M channel should have a 4uF capacitor in series with a 500Ω resistor to GND (4 x 1uF in parallel = 4uF;
4 x 2kΩ in parallel = 500Ω).
Demodulation Filter Design
The amplifier outputs are driven by high-current LDMOS transistors in an H-bridge configuration. These
transistors are either fully off or on. The result is a square-wave output signal with a duty cycle that is
proportional to the amplitude of the audio signal. It is recommended that a second-order LC filter be used to
recover the audio signal. The main purpose of the demodulation filter is to attenuate the high-frequency
components of the output signals that are out of the audio band. Design of the demodulation filter significantly
affects the audio performance of the power amplifier. Therefore, to meet the system THD+N needs, the selection
of the inductors used in the output filter should be carefully considered. The rule is that the inductance should
stay above 10% of the inductance value within the range of peak current seen at maximum output power in the
system design.
Line Driver Applications
In many automotive audio applications the end user would like to use the same head unit to drive either a
speaker (with several Ohms of impedance) or an external amplifier (with several kOhms of impedance). The
design is capable of supporting both applications; however, the output filter and system must be designed to
handle the expected output load conditions.
Thermal Information
The thermally augmented package is designed to interface directly to heat sinks using a thermal interface
compound (for example, Artic Silver, Ceramique thermal compound.) The heat sink then absorbs heat from the
ICs and couples it to the local air. If louvers or fans are supplied, this process can reach equilibrium and heat can
be continually removed from the ICs. Because of the device efficiency heat sinks can be smaller than those
required for linear amplifiers of equivalent performance.
RθJA is a system thermal resistance from junction to ambient air. As such, it is a system parameter with the
following components:
• RθJC (the thermal resistance from junction to case, or in this case the heat slug)
• Thermal grease thermal resistance
• Heat sink thermal resistance
The thermal grease thermal resistance can be calculated from the exposed heat slug area and the thermal
grease manufacturer's area thermal resistance (expressed in °C-in2/W or °C-mm2/W). The area thermal
resistance of the example thermal grease with a 0.001-inch (0.0254-mm) thick layer is about 0.007°C-in2/W
(4.52°C-mm2/W). The approximate exposed heat slug size is as follows:
36/44-pin PSOP3
64-pin QFP
0.124 in2 (80 mm2)
0.099 in2 (64 mm2)
Dividing the example thermal grease area resistance by the area of the heat slug gives the actual resistance
through the thermal grease for both parts:
32
Copyright © 2011, Texas Instruments Incorporated
TAS5414B-Q1
TAS5424B-Q1
SLOS673 – DECEMBER 2011
www.ti.com
36/44-pin PSOP3
64-pin QFP
0.06°C/W
0.07°C/W
The thermal resistance of thermal pads is generally considerably higher than a thin thermal grease layer.
Thermal tape has an even higher thermal resistance and should not be used at all. Heat sink thermal resistance
generally is predicted by the heat sink vendor, modeled using a continuous flow dynamics (CFD) model, or
measured.
Thus, for a single monaural channel in the IC, the system RθJA = RθJC + thermal grease resistance + heat sink
resistance.
The following table indicates modeled parameters for one device on a heat sink. The junction temperature is set
at 115°C while delivering 20 Wrms per channel into 4-Ω loads with no clipping. It is assumed that the thermal
grease is about 0.001 inches (0.0254 mm) thick.
Device
36-Pin PSOP3
Ambient temperature
25°C
Power to load
20 W × 4
Power dissipation
1.90 W × 4
ΔT inside package
7.6°C
ΔT through thermal grease
0.46°C
Required heatsink thermal resistance
10.78°C/W
Junction temperature
115°C
System RθJA
11.85°C/W
RθJA × power dissipation
90°C
Electrical Connection of Heat Slug and Heat Sink
The heat sink connected to the heat slug of the device should be connected to GND or left floating. The heat
slug should not be connected to any other electrical node.
Copyright © 2011, Texas Instruments Incorporated
33
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
Top-Side Markings
(4)
TAS5414BTDKDRQ1
ACTIVE
HSSOP
DKD
36
500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-245C-168 HR
-40 to 105
TAS5414BQ1
TAS5414BTPHDQ1
ACTIVE
HTQFP
PHD
64
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
TAS5414BTQ1
TAS5414BTPHDRQ1
ACTIVE
HTQFP
PHD
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
TAS5414BTQ1
TAS5424BTDKDRQ1
ACTIVE
HSSOP
DKD
44
500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-245C-168 HR
-40 to 105
TAS5424BQ1
TAS5424BTDKERQ1
ACTIVE
HSSOP
DKE
44
500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-245C-168 HR
-40 to 105
TAS5424BQ1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
HSSOP
DKD
36
500
330.0
24.4
TAS5414BTPHDRQ1
HTQFP
PHD
64
1000
330.0
TAS5424BTDKDRQ1
HSSOP
DKD
44
500
330.0
TAS5424BTDKERQ1
HSSOP
DKE
44
500
330.0
TAS5414BTDKDRQ1
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
14.7
16.4
4.0
20.0
24.0
Q1
24.4
17.0
17.0
1.5
20.0
24.0
Q2
24.4
14.7
16.4
4.0
20.0
24.0
Q1
24.4
14.7
16.4
4.0
20.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TAS5414BTDKDRQ1
HSSOP
DKD
TAS5414BTPHDRQ1
HTQFP
PHD
36
500
350.0
350.0
43.0
64
1000
350.0
350.0
43.0
TAS5424BTDKDRQ1
HSSOP
TAS5424BTDKERQ1
HSSOP
DKD
44
500
350.0
350.0
43.0
DKE
44
500
350.0
350.0
43.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PHD 64
HTQFP - 1.20 mm max height
QUAD FLATPACK
14 x 14, 0.8 mm pitch
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224851/A
www.ti.com
PACKAGE OUTLINE
HTQFP - 1.2 mm max height
PHD0064B
PLASTIC QUAD FLATPACK
14.05
13.95
NOTE 3
PIN 1 ID
64
8.00
6.68
B
49
48
1
THERMAL PAD
4
14.05
13.95
NOTE 3
16.15
15.85
TYP
8.00
6.68
16
32
17
A
33
64 X 0.40
0.30
60 X 0.8
4 X 12
0.2
SEE DETAIL A
C A B
C
1.2 MAX
SEATING PLANE
(0.127) TYP
17
32
16
33
0.25
GAGE PLANE
(1)
0°-7°
0.75
0.45
1
48
64
49
0.1 C
0.15
0.05
DETAIL A
TYPICAL
4224850/A 05/2019
NOTES:
1.
2.
3.
4.
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
This drawing is subject to change without notice.
This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed
0.15 per side.
See technical brief. PowerPad Thermally Enhanced Package, Texas Instruments Literature No. SLMA002
(www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004) for information regarding recommended board layout.
www.ti.com
EXAMPLE BOARD LAYOUT
HTQFP - 1.2 mm max height
PHD0064B
PLASTIC QUAD FLATPACK
SYMM
49
64
64 X (1.5)
1
48
64 X (0.55)
60 X (0.8)
SYMM
(15.4)
33
(R0.05) TYP
16
32
17
(15.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 6X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
EXPOSED
METAL
EXPOSED
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4224850/A 05/2019
NOTES: (continued)
5.
6.
7.
Publication IPC-7351 may have alternate designs.
Solder mask tolerances between and around signal pads can vary based on board fabrication site.
Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
HTQFP - 1.2 mm max height
PHD0064B
PLASTIC QUAD FLATPACK
SYMM
49
64
64 X (1.5)
1
48
64 X (0.55)
60 X (0.8)
SYMM
(15.4)
33
(R0.05) TYP
16
32
17
(15.4)
SOLDER PASTE EXAMPLE
SCALE: 6X
4224850/A 05/2019
NOTES: (continued)
7.
8.
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
Board assembly site may have different recommendations for stencil design.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
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damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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