Texas Instruments | PGA4311: 4-Channel Audio Volume Control (Rev. A) | Datasheet | Texas Instruments PGA4311: 4-Channel Audio Volume Control (Rev. A) Datasheet

Texas Instruments PGA4311: 4-Channel Audio Volume Control (Rev. A) Datasheet
 SBOS230A − MARCH 2002 − REVISED JUNE 2002
FEATURES
D DIGITALLY-CONTROLLED ANALOG VOLUME
D
D
D
D
D
D
APPLICATIONS
D AUDIO AMPLIFIERS
D MIXING CONSOLES
D MULTI−TRACK RECORDERS
D BROADCAST STUDIO EQUIPMENT
D MUSICAL INSTRUMENTS
D EFFECTS PROCESSORS
D A/V RECEIVERS
D CAR AUDIO SYSTEMS
CONTROL:
Four Independent Audio Channels
Serial Control Interface
Zero Crossing Detection
Mute Function
WIDE GAIN AND ATTENUATION RANGE:
+31.5dB to −95.5dB with 0.5dB Steps
LOW NOISE AND DISTORTION:
120dB Dynamic Range
0.0004% THD+N at 1kHz (U−Grade)
0.0002% THD+N at 1kHz (A−Grade)
NOISE-FREE LEVEL TRANSITIONS
LOW INTERCHANNEL CROSSTALK:
−130dBFS
POWER SUPPLIES: ±5V Analog, +5V Digital
AVAILABLE IN AN SOP-28 PACKAGE
DESCRIPTION
The PGA4311 is a high−performance, 4-channel audio
volume control designed for professional and high-end
consumer audio systems. Using high performance
operational amplifier stages internal to the PGA4311
yields low noise and distortion, while providing the
capability to drive 600Ω loads directly without buffering.
The 3-wire serial control interface allows for connection
to a wide variety of host controllers, in addition to
support for daisy-chaining of multiple PGA4311
devices.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
! " # ! ! $ %&#
! ' & ' !#
1
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Copyright  2002, Texas Instruments Incorporated
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, VA+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.5V
VA− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −5.5V
VD+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.5V
VA+ to VD+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . < ± 0.3V
Analog Input Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to VA+, VA−
Digital Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . −0.3V to VD+
Operating Temperature Range . . . . . . . . . . . . . . . . −40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . +300°C
Package Temperature (IR reflow, 10s) . . . . . . . . . . . . . . . . . +235°C
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe proper handling and installation procedures can
cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause
the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PACKAGE−LEAD
PACKAGE
DESIGNATOR(1)
OPERATING
TEMPERATURE
RANGE
PGA4311 (U−Grade)
SOP−28
DW
−40°C to +85°C
PGA4311 (A−Grade)
SOP−28
DW
−40°C to +85°C
PRODUCT
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PGA4311U
PGA4311U
Rails
PGA4311U
PGA4311U/1K
Tape and Reel, 1000
PGA4311UA
PGA4311UA
Rails
PGA4311UA
PGA4311UA/1K
Tape and Reel, 1000
(1) For the most current specifications and package information, refer to our web site at www. ti.com.
ELECTRICAL CHARACTERISTICS
At TA = +25°C, VA+ = +5V, VA− = −5V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted.
PGA4311U (U−Grade)
PARAMETER
CONDITIONS
MIN
TYP
MAX
PGA4311UA (A−Grade)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Step Size
0.5
0.5
dB
±0.05
±0.05
dB
±0.05
±0.05
dB
Input Resistance
10
10
kΩ
Input Capacitance
3
3
pF
Gain Error
Gain Setting = 31.5dB
Gain Matching
AC CHARACTERISTICS
THD+N
Dynamic Range
VIN = 2Vrms, f = 1kHz
VIN = AGND, Gain = 0dB
Voltage Range, Input (without clipping)
Interchannel Crosstalk
0.001
120
(VA−) +
1.25
Voltage Range, Output
Output Noise
0.0004
116
(VA+) −
1.25
2.5
VIN = AGND, Gain = 0dB
f = 1kHz
2.5
−130
VIN = AGND, Gain = 0dB
0.25
0.0002
116
0.0004
120
(VA−) +
1.25
(VA+) −
1.25
V
4
µVrms
2.5
4
2.5
%
dB
Vrms
−130
dBFS
OUTPUT BUFFER
Offset Voltage
0.5
0.25
0.5
mV
Load Capacitance Stability
100
100
pF
Short−Circuit Current
50
50
mA
Unity−Gain Bandwidth, Small Signal
10
10
MHz
2
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
ELECTRICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VA+ = +5V, VA− = −5V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted.
PGA4311U (U−Grade)
PARAMETER
CONDITIONS
MIN
TYP
PGA4311UA (A−Grade)
MAX
MIN
VD+
0.8
+2.0
TYP
MAX
UNITS
DIGITAL CHARACTERISTICS
High−Level Input Voltage, VIH
+2.0
Low−Level Input Voltage, VIL
−0.3
High−Level Output Voltage, VOH
IO = 200µA
Low−Level Output Voltage, VOL
IO = −3.2mA
(VA+) −
1.0
VD+
0.8
−0.3
(VD+) −
1.0
1
10
V
V
0.4
Input Leakage Current
V
1
0.4
V
10
µA
6.25
MHz
SWITCHING CHARACTERISTICS
Serial Clock (SCLK) Frequency
Serial Clock (SCLK) Pulse Width LOW
Serial Clock (SCLK) Pulse Width HIGH
MUTE Pulse Width LOW
fSCLK
tPH
0
6.25
0
80
80
80
80
ns
2.0
2.0
ms
tSDS
tSDH
20
20
ns
20
20
ns
tCSCR
tCFCS
90
90
ns
35
35
ns
tPL
tMI
ns
Input Timing
SDI Setup Time
SDI Hold Time
CS Falling to SCLK Rising
SCLK Falling to CS Rising
Output Timing
CS LOW to SDO Active
SCLK Falling to SDO Data Valid
CS HIGH to SDO High Impedance
tCSO
tCFDO
tCSZ
35
35
ns
60
60
ns
100
100
ns
POWER SUPPLY
Operating Voltage
VA+
VA−
+4.75
+5
+5.25
+4.75
+5
+5.25
V
−4.75
−5
−5.25
−4.75
−5
−5.25
V
+4.75
+5
+5.25
+4.75
+5
+5.25
V
VA+ = +5V
VA− = −5V
17
22
17
22
mA
19
24
19
24
mA
VD+ = +5V
0.5
1.0
0.5
1.0
mA
VD+
Quiescent Current
IA+
IA−
ID+
Power−Supply Rejection Ratio PSRR (250Hz)
100
100
dB
TEMPERATURE RANGE
Operating Range
−40
+85
−40
+85
°C
Storage Range
−65
+150
−65
+150
°C
3
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
PIN CONFIGURATION
Top View
PIN ASSIGNMENTS
SO
PIN
NAME
FUNCTION
1
MUTE
Mute Control Input (Active LOW)
2
AGND_1
Analog Ground, Channel 1
3
AIN_1
AGND_1
Analog Input, Channel 1
AOUT_1
VA−
Analog Output, Channel 1
Analog Power Supply, +5V
8
VA+
AOUT_3
9
AGND_3
Analog Ground, Channel 3
10
AIN_3
AGND_3
Analog Input, Channel 3
4
5
6
7
11
12
Analog Power Supply, −5V
Analog Output, Channel 3
Analog Ground, Channel 3
Digital Power Supply, +5V
13
VD+
SDI
14
CS
Chip Select Input
15
SCLK
Serial Clock Input
16
SDO
Serial Data Output
17
DGND
18
AGND_4
Analog Ground, Channel 4
19
AIN_4
AGND_4
Analog Input, Channel 4
AOUT_4
VA+
Analog Output, Channel 4
Analog Power Supply, −5V
24
VA−
AOUT_2
25
AGND_2
Analog Ground, Channel 2
26
Analog Input, Channel 2
27
AIN_2
AGND_2
28
ZCEN
20
21
22
23
4
Analog Ground, Channel 1
Serial Data Input
Digital Ground
Analog Ground, Channel 4
Analog Power Supply, +5V
Analog Output, Channel 2
Analog Ground, Channel 2
Zero Crossing Enable (Active HIGH)
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
TYPICAL CHARACTERISTICS
At TA = +25°C, VA+ = +5V, VA− = −5V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted.
(NOTE: All plots taken with PGA4311 A−Grade.)
5
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VA+ = +5V, VA− = −5V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted.
(NOTE: All plots taken with PGA4311 A−Grade.)
GENERAL DESCRIPTION
POWER−UP STATE
The PGA4311 is a four-channel audio volume control.
It may be used in a wide array of professional and
consumer audio equipment. The PGA4311 is fabricated
in a sub-micron CMOS process.
The heart of the PGA4311 is a resistor network, an analog
switch array, and a high-performance op amp stage. The
switches are used to select taps in the resistor network
that, in turn, determine the gain of the amplifier stage.
Switch selections are programmed using a serial control
port. The serial port allows connection to a wide variety of
host controllers. See Figure 1 for a functional block
diagram of the PGA4311.
On power up, “power-up reset” is activated for about
100ms during which the circuit is in hardware MUTE state
and all internal flip-flops are reset. At the end of this period,
the offset calibration is initiated without any external signals.
Once this has been completed, the gain byte value for all
channels are set to 00HEX, or the software MUTE condition. The gain will remain at this setting until the host controller programs new settings for for each channel via the
serial control port.
6
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
Figure 1. PGA4311 Block Diagram.
If during normal operation the power supply voltage
drops below ±3.2V, the circuit enters a hardware MUTE
state. A power-up sequence will be initiated if the
power-supply voltage returns to greater than ±3.2V.
ANALOG INPUTS AND OUTPUTS
The PGA4311 includes four independent channels.
Each channel has a corresponding input and output pin.
The input and output pins are unbalanced, and referenced to analog ground.
The input and output pins may swing within 1.25V of the
analog power supplies, VA+ and VA−. Given VA+ = +5V
and VA− = −5V, the maximum input or output voltage
range is 7.5Vp-p.
For optimal performance, it is best to drive the PGA4311
with a low source impedance. A source impedance of
600Ω or less is recommended. Source impedances up
to 2kΩ will cause minimal degradation of THD+N. Please
refer to the “THD+N vs Source Impedance” plot in the
Typical Characteristics section of the datasheet.
7
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
SERIAL CONTROL PORT
The serial control port is utilized to program the gain settings for the PGA4311. The serial control port includes
three input pins and one output pin. The inputs include
CS (pin 14), SDI (pin 13), and SCLK (pin 15). The sole
output pin is SDO (pin 16).
The CS pin functions as the chip select input. Data may
be written to the PGA4311 only when CS is LOW. SDI
is the serial data input pin. Control data is provided as
a 32-bit word at the SDI pin, 8 bits each for each channel gain setting.
Data is formatted as MSB first, straight binary code.
SCLK is the serial clock input. Data is clocked into SDI
on the rising edge of SCLK.
SDO is the serial data output pin, and is used when
daisy-chaining multiple PGA4311 devices. Daisy-chain
operation is described in detail later in this section. SDO
is a tri-state output, and assumes a high impedance state
when CS is HIGH. Data appears at SDO on the falling
edge of SCLK.
The protocol for the serial control port is shown in
Figure 2. See Figure 3 for detailed timing specifications for the serial control port.
Gain Byte Format is MSB First, Straight Binary
0 is the Least Significant Bit of the Channel Gain Byte
7 is the Most Significant Bit of the Channel Gain Byte
SDI is latched on the rising edge of SCLK.
SDO transitions on the falling edge of SCLK.
Figure 2. Serial Interface Protocol.
8
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
Figure 3. Serial Interface Timing Requirements.
GAIN SETTINGS
For N = 1 to 255:
The gain for each channel is set by its corresponding
8-bit code, [7:0] (see Figure 2). The gain code data is
straight binary format. If we let N equal the decimal
equivalent of [7:0], then the following relationships exist for the gain settings:
For N = 0:
Mute Condition. The input multiplexer is connected to
analog ground.
Gain (dB) = 31.5 − [0.5 w (255 − N)]
This results in a gain range of +31.5dB (with N = 255)
to −95.5dB (with N = 1).
Changes in gain setting may be made with or without
zero crossing detection. The operation of the zero
crossing detector and timeout circuitry is discussed later in this data sheet.
9
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
DAISY-CHAINING MULTIPLE PGA4311 DEVICES
In order to reduce the number of control signals required to support multiple PGA4311 devices on a
printed circuit board, the serial control port supports
daisy-chaining of multiple PGA4311 devices. Figure 4
shows the connection requirements for daisy-chain
operation. This arrangement allows a 3-wire serial interface to control many PGA4311 devices.
As shown in Figure 4, the SDO pin from device #1 is connected to the SDI input of device #2, and is repeated for
additional devices. This in turn forms a large shift register, in which gain data may be written for all PGA4311s
connected to the serial bus. The length of the shift register is 32 • N bits, where N is equal to the number of
PGA4311 devices included in the chain. The CS input
must remain LOW for 32 • N SCLK periods, where N is
the number of devices connected in the chain, in order
to allow enough SCLK cycles to load all devices.
Figure 4. Daisy-Chaining Multiple PGA4311 Devices.
10
ZERO CROSSING DETECTION
The PGA4311 includes a zero crossing detection function that can provide for noise-free level transitions.
The concept is to change gain settings on a zero crossing of the input signal, thus minimizing audible glitches.
This function is enabled or disabled using the ZCEN input. When ZCEN is LOW, zero crossing detection is
disabled. When ZCEN is HIGH, zero crossing detection will be enabled.
The zero crossing detection takes effect with a change
in gain setting for a corresponding channel. The new
gain setting will not be implemented until either positive
slope zero crossing is detected or a time-out period of
16ms has elapsed. In the case of a time-out, the new
gain setting takes effect with no attempt to minimize
audible artifacts.
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
MUTE FUNCTION
APPLICATIONS INFORMATION
Muting can be achieved by either hardware or software
control. Hardware muting is accomplished via the
MUTE input, and software muting by loading all zeroes
into the volume control register.
MUTE disconnects the internal buffer amplifiers from
the output pins and terminates the outputs with 10kΩ
resistors to ground. The mute is activated with a zero
crossing detection (independent of the zero cross enable status) or an 16ms time-out to eliminate any audible “clicks” or “pops”. MUTE also initiates an internal
offset calibration.
A software mute is implemented by loading all zeroes
into the volume control register. The internal amplifier
is set to unity gain with the amplifier input connected to
AGND.
This section includes additional information that is pertinent to designing the PGA4311 into an end application.
RECOMMENDED CONNECTION DIAGRAM
Figure 5 depicts the recommended connections for the
PGA4311. Power-supply bypass capacitors should be
placed as close to the PGA4311 package as physically
possible.
PRINTED CIRCUIT BOARD (PCB) LAYOUT GUIDELINES
It is recommended that the ground planes for the digital
and analog sections of the PCB be separate from one
another. The planes should be connected at a single
point. See Figure 6 for the recommended PCB floor
plan for the PGA4311.
Figure 5. Recommended Connection Diagram.
11
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SBOS230A − MARCH 2002 − REVISED JUNE 2002
Figure 6. Typical PCB Layout Floor Plan.
12
PACKAGE OPTION ADDENDUM
www.ti.com
14-Dec-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
PGA4311U
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
PGA4311U
PGA4311U/1K
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
PGA4311U
A
PGA4311U/1KG4
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
PGA4311U
A
PGA4311UA
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
PGA4311U
A
PGA4311UAG4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
PGA4311U
A
PGA4311UG4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
PGA4311U
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Dec-2016
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
PGA4311U/1K
Package Package Pins
Type Drawing
SOIC
DW
28
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
32.4
Pack Materials-Page 1
11.35
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
18.67
3.1
16.0
32.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
PGA4311U/1K
SOIC
DW
28
1000
367.0
367.0
55.0
Pack Materials-Page 2
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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
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