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Texas Instruments TAS2770 Evaluation Module User guides
ECCN: 3E991
User's Guide
SLOU495 – December 2017
TAS2770 Evaluation Module
This user’s guide describes the characteristics, operation, and use of the TAS2770EVM Reference Board.
A complete schematic diagram, printed-circuit board layouts, and bill of materials (BOM) are included in
this document.
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Contents
Export Control Notice........................................................................................................ 2
Description .................................................................................................................... 2
Specifications ................................................................................................................. 2
Software ....................................................................................................................... 2
Mono Setup ................................................................................................................... 3
Multi-Channel Setup ......................................................................................................... 6
Digital Audio Interfaces ..................................................................................................... 7
Hardware Documentation ................................................................................................. 10
List of Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
...................................................................................... 3
Playback Device Settings ................................................................................................... 4
Texas Instruments Audio Control Panel .................................................................................. 4
Multi-Channel Setup ......................................................................................................... 6
USB Audio Input Configuration ............................................................................................ 8
AP or PSIA Input Configuration ............................................................................................ 9
Schematic: XMOS USB Controller ....................................................................................... 10
Schematic: Input Multiplexing and Level Shift .......................................................................... 11
Schematic: External Input and Output Routing ........................................................................ 12
Schematic: TAS2770 Channel 1 Control ................................................................................ 13
Schematic: Onboard Power............................................................................................... 14
PCB: Top Silkscreen ....................................................................................................... 15
PCB: Top Solder Mask .................................................................................................... 16
PCB: Top Copper .......................................................................................................... 17
PCB: Copper Layer 2 ...................................................................................................... 18
PCB: Copper Layer 3 ...................................................................................................... 19
PCB: Bottom Copper ...................................................................................................... 20
PCB: Bottom Solder Mask ................................................................................................ 21
PCB: Bottom Silkscreen ................................................................................................... 22
TAS2770EVM Stereo Configuration
List of Tables
1
Reference Board Specifications ........................................................................................... 2
2
Default Jumper Settings .................................................................................................... 5
3
TAS2770EVM Bill of Materials
...........................................................................................
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Export Control Notice
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Trademarks
PurePath is a trademark of Texas Instruments.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
All other trademarks are the property of their respective owners.
1
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
2
Description
The TAS2770 is a mono digital input Class-D audio amplifier optimized for efficiently driving high peak
power into small loudspeakers. The Class-D amplifier is capable of delivering 18.3 W of peak power into a
4-Ω load while sustaining 1% THD+N at a battery voltage of 13.8 V. Integrated speaker voltage and
current sense provides for real time monitoring of loudspeaker behavior. Up to eight devices can share a
common bus via either I2S, TDM + I2C or SoundwireSM interfaces. Two PDM inputs are provided for low
latency playback or sensor aggregation.
The TAS2770EVM supports evaluation and development with the TAS2770 device through the following
interfaces:
• USB interface
– TAS2770 control through PurePath™ Console 3 (PPC3) GUI, USB-HID
– USB-class audio device, compatible with Microsoft® Windows® 7+
• Digital audio AP and PSIA interface through 100-mil headers
• I2C interface for TAS2770 control
• SoundwireSM interface for TAS2770 control
3
Specifications
Table 1 lists the reference board specifications.
Table 1. Reference Board Specifications
Amplifier power supply (VBAT)
EVM power supply
4.5 to 16 V
IO power supply (IOVDD)
1.65 to 1.95 V
Output power
18.3 W
USB, USB class-audio
4
4.5 to 16 V
Micro-USB B
Software
The TAS2770 EVM is easily configured with PurePath Console 3 running the TAS2770 plug-in.
NOTE: The evaluation driver currently distributed for use with this EVM will periodically inject a tone
into the data stream. This is intentional behavior for this version of the driver. We are in the
process of legal procurement of the full release version of this driver which will resolve this
issue. Once available, it will be provided to the end user.
2
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Mono Setup
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5
Mono Setup
Use the following steps for mono setup:
1. Install PurePath Console 3 with the TAS2770EVM plug-in.
2. Connect a speaker to J10 on the EVM. Alternatively, J20 and J15 can be used for speaker
connections.
3. Attach a power supply to connector J9. There is also an alternate barrel jack connector (J19) adjacent
to this connector.
4. Set jumper J13 to select the desired I2C address for channel 1.
5. Connect the EVM to a Windows 7+ PC with a micro-USB cable (J16).
Figure 1. TAS2770EVM Stereo Configuration
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Mono Setup
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6. Verify that the EVM is the default playback device by opening the sound dialog from the Windows
Control Panel as shown in Figure 2.
Figure 2. Playback Device Settings
7. Set the sampling rate using the Windows setting by opening Properties > Advanced. The
TAS2770EVM supports 44.1-kHz and 48-kHz sampling rates.
8. Set the bit depth as desired using the Texas Instruments USB Audio Control Panel accessible from the
system tray shown in Figure 3.
Figure 3. Texas Instruments Audio Control Panel
9. Configure the device using PPC3.
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Mono Setup
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Refer to Table 2 for the default jumper settings.
Table 2. Default Jumper Settings
Jumper
Setting
J1
3.3V
Description
J2
Remove
Selects TDM input source
J6
Remove
Selects I2C input source
J13
0x82
J11
Remove
J21
Insert
AVDD connect
J22
Insert
IOVDD connect
J18
Insert
VBAT connect
J8
Remove
PDM inputs
SDZ pulldown
Selects I2S or TDM logic level
Selects I2C address
SoundWire address select
J3
Remove
J12
Insert
J4
Remove
IRQZ pullup
J14
Remove
3.3-V SDOUT
FSYNC/I2C Soundwire address enable
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Multi-Channel Setup
6
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Multi-Channel Setup
Use the following for multi-channel setup:
1. Install PurePath Console 3 with the TAS2770EVM plug-in.
2. Connect up to 8 TAS2770 EVMs together using connectors J5 and J7.
3. Attach a power supply to each board.
4. The leftmost board should have jumpers set to match the mono configuration. On all other boards,
insert a jumper on J2 and J6. PPC3 will recognize 1, 2, 4, or 8 channel setups. See Figure 4 for
details.
5. Set Jumper J13 on each board to a unique address.
6. Verify that the EVM is the default playback device by opening the sound dialog from the Windows
Control Panel as shown in Figure 2.
7. Set the sampling rate using the Windows setting by opening Properties > Advanced. The
TAS2770EVM supports 44.1-kHz and 48-kHz sampling rates.
8. Set the bit depth as desired using the Texas Instruments USB Audio Control Panel accessible from the
system tray shown in Figure 3.
9. Configure the device using PPC3.
10. Connect the leftmost EVM to a Windows 7+ PC with a micro-USB cable (J16).
Figure 4. Multi-Channel Setup
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Digital Audio Interfaces
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7
Digital Audio Interfaces
Select the various digital audio interfaces on the TAS2770EVM Reference Board through hardware
settings and software settings. Several headers close to the TAS2770 device allow access to the following
digital audio signals:
• I2S Data out (SDOUT) from the TAS2770 (for example, current and voltage sense data)
• I2S Data in (SDIN) to the TAS2770
• I2S Word clock or frame sync (FSYNC)
• I2S Bit clock (SBCLK)
• PDM Clock (PDMCLK0) – optional input source for TAS2770
• PDM Clock (PDMCLK1) – optional input source for TAS2770
• PDM Data (PDMD0) – optional input source for TAS2770
• PDM Data (PDMD1) – optional input source for TAS2770
• I2C Clock (SCLK)
• I2C Data (SDA)
The TAS2770 device can also be configured for SoundwireSM Mode:
• SoundwireSM clock - SBCLK
• SoundwireSM data - SDOUT
• SoundwireSM address – SDA
• SoundwireSM address – FSYNC
• SoundwireSM address – SCL
A jumper inserted in the SW slot of J13 sets the TAS2770 to SoundwireSM mode. Then J11 can be set as
desired to configure the device address.
The selection between USB (internal) and external inputs is controlled by jumpers J2 and J6. These
jumpers set TDM and I2C, respectively.
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Digital Audio Interfaces
7.1
7.1.1
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Digital Audio Interface Selection
USB
The TAS2770EVM Reference Board contains an XMOS microcontroller that acts as a USB HID and USBclass audio interface. Select USB by removing J2 and J6, as Figure 5 illustrates.
Figure 5. USB Audio Input Configuration
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Digital Audio Interfaces
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7.1.2
Direct (AP or PSIA)
Insert a jumper on J2 and connect the external digital audio source (for example AP or PSIA) to the
external input header pin. The odd numbered pins on this header provide a ground for each signal, as
Figure 6 shows. Note that the jumper setting for J1 must reflect the logic level of the external source.
Figure 6. AP or PSIA Input Configuration
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Hardware Documentation
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Hardware Documentation
This section contains the EVM schematics, PCB layout images, and BOM.
8.1
TAS2770EVM Schematics
Figure 7 through Figure 11 show the TAS2770EVM schematics.
3.3V
3.3V
3.3V
1.8V
U5A
U5B
3.3V
X1D00
X1D01
X1D02
X1D03
X1D04
X1D05
X1D06
X1D07
X1D08
X1D09
X1D10
X1D11
1.0V
U5E
44
USB_VDD33
105
VDDIOL
VDDIOL
VDDIOL
VDDIOL
VDDIOL
52
67
78
83
92
3.3V
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
OTP_VCC
6
14
19
29
42
VDDIOR
VDDIOR
VDDIOR
VDDIOR
VDDIOR
110
111
VDDIOT
VDDIOT
50
65
USB_VDD
11
16
17
24
36
41
56
60
73
80
81
87
101
102
120
126
PLL_AVDD
103
104
NC
NC
PAD
R23
4.75
49
PLL_AGND
X1D14
X1D15
X1D16
X1D17
X1D18
X1D19
X1D20
X1D21
1.0V
R16
R17
R18
1.00k 2.20k 2.20k
85
86
72
74
75
76
77
79
82
84
121
122
51
53
22
23
25
26
54
55
X-SDZ_CTRL
X-SDZ
IRQZ-3.3V
3.3V
3.3V
R5
10.0k
R6
680
D3
USB RDY
C42
0.1µF
129
XEF216-512-TQ128-C20
GND
GND
X1D26
X1D27
X1D28
X1D29
X1D30
X1D31
X1D32
X1D33
X1D35
X1D36
X1D37
X1D38
X1D39
X1D40
X1D41
X1D42
X1D43
112
113
114
115
116
117
118
119
Blue
13 R54
15
18
X-MCLK
20
21
106
107
108
109
30
27
37
38
31
33
34
35
39
40
28
32
62
63
57
58
68
69
70
71
59
61
64
66
88
89
93
94
96
98
99
100
95
97
90
91
3
4
5
7
8
9
10
12
X0D00
X0D01
X0D02
X0D03
X0D04
X0D05
X0D06
X0D07
X0D08
X0D09
X0D10
X0D11
X0D12
X0D13
X0D14
X0D15
X0D16
X0D17
X0D18
X0D19
X0D20
X0D21
X0D22
X0D23
X0D24
X0D25
X0D26
X0D27
X0D28
X0D29
X0D30
X0D31
X0D32
X0D33
X0D34
X0D35
X0D36
X0D37
X0D38
X0D39
X0D40
X0D41
X0D42
X0D43
33.2
3.3V
3.3V
GND
GND
3.3V
3.3V
GND
3.3V
C22
0.1µF
16V
33.2
I2S
33.2
33.2
3.3V
C23
0.1µF
16V
3.3V
C24
0.1µF
16V
3.3V
C25
0.1µF
16V
3.3V
C26
0.1µF
16V
3.3V
C27
0.1µF
16V
3.3V
C28
0.1µF
16V
3.3V
C29
0.1µF
16V
3.3V
C30
0.1µF
16V
GND
GND
GND
GND
GND
GND
GND
GND
GND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
X-LRCK
X-BCLK
X-DIN
X-DOUT
C32
0.1µF
16V
GND
C33
0.1µF
16V
GND
C34
0.1µF
16V
GND
C35
0.1µF
16V
GND
C40
0.1µF
16V
GND
C43
0.1µF
16V
GND
C44
0.1µF
16V
GND
C45
0.1µF
16V
C31
0.1µF
16V
GND
C12
0.1µF
16V
GND
GND
1.0V
1.0V
TO
MUXES
AND
TRANSLATORS
33.2
XEF216-512-TQ128-C20
XEF216-512-TQ128-C20
C20
0.1µF
16V
X-SDA
X-SPI-SS0
X-SPI-SS1
X-SPI-SS2
X-SPI-SS3
R55
1.8V
C19
0.1µF
16V
R19
R20
R21
R22
47.0k 47.0k 47.0k 47.0k
X-MCLK
R32
R33
C18
0.1µF
16V
X-SCL
3.3V
R7
1.8V
I2C
X-QSPI-CS
X-SCL
X-SDA
3.3V
3.3V
R46
10.0k
1.0V
R45
10.0k
1.0V
C47
0.1µF
16V
SHUTDOWN
1.0V
C48
0.1µF
16V
1.0V
C49
0.1µF
16V
1.0V
C50
0.1µF
16V
1.0V
C51
0.1µF
16V
1.0V
C52
0.1µF
16V
C53
0.1µF
16V
C54
0.1µF
16V
1.0V
C55
0.1µF
16V
C56
0.1µF
16V
X-SDZ_CTRL
X-SDZ
IRQ
GND
GND
GND
1.0V
1.0V
1.0V
1.0V
C57
0.1µF
16V
IRQZ-3.3V
GND
J17
1.8V
3.3V
VCCB
8
4
Y1
4
R8
JTAG
1
10.0k
GND
VDD
OUT
OE/STANDBY
GND
R57
33.2
3
X-24M
2
2
3
B1
A2
B2
OE
GND
7
1
6
14
24MHz
4
GND
3.3V
A1
2
13
12
X-SDA
X-SCL
5
GND
VDD
VDDOUT
VDDOUT
VCTRL
11
R56
33.2
Y2
9
R58
33.2
Y3
8
Y1
XIN/CLK
XOUT
S0
SDA/S1
SCL/S2
GND
GND
5
10
VBUS
GND
GND
GND
D-
3
5
R31
51.0k
VCC
SENSE_OUT
1.8V
3.3V
R27
10.0k
2
1
2
GND
X-TRSTN
3
1A
GND
2A
1Y
VCC
2Y
SN74LVC2G07DSFR
GND
GND
GND
6
5
4
C1
0.1µF
16V
U5D
U9
GND
1.8V
GND
J16
USB
1
VBUS-IN
2
USB-DM
3
USB-DP
4
USB-ID
U5C
46
47
R9
10.0k
5
45
43
48
R26
10.0k
SENSE
CT
GND
4
ENABLE
TPS3897ADRYR
C4
470pF
3.3V
GND
C60
0.1µF
16V
R30
0
X-24M
X-RSTN
125
124
CLK
RST
X-TCK
X-TMS
X-TDI
X-TDO
128
127
2
1
123
TCK
TMS
TDI
TDO
TRST
C2
0.1µF
16V
7
1
3.3V
9
6
R24
25.5k
ID
R25
10.0k
GND
X-MCLK
1.0V
U7
GND
X-BCLK
D+
3.3V
GND
6
7
CDCE913PWR
SN74AVC2T244DQMR
X-TCK
X-TMS
X-TDI
X-TDO
GND
GND
U14
3
VCCA
C59
0.1µF
16V
GND
3.3V
1.8V
U8
1
3.3V
GND
8
X-TCK
X-TMS
X-TDI
X-TDO
X-TRSTN
1
2
3
4
5
6
C58
0.1µF
16V
6
IRQZ-3.3V
GND
USB_VBUS
USB_ID
USB_RTUNE
XEF216-512-TQ128-C20
GND-USB
GND
USB_DP
USB_DM
L2
C3
2.2µF
R28
100k
C61
0.1µF
R29
43.2
GND
XEF216-512-TQ128-C20
GND
GND
GND
GND
GND
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Figure 7. Schematic: XMOS USB Controller
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3.3V-1.8V TRANSLATORS (Level Shifters)
TDM SOURCE SELECT
I2S
3.3V
U12
XMOS
>
>
>
>
>
>
>
>
>
X-BCLK
X-LRCK
X-DOUT
EXT-IN
SBCLK-EXTIN
FSYNC-EXTIN
SDIN-EXTIN
>
>
>
VCC
X-BCLK
2
SBCLK-EXTIN 3
1B1
1B2
X-LRCK
5
FSYNC-EXTIN 6
2B1
2B2
X-DOUT
SDIN-EXTIN
11
10
14
13
8
1A
2A
3B1
3B2
3A
4B1
4B2
4A
S
GND
OE
Vcc
16
R38
33.0
R39
33.0
4
7
R40
33.0
9
>
>
>
12
>
>
>
SDOUT-XLTR
FSYNC-XLTR
SBCLK-XLTR
VCCA
15
16
5
6
DIR1
DIR2
DIR3
DIR4
1
2
3
4
1
1.8V
U11
14
7
VCCB
13
I2S
A1
A2
A3
A4
B1
B2
B3
B4
OE
GND
33.0
33.0
33.0
SDIN
FSYNC
SBCLK
>
>
>
SDIN
FSYNC
SBCLK
TO DUT
AND
EXT-OUT
8
15
SN74AVC4T774RSVR
GND
GND
R3
R2
R1
12
11
10
9
GND
SN74CB3Q3257DGVR
GND
Vcc
1.8V
1.8V
3.3V
OUT=INTERNAL
J2
C5
0.1µF
16V
R41
IN=EXTERNAL
10.0k
TDM-SEL
C36
0.1µF
16V
C37
0.1µF
16V
GND
GND
GND
GND
3.3V
I2C
I2C/SHUTDOWN SOURCE SELECT
XMOS
R59
10.0k
X-SCL
X-SDA
EXT-IN
SCL-EXTIN
SDA-EXTIN
>
>
>
SHUTDOWN
3.3V
U17
X-SCL
SCL-EXTIN
2
3
X-SDA
SDA-EXTIN
5
6
X-SDZ
SDZ-EXTIN
11
10
X-SDZ_CTRL 14
13
8
VCC
1B1
1B2
1A
2B1
2B2
2A
3B1
3B2
3A
4B1
4B2
4A
S
GND
XMOS
U15
4
SCL-XLTR
7
SDA-XLTR
9
SDZ-XTLR
SCL-XLTR
SDA-XLTR
>
SDZ-CTRL
12
>
>
X-SDZ
X-SDZ_CTRL
2
SCL_B
SDA_B
5
4
SCL
SDA
OE
6
R43
VCCA
VCCB
3
7
SCL_A
SDA_A
GND
GND
>
SCL
SDA
GND
10.0k
1.8V
15
U18
LVC1G125
SN74CB3Q3257DGVR
GND
>
3.3V
OUT=INTERNAL
SDZ-CTRL
1
SDZ-XTLR
2
SHUTDOWN
4
J6
SDZ
>
SDZ
TO DUT AND EXT-OUT
I2C-SEL
3
R44
IN=EXTERNAL
TO DUT AND
EXT-OUT
TCA9406DCUR
>
1
EXT-IN
SDZ-EXTIN
8
1
5
OE
I2C
1.8V 3.3V
16
10.0k
GND
GND
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Figure 8. Schematic: Input Multiplexing and Level Shift
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3.3V
U3
13
C8
0.1µF
16V
GND
3.3V
C9
0.1µF
16V
GND
3.3V
C10
0.1µF
16V
GND
C11
0.1µF
16V
FROM DUT OR
LEVEL SHIFTERS
VCCB
SBCLK
FSYNC
SDIN
SDOUT
12
11
10
9
>
>
>
>
8
Vcc
I2C
C6
0.1µF
16V
15
16
5
6
DIR1
DIR2
DIR3
DIR4
I2S
GND
14
VCCA
IRQZ LED
3.3V
J1
Vcc SELECT
5
3.3V
1.8V
B1
B2
B3
B4
A1
A2
A3
A4
GND
OE
SBCLK-EXTOUT
FSYNC-EXTOUT
SDIN-EXTOUT
1
2
3
4
SDZ
1
IRQZ
2
R42
470
D2
4
7
SN74AVC4T774RSVR
GND
SCL
SDA
3.3V
U16
SN74LV1T126DCKR
IRQ
Blue
3
3.3V
Vcc
Vcc
3
2
1
1.8V
GND
GND
U4
GND
CONTROL
>
>
SDZ
IRQZ
1.8V
3.3V 1.8V
SCL
SDA
R4
5
4
SCL_A
SDA_A
6
10.0k
8
1
SCL-EXTOUT
SDA-EXTOUT
1.8V
OE
3
7
C38
0.1µF
16V
SCL_B
SDA_B
VCCA
VCCB
J4
R37
GND
IRQZ
2
IRQZ Pullup
10.0k
IRQZ
TCA9406DCUR
J14
TO MUXES
GND
X-DOUT
I2S
>
>
>
GND
X-DIN
3.3V
U6
7
X-DIN
IRQZ-3.3V
CONTROL
VCCA
1
2.20k
SDZ
2
SDOUT
A2
3
IRQZ
OE
4
B1
A1
6
B2
5
GND
GND
OUTPUT HEADER
> SBCLK-EXTIN
> FSYNC-EXTIN
> SDIN-EXTIN
< SDOUT
SCL-EXTIN
GND
J5
GND
SBCLK-EXTOUT
FSYNC-EXTOUT
SDIN-EXTOUT
SDOUT
SCL-EXTOUT
SDA-EXTOUT
SDZ
IRQZ
SDA-EXTIN
> SDZ-EXTIN
< IRQZ
INPUT
GND
R36
47.0k
SN74AVC2T244DQMR
2
4
6
8
10
12
14
16
J3
R34
SDZ-EXTIN
J7
1
3
5
7
9
11
13
15
VCCB
1.8V
TO XMOS
SCL-EXTIN
SDA-EXTIN
>
SDZ Control
1.8V
8
I2C
INPUT HEADER
SDZ
GND
SBCLK-EXTIN
FSYNC-EXTIN
SDIN-EXTIN
>
>
>
<
>
<
2
4
6
8
10
12
14
16
1
3
5
7
9
11
13
15
OUTPUT
(EXT)
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 9. Schematic: External Input and Output Routing
12
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TP12
J21
AVDD
PDM Header
TP13
J22
IOVDD
GND
GND
J8
1
3
2
4
1.8V
PDMCK
PDMD
VBAT
GND
GND
VBAT
TP14
J18
PDM
VBAT1
C79
1µF
10V
GND
C21
2.2µF
10V
GND
SDIN
SDOUT
SBCLK
C46
1µF
10V
C80
0.1µF
25V
IOVDD
IOVDD
AVDD
AVDD
C64
0.1µF
25V
J11
2
4
6
R15
1
3
5
3.3V
3.3V
3.3V
GND
TP28
PDMCK
3.3V
9
R53
C78
0.1µF
16V
10.0k
R52
VBAT
IOVDD
BST_P
17
18
PDMCK
PDMD
TP25
PDMD
C13
0.1µF
16V
C14
0.1µF
16V
C15
0.1µF
16V
SDIN
SDOUT
SBCLK
FSYNC1
10.0k
GND
GND
GND
TP1
GND
SDIN
TP3
SDOUT
TP4
SCL1
SDA1
3.3V
VCC
FSYNC
A1
1A
I2C-SEL_CTRL
B2
1C
FSYNC
11
12
13
14
23
22
U2
A2
D2
C1
2A
1B
2B
FSYNC1
B1
GND
SDZ
IRQZ
To
TDM/Control
Bus
C2
2C
D1
C7
1µF
25V
C82
22µF
20V
C83
22µF
20V
TP20
GND
TP21
TP22
GND
TP23
GND
GND
SDIN
SDOUT
SBCLK
FSYNC
25
GND
4
BSTP
25V
OUT_P
3
VSNS_P
5
VSNS_N
6
OUT_N
26
GND
C84
0.1µF
GND
TP16
R50
OUTP
GND
OUT+
1
DREG
AREG
7
24
PGND
GND
GND
GND
2
10
15
16
BSTN
25V
GND
VSNS+
TP9
J15
OUT+
R51
C39
0.1µF
GND
OUT+
0
OUTN
GND
OUTPUT
TP17
J20
OUTOUT-
OUT-
0
BST_N
GND
OUTP
C85
100pF
DNP
OUTN
C41
100pF
DNP
J10
OUT
TP10
VSNS-
SBCLK
GND
FSYNC
AVDD
10.0k
SW Addr
TP2
TP15
GND
PDMCK
PDMD
Soundwire Mode Settings
1.8V
To
TDM/Control
Bus
GND
C81
0.1µF
25V
VBAT
U1
8
GND
TP24
TP7
TP8
SDZ
IRQZ
MODE
21
20
19
SCL
SDA
DREG
SD
IRQ
MODE
DREG
AREG
TP18
AREG
C17
1µF
10V
C63
0.1µF
25V
GND
GND
GND
GND
TP19
C62
0.1µF
25V
GND
C16
1µF
10V
GND
TAS2770RJQR
SDZ
IRQZ
GND
SN74LVC2G66YZPR
GND
U20
SCL
A1
I2C-SEL_CTRL
B2
SCL
SCL
1A
Mode Settings
1B
R11
10.0k
R12
470
SCL1
B1
1.8V
1C
D2
2A
C1
2C
2B
C2
1
TP5
VCC
GND
10
11
13
A2
4
5
7
3.3V
J13
MODE
D1
SN74LVC2G66YZPR
15
14
9
8
12
3
2
6
GND
U21
3.3V
MODE
A2
A1
I2C-SEL_CTRL
B2
1C
D2
2A
C1
2C
SDA
TP6
SDA
VCC
SDA
3.3V
1A
3.3V
GND
2B
C2
GND
D1
R13
2.20k
R14
47.0k
5
J12
1B
SDA1
B1
U22
2
4
SN74LVC2G66YZPR
R35
10.0k
3
GND
SW Addr EN
LVC1G14
GND
Copyright © 2017, Texas Instruments Incorporated
GND
Figure 10. Schematic: TAS2770 Channel 1 Control
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VBAT RANGE = 4.5-16V
VBAT
J19
VBAT
U19
TL760M33QKVURQ1
L1
1
5V-VR
1
IN
OUT
3
2
C67
47µF
63V
VBAT
C68
1µF
50V
C66
10µF
C69
0.1µF
25V
1
2
GND
C70
0.1µF
50V
GND
4
GND
GND
3.3V
3.3V
3.3V
3
C65
0.1µF
16V
GND
C71
47µF
16V
D1
Green
R47
470
GND
GND
J9
GND
3.3V
U10
7
VIN
SW
VOS
C72
22µF
1
1.0V
L3
EN
FB
PG
GND
GND
1.0V
6
4
470nH
R48
40.2k
3
2
5
C73
22µF
TP11
C74
0.1µF
R49
1.00M
GND
GND
R10
162k
TPS62085RLTR
GND
5V to 1V BUCK LDO
3.3V
U13
TPS73618DBVR
1
3
IN
OUT
EN
NR
1.8V
5
4
C76
0.1µF
GND
C77
0.01µF
2
C75
1µF
10V
GND
GND
GND
GND
Copyright © 2017, Texas Instruments Incorporated
GND
Figure 11. Schematic: Onboard Power
14
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8.2
TAS2770EVM Reference Board Printed Circuit Board Layout
Figure 12 through Figure 19 show the PCB layout images.
Figure 12. PCB: Top Silkscreen
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Figure 13. PCB: Top Solder Mask
16
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Figure 14. PCB: Top Copper
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Figure 15. PCB: Copper Layer 2
18
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Figure 16. PCB: Copper Layer 3
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Figure 17. PCB: Bottom Copper
20
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Figure 18. PCB: Bottom Solder Mask
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Figure 19. PCB: Bottom Silkscreen
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8.3
TAS2770 Evaluation Board Bill of Materials
Table 3 displays the EVM BOM.
Table 3. TAS2770EVM Bill of Materials (1)
Designator
QTY
!PCB1
1
C1, C2, C5, C6, C8,
C9, C10, C11, C12,
C13, C14, C15, C18,
C19, C20, C22, C23,
C24, C25, C26, C27,
C28, C29, C30, C31,
C32, C33, C34, C35,
C36, C37, C38, C40,
C43, C44, C45, C47,
C48, C49, C50, C51,
C52, C53, C54, C55,
C56, C57, C58, C59,
C60, C78
51
C3
C4
Value
Description
Package Reference
Manufacturer
AMPS022
Any
0.1uF
CAP, CERM, 0.1uF, 16V, ±10%, X7R, 0402
0402
GRM155R71C104KA88D
Murata
1
2.2uF
CAP, CERM, 2.2 µF, 10 V, ±10%, X7R, 0603
0603
GRM188R71A225KE15D
Murata
1
470pF
CAP, CERM, 470 pF, 25 V, ±5%, C0G/NP0, 0402
0402
GRM1555C1E471JA01D
Murata
C7
1
1uF
CAP, CERM, 1 µF, 25 V,±10%, X5R, 0603
0603
GRM188R61E105KA12D
Murata
C16, C17, C21, C46,
C75, C79
6
1uF
CAP, CERM, 1 µF, 10 V, ±10%, X7R, 0603
0603
GRM188R71A105KA61D
Murata
C39, C62, C63, C64,
C69, C80, C81, C84
8
0.1uF
CAP, CERM, 0.1 µF, 25 V, ±20%, X7R, 0402
0402
C1005X7R1E104M050BB
TDK
C42, C61, C65, C74
4
0.1uF
CAP, CERM, 0.1 µF, 16 V, ±10%, X7R, 0402
0402
GRM155R71C104KA88D
Murata
C66
1
10uF
CAP, CERM, 10 µF, 35 V, ±10%, X7R, 1206
1206
GMK316AB7106KL
Taiyo Yuden
C67
1
47uF
CAP, AL, 47 µF, 63 V, ±20%, 0.65 ohm, AEC-Q200 Grade 2, SMD
SMT Radial F
EEE-FK1J470P
Panasonic
C68
1
1uF
CAP, CERM, 1 µF, 50 V, ±10%, X7R, 0805
0805
GRM21BR71H105KA12L
Murata
C70
1
0.1uF
CAP, CERM, 0.1 µF, 50 V, ±10%, X7R, 0603
0603
GCM188R71H104KA57D
Murata
C71
1
47uF
CAP, AL, 47 µF, 16 V, ±20%, 0.8 ohm, AEC-Q200 Grade 2, TH
D5xL11mm
EEU-FC1C470
Panasonic
C72, C73
2
22uF
CAP, CERM, 22 µF, 10 V, ±20%, X7R, 0805
0805
GRM21BZ71A226ME15L
Murata
C76
1
0.1uF
CAP, CERM, 0.1 µF, 10 V, ±10%, X7R, 0402
0402
GRM155R71A104KA01D
Murata
C77
1
0.01uF
CAP, CERM, 0.01 µF, 6.3 V, ±10%, X7R, 0402
0402
GRM155R70J103KA01D
Murata
C82, C83
2
22uF
CAP, Tantalum Polymer, 22 µF, 20 V, ±20%, 0.09 ohm, 3528-21
SMD
3528-21
TCJB226M020R0090
AVX
D1
1
Green
LED, Green, SMD
LED_0805
LTST-C171GKT
Lite-On
D2
1
Blue
LED, Blue, SMD
Blue LED
SMLP12BC7TT86
Rohm
D3
1
Blue
LED, Blue, SMD
LED_0805
LTST-C170TBKT
Lite-On
H1, H2, H3, H4
4
Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead
Screw
NY PMS 440 0025 PH
B&F Fastener Supply
H5, H6, H7, H8
4
Standoff, Hex, 0.5"L #4-40 Nylon
Standoff
1902C
Keystone
J1
1
Header, 100mil, 3x1, Gold, TH
PBC03SAAN
PBC03SAAN
Sullins Connector
Solutions
J2, J3, J4, J6, J12,
J14, J18, J21, J22
9
Header, 100mil, 2x1, Gold, TH
Sullins 100mil, 1x2, 230
mil above insulator
PBC02SAAN
Sullins Connector
Solutions
J5
1
Receptacle, 100mil, 8x2, Gold, R/A, TH
SSQ-108-02-G-D-RA
SSQ-108-02-G-D-RA
Samtec
(1)
Printed Circuit Board
Part Number
Alternate Part
Number
Alternate
Manufacturer
-
-
-
-
Unless otherwise noted in the Alternate Part Number or Alternate Manufacturer columns, all parts may be substituted
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Table 3. TAS2770EVM Bill of Materials (1) (continued)
Designator
QTY
Value
Description
Package Reference
Part Number
Manufacturer
J7
1
Header, 100mil, 8x2, Gold, R/A, TH
8x2 R/A Header
TSW-108-08-G-D-RA
Samtec
J8
1
Header, 100mil, 4x2, Tin, TH
Header, 4x2, 100mil, Tin
PEC04DAAN
Sullins Connector
Solutions
J9
1
Terminal Block, 5.08mm, 2x1, TH
Terminal Block, 5.08mm,
2x1, TH
0395443002
Molex
J10
1
Terminal Block, 5 mm, 2x1, Tin, TH
Terminal Block, 5 mm,
2x1, TH
691 101 710 002
Wurth Elektronik
J11
1
Header, 100mil, 3x2, Gold, TH
Sullins 100mil, 2x3, 230
mil above insulator
PBC03DAAN
Sullins Connector
Solutions
J13
1
Header, 2.54mm, 5x3, Gold, TH
Header, 2.54mm, 5x3,
TH
804-10-015-10-002000
Mill-Max
J15
1
Binding Post, RED, TH
11.4x27.2mm
7006
Keystone
J16
1
Connector, Receptacle, Micro-USB Type AB, R/A, Bottom Mount
SMT
Connector, USB Micro
AB
DX4R205JJAR1800
JAE Electronics
J17
1
Receptacle, 50mil, 6x1, Gold, R/A, TH
6x1 Receptacle
LPPB061NGCN-RC
Sullins Connector
Solutions
J19
1
Power Jack, mini, 2.5mm OD, R/A, TH
Jack, 14.5x11x9mm
RAPC712X
Switchcraft
J20
1
Binding Post, BLACK, TH
11.4x27.2mm
7007
Keystone
L1
1
300 ohm
Ferrite Bead, 300 ohm @ 100 MHz, 3.1 A, 0806
0806
NFZ2MSM301SN10L
Murata
L2
1
600 ohm
Ferrite Bead, 600 ohm @ 100MHz, 2A, 0805
0805
MPZ2012S601A
TDK
L3
1
470nH
Inductor, Shielded Drum Core, Ferrite, 470 nH, 2 A, 0.059 ohm, SMD
Inductor, 2x1.2x2mm
VLS2012ET-R47N
TDK
R1, R2, R3, R38, R39,
R40
6
33.2
RES, 33.2, 1%, 0.063 W, 0402
0402
CRCW040233R2FKED
Vishay-Dale
R4, R5, R43, R45, R46
5
10k
RES, 10 k, 5%, 0.063 W, 0402
0402
CRCW040210K0JNED
Vishay-Dale
R6
1
680
RES, 680, 1%, 0.1 W, 0603
0603
RC0603FR-07680RL
Yageo America
R7, R32, R33, R54,
R55, R56, R57, R58
8
33.2
RES, 33.2, 1%, 0.05 W, 0201
0201
RC0201FR-0733R2L
Yageo America
R8, R25, R26, R27
4
10.0k
RES, 10.0 k, 1%, 0.05 W, 0201
0201
CRCW020110K0FKED
Vishay-Dale
R9
1
10.0k
RES, 10.0 k, 1%, 0.1 W, 0402
0402
ERJ-2RKF1002X
Panasonic
R10
1
162k
RES, 162 k, 1%, 0.063 W, 0402
0402
CRCW0402162KFKED
Vishay-Dale
R11, R15, R35, R37,
R52, R53
6
10.0k
RES, 10.0 k, 1%, 0.063 W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R12
1
470
RES, 470, 1%, 0.1 W, AEC-Q200 Grade 0, 0402
0402
ERJ-2RKF4700X
Panasonic
R13, R17, R18, R36
4
2.2k
RES, 2.2 k, 5%, 0.063 W, 0402
0402
CRCW04022K20JNED
Vishay-Dale
R14, R19, R20, R21,
R22, R34
6
47k
RES, 47 k, 5%, 0.063 W, 0402
0402
CRCW040247K0JNED
Vishay-Dale
R16
1
1.0k
RES, 1.0 k, 5%, 0.063 W, 0402
0402
CRCW04021K00JNED
Vishay-Dale
R23
1
4.7
RES, 4.7, 5%, 0.1 W, 0603
0603
CRCW06034R70JNEA
Vishay-Dale
R24
1
25.5k
RES, 25.5 k, 1%, 0.05 W, 0201
0201
RC0201FR-0725K5L
Yageo America
R28
1
100k
RES, 100 k, 5%, 0.063 W, 0402
0402
CRCW0402100KJNED
Vishay-Dale
R29
1
43.2
RES, 43.2, 1%, 0.063 W, 0402
0402
CRCW040243R2FKED
Vishay-Dale
R30
1
0
RES, 0, 5%, 0.063 W, 0402
0402
CRCW04020000Z0ED
Vishay-Dale
R31
1
51.0k
RES, 51.0 k, 1%, 0.05 W, 0201
0201
RC0201FR-0751KL
Yageo America
24
TAS2770 Evaluation Module
Alternate Part
Number
Alternate
Manufacturer
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Table 3. TAS2770EVM Bill of Materials (1) (continued)
Designator
QTY
Value
Description
Package Reference
Part Number
R41, R44, R59
3
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R42
1
360
RES, 360 ohm, 5%, 0.063W, 0402
0402
CRCW0402360RJNED
Vishay-Dale
R47
1
360
RES, 360, 5%, 0.063 W, 0402
0402
CRCW0402360RJNED
Vishay-Dale
R48
1
40.2k
RES, 40.2 k, 1%, 0.063 W, 0402
0402
CRCW040240K2FKED
Vishay-Dale
R49
1
1.00Meg
RES, 1.00 M, 1%, 0.063 W, 0402
0402
CRCW04021M00FKED
Vishay-Dale
R50, R51
2
0
RES, 0, 5%, 0.125 W, 0805
0805
RC0805JR-070RL
Yageo America
SH1, SH2, SH3, SH4,
SH5, SH6, SH7, SH8,
SH9, SH10, SH11,
SH12
12
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
TP1, TP2, TP3, TP4,
TP5, TP6, TP7, TP8,
TP9, TP10, TP16,
TP17, TP25, TP26,
TP27, TP28
16
Orange
Test Point, Miniature, Orange, TH
Orange Miniature
Testpoint
5003
Keystone
TP11, TP14, TP15,
TP18, TP19, TP24
6
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP12, TP13, TP20,
TP21, TP22, TP23
6
Test Point, Miniature, Black, TH
Black Miniature Testpoint
5001
Keystone
U1
1
TBD Data, VQFN26-RJQ
RJQ00026
TAS2770RJQ
Texas Instruments
Texas Instruments
U2, U20, U21
3
Dual Bilateral Analog Switch, YZP0008ADAD (DSBGA-8)
YZP0008ADAD
SN74LVC2G66YZPR
Texas Instruments
Texas Instruments
U3, U11
2
4-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE
VOLTAGE TRANSLATION AND 3-STATE OUTPUTS, RSV0016A
(UQFN-16)
RSV0016A
SN74AVC4T774RSVR
Texas Instruments
Texas Instruments
U4, U15
2
TCA9406 Dual Bidirectional 1-MHz I2C-BUS and SMBus Voltage
Level-Translator, 1.65 to 3.6 V, -40 to 85 degC, 8-pin US8 (DCU),
Green (RoHS & no Sb/Br)
DCU0008A
TCA9406DCUR
Texas Instruments
U5
1
IC MCU 512KB RAM, 128TQFP
TQFP-128
XEF216-512-TQ128-C20
XMOS semiconductor
U6
1
Dual-Bit Dual-Supply Bus Transceiver, DQM0008A (X2SON-8)
DQM0008A
SN74AVC2T244DQMR
Texas Instruments
U7
1
Single-Channel, Adjustable Supervisory Circuit in Ultra-Small
Package, DRY0006A (USON-6)
DRY0006A
TPS3897ADRYR
Texas Instruments
U8
1
2-BIT UNDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR,
DQM0008A (X2SON-8)
DQM0008A
SN74AVC2T244DQMR
Texas Instruments
Texas Instruments
U9
1
DUAL BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS,
DSF0006A
DSF0006A
SN74LVC2G07DSFR
Texas Instruments
Texas Instruments
U10
1
3-A Step-Down Converter with Hiccup Short Circuit Protection in 2x2
QFN Package, RLT0007A
RLT0007A
TPS62085RLTR
Texas Instruments
U12, U17
2
4-Bit 1-of-2 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage
High-Bandwidth Bus Switch, DGV0016A
DGV0016A
SN74CB3Q3257DGVR
Texas Instruments
U13
1
Single Output Low Noise LDO, 400 mA, Fixed 1.8 V Output, 1.7 to
5.5 V Input, with Reverse Current Protection, 5-pin SOT-23 (DBV),
-40 to 85 degC, Green (RoHS & no Sb/Br)
DBV0005A
TPS73618DBVR
Texas Instruments
Equivalent
Texas Instruments
U14
1
Programmable 1-PLL VCXO Clock Synthesizer With 1.8-V, 2.5-V,
and 3.3-V Outputs, PW0014A (TSSOP-14)
PW0014A
CDCE913PWR
Texas Instruments
CDCE913PW
Texas Instruments
U16
1
Single Power Supply Single Buffer Gate with 3-State Output CMOS
Logic Level Shifter, DCK0005A
DCK0005A
SN74LV1T126DCKR
Texas Instruments
U18
1
Single Bus Buffer Gate With 3-State Output, DCK0005A (SOT-5)
DCK0005A
SN74LVC1G125DCKR
Texas Instruments
SLOU495 – December 2017
Submit Documentation Feedback
Manufacturer
Alternate Part
Number
SNT-100-BK-G
Equivalent
Alternate
Manufacturer
Samtec
Texas Instruments
Texas Instruments
TPS3897ADRYT
TPS62085RLTT
Texas Instruments
Texas Instruments
Texas Instruments
Texas Instruments
SN74LVC1G125DC
KT
Texas Instruments
TAS2770 Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
25
ECCN: 3E991
Hardware Documentation
www.ti.com
Table 3. TAS2770EVM Bill of Materials (1) (continued)
Designator
QTY
Value
Description
Package Reference
Part Number
Manufacturer
U19
1
Single Output Automotive LDO, 500 mA, Fixed 3.3 V Output, 3.8 to
26 V Input, 3-pin PFM (KVU), -40 to 125 degC, Green (RoHS & no
Sb/Br)
KVU0003A
TL760M33QKVURQ1
Texas Instruments
U22
1
SINGLE SCHMITT-TRIGGER INVERTER, DRL0005A (SOT-5)
DRL0005A
SN74LVC1G14DRLR
Texas Instruments
Y1
1
OSC, 24 MHz, 2.25 - 3.63 V, SMD
2x1.6mm
ASTMLPA-24.000MHZ-EJ-E-T
Abracon Corporation
C41, C85
0
CAP, CERM, 100 pF, 50 V, ±5%, C0G/NP0, 0402
0402
GRM1555C1H101JA01D
Murata
FID1, FID2, FID3,
FID4, FID5, FID6
0
Fiducial mark. There is nothing to buy or mount.
N/A
N/A
N/A
26
100pF
TAS2770 Evaluation Module
Alternate Part
Number
Equivalent
Alternate
Manufacturer
Texas Instruments
Texas Instruments
SLOU495 – December 2017
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
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