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Texas Instruments TAS5755EVM Evaluation Module (Rev. A) User guides
User's Guide
SLOU481A – August 2017 – Revised October 2017
TAS5755MEVM Evaluation Module
This manual describes the operation of the TAS5755MEVM to evaluate the performance of the
TAS5755M integrated digital audio power amplifier. The main contents of this document are:
• Details on properly connecting a TAS5755M evaluation module (EVM) and the details of the EVM
• Details on installing and using the GUI to program the TAS5755MEVM
• Quick-start guide for the common modes in which the TAS5755MEVM can be used
• Details on using the audio processing features like EQ and DRC
1
2
3
4
5
Contents
Overview ...................................................................................................................... 2
1.1
TAS5755MEVM and MC57xxPSIA Features ................................................................... 3
Installation .................................................................................................................... 4
2.1
EVM Installation ..................................................................................................... 4
2.2
Software Installation ................................................................................................ 7
Using the GUI Software ..................................................................................................... 8
3.1
Launching the GUI interface....................................................................................... 8
3.2
Setting the I2C Device Address ................................................................................... 9
3.3
Initializing the Device ............................................................................................. 10
3.4
Using EQ Function ................................................................................................ 12
3.5
Using the DRC Function: ......................................................................................... 13
3.6
Using the Mixer and Scaler Nodes.............................................................................. 15
3.7
Using the I2C Memory Tool ...................................................................................... 16
Jumpers and Control Utilities on the MC57xxPSIA Board ............................................................ 17
4.1
RCA and OPTICAL Jumpers .................................................................................... 17
4.2
Switches ............................................................................................................ 17
4.3
LED Indicators ..................................................................................................... 17
Board Layouts, Schematic, and Bill of Materials ....................................................................... 18
5.1
TAS5755MEVM Board Layout................................................................................... 18
5.2
TAS5755MEVM Schematic ...................................................................................... 19
5.3
Bill of Materials .................................................................................................... 20
List of Figures
1
TAS5755MEVM Printed-Circuit Board .................................................................................... 2
2
Complete System and EVM Signal Path Overview ..................................................................... 3
3
General Connection Picture ................................................................................................ 4
4
EVM Board Speaker Outputs .............................................................................................. 5
5
Connecting TAS5755MEVM to MC57xxPSIA
6
BTL Connection .............................................................................................................. 6
7
SE Connection ............................................................................................................... 6
8
TAS5755M DAP Block Diagram ........................................................................................... 8
9
Changing the Device Address ............................................................................................. 9
10
Default GUI Interface on Start-up ........................................................................................ 10
11
Zoomed-In Snapshot of the Configuration Drop-Down Menu ........................................................ 10
12
Initiating Connect from the Target Menu ................................................................................ 11
13
Toggling Shut-Down and Mute States ................................................................................... 11
...........................................................................
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1
Overview
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14
TAS57xx GUI EQ Blocks .................................................................................................. 12
15
EQ-Tool Filter Creation Window
12
16
Fixing Low Pass Filter Bug on Woofer Channel
13
17
18
19
20
21
22
23
24
.........................................................................................
.......................................................................
TAS57X1 GUI DRC Blocks ...............................................................................................
TAS57xx GUI DRC Customization Tool.................................................................................
DRC Time Constants Window ............................................................................................
Input, Output Mixer and Scaler Nodes ..................................................................................
I2C Memory Tool............................................................................................................
TAS5755MEVM Top Copper Layer ......................................................................................
TAS5755MEVM Bottom Copper Layer ..................................................................................
TAS5755MEVM Schematic ...............................................................................................
14
14
15
15
16
18
18
19
List of Tables
1
TAS5755MEVM Bill Of Materials ......................................................................................... 20
Trademarks
All trademarks are the property of their respective owners.
1
Overview
The TAS5755M evaluation module demonstrates the TAS5755M device from Texas Instruments. The
TAS5755M combines a high-performance PWM processor with a class-D audio power amplifier. This EVM
can be configured with two single-ended (SE) speakers with a BTL subwoofers (2.1) or two bridge-tied
speakers (BTL) (2.0). Review the TAS5755M data sheet (SLOS982) for detailed information about the
device. The TAS5755M has additional audio processing features such as surround sound (3D).
The EVM software with its graphic user interface (GUI) facilitates evaluation by providing access to the
TAS5755M registers through a USB port.
Figure 1. TAS5755MEVM Printed-Circuit Board
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The EVM, together with other TI components on this board, is a complete 2.1-channel digital audio
amplifier system. The MC57xxPSIA Controller board includes a USB interface, a digital input (SPDIF),
analog inputs via the ADC, power inputs, and other features like a mute function and power down.
Left
MC57xxPSIA
TAS5755MEVM
PC Interface
Right
SPDIF/
Optical, Coax
TAS5755
2CH Analog Input
From Other Source/
Digital Out
Subwoofer
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Figure 2. Complete System and EVM Signal Path Overview
1.1
TAS5755MEVM and MC57xxPSIA Features
The EVM and MC57xxPSIA have the following features:
• Channel evaluation module design
• Self-contained protection systems and control pins
• USB interface
• Standard I2S data input using optical or coaxial inputs
• Analog input through analog-to-digital converter
• Subwoofer connection—the PWM terminal provides the PWM signal and power to an external
subwoofer board
• Access to control signal gain and data format through EVM-software GUI
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Installation
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Installation
This section describes the EVM and software installation.
2.1
EVM Installation
Figure 3 shows the EVM connected to the MC57xxPSIA, including cables, connectors. Figure 4 illustrates
and highlights different parts of the EVM board.
Analog Input
5-V Supply
PVDD Supply
Coaxial Input
Optical Input
USB
PVDD on Controller
is Disconnected
Figure 3. General Connection Picture
The following are the basic tools for the initial EVM power up.
• Power supply for digital supply (5-V)
• Power supply (PVDD)
• Banana-plug test leads for power supplies and speakers
• Optical or coaxial cable for SPDIF interface based on signal source
• USB cable
• EVM software
• Speakers or loads for outputs
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Figure 4. EVM Board Speaker Outputs
The following sections describe the TAS5755MEVM board in regards to power supply (PSU) and system
interfaces.
2.1.1
Connecting the TAS5755MEVM to MC57xxPSIA
On the right side of the MC57xxPSIA is a terminal block and another is located on the left of the
TAS5755MEVM (labeled J1). Carefully place the MC57xxPSIA block above the TAS5755MEVM block and
gently push down.
Figure 5. Connecting TAS5755MEVM to MC57xxPSIA
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Installation
2.1.2
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PSU Interface
The TAS5755MEVM is powered by two power supplies: a 5-V power supply (VIN) connected to the
MC57xx controller board, and the PVDD power supply connected directly to the EVM board. The 3.3-V
level is generated on the controller board by a voltage regulator from the 5-V supply.
NOTE: The power-supply cable length must be minimized. Increasing the length of the PSU cable
increases the distortion of the amplifier at high output levels and low frequencies.
The maximum output-stage supply voltage depends on the speaker load resistance. Check the
recommended maximum supply voltage in the TAS5755 data sheet (SLOS982).
2.1.3
Loudspeaker Connectors
CAUTION
All speaker outputs are biased at VCC / 2 and must not be connected to ground
(for example, through an oscilloscope ground).
Loudspeaker connections vary by device setup and the evaluation module features a dedicated connector
for each configuration. When using SE or BTL mode, ensure that the jumper J9 is populated indicating
that BTL rather than PBTL mode is enabled. When connecting a speaker in SE mode, connect the
TAS5755MEVM speaker to one of the two SE connectors labeled SE A (J2) and SE B (J4). When
connecting a speaker in BTL mode, connect the speaker to one of the two BLT connectors labeled BTL
AB (J3) and BTL CD (J6). Note that the EVM is set up to use only channels A and B in the SE mode, for a
production application; however, any of the four channels (A, B, C, D) can be setup for SE mode
operation. To use PBTL mode, depopulate the jumper on the header labeled J9 and populate jumpers J10
and J11 with a high-current wire or jumper. The speaker can then be connected to the connector labeled
PBTL (J5).
Speakers or loads can be connected to the outputs A-D with clip leads, or cables can be made
with female connectors (JST VHR-2N) that can mate to male connectors on the EVM board.
+
OUT A
–
OUT B
Figure 6. BTL Connection
+
OUT A
–
Figure 7. SE Connection
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2.1.4
USB Interface
The TAS5755M registers are accessed through I2C bus lines SDA and SCL. The USB circuit and USB
connector on the MC57xxPSIA board facilitates the connection between a host computer and the device.
The EVM USB circuit is powered by the 5-V USB line of the host PC and is independent of the power
supplies available on the board. The USB device that is used is a TAS1020B from Texas Instruments.
2.1.5
Digital Audio Interface SPDIF
The Digital Audio Interface SPDIF (RCA, OPTO) accepts digital audio data using the I2S protocol. See the
TAS5755M data sheet for more information.
The RCA connector and the OPTO connector are the two SPDIF interfaces on the MC57xxPSIA board.
The jumper JP11 toggles between the OPTO and RCA connector to accommodate the signal source.
When the RCA cable or optical cable is connected and the signal source is powered up, verify that the
SPDIF lock indicator (blue LED5) illuminates, confirming that a viable signal is available to the device.
Install a jumper on JP4 across the middle pin and the pin marked SPDIF to connect the digital source to
SDIN1. Install a jumper on JP5 to connect the digital source to SDIN2.
For detailed information on how the data and clocks are provided to the TAS5755M, see Figure 24 and
the DIR9001 device data sheet (SLES198).
2.1.6
ADC Interface
In the absence of a digital signal source, the PCM1808 ADC can be used to convert an analog audio
signal to a digital signal to the TAS5755M. The DIR9001 still provides clock signals to the ADC in this
process. A 12-MHz crystal is installed on the MC57xxPSIA board. The ADC is an additional feature of this
board to provide flexibility in sourcing an audio signal to the TAS5755M. Review the PCM1808 data sheet
(SLES177) for a detailed description of the ADC on this EVM. Install the jumper on JP4 and J5 across the
middle pin and the pin marked ADC to select ADC as the source for SDIN1 and SDIN2, and finally, install
JP2 and JP3.
2.1.7
Board Power-Up General Guidelines
Connect the MC57xxPSIA and the TAS5755MEVM boards by locating pin 1 on each board, indicated by a
small white triangle. The MC57xxPSIA plugs down onto the TAS5755MEVM board (that is, the
TAS5755MEVM board fits underneath the MC57xxPSIA board). Pin 1 on each board must be connected
to each other.
Install the EVM software on the PC before powering up the board. After connecting the loudspeakers or
other loads, power supplies, and the data line, power up the 5-V power supply first; then power up the
PVDD power supply.
2.2
Software Installation
Download the TAS57X1 Graphical Design Environment (GDE) from the TI Web site, located on the
TAS5755MEVM product page. The TI Web site always has the latest release and any updates to versions
of the GUI.
NOTE: The TAS5755MEVM is recognized as a TAS5731 device by the GDE software. The
TAS5731 device must be selected in the software when using this EVM.
Execute the GUI install program, Setup.exe. Once the program is installed, the program group and
shortcut icon is created in Start → Program → Texas Instruments Inc → TAS57X1 GDE.
The TAS5731 tab opens when the GUI starts. The TAS5731 tab has two subwindows. One shows the
Process Flow window. This window also shows Input select, Mode select, Channel, and Master Volume.
All functions are shown in the same order as in the device.
The other subwindow, the Properties window, has the properties that a user can update by selecting from
the available options. The properties available depend on the device selected.
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Using the GUI Software
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Using the GUI Software
This section describes the details of using the TAS57xx Graphical User Interface (GUI) software tool to
interface with the TAS5755M device. The software is available for download at the TAS5755M product
page on www.ti.com. The main function of the GUI is to provide the user an easy way to manipulate the
device register space for attaining the required signal processing flow. The block diagram of the Digital
Audio Processing (DAP) flow of the TAS5755M, taken from the TAS5755M data sheet is shown in
Figure 8.
Figure 8. TAS5755M DAP Block Diagram
3.1
Launching the GUI interface
The GUI interface can be opened by clicking on the TAS57X1 GDE icon under the Texas Instruments Inc
title in the start program menu.
NOTE: The PPSI2C variable should be set before the GUI interface (or the Memory Tool) is opened.
If the GUI was opened prior to setting the environment variable (Step 1), close and then
reopen the GUI interface.
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3.2
2
Setting the I C Device Address
The I2C slave address of the TAS5755 can either be 0x34 or 0x36 depending on the state of Pin 21
(Addr/Fault) at device power on. The slave address is 0x34 when Addr/Fault is low and 0x36 when it is
high. By default, the EVM address is configured to 0x34 with Addr/Fault pulled low by R12. The slave
address can be set through the GUI by navigating to the Tools menu and opening the I2C Memory Tool.
Clicking the Change Device Address button opens a dialog to specify the device address as shown in
Figure 9. By default the EVM device address is 34 so the address should be changed by entering 34 and
clicking change.
Figure 9. Changing the Device Address
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Initializing the Device
Figure 10 shows a snap-shot of the GUI when it is first launched. The different blocks seen on the GUI
window are defined functions that can each be used to set the register space to a desired value. (For
example, the volume block shown in Green, can be used to set the desired master-volume level. Changes
made to this block, update the master-volume register with the corresponding hex value).
Figure 10. Default GUI Interface on Start-up
The drop-down properties menu seen on the right-hand side of the GUI window (Figure 10) is used to
specify the device to be used. A zoomed snap-shot of the properties menu is shown in Figure 11. Select
TAS5731 from the CurrentDevice option menu. Other settings like modulation scheme (AD or BD),
operation mode (2.0 or 2.1), and so forth, can also be specified using this menu.
Figure 11. Zoomed-In Snapshot of the Configuration Drop-Down Menu
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To initiate the GUI control, the first step is to ‘Connect’ the GUI. To do this, scroll to the Target section of
the menu and click on Connect (as shown in Figure 12)
Figure 12. Initiating Connect from the Target Menu
After the Target-Connect operation, the GUI window background changes from white (with grid) to a solid
light-green. All the blocks seen in the GUI window are now active and any updates made on these blocks
updates the corresponding register space. Also, note that the configuration menu options on the righthand side (highlighted with blue-box in Figure 13) are now grayed out and cannot be updated. The TargetConnect operation automatically updates the trim register (0x1B) to factory-trim mode, now the device can
be set to stream audio output with only two additional operations: exit-shutdown and un-mute
The device shut-down mode can be toggled through the Shutdown checkbox (highlighted with a red-box in
Figure 13). Uncheck this box to bring the device out of shutdown. Similarly, the mute state of master
volume can be toggled using the Mute checkbox (highlighted with a red-box in Figure 13). After un-muting
the master volume, use the volume slider to set the volume to the desired level. The current volume level
is displayed in the menu area on the right-hand side of the GUI window. After completing these basic
operations, the device can now stream audio.
Figure 13. Toggling Shut-Down and Mute States
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Using EQ Function
The Bi-Quad registers in the TAS5755M can be programmed for EQ and other signal processing
applications using the BQ blocks on the GUI. Commonly used signal processing functions are EQ, TrebleShelf, Bass-Shelf, Low-pass, and high-pass filters. In particular, the EQ function can be used to equalize
(hence the name EQ) the non-ideal frequency response of the speaker. The BQ blocks on the GUI are
highlighted in Figure 14.
Figure 14. TAS57xx GUI EQ Blocks
When a BQ-block is selected on the GUI by using a single mouse click, the device registers associated
with that particular BQ block are displayed in the properties window. Double-Clicking on the BQ-block,
opens the Filter Creation Tool for TAS570x window. The Figure 15 shows the filter-creation window
corresponding to block BQ1, where eight bi-quad registers are available for programming. Each of these
can be independently programmed by using the corresponding entry fields. The default setting for all biquads is AllPass mode. The different filter options available are seen in the drop-down menu in Figure 15.
The frequency and phase response of the filters can be viewed using the frequency and phase response
tabs of the filter tool. Finally, when the Apply button is clicked, the bi-quad registers of the device are
updated with the programmed settings.
Figure 15. EQ-Tool Filter Creation Window
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3.4.1
Woofer Channel Defaults to Low Pass Configuration
The GUI defaults to a 2.1 configuration where the BTL CD channel receives a low pass filter. However,
due to a bug in the GUI, this low pass filter is not shown. To fix this problem the BQ4a block should be
opened and the current settings applied to the channel by clicking the Apply button as shown in Figure 16.
This will ensure the GUI and the EVM filters are in sync.
Figure 16. Fixing Low Pass Filter Bug on Woofer Channel
3.5
Using the DRC Function:
The TAS5755M has two DRC blocks; DRC-1 and DRC-2. Left and right channels are processed using
DRC-1, and the sub-channel is processed via DRC-2. The DRC blocks on the TAS57X1 GUI are
highlighted in Figure 17. A single click on the DRC block brings up the I2C register information in the
properties window as seen in Figure 17. The default state of the DRC control is in disabled state, as seen
in the Runtime Properties section of Figure 17. To use the DRC function in the GUI, update the DRC
control to the Enabled state. Note that the DRC-1 and DRC-2 have independent enable and disable
controls.
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Figure 17. TAS57X1 GUI DRC Blocks
The different parameters of the DRC such as Threshold, Compression, Offset and attack, decay time
constants can be programmed using the DRC customization tool, which is opened by double clicking the
DRC block on the GUI window. Figure 18 shows the controls for DRC-1, with the user programmable
inputs highlighted. The plot on the right estimates the output versus input level corresponding to the user
inputs.
Figure 18. TAS57xx GUI DRC Customization Tool
The DRC time-constants can be programmed via the Time Constants window that can be opened by
clicking on the Time Constants in the DRC customization tool. The Time Constants window snap shot is
shown in Figure 19.
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Figure 19. DRC Time Constants Window
3.6
Using the Mixer and Scaler Nodes
Figure 20 shows a snap shot of the different mixer and scaler blocks from the GUI. The mixer nodes can
be used to mix the contents of the different channels. The input mixer can be used to mix the channels
before they are processed by the bi-quads and DRC, while the output mixer nodes are used to mix the
channels after they are processed through these blocks. The scaler blocks at the output can be used to
scale the outputs.
Clicking on any of these blocks displays their configuration options in the properties window. Figure 20
shows an example where the output-mixer 0x51 is selected. Update the mixer configuration by changing
the values in the properties window.
Figure 20. Input, Output Mixer and Scaler Nodes
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2
Using the I C Memory Tool
The GUI installation includes an I2C read-write interface, called the Memory Tool. Using the Memory Tool,
the device registers can manually be read or written to. The tool can either be opened using the GUI
menu (as shown in Figure 21), or can also be launched stand-alone even when the GUI window is not
opened, through the Windows → All-Programs → Texas Instruments Inc → I2C Memory tool option. The
stand-alone capability is especially convenient when an existing I2C file needs to be loaded to update
device registers or when performing I2C debug.
Figure 21 shows a snap-shot of the Memory Tool window. Click the I2C tab at the top to view the
Read/Write and Execute I2C Command File options. For Read operation, provide register sub-address
and register size (length) in bytes. Clicking on the Read button displays the contents of the register in the
Data window. For a Write operation, provide the data to be written in the Data field, and then click the
Write button.
The Memory Tool can also be used to load a pre-defined I2C register file. Clicking the browse button on
the bottom-right allows the user to browse to the location of the I2C script file, after selecting the desired
file, clicking the Execute button, implements the register write operations specified in the file.
Figure 21. I2C Memory Tool
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4
Jumpers and Control Utilities on the MC57xxPSIA Board
4.1
RCA and OPTICAL Jumpers
Select the jumper to reflect whether the source is RCA or Optical.
4.2
Switches
Reset is an active-low function. Pressing the master reset switch (S2) resets the TAS5755M device; USB
RESET (S1) resets the USB bus. Pressing PDN (S4) powers down the TAS5755M.
4.3
LED Indicators
LED descriptions follow:
• LED1: USB power connector installed at J1
• LED2: 3.3-V power is valid
• LED3: RCA connection made
• LED4: Optical connection made
• LED5: SPDIF signal locked
• LED6: Not Populated
• LED7: PDN switch (S4) is asserted
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Board Layouts, Schematic, and Bill of Materials
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Board Layouts, Schematic, and Bill of Materials
This section contains the TAS5755MEVM board layouts, schematic, and the bill of materials (BOM).
5.1
TAS5755MEVM Board Layout
Figure 22 shows the TAS5755MEVM top copper layer and Figure 23 shows the TAS5755MEVM bottom
copper layer.
Figure 22. TAS5755MEVM Top Copper Layer
Figure 23. TAS5755MEVM Bottom Copper Layer
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5.2
TAS5755MEVM Schematic
Figure 24 illustrates the TAS5755MEVM schematic.
PVDD
J7
PVDD RANGE
8-26.4V
PVDD
J8
NT1
DNP
GND
GND
AVSS
GND
AVDD
DVDD
PVDD
TP1
PVDD
C7
4.7µF
C6
0.1µF
C1
220µF
C8
0.1µF
C3
0.1µF
C2
220µF
C4
0.1µF
R7
DNP
15.0k
R16
AVSS
AVSS
GND
GND
GND
GND
GND
GND
R15
R14
R13
DNP
DNP
DNP
DNP
18
C32
330pF
DNP
18
C35
330pF
DNP
18
C34
330pF
DNP
18
C33
330pF
DNP
SINGLE ENDED
C30
220µF
R6
DNP
15.0k
GND
C5
10µF
PVDD
PVDD
SPLIT-CAP
PVDD
C31
220µF
PVDD
C28
220µF
R4
DNP
15.0k
GND
GND
R5
DNP
15.0k
C29
220µF
AVDD
GND
SNUBBERS
U1
GND
GND
R1
10k
J1
PDN
SCLK
SDIN
SCL
MCLK
DVDD
1
3
5
7
9
11
13
15
17
2
4
6
8
10
12
14
16
18
18
19
PVDD_AB
PVDD_AB
LRCLK
38
39
PVDD_CD
PVDD_CD
SDA
47
DVDD
RST
AVDD
9
AVDD
BST_A
17
OUT_A
OUT_A
20
21
BST_B
28
OUT_B
OUT_B
26
27
BST_C
GND
R8
10k
TP6
ADR/FAULT
ADR/FAULT
TP7
PDN
PDN
TP8
RST
RESET
GND
C12
1µF
C9
4.7µF
C10
0.1µF
GND
41
BST_D
2
VR_ANA
C11
OUT_C
OUT_C
GVDD
10
0.1µF
42
3
VR_DIG
OUT_D
OUT_D
VREG
FLTP
FLTM
DVSS_OSC
NC
NC
NC
NC
NC
NC
NC
NC
GND
5
55
56
54
AVDD
MCLK
SCLK
LRCLK
SDIN
AVDD
OSC_RES
IN = BTL MODE
OUT = PBTL MODE
R11
DNP
15k
R10
10k
SDA
SCL
53
52
J9
16
15
8
1
49
48
ADR/FAULT
PDN
RST
BTL
C17
2200pF
GND
R12
15k
GND
SDA
SCL
DVSS
DVSS
SSTIMER
PBTL
ADR/FAULT
PDN
RESET
STEST
AVSS
AVSS
GND
GND
36
37
L1
PGND
PGND
PGND
PGND
PGND
PGND
Ase
BSTB
A
SE-A
TP2
OUTA
C22
0.68µF
C19
0.033µF
OUTB
C26
DNP
J10
BSTC
J2
A
15uH
30
31
40
C18
0.033µF
OUTA
C20
0.033µF
OUTC
A
J3
GND
DNP
B
BTL-AB
L2
BSTD
C21
0.033µF
OUTD
B
Bse
15uH
C23
C13
11
12
C15
C16
6
7
22
35
43
45
50
51
0.047µF
4700pF
C14
470
0.047µF
TP3
DNP = BTL MODE
IN = PBTL MODE
AD MODE
OPTION
GND
R2
C+D
C
15uH
C27
DNP
DNP
18.2k
GND
PBTL
OUTC
0.68µF
J11
44
46
J5
TP4
C24
R9
A+B
L3
470
AVSS
4
SE-B
OUTB
4700pF
R3
J4
B
0.68µF
VR_ANA
GND
MCLK
SCLK
LRCLK
SDIN
29
BSTA
C
D
J6
BTL-CD
L4
13
14
D
GND
15uH
23
24
25
32
33
34
C25
AVSS
H1
TP5
OUTD
0.68µF
1
2
Heat Sink
TAS5755MDFD
GND
GND
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 24. TAS5755MEVM Schematic
SLOU481A – August 2017 – Revised October 2017
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TAS5755MEVM Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
19
Board Layouts, Schematic, and Bill of Materials
5.3
www.ti.com
Bill of Materials
Table 1 lists the BOM for this EVM.
Table 1. TAS5755MEVM Bill Of Materials (1)
QTY
Value
Description
Package Reference
Part Number
Manufacturer
2
220uF
CAP, AL, 220 µF, 35 V, ±20%, 0.16 ohm, SMD
SMT Radial F
EEE-FK1V221P
Panasonic
2
0.1uF
CAP, CERM, 0.1 µF, 50 V, ±10%, X7R, 1206
1206
GRM319R71H104KA01D
Murata
1
10uF
CAP, CERM, 10 µF, 10 V, ±20%, X5R, 0603
0603
C1608X5R1A106M080AC
TDK
4
0.1uF
CAP, CERM, 0.1 µF, 50 V, ±10%, X7R, 0402
0402
C1005X7R1H104K050BB
TDK
2
4.7uF
CAP, CERM, 4.7 µF, 10 V, ±10%, X5R, 0603
0603
CGB3B1X5R1A475K055AC
TDK
1
1uF
CAP, CERM, 1 µF, 25 V, ±10%, X7R, 0603
0603
GRM188R71E105KA12D
Murata
2
4700pF
CAP, CERM, 4700 pF, 50 V, ±10%, X7R, 0603
0603
GRM188R71H472KA01D
Murata
2
0.047uF
CAP, CERM, 0.047 µF, 16 V, ±10%, X7R, 0603
0603
GRM188R71C473KA01D
Murata
1
2200pF
CAP, CERM, 2200 pF, 25 V, ±10%, X7R, 0402
0402
GRM155R71E222KA01D
Murata
4
0.033uF
CAP, CERM, 0.033 µF, 50 V, ±10%, X7R, 0603
0603
GRM188R71H333KA61D
Murata
4
0.68uF
CAP, CERM, 0.68 µF, 50 V, ±10%, X7R, 1206
1206
GRM31MR71H684KA88L
Murata
4
220uF
CAP, Polymer Hybrid, 220 µF, 25 V, ±20%, 27 ohm,
8x10 SMD
8x10
EEHZA1E221P
Panasonic
1
HEAT SINK FOR TI MOD, 50x13.9mm
HEAT SINK, 50x13.9mm
ATS-TI10P-521-C1-R1
Advanced Thermal Solutions
2
MACHINE SCREW PAN PHILLIPS M3 5mm
Screw M3 Phillips head
MPMS 003 0005 PH
B&F Fastener Supply
4
MACHINE SCREW PAN PHILLIPS 4-40
Machine Screw, 4-40, 1/4
inch
PMSSS 440 0025 PH
B&F Fastener Supply
4
HEX STANDOFF 4-40 ALUMINUM 1/2"
HEX STANDOFF 4-40
ALUMINUM 1/2 inch
2203
Keystone
1
Header, 2.54mm, 9x2, Tin, TH
Header, 2.54mm, 9x2, TH
PEC09DAAN
Sullins Connector Solutions
5
Header (friction lock), 3.96mm, 2x1, Tin, R/A, TH
Header, 2x1, 3.96mm, R/A
B2PS-VH(LF)(SN)
JST Manufacturing
1
Binding Post, RED, TH
11.4x27.2mm
7006
Keystone
1
Binding Post, BLACK, TH
11.4x27.2mm
7007
Keystone
1
Header, 100mil, 2x1, Gold, TH
Sullins 100mil, 1x2, 230 mil
above insulator
PBC02SAAN
Sullins Connector Solutions
Inductor, Shielded Drum Core, Ferrite, 15 µH, 6.5 A,
0.02075 ohm, SMD
WE-PD-XXL
7447709150
Wurth Elektronik
4
(1)
20
15uH
2
10k
RES, 10 k, 5%, 0.063 W, 0402
0402
CRCW040210K0JNED
Vishay-Dale
2
470
RES, 470, 1%, 0.1 W, 0603
0603
RC0603FR-07470RL
Yageo America
1
18.2k
RES, 18.2 k, 1%, 0.1 W, 0603
0603
RC0603FR-0718K2L
Yageo America
1
10k
RES, 10 k, 5%, 0.1 W, 0603
0603
CRCW060310K0JNEA
Vishay-Dale
1
15k
RES, 15 k, 5%, 0.063 W, 0402
0402
CRCW040215K0JNED
Vishay-Dale
1
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
1
Black
Test Point, Compact, Black, TH
Black Compact Testpoint
5006
Keystone
7
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
5003
Keystone
1
2x45 W or 2 x 18W + 1 x 45W Digital Input Audio
Amplifier with Equalizer, 2-Band DRC, and Licensefree 3D Effect, DFD0056A (HTSSOP-56)
DFD0056A
TAS5755MDFD
Texas Instruments
Alternate Part Number
Alternate Manufacturer
SNT-100-BK-G
Samtec
Texas Instruments
Unless otherwise noted in the Alternate Part Number or Alternate Manufacturer columns, all parts may be substituted with equivalents.
TAS5755MEVM Evaluation Module
SLOU481A – August 2017 – Revised October 2017
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Copyright © 2017, Texas Instruments Incorporated
Board Layouts, Schematic, and Bill of Materials
www.ti.com
Table 1. TAS5755MEVM Bill Of Materials (1) (continued)
QTY
Value
Description
Package Reference
Part Number
Manufacturer
0
0.33uF
CAP, CERM, 0.33 µF, 50 V, ±10%, X7R, 1206
1206
GRM319R71H334KA01D
Murata
0
330pF
CAP, CERM, 330 pF, 50 V, ±5%, C0G/NP0, 0603
0603
GRM1885C1H331JA01D
Murata
0
Fiducial mark. There is nothing to buy or mount.
Fiducial
N/A
N/A
0
JUMPER TIN SMD
6.85x0.97x2.51 mm
S1911-46R
Harwin
RES, 15.0 k, 1%, 0.063 W, 0402
0402
CRCW040215K0FKED
Vishay-Dale
0
15.0k
0
15k
RES, 15 k, 5%, 0.063 W, 0402
0402
CRCW040215K0JNED
Vishay-Dale
0
18
RES, 18, 5%, 0.1 W, 0603
0603
CRCW060318R0JNEA
Vishay-Dale
SLOU481A – August 2017 – Revised October 2017
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Alternate Part Number
Alternate Manufacturer
TAS5755MEVM Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
21
Revision History
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (August 2017) to A Revision ..................................................................................................... Page
•
•
•
22
Changed images in the TAS5755MEVM Board Layout section. .................................................................. 18
Changed schematic. ..................................................................................................................... 19
Changed BOM. ........................................................................................................................... 20
Revision History
SLOU481A – August 2017 – Revised October 2017
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Copyright © 2017, Texas Instruments Incorporated
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
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TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
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You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
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This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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