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Texas Instruments TPA3245 Evaluation Module (Rev. A) User guides
User's Guide
SLVUAT6A – September 2016 – Revised January 2018
TPA3245 Evaluation Module
This user's guide describes the characteristics, operation, and use of the TPA3245 evaluation module
(EVM). A complete printed-circuit board (PCB) description, schematic diagram, and bill of materials are
also included.
Figure 1. TPA3245 Evaluation Module
1
2
3
4
Contents
Quick Start (BTL Mode) ..................................................................................................... 3
Setup By Mode ............................................................................................................... 5
Hardware Configuration ................................................................................................... 10
EVM Design Documents ................................................................................................. 14
List of Figures
1
TPA3245 Evaluation Module ............................................................................................... 1
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1
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2
EVM Board (Top Side) ...................................................................................................... 3
3
EVM Board (Bottom Side) .................................................................................................. 3
4
AIB Input: THD+N vs Frequency
5
AIB Input: THD+N vs Power
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
.......................................................................................... 5
............................................................................................... 5
Molex™ Input: THD+N vs Frequency .................................................................................... 5
Molex Input: THD+N vs Power ............................................................................................ 5
RCA Input: THD+N vs Frequency ........................................................................................ 5
RCA Input: THD+N vs Power ............................................................................................. 5
AIB Input: THD+N vs Frequency .......................................................................................... 8
AIB Input: THD+N vs Power ............................................................................................... 8
Molex Input: THD+N vs Frequency ....................................................................................... 8
Molex Input: THD+N vs Power ............................................................................................ 8
RCA Input: THD+N vs Frequency ........................................................................................ 8
RCA Input: THD+N vs Power ............................................................................................. 8
AIB Input: THD+N vs Frequency .......................................................................................... 9
AIB Input: THD+N vs Power ............................................................................................... 9
Molex Input: THD+N vs Frequency ..................................................................................... 10
Molex Input: THD+N vs Power .......................................................................................... 10
RCA Input: THD+N vs Frequency ....................................................................................... 10
RCA Input THD+N vs Power ............................................................................................. 10
EVM Power Tree ........................................................................................................... 13
BTL LC Frequency Response ........................................................................................... 13
SE LC Frequency Response ............................................................................................. 13
TPA3245 EVM Top Composite Assembly .............................................................................. 14
TPA3245 EVM Bottom Composite Assembly .......................................................................... 15
TPA3245EVM Board Dimensions ........................................................................................ 16
TPA3245 EVM Top Layer ................................................................................................ 17
TPA3245 EVM Bottom Layer ............................................................................................. 18
TPA3245EVM Schematic 1 ............................................................................................... 19
TPA3245EVM Schematic 2 ............................................................................................... 20
TPA3245EVM Schematic 3 ............................................................................................... 21
List of Tables
1
Jumper Configurations (BTL Mode) ....................................................................................... 4
2
Mode Selection Pins
3
4
5
6
7
8
9
10
........................................................................................................ 5
Jumper Configurations (2.1 BTL Mode) .................................................................................. 6
Jumper Configuration (PBTL Mode) ...................................................................................... 7
Jumper Configuration (SE Mode).......................................................................................... 9
Fault and Clip Overtemperature Status ................................................................................. 10
Frequency Adjust Master Mode Selection .............................................................................. 11
Overcurrent Protection Selection......................................................................................... 11
AIB Connector (J28) Pinout ............................................................................................... 12
TPA3245EVM Bill of Materials ........................................................................................... 22
Trademarks
PurePath is a trademark of Texas Instruments.
CoilCraft is a trademark of Coilcraft, Incorporated.
Molex is a trademark of Molex, LLC.
All other trademarks are the property of their respective owners.
2
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Quick Start (BTL Mode)
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1
Quick Start (BTL Mode)
This section describes the necessary hardware, connections, configuration, and steps to quick start the
EVM into bridge-tied load (BTL) mode with stereo audio playing out of two speakers.
1.1
Required Hardware
The EVM requires the following hardware:
• TPA3245EVM (AMPS030-001) power supply 18-V to 36-V DC, 15 A
• Two 2-Ω to 8-Ω, 100-W speakers or resistor loads
• Four speaker or banana cables
• RCA input cables
• Analog output audio source
1.2
Connections and Board Configuration
Figure 2 and Figure 3 show both sides of the EVM board.
Figure 2. EVM Board (Top Side)
Figure 3. EVM Board (Bottom Side)
The steps for making the connections are as follows:
1. Set S1 to the RESET position.
2. Set the power supply to 30 V (18-V to 31.5-V range) and current to 10 A (5-A to 14-A range).
3. Connect the power supply to the TPA3245EVM positive terminal to PVDD (J1-RED) and negative
terminal to GND (J1-BLACK).
4. Connect the positive side of the left channel load to the TPA3245EVM OUTA (J9-RED) terminal.
5. Connect the negative side of the left channel load to the TPA3245EVM OUTB (J9-BLACK) terminal.
6. Connect the positive side of the right channel load to the TPA3245EVM OUTC (J2-RED) terminal.
7. Connect the negative side of the right channel load to the TPA3245EVM OUTD (J2-BLACK) terminal.
8. Be careful not to mix up PVDD, OUTA, and OUTC because the colors are the same (RED).
9. Input configuration:
a. Single-ended (SE) inputs: Set J4 and J19 to SE and set J26, J27, J34, and J35 to RCA.
a. Connect the RCA male jack to the female RCA jack input A/AB (J3-RED).
b. Connect the RCA male jack to the female RCA jack input C/CD (J18-WHITE).
b. Differential inputs: Set J4 and J19 to DIFF and set J26, J27, J34, and J35 to RCA.
a. Connect the positive RCA male jack to the female RCA jack input A/AB (J3-RED) and connect
the negative RCA male jack to the female RCA jack input B (J14-BLACK).
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Quick Start (BTL Mode)
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b. Connect the positive RCA male jack to the female RCA jack input C/CD (J18-RED) and
connect the negative RCA male jack to the female RCA jack input D (J15-BLACK).
c. Analog-Input Board (AIB) input: Set J26, J27, J34, and J35 to AIB.
10. Power up the power supply after correctly making all the connections. The 3.3-V and 12-V LEDs
(GREEN) then illuminate.
11. Set S1 to the NORMAL position.
12. The CLIP_OTW (ORANGE) and FAULT (RED) LEDs must be off if the audio source is off.
Table 1 lists the jumper configurations in BTL mode.
Table 1. Jumper Configurations (BTL Mode)
4
Jumper
Setting
J29
IN
PVDD to 15-V Buck
J31
IN
12-V LDO to 12-V terminal
J32
IN
3.3-V LDO to 3.3-V terminal
J33
IN
3.3-V LDO to 3.3-V terminal
J21
OUT
CSTART SE
J16
3 to 4
Master mode
J5
2 to 3
M1 – BTL
J6
2 to 3
M2 – BTL
J22
IN
OUTA capacitor shunt
J23
IN
OUTB capacitor shunt
J24
IN
OUTC capacitor shunt
J25
IN
OUTD capacitor shunt
J26
2 to 3
INC select
J27
2 to 3
IND select
J7
OUT
PBTL select INC
TPA3245 Evaluation Module
Comment
J8
OUT
PBTL select IND
J10
OUT
INC/D DIFF input
J12
OUT
INC/D DIFF input
J4
1 to 2
INA/B SE input
J19
1 to 2
INC/D SE input
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Setup By Mode
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2
Setup By Mode
The TPA3245EVM is configurable for four different output operations. The 2.0 BTL configuration is the
default set up of the TPA3245EVM as described in Section 1.2. The remaining three configurations are
2.1 BTL plus two SE outputs, 0.1 PBTL output, and 4.0 SE outputs.
Table 2. Mode Selection Pins
Mode Pins
2.1
Input Mode
Output Configuration Description
M2
M1
0
0
2N + 1
2 × BTL
0
1
2N/1N + 1
1 × BTL + 2 × SE
1
0
2N + 1
1 × PBTL
1
1
1N + 1
4 × SE
Stereo BTL output configuration
2.1 BTL + SE mode
Paralleled BTL configuration. Connect INPUT_C and INPUT_D to
GND.
Single-ended output configuration
BTL Mode (Two-Speaker Output)
This mode is the same as described in Section 1.
2.1.1
Performance Data (BTL Mode)
All measurements are taken at an audio frequency = 1 kHz, PVDD_X = 36 V, RL = 4 Ω, fS = 600 kHz,
ROC = 22 kΩ, output filter: L = 7 μH, C = 0.68 µF, with AES17 + AUX-0025 measurement filters.
10
10
1W
20 W
60 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.01
0.001
0.0001
20
0.1
100
1k
Frequency (Hz)
10k
0.001
10
20k
100
D001
Figure 4. AIB Input: THD+N vs Frequency
1k
Power (W)
10k
100k
D009
Figure 5. AIB Input: THD+N vs Power
10
10
1W
20 W
60 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
0.001
0.0001
20
100
1k
Frequency (Hz)
10k
20k
0.001
0.01
D004
Figure 6. Molex™ Input: THD+N vs Frequency
0.1
1
Power (W)
10
100
D012
Figure 7. Molex Input: THD+N vs Power
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10
10
1W
20 W
60 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
0.001
0.0001
20
200
2000
Frequency (Hz)
0.001
0.01
20000
Figure 8. RCA Input: THD+N vs Frequency
2.2
0.1
D007
1
Power (W)
10
100
D015
Figure 9. RCA Input: THD+N vs Power
BTL MODE (Three-Speaker Output)
OUTC and OUTD are the SE output channels and OUTA and OUTB are the BTL channels for 2.1
operations. OUTC and OUTD can only be in DIFF input mode.
1. Set J6 to L and J5 to H.
2. Remove jumpers J24 and J25.
3. Connect the positive side of the left channel load to OUTC (J2- RED) terminal and the negative side of
the left channel load to the GND (J20) terminal.
4. Connect the positive side of the right channel load to OUTD (J2-BLACK) terminal and the negative
side of the right channel load to the GND (J20) terminal.
5. Connect the positive terminal to OUTA (J9-RED) and the negative terminal to OUTB (J9-BLACK).
6. Set the J19 jumper position to DIFF.
7. Input configuration:
a. SE inputs: Connect the RCA male jack to the female RCA jack input A/AB (J3-RED) and set the J4
jumper positions to SE. Set J26, J27, J34, and J35 to RCA.
b. Differential inputs: Connect the positive RCA male jack to the female RCA jack input A/AB ( J3RED) and connect the negative RCA male jack to the female RCA jack input B (J14-BLACK) and
set the J4 jumper positions to DIFF. Set J26, J27, J34, and J35 to RCA.
c. AIB inputs: Set J26, J27, J34, and J35 to AIB.
Table 3. Jumper Configurations (2.1 BTL Mode)
6
TPA3245 Evaluation Module
Jumper
Setting
J29
IN
Comment
PVDD to 15-V Buck
J32
IN
12-V LDO to 12-V terminal
J33
IN
3.3-V LDO to 3.3-V terminal
J36
IN
12-V LDO to GVDD
J16
3 to 4
Master mode 600 kHz
J22
IN
OUTA capacitor shunt
J23
IN
OUTB capacitor shunt
J24
OUT
OUTC capacitor shunt
J25
OUT
OUTD capacitor shunt
J5
1 to 2
M1 – H
J6
2 to 3
M2 – L
J7
OUT
PBTL SELECT INC
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2.3
PBTL Mode (One-Speaker Output)
This mode uses all four half bridges for a mono output, allowing for the maximum power output from the
device across one load.
2.3.1
1.
2.
3.
4.
5.
Connections and Board Configuration
Set J6 to H and J5 to L.
Connect the positive side of the load to OUTA (J9-RED) and OUTC (J2-RED) terminals (OUTA and
OUTC shorted).
Connect the negative side of the load to OUTB (J9-BLACK) and OUTD (J2-BLACK) terminals (OUTB
and OUTD shorted).
Install PBTL jumpers J7 and J8 (pulls input C and input D to GND).
Input configuration:
a. SE inputs: Connect the RCA male jack to the female RCA jack input A/AB (J3-RED) and set the J4
jumper positions to SE. Set J26, J27, J34, and J35 to RCA.
b. Differential inputs: Connect the positive RCA male jack to the female RCA jack input A/AB (J3RED) and connect the negative RCA male jack to the female RCA jack input B (J14-BLACK). Set
the J4 jumper position to DIFF, and set J26, J27, J34, and J35 to RCA.
c. AIB input: Set J26, J27, J34, and J35 to AIB.
Table 4. Jumper Configuration (PBTL Mode)
Jumper
Setting
J29
IN
Comment
PVDD to 15-V Buck
J31
IN
12-V LDO to 12-V terminal
J32
IN
3.3-V LDO to 3.3-V terminal
J33
IN
3.3-V LDO to 3.3-V terminal
J21
OUT
CSTART SE
J16
3 to 4
Master mode
J5
2 to 3
M1 – PBTL
J6
1 to 2
M2 – PBTL
J22
IN
OUTA capacitor shunt
J23
IN
OUTB capacitor shunt
J24
IN
OUTC capacitor shunt
J25
IN
OUTD capacitor shunt
J26
2 to 3
INC select
J27
2 to 3
IND select
J7
2 to 3
PBTL select INC – GND
J8
2 to 3
PBTL select IND – GND
J10
OUT
INC/D DIFF input
J12
OUT
INC/D DIFF input
J4
1 to 2
INA/B SE input
J19
1 to 2
INC/D SE input
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Setup By Mode
2.3.2
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Performance Data (PBTL Mode)
All measurements are taken at an audio frequency = 1 kHz, PVDD_X = 36 V, RL = 4 Ω, ƒS = 600 kHz,
ROC = 22 kΩ, output filter: L = 7 μH, C = 0.68 µF, with AES17 + AUX-0025 measurement filters.
10
10
1W
40 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
0.001
0.0001
20
200
2000
Frequency (Hz)
0.001
10
20000
100
D002
Figure 10. AIB Input: THD+N vs Frequency
1k
Power (W)
10k
100k
D010
Figure 11. AIB Input: THD+N vs Power
10
10
1W
40 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
0.001
0.0001
20
100
1k
Frequency (Hz)
0.001
0.01
10k
0.1
D005
Figure 12. Molex Input: THD+N vs Frequency
1
Power (W)
10
100
D013
Figure 13. Molex Input: THD+N vs Power
10
10
1W
40 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
0.001
0.0001
20
100
1k
Frequency (Hz)
10k
20k
Figure 14. RCA Input: THD+N vs Frequency
2.4
0.001
0.01
D008
0.1
1
Power (W)
10
100
D016
Figure 15. RCA Input: THD+N vs Power
SE Mode (Four-Speaker Output)
1. Set J6 to H and J5 to H.
2. Remove jumpers J22, J23, J24, and J25.
3. Connect the positive side of the load to the OUTA (J9-RED) terminal and the negative side of the load
to the GND (J11) terminal.
4. Connect the positive side of the load to the OUTB (J9-BLACK) terminal and the negative side of the
load to the GND (J11) terminal.
5. Connect the positive side of the load to the OUTC (J2-RED) terminal and the negative side of the load
to the GND (J20) terminal.
6. Connect the positive side of the load to the OUTD (J2-BLACK) terminal and the negative side of the
load to the GND (J20) terminal.
7. Set both J4 and J19 jumpers position to DIFF.
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8. Input configuration:
a. Differential inputs: Set J26, J27, J34, and J35 to RCA.
i. Connect the male RCA jack to the female RCA jack input A/AB (J3-RED) for the OUTA
speaker.
ii. Connect the male RCA jack to the female RCA jack input B (J14-BLACK) for the OUTB
speaker.
iii. Connect the male RCA jack to the female RCA jack input C/CD (J18-WHITE) for the OUTC
speaker.
iv. Connect the male RCA jack to the female RCA jack input D (J15-BLUE) for the OUTD
speaker.
b. AIB input: Set J26, J27, J34, and J35 to AIB.
Table 5. Jumper Configuration (SE Mode)
Jumper
Setting
Comment
J29
IN
PVDD to 15-V Buck
J32
IN
12-V LDO to 12-V terminal
J33
IN
3.3-V LDO to 3.3-V terminal
J36
IN
12-V LDO to GVDD
J16
3 to 4
Master mode 600 kHz
J22
OUT
OUTA capacitor shunt
J23
OUT
OUTB capacitor shunt
J24
OUT
OUTC capacitor shunt
J25
OUT
OUTD capacitor shunt
J5
1 to 2
M1 – H
J6
1 to 2
M2 – H
J7
OUT
PBTL SELECT INC
J8
OUT
PBTL SELECT IND
J4
2 to 3
INA/B DIFF INPUT
J19
2 to 3
INC/D DIFF INPUT
J26
1 to 2
INC-SEL RCA
J27
1 to 2
IND-SEL RCA
J34
1 to 2
INA-SEL RCA
J35
1 to 2
INB-SEL RCA
J21
IN
C_START
NOTE: The performance of the TPA3245EVM and TPA3245D2DDV is dependent on the power
supply. Design the power supply with margins that can deliver the required power. Some
low-frequency applications can require additional bulk capacitance. Replacing the bulk
capacitors on the TPA3245EVM with 3300 µF or more capacitance can be necessary,
depending on the power supply used.
2.4.1
Performance Data (SE Mode)
All measurements are taken at audio frequency = 1 kHz, PVDD_X = 36 V, RL = 4 Ω, ƒS = 600 kHz, ROC =
22 kΩ, output filter: L = 7 μH, C = 0.68 µF, with AES17 + AUX-0025 measurement filters.
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Hardware Configuration
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10
10
1W
5W
20 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.01
0.001
20
0.1
100
1k
Frequency (Hz)
10k
0.001
0.01
20k
0.1
D003
Figure 16. AIB Input: THD+N vs Frequency
1
Power (W)
10
100
D011
Figure 17. AIB Input: THD+N vs Power
10
10
1W
5W
20 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.001
20
0.1
0.01
100
1k
Frequency (Hz)
10k
0.001
0.01
20k
0.1
D006
Figure 18. Molex Input: THD+N vs Frequency
1
Power (W)
10
100
D014
Figure 19. Molex Input: THD+N vs Power
10
10
1W
5W
20 W
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.001
20
0.1
0.01
200
2000
Frequency (Hz)
20000
0.001
0.01
D018
Figure 20. RCA Input: THD+N vs Frequency
3
Hardware Configuration
3.1
Indicator Overview (OTW_CLIP and FAULT)
0.1
1
Power (W)
10
100
D017
Figure 21. RCA Input THD+N vs Power
The TPA3245EVM is equipped with LED indicators that illuminate when the FAULT or CLIP_OTW pin (or
both) goes low. See Table 6 and TPA3245 115-W Stereo, 230-W Mono PurePath™ Ultra-HD AnalogInput Class-D Amplifier for more details on which events trigger the pins to go low.
Table 6. Fault and Clip Overtemperature Status
10
FAULT
CLIP_OTW
0
0
Overtemperature (OTE) or overload (OLP) or undervoltage (UVP). Junction temperature higher
than 125°C (overtemperature warning).
0
0
Overload (OLP) or undervoltage (UVP). Junction temperature higher than 125°C (overtemperature
warning).
0
1
Overload (OLP) or undervoltage (UVP). Junction temperature lower than 125°C.
1
0
Junction temperature higher than 125°C (overtemperature warning)
1
1
Junction temperature lower than 125°C and no OLP or UVP faults (normal operation)
TPA3245 Evaluation Module
Description
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3.2
PWM Frequency Adjust
The TPA3245EVM offers a hardware-trimmed oscillator frequency through the external control of the
FREQ_ADJ pin. Use the frequency adjust to reduce interference problems while using a radio receiver
tuned within the AM band and change the switching frequency from nominal values to lower values (see
Table 7). Choose these values such that the nominal- and the lower-value switching frequencies together
result in the fewest cases of interference throughout the AM band. Select the oscillator frequency based
on the value of the FREQ_ADJ resistor connected to GND in master mode.
Table 7. Frequency Adjust Master Mode Selection
Master Mode
Resistor to GND
PWM Frequency
Nominal
10 kΩ
600 kHz
AM1
20 kΩ
500 kHz
AM2
30 kΩ
450 kHz
For slave-mode operation, turn off the oscillator by pulling the FREQ_ADJ pin to 3.3 V. This action
configures the OSC_I/O pins as inputs, which are to be slaved from an external differential clock. In a
master and slave system, interchannel delay is automatically set up between the switching phases of the
audio channels, which can be illustrated by no idle channels switching at the same time. This setup does
not influence the audio output; rather, only the switch timing to minimize noise coupling between audio
channels through the power supply. In turn, this process optimizes audio performance and results in better
operating conditions for the power supply. The interchannel delay is setup for a slave device depending on
the polarity of the OSC_I/O connection, such that slave mode 1 is selected by connecting OSC_I/O of the
master device in phase with OSC_I/O of the slave device (+ to + and – to –), while slave mode 2 is
selected by connecting the OSC_I/Os out of phase (+ to – and – to +).
3.3
TPA3245EVM Overcurrent Adjust
The TPA3245EVM offers the ability to change the current limit by changing R13 as well as having two
different protection modes; Cycle-by-Cycle Current Control (CB3C) and Latching Shutdown (Latched OC).
For CB3C operations, the resistance must be a value of 22 kΩ to 30 kΩ. For Latched OC operations, the
resistance must be a value of 47 kΩ to 64 kΩ. By default, the resistor R13 is 22 kΩ. Table 8 shows a few
resistance values and their corresponding OC threshold and OC protection mode.
Table 8. Overcurrent Protection Selection
3.4
OC_ADJ Resistor
Value
Protection Mode
OC Threshold
22 kΩ
CB3C
16.3 A
24 kΩ
CB3C
15.1 A
27 kΩ
CB3C
13.5 A
30 kΩ
CB3C
12.3 A
47 kΩ
Latched OC
16.3 A
51 kΩ
Latched OC
15.1 A
56 kΩ
Latched OC
13.5 A
64 kΩ
Latched OC
12.3 A
TPA3245EVM Single-Ended and Differential Inputs
The TPA3245EVM supports both differential and SE inputs. For SE inputs, set either the J4 or J19 jumper
(or both) to the SE position so that the TPA3245EVM uses the OPA1678 operational amplifier (op amp) to
convert the SE input signal to differential to properly drive the differential inputs of the TPA3245 device.
Use input RCA jack J3 to provide INA and INB inputs. Use RCA jack J18 to provide INC and IND inputs
with SE inputs. For differential input operation, set either the J4 or J19 jumpers (or both) to the DIFF
position. The TPA3245EVM uses the OPA1678 to buffer the differential input signal to the differential
inputs of the TPA3245 device. Use input RCA jack J3 to provide INA, RCA jack J14 to provide INB, RCA
jack J18 to provide INC, and RCA jack J15 to provide IND with differential inputs.
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NOTE: The SE input settings on the TPA3245EVM must only be used for channels with output
configuration BTL or PBTL, not SE. For SE output configuration, either jumper J4 or J19 (or
both), must be set for that channel to the DIFF position so that the input signal INx is
mapped directly to OUTx.
3.5
Input Connectors
The TPA3245EVM supports three different input connectors. J3, J14, J15, and J18 are RCA connectors.
J10 and J12 are Molex connectors, and J28 is the AIB connector with J30 being the AIB alignment
connection. Table 9 shows the AIB pinout in detail.
Table 9. AIB Connector (J28) Pinout
12
Pin
No.
Function
Audio EVM Input
or Output
1
Amp Out A
Speaker-level output from audio class-D EVM (SE or one side of BTL)
O
2
Amp Out B
Speaker-level output from audio class-D EVM (SE or one side of BTL)
O
O
-
Description
3
PVDD
PVDD voltage supply from audio class-D EVM (variable voltage depending on
class-D EVM use)
4
GND
Ground reference between audio plug-in module and audio class-D EVM
5
NC
-
-
6
NC
-
-
7
3.3 V
3.3-V supply from EVM; used for powering audio plug-in module
O
8
3.3 V
3.3-V supply from EVM; used for powering audio plug-in module
O
9
12 V
12-V supply from EVM; used for powering audio plug-in module
O
10
EN and Reset
Assert enable and reset control for audio class-D EVM (active low)
I
11
Analog IN_A
12
NC
13
Analog IN_B
Analog audio input B (analog in EVM), bit clock I2S bus (digital in EVM)
I
14
CLIP_OTW
Clipping detection, overtemperature warning, or both from audio class-D EVM
(active low)
O
15
Analog IN_C
Analog audio input C (analog in EVM), frame clock I2S bus (digital in EVM)
I
Fault detection from audio class-D EVM (active low)
O
Analog audio input A (analog in EVM), Master I2S bus (digital in EVM)
-
I
-
16
FAULT
17
Analog IN_D
18
NC
-
-
19
NC
-
-
20
NC
-
-
21
GND
Ground reference between audio plug-in module and audio class-D EVM
-
22
GND
Ground reference between audio plug-in module and audio class-D EVM
-
23
NC
-
-
24
NC
-
-
25
NC
-
-
Analog audio Input D (analog in EVM), data in I2S bus (digital in EVM)
26
NC
27
Amp Out C
Speaker-level output from audio class-D EVM (SE or one side of BTL)
O
28
Amp Out D
Speaker-level output from audio class-D EVM (SE or one side of BTL)
O
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3.6
EVM Power Tree
The EVM power section is self-contained with all the necessary onboard voltages generated from the
main PVDD (J1) power input. The PVDD is reduced to 15 V and then used to generate the remaining
required board voltages of 12 V, 5 V, and 3.3 V. Low-dropout linear regulators (LDOs) generate supplies
going to the TPA3245 device itself to reduce the chance of extra added noise. LEDs are provided on the
5-V and 3.3-V supplies for easy verification that the EVM is powered (see Figure 22).
12 V
15 V
PVDD
J29
LM5010ASD
J31
LM2940IMP-12
J32
TLV117-33IDCY
J36
J33
3.3 V
GVDD
Figure 22. EVM Power Tree
3.7
LC Filter Overview
Included near the output of the TPA3245 device are four output LC filters. These output filters filter the
pulse-width modulation (PWM) output, leaving only the audio content at high power, which is fed to the
speakers. The board uses a CoilCraft™ 7-µH inductor and a 0.68-µF film capacitor to form this LC filter.
Using the equations listed in LC Filter Design Application Report, the low-pass filter cutoff is calculated as
follows in Equation 1:
Fcut
off
1
1
2S L u C
2S 7 PH u .68 PF
Figure 23. BTL LC Frequency Response
3.8
72.9 kHz
(1)
Figure 24. SE LC Frequency Response
Post-Filter Feedback (PFFB)
The TPA3245EVM has the footprints available to implement post-filter feedback to improve the audio
performance of the TPA3245 amplifier. For more details on benefits and implementation, see TPA324x
and TPA325x Post-Filter Feedback.
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3.9
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Reset Circuit
The TPA3245EVM includes RESET supervision so that the TPA3245 device remains in reset until all the
power rails are up and stable. The RESET supervisor also ensures that the device is put into reset if one
of the power rails experiences a brownout. This circuit combined with the RESET switch (S1) help ensure
that the TPA3245 can be placed in reset easily as needed or automatically if there is a power supply
issue.
3.10 Op Amp vs Direct Drive
The op amps are used to change a single-ended input into a differential input. By default, the gain of the
op amps are set for unity gain; however, this can be modified to increase or decrease the gain through the
op amps. One way to bypass the op amps for a more direct connection is using the AIB.
4
EVM Design Documents
This section contains the TPA3245EVM board layout, schematics, and bill of materials (BOM).
4.1
TPA3245EVM Board Layouts
Figure 25 and Figure 26 illustrate the EVM board layouts.
Figure 25. TPA3245 EVM Top Composite Assembly
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Figure 26. TPA3245 EVM Bottom Composite Assembly
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4.2
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TPA3245EVM Board Layouts
Figure 27 shows the EVM board dimensions.
Figure 27. TPA3245EVM Board Dimensions
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4.3
TPA3245 EVM Board Debug Plots
Figure 28 and Figure 29 illustrate the TPA3245EVM Debug plots
Figure 28. TPA3245 EVM Top Layer
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Figure 29. TPA3245 EVM Bottom Layer
18
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4.4
TPA3245 EVM Schematics
Figure 30 through Figure 32 illustrate the TPA3245EVM schematics.
1
2
3
J34 INA-SEL
C20
J3
1
INA/AB
2
3
LEFT+
INPUT SE A
SE AB
DIFF A+
R9
C17
R7
INA-RCA
C18
22pF
10.0k
10µF
IN-A_RCA
R8
10.0k
100k
R52
0
R4
0
INA-SEL
R47
18.0k
R11
R41
J10
<-
2.00k
C73
22pF
OUTA
J35 INB-SEL
10.0k
U5A
AGND1
GND
From DUT
2
ROUTED
GROUND
VMID
3
1
A
U5B
R42
10.0k
OPA1678IDGKR
6
VMID
R14
2.00k
C74
22pF
OUTB
IN-B_RCA
7
B
5
C37
220pF
GND
R49
18.0k
OPA1678IDGKR
J4
LEFT-
10µF
22pF
AGND1
1
2
3
1
2
3
C71
J14
1
INB
2
3
RCA INPUT
To DUT
INA
C26
220pF
C23
1
2
3
RCA INPUT
INB-RCA
R43
10µF
C28
+12V-OA
SE
8
DIFF
R59
V+
0
R12
0
INB-SEL
INB
V-
To DUT
10µF
4
IN A/B
OPA1678IDGKR
100k
INPUT SE B
DIFF A-
U5C
GND
SPKB-OUT R63
SPKA-OUT R64
AGND1
0
0
INA-AIB
INB-AIB
PBTL
SELECT
J28
SPKB-OUT
RESET
FROM DUT
R53
RESET-SW
3.3V
1.00k
SPKA-OUT
PVDD
1
0
3 R67
5 DNP
3.3V
+12V
7
9
11 INA-AIB
13 INB-AIB
15 INC-AIB
17 IND-AIB
19
3.3V
R36
10.0k
21
23
25
SPKC-OUT
27
2
4
6
8
10
12
14
16
18
20
22
24
26
28
RST-AIB
CLIP_OTW
FAULT
SPKD-OUT
AIB
ALIGNMENT
HEADER
J30
J7
1
2
NT1
Net-Tie
GND
AUDIO
INC
AGND1
INTERFACE
GND
NT2
BOARD
J8
1
2
Net-Tie
AGND2
GND
IND
GND
GND
SPKC-OUT R65
SPKD-OUT R66
GND
0
0
1
2
3
J26 INC-SEL
RIGHT+
C62
J18
1
INC/CD
2
3
RCA INPUT
INC-RCA
10µF
R20
C55
R60
0
R44
0
INC-SEL
R21
10.0k
R45
100k
INPUT SE C
SE CD
DIFF C+
INC-AIB
IN-C_RCA
C57
22pF
10.0k
INC
C45
220pF
R50
18.0k
U6C
+12V-OA
8
V+
V-
4
R18
2.00k
R22
2.00k
C75
To DUT
10µF
22pF
OUTC
J12
U6A
1
2
3
AGND2
OPA1678IDGKR
3
From DUT
GND
2
VMID
GND
A
1
J27 IND-SEL
DNP
C61
220pF
AGND2
C65
OPA1678IDGKR
1
2
3
GND
22pF
J19
1
IND
2
3
RCA INPUT
RIGHT-
C66
J15
IND-RCA
10µF
R48
100k
INPUT SE D
DIFF C-
1
2
3
SE
R25
DIFF
10.0k
IND-AIB
C76
22pF
OUTD
R51
18.0k
C63
R62
0
R46
0
IND-SEL
IND
To DUT
10µF
IN C/D
U6B
R27
10.0k
6
VMID
5
B
7
IN-D_RCA
OPA1678IDGKR
AGND2
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Figure 30. TPA3245EVM Schematic 1
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Hi Current Shunt
+12V GVDD
GVDD
PVDD
C31
1000µF
50V
C14
0.1uF
R5
INPUT_A
PVDD-AB
GVDD_AB
0
INA
J22
TP4
R3
C32
1µF
50V
GND
GVDD
GND
GND
TP8
10µH
GND
INPUT_B
C47
1µF
50V
GND
FROM ANALOG MUX
GND
GND
R19
R1
GVDD-AB
TP15
VDD
TP16
GVDD-CD
TP17
GVDD_CD
0
INPUT_C
C69
0.1uF
100
C58
100pF
C40
GND
INA
TP20
INB
TP21
INC
TP22
IND
TP23
INPUT_D
IND
100
C64
100pF
3.3V
GND
M1
1µF
INPUT_A
PVDD_CD
PVDD_CD
PVDD_CD
1
GVDD_AB
2
VDD
22
11
14
5
M1
M2
3
4
RESET
TP13
C49
0.047µF
GND
18
OUT_A
OUT_A
M1 INPUT MODE OUTPUT
OUT_D
OUT_D
OUT_A
40
39
35
OUT_B
32
OUT_C
C34
OUT_B
C35
0.68µF
250V
BST_D
CLIP OTW
VBG
FAULT
J11
GND
GND
GND
GND
GND
GND
GND
GND
GND
OC_IOP
OC_IOM
FREQ_ADJ
GND
PWMD
TP9
24
C52
0.033µF
23
C54
0.033µF
C42
C43
0.68µF
250V
L9
CLIP_OTW
VBG
21
20
19
VBG
TP27
FAULT
42
41
34
33
26
25
13
12
4
3
1
2
C86
1µF
OUTC
OUTC
OC
10µH
1500µF
63V
TP11
J2
C44
1000pF
50V
GND
GND
Hi Current Shunt
GND
C_START
GNDAB
J24
OUT_D
28
27
RESET
TP10
C36
1000pF
50V
Hi Current Shunt
OC_ADJ
M1
M2
1500µF
63V
GND
L4
BST_C
OUTB
OUTB
OB
10µH
PWMA
TP2
OUT_C
INPUT_D
C68
0.1µF
J25
7µH
L5
GND
C56
OUT_D
C59
0.68µF
250V
OUTD
OUTD
OD
10µH
1500µF
63V
TP12
C60
1000pF
50V
TPA3245DDVR
GND
J20
GND
4
3
2
1
DESCRIPTION
GND
J23
PWMB
TP5
INPUT_A
GND
GNDCD
H1
FREQ_ADJ
TP26
M2
J9
7µH
TP6
10
9
TP3
C25
1000pF
50V
GND
L3
J17
MODE PIN SELECTION
C85
1µF
PWMC
TP7
INPUT_C
C_START
GND
0.033µF
OUT_C
INPUT_B
8
GND
0.033µF
C29
AVDD
6
15
C50
0.47µF
MODE
SELECTION
C27
43
OUT_B
17
C_START
OSCILLATOR
SYNC
INTERFACE
44
BST_B
DVDD
16
7
BST_A
GVDD_CD
INPUT_D
OC-ADJ
TP24
R13
J21
OUT = BTL
M2
PVDD_AB
PVDD_AB
PVDD_AB
31
30
29
INPUT_C
RESET
IN = SE
38
37
36
INPUT_B
GND
3.3V
2
OUTA
OUTA
1500µF
63V
Hi Current Shunt
22.0k
TP28
GND
J6
GVDD_CD
DVDD
TP18
AVDD
TP19
GND
M1
1
2
3
VDD
M2
TP25
1
2
3
GVDD_AB
1µF
C41
GND
R23
J5
GND
GVDD
GND
3
1
U4
C48
1µF
50V
100
C30
100pF
4
PVDD-CD
C46
1000µF
50V
C22
0.1uF
C24
0.68µF
250V
L8
GND
PVDD
L7
VDD
INC
C21
OA
10µH
C19
100pF
R10
L2
OUT_A
J36
GVDD
100
INB
C33
1µF
50V
TP14
R57
FAULT
C77
1µF
C78
1µF
C79
1µF
C80
1µF
GND
3.30
GND
0
0
2N + 1
2xBTL
STEREO BTL OUTPUT, A D MODE
0
1
2N/1N + 1
1xBTL + 2xSE
2.1 BTL + SE MODE, AD MODE
1
0
2N + 1
1xPBTL
PARALLEL BTL OUTPUT, A D MODE
1
1
1N + 1
4xSE
SINGLE ENDED OUTPUT, A D MODE
TP1
GND
CLIP_OTW
R54
GND
TO
ANALOG
MUX
3.30
3.3V
J16
R17
10.0k
R16
20.0k
R15
GND
2
4
6
8
1
3
5
7
SLAVE MODE
MASTER MODE (600kHz)
MASTER MODE AM1 (500kHz)
MASTER MODE AM2 (450kHz)
GND
TO AIB CONNECTOR
R55
CLIP_OTW
OUTA
3.30
FAULT
30.0k
FREQUENCY
ADJUST
OUTB
GND
RESET-SW
OUTC
R56
OUTD
3.30
GND
PVDD
GVDD
RESET CONTROL
R6
100k
4
VDD
5
6
5
RESET-SW
3
C84
1µF
50V
RESET
3
R24
47k
R30
R26
3.30k
1
MR
GND
GND
1
2
C82
+12V
R31
RESET
RESET-SW
S1
3.3V
+12V
DNP
U7
C83
1µF
50V
4
3.3V
J13
R32
8.66k
FAULT
0
FAULT
R29
R28
47k
1.00k
R35
100
0.1uF
C67
0.1uF
CLIP_OTW
1.00k
R33
D2
OTW
Orange
Q1
100
MONITORS
TPS3802K33DCKR
GND
GND
GND
GND
GND
GND
RESET
GND
D4
FAULT
Red
Q2
GND
GND
GND
GND
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Figure 31. TPA3245EVM Schematic 2
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PVDD
PVDD
PVDD MAX = 30V
J1
U1
D3
3A
C39
47µF
50V
C3
1µF
50V
C4
2.2µF
50V
C11
0.01µF
50V
10
C2
0.1µF
50V
182k
GND
8
7
5
C12
4700pF
4
GND
RON/SD
SS
2
D1
1A
3
R39
4.99k
Hi Current Shunt
11
DAP
R40
1.00k
LM5010ASD/NOPB
GND
C7
5600pF
6
FB
SGND
+15V
J31
15V-VR
1
SW
ISEN
RTN
C13
GND
L1
0.1uF
C1
0.047µF
100µH 1.5A
9
VCC
BST
R2
J29
PVDD-IN
GND
VIN
GND
GND
GND
+15V
+12V
U2
1
4
C6
4.7µF
C8
0.47µF
IN
OUT
TAB
GND
3
+12V
C5
47µF
LM2940IMP-12/NOPB
GND
GND
12V-VR
2
GND
GND
C9
0.1uF
R58
D6
Green
J32
12V
1.50k
12V
GND
GND
GND
3.3V
U3
+12V
3
3.3V
IN
C38
10µF
3.3V-VR
2
4
OUTPUT
OUTPUT
360
GND
C10
100µF
1
GND
R34
D5
Green
3.3V
TLV1117-33IDCY
GND
J33
3.3V
GND
+12V
GND
+12V-OA
L6
+12V-OA
VMID
R37
10uH
0.8A
10.0k
C81
10µF
C16
10µF
C15
0.1uF
C53
10µF
R38
10.0k
C51
0.1uF
NT3
GND
GND
GND
GND
C89
10µF
C70
10µF
C72
0.1uF
C87
10µF
C88
0.1uF
GND-VMID
Net-Tie
GND
GND
GND
GND
GND
GND
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Figure 32. TPA3245EVM Schematic 3
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TPA3245EVM Bill of Materials
Table 10 lists the TPA3245EVM BOM.
Table 10. TPA3245EVM Bill of Materials
Designator
Qty
Value
!PCB
1
C1
1
0.047uF
C2, C9, C13, C14, C15, C22,
C51, C67, C68, C69, C72,
C82, C88
13
0.1uF
C3, C32, C33, C47, C48, C83,
C84
7
1uF
C4
1
C5
1
C6
Description
Package Reference
Printed Circuit Board
Part Number
Manufacturer
AAP072
Any
CAP, CERM, 0.047 µF, 25 V, +/- 10%, X7R, 0402
0402
GRM155R71E473KA88D
Murata
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0603
0603
C0603C104K5RACTU
Kemet
CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, 0603
0603
UMK107AB7105KA-T
Taiyo Yuden
2.2uF
CAP, CERM, 2.2 µF, 50 V, +/- 10%, X7R, 0805
0805
C2012X7R1H225K125AC
TDK
47uF
CAP, AL, 47 µF, 16 V, +/- 20%, 0.36 ohm, SMD
SMT Radial D
EEE-FK1C470P
Panasonic
1
4.7uF
CAP, CERM, 4.7 µF, 25 V, +/- 10%, X7R, 1206
1206
GRM31CR71E475KA88L
Murata
C7
1
5600pF
CAP, CERM, 5600 pF, 50 V, +/- 10%, X7R, 0603
0603
GRM188R71H562KA01D
Murata
C8, C50
2
0.47uF
CAP, CERM, 0.47 µF, 25 V, +/- 10%, X7R, 0603
0603
GRM188R71E474KA12D
Murata
C10
1
100uF
CAP, AL, 100 µF, 6.3 V, +/- 20%, 0.7 ohm, SMD
SMT Radial C
EEE-FK0J101UR
Panasonic
C11
1
0.01uF
CAP, CERM, 0.01 µF, 50 V, +/- 10%, X7R, 0603
0603
C0603C103K5RACTU
Kemet
C12
1
4700pF
CAP, CERM, 4700 pF, 50 V, +/- 10%, X7R, 0603
0603
C0603X472K5RACTU
Kemet
C16, C53, C70, C81, C89,
C90
6
10uF
CAP, CERM, 10 µF, 16 V, +/- 10%, X5R, 0805
0805
EMK212BJ106KG-T
Taiyo Yuden
C17, C28, C55, C63
4
10uF
CAP, CERM, 10 µF, 16 V, +/- 10%, X7R, 1206
1206
GRM31CR71C106KAC7L
Murata
C18, C23, C57, C65
4
22pF
CAP, CERM, 22 pF, 50 V, +/- 5%, C0G/NP0, 0603
0603
GRM1885C1H220JA01D
Murata
C19, C30, C58, C64
4
100pF
CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0, 0603
0603
GRM1885C1H101JA01D
Murata
C20, C38, C62, C66, C71
5
10uF
CAP, AL, 10 µF, 16 V, +/- 20%, 1.35 ohm, SMD
SMT Radial B
EEE-FK1C100R
Panasonic
C21, C34, C42, C56
4
1500uF
CAP, AL, 1500 µF, 63 V, +/- 20%, 0.03 ohm, AEC-Q200 Grade 2, TH
Dia 18mm
EEU-FC1J152
Panasonic
C24, C35, C43, C59
4
0.68uF
CAP, Film, 0.68 µF, 250 V,+/- 5%, TH
18x9x17.5mm
B32652A3684J
TDK
C27, C29, C52, C54
4
0.033uF
CAP, CERM, 0.033 µF, 25 V, +/- 10%, X7R, 0603
0603
GRM188R71E333KA01D
Murata
C31, C46
2
1000uF
CAP, AL, 1000 µF, 50 V, +/- 20%, 0.034 ohm, AEC-Q200 Grade 2, TH
D16xL25
EEU-FC1H102
Panasonic
C39
1
47uF
CAP, AL, 47 µF, 50 V, +/- 20%, 0.68 ohm, SMD
SMT Radial E
EEE-FK1H470P
Panasonic
C40, C41
2
1uF
CAP, CERM, 1 µF, 16 V, +/- 10%, X7R, 0603
0603
GRM188R71C105KA12D
Murata
C49
1
0.047uF
CAP, CERM, 0.047 µF, 50 V, +/- 10%, X7R, 0603
0603
GRM188R71H473KA61D
Murata
D1
1
100V
Diode, Schottky, 100 V, 1 A, SMA
SMA
B1100-13-F
Diodes Inc.
D2
1
Orange
LED, Orange, SMD
LED_0805
LTST-C170KFKT
Lite-On
D3
1
100V
Diode, Schottky, 100 V, 3 A, SMA
SMA
SK310A-TP
Micro Commercial Components
D4
1
Red
LED, Red, SMD
Red 0805 LED
LTST-C170KRKT
Lite-On
D5, D6
2
Green
LED, Green, SMD
LED_0805
LTST-C171GKT
Lite-On
H1
1
HEATSINK TI TAS5612 AND TAS5614
HEATSINK TI TAS5612 AND
TAS5614
ATS-TI1OP-563-C1-R0
Advanced Thermal Solutions
H2, H3, H4, H5, H6, H12, H13
7
MACHINE SCREW PAN PHILLIPS M3
M3 Screw
RM3X8MM 2701
APM HEXSEAL
H7, H8, H9, H10, H11
5
Standoff, Hex,25mm Length, M3, Aluminum
Standoff M3
24438
Keystone
J1, J2, J9
3
Dual Binding Posts with Base, 2x1, TH
Dual Binding Posts with Base,
2x1, TH
6883
Pomona Electronics
22
TPA3245 Evaluation Module
SLVUAT6A – September 2016 – Revised January 2018
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Copyright © 2016–2018, Texas Instruments Incorporated
EVM Design Documents
www.ti.com
Table 10. TPA3245EVM Bill of Materials (continued)
Designator
Description
Package Reference
Part Number
Manufacturer
J3
Qty
1
Value
RCA Jack, Vertical, Red, TH
RCA JACK, RED
RCJ-022
CUI Inc.
J4, J5, J6, J19, J26, J27, J34,
J35
8
Header, 100mil, 3x1, Gold, TH
PBC03SAAN
PBC03SAAN
Sullins Connector Solutions
J7, J8, J21, J29, J30, J32,
J33, J36
8
Header, 100mil, 2x1, Gold, TH
Sullins 100mil, 1x2, 230 mil
above insulator
PBC02SAAN
Sullins Connector Solutions
J10, J12
2
Header, 2.54 mm, 3x1, TH
Header, 2.54mm, 3x1, TH
22-11-2032
Molex
J11, J20
2
Binding Post, BLACK, TH
11.4x27.2mm
7007
Keystone
J14
1
RCA Jack, Vertical, Black, TH
RCA Jack, Vertical, Black, TH
RCJ-021
CUI Inc.
J15
1
RCA Jack, Vertical, Blue, TH
RCA Jack, Vertical, Blue, TH
RCJ-025
CUI Inc.
J16
1
Header, 100mil, 4x2, Tin, TH
Header, 4x2, 100mil, Tin
PEC04DAAN
Sullins Connector Solutions
J17
1
Header (friction lock), 100mil, 4x1, Gold, TH
Header 4x1 keyed
0022112042
Molex
J18
1
RCA Jack, Vertical, White, TH
RCA JACK, WHITE
RCJ-023
CUI Inc.
J22, J23, J24, J25, J31
5
JUMPER TIN SMD
6.85x0.97x2.51 mm
S1911-46R
Harwin
J28
1
Receptacle, 100mil, 14x2, Gold, TH
14x2 Receptacle
SSW-114-01-G-D
Samtec
L1
1
100uH
Inductor, Shielded Drum Core, Ferrite, 100 µH, 1.5 A, 0.165 ohm, SMD
SMD
7447714101
Wurth Elektronik
L2, L3, L4, L5
4
10uH
Inductor, Toroid, Powdered Iron, 10 µH, 6.1 A, 0.026 ohm, TH
28.6x12.3mm
MA5172-AE
Coilcraft
L6
1
10uH
Inductor, Wirewound, 10 µH, 0.8 A, 0.204 ohm, SMD
2-Pin SMD, Body 4 x 4 mm,
Height 1.2 mm
NRS4012T100MDGJV
Taiyo Yuden
L7
1
10uH
Inductor, Wirewound, 10 µH, 0.08 A, 0.36 ohm, SMD
0603
GLFR1608T100M-LR
TDK
L8, L9
2
7uH
Inductor, Shielded, Ferrite, 7 µH, 6.5 A, .0066 ohm, AEC-Q200 Grade 1, SMD
15.5x14mm
UA8013-ALD
Coilcraft
Q1, Q2
2
60V
MOSFET, N-CH, 60 V, 0.17 A, SOT-23
SOT-23
2N7002-7-F
Diodes Inc.
R1, R3, R30
3
0
RES, 0, 5%, 0.1 W, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
R2
1
182k
RES, 182 k, 1%, 0.125 W, 0805
0805
ERJ-6ENF1823V
Panasonic
R4, R12, R44, R46
4
0
RES, 0, 5%, 0.125 W, 0805
0805
ERJ-6GEY0R00V
Panasonic
R5, R10, R19, R23, R33, R35
6
100
RES, 100, 1%, 0.1 W, 0603
0603
CRCW0603100RFKEA
Vishay-Dale
R6
1
100k
RES, 100 k, 1%, 0.1 W, 0603
0603
CRCW0603100KFKEA
Vishay-Dale
R7, R8, R20, R21, R25, R27,
R37, R38, R41, R42
10
10.0k
RES, 10.0 k, 0.1%, 0.1 W, 0603
0603
RT0603BRD0710KL
Yageo America
R9, R43, R45, R48
4
100k
RES, 100 k, 1%, 0.063 W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R13
1
22.0k
RES, 22.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0722KL
Yageo America
R15
1
30.0k
RES, 30.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0730KL
Yageo America
R16
1
20.0k
RES, 20.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0720KL
Yageo America
R17,
1
10.0k
RES, 10.0 k, 1%, 0.1 W, 0603
0603
CRCW060310K0FKEA
Vishay-Dale
R24, R28
2
47k
RES, 47 k, 5%, 0.1 W, 0603
0603
RC0603JR-0747KL
Yageo America
R26
1
3.30k
RES, 3.30 k, 1%, 0.1 W, 0603
0603
RC0603FR-073K3L
Yageo America
R29, R31
2
1.00k
RES, 1.00 k, 1%, 0.1 W, 0603
0603
CRCW06031K00FKEA
Vishay-Dale
R32
1
8.66k
RES, 8.66 k, 1%, 0.1 W, 0603
0603
RC0603FR-078K66L
Yageo America
R34
1
360
RES, 360, 5%, 0.063 W, 0402
0402
CRCW0402360RJNED
Vishay-Dale
R36
1
10.0k
RES, 10.0 k, 1%, 0.063 W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R39
1
4.99k
RES, 4.99 k, 1%, 0.063 W, 0402
0402
CRCW04024K99FKED
Vishay-Dale
R40
1
1.00k
RES, 1.00 k, 1%, 0.063 W, 0402
0402
CRCW04021K00FKED
Vishay-Dale
SLVUAT6A – September 2016 – Revised January 2018
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TPA3245 Evaluation Module
Copyright © 2016–2018, Texas Instruments Incorporated
23
EVM Design Documents
www.ti.com
Table 10. TPA3245EVM Bill of Materials (continued)
Designator
Qty
Value
R52, R59, R60, R62
4
0
Description
Package Reference
Part Number
Manufacturer
RES, 0, 5%, 0.25 W, 1206
1206
CRCW12060000Z0EA
R53
1
Vishay-Dale
1.00k
RES, 1.00 k, 1%, 0.1 W, 0402
0402
ERJ-2RKF1001X
R58
1
Panasonic
1.50k
RES, 1.50 k, 1%, 0.063 W, 0402
0402
CRCW04021K50FKED
S1
1
Vishay-Dale
Switch, SPDT, On-On, 2 Pos, TH
Switch, 7x4.5mm
200USP1T1A1M2RE
SH1, SH2, SH3, SH4, SH5,
SH6, SH7, SH8, SH9, SH10,
SH11, SH12, SH13, SH14,
SH15, SH16
16
E-Switch
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
TP1, TP2, TP3, TP4, TP5,
TP7, TP8, TP9, TP10, TP11,
TP12, TP13, TP14
13
Test Point, Multipurpose, Grey, TH
Grey Multipurpose Testpoint
5128
Keystone
U1
1
High Voltage 1A Step Down Switching Regulator, 10-pin LLP, Pb-Free
SDC10A
LM5010ASD/NOPB
Texas Instruments
U2
1
1A Low Dropout Regulator, 4-pin SOT-223, Pb-Free
MP04A
LM2940IMP-12/NOPB
Texas Instruments
U3
1
FIXED LOW-DROPOUT VOLTAGE REGULATOR, DCY0004A
DCY0004A
TLV1117-33IDCY
Texas Instruments
U4
1
150W Stereo/300W MONO PurePath HD Analog-input Power Stage, DDV0044D
DDV0044D
TPA3245DDVR
Texas Instruments
U5, U6
2
Low Distortion, Low Noise, General Purpose Audio Op Amp, DGK0008A (VSSOP8)
DGK0008A
OPA1678IDGKR
Texas Instruments
U7
1
ULTRA-SMALL SUPPLY VOLTAGE SUPERVISORS, DCK0005A
DCK0005A
TPS3802K33DCKR
Texas Instruments
C25, C36, C44, C60
0
1000pF
CAP, CERM, 1000 pF, 50 V, +/- 1%, C0G/NP0, 0603
0603
GRM1885C1H102FA01J
MuRata
C26, C37, C45, C61
0
220pF
CAP, CERM, 220 pF, 50 V,+/- 5%, C0G/NP0, 0603
0603
GRM1885C1H221JA01D
MuRata
C73, C74, C75, C76
0
22pF
CAP, CERM, 22 pF, 50 V, +/- 5%, C0G/NP0, 0603
0603
GRM1885C1H220JA01D
Murata
C77, C78, C79, C80
0
1uF
CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, 1206
1206
GRM31MR71H105KA88L
Murata
C85, C86
0
1000pF
CAP, CERM, 1000 pF, 50 V, +/- 1%, C0G/NP0, 0603
0603
GRM1885C1H102FA01J
Murata
FID1, FID2, FID3, FID4, FID5,
FID6
0
Fiducial mark. There is nothing to buy or mount.
N/A
N/A
N/A
J13
0
Header, 100mil, 2x1, Gold, TH
Sullins 100mil, 1x2, 230 mil
above insulator
PBC02SAAN
Sullins Connector Solutions
L2, L3, L4, L5
0
10uH
Inductor, 10 µH, 4.6 A, 0.0234 ohm, TH
14x9.6mm
7G14J-100M-R
Sagami Elec Co Ltd
R11, R14, R18, R22
0
2.00k
RES, 2.00 k, 1%, 0.1 W, 0603
0603
CRCW06032K00FKEA
Vishay-Dale
R47, R49, R50, R51
0
18.0k
RES, 18.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0718KL
Yageo America
R54, R55, R56, R57
0
3.30
RES, 3.30, 1%, 0.25 W, 1206
1206
ERJ-8RQF3R3V
Panasonic
R59, R60, R61, R62
0
10.0
RES, 10.0, 1%, 0.1 W, 0603
0603
CRCW060310R0FKEA
Vishay-Dale
R63, R64, R65, R66
0
0
RES, 0, 5%, 0.1 W, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
R67
0
0
RES, 0, 5%, 0.125 W, 0805
0805
ERJ-6GEY0R00V
Panasonic
TP6
0
Test Point, Multipurpose, Grey, TH
Grey Multipurpose Testpoint
5128
Keystone
0
Testpoint
Test Point, 0.45mm hole size
TP_H0.45P0.75
Texas Instruments
TP15,
TP19,
TP23,
TP27,
24
TP16, TP17, TP18,
TP20, TP21, TP22,
TP24, TP25, TP26,
TP28
1x2
TPA3245 Evaluation Module
SLVUAT6A – September 2016 – Revised January 2018
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Copyright © 2016–2018, Texas Instruments Incorporated
Revision History
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (September 2016) to A Revision ............................................................................................... Page
•
Changed entire document for board revision C. ...................................................................................... 1
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Revision History
25
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
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