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Texas Instruments TAS5780M Evaluation Module User guides
User's Guide
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TAS5780M Evaluation Module
This user’s guide describes the operation of the TAS57780M Evaluation Modules (EVM). The EVM is
connected to the PurePath™ Console Motherboard (PPCMB). The main contents of this document are:
• Hardware descriptions and implementation
• Start-up procedure using PurePath Console3 (PPC3) software with TAS5780M plug-in
Related documents:
• TAS5780M Data Sheet (SLASEG7)
• PurePath Console Motherboard User’s Guide (SLOU366)
• PurePath Graphic Development Suite (PurePath Console)
• PurePath Console 3 User Manual (SLOU408)
Required equipment and accessories:
1. TAS5780MEVM
2. PurePath Console Motherboard
3. A USB micro type-B cable
4. Power Supply Unit (PSU) 8 – 26.4 VDC
5. Speakers and cables
6. Desktop or laptop running Windows 7, Windows 8 or Windows 8.1
7. Audio source: This can be a DVD player with appropriate SPDIF cable or Playback Media from
Windows 7, Windows 8 or Windows 8.1
PurePath is a trademark of Texas Instruments.
Windows is a registered trademark of Microsoft Corporation.
All other trademarks are the property of their respective owners.
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Hardware Overview
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Hardware Overview
The TAS5780MEVM showcases the latest TI digital input Class-D closed loop amplifier. The TAS5780M is
an I2S or TDM input class D amplifier with 96-kHz processing. The EVM is used in conjunction with the
PurePath Console Motherboard (PPCMB). The PVDD supply is provided via the TAS5780EVM and is
regulated to 5 VDC and 3.3 VDC on the PPCMB. The PPCMB provides the I2S, I2C, and 3.3 VDC to the
TAS5780MEVM.
Figure 1. TAS5780MEVM
1.1
Features
•
•
•
•
1.2
GUI control via USB port
Stereo and mono channels with I2S input
Processed and non-processed mono channel I2S input
Operates in BTL or PBTL
Functions
The TAS5780MEVM is controlled by the PPCMB. The PPCMB sends I2C commands from PPC3 to the
TAS5780M. Upon PPC3 execution and connection, the TAS5780M is put in software mode.
The digital audio data input to the TAS5780EVM is sent from PPCMB and is selectable from USB audio,
optical SPDIF, coaxial SPDIF, PSIA (external I2S), and analog ADC sources. When a digital audio data
input is selected, the PPC3 automatically sends appropriate scripts to the device in use.
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1.3
Detailed Operations
Upon power-on, the PPCMB uses USB audio input (default). The I2S signals LRCLK, SCLK, SDIN and
MCLK come from the TAS1020B. foobar2000 or similar non-processing media source can be used to
stream audio. The TAS1020B enumerates as the following device on a Microsoft® Windows® operating
system (OS): USB audio (USB-AudioEVM), Human Interface Devices, and USB Composite Device, see
Figure 2.
Figure 2. Device Manager
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Hardware Setup
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Hardware Setup
Step 1: Connect the PPCMB to the TAS5780MEVM.
Step 2: Connect speakers to TAS5780MEVM.
Step 3: Connect a PSU to the TAS5780MEVM and turn on the power. 5-V and 3.3-V LEDs (Yellow) are
illuminated. The USB Lock LED (Blue) is also illuminated.
Step 4: Plug in a USB cable from the PC to the PPCMB.
Step 5: If an optical SPDIF source is used, the blue SPDIF clock-locked LED is illuminated.
Figure 3. PPCMB and TAS5780MEVM Connection
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Software Overview
3.1
PurePath Console 3 (PPC3)
PurePath™ Console 3 (PPC3) is a software platform for Texas Instruments’ audio devices. Many of these
audio devices can be configured, tuned and validated. This platform has the ability to support a number of
TI’s audio devices with features that make the audio tuning experience more intuitive and exciting. Access
can be requested on http://www.ti.com/tool/PUREPATHCONSOLE.
Once approval is given, go to www.ti.com/mysecuresoftware to download the software. After login, users
will see this webpage with a similar list of software products available for download.
Figure 4. PPC3 Download Window
Run the installation program. Also download the PPC3 User Manual (SLOU408) for further instructions.
The following window is displayed when PPC3 is launched for the first time.
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When the window in Figure 5 is displayed, click on “sign in” to see TAS5780 EVM application. Click on
TAS5780M box to download TAS5780M EVM App. Installation window will pop up, then click “Install”.
Figure 5. PPC3 Window
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After installation, TAS5780 EVM box will appear in “Installed EVM Apps” section, see Figure 6. Click on
TAS5780 box to launch TAS5780 App.
Figure 6. Installed EVM Apps
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TAS5780M Home Page
When the TAS5780M EVM App is launched, the TAS5780M Home Page is shown, see Figure 7. It
displays features that are available for that EVM. When a feature is selected, then the respective page is
loaded.
If the EVM is powered on and the USB is connected to the PC, the Home Page will display “Connect”
button in the bottom left corner. If the USB is not connected, only “TAS5780M – offline” is shown.
There are six pages available in the TAS5780 EVM App: System Checks, Direct I2C, Audio I/O, Register
Map, End System Integration and Tuning and Audio Processing.
Figure 7. TAS5780M Home Page
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3.3
System Checks
The System Checks Page (See Figure 8) is used to determine whether the EVM can be configured
correctly and receive audio stream from PC via USB. These checks will complete in a few minutes if no
problem is detected. It is recommended to run the system checks before proceeding to the Turning and
Audio Processing section.
Figure 8. System Checks Page
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3.4
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2
Direct I C
The I/O tab in the Direct I2C has two sub sections. The Input section has the provision to enter the read or
write commands scripts. Clicking the Execute button will execute the commands written in the Input
section. The status of the execution is displayed in the Output section as shown in Figure 9.
The Checksum button on the right is used to compute the checksum value of a cfg file. Load a cfg file by
clicking the Checksum button and then the computed XOR and CRC checksum will show on the Output
section
Figure 9. Direct I2C Page, I/O Tab
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The Log tab in the Direct I2C displays the I2C command history, if the record option is enabled. The log tab
has a search option to search for a particular command. The search key can be found at the top left of the
window with the search icon. ‘Save to a file’ can be used to save the log as a .cfg file. ‘Delete Output’
clears the log history. ‘Copy to a Clipboard’ copies the log text to the clipboard. Clicking the ‘Start
Recording’ button starts recording the I2C transactions and displays them in the log window. ‘Stop
Recording’ stops recording I2C transactions.
Figure 10. Direct I2C Page, Log Tab
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Audio I/O
This tool selects the desired audio input to the EVM. USB, coax, analog ,optical and PSIA (external I2S)
are supported by the motherboard. USB audio source is selected as default.
Figure 11. Audio I/O Page
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3.6
Register Map
The Register Map Page shows the current I2C register values (hexadecimal) in the TAS5780M and it can
be also used to change the register values. Manually changing register values is accomplished by doubleclicking in the desired bit to change. Clicking on Read All Registers allows monitoring of the register status
of the amplifier. The Fields section shows the register name and a brief description of each bit that affects
the selected register.
Figure 12. Register Map Page
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3.7
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End System Integration
The End System Integration Page offers a powerful tool to generate a configuration file to use with
processors and a method to debug the device in the end system. Three options are available: (1) Dump
Current State into a Header file, (2) In-System Debugging and (3) In-System Tuning.
Figure 13. End System Integration Page
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3.7.1
Dump Current State into a Header File
This tool is used to generate a header or configuration file for the evaluated device according to the
features evaluated and configured with PPC3. A few settings are available for file generation, including the
format, end system I2C address, burst length and so forth. The generated file can be saved in the PC or
shown in the output window on the right.
Figure 14. Header File Generation
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3.7.2
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In-System Debugging
This tool helps debug the device which is already integrated in the end-system. This is possible by
connecting the I2C signals of the end-system device to the SCL, SDA, and GND test points of PPCMB.
Only Register Map and Direct I2C will be available in this mode. Leave the In-System Debugging Mode by
clicking on the Disconnect button on the bottom left corner of the window.
Figure 15. In-System Debugging
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3.7.3
In-System Tuning
Even if the device is integrated in the end application, it is still possible to make fine adjustments with the
help of In-System Tuning. Like the In-System Debugging above, this is done by connecting I2C signals
from PPCMB to the TAS5780M device in the end-system.
Figure 16. In-System Tuning
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3.8
3.8.1
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Tuning and Audio Processing
Input Mixer
The input mixer can be used to mix the left and right channel input signals as shown in Figure 17. The
input mixer has four coefficients, which control the mixing and gains of the input signals.
Audio left in
L2L
Gain
+
Audio left out
L2R
Gain
R2L
Gain
Audio right in
R2R
Gain
+
Audio right out
Figure 17. Input Mixer
Table 1 shows the default values of the four coefficients in the Basic Tab (see Figure 18). If the Invert
Phase boxes are selected, the L2L / R2R Gain will simply be -1.
Figure 18. Basic Tab
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Table 1. Coefficient Values in Basic Tab
Coefficient
Value
L2L Gain
1
L2L Gain
0
R2L Gain
0
R2R Gain
1
Switch to the Advanced tab (see Figure 19) if all the four coefficients need to be adjusted. Note that the
four parameters need to be specified in decibels (dB). Like the Invert Phase boxes in the Basic tab, the
Inv Phase options will reverse the sign of the gain values.
Figure 19. Advanced Tab
3.8.2
Sample Rate Configuration
The process flow in the TAS5780M is based on 96 kHz audio signals, but can support multiple sample
rates: 96 kHz, 88.2 kHz, 48 kHz, 44.1 kHz and 32 kHz. To achieve the rates, It uses its interpolator and
two Equalizer banks.
The interpolator can be configured to work with 1x, 2x or 3x. While playing 96 kHz, 88.2 kHz, 48 kHz and
44.1 kHz, TAS5780M is configured in auto mode to detect sample rates and interpolate. When 32 kHz
audio is played, a 3x interpolator should be activated by writing an additional script. PPC3 automatically
does this when the 32kHz sample rate is chosen.
The EQ Bank 1 will have equalizer coefficients computed for the 96 kHz. When second EQ bank is
enabled, EQ Bank 2 will have equalizer coefficients computed for 88.2 kHz. When playing 88.2 kHz or
44.1 kHz audio, TAS5780M needs to be configured to use the EQ Bank 2. PPC3 automatically does this
when the 88.2 kHz or 44.1 kHz sample rate is chosen
Table 2. Sample Rates and Corresponding EQ Banks
Sample Rate
Auto Detected
Interpolation
EQ Bank
96 kHz
Yes
1x
Bank 1
88.2 kHz
Yes
1x
Bank 2
48 kHz
Yes
2x
Bank 1
44.1 kHz
Yes
2x
Bank 2
32 kHz
No
3x
Bank 1
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Figure 20 shows the Sample Rate Configuration Tab. Choose your preferred audio source in the Audio I/O
page and then select a proper sampling rate of audio in the dropdown box. Either Bank 1 or Bank 2 will be
active after the sampling rate is entered.
The Sync Bank 1 and 2 box is used to make sure the equalizer coefficients on Bank 1 and Bank 2 are
synchronized when either of them is changed.
Figure 20. Sample Rate Configuration
3.8.3
Equalize
The Equalizer window contains 12 independent filters designed for tuning the frequency response of the
overall system. This is where the bulk of the frequency compensation occurs. Complex tuning shapes can
be made to compensate for deficiencies in speaker response.
Figure 21. Equalizer Tuning Window
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Figure 20 shows the Equalizer audio processing window. Both left and right channels have 12 filters
individually, which appear under the frequency graph. Each filter has quite a few different filter types and
can be turned on or off independently. All the changes to these filters are reflected in Figure 21. The
composite plot (red) shows the overall frequency response alteration applied to the incoming digital audio
data. The equalizers for left and right channels are configured independently by default, but they can be
ganged by selecting Ganged option. Phase, Group Delay, Impulse Response and Pole zero charts are
also available on the right side.
3.8.4
DEQ
The dynamic equalizer mixes the audio signals routed through two paths containing one BQ each based
upon the signal level detected by the sense path, as shown in Figure 22.
Low level
BQ
DPEQ
Control
+
+
Sense
BQ
+
High level
BQ
Figure 22. DEQ
Figure 23. DEQ Tuning Window
3.8.4.1
DEQ
The Energy simply tells the algorithm for how long to average the samples of audio before it determines
how it compares to the mixing thresholds. The shorter the time, the faster the mixer reacts to changes in
the input signal level. The longer the time, the slower the mixer reacts to changes in level.
The mixing of the two paths (low level and high level) is controlled by setting the Threshold Low and
Threshold High. When the averaged signal (as set by the Energy) is below the Threshold Low, the
dynamic mixer sends all of the audio through the low-level path. When the signal is above the Threshold
High, it is sent through the upper-level path. When the signal is between the two, it is mixed together by
the dynamic mixer.
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Sense EQ
The sense path contains 1 configurable Biquad, which can be used to focus the DEQ sensing on a
specific frequency bandwidth.
3.8.4.3
Low Level EQ
The low-level path also has 1 configurable Biquad to establish the EQ curve which the audio is sent
through when the time averaged signal is at a low-level. This fully-functional Biquad can be assigned to
several filter types. This determines frequency response when low-level is active based on the Energy
configuration and the mixing thresholds.
3.8.4.4
High Level EQ
The high-level path, similar to the low-level path, has 1 Biquad that can set the EQ curve used when the
time averaged input signal is above the upper mixing threshold.
3.8.5
DRC
The Dynamic Range Control (DRC) is a feed-forward mechanism that can be used to automatically control
the audio signal amplitude or the dynamic range within specified limits. The dynamic range control is done
by sensing the audio signal level using an estimate of the alpha filter energy then adjusting the gain based
on the region and slope parameters that are defined.
The two-band dynamic range control is comprised of two DRCs that can be spilt into two bands using the
BQ at the input of each band. The frequency where the two bands are spilt is referred to as the crossover
frequency. The crossover frequency is the cut off frequency for the low pass filter used to create the low
band and the cut off frequency for the high pass filter used to create the high band.
The DRC in each band is equipped with individual energy, attack, and decay time constants. The DRC
time constants control the transition time of changes and decisions in the DRC gain during compression or
expansion. The energy, attack, and decay time constants affect the sensitivity level of the DRC. The
shorter the time constant, the more aggressive the DRC response and vice versa.
This DRC can be used for power limiting and signal compression; therefore, it must be tested with
maximum signal levels for the desired application. Use a resistive load for initial testing. However, the
speaker used in the end application must be used for final testing and tweaking.
Figure 24. DRC Tuning Window
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The Input / Output region has consists of two identical windows for low and high bands. Each has a DRC
curve that offers 3 regions of compression. The points on the DRC curve can be dragged and dropped.
Below the DRC plot, parameters such as threshold, offset and ratio can be manually typed in for each of
the 3 regions. By typing a value and pressing Enter on the keyboard, the DRC curve automatically adjusts
to the entered parameter.
3.8.5.1
DRC Time Constant
Change time constants by entering new values for each band.
Attack(ms) determines the attack time of the DRC and Release(ms) determines the release time once the
windowed energy band passes. Energy(ms) controls the time averaging windowing uses to determine the
average signal energy; therefore, where the incoming signal compares to the set DRC curve. It is
beneficial to have control over the DRC time constant for a given frequency band to avoid beating tones
caused by the DRC attack and the incoming signal frequency
The mixer gain controls the relative gain of each of the 2 frequency bands when they are mixed together.
This is used to attenuate one of the frequency bands relative to the others, if needed. Make note of the
sign of the gain coefficients. Since filters effect phase, a phase reversal or a 180 degree phase shift
may be necessary. Use a negative sign on the coefficient to reverse the phase
3.8.5.2
Crossover
By default, the two-band crossover frequencies are set to 2500 Hz, using second-order Linkwitz-Riley
filters. This filter type is chosen because the total sum of the two-band signals has a flat response without
having to calculate individual cross-over frequencies for unity summation. The crossover frequencies need
to be separated far enough in the frequency range from each other to avoid any dip caused by the filter
sum response.
The crossover configuration has two tabs. In the Basic Tab, only the filter type and two cut-off frequencies
need to be determined. Go to the Advanced Tab if more parameters need to be adjusted.
3.8.6
Full Band AGL
The Full Band AGL is a feedback mechanism that can be used to automatically control the audio signal
amplitude or dynamic range within specified limits. The automatic gain limiting is done by sensing the
audio signal level using an alpha filter energy structure at the output of the AGL then adjusting the gain
based on the whether the signal level is above or below the defined threshold. Three decisions made by
the AGL are engage, disengage, or do nothing. The rate at which the AGL engages or disengages
depends on the attack and release settings respectively.
Figure 25 shows the AGL Tuning Window. By default, the AGL is disabled and it can be enabled by
clicking the ON/OFF switch on the top right corner.
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Figure 25. AGL Tuning Window
3.8.6.1
Threshold(dB)
This parameter sets the threshold at which the compressor will be activated. Lowering the threshold will
cause the compression to be activated at lower volume levels. Once the signal exceeds this threshold,
compression will be applied.
3.8.6.2
Alpha(ms)
This parameter configures the sharpness of the compression knee of the AGL.
3.8.6.3
Attack
This parameter controls how quickly compression will be applied to the signal. Higher values will cause
the compressor to respond to signals slowly, while lower values will give faster response times.
3.8.6.4
Release
This parameter controls how quickly compression will be removed from the signal as the signal gets
quieter. Higher values will cause the compressor to release from signals slowly, while lower values will
give faster response times.
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Threshold
INPUT
Threshold
OUTPUT
Attack Rate
Release Rate
W0003-01
Figure 26. AGL Attack and Release
3.8.7
THD Boost / Fine Volume
A THD boost and fine volume together can be used to achieve digitally the specified THD levels without
voltage clipping. It allows users to achieve the same THD (for example, 10% THD) for different power
levels (15 W/10W/5W) with same PVCC level.
Figure 27. THD Boost / Fine Volume
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THD Clipper (dB)
The THD clipper controls the signal level at which clipping occurs.
3.8.7.2
Fine Volume (dB)
The fine volume sets additional fine volume steps from –110 dB to 6 dB.
3.8.8
Simple Register Tuning
The SDOUT Origin dropdown list selects what is being output as SDOUT via GPIO pins.
The Mute check box can be used to mute / unmute the TAS580M device. The Standby and Powerdown
check boxes will put the TAS5780M device into standby mode or powerdown mode if they are checked.
The DAC Gain spinner controls the digital volume of DAC. The digital volume is 24 dB to -103 dB in -0.5
dB step. The Analog DAC Gain dropdown list selects the analog gain. Two options are available: 2 Vrms
FS (0 dB) or 1 Vrms FS (-6 dB).
Figure 28. Simple Register Tuning
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3.8.9
Level Meter
Figure 29 shows the level meter, which uses an energy estimator with a programmable time constant to
adjust the sensitivity level based on signal frequency and desired accuracy level. The level meter will
appear if the LM icon on the bottom is clicked.
Figure 29. Level Meter
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Board Layouts, Bill of Materials, and Schematic
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Board Layouts, Bill of Materials, and Schematic
This section includes the EVM schematics, board layouts and bill of materials.
4.1
Schematics
Figure 30 through Figure 32 illustrate the schematic for this EVM.
L1
OUT1A+
SPK1_OUTA+
4.7µH
GAIN SETTING TABLE
GAIN/FREQUENCY
R-GF1
R-GF2
20dB/768kHz 20dB/576kHz 20dB/480kHz 20dB/384kHz 14dB/768kHz 14dB/576kHz 14dB/480kHz 14dB/384kHz
650k Ohms
550k Ohms
450k Ohms
350k Ohms
250k Ohms
150k Ohms
50k Ohms
750k Ohms
150k Ohms
250k Ohms
350k Ohms
450k Ohms
550k Ohms
650k Ohms
750k Ohms
850k Ohms
R-GF1
R1
R-GF2
R2
750k
150k
J2
J1
1
2
DVDD1
PVDD
DVDD1
C26
1µF
C1
1µF
L2
C4
1µF
GND
OUT1A
OUT1A-
SPK1_OUTA4.7µH
C11
22µF
GND
C2
0.68µF
3.3V
C10
22µF
C9
0.1µF
GND
C8
0.68µF
GND
GND
U1
GND
GND
GND
PVDD
C25
1µF
SCL
SDA
I2C
C18
22µF
I2S
MCLK
SCLK
LRCK/FS
SDIN1
SDOUT1
GND
C17
22µF
GND
C16
0.1µF
14
30
31
AVDD
DVDD
CPVDD
BSTRPA+
5
SPK_OUTA+
4
C3
0.22µF
SPK1_OUTA+
28
DVDD_REG
SPK_OUTA-
2
SPK1_OUTA-
BSTRPA-
1
BSTRPB-
48
GND
6
7
41
42
43
GND
8
9
SCL
SDA
17
16
MCLK
SCLK
LRCK/FS
SDIN1
22
23
25
24
GPIO0
RESET
SDOUT1
18
19
21
TP16
RESET
RESET
ADDRESS
SELECT
I2C ADDR=0x90
DVDD1
DVDD1
ADR0-0
ADR1-0
26
20
SPK-MUTE1
27
SPK-FAULT1 40
R3
DNP
10.0k
DNP
R8
DNP
10.0k
DNP
34
C20
1µF
ADR0-0
32
PVDD
PVDD
PVDD
PVDD
PVDD
GVDD_REG
SPK_GAIN/FREQ
SCL
SDA
MCLK
SCLK
LRCK/FS
SDIN
GPIO0
GPIO1
GPIO2
ADR0
ADR1
SPK_MUTE
SPK_FAULT
SPK_OUTB-
47
C7
0.22µF
C19
0.22µF
SPK1_OUTB-
SPK_OUTB+
45
SPK1_OUTB+
BSTRPB+
44
SPK_INASPK_INA+
DAC_OUTA
11
12
13
SPK_INBSPK_INB+
DAC_OUTB
CPVSS
AGND
AGND
DGND
PGND
PGND
PGND
CN
GND
CP
PAD
GND
SNUBBERS
C24
0.22µF
R4
18
DNP
DNP
R5
18
DNP
DNP
C12
330pF
DNP
DNP
C13
330pF
DNP
DNP
R6
18
DNP
DNP
R7
18
DNP
DNP
C14
330pF
DNP
DNP
C15
330pF
DNP
DNP
GND
C5
2.2µF
38
37
36
L3
C21
2.2µF
OUT1B-
SPK1_OUTB4.7µH
C23
0.68µF
35
J3
1
2
10
15
L4
29
3
39
46
GND
OUT1B
OUT1B+
SPK1_OUTB+
4.7µH
C28
0.68µF
33
C27
1µF
49
C22
2.2µF
C6
2.2µF
GND
ADR1-0
TAS5780MDCAR
GND
R13
0
GND
GND
GND
GND
R29
0
GND
PP-CMB
DVDD1
DVDD1
R9
10.0k
R10
10.0k
SPK-MUTE1
SPK-FAULT1
Figure 30. Schematic (1 of 3)
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GAIN SETTING TABLE
GAIN/FREQUENCY
R-GF1
R-GF2
3.3V
20dB/768kHz 20dB/576kHz 20dB/480kHz 20dB/384kHz 14dB/768kHz 14dB/576kHz 14dB/480kHz 14dB/384kHz
650k Ohms
550k Ohms
450k Ohms
350k Ohms
250k Ohms
150k Ohms
50k Ohms
750k Ohms
150k Ohms
250k Ohms
350k Ohms
450k Ohms
550k Ohms
650k Ohms
750k Ohms
850k Ohms
R-GF1
R11
R-GF2
R12
750k
150k
J5
1
2
DVDD2
PVDD
C29
1µF
C36
390µF
GND
L5
SPK2_OUTA
DVDD2
C49
1µF
C31
1µF
OUT2A
4.7µH
C35
0.68µF
C39
22µF
C38
22µF
C37
0.1µF
GND
GND
GND
GND
U2
GND
GND
GND
GND
PVDD
I2C
C48
1µF
SCL
SDA
I2S
C40
390µF
MCLK
SCLK
LRCK/FS
SDIN2
SDOUT2
GND
C43
22µF
GND
C42
22µF
GND
C41
0.1µF
14
30
31
AVDD
DVDD
CPVDD
BSTRPA+
5
SPK_OUTA+
4
28
DVDD_REG
SPK_OUTA-
2
BSTRPA-
1
BSTRPB-
48
GND
6
7
41
42
43
GND
8
9
SCL
SDA
17
16
MCLK
SCLK
LRCK/FS
SDIN2
22
23
25
24
GPIO0
RESET
SDOUT2
18
19
21
TP17
RESET
RESET
ADDRESS
SELECT
DVDD2
DVDD2
ADR0-1
ADR1-1
26
20
SPK-MUTE2
27
SPK-FAULT2 40
R30
10.0k
I2C ADDR=0x92
R31
10.0k
DNP
DNP
34
C45
1µF
ADR0-1
32
PVDD
PVDD
PVDD
PVDD
PVDD
GVDD_REG
SPK_GAIN/FREQ
SCL
SDA
MCLK
SCLK
LRCK/FS
SDIN
SNUBBERS
SPK2_OUTA
SPK_OUTB-
47
SPK_OUTB+
45
BSTRPB+
44
SPK_INASPK_INA+
DAC_OUTA
11
12
13
SPK_INBSPK_INB+
DAC_OUTB
C30
0.22µF
C34
0.22µF
C44
0.22µF
R34
18
DNP
DNP
C57
330pF
DNP
DNP
R35
18
DNP
DNP
C58
330pF
DNP
DNP
J4
1
2
OUT2
SPK2_OUTB
GND
C47
0.22µF
C32
2.2µF
38
37
36
L6
GPIO0
GPIO1
GPIO2
ADR0
ADR1
SPK_MUTE
SPK_FAULT
CPVSS
AGND
AGND
DGND
PGND
PGND
PGND
CN
GND
CP
PAD
SPK2_OUTB
35
OUT2B
4.7µH
10
15
C46
0.68µF
29
3
39
46
GND
33
C50
1µF
49
R14
49.9k
C33
2.2µF
ADR1-1
TAS5780MDCAR
R32
0
DNP
DNP
GND
GND
GND
GND
GND
R33
0
GND
PP-CMB
DVDD2
DVDD2
R15
10.0k
R16
10.0k
SPK-MUTE2
SPK-FAULT2
Figure 31. Schematic (2 of 3)
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3.3V
3.3V
J6B
U3
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
PVDD
J7
1
PVDD
C51
390µF
J8
1
GND
GND
PVDD RANGE = 8.0V - 26.4V
PVDD
J6A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
GND
GND
GND
GND
SCL-PPCMB
1
R17
10.0k
SDA-PPCMB
2
3
3.3V
4
A0
VCC
A1
WP
A2
SCL
VSS
SDA
3.3V
R26
3.3V
POWER IN
7
DNP
DNP
TP14
3.3V
3.3V
Green
332
3.3V
8
D1
R18
10.0k
TP15
GND
GND
GND
TP18
GND
GND
TP19
GND
GND
6
R19
10.0k
5
3.3V
3.3V
24LC512-I/ST
R20
2.20k
GND
GND
SCL-PPCMB
R22
0
SDA-PPCMB
R23
0
R21
2.20k
TP1
SCL
TP2
SDA
TP3
MUTE1
TP4
MUTE2
SCL
SDA
SPK-MUTE1
TO DUTS
SPK-MUTE2
TP5
FAULT1
TP6
FAULT2
SPK-FAULT1
SPK-FAULT2
SPK-MUTE1 (PPCMB-GPIO6)
FROM DUTS
3.3V
SDIN-SEL
(PPCMB-GPIO7)
R27
10.0k
3.3V
3.3V
3.3V
3.3V
3.3V
U4
SPK-FAULT1 (PPCMB-GPIO8)
SDIN1
1
SDOUT1
2
SPK-FAULT2 (PPCMB-GPIO9)
SDIN-SEL
6
4
A
VCC
B
Y
A/B
Y
GND
G
8
C52
0.1µF
SDIN2
5
C53
0.1µF
C54
0.1µF
C55
0.1µF
3
7
GND
GND
GND
GND
SN74LVC2G157DCUR
GND
GND
SPK-MUTE2 (PPCMB-GPIO10)
3.3V
(PPCMB-GPIO0)
GND
GND
GND
GND
105
106
107
108
U5
8
SDOUT
R24
5
49.9
3
(PPCMB-GPIO1)
GND
7
VCC
A
Y
B
Y
A/B
G
GND
TP7
SDOUT1
TP8
SDOUT2
SDOUT1
1
2
SDOUT2
6
SDOUT-SEL
SDOUT1
SDOUT2
FROM DUTS
4
3.3V
3.3V
SN74LVC2G157DCUR
U6
(PPCMB-GPIO2)
GND
SDOUT-SEL
GND
5
(PPCMB-GPIO3)
(PPCMB-GPIO5)
R25
10.0k
S1
RESET
R28
10.0k
1
2
C56
47pF
VDD
RESET
RESET
4
MR
GND
1
RESET
3
2
TPS3825-33QDBVRQ1
GND
GND
GND
RESET
TP9
MCLK
TP10
SCLK
TP11
LRCK/FS
MCLK
MCLK
SCLK
SDOUT
LRCK/FS
TO DUTS
SCLK
LRCK/FS
SDIN2
SDIN1
SDIN1
TP12
SDIN1
TP13
SDIN2
101
102
103
104
GND
Figure 32. Schematic (3 of 3)
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4.2
Board Layouts, Bill of Materials, and Schematic
Board Layouts
Figure 33 and Figure 34 illustrate the board layouts for the EVM.
Figure 33. Top Composite Assembly
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Figure 34. Bottom Composite Assembly
32
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Board Layouts, Bill of Materials, and Schematic
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4.3
Bill of Materials
Table 3. Bill of Materials
Designator
C1, C29
Quantity
2
Value
1uF
Description
Package Reference
Part Number
Manufacturer
CAP, CERM, 1 µF, 16 V, +/- 10%, X5R,
0603
0603
GRM185R61C105KE44D
MuRata
0805
C2012X7R1H684M125AB
TDK
C2, C8, C23, C28,
C35, C46
6
0.68uF
CAP, CERM, 0.68 µF, 50 V, +/- 20%, X7R,
0805
C3, C7, C19, C24,
C30, C34, C44, C47
8
0.22uF
CAP, CERM, 0.22 µF, 50 V, +/- 10%, X7R,
0603
0603
C1608X7R1H224K080AB
TDK
C4, C20, C25, C26,
C27, C31, C45, C48,
C49, C50
10
1uF
CAP, CERM, 1 µF, 16 V, +/- 10%, X5R,
0402
0402
C1005X5R1C105K050BC
TDK
C5, C6, C21, C22,
C32, C33
6
2.2uF
CAP, CERM, 2.2 µF, 16 V, +/- 10%, X5R,
0402
0402
C1005X5R1C225K050BC
TDK
0402
C1005X7R1H104K050BB
TDK
C9, C16, C37, C41,
C52, C53, C54, C55
8
0.1uF
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R,
0402
C10, C11, C17, C18,
C38, C39, C42, C43
8
22uF
CAP, CERM, 22 µF, 35 V, +/- 20%, JB,
0805
0805
C2012JB1V226M125AC
TDK
10x10
UCL1V391MNL1GS
Nichicon
C36, C40, C51
3
390uF
CAP, AL, 390 µF, 35 V, +/- 20%, 0.08 ohm,
SMD
C56
1
47pF
CAP, CERM, 47pF, 25V, +/-5%, C0G/NP0,
0402
0402
GRM1555C1E470JA01D
MuRata
D1
1
Green
LED, Green, SMD
LED_0805
LTST-C170KGKT
Lite-On
H1, H2, H3, H4
4
MACHINE SCREW PAN PHILLIPS M3
M3 Screw
RM3X8MM 2701
APM HEXSEAL
H5, H6, H7, H8
4
Washer, Flat, #4 Nylon
3200
Keystone
H9, H10, H11, H12
4
Standoff, HexBrass M3, 30 mm
Spacer M3, 30mm
R30-1003002
Harwin
3
Header (friction lock), 3.96mm, 2x1, Tin,
R/A, TH
Header, 2x1, 3.96mm, R/A
B2PS-VH(LF)(SN)
JST Manufacturing
PBC02SAAN
Sullins Connector
Solutions
J1, J3, J4
J2, J5
2
Header, 100mil, 2x1, Gold, TH
Sullins 100mil, 1x2, 230 mil
above insulator
J6
1
Connector, 100 Pos. 0.635mm, SMT
Connector, 1575x235x280
mil
QTS-050-01-F-D-A
Samtec
J7
1
Binding Post, RED, TH
11.4x27.2mm
7006
Keystone
J8
1
Binding Post, BLACK, TH
11.4x27.2mm
7007
Keystone
L1, L2, L3, L4
4
4.7uH
Inductor, Shielded, 4.7 µH, 4 A, 0.023 ohm,
SMD
6.3x4.5x6.3mm
1255AY-4R7M=P3
MuRata Toko
L5, L6
2
4.7uH
Inductor, Wirewound, Ferrite, 4.7 µH, 8.7 A,
0.0085 ohm, TH
D12.8xH9mm
744750420047
Wurth Elektronik
R1, R11
2
750k
RES, 750 k, 1%, 0.125 W, 0805
0805
ERJ-6ENF7503V
Panasonic
R2, R12
2
150k
RES, 150 k, 1%, 0.125 W, 0805
0805
ERJ-6ENF1503V
Panasonic
R9, R10, R15, R16,
R17, R19
6
10.0k
RES, 10.0 k, 1%, 0.063 W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R13, R22, R23, R29,
R33
5
0
RES, 0, 5%, 0.1 W, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
R14
1
49.9k
RES, 49.9 k, 1%, 0.063 W, 0402
0402
CRCW040249K9FKED
Vishay-Dale
R20, R21
2
2.20k
RES, 2.20 k, 1%, 0.063 W, 0402
0402
CRCW04022K20FKED
Vishay-Dale
R24
1
49.9
RES, 49.9, 1%, 0.063 W, 0402
0402
CRCW040249R9FKED
Vishay-Dale
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Table 3. Bill of Materials (continued)
Designator
Quantity
Value
R25, R27, R28, R30
4
10.0k
R26
1
332
S1
1
SH1, SH2
2
TP1, TP2, TP3, TP4,
TP5, TP6, TP7, TP8,
TP9, TP10, TP11,
TP12, TP13, TP16,
TP17
Description
Package Reference
Part Number
Manufacturer
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
RES, 332, 1%, 0.063 W, 0402
0402
CRCW0402332RFKED
Vishay-Dale
Switch, Tactile, SPST-NO, 0.05A, 12V, SMT
Switch, 4.4x2x2.9 mm
TL1015AF160QG
E-Switch
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
15
Test Point, Miniature, Orange, TH
Orange Miniature Testpoint
5003
Keystone
TP14
1
Test Point, Miniature, Red, TH
Red Miniature Testpoint
5000
Keystone
TP15, TP18, TP19
3
Test Point, Miniature, Black, TH
Black Miniature Testpoint
5001
Keystone
U1, U2
2
Digital Input, Closed-Loop Class-D Amplifier
with 96-kHz Processing, DCA0048G
(TSSOP-48)
DCA0048G
TAS5780MDCAR
Texas Instruments
U3
1
EEPROM, 512KBIT, 400KHZ, 8TSSOP
TSSOP-8
24LC512-I/ST
Microchip
U4, U5
2
Single 2-Line to 1-Line Data Selector
Multiplexer, DCU0008A
DCU0008A
SN74LVC2G157DCUR
Texas Instruments
U6
1
Processor Supervisory Circuit, DBV0005A
DBV0005A
TPS3825-33QDBVRQ1
Texas Instruments
C12, C13, C14, C15,
C57, C58
0
CAP, CERM, 330 pF, 50 V, +/- 5%,
C0G/NP0, 0603
0603
GRM1885C1H331JA01D
MuRata
FID1, FID2, FID3,
FID4, FID5, FID6
0
Fiducial mark. There is nothing to buy or
mount.
N/A
N/A
N/A
R3, R8, R31
0
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R4, R5, R6, R7,
R34, R35
0
18
RES, 18, 5%, 0.1 W, 0603
0603
CRCW060318R0JNEA
Vishay-Dale
R18
0
10.0k
RES, 10.0 k, 1%, 0.063 W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R32
0
0
RES, 0, 5%, 0.1 W, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
34
1x2
330pF
TAS5780M Evaluation Module
Alternate Part Number
Alternate Manufacturer
SNT-100-BK-G
Samtec
TAS5780MDCA
Texas Instruments
SN74LVC2G157DCUT
Texas Instruments
Texas Instruments
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation
which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms
and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
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www.ti.com/audio
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www.ti.com/automotive
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amplifier.ti.com
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www.ti.com/communications
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www.ti.com/computers
DLP® Products
www.dlp.com
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www.ti.com/clocks
Industrial
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www.ti-rfid.com
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Copyright © 2016, Texas Instruments Incorporated
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